HFBR-3541ETZ [FOXCONN]
Fiber Optic Device;
| 型号： | HFBR-3541ETZ |
| 厂家： | 
FOXCONN |
| 描述： | Fiber Optic Device |
| 文件： | 总16页 (文件大小：240K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HFBR-0500ETZ Series
Versatile Link
The Versatile Fiber Optic Connection
Data Sheet
Description
Features
Extended temperature range -40 to +85° C
RoHS-compliant
The Versatile Link series is a complete family of fiber
optic link components for applications requiring a low
cost solution. The HFBR-0500ETZ series includes trans-
mitters, receivers, connectors and cable specified for
easy design. This series of components is ideal for
solving problems with voltage isolation/insulation,
EMI/RFI immunity or data security. The optical link
design is simplified by the logic compatible receivers
and complete specifi-cations for each component. The
key optical and electrical parameters of links configured
with the HFBR-0500ETZ family are fully guaranteed from
-40° to 85° C.
Low cost fiber optic components
Enhanced digital links: dc-5 MBd
Link distance up to 43m at 1MBd and 20m at 5MBd
Low current link: 6 mA peak supply current
Horizontal and vertical mounting
Interlocking feature
High noise immunity
Easy connectoring: simplex, duplex, and latching
connectors
A wide variety of package configurations and connectors
provide the designer with numerous mechanical solutions
to meet application requirements. The transmitter and
receiver components have been designed for use in high
volume/low cost assembly processes such as auto inser-
tion and wave soldering.
Flame retardant
Transmitters incorporate a 660 nm red LED for easy
visibility
Compatible with standard TTL circuitry
Applications
Industrial Drives/Frequency Inverters
Transmitters incorporate a 660 nm LED. Receivers
include a monolithic dc coupled, digital IC receiver
with open collector Schottky output transistor. An
internal pullup resistor is available for use in the
HFBR-25X1ETZ and HFBR-25X2ETZ receivers. A shield has
been integrated into the receiver IC to provide additional,
localized noise immunity.
Renewable Energies (Wind Turbines, Solar PV farms)
Power electronics
Reduction of lightning/voltage transient susceptibility
Motor controller triggering
Data communications and local area networks
Internal optics have been optimized for use with 1 mm
diameter plastic optical fiber. Versatile Link specifications
incorporate all connector interface losses. Therefore,
optical calculations for common link applications are
simplified.
Electromagnetic Compatibility (EMC) for regulated
systems: FCC, VDE, CSA, etc.
Tempest-secure data processing equipment
Isolation in test and measurement instruments
Error free signalling for industrial and manufacturing
equipment
Automotive communications and control networks
Noise immune communication in audio and video
equipment
HFBR-0500ETZ Series Part Number Guide
HFBR-X5XXETZ
1 = Transmitter
2 = Receiver
ET = extended temperature range
Z = RoHS compliant
5 = 600 nm Transmitter and
Receiver Products
1 = 5 MBd High Performance Link
2 = 1 MBd High Performance Link
6 = 155 MBd Receiver
2 = Horizontal Package
3 = Vertical Package
4 = 30° Tilted Package
7 = 155 MBd Transmitter
Available option – Horizontal Package
HFBR-x521ETZ
HFBR-x522ETZ
HFBR-x532ETZ
HFBR-x542ETZ
Available option – Vertical Package
HFBR-x531ETZ
Available option – 30° Tilted Package
HFBR-x541ETZ
Link Selection Guide
(Links specified from -40° to 85° C, for plastic optical fiber unless specified.)
Signal Rate
1 MBd
Distance (m) 25° C
Distance (m)
Transmitter
Receiver
67
38
43
20
HFBR-15x2ETZ
HFBR-15x1ETZ
HFBR-25x2ETZ
HFBR-25x1ETZ
5 Mbd
2
Application Literature
Handling
Application Note 1035 (Versatile Link)
Versatile Link components are auto-insertable. When
wave soldering is performed with Versatile Link compo-
nents, the optical port plug should be left in to prevent
contamination of the port. Do not use reflow solder
processes (i.e., infrared reflow or vapor-phase reflow).
Nonhalogenated water soluble fluxes (i.e., 0% chloride),
not rosin based fluxes, are recommended for use with
Versatile Link components.
Package and Handling Information
The compact Versatile Link package is made of a flame
®
retardant VALOX UL 94 V-0 material (UL file # E121562)
and uses the same pad layout as a standard, eight pin
dual-in-line package. Vertical and horizontal mountable
parts are available. These low profile Versatile Link pack-
ages are stackable and are enclosed to provide a dust
resistant seal. Snap action simplex, simplex latching,
duplex, and duplex latching connectors are offered with
simplex or duplex cables.
Versatile Link components are moisture sensitive
devices and are shipped in a moisture sealed bag. If the
components are exposed to air for an extended period of
time, they may require a baking step before the solder-
ing process. Refer to the special labeling on the shipping
tube for details.
Package Orientation
Performance and pinouts for the vertical and hori-
zontal packages are identical. To provide additional
attachment support for the vertical Versatile Link
housing, the designer has the option of using a self-
tapping screw through a printed circuit board into a
mounting hole at the bottom of the package. For most
applications this is not necessary.
Recommended Chemicals for Cleaning/Degreasing
Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane,
heptane. Other: soap solution, naphtha.
Do not use partially halogenated hydrocarbons such
as 1,1.1 trichloroethane, ketones such as MEK, acetone,
chloroform, ethyl acetate, methylene dichloride, phenol,
methylene chloride, or N-methylpyrolldone. Also, Avago
does not recommend the use of cleaners that use
halogenated hydrocarbons because of their potential
environmental harm.
Package Housing Color
Versatile Link components and simplex connectors are
color coded to eliminate confusion when making connec-
tions. Receivers are blue and transmitters are gray.
VALOX is a registered trademark of the General Electric Corporation.
3
Mechanical Dimensions
Horizontal Modules
Vertical Modules
2.03
(0.080)
6.86
(0.270)
5.08
(0.200)
10.16
(0.400)
10.16
(0.400)
2.03
(0.080)
5.08
(0.200)
18.8
(0.74)
18.29
(0.720)
6.86
(0.27)
4.19
(0.165)
0.64
(0.025)
7.62
(0.30)
3.81 (0.150) MAX.
3.56 (0.140) MIN.
18.80
(0.740)
1.27
7.62
0.51
(0.020)
(0.050)
(0.300)
2.54
(0.100)
0.64 (0.025) DIA.
1.85
(0.073)
2.77
(0.109)
DIMENSIONS IN MILLIMETERS (INCHES).
30° Tilted Modules
A
B
∅0.7
(0.03)
0.4
(0.02)
1.3
(0.05)
1.1
(0.05)
0.5
(0.02)
2.54
(0.100)
7.62
(0.300)
10.1
(0.40)
2.2
(0.09)
8.7
(0.34)
19.3
(0.76)
DIMENSIONS IN MILLIMETERS (INCHES).
4
Versatile Link Printed Board Layout Dimensions
Horizontal Module
Vertical Module
7.62
(0.300)
2.54
(0.100)
1.01 (0.040) DIA.
4
5
3
2
1
8
TOP VIEW
7.62
(0.300)
PCB EDGE
1.85
(0.073)
MIN.
DIMENSIONS IN MILLIMETERS (INCHES).
30° Tilted Modules
7.62
(0.300)
2.54
(0.100)
0.5
(0.02)
1.01
(0.040)
DIA.
Bottom View
DIMENSIONS IN MILLIMETERS (INCHES).
5
Interlocked (Stacked) Assemblies (refer to Figure 1)
packages can be disengaged if necessary. Repeated
stacking and unstacking causes no damage to individual
units.
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the inter-
locking mechanism by sliding the L bracket body from
above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked
units into uniform alignment. This technique prevents
potential harm that could occur to fingers and hands of
assemblers from the package pins. Stacked horizontal
To stack vertical packages, hold one unit in each hand,
with the pins facing away and the optical ports on the
bottom. Slide the L bracket unit into the L slot unit. The
straight edge used for horizontal package alignment is
not needed.
Stacking Horizontal Modules
Stacking Vertical Modules
Stacking 30° Tilted Modules
Figure 1. Interlocked (stacked) horizontal, vertical or 30° tilted packages
6
5 MBd Link (HFBR-15X1ETZ/25X1ETZ)
System Performance -40° to 85° C unless otherwise specified.
Parameter
Data Rate
Symbol
Min.
dc
Typ. Max. Units
Conditions
Ref.
Note 3
Note 3
High
Performance
5 MBd
5
MBd BER ≤10-9, PRBS:27-1
Link Distance
(Standard Cable)
Link Distance
(Improved Cable)
Propagation
Delay
d
d
17
m
m
m
m
ns
ns
IFdc = 60 mA
Fdc = 60 mA, 25° C
33
I
20
IFdc = 60 mA
38
IFdc = 60 mA, 25° C
RL = 560 , CL = 30 pF
fiber length = 0.5 m
-21.6 ≤PR ≤-9.5 dBm
PR = -15 dBm
tPLH
tPHL
90
50
140
140
Fig. 3, 6
Notes 1, 2
Pulse Width
tD
40
ns
Fig. 3, 5
Distortion tPLH-tPHL
RL = 560 , CL = 30 pF
Notes:
1. The propagation delay for one metre of cable is typically 5 ns.
2. Typical propagation delay is measured at P = -15 dBm.
R
3. Estimated typical link life expectancy at 40° C exceeds 10 years at 60 mA.
Figure 2. Typical 5 MBd interface circuit
Figure 3. 5 MBd propagation delay test circuit
7
Figure 4. Propagation delay test waveforms
100
80
60
40
20
0
70
60
50
40
30
20
10
0
X5X1ETZ -40° C
X5X1ETZ 25° C
X5X1ETZ 85° C
tPLH X5X1ETZ
tPHL X5X1ETZ
-27
-24
-21
-18
-15
-12
-9
-6
-27
-24
-21
-18
-15
-12
-9
-6
PR - INPUT OPTICAL POWER - dBm
PR - INPUT OPTICAL POWER - dBm
Figure 5. Typical link pulse width distortion vs. optical power
Figure 6. Typical link propagation delay vs. optical power
8
HFBR-15X1ETZ Transmitter
8 GROUND
5 GROUND
Pin #
Function
Anode
1
1
2
3
4
5
8
ANODE
Cathode
Ground
Ground
Ground
Ground
2
CATHODE
3
GROUND
4
GROUND
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
Absolute Maximum Ratings
Parameter
Symbol
TS
Min.
–40
–40
Max.
+85
+85
260
10
Units
°C
Reference
Storage Temperature
Operating Temperature
Lead Soldering Cycle
TA
°C
Temp.
Time
°C
Note 1, 4
Note 2, 3
sec
mA
Forward Input Current
Reverse Input Voltage
IFPK
IFdc
VBR
1000
80
5
V
Notes:
1. 1.6 mm below seating plane.
2. Recommended operating range between 10 and 750 mA.
3. 1 s pulse, 20 s period.
4. Moisture sensitivity level is MSL-3
All HFBR-15XXETZ LED transmitters are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed
draft scheduled to go into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. Contact your local Avago sales
representative for more information.
9
Transmitter Electrical/Optical Characteristics -40° to 85° C unless otherwise specified.
[5]
Parameter
Transmitter Output
Optical Power
Symbol
PT
Min.
-16.8
-14.3
Typ.
Max.
-7.1
-8.0
Units
dBm
dBm
%/°C
Conditions
IFdc = 60 mA
Ref.
Notes 1, 2
IFdc = 60 mA, 25° C
Output Optical Power
Temperature Coefficient
Peak Emission
PT/T
-0.85
660
PK
nm
Wavelength
Forward Voltage
Forward Voltage
Temperature Coefficient
Effective Diameter
Reverse Input Breakdown
Voltage
VF
1.43
5.0
1.67
2.05
V
IFdc = 60 mA
VF/T
-1.37
mV/°C
Fig. 7
D
1
mm
V
VBR
11.0
IFdc = 10 A,
TA = 25° C
Diode Capacitance
Rise Time
CO
tr
86
20
20
pF
ns
ns
VF = 0, f = MHz
10% to 90%,
IF = 60 mA
Note 3
Fall Time
tf
Notes:
1. Optical power measured at the end of 0.5 m of 1 mm diameter POF (NA = 0.5) with a large area detector.
2. Optical power, P (dBm) = 10 Log [P(W)/1000 W].
3. Rise and fall times are measured with a voltage pulse driving the transmitter driver IC (75451). A wide bandwidth optical to electrical waveform
analyzer, terminated to a 50 input of a wide bandwidth oscilloscope, is used for this response time measurement.
1.8
1.75
1.7
5
0
1.65
1.6
-5
-10
-15
-20
1.55
1.5
-40° C
25° C
85° C
-40° C
25° C
85° C
1.45
1.4
1
10
100
1
10
100
IFdc - TRANSMITTER DRIVE CURRENT (mA)
IFdc - TRANSMITTER DRIVE CURRENT (mA)
Figure 7. Typical forward voltage vs. drive current
Figure 8. Normalized typical output power vs. drive current
10
HFBR-25X1ETZ Receiver
Pin #
Function
VO
1
2
3
4
5
8
GROUND
5
Ground
VCC
1000 Ω
RL
4
3
VCC
RL
Ground
Ground
GROUND
VO
2
1
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
GROUND
8
Absolute Maximum Ratings
Parameter
Symbol
TS
Min.
–40
–40
Max.
+85
+85
260
10
Units
° C
° C
° C
sec
V
Reference
Storage Temperature
Operating Temperature
Lead Soldering Cycle
TA
Temp.
Time
Note 1, 3
Note 2
Supply Voltage
VCC
IOAV
POD
VO
–0.5
7
Output Collector Current
25
mA
mW
V
Output Collector Power Dissipation
Output Voltage
40
–0.5
–5
18
Pull-up Voltage
VP
VCC
5
V
Fan Out (TTL)
N
Notes:
1. 1.6 mm below seating plane.
2. It is essential that a bypass capacitor 0.1 F be connected from pin 2 to pin 3 of the receiver. Total lead length between both ends of the capacitor
and the pins should not exceed 20 mm.
3. Moisture sensitivity level is MSL-3
Receiver Electrical/Optical Characteristics -40° to 85° C, 4.75 V ≤V ≤5.25 V unless otherwise specified.
CC
Parameter
Input Optical Power
Level for Logic “0”
Symbol
PR(L)
Min.
–21.6
Typ.
Max.
–9.5
Units
dBm
Conditions
Ref.
Notes 1,
2, 4
VOL = 0.5 V
OL = 8 mA
OL = 0.5 V
OL = 8 mA, 25° C
I
V
I
–21.6
–8.7
–43
Input Optical Power
PR(H)
dBm
VOL = 5.25 V
Note 1
Level for Logic “1”
IOH ≤250 μA
High Level Output Current
Low Level Output Voltage
IOH
VOL
5
0.4
250
0.5
A
V
VO = 18 V, PR = 0
IOL = 8 mA,
PR = PR(L)MIN
VCC = 5.25 V,
PR = 0
Note 3
Note 3
High Level Supply
Current
Low Level Supply Current
ICCH
ICCL
3.5
6.2
6.3
10
mA
mA
Note 3
Note 3
VCC = 5.25 V
PR = -12.5 dBm
Effective Diameter
D
1
mm
Internal Pull-up Resistor
RL
680
1000
1700
Notes:
1. Optical flux, P (dBm) = 10 Log [P (μW)/1000 μW].
2. Optical power measured at the end of 1 mm diameter POF (NA = 0.5) with a large area detector.
3. R is open.
L
4. Pulsed LED operation at I > 80 mA will cause increased link t
propagation delay time. This extended t
time contributes to increased pulse
F
PLH
PLH
width distortion of the receiver output signal.
11
1 MBd Link
(High Performance HFBR-15X2ETZ/25X2ETZ)
System Performance Under recommended operating conditions unless otherwise specified.
Parameter
Data Rate
Symbol
Min.
dc
Typ. Max. Units
Conditions
Ref.
High
1
MBd BER ≤10-9, PRBS:27-1
Performance
1 MBd
Link Distance
(Standard Cable)
Link Distance
(Improved Cable)
Propagation
Delay
d
d
37
m
m
m
m
ns
ns
I
Fdc = 60 mA
Notes 1,
3, 4
58
IFdc = 60 mA, 25° C
IFdc = 60 mA
43
Notes 1,
3, 4
67
IFdc = 60 mA, 25° C
tPLH
tPHL
100 250
RL = 560 , CL = 30 pF
I = 0.5 metre
Fig. 10, 12
Notes 2, 4
80
140
PR = -24 dBm
Pulse Width
tD
20
ns
PR = -24 dBm
Fig. 10, 11
Note 4
Distortion tPLH-tPHL
RL = 560 , CL = 30 pF
Notes:
1. For I > 80 mA, the duty factor must be such as to keep I ≤80 mA. In addition, for I > 80 mA, the following rules for pulse width apply:
FPK
Fdc
FPK
I
I
≤160 mA: Pulse width ≤1 ms
> 160 mA: Pulse width ≤1 S, period ≥20 S.
FPK
FPK
2. The propagation delay for one meter of cable is typically 5 ns.
3. Estimated typical link life expectancy at 40° C exceeds 10 years at 60 mA.
4. Pulsed LED operation at I
> 80 mA will cause increased link t
propagation delay time. This extended t
time contributes to increased
FPK
PLH
PLH
pulse width distortion of the receiver output signal.
Figure 9. Required 1 MBd interface circuit
The HFBR-25X2ETZ receiver cannot be overdriven when using the required
interface circuit shown in Figure 9
12
Figure 10. 1 MBd propagation delay test circuit
90
80
70
60
50
40
30
20
10
0
120
100
80
60
40
20
0
X5X2ETZ -40° C
X5X2ETZ 25° C
X5X2ETZ 85° C
tPLH X5X2ETZ
tPHL X5X2ETZ
-27
-24
-21
-18
-15
-12
-9
-6
-27
-24
-21
-18
-15
-12
-9
-6
P
R - INPUT OPTICAL POWER - dBm
PR - INPUT OPTICAL POWER - dBm
Figure 11. Typical link pulse width distortion vs. optical power
Figure 12. Typical link propagation delay vs. optical power
Figure 13. Propagation delay test waveforms
13
HFBR-15X2ETZ Transmitters
Pin #
Function
Anode
1
2
3
4
5
8
8 GROUND
5 GROUND
Cathode
Ground
Ground
Ground
Ground
1
ANODE
2
CATHODE
3
GROUND
4
GROUND
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
Absolute Maximum Ratings
Parameter
Symbol
TS
Min.
–40
–40
Max.
+85
+85
260
10
Units
° C
Reference
Storage Temperature
Operating Temperature
Lead Soldering Cycle
TA
° C
Temp.
Time
° C
Note 1, 4
Note 2, 3
sec
mA
Forward Input Current
Reverse Input Voltage
IFPK
IFdc
VBR
1000
80
5
V
Notes:
1. 1.6 mm below seating plane.
2. Recommended operating range between 10 and 750 mA.
3. 1 s pulse, 20 s period.
4. Moisture sensitivity level is MSL-3
All HFBR15XXETZ LED transmitters are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed
draft scheduled to go into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. Contact your Avago sales
representative for more information.
Transmitter Electrical/Optical Characteristics -40° to 85° C unless otherwise specified.
For forward voltage and output power vs. drive current graphs.
Parameter
Transmitter Output
Optical Power
Symbol
PT
Min.
–13.9
–11.2
Typ.
Max.
–4.0
–5.1
Units
dBm
Conditions
IFdc = 60 mA
Fdc = 60 mA, 25° C
Ref.
Note 1
I
Output Optical Power
Temperature Coefficient
Peak Emission Wavelength
Forward Voltage
Forward Voltage
Temperature Coefficient
Effective Diameter
Reverse Input Breakdown
Voltage
PT/T
–0.85
%/° C
PK
VF
VF/T
660
1.67
–1.37
nm
V
mV/° C
1.43
5.0
2.05
IFdc = 60 mA
Fig. 09
Note 2
DT
VBR
1
11.0
mm
V
IFdc = 10 μA,
TA = 25° C
VF = 0, f = 1 MHz
10% to 90%,
IF = 60 mA
Diode Capacitance
Rise Time
Fall Time
CO
tr
tf
86
20
20
pF
ns
ns
Note:
1. Optical power measured at the end of 0.5 m of 1 mm diameter POF (NA = 0.5) with a large area detector.
2. Rise and fall times are measured with a voltage pulse driving the transmitter driver IC (75451). A wide bandwidth optical to electrical waveform
analyzer, terminated to a 50 input of a wide bandwidth oscilloscope, is used for this response time measurement.
14
HFBR-25X2ETZ Receivers
Pin #
Function
VO
1
2
3
4
5
8
GROUND
5
Ground
VCC
1000 Ω
RL
4
3
VCC
RL
GROUND
VO
Ground
Ground
2
1
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
GROUND
8
Absolute Maximum Ratings
Parameter
Symbol
TS
TA
Min.
–40
–40
Max.
+85
+85
260
10
7
25
40
18
Units
° C
° C
° C
sec
V
mA
mW
V
Reference
Storage Temperature
Operating Temperature
Lead Soldering Cycle
Temp.
Time
Note 1, 3
Note 2
Supply Voltage
Output Collector Current
Output Collector Power Dissipation
Output Voltage
Pull-up Voltage
VCC
IOAV
POD
VO
VP
N
–0.5
–0.5
–5
VCC
5
V
Fan Out (TTL)
Notes:
1. 1.6 mm below seating plane.
2. It is essential that a bypass capacitor 0.1 F be connected from pin 2 to pin 3 of the receiver. Total lead length between both ends of the capacitor
and the pins should not exceed 20 mm.
3. Moisture sensitivity level is MSL-3
Receiver Electrical/Optical Characteristics -40° to 85° C, 4.75 V ≤V ≤5.25 V unless otherwise specified.
CC
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Ref.
Receiver Optical Input
Power Level Logic 0
Optical Input Power
Level Logic 1
PR(L)
–24
-9.5
dBm
VOL 0.5 V
OL = 8 mA
VOH = 5.25 V
OH = ≤250 μA
Notes 1, 2, 3
I
PR(H)
-43
dBm
Note 4
I
High Level Output Current
Low Level Output Voltage
IOH
VOL
5
0.4
250
0.5
A
V
VO = 18 V, PR = 0
IOL = 8 mA
Note 5
Note 5
PR = PR(L)MIN
VCC = 5.25 V,
PR = 0
VCC = 5.25 V,
PR = -12.5 dBm
High Level Supply Current
Low Level Supply Current
ICCH
ICCL
3.5
6.2
6.3
10
mA
mA
Note 5
Note 5
Effective Diameter
D
1
mm
Internal Pull-up Resistor
RL
680
1000
1700
Notes:
1. Optical power measured at the end of 1 mm diameter POF (NA = 0.5) with a large area detector.
2. Pulsed LED operation at I > 80 mA will cause increased link t
propagation delay time. This extended t
time contributes to increased pulse
F
PLH
PLH
width distortion of the receiver output signal.
3. The LED drive circuit of Figure 11 is required for 1 MBd operation of the HFBR-25X2ETZ.
4. Optical flux, P (dBm) = 10 Log [P(W)/1000 W].
5. R is open.
L
15
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Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-3283EN - February 23, 2012
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