AO8807 [FREESCALE]
Dual P-Channel Enhancement Mode Field Effect Transistor; 双P沟道增强型场效应晶体管型号: | AO8807 |
厂家: | Freescale |
描述: | Dual P-Channel Enhancement Mode Field Effect Transistor |
文件: | 总5页 (文件大小:454K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AO8807
Dual P-Channel Enhancement Mode Field
Effect Transistor
General Description
The AO8807 uses advanced trench technology to
provide excellent R
DS(ON) , low gate charge and
operation with gate voltages as low as 1.8V. This device is suitable for use as a load switch. AO8807
and AO8807L are electrically identical.
- RoHS Compliant
-Halogen Free
Features
VDS (V) = -12V
ID = -6.5 A (VGS = -4.5V)
RDS(ON) < 20mΩ (VGS = -4.5V)
RDS(ON) < 24mΩ (VGS = -2.5V)
RDS(ON) < 30mΩ (VGS = -1.8V)
D1
D2
TSSOP-8
Top View
D2
S2
S2
G2
1
2
3
4
8
7
6
5
D1
S1
S1
G1
Rg
Rg
G1
G2
S1
S2
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Maximum
Units
VDS
Drain-Source Voltage
-12
V
VGS
Gate-Source Voltage
±8
-6.5
V
A
TA=25°C
TA=70°C
Continuous Drain
Current
Pulsed Drain Current C
ID
-5
IDM
-60
TA=25°C
TA=70°C
1.4
PD
W
Power Dissipation B
0.9
TJ, TSTG
Junction and Storage Temperature Range
-55 to 150
°C
Thermal Characteristics
Parameter
Symbol
Typ
73
Max
90
Units
°C/W
°C/W
°C/W
Maximum Junction-to-Ambient A
t ≤ 10s
RθJA
Maximum Junction-to-Ambient AD
Maximum Junction-to-Lead
96
125
75
Steady-State
Steady-State
RθJL
63
1 / 5
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AO8807
Dual P-Channel Enhancement Mode Field
Effect Transistor
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
ID=-250µA, VGS=0V
-12
V
VDS=-12V, VGS=0V
-1
-5
IDSS
Zero Gate Voltage Drain Current
µA
µA
TJ=55°C
IGSS
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
VDS=0V, VGS=±8V
±10
VGS(th)
ID(ON)
VDS=VGS ID=-250µA
-0.35 -0.53 -0.85
-60
V
GS=-4.5V, VDS=-5V
A
VGS=-4.5V, ID=-6.5A
16
23
20
28
24
30
36
mΩ
TJ=125°C
mΩ
mΩ
mΩ
RDS(ON)
Static Drain-Source On-Resistance
V
GS=-2.5V, ID=-6A
19
VGS=-1.8V, ID=-5.5A
VGS=-1.5V, ID=-5A
VDS=-5V, ID=-6.5A
IS=-1A,VGS=0V
23
28
gFS
VSD
IS
Forward Transconductance
Diode Forward Voltage
45
S
V
A
-0.56
-1
Maximum Body-Diode Continuous Current
-1.4
DYNAMIC PARAMETERS
Ciss
Coss
Crss
Rg
Input Capacitance
1740
334
200
1.3
2100
pF
pF
VGS=0V, VDS=-6V, f=1MHz
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
pF
kΩ
V
V
GS=0V, VDS=0V, f=1MHz
1.7
23
SWITCHING PARAMETERS
Qg
Qgs
Qgd
tD(on)
tr
Total Gate Charge
Gate Source Charge
Gate Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
19
4.5
5.3
240
580
7
nC
nC
nC
ns
GS=-4.5V, VDS=-6V, ID=-6.5A
V
GS=-4.5V, VDS=-6V, RL=0.9Ω,
ns
µs
RGEN=3Ω
tD(off)
tf
µs
4.2
22
trr
IF=-6.5A, dI/dt=100A/µs
IF=-6.5A, dI/dt=100A/µs
27
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
ns
Qrr
17
nC
A: The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The value
in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in 2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
2 / 5
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AO8807
Dual P-Channel Enhancement Mode Field
Effect Transistor
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
60
50
40
30
20
10
0
60
50
40
30
20
10
0
VDS=-5V
-4.5V
-2.5V
-3V
-2V
125°C
VGS=-1.5V
25°C
0
1
2
3
4
5
0
0.5
1
1.5
2
2.5
3
-VGS(Volts)
-VDS (Volts)
Figure 2: Transfer Characteristics(Note E)
Figure 1: On-Region Characteristics(Note E)
45
40
35
30
25
20
15
10
1.6
1.4
1.2
1.0
0.8
ID=-6A, VGS=-2.5V
VGS=-1.5V
ID=-6.5A, VGS=-4.5V
VGS=-2.5V
VGS=-1.8V
ID=-5A, VGS=-1.5V
ID=-5.5A, VGS=-1.8V
VGS=-4.5V
0
2
4
6
8
10 12 14 16 18 20
-ID (A)
0
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature(Note E)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage(Note E)
50
1E+01
1E+00
1E-01
1E-02
1E-03
1E-04
1E-05
ID=-6.5A
45
40
35
30
25
20
15
10
125°C
25°C
125°C
25°C
0.0
0.2
0.4
0.6
0.8
1.0
0
2
4
6
8
-VSD (Volts)
-VGS (Volts)
Figure 6: Body-Diode Characteristics(Note E)
Figure 5: On-Resistance vs. Gate-Source
Voltage(Note E)
3 / 5
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AO8807
Dual P-Channel Enhancement Mode Field
Effect Transistor
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
2800
2400
4.5
4
VDS=-6V
ID=-6.5A
Ciss
3.5
3
2000
1600
1200
800
400
0
2.5
2
1.5
1
Coss
0.5
0
Crss
0
4
8
12
-Qg (nC)
Figure 7: Gate-Charge Characteristics
16
20
0
2
4
6
8
10
12
-VDS (Volts)
Figure 8: Capacitance Characteristics
100
10
1
80
60
40
20
0
TJ(Max)=150°C
TA=25°C
10µs
RDS(ON)
limited
100µs
1ms
10s
0.1s
1s
0
DC
TJ(Max)=150°C
TA=25°C
0
0.0001 0.001
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Pulse Width (s)
V
DS (Volts)
Figure 9: Maximum Forward Biased Safe
Figure 10: Single Pulse Power Rating Junction-to-
Ambient (Note F)
Operating Area (Note F)
10
D=Ton/T
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=125°C/W
1
0.1
PD
Ton
T
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance(Note F)
4 / 5
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AO8807
Dual P-Channel Enhancement Mode Field
Effect Transistor
Gate Charge Test Circuit & Waveform
Vgs
Qg
-
-10V
-
VDC
Qgs
Qgd
+
Vds
VDC
+
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
90%
10%
-
DUT
Vdd
Vgs
VDC
+
Rg
Vgs
Vgs
td(on)
t
r
td(off)
t
f
ton
toff
Diode Recovery Test Circuit & Waveforms
Qrr = - Idt
Vds +
DUT
Vgs
trr
Vds -
L
-Isd
-IF
Isd
Vgs
dI/dt
-IRM
+
Vdd
VDC
Vdd
-
-Vds
Ig
5 / 5
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