AOD413A [FREESCALE]

40V P-Channel MOSFET; 40V P沟道MOSFET
AOD413A
型号: AOD413A
厂家: Freescale    Freescale
描述:

40V P-Channel MOSFET
40V P沟道MOSFET

文件: 总6页 (文件大小:494K)
中文:  中文翻译
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AOD413A  
40V P-Channel MOSFET  
General Description  
The AOD413A uses advanced trench technology and  
design to provide excellent RDS(ON) with low gate  
charge. With the excellent thermal resistance of the DPAK package, this device is well suited for high  
current load applications.  
Features  
VDS (V) = -40V  
ID = -12A  
(VGS = -10V)  
RDS(ON) < 44m(VGS = -10V)  
RDS(ON) < 66m(VGS = -4.5V)  
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
Drain-Source Voltage  
VDS  
-40  
V
Gate-Source Voltage  
Continuous Drain  
Current B,H  
Pulsed Drain Current C  
Avalanche Current C  
VGS  
±20  
-12  
V
TC=25°C  
TC=100°C  
ID  
-12  
A
IDM  
IAR  
EAR  
-30  
-20  
Repetitive avalanche energy L=0.1mH C  
20  
mJ  
W
°C  
TC=25°C  
50  
PD  
Power Dissipation B  
TC=100°C  
25  
TA=25°C  
2.5  
PDSM  
Power Dissipation A  
1.6  
TA=70°C  
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 175  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
16.7  
40  
Max  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A,G  
t 10s  
25  
50  
3
RθJA  
Maximum Junction-to-Ambient A,G  
Maximum Junction-to-Case F  
Steady-State  
Steady-State  
RθJC  
2
1/6  
www.freescale.net.cn  
AOD413A  
40V P-Channel MOSFET  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
ID= -250µA, VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
-40  
V
VDS= -40V, VGS=0V  
-1  
-5  
IDSS  
Zero Gate Voltage Drain Current  
µA  
TJ=55°C  
VDS=0V, VGS= ±20V  
VDS=VGS ID= -250µA  
VGS= -10V, VDS= -5V  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
±100  
-3  
nA  
V
VGS(th)  
ID(ON)  
-1.7  
-30  
-2  
A
V
GS= -10V, ID= -12A  
36  
52  
44  
65  
66  
RDS(ON)  
Static Drain-Source On-Resistance  
TJ=125°C  
mΩ  
VGS= -4.5V, ID= -8A  
VDS= -5V, ID= -12A  
IS= -1A,VGS=0V  
52  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
22  
S
V
A
-0.76  
-1  
Maximum Body-Diode Continuous Current  
-12  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
900  
97  
1125  
pF  
pF  
pF  
VGS=0V, VDS= -20V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
68  
VGS=0V, VDS=0V, f=1MHz  
14  
SWITCHING PARAMETERS  
Qg (-10V) Total Gate Charge  
Qg (-4.5V) Total Gate Charge  
16.2  
7.2  
21  
nC  
nC  
nC  
nC  
ns  
VGS= -10V, VDS= -20V,  
ID= -12A  
9.4  
Qgs  
Qgd  
tD(on)  
tr  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
3.8  
3.5  
6.2  
VGS= -10V, VDS= -20V, RL=1.6,  
RGEN=3Ω  
8.4  
ns  
tD(off)  
tf  
44.8  
41.2  
21.2  
13.8  
ns  
ns  
trr  
IF= -12A, dI/dt=100A/µs  
IF= -12A, dI/dt=100A/µs  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
Qrr  
nC  
A: The value of RθJA is measured with the device in a still air environment with T A =25°C. The power dissipation P DSM and current rating IDSM  
are based on TJ(MAX)=150°C, using t 10s junction-to-ambient thermal resistance.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming  
a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse ratin g.  
G. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.  
H. The maximum current rating is limited by bond-wires.  
*This device is guaranteed green after data code 8X11 (Sep 1ST 2008).  
Rev4: April 2011  
2/6  
www.freescale.net.cn  
AOD413A  
40V P-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
30  
30  
VDS= -5V  
-4.5V  
-10V  
25  
20  
15  
25  
20  
15  
10  
5
-4.0V  
-3.5V  
10  
125°C  
5
VGS= -2.5V  
3
25°C  
0
0
0
1
2
4
5
1.5  
2
2.5  
3
3.5  
4
4.5  
5
-VDS (Volts)  
-VGS(Volts)  
Figure 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
70  
65  
60  
55  
50  
45  
40  
35  
30  
1.8  
1.6  
1.4  
1.2  
1
VGS= -10V  
I
D
= -12A  
VGS= -4.5V  
VGS= -4.5V  
ID= -8A  
VGS= -10V  
0.8  
0.6  
0
5
10  
15  
20  
-60 -30  
0
30  
60  
90 120 150 180  
-ID (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
Figure 4: On-Resistance vs. Junction  
Temperature  
120  
100  
80  
100  
10  
ID= -12A  
1
0.1  
125°C  
125°C  
25°C  
25°C  
0.01  
60  
0.001  
0.0001  
0.00001  
40  
20  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
3
4
5
6
7
8
9
10  
-vSD (Volts)  
-VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Figure 6: Body-Diode Characteristics  
3/6  
www.freescale.net.cn  
AOD413A  
40V P-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
1200  
1000  
10  
8
VDS= -20V  
ID= -12A  
Ciss  
800  
600  
400  
200  
0
6
4
Coss  
2
Crss  
0
0
5
10  
15  
20  
25  
30  
35  
40  
0
2
4
6
8
10  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
12  
14  
16  
18  
-VDS (Volts)  
Figure 8: Capacitance Characteristics  
10000  
1000  
100  
100  
TJ(Max)=175°C  
TC=25°C  
10µs  
RDS(ON)  
limited  
100µs  
10  
1
1ms  
10ms  
DC  
TJ(Max)=175°C  
TC=25°C  
0.1  
10  
0.1  
1
10  
100  
0.00001 0.0001  
0.001  
0.01  
0.1  
1
-VDS (Volts)  
Pulse Width (s)  
Figure 9: Maximum Forward Biased  
Safe Operating Area (Note F)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
10  
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=Tc+PDM.ZθJC.RθJC  
RθJC=3°C/W  
1
0.1  
PD  
Ton  
T
Single Pulse  
0.0001  
0.01  
0.00001  
0.001  
0.01  
0.1  
1
10  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
4/6  
www.freescale.net.cn  
AOD413A  
40V P-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
60  
50  
40  
30  
20  
10  
0
20  
15  
10  
5
0
0
25  
50  
75  
CASE (°C)  
Figure 12: Power De-rating (Note B)  
100  
125  
150  
175  
0
25  
50  
75  
100  
125  
150  
175  
T
TCASE (°C)  
Figure 13: Current De-rating (Note B)  
1000  
100  
10  
TJ(Max)=150°C  
TA=25°C  
1
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 14: Single Pulse Power Rating Junction-to-Ambient (Note G)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
0.1  
PD  
0.01  
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
Ton  
Single Pulse  
0.0001  
T
R
θJA=50°C/W  
0.001  
0.00001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 15: Normalized Maximum Transient Thermal Impedance (Note G)  
5/6  
www.freescale.net.cn  
AOD413A  
40V P-Channel MOSFET  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
-
-10V  
-
VDC  
Qgs  
Qgd  
+
Vds  
VDC  
+
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
toff  
ton  
t
td(off)  
td(on)  
t
r
f
Vgs  
-
90%  
10%  
DUT  
Vdd  
Vgs  
VDC  
+
Rg  
Vgs  
Vds  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
EAR= 1/2 LIA2R  
L
Vds  
Id  
Vgs  
Vds  
-
BVDSS  
Vgs  
Vdd  
VDC  
+
Id  
Rg  
I AR  
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Qrr = - Idt  
Vds +  
DUT  
Vgs  
trr  
Vds -  
L
-Isd  
-IF  
Isd  
Vgs  
dI/dt  
-IRM  
+
Vdd  
VDC  
Vdd  
-
-Vds  
Ig  
6/6  
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