AOB482L [FREESCALE]

80V N-Channel MOSFET; 80V N沟道MOSFET
AOB482L
型号: AOB482L
厂家: Freescale    Freescale
描述:

80V N-Channel MOSFET
80V N沟道MOSFET

文件: 总7页 (文件大小:544K)
中文:  中文翻译
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AOT482L/AOB482L  
80V N-Channel MOSFET  
General Description  
TM trench technology that combines excellent RDS(ON) with low  
efficiency with controlled switching behavior. This  
switching and general purpose applications.  
The AOT482L/AOB482L is fabricated with SDMOS  
gate charge and low Q .The result is outstanding  
rr  
universal technology is well suited for PWM, load  
Features  
VDS  
80V  
105A  
ID (at VGS=10V)  
RDS(ON) (at VGS=10V)  
RDS(ON) (at VGS = 7V)  
< 7.2mΩ  
< 9mΩ  
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
Maximum  
80  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
V
V
±25  
VGS  
Continuous Drain  
Current G  
Pulsed Drain Current C  
TC=25°C  
105  
82  
ID  
TC=100°C  
A
IDM  
330  
11  
TA=25°C  
TA=70°C  
Continuous Drain  
Current  
Avalanche Current C  
IDSM  
A
9
IAS, IAR  
82  
A
Avalanche energy L=0.1mH C  
EAS, EAR  
336  
333  
167  
2.1  
mJ  
TC=25°C  
Power Dissipation B  
TC=100°C  
PD  
W
TA=25°C  
PDSM  
W
Power Dissipation A  
TA=70°C  
1.3  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 175  
°C  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
11  
Max  
15  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
t 10s  
RθJA  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Case  
47  
60  
Steady-State  
Steady-State  
RθJC  
0.36  
0.45  
1/7  
www.freescale.net.cn  
AOT482L/AOB482L  
80V N-Channel MOSFET  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=250µA, VGS=0V  
80  
V
VDS=80V, VGS=0V  
10  
µA  
50  
IDSS  
Zero Gate Voltage Drain Current  
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
V
DS=0V, VGS= ±25V  
100  
3.7  
nA  
V
VGS(th)  
ID(ON)  
VDS=VGS ID=250µA  
VGS=10V, VDS=5V  
VGS=10V, ID=20A  
TO220  
2.5  
3.1  
330  
A
5.9  
11  
7.2  
13  
mΩ  
TJ=125°C  
VGS=7V, ID=20A  
TO220  
6.8  
5.6  
9
mΩ  
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
VGS=10V, ID=20A  
TO263  
6.9  
8.7  
VGS=7V, ID=20A  
TO263  
6.5  
50  
mΩ  
S
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
VDS=5V, ID=20A  
IS=1A,VGS=0V  
Maximum Body-Diode Continuous CurrentG  
0.64  
1
V
105  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
3240 4054 4870  
pF  
pF  
pF  
VGS=0V, VDS=40V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
320  
95  
458  
160  
0.45  
600  
225  
0.7  
VGS=0V, VDS=0V, f=1MHz  
VGS=10V, VDS=40V, ID=20A  
0.2  
SWITCHING PARAMETERS  
Qg(10V)  
Qgs  
Qgd  
tD(on)  
tr  
Total Gate Charge  
53  
16  
12  
66.8  
20.8  
20.2  
26  
81  
25  
30  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
VGS=10V, VDS=40V, RL=2,  
RGEN=3Ω  
18  
tD(off)  
tf  
Turn-Off DelayTime  
48  
Turn-Off Fall Time  
21  
trr  
IF=20A, dI/dt=500A/µs  
IF=20A, dI/dt=500A/µs  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
18  
75  
26  
34  
ns  
Qrr  
nC  
108  
140  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends  
on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep initial  
TJ =25°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming  
a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating.  
G. The maximum current rating is package limited.  
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.  
2/7  
www.freescale.net.cn  
AOT482L/AOB482L  
80V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
10V  
VDS=5V  
7V  
6V  
5.5V  
125°C  
VGS=5V  
25°C  
3
4
5
6
7
0
1
2
3
4
5
VGS(Volts)  
VDS (Volts)  
Figure 2: Transfer Characteristics (Note E)  
Fig 1: On-Region Characteristics (Note E)  
12  
10  
8
2.4  
2.2  
2
VGS=10V  
ID=20A  
VGS=7V  
1.8  
1.6  
1.4  
1.2  
1
6
VGS=10V  
VGS=7V  
ID=20A  
4
0.8  
2
0
25  
50  
75  
100 125 150 175 200  
0
5
10  
15  
20  
25  
30  
ID (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage (Note E)  
Figure 4: On-Resistance vs. Junction  
Temperature (Note E)  
16  
14  
12  
10  
8
1.0E+02  
ID=20A  
1.0E+01  
125°C  
125°C  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
25°C  
25°C  
6
4
5
6
7
8
9
10  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
VGS (Volts)  
VSD (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
Figure 6: Body-Diode Characteristics (Note E)  
3/7  
www.freescale.net.cn  
AOT482L/AOB482L  
80V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
6000  
5000  
4000  
3000  
2000  
1000  
0
10  
VDS=40V  
ID=20A  
8
Ciss  
6
4
Coss  
2
Crss  
0
0
10  
20  
30  
40  
50  
60  
70  
0
10  
20  
30  
V
40  
50  
60  
70  
80  
Qg (nC)  
DS (Volts)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
5000  
4000  
3000  
2000  
1000  
0
1000.0  
100.0  
10.0  
1.0  
10µs  
RDS(ON)  
limited  
TJ(Max)=175°C  
TC=25°C  
100µs  
1ms  
DC  
10ms  
TJ(Max)=175°C  
TC=25°C  
0.1  
0.0  
0.01  
0.1  
1
10  
100  
1000  
1E-05 0.0001 0.001 0.01  
0.1  
1
10  
VDS (Volts)  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
1
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=TC+PDM.ZθJC.RθJC  
RθJC=0.45°C/W  
0.1  
PD  
0.01  
0.001  
Ton  
T
Single Pulse  
0.00001 0.0001  
0.000001  
0.001  
0.01  
0.1  
1
10  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
4/7  
www.freescale.net.cn  
AOT482L/AOB482L  
80V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
1000  
100  
10  
350  
300  
250  
200  
150  
100  
50  
TA=25°C  
TA=100°C  
TA=125°C  
TA=150°C  
1
0
1
10  
100  
1000  
0
25  
50  
75  
100  
125  
150  
175  
Time in avalanche, tA (µs)  
TCASE (°C)  
Figure 12: Single Pulse Avalanche capability  
(Note C)  
Figure 13: Power De-rating (Note F)  
1000  
100  
10  
120  
100  
80  
60  
40  
20  
0
TA=25°C  
1
0.01  
1
100  
0
25  
50  
75  
TCASE (°C)  
Figure 14: Current De-rating (Note F)  
100  
125  
150  
175  
Pulse Width (s)  
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
10  
1
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=60°C/W  
0.1  
PD  
0.01  
0.001  
Single Pulse  
Ton  
T
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
5/7  
www.freescale.net.cn  
AOT482L/AOB482L  
80V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
240  
200  
160  
120  
80  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
35  
3
di/dt=800A/µs  
30  
125ºC  
di/dt=800A/µs  
2.5  
2
125ºC  
25  
trr  
Qrr  
20  
25ºC  
25ºC  
1.5  
1
15  
125ºC  
25ºC  
10  
S
Irm  
40  
25ºC  
0.5  
0
5
125º  
0
0
0
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
IS (A)  
IS (A)  
Figure 17: Diode Reverse Recovery Charge and  
Peak Current vs. Conduction Current  
Figure 18: Diode Reverse Recovery Time and  
Softness Factor vs. Conduction Current  
250  
200  
150  
100  
50  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
0
2.5  
2
Is=20A  
Is=20A  
125ºC  
125ºC  
1.5  
1
trr  
25ºC  
125ºC  
25ºC  
Qrr  
25ºC  
S
0.5  
Irm  
25ºC  
125ºC  
0
0
0
200  
400  
600  
800  
1000  
0
200  
400  
600  
800  
1000  
di/dt (A/µs)  
di/dt (A/µs)  
Figure 19: Diode Reverse Recovery Charge and  
Peak Current vs. di/dt  
Figure 20: Diode Reverse Recovery Time and  
Softness Factor vs. di/dt  
6/7  
www.freescale.net.cn  
AOT482L/AOB482L  
80V N-Channel MOSFET  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
Vgs  
Vgs  
td(on)  
t
r
td(off)  
t
f
ton  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
EAR= 1/2 LIA2R  
BVDSS  
Vds  
Id  
Vgs  
Vds  
+
Vgs  
Vdd  
I AR  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Q rr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
Isd  
I F  
Isd  
Vgs  
dI/dt  
I RM  
+
Vdd  
VDC  
Vdd  
-
Vds  
7/7  
www.freescale.net.cn  

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