MC9S08DV128F2VLF [FREESCALE]
Microcontrollers; 微控制器
| 型号： | MC9S08DV128F2VLF |
| 厂家： | 
Freescale |
| 描述： | Microcontrollers |
| 文件： | 总458页 (文件大小：4788K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC9S08DZ128
MC9S08DZ96
MC9S08DV128
MC9S08DV96
Data Sheet
HCS08
Microcontrollers
MC9S08DZ128
Rev. 1
5/2008
freescale.com
MC9S08DZ128 Series Features
8-Bit HCS08 Central Processor Unit (CPU)
Peripherals
• 40-MHz HCS08 CPU (20-MHz bus)
• ADC — 24-channel, 12-bit resolution, 2.5 μs
conversion time, automatic compare function,
temperature sensor, internal bandgap reference channel
• HC08 instruction set with added BGND instruction
• Support for up to 32 interrupt/reset sources
• ACMPx — Two analog comparators with selectable
interrupt on rising, falling, or either edge of comparator
output; compare option to fixed internal bandgap
reference voltage; runs in stop3 mode
On-Chip Memory
• FLASH read/program/erase over full operating voltage
and temperature
• EEPROM in-circuit programmable memory; 8-byte
single-page or 4-byte dual-page erase sector; Program
and Erase while executing FLASH; Erase abort
• MSCAN — CAN protocol - Version 2.0 A, B; standard
and extended data frames; Support for remote frames;
Five receive buffers with FIFO storage scheme; Flexible
identifier acceptance filters programmable as: 2 x
32-bit, 4 x 16-bit, or 8 x 8-bit
• Random-access memory (RAM)
MC9S08 MC9S08 MC9S08 MC9S08
• SCIx — Two SCIs supporting LIN 2.0 Protocol and
SAE J2602 protocols; Full duplex non-return to zero
(NRZ); Master extended break generation; Slave
extended break detection; Wakeup on active edge
DZ128
128K
2K
DZ96
96K
2K
DV128
128K
—
DV96
96K
—
FLASH
EEPROM
RAM
8K
6K
6K
4K
• SPIx — Up to two SPIs; Full-duplex or single-wire
bidirectional; Double-buffered transmit and receive;
Master or Slave mode; MSB-first or LSB-first shifting
Power-Saving Modes
• Two very low power stop modes
• IICx — Up to two IICs; Up to 100 kbps with maximum
bus loading; Multi-master operation; Programmable
slave address; General Call Address; Interrupt driven
byte-by-byte data transfer
• Reduced power wait mode
• Very low power real time interrupt for use in run, wait,
and stop
• TPMx — One 6-channel (TPM1), one 2-channel
(TPM2) and one 4-channel (TPM3); Selectable input
capture, output compare, or buffered edge- and
center-aligned PWM on each channel.
Clock Source Options
• Oscillator (XOSC) — Loop-control Pierce oscillator;
Crystal or ceramic resonator range of 31.25 kHz to
38.4 kHz or 1 MHz to 16 MHz
• RTC — (Real-time counter) 8-bit modulus counter with
binary or decimal based prescaler; Real-time clock
capabilities using external crystal and RTC for precise
time base, time-of-day, calendar or task scheduling
functions; Free running on-chip low power oscillator
(1 kHz) for cyclic wake-up without external
components
• Multi-purpose Clock Generator (MCG) — PLL and
FLL modes; reference clock with nonvolatile trim
(0.2% resolution, 1.5% tolerance over temperature with
internal temperature compensation); External reference
with oscillator/resonator options
System Protection
• Watchdog computer operating properly (COP) reset
with option to run from backup dedicated 1-kHz
internal clock source or bus clock; with optional
windowed operation
Input/Output
• Up to 87 general-purpose input/output (I/O) pins and
1 input-only pin
• Up to 32 interrupt pins with selectable polarity on each
pin
• Low-voltage detection with reset or interrupt; selectable
trip points
• Hysteresis and configurable pull device on all input
pins.
• Illegal opcode detection with reset
• Illegal address detection with reset
• FLASH and EEPROM block protect
• Loss-of-lock protection
• Configurable slew rate and drive strength on all output
pins.
Package Options
Development Support
• 100-pin low-profile quad flat-pack(LQFP) — 14x14
• Single-wire background debug interface
mm
• On-chip, in-circuit emulation (ICE) with real-time bus
capture
• 64-pin low-profile quad flat-pack (LQFP) — 10x10 mm
• 48-pin low-profile quad flat-pack (LQFP) — 7x7 mm
MC9S08DZ128 Series Data Sheet
Covers: MC9S08DZ128
MC9S08DZ96
MC9S08DV128
MC9S08DV96
MC9S08DZ128
Rev. 1
5/2008
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
© Freescale Semiconductor, Inc., 2007, 2008. All rights reserved.
Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web will be
the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
http://freescale.com/
The following revision history table summarizes changes contained in this document.
Revision
Number
Revision
Date
Description of Changes
1
4/2008
Initial Release
© Freescale Semiconductor, Inc., 2007, 2008. All rights reserved.
This product incorporates SuperFlash® Technology licensed from SST.
MC9S08DZ128 Series Data Sheet, Rev. 1
6
Freescale Semiconductor
List of Chapters
Chapter
Title
Page
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Chapter 5
Chapter 6
Chapter 7
Chapter 8
Chapter 9
Chapter 10
Chapter 11
Chapter 12
Chapter 13
Chapter 14
Chapter 15
Chapter 16
Chapter 17
Chapter 18
Appendix A
Appendix B
Device Overview..............................................................................21
Pins and Connections.....................................................................27
Modes of Operation.........................................................................39
Memory.............................................................................................45
Resets, Interrupts, and General System Control..........................85
Parallel Input/Output Control........................................................101
Central Processor Unit (S08CPUV5)............................................143
Multi-Purpose Clock Generator (S08MCGV2) .............................165
5-V Analog Comparator (S08ACMPV3)........................................199
Analog-to-Digital Converter (S08ADC12V1)................................207
Inter-Integrated Circuit (S08IICV2) ...............................................233
Freescale’s Controller Area Network (S08MSCANV1) ...............253
Serial Peripheral Interface (S08SPIV3) ........................................307
Serial Communications Interface (S08SCIV4).............................323
Real-Time Counter (S08RTCV1) ...................................................343
Timer Pulse-Width Modulator (S08TPMV3).................................353
Development Support ...................................................................379
Debug Module (S08DBGV3) (128K)..............................................393
Electrical Characteristics..............................................................419
Ordering Information and Mechanical Drawings........................447
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
7
Contents
Section Number
Title
Page
Chapter 1
Device Overview
1.1 Devices in the MC9S08DZ128 Series..............................................................................................21
1.2 MCU Block Diagram .......................................................................................................................23
1.3 System Clock Distribution ...............................................................................................................25
Chapter 2
Pins and Connections
2.1 Device Pin Assignment ....................................................................................................................27
2.2 Recommended System Connections ................................................................................................31
2.2.1 Power ................................................................................................................................32
2.2.2 Oscillator ...........................................................................................................................32
2.2.3 RESET ..............................................................................................................................32
2.2.4 Background / Mode Select (BKGD/MS) ..........................................................................33
2.2.5 ADC Reference (V
, V
) Pins ..............................................................................33
REFH
REFL
2.2.6 General-Purpose I/O and Peripheral Ports ........................................................................33
Chapter 3
Modes of Operation
3.1 Introduction ......................................................................................................................................39
3.2 Features ............................................................................................................................................39
3.3 Run Mode.........................................................................................................................................39
3.4 Active Background Mode.................................................................................................................39
3.5 Wait Mode ........................................................................................................................................40
3.6 Stop Modes.......................................................................................................................................41
3.6.1 Stop3 Mode .......................................................................................................................41
3.6.2 Stop2 Mode .......................................................................................................................42
3.6.3 On-Chip Peripheral Modules in Stop Modes ....................................................................42
Chapter 4
Memory
4.1 MC9S08DZ128 Series Memory Map ..............................................................................................45
4.2 Reset and Interrupt Vector Assignments ..........................................................................................49
4.3 Register Addresses and Bit Assignments.........................................................................................51
4.4 Memory Management Unit ..............................................................................................................61
4.4.1 Features .............................................................................................................................61
4.4.2 Memory Expansion ...........................................................................................................61
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
9
Section Number
Title
Page
4.4.3 MMU Registers and Control Bits .....................................................................................63
4.5 RAM.................................................................................................................................................66
4.6 FLASH and EEPROM .....................................................................................................................67
4.6.1 Features .............................................................................................................................67
4.6.2 Program and Erase Times .................................................................................................67
4.6.3 Program and Erase Command Execution .........................................................................68
4.6.4 Burst Program Execution ..................................................................................................69
4.6.5 Sector Erase Abort ............................................................................................................72
4.6.6 Access Errors ....................................................................................................................73
4.6.7 Block Protection ................................................................................................................74
4.6.8 Vector Redirection ............................................................................................................74
4.6.9 Security .............................................................................................................................74
4.6.10 EEPROM Mapping ...........................................................................................................76
4.6.11 FLASH and EEPROM Registers and Control Bits ...........................................................76
Chapter 5
Resets, Interrupts, and General System Control
5.1 Introduction ......................................................................................................................................85
5.2 Features ............................................................................................................................................85
5.3 MCU Reset.......................................................................................................................................85
5.4 Computer Operating Properly (COP) Watchdog..............................................................................86
5.5 Interrupts ..........................................................................................................................................87
5.5.1 Interrupt Stack Frame .......................................................................................................88
5.5.2 External Interrupt Request (IRQ) Pin ...............................................................................88
5.5.3 Interrupt Vectors, Sources, and Local Masks ....................................................................89
5.6 Low-Voltage Detect (LVD) System .................................................................................................91
5.6.1 Power-On Reset Operation ...............................................................................................91
5.6.2 Low-Voltage Detection (LVD) Reset Operation ...............................................................91
5.6.3 Low-Voltage Warning (LVW) Interrupt Operation ...........................................................92
5.7 MCLK Output ..................................................................................................................................92
5.8 Reset, Interrupt, and System Control Registers and Control Bits....................................................92
5.8.1 Interrupt Pin Request Status and Control Register (IRQSC) ............................................92
5.8.2 System Reset Status Register (SRS) .................................................................................94
5.8.3 System Background Debug Force Reset Register (SBDFR) ............................................95
5.8.4 System Options Register 1 (SOPT1) ................................................................................96
5.8.5 System Options Register 2 (SOPT2) ................................................................................97
5.8.6 System Device Identification Register (SDIDH, SDIDL) ................................................98
5.8.7 System Power Management Status and Control 1 Register (SPMSC1) ...........................99
5.8.8 System Power Management Status and Control 2 Register (SPMSC2) .........................100
MC9S08DZ128 Series Data Sheet, Rev. 1
10
Freescale Semiconductor
Section Number
Title
Page
Chapter 6
Parallel Input/Output Control
6.1 Port Data and Data Direction .........................................................................................................101
6.2 Pull-up, Slew Rate, and Drive Strength..........................................................................................102
6.3 Pin Interrupts..................................................................................................................................103
6.3.1 Edge Only Sensitivity .....................................................................................................103
6.3.2 Edge and Level Sensitivity ..............................................................................................103
6.3.3 Pull-up/Pull-down Resistors ...........................................................................................104
6.3.4 Pin Interrupt Initialization ...............................................................................................104
6.4 Pin Behavior in Stop Modes...........................................................................................................104
6.5 Parallel I/O and Pin Control Registers ...........................................................................................104
6.5.1 Port A Registers ..............................................................................................................105
6.5.2 Port B Registers ..............................................................................................................109
6.5.3 Port C Registers ..............................................................................................................113
6.5.4 Port D Registers ..............................................................................................................116
6.5.5 Port E Registers ...............................................................................................................120
6.5.6 Port F Registers ...............................................................................................................123
6.5.7 Port G Registers ..............................................................................................................126
6.5.8 Port H Registers ..............................................................................................................129
6.5.9 Port J Registers ...............................................................................................................132
6.5.10 Port K Registers ..............................................................................................................136
6.5.11 Port L Registers ...............................................................................................................139
Chapter 7
Central Processor Unit (S08CPUV5)
7.1 Introduction ....................................................................................................................................143
7.1.1 Features ...........................................................................................................................143
7.2 Programmer’s Model and CPU Registers ......................................................................................144
7.2.1 Accumulator (A) .............................................................................................................144
7.2.2 Index Register (H:X) .......................................................................................................144
7.2.3 Stack Pointer (SP) ...........................................................................................................145
7.2.4 Program Counter (PC) ....................................................................................................145
7.2.5 Condition Code Register (CCR) .....................................................................................145
7.3 Addressing Modes..........................................................................................................................147
7.3.1 Inherent Addressing Mode (INH) ...................................................................................147
7.3.2 Relative Addressing Mode (REL) ...................................................................................147
7.3.3 Immediate Addressing Mode (IMM) ..............................................................................147
7.3.4 Direct Addressing Mode (DIR) ......................................................................................148
7.3.5 Extended Addressing Mode (EXT) ................................................................................148
7.3.6 Indexed Addressing Mode ..............................................................................................148
7.4 Special Operations..........................................................................................................................149
7.4.1 Reset Sequence ...............................................................................................................149
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
11
Section Number
Title
Page
7.4.2 Interrupt Sequence ..........................................................................................................149
7.4.3 Wait Mode Operation ......................................................................................................150
7.4.4 Stop Mode Operation ......................................................................................................150
7.4.5 BGND Instruction ...........................................................................................................151
7.5 CALL and RTC Instructions ..........................................................................................................151
7.6 HCS08 Instruction Set Summary ...................................................................................................153
Chapter 8
Multi-Purpose Clock Generator (S08MCGV2)
8.1 Introduction ....................................................................................................................................165
8.1.1 Features ...........................................................................................................................167
8.1.2 Modes of Operation ........................................................................................................169
8.2 External Signal Description ...........................................................................................................169
8.3 Register Definition .........................................................................................................................170
8.3.1 MCG Control Register 1 (MCGC1) ...............................................................................170
8.3.2 MCG Control Register 2 (MCGC2) ...............................................................................172
8.3.3 MCG Trim Register (MCGTRM) ...................................................................................173
8.3.4 MCG Status and Control Register (MCGSC) .................................................................174
8.3.5 MCG Control Register 3 (MCGC3) ...............................................................................175
8.3.6 MCG Test and Control Register (MCGT) ......................................................................177
8.4 Functional Description ...................................................................................................................178
8.4.1 Operational Modes ..........................................................................................................178
8.4.2 Mode Switching ..............................................................................................................182
8.4.3 Bus Frequency Divider ...................................................................................................183
8.4.4 Low Power Bit Usage .....................................................................................................183
8.4.5 Internal Reference Clock ................................................................................................183
8.4.6 External Reference Clock ...............................................................................................183
8.4.7 Fixed Frequency Clock ...................................................................................................184
8.5 Initialization / Application Information .........................................................................................185
8.5.1 MCG Module Initialization Sequence ............................................................................185
8.5.2 Using a 32.768 kHz Reference .......................................................................................186
8.5.3 MCG Mode Switching ....................................................................................................187
8.5.4 Calibrating the Internal Reference Clock (IRC) .............................................................195
Chapter 9
5-V Analog Comparator (S08ACMPV3)
9.1 Introduction ....................................................................................................................................199
9.1.1 ACMP Configuration Information ..................................................................................199
9.1.2 Features ...........................................................................................................................201
9.1.3 Modes of Operation ........................................................................................................201
9.1.4 Block Diagram ................................................................................................................201
9.2 External Signal Description ...........................................................................................................203
MC9S08DZ128 Series Data Sheet, Rev. 1
12
Freescale Semiconductor
Section Number
Title
Page
9.3 Memory Map .................................................................................................................................203
9.3.1 Register Descriptions ......................................................................................................203
9.4 Functional Description ...................................................................................................................205
Chapter 10
Analog-to-Digital Converter (S08ADC12V1)
10.1 Introduction ....................................................................................................................................207
10.1.1 Channel Assignments ......................................................................................................207
10.1.2 Analog Power and Ground Signal Names ......................................................................207
10.1.3 Alternate Clock ...............................................................................................................208
10.1.4 Hardware Trigger ............................................................................................................208
10.1.5 Temperature Sensor ........................................................................................................209
10.1.6 Features ...........................................................................................................................211
10.1.7 ADC Module Block Diagram .........................................................................................211
10.2 External Signal Description ...........................................................................................................212
10.2.1 Analog Power (V
) ..................................................................................................213
DDAD
10.2.2 Analog Ground (V
) .................................................................................................213
SSAD
10.2.3 Voltage Reference High (V
) ...................................................................................213
REFH
10.2.4 Voltage Reference Low (V
) .....................................................................................213
REFL
10.2.5 Analog Channel Inputs (ADx) ........................................................................................213
10.3 Register Definition .........................................................................................................................213
10.3.1 Status and Control Register 1 (ADCSC1) ......................................................................213
10.3.2 Status and Control Register 2 (ADCSC2) ......................................................................215
10.3.3 Data Result High Register (ADCRH) .............................................................................215
10.3.4 Data Result Low Register (ADCRL) ..............................................................................216
10.3.5 Compare Value High Register (ADCCVH) ....................................................................216
10.3.6 Compare Value Low Register (ADCCVL) .....................................................................217
10.3.7 Configuration Register (ADCCFG) ................................................................................217
10.3.8 Pin Control 1 Register (APCTL1) ..................................................................................218
10.3.9 Pin Control 2 Register (APCTL2) ..................................................................................219
10.3.10Pin Control 3 Register (APCTL3) ..................................................................................220
10.4 Functional Description ...................................................................................................................221
10.4.1 Clock Select and Divide Control ....................................................................................222
10.4.2 Input Select and Pin Control ...........................................................................................222
10.4.3 Hardware Trigger ............................................................................................................222
10.4.4 Conversion Control .........................................................................................................222
10.4.5 Automatic Compare Function .........................................................................................225
10.4.6 MCU Wait Mode Operation ............................................................................................225
10.4.7 MCU Stop3 Mode Operation ..........................................................................................226
10.4.8 MCU Stop2 Mode Operation ..........................................................................................226
10.5 Initialization Information ...............................................................................................................227
10.5.1 ADC Module Initialization Example .............................................................................227
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
13
Section Number
Title
Page
10.6 Application Information.................................................................................................................229
10.6.1 External Pins and Routing ..............................................................................................229
10.6.2 Sources of Error ..............................................................................................................230
Chapter 11
Inter-Integrated Circuit (S08IICV2)
11.1 Introduction ....................................................................................................................................233
11.1.1 IIC1 Configuration Information ......................................................................................233
11.1.2 Features ...........................................................................................................................235
11.1.3 Modes of Operation ........................................................................................................235
11.1.4 Block Diagram ................................................................................................................236
11.2 External Signal Description ...........................................................................................................236
11.2.1 SCL — Serial Clock Line ...............................................................................................236
11.2.2 SDA — Serial Data Line ................................................................................................236
11.3 Register Definition .........................................................................................................................236
11.3.1 IIC Address Register (IICxA) .........................................................................................237
11.3.2 IIC Frequency Divider Register (IICxF) .........................................................................237
11.3.3 IIC Control Register (IICxC1) ........................................................................................240
11.3.4 IIC Status Register (IICxS) .............................................................................................241
11.3.5 IIC Data I/O Register (IICxD) ........................................................................................242
11.3.6 IIC Control Register 2 (IICxC2) .....................................................................................242
11.4 Functional Description ...................................................................................................................243
11.4.1 IIC Protocol .....................................................................................................................243
11.4.2 10-bit Address .................................................................................................................247
11.4.3 General Call Address ......................................................................................................248
11.5 Resets .............................................................................................................................................248
11.6 Interrupts ........................................................................................................................................248
11.6.1 Byte Transfer Interrupt ....................................................................................................248
11.6.2 Address Detect Interrupt .................................................................................................248
11.6.3 Arbitration Lost Interrupt ................................................................................................248
11.7 Initialization/Application Information ...........................................................................................250
Chapter 12
Freescale’s Controller Area Network (S08MSCANV1)
12.1 Introduction ....................................................................................................................................253
12.1.1 Features ...........................................................................................................................255
12.1.2 Modes of Operation ........................................................................................................255
12.1.3 Block Diagram ................................................................................................................256
12.2 External Signal Description ...........................................................................................................256
12.2.1 RXCAN — CAN Receiver Input Pin .............................................................................256
12.2.2 TXCAN — CAN Transmitter Output Pin .....................................................................256
12.2.3 CAN System ...................................................................................................................256
MC9S08DZ128 Series Data Sheet, Rev. 1
14
Freescale Semiconductor
Section Number
Title
Page
12.3 Register Definition .........................................................................................................................257
12.3.1 MSCAN Control Register 0 (CANCTL0) ......................................................................257
12.3.2 MSCAN Control Register 1 (CANCTL1) ......................................................................260
12.3.3 MSCAN Bus Timing Register 0 (CANBTR0) ...............................................................261
12.3.4 MSCAN Bus Timing Register 1 (CANBTR1) ...............................................................262
12.3.5 MSCAN Receiver Interrupt Enable Register (CANRIER) .............................................265
12.3.6 MSCAN Transmitter Flag Register (CANTFLG) ..........................................................266
12.3.7 MSCAN Transmitter Interrupt Enable Register (CANTIER) ........................................267
12.3.8 MSCAN Transmitter Message Abort Request Register (CANTARQ) ...........................268
12.3.9 MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK) .................269
12.3.10MSCAN Transmit Buffer Selection Register (CANTBSEL) .........................................269
12.3.11MSCAN Identifier Acceptance Control Register (CANIDAC) ......................................270
12.3.12MSCAN Miscellaneous Register (CANMISC) ..............................................................271
12.3.13MSCAN Receive Error Counter (CANRXERR) ............................................................272
12.3.14MSCAN Transmit Error Counter (CANTXERR) ..........................................................273
12.3.15MSCAN Identifier Acceptance Registers (CANIDAR0-7) ............................................273
12.3.16MSCAN Identifier Mask Registers (CANIDMR0–CANIDMR7) .................................274
12.4 Programmer’s Model of Message Storage .....................................................................................275
12.4.1 Identifier Registers (IDR0–IDR3) ...................................................................................278
12.4.2 IDR0–IDR3 for Standard Identifier Mapping .................................................................280
12.4.3 Data Segment Registers (DSR0-7) .................................................................................281
12.4.4 Data Length Register (DLR) ...........................................................................................282
12.4.5 Transmit Buffer Priority Register (TBPR) ......................................................................283
12.4.6 Time Stamp Register (TSRH–TSRL) .............................................................................283
12.5 Functional Description ...................................................................................................................284
12.5.1 General ............................................................................................................................284
12.5.2 Message Storage .............................................................................................................285
12.5.3 Identifier Acceptance Filter .............................................................................................288
12.5.4 Modes of Operation ........................................................................................................295
12.5.5 Low-Power Options ........................................................................................................296
12.5.6 Reset Initialization ..........................................................................................................302
12.5.7 Interrupts .........................................................................................................................302
12.6 Initialization/Application Information ...........................................................................................304
12.6.1 MSCAN initialization .....................................................................................................304
12.6.2 Bus-Off Recovery ...........................................................................................................305
Chapter 13
Serial Peripheral Interface (S08SPIV3)
13.1 Introduction ....................................................................................................................................307
13.1.1 Features ...........................................................................................................................309
13.1.2 Block Diagrams ..............................................................................................................309
13.1.3 SPI Baud Rate Generation ..............................................................................................311
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
15
Section Number
Title
Page
13.2 External Signal Description ...........................................................................................................312
13.2.1 SPSCK — SPI Serial Clock ............................................................................................312
13.2.2 MOSI — Master Data Out, Slave Data In ......................................................................312
13.2.3 MISO — Master Data In, Slave Data Out ......................................................................312
13.2.4 SS — Slave Select ...........................................................................................................312
13.3 Modes of Operation........................................................................................................................313
13.3.1 SPI in Stop Modes ..........................................................................................................313
13.4 Register Definition .........................................................................................................................313
13.4.1 SPI Control Register 1 (SPIxC1) ....................................................................................313
13.4.2 SPI Control Register 2 (SPIxC2) ....................................................................................314
13.4.3 SPI Baud Rate Register (SPIxBR) ..................................................................................315
13.4.4 SPI Status Register (SPIxS) ............................................................................................316
13.4.5 SPI Data Register (SPIxD) ..............................................................................................317
13.5 Functional Description ...................................................................................................................318
13.5.1 SPI Clock Formats ..........................................................................................................318
13.5.2 SPI Interrupts ..................................................................................................................321
13.5.3 Mode Fault Detection .....................................................................................................321
Chapter 14
Serial Communications Interface (S08SCIV4)
14.1 Introduction ....................................................................................................................................323
14.1.1 SCI2 Configuration Information .....................................................................................323
14.1.2 Features ...........................................................................................................................325
14.1.3 Modes of Operation ........................................................................................................325
14.1.4 Block Diagram ................................................................................................................326
14.2 Register Definition .........................................................................................................................328
14.2.1 SCI Baud Rate Registers (SCIxBDH, SCIxBDL) ..........................................................328
14.2.2 SCI Control Register 1 (SCIxC1) ...................................................................................329
14.2.3 SCI Control Register 2 (SCIxC2) ...................................................................................330
14.2.4 SCI Status Register 1 (SCIxS1) ......................................................................................331
14.2.5 SCI Status Register 2 (SCIxS2) ......................................................................................333
14.2.6 SCI Control Register 3 (SCIxC3) ...................................................................................334
14.2.7 SCI Data Register (SCIxD) .............................................................................................335
14.3 Functional Description ...................................................................................................................335
14.3.1 Baud Rate Generation .....................................................................................................335
14.3.2 Transmitter Functional Description ................................................................................336
14.3.3 Receiver Functional Description .....................................................................................337
14.3.4 Interrupts and Status Flags ..............................................................................................339
14.3.5 Additional SCI Functions ...............................................................................................340
MC9S08DZ128 Series Data Sheet, Rev. 1
16
Freescale Semiconductor
Section Number
Title
Page
Chapter 15
Real-Time Counter (S08RTCV1)
15.1 Introduction ....................................................................................................................................343
15.1.1 RTC Clock Signal Names ...............................................................................................343
15.1.2 Features ...........................................................................................................................345
15.1.3 Modes of Operation ........................................................................................................345
15.1.4 Block Diagram ................................................................................................................346
15.2 External Signal Description ...........................................................................................................346
15.3 Register Definition .........................................................................................................................346
15.3.1 RTC Status and Control Register (RTCSC) ....................................................................347
15.3.2 RTC Counter Register (RTCCNT) ..................................................................................348
15.3.3 RTC Modulo Register (RTCMOD) ................................................................................348
15.4 Functional Description ...................................................................................................................348
15.4.1 RTC Operation Example .................................................................................................349
15.5 Initialization/Application Information ...........................................................................................350
Chapter 16
Timer Pulse-Width Modulator (S08TPMV3)
16.1 Introduction ....................................................................................................................................353
16.1.1 Features ...........................................................................................................................355
16.1.2 Modes of Operation ........................................................................................................355
16.1.3 Block Diagram ................................................................................................................356
16.2 Signal Description..........................................................................................................................358
16.2.1 Detailed Signal Descriptions ...........................................................................................358
16.3 Register Definition .........................................................................................................................362
16.3.1 TPM Status and Control Register (TPMxSC) ................................................................362
16.3.2 TPM-Counter Registers (TPMxCNTH:TPMxCNTL) ....................................................363
16.3.3 TPM Counter Modulo Registers (TPMxMODH:TPMxMODL) ....................................364
16.3.4 TPM Channel n Status and Control Register (TPMxCnSC) ..........................................365
16.3.5 TPM Channel Value Registers (TPMxCnVH:TPMxCnVL) ..........................................367
16.4 Functional Description ...................................................................................................................368
16.4.1 Counter ............................................................................................................................369
16.4.2 Channel Mode Selection .................................................................................................371
16.5 Reset Overview ..............................................................................................................................374
16.5.1 General ............................................................................................................................374
16.5.2 Description of Reset Operation .......................................................................................374
16.6 Interrupts ........................................................................................................................................374
16.6.1 General ............................................................................................................................374
16.6.2 Description of Interrupt Operation ..................................................................................375
16.7 The Differences from TPM v2 to TPM v3.....................................................................................376
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
17
Section Number
Title
Page
Chapter 17
Development Support
17.1 Introduction ....................................................................................................................................379
17.1.1 Forcing Active Background ............................................................................................379
17.1.2 Features ...........................................................................................................................380
17.2 Background Debug Controller (BDC) ...........................................................................................380
17.2.1 BKGD Pin Description ...................................................................................................381
17.2.2 Communication Details ..................................................................................................381
17.2.3 BDC Commands .............................................................................................................385
17.2.4 BDC Hardware Breakpoint .............................................................................................387
17.3 Register Definition .........................................................................................................................387
17.3.1 BDC Registers and Control Bits .....................................................................................388
17.3.2 System Background Debug Force Reset Register (SBDFR) ..........................................390
Chapter 18
Debug Module (S08DBGV3) (128K)
18.1 Introduction ....................................................................................................................................393
18.1.1 Features ...........................................................................................................................393
18.1.2 Modes of Operation ........................................................................................................394
18.1.3 Block Diagram ................................................................................................................394
18.2 Signal Description..........................................................................................................................394
18.3 Memory Map and Registers ...........................................................................................................395
18.3.1 Module Memory Map .....................................................................................................395
18.3.2
396
18.3.3 Register Descriptions ......................................................................................................397
18.4 Functional Description ...................................................................................................................410
18.4.1 Comparator .....................................................................................................................410
18.4.2 Breakpoints .....................................................................................................................411
18.4.3 Trigger Selection .............................................................................................................411
18.4.4 Trigger Break Control (TBC) .........................................................................................412
18.4.5 FIFO ................................................................................................................................415
18.4.6 Interrupt Priority .............................................................................................................416
18.5 Resets .............................................................................................................................................416
18.6 Interrupts ........................................................................................................................................417
18.7 Electrical Specifications .................................................................................................................417
Appendix A
Electrical Characteristics
A.1 Introduction ...................................................................................................................................419
A.2 Parameter Classification ................................................................................................................419
A.3 Absolute Maximum Ratings ..........................................................................................................419
A.4 Thermal Characteristics .................................................................................................................420
MC9S08DZ128 Series Data Sheet, Rev. 1
18
Freescale Semiconductor
Section Number
Title
Page
A.5 ESD Protection and Latch-Up Immunity ......................................................................................422
A.6 DC Characteristics .........................................................................................................................423
A.7 Supply Current Characteristics ......................................................................................................427
A.8 Analog Comparator (ACMP) Electricals ......................................................................................429
A.9 ADC Characteristics ......................................................................................................................431
A.10 External Oscillator (XOSC) Characteristics .................................................................................435
A.11 MCG Specifications ......................................................................................................................436
A.12 AC Characteristics .........................................................................................................................438
A.12.1 Control Timing ...............................................................................................................438
A.12.2 Timer/PWM ....................................................................................................................440
A.12.3 MSCAN ..........................................................................................................................441
A.12.4 SPI ...................................................................................................................................442
A.13 FLASH and EEPROM ..................................................................................................................445
A.14 EMC Performance .........................................................................................................................446
A.14.1 Radiated Emissions .........................................................................................................446
Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information ....................................................................................................................447
B.1.1 MC9S08DZ128 Series Devices ......................................................................................447
B.2 Mechanical Drawings ....................................................................................................................448
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
19
Chapter 1
Device Overview
MC9S08DZ128 Series devices are members of the low-cost, high-performance HCS08 Family of 8-bit
microcontroller units (MCUs). All MCUs in the family use the enhanced HCS08 core and are available
with a variety of modules, memory sizes, memory types, and package types.
1.1
Devices in the MC9S08DZ128 Series
This data sheet covers members of the MC9S08DZ128 Series of MCUs:
•
•
•
•
MC9S08DZ128
MC9S08DZ96
MC9S08DV128
MC9S08DV96
Table 1-1 summarizes the feature set available in the MC9S08DZ128 Series.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
21
Chapter 1 Device Overview
t
Table 1-1. MC9S08DZ128 Series Features by MCU and Pin Count
Feature
MC9S08DZ128
MC9S08DZ96
MC9S08DV128
MC9S08DV96
FLASH (bytes)
RAM (bytes)
131,072
8192
98,304
6016
131,072
6016
—
98,304
4096
—
EEPROM (bytes)
2048
2048
Pin quantity
Pin Interrupts
ACMP1
100
64
24
48
100
64
24
48
24
100
64
24
48
100
64
24
48
24
32
24
16
no
32
32
24
32
yes
yes1
24
yes
yes1
24
yes
yes1
24
yes
yes1
24
ACMP2
ADC channels
DBG
24
24
16
no
24
16
24
16
no
yes
yes
no
yes
yes
no
yes
yes
no
yes
yes
no
IIC1
IIC2
yes
yes
yes
n o
yes
IRQ
yes
yes
yes
yes
yes
yes
yes
no
yes
yes
yes
yes
yes
yes
yes
no
yes
yes
yes
yes
yes
yes
yes
no
yes
yes
yes
yes
yes
yes
yes
no
MCG
MSCAN
RTC
SCI1
SCI2
SPI1
SPI2
yes
no
yes
no
yes
no
yes
no
TPM1 channels
TPM2 channels
TPM3 channels
XOSC
6
6
6
6
2
42
2
42
2
42
2
42
yes
yes
yes
yes
yes
yes
yes
yes
COP Watchdog
1
ACMP2O is not available in the 48-pin package.
2
TPM3 pins are not available in the 64-pin and 48-pin packages.
MC9S08DZ128 Series Data Sheet, Rev. 1
22
Freescale Semiconductor
Chapter 1 Device Overview
Table 1-2 provides the functional version of the on-chip modules.
Table 1-2. Module Versions
Module
Version
Central Processor Unit
(CPU)
(ACMP_5V)
(ADC)
(DBG)
(IIC)
5
3
1
3
2
2
1
3
4
1
3
Analog Comparator (5V)
Analog-to-Digital Converter
Debug Module
Inter-Integrated Circuit
Multi-Purpose Clock Generator
Freescale’s Controller Area Network
Serial Peripheral Interface
Serial Communications Interface
Real-Time Counter
(MCG)
(MSCAN)
(SPI)
(SCI)
(RTC)
Timer Pulse Width Modulator
(TPM)
1.2
MCU Block Diagram
Figure 1-1 is the MC9S08DZ128 Series system-level block diagram.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
23
Chapter 1 Device Overview
PTA7/PIA7/ADP7/IRQ
PTA6/PIA6/ADP6
PTA5/PIA5/ADP5
HCS08 CORE
CPU
DEBUG MODULE (DBG)
BKGD/MS
RESET
PTA4/PIA4/ADP4
ACMP1O
ACMP1-
ACMP1+
BDC
BKP
PTA3/PIA3/ADP3/ACMP1O
PTA2/PIA2/ADP2/ACMP1-
PTA1/PIA1/ADP1/ACMP1+
PTA0/PIA0/ADP0/MCLK
ANALOG COMPARATOR
(ACMP1)
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
REAL-TIME COUNTER (RTC)
PTB7/PIB7/ADP15
PTB6/PIB6/ADP14
PTB5/PIB5/ADP13
PTB4/PIB4/ADP12
PTB3/PIB3/ADP11
PTB2/PIB2/ADP10
PTB1/PIB1/ADP9
PTB0/PIB0/ADP8
COP
INT
LVD
IRQ
V
DD
8
VOLTAGE
REGULATOR
V
SS
V
REFH
ADP7-ADP0
24-CHANNEL,12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
V
REFL
●
●
●
●
●
●
●
●
PTC7/ADP23
PTC6/ADP22
PTC5/ADP21
PTC4/ADP20
PTC3/ADP19
PTC2/ADP18
PTC1/ADP17
PTC0/ADP16
V
DDA
ADP15-ADP8
ADP23-ADP16
V
SSA
USER MEMORY
FLASH _EEPROM _RAM
MC9S08DZ128 = 128K_2K_8K
MC9S08DZ96 = 96K_2K_6K
MC9S08DV128 = 128K_0K_6K
MC9S08DV96 = 96K_0K_4K
TPM1CH5 -
6-CHANNEL TIMER/PWM TPM1CH0
TPM1CLK
PTJ7/PIJ7/TPM3CLK
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTD1/PID1/TPM2CH1
PTD0/PID0/TPM2CH0
TPM3CLK
6
PTJ6/PIJ6
PTJ5/PIJ5
PTJ4/PIJ4
MODULE (TPM1)
TPM2CH1,
TPM2CH0
TPM2CLK
TPM3CH0 -
TPM3CH3
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTJ3/PIJ3/TMP3CH3
PTJ2/PIJ2/TPM3CH2
PTJ1/PIJ1/TPM3CH1
PTJ0/PIJ0/TMP3CH0
4-CHANNEL TIMER/PWM
MODULE (TPM3)
4
RxCAN
TXCAN
MISO1
PTK7
PTK6
PTK5
PTK4
PTK3
PTK2
PTK1
PTK0
CONTROLLER AREA
NETWORK (MSCAN)
PTE7/RxD2/RXCAN
PTE6/TxD2/TXCAN
PTE5/SDA1/MISO1
PTE4/SCL1/MOSI1
PTE3/SPSCK1
PTE2/SS1
MOSI1
SPSCK1
SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
SS1
RxD1
TxD1
PTE1/RxD1
SERIAL COMMUNICATIONS
INTERFACE (SCI1)
PTE0/TxD1
●
●
PTL7
PTL6
PTL5
PTL4
PTL3
PTL2
PTL1
PTL0
PTF7
ACMP2O
ACMP2-
ACMP2+
SDA1
PTF6/ACMP2O
PTF5/ACMP2-
PTF4/ACMP2+
PTF3/TPM2CLK/SDA1
PTF2/TPM1CLK/SCL1
PTF1/RxD2
ANALOG COMPARATOR
(ACMP2)
SCL1
IIC MODULE (IIC1)
RxD2
TxD2
SERIAL COMMUNICATIONS
INTERFACE (SCI2)
PTF0/TxD2
SDA2
SCL2
PTH7
PTH6
PTG7/SDA2
PTG6/SCL2
PTG5
IIC MODULE (IIC2)
●
●
●
●
PTH5
MULTI-PURPOSE
CLOCK
GENERATOR
(MCG)
PTH4
MISO2
PTG4
PTG3
PTH3/MISO2
PTH2/MOSI2
PTH1/SPSCK2
PTH0/SS2
MOSI2
SPSCK2
SERIAL PERIPHERAL
PTG2
XTAL
EXTAL
INTERFACE MODULE (SPI2)
OSCILLATOR
(XOSC)
SS2
PTG1/XTAL
PTG0/EXTAL
- Pin not connected in 64-pin and 48-pin packages ● - Pin not available in the 48-pin package
- In 48-pin package, VDDA and VREFH are internally connected to each other and VSSA and VREFL are internally connected to each other.
Figure 1-1. MC9S08DZ128 Block Diagram
MC9S08DZ128 Series Data Sheet, Rev. 1
24
Freescale Semiconductor
Chapter 1 Device Overview
1.3
System Clock Distribution
Figure 1-2 shows a simplified clock connection diagram. Some modules in the MCU have selectable clock
inputs as shown. The clock inputs to the modules indicate the clock(s) that are used to drive the module
function.
The following are the clocks used in this MCU:
•
•
•
•
BUSCLK — The frequency of the bus is always half of MCGOUT.
LPO — Independent 1-kHz clock that can be selected as the source for the COP and RTC modules.
MCGOUT — Primary output of the MCG and is twice the bus frequency.
MCGLCLK — Development tools can select this clock source to speed up BDC communications
in systems where BUSCLK is configured to run at a very slow frequency.
•
MCGERCLK — External reference clock can be selected as the RTC clock source. It can also be
used as the alternate clock for the ADC and MSCAN.
•
•
•
•
•
MCGIRCLK — Internal reference clock can be selected as the RTC clock source.
MCGFFCLK — Fixed frequency clock can be selected as clock source for the TPMx.
TPM1CLK — External input clock source for TPM1.
TPM2CLK — External input clock source for TPM2.
TPM3CLK — External input clock source for TPM3.
TPM1CLK TPM2CLK
TPM3CLK
TPM3
1 kHZ
LPO
TPM1
TPM2
IIC1
SCI1
SCI2
SPI1
SPI2
IIC2
COP
RTC
MCGERCLK
MCGIRCLK
MCG
MCGFFCLK
FFCLK*
÷2
÷2
MCGOUT
MCGLCLK
BUSCLK
XOSC
CPU
BDC
MSCAN
FLASH
EEPROM
ADC
ADC has min and max
FLASH and EEPROM
have frequency
requirements for program
and erase operation. See
the electricals appendix
for details.
EXTAL
XTAL
frequency requirements.
See the ADC chapter
and electricals appendix
for details.
* The fixed frequency clock (FFCLK) is internally
synchronized to the bus clock and must not exceed one half
of the bus clock frequency.
Figure 1-2. System Clock Distribution Diagram
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
25
Chapter 1 Device Overview
MC9S08DZ128 Series Data Sheet, Rev. 1
26
Freescale Semiconductor
Chapter 2
Pins and Connections
This section describes signals that connect to package pins. It includes pinout diagrams, recommended
system connections, and detailed discussions of signals.
2.1
Device Pin Assignment
This section shows the pin assignments for MC9S08DZ128 Series MCUs in the available packages.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
27
Chapter 2 Pins and Connections
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
PTB1/PIB1/ADP9
PTC2/ADP18
1
2
3
4
5
6
7
8
PTB6/PIB6/ADP14
PTC5/ADP21
PTA0/PIA0/ADP0/MCLK
PTC1/ADP17
PTB0/PIB0/ADP8
PTA7/PIA7/ADP7/IRQ
PTC6/ADP22
PTB7/PIB7/ADP15
PTC7/ADP23
PTC0/ADP16
PTH7
PTH6
PTJ0/PIJ0/TPM3CH0
PTJ1/PIJ1/TPM3CH1
PTH5
9
V
DD
PTH4
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
V
SS
BKGD/MS
PTG0/EXTAL
PTG1/XTAL
RESET
100-Pin
LQFP
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
V
PTJ2/PIJ2/TPM3CH2
PTJ3/PIJ3/TPM3CH3
PTL5
DD
V
SS
PTL3
PTF4/ACMP2+
PTF5/ACMP2-
PTF6/ACMP2O
PTJ4/PIJ4
PTF7
PTH3/MISO2
PTH2/MOSI2
PTH1/SPSCK2
PTH0/SS2
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTJ5/PIJ5
PTJ6/PIJ6
PTJ7/PIJ7/TPM3CLK
PTE0/TxD1
PTE1/RxD1
Figure 2-1. MC9S08DZ128 Series in 100-Pin LQFP Package
MC9S08DZ128 Series Data Sheet, Rev. 1
28
Freescale Semiconductor
Chapter 2 Pins and Connections
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PTB1/PIB1/ADP9
PTC2/ADP18
1
2
3
4
5
6
7
8
PTB6/PIB6/ADP14
PTC5/ADP21
PTA0/PIA0/ADP0/MCLK
PTC1/ADP17
PTA7/PIA7/ADP7/IRQ
PTC6/ADP22
PTB0/PIB0/ADP8
PTC0/ADP16
BKGD/MS
PTB7/PIB7/ADP15
PTC7/ADP23
V
DD
64-Pin
LQFP
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
V
SS
9
PTG0/EXTAL
PTG1/XTAL
RESET
V
10
11
12
13
14
15
16
DD
V
PTF7
SS
PTF4/ACMP2+
PTF5/ACMP2-
PTF6/ACMP2O
PTE0/TxD1
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTE1/RxD1
Figure 2-2. MC9S08DZ128 Series in 64-Pin LQFP Package
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
29
Chapter 2 Pins and Connections
36
35
34
33
32
31
30
29
28
27
26
25
PTB6/PIB6/ADP14
PTA7/PIA7/ADP7/IRQ
PTB7/PIB7/ADP15
PTB1/PIB1/ADP9
1
2
3
4
5
6
7
8
PTA0/PIA0/ADP0/MCLK
PTB0/PIB0/ADP8
BKGD/MS
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
V
DD
V
SS
PTG0/EXTAL
PTG1/XTAL
RESET
48-Pin LQFP
V
DD
V
SS
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTF4/ACMP2+
PTF5/ACMP2-
PTE0/TxD1
PTE1/RxD1
9
10
11
12
V
and V
are internally connected to V
and V , respectively.
DDA SSA
REFH
REFL
Figure 2-3. MC9S08DZ128 Series in 48-Pin LQFP
MC9S08DZ128 Series Data Sheet, Rev. 1
30
Freescale Semiconductor
Chapter 2 Pins and Connections
2.2
Recommended System Connections
Figure 2-4 shows pin connections that are common to MC9S08DZ128 Series application systems.
MC9S08DZ128
V
DD
+
C
BY
C
+
BLK
5 V
0.1 μF
10 μF
PTA0/PIA0/ADP0/MCLK
PTA1/PIA1/ADP1/ACMP1+
PTA2/PIA2/ADP2/ACMP1-
PTA3/PIA3/ADP3/ACMP1O
PTA4/PIA4/ADP4
PTA5/PIA5/ADP5
PTA6/PIA6/ADP6
PTA7/PIA7/ADP7/IRQ
V
SS
PORT
A
V
V
DDA
SYSTEM
POWER
C
BY
REFH
0.1 μF
IRQ
V
V
REFL
SSA
PTB0/PIB0/ADP8
PTB1/PIB1/ADP9
PTB2/PIB2/ADP10
PTB3/PIB3/ADP11
PTB4/PIB4/ADP12
PTB5/PIB5/ADP13
PTB6/PIB6/ADP14
PTB7/PIB7/ADP15
PORT
B
BACKGROUND HEADER
BKGD/MS
RESET
V
DD
V
DD
PTC0/ADP16
PTC1/ADP17
PTC2/ADP18
PTC3/ADP19
PTC4/ADP20
PTC5/ADP21
PTC6/ADP22
PTC7/ADP23
4.7 kΩ–10 kΩ
0.1 μF
PORT
C
OPTIONAL
MANUAL
RESET
PTL0
PTL1
PTL2
PTL3
PTL4
PTL5
PTL6
PTL7
PTD0/PID0/TPM2CH0
PTD1/PID1/TPM2CH1
PTD2/PID2/TPM1CH0
PTD3/PID3/TPM1CH1
PTD4/PID4/TPM1CH2
PTD5/PID5/TPM1CH3
PTD6/PID6/TPM1CH4
PTD7/PID7/TPM1CH5
PORT
L
PORT
D
PTK0
PTK1
PTK2
PTK3
PTK4
PTK5
PTK6
PTK7
PTE0/TxD1
PTE1/RxD1
PTE2/SS1
PTE3/SPSCK1
PTE4/SCL1/MOSI1
PTE5/SDA1/MISO1
PTE6/TxD2/TXCAN
PTE7/RxD2/RXCAN
PORT
K
PORT
E
PTF0/TxD2
PTF1/RxD2
PTJ0/PIJ0/TPM3CH0
PTJ1/PIJ1/TPM3CH1
PTJ2/PIJ2/TPM3CH2
PTJ3/PIJ3/TPM3CH3
PTJ4/PIJ4
PTJ5/PIJ5
PTJ6/PIJ6
PTJ7/PIJ7/TPM3CLK
PTF2/TPM1CLK/SCL1
PTF3/TPM2CLK/SDA1
PTF4/ACMP2+
PTF5/ACMP2–
PTF6/ACMP2O
PORT
F
PORT
J
R
R
S
F
PTF7
C2
C1
PTG0/EXTAL
PTG1/XTAL
PTG2
PTG3
PTG4
PTH0/SS2
PTH1/SPSCK2
PTH2/MOSI2
PTH3/MISO2
PTH4
X1
PORT
G
PORT
H
PTG5
PTG6/SCL2
PTG7/SDA2
PTH5
PTH6
PTH7
Figure 2-4. Basic System Connections (Shown in 100Pin Package)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
31
Chapter 2 Pins and Connections
2.2.1
Power
V
and V are the primary power supply pins for the MCU. This voltage source supplies power to all
SS
DD
I/O buffer circuitry and to an internal voltage regulator. The internal voltage regulator provides regulated
lower-voltage source to the CPU and other internal circuitry of the MCU.
Typically, application systems have two separate capacitors across the power pins. In this case, there
should be a bulk electrolytic capacitor, such as a 10-μF tantalum capacitor, to provide bulk charge storage
for the overall system and a 0.1-μF ceramic bypass capacitor located as near to the MCU power pins as
practical to suppress high-frequency noise. The MC9S08DZ128 Series has up to three V pins. Each pin
DD
must have a bypass capacitor for best noise suppression.
V
and V
are the analog power supply pins for the MCU. This voltage source supplies power to the
DDA
SSA
ADC module. A 0.1-μF ceramic bypass capacitor should be located as near to the MCU power pins as
practical to suppress high-frequency noise.
2.2.2
Oscillator
Immediately after reset, the MCU uses an internally generated clock provided by the multi-purpose clock
generator (MCG) module. For more information on the MCG, see Chapter 8, “Multi-Purpose Clock
Generator (S08MCGV2).”
The oscillator (XOSC) in this MCU is a Pierce oscillator that can accommodate a crystal or ceramic
resonator. Rather than a crystal or ceramic resonator, an external oscillator can be connected to the EXTAL
input pin.
Refer to Figure 2-4 for the following discussion. R (when used) and R should be low-inductance
S
F
resistors such as carbon composition resistors. Wire-wound resistors and some metal film resistors have
too much inductance. C1 and C2 normally should be high-quality ceramic capacitors that are specifically
designed for high-frequency applications.
R is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup; its value
F
is not generally critical. Typical systems use 1 MΩ to 10 MΩ. Higher values are sensitive to humidity, and
lower values reduce gain and (in extreme cases) could prevent startup.
C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific
crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin
capacitance when selecting C1 and C2. The crystal manufacturer typically specifies a load capacitance
which is the series combination of C1 and C2 (which are usually the same size). As a first-order
approximation, use 10 pF as an estimate of combined pin and PCB capacitance for each oscillator pin
(EXTAL and XTAL).
2.2.3
RESET
RESET is a dedicated pin with a pull-up device built in. It has input hysteresis, a high current output driver,
and no output slew rate control. Internal power-on reset and low-voltage reset circuitry typically make
external reset circuitry unnecessary. This pin is normally connected to the standard 6-pin background
debug connector so a development system can directly reset the MCU system. If desired, a manual external
reset can be added by supplying a simple switch to ground (pull reset pin low to force a reset).
MC9S08DZ128 Series Data Sheet, Rev. 1
32
Freescale Semiconductor
Chapter 2 Pins and Connections
Whenever any reset is initiated (whether from an external signal or from an internal system), the RESET
pin is driven low for about 34 bus cycles. The reset circuitry decodes the cause of reset and records it by
setting a corresponding bit in the system reset status register (SRS).
2.2.4
Background / Mode Select (BKGD/MS)
While in reset, the BKGD/MS pin functions as a mode select pin. Immediately after reset rises, the pin
functions as the background pin and can be used for background debug communication. While functioning
as a background or mode select pin, the pin includes an internal pull-up device, input hysteresis, a standard
output driver, and no output slew rate control.
If nothing is connected to this pin, the MCU will enter normal operating mode at the rising edge of reset.
If a debug system is connected to the 6-pin standard background debug header, it can hold BKGD low
during the rising edge of reset which forces the MCU to active background mode.
The BKGD/MS pin is used primarily for background debug controller (BDC) communications using a
custom protocol that uses 16 clock cycles of the target MCU’s BDC clock per bit time. The target MCU’s
BDC clock could be as fast as the bus clock rate, so there should never be any significant capacitance
connected to the BKGD/MS pin that could interfere with background serial communications.
Although the BKGD/MS pin is a pseudo open-drain pin, the background debug communication protocol
provides brief, actively driven, high speedup pulses to ensure fast rise times. Small capacitances from
cables and the absolute value of the internal pull-up device play almost no role in determining rise and fall
times on the BKGD/MS pin.
2.2.5
ADC Reference (VREFH, VREFL) Pins
The V
and V
pins are the voltage reference high and voltage reference low inputs, respectively,
REFH
REFL
for the ADC module.
2.2.6
General-Purpose I/O and Peripheral Ports
The MC9S08DZ128 Series series of MCUs support up to 87 general-purpose I/O pins and 1 input-only
pin, which are shared with on-chip peripheral functions (timers, serial I/O, ADC, MSCAN, etc.).
When a port pin is configured as a general-purpose output or a peripheral uses the port pin as an output,
software can select one of two drive strengths and enable or disable slew rate control. When a port pin is
configured as a general-purpose input or a peripheral uses the port pin as an input, software can enable a
pull-up device. Immediately after reset, all of these pins are configured as high-impedance general-purpose
inputs with internal pull-up devices disabled.
When an on-chip peripheral system is controlling a pin, data direction control bits still determine what is
read from port data registers even though the peripheral module controls the pin direction by controlling
the enable for the pin’s output buffer. For information about controlling these pins as general-purpose I/O
pins, see Chapter 6, “Parallel Input/Output Control.”
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
33
Chapter 2 Pins and Connections
NOTE
To avoid extra current drain from floating input pins, the reset initialization
routine in the application program should either enable on-chip pull-up
devices or change the direction of unused or non-bonded pins to outputs so
they do not float.
Table 2-1. Pin Availability by Package Pin-Count
Pin Number
<-- Lowest Priority --> Highest
Port
Alt 1
100
64
48
Alt 2
Pin/Interrupt
1
1
2
1
—
2
PTB6
PTC5
PTA7
PTC6
PTB7
PTC7
PTJ0
PTJ1
PTJ2
PTJ3
PIB6
ADP14
2
ADP21
3
3
PIA7
PIB7
ADP7
IRQ
4
4
—
3
ADP22
5
5
ADP15
6
6
—
—
—
—
—
4
ADP23
7
—
—
—
—
7
PIJ0
PIJ1
PIJ2
PIJ3
TPM3CH0
TPM3CH1
TPM3CH2
TPM3CH3
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
VDD
VSS
8
5
9
6
PTG0
PTG1
EXTAL
XTAL
10
11
—
12
13
14
—
—
—
—
15
16
7
8
RESET
—
9
PTL5
PTF4
ACMP2+
ACMP2-
ACMP2O
10 PTF5
—
—
—
—
—
PTF6
PTJ4
PTJ5
PTJ6
PTJ7
PIJ4
PIJ5
PIJ6
PIJ7
TPM3CLK
11 PTE0
12 PTE11
TxD1
RxD1
MC9S08DZ128 Series Data Sheet, Rev. 1
34
Freescale Semiconductor
Chapter 2 Pins and Connections
Table 2-1. Pin Availability by Package Pin-Count (continued)
Pin Number
<-- Lowest Priority --> Highest
Port
Alt 1
100
64
48
Alt 2
SS1
Pin/Interrupt
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
17
18
19
20
21
22
—
—
23
24
25
26
—
—
27
28
—
—
29
30
—
—
—
31
32
13 PTE2
14 PTE3
15 PTE4
16 PTE5
SPSCK1
MOSI1
MISO1
SCL12
SDA12
—
—
—
—
PTG2
PTG3
PTL6
PTL7
17 PTF0
18 PTF1
19 PTF2
20 PTF3
—
TxD23
RxD23
SCL12
SDA12
VDD
TPM1CLK
TPM2CLK
—
VSS
—
—
—
—
PTG4
PTG5
PTG6
PTG7
SCL2
SDA2
21 PTE6
22 PTE7
TxD23
RxD23
TXCAN
RxCAN
—
—
—
PTL0
PTL1
PTL2
23 PTD0
24 PTD1
PID0
PID1
TPM2CH0
TPM2CH1
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
35
Chapter 2 Pins and Connections
Table 2-1. Pin Availability by Package Pin-Count (continued)
Pin Number
<-- Lowest Priority --> Highest
Port
Alt 1
100
64
48
Alt 2
Pin/Interrupt
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
33
34
35
36
—
—
—
—
37
—
38
39
40
41
42
—
—
—
—
43
44
45
46
47
48
49
50
51
52
53
54
—
—
—
—
—
55
56
25 PTD2
26 PTD3
27 PTD4
28 PTD5
PID2
PID3
PID4
PID5
TPM1CH0
TPM1CH1
TPM1CH2
TPM1CH3
SS2
—
—
—
—
—
—
29
30
PTH0
PTH1
PTH2
PTH3
PTF7
PTL3
SPSCK2
MOSI2
MISO2
VSS
VDD
31 PTD6
32 PTD7
33
PID6
PID7
TPM1CH4
TPM1CH5
MS
BKGD
—
—
—
—
—
PTH4
PTH5
PTH6
PTH7
PTC0
ADP16
ADP8
34 PTB0
PTC1
35 PTA0
PTC2
PIB0
PIA0
—
ADP17
ADP0
MCLK
—
ADP18
ADP9
36 PTB1
37 PTA1
38 PTB2
39 PTA2
PIB1
PIA1
PIB2
PIA2
ADP14
ADP10
ADP24
ADP19
ADP11
ADP3
ACMP1+4
ACMP1-4
—
PTC3
40 PTB3
41 PTA3
PIB3
PIA3
ACMP1O
—
—
—
—
—
PTL4
PTK0
PTK1
PTK2
PTK3
VSSA
42
VREFL
MC9S08DZ128 Series Data Sheet, Rev. 1
36
Freescale Semiconductor
Chapter 2 Pins and Connections
Table 2-1. Pin Availability by Package Pin-Count (continued)
Pin Number
<-- Lowest Priority --> Highest
Port
Alt 1
100
64
48
Alt 2
Pin/Interrupt
89
90
91
92
93
94
95
96
97
98
99
100
57
58
—
—
—
—
59
60
61
62
63
64
VREFH
VDDA
43
—
—
—
—
PTK4
PTK5
PTK6
PTK7
44 PTA4
45 PTB4
PIA4
PIB4
ADP4
ADP12
ADP20
ADP5
—
PTC4
46 PTA5
47 PTB5
48 PTA6
PIA5
PIB5
PIA6
ADP13
ADP6
1
Pin does not contain a clamp diode to VDD and should not be driven above
DD. The voltage measured on this pin when internal pull-up is enabled may
be as low as VDD - 0.7V. The internal gates connected to this pin are pulled to
VDD
V
.
2
3
4
The IIC1 module pins can be repositioned using IIC1PS bit in the SOPT1
register. The default reset locations are on PTF2 and PTF3.
The SCI2 module pins can be repositioned using SCI2PS bit in the SOPT1
register. The default reset locations are on PTF0 and PTF1.
If both these analog modules are enabled they both will have access to the pin.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
37
Chapter 2 Pins and Connections
MC9S08DZ128 Series Data Sheet, Rev. 1
38
Freescale Semiconductor
Chapter 3
Modes of Operation
3.1
Introduction
The operating modes of the MC9S08DZ128 Series are described in this chapter. Entry into each mode,
exit from each mode, and functionality while in each of the modes are described.
3.2
Features
•
Active background mode for code development
•
•
Wait mode — CPU shuts down to conserve power; system clocks are running and full regulation
is maintained
Stop modes — System clocks are stopped and voltage regulator is in standby
— Stop3 — All internal circuits are powered for fast recovery
— Stop2 — Partial power down of internal circuits; RAM content is retained
3.3
Run Mode
This is the normal operating mode for the MC9S08DZ128 Series. This mode is selected when the
BKGD/MS pin is high at the rising edge of reset. In this mode, the CPU executes code from internal
memory with execution beginning at the address fetched from memory at 0xFFFE–0xFFFF after reset.
3.4
Active Background Mode
The active background mode functions are managed through the background debug controller (BDC) in
the HCS08 core. The BDC, together with the on-chip debug module (DBG), provide the means for
analyzing MCU operation during software development.
Active background mode is entered in any of five ways:
•
•
•
•
•
When the BKGD/MS pin is low at the rising edge of reset
When a BACKGROUND command is received through the BKGD/MS pin
When a BGND instruction is executed
When encountering a BDC breakpoint
When encountering a DBG breakpoint
After entering active background mode, the CPU is held in a suspended state waiting for serial background
commands rather than executing instructions from the user application program.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
39
Chapter 3 Modes of Operation
Background commands are of two types:
•
Non-intrusive commands, defined as commands that can be issued while the user program is
running. Non-intrusive commands can be issued through the BKGD/MS pin while the MCU is in
run mode; non-intrusive commands can also be executed when the MCU is in the active
background mode. Non-intrusive commands include:
— Memory access commands
— Memory-access-with-status commands
— BDC register access commands
— The BACKGROUND command
•
Active background commands, which can only be executed while the MCU is in active background
mode. Active background commands include commands to:
— Read or write CPU registers
— Trace one user program instruction at a time
— Leave active background mode to return to the user application program (GO)
The active background mode is used to program a bootloader or user application program into the FLASH
program memory before the MCU is operated in run mode for the first time. When the MC9S08DZ128
Series is shipped from the Freescale Semiconductor factory, the FLASH program memory is erased by
default unless specifically noted so there is no program that could be executed in run mode until the
FLASH memory is initially programmed. The active background mode can also be used to erase and
reprogram the FLASH memory after it has been previously programmed.
For additional information about the active background mode, refer to the Development Support chapter.
3.5
Wait Mode
Wait mode is entered by executing a WAIT instruction. Upon execution of the WAIT instruction, the CPU
enters a low-power state in which it is not clocked. The I bit in CCR is cleared when the CPU enters the
wait mode, enabling interrupts. When an interrupt request occurs, the CPU exits the wait mode and
resumes processing, beginning with the stacking operations leading to the interrupt service routine.
While the MCU is in wait mode, there are some restrictions on which background debug commands can
be used. Only the BACKGROUND command and memory-access-with-status commands are available
when the MCU is in wait mode. The memory-access-with-status commands do not allow memory access,
but they report an error indicating that the MCU is in either stop or wait mode. The BACKGROUND
command can be used to wake the MCU from wait mode and enter active background mode.
MC9S08DZ128 Series Data Sheet, Rev. 1
40
Freescale Semiconductor
Chapter 3 Modes of Operation
3.6
Stop Modes
One of two stop modes is entered upon execution of a STOP instruction when the STOPE bit in SOPT1
register is set. In both stop modes, all internal clocks are halted. The MCG module can be configured to
leave the reference clocks running. See Chapter 8, “Multi-Purpose Clock Generator (S08MCGV2),” for
more information.
Table 3-1 shows all of the control bits that affect stop mode selection and the mode selected under various
conditions. The selected mode is entered following the execution of a STOP instruction.
Table 3-1. Stop Mode Selection
STOPE ENBDM 1
LVDE
LVDSE PPDC
Stop Mode
0
1
1
1
1
x
1
0
0
0
x
x
x
x
Stop modes disabled; illegal opcode reset if STOP instruction executed
Stop3 with BDM enabled 2
Both bits must be 1
Either bit a 0
x3
0
Stop3 with voltage regulator active
Stop3
Stop2
Either bit a 0
1
1
2
3
ENBDM is located in the BDCSCR, which is only accessible through BDC commands, see the Development Support chapter.
When in Stop3 mode with BDM enabled, The SIDD will be near RIDD levels because internal clocks are enabled.
If LVD = 1 in stop, the MCU enters stop3, regardless of the configuration of PPDC.
3.6.1
Stop3 Mode
Stop3 mode is entered by executing a STOP instruction under the conditions as shown in Table 3-1. The
states of all of the internal registers and logic, RAM contents, and I/O pin states are maintained.
Exit from stop3 is done by asserting RESET or an asynchronous interrupt pin. The asynchronous interrupt
pins are IRQ, PIA0–PIA7, PIB0–PIB7, PID0–PID7, and PIJ0–PIJ7. Exit from stop3 can also be done by
the low voltage detection (LVD) reset, the low voltage warning (LVW) interrupt, the ADC conversion
complete interrupt, the analog comparator interrupt, the real-time clock (RTC) interrupt, the MSCAN
wake-up interrupt, or the SCI receiver interrupt.
If stop3 is exited by means of the RESET pin, the MCU will be reset and operation will resume after
fetching the reset vector. Exit by means of an interrupt will result in the MCU fetching the appropriate
interrupt vector.
3.6.1.1
LVD Enabled in Stop3 Mode
The LVD system is capable of generating either an interrupt or a reset when the supply voltage drops below
the LVD voltage. If the LVD is enabled in stop (LVDE and LVDSE bits in SPMSC1 both set) at the time
the CPU executes a STOP instruction, then the voltage regulator remains active during stop mode.
For the ADC to operate or for the ACMP to be used when comparing with an internal voltage, the LVD
must be left enabled when entering stop3.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
41
Chapter 3 Modes of Operation
3.6.1.2
Active BDM Enabled in Stop3 Mode
Entry into the active background mode from run mode is enabled if ENBDM in BDCSCR is set. This
register is described in Chapter 17, “Development Support.” If ENBDM is set when the CPU executes a
STOP instruction, the system clocks to the background debug logic remain active when the MCU enters
stop mode. Because of this, background debug communication remains possible. In addition, the voltage
regulator does not enter its low-power standby state but maintains full internal regulation.
Most background commands are not available in stop mode. The memory-access-with-status commands
do not allow memory access, but they report an error indicating that the MCU is in either stop or wait
mode. The BACKGROUND command can be used to wake the MCU from stop and enter active
background mode if the ENBDM bit is set. After entering background debug mode, all background
commands are available.
3.6.2
Stop2 Mode
Stop2 mode is entered by executing a STOP instruction under the conditions as shown in Table 3-1. Most
of the internal circuitry of the MCU is powered off in stop2 with the exception of the RAM. Upon entering
stop2, all I/O pin control signals are latched so that the pins retain their states during stop2.
Exit from stop2 is performed by asserting RESET.
In addition, the real-time counter (RTC) can wake the MCU from stop2, if enabled.
Upon wake-up from stop2 mode, the MCU starts up as from a power-on reset (POR):
•
•
All module control and status registers are reset
The LVD reset function is enabled and the MCU remains in the reset state if V is below the LVD
DD
trip point (low trip point selected due to POR)
•
The CPU takes the reset vector
In addition to the above, upon waking up from stop2, the PPDF bit in SPMSC2 is set. This flag is used to
direct user code to go to a stop2 recovery routine. PPDF remains set and the I/O pin states remain latched
until a 1 is written to PPDACK in SPMSC2.
To maintain I/O states for pins that were configured as general-purpose I/O before entering stop2, the user
must restore the contents of the I/O port registers, which have been saved in RAM, to the port registers
before writing to the PPDACK bit. If the port registers are not restored from RAM before writing to
PPDACK, then the pins will switch to their reset states when PPDACK is written.
For pins that were configured as peripheral I/O, the user must reconfigure the peripheral module that
interfaces to the pin before writing to the PPDACK bit. If the peripheral module is not enabled before
writing to PPDACK, the pins will be controlled by their associated port control registers when the I/O
latches are opened.
3.6.3
On-Chip Peripheral Modules in Stop Modes
When the MCU enters any stop mode, system clocks to the internal peripheral modules are stopped. Even
in the exception case (ENBDM = 1), where clocks to the background debug logic continue to operate,
MC9S08DZ128 Series Data Sheet, Rev. 1
42
Freescale Semiconductor
Chapter 3 Modes of Operation
clocks to the peripheral systems are halted to reduce power consumption. Refer to Section 3.6.1, “Stop3
Mode” and Section 3.6.1, “Stop3 Mode” for specific information on system behavior in stop modes.
Table 3-2. Stop Mode Behavior
Mode
Peripheral
Stop2
Stop3
CPU
Off
Standby
Standby
RAM
Standby
FLASH/EEPROM
Off
Standby
Parallel Port Registers
Off
Standby
ACMP
ADC
Off
Optionally On1
Optionally On2
Standby
Off
IIC
Off
MCG
Off
Optionally On3
MSCAN
RTC
Off
Optionally On4
Off
Standby
Optionally On4
Standby
SCI
SPI
Off
Standby
TPM
Off
Standby
Voltage Regulator
XOSC
I/O Pins
Optionally On5
Optionally On5
Optionally On6
States Held
Off
States Held
1
2
3
4
5
6
Requires the LVD to be enabled, else in standby.
Requires the asynchronous ADC clock and LVD to be enabled, else in standby.
IRCLKEN and IREFSTEN set in MCGC1, else in standby.
Requires the RTC to be enabled, else in standby.
Requires the LVD or BDC to be enabled.
ERCLKEN and EREFSTEN set in MCGC2 for, else in standby. For high frequency
range (RANGE in MCGC2 set) requires the LVD to also be enabled in stop3.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
43
Chapter 3 Modes of Operation
MC9S08DZ128 Series Data Sheet, Rev. 1
44
Freescale Semiconductor
Chapter 4
Memory
4.1
MC9S08DZ128 Series Memory Map
On-chip memory in the MC9S08DZ128 Series consists of RAM, EEPROM, and FLASH program
memory for nonvolatile data storage, and I/O and control/status registers. The registers are divided into
three groups:
•
•
•
Direct-page registers (0x0000 through 0x007F)
High-page registers (0x1800 through 0x18FF)
Nonvolatile registers (0xFFB0 through 0xFFBF)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
45
Chapter 4 Memory
Extended Address
CPU Address
0x0000
0x0_0000
DIRECT PAGE
REGISTERS
128 BYTES
0x0_007F
0x0_0080
0x007F
0x0080
All 128K bytes of Flash can
also be accessed through
the linear address pointer.
RAM
6016 BYTES
0x0_17FF
0x0_1800
0x17FF
0x1800
HIGH PAGE
REGISTERS
256 BYTES
RAM
2176 BYTES
0x0_18FF
0x0_1900
0x0_217F
0x0_2180
0x18FF
0x1900
0x217F
0x2180
PPAGE=0
FLASH
Extended Address
0x1_C000 - 0x1_FFFF
6784 BYTES
0x0_3BFF
0x0_3C00
0x3BFF
0x3C00
1
EEPROM
0x1_8000 - 0x1_BFFF
0x1_4000 - 0x1_7FFF
2 x 1024 BYTES
0x0_3FFF
0x0_4000
0x3FFF
0x4000
0x1_0000 - 0x1_3FFF
PPAGE=1
FLASH
16384 BYTES
0x0_C000 - 0x0_FFFF
0x0_8000 - 0x0_BFFF
0x0_4000 - 0x0_7FFF
0x0_7FFF
0x0_8000
0x7FFF
0x8000
0x0_0000 - 0x0_3FFF
Paging Window
Extended addresses
formed with PPAGE
and CPU addresses
A13:A0
FLASH
16384 BYTES
0x0_BFFF
0x0_C000
0xBFFF
0xC000
PPAGE=3
FLASH
16384 BYTES
0x0_FFFF
0xFFFF
1
EEPROM address range shows half the total EEPROM. See Section 4.6.10, “EEPROM Mapping” for more
Figure 4-1. MC9S08DZ128 Series Memory Map
MC9S08DZ128 Series Data Sheet, Rev. 1
46
Freescale Semiconductor
Chapter 4 Memory
Extended Address
CPU Address
0x0000
0x1_C000 - 0x1_FFFF
0x0_0000
DIRECT PAGE
REGISTERS
128 BYTES
All 96K bytes of Flash can
also be accessed through
the linear address pointer.
0x1_8000 - 0x1_BFFF
0x007F
0x0080
0x0_007F
0x0_0080
RESERVED
16384 BYTES
RAM
6016 BYTES
0x0_17FF
0x0_1800
0x17FF
0x1800
HIGH PAGE
REGISTERS
256 BYTES
0x0_18FF
0x0_1900
0x18FF
0x1900
PPAGE=0
FLASH
8960 BYTES
0x0_3BFF
0x0_3C00
0x3BFF
0x3C00
1
EEPROM
2 x 1024 BYTES
Extended Address
0x0_3FFF
0x0_4000
0x3FFF
0x4000
0x1_4000 - 0x1_7FFF
0x1_0000 - 0x1_3FFF
0x0_C000 - 0x0_FFFF
PPAGE=1
FLASH
16384 BYTES
0x0_8000 - 0x0_BFFF
0x0_4000 - 0x0_7FFF
0x0_7FFF
0x0_8000
0x7FFF
0x8000
0x0_0000 - 0x0_3FFF
Paging Window
Extended addresses
formed with PPAGE
and CPU addresses
A13:A0
FLASH
16384 BYTES
0x0_BFFF
0x0_C000
0xBFFF
0xC000
PPAGE=3
FLASH
16384 BYTES
0x0_FFFF
0xFFFF
1
EEPROM address range shows half the total EEPROM. See Section 4.6.10, “EEPROM Mapping” for more details.
Figure 4-2. MC9S08DZ96 Memory Map
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
47
Chapter 4 Memory
Extended Address
CPU Address
0x0000
0x0_0000
DIRECT PAGE
REGISTERS
128 BYTES
0x007F
0x0080
0x0_0080
All 128K bytes of Flash can
also be accessed through
the linear address pointer.
RAM
6016 BYTES
0x0_17FF
0x0_1800
0x17FF
0x1800
HIGH PAGE
REGISTERS
256 BYTES
0x0_18FF
0x0_1900
0x18FF
0x1900
PPAGE=0
FLASH
9984 BYTES
Extended Address
0x1_C000 - 0x1_FFFF
0x1_8000 - 0x1_BFFF
0x1_4000 - 0x1_7FFF
0x0_3FFF
0x0_4000
0x3FFF
0x4000
0x1_0000 - 0x1_3FFF
PPAGE=1
FLASH
16384 BYTES
0x0_C000 - 0x0_FFFF
0x0_8000 - 0x0_BFFF
0x0_4000 - 0x0_7FFF
0x0_7FFF
0x0_8000
0x7FFF
0x8000
0x0_0000 - 0x0_3FFF
Paging Window
Extended addresses
formed with PPAGE
and CPU addresses
A13:A0
FLASH
16384 BYTES
0x0_BFFF
0x0_C000
0xBFFF
0xC000
PPAGE=3
FLASH
16384 BYTES
0x0_FFFF
0xFFFF
Figure 4-3. MC9S08DV128 Memory Map
MC9S08DZ128 Series Data Sheet, Rev. 1
48
Freescale Semiconductor
Chapter 4 Memory
Extended Address
CPU Address
0x0000
0x1_C000 - 0x1_FFFF
0x0_0000
DIRECT PAGE
REGISTERS
128 BYTES
RAM
4096 BYTES
All 96K bytes of Flash can
also be accessed through
the linear address pointer.
0x1_8000 - 0x1_BFFF
0x0_007F
0x0_0080
0x007F
0x0080
0x0_107F
0x0_1080
0x107F
0x1080
RESERVED
16384 BYTES
PPAGE=0
FLASH
1920 BYTES
0x0_17FF
0x0_1800
0x17FF
0x1800
HIGH PAGE
REGISTERS
256 BYTES
0x0_18FF
0x0_1900
0x18FF
0x1900
PPAGE=0
FLASH
9984 BYTES
0x0_3FFF
0x0_4000
Extended Address
0x3FFF
0x4000
0x1_4000 - 0x1_7FFF
0x1_0000 - 0x1_3FFF
0x0_C000 - 0x0_FFFF
PPAGE=1
FLASH
16384 BYTES
0x0_8000 - 0x0_BFFF
0x0_4000 - 0x0_7FFF
0x0_7FFF
0x0_8000
0x7FFF
0x8000
0x0_0000 - 0x0_3FFF
Paging Window
Extended addresses
formed with PPAGE
and CPU addresses
A13:A0
FLASH
16384 BYTES
0x0_BFFF
0x0_C000
0xBFFF
0xC000
PPAGE=3
FLASH
16384 BYTES
0x0_FFFF
0xFFFF
Figure 4-4. MC9S08DV96 Memory Map
4.2
Reset and Interrupt Vector Assignments
Table 4-1 shows address assignments for reset and interrupt vectors. The vector names shown in this table
are the labels used in the MC9S08DZ128 Series equate file provided by Freescale Semiconductor.
Table 4-1. Reset and Interrupt Vectors
Address
(High:Low)
Vector
Vector Name
0xFF80:0xFF81 -
0xFF8E:0xFF8F
Reserved
Reserved
0xFF90:0xFF91
0xFF92:0xFF93
0xFF94:0xFF95
0xFF96:0xFF97
0xFF98:0xFF99
0xFF9A:0xFF9B
Port J
IIC2
Vportj
Viic2
SPI2
Vspi2
TPM3 Overflow
TPM3 Channel 3
TPM3 Channel 2
Vtpm3ovf
Vtpm3ch3
Vtpm3ch2
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
49
Chapter 4 Memory
Table 4-1. Reset and Interrupt Vectors (continued)
Vector
Address
(High:Low)
Vector Name
0xFF9C:0xFF9D
0xFF9E:0xFF9F
0xFFA0:0xFFBF
0xFFC0:0xFFC1
0xFFC2:0xFFC3
0xFFC4:0xFFC5
0xFFC6:0xFFC7
0xFFC8:0xFFC9
0xFFCA:0xFFCB
0xFFCC:0xFFCD
0xFFCE:0xFFCF
0xFFD0:0xFFD1
0xFFD2:0xFFD3
0xFFD4:0xFFD5
0xFFD6:0xFFD7
0xFFD8:0xFFD9
0xFFDA:0xFFDB
0xFFDC:0xFFDD
0xFFDE:0xFFDF
0xFFE0:0xFFE1
0xFFE2:0xFFE3
0xFFE4:0xFFE5
0xFFE6:0xFFE7
0xFFE8:0xFFE9
0xFFEA:0xFFEB
0xFFEC:0xFFED
0xFFEE:0xFFEF
0xFFF0:0xFFF1
0xFFF2:0xFFF3
0xFFF4:0xFFF5
0xFFF6:0xFFF7
0xFFF8:0xFFF9
0xFFFA:0xFFFB
0xFFFC:0xFFFD
0xFFFE:0xFFFF
TPM3 Channel 1
TPM3 Channel 0
Non-vector space
ACMP2
Vtpm3ch1
Vtpm3ch0
N/A
Vacmp2
Vacmp1
Vcantx
Vcanrx
Vcanerr
Vcanwu
Vrtc
ACMP1
MSCAN Transmit
MSCAN Receive
MSCAN errors
MSCAN wake up
RTC
IIC1
Viic1
ADC Conversion
Port A, Port B, Port D
SCI2 Transmit
SCI2 Receive
SCI2 Error
Vadc
Vport
Vsci2tx
Vsci2rx
Vsci2err
Vsci1tx
Vsci1rx
Vsci1err
Vspi1
SCI1 Transmit
SCI1 Receive
SCI1 Error
SPI1
TPM2 Overflow
TPM2 Channel 1
TPM2 Channel 0
TPM1 Overflow
TPM1 Channel 5
TPM1 Channel 4
TPM1 Channel 3
TPM1 Channel 2
TPM1 Channel 1
TPM1 Channel 0
MCG Loss of lock
Low-Voltage Detect
IRQ
Vtpm2ovf
Vtpm2ch1
Vtpm2ch0
Vtpm1ovf
Vtpm1ch5
Vtpm1ch4
Vtpm1ch3
Vtpm1ch2
Vtpm1ch1
Vtpm1ch0
Vlol
Vlvd
Virq
SWI
Vswi
Reset
Vreset
MC9S08DZ128 Series Data Sheet, Rev. 1
50
Freescale Semiconductor
Chapter 4 Memory
4.3
Register Addresses and Bit Assignments
The registers in the MC9S08DZ128 Series are divided into these groups:
•
•
•
Direct-page registers are located in the first 128 locations in the memory map; these are accessible
with efficient direct addressing mode instructions.
High-page registers are used much less often, so they are located above 0x1800 in the memory
map. This leaves more room in the direct page for more frequently used registers and RAM.
The nonvolatile register area consists of a block of 16 locations in FLASH memory at
0xFFB0–0xFFBF. Nonvolatile register locations include:
— NVPROT and NVOPT are loaded into working registers at reset
— An 8-byte backdoor comparison key that optionally allows a user to gain controlled access to
secure memory
Because the nonvolatile register locations are FLASH memory, they must be erased and
programmed like other FLASH memory locations.
Direct-page registers can be accessed with efficient direct addressing mode instructions. Bit manipulation
instructions can be used to access any bit in any direct-page register. Table 4-2 is a summary of all
user-accessible direct-page registers and control bits.
The direct page registers in Table 4-2 can use the more efficient direct addressing mode, which requires
only the lower byte of the address. Because of this, the lower byte of the address in column one is shown
in bold text. In Table 4-3 and Table 4-5, the whole address in column one is shown in bold. In Table 4-2,
Table 4-3, and Table 4-5, the register names in column two are shown in bold to set them apart from the
bit names to the right. Cells that are not associated with named bits are shaded. A shaded cell with a 0
indicates this unused bit always reads as a 0. Shaded cells with dashes indicate unused or reserved bit
locations that could read as 1s or 0s.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
51
Chapter 4 Memory
Table 4-2. Direct-Page Register Summary (Sheet 1 of 4)
Register
Name
Address
Bit 7
6
5
4
3
2
1
Bit 0
PTAD7
PTADD7
PTBD7
PTBDD7
PTCD7
PTCDD7
PTDD7
PTDDD7
PTED7
PTEDD7
PTFD7
PTFDD7
PTGD7
PTGDD7
ACME
PTAD6
PTADD6
PTBD6
PTBDD6
PTCD6
PTCDD6
PTDD6
PTDDD6
PTED6
PTEDD6
PTFD6
PTFDD6
PTGD6
PTGDD6
ACBGS
ACBGS
AIEN
PTAD5
PTADD5
PTBD5
PTBDD5
PTCD5
PTCDD5
PTDD5
PTDDD5
PTED5
PTEDD5
PTFD5
PTFDD5
PTGD5
PTGDD5
ACF
PTAD4
PTADD4
PTBD4
PTBDD4
PTCD4
PTCDD4
PTDD4
PTDDD4
PTED4
PTEDD4
PTFD4
PTFDD4
PTGD4
PTGDD4
ACIE
PTAD3
PTADD3
PTBD3
PTBDD3
PTCD3
PTCDD3
PTDD3
PTDDD3
PTED3
PTEDD3
PTFD3
PTFDD3
PTGD3
PTGDD3
ACO
PTAD2
PTADD2
PTBD2
PTBDD2
PTCD2
PTCDD2
PTDD2
PTDDD2
PTED2
PTEDD2
PTFD2
PTFDD2
PTGD2
PTGDD2
ACOPE
ACOPE
ADCH
PTAD1
PTADD1
PTBD1
PTAD0
PTADD0
PTBD0
0x0000 PTAD
0x0001 PTADD
0x0002 PTBD
PTBDD1
PTCD1
PTBDD0
PTCD0
0x0003 PTBDD
0x0004 PTCD
PTCDD1
PTDD1
PTCDD0
PTDD0
0x0005 PTCDD
0x0006 PTDD
PTDDD1
PTED1
PTDDD0
PTED0
0x0007 PTDDD
0x0008 PTED
PTEDD1
PTFD1
PTEDD0
PTFD0
0x0009 PTEDD
0x000A PTFD
PTFDD1
PTGD1
PTFDD0
PTGD0
0x000B PTFDD
0x000C PTGD
PTGDD1
ACMOD1
ACMOD1
PTGDD0
ACMOD0
ACMOD0
0x000D PTGDD
0x000E ACMP1SC
0x000F ACMP2SC
0x0010 ADCSC1
0x0011 ADCSC2
0x0012 ADCRH
0x0013 ADCRL
0x0014 ADCCVH
0x0015 ADCCVL
0x0016 ADCCFG
0x0017 APCTL1
0x0018 APCTL2
0x0019 APCTL3
ACME
ACF
ACIE
ACO
COCO
ADACT
0
ADCO
ACFE
ADTRG
0
ACFGT
0
0
0
Reserved Reserved
0
ADR11
ADR3
ADC11
ADCV3
ADR10
ADR2
ADR9
ADR1
ADR8
ADR0
ADR7
ADR6
ADR5
ADR4
0
0
0
0
ADC10
ADCV2
ADCV9
ADCV1
ADCV8
ADCV0
ADCV7
ADLPC
ADPC7
ADPC15
ADPC23
ADCV6
ADCV5
ADCV4
ADLSMP
ADPC4
ADPC12
ADPC20
ADIV
MODE
ADICLK
ADPC6
ADPC14
ADPC22
ADPC5
ADPC13
ADPC21
ADPC3
ADPC11
ADPC19
ADPC2
ADPC10
ADPC18
ADPC1
ADPC9
ADPC17
ADPC0
ADPC8
ADPC16
0x001A–
Reserved
0x001B
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0
IRQPDD
IRQEDG
IRQPE
IRQF
IRQACK
IRQIE
IRQMOD
0x001C IRQSC
0x001D–
Reserved
0x001F
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
TOF
Bit 15
Bit 7
TOIE
CPWMS
CLKSB
CLKSA
PS2
PS1
9
PS0
Bit 8
Bit 0
Bit 8
Bit 0
0
0x0020 TPM1SC
14
13
5
12
4
11
10
0x0021 TPM1CNTH
0x0022 TPM1CNTL
0x0023 TPM1MODH
0x0024 TPM1MODL
0x0025 TPM1C0SC
0x0026 TPM1C0VH
0x0027 TPM1C0VL
6
14
3
11
2
10
1
Bit 15
Bit 7
13
5
12
4
9
6
3
2
1
CH0F
Bit 15
Bit 7
CH0IE
14
MS0B
13
5
MS0A
12
4
ELS0B
11
ELS0A
10
0
9
Bit 8
Bit 0
6
3
2
1
MC9S08DZ128 Series Data Sheet, Rev. 1
52
Freescale Semiconductor
Chapter 4 Memory
Table 4-2. Direct-Page Register Summary (Sheet 2 of 4)
Register
Name
Address
Bit 7
6
5
4
3
2
1
Bit 0
CH1F
Bit 15
Bit 7
CH1IE
MS1B
13
MS1A
12
ELS1B
11
ELS1A
10
0
9
1
0
9
1
0
9
1
0
9
1
0
9
1
—
0
0x0028 TPM1C1SC
0x0029 TPM1C1VH
0x002A TPM1C1VL
0x002B TPM1C2SC
0x002C TPM1C2VH
0x002D TPM1C2VL
0x002E TPM1C3SC
0x002F TPM1C3VH
0x0030 TPM1C3VL
0x0031 TPM1C4SC
0x0032 TPM1C4VH
0x0033 TPM1C4VL
0x0034 TPM1C5SC
0x0035 TPM1C5VH
0x0036 TPM1C5VL
0x0037 Reserved
0x0038 SCI1BDH
0x0039 SCI1BDL
0x003A SCI1C1
0x003B SCI1C2
0x003C SCI1S1
14
Bit 8
Bit 0
0
6
CH2IE
14
5
4
3
2
CH2F
Bit 15
Bit 7
MS2B
13
MS2A
12
ELS2B
11
ELS2A
10
Bit 8
Bit 0
0
6
5
4
3
2
CH3F
Bit 15
Bit 7
CH3IE
14
MS3B
13
MS3A
12
ELS3B
11
ELS3A
10
Bit 8
Bit 0
0
6
5
4
3
2
CH4F
Bit 15
Bit 7
CH4IE
14
MS4B
13
MS4A
12
ELS4B
11
ELS4A
10
Bit 8
Bit 0
0
6
5
4
3
2
CH5F
Bit 15
Bit 7
CH5IE
14
MS5B
13
MS5A
12
ELS5B
11
ELS5A
10
Bit 8
Bit 0
—
6
5
4
3
2
—
—
—
—
—
—
LBKDIE
SBR7
LOOPS
TIE
RXEDGIE
SBR6
SCISWAI
TCIE
TC
0
SBR12
SBR4
M
SBR11
SBR3
WAKE
TE
SBR10
SBR2
ILT
SBR9
SBR1
PE
SBR8
SBR0
PT
SBR5
RSRC
RIE
RDRF
0
ILIE
IDLE
RXINV
TXINV
4
RE
RWU
FE
SBK
PF
TDRE
LBKDIF
R8
OR
NF
RXEDGIF
T8
RWUID
ORIE
3
BRK13
NEIE
2
LBKDE
FEIE
1
RAF
PEIE
Bit 0
SBR8
SBR0
PT
0x003D SCI1S2
TXDIR
5
0x003E SCI1C3
0x003F SCI1D
Bit 7
6
LBKDIE
SBR7
LOOPS
TIE
RXEDGIE
SBR6
SCISWAI
TCIE
TC
0
SBR12
SBR4
M
SBR11
SBR3
WAKE
TE
SBR10
SBR2
ILT
SBR9
SBR1
PE
0x0040 SCI2BDH
0x0041 SCI2BDL
0x0042 SCI2C1
0x0043 SCI2C2
0x0044 SCI2S1
SBR5
RSRC
RIE
RDRF
0
ILIE
IDLE
RXINV
TXINV
4
RE
RWU
FE
SBK
PF
TDRE
LBKDIF
R8
OR
NF
RXEDGIF
T8
RWUID
ORIE
3
BRK13
NEIE
2
LBKDE
FEIE
1
RAF
PEIE
Bit 0
0x0045 SCI2S2
TXDIR
5
0x0046 SCI2C3
0x0047 SCI2D
Bit 7
6
CLKS
BDIV
RDIV
HGO
IREFS
EREFS
IRCLKEN IREFSTEN
ERCLKEN EREFSTEN
0x0048 MCGC1
0x0049 MCGC2
0x004A MCGTRM
0x004B MCGSC
0x004C MCGC3
0x004D MCGT
RANGE
LP
TRIM
LOLS
LOLIE
0
LOCK
PLLS
0
PLLST
CME
IREFST
DIV32
0
CLKST
OSCINIT
VDIV
FTRIM
DRS
DMX32
0
0
0
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
53
Chapter 4 Memory
Table 4-2. Direct-Page Register Summary (Sheet 3 of 4)
Register
Name
Address
Bit 7
6
5
4
3
2
1
Bit 0
0x004E–
0x004F
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Reserved
SPIE
0
SPE
SPTIE
MSTR
CPOL
CPHA
SSOE
LSBFE
SPC0
SPR0
0
0x0050 SPI1C1
0x0051 SPI1C2
0x0052 SPI1BR
0x0053 SPI1S
0x0054 Reserved
0x0055 SPI1D
0
0
SPPR1
SPTEF
0
MODFEN BIDIROE
0
SPISWAI
0
SPPR2
SPPR0
0
0
0
3
SPR2
SPR1
SPRF
0
0
0
6
MODF
0
0
2
0
0
1
0
4
0
Bit 7
5
Bit 0
0x0056–
Reserved
0x0057
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
AD7
AD6
AD5
AD4
AD3
AD2
AD1
0
0x0058 IIC1A
0x0059 IIC1F
0x005A IIC1C1
0x005B IIC1S
0x005C IIC1D
0x005D IIC1C2
MULT
ICR
IICEN
TCF
IICIE
IAAS
MST
TX
TXAK
0
RSTA
SRW
0
0
BUSY
ARBL
IICIF
RXAK
DATA
GCAEN
ADEXT
0
0
0
AD10
AD9
AD8
0x005E–
Reserved
0x005F
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
TOF
Bit 15
Bit 7
TOIE
CPWMS
CLKSB
12
CLKSA
PS2
PS1
9
PS0
Bit 8
Bit 0
Bit 8
Bit 0
0
0x0060 TPM2SC
0x0061 TPM2CNTH
0x0062 TPM2CNTL
0x0063 TPM2MODH
0x0064 TPM2MODL
0x0065 TPM2C0SC
0x0066 TPM2C0VH
0x0067 TPM2C0VL
0x0068 TPM2C1SC
0x0069 TPM2C1VH
0x006A TPM2C1VL
0x006B Reserved
0x006C RTCSC
14
13
5
11
10
6
14
4
3
2
1
Bit 15
Bit 7
13
12
11
10
9
6
5
4
3
ELS0B
11
2
ELS0A
10
1
CH0F
Bit 15
Bit 7
CH0IE
14
MS0B
13
MS0A
12
0
9
Bit 8
Bit 0
0
6
5
4
3
2
1
CH1F
Bit 15
Bit 7
CH1IE
14
MS1B
13
MS1A
12
ELS1B
11
ELS1A
10
0
9
Bit 8
Bit 0
—
6
5
4
3
2
1
—
—
—
—
—
—
—
RTIF
RTCLKS
RTIE
RTCPS
RTCCNT
RTCMOD
0x006D RTCCNT
0x006E RTCMOD
0x006F Reserved
0x0070 PTHD
—
—
—
—
—
—
—
—
PTHD7
PTHDD7
PTJD7
PTJDD7
PTKD7
PTHD6
PTHDD6
PTJD6
PTJDD6
PTKD6
PTHD5
PTHDD5
PTJD5
PTJDD5
PTKD5
PTHD4
PTHDD4
PTJD4
PTHD3
PTHDD3
PTJD3
PTJDD3
PTKD3
PTHD2
PTHD1
PTHDD1
PTJD1
PTJDD1
PTKD1
PTHD0
PTHDD0
PTJD0
PTJDD0
PTKD0
PTHDD2
PTJD2
0x0071 PTHDD
0x0072 PTJD
PTJDD4
PTKD4
PTJDD2
PTKD2
0x0073 PTJDD
0x0074 PTKD
MC9S08DZ128 Series Data Sheet, Rev. 1
54
Freescale Semiconductor
Chapter 4 Memory
Table 4-2. Direct-Page Register Summary (Sheet 4 of 4)
Register
Name
Address
Bit 7
6
5
4
3
2
1
Bit 0
PTKDD7
PTLD7
PTLDD7
0
PTKDD6
PTLD6
PTLDD6
0
PTKDD5
PTLD5
PTLDD5
0
PTKDD4
PTLD4
PTLDD4
0
PTKDD3
PTLD3
PTLDD3
0
PTKDD2
PTLD2
PTLDD2
XA16
0
PTKDD1
PTLD1
PTLDD1
XA15
0
PTKDD0
PTLD0
PTLDD0
XA14
LA16
LA8
0x0075 PTKDD
0x0076 PTLD
0x0077 PTLDD
0x0078 PPAGE
0x0079 LAP2
0x007A LAP1
0x007B LAP0
0x007C LWP
0x007D LBP
0x007E LB
0
0
0
0
0
LA15
LA7
D7
LA14
LA6
D6
LA13
LA5
D5
LA12
LA4
D4
LA11
LA3
D3
LA10
LA2
LA9
LA1
LA0
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
0x007F LAPAB
High-page registers, shown in Table 4-3, are accessed much less often than other I/O and control registers
so they have been located outside the direct addressable memory space, starting at 0x1800.
Table 4-3. High-Page Register Summary (Sheet 1 of 5)
Address Register Name
Bit 7
6
5
4
3
2
1
Bit 0
POR
0
PIN
0
COP
ILOP
0
ILAD
LOC
LVD
0
BDFR
0
0x1800
0x1801
0x1802
0x1803
SRS
0
STOPE
0
0
IIC1PS
0
0
0
0
0
SBDFR
SOPT1
SOPT2
COPT
COPCLKS COPW
SCI2PS
ADHTS
MCSEL
0x1804 –
0x1805
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Reserved
—
ID7
—
—
ID6
—
ID5
—
ID4
ID11
ID3
ID10
ID2
ID9
ID1
—
ID8
ID0
0x1806
0x1807
0x1808
0x1809
0x180A
SDIDH
SDIDL
—
—
—
—
—
—
Reserved
SPMSC1
SPMSC2
LVWF
0
LVWACK
0
LVWIE
LVDV
LVDRE
LVWV
LVDSE
PPDF
LVDE
PPDACK
0
BGBE
PPDC
—
0x180B–
0x180F
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Reserved
Bit 15
Bit 7
14
6
13
12
4
11
3
10
2
9
1
9
1
9
1
9
1
0
0
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
Bit 16
Bit 16
0x1810
0x1811
0x1812
0x1813
0x1814
0x1815
0x1816
0x1817
0x1818
0x1819
DBGCAH
DBGCAL
DBGCBH
DBGCBL
DBGCCH
DBGCCL
DBGFH
5
Bit 15
Bit 7
14
6
13
12
4
11
3
10
2
5
Bit 15
Bit 7
14
6
13
12
4
11
3
10
2
5
13
Bit 15
Bit 7
14
6
12
4
11
3
10
2
5
DBGFL
RWAEN
RWBEN
RWA
RWB
PAGSEL
PAGSEL
0
0
0
DBGCAX
DBGCBX
0
0
0
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
55
Chapter 4 Memory
Table 4-3. High-Page Register Summary (Sheet 2 of 5)
Address Register Name
Bit 7
6
5
4
3
2
1
Bit 0
RWCEN
PPACC
DBGEN
TRGSEL
AF
RWC
0
PAGSEL
0
0
0
0
0
0
0
0
0
0
Bit 16
Bit 16
0x181A
0x181B
0x181C
0x181D
0x181E
0x181F
0x1820
0x1821
0x1822
0x1823
0x1824
0x1825
0x1826
DBGCCX
DBGFX
DBGC
0
TAG
0
0
ARM
BEGIN
BF
BRKEN
LOOP1
0
0
0
TRG
CNT
DBGT
CF
0
0
0
0
ARMF
DBGS
0
0
DBGCNT
FCDIV
DIVLD
KEYEN
—
PRDIV8
DIV
FNORED EPGMOD
0
—
1
0
—
0
0
—
0
SEC
FOPT
—
—
—
0
—
1
Reserved
FCNFG
FPROT
FSTAT
FCMD
0
EPGSEL KEYACC
EPS
FPS
0
FPOP
0
FCBEF
FCCF
FPVIOL FACCERR
FCMD
FBLANK
0
0x1827–
0x182F
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Reserved
SPIE
0
SPE
SPTIE
MSTR
CPOL
CPHA
SSOE
LSBFE
SPC0
SPR0
0
0x1830
0x1831
0x1832
0x1833
0x1834
0x1835
SPI2C1
SPI2C2
SPI2BR
SPI2S
0
0
SPPR1
SPTEF
0
MODFEN BIDIROE
0
SPISWAI
0
SPPR2
SPPR0
0
0
0
3
SPR2
SPR1
SPRF
0
0
0
6
MODF
0
0
2
0
0
1
0
4
0
Reserved
SPI2D
Bit 7
5
Bit 0
0x1836–
0x1837
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Reserved
PTKPE7
PTKSE7
PTKPE6
PTKSE6
PTKPE5
PTKSE5
PTKPE4
PTKSE4
PTKPE3
PTKSE3
PTKPE2
PTKSE2
PTKPE1
PTKSE1
PTKPE0
PTKSE0
0x1838
0x1839
0x183A
0x183B
0x183C
0x183D
0x183E
0x183F
0x1840
0x1841
0x1842
0x1843
0x1844
0x1845
0x1846
0x1847
0x1848
PTKPE
PTKSE
PTKDS
Reserved
PTLPE
PTKDS7 PTKDS6 PTKDS5 PTKDS4 PTKDS3 PTKDS2 PTKDS1 PTKDS0
—
—
—
—
—
—
—
—
PTLPE7
PTLSE7
PTLDS7
—
PTLPE6
PTLSE6
PTLDS6
—
PTLPE5
PTLSE5
PTLDS5
—
PTLPE4
PTLSE4
PTLDS4
—
PTLPE3
PTLSE3
PTLDS3
—
PTLPE2
PTLSE2
PTLDS2
—
PTLPE1
PTLSE1
PTLDS1
—
PTLPE0
PTLSE0
PTLDS0
—
PTLSE
PTLDS
Reserved
PTAPE
PTASE
PTADS
Reserved
PTASC
PTAPS
PTAES
Reserved
PTBPE
PTAPE7
PTASE7
PTADS7
—
PTAPE6
PTASE6
PTADS6
—
PTAPE5
PTASE5
PTADS5
—
PTAPE4
PTASE4
PTADS4
—
PTAPE3
PTASE3
PTADS3
—
PTAPE2
PTASE2
PTADS2
—
PTAPE1
PTASE1
PTADS1
—
PTAPE0
PTASE0
PTADS0
—
0
0
0
0
PTAIF
PTAACK
PTAPS2
PTAES2
—
PTAIE
PTAPS1
PTAES1
—
PTAMOD
PTAPS0
PTAES0
—
PTAPS7
PTAES7
—
PTAPS6
PTAES6
—
PTAPS5
PTAES5
—
PTAPS4
PTAES4
—
PTAPS3
PTAES3
—
PTBPE7
PTBPE6
PTBPE5
PTBPE4
PTBPE3
PTBPE2
PTBPE1
PTBPE0
MC9S08DZ128 Series Data Sheet, Rev. 1
56
Freescale Semiconductor
Chapter 4 Memory
Table 4-3. High-Page Register Summary (Sheet 3 of 5)
Address Register Name
Bit 7
6
5
4
3
2
1
Bit 0
PTBSE0
PTBSE7
PTBSE6
PTBSE5
PTBSE4
PTBSE3
PTBSE2
PTBSE1
0x1849
0x184A
0x184B
0x184C
0x184D
0x184E
0x184F
0x1850
0x1851
0x1852
PTBSE
PTBDS
Reserved
PTBSC
PTBPS
PTBES
Reserved
PTCPE
PTCSE
PTCDS
PTBDS7 PTBDS6 PTBDS5 PTBDS4 PTBDS3 PTBDS2 PTBDS1 PTBDS0
—
0
—
0
—
0
—
0
—
—
—
—
PTBIF
PTBPS3
PTBES3
—
PTBACK
PTBPS2
PTBES2
—
PTBIE
PTBPS1
PTBES1
—
PTBMOD
PTBPS0
PTBES0
—
PTBPS7
PTBES7
—
PTBPS6
PTBES6
—
PTBPS5
PTBES5
—
PTBPS4
PTBES4
—
PTCPE7 PTCPE6 PTCPE5 PTCPE4 PTCPE3 PTCPE2 PTCPE1 PTCPE0
PTCSE7 PTCSE6 PTCSE5 PTCSE4 PTCSE3 PTCSE2 PTCSE1 PTCSE0
PTCDS7 PTCDS6 PTCDS5 PTCDS4 PTCDS3 PTCDS2 PTCDS1 PTCDS0
0x1853–
0x1857
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Reserved
PTDPE7 PTDPE6 PTDPE5 PTDPE4 PTDPE3 PTDPE2 PTDPE1 PTDPE0
PTDSE7 PTDSE6 PTDSE5 PTDSE4 PTDSE3 PTDSE2 PTDSE1 PTDSE0
PTDDS7 PTDDS6 PTDDS5 PTDDS4 PTDDS3 PTDDS2 PTDDS1 PTDDS0
0x1858
0x1859
0x185A
0x185B
0x185C
0x185D
0x185E
0x185F
0x1860
0x1861
0x1862
PTDPE
PTDSE
PTDDS
Reserved
PTDSC
PTDPS
PTDES
Reserved
PTEPE
PTESE
PTEDS
—
0
—
0
—
0
—
0
—
—
—
—
PTDIF
PTDACK
PTDIE
PTDMOD
PTDPS7 PTDPS6 PTDPS5 PTDPS4 PTDPS3 PTDPS2 PTDPS1 PTDPS0
PTDES7 PTDES6 PTDES5 PTDES4 PTDES3 PTDES2 PTDES1 PTDES0
—
—
—
—
—
—
—
—
PTEPE7
PTESE7
PTEPE6
PTESE6
PTEPE5
PTESE5
PTEPE4
PTESE4
PTEPE3
PTESE3
PTEPE2
PTESE2
PTEPE1
PTESE1
PTEPE0
PTESE0
PTEDS7 PTEDS6 PTEDS5 PTEDS4 PTEDS3 PTEDS2 PTEDS1 PTEDS0
0x1863–
0x1867
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Reserved
PTFPE7
PTFSE7
PTFDS7
PTFPE6
PTFSE6
PTFDS6
PTFPE5
PTFSE5
PTFDS5
PTFPE4
PTFSE4
PTFDS4
PTFPE3
PTFSE3
PTFDS3
PTFPE2
PTFSE2
PTFDS2
PTFPE1
PTFSE1
PTFDS1
PTFPE0
PTFSE0
PTFDS0
0x1868
0x1869
0x186A
PTFPE
PTFSE
PTFDS
0x186B–
0x186F
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Reserved
PTGPE7 PTGPE6 PTGPE5 PTGPE4 PTGPE3 PTGPE2 PTGPE1 PTGPE0
PTGSE7 PTGSE6 PTGSE5 PTGSE4 PTGSE3 PTGSE2 PTGSE1 PTGSE0
PTGDS7 PTGDS6 PTGDS5 PTGDS4 PTGDS3 PTGDS2 PTGDS1 PTGDS0
0x1870
0x1871
0x1872
0x1873
0x1874
0x1875
0x1876
0x1877
0x1878
0x1879
PTGPE
PTGSE
PTGDS
Reserved
PTHPE
PTHSE
PTHDS
Reserved
PTJPE
—
—
—
—
—
—
—
—
PTHPE7 PTHPE6 PTHPE5 PTHPE4 PTHPE3 PTHPE2 PTHPE1 PTHPE0
PTHSE7 PTHSE6 PTHSE5 PTHSE4 PTHSE3 PTHSE2 PTHSE1 PTHSE0
PTHDS7 PTHDS6 PTHDS5 PTHDS4 PTHDS3 PTHDS2 PTHDS1 PTHDS0
—
—
—
—
—
—
—
—
PTJPE7
PTJSE7
PTJPE6
PTJSE6
PTJPE5
PTJSE5
PTJPE4
PTJSE4
PTJPE3
PTJSE3
PTJPE2
PTJSE2
PTJPE1
PTJSE1
PTJPE0
PTJSE0
PTJSE
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
57
Chapter 4 Memory
Table 4-3. High-Page Register Summary (Sheet 4 of 5)
Address Register Name
Bit 7
6
5
4
3
2
1
Bit 0
PTJDS7
PTJDS6
PTJDS5
—
PTJDS4
—
PTJDS3
—
PTJDS2
—
PTJDS1
—
PTJDS0
—
0x187A
0x187B
0x187C
0x187D
0x187E
0x187F
0x1880
0x1881
0x1882
0x1883
0x1884
0x1885
0x1886
0x1887
0x1888
0x1889
0x188A
0x188B
0x188C
0x188D
0x188E
0x188F
PTJDS
—
—
Reserved
PTJSC
0
0
0
0
PTJIF
PTJPS3
PTJES3
—
PTJACK
PTJPS2
PTJES2
—
PTJIE
PTJPS1
PTJES1
—
PTJMOD
PTJPS0
PTJES0
—
PTJPS7
PTJPS6
PTJPS5
PTJES5
—
PTJPS4
PTJES4
—
PTJPS
PTJES7
PTJES6
PTJES
—
—
Reserved
CANCTL0
CANCTL1
CANBTR0
CANBTR1
CANRFLG
CANRIER
CANTFLG
CANTIER
CANTARQ
CANTAAK
CANTBSEL
CANIDAC
Reserved
CANMISC
CANRXERR
CANTXERR
RXFRM
RXACT
CSWAI
LOOPB
BRP5
TSEG21
RSTAT1
SYNCH
LISTEN
BRP4
TSEG20
RSTAT0
TIME
WUPE
WUPM
BRP2
SLPRQ
SLPAK
BRP1
INITRQ
INITAK
BRP0
CANE
CLKSRC
BORM
BRP3
TSEG13
TSTAT1
SJW1
SJW0
SAMP
TSEG22
TSEG12
TSTAT0
TSEG11
OVRIF
OVRIE
TXE1
TSEG10
RXF
WUPIF
CSCIF
WUPIE
CSCIE
RSTATE1 RSTATE0 TSTATE1 TSTATE0
RXFIE
TXE0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
TXE2
0
0
TXEIE2
TXEIE1
TXEIE0
0
0
ABTRQ2 ABTRQ1 ABTRQ0
0
0
ABTAK2
ABTAK1
ABTAK0
TX0
0
0
TX2
TX1
IDAM1
IDAM0
IDHIT2
IDHIT1
IDHIT0
0
0
0
0
0
0
0
0
0
BOHOLD
RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
0x1890 – CANIDAR0 –
0x1893 CANIDAR3
0x1894 – CANIDMR0 –
0x1897 CANIDMR3
0x1898 – CANIDAR4 –
0x189B CANIDAR7
0x189C – CANIDMR4 –
0x189F CANIDMR7
AC7
AM7
AC7
AM7
AC6
AM6
AC6
AM6
AC5
AM5
AC5
AM5
AC4
AM4
AC4
AM4
AC3
AM3
AC3
AM3
AC2
AM2
AC2
AM2
AC1
AM1
AC1
AM1
AC0
AM0
AC0
AM0
0x18A0 – MSCAN Rx Buffer
0x18AF
See Table 4-4 for an example extended mapping buffer layout.
For complete details, see the MSCAN chapter.
0x18B0 – MSCAN Tx Buffer
0x18BF
See Table 4-4 for an example extended mapping buffer layout.
For complete details, see the MSCAN chapter.
TOF
Bit 15
Bit 7
TOIE
14
CPWMS
CLKSB
CLKSA
PS2
10
PS1
9
PS0
Bit 8
Bit 0
Bit 8
Bit 0
0
0x18C0
0x18C1
0x18C2
0x18C3
0x18C4
0x18C5
0x18C6
TPM3SC
13
5
12
4
11
3
TPM3CNTH
TPM3CNTL
TPM3MODH
TPM3MODL
TPM3C0SC
TPM3C0VH
6
2
1
Bit 15
Bit 7
14
13
12
11
10
9
6
5
4
3
2
1
CH0F
Bit 15
CH0IE
14
MS0B
13
MS0A
12
ELS0B
11
ELS0A
10
0
9
Bit 8
MC9S08DZ128 Series Data Sheet, Rev. 1
58
Freescale Semiconductor
Chapter 4 Memory
Table 4-3. High-Page Register Summary (Sheet 5 of 5)
Address Register Name
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
CH1F
Bit 15
Bit 7
6
CH1IE
14
5
MS1B
13
4
MS1A
12
3
ELS1B
11
2
ELS1A
10
1
0
9
1
0
9
1
0
9
1
Bit 0
0
0x18C7
0x18C8
0x18C9
0x18CA
0x18CB
0x18CC
0x18CD
0x18CE
0x18CF
0x18D0
TPM3C0VL
TPM3C1SC
TPM3C1VH
TPM3C1VL
TPM3C2SC
TPM3C2VH
TPM3C2VL
TPM3C3SC
TPM3C3VH
TPM3C3VL
Bit 8
Bit 0
0
6
5
4
3
2
CH2F
Bit 15
Bit 7
CH2IE
14
MS2B
13
MS2A
12
ELS2B
11
ELS2A
10
Bit 8
Bit 0
0
6
5
4
3
2
CH3F
Bit 15
Bit 7
CH3IE
14
MS3B
13
MS3A
12
ELS3B
11
ELS3A
10
Bit 8
Bit 0
6
5
4
3
2
0x18D1–
0x18D7
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Reserved
AD7
AD6
AD5
AD4
AD3
AD2
AD1
0
0x18D8
0x18D9
0x18DA
0x18DB
0x18DC
0x18DD
IIC2A
IIC2F
MULT
ICR
IICEN
TCF
IICIE
IAAS
MST
TX
TXAK
0
RSTA
SRW
0
0
IIC2C1
IIC2S
IIC2D
IIC2C2
BUSY
ARBL
IICIF
RXAK
DATA
GCAEN
ADEXT
0
0
0
AD10
AD9
AD8
0x18DE–
0x18FF
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Reserved
Figure 4-4 shows the structure of receive and transmit buffers for extended identifier mapping. These
registers vary depending on whether standard or extended mapping is selected. See Chapter 12,
“Freescale’s Controller Area Network (S08MSCANV1),” for details on extended and standard identifier
mapping.
Table 4-4. MSCAN Foreground Receive and Transmit Buffer Layouts — Extended Mapping Shown
(Sheet 1 of 2)
ID28
ID20
ID14
ID6
ID27
ID19
ID13
ID5
ID26
ID18
ID12
ID4
ID25
SRR(1)
ID11
ID24
IDE(1)
ID10
ID2
ID23
ID17
ID9
ID22
ID16
ID8
ID21
ID15
ID7
0x18A0
0x18A1
0x18A2
0x18A3
CANRIDR0
CANRIDR1
CANRIDR2
CANRIDR3
ID3
ID1
ID0
RTR2
0x18A4 – CANRDSR0 –
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
0x18AB
0x18AC
0x18AD
0x18AE
0x18AF
0x18B0
0x18B1
0x18B2
CANRDSR7
CANRDLR
Reserved
—
—
—
—
—
—
—
—
DLC3
—
DLC2
—
DLC1
—
DLC0
—
TSR15
TSR7
ID28
ID20
ID14
TSR14
TSR6
ID27
ID19
ID13
TSR13
TSR5
ID26
ID18
ID12
TSR12
TSR4
ID25
SRR(3)
ID11
TSR11
TSR3
ID24
TSR10
TSR2
ID23
ID17
ID9
TSR9
TSR1
ID22
ID16
ID8
TSR8
TSR0
ID21
ID15
ID7
CANRTSRH
CANRTSRL
CANTIDR0
CANTIDR1
CANTIDR2
IDE(1)
ID10
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
59
Chapter 4 Memory
Table 4-4. MSCAN Foreground Receive and Transmit Buffer Layouts — Extended Mapping Shown
(Sheet 2 of 2)
ID6
ID5
ID4
ID3
ID2
ID1
ID0
RTR4
0x18B3
CANTIDR3
0x18B4 – CANTDSR0 –
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
0x18BB
0x18BC
0x18BD
0x18BE
0x18BF
CANTDSR7
CANTDLR
—
—
—
—
DLC3
PRIO3
TSR11
TSR3
DLC2
PRIO2
TSR10
TSR2
DLC1
PRIO1
TSR9
TSR1
DLC0
PRIO0
TSR8
TSR0
PRIO7
TSR15
TSR7
PRIO6
TSR14
TSR6
PRIO5
TSR13
TSR5
PRIO4
TSR12
TSR4
CANTTBPR
CANTTSRH
CANTTSRL
1
2
3
4
SRR and IDE are both 1s.
The position of RTR differs between extended and standard identifier mapping.
SRR and IDE are both 1s.
The position of RTR differs between extended and standard identifier mapping.
Nonvolatile FLASH registers, shown in Table 4-5, are located in the FLASH memory. These registers
include an 8-byte backdoor key, NVBACKKEY, which can be used to gain access to secure memory
resources. During reset events, the contents of NVPROT and NVOPT in the nonvolatile register area of the
FLASH memory are transferred into corresponding FPROT and FOPT working registers in the high-page
registers to control security and block protection options.
The factory MCG trim value is stored in a nonvolatile location and will be loaded into the MCGTRM and
MCGSC registers after any reset if not in a BDM mode. If in a BDM mode, a default value of 0x80 is
loaded. The internal reference trim values stored in Flash (0xFFAE, 0xFFAF), TRIM and FTRIM, can be
programmed by third party programmers and must be copied into the corresponding MCG registers by
user code to override the factory trim.
Table 4-5. Nonvolatile Register Summary
Address Register Name
0xFFAE Reserved for
storage of FTRIM
Reserved for
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
FTRIM
0xFFAF
storage of
MCGTRM
TRIM
0xFFB0– NVBACKKEY
0xFFB7
8-Byte Comparison Key
0xFFB8– Reserved
0xFFBC
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0xFFBD NVPROT
0xFFBE Reserved
0xFFBF NVOPT
EPS
FPS
—
FPOP
—
—
—
—
—
0
—
0
—
KEYEN
FNORED EPGMOD
0
SEC
Provided the key enable (KEYEN) bit is 1, the 8-byte comparison key can be used to temporarily
disengage memory security. This key mechanism can be accessed only through user code running in secure
memory. (A security key cannot be entered directly through background debug commands.) This security
key can be disabled completely by programming the KEYEN bit to 0. If the security key is disabled, the
only way to disengage security is by mass erasing the FLASH if needed (normally through the background
MC9S08DZ128 Series Data Sheet, Rev. 1
60
Freescale Semiconductor
Chapter 4 Memory
debug interface) and verifying that FLASH is blank. To avoid returning to secure mode after the next reset,
program the security bits (SEC) to the unsecured state (1:0).
4.4
Memory Management Unit
The memory management unit (MMU) allows the program and data space for the HCS08 Family of
Microcontrollers to be extended beyond the 64K CPU addressable memory map. The extended memory
when used for data can also be accessed linearly using a linear address pointer and data access registers.
4.4.1
Features
Key features of the MMU module are:
•
Memory Management Unit extends the HCS08 memory space
— up to 128K for program and data space
Extended program space using paging scheme
— PPAGE register used for page selection
— fixed 16K byte memory window
•
— architecture supports eight 16K pages
Extended data space using linear address pointer
— 17-bit linear address pointer
•
— linear address pointer and data register provided in direct page allows access of complete
FLASH memory map using direct page instructions
— optional auto increment of pointer when data accessed
— supports a 2s complement addition/subtraction to address pointer without using any math
instructions or memory resources
— supports word accesses to any address specified by the linear address pointer when using
LDHX, STHX instructions
4.4.2
Memory Expansion
The HCS08 Core architecture limits the CPU addressable space available to 64K bytes. The Program Page
(PPAGE) allows for integrating up to 128K of FLASH into the system by selecting one of the 16K byte
blocks to be accessed through the Paging Window located at 0x8000-0xBFFF. The MMU module also
provides a linear address pointer that allows extension of data access up to 128K.
4.4.2.1
Program Space
The PPAGE register holds the page select value for the Paging Window. The value in PPAGE can be
manipulated by using normal read and write instructions as well as the CALL and RTC instructions. The
user should not change PPAGE directly when running from paged memory, only CALL and RTC should
be used.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
61
Chapter 4 Memory
When the MMU detects that the CPU is addressing the Paging Window, the value currently in PPAGE will
be used to create an extended address that the MCU’s decode logic will use to select the desired FLASH
location. For example, the Flash from location 0x4000-0x7FFF can be accessed directly or using the
paging window, PPAGE = 1, address 0x8000-0xBFFF.
4.4.2.2
CALL and RTC (Return from Call) Instructions
CALL and RTC are instructions that perform automated page switching when executed in the user
program. CALL is similar to a JSR instruction, but the subroutine that is called can be located anywhere
in the normal 64K address space or on any page of program memory.
During the execution of a CALL instruction, the CPU:
•
•
•
•
Stacks the return address.
Pushes the current PPAGE value onto the stack.
Writes the new instruction-supplied PPAGE value into the PPAGE register.
Transfers control to the subroutine of the new instruction-supplied address.
This sequence is not interruptible; there is no need to inhibit interrupts during CALL execution. A CALL
can be executed from any address in memory to any other address.
The new PPAGE value is provided by an immediate operand in the instruction along with the address
within the paging window, 0x8000-0xBFFF.
RTC is similar to an RTS instruction.
The RTC instruction terminates subroutines invoked by a CALL instruction.
During the execution of an RTC instruction, the CPU:
•
•
•
Pulls the old PPAGE value from the stack and loads it into the PPAGE register
Pulls the 16-bit return address from the stack and loads it into the PC
Resumes execution at the return address
This sequence is not interruptible; there is no need to inhibit interrupts during RTC execution. An RTC
can be executed from any address in memory.
4.4.2.3
Data Space
The linear address pointer registers, LAP2:LAP0 along with the linear data register allow the CPU to read
or write any address in the extended FLASH memory space. This linear address pointer may be used to
access data from any memory location while executing code from any location in extended memory,
including accessing data from a different PPAGE than the currently executing program.
To access data using the linear address pointer, the user would first setup the extended address in the 17-bit
address pointer, LAP2:LAP0. Accessing one of the three linear data registers LB, LBP and LWP will
access the extended memory location specified by LAP2:LAP0. The three linear data registers access the
memory locations in the same way, however the LBP and LWP will also increment LAP2:LAP0.
MC9S08DZ128 Series Data Sheet, Rev. 1
62
Freescale Semiconductor
Chapter 4 Memory
Accessing either the LBP or LWP registers allows a user program to read successive memory locations
without re-writing the linear address pointer. Accessing LBP or LWP does the exact same function.
However, because of the address mapping of the registers with LBP following LWP, a user can do word
accesses in the extended address space using the LDHX or STHX instructions to access location LWP.
The MMU supports the addition of a 2s complement value to the linear address pointer without using any
math instructions or memory resources. Writes to LAPAB with a 2s complement value will cause the
MMU to add that value to the existing value in LAP2:LAP0.
4.4.3
MMU Registers and Control Bits
Program Page Register (PPAGE)
4.4.3.1
The HCS08 Core architecture limits the CPU addressable space available to 64K bytes. The address space
can be extended to 128K bytes using a paging window scheme. The Program Page (PPAGE) allows for
selecting one of the 16K byte blocks to be accessed through the Program Page Window located at
0x8000-0xBFFF. The CALL and RTC instructions can load or store the value of PPAGE onto or from the
stack during program execution. After any reset, PPAGE is set to PAGE 2.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
XA16
XA15
XA14
Reset:
0
0
0
0
0
0
1
0
Figure 4-5. Program Page Register (PPAGE)
Table 4-6. Program Page Register Field Descriptions
Description
Field
2:0
When the CPU addresses the paging window, 0x8000-0xBFFF, the value in the PPAGE register along with the
XA16:XA14 CPU addresses A13:A0 are used to create a 17-bit extended address.
4.4.3.2
Linear Address Pointer Registers 2:0 (LAP2:LAP0)
The three registers, LAP2:LAP0 contain the 17-bit linear address that allows the user to access any FLASH
location in the extended address map. This register is used in conjunction with the data registers, linear
byte (LB), linear byte post increment (LBP) and linear word post increment (LWP). The contents of
LAP2:LAP0 will auto-increment when accessing data using the LBP and LWP registers. The contents of
LAP2:LAP0 can be increased by writing an 8-bit value to LAPAB.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
63
Chapter 4 Memory
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
LA16
R
LA15
LA14
LA13
LA12
LA11
LA10
LA9
LA8
W
R
LA7
0
LA6
0
LA5
0
LA4
0
LA3
0
LA2
0
LA1
0
LA0
0
W
Reset:
Figure 4-6. Linear Address Pointer Registers 2:0 (LAP2:LAP0)
Table 4-7. Linear Address Pointer Registers 2:0 Field Descriptions
Description
Field
16:0
The values in LAP2:LAP0 are used to create a 17-bit linear address pointer. The value in these registers are used
LA16:LA0 as the extended address when accessing any of the data registers LB, LBP and LWP.
4.4.3.3
Linear Word Post Increment Register (LWP)
This register is one of three data registers that the user can use to access any FLASH memory location in
the extended address map. When LWP is accessed the contents of LAP2:LAP0 make up the extended
address of the FLASH memory location to be addressed. When accessing data using LWP, the contents of
LAP2:LAP0 will increment after the read or write is complete.
Accessing LWP does the same thing as accessing LBP. The MMU register ordering of LWP followed by
LBP, allow the user to access data by words using the LDHX or STHX instructions of the LWP register.
7
6
5
4
3
2
1
0
R
W
D7
D6
D5
D4
D3
D2
D1
D0
Reset:
0
0
0
0
0
0
0
0
Figure 4-7. Linear Word Post Increment Register (LWP)
Table 4-8. Linear Word Post Increment Register Field Descriptions
Description
Field
7:0
D7:D0
Reads of this register will first return the data value pointed to by the linear address pointer, LAP2:LAP0 and then
will increment LAP2:LAP0. Writes to this register will first write the data value to the memory location specified
by the linear address pointer and then will increment LAP2:LAP0. Writes to this register are most commonly used
when writing to the FLASH block(s) during programming.
4.4.3.4
Linear Byte Post Increment Register (LBP)
This register is one of three data registers that the user can use to access any FLASH memory location in
the extended address map. When LBP is accessed the contents of LAP2:LAP0 make up the extended
MC9S08DZ128 Series Data Sheet, Rev. 1
64
Freescale Semiconductor
Chapter 4 Memory
address of the FLASH memory location to be addressed. When accessing data using LBP, the contents of
LAP2:LAP0 will increment after the read or write is complete.
Accessing LBP does the same thing as accessing LWP. The MMU register ordering of LWP followed by
LBP, allow the user to access data by words using the LDHX or STHX instructions with the address of the
LWP register.
7
6
5
4
3
2
1
0
R
W
D7
D6
D5
D4
D3
D2
D1
D0
Reset:
0
0
0
0
0
0
0
0
Figure 4-8. Linear Byte Post Increment Register (LBP)
Table 4-9. Linear Byte Post Increment Register Field Descriptions
Description
Field
7:0
D7:D0
Reads of this register will first return the data value pointed to by the linear address pointer, LAP2:LAP0 and then
will increment LAP2:LAP0. Writes to this register will first write the data value to the memory location specified
by the linear address pointer and then will increment LAP2:LAP0. Writes to this register are most commonly used
when writing to the FLASH block(s) during programming.
4.4.3.5
Linear Byte Register (LB)
This register is one of three data registers that the user can use to access any FLASH memory location in
the extended address map. When LB is accessed the contents of LAP2:LAP0 make up the extended
address of the FLASH memory location to be addressed.
7
6
5
4
3
2
1
0
R
W
D7
D6
D5
D4
D3
D2
D1
D0
Reset:
0
0
0
0
0
0
0
0
Figure 4-9. Linear Byte Register (LB)
Table 4-10. Linear Data Register Field Descriptions
Description
Field
7:0
D7:D0
Reads of this register returns the data value pointed to by the linear address pointer, LAP2:LAP0. Writes to this
register will write the data value to the memory location specified by the linear address pointer. Writes to this
register are most commonly used when writing to the FLASH block(s) during programming.
4.4.3.6
Linear Address Pointer Add Byte Register (LAPAB)
The user can increase or decrease the contents of LAP2:LAP0 by writing a 2s complement value to
LAPAB. The value written will be added to the current contents of LAP2:LAP0.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
65
Chapter 4 Memory
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
D7
0
D6
0
D5
0
D4
0
D3
0
D2
0
D1
0
D0
0
Reset:
Figure 4-10. Linear Address Pointer Add Byte Register (LAPAB)
Table 4-11. Linear Address Pointer Add Byte Register Field Descriptions
Description
Field
7:0
D7:D0
The 2s complement value written to LAPAB will be added to contents of the linear address pointer register,
LAP2:LAP0. Writing a value of 0x7f to LAPAB will increase LAP by 127, a value of 0x80 will decrease LAP by
128, and a value of 0xff will decrease LAP by 1.
4.5
RAM
The MC9S08DZ128 Series includes static RAM. The locations in RAM below 0x0100 can be accessed
using the more efficient direct addressing mode, and any single bit in this area can be accessed with the bit
manipulation instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed
program variables in this area of RAM is preferred.
The RAM retains data while the MCU is in low-power wait, stop2, or stop3 mode. At power-on the
contents of RAM are uninitialized. RAM data is unaffected by any reset if the supply voltage does not drop
below the minimum value for RAM retention (V
).
RAM
For compatibility with M68HC05 MCUs, the HCS08 resets the stack pointer to 0x00FF. In the
MC9S08DZ128 Series, it is usually best to reinitialize the stack pointer to the top of the RAM so the direct
page RAM can be used for frequently accessed RAM variables and bit-addressable program variables.
Include the following 2-instruction sequence in your reset initialization routine (where RamLast is equated
to the highest address of the RAM in the Freescale Semiconductor equate file).
LDHX
TXS
#RamLast+1
;point one past RAM
;SP<-(H:X-1)
NOTE
On most devices in the MC9S08DZ128 Series, more than 4K of RAM is
present in two separate address blocks.
When security is enabled, the RAM is considered a secure memory resource and is not accessible through
BDM or code executing from non-secure memory. See Section 4.6.9, “Security”, for a detailed description
of the security feature.
MC9S08DZ128 Series Data Sheet, Rev. 1
66
Freescale Semiconductor
Chapter 4 Memory
4.6
FLASH and EEPROM
MC9S08DZ128 Series devices include FLASH and EEPROM memory intended primarily for program
and data storage. In-circuit programming allows the operating program and data to be loaded into FLASH
and EEPROM, respectively, after final assembly of the application product. It is possible to program the
arrays through the single-wire background debug interface. Because no special voltages are needed for
erase and programming operations, in-application programming is also possible through other
software-controlled communication paths. For a more detailed discussion of in-circuit and in-application
programming, refer to the HCS08 Family Reference Manual, Volume I, Freescale Semiconductor
document order number HCS08RMv1.
4.6.1
Features
Features of the FLASH and EEPROM memory include:
•
•
•
•
•
•
•
•
•
•
Up to 128K of FLASH and up to 2K of EEPROM (see Table 1-1 for exact array sizes)
FLASH sector size: 512 bytes
EEPROM sector size: selectable 4-byte or 8-byte sector mapping operation
Single power supply program and erase
Command interface for fast program and erase operation
Up to 100,000 program/erase cycles at typical voltage and temperature
Flexible block protection
Security feature for FLASH, EEPROM, and RAM
Burst programming capability
Sector erase abort
4.6.2
Program and Erase Times
Before any program or erase command can be accepted, the FLASH and EEPROM clock divider register
(FCDIV) must be written to set the internal clock for the FLASH and EEPROM module to a frequency
(f
) between 150 kHz and 200 kHz (see Section 4.6.11.1, “FLASH and EEPROM Clock Divider
FCLK
Register (FCDIV)”). This register can be written only once, so normally this write is performed during
reset initialization. The user must ensure that FACCERR is not set before writing to the FCDIV register.
One period of the resulting clock (1/f
) is used by the command processor to time program and erase
FCLK
pulses. An integer number of these timing pulses is used by the command processor to complete a program
or erase command.
NOTE
When changing from a low power mode (Stop2 mode or bus frequency less
than 150kHz) into an operating condition that allows program or erase, it is
necessary to wait at least 10μs before starting a program or erase command.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
67
Chapter 4 Memory
Table 4-12 shows program and erase times. The bus clock frequency and FCDIV determine the frequency
of FCLK (f
). The time for one cycle of FCLK is t
= 1/f
. The times are shown as a number
FCLK
FCLK
FCLK
of cycles of FCLK and as an absolute time for the case where t
shown include overhead for the command state machine and enabling and disabling of program and erase
voltages.
= 5 μs. Program and erase times
FCLK
Table 4-12. Program and Erase Times
Parameter
Cycles of FCLK
Time if FCLK = 200 kHz
Byte program
Burst program
Sector erase
9
4
45 μs
20 μs1
20 ms
100 ms
20 μs1
4000
20,000
4
Mass erase
Sector erase abort
1
Excluding start/end overhead
4.6.3
Program and Erase Command Execution
The FCDIV register must be initialized after any reset and any error flag is cleared before beginning
command execution. The command execution steps are:
1. Write a data value to an address in the FLASH or EEPROM array. The address and data
information from this write is latched into the FLASH and EEPROM interface. This write is a
required first step in any command sequence. For erase and blank check commands, the value of
the data is not important. For sector erase commands, the address can be any address in the sector
of FLASH or EEPROM to be erased. For mass erase and blank check commands, the address can
be any address in the FLASH or EEPROM memory. FLASH and EEPROM erase independently
of each other.
NOTE
Before programming a particular byte in the FLASH or EEPROM, the
sector in which that particular byte resides must be erased by a mass or
sector erase operation. Reprogramming bits in an already programmed byte
without first performing an erase operation may disturb data stored in the
FLASH or EEPROM memory.
2. Write the command code for the desired command to FCMD. The six valid commands are blank
check (0x05), byte program (0x20), burst program (0x25), sector erase (0x40), mass erase (0x41),
and sector erase abort (0x47). The command code is latched into the command buffer.
3. Write a 1 to the FCBEF bit in FSTAT to clear FCBEF and launch the command (including its
address and data information).
A partial command sequence can be aborted manually by writing a 0 to FCBEF any time after the
write to the memory array and before writing the 1 that clears FCBEF and launches the complete
command. Aborting a command in this way sets the FACCERR access error flag which must be
cleared before starting a new command.
MC9S08DZ128 Series Data Sheet, Rev. 1
68
Freescale Semiconductor
Chapter 4 Memory
A strictly monitored procedure must be obeyed or the command will not be accepted. This
minimizes the possibility of any unintended changes to the memory contents. The command
complete flag (FCCF) indicates when a command is complete. The command sequence must be
completed by clearing FCBEF to launch the command. Figure 4-11 is a flowchart for executing all
of the commands except for burst programming and sector erase abort.
4. Wait until the FCCF bit in FSTAT is set. As soon as FCCF= 1, the operation has completed
successfully.
(1)
(1)
Required only once
after reset.
WRITE TO FCDIV
PROGRAM AND
ERASE FLOW
START
0
FACCERR?
CLEAR ERROR
WRITE TO FLASH OR EEPROM TO
BUFFER ADDRESS AND DATA
WRITE COMMAND TO FCMD
(2)
WRITE 1 TO FCBEF
Wait at least four bus cycles
before checking FCBEF or FCCF.
TO LAUNCH COMMAND
(2)
AND CLEAR FCBEF
YES
FPVIOL OR
FACCERR?
ERROR EXIT
NO
0
FCCF?
1
DONE
Figure 4-11. Program and Erase Flowchart
4.6.4
Burst Program Execution
The burst program command is used to program sequential bytes of data in less time than would be
required using the standard program command. This is possible because the high voltage to the FLASH
array does not need to be disabled between program operations. Ordinarily, when a program or erase
command is issued, an internal charge pump associated with the FLASH memory must be enabled to
supply high voltage to the array. Upon completion of the command, the charge pump is turned off. When
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
69
Chapter 4 Memory
a burst program command is issued, the charge pump is enabled and remains enabled after completion of
the burst program operation if these two conditions are met:
•
•
The next burst program command sequence has begun before the FCCF bit is set.
The next sequential address selects a byte on the same burst block as the current byte being
programmed. A burst block in this FLASH memory consists of 32 bytes. A new burst block begins
at each 32-byte address boundary.
The first byte of a series of sequential bytes being programmed in burst mode will take the same amount
of time to program as a byte programmed in standard mode. Subsequent bytes will program in the burst
program time provided that the conditions above are met. If the next sequential address is the beginning of
a new row, the program time for that byte will be the standard time instead of the burst time. This is because
the high voltage to the array must be disabled and then enabled again. If a new burst command has not been
queued before the current command completes, then the charge pump will be disabled and high voltage
removed from the array.
A flowchart to execute the burst program operation is shown in Figure 4-12.
MC9S08DZ128 Series Data Sheet, Rev. 1
70
Freescale Semiconductor
Chapter 4 Memory
(1)
Required only once
after reset.
(1)
WRITE TO FCDIV
BURST PROGRAM
FLOW
START
0
FACCERR?
1
CLEAR ERROR
0
FCBEF?
1
WRITE TO FLASH
TO BUFFER ADDRESS AND DATA
WRITE COMMAND TO FCMD
(2)
WRITE 1 TO FCBEF
Wait at least four bus cycles
before checking FCBEF or FCCF.
TO LAUNCH COMMAND
(2)
AND CLEAR FCBEF
YES
FPVIOL OR
FACCERR?
ERROR EXIT
NO
YES
NEW BURST COMMAND?
NO
0
FCCF?
1
DONE
Figure 4-12. Burst Program Flowchart
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
71
Chapter 4 Memory
4.6.5
Sector Erase Abort
The sector erase abort operation will terminate the active sector erase operation so that other sectors are
available for read and program operations without waiting for the sector erase operation to complete.
The sector erase abort command write sequence is as follows:
1. Write to any FLASH or EEPROM address to start the command write sequence for the sector erase
abort command. The address and data written are ignored.
2. Write the sector erase abort command, 0x47, to the FCMD register.
3. Clear the FCBEF flag in the FSTAT register by writing a 1 to FCBEF to launch the sector erase
abort command.
If the sector erase abort command is launched resulting in the early termination of an active sector erase
operation, the FACCERR flag will set once the operation completes as indicated by the FCCF flag being
set. The FACCERR flag sets to inform the user that the FLASH sector may not be fully erased and a new
sector erase command must be launched before programming any location in that specific sector.
If the sector erase abort command is launched but the active sector erase operation completes normally,
the FACCERR flag will not set upon completion of the operation as indicated by the FCCF flag being set.
Therefore, if the FACCERR flag is not set after the sector erase abort command has completed, a sector
being erased when the abort command was launched will be fully erased.
A flowchart to execute the sector erase abort operation is shown in Figure 4-13.
SECTOR ERASE
START
ABORT FLOW
1
FCCF?
0
WRITE TO FLASH
TO BUFFER ADDRESS AND DATA
WRITE 0x47 TO FCMD
(2)
WRITE 1 TO FCBEF
Wait at least four bus cycles
TO LAUNCH COMMAND
(2)
before checking FCBEF or FCCF.
AND CLEAR FCBEF
0
FCCF?
1
0
SECTOR ERASE COMPLETED
FACCERR?
1
SECTOR ERASE ABORTED
Figure 4-13. Sector Erase Abort Flowchart
MC9S08DZ128 Series Data Sheet, Rev. 1
72
Freescale Semiconductor
Chapter 4 Memory
NOTE
The FCBEF flag will not set after launching the sector erase abort command.
If an attempt is made to start a new command write sequence with a sector
erase abort operation active, the FACCERR flag in the FSTAT register will
be set. A new command write sequence may be started after clearing the
ACCERR flag, if set.
NOTE
The sector erase abort command should be used sparingly since a sector
erase operation that is aborted counts as a complete program/erase cycle.
4.6.6
Access Errors
An access error occurs whenever the command execution protocol is violated.
Any of the following specific actions will cause the access error flag (FACCERR) in FSTAT to be set.
FACCERR must be cleared by writing a 1 to FACCERR in FSTAT before any command can be processed.
•
•
•
•
Writing to a FLASH address before the internal FLASH and EEPROM clock frequency has been
set by writing to the FCDIV register.
Writing to a FLASH address while FCBEF is not set. (A new command cannot be started until the
command buffer is empty.)
Writing a second time to a FLASH address before launching the previous command. (There is only
one write to FLASH for every command.)
Writing a second time to FCMD before launching the previous command. (There is only one write
to FCMD for every command.)
•
•
Writing to any FLASH control register other than FCMD after writing to a FLASH address.
Writing any command code other than the six allowed codes (0x05, 0x20, 0x25, 0x40, 0x41, or
0x47) to FCMD.
•
•
•
Accessing (read or write) any FLASH control register other than to write to FSTAT (to clear
FCBEF and launch the command) after writing the command to FCMD.
The MCU enters stop mode while a program or erase command is in progress. (The command is
aborted.)
Writing the byte program, burst program, sector erase or sector erase abort command code (0x20,
0x25, 0x40, or 0x47) with a background debug command while the MCU is secured. (The
background debug controller can do blank check and mass erase commands only when the MCU
is secure.)
•
Writing 0 to FCBEF to cancel a partial command.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
73
Chapter 4 Memory
4.6.7
Block Protection
The block protection feature prevents the protected region of FLASH or EEPROM from program or erase
changes. Block protection is controlled through the FLASH and EEPROM protection register (FPROT).
The EPS bits determine the protected region of EEPROM and the FPS bits determine the protected region
of FLASH. See Section 4.6.11.4, “FLASH and EEPROM Protection Register (FPROT and NVPROT).”
After exit from reset, FPROT is loaded with the contents of the NVPROT location, which is in the
nonvolatile register block of the FLASH memory. FPROT cannot be changed directly from application
software so a runaway program cannot alter the block protection settings. Because NVPROT is within the
last sector of FLASH, if any amount of memory is protected, NVPROT is itself protected and cannot be
altered (intentionally or unintentionally) by the application software. FPROT can be written through
background debug commands, which provides a way to erase and reprogram protected FLASH memory.
One use for block protection is to block protect an area of FLASH memory for a bootloader program. This
bootloader program then can be used to erase the rest of the FLASH memory and reprogram it. The
bootloader is protected even if MCU power is lost during an erase and reprogram operation.
4.6.8
Vector Redirection
Whenever any FLASH is block protected, the reset and interrupt vectors will be protected. Vector
redirection allows users to modify interrupt vector information without unprotecting bootloader and reset
vector space. Vector redirection is enabled by programming the FNORED bit in the NVOPT register to 0.
For redirection to occur, at least some portion of the FLASH memory must be block protected by
programming the FPS bits in the NVPROT register. All interrupt vectors (memory locations 0x0_FF80
through 0x0_FFFD) are redirected, though the reset vector (0x0_FFFE:0x0_FFFF) is not.
For example, if 8192 bytes of FLASH are protected, the protected address region is from 0x0_E000
through 0x0_FFFF. The interrupt vectors (0x0_FF80 through 0x0_FFFD) are redirected to the locations
0x0_DF80 through 0x0_DFFD. If vector redirection is enabled and an interrupt occurs, the values in the
locations 0x0_DFE0:0x0_DFE1 are used for the vector instead of the values in the locations
0x0_FFE0:0x0FFE1. This allows the user to reprogram the unprotected portion of the FLASH with new
program code including new interrupt vector values while leaving the protected area, which includes the
default vector locations, unchanged.
4.6.9
Security
The MC9S08DZ128 Series includes circuitry to prevent unauthorized access to the contents of FLASH,
EEPROM, and RAM memory. When security is engaged, FLASH, EEPROM, and RAM are considered
secure resources. Direct-page registers, high-page registers, and the background debug controller are
considered unsecured resources. Programs executing within secure memory have normal access to any
MCU memory locations and resources. Attempts to access a secure memory location with a program
executing from an unsecured memory space or through the background debug interface are blocked (writes
are ignored and reads return all 0s).
Security is engaged or disengaged based on the state of two register bits (SEC[1:0]) in the FOPT register.
During reset, the contents of the nonvolatile location NVOPT are copied from FLASH into the working
FOPT register in high-page register space. A user engages security by programming the NVOPT location,
MC9S08DZ128 Series Data Sheet, Rev. 1
74
Freescale Semiconductor
Chapter 4 Memory
which can be performed at the same time the FLASH memory is programmed. The 1:0 state disengages
security; the other three combinations engage security. Notice the erased state (1:1) makes the MCU
secure. During development, whenever the FLASH is erased, it is good practice to immediately program
the SEC0 bit to 0 in NVOPT so SEC = 1:0. This would allow the MCU to remain unsecured after a
subsequent reset.
The on-chip debug module cannot be enabled while the MCU is secure. The separate background debug
controller can be used for background memory access commands, but the MCU cannot enter active
background mode except by holding BKGD low at the rising edge of reset.
A user can choose to allow or disallow a security unlocking mechanism through an 8-byte backdoor
security key. If the nonvolatile KEYEN bit in NVOPT/FOPT is 0, the backdoor key is disabled and there
is no way to disengage security without completely erasing all FLASH locations. If KEYEN is 1, a secure
user program can temporarily disengage security by:
1. Writing 1 to KEYACC in the FCNFG register. This makes the FLASH module interpret writes to
the backdoor comparison key locations (NVBACKKEY through NVBACKKEY+7) as values to
be compared against the key rather than as the first step in a FLASH program or erase command.
2. Writing the user-entered key values to the NVBACKKEY through NVBACKKEY+7 locations.
These writes must be performed in order starting with the value for NVBACKKEY and ending
with NVBACKKEY+7. STHX must not be used for these writes because these writes cannot be
performed on adjacent bus cycles. User software normally would get the key codes from outside
the MCU system through a communication interface such as a serial I/O.
3. Writing 0 to KEYACC in the FCNFG register. If the 8-byte key that was written matches the key
stored in the FLASH locations, SEC bits are automatically changed to 1:0 and security will be
disengaged until the next reset.
The security key can be written only from secure memory (either RAM, EEPROM, or FLASH), so it
cannot be entered through background commands without the cooperation of a secure user program.
The backdoor comparison key (NVBACKKEY through NVBACKKEY+7) is located in FLASH memory
locations in the nonvolatile register space so users can program these locations exactly as they would
program any other FLASH memory location. The nonvolatile registers are in the same 512-byte block of
FLASH as the reset and interrupt vectors, so block protecting that space also block protects the backdoor
comparison key. Block protects cannot be changed from user application programs, so if the vector space
is block protected, the backdoor security key mechanism cannot permanently change the block protect,
security settings, or the backdoor key.
Security can always be disengaged through the background debug interface by taking these steps:
1. Disable any block protections by writing FPROT. FPROT can be written only with background
debug commands, not from application software.
2. Mass erase FLASH if necessary.
3. Blank check FLASH. Provided FLASH is completely erased, security is disengaged until the next
reset.
To avoid returning to secure mode after the next reset, program NVOPT so SEC = 1:0.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
75
Chapter 4 Memory
4.6.10 EEPROM Mapping
Only half of the EEPROM is in the memory map. The EPGSEL bit in FCNFG register selects which half
of the array can be accessed in foreground while the other half can not be accessed in background. There
are two mapping mode options that can be selected to configure the 8-byte EEPROM sectors: 4-byte mode
and 8-byte mode. Each mode is selected by the EPGMOD bit in the FOPT register.
In 4-byte sector mode (EPGMOD = 0), each 8-byte sector splits four bytes on foreground and four bytes
on background but on the same addresses. The EPGSEL bit selects which four bytes can be accessed.
During a sector erase, the entire 8-byte sector (four bytes in foreground and four bytes in background) is
erased.
In 8-byte sector mode (EPGMOD = 1), each entire 8-byte sector is in a single page. The EPGSEL bit
selects which sectors are on background. During a sector erase, the entire 8-byte sector in foreground is
erased.
4.6.11 FLASH and EEPROM Registers and Control Bits
The FLASH and EEPROM modules have seven 8-bit registers in the high-page register space and three
locations in the nonvolatile register space in FLASH memory. Two of those locations are copied into two
corresponding high-page control registers at reset. There is also an 8-byte comparison key in FLASH
memory. Refer to Table 4-3 and Table 4-5 for the absolute address assignments for all FLASH and
EEPROM registers. This section refers to registers and control bits only by their names. A Freescale
Semiconductor-provided equate or header file normally is used to translate these names into the
appropriate absolute addresses.
4.6.11.1 FLASH and EEPROM Clock Divider Register (FCDIV)
Bit 7 of this register is a read-only status flag. Bits 6 through 0 may be read at any time but can be written
only one time. Before any erase or programming operations are possible, write to this register to set the
frequency of the clock for the nonvolatile memory system within acceptable limits.
7
6
5
4
3
2
1
0
R
W
DIVLD
PRDIV8
DIV
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-14. FLASH and EEPROM Clock Divider Register (FCDIV)
MC9S08DZ128 Series Data Sheet, Rev. 1
76
Freescale Semiconductor
Chapter 4 Memory
Table 4-13. FCDIV Register Field Descriptions
Description
Field
7
Divisor Loaded Status Flag — When set, this read-only status flag indicates that the FCDIV register has been
written since reset. Reset clears this bit and the first write to this register causes this bit to become set regardless
of the data written.
DIVLD
0 FCDIV has not been written since reset; erase and program operations disabled for FLASH and EEPROM.
1 FCDIV has been written since reset; erase and program operations enabled for FLASH and EEPROM.
6
Prescale (Divide) FLASH and EEPROM Clock by 8 (This bit is write once.)
0 Clock input to the FLASH and EEPROM clock divider is the bus rate clock.
1 Clock input to the FLASH and EEPROM clock divider is the bus rate clock divided by 8.
PRDIV8
5:0
DIV
Divisor for FLASH and EEPROM Clock Divider — The FLASH and EEPROM clock divider divides the bus rate
clock (or the bus rate clock divided by 8 if PRDIV8 = 1) by the value in the 6-bit DIV field plus one. The resulting
frequency of the internal FLASH and EEPROM clock must fall within the range of 200 kHz to 150 kHz for proper
FLASH and EEPROM operations. Program/Erase timing pulses are one cycle of this internal FLASH and
EEPROM clock which corresponds to a range of 5 μs to 6.7 μs. The automated programming logic uses an
integer number of these pulses to complete an erase or program operation. See Equation 4-1 and Equation 4-2.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
77
Chapter 4 Memory
if PRDIV8 = 0 — f
if PRDIV8 = 1 — f
= f
÷ (DIV + 1)
Eqn. 4-1
Eqn. 4-2
FCLK
Bus
= f
÷ (8 × (DIV + 1))
FCLK
Bus
Table 4-14 shows the appropriate values for PRDIV8 and DIV for selected bus frequencies.
Table 4-14. FLASH and EEPROM Clock Divider Settings
PRDIV8
(Binary)
DIV
(Decimal)
Program/Erase Timing Pulse
fBus
fFCLK
(5 μs Min, 6.7 μs Max)
20 MHz
10 MHz
8 MHz
1
0
0
0
0
0
0
0
12
49
39
19
9
192.3 kHz
200 kHz
200 kHz
200 kHz
200 kHz
200 kHz
200 kHz
150 kHz
5.2 μs
5 μs
5 μs
4 MHz
5 μs
2 MHz
5 μs
1 MHz
4
5 μs
200 kHz
150 kHz
0
5 μs
0
6.7 μs
4.6.11.2 FLASH and EEPROM Options Register (FOPT and NVOPT)
During reset, the contents of the nonvolatile location NVOPT are copied from FLASH into FOPT. To
change the value in this register, erase and reprogram the NVOPT location in FLASH memory as usual
and then issue a new MCU reset.
7
6
5
4
3
2
1
0
R
W
KEYEN
FNORED
EPGMOD
0
0
0
SEC
Reset
F
F
F
0
0
0
F
F
= Unimplemented or Reserved
Figure 4-15. FLASH and EEPROM Options Register (FOPT)
Table 4-15. FOPT Register Field Descriptions
Description
Field
7
Backdoor Key Mechanism Enable — When this bit is 0, the backdoor key mechanism cannot be used to
disengage security. The backdoor key mechanism is accessible only from user (secured) firmware. BDM
commands cannot be used to write key comparison values that would unlock the backdoor key. For more detailed
information about the backdoor key mechanism, refer to Section 4.6.9, “Security.”
KEYEN
0 No backdoor key access allowed.
1 If user firmware writes an 8-byte value that matches the nonvolatile backdoor key (NVBACKKEY through
NVBACKKEY+7 in that order), security is temporarily disengaged until the next MCU reset.
6
Vector Redirection Disable — When this bit is 1, vector redirection is disabled.
FNORED 0 Vector redirection enabled.
1 Vector redirection disabled.
MC9S08DZ128 Series Data Sheet, Rev. 1
78
Freescale Semiconductor
Chapter 4 Memory
Table 4-15. FOPT Register Field Descriptions
Description
Field
5
EEPROM Sector Mode — When this bit is 0, each sector is split into two pages (4-byte mode). When this bit is
EPGMOD 1, each sector is in a single page (8-byte mode).
0 Half of each EEPROM sector is in Page 0 and the other half is in Page 1.
1 Each sector is in a single page.
1:0
SEC
Security State Code — This 2-bit field determines the security state of the MCU as shown in Table 4-16. When
the MCU is secure, the contents of RAM, EEPROM and FLASH memory cannot be accessed by instructions
from any unsecured source including the background debug interface. SEC changes to 1:0 after successful
backdoor key entry or a successful blank check of FLASH. For more detailed information about security, refer to
Section 4.6.9, “Security.”
1
Table 4-16. Security States
SEC[1:0]
Description
0:0
0:1
1:0
1:1
secure
secure
unsecured
secure
1
SEC changes to 1:0 after successful backdoor key entry
or a successful blank check of FLASH.
4.6.11.3 FLASH and EEPROM Configuration Register (FCNFG)
7
6
5
4
3
2
1
0
R
W
0
1
0
0
0
1
EPGSEL
KEYACC
Reset
0
0
0
1
0
0
0
1
= Unimplemented or Reserved
Figure 4-16. FLASH and EEPROM Configuration Register (FCNFG)
Table 4-17. FCNFG Register Field Descriptions
Description
Field
6
EEPROM Page Select — This bit selects which EEPROM page is accessed in the memory map.
0 Page 0 is in foreground of memory map. Page 1 is in background and can not be accessed.
1 Page 1 is in foreground of memory map. Page 0 is in background and can not be accessed.
EPGSEL
5
Enable Writing of Access Key — This bit enables writing of the backdoor comparison key. For more detailed
information about the backdoor key mechanism, refer to Section 4.6.9, “Security.”
KEYACC
0 Writes to 0xFFB0–0xFFB7 are interpreted as the start of a FLASH programming or erase command.
1 Writes to NVBACKKEY (0xFFB0–0xFFB7) are interpreted as comparison key writes.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
79
Chapter 4 Memory
4.6.11.4 FLASH and EEPROM Protection Register (FPROT and NVPROT)
The FPROT register defines which FLASH and EEPROM sectors are protected against program and erase
operations.
During the reset sequence, the FPROT register is loaded from the nonvolatile location NVPROT. To
change the protection that will be loaded during the reset sequence, the sector containing NVPROT must
be unprotected and erased, then NVPROT can be reprogrammed.
FPROT bits are readable at any time and writable as long as the size of the protected region is being
increased. Any write to FPROT that attempts to decrease the size of the protected memory will be ignored.
Trying to alter data in any protected area will result in a protection violation error and the FPVIOL flag
will be set in the FSTAT register. Mass erase is not possible if any one of the sectors is protected.
7
6
5
4
3
2
1
0
R
W
EPS
FPS
FPOP
Reset
F
F
F
F
F
F
F
F
Figure 4-17. FLASH and EEPROM Protection Register (FPROT)
Table 4-18. FPROT Register Field Descriptions
Description
Field
7:6
EEPROM Protect Select Bits — This 2-bit field determines the protected EEPROM locations that cannot be
EPS
erased or programmed. See Table 4-19.
5:1
FLASH Protect Select Bits — With FPOP set, this 5-bit field determines the protected FLASH locations that
FPS
cannot be erased or programmed. SeeTable 4-20.
0
FLASH Protection Open
FPOP
0 Flash is fully protected.
1 Flash protected address range determined by FPS bits.
Table 4-19. EEPROM Block Protection
EPS
Protected Address Range
Protected Size
0x3
0x2
0x1
0x0
No protection
3FF0 - 3FFF
3FE0 - 3FFF
3FC0–3FFF
0 bytes
32 bytes
64 bytes
128 bytes
MC9S08DZ128 Series Data Sheet, Rev. 1
80
Freescale Semiconductor
Chapter 4 Memory
Table 4-20. FLASH Block Protection
Protected Address Range
Relative to Flash Array base
Protected Size
FPS
FPOP
Flash Array 0
Flash Array 1
0x1F
0x1E
0x1D
0x1C
0x1B
0x1A
0x19
0x18
0x17
0x16
0x15
0x14
0x13
0x12
0x11
0x10
0x0F
0x0E
0x0D
0x0C
...
No protection
0 Kbytes
8 Kbytes
0x0_E000–0x0_FFFF
0x0_C000–0x0_FFFF
0x0_A000–0x0_FFFF
0x0_8000–0x0_FFFF
0x0_6000–0x0_FFFF
0x0_4000–0x0_FFFF
0x0_2000–0x0_FFFF
0x0_0000–0x0_FFFF
16 Kbytes
24 Kbytes
32 Kbytes
40 Kbytes
48 Kbytes
56 Kbytes
64 Kbytes
68 Kbytes
72 Kbytes
76 Kbytes
80 Kbytes
84 Kbytes
88 Kbytes
92 Kbytes
96 Kbytes
98 Kbytes
100 Kbytes
102 Kbytes
...
No protection
0x0_0000–0x0_FFFF 0x1_F000–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_E000–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_D000–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_C000–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_B000–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_A000–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_9000–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_8000–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_7800–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_7000–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_6800–0x1_FFFF
1
...
...
0x05
0x04
0x03
0x02
0x01
0x00
-
0x0_0000–0x0_FFFF 0x1_3000–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_2800–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_2000–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_1800–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_1000–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_0800–0x1_FFFF
0x0_0000–0x0_FFFF 0x1_0000–0x1_FFFF
116 Kbytes
118 Kbytes
120 Kbytes
122 Kbytes
124 Kbytes
126 Kbytes
128 Kbytes
0
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
81
Chapter 4 Memory
4.6.11.5 FLASH and EEPROM Status Register (FSTAT)
7
6
5
4
3
2
1
0
R
W
FCCF
0
FBLANK
0
0
FCBEF
FPVIOL
FACCERR
Reset
1
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-18. FLASH and EEPROM Status Register (FSTAT)
Table 4-21. FSTAT Register Field Descriptions
Field
Description
7
Command Buffer Empty Flag — The FCBEF bit is used to launch commands. It also indicates that the
FCBEF
command buffer is empty so that a new command sequence can be executed when performing burst
programming. The FCBEF bit is cleared by writing a 1 to it or when a burst program command is transferred to
the array for programming. Only burst program commands can be buffered.
0 Command buffer is full (not ready for additional commands).
1 A new burst program command can be written to the command buffer.
6
Command Complete Flag — FCCF is set automatically when the command buffer is empty and no command
is being processed. FCCF is cleared automatically when a new command is started (by writing 1 to FCBEF to
register a command). Writing to FCCF has no meaning or effect.
0 Command in progress
FCCF
1 All commands complete
5
Protection Violation Flag — FPVIOL is set automatically when a command that attempts to erase or program
a location in a protected block (the erroneous command is ignored). FPVIOL is cleared by writing a 1 to FPVIOL.
0 No protection violation.
FPVIOL
1 An attempt was made to erase or program a protected location.
4
Access Error Flag — FACCERR is set automatically when the proper command sequence is not obeyed exactly
FACCERR (the erroneous command is ignored), if a program or erase operation is attempted before the FCDIV register has
been initialized, or if the MCU enters stop while a command was in progress. For a more detailed discussion of
the exact actions that are considered access errors, see Section 4.6.6, “Access Errors.” FACCERR is cleared by
writing a 1 to FACCERR. Writing a 0 to FACCERR has no meaning or effect.
0 No access error.
1 An access error has occurred.
2
Verified as All Blank (erased) Flag — FBLANK is set automatically at the conclusion of a blank check command
if the entire FLASH or EEPROM array was verified to be erased. FBLANK is cleared by clearing FCBEF to write
a new valid command. Writing to FBLANK has no meaning or effect.
FBLANK
0 After a blank check command is completed and FCCF = 1, FBLANK = 0 indicates the FLASH or EEPROM
array is not completely erased.
1 After a blank check command is completed and FCCF = 1, FBLANK = 1 indicates the FLASH or EEPROM
array is completely erased (all 0xFFFF).
4.6.11.6 FLASH and EEPROM Command Register (FCMD)
Only six command codes are recognized in normal user modes, as shown in Table 4-22. All other
command codes are illegal and generate an access error. Refer to Section 4.6.3, “Program and Erase
MC9S08DZ128 Series Data Sheet, Rev. 1
82
Freescale Semiconductor
Chapter 4 Memory
Command Execution,” for a detailed discussion of FLASH and EEPROM programming and erase
operations.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
FCMD
Reset
0
0
0
0
0
0
0
0
Figure 4-19. FLASH and EEPROM Command Register (FCMD)
Table 4-22. FLASH and EEPROM Commands
Command
FCMD
Equate File Label
Blank check
Byte program
Burst program
Sector erase
0x05
0x20
0x25
0x40
0x41
0x47
mBlank
mByteProg
mBurstProg
mSectorErase
mMassErase
mEraseAbort
Mass erase
Sector erase abort
It is not necessary to perform a blank check command after a mass erase operation. Only blank check is
required as part of the security unlocking mechanism.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
83
Chapter 4 Memory
MC9S08DZ128 Series Data Sheet, Rev. 1
84
Freescale Semiconductor
Chapter 5
Resets, Interrupts, and General System Control
5.1
Introduction
This section discusses basic reset and interrupt mechanisms and their various sources in the
MC9S08DZ128 Series. Some interrupt sources from peripheral modules are discussed in greater detail
within other sections of this data sheet. This section gathers basic information about all reset and interrupt
sources in one place for easy reference. A few reset and interrupt sources, including the computer
operating properly (COP) watchdog, are not part of on-chip peripheral systems with their own chapters.
5.2
Features
Reset and interrupt features include:
•
•
•
Multiple sources of reset for flexible system configuration and reliable operation
Reset status register (SRS) to indicate source of most recent reset
Separate interrupt vector for each module (reduces polling overhead); see Table 5-1
5.3
MCU Reset
Resetting the MCU provides a way to start processing from a known set of initial conditions. During reset,
most control and status registers are forced to initial values and the program counter is loaded from the
reset vector (0xFFFE:0xFFFF). On-chip peripheral modules are disabled and I/O pins are initially
configured as general-purpose high-impedance inputs with pull-up devices disabled. The I bit in the
condition code register (CCR) is set to block maskable interrupts so the user program has a chance to
initialize the stack pointer (SP) and system control settings. (See the CPU chapter for information on the
Interrupt (I) bit.) SP is forced to 0x00FF at reset.
The MC9S08DZ128 Series has eight sources for reset:
•
•
•
•
•
•
•
•
Power-on reset (POR)
External pin reset (PIN)
Computer operating properly (COP) timer
Illegal opcode detect (ILOP)
Illegal address detect (ILAD)
Low-voltage detect (LVD)
Loss of clock (LOC)
Background debug forced reset (BDFR)
Each of these sources, with the exception of the background debug forced reset, has an associated bit in
the system reset status register (SRS). Whenever the MCU enters reset, the reset pin is driven low for 34
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
85
Chapter 5 Resets, Interrupts, and General System Control
bus cycles. After the 34 cycles are completed, the pin is released and will be pulled up by the internal
pull-up resistor, unless it is held low externally. After the pin is released, it is sampled after another 38
cycles to determine whether the reset pin is the cause of the MCU reset.
5.4
Computer Operating Properly (COP) Watchdog
The COP watchdog is intended to force a system reset when the application software fails to execute as
expected. To prevent a system reset from the COP timer (when it is enabled), application software must
reset the COP counter periodically. If the application program gets lost and fails to reset the COP counter
before it times out, a system reset is generated to force the system back to a known starting point.
After any reset, the COP watchdog is enabled (see Section 5.8.4, “System Options Register 1 (SOPT1),”
for additional information). If the COP watchdog is not used in an application, it can be disabled by
clearing COPT bits in SOPT1.
The COP counter is reset by writing 0x0055 and 0x00AA (in this order) to the address of SRS during the
selected timeout period. Writes do not affect the data in the read-only SRS. As soon as the write sequence
is done, the COP timeout period is restarted. If the program fails to do this during the time-out period, the
MCU will reset. Also, if any value other than 0x0055 or 0x00AA is written to SRS, the MCU is
immediately reset.
The COPCLKS bit in SOPT2 (see Section 5.8.5, “System Options Register 2 (SOPT2),” for additional
information) selects the clock source used for the COP timer. The clock source options are either the bus
clock or an internal 1-kHz clock source. With each clock source, there are three associated time-outs
controlled by the COPT bits in SOPT1. Table 5-6 summarizes the control functions of the COPCLKS and
COPT bits. The COP watchdog defaults to operation from the 1-kHz clock source and the longest time-out
10
(2 cycles).
When the bus clock source is selected, windowed COP operation is available by setting COPW in the
SOPT2 register. In this mode, writes to the SRS register to clear the COP timer must occur in the last 25%
of the selected timeout period. A premature write immediately resets the MCU. When the 1-kHz clock
source is selected, windowed COP operation is not available.
The COP counter is initialized by the first writes to the SOPT1 and SOPT2 registers and after any system
reset. Subsequent writes to SOPT1 and SOPT2 have no effect on COP operation. Even if the application
will use the reset default settings of COPT, COPCLKS, and COPW bits, the user should write to the
write-once SOPT1 and SOPT2 registers during reset initialization to lock in the settings. This will prevent
accidental changes if the application program gets lost.
The write to SRS that services (clears) the COP counter should not be placed in an interrupt service routine
(ISR) because the ISR could continue to be executed periodically even if the main application program
fails.
If the bus clock source is selected, the COP counter does not increment while the MCU is in background
debug mode or while the system is in stop mode. The COP counter resumes when the MCU exits
background debug mode or stop mode.
MC9S08DZ128 Series Data Sheet, Rev. 1
86
Freescale Semiconductor
Chapter 5 Resets, Interrupts, and General System Control
If the 1-kHz clock source is selected, the COP counter is re-initialized to zero upon entry to either
background debug mode or stop mode and begins from zero upon exit from background debug mode or
stop mode.
5.5
Interrupts
Interrupts provide a way to save the current CPU status and registers, execute an interrupt service routine
(ISR), and then restore the CPU status so processing resumes where it left off before the interrupt. Other
than the software interrupt (SWI), which is a program instruction, interrupts are caused by hardware events
such as an edge on the IRQ pin or a timer-overflow event. The debug module can also generate an SWI
under certain circumstances.
If an event occurs in an enabled interrupt source, an associated read-only status flag will become set. The
CPU will not respond unless the local interrupt enable is a 1 to enable the interrupt and the I bit in the CCR
is 0 to allow interrupts. The global interrupt mask (I bit) in the CCR is initially set after reset which
prevents all maskable interrupt sources. The user program initializes the stack pointer and performs other
system setup before clearing the I bit to allow the CPU to respond to interrupts.
When the CPU receives a qualified interrupt request, it completes the current instruction before responding
to the interrupt. The interrupt sequence obeys the same cycle-by-cycle sequence as the SWI instruction and
consists of:
•
•
•
•
Saving the CPU registers on the stack
Setting the I bit in the CCR to mask further interrupts
Fetching the interrupt vector for the highest-priority interrupt that is currently pending
Filling the instruction queue with the first three bytes of program information starting from the
address fetched from the interrupt vector locations
While the CPU is responding to the interrupt, the I bit is automatically set to avoid the possibility of another
interrupt interrupting the ISR itself (this is called nesting of interrupts). Normally, the I bit is restored to 0
when the CCR is restored from the value stacked on entry to the ISR. In rare cases, the I bit can be cleared
inside an ISR (after clearing the status flag that generated the interrupt) so that other interrupts can be
serviced without waiting for the first service routine to finish. This practice is not recommended for anyone
other than the most experienced programmers because it can lead to subtle program errors that are difficult
to debug.
The interrupt service routine ends with a return-from-interrupt (RTI) instruction which restores the CCR,
A, X, and PC registers to their pre-interrupt values by reading the previously saved information from the
stack.
NOTE
For compatibility with M68HC08 devices, the H register is not
automatically saved and restored. It is good programming practice to push
H onto the stack at the start of the interrupt service routine (ISR) and restore
it immediately before the RTI that is used to return from the ISR.
If more than one interrupt is pending when the I bit is cleared, the highest priority source is serviced first
(see Table 5-1).
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
87
Chapter 5 Resets, Interrupts, and General System Control
5.5.1
Interrupt Stack Frame
Figure 5-1 shows the contents and organization of a stack frame. Before the interrupt, the stack pointer
(SP) points at the next available byte location on the stack. The current values of CPU registers are stored
on the stack starting with the low-order byte of the program counter (PCL) and ending with the CCR. After
stacking, the SP points at the next available location on the stack which is the address that is one less than
the address where the CCR was saved. The PC value that is stacked is the address of the instruction in the
main program that would have executed next if the interrupt had not occurred.
UNSTACKING
ORDER
TOWARD LOWER ADDRESSES
7
0
SP AFTER
INTERRUPT STACKING
5
4
3
2
1
1
2
3
4
5
CONDITION CODE REGISTER
ACCUMULATOR
*
INDEX REGISTER (LOW BYTE X)
PROGRAM COUNTER HIGH
PROGRAM COUNTER LOW
SP BEFORE
THE INTERRUPT
STACKING
ORDER
TOWARD HIGHER ADDRESSES
* High byte (H) of index register is not automatically stacked.
Figure 5-1. Interrupt Stack Frame
When an RTI instruction is executed, these values are recovered from the stack in reverse order. As part of
the RTI sequence, the CPU fills the instruction pipeline by reading three bytes of program information,
starting from the PC address recovered from the stack.
The status flag corresponding to the interrupt source must be acknowledged (cleared) before returning
from the ISR. Typically, the flag is cleared at the beginning of the ISR so that if another interrupt is
generated by this same source, it will be registered so it can be serviced after completion of the current ISR.
5.5.2
External Interrupt Request (IRQ) Pin
External interrupts are managed by the IRQ status and control register, IRQSC. When the IRQ function is
enabled, synchronous logic monitors the pin for edge-only or edge-and-level events. When the MCU is in
stop mode and system clocks are shut down, a separate asynchronous path is used so the IRQ (if enabled)
can wake the MCU.
5.5.2.1
Pin Configuration Options
The IRQ pin enable (IRQPE) control bit in IRQSC must be 1 in order for the IRQ pin to act as the interrupt
request (IRQ) input. As an IRQ input, the user can choose the polarity of edges or levels detected
(IRQEDG), whether the pin detects edges-only or edges and levels (IRQMOD), and whether an event
causes an interrupt or only sets the IRQF flag which can be polled by software.
MC9S08DZ128 Series Data Sheet, Rev. 1
88
Freescale Semiconductor
Chapter 5 Resets, Interrupts, and General System Control
The IRQ pin, when enabled, defaults to use an internal pull device (IRQPDD = 0), the device is a pull-up
or pull-down depending on the polarity chosen. If the user desires to use an external pull-up or pull-down,
the IRQPDD can be written to a 1 to turn off the internal device.
BIH and BIL instructions may be used to detect the level on the IRQ pin when the pin is configured to act
as the IRQ input.
5.5.2.2
Edge and Level Sensitivity
The IRQMOD control bit reconfigures the detection logic so it detects edge events and pin levels. In the
edge and level detection mode, the IRQF status flag becomes set when an edge is detected (when the IRQ
pin changes from the deasserted to the asserted level), but the flag is continuously set (and cannot be
cleared) as long as the IRQ pin remains at the asserted level.
5.5.3
Interrupt Vectors, Sources, and Local Masks
Table 5-1 provides a summary of all interrupt sources. Higher-priority sources are located toward the
bottom of the table. The high-order byte of the address for the interrupt service routine is located at the
first address in the vector address column, and the low-order byte of the address for the interrupt service
routine is located at the next higher address.
When an interrupt condition occurs, an associated flag bit becomes set. If the associated local interrupt
enable is 1, an interrupt request is sent to the CPU. Within the CPU, if the global interrupt mask (I bit in
the CCR) is 0, the CPU will finish the current instruction; stack the PCL, PCH, X, A, and CCR CPU
registers; set the I bit; and then fetch the interrupt vector for the highest priority pending interrupt.
Processing then continues in the interrupt service routine.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
89
Chapter 5 Resets, Interrupts, and General System Control
1
Table 5-1. Vector Summary
Vector
Number
Address
(High/Low)
Vector
Name
Module
Source
Enable
Description
56-63 0xFF80/0xFF81 -
0xFF8E/0xFF8F
Reserved
55
54
53
0xFF90/0xFF91
0xFF92/0xFF93
0xFF94/0xFF95
Vportj
Viic1
Port J
IIC2
PTJIF
IICIS
PTJIE
IICIE
Port J Pins
IIC2 control
Vspi2
SPI2
SPIF, MODF,
SPTEF
SPIE, SPIE, SPTIE SPI2
52
51
50
49
48
N/A
31
30
29
28
27
26
25
24
23
22
0xFF96/0xFF97
0xFF98/0xFF99
Vtpm3ovf
Vtpm3ch3
TPM3
TPM3
TPM3
TPM3
TPM3
TOF
TOIE
CH3IE
CH2IE
CH1IE
CH0IE
TPM3 overflow
CH1F
CH0F
CH1F
CH0F
TPM3 channel 3
TPM3 channel 2
TPM3 channel 1
TPM3 channel 0
0xFF9A/0xFF9B Vtpm3ch2
0xFF9C/0xFF9D Vtpm3ch1
0xFF9E/0xFF9F
0xFFA0 - 0xFFBF
0xFFC0/0xFFC1
0xFFC2/0xFFC3
0xFFC4/0xFFC5
0xFFC6/0xFFC7
0xFFC8/0xFFC9
0xFFCA/0xFFCB
0xFFCC/0xFFCD
0xFFCE/0xFFCF
0xFFD0/0xFFD1
0xFFD2/0xFFD3
Vtpm3ch0
Non-vector space
Vacmp2
Vacmp1
Vcantx
Vcanrx
Vcanerr
Vcanwu
Vrtc
ACMP2
ACMP1
MSCAN
MSCAN
MSCAN
MSCAN
RTC
ACF
ACF
ACIE
ACIE
Analog comparator 2
Analog comparator 1
CAN transmit
CAN receive
TXE[2:0]
RXF
TXEIE[2:0]
RXFIE
CSCIF, OVRIF
WUPIF
RTIF
CSCIE, OVRIE
WUPIE
RTIE
CAN errors
CAN wake-up
Real-time interrupt
IIC1 control
Viic1
IIC1
IICIS
IICIE
Vadc
ADC
COCOF
AIEN
ADC
Vport
Port A,B,D
PTAIF, PTBIF, PTAIE, PTBIE, PTDIE Port A, B and D Pins
PTDIF
21
20
0xFFD4/0xFFD5
0xFFD6/0xFFD7
Vsci2tx
Vsci2rx
SCI2
SCI2
TDRE, TC
TIE, TCIE
SCI2 transmit
IDLE, LBKDIF,
RDRF, RXEDGIF
ILIE, LBKDIE, RIE, SCI2 receive
RXEDGIE
19
0xFFD8/0xFFD9
Vsci2err
SCI2
OR, NF
FE, PF
ORIE, NFIE,
FEIE, PFIE
SCI2 error
18
17
0xFFDA/0xFFDB
0xFFDC/0xFFDD
Vsci1tx
Vsci1rx
SCI1
SCI1
TDRE, TC
TIE, TCIE
SCI1 transmit
IDLE, LBKDIF,
RDRF, RXEDGIF
ILIE, LBKDIE, RIE, SCI1 receive
RXEDGIE
16
15
0xFFDE/0xFFDF
0xFFE0/0xFFE1
0xFFE2/0xFFE3
Vsci1err
Vspi1
SCI1
SPI1
OR, NF,
FE, PF
ORIE, NFIE,
FEIE, PFIE
SCI1 error
SPIF, MODF,
SPTEF
SPIE, SPIE, SPTIE SPI1
14
13
12
11
10
9
Vtpm2ovf
TPM2
TPM2
TPM2
TPM1
TPM1
TPM1
TPM1
TPM1
TOF
CH1F
CH0F
TOF
TOIE
CH1IE
CH0IE
TOIE
TPM2 overflow
0xFFE4/0xFFE5 Vtpm2ch1
0xFFE6/0xFFE7 Vtpm2ch0
TPM2 channel 1
TPM2 channel 0
TPM1 overflow
TPM1 channel 5
TPM1 channel 4
TPM1 channel 3
TPM1 channel 2
0xFFE8/0xFFE9
Vtpm1ovf
0xFFEA/0xFFEB Vtpm1ch5
0xFFEC/0xFFED Vtpm1ch4
0xFFEE/0xFFEF Vtpm1ch3
CH5F
CH4F
CH3F
CH2F
CH5IE
CH4IE
CH3IE
CH2IE
8
7
0xFFF0/0xFFF1
Vtpm1ch2
MC9S08DZ128 Series Data Sheet, Rev. 1
90
Freescale Semiconductor
Chapter 5 Resets, Interrupts, and General System Control
1
Table 5-1. Vector Summary
Vector
Number
Address
(High/Low)
Vector
Name
Module
Source
Enable
Description
6
5
4
3
0xFFF2/0xFFF3
0xFFF4/0xFFF5
0xFFF6/0xFFF7
0xFFF8/0xFFF9
Vtpm1ch1
Vtpm1ch0
Vlol
TPM1
TPM1
MCG
CH1F
CH0F
LOLS
LVWF
CH1IE
CH0IE
LOLIE
LVWIE
TPM1 channel 1
TPM1 channel 0
MCG loss of lock
Low-voltage warning
Vlvd
System
control
2
1
0
0xFFFA/0xFFFB
0xFFFC/0xFFFD
0xFFFE/0xFFFF
Virq
Vswi
IRQ
IRQF
IRQIE
—
IRQ pin
Core
SWI Instruction
Software interrupt
Vreset
System
control
COP,
LOC,
LVD,
RESET,
ILOP,
ILAD,
POR,
BDFR
COPT
CME
LVDRE
—
Watchdog timer
Loss-of-clock
Low-voltage detect
External pin
Illegal opcode
Illegal address
Power-on-reset
BDM-forced reset
—
—
—
—
1
Vector priority is shown from lowest (first row) to highest (last row). For example, Vreset is the highest priority vector.
5.6
Low-Voltage Detect (LVD) System
The MC9S08DZ128 Series includes a system to protect against low-voltage conditions in order to protect
memory contents and control MCU system states during supply voltage variations. The system is
comprised of a power-on reset (POR) circuit and a LVD circuit with trip voltages for warning and
detection. The LVD circuit is enabled when LVDE in SPMSC1 is set to 1. The LVD is disabled upon
entering any of the stop modes unless LVDSE is set in SPMSC1. If LVDSE and LVDE are both set, then
the MCU cannot enter stop2 (it will enter stop3 instead), and the current consumption in stop3 with the
LVD enabled will be higher.
5.6.1
Power-On Reset Operation
When power is initially applied to the MCU, or when the supply voltage drops below the power-on reset
rearm voltage level, V , the POR circuit will cause a reset condition. As the supply voltage rises, the
POR
LVD circuit will hold the MCU in reset until the supply has risen above the low-voltage detection low
threshold, V
. Both the POR bit and the LVD bit in SRS are set following a POR.
LVDL
5.6.2
Low-Voltage Detection (LVD) Reset Operation
The LVD can be configured to generate a reset upon detection of a low-voltage condition by setting
LVDRE to 1. The low-voltage detection threshold is determined by the LVDV bit. After an LVD reset has
occurred, the LVD system will hold the MCU in reset until the supply voltage has risen above the
low-voltage detection threshold. The LVD bit in the SRS register is set following either an LVD reset or
POR.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
91
Chapter 5 Resets, Interrupts, and General System Control
5.6.3
Low-Voltage Warning (LVW) Interrupt Operation
The LVD system has a low-voltage warning flag to indicate to the user that the supply voltage is
approaching the low-voltage condition. When a low-voltage warning condition is detected and is
configured for interrupt operation (LVWIE set to 1), LVWF in SPMSC1 will be set and an LVW interrupt
request will occur.
5.7
MCLK Output
The PTA0 pin is shared with the MCLK clock output. If the MCSEL bits are all zeroes, the MCLK clock
is disabled. Setting any of the MCSEL bits causes the PTA0 pin to output a divided version of the internal
MCU bus clock regardless of the state of the port data direction control bit for the pin. The divide ratio is
determined by the MCSEL bits. The slew rate and drive strength for the pin are controlled by PTASE0 and
PTADS0, respectively.
5.8
Reset, Interrupt, and System Control Registers and Control Bits
One 8-bit register in the direct page register space and eight 8-bit registers in the high-page register space
are related to reset and interrupt systems.
Refer to Table 4-2 and Table 4-3 in Chapter 4, “Memory,” of this data sheet for the absolute address
assignments for all registers. This section refers to registers and control bits only by their names. A
Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
Some control bits in the SOPT1 and SPMSC2 registers are related to modes of operation. Although brief
descriptions of these bits are provided here, the related functions are discussed in greater detail in
Chapter 3, “Modes of Operation.”
5.8.1
Interrupt Pin Request Status and Control Register (IRQSC)
This direct page register includes status and control bits which are used to configure the IRQ function,
report status, and acknowledge IRQ events.
7
6
5
4
3
2
1
0
R
W
0
IRQF
0
IRQPDD
IRQEDG
IRQPE
IRQIE
IRQMOD
IRQACK
0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-2. Interrupt Request Status and Control Register (IRQSC)
MC9S08DZ128 Series Data Sheet, Rev. 1
92
Freescale Semiconductor
Chapter 5 Resets, Interrupts, and General System Control
Table 5-2. IRQSC Register Field Descriptions
Field
Description
6
Interrupt Request (IRQ) Pull Device Disable— This read/write control bit is used to disable the internal
pull-up/pull-down device when the IRQ pin is enabled (IRQPE = 1) allowing for an external device to be used.
0 IRQ pull device enabled if IRQPE = 1.
IRQPDD
1 IRQ pull device disabled if IRQPE = 1.
5
Interrupt Request (IRQ) Edge Select — This read/write control bit is used to select the polarity of edges or
levels on the IRQ pin that cause IRQF to be set. The IRQMOD control bit determines whether the IRQ pin is
sensitive to both edges and levels or only edges. When the IRQ pin is enabled as the IRQ input and is configured
to detect rising edges, it has a pull-down. When the IRQ pin is enabled as the IRQ input and is configured to
detect falling edges, it has a pull-up.
IRQEDG
0 IRQ is falling edge or falling edge/low-level sensitive.
1 IRQ is rising edge or rising edge/high-level sensitive.
4
IRQ Pin Enable — This read/write control bit enables the IRQ pin function. When this bit is set the IRQ pin can
IRQPE
be used as an interrupt request.
0 IRQ pin function is disabled.
1 IRQ pin function is enabled.
3
IRQ Flag — This read-only status bit indicates when an interrupt request event has occurred.
IRQF
0 No IRQ request.
1 IRQ event detected.
2
IRQ Acknowledge — This write-only bit is used to acknowledge interrupt request events (write 1 to clear IRQF).
Writing 0 has no meaning or effect. Reads always return 0. If edge-and-level detection is selected (IRQMOD = 1),
IRQF cannot be cleared while the IRQ pin remains at its asserted level.
IRQACK
1
IRQ Interrupt Enable — This read/write control bit determines whether IRQ events generate an interrupt
request.
IRQIE
0 Interrupt request when IRQF set is disabled (use polling).
1 Interrupt requested whenever IRQF = 1.
0
IRQ Detection Mode — This read/write control bit selects either edge-only detection or edge-and-level
IRQMOD detection. The IRQEDG control bit determines the polarity of edges and levels that are detected as interrupt
request events. See Section 5.5.2.2, “Edge and Level Sensitivity” for more details.
0 IRQ event on falling edges or rising edges only.
1 IRQ event on falling edges and low levels or on rising edges and high levels.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
93
Chapter 5 Resets, Interrupts, and General System Control
5.8.2
System Reset Status Register (SRS)
This high page register includes read-only status flags to indicate the source of the most recent reset. When
a debug host forces reset by writing 1 to BDFR in the SBDFR register, none of the status bits in SRS will
be set. Writing any value to this register address causes a COP reset when the COP is enabled except the
values 0x55 and 0xAA. Writing a 0x55-0xAA sequence to this address clears the COP watchdog timer
without affecting the contents of this register. The reset state of these bits depends on what caused the
MCU to reset.
7
6
5
4
3
2
1
0
R
W
POR
PIN
COP
ILOP
ILAD
LOC
LVD
0
Writing 0x55, 0xAA to SRS address clears COP watchdog timer.
POR:
LVD:
1
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
Any other
reset:
0
Note(1)
Note(1)
Note(1)
Note(1)
0
0
0
1
Any of these reset sources that are active at the time of reset entry will cause the corresponding bit(s) to be set; bits
corresponding to sources that are not active at the time of reset entry will be cleared.
Figure 5-3. System Reset Status (SRS)
Table 5-3. SRS Register Field Descriptions
Field
Description
7
POR
Power-On Reset — Reset was caused by the power-on detection logic. Because the internal supply voltage was
ramping up at the time, the low-voltage reset (LVD) status bit is also set to indicate that the reset occurred while
the internal supply was below the LVD threshold.
0 Reset not caused by POR.
1 POR caused reset.
6
PIN
External Reset Pin — Reset was caused by an active-low level on the external reset pin.
0 Reset not caused by external reset pin.
1 Reset came from external reset pin.
5
COP
Computer Operating Properly (COP) Watchdog — Reset was caused by the COP watchdog timer timing out.
This reset source can be blocked by COPT bits = 0:0.
0 Reset not caused by COP timeout.
1 Reset caused by COP timeout.
4
Illegal Opcode — Reset was caused by an attempt to execute an unimplemented or illegal opcode. The STOP
instruction is considered illegal if stop is disabled by STOPE = 0 in the SOPT register. The BGND instruction is
considered illegal if active background mode is disabled by ENBDM = 0 in the BDCSC register.
0 Reset not caused by an illegal opcode.
ILOP
1 Reset caused by an illegal opcode.
3
Illegal Address — Reset was caused by an attempt to access either data or an instruction at an unimplemented
ILAD
memory address.
0 Reset not caused by an illegal address.
1 Reset caused by an illegal address.
MC9S08DZ128 Series Data Sheet, Rev. 1
94
Freescale Semiconductor
Chapter 5 Resets, Interrupts, and General System Control
Table 5-3. SRS Register Field Descriptions
Field
Description
2
LOC
Loss of Clock — Reset was caused by a loss of external clock.
0 Reset not caused by loss of external clock
1 Reset caused by loss of external clock
1
LVD
Low-Voltage Detect — If the LVDRE bit is set and the supply drops below the LVD trip voltage, an LVD reset will
occur. This bit is also set by POR.
0 Reset not caused by LVD trip or POR.
1 Reset caused by LVD trip or POR.
5.8.3
System Background Debug Force Reset Register (SBDFR)
This high page register contains a single write-only control bit. A serial background command such as
WRITE_BYTE must be used to write to SBDFR. Attempts to write this register from a user program are
ignored. Reads always return 0x00.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
BDFR1
0
Reset:
0
0
0
0
0
0
0
= Unimplemented or Reserved
1
BDFR is writable only through serial background debug commands, not from user programs.
Figure 5-4. System Background Debug Force Reset Register (SBDFR)
Table 5-4. SBDFR Register Field Descriptions
Description
Field
0
Background Debug Force Reset — A serial background command such as WRITE_BYTE can be used to allow
an external debug host to force a target system reset. Writing 1 to this bit forces an MCU reset. This bit cannot
be written from a user program.
BDFR
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
95
Chapter 5 Resets, Interrupts, and General System Control
5.8.4
System Options Register 1 (SOPT1)
This high page register is a write-once register so only the first write after reset is honored. It can be read
at any time. Any subsequent attempt to write to SOPT1 (intentionally or unintentionally) is ignored to
avoid accidental changes to these sensitive settings. This register should be written during the user’s reset
initialization program to set the desired controls even if the desired settings are the same as the reset
settings.
7
6
5
4
3
2
1
0
R
W
0
0
0
COPT
STOPE
SCI2PS
IIC1PS
Reset:
1
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-5. System Options Register 1 (SOPT1)
Table 5-5. SOPT1 Register Field Descriptions
Field
Description
7:6
COP Watchdog Timeout — These write-once bits select the timeout period of the COP. COPT along with
COPT[1:0] COPCLKS in SOPT2 defines the COP timeout period. See Table 5-6.
5
Stop Mode Enable — This write-once bit is used to enable stop mode. If stop mode is disabled and a user
program attempts to execute a STOP instruction, an illegal opcode reset is forced.
0 Stop mode disabled.
STOPE
1 Stop mode enabled.
4
SCI2 Pin Select— This write-once bit selects the location of the RxD2 and TxD2 pins of the SCI2 module.
0 TxD2 on PTF0, RxD2 on PTF1.
SCI2PS
1 TxD2 on PTE6, RxD2 on PTE7.
3
IIC1 Pin Select— This write-once bit selects the location of the SCL1 and SDA1 pins of the IIC1 module.
0 SCL1 on PTF2, SDA1 on PTF3.
IIC1PS
1 SCL1 on PTE4, SDA1 on PTE5.
Table 5-6. COP Configuration Options
COP Window1 Opens
Control Bits
Clock Source
COP Overflow Count
(COPW = 1)
COPCLKS
COPT[1:0]
N/A
0
0:0
0:1
N/A
1 kHz
1 kHz
1 kHz
Bus
N/A
N/A
COP is disabled
25 cycles (32 ms2)
28 cycles (256 ms1)
210 cycles (1.024 s1)
213 cycles
0
0
1
1
1
1:0
1:1
0:1
1:0
1:1
N/A
N/A
6144 cycles
49,152 cycles
196,608 cycles
216 cycles
Bus
218 cycles
Bus
1
2
Windowed COP operation requires the user to clear the COP timer in the last 25% of the selected timeout period. This column
displays the minimum number of clock counts required before the COP timer can be reset when in windowed COP mode
(COPW = 1).
Values shown in milliseconds based on tLPO = 1 ms. See tLPO in the appendix Section A.12.1, “Control Timing,” for the
tolerance of this value.
MC9S08DZ128 Series Data Sheet, Rev. 1
96
Freescale Semiconductor
Chapter 5 Resets, Interrupts, and General System Control
5.8.5
System Options Register 2 (SOPT2)
This high page register contains bits to configure MCU specific features on the MC9S08DZ128 Series
devices.
7
6
5
4
3
2
1
0
R
W
0
0
COPCLKS1
COPW1
ADHTS
MCSEL
Reset:
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-6. System Options Register 2 (SOPT2)
1
This bit can be written only one time after reset. Additional writes are ignored.
Table 5-7. SOPT2 Register Field Descriptions
Field
Description
COP Watchdog Clock Select — This write-once bit selects the clock source of the COP watchdog. See
7
COPCLKS Table 5-6 for details.
0 Internal 1-kHz clock is source to COP.
1 Bus clock is source to COP.
6
COP Window — This write-once bit selects the COP operation mode. When set, the 0x55-0xAA write sequence
to the SRS register must occur in the last 25% of the selected period. Any write to the SRS register during the
first 75% of the selected period will reset the MCU.
COPW
0 Normal COP operation.
1 Window COP operation (only if COPCLKS=1).
4
ADC Hardware Trigger Select — This bit selects which hardware trigger initiates conversion for the analog to
digital converter when the ADC hardware trigger is enabled (ADCTRG is set in ADCSC2 register).
0 Real Time Counter (RTC) overflow.
ADHTS
1 External Interrupt Request (IRQ) pin.
2:0
MCSEL
MCLK Divide Select— These bits enable the MCLK output on PTA0 pin and select the divide ratio for the MCLK
output according to the formula below when the MCSEL bits are not equal to all zeroes. In case that the MCSEL
bits are all zeroes, the MCLK output is disabled.
MCLK frequency = Bus Clock frequency ÷ (2 * MCSEL)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
97
Chapter 5 Resets, Interrupts, and General System Control
5.8.6
System Device Identification Register (SDIDH, SDIDL)
These high page read-only registers are included so host development systems can identify the HCS08
derivative and revision number. This allows the development software to recognize where specific memory
blocks, registers, and control bits are located in a target MCU.
7
6
5
4
3
2
1
0
R
W
Reserved
ID11
ID10
ID9
ID8
1
1
1
Reset:
01
0
0
0
0
0
0
0
= Unimplemented or Reserved
1
The revision number that is hard coded into these bits reflects the current silicon revision level.
Figure 5-7. System Device Identification Register — High (SDIDH)
Table 5-8. SDIDH Register Field Descriptions
Field
Description
3:0
Part Identification Number — MC9S08DZ128 Series MCUs are hard-coded to the value 0x0019. See also ID
ID[11:8]
bits in Table 5-9.
7
6
5
4
3
2
1
0
R
W
ID7
ID6
ID5
ID4
ID3
ID2
ID1
ID0
Reset:
0
0
0
1
1
0
0
1
= Unimplemented or Reserved
Figure 5-8. System Device Identification Register — Low (SDIDL)
Table 5-9. SDIDL Register Field Descriptions
Field
Description
7:0
Part Identification Number — MC9S08DZ128 Series MCUs are hard-coded to the value 0x0019. See also ID
ID[7:0]
bits in Table 5-8.
MC9S08DZ128 Series Data Sheet, Rev. 1
98
Freescale Semiconductor
Chapter 5 Resets, Interrupts, and General System Control
5.8.7
System Power Management Status and Control 1 Register
(SPMSC1)
This high page register contains status and control bits to support the low-voltage detect function, and to
enable the bandage voltage reference for use by the ADC and ACMP modules. This register should be
written during the user’s reset initialization program to set the desired controls even if the desired settings
are the same as the reset settings.
7
6
5
4
3
2
1
0
R
W
LVWF1
0
0
LVWIE
LVDRE2
LVDSE
LVDE2
BGBE
LVWACK
0
Reset:
0
0
1
1
1
0
0
= Unimplemented or Reserved
1
2
LVWF will be set in the case when VSupply transitions below the trip point or after reset and VSupply is already below VLVW
.
This bit can be written only one time after reset. Additional writes are ignored.
Figure 5-9. System Power Management Status and Control 1 Register (SPMSC1)
Table 5-10. SPMSC1 Register Field Descriptions
Field
Description
7
Low-Voltage Warning Flag — The LVWF bit indicates the low-voltage warning status.
0 low-voltage warning is not present.
LVWF
1 low-voltage warning is present or was present.
6
Low-Voltage Warning Acknowledge — If LVWF = 1, a low-voltage condition has occurred. To acknowledge this
low-voltage warning, write 1 to LVWACK, which will automatically clear LVWF to 0 if the low-voltage warning is
no longer present.
LVWACK
5
Low-Voltage Warning Interrupt Enable — This bit enables hardware interrupt requests for LVWF.
0 Hardware interrupt disabled (use polling).
LVWIE
1 Request a hardware interrupt when LVWF = 1.
4
Low-Voltage Detect Reset Enable — This write-once bit enables LVD events to generate a hardware reset
(provided LVDE = 1).
LVDRE
0 LVD events do not generate hardware resets.
1 Force an MCU reset when an enabled low-voltage detect event occurs.
3
Low-Voltage Detect Stop Enable — Provided LVDE = 1, this read/write bit determines whether the low-voltage
detect function operates when the MCU is in stop mode.
LVDSE
0 Low-voltage detect disabled during stop mode.
1 Low-voltage detect enabled during stop mode.
2
Low-Voltage Detect Enable — This write-once bit enables low-voltage detect logic and qualifies the operation
LVDE
of other bits in this register.
0 LVD logic disabled.
1 LVD logic enabled.
0
Bandgap Buffer Enable — This bit enables an internal buffer for the bandgap voltage reference for use by the
ADC and ACMP modules on one of its internal channels.
0 Bandgap buffer disabled.
BGBE
1 Bandgap buffer enabled.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
99
Chapter 5 Resets, Interrupts, and General System Control
5.8.8
System Power Management Status and Control 2 Register
(SPMSC2)
This register is used to report the status of the low-voltage warning function, and to configure the stop
mode behavior of the MCU. This register should be written during the user’s reset initialization program
to set the desired controls even if the desired settings are the same as the reset settings.
7
6
5
4
3
2
1
0
R
W
0
0
PPDF
0
0
LVDV1
LVWV
PPDC2
PPDACK
Power-on Reset:
LVD Reset:
0
0
0
0
0
0
0
u
u
0
u
u
0
0
0
0
0
0
0
0
0
0
0
0
Any other Reset:
= Unimplemented or Reserved
u = Unaffected by reset
1
2
This bit can be written only one time after power-on reset. Additional writes are ignored.
This bit can be written only one time after reset. Additional writes are ignored.
Figure 5-10. System Power Management Status and Control 2 Register (SPMSC2)
Table 5-11. SPMSC2 Register Field Descriptions
Field
Description
5
Low-Voltage Detect Voltage Select — This write-once bit selects the low-voltage detect (LVD) trip point setting.
LVDV
It also selects the warning voltage range. See Table 5-12.
4
Low-Voltage Warning Voltage Select — This bit selects the low-voltage warning (LVW) trip point voltage. See
LVWV
Table 5-12.
3
Partial Power Down Flag — This read-only status bit indicates that the MCU has recovered from stop2 mode.
0 MCU has not recovered from stop2 mode.
PPDF
1 MCU recovered from stop2 mode.
2
Partial Power Down Acknowledge — Writing a 1 to PPDACK clears the PPDF bit.
PPDACK
0
Partial Power Down Control — This write-once bit controls whether stop2 or stop3 mode is selected.
0 Stop3 mode enabled.
PPDC
1 Stop2, partial power down, mode enabled.
1
Table 5-12. LVD and LVW Trip Point Typical Values
LVDV:LVWV
LVW Trip Point
LVW0 = 2.74 V
LVD Trip Point
0:0
0:1
1:0
1:1
V
VLVD0 = 2.56 V
VLVW1 = 2.92 V
VLVW2 = 4.3 V
VLVW3 = 4.6 V
VLVD1 = 4.0 V
1
See Appendix A, “Electrical Characteristics” for minimum and maximum values.
MC9S08DZ128 Series Data Sheet, Rev. 1
100
Freescale Semiconductor
Chapter 6
Parallel Input/Output Control
This section explains software controls related to parallel input/output (I/O) and pin control. The
MC9S08DZ128 Series has up to 11 parallel I/O ports which include a total of up to 87 I/O pins and one
input-only pin. See Chapter 2, “Pins and Connections,” for more information about pin assignments and
external hardware considerations of these pins.
Many of these pins are shared with on-chip peripherals such as timer systems, communication systems, or
pin interrupts as shown in Table 2-1. The peripheral modules have priority over the general-purpose I/O
functions so that when a peripheral is enabled, the I/O functions associated with the shared pins are
disabled.
After reset, the shared peripheral functions are disabled and the pins are configured as inputs
(PTxDDn = 0). The pin control functions for each pin are configured as follows: slew rate control enabled
(PTxSEn = 1), low drive strength selected (PTxDSn = 0), and internal pull-ups disabled (PTxPEn = 0).
NOTE
Not all general-purpose I/O pins are available on all packages. To avoid
extra current drain from floating input pins, the user’s reset initialization
routine in the application program must either enable on-chip pull-up
devices or change the direction of unconnected pins to outputs so the pins
do not float.
6.1
Port Data and Data Direction
Reading and writing of parallel I/Os are performed through the port data registers. The direction, either
input or output, is controlled through the port data direction registers. The parallel I/O port function for an
individual pin is illustrated in the block diagram shown in Figure 6-1.
The data direction control bit (PTxDDn) determines whether the output buffer for the associated pin is
enabled, and also controls the source for port data register reads. The input buffer for the associated pin is
always enabled unless the pin is enabled as an analog function or is an output-only pin.
When a shared digital function is enabled for a pin, the output buffer is controlled by the shared function.
However, the data direction register bit will continue to control the source for reads of the port data register.
When a shared analog function is enabled for a pin, both the input and output buffers are disabled. A value
of 0 is read for any port data bit where the bit is an input (PTxDDn = 0) and the input buffer is disabled.
In general, whenever a pin is shared with both an alternate digital function and an analog function, the
analog function has priority such that if both the digital and analog functions are enabled, the analog
function controls the pin.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
101
Chapter 6 Parallel Input/Output Control
It is a good programming practice to write to the port data register before changing the direction of a port
pin to become an output. This ensures that the pin will not be driven momentarily with an old data value
that happened to be in the port data register.
PTxDDn
Output Enable
D
Q
PTxDn
Output Data
D
Q
1
0
Port Read
Data
Input Data
Synchronizer
BUSCLK
Figure 6-1. Parallel I/O Block Diagram
6.2
Pull-up, Slew Rate, and Drive Strength
Associated with the parallel I/O ports is a set of registers located in the high page register space that operate
independently of the parallel I/O registers. These registers are used to control pull-ups, slew rate, and drive
strength for the pins.
An internal pull-up device can be enabled for each port pin by setting the corresponding bit in the pull-up
enable register (PTxPEn). The pull-up device is disabled if the pin is configured as an output by the parallel
I/O control logic or any shared peripheral function regardless of the state of the corresponding pull-up
enable register bit. The pull-up device is also disabled if the pin is controlled by an analog function.
Slew rate control can be enabled for each port pin by setting the corresponding bit in the slew rate control
register (PTxSEn). When enabled, slew control limits the rate at which an output can transition in order to
reduce EMC emissions. Slew rate control has no effect on pins that are configured as inputs.
NOTE
Slew rate reset default values may differ between engineering samples and
final production parts. Always initialize slew rate control to the desired
value to ensure correct operation.
An output pin can be selected to have high output drive strength by setting the corresponding bit in the
drive strength select register (PTxDSn). When high drive is selected, a pin is capable of sourcing and
sinking greater current. Even though every I/O pin can be selected as high drive, the user must ensure that
the total current source and sink limits for the MCU are not exceeded. Drive strength selection is intended
to affect the DC behavior of I/O pins. However, the AC behavior is also affected. High drive allows a pin
MC9S08DZ128 Series Data Sheet, Rev. 1
102
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
to drive a greater load with the same switching speed as a low drive enabled pin into a smaller load.
Because of this, the EMC emissions may be affected by enabling pins as high drive.
6.3
Pin Interrupts
Port A, port B, port D, and port J pins can be configured as external interrupt inputs and as an external
means of waking the MCU from stop or wait low-power modes.
The block diagram for each port interrupt logic is shown Figure 6-2.
BUSCLK
PTxACK
RESET
V
1
0
DD
PTxIF
PTxn
CLR
S
PTxPS0
D
Q
SYNCHRONIZER
STOP BYPASS
CK
PTxES0
PTx
PORT
INTERRUPT FF
STOP
INTERRUPT
REQUEST
1
0
PTxn
PTxMOD
S
PTxPSn
PTxIE
PTxESn
Figure 6-2. Port Interrupt Block Diagram
Writing to the PTxPSn bits in the port interrupt pin select register (PTxPS) independently enables or
disables each port pin. Each port can be configured as edge sensitive or edge and level sensitive based on
the PTxMOD bit in the port interrupt status and control register (PTxSC). Edge sensitivity can be software
programmed to be either falling or rising; the level can be either low or high. The polarity of the edge or
edge and level sensitivity is selected using the PTxESn bits in the port interrupt edge select register
(PTxES).
Synchronous logic is used to detect edges. Prior to detecting an edge, enabled port inputs must be at the
deasserted logic level. A falling edge is detected when an enabled port input signal is seen as a logic 1 (the
deasserted level) during one bus cycle and then a logic 0 (the asserted level) during the next cycle. A rising
edge is detected when the input signal is seen as a logic 0 during one bus cycle and then a logic 1 during
the next cycle.
6.3.1
Edge Only Sensitivity
A valid rising or falling edge on an enabled port pin will set PTxIF in PTxSC. If PTxIE in PTxSC is set,
an interrupt request will be presented to the CPU. Clearing of PTxIF is accomplished by writing a 1 to
PTxACK in PTxSC.
6.3.2
Edge and Level Sensitivity
A valid edge or level on an enabled port pin will set PTxIF in PTxSC. If PTxIE in PTxSC is set, an interrupt
request will be presented to the CPU. Clearing of PTxIF is accomplished by writing a 1 to PTxACK in
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
103
Chapter 6 Parallel Input/Output Control
PTxSC provided all enabled port inputs are at their deasserted levels. PTxIF will remain set if any enabled
port pin is asserted while attempting to clear by writing a 1 to PTxACK.
6.3.3
Pull-up/Pull-down Resistors
The port interrupt pins can be configured to use an internal pull-up/pull-down resistor using the associated
I/O port pull-up enable register. If an internal resistor is enabled, the PTxES register is used to select
whether the resistor is a pull-up (PTxESn = 0) or a pull-down (PTxESn = 1).
6.3.4
Pin Interrupt Initialization
When an interrupt pin is first enabled, it is possible to get a false interrupt flag. To prevent a false interrupt
request during pin interrupt initialization, the user should do the following:
1. Mask interrupts by clearing PTxIE in PTxSC.
2. Select the pin polarity by setting the appropriate PTxESn bits in PTxES.
3. If using internal pull-up/pull-down device, configure the associated pull enable bits in PTxPE.
4. Enable the interrupt pins by setting the appropriate PTxPSn bits in PTxPS.
5. Write to PTxACK in PTxSC to clear any false interrupts.
6. Set PTxIE in PTxSC to enable interrupts.
6.4
Pin Behavior in Stop Modes
Pin behavior following execution of a STOP instruction depends on the stop mode that is entered. An
explanation of pin behavior for the various stop modes follows:
•
Stop2 mode is a partial power-down mode, whereby I/O latches are maintained in their state as
before the STOP instruction was executed. CPU register status and the state of I/O registers should
be saved in RAM before the STOP instruction is executed to place the MCU in stop2 mode. Upon
recovery from stop2 mode, before accessing any I/O, the user should examine the state of the PPDF
bit in the SPMSC2 register. If the PPDF bit is 0, I/O must be initialized as if a power on reset had
occurred. If the PPDF bit is 1, peripherals may require initialization to be restored to their pre-stop
condition. This can be done using data previously stored in RAM if it was saved before the STOP
instruction was executed. The user must then write a 1 to the PPDACK bit in the SPMSC2 register.
Access to I/O is now permitted again in the user application program.
•
In stop3 mode, all I/O is maintained because internal logic circuity stays powered up. Upon
recovery, normal I/O function is available to the user.
6.5
Parallel I/O and Pin Control Registers
This section provides information about the registers associated with the parallel I/O ports. The data and
data direction registers are located in page zero of the memory map. The pull up, slew rate, drive strength,
and interrupt control registers are located in the high page section of the memory map.
Refer to tables in Chapter 4, “Memory,” for the absolute address assignments for all parallel I/O and their
pin control registers. This section refers to registers and control bits only by their names. A Freescale
MC9S08DZ128 Series Data Sheet, Rev. 1
104
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
Semiconductor-provided equate or header file normally is used to translate these names into the
appropriate absolute addresses.
6.5.1
Port A Registers
Port A is controlled by the registers listed below.
6.5.1.1
Port A Data Register (PTAD)
7
6
5
4
3
2
1
0
R
W
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-3. Port A Data Register (PTAD)
Table 6-1. PTAD Register Field Descriptions
Description
Field
7:0
Port A Data Register Bits — For port A pins that are inputs, reads return the logic level on the pin. For port A
PTAD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port A pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTAD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pull-ups/pull-downs disabled.
6.5.1.2
Port A Data Direction Register (PTADD)
7
6
5
4
3
2
1
0
R
W
PTADD7
PTADD6
PTADD5
PTADD4
PTADD3
PTADD2
PTADD1
PTADD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-4. Port A Data Direction Register (PTADD)
Table 6-2. PTADD Register Field Descriptions
Field
Description
7:0
Data Direction for Port A Bits — These read/write bits control the direction of port A pins and what is read for
PTADD[7:0] PTAD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port A bit n and PTAD reads return the contents of PTADn.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
105
Chapter 6 Parallel Input/Output Control
6.5.1.3
Port A Pull Enable Register (PTAPE)
7
6
5
4
3
2
1
0
R
W
PTAPE7
PTAPE6
PTAPE5
PTAPE4
PTAPE3
PTAPE2
PTAPE1
PTAPE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-5. Internal Pull Enable for Port A Register (PTAPE)
Table 6-3. PTAPE Register Field Descriptions
Field
Description
7:0
Internal Pull Enable for Port A Bits — Each of these control bits determines if the internal pull-up or pull-down
PTAPE[7:0] device is enabled for the associated PTA pin. For port A pins that are configured as outputs, these bits have no
effect and the internal pull devices are disabled.
0 Internal pull-up/pull-down device disabled for port A bit n.
1 Internal pull-up/pull-down device enabled for port A bit n.
NOTE
Pull-down devices only apply when using pin interrupt functions, when
corresponding edge select and pin select functions are configured.
6.5.1.4
Port A Slew Rate Enable Register (PTASE)
7
6
5
4
3
2
1
0
R
W
PTASE7
PTASE6
PTASE5
PTASE4
PTASE3
PTASE2
PTASE1
PTASE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-6. Slew Rate Enable for Port A Register (PTASE)
Table 6-4. PTASE Register Field Descriptions
Field
Description
7:0
Output Slew Rate Enable for Port A Bits — Each of these control bits determines if the output slew rate control
PTASE[7:0] is enabled for the associated PTA pin. For port A pins that are configured as inputs, these bits have no effect.
0 Output slew rate control disabled for port A bit n.
1 Output slew rate control enabled for port A bit n.
Note: Slew rate reset default values may differ between engineering samples and final production parts. Always initialize slew
rate control to the desired value to ensure correct operation.
MC9S08DZ128 Series Data Sheet, Rev. 1
106
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.1.5
Port A Drive Strength Selection Register (PTADS)
7
6
5
4
3
2
1
0
R
W
PTADS7
PTADS6
PTADS5
PTADS4
PTADS3
PTADS2
PTADS1
PTADS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-7. Drive Strength Selection for Port A Register (PTADS)
Table 6-5. PTADS Register Field Descriptions
Field
Description
7:0
Output Drive Strength Selection for Port A Bits — Each of these control bits selects between low and high
PTADS[7:0] output drive for the associated PTA pin. For port A pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port A bit n.
1 High output drive strength selected for port A bit n.
6.5.1.6
Port A Interrupt Status and Control Register (PTASC)
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PTAIF
0
PTAIE
PTAMOD
PTAACK
0
Reset:
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 6-8. Port A Interrupt Status and Control Register (PTASC)
Table 6-6. PTASC Register Field Descriptions
Field
Description
3
Port A Interrupt Flag — PTAIF indicates when a port A interrupt is detected. Writes have no effect on PTAIF.
PTAIF
0 No port A interrupt detected.
1 Port A interrupt detected.
2
Port A Interrupt Acknowledge — Writing a 1 to PTAACK is part of the flag clearing mechanism. PTAACK
PTAACK
always reads as 0.
1
Port A Interrupt Enable — PTAIE determines whether a port A interrupt is requested.
0 Port A interrupt request not enabled.
PTAIE
1 Port A interrupt request enabled.
0
Port A Detection Mode — PTAMOD (along with the PTAES bits) controls the detection mode of the port A
PTAMOD interrupt pins.
0 Port A pins detect edges only.
1 Port A pins detect both edges and levels.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
107
Chapter 6 Parallel Input/Output Control
6.5.1.7
Port A Interrupt Pin Select Register (PTAPS)
7
6
5
4
3
2
1
0
R
W
PTAPS7
PTAPS6
PTAPS5
PTAPS4
PTAPS3
PTAPS2
PTAPS1
PTAPS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-9. Port A Interrupt Pin Select Register (PTAPS)
Table 6-7. PTAPS Register Field Descriptions
Field
Description
7:0
Port A Interrupt Pin Selects — Each of the PTAPSn bits enable the corresponding port A interrupt pin.
PTAPS[7:0] 0 Pin not enabled as interrupt.
1 Pin enabled as interrupt.
6.5.1.8
Port A Interrupt Edge Select Register (PTAES)
7
6
5
4
3
2
1
0
R
W
PTAES7
PTAES6
PTAES5
PTAES4
PTAES3
PTAES2
PTAES1
PTAES0
Reset:
0
0
0
0
0
0
0
0
Figure 6-10. Port A Edge Select Register (PTAES)
Table 6-8. PTAES Register Field Descriptions
Field
Description
7:0
Port A Edge Selects — Each of the PTAESn bits serves a dual purpose by selecting the polarity of the active
PTAES[7:0] interrupt edge as well as selecting a pull-up or pull-down device if enabled.
0 A pull-up device is connected to the associated pin and detects falling edge/low level for interrupt generation.
1 A pull-down device is connected to the associated pin and detects rising edge/high level for interrupt
generation.
MC9S08DZ128 Series Data Sheet, Rev. 1
108
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.2
Port B Registers
Port B is controlled by the registers listed below.
6.5.2.1
Port B Data Register (PTBD)
7
6
5
4
3
2
1
0
R
W
PTBD7
PTBD6
PTBD5
PTBD4
PTBD3
PTBD2
PTBD1
PTBD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-11. Port B Data Register (PTBD)
Table 6-9. PTBD Register Field Descriptions
Field
Description
7:0
Port B Data Register Bits — For port B pins that are inputs, reads return the logic level on the pin. For port B
PTBD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port B pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTBD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pull-ups/pull-downs disabled.
6.5.2.2
Port B Data Direction Register (PTBDD)
7
6
5
4
3
2
1
0
R
W
PTBDD7
PTBDD6
PTBDD5
PTBDD4
PTBDD3
PTBDD2
PTBDD1
PTBDD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-12. Port B Data Direction Register (PTBDD)
Table 6-10. PTBDD Register Field Descriptions
Field
Description
7:0
Data Direction for Port B Bits — These read/write bits control the direction of port B pins and what is read for
PTBDD[7:0] PTBD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port B bit n and PTBD reads return the contents of PTBDn.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
109
Chapter 6 Parallel Input/Output Control
6.5.2.3
Port B Pull Enable Register (PTBPE)
7
6
5
4
3
2
1
0
R
W
PTBPE7
PTBPE6
PTBPE5
PTBPE4
PTBPE3
PTBPE2
PTBPE1
PTBPE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-13. Internal Pull Enable for Port B Register (PTBPE)
Table 6-11. PTBPE Register Field Descriptions
Field
Description
7:0
Internal Pull Enable for Port B Bits — Each of these control bits determines if the internal pull-up or pull-down
PTBPE[7:0] device is enabled for the associated PTB pin. For port B pins that are configured as outputs, these bits have no
effect and the internal pull devices are disabled.
0 Internal pull-up/pull-down device disabled for port B bit n.
1 Internal pull-up/pull-down device enabled for port B bit n.
NOTE
Pull-down devices only apply when using pin interrupt functions, when
corresponding edge select and pin select functions are configured.
6.5.2.4
Port B Slew Rate Enable Register (PTBSE)
7
6
5
4
3
2
1
0
R
W
PTBSE7
PTBSE6
PTBSE5
PTBSE4
PTBSE3
PTBSE2
PTBSE1
PTBSE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-14. Slew Rate Enable for Port B Register (PTBSE)
Table 6-12. PTBSE Register Field Descriptions
Field
Description
7:0
Output Slew Rate Enable for Port B Bits — Each of these control bits determines if the output slew rate control
PTBSE[7:0] is enabled for the associated PTB pin. For port B pins that are configured as inputs, these bits have no effect.
0 Output slew rate control disabled for port B bit n.
1 Output slew rate control enabled for port B bit n.
Note: Slew rate reset default values may differ between engineering samples and final production parts. Always initialize slew
rate control to the desired value to ensure correct operation.
MC9S08DZ128 Series Data Sheet, Rev. 1
110
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.2.5
Port B Drive Strength Selection Register (PTBDS)
7
6
5
4
3
2
1
0
R
W
PTBDS7
PTBDS6
PTBDS5
PTBDS4
PTBDS3
PTBDS2
PTBDS1
PTBDS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-15. Drive Strength Selection for Port B Register (PTBDS)
Table 6-13. PTBDS Register Field Descriptions
Field
Description
7:0
Output Drive Strength Selection for Port B Bits — Each of these control bits selects between low and high
PTBDS[7:0] output drive for the associated PTB pin. For port B pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port B bit n.
1 High output drive strength selected for port B bit n.
6.5.2.6
Port B Interrupt Status and Control Register (PTBSC)
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PTBIF
0
PTBIE
PTBMOD
PTBACK
0
Reset:
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 6-16. Port B Interrupt Status and Control Register (PTBSC)
Table 6-14. PTBSC Register Field Descriptions
Field
Description
3
Port B Interrupt Flag — PTBIF indicates when a Port B interrupt is detected. Writes have no effect on PTBIF.
PTBIF
0 No Port B interrupt detected.
1 Port B interrupt detected.
2
Port B Interrupt Acknowledge — Writing a 1 to PTBACK is part of the flag clearing mechanism. PTBACK
PTBACK
always reads as 0.
1
Port B Interrupt Enable — PTBIE determines whether a port B interrupt is requested.
0 Port B interrupt request not enabled.
PTBIE
1 Port B interrupt request enabled.
0
Port B Detection Mode — PTBMOD (along with the PTBES bits) controls the detection mode of the port B
PTBMOD interrupt pins.
0 Port B pins detect edges only.
1 Port B pins detect both edges and levels.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
111
Chapter 6 Parallel Input/Output Control
6.5.2.7
Port B Interrupt Pin Select Register (PTBPS)
7
6
5
4
3
2
1
0
R
W
PTBPS7
PTBPS6
PTBPS5
PTBPS4
PTBPS3
PTBPS2
PTBPS1
PTBPS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-17. Port B Interrupt Pin Select Register (PTBPS)
Table 6-15. PTBPS Register Field Descriptions
Field
Description
7:0
Port B Interrupt Pin Selects — Each of the PTBPSn bits enable the corresponding port B interrupt pin.
PTBPS[7:0] 0 Pin not enabled as interrupt.
1 Pin enabled as interrupt.
6.5.2.8
Port B Interrupt Edge Select Register (PTBES)
7
6
5
4
3
2
1
0
R
W
PTBES7
PTBES6
PTBES5
PTBES4
PTBES3
PTBES2
PTBES1
PTBES0
Reset:
0
0
0
0
0
0
0
0
Figure 6-18. Port B Edge Select Register (PTBES)
Table 6-16. PTBES Register Field Descriptions
Field
Description
7:0
Port B Edge Selects — Each of the PTBESn bits serves a dual purpose by selecting the polarity of the active
PTBES[7:0] interrupt edge as well as selecting a pull-up or pull-down device if enabled.
0 A pull-up device is connected to the associated pin and detects falling edge/low level for interrupt generation.
1 A pull-down device is connected to the associated pin and detects rising edge/high level for interrupt
generation.
MC9S08DZ128 Series Data Sheet, Rev. 1
112
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.3
Port C Registers
Port C is controlled by the registers listed below.
6.5.3.1
Port C Data Register (PTCD)
7
6
5
4
3
2
1
0
R
W
PTCD7
PTCD6
PTCD5
PTCD4
PTCD3
PTCD2
PTCD1
PTCD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-19. Port C Data Register (PTCD)
Table 6-17. PTCD Register Field Descriptions
Field
Description
7:0
Port C Data Register Bits — For port C pins that are inputs, reads return the logic level on the pin. For port C
PTCD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port C pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTCD to all 0s, but these 0s are not driven out the corresponding pins because reset also
configures all port pins as high-impedance inputs with pull-ups disabled.
6.5.3.2
Port C Data Direction Register (PTCDD)
7
6
5
4
3
2
1
0
R
W
PTCDD7
PTCDD6
PTCDD5
PTCDD4
PTCDD3
PTCDD2
PTCDD1
PTCDD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-20. Port C Data Direction Register (PTCDD)
Table 6-18. PTCDD Register Field Descriptions
Field
Description
7:0
Data Direction for Port C Bits — These read/write bits control the direction of port C pins and what is read for
PTCDD[7:0] PTCD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port C bit n and PTCD reads return the contents of PTCDn.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
113
Chapter 6 Parallel Input/Output Control
6.5.3.3
Port C Pull Enable Register (PTCPE)
7
6
5
4
3
2
1
0
R
W
PTCPE7
PTCPE6
PTCPE5
PTCPE4
PTCPE3
PTCPE2
PTCPE1
PTCPE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-21. Internal Pull Enable for Port C Register (PTCPE)
Table 6-19. PTCPE Register Field Descriptions
Field
Description
7:0
Internal Pull Enable for Port C Bits — Each of these control bits determines if the internal pull-up device is
PTCPE[7:0] enabled for the associated PTC pin. For port C pins that are configured as outputs, these bits have no effect and
the internal pull devices are disabled.
0 Internal pull-up device disabled for port C bit n.
1 Internal pull-up device enabled for port C bit n.
NOTE
Pull-down devices only apply when using pin interrupt functions, when
corresponding edge select and pin select functions are configured.
6.5.3.4
Port C Slew Rate Enable Register (PTCSE)
7
6
5
4
3
2
1
0
R
W
PTCSE7
PTCSE6
PTCSE5
PTCSE4
PTCSE3
PTCSE2
PTCSE1
PTCSE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-22. Slew Rate Enable for Port C Register (PTCSE)
Table 6-20. PTCSE Register Field Descriptions
Field
Description
7:0
Output Slew Rate Enable for Port C Bits — Each of these control bits determines if the output slew rate control
PTCSE[7:0] is enabled for the associated PTC pin. For port C pins that are configured as inputs, these bits have no effect.
0 Output slew rate control disabled for port C bit n.
1 Output slew rate control enabled for port C bit n.
Note: Slew rate reset default values may differ between engineering samples and final production parts. Always initialize slew
rate control to the desired value to ensure correct operation.
MC9S08DZ128 Series Data Sheet, Rev. 1
114
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.3.5
Port C Drive Strength Selection Register (PTCDS)
7
6
5
4
3
2
1
0
R
W
PTCDS7
PTCDS6
PTCDS5
PTCDS4
PTCDS3
PTCDS2
PTCDS1
PTCDS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-23. Drive Strength Selection for Port C Register (PTCDS)
Table 6-21. PTCDS Register Field Descriptions
Field
Description
7:0
Output Drive Strength Selection for Port C Bits — Each of these control bits selects between low and high
PTCDS[7:0] output drive for the associated PTC pin. For port C pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port C bit n.
1 High output drive strength selected for port C bit n.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
115
Chapter 6 Parallel Input/Output Control
6.5.4
Port D Registers
Port D is controlled by the registers listed below.
6.5.4.1
Port D Data Register (PTDD)
7
6
5
4
3
2
1
0
R
W
PTDD7
PTDD6
PTDD5
PTDD4
PTDD3
PTDD2
PTDD1
PTDD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-24. Port D Data Register (PTDD)
Table 6-22. PTDD Register Field Descriptions
Field
Description
7:0
Port D Data Register Bits — For port D pins that are inputs, reads return the logic level on the pin. For port D
PTDD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port D pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTDD to all 0s, but these 0s are not driven out the corresponding pins because reset also
configures all port pins as high-impedance inputs with pull-ups/pull-downs disabled.
6.5.4.2
Port D Data Direction Register (PTDDD)
7
6
5
4
3
2
1
0
R
W
PTDDD7
PTDDD6
PTDDD5
PTDDD4
PTDDD3
PTDDD2
PTDDD1
PTDDD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-25. Port D Data Direction Register (PTDDD)
Table 6-23. PTDDD Register Field Descriptions
Field
Description
7:0
Data Direction for Port D Bits — These read/write bits control the direction of port D pins and what is read for
PTDDD[7:0] PTDD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port D bit n and PTDD reads return the contents of PTDDn.
MC9S08DZ128 Series Data Sheet, Rev. 1
116
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.4.3
Port D Pull Enable Register (PTDPE)
7
6
5
4
3
2
1
0
R
W
PTDPE7
PTDPE6
PTDPE5
PTDPE4
PTDPE3
PTDPE2
PTDPE1
PTDPE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-26. Internal Pull Enable for Port D Register (PTDPE)
Table 6-24. PTDPE Register Field Descriptions
Field
Description
7:0
Internal Pull Enable for Port D Bits — Each of these control bits determines if the internal pull-up or pull-down
PTDPE[7:0] device is enabled for the associated PTD pin. For port D pins that are configured as outputs, these bits have no
effect and the internal pull devices are disabled.
0 Internal pull-up/pull-down device disabled for port D bit n.
1 Internal pull-up/pull-down device enabled for port D bit n.
NOTE
Pull-down devices only apply when using pin interrupt functions, when
corresponding edge select and pin select functions are configured.
6.5.4.4
Port D Slew Rate Enable Register (PTDSE)
7
6
5
4
3
2
1
0
R
W
PTDSE7
PTDSE6
PTDSE5
PTDSE4
PTDSE3
PTDSE2
PTDSE1
PTDSE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-27. Slew Rate Enable for Port D Register (PTDSE)
Table 6-25. PTDSE Register Field Descriptions
Field
Description
7:0
Output Slew Rate Enable for Port D Bits — Each of these control bits determines if the output slew rate control
PTDSE[7:0] is enabled for the associated PTD pin. For port D pins that are configured as inputs, these bits have no effect.
0 Output slew rate control disabled for port D bit n.
1 Output slew rate control enabled for port D bit n.
Note: Slew rate reset default values may differ between engineering samples and final production parts. Always initialize slew
rate control to the desired value to ensure correct operation.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
117
Chapter 6 Parallel Input/Output Control
6.5.4.5
Port D Drive Strength Selection Register (PTDDS)
7
6
5
4
3
2
1
0
R
W
PTDDS7
PTDDS6
PTDDS5
PTDDS4
PTDDS3
PTDDS2
PTDDS1
PTDDS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-28. Drive Strength Selection for Port D Register (PTDDS)
Table 6-26. PTDDS Register Field Descriptions
Field
Description
7:0
Output Drive Strength Selection for Port D Bits — Each of these control bits selects between low and high
PTDDS[7:0] output drive for the associated PTD pin. For port D pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port D bit n.
1 High output drive strength selected for port D bit n.
6.5.4.6
Port D Interrupt Status and Control Register (PTDSC)
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PTDIF
0
PTDIE
PTDMOD
PTDACK
0
Reset:
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 6-29. Port D Interrupt Status and Control Register (PTDSC)
Table 6-27. PTDSC Register Field Descriptions
Field
Description
3
Port D Interrupt Flag — PTDIF indicates when a port D interrupt is detected. Writes have no effect on PTDIF.
PTDIF
0 No port D interrupt detected.
1 Port D interrupt detected.
2
Port D Interrupt Acknowledge — Writing a 1 to PTDACK is part of the flag clearing mechanism. PTDACK
PTDACK
always reads as 0.
1
Port D Interrupt Enable — PTDIE determines whether a port D interrupt is requested.
0 Port D interrupt request not enabled.
PTDIE
1 Port D interrupt request enabled.
0
Port D Detection Mode — PTDMOD (along with the PTDES bits) controls the detection mode of the port D
PTDMOD interrupt pins.
0 Port D pins detect edges only.
1 Port D pins detect both edges and levels.
MC9S08DZ128 Series Data Sheet, Rev. 1
118
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.4.7
Port D Interrupt Pin Select Register (PTDPS)
7
6
5
4
3
2
1
0
R
W
PTDPS7
PTDPS6
PTDPS5
PTDPS4
PTDPS3
PTDPS2
PTDPS1
PTDPS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-30. Port D Interrupt Pin Select Register (PTDPS)
Table 6-28. PTDPS Register Field Descriptions
Field
Description
7:0
Port D Interrupt Pin Selects — Each of the PTDPSn bits enable the corresponding port D interrupt pin.
PTDPS[7:0] 0 Pin not enabled as interrupt.
1 Pin enabled as interrupt.
6.5.4.8
Port D Interrupt Edge Select Register (PTDES)
7
6
5
4
3
2
1
0
R
W
PTDES7
PTDES6
PTDES5
PTDES4
PTDES3
PTDES2
PTDES1
PTDES0
Reset:
0
0
0
0
0
0
0
0
Figure 6-31. Port D Edge Select Register (PTDES)
Table 6-29. PTDES Register Field Descriptions
Field
Description
7:0
Port D Edge Selects — Each of the PTDESn bits serves a dual purpose by selecting the polarity of the active
PTDES[7:0] interrupt edge as well as selecting a pull-up or pull-down device if enabled.
0 A pull-up device is connected to the associated pin and detects falling edge/low level for interrupt generation.
1 A pull-down device is connected to the associated pin and detects rising edge/high level for interrupt
generation.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
119
Chapter 6 Parallel Input/Output Control
6.5.5
Port E Registers
Port E is controlled by the registers listed below.
6.5.5.1
Port E Data Register (PTED)
7
6
5
4
3
2
1
0
R
W
PTED7
PTED6
PTED5
PTED4
PTED3
PTED2
PTED11
PTED0
Reset:
0
0
0
0
0
0
0
0
Figure 6-32. Port E Data Register (PTED)
1
Reads of this bit always return the pin value of the associated pin, regardless of the value stored in the port data direction bit.
Table 6-30. PTED Register Field Descriptions
Field
Description
7:0
Port E Data Register Bits — For port E pins that are inputs, reads return the logic level on the pin. For port E
PTED[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port E pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTED to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pull-ups disabled.
6.5.5.2
Port E Data Direction Register (PTEDD)
7
6
5
4
3
2
1
0
R
W
PTEDD7
PTEDD6
PTEDD5
PTEDD4
PTEDD3
PTEDD2
PTEDD11
PTEDD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-33. Port E Data Direction Register (PTEDD)
1
PTEDD1 has no effect on the input-only PTE1 pin.
Table 6-31. PTEDD Register Field Descriptions
Field
Description
Data Direction for Port E Bits — These read/write bits control the direction of port E pins and what is read for
7:0
PTEDD[7:0] PTED reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port E bit n and PTED reads return the contents of PTEDn.
MC9S08DZ128 Series Data Sheet, Rev. 1
120
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.5.3
Port E Pull Enable Register (PTEPE)
7
6
5
4
3
2
1
0
R
W
PTEPE7
PTEPE6
PTEPE5
PTEPE4
PTEPE3
PTEPE2
PTEPE1
PTEPE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-34. Internal Pull Enable for Port E Register (PTEPE)
Table 6-32. PTEPE Register Field Descriptions
Field
Description
7:0
Internal Pull Enable for Port E Bits — Each of these control bits determines if the internal pull-up device is
PTEPE[7:0] enabled for the associated PTE pin. For port E pins that are configured as outputs, these bits have no effect and
the internal pull devices are disabled.
0 Internal pull-up device disabled for port E bit n.
1 Internal pull-up device enabled for port E bit n.
NOTE
Pull-down devices only apply when using pin interrupt functions, when
corresponding edge select and pin select functions are configured.
6.5.5.4
Port E Slew Rate Enable Register (PTESE)
7
6
5
4
3
2
1
0
R
W
PTESE7
PTESE6
PTESE5
PTESE4
PTESE3
PTESE2
PTESE11
PTESE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-35. Slew Rate Enable for Port E Register (PTESE)
1
PTESE1 has no effect on the input-only PTE1 pin.
Table 6-33. PTESE Register Field Descriptions
Field
Description
Output Slew Rate Enable for Port E Bits — Each of these control bits determines if the output slew rate control
7:0
PTESE[7:0] is enabled for the associated PTE pin. For port E pins that are configured as inputs, these bits have no effect.
0 Output slew rate control disabled for port E bit n.
1 Output slew rate control enabled for port E bit n.
Note: Slew rate reset default values may differ between engineering samples and final production parts. Always initialize slew
rate control to the desired value to ensure correct operation.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
121
Chapter 6 Parallel Input/Output Control
6.5.5.5
Port E Drive Strength Selection Register (PTEDS)
7
6
5
4
3
2
1
0
R
W
PTEDS7
PTEDS6
PTEDS5
PTEDS4
PTEDS3
PTEDS2
PTEDS11
PTEDS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-36. Drive Strength Selection for Port E Register (PTEDS)
1
PTEDS1 has no effect on the input-only PTE1 pin.
Table 6-34. PTEDS Register Field Descriptions
Field
Description
Output Drive Strength Selection for Port E Bits — Each of these control bits selects between low and high
7:0
PTEDS[7:0] output drive for the associated PTE pin. For port E pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port E bit n.
1 High output drive strength selected for port E bit n.
MC9S08DZ128 Series Data Sheet, Rev. 1
122
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.6
Port F Registers
Port F is controlled by the registers listed below.
6.5.6.1
Port F Data Register (PTFD)
7
6
5
4
3
2
1
0
R
W
PTFD7
PTFD6
PTFD5
PTFD4
PTFD3
PTFD2
PTFD1
PTFD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-37. Port F Data Register (PTFD)
Table 6-35. PTFD Register Field Descriptions
Description
Field
7:0
Port F Data Register Bits — For port F pins that are inputs, reads return the logic level on the pin. For port F
PTFD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port F pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTFD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pull-ups disabled.
6.5.6.2
Port F Data Direction Register (PTFDD)
7
6
5
4
3
2
1
0
R
W
PTFDD7
PTFDD6
PTFDD5
PTFDD4
PTFDD3
PTFDD2
PTFDD1
PTFDD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-38. Port F Data Direction Register (PTFDD)
Table 6-36. PTFDD Register Field Descriptions
Field
Description
7:0
Data Direction for Port F Bits — These read/write bits control the direction of port F pins and what is read for
PTFDD[7:0] PTFD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port F bit n and PTFD reads return the contents of PTFDn.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
123
Chapter 6 Parallel Input/Output Control
6.5.6.3
Port F Pull Enable Register (PTFPE)
7
6
5
4
3
2
1
0
R
W
PTFPE7
PTFPE6
PTFPE5
PTFPE4
PTFPE3
PTFPE2
PTFPE1
PTFPE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-39. Internal Pull Enable for Port F Register (PTFPE)
Table 6-37. PTFPE Register Field Descriptions
Field
Description
7:0
Internal Pull Enable for Port F Bits — Each of these control bits determines if the internal pull-up device is
PTFPE[7:0] enabled for the associated PTF pin. For port F pins that are configured as outputs, these bits have no effect and
the internal pull devices are disabled.
0 Internal pull-up device disabled for port F bit n.
1 Internal pull-up device enabled for port F bit n.
NOTE
Pull-down devices only apply when using pin interrupt functions, when
corresponding edge select and pin select functions are configured.
6.5.6.4
Port F Slew Rate Enable Register (PTFSE)
7
6
5
4
3
2
1
0
R
W
PTFSE7
PTFSE6
PTFSE5
PTFSE4
PTFSE3
PTFSE2
PTFSE1
PTFSE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-40. Slew Rate Enable for Port F Register (PTFSE)
Table 6-38. PTFSE Register Field Descriptions
Field
Description
7:0
Output Slew Rate Enable for Port F Bits — Each of these control bits determines if the output slew rate control
PTFSE[7:0] is enabled for the associated PTF pin. For port F pins that are configured as inputs, these bits have no effect.
0 Output slew rate control disabled for port F bit n.
1 Output slew rate control enabled for port F bit n.
Note: Slew rate reset default values may differ between engineering samples and final production parts. Always initialize slew
rate control to the desired value to ensure correct operation.
MC9S08DZ128 Series Data Sheet, Rev. 1
124
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.6.5
Port F Drive Strength Selection Register (PTFDS)
7
6
5
4
3
2
1
0
R
W
PTFDS7
PTFDS6
PTFDS5
PTFDS4
PTFDS3
PTFDS2
PTFDS1
PTFDS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-41. Drive Strength Selection for Port F Register (PTFDS)
Table 6-39. PTFDS Register Field Descriptions
Field
Description
7:0
Output Drive Strength Selection for Port F Bits — Each of these control bits selects between low and high
PTFDS[7:0] output drive for the associated PTF pin. For port F pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port F bit n.
1 High output drive strength selected for port F bit n.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
125
Chapter 6 Parallel Input/Output Control
6.5.7
Port G Registers
Port G is controlled by the registers listed below.
6.5.7.1
Port G Data Register (PTGD)
7
6
5
4
3
2
1
0
R
W
PTGD7
PTGD6
PTGD5
PTGD4
PTGD3
PTGD2
PTGD1
PTGD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-42. Port G Data Register (PTGD)
Table 6-40. PTGD Register Field Descriptions
Field
Description
7:0
Port G Data Register Bits — For port G pins that are inputs, reads return the logic level on the pin. For port G
PTGD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port G pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTGD to all 0s, but these 0s are not driven out the corresponding pins because reset also
configures all port pins as high-impedance inputs with pull-ups disabled.
6.5.7.2
Port G Data Direction Register (PTGDD)
7
6
5
4
3
2
1
0
R
W
PTGDD7
PTGDD6
PTGDD5
PTGDD4
PTGDD3
PTGDD2
PTGDD1
PTGDD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-43. Port G Data Direction Register (PTGDD)
Table 6-41. PTGDD Register Field Descriptions
Field
Description
7:0
Data Direction for Port G Bits — These read/write bits control the direction of port G pins and what is read for
PTGDD[7:0] PTGD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port G bit n and PTGD reads return the contents of PTGDn.
MC9S08DZ128 Series Data Sheet, Rev. 1
126
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.7.3
Port G Pull Enable Register (PTGPE)
7
6
5
4
3
2
1
0
R
W
PTGPE7
PTGPE6
PTGPE5
PTGPE4
PTGPE3
PTGPE2
PTGPE1
PTGPE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-44. Internal Pull Enable for Port G Register (PTGPE)
Table 6-42. PTGPE Register Field Descriptions
Field
Description
7:0
Internal Pull Enable for Port G Bits — Each of these control bits determines if the internal pull-up device is
PTGPE[7:0] enabled for the associated PTG pin. For port G pins that are configured as outputs, these bits have no effect and
the internal pull devices are disabled.
0 Internal pull-up device disabled for port G bit n.
1 Internal pull-up device enabled for port G bit n.
NOTE
Pull-down devices only apply when using pin interrupt functions, when
corresponding edge select and pin select functions are configured.
6.5.7.4
Port G Slew Rate Enable Register (PTGSE)
7
6
5
4
3
2
1
0
R
W
PTGSE7
PTGSE6
PTGSE5
PTGSE4
PTGSE3
PTGSE2
PTGSE1
PTGSE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-45. Slew Rate Enable for Port G Register (PTGSE)
Table 6-43. PTGSE Register Field Descriptions
Field
Description
7:0
Output Slew Rate Enable for Port G Bits — Each of these control bits determines if the output slew rate control
PTGSE[7:0] is enabled for the associated PTG pin. For port G pins that are configured as inputs, these bits have no effect.
0 Output slew rate control disabled for port G bit n.
1 Output slew rate control enabled for port G bit n.
Note: Slew rate reset default values may differ between engineering samples and final production parts. Always initialize slew
rate control to the desired value to ensure correct operation.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
127
Chapter 6 Parallel Input/Output Control
6.5.7.5
Port G Drive Strength Selection Register (PTGDS)
7
6
5
4
3
2
1
0
R
W
PTGDS7
PTGDS6
PTGDS5
PTGDS4
PTGDS3
PTGDS2
PTGDS1
PTGDS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-46. Drive Strength Selection for Port G Register (PTGDS)
Table 6-44. PTGDS Register Field Descriptions
Field
Description
7:0
Output Drive Strength Selection for Port G Bits — Each of these control bits selects between low and high
PTGDS[7:0] output drive for the associated PTG pin. For port G pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port G bit n.
1 High output drive strength selected for port G bit n.
MC9S08DZ128 Series Data Sheet, Rev. 1
128
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.8
Port H Registers
Port H is controlled by the registers listed below.
6.5.8.1
Port H Data Register (PTHD)
7
6
5
4
3
2
1
0
R
W
PTHD7
PTHD6
PTHD5
PTHD4
PTHD3
PTHD2
PTHD1
PTHD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-47. Port H Data Register (PTHD)
Table 6-45. PTHD Register Field Descriptions
Field
Description
7:0
Port H Data Register Bits — For port H pins that are inputs, reads return the logic level on the pin. For port H
PTHD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port H pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTHD to all 0s, but these 0s are not driven out the corresponding pins because reset also
configures all port pins as high-impedance inputs with pull-ups disabled.
6.5.8.2
Port H Data Direction Register (PTHDD)
7
6
5
4
3
2
1
0
R
W
PTHDD7
PTHDD6
PTHDD5
PTHDD4
PTHDD3
PTHDD2
PTHDD1
PTHDD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-48. Port H Data Direction Register (PTHDD)
Table 6-46. PTHDD Register Field Descriptions
Field
Description
7:0
Data Direction for Port H Bits — These read/write bits control the direction of port H pins and what is read for
PTHDD[7:0] PTHD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port H bit n and PTHD reads return the contents of PTHDn.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
129
Chapter 6 Parallel Input/Output Control
6.5.8.3
Port H Pull Enable Register (PTHPE)
7
6
5
4
3
2
1
0
R
W
PTHPE7
PTHPE6
PTHPE5
PTHPE4
PTHPE3
PTHPE2
PTHPE1
PTHPE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-49. Internal Pull Enable for Port H Register (PTHPE)
Table 6-47. PTHPE Register Field Descriptions
Field
Description
7:0
Internal Pull Enable for Port H Bits — Each of these control bits determines if the internal pull-up device is
PTHPE[7:0] enabled for the associated PTH pin. For port H pins that are configured as outputs, these bits have no effect and
the internal pull devices are disabled.
0 Internal pull-up device disabled for port H bit n.
1 Internal pull-up device enabled for port H bit n.
NOTE
Pull-down devices only apply when using pin interrupt functions, when
corresponding edge select and pin select functions are configured.
6.5.8.4
Port H Slew Rate Enable Register (PTHSE)
7
6
5
4
3
2
1
0
R
W
PTHSE7
PTHSE6
PTHSE5
PTHSE4
PTHSE3
PTHSE2
PTHSE1
PTHSE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-50. Slew Rate Enable for Port H Register (PTHSE)
Table 6-48. PTHSE Register Field Descriptions
Field
Description
7:0
Output Slew Rate Enable for Port H Bits — Each of these control bits determines if the output slew rate control
PTHSE[7:0] is enabled for the associated PTH pin. For port H pins that are configured as inputs, these bits have no effect.
0 Output slew rate control disabled for port H bit n.
1 Output slew rate control enabled for port H bit n.
Note: Slew rate reset default values may differ between engineering samples and final production parts. Always initialize slew
rate control to the desired value to ensure correct operation.
MC9S08DZ128 Series Data Sheet, Rev. 1
130
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.8.5
Port H Drive Strength Selection Register (PTHDS)
7
6
5
4
3
2
1
0
R
W
PTHDS7
PTHDS6
PTHDS5
PTHDS4
PTHDS3
PTHDS2
PTHDS1
PTHDS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-51. Drive Strength Selection for Port H Register (PTHDS)
Table 6-49. PTHDS Register Field Descriptions
Field
Description
7:0
Output Drive Strength Selection for Port H Bits — Each of these control bits selects between low and high
PTHDS[7:0] output drive for the associated PTH pin. For port H pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port H bit n.
1 High output drive strength selected for port H bit n.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
131
Chapter 6 Parallel Input/Output Control
6.5.9
Port J Registers
Port J is controlled by the registers listed below.
6.5.9.1
Port J Data Register (PTJD)
7
6
5
4
3
2
1
0
R
W
PTJD7
PTJD6
PTJD5
PTJD4
PTJD3
PTJD2
PTJD1
PTJD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-52. Port J Data Register (PTJD)
Table 6-50. PTJD Register Field Descriptions
Description
Field
7:0
Port J Data Register Bits — For port J pins that are inputs, reads return the logic level on the pin. For port J
PTJD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port J pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTJD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pull-ups disabled.
6.5.9.2
Port J Data Direction Register (PTJDD)
7
6
5
4
3
2
1
0
R
W
PTJDD7
PTJDD6
PTJDD5
PTJDD4
PTJDD3
PTJDD2
PTJDD1
PTJDD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-53. Port J Data Direction Register (PTJDD)
Table 6-51. PTJDD Register Field Descriptions
Field
Description
7:0
Data Direction for Port J Bits — These read/write bits control the direction of port J pins and what is read for
PTJDD[7:0] PTJD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port J bit n and PTJD reads return the contents of PTJDn.
MC9S08DZ128 Series Data Sheet, Rev. 1
132
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.9.3
Port J Pull Enable Register (PTJPE)
7
6
5
4
3
2
1
0
R
W
PTJPE7
PTJPE6
PTJPE5
PTJPE4
PTJPE3
PTJPE2
PTJPE1
PTJPE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-54. Internal Pull Enable for Port J Register (PTJPE)
Table 6-52. PTJPE Register Field Descriptions
Field
Description
7:0
Internal Pull Enable for Port J Bits — Each of these control bits determines if the internal pull-up device is
PTJPE[7:0] enabled for the associated PTJ pin. For port J pins that are configured as outputs, these bits have no effect and
the internal pull devices are disabled.
0 Internal pull-up device disabled for port J bit n.
1 Internal pull-up device enabled for port J bit n.
NOTE
Pull-down devices only apply when using pin interrupt functions, when
corresponding edge select and pin select functions are configured.
6.5.9.4
Port J Slew Rate Enable Register (PTJSE)
7
6
5
4
3
2
1
0
R
W
PTJSE7
PTJSE6
PTJSE5
PTJSE4
PTJSE3
PTJSE2
PTJSE1
PTJSE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-55. Slew Rate Enable for Port J Register (PTJSE)
Table 6-53. PTJSE Register Field Descriptions
Field
Description
7:0
Output Slew Rate Enable for Port J Bits — Each of these control bits determines if the output slew rate control
PTJSE[7:0] is enabled for the associated PTJ pin. For port J pins that are configured as inputs, these bits have no effect.
0 Output slew rate control disabled for port J bit n.
1 Output slew rate control enabled for port J bit n.
Note: Slew rate reset default values may differ between engineering samples and final production parts. Always initialize slew
rate control to the desired value to ensure correct operation.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
133
Chapter 6 Parallel Input/Output Control
6.5.9.5
Port J Drive Strength Selection Register (PTJDS)
7
6
5
4
3
2
1
0
R
W
PTJDS7
PTJDS6
PTJDS5
PTJDS4
PTJDS3
PTJDS2
PTJDS1
PTJDS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-56. Drive Strength Selection for Port J Register (PTJDS)
Table 6-54. PTJDS Register Field Descriptions
Field
Description
7:0
Output Drive Strength Selection for Port J Bits — Each of these control bits selects between low and high
PTJDS[7:0] output drive for the associated PTJ pin. For port J pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port J bit n.
1 High output drive strength selected for port J bit n.
6.5.9.6
Port J Interrupt Status and Control Register (PTJSC)
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PTJIF
0
PTJIE
PTJMOD
PTJACK
0
Reset:
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 6-57. Port J Interrupt Status and Control Register (PTJSC)
Table 6-55. PTJSC Register Field Descriptions
Field
Description
3
Port J Interrupt Flag — PTJIF indicates when a port J interrupt is detected. Writes have no effect on PTJIF.
PTJIF
0 No port J interrupt detected.
1 Port J interrupt detected.
2
Port J Interrupt Acknowledge — Writing a 1 to PTJACK is part of the flag clearing mechanism. PTJACK always
PTJACK
reads as 0.
1
Port J Interrupt Enable — PTJIE determines whether a port J interrupt is requested.
0 Port J interrupt request not enabled.
PTJIE
1 Port J interrupt request enabled.
0
Port J Detection Mode — PTJMOD (along with the PTJES bits) controls the detection mode of the port J
PTJMOD interrupt pins.
0 Port J pins detect edges only.
1 Port J pins detect both edges and levels.
MC9S08DZ128 Series Data Sheet, Rev. 1
134
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.9.7
Port J Interrupt Pin Select Register (PTJPS)
7
6
5
4
3
2
1
0
R
W
PTJPS7
PTJPS6
PTJPS5
PTJPS4
PTJPS3
PTJPS2
PTJPS1
PTJPS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-58. Port J Interrupt Pin Select Register (PTJPS)
Table 6-56. PTJPS Register Field Descriptions
Field
Description
7:0
Port J Interrupt Pin Selects — Each of the PTJPSn bits enable the corresponding port J interrupt pin.
PTJPS[7:0] 0 Pin not enabled as interrupt.
1 Pin enabled as interrupt.
6.5.9.8
Port J Interrupt Edge Select Register (PTJES)
7
6
5
4
3
2
1
0
R
W
PTJES7
PTJES6
PTJES5
PTJES4
PTJES3
PTJES2
PTJES1
PTJES0
Reset:
0
0
0
0
0
0
0
0
Figure 6-59. Port J Edge Select Register (PTJES)
Table 6-57. PTJES Register Field Descriptions
Field
Description
7:0
Port J Edge Selects — Each of the PTJESn bits serves a dual purpose by selecting the polarity of the active
PTJES[7:0] interrupt edge as well as selecting a pull-up or pull-down device if enabled.
0 A pull-up device is connected to the associated pin and detects falling edge/low level for interrupt generation.
1 A pull-down device is connected to the associated pin and detects rising edge/high level for interrupt
generation.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
135
Chapter 6 Parallel Input/Output Control
6.5.10 Port K Registers
Port K is controlled by the registers listed below.
6.5.10.1 Port K Data Register (PTKD)
7
6
5
4
3
2
1
0
R
W
PTKD7
PTKD6
PTKD5
PTKD4
PTKD3
PTKD2
PTKD1
PTKD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-60. Port K Data Register (PTKD)
Table 6-58. PTKD Register Field Descriptions
Field
Description
7:0
Port K Data Register Bits — For port K pins that are inputs, reads return the logic level on the pin. For port K
PTKD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port K pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTKD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pull-ups disabled.
6.5.10.2 Port K Data Direction Register (PTKDD)
7
6
5
4
3
2
1
0
R
W
PTKDD7
PTKDD6
PTKDD5
PTKDD4
PTKDD3
PTKDD2
PTKDD1
PTKDD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-61. Port K Data Direction Register (PTKDD)
Table 6-59. PTKDD Register Field Descriptions
Field
Description
7:0
Data Direction for Port K Bits — These read/write bits control the direction of port K pins and what is read for
PTKDD[7:0] PTKD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port K bit n and PTKD reads return the contents of PTKDn.
MC9S08DZ128 Series Data Sheet, Rev. 1
136
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.10.3 Port K Pull Enable Register (PTKPE)
7
6
5
4
3
2
1
0
R
W
PTKPE7
PTKPE6
PTKPE5
PTKPE4
PTKPE3
PTKPE2
PTKPE1
PTKPE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-62. Internal Pull Enable for Port K Register (PTKPE)
Table 6-60. PTKPE Register Field Descriptions
Field
Description
7:0
Internal Pull Enable for Port K Bits — Each of these control bits determines if the internal pull-up device is
PTKPE[7:0] enabled for the associated PTK pin. For port K pins that are configured as outputs, these bits have no effect and
the internal pull devices are disabled.
0 Internal pull-up device disabled for port K bit n.
1 Internal pull-up device enabled for port K bit n.
NOTE
Pull-down devices only apply when using pin interrupt functions, when
corresponding edge select and pin select functions are configured.
6.5.10.4 Port K Slew Rate Enable Register (PTKSE)
7
6
5
4
3
2
1
0
R
W
PTKSE7
PTKSE6
PTKSE5
PTKSE4
PTKSE3
PTKSE2
PTKSE1
PTKSE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-63. Slew Rate Enable for Port K Register (PTKSE)
Table 6-61. PTKSE Register Field Descriptions
Field
Description
7:0
Output Slew Rate Enable for Port K Bits — Each of these control bits determines if the output slew rate control
PTKSE[7:0] is enabled for the associated PTK pin. For port K pins that are configured as inputs, these bits have no effect.
0 Output slew rate control disabled for port K bit n.
1 Output slew rate control enabled for port K bit n.
Note: Slew rate reset default values may differ between engineering samples and final production parts. Always initialize slew
rate control to the desired value to ensure correct operation.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
137
Chapter 6 Parallel Input/Output Control
6.5.10.5 Port K Drive Strength Selection Register (PTKDS)
7
6
5
4
3
2
1
0
R
W
PTKDS7
PTKDS6
PTKDS5
PTKDS4
PTKDS3
PTKDS2
PTKDS1
PTKDS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-64. Drive Strength Selection for Port K Register (PTKDS)
Table 6-62. PTKDS Register Field Descriptions
Field
Description
7:0
Output Drive Strength Selection for Port K Bits — Each of these control bits selects between low and high
PTKDS[7:0] output drive for the associated PTK pin. For port K pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port K bit n.
1 High output drive strength selected for port K bit n.
MC9S08DZ128 Series Data Sheet, Rev. 1
138
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.11 Port L Registers
Port L is controlled by the registers listed below.
6.5.11.1 Port L Data Register (PTLD)
7
6
5
4
3
2
1
0
R
W
PTLD7
PTLD6
PTLD5
PTLD4
PTLD3
PTLD2
PTLD1
PTLD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-65. Port L Data Register (PTLD)
Table 6-63. PTLD Register Field Descriptions
Description
Field
7:0
Port L Data Register Bits — For port L pins that are inputs, reads return the logic level on the pin. For port L
PTLD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port L pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTLD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pull-ups disabled.
6.5.11.2 Port L Data Direction Register (PTLDD)
7
6
5
4
3
2
1
0
R
W
PTLDD7
PTLDD6
PTLDD5
PTLDD4
PTLDD3
PTLDD2
PTLDD1
PTLDD0
Reset:
0
0
0
0
0
0
0
0
Figure 6-66. Port L Data Direction Register (PTLDD)
Table 6-64. PTLDD Register Field Descriptions
Field
Description
7:0
Data Direction for Port L Bits — These read/write bits control the direction of port L pins and what is read for
PTLDD[7:0] PTLD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port L bit n and PTLD reads return the contents of PTLDn.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
139
Chapter 6 Parallel Input/Output Control
6.5.11.3 Port L Pull Enable Register (PTLPE)
7
6
5
4
3
2
1
0
R
W
PTLPE7
PTLPE6
PTLPE5
PTLPE4
PTLPE3
PTLPE2
PTLPE1
PTLPE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-67. Internal Pull Enable for Port L Register (PTLPE)
Table 6-65. PTLPE Register Field Descriptions
Field
Description
7:0
Internal Pull Enable for Port L Bits — Each of these control bits determines if the internal pull-up device is
PTLPE[7:0] enabled for the associated PTL pin. For port L pins that are configured as outputs, these bits have no effect and
the internal pull devices are disabled.
0 Internal pull-up device disabled for port L bit n.
1 Internal pull-up device enabled for port L bit n.
NOTE
Pull-down devices only apply when using pin interrupt functions, when
corresponding edge select and pin select functions are configured.
6.5.11.4 Port L Slew Rate Enable Register (PTLSE)
7
6
5
4
3
2
1
0
R
W
PTLSE7
PTLSE6
PTLSE5
PTLSE4
PTLSE3
PTLSE2
PTLSE1
PTLSE0
Reset:
0
0
0
0
0
0
0
0
Figure 6-68. Slew Rate Enable for Port L Register (PTLSE)
Table 6-66. PTLSE Register Field Descriptions
Field
Description
7:0
Output Slew Rate Enable for Port L Bits — Each of these control bits determines if the output slew rate control
PTLSE[7:0] is enabled for the associated PTL pin. For port L pins that are configured as inputs, these bits have no effect.
0 Output slew rate control disabled for port L bit n.
1 Output slew rate control enabled for port L bit n.
Note: Slew rate reset default values may differ between engineering samples and final production parts. Always initialize slew
rate control to the desired value to ensure correct operation.
MC9S08DZ128 Series Data Sheet, Rev. 1
140
Freescale Semiconductor
Chapter 6 Parallel Input/Output Control
6.5.11.5 Port L Drive Strength Selection Register (PTLDS)
7
6
5
4
3
2
1
0
R
W
PTLDS7
PTLDS6
PTLDS5
PTLDS4
PTLDS3
PTLDS2
PTLDS1
PTLDS0
Reset:
0
0
0
0
0
0
0
0
Figure 6-69. Drive Strength Selection for Port L Register (PTLDS)
Table 6-67. PTLDS Register Field Descriptions
Field
Description
7:0
Output Drive Strength Selection for Port L Bits — Each of these control bits selects between low and high
PTLDS[7:0] output drive for the associated PTL pin. For port L pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port L bit n.
1 High output drive strength selected for port L bit n.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
141
Chapter 6 Parallel Input/Output Control
MC9S08DZ128 Series Data Sheet, Rev. 1
142
Freescale Semiconductor
Chapter 7
Central Processor Unit (S08CPUV5)
7.1
Introduction
This section provides summary information about the registers, addressing modes, and instruction set of
the CPU of the HCS08 Family. For a more detailed discussion, refer to the HCS08 Family Reference
Manual, volume 1, Freescale Semiconductor document order number HCS08RMV1/D.
The HCS08 CPU is fully source- and object-code-compatible with the M68HC08 CPU. Several
instructions and enhanced addressing modes were added to improve C compiler efficiency and to support
a new background debug system which replaces the monitor mode of earlier M68HC08 microcontrollers
(MCU).
7.1.1
Features
Features of the HCS08 CPU include:
•
•
•
•
•
•
•
Object code fully upward-compatible with M68HC05 and M68HC08 Families
64-KB CPU address space with banked memory management unit for greater than 64 KB
16-bit stack pointer (any size stack anywhere in 64-KB CPU address space)
16-bit index register (H:X) with powerful indexed addressing modes
8-bit accumulator (A)
Many instructions treat X as a second general-purpose 8-bit register
Seven addressing modes:
— Inherent — Operands in internal registers
— Relative — 8-bit signed offset to branch destination
— Immediate — Operand in next object code byte(s)
— Direct — Operand in memory at 0x0000–0x00FF
— Extended — Operand anywhere in 64-Kbyte address space
— Indexed relative to H:X — Five submodes including auto increment
— Indexed relative to SP — Improves C efficiency dramatically
Memory-to-memory data move instructions with four address mode combinations
•
•
Overflow, half-carry, negative, zero, and carry condition codes support conditional branching on
the results of signed, unsigned, and binary-coded decimal (BCD) operations
•
•
•
Efficient bit manipulation instructions
Fast 8-bit by 8-bit multiply and 16-bit by 8-bit divide instructions
STOP and WAIT instructions to invoke low-power operating modes
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
143
Chapter 7 Central Processor Unit (S08CPUV5)
7.2
Programmer’s Model and CPU Registers
Figure 7-1 shows the five CPU registers. CPU registers are not part of the memory map.
7
0
ACCUMULATOR
A
16-BIT INDEX REGISTER H:X
INDEX REGISTER (HIGH) INDEX REGISTER (LOW)
H
X
15
8
7
0
SP
PC
STACK POINTER
15
0
PROGRAM COUNTER
7
0
CONDITION CODE REGISTER
V
1
1
H
I
N
Z
C
CCR
CARRY
ZERO
NEGATIVE
INTERRUPT MASK
HALF-CARRY (FROM BIT 3)
TWO’S COMPLEMENT OVERFLOW
Figure 7-1. CPU Registers
7.2.1
Accumulator (A)
The A accumulator is a general-purpose 8-bit register. One operand input to the arithmetic logic unit
(ALU) is connected to the accumulator and the ALU results are often stored into the A accumulator after
arithmetic and logical operations. The accumulator can be loaded from memory using various addressing
modes to specify the address where the loaded data comes from, or the contents of A can be stored to
memory using various addressing modes to specify the address where data from A will be stored.
Reset has no effect on the contents of the A accumulator.
7.2.2
Index Register (H:X)
This 16-bit register is actually two separate 8-bit registers (H and X), which often work together as a 16-bit
address pointer where H holds the upper byte of an address and X holds the lower byte of the address. All
indexed addressing mode instructions use the full 16-bit value in H:X as an index reference pointer;
however, for compatibility with the earlier M68HC05 Family, some instructions operate only on the
low-order 8-bit half (X).
Many instructions treat X as a second general-purpose 8-bit register that can be used to hold 8-bit data
values. X can be cleared, incremented, decremented, complemented, negated, shifted, or rotated. Transfer
instructions allow data to be transferred from A or transferred to A where arithmetic and logical operations
can then be performed.
For compatibility with the earlier M68HC05 Family, H is forced to 0x00 during reset. Reset has no effect
on the contents of X.
MC9S08DZ128 Series Data Sheet, Rev. 1
144
Freescale Semiconductor
Chapter 7 Central Processor Unit (S08CPUV5)
7.2.3
Stack Pointer (SP)
This 16-bit address pointer register points at the next available location on the automatic last-in-first-out
(LIFO) stack. The stack may be located anywhere in the 64-Kbyte address space that has RAM and can
be any size up to the amount of available RAM. The stack is used to automatically save the return address
for subroutine calls, the return address and CPU registers during interrupts, and for local variables. The
AIS (add immediate to stack pointer) instruction adds an 8-bit signed immediate value to SP. This is most
often used to allocate or deallocate space for local variables on the stack.
SP is forced to 0x00FF at reset for compatibility with the earlier M68HC05 Family. HCS08 programs
normally change the value in SP to the address of the last location (highest address) in on-chip RAM
during reset initialization to free up direct page RAM (from the end of the on-chip registers to 0x00FF).
The RSP (reset stack pointer) instruction was included for compatibility with the M68HC05 Family and
is seldom used in new HCS08 programs because it only affects the low-order half of the stack pointer.
7.2.4
Program Counter (PC)
The program counter is a 16-bit register that contains the address of the next instruction or operand to be
fetched.
During normal program execution, the program counter automatically increments to the next sequential
memory location every time an instruction or operand is fetched. Jump, branch, interrupt, and return
operations load the program counter with an address other than that of the next sequential location. This
is called a change-of-flow.
During reset, the program counter is loaded with the reset vector that is located at 0xFFFE and 0xFFFF.
The vector stored there is the address of the first instruction that will be executed after exiting the reset
state.
7.2.5
Condition Code Register (CCR)
The 8-bit condition code register contains the interrupt mask (I) and five flags that indicate the results of
the instruction just executed. Bits 6 and 5 are set permanently to 1. The following paragraphs describe the
functions of the condition code bits in general terms. For a more detailed explanation of how each
instruction sets the CCR bits, refer to the HCS08 Family Reference Manual, volume 1, Freescale
Semiconductor document order number HCS08RMv1.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
145
Chapter 7 Central Processor Unit (S08CPUV5)
7
0
CONDITION CODE REGISTER
V
1
1
H
I
N
Z
C
CCR
CARRY
ZERO
NEGATIVE
INTERRUPT MASK
HALF-CARRY (FROM BIT 3)
TWO’S COMPLEMENT OVERFLOW
Figure 7-2. Condition Code Register
Table 7-1. CCR Register Field Descriptions
Description
Field
7
Two’s Complement Overflow Flag — The CPU sets the overflow flag when a two’s complement overflow occurs.
V
The signed branch instructions BGT, BGE, BLE, and BLT use the overflow flag.
0 No overflow
1 Overflow
4
H
Half-Carry Flag — The CPU sets the half-carry flag when a carry occurs between accumulator bits 3 and 4 during
an add-without-carry (ADD) or add-with-carry (ADC) operation. The half-carry flag is required for binary-coded
decimal (BCD) arithmetic operations. The DAA instruction uses the states of the H and C condition code bits to
automatically add a correction value to the result from a previous ADD or ADC on BCD operands to correct the
result to a valid BCD value.
0 No carry between bits 3 and 4
1 Carry between bits 3 and 4
3
I
Interrupt Mask Bit — When the interrupt mask is set, all maskable CPU interrupts are disabled. CPU interrupts
are enabled when the interrupt mask is cleared. When a CPU interrupt occurs, the interrupt mask is set
automatically after the CPU registers are saved on the stack, but before the first instruction of the interrupt service
routine is executed.
Interrupts are not recognized at the instruction boundary after any instruction that clears I (CLI or TAP). This
ensures that the next instruction after a CLI or TAP will always be executed without the possibility of an intervening
interrupt, provided I was set.
0 Interrupts enabled
1 Interrupts disabled
2
N
Negative Flag — The CPU sets the negative flag when an arithmetic operation, logic operation, or data
manipulation produces a negative result, setting bit 7 of the result. Simply loading or storing an 8-bit or 16-bit value
causes N to be set if the most significant bit of the loaded or stored value was 1.
0 Non-negative result
1 Negative result
1
Z
Zero Flag — The CPU sets the zero flag when an arithmetic operation, logic operation, or data manipulation
produces a result of 0x00 or 0x0000. Simply loading or storing an 8-bit or 16-bit value causes Z to be set if the
loaded or stored value was all 0s.
0 Non-zero result
1 Zero result
0
C
Carry/Borrow Flag — The CPU sets the carry/borrow flag when an addition operation produces a carry out of bit
7 of the accumulator or when a subtraction operation requires a borrow. Some instructions — such as bit test and
branch, shift, and rotate — also clear or set the carry/borrow flag.
0 No carry out of bit 7
1 Carry out of bit 7
MC9S08DZ128 Series Data Sheet, Rev. 1
146
Freescale Semiconductor
Chapter 7 Central Processor Unit (S08CPUV5)
7.3
Addressing Modes
Addressing modes define the way the CPU accesses operands and data. In the HCS08, memory, status and
control registers, and input/output (I/O) ports share a single 64-Kbyte CPU address space. This
arrangement means that the same instructions that access variables in RAM can also be used to access I/O
and control registers or nonvolatile program space.
NOTE
For more information about extended addressing modes, see the Memory
Management Unit section in the Memory chapter.
MCU derivatives with more than 64-Kbytes of memory also include a memory management unit (MMU)
to support extended memory space. A PPAGE register is used to manage 16-Kbyte pages of memory which
can be accessed by the CPU through a 16-Kbyte window from 0x8000 through 0xBFFF. The CPU includes
two special instructions (CALL and RTC). CALL operates like the JSR instruction except that CALL saves
the current PPAGE value on the stack and provides a new PPAGE value for the destination. RTC works
like the RTS instruction except RTC restores the old PPAGE value in addition to the PC during the return
from the called routine. The MMU also includes a linear address pointer register and data access registers
so that the extended memory space operates as if it was a single linear block of memory. For additional
information about the MMU, refer to the Memory chapter of this data sheet.
Some instructions use more than one addressing mode. For instance, move instructions use one addressing
mode to specify the source operand and a second addressing mode to specify the destination address.
Instructions such as BRCLR, BRSET, CBEQ, and DBNZ use one addressing mode to specify the location
of an operand for a test and then use relative addressing mode to specify the branch destination address
when the tested condition is true. For BRCLR, BRSET, CBEQ, and DBNZ, the addressing mode listed in
the instruction set tables is the addressing mode needed to access the operand to be tested, and relative
addressing mode is implied for the branch destination.
7.3.1
Inherent Addressing Mode (INH)
In this addressing mode, operands needed to complete the instruction (if any) are located within CPU
registers so the CPU does not need to access memory to get any operands.
7.3.2
Relative Addressing Mode (REL)
Relative addressing mode is used to specify the destination location for branch instructions. A signed 8-bit
offset value is located in the memory location immediately following the opcode. During execution, if the
branch condition is true, the signed offset is sign-extended to a 16-bit value and is added to the current
contents of the program counter, which causes program execution to continue at the branch destination
address.
7.3.3
Immediate Addressing Mode (IMM)
In immediate addressing mode, the operand needed to complete the instruction is included in the object
code immediately following the instruction opcode in memory. In the case of a 16-bit immediate operand,
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
147
Chapter 7 Central Processor Unit (S08CPUV5)
the high-order byte is located in the next memory location after the opcode, and the low-order byte is
located in the next memory location after that.
7.3.4
Direct Addressing Mode (DIR)
In direct addressing mode, the instruction includes the low-order eight bits of an address in the direct page
(0x0000–0x00FF). During execution a 16-bit address is formed by concatenating an implied 0x00 for the
high-order half of the address and the direct address from the instruction to get the 16-bit address where
the desired operand is located. This is faster and more memory efficient than specifying a complete 16-bit
address for the operand.
7.3.5
Extended Addressing Mode (EXT)
In extended addressing mode, the full 16-bit address of the operand is located in the next two bytes of
program memory after the opcode (high byte first).
7.3.6
Indexed Addressing Mode
Indexed addressing mode has seven variations including five that use the 16-bit H:X index register pair and
two that use the stack pointer as the base reference.
7.3.6.1
Indexed, No Offset (IX)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair as the address of
the operand needed to complete the instruction.
7.3.6.2
Indexed, No Offset with Post Increment (IX+)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair as the address of
the operand needed to complete the instruction. The index register pair is then incremented
(H:X = H:X + 0x0001) after the operand has been fetched. This addressing mode is only used for MOV
and CBEQ instructions.
7.3.6.3
Indexed, 8-Bit Offset (IX1)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus an unsigned
8-bit offset included in the instruction as the address of the operand needed to complete the instruction.
7.3.6.4
Indexed, 8-Bit Offset with Post Increment (IX1+)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus an unsigned
8-bit offset included in the instruction as the address of the operand needed to complete the instruction.
The index register pair is then incremented (H:X = H:X + 0x0001) after the operand has been fetched. This
addressing mode is used only for the CBEQ instruction.
MC9S08DZ128 Series Data Sheet, Rev. 1
148
Freescale Semiconductor
Chapter 7 Central Processor Unit (S08CPUV5)
7.3.6.5
Indexed, 16-Bit Offset (IX2)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus a 16-bit offset
included in the instruction as the address of the operand needed to complete the instruction.
7.3.6.6
SP-Relative, 8-Bit Offset (SP1)
This variation of indexed addressing uses the 16-bit value in the stack pointer (SP) plus an unsigned 8-bit
offset included in the instruction as the address of the operand needed to complete the instruction.
7.3.6.7
SP-Relative, 16-Bit Offset (SP2)
This variation of indexed addressing uses the 16-bit value in the stack pointer (SP) plus a 16-bit offset
included in the instruction as the address of the operand needed to complete the instruction.
7.4
Special Operations
The CPU performs a few special operations that are similar to instructions but do not have opcodes like
other CPU instructions. In addition, a few instructions such as STOP and WAIT directly affect other MCU
circuitry. This section provides additional information about these operations.
7.4.1
Reset Sequence
Reset can be caused by a power-on-reset (POR) event, internal conditions such as the COP (computer
operating properly) watchdog, or by assertion of an external active-low reset pin. When a reset event
occurs, the CPU immediately stops whatever it is doing (the MCU does not wait for an instruction
boundary before responding to a reset event). For a more detailed discussion about how the MCU
recognizes resets and determines the source, refer to the Resets, Interrupts, and System Configuration
chapter.
The reset event is considered concluded when the sequence to determine whether the reset came from an
internal source is done and when the reset pin is no longer asserted. At the conclusion of a reset event, the
CPU performs a 6-cycle sequence to fetch the reset vector from 0xFFFE and 0xFFFF and to fill the
instruction queue in preparation for execution of the first program instruction.
7.4.2
Interrupt Sequence
When an interrupt is requested, the CPU completes the current instruction before responding to the
interrupt. At this point, the program counter is pointing at the start of the next instruction, which is where
the CPU should return after servicing the interrupt. The CPU responds to an interrupt by performing the
same sequence of operations as for a software interrupt (SWI) instruction, except the address used for the
vector fetch is determined by the highest priority interrupt that is pending when the interrupt sequence
started.
The CPU sequence for an interrupt is:
1. Store the contents of PCL, PCH, X, A, and CCR on the stack, in that order.
2. Set the I bit in the CCR.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
149
Chapter 7 Central Processor Unit (S08CPUV5)
3. Fetch the high-order half of the interrupt vector.
4. Fetch the low-order half of the interrupt vector.
5. Delay for one free bus cycle.
6. Fetch three bytes of program information starting at the address indicated by the interrupt vector
to fill the instruction queue in preparation for execution of the first instruction in the interrupt
service routine.
After the CCR contents are pushed onto the stack, the I bit in the CCR is set to prevent other interrupts
while in the interrupt service routine. Although it is possible to clear the I bit with an instruction in the
interrupt service routine, this would allow nesting of interrupts (which is not recommended because it
leads to programs that are difficult to debug and maintain).
For compatibility with the earlier M68HC05 MCUs, the high-order half of the H:X index register pair (H)
is not saved on the stack as part of the interrupt sequence. The user must use a PSHH instruction at the
beginning of the service routine to save H and then use a PULH instruction just before the RTI that ends
the interrupt service routine. It is not necessary to save H if you are certain that the interrupt service routine
does not use any instructions or auto-increment addressing modes that might change the value of H.
The software interrupt (SWI) instruction is like a hardware interrupt except that it is not masked by the
global I bit in the CCR and it is associated with an instruction opcode within the program so it is not
asynchronous to program execution.
7.4.3
Wait Mode Operation
The WAIT instruction enables interrupts by clearing the I bit in the CCR. It then halts the clocks to the
CPU to reduce overall power consumption while the CPU is waiting for the interrupt or reset event that
will wake the CPU from wait mode. When an interrupt or reset event occurs, the CPU clocks will resume
and the interrupt or reset event will be processed normally.
If a serial BACKGROUND command is issued to the MCU through the background debug interface while
the CPU is in wait mode, CPU clocks will resume and the CPU will enter active background mode where
other serial background commands can be processed. This ensures that a host development system can still
gain access to a target MCU even if it is in wait mode.
7.4.4
Stop Mode Operation
Usually, all system clocks, including the crystal oscillator (when used), are halted during stop mode to
minimize power consumption. In such systems, external circuitry is needed to control the time spent in
stop mode and to issue a signal to wake up the target MCU when it is time to resume processing. Unlike
the earlier M68HC05 and M68HC08 MCUs, the HCS08 can be configured to keep a minimum set of
clocks running in stop mode. This optionally allows an internal periodic signal to wake the target MCU
from stop mode.
When a host debug system is connected to the background debug pin (BKGD) and the ENBDM control
bit has been set by a serial command through the background interface (or because the MCU was reset into
active background mode), the oscillator is forced to remain active when the MCU enters stop mode. In this
case, if a serial BACKGROUND command is issued to the MCU through the background debug interface
MC9S08DZ128 Series Data Sheet, Rev. 1
150
Freescale Semiconductor
Chapter 7 Central Processor Unit (S08CPUV5)
while the CPU is in stop mode, CPU clocks will resume and the CPU will enter active background mode
where other serial background commands can be processed. This ensures that a host development system
can still gain access to a target MCU even if it is in stop mode.
Recovery from stop mode depends on the particular HCS08 and whether the oscillator was stopped in stop
mode. Refer to the Modes of Operation chapter for more details.
7.4.5
BGND Instruction
The BGND instruction is new to the HCS08 compared to the M68HC08. BGND would not be used in
normal user programs because it forces the CPU to stop processing user instructions and enter the active
background mode. The only way to resume execution of the user program is through reset or by a host
debug system issuing a GO, TRACE1, or TAGGO serial command through the background debug
interface.
Software-based breakpoints can be set by replacing an opcode at the desired breakpoint address with the
BGND opcode. When the program reaches this breakpoint address, the CPU is forced to active background
mode rather than continuing the user program.
7.5
CALL and RTC Instructions
The CALL is similar to a jump-to-subroutine (JSR) instruction, but the subroutine that is called can be
located anywhere in the normal 64-Kbyte address space or on any page of program expansion memory.
When CALL is executed, a return address is calculated, then it and the current program page register value
are stacked, and a new instruction-supplied value is written to PPAGE. The PPAGE value controls which
of the possible 16-Kbyte pages is visible through the window in the 64-Kbyte memory map. Execution
continues at the address of the called subroutine.
The actual sequence of operations that occur during execution of CALL is:
1. CPU calculates the address of the next instruction after the CALL instruction (the return address)
and pushes this 16-bit value onto the stack, low byte first.
2. CPU reads the old PPAGE value and pushes it onto the stack.
3. CPU writes the new instruction-supplied page select value to PPAGE. This switches the destination
page into the program overlay window in the CPU address range 0x8000 0xBFFF.
4. Instruction queue is refilled starting from the destination address, and execution begins at the new
address.
This sequence of operations is an uninterruptable CPU instruction. There is no need to inhibit interrupts
during CALL execution. In addition, a CALL can be performed from any address in memory to any other
address. This is a big improvement over other bank-switching schemes, where the page switch operation
can be performed only by a program outside the overlay window.
For all practical purposes, the PPAGE value supplied by the instruction can be considered to be part of the
effective address. The new page value is provided by an immediate operand in the instruction.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
151
Chapter 7 Central Processor Unit (S08CPUV5)
The RTC instruction is used to terminate subroutines invoked by a CALL instruction. RTC unstacks the
PPAGE value and the return address, the queue is refilled, and execution resumes with the next instruction
after the corresponding CALL.
The actual sequence of operations that occur during execution of RTC is:
1. The return value of the 8-bit PPAGE register is pulled from the stack.
2. The 16-bit return address is pulled from the stack and loaded into the PC.
3. The return PPAGE value is written to the PPAGE register.
4. The queue is refilled and execution begins at the new address.
Since the return operation is implemented as a single uninterruptable CPU instruction, the RTC can be
executed from anywhere in memory, including from a different page of extended memory in the overlay
window.
The CALL and RTC instructions behave like JSR and RTS, except they have slightly longer execution
times. Since extra execution cycles are required, routinely substituting CALL/RTC for JSR/RTS is not
recommended. JSR and RTS can be used to access subroutines that are located outside the program overlay
window or on the same memory page. However, if a subroutine can be called from other pages, it must be
terminated with an RTC. In this case, since RTC unstacks the PPAGE value as well as the return address,
all accesses to the subroutine, even those made from the same page, must use CALL instructions.
MC9S08DZ128 Series Data Sheet, Rev. 1
152
Freescale Semiconductor
Chapter 7 Central Processor Unit (S08CPUV5)
7.6
HCS08 Instruction Set Summary
Table 7-2 provides a summary of the HCS08 instruction set in all possible addressing modes. The table
shows operand construction, execution time in internal bus clock cycles, and cycle-by-cycle details for
each addressing mode variation of each instruction.
Table 7-2. Instruction Set Summary (Sheet 1 of 9)
Affect
Source
Form
Cyc-by-Cyc
Details
on CCR
Operation
Object Code
V 1 1 H I N Z C
ADC #opr8i
ADC opr8a
IMM
DIR
EXT
IX2
IX1
IX
A9 ii
B9 dd
C9 hh ll
D9 ee ff
E9 ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
ADC opr16a
ADC oprx16,X
ADC oprx8,X
ADC ,X
ADC oprx16,SP
ADC oprx8,SP
Add with Carry
A ← (A) + (M) + (C)
↕ 1 1 ↕ – ↕ ↕ ↕
F9
SP2
SP1
9E D9 ee ff
9E E9 ff
ADD #opr8i
ADD opr8a
ADD opr16a
ADD oprx16,X
ADD oprx8,X
ADD ,X
IMM
DIR
EXT
IX2
IX1
IX
AB ii
BB dd
CB hh ll
DB ee ff
EB ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
Add without Carry
A ← (A) + (M)
↕ 1 1 ↕ – ↕ ↕ ↕
FB
ADD oprx16,SP
ADD oprx8,SP
SP2
SP1
9E DB ee ff
9E EB ff
Add Immediate Value (Signed) to
Stack Pointer
SP ← (SP) + (M)
AIS #opr8i
AIX #opr8i
IMM
IMM
A7 ii
AF ii
2
2
pp
pp
– 1 1 – – – – –
– 1 1 – – – – –
Add Immediate Value (Signed) to
Index Register (H:X)
H:X ← (H:X) + (M)
AND #opr8i
AND opr8a
AND opr16a
AND oprx16,X
AND oprx8,X
AND ,X
IMM
DIR
EXT
IX2
IX1
IX
A4 ii
B4 dd
C4 hh ll
D4 ee ff
E4 ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
Logical AND
A ← (A) & (M)
0 1 1 – – ↕ ↕ –
F4
AND oprx16,SP
AND oprx8,SP
SP2
SP1
9E D4 ee ff
9E E4 ff
Arithmetic Shift Left
DIR
INH
INH
IX1
IX
38 dd
48
58
68 ff
78
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
ASL opr8a
ASLA
ASLX
ASL oprx8,X
ASL ,X
ASL oprx8,SP
C
0
↕ 1 1 – – ↕ ↕ ↕
b7
b0
SP1
9E 68 ff
(Same as LSL)
Arithmetic Shift Right
ASR opr8a
ASRA
ASRX
ASR oprx8,X
ASR ,X
ASR oprx8,SP
DIR
INH
INH
IX1
IX
37 dd
47
57
67 ff
77
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
↕ 1 1 – – ↕ ↕ ↕
C
b7
b0
SP1
9E 67 ff
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
153
Chapter 7 Central Processor Unit (S08CPUV5)
Table 7-2. Instruction Set Summary (Sheet 2 of 9)
Affect
on CCR
Source
Form
Cyc-by-Cyc
Details
Operation
Object Code
V 1 1 H I N Z C
Branch if Carry Bit Clear
(if C = 0)
BCC rel
REL
24 rr
3
ppp
– 1 1 – – – – –
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
11 dd
13 dd
15 dd
17 dd
19 dd
1B dd
1D dd
1F dd
5
5
5
5
5
5
5
5
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
Clear Bit n in Memory
(Mn ← 0)
BCLR n,opr8a
– 1 1 – – – – –
Branch if Carry Bit Set (if C = 1)
(Same as BLO)
BCS rel
BEQ rel
BGE rel
REL
REL
REL
25 rr
27 rr
90 rr
3
3
3
ppp
ppp
ppp
– 1 1 – – – – –
– 1 1 – – – – –
– 1 1 – – – – –
Branch if Equal (if Z = 1)
Branch if Greater Than or Equal To
(if N ⊕ V = 0) (Signed)
Enter active background if ENBDM=1
Waits for and processes BDM commands
until GO, TRACE1, or TAGGO
BGND
INH
82
5+ fp...ppp
– 1 1 – – – – –
– 1 1 – – – – –
Branch if Greater Than (if Z | (N ⊕ V) = 0)
(Signed)
BGT rel
REL
92 rr
3
ppp
BHCC rel
BHCS rel
BHI rel
Branch if Half Carry Bit Clear (if H = 0)
Branch if Half Carry Bit Set (if H = 1)
Branch if Higher (if C | Z = 0)
REL
REL
REL
28 rr
29 rr
22 rr
3
3
3
ppp
ppp
ppp
– 1 1 – – – – –
– 1 1 – – – – –
– 1 1 – – – – –
Branch if Higher or Same (if C = 0)
(Same as BCC)
BHS rel
REL
24 rr
3
ppp
– 1 1 – – – – –
BIH rel
BIL rel
Branch if IRQ Pin High (if IRQ pin = 1)
Branch if IRQ Pin Low (if IRQ pin = 0)
REL
REL
2F rr
2E rr
3
3
ppp
ppp
– 1 1 – – – – –
– 1 1 – – – – –
BIT #opr8i
BIT opr8a
BIT opr16a
BIT oprx16,X
BIT oprx8,X
BIT ,X
IMM
DIR
EXT
IX2
IX1
IX
A5 ii
B5 dd
C5 hh ll
D5 ee ff
E5 ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
Bit Test
(A) & (M)
0 1 1 – – ↕ ↕ –
(CCR Updated but Operands Not Changed)
F5
BIT oprx16,SP
BIT oprx8,SP
SP2
SP1
9E D5 ee ff
9E E5 ff
Branch if Less Than or Equal To
(if Z | (N ⊕ V) = 1) (Signed)
BLE rel
REL
93 rr
3
ppp
– 1 1 – – – – –
BLO rel
BLS rel
BLT rel
Branch if Lower (if C = 1) (Same as BCS)
Branch if Lower or Same (if C | Z = 1)
Branch if Less Than (if N ⊕ V = 1) (Signed)
Branch if Interrupt Mask Clear (if I = 0)
Branch if Minus (if N = 1)
REL
REL
REL
REL
REL
REL
REL
25 rr
23 rr
91 rr
2C rr
2B rr
2D rr
26 rr
3
3
3
3
3
3
3
ppp
ppp
ppp
ppp
ppp
ppp
ppp
– 1 1 – – – – –
– 1 1 – – – – –
– 1 1 – – – – –
– 1 1 – – – – –
– 1 1 – – – – –
– 1 1 – – – – –
– 1 1 – – – – –
BMC rel
BMI rel
BMS rel
BNE rel
Branch if Interrupt Mask Set (if I = 1)
Branch if Not Equal (if Z = 0)
MC9S08DZ128 Series Data Sheet, Rev. 1
154
Freescale Semiconductor
Chapter 7 Central Processor Unit (S08CPUV5)
Table 7-2. Instruction Set Summary (Sheet 3 of 9)
Affect
on CCR
Source
Form
Cyc-by-Cyc
Details
Operation
Object Code
V 1 1 H I N Z C
– 1 1 – – – – –
– 1 1 – – – – –
BPL rel
BRA rel
Branch if Plus (if N = 0)
Branch Always (if I = 1)
REL
REL
2A rr
20 rr
3
3
ppp
ppp
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
01 dd rr
03 dd rr
05 dd rr
07 dd rr
09 dd rr
0B dd rr
0D dd rr
0F dd rr
5
5
5
5
5
5
5
5
rpppp
rpppp
rpppp
rpppp
rpppp
rpppp
rpppp
rpppp
BRCLR n,opr8a,rel Branch if Bit n in Memory Clear (if (Mn) = 0)
– 1 1 – – – – ↕
– 1 1 – – – – –
– 1 1 – – – – ↕
BRN rel
Branch Never (if I = 0)
REL
21 rr
3
ppp
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
00 dd rr
02 dd rr
04 dd rr
06 dd rr
08 dd rr
0A dd rr
0C dd rr
0E dd rr
5
5
5
5
5
5
5
5
rpppp
rpppp
rpppp
rpppp
rpppp
rpppp
rpppp
rpppp
BRSET n,opr8a,rel Branch if Bit n in Memory Set (if (Mn) = 1)
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
10 dd
12 dd
14 dd
16 dd
18 dd
1A dd
1C dd
1E dd
5
5
5
5
5
5
5
5
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
BSET n,opr8a
Set Bit n in Memory (Mn ← 1)
– 1 1 – – – – –
Branch to Subroutine
PC ← (PC) + $0002
BSR rel
push (PCL); SP ← (SP) – $0001
push (PCH); SP ← (SP) – $0001
PC ← (PC) + rel
REL
EXT
AD rr
5
8
ssppp
– 1 1 – – – – –
– 1 1 – – – – –
CALL page, opr16a Call Subroutine
AC pg hhll
ppsssppp
CBEQ opr8a,rel
CBEQA #opr8i,rel
CBEQX #opr8i,rel
CBEQ oprx8,X+,rel
CBEQ ,X+,rel
Compare and... Branch if (A) = (M)
DIR
IMM
IMM
IX1+
IX+
31 dd rr
41 ii rr
51 ii rr
61 ff rr
71 rr
5
4
4
5
5
6
rpppp
pppp
pppp
rpppp
rfppp
prpppp
Branch if (A) = (M)
Branch if (X) = (M)
Branch if (A) = (M)
Branch if (A) = (M)
Branch if (A) = (M)
– 1 1 – – – – –
CBEQ oprx8,SP,rel
SP1
9E 61 ff rr
CLC
CLI
Clear Carry Bit (C ← 0)
Clear Interrupt Mask Bit (I ← 0)
INH
INH
98
9A
1
1
p
p
– 1 1 – – – – 0
– 1 1 – 0 – – –
CLR opr8a
CLRA
CLRX
CLRH
CLR oprx8,X
CLR ,X
Clear
M ← $00
A ← $00
X ← $00
H ← $00
M ← $00
M ← $00
M ← $00
DIR
INH
INH
INH
IX1
IX
3F dd
4F
5F
8C
6F ff
7F
5
1
1
1
5
4
6
rfwpp
p
p
p
0 1 1 – – 0 1 –
rfwpp
rfwp
prfwpp
CLR oprx8,SP
SP1
9E 6F ff
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
155
Chapter 7 Central Processor Unit (S08CPUV5)
Table 7-2. Instruction Set Summary (Sheet 4 of 9)
Affect
on CCR
Source
Form
Cyc-by-Cyc
Details
Operation
Object Code
V 1 1 H I N Z C
CMP #opr8i
CMP opr8a
IMM
DIR
EXT
IX2
IX1
IX
A1 ii
B1 dd
C1 hh ll
D1 ee ff
E1 ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
CMP opr16a
CMP oprx16,X
CMP oprx8,X
CMP ,X
CMP oprx16,SP
CMP oprx8,SP
Compare Accumulator with Memory
A – M
(CCR Updated But Operands Not Changed)
↕ 1 1 – – ↕ ↕ ↕
F1
SP2
SP1
9E D1 ee ff
9E E1 ff
COM opr8a
COMA
COMX
COM oprx8,X
COM ,X
COM oprx8,SP
Complement
(One’s Complement) A ← (A) = $FF – (A)
X ← (X) = $FF – (X)
M ← (M)= $FF – (M)
DIR
INH
INH
33 dd
43
53
63 ff
73
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
0 1 1 – – ↕ ↕ 1
M ← (M) = $FF – (M) IX1
M ← (M) = $FF – (M) IX
M ← (M) = $FF – (M) SP1
9E 63 ff
CPHX opr16a
CPHX #opr16i
CPHX opr8a
EXT
IMM
3E hh ll
65 jj kk
75 dd
6
3
5
6
prrfpp
ppp
rrfpp
prrfpp
Compare Index Register (H:X) with Memory
(H:X) – (M:M + $0001)
↕ 1 1 – – ↕ ↕ ↕
DIR
(CCR Updated But Operands Not Changed)
SP1
CPHX oprx8,SP
9E F3 ff
CPX #opr8i
CPX opr8a
CPX opr16a
CPX oprx16,X
CPX oprx8,X
CPX ,X
IMM
DIR
EXT
IX2
IX1
A3 ii
B3 dd
C3 hh ll
D3 ee ff
E3 ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
Compare X (Index Register Low) with
Memory
X – M
↕ 1 1 – – ↕ ↕ ↕
(CCR Updated But Operands Not Changed) IX
SP2
F3
CPX oprx16,SP
CPX oprx8,SP
9E D3 ee ff
9E E3 ff
SP1
Decimal Adjust Accumulator
After ADD or ADC of BCD Values
DAA
INH
72
1
p
U 1 1 – – ↕ ↕ ↕
DBNZ opr8a,rel
DBNZA rel
DBNZX rel
DBNZ oprx8,X,rel
DBNZ ,X,rel
DBNZ oprx8,SP,rel
DIR
INH
INH
IX1
IX
3B dd rr
4B rr
5B rr
6B ff rr
7B rr
7
4
4
7
6
8
rfwpppp
fppp
fppp
rfwpppp
rfwppp
prfwpppp
Decrement A, X, or M and Branch if Not Zero
(if (result) ≠ 0)
DBNZX Affects X Not H
– 1 1 – – – – –
SP1
9E 6B ff rr
DEC opr8a
DECA
DECX
DEC oprx8,X
DEC ,X
DEC oprx8,SP
Decrement M ← (M) – $01
A ← (A) – $01
DIR
INH
INH
IX1
IX
3A dd
4A
5A
6A ff
7A
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
X ← (X) – $01
M ← (M) – $01
M ← (M) – $01
M ← (M) – $01
↕ 1 1 – – ↕ ↕ –
SP1
9E 6A ff
Divide
DIV
INH
52
6
fffffp
– 1 1 – – – ↕ ↕
A ← (H:A)÷(X); H ← Remainder
EOR #opr8i
EOR opr8a
EOR opr16a
EOR oprx16,X
EOR oprx8,X
EOR ,X
Exclusive OR Memory with Accumulator
A ← (A ⊕ M)
IMM
DIR
EXT
IX2
IX1
IX
A8 ii
B8 dd
C8 hh ll
D8 ee ff
E8 ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
0 1 1 – – ↕ ↕ –
F8
EOR oprx16,SP
EOR oprx8,SP
SP2
SP1
9E D8 ee ff
9E E8 ff
MC9S08DZ128 Series Data Sheet, Rev. 1
156
Freescale Semiconductor
Chapter 7 Central Processor Unit (S08CPUV5)
Table 7-2. Instruction Set Summary (Sheet 5 of 9)
Affect
on CCR
Source
Form
Cyc-by-Cyc
Details
Operation
Object Code
V 1 1 H I N Z C
INC opr8a
INCA
INCX
INC oprx8,X
INC ,X
Increment
M ← (M) + $01
A ← (A) + $01
X ← (X) + $01
M ← (M) + $01
M ← (M) + $01
M ← (M) + $01
DIR
INH
INH
IX1
IX
3C dd
4C
5C
6C ff
7C
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
↕ 1 1 – – ↕ ↕ –
INC oprx8,SP
SP1
9E 6C ff
JMP opr8a
JMP opr16a
JMP oprx16,X
JMP oprx8,X
JMP ,X
DIR
EXT
IX2
IX1
IX
BC dd
3
4
4
3
3
ppp
CC hh ll
DC ee ff
EC ff
pppp
pppp
ppp
Jump
PC ← Jump Address
– 1 1 – – – – –
FC
ppp
JSR opr8a
JSR opr16a
JSR oprx16,X
JSR oprx8,X
JSR ,X
Jump to Subroutine
DIR
EXT
IX2
IX1
IX
BD dd
5
6
6
5
5
ssppp
pssppp
pssppp
ssppp
ssppp
PC ← (PC) + n (n = 1, 2, or 3)
Push (PCL); SP ← (SP) – $0001
Push (PCH); SP ← (SP) – $0001
PC ← Unconditional Address
CD hh ll
DD ee ff
ED ff
– 1 1 – – – – –
FD
LDA #opr8i
LDA opr8a
LDA opr16a
LDA oprx16,X
LDA oprx8,X
LDA ,X
IMM
DIR
EXT
IX2
IX1
IX
A6 ii
B6 dd
C6 hh ll
D6 ee ff
E6 ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
Load Accumulator from Memory
A ← (M)
0 1 1 – – ↕ ↕ –
0 1 1 – – ↕ ↕ –
0 1 1 – – ↕ ↕ –
F6
LDA oprx16,SP
LDA oprx8,SP
SP2
SP1
9E D6 ee ff
9E E6 ff
LDHX #opr16i
LDHX opr8a
LDHX opr16a
LDHX ,X
LDHX oprx16,X
LDHX oprx8,X
LDHX oprx8,SP
IMM
DIR
EXT
IX
IX2
IX1
SP1
45 jj kk
55 dd
32 hh ll
9E AE
9E BE ee ff
9E CE ff
9E FE ff
3
4
5
5
6
5
5
ppp
rrpp
prrpp
prrfp
pprrpp
prrpp
prrpp
Load Index Register (H:X)
H:X ← (M:M + $0001)
LDX #opr8i
LDX opr8a
LDX opr16a
LDX oprx16,X
LDX oprx8,X
LDX ,X
IMM
DIR
EXT
IX2
IX1
IX
AE ii
BE dd
CE hh ll
DE ee ff
EE ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
Load X (Index Register Low) from Memory
X ← (M)
FE
LDX oprx16,SP
LDX oprx8,SP
SP2
SP1
9E DE ee ff
9E EE ff
LSL opr8a
LSLA
LSLX
LSL oprx8,X
LSL ,X
LSL oprx8,SP
DIR
INH
INH
IX1
IX
38 dd
48
58
68 ff
78
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
Logical Shift Left
C
0
↕ 1 1 – – ↕ ↕ ↕
b7
b0
(Same as ASL)
SP1
9E 68 ff
LSR opr8a
LSRA
LSRX
LSR oprx8,X
LSR ,X
LSR oprx8,SP
DIR
INH
INH
IX1
IX
34 dd
44
54
64 ff
74
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
Logical Shift Right
↕ 1 1 – – 0 ↕ ↕
0
C
b7
b0
SP1
9E 64 ff
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
157
Chapter 7 Central Processor Unit (S08CPUV5)
Table 7-2. Instruction Set Summary (Sheet 6 of 9)
Affect
on CCR
Source
Form
Cyc-by-Cyc
Details
Operation
Object Code
V 1 1 H I N Z C
0 1 1 – – ↕ ↕ –
MOV opr8a,opr8a
MOV opr8a,X+
MOV #opr8i,opr8a
MOV ,X+,opr8a
Move
(M)
DIR/DIR
DIR/IX+
IMM/DIR
IX+/DIR
4E dd dd
5E dd
6E ii dd
7E dd
5
5
4
5
rpwpp
rfwpp
pwpp
← (M)
destination
source
In IX+/DIR and DIR/IX+ Modes,
H:X ← (H:X) + $0001
rfwpp
Unsigned multiply
X:A ← (X) × (A)
MUL
INH
42
5
ffffp
– 1 1 0 – – – 0
NEG opr8a
NEGA
NEGX
NEG oprx8,X
NEG ,X
NEG oprx8,SP
Negate
M ← – (M) = $00 – (M) DIR
30 dd
40
50
60 ff
70
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
(Two’s Complement) A ← – (A) = $00 – (A) INH
X ← – (X) = $00 – (X) INH
↕ 1 1 – – ↕ ↕ ↕
M ← – (M) = $00 – (M) IX1
M ← – (M) = $00 – (M) IX
M ← – (M) = $00 – (M) SP1
9E 60 ff
NOP
NSA
No Operation — Uses 1 Bus Cycle
INH
9D
62
1
1
p
p
– 1 1 – – – – –
– 1 1 – – – – –
Nibble Swap Accumulator
A ← (A[3:0]:A[7:4])
INH
ORA #opr8i
ORA opr8a
ORA opr16a
ORA oprx16,X
ORA oprx8,X
ORA ,X
IMM
DIR
EXT
IX2
IX1
IX
AA ii
BA dd
CA hh ll
DA ee ff
EA ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
Inclusive OR Accumulator and Memory
A ← (A) | (M)
0 1 1 – – ↕ ↕ –
FA
ORA oprx16,SP
ORA oprx8,SP
SP2
SP1
9E DA ee ff
9E EA ff
Push Accumulator onto Stack
Push (A); SP ← (SP) – $0001
PSHA
PSHH
PSHX
PULA
PULH
PULX
INH
INH
INH
INH
INH
INH
87
8B
89
86
8A
88
2
2
2
3
3
3
sp
– 1 1 – – – – –
– 1 1 – – – – –
– 1 1 – – – – –
– 1 1 – – – – –
– 1 1 – – – – –
– 1 1 – – – – –
Push H (Index Register High) onto Stack
Push (H); SP ← (SP) – $0001
sp
Push X (Index Register Low) onto Stack
Push (X); SP ← (SP) – $0001
sp
Pull Accumulator from Stack
SP ← (SP + $0001); Pull (A)
ufp
ufp
ufp
Pull H (Index Register High) from Stack
SP ← (SP + $0001); Pull (H)
Pull X (Index Register Low) from Stack
SP ← (SP + $0001); Pull (X)
ROL opr8a
ROLA
ROLX
ROL oprx8,X
ROL ,X
ROL oprx8,SP
DIR
INH
INH
IX1
IX
39 dd
49
59
69 ff
79
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
Rotate Left through Carry
↕ 1 1 – – ↕ ↕ ↕
C
b7
b0
SP1
9E 69 ff
ROR opr8a
RORA
RORX
ROR oprx8,X
ROR ,X
ROR oprx8,SP
DIR
INH
INH
IX1
IX
36 dd
46
56
66 ff
76
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
Rotate Right through Carry
C
↕ 1 1 – – ↕ ↕ ↕
b7
b0
SP1
9E 66 ff
MC9S08DZ128 Series Data Sheet, Rev. 1
158
Freescale Semiconductor
Chapter 7 Central Processor Unit (S08CPUV5)
Table 7-2. Instruction Set Summary (Sheet 7 of 9)
Affect
on CCR
Source
Form
Cyc-by-Cyc
Details
Operation
Object Code
V 1 1 H I N Z C
– 1 1 – – – – –
– 1 1 – – – – –
Reset Stack Pointer (Low Byte)
SPL ← $FF
(High Byte Not Affected)
RSP
RTC
INH
INH
9C
8D
1
7
p
Return from CALL
uuufppp
Return from Interrupt
SP ← (SP) + $0001; Pull (CCR)
SP ← (SP) + $0001; Pull (A)
SP ← (SP) + $0001; Pull (X)
SP ← (SP) + $0001; Pull (PCH)
SP ← (SP) + $0001; Pull (PCL)
RTI
INH
80
81
9
uuuuufppp
↕ 1 1 ↕ ↕ ↕ ↕ ↕
Return from Subroutine
SP ← SP + $0001; Pull (PCH)
SP ← SP + $0001; Pull (PCL)
RTS
INH
5
ufppp
– 1 1 – – – – –
SBC #opr8i
SBC opr8a
SBC opr16a
SBC oprx16,X
SBC oprx8,X
SBC ,X
IMM
DIR
EXT
IX2
IX1
IX
A2 ii
B2 dd
C2 hh ll
D2 ee ff
E2 ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
Subtract with Carry
A ← (A) – (M) – (C)
↕ 1 1 – – ↕ ↕ ↕
F2
SBC oprx16,SP
SBC oprx8,SP
SP2
SP1
9E D2 ee ff
9E E2 ff
Set Carry Bit
(C ← 1)
SEC
SEI
INH
INH
99
9B
1
1
p
p
– 1 1 – – – – 1
– 1 1 – 1 – – –
Set Interrupt Mask Bit
(I ← 1)
STA opr8a
DIR
EXT
IX2
IX1
IX
B7 dd
C7 hh ll
D7 ee ff
E7 ff
3
4
4
3
2
5
4
wpp
STA opr16a
STA oprx16,X
STA oprx8,X
STA ,X
STA oprx16,SP
STA oprx8,SP
pwpp
pwpp
wpp
wp
ppwpp
pwpp
Store Accumulator in Memory
M ← (A)
0 1 1 – – ↕ ↕ –
F7
SP2
SP1
9E D7 ee ff
9E E7 ff
STHX opr8a
STHX opr16a
STHX oprx8,SP
DIR
EXT
SP1
35 dd
96 hh ll
9E FF ff
4
5
5
wwpp
pwwpp
pwwpp
Store H:X (Index Reg.)
(M:M + $0001) ← (H:X)
0 1 1 – – ↕ ↕ –
Enable Interrupts: Stop Processing
Refer to MCU Documentation
I bit ← 0; Stop Processing
STOP
INH
8E
2
fp...
– 1 1 – 0 – – –
STX opr8a
DIR
EXT
IX2
IX1
IX
BF dd
CF hh ll
DF ee ff
EF ff
3
4
4
3
2
5
4
wpp
STX opr16a
STX oprx16,X
STX oprx8,X
STX ,X
STX oprx16,SP
STX oprx8,SP
pwpp
pwpp
wpp
wp
ppwpp
pwpp
Store X (Low 8 Bits of Index Register)
in Memory
M ← (X)
0 1 1 – – ↕ ↕ –
FF
SP2
SP1
9E DF ee ff
9E EF ff
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
159
Chapter 7 Central Processor Unit (S08CPUV5)
Table 7-2. Instruction Set Summary (Sheet 8 of 9)
Affect
on CCR
Source
Form
Cyc-by-Cyc
Details
Operation
Object Code
V 1 1 H I N Z C
SUB #opr8i
SUB opr8a
IMM
DIR
EXT
IX2
IX1
IX
A0 ii
B0 dd
C0 hh ll
D0 ee ff
E0 ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
SUB opr16a
SUB oprx16,X
SUB oprx8,X
SUB ,X
SUB oprx16,SP
SUB oprx8,SP
Subtract
A ← (A) – (M)
↕ 1 1 – – ↕ ↕ ↕
F0
SP2
SP1
9E D0 ee ff
9E E0 ff
Software Interrupt
PC ← (PC) + $0001
Push (PCL); SP ← (SP) – $0001
Push (PCH); SP ← (SP) – $0001
Push (X); SP ← (SP) – $0001
Push (A); SP ← (SP) – $0001
Push (CCR); SP ← (SP) – $0001
I ← 1;
SWI
INH
83
11 sssssvvfppp
– 1 1 – 1 – – –
PCH ← Interrupt Vector High Byte
PCL ← Interrupt Vector Low Byte
Transfer Accumulator to CCR
CCR ← (A)
TAP
TAX
TPA
INH
INH
INH
84
97
85
1
1
1
p
p
p
↕ 1 1 ↕ ↕ ↕ ↕ ↕
– 1 1 – – – – –
– 1 1 – – – – –
Transfer Accumulator to X (Index Register
Low)
X ← (A)
Transfer CCR to Accumulator
A ← (CCR)
TST opr8a
TSTA
TSTX
TST oprx8,X
TST ,X
TST oprx8,SP
Test for Negative or Zero
(M) – $00
(A) – $00
(X) – $00
(M) – $00
(M) – $00
(M) – $00
DIR
INH
INH
IX1
IX
3D dd
4D
5D
6D ff
7D
4
1
1
4
3
5
rfpp
p
p
rfpp
rfp
prfpp
0 1 1 – – ↕ ↕ –
SP1
9E 6D ff
Transfer SP to Index Reg.
H:X ← (SP) + $0001
TSX
TXA
INH
INH
95
9F
2
1
fp
p
– 1 1 – – – – –
– 1 1 – – – – –
Transfer X (Index Reg. Low) to Accumulator
A ← (X)
MC9S08DZ128 Series Data Sheet, Rev. 1
160
Freescale Semiconductor
Chapter 7 Central Processor Unit (S08CPUV5)
Table 7-2. Instruction Set Summary (Sheet 9 of 9)
Affect
on CCR
Source
Form
Cyc-by-Cyc
Details
Operation
Object Code
V 1 1 H I N Z C
Transfer Index Reg. to SP
SP ← (H:X) – $0001
TXS
INH
INH
94
8F
2
fp
– 1 1 – – – – –
Enable Interrupts; Wait for Interrupt
I bit ← 0; Halt CPU
WAIT
2+ fp...
– 1 1 – 0 – – –
Source Form: Everything in the source forms columns, except expressions in italic characters, is literal information which must appear in the
assembly source file exactly as shown. The initial 3- to 5-letter mnemonic and the characters (# , ( ) and +) are always a literal characters.
n
opr8i
Any label or expression that evaluates to a single integer in the range 0-7.
Any label or expression that evaluates to an 8-bit immediate value.
opr16i Any label or expression that evaluates to a 16-bit immediate value.
opr8a Any label or expression that evaluates to an 8-bit direct-page address ($00xx).
opr16a Any label or expression that evaluates to a 16-bit address.
oprx8 Any label or expression that evaluates to an unsigned 8-bit value, used for indexed addressing.
oprx16 Any label or expression that evaluates to a 16-bit value, used for indexed addressing.
rel Any label or expression that refers to an address that is within –128 to +127 locations from the start of the next instruction.
Operation Symbols:
Accumulator
CCR Condition code register
Addressing Modes:
A
DIR Direct addressing mode
EXT Extended addressing mode
IMM Immediate addressing mode
INH Inherent addressing mode
H
Index register high byte
Memory location
Any bit
M
n
IX
Indexed, no offset addressing mode
opr
PC
Operand (one or two bytes)
Program counter
IX1
IX2
IX+
Indexed, 8-bit offset addressing mode
Indexed, 16-bit offset addressing mode
Indexed, no offset, post increment addressing mode
PCH Program counter high byte
PCL Program counter low byte
rel
IX1+ Indexed, 8-bit offset, post increment addressing mode
REL Relative addressing mode
SP1 Stack pointer, 8-bit offset addressing mode
SP2 Stack pointer 16-bit offset addressing mode
Relative program counter offset byte
Stack pointer
SP
SPL Stack pointer low byte
X
&
|
⊕
( )
+
–
×
÷
#
Index register low byte
Logical AND
Logical OR
Logical EXCLUSIVE OR
Contents of
Add
Subtract, Negation (two’s complement)
Multiply
Divide
Immediate value
Loaded with
Concatenated with
Cycle-by-Cycle Codes:
f
Free cycle. This indicates a cycle where the CPU
does not require use of the system buses. An f
cycle is always one cycle of the system bus clock
and is always a read cycle.
p
Program fetch; read from next consecutive
location in program memory
r
s
u
v
w
Read 8-bit operand
Push (write) one byte onto stack
Pop (read) one byte from stack
Read vector from $FFxx (high byte first)
Write 8-bit operand
←
:
CCR Bits:
CCR Effects:
V
H
I
N
Z
C
Overflow bit
Half-carry bit
Interrupt mask
Negative bit
Zero bit
↕
Set or cleared
Not affected
Undefined
–
U
Carry/borrow bit
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
161
Chapter 7 Central Processor Unit (S08CPUV5)
Table 7-3. Opcode Map (Sheet 1 of 2)
Bit-Manipulation
10
Branch
20
Read-Modify-Write
Control
Register/Memory
00
5
5
3
30
5
40
1
50
1
60
5
70
4
80
9
90
3
A0
2
B0
3
C0
4
D0
4
E0
3
F0
3
BRSET0 BSET0
3
01
BRA
NEG
NEGA
NEGX
NEG
NEG
RTI
INH
6
BGE
REL
3
SUB
SUB
SUB
SUB
SUB
SUB
DIR
5
2
11
DIR
5
2
21
REL
3
2
DIR
5
1
INH
4
1
INH
4
2
IX1
5
1
IX
5
1
81
2
91
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
31
41
51
61
71
A1
B1
C1
D1
E1
F1
BRCLR0 BCLR0
BRN
REL
3
CBEQ CBEQA CBEQX CBEQ
CBEQ
RTS
BLT
REL
3
CMP
CMP
CMP
CMP
CMP
CMP
3
DIR
5
2
DIR
5
2
22
3
DIR
5
3
IMM
5
3
IMM
6
3
IX1+
1
2
IX+
1
1
82
INH
2
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
02
12
32
42
52
62
72
5+ 92
A2
B2
C2
D2
E2
F2
BRSET1 BSET1
BHI
REL
3
LDHX
MUL
INH
1
DIV
INH
1
NSA
INH
5
DAA
INH
4
BGND
BGT
REL
3
SBC
SBC
SBC
SBC
SBC
SBC
3
DIR
5
2
DIR
5
2
23
3
EXT
5
1
43
1
53
1
63
1
73
1
INH
2
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
03
13
33
83
11 93
A3
B3
C3
D3
E3
F3
BRCLR1 BCLR1
BLS
REL
3
COM
COMA
COMX
COM
COM
SWI
INH
1
BLE
REL
2
CPX
CPX
CPX
CPX
CPX
CPX
3
DIR
5
2
DIR
5
2
24
2
DIR
5
1
INH
1
INH
2
IX1
5
1
IX
4
1
84
2
94
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
04
14
34
44
1
54
1
64
74
A4
B4
C4
D4
E4
F4
BRSET2 BSET2
BCC
REL
3
LSR
DIR
4
LSRA
LSRX
LSR
LSR
TAP
INH
1
TXS
INH
2
AND
AND
AND
AND
AND
AND
3
DIR
5
2
DIR
5
2
25
2
35
1
INH
3
1
INH
4
2
65
IX1
3
1
75
IX
5
1
85
1
95
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
05
15
45
55
A5
B5
C5
D5
E5
F5
BRCLR2 BCLR2
BCS
STHX
LDHX
LDHX
CPHX
CPHX
TPA
TSX
BIT
BIT
BIT
BIT
BIT
BIT
LDA
STA
3
DIR
5
2
DIR
5
2
26
REL
3
2
DIR
5
3
IMM
1
2
DIR
1
3
IMM
5
2
DIR
4
1
86
INH
3
1
96
INH
5
2
A6
IMM
2
2
B6
DIR
3
3
C6
EXT
4
3
D6
IX2
4
2
E6
IX1
3
1
F6
IX
3
06
16
36
ROR
46
56
66
ROR
76
ROR
BRSET3 BSET3
BNE
REL
3
BEQ
REL
3
RORA
RORX
PULA
STHX
EXT
1
TAX
INH
1
LDA
IMM
2
AIS
IMM
2
LDA
DIR
3
STA
DIR
3
LDA
EXT
4
STA
EXT
4
LDA
IX2
4
STA
IX2
4
LDA
IX1
3
STA
IX1
3
3
07
DIR
5
2
17
DIR
5
2
27
2
DIR
5
1
INH
1
INH
2
IX1
5
1
IX
4
1
87
INH
2
3
97
2
A7
2
B7
3
C7
3
D7
2
E7
1
F7
IX
2
37
47
1
57
1
67
77
BRCLR3 BCLR3
ASR
ASRA
ASRX
ASR
ASR
PSHA
3
08
DIR
5
2
18
DIR
5
2
28
2
DIR
5
1
INH
1
1
INH
1
2
IX1
5
1
IX
4
1
88
INH
3
1
98
2
A8
2
B8
3
C8
3
D8
2
E8
1
F8
IX
3
38
48
58
68
78
BRSET4 BSET4
BHCC
LSL
DIR
5
LSLA
LSLX
LSL
IX1
5
LSL
PULX
CLC
INH
1
EOR
EOR
EOR
EOR
EOR
EOR
3
DIR
5
2
DIR
5
2
REL
2
39
1
INH
1
1
INH
1
2
69
1
79
IX
4
1
INH
2
1
99
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
09
19
29
3
49
59
89
A9
B9
C9
D9
E9
F9
BRCLR4 BCLR4
BHCS
ROL
ROLA
ROLX
ROL
ROL
PSHX
SEC
ADC
ADC
ADC
ADC
ADC
ADC
3
DIR
5
2
DIR
5
2
REL
3
2
DIR
5
1
INH
1
1
INH
1
2
IX1
5
1
IX
4
1
INH
3
1
INH
1
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
0A
1A
2A
3A
4A
5A
6A
7A
8A
9A
AA
BA
CA
DA
EA
FA
BRSET5 BSET5
BPL
REL
3
DEC
DECA
DECX
DEC
DEC
PULH
CLI
INH
1
ORA
ORA
ORA
ORA
ORA
ORA
3
DIR
5
2
DIR
5
2
2B
2
DIR
7
1
INH
1
INH
2
IX1
7
1
IX
6
1
INH
2
1
9B
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
0B
1B
3B
4B
4
5B
4
6B
7B
8B
AB
BB
CB
DB
EB
FB
BRCLR5 BCLR5
BMI
REL
3
DBNZ
DBNZA DBNZX
DBNZ
DBNZ
PSHH
SEI
INH
1
ADD
ADD
ADD
ADD
ADD
ADD
3
DIR
5
2
DIR
5
2
2C
3
DIR
5
2
INH
1
2
INH
1
3
IX1
5
2
IX
4
1
INH
1
9C
2
IMM
8
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
0C
1C
3C
4C
5C
6C
7C
8C
1
AC
BC
CC
DC
EC
FC
BRSET6 BSET6
BMC
INC
DIR
4
INCA
INCX
INC
IX1
4
INC
CLRH
RSP
CALL
JMP
JMP
JMP
JMP
JMP
3
DIR
5
2
DIR
5
2
REL
3
2
3D
1
INH
1
1
INH
1
2
6D
1
7D
IX
3
1
INH
7
1
INH
1
4
EXT
5
2
DIR
5
3
EXT
6
3
IX2
6
2
IX1
5
1
IX
5
0D
1D
2D
4D
5D
8D
9D
AD
BD
CD
DD
ED
FD
BRCLR6 BCLR6
BMS
TST
DIR
6
TSTA
TSTX
TST
IX1
4
TST
RTC
NOP
BSR
JSR
JSR
JSR
JSR
JSR
3
DIR
5
2
DIR
5
2
REL
3
2
3E
1
INH
5
1
INH
5
2
6E
1
7E
IX
5
1
INH
1
INH
2
REL
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
0E
1E
2E
4E
5E
8E
2+ 9E
AE
BE
CE
DE
EE
FE
BRSET7 BSET7
BIL
CPHX
MOV
MOV
MOV
MOV
STOP
Page 2
LDX
LDX
LDX
LDX
LDX
LDX
3
DIR
5
2
DIR
5
2
2F
REL
3
3
EXT
3
DD
1
2
DIX+
1
3
IMD
5
2
IX+D
4
1
INH
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
FF
IX
2
0F
1F
3F
5
4F
5F
6F
7F
1
8F
2+ 9F
1
AF
BF
STX
CF
STX
DF
STX
EF
STX
BRCLR7 BCLR7
BIH
REL
CLR
CLRA
CLRX
CLR
CLR
WAIT
TXA
AIX
STX
3
DIR
2
DIR
2
2
DIR
1
INH
1
INH
2
IX1
IX
1
INH
1
INH
2
IMM
2
DIR
3
EXT
3
IX2
2
IX1
1
IX
INH
IMM
DIR
EXT
DD
Inherent
REL
IX
IX1
IX2
IMD
Relative
SP1
SP2
IX+
Stack Pointer, 8-Bit Offset
Stack Pointer, 16-Bit Offset
Indexed, No Offset with
Post Increment
Indexed, 1-Byte Offset with
Post Increment
Immediate
Direct
Indexed, No Offset
Indexed, 8-Bit Offset
Indexed, 16-Bit Offset
IMM to DIR
Extended
DIR to DIR
IX+D IX+ to DIR
IX1+
DIX+ DIR to IX+
Opcode in
F0
3
HCS08 Cycles
Instruction Mnemonic
Addressing Mode
Hexadecimal
SUB
Number of Bytes
1
IX
MC9S08DZ128 Series Data Sheet, Rev. 1
162
Freescale Semiconductor
Chapter 7 Central Processor Unit (S08CPUV5)
Table 7-3. Opcode Map (Sheet 2 of 2)
Bit-Manipulation
Branch
Read-Modify-Write
9E60
Control
Register/Memory
6
9ED0
SUB
5
9EE0
4
NEG
SUB
3
SP1
6
4
SP2
5
3
SP1
4
9E61
9ED1
9EE1
CBEQ
CMP
CMP
4
SP1
4
SP2
5
3
SP1
4
9ED2
9EE2
SBC
SBC
4
SP2
5
3
SP1
4
9E63
6
9ED3
9EE3
6
COM
CPX
CPX
3
SP1
6
4
SP2
5
3
SP1
4
SP1
9E64
9ED4
9EE4
LSR
SP1
AND
AND
3
4
SP2
5
3
SP1
4
9ED5
9EE5
BIT
BIT
4
SP2
5
3
SP1
4
9E66
6
9ED6
9EE6
ROR
LDA
LDA
3
SP1
6
4
SP2
5
3
SP1
4
9E67
9ED7
9EE7
ASR
STA
STA
3
SP1
6
4
SP2
5
3
SP1
4
9E68
9ED8
9EE8
LSL
EOR
EOR
3
SP1
6
4
SP2
5
3
SP1
4
9E69
9ED9
9EE9
ROL
ADC
ADC
3
SP1
6
4
SP2
5
3
SP1
4
9E6A
9EDA
9EEA
DEC
ORA
ORA
3
SP1
8
4
SP2
5
3
SP1
4
9E6B
9EDB
9EEB
DBNZ
ADD
SP2
ADD
SP1
4
SP1
4
3
9E6C
6
INC
3
SP1
5
9E6D
TST
SP1
3
9EAE
5
6
5
5
4
5
LDHX
2
IX
IX2
IX1
SP1
5
9E6F
6
CLR
STX
SP2
STX
SP1
STHX
3
SP1
4
3
3
SP1
INH
Inherent
Immediate
Direct
REL
IX
IX1
IX2
IMD
Relative
SP1
SP2
IX+
Stack Pointer, 8-Bit Offset
Stack Pointer, 16-Bit Offset
Indexed, No Offset with
Post Increment
Indexed, 1-Byte Offset with
Post Increment
IMM
DIR
EXT
DD
Indexed, No Offset
Indexed, 8-Bit Offset
Indexed, 16-Bit Offset
IMM to DIR
Extended
DIR to DIR
IX1+
IX+D IX+ to DIR
DIX+ DIR to IX+
Note: All Sheet 2 Opcodes are Preceded by the Page 2 Prebyte (9E)
Prebyte (9E) and Opcode in
Hexadecimal
9E60
3
6
HCS08 Cycles
Instruction Mnemonic
Addressing Mode
NEG
Number of Bytes
SP1
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
163
Chapter 7 Central Processor Unit (S08CPUV5)
MC9S08DZ128 Series Data Sheet, Rev. 1
164
Freescale Semiconductor
Chapter 8
Multi-Purpose Clock Generator (S08MCGV2)
8.1
Introduction
The multi-purpose clock generator (MCG) module provides several clock source choices for the MCU.
The module contains a frequency-locked loop (FLL) and a phase-locked loop (PLL) that are controllable
by either an internal or an external reference clock. The module can select either of the FLL or PLL clocks,
or either of the internal or external reference clocks as a source for the MCU system clock. Whichever
clock source is chosen, it is passed through a reduced bus divider which allows a lower output clock
frequency to be derived. The MCG also controls an external oscillator (XOSC) for the use of a crystal or
resonator as the external reference clock.
All devices in the MC9S08DZ128 Series feature the MCG module.
NOTE
Refer to Section 1.3, “System Clock Distribution,” for detailed view of the
distribution of clock sources throughout the chip.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
165
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
PTA7/PIA7/ADP7/IRQ
PTA6/PIA6/ADP6
PTA5/PIA5/ADP5
HCS08 CORE
DEBUG MODULE (DBG)
CPU
BKGD/MS
RESET
PTA4/PIA4/ADP4
ACMP1O
ACMP1-
ACMP1+
BDC
BKP
PTA3/PIA3/ADP3/ACMP1O
PTA2/PIA2/ADP2/ACMP1-
PTA1/PIA1/ADP1/ACMP1+
PTA0/PIA0/ADP0/MCLK
ANALOG COMPARATOR
(ACMP1)
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
REAL-TIME COUNTER (RTC)
PTB7/PIB7/ADP15
PTB6/PIB6/ADP14
PTB5/PIB5/ADP13
PTB4/PIB4/ADP12
PTB3/PIB3/ADP11
PTB2/PIB2/ADP10
PTB1/PIB1/ADP9
PTB0/PIB0/ADP8
COP
INT
LVD
IRQ
V
DD
8
VOLTAGE
REGULATOR
V
SS
V
REFH
ADP7-ADP0
24-CHANNEL,12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
V
REFL
●
●
●
●
●
●
●
●
PTC7/ADP23
PTC6/ADP22
PTC5/ADP21
PTC4/ADP20
PTC3/ADP19
PTC2/ADP18
PTC1/ADP17
PTC0/ADP16
V
DDA
ADP15-ADP8
ADP23-ADP16
V
SSA
USER MEMORY
FLASH _EEPROM _RAM
MC9S08DZ128 = 128K_2K_8K
MC9S08DZ96 = 96K_2K_6K
MC9S08DV128 = 128K_0K_6K
MC9S08DV96 = 96K_0K_4K
TPM1CH5 -
6-CHANNEL TIMER/PWM TPM1CH0
TPM1CLK
PTJ7/PIJ7/TPM3CLK
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTD1/PID1/TPM2CH1
PTD0/PID0/TPM2CH0
TPM3CLK
6
PTJ6/PIJ6
PTJ5/PIJ5
PTJ4/PIJ4
MODULE (TPM1)
TPM2CH1,
TPM2CH0
TPM2CLK
TPM3CH0 -
TPM3CH3
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTJ3/PIJ3/TMP3CH3
PTJ2/PIJ2/TPM3CH2
PTJ1/PIJ1/TPM3CH1
PTJ0/PIJ0/TMP3CH0
4-CHANNEL TIMER/PWM
MODULE (TPM3)
4
RxCAN
TXCAN
MISO1
PTK7
PTK6
PTK5
PTK4
PTK3
PTK2
PTK1
PTK0
CONTROLLER AREA
NETWORK (MSCAN)
PTE7/RxD2/RXCAN
PTE6/TxD2/TXCAN
PTE5/SDA1/MISO1
PTE4/SCL1/MOSI1
PTE3/SPSCK1
PTE2/SS1
MOSI1
SPSCK1
SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
SS1
RxD1
TxD1
PTE1/RxD1
SERIAL COMMUNICATIONS
INTERFACE (SCI1)
PTE0/TxD1
●
●
PTL7
PTL6
PTL5
PTL4
PTL3
PTL2
PTL1
PTL0
PTF7
ACMP2O
ACMP2-
ACMP2+
SDA1
PTF6/ACMP2O
PTF5/ACMP2-
PTF4/ACMP2+
PTF3/TPM2CLK/SDA1
PTF2/TPM1CLK/SCL1
PTF1/RxD2
ANALOG COMPARATOR
(ACMP2)
SCL1
IIC MODULE (IIC1)
RxD2
TxD2
SERIAL COMMUNICATIONS
INTERFACE (SCI2)
PTF0/TxD2
SDA2
SCL2
PTH7
PTH6
PTG7/SDA2
PTG6/SCL2
PTG5
IIC MODULE (IIC2)
●
●
●
●
PTH5
MULTI-PURPOSE
CLOCK
GENERATOR
(MCG)
PTH4
MISO2
PTG4
PTG3
PTH3/MISO2
PTH2/MOSI2
PTH1/SPSCK2
PTH0/SS2
MOSI2
SPSCK2
SERIAL PERIPHERAL
PTG2
XTAL
EXTAL
INTERFACE MODULE (SPI2)
OSCILLATOR
(XOSC)
SS2
PTG1/XTAL
PTG0/EXTAL
- Pin not connected in 64-pin and 48-pin packages ● - Pin not available in the 48-pin package
- In 48-pin package, VDDA and VREFH are internally connected to each other and VSSA and VREFL are internally connected to each other.
Figure 8-1. MC9S08DZ128 Block Diagram with MCG Highlighted
MC9S08DZ128 Series Data Sheet, Rev. 1
166
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.1.1
Features
Key features of the MCG module are:
•
Frequency-locked loop (FLL)
— Internal or external reference can be used to control the FLL
Phase-locked loop (PLL)
•
— Voltage-controlled oscillator (VCO)
— Modulo VCO frequency divider
— Phase/Frequency detector
— Integrated loop filter
— Lock detector with interrupt capability
Internal reference clock
•
•
— Nine trim bits for accuracy
— Can be selected as the clock source for the MCU
External reference clock
— Control for external oscillator
— Clock monitor with reset capability
— Can be selected as the clock source for the MCU
Reference divider is provided
•
•
•
Clock source selected can be divided down by 1, 2, 4, or 8
BDC clock (MCGLCLK) is provided as a constant divide by 2 of the DCO output whether in an
FLL or PLL mode.
•
•
Two selectable digitally controlled oscillators (DCOs) optimized for different frequency ranges.
Option to maximize DCO output frequency for a 32,768 Hz external reference clock source.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
167
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
External Reference
Clock (XOSC)
MCGERCLK
MCGIRCLK
ERCLKEN
IRCLKEN
EREFS
CME
EREFSTEN
HGO
Clock
Monitor
CLKS
BDIV
RANGE
n
/ 2
MCGOUT
n=0-3
DMX32
OSCINIT
DIV32
LOC
FLL
DCOM
DCOOUT
LP
Filter
Lock
Detector
DCOL
RDIV
PLLS
/ 2
LOLS LOCK
DRS
LP
MCGFFCLK
MCGFFCLKVALID
MCGLCLK
n
/ 2
5
/ 2
n=0-7
IREFS
IREFSTEN
Charge
Pump
Phase
Detector
VCO
Internal
Reference
Clock
Internal
Filter
VDIV
VCOOUT
/(4,8,12,...,40)
TRIM
FTRIM
PLL
Multi-purpose Clock Generator (MCG)
IREFST CLKST OSCINIT
DRST
Figure 8-2. Multi-Purpose Clock Generator (MCG) Block Diagram
MC9S08DZ128 Series Data Sheet, Rev. 1
168
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.1.2
Modes of Operation
There are several modes of operation for the MCG:
•
•
•
•
•
•
•
•
•
FLL Engaged Internal (FEI)
FLL Engaged External (FEE)
FLL Bypassed Internal (FBI)
FLL Bypassed External (FBE)
PLL Engaged External (PEE)
PLL Bypassed External (PBE)
Bypassed Low Power Internal (BLPI)
Bypassed Low Power External (BLPE)
Stop
For details see Section 8.4.1, “Operational Modes.
8.2
External Signal Description
There are no MCG signals that connect off chip.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
169
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.3
Register Definition
8.3.1
MCG Control Register 1 (MCGC1)
7
6
5
4
3
2
1
0
R
W
CLKS
RDIV
IREFS
IRCLKEN IREFSTEN
Reset:
0
0
0
0
0
1
0
0
Figure 8-3. MCG Control Register 1 (MCGC1)
Table 8-1. MCG Control Register 1 Field Descriptions
Description
Field
7:6
CLKS
Clock Source Select — Selects the system clock source.
00 Encoding 0 — Output of FLL or PLL is selected.
01 Encoding 1 — Internal reference clock is selected.
10 Encoding 2 — External reference clock is selected.
11 Encoding 3 — Reserved, defaults to 00.
5:3
RDIV
External Reference Divider — Selects the amount to divide down the external reference clock. If the FLL is
selected, the resulting frequency must be in the range 31.25 kHz to 39.0625 kHz. If the PLL is selected, the
resulting frequency must be in the range 1 MHz to 2 MHz. See Table 8-2 and Table 8-3 for the divide-by factors.
2
Internal Reference Select — Selects the reference clock source.
1 Internal reference clock selected
IREFS
0 External reference clock selected
1
Internal Reference Clock Enable — Enables the internal reference clock for use as MCGIRCLK.
IRCLKEN 1 MCGIRCLK active
0 MCGIRCLK inactive
0
Internal Reference Stop Enable — Controls whether or not the internal reference clock remains enabled when
IREFSTEN the MCG enters stop mode.
1 Internal reference clock stays enabled in stop if IRCLKEN is set or if MCG is in FEI, FBI, or BLPI mode before
entering stop
0 Internal reference clock is disabled in stop
MC9S08DZ128 Series Data Sheet, Rev. 1
170
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
Table 8-2. FLL External Reference Divide Factor
Divide Factor
RDIV
RANGE:DIV32
0:X
RANGE:DIV32
1:0
RANGE:DIV32
1:1
0
1
2
3
4
5
6
7
1
2
1
2
32
64
4
4
128
8
8
256
16
32
64
128
16
32
64
128
512
1024
Reserved
Reserved
Table 8-3. PLL External Reference Divide Factor
RDIV
Divide Factor
0
1
2
3
4
5
6
7
1
2
4
8
16
32
64
128
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
171
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.3.2
MCG Control Register 2 (MCGC2)
7
6
5
4
3
2
1
0
R
BDIV
RANGE
HGO
LP
EREFS
ERCLKEN EREFSTEN
W
Reset:
0
1
0
0
0
0
0
0
Figure 8-4. MCG Control Register 2 (MCGC2)
Table 8-4. MCG Control Register 2 Field Descriptions
Description
Field
7:6
BDIV
Bus Frequency Divider — Selects the amount to divide down the clock source selected by the CLKS bits in the
MCGC1 register. This controls the bus frequency.
00 Encoding 0 — Divides selected clock by 1
01 Encoding 1 — Divides selected clock by 2 (reset default)
10 Encoding 2 — Divides selected clock by 4
11 Encoding 3 — Divides selected clock by 8
5
Frequency Range Select — Selects the frequency range for the external oscillator or external clock source.
RANGE
1 High frequency range selected for the external oscillator of 1 MHz to 16 MHz (1 MHz to 40 MHz for external
clock source)
0 Low frequency range selected for the external oscillator of 32 kHz to 100 kHz (32 kHz to 1 MHz for external
clock source)
4
High Gain Oscillator Select — Controls the external oscillator mode of operation.
1 Configure external oscillator for high gain operation
HGO
0 Configure external oscillator for low power operation
3
LP
Low Power Select — Controls whether the FLL (or PLL) is disabled in bypassed modes.
1 FLL (or PLL) is disabled in bypass modes (lower power).
0 FLL (or PLL) is not disabled in bypass modes.
2
External Reference Select — Selects the source for the external reference clock.
1 Oscillator requested
EREFS
0 External Clock Source requested
1
External Reference Enable — Enables the external reference clock for use as MCGERCLK.
ERCLKEN 1 MCGERCLK active
0 MCGERCLK inactive
0
External Reference Stop Enable — Controls whether or not the external reference clock remains enabled when
EREFSTEN the MCG enters stop mode.
1 External reference clock stays enabled in stop if ERCLKEN is set or if MCG is in FEE, FBE, PEE, PBE, or
BLPE mode before entering stop
0 External reference clock is disabled in stop
MC9S08DZ128 Series Data Sheet, Rev. 1
172
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.3.3
MCG Trim Register (MCGTRM)
7
6
5
4
3
2
1
0
R
TRIM1
W
Figure 8-5. MCG Trim Register (MCGTRM)
1
A value for TRIM is loaded during reset from a factory programmed location when not in any BDM mode. If in a BDM
mode, a default value of 0x80 is loaded.
Table 8-5. MCG Trim Register Field Descriptions
Field
Description
7:0
TRIM
MCG Trim Setting — Controls the internal reference clock frequency by controlling the internal reference clock
period. The TRIM bits are binary weighted (i.e., bit 1 will adjust twice as much as bit 0). Increasing the binary
value in TRIM will increase the period, and decreasing the value will decrease the period.
An additional fine trim bit is available in MCGSC as the FTRIM bit.
If a TRIM[7:0] value stored in nonvolatile memory is to be used, it’s the user’s responsibility to copy that value
from the nonvolatile memory location to this register.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
173
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.3.4
MCG Status and Control Register (MCGSC)
7
6
5
4
3
2
1
0
R
W
LOLS
LOCK
PLLST
IREFST
CLKST
OSCINIT
FTRIM1
Reset:
0
0
0
1
0
0
0
Figure 8-6. MCG Status and Control Register (MCGSC)
1
A value for FTRIM is loaded during reset from a factory programmed location when not in any BDM mode. If in a BDM
mode, a default value of 0x0 is loaded.
Table 8-6. MCG Status and Control Register Field Descriptions
Field
Description
7
Loss of Lock Status — This bit is a sticky indication of lock status for the FLL or PLL. LOLS is set when lock
detection is enabled and after acquiring lock, the FLL or PLL output frequency has fallen outside the lock exit
frequency tolerance, Dunl. LOLIE determines whether an interrupt request is made when set. LOLS is cleared by
reset or by writing a logic 1 to LOLS when LOLS is set. Writing a logic 0 to LOLS has no effect.
0 FLL or PLL has not lost lock since LOLS was last cleared.
LOLS
1 FLL or PLL has lost lock since LOLS was last cleared.
6
Lock Status — Indicates whether the FLL or PLL has acquired lock. Lock detection is disabled when both the
FLL and PLL are disabled. If the lock status bit is set, changing the value of DMX32, DRS and IREFS bits in FBE,
FBI, FEE and FEI modes; DIV32 bit in FBE and FEE modes; TRIM[7:0] bits in FBI and FEI modes; RDIV[2:0]
bits in FBE, FEE, PBE and PEE modes; VDIV[3:0] bits in PBE and PEE modes; and PLLS bit, causes the lock
status bit to clear and stay clear until the FLL or PLL has reacquired lock. Entry into BLPI, BLPE or stop mode
also causes the lock status bit to clear and stay cleared until the exit of these modes and the FLL or PLL has
reacquired lock.
LOCK
0 FLL or PLL is currently unlocked.
1 FLL or PLL is currently locked.
5
PLL Select Status — The PLLST bit indicates the current source for the PLLS clock. The PLLST bit does not
update immediately after a write to the PLLS bit due to internal synchronization between clock domains.
0 Source of PLLS clock is FLL clock.
PLLST
1 Source of PLLS clock is PLL clock.
4
Internal Reference Status — The IREFST bit indicates the current source for the reference clock. The IREFST
bit does not update immediately after a write to the IREFS bit due to internal synchronization between clock
domains.
IREFST
0 Source of reference clock is external reference clock (oscillator or external clock source as determined by the
EREFS bit in the MCGC2 register).
1 Source of reference clock is internal reference clock.
3:2
CLKST
Clock Mode Status — The CLKST bits indicate the current clock mode. The CLKST bits do not update
immediately after a write to the CLKS bits due to internal synchronization between clock domains.
00 Encoding 0 — Output of FLL is selected.
01 Encoding 1 — Internal reference clock is selected.
10 Encoding 2 — External reference clock is selected.
11 Encoding 3 — Output of PLL is selected.
MC9S08DZ128 Series Data Sheet, Rev. 1
174
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
Table 8-6. MCG Status and Control Register Field Descriptions (continued)
Field
Description
1
OSC Initialization — If the external reference clock is selected by ERCLKEN or by the MCG being in FEE, FBE,
PEE, PBE, or BLPE mode, and if EREFS is set, then this bit is set after the initialization cycles of the external
oscillator clock have completed. This bit is only cleared when either EREFS is cleared or when the MCG is in
either FEI, FBI, or BLPI mode and ERCLKEN is cleared.
OSCINIT
0
MCG Fine Trim — Controls the smallest adjustment of the internal reference clock frequency. Setting FTRIM
FTRIM
will increase the period and clearing FTRIM will decrease the period by the smallest amount possible.
If an FTRIM value stored in nonvolatile memory is to be used, it’s the user’s responsibility to copy that value from
the nonvolatile memory location to this register’s FTRIM bit.
8.3.5
MCG Control Register 3 (MCGC3)
7
6
5
4
3
2
1
0
R
LOLIE
PLLS
CME
DIV32
VDIV
W
Reset:
0
0
0
0
0
0
0
1
Figure 8-7. MCG Control Register 3 (MCGC3)
Table 8-7. MCG Control Register 3 Field Descriptions
Description
Field
7
Loss of Lock Interrupt Enable — Determines if an interrupt request is made following a loss of lock indication.
The LOLIE bit only has an effect when LOLS is set.
LOLIE
0 No request on loss of lock.
1 Generate an interrupt request on loss of lock.
6
PLL Select — Controls whether the PLL or FLL is selected. If the PLLS bit is clear, the PLL is disabled in all
PLLS
modes. If the PLLS is set, the FLL is disabled in all modes.
1 PLL is selected
0 FLL is selected
5
CME
Clock Monitor Enable — Determines if a reset request is made following a loss of external clock indication. The
CME bit should only be set to a logic 1 when either the MCG is in an operational mode that uses the external
clock (FEE, FBE, PEE, PBE, or BLPE) or the external reference is enabled (ERCLKEN=1 in the MCGC2
register). Whenever the CME bit is set to a logic 1, the value of the RANGE bit in the MCGC2 register should not
be changed.
0 Clock monitor is disabled.
1 Generate a reset request on loss of external clock.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
175
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
Table 8-7. MCG Control Register 3 Field Descriptions (continued)
Field
Description
4
Divide-by-32 Enable — Controls an additional divide-by-32 factor to the external reference clock for the FLL
DIV32
when RANGE bit is set. When the RANGE bit is 0, this bit has no effect. Writes to this bit are ignored if PLLS bit
is set.
0 Divide-by-32 is disabled.
1 Divide-by-32 is enabled when RANGE=1.
3:0
VDIV
VCO Divider — Selects the amount to divide down the VCO output of PLL. The VDIV bits establish the
multiplication factor (M) applied to the reference clock frequency.
0000 Encoding 0 — Reserved.
0001 Encoding 1 — Multiply by 4.
0010 Encoding 2 — Multiply by 8.
0011 Encoding 3 — Multiply by 12.
0100 Encoding 4 — Multiply by 16.
0101 Encoding 5 — Multiply by 20.
0110 Encoding 6 — Multiply by 24.
0111 Encoding 7 — Multiply by 28.
1000 Encoding 8 — Multiply by 32.
1001 Encoding 9 — Multiply by 36.
1010 Encoding 10 — Multiply by 40.
1011 Encoding 11 — Reserved (default to M=40).
11xx Encoding 12-15 — Reserved (default to M=40).
MC9S08DZ128 Series Data Sheet, Rev. 1
176
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.3.6
MCG Test and Control Register (MCGT)
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
DRST
DMX32
DRS
1
Reset:
0
0
0
0
0
0
0
Figure 8-8. MCG Test and Control Register (MCGT)
Table 8-8. MCG Test and Control Register Field Descriptions
Description
dco_select
Field
7:6
Reserved for test, user code should not write 1’s to these bits.
5
DCO Maximum frequency with 32.768 kHz reference — The DMX32 bit controls whether or not the DCO
frequency range is narrowed to its maximum frequency with a 32.768 kHz reference. See Table 8-9.
0 DCO has default range of 25%.
DMX32
1 DCO is fined tuned for maximum frequency with 32.768 kHz reference.
4:1
Reserved for test, user code should not write 1’s to these bits.
0
DCO Range Status — The DRST read bit indicates the current frequency range for the FLL output, DCOOUT.
See Table 8-9. The DRST bit does not update immediately after a write to the DRS field due to internal
synchronization between clock domains. The DRST bit is not valid in BLPI, BLPE, PBE or PEE mode and it reads
zero regardless of the DCO range selected by the DRS bit.
DRST
DRS
DCO Range Select — The DRS bit selects the frequency range for the FLL output, DCOOUT. Writes to the DRS
bit while either the LP or PLLS bit is set are ignored.
0 Low range.
1 Mid range.
1
Table 8-9. DCO frequency range
DRS DMX32
Reference range
31.25 - 39.0625 kHz
32.768 kHz
FLL factor
512
DCO range
16 - 20 MHz
19.92 MHz
32 - 40 MHz
39.85 MHz
0
0
1
1
608
0
31.25 - 39.0625 kHz
32.768 kHz
1024
1
1216
1
The resulting bus clock frequency should not exceed the maximum specified bus
clock frequency of the device.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
177
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.4
Functional Description
8.4.1
Operational Modes
IREFS=1
CLKS=00
PLLS=0
IREFS=0
CLKS=00
PLLS=0
FLL Engaged
Internal (FEI)
FLL Engaged
External (FEE)
IREFS=1
CLKS=01
PLLS=0
BDM Enabled
or LP=0
IREFS=0
CLKS=10
PLLS=0
BDM Enabled
or LP=0
FLL Bypassed
Internal (FBI)
FLL Bypassed
External (FBE)
Bypassed
Low Power
External (BLPE)
Bypassed
Low Power
Internal (BLPI)
IREFS=0
CLKS=10
BDM Disabled
and LP=1
IREFS=1
CLKS=01
PLLS=0
BDM Disabled
and LP=1
PLL Bypassed
External (PBE)
IREFS=0
CLKS=10
PLLS=1
BDM Enabled
or LP=0
IREFS=0
CLKS=00
PLLS=1
PLL Engaged
External (PEE)
Returns to state that was active
before MCU entered stop, unless
RESET occurs while in stop.
Entered from any state
when MCU enters stop
Stop
Figure 8-9. Clock Switching Modes
MC9S08DZ128 Series Data Sheet, Rev. 1
178
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
The nine states of the MCG are shown as a state diagram and are described below. The arrows indicate the
allowed movements between the states.
8.4.1.1
FLL Engaged Internal (FEI)
FLL engaged internal (FEI) is the default mode of operation and is entered when all the following
conditions occur:
•
•
•
CLKS bits are written to 00
IREFS bit is written to 1
PLLS bit is written to 0
In FLL engaged internal mode, the MCGOUT clock is derived from the FLL clock, which is controlled by
the internal reference clock. The FLL clock frequency locks to a multiplication factor, as selected by the
DRS and DMX32 bits, times the internal reference frequency. The MCGLCLK is derived from the FLL
and the PLL is disabled in a low power state.
8.4.1.2
FLL Engaged External (FEE)
The FLL engaged external (FEE) mode is entered when all the following conditions occur:
•
•
•
•
CLKS bits are written to 00
IREFS bit is written to 0
PLLS bit is written to 0
RDIV bits are written to divide reference clock to be within the range of 31.25 kHz to 39.0625 kHz
In FLL engaged external mode, the MCGOUT clock is derived from the FLL clock which is controlled by
the external reference clock. The external reference clock which is enabled can be an external
crystal/resonator or it can be another external clock source.The FLL clock frequency locks to a
multiplication factor, as selected by the DRS and DMX32 bits, times the external reference frequency, as
selected by the RDIV, RANGE and DIV32 bits. The MCGLCLK is derived from the FLL and the PLL is
disabled in a low power state.
8.4.1.3
FLL Bypassed Internal (FBI)
In FLL bypassed internal (FBI) mode, the MCGOUT clock is derived from the internal reference clock
and the FLL is operational but its output clock is not used. This mode is useful to allow the FLL to acquire
its target frequency while the MCGOUT clock is driven from the internal reference clock.
The FLL bypassed internal mode is entered when all the following conditions occur:
•
•
•
•
CLKS bits are written to 01
IREFS bit is written to 1
PLLS bit is written to 0
LP bit is written to 0
In FLL bypassed internal mode, the MCGOUT clock is derived from the internal reference clock. The FLL
clock is controlled by the internal reference clock, and the FLL clock frequency locks to a multiplication
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
179
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
factor, as selected by the DRS and DMX32 bits, times the internal reference frequency. The MCGLCLK
is derived from the FLL and the PLL is disabled in a low power state.
8.4.1.4
FLL Bypassed External (FBE)
In FLL bypassed external (FBE) mode, the MCGOUT clock is derived from the external reference clock
and the FLL is operational but its output clock is not used. This mode is useful to allow the FLL to acquire
its target frequency while the MCGOUT clock is driven from the external reference clock.
The FLL bypassed external mode is entered when all the following conditions occur:
•
•
•
•
•
CLKS bits are written to 10
IREFS bit is written to 0
PLLS bit is written to 0
RDIV bits are written to divide reference clock to be within the range of 31.25 kHz to 39.0625 kHz
LP bit is written to 0
In FLL bypassed external mode, the MCGOUT clock is derived from the external reference clock. The
external reference clock which is enabled can be an external crystal/resonator or it can be another external
clock source.The FLL clock is controlled by the external reference clock, and the FLL clock frequency
locks to a multiplication factor, as selected by the DRS and DMX32 bits, times the external reference
frequency, as selected by the RDIV, RANGE and DIV32 bits. The MCGLCLK is derived from the FLL
and the PLL is disabled in a low power state.
8.4.1.5
PLL Engaged External (PEE)
The PLL engaged external (PEE) mode is entered when all the following conditions occur:
•
•
•
•
CLKS bits are written to 00
IREFS bit is written to 0
PLLS bit is written to 1
RDIV bits are written to divide reference clock to be within the range of 1 MHz to 2 MHz
In PLL engaged external mode, the MCGOUT clock is derived from the PLL clock which is controlled by
the external reference clock. The external reference clock which is enabled can be an external
crystal/resonator or it can be another external clock source The PLL clock frequency locks to a
multiplication factor, as selected by the VDIV bits, times the external reference frequency, as selected by
the RDIV, RANGE and DIV32 bits. If BDM is enabled then the MCGLCLK is derived from the DCO
(open-loop mode) divided by two. If BDM is not enabled then the FLL is disabled in a low power state.
In this mode, the DRST bit reads 0 regardless of whether the DRS bit is set to 1 or 0.
MC9S08DZ128 Series Data Sheet, Rev. 1
180
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.4.1.6
PLL Bypassed External (PBE)
In PLL bypassed external (PBE) mode, the MCGOUT clock is derived from the external reference clock
and the PLL is operational but its output clock is not used. This mode is useful to allow the PLL to acquire
its target frequency while the MCGOUT clock is driven from the external reference clock.
The PLL bypassed external mode is entered when all the following conditions occur:
•
•
•
•
•
CLKS bits are written to 10
IREFS bit is written to 0
PLLS bit is written to 1
RDIV bits are written to divide reference clock to be within the range of 1 MHz to 2 MHz
LP bit is written to 0
In PLL bypassed external mode, the MCGOUT clock is derived from the external reference clock. The
external reference clock which is enabled can be an external crystal/resonator or it can be another external
clock source. The PLL clock frequency locks to a multiplication factor, as selected by the VDIV bits, times
the external reference frequency, as selected by the RDIV, RANGE and DIV32 bits. If BDM is enabled
then the MCGLCLK is derived from the DCO (open-loop mode) divided by two. If BDM is not enabled
then the FLL is disabled in a low power state.
In this mode, the DRST bit reads 0 regardless of whether the DRS bit is set to 1 or 0.
8.4.1.7
Bypassed Low Power Internal (BLPI)
The bypassed low power internal (BLPI) mode is entered when all the following conditions occur:
•
•
•
•
•
CLKS bits are written to 01
IREFS bit is written to 1
PLLS bit is written to 0
LP bit is written to 1
BDM mode is not active
In bypassed low power internal mode, the MCGOUT clock is derived from the internal reference clock.
The PLL and the FLL are disabled at all times in BLPI mode and the MCGLCLK will not be available for
BDC communications If the BDM becomes active the mode will switch to FLL bypassed internal (FBI)
mode.
In this mode, the DRST bit reads 0 regardless of whether the DRS bit is set to 1 or 0.
8.4.1.8
Bypassed Low Power External (BLPE)
The bypassed low power external (BLPE) mode is entered when all the following conditions occur:
•
•
•
•
CLKS bits are written to 10
IREFS bit is written to 0
PLLS bit is written to 0 or 1
LP bit is written to 1
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
181
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
•
BDM mode is not active
In bypassed low power external mode, the MCGOUT clock is derived from the external reference clock.
The external reference clock which is enabled can be an external crystal/resonator or it can be another
external clock source.
The PLL and the FLL are disabled at all times in BLPE mode and the MCGLCLK will not be available
for BDC communications. If the BDM becomes active the mode will switch to one of the bypassed
external modes as determined by the state of the PLLS bit.
In this mode, the DRST bit reads 0 regardless of whether the DRS bit is set to 1 or 0.
8.4.1.9
Stop
Stop mode is entered whenever the MCU enters a STOP state. In this mode, the FLL and PLL are disabled
and all MCG clock signals are static except in the following cases:
MCGIRCLK will be active in stop mode when all the following conditions occur:
•
•
IRCLKEN = 1
IREFSTEN = 1
MCGERCLK will be active in stop mode when all the following conditions occur:
•
•
ERCLKEN = 1
EREFSTEN = 1
8.4.2
Mode Switching
The IREFS bit can be changed at anytime, but the actual switch to the newly selected clock is shown by
the IREFST bit. When switching between engaged internal and engaged external modes, the FLL or PLL
will begin locking again after the switch is completed.
For the special case of entering stop mode immediately after switching to FBE mode, if the external clock
and the internal clock are disabled in stop mode, (EREFSTEN = 0 and IREFSTEN = 0), it is necessary to
allow 100us after the IREFST bit is cleared to allow the internal reference to shutdown. For most cases the
delay due to instruction execution times will be sufficient.
The CLKS bits can also be changed at anytime, but the actual switch to the newly selected clock is shown
by the CLKST bits. If the newly selected clock is not available, the previous clock will remain selected.
The DRS bits can be changed at anytime except when LP bit is 1. If the DRS bits are changed while in
FLL engaged internal (FEI) or FLL engaged external (FEE), the bus clock remains at the previous DCO
range until the new DCO starts. When the new DCO starts the bus clock switches to it. After switching to
the new DCO the FLL remains unlocked for several reference cycles. Once the selected DCO startup time
is over, the FLL is locked. The completion of the switch is shown by the DRST bits.
For details see Figure 8-9.
MC9S08DZ128 Series Data Sheet, Rev. 1
182
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.4.3
Bus Frequency Divider
The BDIV bits can be changed at anytime and the actual switch to the new frequency will occur
immediately.
8.4.4
Low Power Bit Usage
The low power bit (LP) is provided to allow the FLL or PLL to be disabled and thus conserve power when
these systems are not being used. The DRS bit can not be written while LP bit is 1.However, in some
applications it may be desirable to enable the FLL or PLL and allow it to lock for maximum accuracy
before switching to an engaged mode. Do this by writing the LP bit to 0.
8.4.5
Internal Reference Clock
When IRCLKEN is set the internal reference clock signal will be presented as MCGIRCLK, which can be
used as an additional clock source. The MCGIRCLK frequency can be re-targeted by trimming the period
of the internal reference clock. This can be done by writing a new value to the TRIM bits in the MCGTRM
register. Writing a larger value will decrease the MCGIRCLK frequency, and writing a smaller value to
the MCGTRM register will increase the MCGIRCLK frequency. The TRIM bits will effect the MCGOUT
frequency if the MCG is in FLL engaged internal (FEI), FLL bypassed internal (FBI), or bypassed low
power internal (BLPI) mode. The TRIM and FTRIM value is initialized by POR but is not affected by other
resets.
Until MCGIRCLK is trimmed, programming low reference divider (RDIV) factors may result in
MCGOUT frequencies that exceed the maximum chip-level frequency and violate the chip-level clock
timing specifications (see the Device Overview chapter).
If IREFSTEN and IRCLKEN bits are both set, the internal reference clock will keep running during stop
mode in order to provide a fast recovery upon exiting stop.
8.4.6
External Reference Clock
The MCG module can support an external reference clock with frequencies between 31.25 kHz to 40 MHz
in all modes. When ERCLKEN is set, the external reference clock signal will be presented as
MCGERCLK, which can be used as an additional clock source. When IREFS = 1, the external reference
clock will not be used by the FLL or PLL and will only be used as MCGERCLK. In these modes, the
frequency can be equal to the maximum frequency the chip-level timing specifications will support (see
the Device Overview chapter).
If EREFSTEN and ERCLKEN bits are both set or the MCG is in FEE, FBE, PEE, PBE or BLPE mode,
the external reference clock will keep running during stop mode in order to provide a fast recovery upon
exiting stop.
If CME bit is written to 1, the clock monitor is enabled. If the external reference falls below a certain
frequency (f
or f
depending on the RANGE bit in the MCGC2), the MCU will reset. The LOC
loc_high
loc_low
bit in the System Reset Status (SRS) register will be set to indicate the error.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
183
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.4.7
Fixed Frequency Clock
The MCG presents the divided reference clock as MCGFFCLK for use as an additional clock source. The
MCGFFCLK frequency must be no more than 1/4 of the MCGOUT frequency to be valid. When
MCGFFCLK is valid then MCGFFCLKVALID is set to 1. When MCGFFCLK is not valid then
MCGFFCLKVALID is set to 0.
MC9S08DZ128 Series Data Sheet, Rev. 1
184
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.5
Initialization / Application Information
This section describes how to initialize and configure the MCG module in application. The following
sections include examples on how to initialize the MCG and properly switch between the various available
modes.
8.5.1
MCG Module Initialization Sequence
The MCG comes out of reset configured for FEI mode with the BDIV set for divide-by-2. The internal
reference will stabilize in t microseconds before the FLL can acquire lock. As soon as the internal
irefst
reference is stable, the FLL will acquire lock in t
milliseconds.
fll_acquire
NOTE
If the internal reference is not already trimmed, the BDIV value should not
be changed to divide-by-1 without first trimming the internal reference.
Failure to do so could result in the MCU running out of specification.
8.5.1.1
Initializing the MCG
Because the MCG comes out of reset in FEI mode, the only MCG modes which can be directly switched
to upon reset are FEE, FBE, and FBI modes (see Figure 8-9). Reaching any of the other modes requires
first configuring the MCG for one of these three initial modes. Care must be taken to check relevant status
bits in the MCGSC register reflecting all configuration changes within each mode.
To change from FEI mode to FEE or FBE modes, follow this procedure:
1. Enable the external clock source by setting the appropriate bits in MCGC2.
2. If the RANGE bit (bit 5) in MCGC2 is set, set DIV32 in MCGC3 to allow access to the proper
RDIV values.
3. Write to MCGC1 to select the clock mode.
— If entering FEE mode, set RDIV appropriately, clear the IREFS bit to switch to the external
reference, and leave the CLKS bits at %00 so that the output of the FLL is selected as the
system clock source.
— If entering FBE, clear the IREFS bit to switch to the external reference and change the CLKS
bits to %10 so that the external reference clock is selected as the system clock source. The
RDIV bits should also be set appropriately here according to the external reference frequency
because although the FLL is bypassed, it is still on in FBE mode.
— The internal reference can optionally be kept running by setting the IRCLKEN bit. This is
useful if the application will switch back and forth between internal and external modes. For
minimum power consumption, leave the internal reference disabled while in an external clock
mode.
4. Once the proper configuration bits have been set, wait for the affected bits in the MCGSC register
to be changed appropriately, reflecting that the MCG has moved into the proper mode.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
185
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
— If ERCLKEN was set in step 1 or the MCG is in FEE, FBE, PEE, PBE, or BLPE mode, and
EREFS was also set in step 1, wait here for the OSCINIT bit to become set indicating that the
external clock source has finished its initialization cycles and stabilized. Typical crystal startup
times are given in Appendix A, “Electrical Characteristics”.
— If in FEE mode, check to make sure the IREFST bit is cleared and the LOCK bit is set before
moving on.
— If in FBE mode, check to make sure the IREFST bit is cleared, the LOCK bit is set, and the
CLKST bits have changed to %10 indicating the external reference clock has been
appropriately selected. Although the FLL is bypassed in FBE mode, it is still on and will lock
in FBE mode.
5. Write to the MCGT register to determine the DCO output (MCGOUT) frequency range.
— By default, with DMX32 (bit 5) cleared to 0, the FLL multiplier for the DCO output is 1024.
For greater flexibility, if a mid-range FLL multiplier of 512 is desired instead, clear the DRS
bit (bit 0) to 0 for a DCO output frequency of 16.78 MHz.
— When using a 32.768 kHz external reference, if the maximum mid-range DCO frequency that
can be achieved with a 32.768 kHz reference is desired, clear the DRS bit (bit 0) to 0 and set
the DMX32 bit (bit 5) to 1. The resulting DCO output (MCGOUT) frequency with the new
multiplier of 608 will be 19.92 MHz.
— When using a 32.768 kHz external reference, if the maximum high-range DCO frequency that
can be achieved with a 32.768 kHz reference is desired, set the DRS bit (bit 0) to 1 and set the
DMX32 bit (bit 5) to 1. The resulting DCO output (MCGOUT) frequency with the new
multiplier of 1216 will be 39.85 MHz.
6. Wait for the LOCK bit in MCGSC to become set, indicating that the FLL has locked to the new
multiplier value designated by the DRS and DMX32 bits.
NOTE
Setting DIV32 (bit 4) in MCGC3 is strongly recommended for FLL external
modes when using a high frequency range (RANGE = 1) external reference
clock. The DIV32 bit is ignored in all other modes.
To change from FEI clock mode to FBI clock mode, follow this procedure:
1. Change the CLKS bits in MCGC1 to %01 so that the internal reference clock is selected as the
system clock source.
2. Wait for the CLKST bits in the MCGSC register to change to %01, indicating that the internal
reference clock has been appropriately selected.
8.5.2
Using a 32.768 kHz Reference
In FEE and FBE modes, if using a 32.768 kHz external reference, at the default FLL multiplication factor
of 1024, the DCO output (MCGOUT) frequency is 33.55 MHz at high-range. If DRS is cleared to 0, the
multiplication factor is halved to 512, and the resulting DCO output frequency is 16.78 Mhz at mid-range.
Setting the DMX32 bit in MCGT to 1 increases the FLL multiplication factor to allow the 32.768 kHz
reference to achieve its maximum DCO output frequency. When the DRS bit is set, the 32.768 kHz
MC9S08DZ128 Series Data Sheet, Rev. 1
186
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
reference can achieve a high-range maximum DCO output of 39.85 MHz with a multiplier of 1216. When
the DRS bit is clear, the 32.768 kHz reference can achieve a mid-range maximum DCO output of 19.92
MHz with a multiplier of 608.
In FBI and FEI modes, setting the DMX32 bit is not recommended. If the internal reference is trimmed to
a frequency above 32.768 kHz, the greater FLL multiplication factor could potentially push the
microcontroller system clock out of specification and damage the part.
8.5.3
MCG Mode Switching
When switching between operational modes of the MCG, certain configuration bits must be changed in
order to properly move from one mode to another. Each time any of these bits are changed (PLLS, IREFS,
CLKS, or EREFS), the corresponding bits in the MCGSC register (PLLST, IREFST, CLKST, or
OSCINIT) must be checked before moving on in the application software.
Additionally, care must be taken to ensure that the reference clock divider (RDIV) is set properly for the
mode being switched to. For instance, in PEE mode, if using a 4 MHz crystal, RDIV must be set to %001
(divide-by-2) or %010 (divide -by-4) in order to divide the external reference down to the required
frequency between 1 and 2 MHz.
If switching to FBE or FEE mode, first setting the DIV32 bit will ensure a proper reference frequency is
sent to the FLL clock at all times.
In FBE, FEE, FBI, and FEI modes, at any time, the application can switch the FLL multiplication factor
between 1024 and 512 with the DRS bit in MCGT. Writes to DRS will be ignored if LP=1 or PLLS=1.
The RDIV and IREFS bits should always be set properly before changing the PLLS bit so that the FLL or
PLL clock has an appropriate reference clock frequency to switch to. The table below shows MCGOUT
frequency calculations using RDIV, BDIV, and VDIV settings for each clock mode. The bus frequency is
equal to MCGOUT divided by 2.
Table 8-10. MCGOUT Frequency Calculation Options
1
Clock Mode
fMCGOUT
Note
FEI (FLL engaged internal)
(fint * F ) / B
Typical fMCGOUT = 16 MHz
immediately after reset.
FEE (FLL engaged external)
FBE (FLL bypassed external)
(fext / R *F) / B
fext / R must be in the range of
31.25 kHz to 39.0625 kHz
fext / B
fext / R must be in the range of
31.25 kHz to 39.0625 kHz
FBI (FLL bypassed internal)
PEE (PLL engaged external)
f
int / B
Typical fint = 32 kHz
[(fext / R) * M] / B
fext / R must be in the range of 1
MHz to 2 MHz
PBE (PLL bypassed external)
fext / B
fext / R must be in the range of 1
MHz to 2 MHz
BLPI (Bypassed low power internal)
BLPE (Bypassed low power external)
f
int / B
fext / B
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
187
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
1
R is the reference divider selected by the RDIV bits, B is the bus frequency divider selected by the BDIV bits,
F is the FLL factor selected by the DRS and DMX32 bits, and M is the multiplier selected by the VDIV bits.
This section will include 3 mode switching examples using an 8 MHz external crystal. If using an external
clock source less than 1 MHz, the MCG should not be configured for any of the PLL modes (PEE and
PBE).
8.5.3.1
Example # 1: Moving from FEI to PEE Mode: External Crystal = 8 MHz,
Bus Frequency = 16 MHz
In this example, the MCG will move through the proper operational modes from FEI to PEE mode until
the 8 MHz crystal reference frequency is set to achieve a bus frequency of 16 MHz. Because the MCG is
in FEI mode out of reset, this example also shows how to initialize the MCG for PEE mode out of reset.
First, the code sequence will be described. Then a flowchart will be included which illustrates the
sequence.
1. First, FEI must transition to FBE mode:
a) MCGC2 = 0x36 (%00110110)
– BDIV (bits 7 and 6) set to %00, or divide-by-1
– RANGE (bit 5) set to 1 because the frequency of 8 MHz is within the high frequency range
– HGO (bit 4) set to 1 to configure external oscillator for high gain operation
– EREFS (bit 2) set to 1, because a crystal is being used
– ERCLKEN (bit 1) set to 1 to ensure the external reference clock is active
b) Loop until OSCINIT (bit 1) in MCGSC is 1, indicating the crystal selected by the EREFS bit
has been initialized.
c) Because RANGE = 1, set DIV32 (bit 4) in MCGC3 to allow access to the proper RDIV bits
while in an FLL external mode.
d) MCGC1 = 0x98 (%10011000)
– CLKS (bits 7 and 6) set to %10 in order to select external reference clock as system clock
source
– RDIV (bits 5-3) set to %011, or divide-by-256 because 8MHz / 256 = 31.25 kHz which is
in the 31.25 kHz to 39.0625 kHz range required by the FLL
– IREFS (bit 2) cleared to 0, selecting the external reference clock
e) Loop until IREFST (bit 4) in MCGSC is 0, indicating the external reference is the current
source for the reference clock
f) Loop until CLKST (bits 3 and 2) in MCGSC is %10, indicating that the external reference
clock is selected to feed MCGOUT
2. Then, FBE must transition either directly to PBE mode or first through BLPE mode and then to
PBE mode:
MC9S08DZ128 Series Data Sheet, Rev. 1
188
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
a) BLPE: If a transition through BLPE mode is desired, first set LP (bit 3) in MCGC2 to 1.
b) BLPE/PBE: MCGC3 = 0x58 (%01011000)
– PLLS (bit 6) set to 1, selects the PLL. At this time, with an RDIV value of %011, the FLL
reference divider of 256 is switched to the PLL reference divider of 8 (see Table 8-3),
resulting in a reference frequency of 8 MHz/ 8 = 1 MHz. In BLPE mode,changing the PLLS
bit only prepares the MCG for PLL usage in PBE mode
– DIV32 (bit 4) still set at 1. Because the MCG is in a PLL mode, the DIV32 bit is ignored.
Keeping it set at 1 makes transitions back into an FLL external mode easier.
– VDIV (bits 3-0) set to %1000, or multiply-by-32 because 1 MHz reference * 32= 32MHz.
In BLPE mode, the configuration of the VDIV bits does not matter because the PLL is
disabled. Changing them only sets up the multiply value for PLL usage in PBE mode
c) BLPE: If transitioning through BLPE mode, clear LP (bit 3) in MCGC2 to 0 here to switch to
PBE mode
d) PBE: Loop until PLLST (bit 5) in MCGSC is set, indicating that the current source for the
PLLS clock is the PLL
e) PBE: Then loop until LOCK (bit 6) in MCGSC is set, indicating that the PLL has acquired lock
3. Lastly, PBE mode transitions into PEE mode:
a) MCGC1 = 0x18 (%00011000)
– CLKS (bits7 and 6) in MCGSC1 set to %00 in order to select the output of the PLL as the
system clock source
b) Loop until CLKST (bits 3 and 2) in MCGSC are %11, indicating that the PLL output is selected
to feed MCGOUT in the current clock mode
– Now, With an RDIV of divide-by-8, a BDIV of divide-by-1, and a VDIV of multiply-by-32,
MCGOUT = [(8 MHz / 8) * 32] / 1 = 32 MHz, and the bus frequency is MCGOUT / 2, or
16 MHz
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
189
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
START
IN FEI MODE
MCGC3 = $58
MCGC2 = $36
IN
NO
BLPE MODE ?
(LP=1)
CHECK
NO
YES
OSCINIT = 1 ?
MCGC2 = $36
(LP = 0)
YES
MCGC3 = $11
(DIV32 = 1)
MCGC1 = $98
CHECK
NO
PLLST = 1?
YES
CHECK
NO
NO
IREFST = 0?
CHECK
NO
YES
LOCK = 1?
CHECK
YES
CLKST = %10?
MCGC1 = $18
YES
NO
CHECK
ENTER
NO
CLKST = %11?
BLPE MODE ?
YES
YES
MCGC2 = $3E
(LP = 1)
CONTINUE
IN PEE MODE
Figure 8-10. Flowchart of FEI to PEE Mode Transition using an 8 MHz crystal
MC9S08DZ128 Series Data Sheet, Rev. 1
190
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.5.3.2
Example # 2: Moving from PEE to BLPI Mode: Bus Frequency =16 kHz
In this example, the MCG will move through the proper operational modes from PEE mode with an 8MHz
crystal configured for an 16 MHz bus frequency (see previous example) to BLPI mode with a 16 kHz bus
frequency.First, the code sequence will be described. Then a flowchart will be included which illustrates
the sequence.
1. First, PEE must transition to PBE mode:
a) MCGC1 = 0x98 (%10011000)
– CLKS (bits 7 and 6) set to %10 in order to switch the system clock source to the external
reference clock
b) Loop until CLKST (bits 3 and 2) in MCGSC are %10, indicating that the external reference
clock is selected to feed MCGOUT
2. Then, PBE must transition either directly to FBE mode or first through BLPE mode and then to
FBE mode:
a) BLPE: If a transition through BLPE mode is desired, first set LP (bit 3) in MCGC2 to 1
b) BLPE/FBE: MCGC3 = 0x18(%00011000)
– PLLS (bit 6) clear to 0 to select the FLL. At this time, with an RDIV value of %011, the PLL
reference divider of 8 is switched to an FLL divider of 256 (see Table 8-2), resulting in a
reference frequency of 8 MHz / 256 = 31.25 kHz. If RDIV was not previously set to %011
(necessary to achieve required 31.25-39.06 kHz FLL reference frequency with an 8 MHz
external source frequency), it must be changed prior to clearing the PLLS bit. In BLPE
mode,changing this bit only prepares the MCG for FLL usage in FBE mode. With PLLS =
0, the VDIV value does not matter.
– DIV32 (bit 4) set to 1 (if previously cleared), automatically switches RDIV bits to the proper
reference divider for the FLL clock (divide-by-256)
c) BLPE: If transitioning through BLPE mode, clear LP (bit 3) in MCGC2 to 0 here to switch to
FBE mode
d) FBE: Loop until PLLST (bit 5) in MCGSC is clear, indicating that the current source for the
PLLS clock is the FLL
e) FBE: Optionally, loop until LOCK (bit 6) in the MCGSC is set, indicating that the FLL has
acquired lock. Although the FLL is bypassed in FBE mode, it is still enabled and running.
3. Next, FBE mode transitions into FBI mode:
a) MCGC1 = 0x5C (%01011100)
– CLKS (bits7 and 6) in MCGSC1 set to %01 in order to switch the system clock to the
internal reference clock
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
191
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
– IREFS (bit 2) set to 1 to select the internal reference clock as the reference clock source
– RDIV (bits 5-3) remain unchanged because the reference divider does not affect the internal
reference.
b) Loop until IREFST (bit 4) in MCGSC is 1, indicating the internal reference clock has been
selected as the reference clock source
c) Loop until CLKST (bits 3 and 2) in MCGSC are %01, indicating that the internal reference
clock is selected to feed MCGOUT
4. Lastly, FBI transitions into BLPI mode.
a) MCGC2 = 0x08 (%00001000)
– LP (bit 3) in MCGSC is 1
– RANGE, HGO, EREFS, ERCLKEN, and EREFSTEN bits are ignored when the IREFS bit
(bit2) in MCGC is set. They can remain set, or be cleared at this point.
MC9S08DZ128 Series Data Sheet, Rev. 1
192
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
START
IN PEE MODE
MCGC1 = $98
CHECK
NO
PLLST = 0?
CHECK
NO
NO
YES
CLKST = %10 ?
YES
OPTIONAL:
CHECK LOCK
= 1?
NO
ENTER
BLPE MODE ?
YES
MCGC1 = $5C
YES
MCGC2 = $3E
(LP = 1)
CHECK
NO
IREFST = 0?
MCGC3 = $18
YES
CHECK
NO
IN
NO
CLKST = %01?
BLPE MODE ?
(LP=1)
YES
YES
MCGC2 = $08
MCGC2 = $36
(LP = 0)
CONTINUE
IN BLPI MODE
Figure 8-11. Flowchart of PEE to BLPI Mode Transition using an 8 MHz crystal
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
193
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
8.5.3.3
Example #3: Moving from BLPI to FEE Mode: External Crystal = 8 MHz,
Bus Frequency = 16 MHz
In this example, the MCG will move through the proper operational modes from BLPI mode at a 16 kHz
bus frequency running off of the internal reference clock (see previous example) to FEE mode using an
8MHz crystal configured for a 16 MHz bus frequency. First, the code sequence will be described. Then a
flowchart will be included which illustrates the sequence.
1. First, BLPI must transition to FBI mode.
a) MCGC2 = 0x00 (%00000000)
– LP (bit 3) in MCGSC is 0
b) Optionally, loop until LOCK (bit 6) in the MCGSC is set, indicating that the FLL has acquired
lock. Although the FLL is bypassed in FBI mode, it is still enabled and running.
2. Next, FBI will transition to FEE mode.
a) MCGC2 = 0x36 (%00110110)
– RANGE (bit 5) set to 1 because the frequency of 8 MHz is within the high frequency range
– HGO (bit 4) set to 1 to configure external oscillator for high gain operation
– EREFS (bit 2) set to 1, because a crystal is being used
– ERCLKEN (bit 1) set to 1 to ensure the external reference clock is active
b) Loop until OSCINIT (bit 1) in MCGSC is 1, indicating the crystal selected by the EREFS bit
has been initialized.
c) MCGC1 = 0x18 (%00011000)
– CLKS (bits 7 and 6) set to %00 in order to select the output of the FLL as system clock
source
– RDIV (bits 5-3) remain at %011, or divide-by-256 for a reference of 8 MHz / 256 = 31.25
kHz.
– IREFS (bit 1) cleared to 0, selecting the external reference clock
d) Loop until IREFST (bit 4) in MCGSC is 0, indicating the external reference clock is the current
source for the reference clock
e) Optionally, loop until LOCK (bit 6) in the MCGSC is set, indicating that the FLL has
reacquired lock.
f) Loop until CLKST (bits 3 and 2) in MCGSC are %00, indicating that the output of the FLL is
selected to feed MCGOUT
g) Now, with a 31.25 kHz reference frequency, a fixed DCO multiplier of 1024, and a bus divider
of 1, MCGOUT = 31.25 kHz * 1024 / 1 = 32 MHz. Therefore, the bus frequency is 16 MHz.
h) At this point, by default, DRS (bit 0) in MCGT is set to 1 and DMX32 (bit 5) in MCGT is
cleared to 0. If a bus frequency of 8 MHz is desired instead, clear DRS to 0 to switch the FLL
multiplication factor from 1024 to 512 and loop until LOCK (bit 6) in MCGSC is set, indicating
that the FLL has reacquired LOCK. To return the bus frequency to 16 MHz, set DRS to 1 again,
and the FLL multiplication factor will switch back to 1024. Then loop again until the LOCK
bit is set.
MC9S08DZ128 Series Data Sheet, Rev. 1
194
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
START
IN BLPI MODE
CHECK
NO
NO
NO
IREFST = 0?
MCGC2 = $00
YES
OPTIONAL:
NO
OPTIONAL:
CHECK LOCK
= 1?
CHECK LOCK
= 1?
YES
YES
MCGC2 = $36
CHECK
CLKST = %00?
YES
CHECK
NO
OSCINIT = 1 ?
CONTINUE
IN FEE MODE
YES
MCGC1 = $18
Figure 8-12. Flowchart of BLPI to FEE Mode Transition using an 8 MHz crystal
8.5.4
Calibrating the Internal Reference Clock (IRC)
The IRC is calibrated by writing to the MCGTRM register first, then using the FTRIM bit to “fine tune”
the frequency. We will refer to this total 9-bit value as the trim value, ranging from 0x000 to 0x1FF, where
the FTRIM bit is the LSB.
The trim value after reset is the factory trim value unless the device resets into any BDM mode in which
case it is 0x800. Writing a larger value will decrease the frequency and smaller values will increase the
frequency. The trim value is linear with the period, except that slight variations in wafer fab processing
produce slight non-linearities between trim value and period. These non-linearities are why an iterative
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
195
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
trimming approach to search for the best trim value is recommended. In Example #4: Internal Reference
Clock Trim later in this section, this approach will be demonstrated.
If a user specified trim value has been found for a device (to replace the factory trim value), this value can
be stored in FLASH memory to save the value. If power is removed from the device, the IRC can easily
be re-trimmed to the user specified value by copying the saved value from FLASH to the MCG registers.
Freescale identifies recommended FLASH locations for storing the trim value for each MCU. Consult the
memory map in the data sheet for these locations.
8.5.4.1
Example #4: Internal Reference Clock Trim
For applications that require a user specified tight frequency tolerance, a trimming procedure is provided
that will allow a very accurate internal clock source. This section outlines one example of trimming the
internal oscillator. Many other possible trimming procedures are valid and can be used.
In the example below, the MCG trim will be calibrated for the 9-bit MCGTRM and FTRIM collective
value. This value will be referred to as TRMVAL.
MC9S08DZ128 Series Data Sheet, Rev. 1
196
Freescale Semiconductor
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
Initial conditions:
1) Clock supplied from ATE has 500 μsec duty period
2) MCG configured for internal reference with 8MHz bus
START TRIM PROCEDURE
TRMVAL = $100
n=1
MEASURE
INCOMING CLOCK WIDTH
(COUNT = # OF BUS CLOCKS / 8)
COUNT < EXPECTED = 500
(RUNNING TOO SLOW)
COUNT = EXPECTED = 500
.
CASE STATEMENT
COUNT > EXPECTED = 500
(RUNNING TOO FAST)
TRMVAL =
TRMVAL - 256/ (2**n)
(DECREASING TRMVAL
INCREASES THE FREQUENCY)
TRMVAL =
STORE MCGTRM AND
FTRIM VALUES IN
NON-VOLATILE MEMORY
TRMVAL + 256/ (2**n)
(INCREASING TRMVAL
DECREASES THE FREQUENCY)
CONTINUE
n = n + 1
YES
IS n > 9?
NO
Figure 8-13. Trim Procedure
In this particular case, the MCU has been attached to a PCB and the entire assembly is undergoing final
test with automated test equipment. A separate signal or message is provided to the MCU operating under
user provided software control. The MCU initiates a trim procedure as outlined in Figure 8-13 while the
tester supplies a precision reference signal.
If the intended bus frequency is near the maximum allowed for the device, it is recommended to trim using
a reference divider value (RDIV setting) of twice the final value. After the trim procedure is complete, the
reference divider can be restored. This will prevent accidental overshoot of the maximum clock frequency.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
197
Chapter 8 Multi-Purpose Clock Generator (S08MCGV2)
MC9S08DZ128 Series Data Sheet, Rev. 1
198
Freescale Semiconductor
Chapter 9
5-V Analog Comparator (S08ACMPV3)
9.1
Introduction
The analog comparator module (ACMP) provides a circuit for comparing two analog input voltages or for
comparing one analog input voltage to an internal reference voltage. The comparator circuit is designed to
operate across the full range of the supply voltage (rail-to-rail operation).
All MC9S08DZ128 Series MCUs have two full function ACMPs. MCUs in the 48-pin package have two
ACMPs, but the output of ACMP2 is not accessible.
NOTE
MC9S08DZ128 Series devices operate at a higher voltage range (2.7 V to
5.5 V) and do not include stop1 mode. Please ignore references to stop1.
ACMP2O is not available in the 48-pin package.
9.1.1
ACMP Configuration Information
When using the bandgap reference voltage for input to ACMP+, the user must enable the bandgap buffer
by setting BGBE =1 in SPMSC1 see Section 5.8.7, “System Power Management Status and Control 1
Register (SPMSC1).” For value of bandgap voltage reference see Appendix A, “Electrical Characteristics”
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
199
Chapter 9 5-V Analog Comparator (S08ACMPV3)
PTA7/PIA7/ADP7/IRQ
PTA6/PIA6/ADP6
PTA5/PIA5/ADP5
HCS08 CORE
DEBUG MODULE (DBG)
CPU
BKGD/MS
PTA4/PIA4/ADP4
ACMP1O
ACMP1-
ACMP1+
BDC
BKP
PTA3/PIA3/ADP3/ACMP1O
PTA2/PIA2/ADP2/ACMP1-
PTA1/PIA1/ADP1/ACMP1+
PTA0/PIA0/ADP0/MCLK
ANALOG COMPARATOR
(ACMP1)
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
RESET
REAL-TIME COUNTER (RTC)
PTB7/PIB7/ADP15
PTB6/PIB6/ADP14
PTB5/PIB5/ADP13
PTB4/PIB4/ADP12
PTB3/PIB3/ADP11
PTB2/PIB2/ADP10
PTB1/PIB1/ADP9
PTB0/PIB0/ADP8
COP
INT
LVD
IRQ
V
DD
8
VOLTAGE
REGULATOR
V
SS
V
REFH
ADP7-ADP0
24-CHANNEL,12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
V
V
V
REFL
DDA
SSA
●
●
●
●
●
●
●
●
PTC7/ADP23
PTC6/ADP22
PTC5/ADP21
PTC4/ADP20
PTC3/ADP19
PTC2/ADP18
PTC1/ADP17
PTC0/ADP16
ADP15-ADP8
ADP23-ADP16
USER MEMORY
FLASH _EEPROM _RAM
MC9S08DZ128 = 128K_2K_8K
MC9S08DZ96 = 96K_2K_6K
MC9S08DV128 = 128K_0K_6K
MC9S08DV96 = 96K_0K_4K
TPM1CH5 -
6-CHANNEL TIMER/PWM TPM1CH0
TPM1CLK
PTJ7/PIJ7/TPM3CLK
PTJ6/PIJ6
PTJ5/PIJ5
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTD1/PID1/TPM2CH1
PTD0/PID0/TPM2CH0
TPM3CLK
6
MODULE (TPM1)
TPM2CH1,
TPM2CH0
TPM2CLK
TPM3CH0 -
TPM3CH3
PTJ4/PIJ4
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTJ3/PIJ3/TMP3CH3
PTJ2/PIJ2/TPM3CH2
PTJ1/PIJ1/TPM3CH1
PTJ0/PIJ0/TMP3CH0
4-CHANNEL TIMER/PWM
MODULE (TPM3)
4
RxCAN
TXCAN
MISO1
PTK7
PTK6
PTK5
PTK4
PTK3
PTK2
PTK1
PTK0
CONTROLLER AREA
NETWORK (MSCAN)
PTE7/RxD2/RXCAN
PTE6/TxD2/TXCAN
PTE5/SDA1/MISO1
PTE4/SCL1/MOSI1
PTE3/SPSCK1
PTE2/SS1
MOSI1
SPSCK1
SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
SS1
RxD1
TxD1
PTE1/RxD1
SERIAL COMMUNICATIONS
INTERFACE (SCI1)
PTE0/TxD1
●
●
PTL7
PTL6
PTL5
PTL4
PTL3
PTL2
PTL1
PTL0
PTF7
ACMP2O
ACMP2-
ACMP2+
SDA1
PTF6/ACMP2O
PTF5/ACMP2-
PTF4/ACMP2+
PTF3/TPM2CLK/SDA1
PTF2/TPM1CLK/SCL1
PTF1/RxD2
ANALOG COMPARATOR
(ACMP2)
SCL1
IIC MODULE (IIC1)
RxD2
TxD2
SERIAL COMMUNICATIONS
INTERFACE (SCI2)
PTF0/TxD2
SDA2
SCL2
PTH7
PTH6
PTG7/SDA2
PTG6/SCL2
PTG5
IIC MODULE (IIC2)
●
●
●
●
PTH5
MULTI-PURPOSE
CLOCK
GENERATOR
(MCG)
PTH4
MISO2
PTG4
PTG3
PTH3/MISO2
PTH2/MOSI2
PTH1/SPSCK2
PTH0/SS2
MOSI2
SPSCK2
SERIAL PERIPHERAL
PTG2
XTAL
EXTAL
INTERFACE MODULE (SPI2)
OSCILLATOR
(XOSC)
SS2
PTG1/XTAL
PTG0/EXTAL
- Pin not connected in 64-pin and 48-pin packages ● - Pin not available in the 48-pin package
- In 48-pin package, VDDA and VREFH are internally connected to each other and VSSA and VREFL are internally connected to each other.
Figure 9-1. MC9S08DZ128 Block Diagram with ACMP Highlighted
MC9S08DZ128 Series Data Sheet, Rev. 1
200
Freescale Semiconductor
Chapter 9 Analog Comparator (S08ACMPV3)
9.1.2
Features
The ACMP has the following features:
•
•
Full rail to rail supply operation.
Selectable interrupt on rising edge, falling edge, or either rising or falling edges of comparator
output.
•
•
•
Option to compare to fixed internal bandgap reference voltage.
Option to allow comparator output to be visible on a pin, ACMPxO.
Can operate in stop3 mode
9.1.3
Modes of Operation
This section defines the ACMP operation in wait, stop and background debug modes.
9.1.3.1
ACMP in Wait Mode
The ACMP continues to run in wait mode if enabled before executing the WAIT instruction. Therefore,
the ACMP can be used to bring the MCU out of wait mode if the ACMP interrupt, ACIE is enabled. For
lowest possible current consumption, the ACMP should be disabled by software if not required as an
interrupt source during wait mode.
9.1.3.2
ACMP in Stop Modes
Stop3 Mode Operation
9.1.3.2.1
The ACMP continues to operate in Stop3 mode if enabled and compare operation remains active. If
ACOPE is enabled, comparator output operates as in the normal operating mode and comparator output is
placed onto the external pin. The MCU is brought out of stop when a compare event occurs and ACIE is
enabled; ACF flag sets accordingly.
If stop is exited with a reset, the ACMP will be put into its reset state.
9.1.3.2.2
Stop2 and Stop1 Mode Operation
During either Stop2 and Stop1 mode, the ACMP module will be fully powered down. Upon wake-up from
Stop2 or Stop1 mode, the ACMP module will be in the reset state.
9.1.3.3
ACMP in Active Background Mode
When the microcontroller is in active background mode, the ACMP will continue to operate normally.
9.1.4
Block Diagram
The block diagram for the Analog Comparator module is shown Figure 9-2.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
201
Chapter 9 Analog Comparator (S08ACMPV3)
Internal Bus
Internal
Reference
ACMPx
INTERRUPT
REQUEST
ACIE
ACBGS
ACME
Status & Control
Register
ACF
ACOPE
ACMPx+
+
-
Interrupt
Control
Comparator
ACMPx-
ACMPxO
Figure 9-2. Analog Comparator 5V (ACMP5) Block Diagram
MC9S08DZ128 Series Data Sheet, Rev. 1
202
Freescale Semiconductor
Chapter 9 Analog Comparator (S08ACMPV3)
9.2
External Signal Description
The ACMP has two analog input pins, ACMPx+ and ACMPx- and one digital output pin ACMPxO. Each
of these pins can accept an input voltage that varies across the full operating voltage range of the MCU.
As shown in Figure 9-2, the ACMPx- pin is connected to the inverting input of the comparator, and the
ACMPx+ pin is connected to the comparator non-inverting input if ACBGS is a 0. As shown in Figure 9-2,
the ACMPxO pin can be enabled to drive an external pin.
The signal properties of ACMP are shown in Table 9-1.
Table 9-1. Signal Properties
Signal
Function
I/O
ACMPx-
Inverting analog input to the ACMP.
(Minus input)
I
ACMPx+
ACMPxO
Non-inverting analog input to the ACMP.
(Positive input)
I
Digital output of the ACMP.
O
9.3
Memory Map
9.3.1
Register Descriptions
The ACMP includes one register:
An 8-bit status and control register
•
Refer to the direct-page register summary in the memory section of this data sheet for the absolute address
assignments for all ACMP registers.This section refers to registers and control bits only by their names .
Some MCUs may have more than one ACMP, so register names include placeholder characters to identify
which ACMP is being referenced.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
203
Chapter 9 Analog Comparator (S08ACMPV3)
9.3.1.1
ACMPx Status and Control Register (ACMPxSC)
ACMPxSC contains the status flag and control bits which are used to enable and configure the ACMP.
7
6
5
4
3
2
1
0
R
W
ACO
ACME
ACBGS
ACF
ACIE
ACOPE
ACMOD
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 9-3. ACMPx Status and Control Register
Table 9-2. ACMPx Status and Control Register Field Descriptions
Description
Field
7
Analog Comparator Module Enable — ACME enables the ACMP module.
ACME
0 ACMP not enabled
1 ACMP is enabled
6
Analog Comparator Bandgap Select — ACBGS is used to select between the bandgap reference voltage or
the ACMPx+ pin as the input to the non-inverting input of the analog comparatorr.
0 External pin ACMPx+ selected as non-inverting input to comparator
1 Internal reference select as non-inverting input to comparator
ACBGS
Note: refer to this chapter introduction to verify if any other config bits are necessary to enable the bandgap
reference in the chip level.
5
ACF
Analog Comparator Flag — ACF is set when a compare event occurs. Compare events are defined by ACMOD.
ACF is cleared by writing a one to ACF.
0 Compare event has not occured
1 Compare event has occured
4
Analog Comparator Interrupt Enable — ACIE enables the interrupt from the ACMP. When ACIE is set, an
ACIE
interupt will be asserted when ACF is set.
0 Interrupt disabled
1 Interrupt enabled
3
Analog Comparator Output — Reading ACO will return the current value of the analog comparator output. ACO
ACO
is reset to a 0 and will read as a 0 when the ACMP is disabled (ACME = 0).
2
Analog Comparator Output Pin Enable — ACOPE is used to enable the comparator output to be placed onto
the external pin, ACMPxO.
ACOPE
0 Analog comparator output not available on ACMPxO
1 Analog comparator output is driven out on ACMPxO
1:0
ACMOD
Analog Comparator Mode — ACMOD selects the type of compare event which sets ACF.
00 Encoding 0 — Comparator output falling edge
01 Encoding 1 — Comparator output rising edge
10 Encoding 2 — Comparator output falling edge
11 Encoding 3 — Comparator output rising or falling edge
MC9S08DZ128 Series Data Sheet, Rev. 1
204
Freescale Semiconductor
Chapter 9 Analog Comparator (S08ACMPV3)
9.4
Functional Description
The analog comparator can be used to compare two analog input voltages applied to ACMPx+ and
ACMPx-; or it can be used to compare an analog input voltage applied to ACMPx- with an internal
bandgap reference voltage. ACBGS is used to select between the bandgap reference voltage or the
ACMPx+ pin as the input to the non-inverting input of the analog comparator. The comparator output is
high when the non-inverting input is greater than the inverting input, and is low when the non-inverting
input is less than the inverting input. ACMOD is used to select the condition which will cause ACF to be
set. ACF can be set on a rising edge of the comparator output, a falling edge of the comparator output, or
either a rising or a falling edge (toggle). The comparator output can be read directly through ACO. The
comparator output can be driven onto the ACMPxO pin using ACOPE.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
205
Chapter 9 Analog Comparator (S08ACMPV3)
MC9S08DZ128 Series Data Sheet, Rev. 1
206
Freescale Semiconductor
Chapter 10
Analog-to-Digital Converter (S08ADC12V1)
10.1 Introduction
The 12-bit analog-to-digital converter (ADC) is a successive approximation ADC designed for operation
within an integrated microcontroller system-on-chip.
NOTE
MC9S08DZ128 Series devices operate at a higher voltage range (2.7 V to
5.5 V) and do not include stop1 mode. Please ignore references to stop1.
The ADC channel assignments, alternate clock function, and hardware trigger function are configured as
described in Section 10.1.1, “Channel Assignments.”
10.1.1 Channel Assignments
NOTE
The ADC channel assignments for the MC9S08DZ128 Series devices are
shown in Table 10-1. Reserved channels convert to an unknown value.
This chapter shows bits for all S08ADC12V1 channels. MC9S08DZ128
Series MCUs do not use all of these channels. All bits corresponding to
channels that are not available on a device are reserved.
10.1.2 Analog Power and Ground Signal Names
References to V
and V
in this chapter correspond to signals V
and V , respectively.
DDA SSA
DDAD
SSAD
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
207
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
Table 10-1. ADC Channel Assignment
ADCH
Channel
Input
ADCH
Channel
Input
10000
10001
10010
10011
10100
10101
10110
10111
AD16
AD17
AD18
AD19
AD20
AD21
AD22
AD23
PTC0/ADP16
PTC1/ADP17
PTC2/ADP18
PTC3/ADP19
PTC4/ADP20
PTC5/ADP21
PTC6/ADP22
PTC7/ADP23
Reserved
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
AD0
AD1
PTA0/ADP0/MCLK
PTA1/ADP1/ACMP1+
PTA2/ADP2/ACMP1P-
PTA3/ADP3/ACMP1O
PTA4/ADP4
AD2
AD3
AD4
AD5
PTA5/ADP5
AD6
PTA6/ADP6
AD7
PTA7/ADP7
11000– AD24 through AD25
11001
AD8
PTB0/ADP8
AD9
PTB1/ADP9
11010
11011
11100
11101
11110
11111
AD26
AD27
Temperature Sensor1
Internal Bandgap2
VREFH
AD10
AD11
AD12
AD13
AD14
AD15
PTB2/ADP10
PTB3/ADP11
VREFH
PTB4/ADP12
VREFH
VREFH
PTB5/ADP13
VREFL
VREFL
PTB6/ADP14
Module Disabled
None
PTB7/ADP15
Notes:
1 For information, see Section 10.1.5, “Temperature Sensor”.
2 Requires BGBE =1 in SPMSC1 see Section 5.8.7, “System Power Management Status and Control 1 Register
(SPMSC1)”. For value of bandgap voltage reference see Section A.6, “DC Characteristics”.
10.1.3 Alternate Clock
The ADC module is capable of performing conversions using the MCU bus clock, the bus clock divided
by two, the local asynchronous clock (ADACK) within the module, or the alternate clock, ALTCLK. The
alternate clock for the MC9S08DZ128 Series MCU devices is the external reference clock
(MCGERCLK).
The selected clock source must run at a frequency such that the ADC conversion clock (ADCK) runs at a
frequency within its specified range (f
determined by the ADIV bits.
) after being divided down from the ALTCLK input as
ADCK
ALTCLK is active while the MCU is in wait mode provided the conditions described above are met. This
allows ALTCLK to be used as the conversion clock source for the ADC while the MCU is in wait mode.
ALTCLK cannot be used as the ADC conversion clock source while the MCU is in either stop2 or stop3.
10.1.4 Hardware Trigger
The ADC hardware trigger, ADHWT, is the output from the real time counter (RTC) overflow or the
external interrupt request (IRQ) pin. The source is selected by the ADC hardware trigger select bit,
MC9S08DZ128 Series Data Sheet, Rev. 1
208
Freescale Semiconductor
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
ADHTS, in the SOPT2 register. The RTC or IRQ can be configured to cause a hardware trigger in run,
wait, and stop3 modes.
10.1.5 Temperature Sensor
To use the on-chip temperature sensor, the user must perform the following:
•
•
Configure ADC for long sample with a maximum of 1 MHz clock
Convert the bandgap voltage reference channel (AD27)
— By converting the digital value of the bandgap voltage reference channel using the value of
V
the user can determine V . For value of bandgap voltage, see Section A.6, “DC
BG
DD
Characteristics”.
•
Convert the temperature sensor channel (AD26)
— By using the calculated value of V , convert the digital value of AD26 into a voltage, V
TEMP
DD
Equation 10-1 provides an approximate transfer function of the temperature sensor.
Temp = 25 - ((V
-V
) ÷ m)
TEMP25
Eqn. 10-1
TEMP
where:
— V
— V
is the voltage of the temperature sensor channel at the ambient temperature.
TEMP
is the voltage of the temperature sensor channel at 25°C.
TEMP25
— m is the hot or cold voltage versus temperature slope in V/°C.
For temperature calculations, use the V and m values from the ADC Electricals table.
TEMP25
In application code, the user reads the temperature sensor channel, calculates V
, and compares to
TEMP
V
. If V
is greater than V
the cold slope value is applied in Equation 10-1. If V
is
TEMP25
TEMP
TEMP25
TEMP
less than V
the hot slope value is applied in Equation 10-1.
TEMP25
To improve accuracy the user should calibrate the bandgap voltage reference and temperature sensor.
Calibrating at 25°C will improve accuracy to 4.5°C.
Calibration at three points, -40°C, 25°C, and 125°C will improve accuracy to 2.5°C. Once calibration
has been completed, the user will need to calculate the slope for both hot and cold. In application code, the
user would then calculate the temperature using Equation 10-1 as detailed above and then determine if the
temperature is above or below 25°C. Once determined if the temperature is above or below 25°C, the user
can recalculate the temperature using the hot or cold slope value obtained during calibration.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
209
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
PTA7/PIA7/ADP7/IRQ
PTA6/PIA6/ADP6
PTA5/PIA5/ADP5
HCS08 CORE
DEBUG MODULE (DBG)
CPU
BKGD/MS
RESET
PTA4/PIA4/ADP4
ACMP1O
ACMP1-
ACMP1+
BDC
BKP
PTA3/PIA3/ADP3/ACMP1O
PTA2/PIA2/ADP2/ACMP1-
PTA1/PIA1/ADP1/ACMP1+
PTA0/PIA0/ADP0/MCLK
ANALOG COMPARATOR
(ACMP1)
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
REAL-TIME COUNTER (RTC)
PTB7/PIB7/ADP15
PTB6/PIB6/ADP14
PTB5/PIB5/ADP13
PTB4/PIB4/ADP12
PTB3/PIB3/ADP11
PTB2/PIB2/ADP10
PTB1/PIB1/ADP9
PTB0/PIB0/ADP8
COP
INT
LVD
IRQ
V
DD
8
VOLTAGE
REGULATOR
V
SS
V
REFH
ADP7-ADP0
24-CHANNEL,12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
V
REFL
●
●
●
●
●
●
●
●
PTC7/ADP23
PTC6/ADP22
PTC5/ADP21
PTC4/ADP20
PTC3/ADP19
PTC2/ADP18
PTC1/ADP17
PTC0/ADP16
V
DDA
ADP15-ADP8
ADP23-ADP16
V
SSA
USER MEMORY
FLASH _EEPROM _RAM
MC9S08DZ128 = 128K_2K_8K
MC9S08DZ96 = 96K_2K_6K
MC9S08DV128 = 128K_0K_6K
MC9S08DV96 = 96K_0K_4K
TPM1CH5 -
6-CHANNEL TIMER/PWM TPM1CH0
TPM1CLK
PTJ7/PIJ7/TPM3CLK
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTD1/PID1/TPM2CH1
PTD0/PID0/TPM2CH0
TPM3CLK
6
PTJ6/PIJ6
PTJ5/PIJ5
PTJ4/PIJ4
MODULE (TPM1)
TPM2CH1,
TPM2CH0
TPM2CLK
TPM3CH0 -
TPM3CH3
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTJ3/PIJ3/TMP3CH3
PTJ2/PIJ2/TPM3CH2
PTJ1/PIJ1/TPM3CH1
PTJ0/PIJ0/TMP3CH0
4-CHANNEL TIMER/PWM
MODULE (TPM3)
4
RxCAN
TXCAN
MISO1
PTK7
PTK6
PTK5
PTK4
PTK3
PTK2
PTK1
PTK0
CONTROLLER AREA
NETWORK (MSCAN)
PTE7/RxD2/RXCAN
PTE6/TxD2/TXCAN
PTE5/SDA1/MISO1
PTE4/SCL1/MOSI1
PTE3/SPSCK1
PTE2/SS1
MOSI1
SPSCK1
SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
SS1
RxD1
TxD1
PTE1/RxD1
SERIAL COMMUNICATIONS
INTERFACE (SCI1)
PTE0/TxD1
●
●
PTL7
PTL6
PTL5
PTL4
PTL3
PTL2
PTL1
PTL0
PTF7
ACMP2O
ACMP2-
ACMP2+
SDA1
PTF6/ACMP2O
PTF5/ACMP2-
PTF4/ACMP2+
PTF3/TPM2CLK/SDA1
PTF2/TPM1CLK/SCL1
PTF1/RxD2
ANALOG COMPARATOR
(ACMP2)
SCL1
IIC MODULE (IIC1)
RxD2
TxD2
SERIAL COMMUNICATIONS
INTERFACE (SCI2)
PTF0/TxD2
SDA2
SCL2
PTH7
PTH6
PTG7/SDA2
PTG6/SCL2
PTG5
IIC MODULE (IIC2)
●
●
●
●
PTH5
MULTI-PURPOSE
CLOCK
GENERATOR
(MCG)
PTH4
MISO2
PTG4
PTG3
PTH3/MISO2
PTH2/MOSI2
PTH1/SPSCK2
PTH0/SS2
MOSI2
SPSCK2
SERIAL PERIPHERAL
PTG2
XTAL
EXTAL
INTERFACE MODULE (SPI2)
OSCILLATOR
(XOSC)
SS2
PTG1/XTAL
PTG0/EXTAL
- Pin not connected in 64-pin and 48-pin packages
● - Pin not available in the 48-pin package
- In 48-pin package, VDDA and VREFH are internally connected to each other and VSSA and VREFL are internally connected to each other.
Figure 10-1. MC9S08DZ128 Block Diagram with ADC Highlighted
MC9S08DZ128 Series Data Sheet, Rev. 1
210
Freescale Semiconductor
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
10.1.6 Features
Features of the ADC module include:
•
•
•
•
•
•
•
•
•
•
•
•
Linear successive approximation algorithm with 12-bit resolution
Up to 28 analog inputs
Output formatted in 12-, 10-, or 8-bit right-justified unsigned format
Single or continuous conversion (automatic return to idle after single conversion)
Configurable sample time and conversion speed/power
Conversion complete flag and interrupt
Input clock selectable from up to four sources
Operation in wait or stop3 modes for lower noise operation
Asynchronous clock source for lower noise operation
Selectable asynchronous hardware conversion trigger
Automatic compare with interrupt for less-than, or greater-than or equal-to, programmable value
Temperature sensor
10.1.7 ADC Module Block Diagram
Figure 10-2 provides a block diagram of the ADC module.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
211
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
Compare true
ADCSC1
3
ADCCFG
Async
Clock Gen
1
2
ADACK
Bus Clock
ALTCLK
MCU STOP
ADHWT
ADCK
Clock
Divide
Control Sequencer
÷2
AD0
1
2
AIEN
Interrupt
COCO
ADVIN
SAR Converter
AD27
V
V
REFH
Data Registers
REFL
Compare true
ADCSC2
3
Compare
Logic
Compare Value Registers
Figure 10-2. ADC Block Diagram
10.2 External Signal Description
The ADC module supports up to 28 separate analog inputs. It also requires four supply/reference/ground
connections.
Table 10-2. Signal Properties
Name
Function
AD27–AD0
VREFH
Analog Channel inputs
High reference voltage
Low reference voltage
Analog power supply
Analog ground
VREFL
VDDAD
VSSAD
MC9S08DZ128 Series Data Sheet, Rev. 1
212
Freescale Semiconductor
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
10.2.1 Analog Power (VDDAD
)
The ADC analog portion uses V
as its power connection. In some packages, V
is connected
DDAD
DDAD
internally to V . If externally available, connect the V
pin to the same voltage potential as V
.
DD
DDAD
DD
External filtering may be necessary to ensure clean V
for good results.
DDAD
10.2.2 Analog Ground (VSSAD
)
The ADC analog portion uses V
as its ground connection. In some packages, V
is connected
SSAD
SSAD
internally to V . If externally available, connect the V
pin to the same voltage potential as V .
SS
SSAD
SS
10.2.3 Voltage Reference High (VREFH
)
V
V
is the high reference voltage for the converter. In some packages, V
is connected internally to
REFH
REFH
. If externally available, V
may be connected to the same potential as V
or may be driven
DDAD
REFH
DDAD
by an external source between the minimum V
spec and the V
potential (V
must never
DDAD
DDAD
REFH
exceed V
).
DDAD
10.2.4 Voltage Reference Low (VREFL
)
V
V
is the low-reference voltage for the converter. In some packages, V
is connected internally to
REFL
SSAD
REFL
. If externally available, connect the V
pin to the same voltage potential as V
.
REFL
SSAD
10.2.5 Analog Channel Inputs (ADx)
The ADC module supports up to 28 separate analog inputs. An input is selected for conversion through the
ADCH channel select bits.
10.3 Register Definition
These memory-mapped registers control and monitor operation of the ADC:
•
•
•
•
•
•
Status and control register, ADCSC1
Status and control register, ADCSC2
Data result registers, ADCRH and ADCRL
Compare value registers, ADCCVH and ADCCVL
Configuration register, ADCCFG
Pin control registers, APCTL1, APCTL2, APCTL3
10.3.1 Status and Control Register 1 (ADCSC1)
This section describes the function of the ADC status and control register (ADCSC1). Writing ADCSC1
aborts the current conversion and initiates a new conversion (if the ADCH bits are equal to a value other
than all 1s).
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
213
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
7
6
5
4
3
2
1
0
R
W
COCO
AIEN
ADCO
ADCH
Reset:
0
0
0
1
1
1
1
1
Figure 10-3. Status and Control Register (ADCSC1)
Table 10-3. ADCSC1 Field Descriptions
Description
Field
7
Conversion Complete Flag. The COCO flag is a read-only bit set each time a conversion is completed when the
compare function is disabled (ACFE = 0). When the compare function is enabled (ACFE = 1), the COCO flag is
set upon completion of a conversion only if the compare result is true. This bit is cleared when ADCSC1 is written
or when ADCRL is read.
COCO
0 Conversion not completed
1 Conversion completed
6
Interrupt Enable AIEN enables conversion complete interrupts. When COCO becomes set while AIEN is high,
an interrupt is asserted.
AIEN
0 Conversion complete interrupt disabled
1 Conversion complete interrupt enabled
5
Continuous Conversion Enable. ADCO enables continuous conversions.
ADCO
0 One conversion following a write to the ADCSC1 when software triggered operation is selected, or one
conversion following assertion of ADHWT when hardware triggered operation is selected.
1 Continuous conversions initiated following a write to ADCSC1 when software triggered operation is selected.
Continuous conversions are initiated by an ADHWT event when hardware triggered operation is selected.
4:0
ADCH
Input Channel Select. The ADCH bits form a 5-bit field that selects one of the input channels. The input channels
are detailed in Table 10-4.
The successive approximation converter subsystem is turned off when the channel select bits are all set. This
feature allows for explicit disabling of the ADC and isolation of the input channel from all sources. Terminating
continuous conversions this way prevents an additional, single conversion from being performed. It is not
necessary to set the channel select bits to all ones to place the ADC in a low-power state when continuous
conversions are not enabled because the module automatically enters a low-power state when a conversion
completes.
Table 10-4. Input Channel Select
ADCH
Input Select
00000–01111
10000–11011
11100
AD0–15
AD16–27
Reserved
VREFH
11101
11110
VREFL
11111
Module disabled
MC9S08DZ128 Series Data Sheet, Rev. 1
214
Freescale Semiconductor
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
10.3.2 Status and Control Register 2 (ADCSC2)
The ADCSC2 register controls the compare function, conversion trigger, and conversion active of the ADC
module.
7
6
5
4
3
2
1
0
R
W
ADACT
0
0
ADTRG
ACFE
ACFGT
R1
R1
Reset:
0
0
0
0
0
0
0
0
Figure 10-4. Status and Control Register 2 (ADCSC2)
1
Bits 1 and 0 are reserved bits that must always be written to 0.
Table 10-5. ADCSC2 Register Field Descriptions
Description
Field
7
Conversion Active. Indicates that a conversion is in progress. ADACT is set when a conversion is initiated and
cleared when a conversion is completed or aborted.
0 Conversion not in progress
ADACT
1 Conversion in progress
6
Conversion Trigger Select. Selects the type of trigger used for initiating a conversion. Two types of triggers are
selectable: software trigger and hardware trigger. When software trigger is selected, a conversion is initiated
following a write to ADCSC1. When hardware trigger is selected, a conversion is initiated following the assertion
of the ADHWT input.
ADTRG
0 Software trigger selected
1 Hardware trigger selected
5
Compare Function Enable. Enables the compare function.
0 Compare function disabled
ACFE
1 Compare function enabled
4
Compare Function Greater Than Enable. Configures the compare function to trigger when the result of the
conversion of the input being monitored is greater than or equal to the compare value. The compare function
defaults to triggering when the result of the compare of the input being monitored is less than the compare value.
0 Compare triggers when input is less than compare value
ACFGT
1 Compare triggers when input is greater than or equal to compare value
10.3.3 Data Result High Register (ADCRH)
In 12-bit operation, ADCRH contains the upper four bits of the result of a 12-bit conversion. In 10-bit
mode, ADCRH contains the upper two bits of the result of a 10-bit conversion. When configured for 10-bit
mode, ADR[11:10] are cleared. When configured for 8-bit mode, ADR[11:8] are cleared.
In 12-bit and 10-bit mode, ADCRH is updated each time a conversion completes except when automatic
compare is enabled and the compare condition is not met. When a compare event does occur, the value is
the addition of the conversion result and the two’s complement of the compare value. In 12-bit and 10-bit
mode, reading ADCRH prevents the ADC from transferring subsequent conversion results into the result
registers until ADCRL is read. If ADCRL is not read until after the next conversion is completed, the
intermediate conversion result is lost. In 8-bit mode, there is no interlocking with ADCRL.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
215
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
If the MODE bits are changed, any data in ADCRH becomes invalid.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
ADR11
ADR10
ADR9
ADR8
Reset:
0
0
0
0
0
0
0
0
Figure 10-5. Data Result High Register (ADCRH)
10.3.4 Data Result Low Register (ADCRL)
ADCRL contains the lower eight bits of the result of a 12-bit or 10-bit conversion, and all eight bits of an
8-bit conversion. This register is updated each time a conversion completes except when automatic
compare is enabled and the compare condition is not met. In 12-bit and 10-bit mode, reading ADCRH
prevents the ADC from transferring subsequent conversion results into the result registers until ADCRL is
read. If ADCRL is not read until the after next conversion is completed, the intermediate conversion results
are lost. In 8-bit mode, there is no interlocking with ADCRH. If the MODE bits are changed, any data in
ADCRL becomes invalid.
7
6
5
4
3
2
1
0
R
W
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
ADR0
Reset:
0
0
0
0
0
0
0
0
Figure 10-6. Data Result Low Register (ADCRL)
10.3.5 Compare Value High Register (ADCCVH)
In 12-bit mode, the ADCCVH register holds the upper four bits of the 12-bit compare value. When the
compare function is enabled, these bits are compared to the upper four bits of the result following a
conversion in 12-bit mode.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
ADCV11
ADCV10
ADCV9
ADCV8
Reset:
0
0
0
0
0
0
0
0
Figure 10-7. Compare Value High Register (ADCCVH)
MC9S08DZ128 Series Data Sheet, Rev. 1
216
Freescale Semiconductor
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
In 10-bit mode, the ADCCVH register holds the upper two bits of the 10-bit compare value (ADCV[9:8]).
These bits are compared to the upper two bits of the result following a conversion in 10-bit mode when the
compare function is enabled.
In 8-bit mode, ADCCVH is not used during compare.
10.3.6 Compare Value Low Register (ADCCVL)
This register holds the lower 8 bits of the 12-bit or 10-bit compare value or all 8 bits of the 8-bit compare
value. When the compare function is enabled, bits ADCV[7:0] are compared to the lower 8 bits of the
result following a conversion in 12-bit, 10-bit or 8-bit mode.
7
6
5
4
3
2
1
0
R
W
ADCV7
ADCV6
ADCV5
ADCV4
ADCV3
ADCV2
ADCV1
ADCV0
Reset:
0
0
0
0
0
0
0
0
Figure 10-8. Compare Value Low Register(ADCCVL)
10.3.7 Configuration Register (ADCCFG)
ADCCFG selects the mode of operation, clock source, clock divide, and configures for low power and
long sample time.
7
6
5
4
3
2
1
0
R
W
ADLPC
ADIV
ADLSMP
MODE
ADICLK
Reset:
0
0
0
0
0
0
0
0
Figure 10-9. Configuration Register (ADCCFG)
Table 10-6. ADCCFG Register Field Descriptions
Description
Field
7
Low-Power Configuration. ADLPC controls the speed and power configuration of the successive approximation
converter. This optimizes power consumption when higher sample rates are not required.
0 High speed configuration
ADLPC
1 Low power configuration:The power is reduced at the expense of maximum clock speed.
6:5
ADIV
Clock Divide Select. ADIV selects the divide ratio used by the ADC to generate the internal clock ADCK.
Table 10-7 shows the available clock configurations.
4
Long Sample Time Configuration. ADLSMP selects between long and short sample time. This adjusts the
ADLSMP sample period to allow higher impedance inputs to be accurately sampled or to maximize conversion speed for
lower impedance inputs. Longer sample times can also be used to lower overall power consumption when
continuous conversions are enabled if high conversion rates are not required.
0 Short sample time
1 Long sample time
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
217
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
Table 10-6. ADCCFG Register Field Descriptions (continued)
Field
Description
3:2
Conversion Mode Selection. MODE bits are used to select between 12-, 10-, or 8-bit operation. See Table 10-8.
MODE
1:0
ADICLK
Input Clock Select. ADICLK bits select the input clock source to generate the internal clock ADCK. See
Table 10-9.
Table 10-7. Clock Divide Select
ADIV
Divide Ratio
Clock Rate
00
01
10
11
1
2
4
8
Input clock
Input clock ÷ 2
Input clock ÷ 4
Input clock ÷ 8
Table 10-8. Conversion Modes
Mode Description
MODE
00
01
10
11
8-bit conversion (N=8)
12-bit conversion (N=12)
10-bit conversion (N=10)
Reserved
Table 10-9. Input Clock Select
ADICLK
Selected Clock Source
00
01
10
11
Bus clock
Bus clock divided by 2
Alternate clock (ALTCLK)
Asynchronous clock (ADACK)
10.3.8 Pin Control 1 Register (APCTL1)
The pin control registers disable the I/O port control of MCU pins used as analog inputs. APCTL1 is
MC9S08DZ128 Series Data Sheet, Rev. 1
218
Freescale Semiconductor
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
used to control the pins associated with channels 0–7 of the ADC module.
7
6
5
4
3
2
1
0
R
W
ADPC7
ADPC6
ADPC5
ADPC4
ADPC3
ADPC2
ADPC1
ADPC0
Reset:
0
0
0
0
0
0
0
0
Figure 10-10. Pin Control 1 Register (APCTL1)
Table 10-10. APCTL1 Register Field Descriptions
Description
Field
7
ADC Pin Control 7. ADPC7 controls the pin associated with channel AD7.
0 AD7 pin I/O control enabled
ADPC7
1 AD7 pin I/O control disabled
6
ADC Pin Control 6. ADPC6 controls the pin associated with channel AD6.
0 AD6 pin I/O control enabled
ADPC6
1 AD6 pin I/O control disabled
5
ADC Pin Control 5. ADPC5 controls the pin associated with channel AD5.
0 AD5 pin I/O control enabled
ADPC5
1 AD5 pin I/O control disabled
4
ADC Pin Control 4. ADPC4 controls the pin associated with channel AD4.
0 AD4 pin I/O control enabled
ADPC4
1 AD4 pin I/O control disabled
3
ADC Pin Control 3. ADPC3 controls the pin associated with channel AD3.
0 AD3 pin I/O control enabled
ADPC3
1 AD3 pin I/O control disabled
2
ADC Pin Control 2. ADPC2 controls the pin associated with channel AD2.
0 AD2 pin I/O control enabled
ADPC2
1 AD2 pin I/O control disabled
1
ADC Pin Control 1. ADPC1 controls the pin associated with channel AD1.
0 AD1 pin I/O control enabled
ADPC1
1 AD1 pin I/O control disabled
0
ADC Pin Control 0. ADPC0 controls the pin associated with channel AD0.
0 AD0 pin I/O control enabled
ADPC0
1 AD0 pin I/O control disabled
10.3.9 Pin Control 2 Register (APCTL2)
APCTL2 controls channels 8–15 of the ADC module.
7
6
5
4
3
2
1
0
R
W
ADPC15
ADPC14
ADPC13
ADPC12
ADPC11
ADPC10
ADPC9
ADPC8
Reset:
0
0
0
0
0
0
0
0
Figure 10-11. Pin Control 2 Register (APCTL2)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
219
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
Table 10-11. APCTL2 Register Field Descriptions
Field
Description
7
ADC Pin Control 15. ADPC15 controls the pin associated with channel AD15.
ADPC15 0 AD15 pin I/O control enabled
1 AD15 pin I/O control disabled
6
ADC Pin Control 14. ADPC14 controls the pin associated with channel AD14.
ADPC14 0 AD14 pin I/O control enabled
1 AD14 pin I/O control disabled
5
ADC Pin Control 13. ADPC13 controls the pin associated with channel AD13.
ADPC13 0 AD13 pin I/O control enabled
1 AD13 pin I/O control disabled
4
ADC Pin Control 12. ADPC12 controls the pin associated with channel AD12.
ADPC12 0 AD12 pin I/O control enabled
1 AD12 pin I/O control disabled
3
ADC Pin Control 11. ADPC11 controls the pin associated with channel AD11.
ADPC11 0 AD11 pin I/O control enabled
1 AD11 pin I/O control disabled
2
ADC Pin Control 10. ADPC10 controls the pin associated with channel AD10.
ADPC10 0 AD10 pin I/O control enabled
1 AD10 pin I/O control disabled
1
ADC Pin Control 9. ADPC9 controls the pin associated with channel AD9.
ADPC9 0 AD9 pin I/O control enabled
1 AD9 pin I/O control disabled
0
ADC Pin Control 8. ADPC8 controls the pin associated with channel AD8.
ADPC8 0 AD8 pin I/O control enabled
1 AD8 pin I/O control disabled
10.3.10 Pin Control 3 Register (APCTL3)
APCTL3 controls channels 16–23 of the ADC module.
7
6
5
4
3
2
1
0
R
W
ADPC23
ADPC22
ADPC21
ADPC20
ADPC19
ADPC18
ADPC17
ADPC16
Reset:
0
0
0
0
0
0
0
0
Figure 10-12. Pin Control 3 Register (APCTL3)
MC9S08DZ128 Series Data Sheet, Rev. 1
220
Freescale Semiconductor
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
Table 10-12. APCTL3 Register Field Descriptions
Field
Description
7
ADC Pin Control 23. ADPC23 controls the pin associated with channel AD23.
ADPC23 0 AD23 pin I/O control enabled
1 AD23 pin I/O control disabled
6
ADC Pin Control 22. ADPC22 controls the pin associated with channel AD22.
ADPC22 0 AD22 pin I/O control enabled
1 AD22 pin I/O control disabled
5
ADC Pin Control 21. ADPC21 controls the pin associated with channel AD21.
ADPC21 0 AD21 pin I/O control enabled
1 AD21 pin I/O control disabled
4
ADC Pin Control 20. ADPC20 controls the pin associated with channel AD20.
ADPC20 0 AD20 pin I/O control enabled
1 AD20 pin I/O control disabled
3
ADC Pin Control 19. ADPC19 controls the pin associated with channel AD19.
ADPC19 0 AD19 pin I/O control enabled
1 AD19 pin I/O control disabled
2
ADC Pin Control 18. ADPC18 controls the pin associated with channel AD18.
ADPC18 0 AD18 pin I/O control enabled
1 AD18 pin I/O control disabled
1
ADC Pin Control 17. ADPC17 controls the pin associated with channel AD17.
ADPC17 0 AD17 pin I/O control enabled
1 AD17 pin I/O control disabled
0
ADC Pin Control 16. ADPC16 controls the pin associated with channel AD16.
ADPC16 0 AD16 pin I/O control enabled
1 AD16 pin I/O control disabled
10.4 Functional Description
The ADC module is disabled during reset or when the ADCH bits are all high. The module is idle when a
conversion has completed and another conversion has not been initiated. When idle, the module is in its
lowest power state.
The ADC can perform an analog-to-digital conversion on any of the software selectable channels. In 12-bit
and 10-bit mode, the selected channel voltage is converted by a successive approximation algorithm into
a 12-bit digital result. In 8-bit mode, the selected channel voltage is converted by a successive
approximation algorithm into a 9-bit digital result.
When the conversion is completed, the result is placed in the data registers (ADCRH and ADCRL). In
10-bit mode, the result is rounded to 10 bits and placed in the data registers (ADCRH and ADCRL). In
8-bit mode, the result is rounded to 8 bits and placed in ADCRL. The conversion complete flag (COCO)
is then set and an interrupt is generated if the conversion complete interrupt has been enabled (AIEN = 1).
The ADC module has the capability of automatically comparing the result of a conversion with the
contents of its compare registers. The compare function is enabled by setting the ACFE bit and operates
with any of the conversion modes and configurations.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
221
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
10.4.1 Clock Select and Divide Control
One of four clock sources can be selected as the clock source for the ADC module. This clock source is
then divided by a configurable value to generate the input clock to the converter (ADCK). The clock is
selected from one of the following sources by means of the ADICLK bits.
•
The bus clock, which is equal to the frequency at which software is executed. This is the default
selection following reset.
•
The bus clock divided by two. For higher bus clock rates, this allows a maximum divide by 16 of
the bus clock.
•
•
ALTCLK, as defined for this MCU (See module section introduction).
The asynchronous clock (ADACK). This clock is generated from a clock source within the ADC
module. When selected as the clock source, this clock remains active while the MCU is in wait or
stop3 mode and allows conversions in these modes for lower noise operation.
Whichever clock is selected, its frequency must fall within the specified frequency range for ADCK. If the
available clocks are too slow, the ADC do not perform according to specifications. If the available clocks
are too fast, the clock must be divided to the appropriate frequency. This divider is specified by the ADIV
bits and can be divide-by 1, 2, 4, or 8.
10.4.2 Input Select and Pin Control
The pin control registers (APCTL3, APCTL2, and APCTL1) disable the I/O port control of the pins used
as analog inputs.When a pin control register bit is set, the following conditions are forced for the associated
MCU pin:
•
•
The output buffer is forced to its high impedance state.
The input buffer is disabled. A read of the I/O port returns a zero for any pin with its input buffer
disabled.
•
The pullup is disabled.
10.4.3 Hardware Trigger
The ADC module has a selectable asynchronous hardware conversion trigger, ADHWT, that is enabled
when the ADTRG bit is set. This source is not available on all MCUs. Consult the module introduction for
information on the ADHWT source specific to this MCU.
When ADHWT source is available and hardware trigger is enabled (ADTRG=1), a conversion is initiated
on the rising edge of ADHWT. If a conversion is in progress when a rising edge occurs, the rising edge is
ignored. In continuous convert configuration, only the initial rising edge to launch continuous conversions
is observed. The hardware trigger function operates in conjunction with any of the conversion modes and
configurations.
10.4.4 Conversion Control
Conversions can be performed in 12-bit mode, 10-bit mode, or 8-bit mode as determined by the MODE
bits. Conversions can be initiated by a software or hardware trigger. In addition, the ADC module can be
MC9S08DZ128 Series Data Sheet, Rev. 1
222
Freescale Semiconductor
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
configured for low power operation, long sample time, continuous conversion, and automatic compare of
the conversion result to a software determined compare value.
10.4.4.1 Initiating Conversions
A conversion is initiated:
•
Following a write to ADCSC1 (with ADCH bits not all 1s) if software triggered operation is
selected.
•
•
Following a hardware trigger (ADHWT) event if hardware triggered operation is selected.
Following the transfer of the result to the data registers when continuous conversion is enabled.
If continuous conversions are enabled, a new conversion is automatically initiated after the completion of
the current conversion. In software triggered operation, continuous conversions begin after ADCSC1 is
written and continue until aborted. In hardware triggered operation, continuous conversions begin after a
hardware trigger event and continue until aborted.
10.4.4.2 Completing Conversions
A conversion is completed when the result of the conversion is transferred into the data result registers,
ADCRH and ADCRL. This is indicated by the setting of COCO. An interrupt is generated if AIEN is high
at the time that COCO is set.
A blocking mechanism prevents a new result from overwriting previous data in ADCRH and ADCRL if
the previous data is in the process of being read while in 12-bit or 10-bit MODE (the ADCRH register has
been read but the ADCRL register has not). When blocking is active, the data transfer is blocked, COCO
is not set, and the new result is lost. In the case of single conversions with the compare function enabled
and the compare condition false, blocking has no effect and ADC operation is terminated. In all other cases
of operation, when a data transfer is blocked, another conversion is initiated regardless of the state of
ADCO (single or continuous conversions enabled).
If single conversions are enabled, the blocking mechanism could result in several discarded conversions
and excess power consumption. To avoid this issue, the data registers must not be read after initiating a
single conversion until the conversion completes.
10.4.4.3 Aborting Conversions
Any conversion in progress is aborted when:
•
A write to ADCSC1 occurs (the current conversion will be aborted and a new conversion will be
initiated, if ADCH are not all 1s).
•
A write to ADCSC2, ADCCFG, ADCCVH, or ADCCVL occurs. This indicates a mode of
operation change has occurred and the current conversion is therefore invalid.
•
•
The MCU is reset.
The MCU enters stop mode with ADACK not enabled.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
223
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
When a conversion is aborted, the contents of the data registers, ADCRH and ADCRL, are not altered.
However, they continue to be the values transferred after the completion of the last successful conversion.
If the conversion was aborted by a reset, ADCRH and ADCRL return to their reset states.
10.4.4.4 Power Control
The ADC module remains in its idle state until a conversion is initiated. If ADACK is selected as the
conversion clock source, the ADACK clock generator is also enabled.
Power consumption when active can be reduced by setting ADLPC. This results in a lower maximum value
for f
(see the electrical specifications).
ADCK
10.4.4.5 Sample Time and Total Conversion Time
The total conversion time depends on the sample time (as determined by ADLSMP), the MCU bus
frequency, the conversion mode (8-bit, 10-bit or 12-bit), and the frequency of the conversion clock (fADCK).
After the module becomes active, sampling of the input begins. ADLSMP selects between short (3.5
ADCK cycles) and long (23.5 ADCK cycles) sample times.When sampling is complete, the converter is
isolated from the input channel and a successive approximation algorithm is performed to determine the
digital value of the analog signal. The result of the conversion is transferred to ADCRH and ADCRL upon
completion of the conversion algorithm.
If the bus frequency is less than the f
frequency, precise sample time for continuous conversions
ADCK
cannot be guaranteed when short sample is enabled (ADLSMP=0). If the bus frequency is less than 1/11th
of the f frequency, precise sample time for continuous conversions cannot be guaranteed when long
ADCK
sample is enabled (ADLSMP=1).
The maximum total conversion time for different conditions is summarized in Table 10-13.
Table 10-13. Total Conversion Time vs. Control Conditions
Conversion Type
ADICLK
ADLSMP
Max Total Conversion Time
Single or first continuous 8-bit
Single or first continuous 10-bit or 12-bit
Single or first continuous 8-bit
0x, 10
0x, 10
0x, 10
0x, 10
11
0
0
1
1
0
0
1
1
0
20 ADCK cycles + 5 bus clock cycles
23 ADCK cycles + 5 bus clock cycles
40 ADCK cycles + 5 bus clock cycles
43 ADCK cycles + 5 bus clock cycles
5 μs + 20 ADCK + 5 bus clock cycles
5 μs + 23 ADCK + 5 bus clock cycles
5 μs + 40 ADCK + 5 bus clock cycles
5 μs + 43 ADCK + 5 bus clock cycles
17 ADCK cycles
Single or first continuous 10-bit or 12-bit
Single or first continuous 8-bit
Single or first continuous 10-bit or 12-bit
Single or first continuous 8-bit
11
11
Single or first continuous 10-bit or 12-bit
11
Subsequent continuous 8-bit;
xx
fBUS > fADCK
Subsequent continuous 10-bit or 12-bit;
xx
xx
0
1
20 ADCK cycles
37 ADCK cycles
fBUS > fADCK
Subsequent continuous 8-bit;
fBUS > fADCK/11
MC9S08DZ128 Series Data Sheet, Rev. 1
224
Freescale Semiconductor
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
Table 10-13. Total Conversion Time vs. Control Conditions
Conversion Type
ADICLK
ADLSMP
Max Total Conversion Time
Subsequent continuous 10-bit or 12-bit;
xx
1
40 ADCK cycles
fBUS > fADCK/11
The maximum total conversion time is determined by the clock source chosen and the divide ratio selected.
The clock source is selectable by the ADICLK bits, and the divide ratio is specified by the ADIV bits. For
example, in 10-bit mode, with the bus clock selected as the input clock source, the input clock divide-by-1
ratio selected, and a bus frequency of 8 MHz, then the conversion time for a single conversion is:
23 ADCK Cyc
8 MHz/1
5 bus Cyc
8 MHz
+
Conversion time =
= 3.5 ms
Number of bus cycles = 3.5 ms x 8 MHz = 28 cycles
NOTE
The ADCK frequency must be between f
maximum to meet ADC specifications.
minimum and f
ADCK
ADCK
10.4.5 Automatic Compare Function
The compare function can be configured to check for an upper or lower limit. After the input is sampled
and converted, the result is added to the two’s complement of the compare value (ADCCVH and
ADCCVL). When comparing to an upper limit (ACFGT = 1), if the result is greater-than or equal-to the
compare value, COCO is set. When comparing to a lower limit (ACFGT = 0), if the result is less than the
compare value, COCO is set. The value generated by the addition of the conversion result and the two’s
complement of the compare value is transferred to ADCRH and ADCRL.
Upon completion of a conversion while the compare function is enabled, if the compare condition is not
true, COCO is not set and no data is transferred to the result registers. An ADC interrupt is generated upon
the setting of COCO if the ADC interrupt is enabled (AIEN = 1).
NOTE
The compare function can monitor the voltage on a channel while the MCU
is in wait or stop3 mode. The ADC interrupt wakes the MCU when the
compare condition is met.
10.4.6 MCU Wait Mode Operation
Wait mode is a lower power-consumption standby mode from which recovery is fast because the clock
sources remain active. If a conversion is in progress when the MCU enters wait mode, it continues until
completion. Conversions can be initiated while the MCU is in wait mode by means of the hardware trigger
or if continuous conversions are enabled.
The bus clock, bus clock divided by two, and ADACK are available as conversion clock sources while in
wait mode. The use of ALTCLK as the conversion clock source in wait is dependent on the definition of
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
225
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
ALTCLK for this MCU. Consult the module introduction for information on ALTCLK specific to this
MCU.
A conversion complete event sets the COCO and generates an ADC interrupt to wake the MCU from wait
mode if the ADC interrupt is enabled (AIEN = 1).
10.4.7 MCU Stop3 Mode Operation
Stop mode is a low power-consumption standby mode during which most or all clock sources on the MCU
are disabled.
10.4.7.1 Stop3 Mode With ADACK Disabled
If the asynchronous clock, ADACK, is not selected as the conversion clock, executing a stop instruction
aborts the current conversion and places the ADC in its idle state. The contents of ADCRH and ADCRL
are unaffected by stop3 mode. After exiting from stop3 mode, a software or hardware trigger is required
to resume conversions.
10.4.7.2 Stop3 Mode With ADACK Enabled
If ADACK is selected as the conversion clock, the ADC continues operation during stop3 mode. For
guaranteed ADC operation, the MCU’s voltage regulator must remain active during stop3 mode. Consult
the module introduction for configuration information for this MCU.
If a conversion is in progress when the MCU enters stop3 mode, it continues until completion. Conversions
can be initiated while the MCU is in stop3 mode by means of the hardware trigger or if continuous
conversions are enabled.
A conversion complete event sets the COCO and generates an ADC interrupt to wake the MCU from stop3
mode if the ADC interrupt is enabled (AIEN = 1).
NOTE
The ADC module can wake the system from low-power stop and cause the
MCU to begin consuming run-level currents without generating a system
level interrupt. To prevent this scenario, software should ensure the data
transfer blocking mechanism (discussed in Section 10.4.4.2, “Completing
Conversions) is cleared when entering stop3 and continuing ADC
conversions.
10.4.8 MCU Stop2 Mode Operation
The ADC module is automatically disabled when the MCU enters stop2 mode. All module registers
contain their reset values following exit from stop2. Therefore, the module must be re-enabled and
re-configured following exit from stop2.
MC9S08DZ128 Series Data Sheet, Rev. 1
226
Freescale Semiconductor
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
10.5 Initialization Information
This section gives an example that provides some basic direction on how to initialize and configure the
ADC module. You can configure the module for 8-, 10-, or 12-bit resolution, single or continuous
conversion, and a polled or interrupt approach, among many other options. Refer to Table 10-7,
Table 10-8, and Table 10-9 for information used in this example.
NOTE
Hexadecimal values designated by a preceding 0x, binary values designated
by a preceding %, and decimal values have no preceding character.
10.5.1 ADC Module Initialization Example
10.5.1.1 Initialization Sequence
Before the ADC module can be used to complete conversions, an initialization procedure must be
performed. A typical sequence is as follows:
1. Update the configuration register (ADCCFG) to select the input clock source and the divide ratio
used to generate the internal clock, ADCK. This register is also used for selecting sample time and
low-power configuration.
2. Update status and control register 2 (ADCSC2) to select the conversion trigger (hardware or
software) and compare function options, if enabled.
3. Update status and control register 1 (ADCSC1) to select whether conversions will be continuous
or completed only once, and to enable or disable conversion complete interrupts. The input channel
on which conversions will be performed is also selected here.
10.5.1.2 Pseudo-Code Example
In this example, the ADC module is set up with interrupts enabled to perform a single 10-bit conversion
at low power with a long sample time on input channel 1, where the internal ADCK clock is derived from
the bus clock divided by 1.
ADCCFG = 0x98 (%10011000)
Bit 7
Bit 6:5 ADIV
Bit 4
ADLPC
1
00
1
Configures for low power (lowers maximum clock speed)
Sets the ADCK to the input clock ÷ 1
Configures for long sample time
ADLSMP
Bit 3:2 MODE
Bit 1:0 ADICLK
10
00
Sets mode at 10-bit conversions
Selects bus clock as input clock source
ADCSC2 = 0x00 (%00000000)
Bit 7
Bit 6
Bit 5
ADACT
ADTRG
ACFE
0
0
0
Flag indicates if a conversion is in progress
Software trigger selected
Compare function disabled
Bit 4
ACFGT
0
Not used in this example
Bit 3:2
Bit 1:0
00
00
Reserved, always reads zero
Reserved for Freescale’s internal use; always write zero
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
227
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
ADCSC1 = 0x41 (%01000001)
Bit 7
Bit 6
Bit 5
COCO
AIEN
ADCO
0
1
0
Read-only flag which is set when a conversion completes
Conversion complete interrupt enabled
One conversion only (continuous conversions disabled)
Input channel 1 selected as ADC input channel
Bit 4:0 ADCH
00001
ADCRH/L = 0xxx
Holds results of conversion. Read high byte (ADCRH) before low byte (ADCRL) so that
conversion data cannot be overwritten with data from the next conversion.
ADCCVH/L = 0xxx
Holds compare value when compare function enabled
APCTL1=0x02
AD1 pin I/O control disabled. All other AD pins remain general purpose I/O pins
APCTL2=0x00
All other AD pins remain general purpose I/O pins
Reset
Initialize ADC
ADCCFG = 0x98
ADCSC2 = 0x00
ADCSC1 = 0x41
No
Check
COCO=1?
Yes
Read ADCRH
Then ADCRL To
Clear COCO Bit
Continue
Figure 10-13. Initialization Flowchart for Example
MC9S08DZ128 Series Data Sheet, Rev. 1
228
Freescale Semiconductor
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
10.6 Application Information
This section contains information for using the ADC module in applications. The ADC has been designed
to be integrated into a microcontroller for use in embedded control applications requiring an A/D
converter.
10.6.1 External Pins and Routing
The following sections discuss the external pins associated with the ADC module and how they should be
used for best results.
10.6.1.1 Analog Supply Pins
The ADC module has analog power and ground supplies (V
and V
) available as separate pins
DDAD
SSAD
on some devices. V
is shared on the same pin as the MCU digital V on some devices. On other
SSAD
SS
devices, V
and V
are shared with the MCU digital supply pins. In these cases, there are separate
SSAD
DDAD
pads for the analog supplies bonded to the same pin as the corresponding digital supply so that some degree
of isolation between the supplies is maintained.
When available on a separate pin, both V
and V
must be connected to the same voltage potential
SSAD
DDAD
as their corresponding MCU digital supply (V and V ) and must be routed carefully for maximum
DD
SS
noise immunity and bypass capacitors placed as near as possible to the package.
If separate power supplies are used for analog and digital power, the ground connection between these
supplies must be at the V
pin. This should be the only ground connection between these supplies if
SSAD
possible. The V
pin makes a good single point ground location.
SSAD
10.6.1.2 Analog Reference Pins
In addition to the analog supplies, the ADC module has connections for two reference voltage inputs. The
high reference is V
, which may be shared on the same pin as V
on some devices. The low
REFH
DDAD
reference is V
, which may be shared on the same pin as V
on some devices.
REFL
SSAD
When available on a separate pin, V
may be connected to the same potential as V
, or may be
REFH
DDAD
driven by an external source between the minimum V
spec and the V
potential (V
must
DDAD
DDAD
REFH
never exceed V
). When available on a separate pin, V
must be connected to the same voltage
DDAD
REFL
potential as V
. V
and V
must be routed carefully for maximum noise immunity and bypass
SSAD REFH
REFL
capacitors placed as near as possible to the package.
AC current in the form of current spikes required to supply charge to the capacitor array at each successive
approximation step is drawn through the V
and V
loop. The best external component to meet this
REFH
REFL
current demand is a 0.1 μF capacitor with good high frequency characteristics. This capacitor is connected
between V and V and must be placed as near as possible to the package pins. Resistance in the
REFH
REFL
path is not recommended because the current causes a voltage drop that could result in conversion errors.
Inductance in this path must be minimum (parasitic only).
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
229
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
10.6.1.3 Analog Input Pins
The external analog inputs are typically shared with digital I/O pins on MCU devices. The pin I/O control
is disabled by setting the appropriate control bit in one of the pin control registers. Conversions can be
performed on inputs without the associated pin control register bit set. It is recommended that the pin
control register bit always be set when using a pin as an analog input. This avoids problems with contention
because the output buffer is in its high impedance state and the pullup is disabled. Also, the input buffer
draws DC current when its input is not at V or V . Setting the pin control register bits for all pins used
DD
SS
as analog inputs should be done to achieve lowest operating current.
Empirical data shows that capacitors on the analog inputs improve performance in the presence of noise
or when the source impedance is high. Use of 0.01 μF capacitors with good high-frequency characteristics
is sufficient. These capacitors are not necessary in all cases, but when used they must be placed as near as
possible to the package pins and be referenced to V
.
SSA
For proper conversion, the input voltage must fall between V
and V
. If the input is equal to or
REFH
REFL
exceeds V
, the converter circuit converts the signal to 0xFFF (full scale 12-bit representation), 0x3FF
REFH
(full scale 10-bit representation) or 0xFF (full scale 8-bit representation). If the input is equal to or less
than V , the converter circuit converts it to 0x000. Input voltages between V and V are
REFL
REFH
REFL
straight-line linear conversions. There is a brief current associated with V
when the sampling
REFL
capacitor is charging. The input is sampled for 3.5 cycles of the ADCK source when ADLSMP is low, or
23.5 cycles when ADLSMP is high.
For minimal loss of accuracy due to current injection, pins adjacent to the analog input pins should not be
transitioning during conversions.
10.6.2 Sources of Error
Several sources of error exist for A/D conversions. These are discussed in the following sections.
10.6.2.1 Sampling Error
For proper conversions, the input must be sampled long enough to achieve the proper accuracy. Given the
maximum input resistance of approximately 7kΩ and input capacitance of approximately 5.5 pF, sampling
to within 1/4LSB (at 12-bit resolution) can be achieved within the minimum sample window (3.5 cycles @
8 MHz maximum ADCK frequency) provided the resistance of the external analog source (R ) is kept
AS
below 2 kΩ.
Higher source resistances or higher-accuracy sampling is possible by setting ADLSMP (to increase the
sample window to 23.5 cycles) or decreasing ADCK frequency to increase sample time.
10.6.2.2 Pin Leakage Error
Leakage on the I/O pins can cause conversion error if the external analog source resistance (R ) is high.
AS
N
If this error cannot be tolerated by the application, keep R lower than V
/ (2 *I
) for less than
AS
DDAD
LEAK
1/4LSB leakage error (N = 8 in 8-bit, 10 in 10-bit or 12 in 12-bit mode).
MC9S08DZ128 Series Data Sheet, Rev. 1
230
Freescale Semiconductor
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
10.6.2.3 Noise-Induced Errors
System noise that occurs during the sample or conversion process can affect the accuracy of the
conversion. The ADC accuracy numbers are guaranteed as specified only if the following conditions are
met:
•
•
•
There is a 0.1 μF low-ESR capacitor from V
There is a 0.1 μF low-ESR capacitor from V
to V
.
REFH
REFL
to V
.
DDAD
SSAD
If inductive isolation is used from the primary supply, an additional 1 μF capacitor is placed from
V
to V
.
DDAD
SSAD
•
•
V
(and V
, if connected) is connected to V at a quiet point in the ground plane.
SSAD
REFL SS
Operate the MCU in wait or stop3 mode before initiating (hardware triggered conversions) or
immediately after initiating (hardware or software triggered conversions) the ADC conversion.
— For software triggered conversions, immediately follow the write to ADCSC1 with a wait
instruction or stop instruction.
— For stop3 mode operation, select ADACK as the clock source. Operation in stop3 reduces V
noise but increases effective conversion time due to stop recovery.
DD
•
There is no I/O switching, input or output, on the MCU during the conversion.
There are some situations where external system activity causes radiated or conducted noise emissions or
excessive V noise is coupled into the ADC. In these situations, or when the MCU cannot be placed in
DD
wait or stop3 or I/O activity cannot be halted, these recommended actions may reduce the effect of noise
on the accuracy:
•
•
•
Place a 0.01 μF capacitor (C ) on the selected input channel to V
or V
(this improves
AS
REFL
SSAD
noise issues, but affects the sample rate based on the external analog source resistance).
Average the result by converting the analog input many times in succession and dividing the sum
of the results. Four samples are required to eliminate the effect of a 1LSB, one-time error.
Reduce the effect of synchronous noise by operating off the asynchronous clock (ADACK) and
averaging. Noise that is synchronous to ADCK cannot be averaged out.
10.6.2.4 Code Width and Quantization Error
The ADC quantizes the ideal straight-line transfer function into 4096 steps (in 12-bit mode). Each step
ideally has the same height (1 code) and width. The width is defined as the delta between the transition
points to one code and the next. The ideal code width for an N bit converter (in this case N can be 8, 10 or
12), defined as 1LSB, is:
N
1 lsb = (V
- V
) / 2
REFL
Eqn. 10-2
REFH
There is an inherent quantization error due to the digitization of the result. For 8-bit or 10-bit conversions
the code transitions when the voltage is at the midpoint between the points where the straight line transfer
function is exactly represented by the actual transfer function. Therefore, the quantization error will be
1/2 lsb in 8- or 10-bit mode. As a consequence, however, the code width of the first (0x000) conversion is
only 1/2 lsb and the code width of the last (0xFF or 0x3FF) is 1.5 lsb.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
231
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
For 12-bit conversions the code transitions only after the full code width is present, so the quantization
error is −1 lsb to 0 lsb and the code width of each step is 1 lsb.
10.6.2.5 Linearity Errors
The ADC may also exhibit non-linearity of several forms. Every effort has been made to reduce these
errors but the system should be aware of them because they affect overall accuracy. These errors are:
•
Zero-scale error (E ) (sometimes called offset) — This error is defined as the difference between
ZS
the actual code width of the first conversion and the ideal code width (1/2 lsb in 8-bit or 10-bit
modes and 1 lsb in 12-bit mode). If the first conversion is 0x001, the difference between the actual
0x001 code width and its ideal (1 lsb) is used.
•
Full-scale error (E ) — This error is defined as the difference between the actual code width of
FS
the last conversion and the ideal code width (1.5 lsb in 8-bit or 10-bit modes and 1LSB in 12-bit
mode). If the last conversion is 0x3FE, the difference between the actual 0x3FE code width and its
ideal (1LSB) is used.
•
•
Differential non-linearity (DNL) — This error is defined as the worst-case difference between the
actual code width and the ideal code width for all conversions.
Integral non-linearity (INL) — This error is defined as the highest-value the (absolute value of the)
running sum of DNL achieves. More simply, this is the worst-case difference of the actual
transition voltage to a given code and its corresponding ideal transition voltage, for all codes.
•
Total unadjusted error (TUE) — This error is defined as the difference between the actual transfer
function and the ideal straight-line transfer function and includes all forms of error.
10.6.2.6 Code Jitter, Non-Monotonicity, and Missing Codes
Analog-to-digital converters are susceptible to three special forms of error. These are code jitter,
non-monotonicity, and missing codes.
Code jitter is when, at certain points, a given input voltage converts to one of two values when sampled
repeatedly. Ideally, when the input voltage is infinitesimally smaller than the transition voltage, the
converter yields the lower code (and vice-versa). However, even small amounts of system noise can cause
the converter to be indeterminate (between two codes) for a range of input voltages around the transition
voltage. This range is normally around 1/2lsb in 8-bit or 10-bit mode, or around 2 lsb in 12-bit mode, and
increases with noise.
This error may be reduced by repeatedly sampling the input and averaging the result. Additionally the
techniques discussed in Section 10.6.2.3 reduces this error.
Non-monotonicity is defined as when, except for code jitter, the converter converts to a lower code for a
higher input voltage. Missing codes are those values never converted for any input value.
In 8-bit or 10-bit mode, the ADC is guaranteed to be monotonic and have no missing codes.
MC9S08DZ128 Series Data Sheet, Rev. 1
232
Freescale Semiconductor
Chapter 11
Inter-Integrated Circuit (S08IICV2)
11.1 Introduction
The inter-integrated circuit (IIC) provides a method of communication between a number of devices. The
interface is designed to operate up to 100 kbps with maximum bus loading and timing. The device is
capable of operating at higher baud rates, up to a maximum of clock/20, with reduced bus loading. The
maximum communication length and the number of devices that can be connected are limited by a
maximum bus capacitance of 400 pF.
All MC9S08DZ128 Series MCUs in the 100-pin package have two IICs; devices in the 64-pin and 48-pin
packages have one IIC.
NOTE
MC9S08DZ128 Series devices operate at a higher voltage range (2.7 V to
5.5 V) and do not include stop1 mode. Please ignore references to stop1.
11.1.1 IIC1 Configuration Information
The IIC1 module pins, SDA1 and SCL1 can be repositioned under software control using IIC1PS in
SOPT1 as shown in Table 11-1. IIC1PS in SOPT1 selects which general-purpose I/O ports are associated
with the IIC1 operation.
Table 11-1. IIC1 Position Options
IIC1PS in SOPT1
Port Pin for SCL1
Port Pin for SDA1
0 (default)
1
PTF2
PTE4
PTF3
PTE5
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
233
Chapter 11 Inter-Integrated Circuit (S08IICV2)
PTA7/PIA7/ADP7/IRQ
PTA6/PIA6/ADP6
PTA5/PIA5/ADP5
HCS08 CORE
DEBUG MODULE (DBG)
CPU
BKGD/MS
PTA4/PIA4/ADP4
ACMP1O
ACMP1-
ACMP1+
BDC
BKP
PTA3/PIA3/ADP3/ACMP1O
PTA2/PIA2/ADP2/ACMP1-
PTA1/PIA1/ADP1/ACMP1+
PTA0/PIA0/ADP0/MCLK
ANALOG COMPARATOR
(ACMP1)
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
RESET
REAL-TIME COUNTER (RTC)
PTB7/PIB7/ADP15
PTB6/PIB6/ADP14
PTB5/PIB5/ADP13
PTB4/PIB4/ADP12
PTB3/PIB3/ADP11
PTB2/PIB2/ADP10
PTB1/PIB1/ADP9
PTB0/PIB0/ADP8
COP
INT
LVD
IRQ
V
DD
8
VOLTAGE
REGULATOR
V
SS
V
REFH
ADP7-ADP0
24-CHANNEL,12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
V
V
V
REFL
DDA
SSA
●
●
●
●
●
●
●
●
PTC7/ADP23
PTC6/ADP22
PTC5/ADP21
PTC4/ADP20
PTC3/ADP19
PTC2/ADP18
PTC1/ADP17
PTC0/ADP16
ADP15-ADP8
ADP23-ADP16
USER MEMORY
FLASH _EEPROM _RAM
MC9S08DZ128 = 128K_2K_8K
MC9S08DZ96 = 96K_2K_6K
MC9S08DV128 = 128K_0K_6K
MC9S08DV96 = 96K_0K_4K
TPM1CH5 -
6-CHANNEL TIMER/PWM TPM1CH0
TPM1CLK
PTJ7/PIJ7/TPM3CLK
PTJ6/PIJ6
PTJ5/PIJ5
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTD1/PID1/TPM2CH1
PTD0/PID0/TPM2CH0
TPM3CLK
6
MODULE (TPM1)
TPM2CH1,
TPM2CH0
TPM2CLK
TPM3CH0 -
TPM3CH3
PTJ4/PIJ4
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTJ3/PIJ3/TMP3CH3
PTJ2/PIJ2/TPM3CH2
PTJ1/PIJ1/TPM3CH1
PTJ0/PIJ0/TMP3CH0
4-CHANNEL TIMER/PWM
MODULE (TPM3)
4
RxCAN
TXCAN
MISO1
PTK7
PTK6
PTK5
PTK4
PTK3
PTK2
PTK1
PTK0
CONTROLLER AREA
NETWORK (MSCAN)
PTE7/RxD2/RXCAN
PTE6/TxD2/TXCAN
PTE5/SDA1/MISO1
PTE4/SCL1/MOSI1
PTE3/SPSCK1
PTE2/SS1
MOSI1
SPSCK1
SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
SS1
RxD1
TxD1
PTE1/RxD1
SERIAL COMMUNICATIONS
INTERFACE (SCI1)
PTE0/TxD1
●
●
PTL7
PTL6
PTL5
PTL4
PTL3
PTL2
PTL1
PTL0
PTF7
ACMP2O
ACMP2-
ACMP2+
SDA1
PTF6/ACMP2O
PTF5/ACMP2-
PTF4/ACMP2+
PTF3/TPM2CLK/SDA1
PTF2/TPM1CLK/SCL1
PTF1/RxD2
ANALOG COMPARATOR
(ACMP2)
SCL1
IIC MODULE (IIC1)
RxD2
TxD2
SERIAL COMMUNICATIONS
INTERFACE (SCI2)
PTF0/TxD2
SDA2
SCL2
PTH7
PTH6
PTG7/SDA2
PTG6/SCL2
PTG5
IIC MODULE (IIC2)
●
●
●
●
PTH5
MULTI-PURPOSE
CLOCK
GENERATOR
(MCG)
PTH4
MISO2
PTG4
PTG3
PTH3/MISO2
PTH2/MOSI2
PTH1/SPSCK2
PTH0/SS2
MOSI2
SPSCK2
SERIAL PERIPHERAL
PTG2
XTAL
EXTAL
INTERFACE MODULE (SPI2)
OSCILLATOR
(XOSC)
SS2
PTG1/XTAL
PTG0/EXTAL
- Pin not connected in 64-pin and 48-pin packages
● - Pin not available in the 48-pin package
- In 48-pin package, VDDA and VREFH are internally connected to each other and VSSA and VREFL are internally connected to each other.
Figure 11-1. MC9S08DZ128 Block Diagram with IIC Highlighted
MC9S08DZ128 Series Data Sheet, Rev. 1
234
Freescale Semiconductor
Chapter 11 Inter-Integrated Circuit (S08IICV2)
11.1.2 Features
The IIC includes these distinctive features:
•
•
•
•
•
•
•
•
•
•
•
•
•
Compatible with IIC bus standard
Multi-master operation
Software programmable for one of 64 different serial clock frequencies
Software selectable acknowledge bit
Interrupt driven byte-by-byte data transfer
Arbitration lost interrupt with automatic mode switching from master to slave
Calling address identification interrupt
Start and stop signal generation/detection
Repeated start signal generation
Acknowledge bit generation/detection
Bus busy detection
General call recognition
10-bit address extension
11.1.3 Modes of Operation
A brief description of the IIC in the various MCU modes is given here.
•
•
•
Run mode — This is the basic mode of operation. To conserve power in this mode, disable the
module.
Wait mode — The module continues to operate while the MCU is in wait mode and can provide
a wake-up interrupt.
Stop mode — The IIC is inactive in stop3 mode for reduced power consumption. The stop
instruction does not affect IIC register states. Stop2 resets the register contents.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
235
Chapter 11 Inter-Integrated Circuit (S08IICV2)
11.1.4 Block Diagram
Figure 11-2 is a block diagram of the IIC.
Address
Data Bus
Interrupt
ADDR_DECODE
DATA_MUX
CTRL_REG
FREQ_REG
ADDR_REG
STATUS_REG
DATA_REG
Input
Sync
In/Out
Data
Shift
Start
Stop
Arbitration
Control
Register
Clock
Control
Address
Compare
SDA
SCL
Figure 11-2. IIC Functional Block Diagram
11.2 External Signal Description
This section describes each user-accessible pin signal.
11.2.1 SCL — Serial Clock Line
The bidirectional SCL is the serial clock line of the IIC system.
11.2.2 SDA — Serial Data Line
The bidirectional SDA is the serial data line of the IIC system.
11.3 Register Definition
This section consists of the IIC register descriptions in address order.
MC9S08DZ128 Series Data Sheet, Rev. 1
236
Freescale Semiconductor
Chapter 11 Inter-Integrated Circuit (S08IICV2)
Refer to the direct-page register summary in the memory chapter of this document for the absolute address
assignments for all IIC registers. This section refers to registers and control bits only by their names. A
Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
11.3.1 IIC Address Register (IICxA)
7
6
5
4
3
2
1
0
R
W
0
AD7
AD6
AD5
AD4
AD3
AD2
AD1
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-3. IIC Address Register (IICxA)
Table 11-2. IICxA Field Descriptions
Description
Field
7–1
Slave Address. The AD[7:1] field contains the slave address to be used by the IIC module. This field is used on
AD[7:1]
the 7-bit address scheme and the lower seven bits of the 10-bit address scheme.
11.3.2 IIC Frequency Divider Register (IICxF)
7
6
5
4
3
2
1
0
R
W
MULT
ICR
Reset
0
0
0
0
0
0
0
0
Figure 11-4. IIC Frequency Divider Register (IICxF)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
237
Chapter 11 Inter-Integrated Circuit (S08IICV2)
Table 11-3. IICxF Field Descriptions
Description
Field
7–6
IIC Multiplier Factor. The MULT bits define the multiplier factor, mul. This factor, along with the SCL divider,
MULT
generates the IIC baud rate. The multiplier factor mul as defined by the MULT bits is provided below.
00 mul = 01
01 mul = 02
10 mul = 04
11 Reserved
5–0
ICR
IIC Clock Rate. The ICR bits are used to prescale the bus clock for bit rate selection. These bits and the MULT
bits determine the IIC baud rate, the SDA hold time, the SCL Start hold time, and the SCL Stop hold time.
Table 11-5 provides the SCL divider and hold values for corresponding values of the ICR.
The SCL divider multiplied by multiplier factor mul generates IIC baud rate.
bus speed (Hz)
IIC baud rate = --------------------------------------------
Eqn. 11-1
mul × SCLdivider
SDA hold time is the delay from the falling edge of SCL (IIC clock) to the changing of SDA (IIC data).
SDA hold time = bus period (s) × mul × SDA hold value
Eqn. 11-2
SCL start hold time is the delay from the falling edge of SDA (IIC data) while SCL is high (Start condition) to the
falling edge of SCL (IIC clock).
SCL Start hold time = bus period (s) × mul × SCL Start hold value
Eqn. 11-3
SCL stop hold time is the delay from the rising edge of SCL (IIC clock) to the rising edge of SDA
SDA (IIC data) while SCL is high (Stop condition).
SCL Stop hold time = bus period (s) × mul × SCL Stop hold value
Eqn. 11-4
For example, if the bus speed is 8 MHz, the table below shows the possible hold time values with different
ICR and MULT selections to achieve an IIC baud rate of 100kbps.
Table 11-4. Hold Time Values for 8 MHz Bus Speed
Hold Times (μs)
MULT
ICR
SDA
SCL Start
SCL Stop
0x2
0x1
0x1
0x0
0x0
0x00
0x07
0x0B
0x14
0x18
3.500
2.500
2.250
2.125
1.125
3.000
4.000
4.000
4.250
4.750
5.500
5.250
5.250
5.125
5.125
MC9S08DZ128 Series Data Sheet, Rev. 1
238
Freescale Semiconductor
Chapter 11 Inter-Integrated Circuit (S08IICV2)
Table 11-5. IIC Divider and Hold Values
SCL Hold SDA Hold
SCL Hold SCL Hold
ICR
(hex)
SCL
Divider
SDA Hold
Value
ICR
(hex)
SCL
Divider
SDA Hold
Value
(Start)
Value
(Stop)
Value
(Start)
Value
(Stop)
Value
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
22
7
7
6
7
11
12
13
14
15
16
18
21
15
17
19
21
23
25
29
35
25
29
33
37
41
45
53
65
41
49
57
65
73
81
97
121
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
160
192
17
17
78
94
81
97
24
8
8
224
33
110
126
142
158
190
238
158
190
222
254
286
318
382
478
318
382
446
510
574
638
766
958
638
766
894
1022
1150
1278
1534
1918
113
129
145
161
193
241
161
193
225
257
289
321
385
481
321
385
449
513
577
641
769
961
641
769
897
1025
1153
1281
1537
1921
26
8
9
256
33
28
9
10
11
13
16
10
12
14
16
18
20
24
30
18
22
26
30
34
38
46
58
38
46
54
62
70
78
94
118
288
49
30
9
320
49
34
10
10
7
384
65
40
480
65
28
320
33
32
7
384
33
36
9
448
65
40
9
512
65
44
11
11
13
13
9
576
97
48
640
97
56
768
129
129
65
68
960
48
640
56
9
768
65
64
13
13
17
17
21
21
9
896
129
129
193
193
257
257
129
129
257
257
385
385
513
513
72
1024
1152
1280
1536
1920
1280
1536
1792
2048
2304
2560
3072
3840
80
88
104
128
80
96
9
112
128
144
160
192
240
17
17
25
25
33
33
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
239
Chapter 11 Inter-Integrated Circuit (S08IICV2)
11.3.3 IIC Control Register (IICxC1)
7
6
5
4
3
2
1
0
R
W
0
0
0
IICEN
IICIE
MST
TX
TXAK
RSTA
0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-5. IIC Control Register (IICxC1)
Table 11-6. IICxC1 Field Descriptions
Description
Field
7
IIC Enable. The IICEN bit determines whether the IIC module is enabled.
IICEN
0 IIC is not enabled
1 IIC is enabled
6
IICIE
IIC Interrupt Enable. The IICIE bit determines whether an IIC interrupt is requested.
0 IIC interrupt request not enabled
1 IIC interrupt request enabled
5
Master Mode Select. The MST bit changes from a 0 to a 1 when a start signal is generated on the bus and
MST
master mode is selected. When this bit changes from a 1 to a 0 a stop signal is generated and the mode of
operation changes from master to slave.
0 Slave mode
1 Master mode
4
Transmit Mode Select. The TX bit selects the direction of master and slave transfers. In master mode, this bit
TX
should be set according to the type of transfer required. Therefore, for address cycles, this bit is always high.
When addressed as a slave, this bit should be set by software according to the SRW bit in the status register.
0 Receive
1 Transmit
3
Transmit Acknowledge Enable. This bit specifies the value driven onto the SDA during data acknowledge
cycles for master and slave receivers.
TXAK
0 An acknowledge signal is sent out to the bus after receiving one data byte
1 No acknowledge signal response is sent
2
Repeat start. Writing a 1 to this bit generates a repeated start condition provided it is the current master. This
RSTA
bit is always read as cleared. Attempting a repeat at the wrong time results in loss of arbitration.
MC9S08DZ128 Series Data Sheet, Rev. 1
240
Freescale Semiconductor
Chapter 11 Inter-Integrated Circuit (S08IICV2)
11.3.4 IIC Status Register (IICxS)
7
6
5
4
3
2
1
0
R
W
TCF
BUSY
0
SRW
RXAK
IAAS
ARBL
IICIF
Reset
1
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-6. IIC Status Register (IICxS)
Table 11-7. IICxS Field Descriptions
Description
Field
7
TCF
Transfer Complete Flag. This bit is set on the completion of a byte transfer. This bit is only valid during or
immediately following a transfer to the IIC module or from the IIC module.The TCF bit is cleared by reading the
IICxD register in receive mode or writing to the IICxD in transmit mode.
0 Transfer in progress
1 Transfer complete
6
Addressed as a Slave. The IAAS bit is set when the calling address matches the programmed slave address
IAAS
or when the GCAEN bit is set and a general call is received. Writing the IICxC register clears this bit.
0 Not addressed
1 Addressed as a slave
5
Bus Busy. The BUSY bit indicates the status of the bus regardless of slave or master mode. The BUSY bit is
BUSY
set when a start signal is detected and cleared when a stop signal is detected.
0 Bus is idle
1 Bus is busy
4
Arbitration Lost. This bit is set by hardware when the arbitration procedure is lost. The ARBL bit must be cleared
ARBL
by software by writing a 1 to it.
0 Standard bus operation
1 Loss of arbitration
2
Slave Read/Write. When addressed as a slave, the SRW bit indicates the value of the R/W command bit of the
calling address sent to the master.
SRW
0 Slave receive, master writing to slave
1 Slave transmit, master reading from slave
1
IIC Interrupt Flag. The IICIF bit is set when an interrupt is pending. This bit must be cleared by software, by
IICIF
writing a 1 to it in the interrupt routine. One of the following events can set the IICIF bit:
•
•
•
One byte transfer completes
Match of slave address to calling address
Arbitration lost
0 No interrupt pending
1 Interrupt pending
0
Receive Acknowledge. When the RXAK bit is low, it indicates an acknowledge signal has been received after
RXAK
the completion of one byte of data transmission on the bus. If the RXAK bit is high it means that no acknowledge
signal is detected.
0 Acknowledge received
1 No acknowledge received
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
241
Chapter 11 Inter-Integrated Circuit (S08IICV2)
11.3.5 IIC Data I/O Register (IICxD)
7
6
5
4
3
2
1
0
R
W
DATA
Reset
0
0
0
0
0
0
0
0
Figure 11-7. IIC Data I/O Register (IICxD)
Table 11-8. IICxD Field Descriptions
Description
Field
7–0
Data — In master transmit mode, when data is written to the IICxD, a data transfer is initiated. The most
DATA
significant bit is sent first. In master receive mode, reading this register initiates receiving of the next byte of data.
NOTE
When transitioning out of master receive mode, the IIC mode should be
switched before reading the IICxD register to prevent an inadvertent
initiation of a master receive data transfer.
In slave mode, the same functions are available after an address match has occurred.
The TX bit in IICxC must correctly reflect the desired direction of transfer in master and slave modes for
the transmission to begin. For instance, if the IIC is configured for master transmit but a master receive is
desired, reading the IICxD does not initiate the receive.
Reading the IICxD returns the last byte received while the IIC is configured in master receive or slave
receive modes. The IICxD does not reflect every byte transmitted on the IIC bus, nor can software verify
that a byte has been written to the IICxD correctly by reading it back.
In master transmit mode, the first byte of data written to IICxD following assertion of MST is used for the
address transfer and should comprise of the calling address (in bit 7 to bit 1) concatenated with the required
R/W bit (in position bit 0).
11.3.6 IIC Control Register 2 (IICxC2)
7
6
5
4
3
2
1
0
R
W
0
0
0
GCAEN
ADEXT
AD10
AD9
AD8
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-8. IIC Control Register (IICxC2)
MC9S08DZ128 Series Data Sheet, Rev. 1
242
Freescale Semiconductor
Chapter 11 Inter-Integrated Circuit (S08IICV2)
Table 11-9. IICxC2 Field Descriptions
Description
Field
7
General Call Address Enable. The GCAEN bit enables or disables general call address.
0 General call address is disabled
GCAEN
1 General call address is enabled
6
Address Extension. The ADEXT bit controls the number of bits used for the slave address.
ADEXT
0 7-bit address scheme
1 10-bit address scheme
2–0
AD[10:8]
Slave Address. The AD[10:8] field contains the upper three bits of the slave address in the 10-bit address
scheme. This field is only valid when the ADEXT bit is set.
11.4 Functional Description
This section provides a complete functional description of the IIC module.
11.4.1 IIC Protocol
The IIC bus system uses a serial data line (SDA) and a serial clock line (SCL) for data transfer. All devices
connected to it must have open drain or open collector outputs. A logic AND function is exercised on both
lines with external pull-up resistors. The value of these resistors is system dependent.
Normally, a standard communication is composed of four parts:
•
•
•
•
Start signal
Slave address transmission
Data transfer
Stop signal
The stop signal should not be confused with the CPU stop instruction. The IIC bus system communication
is described briefly in the following sections and illustrated in Figure 11-9.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
243
Chapter 11 Inter-Integrated Circuit (S08IICV2)
msb
lsb
8
msb
1
lsb
8
SCL
SDA
1
2
3
4
5
6
7
9
2
3
4
5
6
7
9
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
XXX
D7 D6 D5
D4 D3 D2 D1 D0
Start
Signal
Calling Address
Read/ Ack
Data Byte
No
Stop
Ack Signal
Bit
Bit
Write
msb
1
lsb
msb
lsb
SCL
SDA
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
XX
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
Start
Signal
Calling Address
Read/ Ack
Repeated
Start
Signal
New Calling Address
No
Stop
Read/
Write
Ack Signal
Bit
Bit
Write
Figure 11-9. IIC Bus Transmission Signals
11.4.1.1 Start Signal
When the bus is free, no master device is engaging the bus (SCL and SDA lines are at logical high), a
master may initiate communication by sending a start signal. As shown in Figure 11-9, a start signal is
defined as a high-to-low transition of SDA while SCL is high. This signal denotes the beginning of a new
data transfer (each data transfer may contain several bytes of data) and brings all slaves out of their idle
states.
11.4.1.2 Slave Address Transmission
The first byte of data transferred immediately after the start signal is the slave address transmitted by the
master. This is a seven-bit calling address followed by a R/W bit. The R/W bit tells the slave the desired
direction of data transfer.
1 = Read transfer, the slave transmits data to the master.
0 = Write transfer, the master transmits data to the slave.
Only the slave with a calling address that matches the one transmitted by the master responds by sending
back an acknowledge bit. This is done by pulling the SDA low at the ninth clock (see Figure 11-9).
No two slaves in the system may have the same address. If the IIC module is the master, it must not transmit
an address equal to its own slave address. The IIC cannot be master and slave at the same time. However,
if arbitration is lost during an address cycle, the IIC reverts to slave mode and operates correctly even if it
is being addressed by another master.
MC9S08DZ128 Series Data Sheet, Rev. 1
244
Freescale Semiconductor
Chapter 11 Inter-Integrated Circuit (S08IICV2)
11.4.1.3 Data Transfer
Before successful slave addressing is achieved, the data transfer can proceed byte-by-byte in a direction
specified by the R/W bit sent by the calling master.
All transfers that come after an address cycle are referred to as data transfers, even if they carry sub-address
information for the slave device
Each data byte is 8 bits long. Data may be changed only while SCL is low and must be held stable while
SCL is high as shown in Figure 11-9. There is one clock pulse on SCL for each data bit, the msb being
transferred first. Each data byte is followed by a 9th (acknowledge) bit, which is signalled from the
receiving device. An acknowledge is signalled by pulling the SDA low at the ninth clock. In summary, one
complete data transfer needs nine clock pulses.
If the slave receiver does not acknowledge the master in the ninth bit time, the SDA line must be left high
by the slave. The master interprets the failed acknowledge as an unsuccessful data transfer.
If the master receiver does not acknowledge the slave transmitter after a data byte transmission, the slave
interprets this as an end of data transfer and releases the SDA line.
In either case, the data transfer is aborted and the master does one of two things:
•
•
Relinquishes the bus by generating a stop signal.
Commences a new calling by generating a repeated start signal.
11.4.1.4 Stop Signal
The master can terminate the communication by generating a stop signal to free the bus. However, the
master may generate a start signal followed by a calling command without generating a stop signal first.
This is called repeated start. A stop signal is defined as a low-to-high transition of SDA while SCL at
logical 1 (see Figure 11-9).
The master can generate a stop even if the slave has generated an acknowledge at which point the slave
must release the bus.
11.4.1.5 Repeated Start Signal
As shown in Figure 11-9, a repeated start signal is a start signal generated without first generating a stop
signal to terminate the communication. This is used by the master to communicate with another slave or
with the same slave in different mode (transmit/receive mode) without releasing the bus.
11.4.1.6 Arbitration Procedure
The IIC bus is a true multi-master bus that allows more than one master to be connected on it. If two or
more masters try to control the bus at the same time, a clock synchronization procedure determines the bus
clock, for which the low period is equal to the longest clock low period and the high is equal to the shortest
one among the masters. The relative priority of the contending masters is determined by a data arbitration
procedure, a bus master loses arbitration if it transmits logic 1 while another master transmits logic 0. The
losing masters immediately switch over to slave receive mode and stop driving SDA output. In this case,
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
245
Chapter 11 Inter-Integrated Circuit (S08IICV2)
the transition from master to slave mode does not generate a stop condition. Meanwhile, a status bit is set
by hardware to indicate loss of arbitration.
11.4.1.7 Clock Synchronization
Because wire-AND logic is performed on the SCL line, a high-to-low transition on the SCL line affects all
the devices connected on the bus. The devices start counting their low period and after a device’s clock has
gone low, it holds the SCL line low until the clock high state is reached. However, the change of low to
high in this device clock may not change the state of the SCL line if another device clock is still within its
low period. Therefore, synchronized clock SCL is held low by the device with the longest low period.
Devices with shorter low periods enter a high wait state during this time (see Figure 11-10). When all
devices concerned have counted off their low period, the synchronized clock SCL line is released and
pulled high. There is then no difference between the device clocks and the state of the SCL line and all the
devices start counting their high periods. The first device to complete its high period pulls the SCL line
low again.
Start Counting High Period
Delay
SCL1
SCL2
SCL
Internal Counter Reset
Figure 11-10. IIC Clock Synchronization
11.4.1.8 Handshaking
The clock synchronization mechanism can be used as a handshake in data transfer. Slave devices may hold
the SCL low after completion of one byte transfer (9 bits). In such a case, it halts the bus clock and forces
the master clock into wait states until the slave releases the SCL line.
11.4.1.9 Clock Stretching
The clock synchronization mechanism can be used by slaves to slow down the bit rate of a transfer. After
the master has driven SCL low the slave can drive SCL low for the required period and then release it. If
the slave SCL low period is greater than the master SCL low period then the resulting SCL bus signal low
period is stretched.
MC9S08DZ128 Series Data Sheet, Rev. 1
246
Freescale Semiconductor
Chapter 11 Inter-Integrated Circuit (S08IICV2)
11.4.2 10-bit Address
For 10-bit addressing, 0x11110 is used for the first 5 bits of the first address byte. Various combinations of
read/write formats are possible within a transfer that includes 10-bit addressing.
11.4.2.1 Master-Transmitter Addresses a Slave-Receiver
The transfer direction is not changed (see Table 11-10). When a 10-bit address follows a start condition,
each slave compares the first seven bits of the first byte of the slave address (11110XX) with its own
address and tests whether the eighth bit (R/W direction bit) is 0. More than one device can find a match
and generate an acknowledge (A1). Then, each slave that finds a match compares the eight bits of the
second byte of the slave address with its own address. Only one slave finds a match and generates an
acknowledge (A2). The matching slave remains addressed by the master until it receives a stop condition
(P) or a repeated start condition (Sr) followed by a different slave address.
Slave Address 1st 7 bits R/W
11110 + AD10 + AD9
Slave Address 2nd byte
AD[8:1]
S
A1
A2
Data
A
...
Data
A/A
P
0
Table 11-10. Master-Transmitter Addresses Slave-Receiver with a 10-bit Address
After the master-transmitter has sent the first byte of the 10-bit address, the slave-receiver sees an IIC
interrupt. Software must ensure the contents of IICD are ignored and not treated as valid data for this
interrupt.
11.4.2.2 Master-Receiver Addresses a Slave-Transmitter
The transfer direction is changed after the second R/W bit (see Table 11-11). Up to and including
acknowledge bit A2, the procedure is the same as that described for a master-transmitter addressing a
slave-receiver. After the repeated start condition (Sr), a matching slave remembers that it was addressed
before. This slave then checks whether the first seven bits of the first byte of the slave address following
Sr are the same as they were after the start condition (S) and tests whether the eighth (R/W) bit is 1. If there
is a match, the slave considers that it has been addressed as a transmitter and generates acknowledge A3.
The slave-transmitter remains addressed until it receives a stop condition (P) or a repeated start condition
(Sr) followed by a different slave address.
After a repeated start condition (Sr), all other slave devices also compare the first seven bits of the first byte
of the slave address with their own addresses and test the eighth (R/W) bit. However, none of them are
addressed because R/W = 1 (for 10-bit devices) or the 11110XX slave address (for 7-bit devices) does not
match.
Slave Address
1st 7 bits
Slave Address
2nd byte
Slave Address
1st 7 bits
R/W
0
R/W
1
S
A1
A2
Sr
A3
Data
A
...
Data
A
P
11110 + AD10 + AD9
AD[8:1]
11110 + AD10 + AD9
Table 11-11. Master-Receiver Addresses a Slave-Transmitter with a 10-bit Address
After the master-receiver has sent the first byte of the 10-bit address, the slave-transmitter sees an IIC
interrupt. Software must ensure the contents of IICD are ignored and not treated as valid data for this
interrupt.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
247
Chapter 11 Inter-Integrated Circuit (S08IICV2)
11.4.3 General Call Address
General calls can be requested in 7-bit address or 10-bit address. If the GCAEN bit is set, the IIC matches
the general call address as well as its own slave address. When the IIC responds to a general call, it acts as
a slave-receiver and the IAAS bit is set after the address cycle. Software must read the IICD register after
the first byte transfer to determine whether the address matches is its own slave address or a general call.
If the value is 00, the match is a general call. If the GCAEN bit is clear, the IIC ignores any data supplied
from a general call address by not issuing an acknowledgement.
11.5 Resets
The IIC is disabled after reset. The IIC cannot cause an MCU reset.
11.6 Interrupts
The IIC generates a single interrupt.
An interrupt from the IIC is generated when any of the events in Table 11-12 occur, provided the IICIE bit
is set. The interrupt is driven by bit IICIF (of the IIC status register) and masked with bit IICIE (of the IIC
control register). The IICIF bit must be cleared by software by writing a 1 to it in the interrupt routine. You
can determine the interrupt type by reading the status register.
Table 11-12. Interrupt Summary
Interrupt Source
Status
Flag
Local Enable
Complete 1-byte transfer
Match of received calling address
Arbitration Lost
TCF
IAAS
ARBL
IICIF
IICIF
IICIF
IICIE
IICIE
IICIE
11.6.1 Byte Transfer Interrupt
The TCF (transfer complete flag) bit is set at the falling edge of the ninth clock to indicate the completion
of byte transfer.
11.6.2 Address Detect Interrupt
When the calling address matches the programmed slave address (IIC address register) or when the
GCAEN bit is set and a general call is received, the IAAS bit in the status register is set. The CPU is
interrupted, provided the IICIE is set. The CPU must check the SRW bit and set its Tx mode accordingly.
11.6.3 Arbitration Lost Interrupt
The IIC is a true multi-master bus that allows more than one master to be connected on it. If two or more
masters try to control the bus at the same time, the relative priority of the contending masters is determined
by a data arbitration procedure. The IIC module asserts this interrupt when it loses the data arbitration
process and the ARBL bit in the status register is set.
MC9S08DZ128 Series Data Sheet, Rev. 1
248
Freescale Semiconductor
Chapter 11 Inter-Integrated Circuit (S08IICV2)
Arbitration is lost in the following circumstances:
•
•
SDA sampled as a low when the master drives a high during an address or data transmit cycle.
SDA sampled as a low when the master drives a high during the acknowledge bit of a data receive
cycle.
•
•
•
A start cycle is attempted when the bus is busy.
A repeated start cycle is requested in slave mode.
A stop condition is detected when the master did not request it.
This bit must be cleared by software writing a 1 to it.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
249
Chapter 11 Inter-Integrated Circuit (S08IICV2)
11.7 Initialization/Application Information
Module Initialization (Slave)
1. Write: IICC2
—
—
to enable or disable general call
to select 10-bit or 7-bit addressing mode
2. Write: IICA
—
to set the slave address
3. Write: IICC1
—
to enable IIC and interrupts
4. Initialize RAM variables (IICEN = 1 and IICIE = 1) for transmit data
5. Initialize RAM variables used to achieve the routine shown in Figure 11-12
Module Initialization (Master)
1. Write: IICF
—
to set the IIC baud rate (example provided in this chapter)
2. Write: IICC1
—
to enable IIC and interrupts
3. Initialize RAM variables (IICEN = 1 and IICIE = 1) for transmit data
4. Initialize RAM variables used to achieve the routine shown in Figure 11-12
5. Write: IICC1
—
to enable TX
6. Write: IICC1
—
to enable MST (master mode)
7. Write: IICD
—
with the address of the target slave. (The lsb of this byte determines whether the communication is
master receive or transmit.)
Module Use
The routine shown in Figure 11-12 can handle both master and slave IIC operations. For slave operation, an
incoming IIC message that contains the proper address begins IIC communication. For master operation,
communication must be initiated by writing to the IICD register.
Register Model
AD[7:1]
When addressed as a slave (in slave mode), the module responds to this address
MULT
Baud rate = BUSCLK / (2 x MULT x (SCL DIVIDER))
0
IICA
IICF
ICR
IICEN
Module configuration
TCF IAAS
Module status flags
IICIE
MST
TX
TXAK
RSTA
0
0
IICC1
IICS
BUSY
ARBL
0
SRW
IICIF
RXAK
DATA
Data register; Write to transmit IIC data read to read IIC data
IICD
GCAEN ADEXT
0
0
0
AD10
AD9
AD8
IICC2
Address configuration
Figure 11-11. IIC Module Quick Start
MC9S08DZ128 Series Data Sheet, Rev. 1
250
Freescale Semiconductor
Chapter 11 Inter-Integrated Circuit (S08IICV2)
Clear
IICIF
Master
Mode
?
Y
N
Y
Arbitration
Lost
TX
RX
Tx/Rx
?
?
N
Last Byte
Transmitted
Clear ARBL
Y
N
?
N
Last
Byte to Be Read
?
Y
N
RXAK=0
?
IAAS=1
?
IAAS=1
?
Y
N
Y
Y
N
Data Transfer
See Note 2
Address Transfer
See Note 1
Y
End of
Addr Cycle
(Master Rx)
?
2nd Last
Byte to Be Read
?
(Read)
Y
Y
SRW=1
TX/RX
RX
?
?
TX
(Write)
N
N
N
ACK from
Receiver
?
Y
Generate
Stop Signal
(MST = 0)
Write Next
Byte to IICD
Set TX
Mode
Set TXACK =1
N
Read Data
from IICD
and Store
Tx Next
Byte
Write Data
to IICD
Switch to
Rx Mode
Set RX
Mode
Switch to
Rx Mode
Generate
Stop Signal
(MST = 0)
Read Data
from IICD
and Store
Dummy Read
from IICD
Dummy Read
from IICD
Dummy Read
from IICD
RTI
NOTES:
1. If general call is enabled, a check must be done to determine whether the received address was a general call address (0x00). If the received address was a
general call address, then the general call must be handled by user software.
2. When 10-bit addressing is used to address a slave, the slave sees an interrupt following the first byte of the extended address. User software must ensure that for
this interrupt, the contents of IICD are ignored and not treated as a valid data transfer
Figure 11-12. Typical IIC Interrupt Routine
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
251
Chapter 11 Inter-Integrated Circuit (S08IICV2)
MC9S08DZ128 Series Data Sheet, Rev. 1
252
Freescale Semiconductor
Chapter 12
Freescale’s Controller Area Network (S08MSCANV1)
12.1 Introduction
Freescale’s controller area network (MSCAN) is a communication controller implementing the CAN
2.0A/B protocol as defined in the Bosch specification dated September 1991. To fully understand the
MSCAN specification, it is recommended that the Bosch specification be read first to gain familiarity with
the terms and concepts contained within this document.
Though not exclusively intended for automotive applications, CAN protocol is designed to meet the
specific requirements of a vehicle serial data bus: real-time processing, reliable operation in the EMI
environment of a vehicle, cost-effectiveness, and required bandwidth.
MSCAN uses an advanced buffer arrangement resulting in predictable real-time behavior and simplified
application software.
The MSCAN module is available in all devices in the MC9S08DZ128 Series.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
253
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
PTA7/PIA7/ADP7/IRQ
PTA6/PIA6/ADP6
PTA5/PIA5/ADP5
HCS08 CORE
DEBUG MODULE (DBG)
CPU
BKGD/MS
RESET
PTA4/PIA4/ADP4
ACMP1O
ACMP1-
ACMP1+
BDC
BKP
PTA3/PIA3/ADP3/ACMP1O
PTA2/PIA2/ADP2/ACMP1-
PTA1/PIA1/ADP1/ACMP1+
PTA0/PIA0/ADP0/MCLK
ANALOG COMPARATOR
(ACMP1)
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
REAL-TIME COUNTER (RTC)
PTB7/PIB7/ADP15
PTB6/PIB6/ADP14
PTB5/PIB5/ADP13
PTB4/PIB4/ADP12
PTB3/PIB3/ADP11
PTB2/PIB2/ADP10
PTB1/PIB1/ADP9
PTB0/PIB0/ADP8
COP
INT
LVD
IRQ
V
DD
8
VOLTAGE
REGULATOR
V
SS
V
REFH
ADP7-ADP0
24-CHANNEL,12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
V
REFL
●
●
●
●
●
●
●
●
PTC7/ADP23
PTC6/ADP22
PTC5/ADP21
PTC4/ADP20
PTC3/ADP19
PTC2/ADP18
PTC1/ADP17
PTC0/ADP16
V
DDA
ADP15-ADP8
ADP23-ADP16
V
SSA
USER MEMORY
FLASH _EEPROM _RAM
MC9S08DZ128 = 128K_2K_8K
MC9S08DZ96 = 96K_2K_6K
MC9S08DV128 = 128K_0K_6K
MC9S08DV96 = 96K_0K_4K
TPM1CH5 -
6-CHANNEL TIMER/PWM TPM1CH0
TPM1CLK
PTJ7/PIJ7/TPM3CLK
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTD1/PID1/TPM2CH1
PTD0/PID0/TPM2CH0
TPM3CLK
6
PTJ6/PIJ6
PTJ5/PIJ5
PTJ4/PIJ4
MODULE (TPM1)
TPM2CH1,
TPM2CH0
TPM2CLK
TPM3CH0 -
TPM3CH3
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTJ3/PIJ3/TMP3CH3
PTJ2/PIJ2/TPM3CH2
PTJ1/PIJ1/TPM3CH1
PTJ0/PIJ0/TMP3CH0
4-CHANNEL TIMER/PWM
MODULE (TPM3)
4
RxCAN
TXCAN
MISO1
PTK7
PTK6
PTK5
PTK4
PTK3
PTK2
PTK1
PTK0
CONTROLLER AREA
NETWORK (MSCAN)
PTE7/RxD2/RXCAN
PTE6/TxD2/TXCAN
PTE5/SDA1/MISO1
PTE4/SCL1/MOSI1
PTE3/SPSCK1
PTE2/SS1
MOSI1
SPSCK1
SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
SS1
RxD1
TxD1
PTE1/RxD1
SERIAL COMMUNICATIONS
INTERFACE (SCI1)
PTE0/TxD1
●
●
PTL7
PTL6
PTL5
PTL4
PTL3
PTL2
PTL1
PTL0
PTF7
ACMP2O
ACMP2-
ACMP2+
SDA1
PTF6/ACMP2O
PTF5/ACMP2-
PTF4/ACMP2+
PTF3/TPM2CLK/SDA1
PTF2/TPM1CLK/SCL1
PTF1/RxD2
ANALOG COMPARATOR
(ACMP2)
SCL1
IIC MODULE (IIC1)
RxD2
TxD2
SERIAL COMMUNICATIONS
INTERFACE (SCI2)
PTF0/TxD2
SDA2
SCL2
PTH7
PTH6
PTG7/SDA2
PTG6/SCL2
PTG5
IIC MODULE (IIC2)
●
●
●
●
PTH5
MULTI-PURPOSE
CLOCK
GENERATOR
(MCG)
PTH4
MISO2
PTG4
PTG3
PTH3/MISO2
PTH2/MOSI2
PTH1/SPSCK2
PTH0/SS2
MOSI2
SPSCK2
SERIAL PERIPHERAL
PTG2
XTAL
EXTAL
INTERFACE MODULE (SPI2)
OSCILLATOR
(XOSC)
SS2
PTG1/XTAL
PTG0/EXTAL
- Pin not connected in 64-pin and 48-pin packages
● - Pin not available in the 48-pin package
- In 48-pin package, VDDA and VREFH are internally connected to each other and VSSA and VREFL are internally connected to each other.
Figure 12-1. MC9S08DZ128 Block Diagram with MSCAN Highlighted
MC9S08DZ128 Series Data Sheet, Rev. 1
254
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.1.1 Features
The basic features of the MSCAN are as follows:
•
Implementation of the CAN protocol — Version 2.0A/B
— Standard and extended data frames
— Zero to eight bytes data length
— Programmable bit rate up to 1 Mbps
— Support for remote frames
1
•
•
•
Five receive buffers with FIFO storage scheme
Three transmit buffers with internal prioritization using a “local priority” concept
Flexible maskable identifier filter supports two full-size (32-bit) extended identifier filters, or four
16-bit filters, or eight 8-bit filters
•
•
•
•
•
Programmable wakeup functionality with integrated low-pass filter
Programmable loopback mode supports self-test operation
Programmable listen-only mode for monitoring of CAN bus
Programmable bus-off recovery functionality
Separate signalling and interrupt capabilities for all CAN receiver and transmitter error states
(warning, error passive, bus-off)
•
•
•
•
Programmable MSCAN clock source either bus clock or oscillator clock
Internal timer for time-stamping of received and transmitted messages
Three low-power modes: sleep, power down, and MSCAN enable
Global initialization of configuration registers
12.1.2 Modes of Operation
The following modes of operation are specific to the MSCAN. See Section 12.5, “Functional Description,”
for details.
•
•
•
•
•
Listen-Only Mode
MSCAN Sleep Mode
MSCAN Initialization Mode
MSCAN Power Down Mode
Loopback Self Test Mode
1. Depending on the actual bit timing and the clock jitter of the PLL.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
255
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.1.3 Block Diagram
MSCAN
CANCLK
Oscillator Clock
Tq Clk
MUX
Presc.
Bus Clock
RXCAN
TXCAN
Receive/
Transmit
Engine
Transmit Interrupt Req.
Receive Interrupt Req.
Errors Interrupt Req.
Wake-Up Interrupt Req.
Message
Filtering
and
Control
and
Status
Buffering
Configuration
Registers
Wake-Up
Low Pass Filter
Figure 12-2. MSCAN Block Diagram
12.2 External Signal Description
The MSCAN uses two external pins:
12.2.1 RXCAN — CAN Receiver Input Pin
RXCAN is the MSCAN receiver input pin.
12.2.2 TXCAN — CAN Transmitter Output Pin
TXCAN is the MSCAN transmitter output pin. The TXCAN output pin represents the logic level on the
CAN bus:
0 = Dominant state
1 = Recessive state
12.2.3 CAN System
A typical CAN system with MSCAN is shown in Figure 12-3. Each CAN node is connected physically to
the CAN bus lines through a transceiver device. The transceiver is capable of driving the large current
needed for the CAN bus and has current protection against defective CAN or defective nodes.
MC9S08DZ128 Series Data Sheet, Rev. 1
256
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
CAN node 2 CAN node n
CAN node 1
MCU
CAN Controller
(MSCAN)
TXCAN
RXCAN
Transceiver
CAN_H
CAN_L
CAN Bus
Figure 12-3. CAN System
12.3 Register Definition
This section describes in detail all the registers and register bits in the MSCAN module. Each description
includes a standard register diagram with an associated figure number. Details of register bit and field
function follow the register diagrams, in bit order. All bits of all registers in this module are completely
synchronous to internal clocks during a register read.
12.3.1 MSCAN Control Register 0 (CANCTL0)
The CANCTL0 register provides various control bits of the MSCAN module as described below.
7
6
5
4
3
2
1
0
R
W
RXFRM
RXACT
SYNCH
CSWAI
TIME
WUPE
SLPRQ
INITRQ
Reset:
0
0
0
0
0
0
0
1
= Unimplemented
Figure 12-4. MSCAN Control Register 0 (CANCTL0)
NOTE
The CANCTL0 register, except WUPE, INITRQ, and SLPRQ, is held in the
reset state when the initialization mode is active (INITRQ = 1 and
INITAK = 1). This register is writable again as soon as the initialization
mode is exited (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime when out of initialization mode; exceptions are read-only RXACT and SYNCH, RXFRM
(which is set by the module only), and INITRQ (which is also writable in initialization mode).
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
257
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-1. CANCTL0 Register Field Descriptions
Field
Description
7
Received Frame Flag — This bit is read and clear only. It is set when a receiver has received a valid message
correctly, independently of the filter configuration. After it is set, it remains set until cleared by software or reset.
Clearing is done by writing a 1. Writing a 0 is ignored. This bit is not valid in loopback mode.
0 No valid message was received since last clearing this flag
RXFRM1
1 A valid message was received since last clearing of this flag
6
Receiver Active Status — This read-only flag indicates the MSCAN is receiving a message. The flag is
controlled by the receiver front end. This bit is not valid in loopback mode.
0 MSCAN is transmitting or idle2
RXACT
1 MSCAN is receiving a message (including when arbitration is lost)2
5
CAN Stops in Wait Mode — Enabling this bit allows for lower power consumption in wait mode by disabling all
the clocks at the CPU bus interface to the MSCAN module.
CSWAI3
0 The module is not affected during wait mode
1 The module ceases to be clocked during wait mode
4
Synchronized Status — This read-only flag indicates whether the MSCAN is synchronized to the CAN bus and
able to participate in the communication process. It is set and cleared by the MSCAN.
0 MSCAN is not synchronized to the CAN bus
SYNCH
1 MSCAN is synchronized to the CAN bus
3
Timer Enable — This bit activates an internal 16-bit wide free running timer which is clocked by the bit clock rate.
If the timer is enabled, a 16-bit time stamp will be assigned to each transmitted/received message within the
active TX/RX buffer. As soon as a message is acknowledged on the CAN bus, the time stamp will be written to
the highest bytes (0x000E, 0x000F) in the appropriate buffer (see Section 12.4, “Programmer’s Model of
Message Storage”). The internal timer is reset (all bits set to 0) when disabled. This bit is held low in initialization
mode.
TIME
0 Disable internal MSCAN timer
1 Enable internal MSCAN timer
2
Wake-Up Enable — This configuration bit allows the MSCAN to restart from sleep mode when traffic on CAN is
detected (see Section 12.5.5.4, “MSCAN Sleep Mode”). This bit must be configured before sleep mode entry for
the selected function to take effect.
WUPE4
0 Wake-up disabled — The MSCAN ignores traffic on CAN
1 Wake-up enabled — The MSCAN is able to restart
MC9S08DZ128 Series Data Sheet, Rev. 1
258
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-1. CANCTL0 Register Field Descriptions (continued)
Field
Description
1
Sleep Mode Request — This bit requests the MSCAN to enter sleep mode, which is an internal power saving
mode (see Section 12.5.5.4, “MSCAN Sleep Mode”). The sleep mode request is serviced when the CAN bus is
idle, i.e., the module is not receiving a message and all transmit buffers are empty. The module indicates entry
to sleep mode by setting SLPAK = 1 (see Section 12.3.2, “MSCAN Control Register 1 (CANCTL1)”). SLPRQ
cannot be set while the WUPIF flag is set (see Section 12.3.4.1, “MSCAN Receiver Flag Register (CANRFLG)”).
Sleep mode will be active until SLPRQ is cleared by the CPU or, depending on the setting of WUPE, the MSCAN
detects activity on the CAN bus and clears SLPRQ itself.
SLPRQ5
0 Running — The MSCAN functions normally
1 Sleep mode request — The MSCAN enters sleep mode when CAN bus idle
0
Initialization Mode Request — When this bit is set by the CPU, the MSCAN skips to initialization mode (see
INITRQ6,7 Section 12.5.5.5, “MSCAN Initialization Mode”). Any ongoing transmission or reception is aborted and
synchronization to the CAN bus is lost. The module indicates entry to initialization mode by setting INITAK = 1
(Section 12.3.2, “MSCAN Control Register 1 (CANCTL1)”).
The following registers enter their hard reset state and restore their default values: CANCTL08, CANRFLG9,
CANRIER10, CANTFLG, CANTIER, CANTARQ, CANTAAK, and CANTBSEL.
The registers CANCTL1, CANBTR0, CANBTR1, CANIDAC, CANIDAR0-7, and CANIDMR0-7 can only be
written by the CPU when the MSCAN is in initialization mode (INITRQ = 1 and INITAK = 1). The values of the
error counters are not affected by initialization mode.
When this bit is cleared by the CPU, the MSCAN restarts and then tries to synchronize to the CAN bus. If the
MSCAN is not in bus-off state, it synchronizes after 11 consecutive recessive bits on the CAN bus; if the MSCAN
is in bus-off state, it continues to wait for 128 occurrences of 11 consecutive recessive bits.
Writing to otherbits in CANCTL0, CANRFLG, CANRIER, CANTFLG, or CANTIER must be done only after
initialization mode is exited, which is INITRQ = 0 and INITAK = 0.
0 Normal operation
1 MSCAN in initialization mode
1
2
3
The MSCAN must be in normal mode for this bit to become set.
See the Bosch CAN 2.0A/B specification for a detailed definition of transmitter and receiver states.
In order to protect from accidentally violating the CAN protocol, the TXCAN pin is immediately forced to a recessive state when
the CPU enters wait (CSWAI = 1) or stop mode (see Section 12.5.5.2, “Operation in Wait Mode” and Section 12.5.5.3,
“Operation in Stop Mode”).
The CPU has to make sure that the WUPE bit and the WUPIE wake-up interrupt enable bit (see Section 12.3.5, “MSCAN
Receiver Interrupt Enable Register (CANRIER)) is enabled, if the recovery mechanism from stop or wait is required.
The CPU cannot clear SLPRQ before the MSCAN has entered sleep mode (SLPRQ = 1 and SLPAK = 1).
The CPU cannot clear INITRQ before the MSCAN has entered initialization mode (INITRQ = 1 and INITAK = 1).
In order to protect from accidentally violating the CAN protocol, the TXCAN pin is immediately forced to a recessive state when
the initialization mode is requested by the CPU. Thus, the recommended procedure is to bring the MSCAN into sleep mode
(SLPRQ = 1 and SLPAK = 1) before requesting initialization mode.
Not including WUPE, INITRQ, and SLPRQ.
TSTAT1 and TSTAT0 are not affected by initialization mode.
4
5
6
7
8
9
10 RSTAT1 and RSTAT0 are not affected by initialization mode.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
259
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.3.2 MSCAN Control Register 1 (CANCTL1)
The CANCTL1 register provides various control bits and handshake status information of the MSCAN
module as described below.
7
6
5
4
3
2
1
0
R
W
SLPAK
INITAK
CANE
CLKSRC
LOOPB
LISTEN
BORM
WUPM
Reset:
0
0
0
1
0
0
0
1
= Unimplemented
Figure 12-5. MSCAN Control Register 1(CANCTL1)
Read: Anytime
Write: Anytime when INITRQ = 1 and INITAK = 1, except CANE which is write once in normal and
anytime in special system operation modes when the MSCAN is in initialization mode (INITRQ = 1 and
INITAK = 1).
Table 12-2. CANCTL1 Register Field Descriptions
Field
Description
7
MSCAN Enable
CANE
0 MSCAN module is disabled
1 MSCAN module is enabled
6
MSCAN Clock Source — This bit defines the clock source for the MSCAN module (only for systems with a clock
generation module; Section 12.5.3.3, “Clock System,” and Section Figure 12-42., “MSCAN Clocking Scheme,”).
0 MSCAN clock source is the oscillator clock
CLKSRC
1 MSCAN clock source is the bus clock
5
Loopback Self Test Mode — When this bit is set, the MSCAN performs an internal loopback which can be used
for self test operation. The bit stream output of the transmitter is fed back to the receiver
internally.Section 12.5.4.6, “Loopback Self Test Mode.
LOOPB
0 Loopback self test disabled
1 Loopback self test enabled
4
Listen Only Mode — This bit configures the MSCAN as a CAN bus monitor. When LISTEN is set, all valid CAN
messages with matching ID are received, but no acknowledgement or error frames are sent out (see
Section 12.5.4.4, “Listen-Only Mode”). In addition, the error counters are frozen. Listen only mode supports
applications which require “hot plugging” or throughput analysis. The MSCAN is unable to transmit any
messages when listen only mode is active.
LISTEN
0 Normal operation
1 Listen only mode activated
3
Bus-Off Recovery Mode — This bits configures the bus-off state recovery mode of the MSCAN. Refer to
Section 12.6.2, “Bus-Off Recovery,” for details.
BORM
0 Automatic bus-off recovery (see Bosch CAN 2.0A/B protocol specification)
1 Bus-off recovery upon user request
2
Wake-Up Mode — If WUPE in CANCTL0 is enabled, this bit defines whether the integrated low-pass filter is
applied to protect the MSCAN from spurious wake-up (see Section 12.5.5.4, “MSCAN Sleep Mode”).
0 MSCAN wakes up on any dominant level on the CAN bus
WUPM
1 MSCAN wakes up only in case of a dominant pulse on the CAN bus that has a length of Twup
MC9S08DZ128 Series Data Sheet, Rev. 1
260
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-2. CANCTL1 Register Field Descriptions (continued)
Field
Description
1
Sleep Mode Acknowledge — This flag indicates whether the MSCAN module has entered sleep mode (see
Section 12.5.5.4, “MSCAN Sleep Mode”). It is used as a handshake flag for the SLPRQ sleep mode request.
Sleep mode is active when SLPRQ = 1 and SLPAK = 1. Depending on the setting of WUPE, the MSCAN will
clear the flag if it detects activity on the CAN bus while in sleep mode.CPU clearing the SLPRQ bit will also reset
the SLPAK bit.
SLPAK
0 Running — The MSCAN operates normally
1 Sleep mode active — The MSCAN has entered sleep mode
0
Initialization Mode Acknowledge — This flag indicates whether the MSCAN module is in initialization mode
(see Section 12.5.5.5, “MSCAN Initialization Mode”). It is used as a handshake flag for the INITRQ initialization
mode request. Initialization mode is active when INITRQ = 1 and INITAK = 1. The registers CANCTL1,
CANBTR0, CANBTR1, CANIDAC, CANIDAR0–CANIDAR7, and CANIDMR0–CANIDMR7 can be written only by
the CPU when the MSCAN is in initialization mode.
INITAK
0 Running — The MSCAN operates normally
1 Initialization mode active — The MSCAN is in initialization mode
12.3.3 MSCAN Bus Timing Register 0 (CANBTR0)
The CANBTR0 register configures various CAN bus timing parameters of the MSCAN module.
7
6
5
4
3
2
1
0
R
W
SJW1
SJW0
BRP5
BRP4
BRP3
BRP2
BRP1
BRP0
Reset:
0
0
0
0
0
0
0
0
Figure 12-6. MSCAN Bus Timing Register 0 (CANBTR0)
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 12-3. CANBTR0 Register Field Descriptions
Field
Description
7:6
SJW[1:0]
Synchronization Jump Width — The synchronization jump width defines the maximum number of time quanta
(Tq) clock cycles a bit can be shortened or lengthened to achieve resynchronization to data transitions on the
CAN bus (see Table 12-4).
5:0
Baud Rate Prescaler — These bits determine the time quanta (Tq) clock which is used to build up the bit timing
BRP[5:0]
(see Table 12-5).
Table 12-4. Synchronization Jump Width
SJW1
SJW0
Synchronization Jump Width
0
0
1
1
0
1
0
1
1 Tq clock cycle
2 Tq clock cycles
3 Tq clock cycles
4 Tq clock cycles
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
261
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-5. Baud Rate Prescaler
BRP5
BRP4
BRP3
BRP2
BRP1
BRP0
Prescaler value (P)
0
0
0
0
:
0
0
0
0
:
0
0
0
0
:
0
0
0
0
:
0
0
1
1
:
0
1
0
1
:
1
2
3
4
:
1
1
1
1
1
1
64
12.3.4 MSCAN Bus Timing Register 1 (CANBTR1)
The CANBTR1 register configures various CAN bus timing parameters of the MSCAN module.
7
6
5
4
3
2
1
0
R
W
SAMP
TSEG22
TSEG21
TSEG20
TSEG13
TSEG12
TSEG11
TSEG10
Reset:
0
0
0
0
0
0
0
0
Figure 12-7. MSCAN Bus Timing Register 1 (CANBTR1)
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 12-6. CANBTR1 Register Field Descriptions
Field
Description
7
Sampling — This bit determines the number of CAN bus samples taken per bit time.
0 One sample per bit.
SAMP
1 Three samples per bit1.
If SAMP = 0, the resulting bit value is equal to the value of the single bit positioned at the sample point. If
SAMP = 1, the resulting bit value is determined by using majority rule on the three total samples. For higher bit
rates, it is recommended that only one sample is taken per bit time (SAMP = 0).
6:4
Time Segment 2 — Time segments within the bit time fix the number of clock cycles per bit time and the location
TSEG2[2:0] of the sample point (see Figure 12-43). Time segment 2 (TSEG2) values are programmable as shown in
Table 12-7.
3:0
Time Segment 1 — Time segments within the bit time fix the number of clock cycles per bit time and the location
TSEG1[3:0] of the sample point (see Figure 12-43). Time segment 1 (TSEG1) values are programmable as shown in
Table 12-8.
1
In this case, PHASE_SEG1 must be at least 2 time quanta (Tq).
MC9S08DZ128 Series Data Sheet, Rev. 1
262
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-7. Time Segment 2 Values
TSEG22
TSEG21
TSEG20
Time Segment 2
0
0
:
0
0
:
0
1
:
1 Tq clock cycle1
2 Tq clock cycles
:
1
1
1
1
0
1
7 Tq clock cycles
8 Tq clock cycles
1
This setting is not valid. Please refer to Table 12-35 for valid settings.
Table 12-8. Time Segment 1 Values
TSEG13
TSEG12
TSEG11
TSEG10
Time segment 1
0
0
0
0
:
0
0
0
0
:
0
0
1
1
:
0
1
0
1
:
1 Tq clock cycle1
2 Tq clock cycles1
3 Tq clock cycles1
4 Tq clock cycles
:
1
1
1
1
1
1
0
1
15 Tq clock cycles
16 Tq clock cycles
1
This setting is not valid. Please refer to Table 12-35 for valid settings.
The bit time is determined by the oscillator frequency, the baud rate prescaler, and the number of time
quanta (Tq) clock cycles per bit (as shown in Table 12-7 and Table 12-8).
Eqn. 12-1
(Prescaler value)
-----------------------------------------------------
f
Bit Time=
• (1 + TimeSegment1 + TimeSegment2)
CANCLK
12.3.4.1 MSCAN Receiver Flag Register (CANRFLG)
A flag can be cleared only by software (writing a 1 to the corresponding bit position) when the condition
which caused the setting is no longer valid. Every flag has an associated interrupt enable bit in the
CANRIER register.
7
6
5
4
3
2
1
0
R
W
RSTAT1
RSTAT0
TSTAT1
TSTAT0
WUPIF
CSCIF
OVRIF
RXF
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 12-8. MSCAN Receiver Flag Register (CANRFLG)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
263
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
NOTE
1
The CANRFLG register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1). This register is writable again
as soon as the initialization mode is exited (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime when out of initialization mode, except RSTAT[1:0] and TSTAT[1:0] flags which are
read-only; write of 1 clears flag; write of 0 is ignored.
Table 12-9. CANRFLG Register Field Descriptions
Field
Description
7
Wake-Up Interrupt Flag — If the MSCAN detects CAN bus activity while in sleep mode (see Section 12.5.5.4,
“MSCAN Sleep Mode,”) and WUPE = 1 in CANTCTL0 (see Section 12.3.1, “MSCAN Control Register 0
(CANCTL0)”), the module will set WUPIF. If not masked, a wake-up interrupt is pending while this flag is set.
WUPIF
0
1
No wake-up activity observed while in sleep mode
MSCAN detected activity on the CAN bus and requested wake-up
6
CAN Status Change Interrupt Flag — This flag is set when the MSCAN changes its current CAN bus status
due to the actual value of the transmit error counter (TEC) and the receive error counter (REC). An additional
4-bit (RSTAT[1:0], TSTAT[1:0]) status register, which is split into separate sections for TEC/REC, informs the
system on the actual CAN bus status (see Section 12.3.5, “MSCAN Receiver Interrupt Enable Register
(CANRIER)”). If not masked, an error interrupt is pending while this flag is set. CSCIF provides a blocking
interrupt. That guarantees that the receiver/transmitter status bits (RSTAT/TSTAT) are only updated when no CAN
status change interrupt is pending. If the TECs/RECs change their current value after the CSCIF is asserted,
which would cause an additional state change in the RSTAT/TSTAT bits, these bits keep their status until the
current CSCIF interrupt is cleared again.
CSCIF
0
1
No change in CAN bus status occurred since last interrupt
MSCAN changed current CAN bus status
5:4
Receiver Status Bits — The values of the error counters control the actual CAN bus status of the MSCAN. As
RSTAT[1:0] soon as the status change interrupt flag (CSCIF) is set, these bits indicate the appropriate receiver related CAN
bus status of the MSCAN. The coding for the bits RSTAT1, RSTAT0 is:
00
01
10
11
RxOK: 0 ≤ receive error counter ≤ 96
RxWRN: 96 < receive error counter ≤ 127
RxERR: 127 < receive error counter
Bus-off1: transmit error counter > 255
3:2
Transmitter Status Bits — The values of the error counters control the actual CAN bus status of the MSCAN.
TSTAT[1:0] As soon as the status change interrupt flag (CSCIF) is set, these bits indicate the appropriate transmitter related
CAN bus status of the MSCAN. The coding for the bits TSTAT1, TSTAT0 is:
00
01
10
11
TxOK: 0 ≤ transmit error counter ≤ 96
TxWRN: 96 < transmit error counter ≤ 127
TxERR: 127 < transmit error counter ≤ 255
Bus-Off: transmit error counter > 255
1. The RSTAT[1:0], TSTAT[1:0] bits are not affected by initialization mode.
MC9S08DZ128 Series Data Sheet, Rev. 1
264
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-9. CANRFLG Register Field Descriptions (continued)
Field
Description
1
Overrun Interrupt Flag — This flag is set when a data overrun condition occurs. If not masked, an error interrupt
OVRIF
is pending while this flag is set.
0
1
No data overrun condition
A data overrun detected
0
Receive Buffer Full Flag — RXF is set by the MSCAN when a new message is shifted in the receiver FIFO. This
flag indicates whether the shifted buffer is loaded with a correctly received message (matching identifier,
matching cyclic redundancy code (CRC) and no other errors detected). After the CPU has read that message
from the RxFG buffer in the receiver FIFO, the RXF flag must be cleared to release the buffer. A set RXF flag
prohibits the shifting of the next FIFO entry into the foreground buffer (RxFG). If not masked, a receive interrupt
is pending while this flag is set.
RXF2
0
1
No new message available within the RxFG
The receiver FIFO is not empty. A new message is available in the RxFG
1
2
Redundant Information for the most critical CAN bus status which is “bus-off”. This only occurs if the Tx error counter exceeds
a number of 255 errors. Bus-off affects the receiver state. As soon as the transmitter leaves its bus-off state the receiver state
skips to RxOK too. Refer also to TSTAT[1:0] coding in this register.
To ensure data integrity, do not read the receive buffer registers while the RXF flag is cleared. For MCUs with dual CPUs,
reading the receive buffer registers while the RXF flag is cleared may result in a CPU fault condition.
12.3.5 MSCAN Receiver Interrupt Enable Register (CANRIER)
This register contains the interrupt enable bits for the interrupt flags described in the CANRFLG register.
7
6
5
4
3
2
1
0
R
W
WUPIE
CSCIE
RSTATE1
RSTATE0
TSTATE1
TSTATE0
OVRIE
RXFIE
Reset:
0
0
0
0
0
0
0
0
Figure 12-9. MSCAN Receiver Interrupt Enable Register (CANRIER)
NOTE
The CANRIER register is held in the reset state when the initialization mode
is active (INITRQ=1 and INITAK=1). This register is writable when not in
initialization mode (INITRQ=0 and INITAK=0).
The RSTATE[1:0], TSTATE[1:0] bits are not affected by initialization
mode.
Read: Anytime
Write: Anytime when not in initialization mode
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
265
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-10. CANRIER Register Field Descriptions
Field
Description
7
Wake-Up Interrupt Enable
WUPIE1
0
1
No interrupt request is generated from this event.
A wake-up event causes a Wake-Up interrupt request.
6
CAN Status Change Interrupt Enable
CSCIE
0
1
No interrupt request is generated from this event.
A CAN Status Change event causes an error interrupt request.
5:4
Receiver Status Change Enable — These RSTAT enable bits control the sensitivity level in which receiver state
RSTATE[1:0] changes are causing CSCIF interrupts. Independent of the chosen sensitivity level the RSTAT flags continue to
indicate the actual receiver state and are only updated if no CSCIF interrupt is pending.
00 Do not generate any CSCIF interrupt caused by receiver state changes.
01 Generate CSCIF interrupt only if the receiver enters or leaves “bus-off” state. Discard other receiver state
changes for generating CSCIF interrupt.
10 Generate CSCIF interrupt only if the receiver enters or leaves “RxErr” or “bus-off”2 state. Discard other
receiver state changes for generating CSCIF interrupt.
11 Generate CSCIF interrupt on all state changes.
3:2
Transmitter Status Change Enable — These TSTAT enable bits control the sensitivity level in which transmitter
TSTATE[1:0] state changes are causing CSCIF interrupts. Independent of the chosen sensitivity level, the TSTAT flags
continue to indicate the actual transmitter state and are only updated if no CSCIF interrupt is pending.
00 Do not generate any CSCIF interrupt caused by transmitter state changes.
01 Generate CSCIF interrupt only if the transmitter enters or leaves “bus-off” state. Discard other transmitter
state changes for generating CSCIF interrupt.
10 Generate CSCIF interrupt only if the transmitter enters or leaves “TxErr” or “bus-off” state. Discard other
transmitter state changes for generating CSCIF interrupt.
11 Generate CSCIF interrupt on all state changes.
1
Overrun Interrupt Enable
OVRIE
0
1
No interrupt request is generated from this event.
An overrun event causes an error interrupt request.
0
Receiver Full Interrupt Enable
RXFIE
0
1
No interrupt request is generated from this event.
A receive buffer full (successful message reception) event causes a receiver interrupt request.
1
2
WUPIE and WUPE (see Section 12.3.1, “MSCAN Control Register 0 (CANCTL0)”) must both be enabled if the recovery
mechanism from stop or wait is required.
Bus-off state is defined by the CAN standard (see Bosch CAN 2.0A/B protocol specification: for only transmitters. Because the
only possible state change for the transmitter from bus-off to TxOK also forces the receiver to skip its current state to RxOK,
the coding of the RXSTAT[1:0] flags define an additional bus-off state for the receiver (see Section 12.3.4.1, “MSCAN Receiver
Flag Register (CANRFLG)”).
12.3.6 MSCAN Transmitter Flag Register (CANTFLG)
The transmit buffer empty flags each have an associated interrupt enable bit in the CANTIER register.
MC9S08DZ128 Series Data Sheet, Rev. 1
266
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
TXE2
TXE1
TXE0
Reset:
0
0
0
0
0
1
1
1
= Unimplemented
Figure 12-10. MSCAN Transmitter Flag Register (CANTFLG)
NOTE
The CANTFLG register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1). This register is writable when
not in initialization mode (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime for TXEx flags when not in initialization mode; write of 1 clears flag, write of 0 is ignored
Table 12-11. CANTFLG Register Field Descriptions
Field
Description
2:0
TXE[2:0]
Transmitter Buffer Empty — This flag indicates that the associated transmit message buffer is empty, and thus
not scheduled for transmission. The CPU must clear the flag after a message is set up in the transmit buffer and
is due for transmission. The MSCAN sets the flag after the message is sent successfully. The flag is also set by
the MSCAN when the transmission request is successfully aborted due to a pending abort request (see
Section 12.3.8, “MSCAN Transmitter Message Abort Request Register (CANTARQ)”). If not masked, a transmit
interrupt is pending while this flag is set.
Clearing a TXEx flag also clears the corresponding ABTAKx (see Section 12.3.9, “MSCAN Transmitter Message
Abort Acknowledge Register (CANTAAK)”). When a TXEx flag is set, the corresponding ABTRQx bit is cleared
(see Section 12.3.8, “MSCAN Transmitter Message Abort Request Register (CANTARQ)”).
When listen-mode is active (see Section 12.3.2, “MSCAN Control Register 1 (CANCTL1)”) the TXEx flags cannot
be cleared and no transmission is started.
Read and write accesses to the transmit buffer are blocked, if the corresponding TXEx bit is cleared (TXEx = 0)
and the buffer is scheduled for transmission.
0 The associated message buffer is full (loaded with a message due for transmission)
1 The associated message buffer is empty (not scheduled)
12.3.7 MSCAN Transmitter Interrupt Enable Register (CANTIER)
This register contains the interrupt enable bits for the transmit buffer empty interrupt flags.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
TXEIE2
TXEIE1
TXEIE0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 12-11. MSCAN Transmitter Interrupt Enable Register (CANTIER)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
267
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
NOTE
The CANTIER register is held in the reset state when the initialization mode
is active (INITRQ = 1 and INITAK = 1). This register is writable when not
in initialization mode (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime when not in initialization mode
Table 12-12. CANTIER Register Field Descriptions
Field
Description
2:0
Transmitter Empty Interrupt Enable
TXEIE[2:0] 0 No interrupt request is generated from this event.
1 A transmitter empty (transmit buffer available for transmission) event causes a transmitter empty interrupt
request. See Section 12.5.2.2, “Transmit Structures” for details.
12.3.8 MSCAN Transmitter Message Abort Request Register (CANTARQ)
The CANTARQ register allows abort request of messages queued for transmission.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
ABTRQ2
ABTRQ1
ABTRQ0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 12-12. MSCAN Transmitter Message Abort Request Register (CANTARQ)
NOTE
The CANTARQ register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1). This register is writable when
not in initialization mode (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime when not in initialization mode
Table 12-13. CANTARQ Register Field Descriptions
Field
Description
Abort Request — The CPU sets the ABTRQx bit to request that a scheduled message buffer (TXEx = 0) be
2:0
ABTRQ[2:0] aborted. The MSCAN grants the request if the message has not already started transmission, or if the
transmission is not successful (lost arbitration or error). When a message is aborted, the associated TXE (see
Section 12.3.6, “MSCAN Transmitter Flag Register (CANTFLG)”) and abort acknowledge flags (ABTAK, see
Section 12.3.9, “MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)”) are set and a transmit
interrupt occurs if enabled. The CPU cannot reset ABTRQx. ABTRQx is reset whenever the associated TXE flag
is set.
0 No abort request
1 Abort request pending
MC9S08DZ128 Series Data Sheet, Rev. 1
268
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.3.9 MSCAN Transmitter Message Abort Acknowledge Register
(CANTAAK)
The CANTAAK register indicates the successful abort of messages queued for transmission, if requested
by the appropriate bits in the CANTARQ register.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
ABTAK2
ABTAK1
ABTAK0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 12-13. MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)
NOTE
The CANTAAK register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1).
Read: Anytime
Write: Unimplemented for ABTAKx flags
Table 12-14. CANTAAK Register Field Descriptions
Field
Description
Abort Acknowledge — This flag acknowledges that a message was aborted due to a pending transmission
2:0
ABTAK[2:0] abort request from the CPU. After a particular message buffer is flagged empty, this flag can be used by the
application software to identify whether the message was aborted successfully or was sent anyway. The ABTAKx
flag is cleared whenever the corresponding TXE flag is cleared.
0 The message was not aborted.
1 The message was aborted.
12.3.10 MSCAN Transmit Buffer Selection Register (CANTBSEL)
The CANTBSEL selections of the actual transmit message buffer, which is accessible in the CANTXFG
register space.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
TX2
TX1
TX0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 12-14. MSCAN Transmit Buffer Selection Register (CANTBSEL)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
269
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
NOTE
The CANTBSEL register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK=1). This register is writable when
not in initialization mode (INITRQ = 0 and INITAK = 0).
Read: Find the lowest ordered bit set to 1, all other bits will be read as 0
Write: Anytime when not in initialization mode
Table 12-15. CANTBSEL Register Field Descriptions
Field
Description
2:0
TX[2:0]
Transmit Buffer Select — The lowest numbered bit places the respective transmit buffer in the CANTXFG
register space (e.g., TX1 = 1 and TX0 = 1 selects transmit buffer TX0; TX1 = 1 and TX0 = 0 selects transmit
buffer TX1). Read and write accesses to the selected transmit buffer will be blocked, if the corresponding TXEx
bit is cleared and the buffer is scheduled for transmission (see Section 12.3.6, “MSCAN Transmitter Flag Register
(CANTFLG)”).
0 The associated message buffer is deselected
1 The associated message buffer is selected, if lowest numbered bit
The following gives a short programming example of the usage of the CANTBSEL register:
To get the next available transmit buffer, application software must read the CANTFLG register and write
this value back into the CANTBSEL register. In this example Tx buffers TX1 and TX2 are available. The
value read from CANTFLG is therefore 0b0000_0110. When writing this value back to CANTBSEL, the
Tx buffer TX1 is selected in the CANTXFG because the lowest numbered bit set to 1 is at bit position 1.
Reading back this value out of CANTBSEL results in 0b0000_0010, because only the lowest numbered
bit position set to 1 is presented. This mechanism eases the application software the selection of the next
available Tx buffer.
•
•
•
LDD CANTFLG; value read is 0b0000_0110
STD CANTBSEL; value written is 0b0000_0110
LDD CANTBSEL; value read is 0b0000_0010
If all transmit message buffers are deselected, no accesses are allowed to the CANTXFG buffer register.
12.3.11 MSCAN Identifier Acceptance Control Register (CANIDAC)
The CANIDAC register is used for identifier filter acceptance control as described below.
7
6
5
4
3
2
1
0
R
W
0
0
0
IDHIT2
IDHIT1
IDHIT0
IDAM1
IDAM0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 12-15. MSCAN Identifier Acceptance Control Register (CANIDAC)
MC9S08DZ128 Series Data Sheet, Rev. 1
270
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1), except bits IDHITx, which are
read-only
Table 12-16. CANIDAC Register Field Descriptions
Field
Description
5:4
Identifier Acceptance Mode — The CPU sets these flags to define the identifier acceptance filter organization
IDAM[1:0] (see Section 12.5.3, “Identifier Acceptance Filter”). Table 12-17 summarizes the different settings. In filter closed
mode, no message is accepted such that the foreground buffer is never reloaded.
2:0
Identifier Acceptance Hit Indicator — The MSCAN sets these flags to indicate an identifier acceptance hit (see
IDHIT[2:0] Section 12.5.3, “Identifier Acceptance Filter”). Table 12-18 summarizes the different settings.
Table 12-17. Identifier Acceptance Mode Settings
IDAM1
IDAM0
Identifier Acceptance Mode
0
0
1
1
0
1
0
1
Two 32-bit acceptance filters
Four 16-bit acceptance filters
Eight 8-bit acceptance filters
Filter closed
Table 12-18. Identifier Acceptance Hit Indication
IDHIT2
IDHIT1
IDHIT0
Identifier Acceptance Hit
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Filter 0 hit
Filter 1 hit
Filter 2 hit
Filter 3 hit
Filter 4 hit
Filter 5 hit
Filter 6 hit
Filter 7 hit
The IDHITx indicators are always related to the message in the foreground buffer (RxFG). When a
message gets shifted into the foreground buffer of the receiver FIFO the indicators are updated as well.
12.3.12 MSCAN Miscellaneous Register (CANMISC)
This register provides additional features.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
271
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
BOHOLD
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 12-16. MSCAN Miscellaneous Register (CANMISC)
Read: Anytime
Write: Anytime; write of ‘1’ clears flag; write of ‘0’ ignored
Table 12-19. CANMISC Register Field Descriptions
Field
Description
Bus-off State Hold Until User Request — If BORM is set in Section 12.3.2, “MSCAN Control Register 1
0
BOHOLD (CANCTL1), this bit indicates whether the module has entered the bus-off state. Clearing this bit requests the
recovery from bus-off. Refer to Section 12.6.2, “Bus-Off Recovery,” for details.
0 Module is not bus-off or recovery has been requested by user in bus-off state
1 Module is bus-off and holds this state until user request
12.3.13 MSCAN Receive Error Counter (CANRXERR)
This register reflects the status of the MSCAN receive error counter.
7
6
5
4
3
2
1
0
R
W
RXERR7
RXERR6
RXERR5
RXERR4
RXERR3
RXERR2
RXERR1
RXERR0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 12-17. MSCAN Receive Error Counter (CANRXERR)
Read: Only when in sleep mode (SLPRQ = 1 and SLPAK = 1) or initialization mode (INITRQ = 1 and
INITAK = 1)
Write: Unimplemented
NOTE
Reading this register when in any other mode other than sleep or
initialization mode may return an incorrect value. For MCUs with dual
CPUs, this may result in a CPU fault condition.
Writing to this register when in special modes can alter the MSCAN
functionality.
MC9S08DZ128 Series Data Sheet, Rev. 1
272
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.3.14 MSCAN Transmit Error Counter (CANTXERR)
This register reflects the status of the MSCAN transmit error counter.
7
6
5
4
3
2
1
0
R
W
TXERR7
TXERR6
TXERR5
TXERR4
TXERR3
TXERR2
TXERR1
TXERR0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 12-18. MSCAN Transmit Error Counter (CANTXERR)
Read: Only when in sleep mode (SLPRQ = 1 and SLPAK = 1) or initialization mode (INITRQ = 1 and
INITAK = 1)
Write: Unimplemented
NOTE
Reading this register when in any other mode other than sleep or
initialization mode, may return an incorrect value. For MCUs with dual
CPUs, this may result in a CPU fault condition.
Writing to this register when in special modes can alter the MSCAN
functionality.
12.3.15 MSCAN Identifier Acceptance Registers (CANIDAR0-7)
On reception, each message is written into the background receive buffer. The CPU is only signalled to
read the message if it passes the criteria in the identifier acceptance and identifier mask registers
(accepted); otherwise, the message is overwritten by the next message (dropped).
The acceptance registers of the MSCAN are applied on the IDR0–IDR3 registers (see Section 12.4.1,
“Identifier Registers (IDR0–IDR3)”) of incoming messages in a bit by bit manner (see Section 12.5.3,
“Identifier Acceptance Filter”).
For extended identifiers, all four acceptance and mask registers are applied. For standard identifiers, only
the first two (CANIDAR0/1, CANIDMR0/1) are applied.
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
Figure 12-19. MSCAN Identifier Acceptance Registers (First Bank) — CANIDAR0–CANIDAR3
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
273
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-20. CANIDAR0–CANIDAR3 Register Field Descriptions
Field
Description
7:0
AC[7:0]
Acceptance Code Bits — AC[7:0] comprise a user-defined sequence of bits with which the corresponding bits
of the related identifier register (IDRn) of the receive message buffer are compared. The result of this comparison
is then masked with the corresponding identifier mask register.
7
6
5
4
3
2
1
0
R
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
W
Reset
0
0
0
0
0
0
0
0
Figure 12-20. MSCAN Identifier Acceptance Registers (Second Bank) — CANIDAR4–CANIDAR7
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 12-21. CANIDAR4–CANIDAR7 Register Field Descriptions
Field
Description
7:0
AC[7:0]
Acceptance Code Bits — AC[7:0] comprise a user-defined sequence of bits with which the corresponding bits
of the related identifier register (IDRn) of the receive message buffer are compared. The result of this comparison
is then masked with the corresponding identifier mask register.
12.3.16 MSCAN Identifier Mask Registers (CANIDMR0–CANIDMR7)
The identifier mask register specifies which of the corresponding bits in the identifier acceptance register
are relevant for acceptance filtering. To receive standard identifiers in 32 bit filter mode, it is required to
program the last three bits (AM[2:0]) in the mask registers CANIDMR1 and CANIDMR5 to “don’t care.”
To receive standard identifiers in 16 bit filter mode, it is required to program the last three bits (AM[2:0])
in the mask registers CANIDMR1, CANIDMR3, CANIDMR5, and CANIDMR7 to “don’t care.”
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
Figure 12-21. MSCAN Identifier Mask Registers (First Bank) — CANIDMR0–CANIDMR3
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
MC9S08DZ128 Series Data Sheet, Rev. 1
274
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-22. CANIDMR0–CANIDMR3 Register Field Descriptions
Field
Description
7:0
AM[7:0]
Acceptance Mask Bits — If a particular bit in this register is cleared, this indicates that the corresponding bit in
the identifier acceptance register must be the same as its identifier bit before a match is detected. The message
is accepted if all such bits match. If a bit is set, it indicates that the state of the corresponding bit in the identifier
acceptance register does not affect whether or not the message is accepted.
0 Match corresponding acceptance code register and identifier bits
1 Ignore corresponding acceptance code register bit (don’t care)
7
6
5
4
3
2
1
0
R
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
W
Reset
0
0
0
0
0
0
0
0
Figure 12-22. MSCAN Identifier Mask Registers (Second Bank) — CANIDMR4–CANIDMR7
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 12-23. CANIDMR4–CANIDMR7 Register Field Descriptions
Field
Description
7:0
AM[7:0]
Acceptance Mask Bits — If a particular bit in this register is cleared, this indicates that the corresponding bit in
the identifier acceptance register must be the same as its identifier bit before a match is detected. The message
is accepted if all such bits match. If a bit is set, it indicates that the state of the corresponding bit in the identifier
acceptance register does not affect whether or not the message is accepted.
0 Match corresponding acceptance code register and identifier bits
1 Ignore corresponding acceptance code register bit (don’t care)
12.4 Programmer’s Model of Message Storage
The following section details the organization of the receive and transmit message buffers and the
associated control registers.
To simplify the programmer interface, the receive and transmit message buffers have the same outline.
Each message buffer allocates 16 bytes in the memory map containing a 13 byte data structure.
An additional transmit buffer priority register (TBPR) is defined for the transmit buffers. Within the last
two bytes of this memory map, the MSCAN stores a special 16-bit time stamp, which is sampled from an
internal timer after successful transmission or reception of a message. This feature is only available for
transmit and receiver buffers if the TIME bit is set (see Section 12.3.1, “MSCAN Control Register 0
(CANCTL0)”).
The time stamp register is written by the MSCAN. The CPU can only read these registers.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
275
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-24. Message Buffer Organization
Offset
Address
Register
Access
0x00X0
0x00X1
0x00X2
0x00X3
0x00X4
0x00X5
0x00X6
0x00X7
0x00X8
0x00X9
0x00XA
0x00XB
0x00XC
0x00XD
0x00XE
0x00XF
Identifier Register 0
Identifier Register 1
Identifier Register 2
Identifier Register 3
Data Segment Register 0
Data Segment Register 1
Data Segment Register 2
Data Segment Register 3
Data Segment Register 4
Data Segment Register 5
Data Segment Register 6
Data Segment Register 7
Data Length Register
Transmit Buffer Priority Register1
Time Stamp Register (High Byte)2
Time Stamp Register (Low Byte)3
1
2
3
Not applicable for receive buffers
Read-only for CPU
Read-only for CPU
Figure 12-23 shows the common 13-byte data structure of receive and transmit buffers for extended
identifiers. The mapping of standard identifiers into the IDR registers is shown in Figure 12-24.
1
All bits of the receive and transmit buffers are ‘x’ out of reset because of RAM-based implementation .
All reserved or unused bits of the receive and transmit buffers always read ‘x’.
1. Exception: The transmit priority registers are 0 out of reset.
MC9S08DZ128 Series Data Sheet, Rev. 1
276
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Register
Name
Bit 7
6
5
4
3
2
1
Bit0
R
IDR0
IDR1
ID28
ID27
ID26
ID25
ID24
ID23
ID22
ID21
W
R
ID20
ID14
ID6
ID19
ID13
ID5
ID18
ID12
ID4
SRR(1)
ID11
ID3
IDE(1)
ID10
ID2
ID17
ID9
ID16
ID8
ID15
ID7
W
R
IDR2
IDR3
W
R
ID1
ID0
RTR2
DB0
DB0
DB0
DB0
DB0
DB0
DB0
DB0
DLC0
W
R
DB7
DB7
DB7
DB7
DB7
DB7
DB7
DB7
DB6
DB6
DB6
DB6
DB6
DB6
DB6
DB6
DB5
DB5
DB5
DB5
DB5
DB5
DB5
DB5
DB4
DB4
DB4
DB4
DB4
DB4
DB4
DB4
DB3
DB3
DB3
DB3
DB3
DB3
DB3
DB3
DLC3
DB2
DB2
DB2
DB2
DB2
DB2
DB2
DB2
DLC2
DB1
DB1
DB1
DB1
DB1
DB1
DB1
DB1
DLC1
DSR0
DSR1
DSR2
DSR3
DSR4
DSR5
DSR6
DSR7
DLR
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
= Unused, always read ‘x’
Figure 12-23. Receive/Transmit Message Buffer — Extended Identifier Mapping
1
2
SRR and IDE are both 1s.
The position of RTR differs between extended and standard indentifier mapping.
Read: For transmit buffers, anytime when TXEx flag is set (see Section 12.3.6, “MSCAN Transmitter Flag
Register (CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
277
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Section 12.3.10, “MSCAN Transmit Buffer Selection Register (CANTBSEL)”). For receive buffers, only
when RXF flag is set (see Section 12.3.4.1, “MSCAN Receiver Flag Register (CANRFLG)”).
Write: For transmit buffers, anytime when TXEx flag is set (see Section 12.3.6, “MSCAN Transmitter Flag
Register (CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see
Section 12.3.10, “MSCAN Transmit Buffer Selection Register (CANTBSEL)”). Unimplemented for
receive buffers.
Reset: Undefined (0x00XX) because of RAM-based implementation
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
IDR0
ID10
ID9
ID8
ID7
ID6
ID5
ID4
ID3
W
R
IDR1
IDR2
IDR3
ID2
ID1
ID0
RTR1
IDE2
W
R
W
R
W
= Unused, always read ‘x’
Figure 12-24. Receive/Transmit Message Buffer — Standard Identifier Mapping
1
2
The position of RTR differs between extended and standard indentifier mapping.
IDE is 0.
12.4.1 Identifier Registers (IDR0–IDR3)
The identifier registers for an extended format identifier consist of a total of 32 bits; ID[28:0], SRR, IDE,
and RTR bits. The identifier registers for a standard format identifier consist of a total of 13 bits; ID[10:0],
RTR, and IDE bits.
12.4.1.1 IDR0–IDR3 for Extended Identifier Mapping
7
6
5
4
3
2
1
0
R
W
ID28
ID27
ID26
ID25
ID24
ID23
ID22
ID21
Reset:
x
x
x
x
x
x
x
x
Figure 12-25. Identifier Register 0 (IDR0) — Extended Identifier Mapping
MC9S08DZ128 Series Data Sheet, Rev. 1
278
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-25. IDR0 Register Field Descriptions — Extended
Field
Description
7:0
ID[28:21]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
7
6
5
4
3
2
1
0
R
ID20
ID19
ID18
SRR(1)
IDE(1)
ID17
ID16
ID15
W
Reset:
x
x
x
x
x
x
x
x
Figure 12-26. Identifier Register 1 (IDR1) — Extended Identifier Mapping
1
SRR and IDE are both 1s.
Table 12-26. IDR1 Register Field Descriptions — Extended
Description
Field
7:5
ID[20:18]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
4
Substitute Remote Request — This fixed recessive bit is used only in extended format. It must be set to 1 by
SRR
the user for transmission buffers and is stored as received on the CAN bus for receive buffers.
3
IDE
ID Extended — This flag indicates whether the extended or standard identifier format is applied in this buffer. In
the case of a receive buffer, the flag is set as received and indicates to the CPU how to process the buffer
identifier registers. In the case of a transmit buffer, the flag indicates to the MSCAN what type of identifier to send.
0 Standard format (11 bit)
1 Extended format (29 bit)
2:0
ID[17:15]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
7
6
5
4
3
2
1
0
R
ID14
ID13
ID12
ID11
ID10
ID9
ID8
ID7
W
Reset:
x
x
x
x
x
x
x
x
Figure 12-27. Identifier Register 2 (IDR2) — Extended Identifier Mapping
Table 12-27. IDR2 Register Field Descriptions — Extended
Description
Field
7:0
ID[14:7]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
279
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
7
6
5
4
3
2
1
0
R
W
ID6
ID5
ID4
ID3
ID2
ID1
ID0
RTR
Reset:
x
x
x
x
x
x
x
x
Figure 12-28. Identifier Register 3 (IDR3) — Extended Identifier Mapping
Table 12-28. IDR3 Register Field Descriptions — Extended
Description
Field
7:1
ID[6:0]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbithation procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
0
Remote Transmission Request — This flag reflects the status of the remote transmission request bit in the
RTR
CAN frame. In the case of a receive buffer, it indicates the status of the received frame and supports the
transmission of an answering frame in software. In the case of a transmit buffer, this flag defines the setting of
the RTR bit to be sent.
0 Data frame
1 Remote frame
12.4.2 IDR0–IDR3 for Standard Identifier Mapping
7
6
5
4
3
2
1
0
R
W
ID10
ID9
ID8
ID7
ID6
ID5
ID4
ID3
Reset:
x
x
x
x
x
x
x
x
Figure 12-29. Identifier Register 0 — Standard Mapping
Table 12-29. IDR0 Register Field Descriptions — Standard
Description
Field
7:0
ID[10:3]
Standard Format Identifier — The identifiers consist of 11 bits (ID[10:0]) for the standard format. ID10 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number. See also ID bits in Table 12-30.
7
6
5
4
3
2
1
0
R
ID2
ID1
ID0
RTR
IDE(1)
W
Reset:
x
x
x
x
x
x
x
x
= Unused; always read ‘x’
Figure 12-30. Identifier Register 1 — Standard Mapping
MC9S08DZ128 Series Data Sheet, Rev. 1
1
IDE is 0.
280
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-30. IDR1 Register Field Descriptions
Field
Description
7:5
ID[2:0]
Standard Format Identifier — The identifiers consist of 11 bits (ID[10:0]) for the standard format. ID10 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number. See also ID bits in Table 12-29.
4
Remote Transmission Request — This flag reflects the status of the Remote Transmission Request bit in the
RTR
CAN frame. In the case of a receive buffer, it indicates the status of the received frame and supports the
transmission of an answering frame in software. In the case of a transmit buffer, this flag defines the setting of
the RTR bit to be sent.
0 Data frame
1 Remote frame
3
IDE
ID Extended — This flag indicates whether the extended or standard identifier format is applied in this buffer. In
the case of a receive buffer, the flag is set as received and indicates to the CPU how to process the buffer
identifier registers. In the case of a transmit buffer, the flag indicates to the MSCAN what type of identifier to send.
0 Standard format (11 bit)
1 Extended format (29 bit)
7
6
5
4
3
2
1
0
R
W
Reset:
x
x
x
x
x
x
x
x
= Unused; always read ‘x’
Figure 12-31. Identifier Register 2 — Standard Mapping
7
6
5
4
3
2
1
0
R
W
Reset:
x
x
x
x
x
x
x
x
= Unused; always read ‘x’
Figure 12-32. Identifier Register 3 — Standard Mapping
12.4.3 Data Segment Registers (DSR0-7)
The eight data segment registers, each with bits DB[7:0], contain the data to be transmitted or received.
The number of bytes to be transmitted or received is determined by the data length code in the
corresponding DLR register.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
281
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
7
6
5
4
3
2
1
0
R
W
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
Reset:
x
x
x
x
x
x
x
x
Figure 12-33. Data Segment Registers (DSR0–DSR7) — Extended Identifier Mapping
Table 12-31. DSR0–DSR7 Register Field Descriptions
Field
Description
7:0
Data bits 7:0
DB[7:0]
12.4.4 Data Length Register (DLR)
This register keeps the data length field of the CAN frame.
7
6
5
4
3
2
1
0
R
W
DLC3
DLC2
DLC1
DLC0
Reset:
x
x
x
x
x
x
x
x
= Unused; always read “x”
Figure 12-34. Data Length Register (DLR) — Extended Identifier Mapping
Table 12-32. DLR Register Field Descriptions
Description
Field
3:0
DLC[3:0]
Data Length Code Bits — The data length code contains the number of bytes (data byte count) of the respective
message. During the transmission of a remote frame, the data length code is transmitted as programmed while
the number of transmitted data bytes is always 0. The data byte count ranges from 0 to 8 for a data frame.
Table 12-33 shows the effect of setting the DLC bits.
MC9S08DZ128 Series Data Sheet, Rev. 1
282
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-33. Data Length Codes
Data Length Code
Data Byte
Count
DLC3
DLC2
DLC1
DLC0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
1
1
1
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
0
1
2
3
4
5
6
7
8
12.4.5 Transmit Buffer Priority Register (TBPR)
This register defines the local priority of the associated message transmit buffer. The local priority is used
for the internal prioritization process of the MSCAN and is defined to be highest for the smallest binary
number. The MSCAN implements the following internal prioritization mechanisms:
•
All transmission buffers with a cleared TXEx flag participate in the prioritization immediately
before the SOF (start of frame) is sent.
•
The transmission buffer with the lowest local priority field wins the prioritization.
In cases of more than one buffer having the same lowest priority, the message buffer with the lower index
number wins.
7
6
5
4
3
2
1
0
R
W
PRIO7
PRIO6
PRIO5
PRIO4
PRIO3
PRIO2
PRIO1
PRIO0
Reset:
0
0
0
0
0
0
0
0
Figure 12-35. Transmit Buffer Priority Register (TBPR)
Read: Anytime when TXEx flag is set (see Section 12.3.6, “MSCAN Transmitter Flag Register
(CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see Section 12.3.10,
“MSCAN Transmit Buffer Selection Register (CANTBSEL)”).
Write: Anytime when TXEx flag is set (see Section 12.3.6, “MSCAN Transmitter Flag Register
(CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see Section 12.3.10,
“MSCAN Transmit Buffer Selection Register (CANTBSEL)”).
12.4.6 Time Stamp Register (TSRH–TSRL)
If the TIME bit is enabled, the MSCAN will write a time stamp to the respective registers in the active
transmit or receive buffer as soon as a message has been acknowledged on the CAN bus (see
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
283
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Section 12.3.1, “MSCAN Control Register 0 (CANCTL0)”). In case of a transmission, the CPU can only
read the time stamp after the respective transmit buffer has been flagged empty.
The timer value, which is used for stamping, is taken from a free running internal CAN bit clock. A timer
overrun is not indicated by the MSCAN. The timer is reset (all bits set to 0) during initialization mode. The
CPU can only read the time stamp registers.
7
6
5
4
3
2
1
0
R
W
TSR15
TSR14
TSR13
TSR12
TSR11
TSR10
TSR9
TSR8
Reset:
x
x
x
x
x
x
x
x
Figure 12-36. Time Stamp Register — High Byte (TSRH)
7
6
5
4
3
2
1
0
R
W
TSR7
TSR6
TSR5
TSR4
TSR3
TSR2
TSR1
TSR0
Reset:
x
x
x
x
x
x
x
x
Figure 12-37. Time Stamp Register — Low Byte (TSRL)
Read: Anytime when TXEx flag is set (see Section 12.3.6, “MSCAN Transmitter Flag Register
(CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see Section 12.3.10,
“MSCAN Transmit Buffer Selection Register (CANTBSEL)”).
Write: Unimplemented
12.5 Functional Description
12.5.1 General
This section provides a complete functional description of the MSCAN. It describes each of the features
and modes listed in the introduction.
MC9S08DZ128 Series Data Sheet, Rev. 1
284
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.5.2 Message Storage
CAN
Receive / Transmit
Engine
CPU12
Memory Mapped
I/O
Rx0
Rx1
Rx2
Rx3
Rx4
MSCAN
RXF
CPU bus
Receiver
TXE0
Tx0
PRIO
TXE1
Tx1
CPU bus
MSCAN
PRIO
TXE2
Tx2
PRIO
Transmitter
Figure 12-38. User Model for Message Buffer Organization
MSCAN facilitates a sophisticated message storage system which addresses the requirements of a broad
range of network applications.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
285
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.5.2.1 Message Transmit Background
Modern application layer software is built upon two fundamental assumptions:
•
Any CAN node is able to send out a stream of scheduled messages without releasing the CAN bus
between the two messages. Such nodes arbitrate for the CAN bus immediately after sending the
previous message and only release the CAN bus in case of lost arbitration.
•
The internal message queue within any CAN node is organized such that the highest priority
message is sent out first, if more than one message is ready to be sent.
The behavior described in the bullets above cannot be achieved with a single transmit buffer. That buffer
must be reloaded immediately after the previous message is sent. This loading process lasts a finite amount
of time and must be completed within the inter-frame sequence (IFS) to be able to send an uninterrupted
stream of messages. Even if this is feasible for limited CAN bus speeds, it requires that the CPU reacts
with short latencies to the transmit interrupt.
A double buffer scheme de-couples the reloading of the transmit buffer from the actual message sending
and, therefore, reduces the reactiveness requirements of the CPU. Problems can arise if the sending of a
message is finished while the CPU re-loads the second buffer. No buffer would then be ready for
transmission, and the CAN bus would be released.
At least three transmit buffers are required to meet the first of the above requirements under all
circumstances. The MSCAN has three transmit buffers.
The second requirement calls for some sort of internal prioritization which the MSCAN implements with
the “local priority” concept described in Section 12.5.2.2, “Transmit Structures.”
12.5.2.2 Transmit Structures
The MSCAN triple transmit buffer scheme optimizes real-time performance by allowing multiple
messages to be set up in advance. The three buffers are arranged as shown in Figure 12-38.
All three buffers have a 13-byte data structure similar to the outline of the receive buffers (see Section 12.4,
“Programmer’s Model of Message Storage”). An additional Section 12.4.5, “Transmit Buffer Priority
Register (TBPR) contains an 8-bit local priority field (PRIO) (see Section 12.4.5, “Transmit Buffer
Priority Register (TBPR)”). The remaining two bytes are used for time stamping of a message, if required
(see Section 12.4.6, “Time Stamp Register (TSRH–TSRL)”).
To transmit a message, the CPU must identify an available transmit buffer, which is indicated by a set
transmitter buffer empty (TXEx) flag (see Section 12.3.6, “MSCAN Transmitter Flag Register
(CANTFLG)”). If a transmit buffer is available, the CPU must set a pointer to this buffer by writing to the
CANTBSEL register (see Section 12.3.10, “MSCAN Transmit Buffer Selection Register
(CANTBSEL)”). This makes the respective buffer accessible within the CANTXFG address space (see
Section 12.4, “Programmer’s Model of Message Storage”). The algorithmic feature associated with the
CANTBSEL register simplifies the transmit buffer selection. In addition, this scheme makes the handler
software simpler because only one address area is applicable for the transmit process, and the required
address space is minimized.
The CPU then stores the identifier, the control bits, and the data content into one of the transmit buffers.
Finally, the buffer is flagged as ready for transmission by clearing the associated TXE flag.
MC9S08DZ128 Series Data Sheet, Rev. 1
286
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
The MSCAN then schedules the message for transmission and signals the successful transmission of the
buffer by setting the associated TXE flag. A transmit interrupt (see Section 12.5.7.2, “Transmit Interrupt”)
1
is generated when TXEx is set and can be used to drive the application software to re-load the buffer.
If more than one buffer is scheduled for transmission when the CAN bus becomes available for arbitration,
the MSCAN uses the local priority setting of the three buffers to determine the prioritization. For this
purpose, every transmit buffer has an 8-bit local priority field (PRIO). The application software programs
this field when the message is set up. The local priority reflects the priority of this particular message
relative to the set of messages being transmitted from this node. The lowest binary value of the PRIO field
is defined to be the highest priority. The internal scheduling process takes place whenever the MSCAN
arbitrates for the CAN bus. This is also the case after the occurrence of a transmission error.
When a high priority message is scheduled by the application software, it may become necessary to abort
a lower priority message in one of the three transmit buffers. Because messages that are already in
transmission cannot be aborted, the user must request the abort by setting the corresponding abort request
bit (ABTRQ) (see Section 12.3.8, “MSCAN Transmitter Message Abort Request Register
(CANTARQ)”.) The MSCAN then grants the request, if possible, by:
1. Setting the corresponding abort acknowledge flag (ABTAK) in the CANTAAK register.
2. Setting the associated TXE flag to release the buffer.
3. Generating a transmit interrupt. The transmit interrupt handler software can determine from the
setting of the ABTAK flag whether the message was aborted (ABTAK = 1) or sent (ABTAK = 0).
12.5.2.3 Receive Structures
The received messages are stored in a five stage input FIFO. The five message buffers are alternately
mapped into a single memory area (see Figure 12-38). The background receive buffer (RxBG) is
exclusively associated with the MSCAN, but the foreground receive buffer (RxFG) is addressable by the
CPU (see Figure 12-38). This scheme simplifies the handler software because only one address area is
applicable for the receive process.
All receive buffers have a size of 15 bytes to store the CAN control bits, the identifier (standard or
extended), the data contents, and a time stamp, if enabled (see Section 12.4, “Programmer’s Model of
Message Storage”).
The receiver full flag (RXF) (see Section 12.3.4.1, “MSCAN Receiver Flag Register (CANRFLG)”)
signals the status of the foreground receive buffer. When the buffer contains a correctly received message
with a matching identifier, this flag is set.
On reception, each message is checked to see whether it passes the filter (see Section 12.5.3, “Identifier
Acceptance Filter”) and simultaneously is written into the active RxBG. After successful reception of a
2
valid message, the MSCAN shifts the content of RxBG into the receiver FIFO , sets the RXF flag, and
3
generates a receive interrupt (see Section 12.5.7.3, “Receive Interrupt”) to the CPU . The user’s receive
handler must read the received message from the RxFG and then reset the RXF flag to acknowledge the
interrupt and to release the foreground buffer. A new message, which can follow immediately after the IFS
1. The transmit interrupt occurs only if not masked. A polling scheme can be applied on TXEx also.
2. Only if the RXF flag is not set.
3. The receive interrupt occurs only if not masked. A polling scheme can be applied on RXF also.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
287
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
field of the CAN frame, is received into the next available RxBG. If the MSCAN receives an invalid
message in its RxBG (wrong identifier, transmission errors, etc.) the actual contents of the buffer will be
over-written by the next message. The buffer will then not be shifted into the FIFO.
When the MSCAN module is transmitting, the MSCAN receives its own transmitted messages into the
background receive buffer, RxBG, but does not shift it into the receiver FIFO, generate a receive interrupt,
or acknowledge its own messages on the CAN bus. The exception to this rule is in loopback mode (see
Section 12.3.2, “MSCAN Control Register 1 (CANCTL1)”) where the MSCAN treats its own messages
exactly like all other incoming messages. The MSCAN receives its own transmitted messages in the event
that it loses arbitration. If arbitration is lost, the MSCAN must be prepared to become a receiver.
An overrun condition occurs when all receive message buffers in the FIFO are filled with correctly
received messages with accepted identifiers and another message is correctly received from the CAN bus
with an accepted identifier. The latter message is discarded and an error interrupt with overrun indication
is generated if enabled (see Section 12.5.7.5, “Error Interrupt”). The MSCAN remains able to transmit
messages while the receiver FIFO is full, but all incoming messages are discarded. As soon as a receive
buffer in the FIFO is available again, new valid messages will be accepted.
12.5.3 Identifier Acceptance Filter
The MSCAN identifier acceptance registers (see Section 12.3.11, “MSCAN Identifier Acceptance Control
Register (CANIDAC)”) define the acceptable patterns of the standard or extended identifier (ID[10:0] or
ID[28:0]). Any of these bits can be marked ‘don’t care’ in the MSCAN identifier mask registers (see
Section 12.3.16, “MSCAN Identifier Mask Registers (CANIDMR0–CANIDMR7)”).
A filter hit is indicated to the application software by a set receive buffer full flag (RXF = 1) and three bits
in the CANIDAC register (see Section 12.3.11, “MSCAN Identifier Acceptance Control Register
(CANIDAC)”). These identifier hit flags (IDHIT[2:0]) clearly identify the filter section that caused the
acceptance. They simplify the application software’s task to identify the cause of the receiver interrupt. If
more than one hit occurs (two or more filters match), the lower hit has priority.
A very flexible programmable generic identifier acceptance filter has been introduced to reduce the CPU
interrupt loading. The filter is programmable to operate in four different modes (see Bosch CAN 2.0A/B
protocol specification):
•
Two identifier acceptance filters, each to be applied to:
— The full 29 bits of the extended identifier and to the following bits of the CAN 2.0B frame:
– Remote transmission request (RTR)
– Identifier extension (IDE)
– Substitute remote request (SRR)
1
— The 11 bits of the standard identifier plus the RTR and IDE bits of the CAN 2.0A/B messages .
This mode implements two filters for a full length CAN 2.0B compliant extended identifier.
Figure 12-39 shows how the first 32-bit filter bank (CANIDAR0–CANIDAR3,
CANIDMR0–CANIDMR3) produces a filter 0 hit. Similarly, the second filter bank
(CANIDAR4–CANIDAR7, CANIDMR4–CANIDMR7) produces a filter 1 hit.
1.Although this mode can be used for standard identifiers, it is recommended to use the four or eight identifier acceptance
filters for standard identifiers
MC9S08DZ128 Series Data Sheet, Rev. 1
288
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
•
Four identifier acceptance filters, each to be applied to
— a) the 14 most significant bits of the extended identifier plus the SRR and IDE bits of CAN 2.0B
messages or
— b) the 11 bits of the standard identifier, the RTR and IDE bits of CAN 2.0A/B messages.
Figure 12-40 shows how the first 32-bit filter bank (CANIDAR0–CANIDA3,
CANIDMR0–3CANIDMR) produces filter 0 and 1 hits. Similarly, the second filter bank
(CANIDAR4–CANIDAR7, CANIDMR4–CANIDMR7) produces filter 2 and 3 hits.
•
•
Eight identifier acceptance filters, each to be applied to the first 8 bits of the identifier. This mode
implements eight independent filters for the first 8 bits of a CAN 2.0A/B compliant standard
identifier or a CAN 2.0B compliant extended identifier. Figure 12-41 shows how the first 32-bit
filter bank (CANIDAR0–CANIDAR3, CANIDMR0–CANIDMR3) produces filter 0 to 3 hits.
Similarly, the second filter bank (CANIDAR4–CANIDAR7, CANIDMR4–CANIDMR7)
produces filter 4 to 7 hits.
Closed filter. No CAN message is copied into the foreground buffer RxFG, and the RXF flag is
never set.
CAN 2.0B
Extended Identifier
ID28
ID10
IDR0
IDR0
ID21 ID20
ID3 ID2
IDR1
IDR1
ID15 ID14
IDR2
ID7 ID6
IDR3
RTR
CAN 2.0A/B
Standard Identifier
IDE
AM7
AC7
CANIDMR0
CANIDAR0
AM0 AM7
AC0 AC7
CANIDMR1
CANIDAR1
AM0 AM7
AC0 AC7
CANIDMR2
CANIDAR2
AM0 AM7
AC0 AC7
CANIDMR3
CANIDAR3
AM0
AC0
ID Accepted (Filter 0 Hit)
Figure 12-39. 32-bit Maskable Identifier Acceptance Filter
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
289
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
CAN 2.0B
Extended Identifier
ID28
ID10
IDR0
IDR0
ID21 ID20
ID3 ID2
IDR1
IDR1
ID15 ID14
IDE
IDR2
ID7 ID6
IDR3
RTR
CAN 2.0A/B
Standard Identifier
AM7
AC7
CANIDMR0
CANIDAR0
AM0 AM7
AC0 AC7
CANIDMR1
CANIDAR1
AM0
AC0
ID Accepted (Filter 0 Hit)
AM7
AC7
CANIDMR2
CANIDAR2
AM0 AM7
AC0 AC7
CANIDMR3
AM0
AC0
CANIDAR3
ID Accepted (Filter 1 Hit)
Figure 12-40. 16-bit Maskable Identifier Acceptance Filters
MC9S08DZ128 Series Data Sheet, Rev. 1
290
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
CAN 2.0B
Extended Identifier ID28
IDR0
IDR0
ID21 ID20
ID3 ID2
IDR1
IDR1
ID15 ID14
IDE
IDR2
ID7 ID6
IDR3
RTR
CAN 2.0A/B
ID10
Standard Identifier
AM7
AC7
CIDMR0
CIDAR0
AM0
AC0
ID Accepted (Filter 0 Hit)
AM7
AC7
CIDMR1
AM0
AC0
CIDAR1
ID Accepted (Filter 1 Hit)
AM7
AC7
CIDMR2
AM0
AC0
CIDAR2
ID Accepted (Filter 2 Hit)
AM7
AC7
CIDMR3
AM0
AC0
CIDAR3
ID Accepted (Filter 3 Hit)
Figure 12-41. 8-bit Maskable Identifier Acceptance Filters
MSCAN filter uses three sets of registers to provide the filter configuration. Firstly, the CANIDAC register
determines the configuration of the banks into filter sizes and number of filters. Secondly, registers
CANIDMR0/1/2/3 determine those bits on which the filter will operate by placing a ‘0’ at the appropriate
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
291
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
bit position in the filter register. Finally, registers CANIDAR0/1/2/3 determine the value of those bits
determined by CANIDMR0/1/2/3.
For instance in the case of the filter value of:
0001x1001x0
The CANIDMR0/1/2/3 register would be configured as:
00001000010
and so all message identifier bits except bit 1 and bit 6 would be compared against the CANIDAR0/1/2/3
registers. These would be configured as:
00010100100
In this case bits 1 and 6 are set to ‘0’, but since they are ignored it is equally valid to set them to ‘1’.
12.5.3.1 Identifier Acceptance Filters example
As described above, filters work by comparisons to individual bits in the CAN message identifier field. The
filter will check each one of the eleven bits of a standard CAN message identifier. Suppose a filter value of
0001x1001x0. In this simple example, there are only three possible CAN messages.
Filter value: 0001x1001x0
Message 1: 00011100110
Message 2: 00110100110
Message 3: 00010100100
Message 2 will be rejected since its third most significant bit is not ‘0’ - 001. The filter is simply a
convenient way of defining the set of messages that the CPU must receive. For full 29-bits of an extended
CAN message identifier, the filter identifies two sets of messages: one set that it receives and one set that
it rejects. Alternatively, the filter may be split into two. This allows the MSCAN to examine only the first
16 bits of a message identifier, but allows two separate filters to perform the checking. See the example
below:
Filter value A: 0001x1001x0
Filter value B: 00x101x01x0
Message 1: 00011100110
Message 2: 00110100110
Message 3: 00010100100
MSCAN will accept all three messages. Filter A will accept messages 1 and 3 as before and filter B will
accept message 2. In practice, it is unimportant which filter accepts the message - messages accepted by
either will be placed in the input buffer. A message may be accepted by more than one filter.
MC9S08DZ128 Series Data Sheet, Rev. 1
292
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.5.3.2 Protocol Violation Protection
The MSCAN protects the user from accidentally violating the CAN protocol through programming errors.
The protection logic implements the following features:
•
•
The receive and transmit error counters cannot be written or otherwise manipulated.
All registers which control the configuration of the MSCAN cannot be modified while the MSCAN
is on-line. The MSCAN has to be in Initialization Mode. The corresponding INITRQ/INITAK
handshake bits in the CANCTL0/CANCTL1 registers (see Section 12.3.1, “MSCAN Control
Register 0 (CANCTL0)”) serve as a lock to protect the following registers:
— MSCAN control 1 register (CANCTL1)
— MSCAN bus timing registers 0 and 1 (CANBTR0, CANBTR1)
— MSCAN identifier acceptance control register (CANIDAC)
— MSCAN identifier acceptance registers (CANIDAR0–CANIDAR7)
— MSCAN identifier mask registers (CANIDMR0–CANIDMR7)
•
•
The TXCAN pin is immediately forced to a recessive state when the MSCAN goes into the power
down mode or initialization mode (see Section 12.5.5.6, “MSCAN Power Down Mode,” and
Section 12.5.5.5, “MSCAN Initialization Mode”).
The MSCAN enable bit (CANE) is writable only once in normal system operation modes, which
provides further protection against inadvertently disabling the MSCAN.
12.5.3.3 Clock System
Figure 12-42 shows the structure of the MSCAN clock generation circuitry.
MSCAN
Bus Clock
Time quanta clock (Tq)
CANCLK
Prescaler
(1 .. 64)
CLKSRC
CLKSRC
Oscillator Clock
Figure 12-42. MSCAN Clocking Scheme
The clock source bit (CLKSRC) in the CANCTL1 register (12.3.2/-260) defines whether the internal
CANCLK is connected to the output of a crystal oscillator (oscillator clock) or to the bus clock.
The clock source has to be chosen such that the tight oscillator tolerance requirements (up to 0.4%) of the
CAN protocol are met. Additionally, for high CAN bus rates (1 Mbps), a 45% to 55% duty cycle of the
clock is required.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
293
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
If the bus clock is generated from a PLL, it is recommended to select the oscillator clock rather than the
bus clock due to jitter considerations, especially at the faster CAN bus rates. PLL lock may also be too
wide to ensure adequate clock tolerance.
For microcontrollers without a clock and reset generator (CRG), CANCLK is driven from the crystal
oscillator (oscillator clock).
A programmable prescaler generates the time quanta (Tq) clock from CANCLK. A time quantum is the
atomic unit of time handled by the MSCAN.
Eqn. 12-2
f
CANCLK
= -----------------------------------------------------
Tq
(Prescaler value)
A bit time is subdivided into three segments as described in the Bosch CAN specification. (see
Figure 12-43):
•
•
•
SYNC_SEG: This segment has a fixed length of one time quantum. Signal edges are expected to
happen within this section.
Time Segment 1: This segment includes the PROP_SEG and the PHASE_SEG1 of the CAN
standard. It can be programmed by setting the parameter TSEG1 to consist of 4 to 16 time quanta.
Time Segment 2: This segment represents the PHASE_SEG2 of the CAN standard. It can be
programmed by setting the TSEG2 parameter to be 2 to 8 time quanta long.
Eqn. 12-3
f
Tq
Bit Rate= --------------------------------------------------------------------------------
(number of Time Quanta)
NRZ Signal
Time Segment 1
Time Segment 2
(PHASE_SEG2)
SYNC_SEG
1
(PROP_SEG + PHASE_SEG1)
4 ... 16
2 ... 8
8 ... 25 Time Quanta
= 1 Bit Time
Transmit Point
Sample Point
(single or triple sampling)
Figure 12-43. Segments within the Bit Time
MC9S08DZ128 Series Data Sheet, Rev. 1
294
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-34. Time Segment Syntax
Syntax
Description
System expects transitions to occur on the CAN bus during this
period.
SYNC_SEG
A node in transmit mode transfers a new value to the CAN bus at
this point.
Transmit Point
Sample Point
A node in receive mode samples the CAN bus at this point. If the
three samples per bit option is selected, then this point marks the
position of the third sample.
The synchronization jump width (see the Bosch CAN specification for details) can be programmed in a
range of 1 to 4 time quanta by setting the SJW parameter.
The SYNC_SEG, TSEG1, TSEG2, and SJW parameters are set by programming the MSCAN bus timing
registers (CANBTR0, CANBTR1) (see Section 12.3.3, “MSCAN Bus Timing Register 0 (CANBTR0)”
and Section 12.3.4, “MSCAN Bus Timing Register 1 (CANBTR1)”).
Table 12-35 gives an overview of the CAN compliant segment settings and the related parameter values.
NOTE
It is the user’s responsibility to ensure the bit time settings are in compliance
with the CAN standard.
Table 12-35. CAN Standard Compliant Bit Time Segment Settings
Synchronization
Time Segment 1
TSEG1
Time Segment 2
TSEG2
SJW
Jump Width
5 .. 10
4 .. 11
5 .. 12
6 .. 13
7 .. 14
8 .. 15
9 .. 16
4 .. 9
3 .. 10
4 .. 11
5 .. 12
6 .. 13
7 .. 14
8 .. 15
2
3
4
5
6
7
8
1
2
3
4
5
6
7
1 .. 2
1 .. 3
1 .. 4
1 .. 4
1 .. 4
1 .. 4
1 .. 4
0 .. 1
0 .. 2
0 .. 3
0 .. 3
0 .. 3
0 .. 3
0 .. 3
12.5.4 Modes of Operation
12.5.4.1 Normal Modes
The MSCAN module behaves as described within this specification in all normal system operation modes.
12.5.4.2 Special Modes
The MSCAN module behaves as described within this specification in all special system operation modes.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
295
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.5.4.3 Emulation Modes
In all emulation modes, the MSCAN module behaves just like normal system operation modes as
described within this specification.
12.5.4.4 Listen-Only Mode
In an optional CAN bus monitoring mode (listen-only), the CAN node is able to receive valid data frames
and valid remote frames, but it sends only “recessive” bits on the CAN bus. In addition, it cannot start a
transmision. If the MAC sub-layer is required to send a “dominant” bit (ACK bit, overload flag, or active
error flag), the bit is rerouted internally so that the MAC sub-layer monitors this “dominant” bit, although
the CAN bus may remain in recessive state externally.
12.5.4.5 Security Modes
The MSCAN module has no security features.
12.5.4.6 Loopback Self Test Mode
Loopback self test mode is sometimes used to check software, independent of connections in the external
system, to help isolate system problems. In this mode, the transmitter output is internally connected to the
receiver input. The RXCAN input pin is ignored and the TXCAN output goes to the recessive state (logic
1). The MSCAN behaves as it does normally when transmitting and treats its own transmitted message as
a message received from a remote node. In this state, the MSCAN ignores the bit sent during the ACK slot
in the CAN frame acknowledge field to ensure proper reception of its own message. Both transmit and
receive interrupts are generated.
12.5.5 Low-Power Options
If the MSCAN is disabled (CANE = 0), the MSCAN clocks are stopped for power saving.
If the MSCAN is enabled (CANE = 1), the MSCAN has two additional modes with reduced power
consumption, compared to normal mode: sleep and power down mode. In sleep mode, power consumption
is reduced by stopping all clocks except those to access the registers from the CPU side. In power down
mode, all clocks are stopped and no power is consumed.
Table 12-36 summarizes the combinations of MSCAN and CPU modes. A particular combination of
modes is entered by the given settings on the CSWAI and SLPRQ/SLPAK bits.
For all modes, an MSCAN wake-up interrupt can occur only if the MSCAN is in sleep mode (SLPRQ = 1
and SLPAK = 1), wake-up functionality is enabled (WUPE = 1), and the wake-up interrupt is enabled
(WUPIE = 1).
MC9S08DZ128 Series Data Sheet, Rev. 1
296
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Table 12-36. CPU vs. MSCAN Operating Modes
MSCAN Mode
Reduced Power Consumption
CPU Mode
Normal
Disabled
(CANE=0)
Sleep
Power Down
CSWAI = X1
SLPRQ = 0
SLPAK = 0
CSWAI = X
SLPRQ = 1
SLPAK = 1
CSWAI = X
SLPRQ = X
SLPAK = X
Run
CSWAI = 0
SLPRQ = 0
SLPAK = 0
CSWAI = 0
SLPRQ = 1
SLPAK = 1
CSWAI = 1
SLPRQ = X
SLPAK = X
CSWAI = X
SLPRQ = X
SLPAK = X
Wait
CSWAI = X2
SLPRQ = 1
SLPAK = 1
CSWAI = X
SLPRQ = 0
SLPAK = 0
CSWAI = X
SLPRQ = X
SLPAK = X
Stop3
CSWAI = X
SLPRQ = X
SLPAK = X
CSWAI = X
SLPRQ = X
SLPAK = X
Stop1 or 2
1
2
‘X’ means don’t care.
For a safe wake up from Sleep mode, SLPRQ and SLPAK must be set to 1 before going into Stop3 mode.
12.5.5.1 Operation in Run Mode
As shown in Table 12-36, only MSCAN sleep mode is available as low power option when the CPU is in
run mode.
12.5.5.2 Operation in Wait Mode
The WAIT instruction puts the MCU in a low power consumption stand-by mode. If the CSWAI bit is set,
additional power can be saved in power down mode because the CPU clocks are stopped. After leaving
this power down mode, the MSCAN restarts its internal controllers and enters normal mode again.
While the CPU is in wait mode, the MSCAN can be operated in normal mode and generate interrupts
(registers can be accessed via background debug mode). The MSCAN can also operate in any of the
low-power modes depending on the values of the SLPRQ/SLPAK and CSWAI bits as seen in Table 12-36.
12.5.5.3 Operation in Stop Mode
The STOP instruction puts the MCU in a low power consumption stand-by mode. In stop1 or stop2 modes,
the MSCAN is set in power down mode regardless of the value of the SLPRQ/SLPAK. In stop3 mode,
power down or sleep modes are determined by the SLPRQ/SLPAK values set prior to entering stop3.
CSWAI bit has no function in any of the stop modes.Table 12-36.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
297
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.5.5.4 MSCAN Sleep Mode
The CPU can request the MSCAN to enter this low power mode by asserting the SLPRQ bit in the
CANCTL0 register. The time when the MSCAN enters sleep mode depends on a fixed synchronization
delay and its current activity:
•
If there are one or more message buffers scheduled for transmission (TXEx = 0), the MSCAN will
continue to transmit until all transmit message buffers are empty (TXEx = 1, transmitted
successfully or aborted) and then goes into sleep mode.
•
•
If the MSCAN is receiving, it continues to receive and goes into sleep mode as soon as the CAN
bus next becomes idle.
If the MSCAN is neither transmitting nor receiving, it immediately goes into sleep mode.
Bus Clock Domain
CAN Clock Domain
SLPRQ
Flag
SYNC
SYNC
SLPRQ
sync.
SLPRQ
CPU
Sleep Request
SLPAK
Flag
sync.
SLPAK
SLPAK
MSCAN
in Sleep Mode
Figure 12-44. Sleep Request / Acknowledge Cycle
NOTE
The application software must avoid setting up a transmission (by clearing
one or more TXEx flag(s)) and immediately request sleep mode (by setting
SLPRQ). Whether the MSCAN starts transmitting or goes into sleep mode
directly depends on the exact sequence of operations.
If sleep mode is active, the SLPRQ and SLPAK bits are set (Figure 12-44). The application software must
use SLPAK as a handshake indication for the request (SLPRQ) to go into sleep mode.
When in sleep mode (SLPRQ = 1 and SLPAK = 1), the MSCAN stops its internal clocks. However, clocks
that allow register accesses from the CPU side continue to run.
If the MSCAN is in bus-off state, it stops counting the 128 occurrences of 11 consecutive recessive bits
due to the stopped clocks. The TXCAN pin remains in a recessive state. If RXF = 1, the message can be
read and RXF can be cleared. Shifting a new message into the foreground buffer of the receiver FIFO
(RxFG) does not take place while in sleep mode.
It is possible to access the transmit buffers and to clear the associated TXE flags. No message abort takes
place while in sleep mode.
MC9S08DZ128 Series Data Sheet, Rev. 1
298
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
If the WUPE bit in CANCLT0 is not asserted, the MSCAN will mask any activity it detects on CAN. The
RXCAN pin is therefore held internally in a recessive state. This locks the MSCAN in sleep mode
(Figure 12-45). WUPE must be set before entering sleep mode to take effect.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
299
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
The MSCAN is able to leave sleep mode (wake up) only when:
•
CAN bus activity occurs and WUPE = 1
or
•
the CPU clears the SLPRQ bit
NOTE
The CPU cannot clear the SLPRQ bit before sleep mode (SLPRQ = 1 and
SLPAK = 1) is active.
After wake-up, the MSCAN waits for 11 consecutive recessive bits to synchronize to the CAN bus. As a
consequence, if the MSCAN is woken-up by a CAN frame, this frame is not received.
The receive message buffers (RxFG and RxBG) contain messages if they were received before sleep mode
was entered. All pending actions will be executed upon wake-up; copying of RxBG into RxFG, message
aborts and message transmissions. If the MSCAN remains in bus-off state after sleep mode was exited, it
continues counting the 128 occurrences of 11 consecutive recessive bits.
CAN Activity
(CAN Activity & WUPE) | SLPRQ
Wait
StartUp
for Idle
CAN Activity
SLPRQ
CAN Activity &
Sleep
Idle
SLPRQ
(CAN Activity & WUPE) |
CAN Activity
CAN Activity &
SLPRQ
CAN Activity
Tx/Rx
Message
Active
CAN Activity
Figure 12-45. Simplified State Transitions for Entering/Leaving Sleep Mode
MC9S08DZ128 Series Data Sheet, Rev. 1
300
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.5.5.5 MSCAN Initialization Mode
In initialization mode, any on-going transmission or reception is immediately aborted and synchronization
to the CAN bus is lost, potentially causing CAN protocol violations. To protect the CAN bus system from
fatal consequences of violations, the MSCAN immediately drives the TXCAN pin into a recessive state.
NOTE
The user is responsible for ensuring that the MSCAN is not active when
initialization mode is entered. The recommended procedure is to bring the
MSCAN into sleep mode (SLPRQ = 1 and SLPAK = 1) before setting the
INITRQ bit in the CANCTL0 register. Otherwise, the abort of an on-going
message can cause an error condition and can impact other CAN bus
devices.
In initialization mode, the MSCAN is stopped. However, interface registers remain accessible. This mode
is used to reset the CANCTL0, CANRFLG, CANRIER, CANTFLG, CANTIER, CANTARQ,
CANTAAK, and CANTBSEL registers to their default values. In addition, the MSCAN enables the
configuration of the CANBTR0, CANBTR1 bit timing registers; CANIDAC; and the CANIDAR,
CANIDMR message filters. See Section 12.3.1, “MSCAN Control Register 0 (CANCTL0),” for a detailed
description of the initialization mode.
Bus Clock Domain
CAN Clock Domain
INIT
Flag
SYNC
SYNC
INITRQ
sync.
INITRQ
CPU
Init Request
INITAK
Flag
sync.
INITAK
INITAK
Figure 12-46. Initialization Request/Acknowledge Cycle
Due to independent clock domains within the MSCAN, INITRQ must be synchronized to all domains by
using a special handshake mechanism. This handshake causes additional synchronization delay (see
Section Figure 12-46., “Initialization Request/Acknowledge Cycle”).
If there is no message transfer ongoing on the CAN bus, the minimum delay will be two additional bus
clocks and three additional CAN clocks. When all parts of the MSCAN are in initialization mode, the
INITAK flag is set. The application software must use INITAK as a handshake indication for the request
(INITRQ) to go into initialization mode.
NOTE
The CPU cannot clear INITRQ before initialization mode (INITRQ = 1 and
INITAK = 1) is active.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
301
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.5.5.6 MSCAN Power Down Mode
The MSCAN is in power down mode (Table 12-36) when
•
CPU is in stop mode
or
•
CPU is in wait mode and the CSWAI bit is set
When entering the power down mode, the MSCAN immediately stops all ongoing transmissions and
receptions, potentially causing CAN protocol violations. To protect the CAN bus system from fatal
consequences of violations to the above rule, the MSCAN immediately drives the TXCAN pin into a
recessive state.
NOTE
The user is responsible for ensuring that the MSCAN is not active when
power down mode is entered. The recommended procedure is to bring the
MSCAN into Sleep mode before the STOP or WAIT instruction (if CSWAI
is set) is executed. Otherwise, the abort of an ongoing message can cause an
error condition and impact other CAN bus devices.
In power down mode, all clocks are stopped and no registers can be accessed. If the MSCAN was not in
sleep mode before power down mode became active, the module performs an internal recovery cycle after
powering up. This causes some fixed delay before the module enters normal mode again.
12.5.5.7 Programmable Wake-Up Function
The MSCAN can be programmed to wake up the MSCAN as soon as CAN bus activity is detected (see
control bit WUPE in Section 12.3.1, “MSCAN Control Register 0 (CANCTL0)”). The sensitivity to
existing CAN bus action can be modified by applying a low-pass filter function to the RXCAN input line
while in sleep mode (see control bit WUPM in Section 12.3.2, “MSCAN Control Register 1
(CANCTL1)”).
This feature can be used to protect the MSCAN from wake-up due to short glitches on the CAN bus lines.
Such glitches can result from—for example—electromagnetic interference within noisy environments.
12.5.6 Reset Initialization
The reset state of each individual bit is listed in Section 12.3, “Register Definition,” which details all the
registers and their bit-fields.
12.5.7 Interrupts
This section describes all interrupts originated by the MSCAN. It documents the enable bits and generated
flags. Each interrupt is listed and described separately.
MC9S08DZ128 Series Data Sheet, Rev. 1
302
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.5.7.1 Description of Interrupt Operation
The MSCAN supports four interrupt vectors (see Table 12-37), any of which can be individually masked
(for details see sections from Section 12.3.5, “MSCAN Receiver Interrupt Enable Register (CANRIER),”
to Section 12.3.7, “MSCAN Transmitter Interrupt Enable Register (CANTIER)”).
NOTE
The dedicated interrupt vector addresses are defined in the Resets and
Interrupts chapter.
Table 12-37. Interrupt Vectors
Interrupt Source
CCR Mask
Local Enable
CANRIER (WUPIE)
Wake-Up Interrupt (WUPIF)
Error Interrupts Interrupt (CSCIF, OVRIF)
Receive Interrupt (RXF)
I bit
I bit
I bit
I bit
CANRIER (CSCIE, OVRIE)
CANRIER (RXFIE)
Transmit Interrupts (TXE[2:0])
CANTIER (TXEIE[2:0])
12.5.7.2 Transmit Interrupt
At least one of the three transmit buffers is empty (not scheduled) and can be loaded to schedule a message
for transmission. The TXEx flag of the empty message buffer is set.
12.5.7.3 Receive Interrupt
A message is successfully received and shifted into the foreground buffer (RxFG) of the receiver FIFO.
This interrupt is generated immediately after receiving the EOF symbol. The RXF flag is set. If there are
multiple messages in the receiver FIFO, the RXF flag is set as soon as the next message is shifted to the
foreground buffer.
12.5.7.4 Wake-Up Interrupt
A wake-up interrupt is generated if activity on the CAN bus occurs during MSCAN internal sleep mode.
WUPE (see Section 12.3.1, “MSCAN Control Register 0 (CANCTL0)”) must be enabled.
12.5.7.5 Error Interrupt
An error interrupt is generated if an overrun of the receiver FIFO, error, warning, or bus-off condition
occurrs. Section 12.3.4.1, “MSCAN Receiver Flag Register (CANRFLG) indicates one of the following
conditions:
•
Overrun — An overrun condition of the receiver FIFO as described in Section 12.5.2.3, “Receive
Structures,” occurred.
•
CAN Status Change — The actual value of the transmit and receive error counters control the
CAN bus state of the MSCAN. As soon as the error counters skip into a critical range
(Tx/Rx-warning, Tx/Rx-error, bus-off) the MSCAN flags an error condition. The status change,
which caused the error condition, is indicated by the TSTAT and RSTAT flags (see
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
303
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
Section 12.3.4.1, “MSCAN Receiver Flag Register (CANRFLG)” and Section 12.3.5, “MSCAN
Receiver Interrupt Enable Register (CANRIER)”).
12.5.7.6 Interrupt Acknowledge
Interrupts are directly associated with one or more status flags in either the Section 12.3.4.1, “MSCAN
Receiver Flag Register (CANRFLG)” or the Section 12.3.6, “MSCAN Transmitter Flag Register
(CANTFLG).” Interrupts are pending as long as one of the corresponding flags is set. The flags in
CANRFLG and CANTFLG must be reset within the interrupt handler to handshake the interrupt. The flags
are reset by writing a 1 to the corresponding bit position. A flag cannot be cleared if the respective
condition prevails.
NOTE
It must be guaranteed that the CPU clears only the bit causing the current
interrupt. For this reason, bit manipulation instructions (BSET) must not be
used to clear interrupt flags. These instructions may cause accidental
clearing of interrupt flags which are set after entering the current interrupt
service routine.
12.5.7.7 Recovery from Stop or Wait
The MSCAN can recover from stop or wait via the wake-up interrupt. This interrupt can only occur if the
MSCAN was in sleep mode (SLPRQ = 1 and SLPAK = 1) before entering power down mode, the wake-up
option is enabled (WUPE = 1), and the wake-up interrupt is enabled (WUPIE = 1).
12.6 Initialization/Application Information
12.6.1 MSCAN initialization
The procedure to initially start up the MSCAN module out of reset is as follows:
1. Assert CANE
2. Write to the configuration registers in initialization mode
3. Clear INITRQ to leave initialization mode and enter normal mode
If the configuration of registers which are writable in initialization mode needs to be changed only when
the MSCAN module is in normal mode:
1. Bring the module into sleep mode by setting SLPRQ and awaiting SLPAK to assert after the CAN
bus becomes idle.
2. Enter initialization mode: assert INITRQ and await INITAK
3. Write to the configuration registers in initialization mode
4. Clear INITRQ to leave initialization mode and continue in normal mode
MC9S08DZ128 Series Data Sheet, Rev. 1
304
Freescale Semiconductor
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
12.6.2 Bus-Off Recovery
The bus-off recovery is user configurable. The bus-off state can either be exited automatically or on user
request.
For reasons of backwards compatibility, the MSCAN defaults to automatic recovery after reset. In this
case, the MSCAN will become error active again after counting 128 occurrences of 11 consecutive
recessive bits on the CAN bus (See the Bosch CAN specification for details).
If the MSCAN is configured for user request (BORM set in Section 12.3.2, “MSCAN Control Register 1
(CANCTL1)”), the recovery from bus-off starts after both independent events have become true:
•
•
128 occurrences of 11 consecutive recessive bits on the CAN bus have been monitored
BOHOLD in Section 12.3.12, “MSCAN Miscellaneous Register (CANMISC) has been cleared by
the user
These two events may occur in any order.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
305
Chapter 12 Freescale’s Controller Area Network (S08MSCANV1)
MC9S08DZ128 Series Data Sheet, Rev. 1
306
Freescale Semiconductor
Chapter 13
Serial Peripheral Interface (S08SPIV3)
13.1 Introduction
The serial peripheral interface (SPI) module provides for full-duplex, synchronous, serial communication
between the MCU and peripheral devices. These peripheral devices can include other microcontrollers,
analog-to-digital converters, shift registers, sensors, memories, etc.
The SPI runs at a baud rate up to the bus clock divided by two in master mode and up to the bus clock
divided by four in slave mode. Software can poll the status flags, or SPI operation can be interrupt driven.
All MC9S08DZ128 Series MCUs in the 100-pin package have two SPIs; devices in the 64-pin and 48-pin
packages have one SPI.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
307
Chapter 13 Serial Peripheral Interface (S08SPIV3)
PTA7/PIA7/ADP7/IRQ
PTA6/PIA6/ADP6
PTA5/PIA5/ADP5
HCS08 CORE
DEBUG MODULE (DBG)
CPU
BKGD/MS
PTA4/PIA4/ADP4
ACMP1O
ACMP1-
ACMP1+
BDC
BKP
PTA3/PIA3/ADP3/ACMP1O
PTA2/PIA2/ADP2/ACMP1-
PTA1/PIA1/ADP1/ACMP1+
PTA0/PIA0/ADP0/MCLK
ANALOG COMPARATOR
(ACMP1)
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
RESET
REAL-TIME COUNTER (RTC)
PTB7/PIB7/ADP15
PTB6/PIB6/ADP14
PTB5/PIB5/ADP13
PTB4/PIB4/ADP12
PTB3/PIB3/ADP11
PTB2/PIB2/ADP10
PTB1/PIB1/ADP9
PTB0/PIB0/ADP8
COP
INT
LVD
IRQ
V
DD
8
VOLTAGE
REGULATOR
V
SS
V
REFH
ADP7-ADP0
24-CHANNEL,12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
V
V
V
REFL
DDA
SSA
●
●
●
●
●
●
●
●
PTC7/ADP23
PTC6/ADP22
PTC5/ADP21
PTC4/ADP20
PTC3/ADP19
PTC2/ADP18
PTC1/ADP17
PTC0/ADP16
ADP15-ADP8
ADP23-ADP16
USER MEMORY
FLASH _EEPROM _RAM
MC9S08DZ128 = 128K_2K_8K
MC9S08DZ96 = 96K_2K_6K
MC9S08DV128 = 128K_0K_6K
MC9S08DV96 = 96K_0K_4K
TPM1CH5 -
6-CHANNEL TIMER/PWM TPM1CH0
TPM1CLK
PTJ7/PIJ7/TPM3CLK
PTJ6/PIJ6
PTJ5/PIJ5
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTD1/PID1/TPM2CH1
PTD0/PID0/TPM2CH0
TPM3CLK
6
MODULE (TPM1)
TPM2CH1,
TPM2CH0
TPM2CLK
TPM3CH0 -
TPM3CH3
PTJ4/PIJ4
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTJ3/PIJ3/TMP3CH3
PTJ2/PIJ2/TPM3CH2
PTJ1/PIJ1/TPM3CH1
PTJ0/PIJ0/TMP3CH0
4-CHANNEL TIMER/PWM
MODULE (TPM3)
4
RxCAN
TXCAN
MISO1
PTK7
PTK6
PTK5
PTK4
PTK3
PTK2
PTK1
PTK0
CONTROLLER AREA
NETWORK (MSCAN)
PTE7/RxD2/RXCAN
PTE6/TxD2/TXCAN
PTE5/SDA1/MISO1
PTE4/SCL1/MOSI1
PTE3/SPSCK1
PTE2/SS1
MOSI1
SPSCK1
SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
SS1
RxD1
TxD1
PTE1/RxD1
SERIAL COMMUNICATIONS
INTERFACE (SCI1)
PTE0/TxD1
●
●
PTL7
PTL6
PTL5
PTL4
PTL3
PTL2
PTL1
PTL0
PTF7
ACMP2O
ACMP2-
ACMP2+
SDA1
PTF6/ACMP2O
PTF5/ACMP2-
PTF4/ACMP2+
PTF3/TPM2CLK/SDA1
PTF2/TPM1CLK/SCL1
PTF1/RxD2
ANALOG COMPARATOR
(ACMP2)
SCL1
IIC MODULE (IIC1)
RxD2
TxD2
SERIAL COMMUNICATIONS
INTERFACE (SCI2)
PTF0/TxD2
SDA2
SCL2
PTH7
PTH6
PTG7/SDA2
PTG6/SCL2
PTG5
IIC MODULE (IIC2)
●
●
●
●
PTH5
MULTI-PURPOSE
CLOCK
GENERATOR
(MCG)
PTH4
MISO2
PTG4
PTG3
PTH3/MISO2
PTH2/MOSI2
PTH1/SPSCK2
PTH0/SS2
MOSI2
SPSCK2
SERIAL PERIPHERAL
PTG2
XTAL
EXTAL
INTERFACE MODULE (SPI2)
OSCILLATOR
(XOSC)
SS2
PTG1/XTAL
PTG0/EXTAL
- Pin not connected in 64-pin and 48-pin packages
● - Pin not available in the 48-pin package
- In 48-pin package, VDDA and VREFH are internally connected to each other and VSSA and VREFL are internally connected to each other.
Figure 13-1. MC9S08DZ128 Block Diagram with SPI Highlighted
MC9S08DZ128 Series Data Sheet, Rev. 1
308
Freescale Semiconductor
Chapter 13 Serial Peripheral Interface (S08SPIV3)
13.1.1 Features
Features of the SPI module include:
•
•
•
•
•
•
•
Master or slave mode operation
Full-duplex or single-wire bidirectional option
Programmable transmit bit rate
Double-buffered transmit and receive
Serial clock phase and polarity options
Slave select output
Selectable MSB-first or LSB-first shifting
13.1.2 Block Diagrams
This section includes block diagrams showing SPI system connections, the internal organization of the SPI
module, and the SPI clock dividers that control the master mode bit rate.
13.1.2.1 SPI System Block Diagram
Figure 13-2 shows the SPI modules of two MCUs connected in a master-slave arrangement. The master
device initiates all SPI data transfers. During a transfer, the master shifts data out (on the MOSI pin) to the
slave while simultaneously shifting data in (on the MISO pin) from the slave. The transfer effectively
exchanges the data that was in the SPI shift registers of the two SPI systems. The SPSCK signal is a clock
output from the master and an input to the slave. The slave device must be selected by a low level on the
slave select input (SS pin). In this system, the master device has configured its SS pin as an optional slave
select output.
SLAVE
MASTER
MOSI
MISO
MOSI
MISO
SPI SHIFTER
SPI SHIFTER
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
SPSCK
SS
SPSCK
SS
CLOCK
GENERATOR
Figure 13-2. SPI System Connections
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
309
Chapter 13 Serial Peripheral Interface (S08SPIV3)
The most common uses of the SPI system include connecting simple shift registers for adding input or
output ports or connecting small peripheral devices such as serial A/D or D/A converters. Although
Figure 13-2 shows a system where data is exchanged between two MCUs, many practical systems involve
simpler connections where data is unidirectionally transferred from the master MCU to a slave or from a
slave to the master MCU.
13.1.2.2 SPI Module Block Diagram
Figure 13-3 is a block diagram of the SPI module. The central element of the SPI is the SPI shift register.
Data is written to the double-buffered transmitter (write to SPIxD) and gets transferred to the SPI shift
register at the start of a data transfer. After shifting in a byte of data, the data is transferred into the
double-buffered receiver where it can be read (read from SPIxD). Pin multiplexing logic controls
connections between MCU pins and the SPI module.
When the SPI is configured as a master, the clock output is routed to the SPSCK pin, the shifter output is
routed to MOSI, and the shifter input is routed from the MISO pin.
When the SPI is configured as a slave, the SPSCK pin is routed to the clock input of the SPI, the shifter
output is routed to MISO, and the shifter input is routed from the MOSI pin.
In the external SPI system, simply connect all SPSCK pins to each other, all MISO pins together, and all
MOSI pins together. Peripheral devices often use slightly different names for these pins.
MC9S08DZ128 Series Data Sheet, Rev. 1
310
Freescale Semiconductor
Chapter 13 Serial Peripheral Interface (S08SPIV3)
PIN CONTROL
M
MOSI
SPE
S
(MOMI)
Tx BUFFER (WRITE SPIxD)
ENABLE
M
S
MISO
SPI SYSTEM
(SISO)
SHIFT
OUT
SHIFT
IN
SPI SHIFT REGISTER
SPC0
Rx BUFFER (READ SPIxD)
BIDIROE
SHIFT
SHIFT
Rx BUFFER
FULL
Tx BUFFER
EMPTY
LSBFE
DIRECTION
CLOCK
MASTER CLOCK
SLAVE CLOCK
M
S
BUS RATE
CLOCK
CLOCK
LOGIC
SPIBR
SPSCK
CLOCK GENERATOR
MASTER/SLAVE
MODE SELECT
MASTER/
SLAVE
MSTR
MODFEN
SSOE
MODE FAULT
DETECTION
SS
SPTEF
SPTIE
SPRF
SPI
INTERRUPT
REQUEST
MODF
SPIE
Figure 13-3. SPI Module Block Diagram
13.1.3 SPI Baud Rate Generation
As shown in Figure 13-4, the clock source for the SPI baud rate generator is the bus clock. The three
prescale bits (SPPR2:SPPR1:SPPR0) choose a prescale divisor of 1, 2, 3, 4, 5, 6, 7, or 8. The three rate
select bits (SPR2:SPR1:SPR0) divide the output of the prescaler stage by 2, 4, 8, 16, 32, 64, 128, or 256
to get the internal SPI master mode bit-rate clock.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
311
Chapter 13 Serial Peripheral Interface (S08SPIV3)
PRESCALER
CLOCK RATE DIVIDER
MASTER
SPI
BIT RATE
DIVIDE BY
DIVIDE BY
BUS CLOCK
1, 2, 3, 4, 5, 6, 7, or 8
2, 4, 8, 16, 32, 64, 128, or 256
SPPR2:SPPR1:SPPR0
SPR2:SPR1:SPR0
Figure 13-4. SPI Baud Rate Generation
13.2 External Signal Description
The SPI optionally shares four port pins. The function of these pins depends on the settings of SPI control
bits. When the SPI is disabled (SPE = 0), these four pins revert to being general-purpose port I/O pins that
are not controlled by the SPI.
13.2.1 SPSCK — SPI Serial Clock
When the SPI is enabled as a slave, this pin is the serial clock input. When the SPI is enabled as a master,
this pin is the serial clock output.
13.2.2 MOSI — Master Data Out, Slave Data In
When the SPI is enabled as a master and SPI pin control zero (SPC0) is 0 (not bidirectional mode), this
pin is the serial data output. When the SPI is enabled as a slave and SPC0 = 0, this pin is the serial data
input. If SPC0 = 1 to select single-wire bidirectional mode, and master mode is selected, this pin becomes
the bidirectional data I/O pin (MOMI). Also, the bidirectional mode output enable bit determines whether
the pin acts as an input (BIDIROE = 0) or an output (BIDIROE = 1). If SPC0 = 1 and slave mode is
selected, this pin is not used by the SPI and reverts to being a general-purpose port I/O pin.
13.2.3 MISO — Master Data In, Slave Data Out
When the SPI is enabled as a master and SPI pin control zero (SPC0) is 0 (not bidirectional mode), this
pin is the serial data input. When the SPI is enabled as a slave and SPC0 = 0, this pin is the serial data
output. If SPC0 = 1 to select single-wire bidirectional mode, and slave mode is selected, this pin becomes
the bidirectional data I/O pin (SISO) and the bidirectional mode output enable bit determines whether the
pin acts as an input (BIDIROE = 0) or an output (BIDIROE = 1). If SPC0 = 1 and master mode is selected,
this pin is not used by the SPI and reverts to being a general-purpose port I/O pin.
13.2.4 SS — Slave Select
When the SPI is enabled as a slave, this pin is the low-true slave select input. When the SPI is enabled as
a master and mode fault enable is off (MODFEN = 0), this pin is not used by the SPI and reverts to being
a general-purpose port I/O pin. When the SPI is enabled as a master and MODFEN = 1, the slave select
output enable bit determines whether this pin acts as the mode fault input (SSOE = 0) or as the slave select
output (SSOE = 1).
MC9S08DZ128 Series Data Sheet, Rev. 1
312
Freescale Semiconductor
Chapter 13 Serial Peripheral Interface (S08SPIV3)
13.3 Modes of Operation
13.3.1 SPI in Stop Modes
The SPI is disabled in all stop modes, regardless of the settings before executing the STOP instruction.
During either stop1 or stop2 mode, the SPI module will be fully powered down. Upon wake-up from stop1
or stop2 mode, the SPI module will be in the reset state. During stop3 mode, clocks to the SPI module are
halted. No registers are affected. If stop3 is exited with a reset, the SPI will be put into its reset state. If
stop3 is exited with an interrupt, the SPI continues from the state it was in when stop3 was entered.
13.4 Register Definition
The SPI has five 8-bit registers to select SPI options, control baud rate, report SPI status, and for
transmit/receive data.
Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address
assignments for all SPI registers. This section refers to registers and control bits only by their names, and
a Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
13.4.1 SPI Control Register 1 (SPIxC1)
This read/write register includes the SPI enable control, interrupt enables, and configuration options.
7
6
5
4
3
2
1
0
R
W
SPIE
SPE
SPTIE
MSTR
CPOL
CPHA
SSOE
LSBFE
Reset
0
0
0
0
0
1
0
0
Figure 13-5. SPI Control Register 1 (SPIxC1)
Table 13-1. SPIxC1 Field Descriptions
Description
Field
7
SPI Interrupt Enable (for SPRF and MODF) — This is the interrupt enable for SPI receive buffer full (SPRF)
and mode fault (MODF) events.
SPIE
0 Interrupts from SPRF and MODF inhibited (use polling)
1 When SPRF or MODF is 1, request a hardware interrupt
6
SPI System Enable — Disabling the SPI halts any transfer that is in progress, clears data buffers, and initializes
SPE
internal state machines. SPRF is cleared and SPTEF is set to indicate the SPI transmit data buffer is empty.
0 SPI system inactive
1 SPI system enabled
5
SPI Transmit Interrupt Enable — This is the interrupt enable bit for SPI transmit buffer empty (SPTEF).
0 Interrupts from SPTEF inhibited (use polling)
SPTIE
1 When SPTEF is 1, hardware interrupt requested
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
313
Chapter 13 Serial Peripheral Interface (S08SPIV3)
Table 13-1. SPIxC1 Field Descriptions (continued)
Field
Description
4
Master/Slave Mode Select
MSTR
0 SPI module configured as a slave SPI device
1 SPI module configured as a master SPI device
3
Clock Polarity — This bit effectively places an inverter in series with the clock signal from a master SPI or to a
slave SPI device. Refer to Section 13.5.1, “SPI Clock Formats” for more details.
0 Active-high SPI clock (idles low)
CPOL
1 Active-low SPI clock (idles high)
2
Clock Phase — This bit selects one of two clock formats for different kinds of synchronous serial peripheral
devices. Refer to Section 13.5.1, “SPI Clock Formats” for more details.
CPHA
0 First edge on SPSCK occurs at the middle of the first cycle of an 8-cycle data transfer
1 First edge on SPSCK occurs at the start of the first cycle of an 8-cycle data transfer
1
Slave Select Output Enable — This bit is used in combination with the mode fault enable (MODFEN) bit in
SSOE
SPCR2 and the master/slave (MSTR) control bit to determine the function of the SS pin as shown in Table 13-2.
0
LSB First (Shifter Direction)
LSBFE
0 SPI serial data transfers start with most significant bit
1 SPI serial data transfers start with least significant bit
Table 13-2. SS Pin Function
MODFEN
SSOE
Master Mode
Slave Mode
Slave select input
0
0
1
1
0
1
0
1
General-purpose I/O (not SPI)
General-purpose I/O (not SPI)
SS input for mode fault
Slave select input
Slave select input
Slave select input
Automatic SS output
NOTE
Ensure that the SPI should not be disabled (SPE=0) at the same time as a bit change to the CPHA bit. These
changes should be performed as separate operations or unexpected behavior may occur.
13.4.2 SPI Control Register 2 (SPIxC2)
This read/write register is used to control optional features of the SPI system. Bits 7, 6, 5, and 2 are not
implemented and always read 0.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
MODFEN
BIDIROE
SPISWAI
SPC0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-6. SPI Control Register 2 (SPIxC2)
MC9S08DZ128 Series Data Sheet, Rev. 1
314
Freescale Semiconductor
Chapter 13 Serial Peripheral Interface (S08SPIV3)
Table 13-3. SPIxC2 Register Field Descriptions
Field
Description
4
Master Mode-Fault Function Enable — When the SPI is configured for slave mode, this bit has no meaning or
MODFEN effect. (The SS pin is the slave select input.) In master mode, this bit determines how the SS pin is used (refer
to Table 13-2 for more details).
0 Mode fault function disabled, master SS pin reverts to general-purpose I/O not controlled by SPI
1 Mode fault function enabled, master SS pin acts as the mode fault input or the slave select output
3
Bidirectional Mode Output Enable — When bidirectional mode is enabled by SPI pin control 0 (SPC0) = 1,
BIDIROE BIDIROE determines whether the SPI data output driver is enabled to the single bidirectional SPI I/O pin.
Depending on whether the SPI is configured as a master or a slave, it uses either the MOSI (MOMI) or MISO
(SISO) pin, respectively, as the single SPI data I/O pin. When SPC0 = 0, BIDIROE has no meaning or effect.
0 Output driver disabled so SPI data I/O pin acts as an input
1 SPI I/O pin enabled as an output
1
SPI Stop in Wait Mode
SPISWAI 0 SPI clocks continue to operate in wait mode
1 SPI clocks stop when the MCU enters wait mode
0
SPI Pin Control 0 — The SPC0 bit chooses single-wire bidirectional mode. If MSTR = 0 (slave mode), the SPI
uses the MISO (SISO) pin for bidirectional SPI data transfers. If MSTR = 1 (master mode), the SPI uses the
MOSI (MOMI) pin for bidirectional SPI data transfers. When SPC0 = 1, BIDIROE is used to enable or disable the
output driver for the single bidirectional SPI I/O pin.
SPC0
0 SPI uses separate pins for data input and data output
1 SPI configured for single-wire bidirectional operation
13.4.3 SPI Baud Rate Register (SPIxBR)
This register is used to set the prescaler and bit rate divisor for an SPI master. This register may be read or
written at any time.
7
6
5
4
3
2
1
0
R
W
0
0
SPPR2
SPPR1
SPPR0
SPR2
SPR1
SPR0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-7. SPI Baud Rate Register (SPIxBR)
Table 13-4. SPIxBR Register Field Descriptions
Description
Field
6:4
SPI Baud Rate Prescale Divisor — This 3-bit field selects one of eight divisors for the SPI baud rate prescaler
SPPR[2:0] as shown in Table 13-5. The input to this prescaler is the bus rate clock (BUSCLK). The output of this prescaler
drives the input of the SPI baud rate divider (see Figure 13-4).
2:0
SPR[2:0]
SPI Baud Rate Divisor — This 3-bit field selects one of eight divisors for the SPI baud rate divider as shown in
Table 13-6. The input to this divider comes from the SPI baud rate prescaler (see Figure 13-4). The output of this
divider is the SPI bit rate clock for master mode.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
315
Chapter 13 Serial Peripheral Interface (S08SPIV3)
Table 13-5. SPI Baud Rate Prescaler Divisor
SPPR2:SPPR1:SPPR0
Prescaler Divisor
0:0:0
0:0:1
0:1:0
0:1:1
1:0:0
1:0:1
1:1:0
1:1:1
1
2
3
4
5
6
7
8
Table 13-6. SPI Baud Rate Divisor
SPR2:SPR1:SPR0
0:0:0
Rate Divisor
2
0:0:1
0:1:0
0:1:1
1:0:0
1:0:1
1:1:0
1:1:1
4
8
16
32
64
128
256
13.4.4 SPI Status Register (SPIxS)
This register has three read-only status bits. Bits 6, 3, 2, 1, and 0 are not implemented and always read 0.
Writes have no meaning or effect.
7
6
5
4
3
2
1
0
R
W
SPRF
0
SPTEF
MODF
0
0
0
0
Reset
0
0
1
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-8. SPI Status Register (SPIxS)
MC9S08DZ128 Series Data Sheet, Rev. 1
316
Freescale Semiconductor
Chapter 13 Serial Peripheral Interface (S08SPIV3)
Table 13-7. SPIxS Register Field Descriptions
Field
Description
7
SPI Read Buffer Full Flag — SPRF is set at the completion of an SPI transfer to indicate that received data may
be read from the SPI data register (SPIxD). SPRF is cleared by reading SPRF while it is set, then reading the
SPI data register.
SPRF
0 No data available in the receive data buffer
1 Data available in the receive data buffer
5
SPI Transmit Buffer Empty Flag — This bit is set when there is room in the transmit data buffer. It is cleared by
reading SPIxS with SPTEF set, followed by writing a data value to the transmit buffer at SPIxD. SPIxS must be
read with SPTEF = 1 before writing data to SPIxD or the SPIxD write will be ignored. SPTEF generates an
SPTEF CPU interrupt request if the SPTIE bit in the SPIxC1 is also set. SPTEF is automatically set when a data
byte transfers from the transmit buffer into the transmit shift register. For an idle SPI (no data in the transmit buffer
or the shift register and no transfer in progress), data written to SPIxD is transferred to the shifter almost
immediately so SPTEF is set within two bus cycles allowing a second 8-bit data value to be queued into the
transmit buffer. After completion of the transfer of the value in the shift register, the queued value from the
transmit buffer will automatically move to the shifter and SPTEF will be set to indicate there is room for new data
in the transmit buffer. If no new data is waiting in the transmit buffer, SPTEF simply remains set and no data
moves from the buffer to the shifter.
SPTEF
0 SPI transmit buffer not empty
1 SPI transmit buffer empty
4
Master Mode Fault Flag — MODF is set if the SPI is configured as a master and the slave select input goes
low, indicating some other SPI device is also configured as a master. The SS pin acts as a mode fault error input
only when MSTR = 1, MODFEN = 1, and SSOE = 0; otherwise, MODF will never be set. MODF is cleared by
reading MODF while it is 1, then writing to SPI control register 1 (SPIxC1).
0 No mode fault error
MODF
1 Mode fault error detected
13.4.5 SPI Data Register (SPIxD)
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 13-9. SPI Data Register (SPIxD)
Reads of this register return the data read from the receive data buffer. Writes to this register write data to
the transmit data buffer. When the SPI is configured as a master, writing data to the transmit data buffer
initiates an SPI transfer.
Data should not be written to the transmit data buffer unless the SPI transmit buffer empty flag (SPTEF)
is set, indicating there is room in the transmit buffer to queue a new transmit byte.
Data may be read from SPIxD any time after SPRF is set and before another transfer is finished. Failure
to read the data out of the receive data buffer before a new transfer ends causes a receive overrun condition
and the data from the new transfer is lost.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
317
Chapter 13 Serial Peripheral Interface (S08SPIV3)
13.5 Functional Description
An SPI transfer is initiated by checking for the SPI transmit buffer empty flag (SPTEF = 1) and then
writing a byte of data to the SPI data register (SPIxD) in the master SPI device. When the SPI shift register
is available, this byte of data is moved from the transmit data buffer to the shifter, SPTEF is set to indicate
there is room in the buffer to queue another transmit character if desired, and the SPI serial transfer starts.
During the SPI transfer, data is sampled (read) on the MISO pin at one SPSCK edge and shifted, changing
the bit value on the MOSI pin, one-half SPSCK cycle later. After eight SPSCK cycles, the data that was in
the shift register of the master has been shifted out the MOSI pin to the slave while eight bits of data were
shifted in the MISO pin into the master’s shift register. At the end of this transfer, the received data byte is
moved from the shifter into the receive data buffer and SPRF is set to indicate the data can be read by
reading SPIxD. If another byte of data is waiting in the transmit buffer at the end of a transfer, it is moved
into the shifter, SPTEF is set, and a new transfer is started.
Normally, SPI data is transferred most significant bit (MSB) first. If the least significant bit first enable
(LSBFE) bit is set, SPI data is shifted LSB first.
When the SPI is configured as a slave, its SS pin must be driven low before a transfer starts and SS must
stay low throughout the transfer. If a clock format where CPHA = 0 is selected, SS must be driven to a
logic 1 between successive transfers. If CPHA = 1, SS may remain low between successive transfers. See
Section 13.5.1, “SPI Clock Formats” for more details.
Because the transmitter and receiver are double buffered, a second byte, in addition to the byte currently
being shifted out, can be queued into the transmit data buffer, and a previously received character can be
in the receive data buffer while a new character is being shifted in. The SPTEF flag indicates when the
transmit buffer has room for a new character. The SPRF flag indicates when a received character is
available in the receive data buffer. The received character must be read out of the receive buffer (read
SPIxD) before the next transfer is finished or a receive overrun error results.
In the case of a receive overrun, the new data is lost because the receive buffer still held the previous
character and was not ready to accept the new data. There is no indication for such an overrun condition
so the application system designer must ensure that previous data has been read from the receive buffer
before a new transfer is initiated.
13.5.1 SPI Clock Formats
To accommodate a wide variety of synchronous serial peripherals from different manufacturers, the SPI
system has a clock polarity (CPOL) bit and a clock phase (CPHA) control bit to select one of four clock
formats for data transfers. CPOL selectively inserts an inverter in series with the clock. CPHA chooses
between two different clock phase relationships between the clock and data.
Figure 13-10 shows the clock formats when CPHA = 1. At the top of the figure, the eight bit times are
shown for reference with bit 1 starting at the first SPSCK edge and bit 8 ending one-half SPSCK cycle after
the sixteenth SPSCK edge. The MSB first and LSB first lines show the order of SPI data bits depending
on the setting in LSBFE. Both variations of SPSCK polarity are shown, but only one of these waveforms
applies for a specific transfer, depending on the value in CPOL. The SAMPLE IN waveform applies to the
MOSI input of a slave or the MISO input of a master. The MOSI waveform applies to the MOSI output
MC9S08DZ128 Series Data Sheet, Rev. 1
318
Freescale Semiconductor
Chapter 13 Serial Peripheral Interface (S08SPIV3)
pin from a master and the MISO waveform applies to the MISO output from a slave. The SS OUT
waveform applies to the slave select output from a master (provided MODFEN and SSOE = 1). The master
SS output goes to active low one-half SPSCK cycle before the start of the transfer and goes back high at
the end of the eighth bit time of the transfer. The SS IN waveform applies to the slave select input of a
slave.
BIT TIME #
(REFERENCE)
1
2
...
6
7
8
SPSCK
(CPOL = 0)
SPSCK
(CPOL = 1)
SAMPLE IN
(MISO OR MOSI)
MOSI
(MASTER OUT)
MSB FIRST
LSB FIRST
BIT 7
BIT 0
BIT 6
BIT 1
...
...
BIT 2
BIT 5
BIT 1
BIT 6
BIT 0
BIT 7
MISO
(SLAVE OUT)
SS OUT
(MASTER)
SS IN
(SLAVE)
Figure 13-10. SPI Clock Formats (CPHA = 1)
When CPHA = 1, the slave begins to drive its MISO output when SS goes to active low, but the data is not
defined until the first SPSCK edge. The first SPSCK edge shifts the first bit of data from the shifter onto
the MOSI output of the master and the MISO output of the slave. The next SPSCK edge causes both the
master and the slave to sample the data bit values on their MISO and MOSI inputs, respectively. At the
third SPSCK edge, the SPI shifter shifts one bit position which shifts in the bit value that was just sampled,
and shifts the second data bit value out the other end of the shifter to the MOSI and MISO outputs of the
master and slave, respectively. When CHPA = 1, the slave’s SS input is not required to go to its inactive
high level between transfers.
Figure 13-11 shows the clock formats when CPHA = 0. At the top of the figure, the eight bit times are
shown for reference with bit 1 starting as the slave is selected (SS IN goes low), and bit 8 ends at the last
SPSCK edge. The MSB first and LSB first lines show the order of SPI data bits depending on the setting
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
319
Chapter 13 Serial Peripheral Interface (S08SPIV3)
in LSBFE. Both variations of SPSCK polarity are shown, but only one of these waveforms applies for a
specific transfer, depending on the value in CPOL. The SAMPLE IN waveform applies to the MOSI input
of a slave or the MISO input of a master. The MOSI waveform applies to the MOSI output pin from a
master and the MISO waveform applies to the MISO output from a slave. The SS OUT waveform applies
to the slave select output from a master (provided MODFEN and SSOE = 1). The master SS output goes
to active low at the start of the first bit time of the transfer and goes back high one-half SPSCK cycle after
the end of the eighth bit time of the transfer. The SS IN waveform applies to the slave select input of a
slave.
BIT TIME #
(REFERENCE)
1
2
...
6
7
8
SPSCK
(CPOL = 0)
SPSCK
(CPOL = 1)
SAMPLE IN
(MISO OR MOSI)
MOSI
(MASTER OUT)
MSB FIRST
LSB FIRST
BIT 7
BIT 0
BIT 6
BIT 1
...
...
BIT 2
BIT 5
BIT 1
BIT 6
BIT 0
BIT 7
MISO
(SLAVE OUT)
SS OUT
(MASTER)
SS IN
(SLAVE)
Figure 13-11. SPI Clock Formats (CPHA = 0)
When CPHA = 0, the slave begins to drive its MISO output with the first data bit value (MSB or LSB
depending on LSBFE) when SS goes to active low. The first SPSCK edge causes both the master and the
slave to sample the data bit values on their MISO and MOSI inputs, respectively. At the second SPSCK
edge, the SPI shifter shifts one bit position which shifts in the bit value that was just sampled and shifts the
second data bit value out the other end of the shifter to the MOSI and MISO outputs of the master and
slave, respectively. When CPHA = 0, the slave’s SS input must go to its inactive high level between
transfers.
MC9S08DZ128 Series Data Sheet, Rev. 1
320
Freescale Semiconductor
Chapter 13 Serial Peripheral Interface (S08SPIV3)
13.5.2 SPI Interrupts
There are three flag bits, two interrupt mask bits, and one interrupt vector associated with the SPI system.
The SPI interrupt enable mask (SPIE) enables interrupts from the SPI receiver full flag (SPRF) and mode
fault flag (MODF). The SPI transmit interrupt enable mask (SPTIE) enables interrupts from the SPI
transmit buffer empty flag (SPTEF). When one of the flag bits is set, and the associated interrupt mask bit
is set, a hardware interrupt request is sent to the CPU. If the interrupt mask bits are cleared, software can
poll the associated flag bits instead of using interrupts. The SPI interrupt service routine (ISR) should
check the flag bits to determine what event caused the interrupt. The service routine should also clear the
flag bit(s) before returning from the ISR (usually near the beginning of the ISR).
13.5.3 Mode Fault Detection
A mode fault occurs and the mode fault flag (MODF) becomes set when a master SPI device detects an
error on the SS pin (provided the SS pin is configured as the mode fault input signal). The SS pin is
configured to be the mode fault input signal when MSTR = 1, mode fault enable is set (MODFEN = 1),
and slave select output enable is clear (SSOE = 0).
The mode fault detection feature can be used in a system where more than one SPI device might become
a master at the same time. The error is detected when a master’s SS pin is low, indicating that some other
SPI device is trying to address this master as if it were a slave. This could indicate a harmful output driver
conflict, so the mode fault logic is designed to disable all SPI output drivers when such an error is detected.
When a mode fault is detected, MODF is set and MSTR is cleared to change the SPI configuration back
to slave mode. The output drivers on the SPSCK, MOSI, and MISO (if not bidirectional mode) are
disabled.
MODF is cleared by reading it while it is set, then writing to the SPI control register 1 (SPIxC1). User
software should verify the error condition has been corrected before changing the SPI back to master
mode.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
321
Chapter 13 Serial Peripheral Interface (S08SPIV3)
MC9S08DZ128 Series Data Sheet, Rev. 1
322
Freescale Semiconductor
Chapter 14
Serial Communications Interface (S08SCIV4)
14.1 Introduction
All MCUs in the MC9S08DZ128 Series include SCI1 and SCI2.
NOTE
MC9S08DZ128 Series devices operate at a higher voltage range (2.7 V to
5.5 V) and do not include stop1 mode. Please ignore references to stop1.
14.1.1 SCI2 Configuration Information
The SCI2 module pins, TxD2 and RxD2 can be repositioned under software control using SCI2PS in
SOPT1 as shown in Table 14-1. SCI2PS in SOPT1 selects which general-purpose I/O ports are associated
with the SCI2 operation.
Table 14-1. SCI2 Position Options
SCI2PS in SOPT1
Port Pin for TXD2
Port Pin for RxD2
0 (default)
1
PTF0
PTE6
PTF1
PTE7
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
323
Chapter 14 Serial Communications Interface (S08SCIV4)
PTA7/PIA7/ADP7/IRQ
PTA6/PIA6/ADP6
PTA5/PIA5/ADP5
HCS08 CORE
DEBUG MODULE (DBG)
CPU
BKGD/MS
RESET
PTA4/PIA4/ADP4
ACMP1O
ACMP1-
ACMP1+
BDC
BKP
PTA3/PIA3/ADP3/ACMP1O
PTA2/PIA2/ADP2/ACMP1-
PTA1/PIA1/ADP1/ACMP1+
PTA0/PIA0/ADP0/MCLK
ANALOG COMPARATOR
(ACMP1)
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
REAL-TIME COUNTER (RTC)
PTB7/PIB7/ADP15
PTB6/PIB6/ADP14
PTB5/PIB5/ADP13
PTB4/PIB4/ADP12
PTB3/PIB3/ADP11
PTB2/PIB2/ADP10
PTB1/PIB1/ADP9
PTB0/PIB0/ADP8
COP
INT
LVD
IRQ
V
DD
8
VOLTAGE
REGULATOR
V
SS
V
REFH
ADP7-ADP0
24-CHANNEL,12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
V
REFL
●
●
●
●
●
●
●
●
PTC7/ADP23
PTC6/ADP22
PTC5/ADP21
PTC4/ADP20
PTC3/ADP19
PTC2/ADP18
PTC1/ADP17
PTC0/ADP16
V
DDA
ADP15-ADP8
ADP23-ADP16
V
SSA
USER MEMORY
FLASH _EEPROM _RAM
MC9S08DZ128 = 128K_2K_8K
MC9S08DZ96 = 96K_2K_6K
MC9S08DV128 = 128K_0K_6K
MC9S08DV96 = 96K_0K_4K
TPM1CH5 -
6-CHANNEL TIMER/PWM TPM1CH0
TPM1CLK
PTJ7/PIJ7/TPM3CLK
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTD1/PID1/TPM2CH1
PTD0/PID0/TPM2CH0
TPM3CLK
6
PTJ6/PIJ6
PTJ5/PIJ5
PTJ4/PIJ4
MODULE (TPM1)
TPM2CH1,
TPM2CH0
TPM2CLK
TPM3CH0 -
TPM3CH3
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTJ3/PIJ3/TMP3CH3
PTJ2/PIJ2/TPM3CH2
PTJ1/PIJ1/TPM3CH1
PTJ0/PIJ0/TMP3CH0
4-CHANNEL TIMER/PWM
MODULE (TPM3)
4
RxCAN
TXCAN
MISO1
PTK7
PTK6
PTK5
PTK4
PTK3
PTK2
PTK1
PTK0
CONTROLLER AREA
NETWORK (MSCAN)
PTE7/RxD2/RXCAN
PTE6/TxD2/TXCAN
PTE5/SDA1/MISO1
PTE4/SCL1/MOSI1
PTE3/SPSCK1
PTE2/SS1
MOSI1
SPSCK1
SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
SS1
RxD1
TxD1
PTE1/RxD1
SERIAL COMMUNICATIONS
INTERFACE (SCI1)
PTE0/TxD1
●
●
PTL7
PTL6
PTL5
PTL4
PTL3
PTL2
PTL1
PTL0
PTF7
ACMP2O
ACMP2-
ACMP2+
SDA1
PTF6/ACMP2O
PTF5/ACMP2-
PTF4/ACMP2+
PTF3/TPM2CLK/SDA1
PTF2/TPM1CLK/SCL1
PTF1/RxD2
ANALOG COMPARATOR
(ACMP2)
SCL1
IIC MODULE (IIC1)
RxD2
SERIAL COMMUNICATIONS
INTERFACE (SCI2)
TxD2
PTF0/TxD2
SDA2
SCL2
PTH7
PTH6
PTG7/SDA2
PTG6/SCL2
PTG5
IIC MODULE (IIC2)
●
●
●
●
PTH5
MULTI-PURPOSE
CLOCK
GENERATOR
(MCG)
PTH4
MISO2
PTG4
PTG3
PTH3/MISO2
PTH2/MOSI2
PTH1/SPSCK2
PTH0/SS2
MOSI2
SPSCK2
SERIAL PERIPHERAL
PTG2
XTAL
EXTAL
INTERFACE MODULE (SPI2)
OSCILLATOR
(XOSC)
SS2
PTG1/XTAL
PTG0/EXTAL
- Pin not connected in 64-pin and 48-pin packages ● - Pin not available in the 48-pin package
- In 48-pin package, VDDA and VREFH are internally connected to each other and VSSA and VREFL are internally connected to each other.
Figure 14-1. MC9S08DZ128 Block Diagram with SCI Highlighted
MC9S08DZ128 Series Data Sheet, Rev. 1
324
Freescale Semiconductor
Chapter 14 Serial Communications Interface (S08SCIV4)
14.1.2 Features
Features of SCI module include:
•
•
•
•
Full-duplex, standard non-return-to-zero (NRZ) format
Double-buffered transmitter and receiver with separate enables
Programmable baud rates (13-bit modulo divider)
Interrupt-driven or polled operation:
— Transmit data register empty and transmission complete
— Receive data register full
— Receive overrun, parity error, framing error, and noise error
— Idle receiver detect
— Active edge on receive pin
— Break detect supporting LIN
•
•
•
•
•
Hardware parity generation and checking
Programmable 8-bit or 9-bit character length
Receiver wakeup by idle-line or address-mark
Optional 13-bit break character generation / 11-bit break character detection
Selectable transmitter output polarity
14.1.3 Modes of Operation
See Section 14.3, “Functional Description,” For details concerning SCI operation in these modes:
•
•
•
•
8- and 9-bit data modes
Stop mode operation
Loop mode
Single-wire mode
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
325
Chapter 14 Serial Communications Interface (S08SCIV4)
14.1.4 Block Diagram
Figure 14-2 shows the transmitter portion of the SCI.
INTERNAL BUS
(WRITE-ONLY)
LOOPS
RSRC
SCID – Tx BUFFER
LOOP
CONTROL
TO RECEIVE
DATA IN
11-BIT TRANSMIT SHIFT REGISTER
M
TO TxD PIN
H
8
7
6
5
4
3
2
1
0
L
1 × BAUD
RATE CLOCK
SHIFT DIRECTION
TXINV
T8
PE
PT
PARITY
GENERATION
SCI CONTROLS TxD
TxD DIRECTION
TE
SBK
TO TxD
TRANSMIT CONTROL
PIN LOGIC
TXDIR
BRK13
TDRE
TIE
Tx INTERRUPT
REQUEST
TC
TCIE
Figure 14-2. SCI Transmitter Block Diagram
MC9S08DZ128 Series Data Sheet, Rev. 1
326
Freescale Semiconductor
Chapter 14 Serial Communications Interface (S08SCIV4)
Figure 14-3 shows the receiver portion of the SCI.
INTERNAL BUS
(READ-ONLY)
SCID – Rx BUFFER
16 × BAUD
RATE CLOCK
DIVIDE
BY 16
FROM
TRANSMITTER
11-BIT RECEIVE SHIFT REGISTER
LOOPS
RSRC
SINGLE-WIRE
LOOP CONTROL
M
LBKDE
H
8
7
6
5
4
3
2
1
0
L
FROM RxD PIN
RXINV
DATA RECOVERY
SHIFT DIRECTION
WAKE
ILT
WAKEUP
LOGIC
RWU
RWUID
ACTIVE EDGE
DETECT
RDRF
RIE
IDLE
ILIE
Rx INTERRUPT
REQUEST
LBKDIF
LBKDIE
RXEDGIF
RXEDGIE
OR
ORIE
FE
FEIE
ERROR INTERRUPT
REQUEST
NF
NEIE
PE
PT
PARITY
CHECKING
PF
PEIE
Figure 14-3. SCI Receiver Block Diagram
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
327
Chapter 14 Serial Communications Interface (S08SCIV4)
14.2 Register Definition
The SCI has eight 8-bit registers to control baud rate, select SCI options, report SCI status, and for
transmit/receive data.
Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address
assignments for all SCI registers. This section refers to registers and control bits only by their names. A
Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
14.2.1 SCI Baud Rate Registers (SCIxBDH, SCIxBDL)
This pair of registers controls the prescale divisor for SCI baud rate generation. To update the 13-bit baud
rate setting [SBR12:SBR0], first write to SCIxBDH to buffer the high half of the new value and then write
to SCIxBDL. The working value in SCIxBDH does not change until SCIxBDL is written.
SCIxBDL is reset to a non-zero value, so after reset the baud rate generator remains disabled until the first
time the receiver or transmitter is enabled (RE or TE bits in SCIxC2 are written to 1).
7
6
5
4
3
2
1
0
R
W
0
LBKDIE
RXEDGIE
SBR12
SBR11
SBR10
SBR9
SBR8
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 14-4. SCI Baud Rate Register (SCIxBDH)
Table 14-2. SCIxBDH Field Descriptions
Description
Field
7
LIN Break Detect Interrupt Enable (for LBKDIF)
LBKDIE
0 Hardware interrupts from LBKDIF disabled (use polling).
1 Hardware interrupt requested when LBKDIF flag is 1.
6
RxD Input Active Edge Interrupt Enable (for RXEDGIF)
RXEDGIE 0 Hardware interrupts from RXEDGIF disabled (use polling).
1 Hardware interrupt requested when RXEDGIF flag is 1.
4:0
Baud Rate Modulo Divisor — The 13 bits in SBR[12:0] are referred to collectively as BR, and they set the
SBR[12:8] modulo divide rate for the SCI baud rate generator. When BR = 0, the SCI baud rate generator is disabled to
reduce supply current. When BR = 1 to 8191, the SCI baud rate = BUSCLK/(16×BR). See also BR bits in
Table 14-3.
MC9S08DZ128 Series Data Sheet, Rev. 1
328
Freescale Semiconductor
Chapter 14 Serial Communications Interface (S08SCIV4)
7
6
5
4
3
2
1
0
R
W
SBR7
SBR6
SBR5
SBR4
SBR3
SBR2
SBR1
SBR0
Reset
0
0
0
0
0
1
0
0
Figure 14-5. SCI Baud Rate Register (SCIxBDL)
Table 14-3. SCIxBDL Field Descriptions
Description
Field
7:0
SBR[7:0]
Baud Rate Modulo Divisor — These 13 bits in SBR[12:0] are referred to collectively as BR, and they set the
modulo divide rate for the SCI baud rate generator. When BR = 0, the SCI baud rate generator is disabled to
reduce supply current. When BR = 1 to 8191, the SCI baud rate = BUSCLK/(16×BR). See also BR bits in
Table 14-2.
14.2.2 SCI Control Register 1 (SCIxC1)
This read/write register is used to control various optional features of the SCI system.
7
6
5
4
3
2
1
0
R
W
LOOPS
SCISWAI
RSRC
M
WAKE
ILT
PE
PT
Reset
0
0
0
0
0
0
0
0
Figure 14-6. SCI Control Register 1 (SCIxC1)
Table 14-4. SCIxC1 Field Descriptions
Description
Field
7
Loop Mode Select — Selects between loop back modes and normal 2-pin full-duplex modes. When
LOOPS = 1, the transmitter output is internally connected to the receiver input.
0 Normal operation — RxD and TxD use separate pins.
LOOPS
1 Loop mode or single-wire mode where transmitter outputs are internally connected to receiver input. (See
RSRC bit.) RxD pin is not used by SCI.
6
SCI Stops in Wait Mode
SCISWAI 0 SCI clocks continue to run in wait mode so the SCI can be the source of an interrupt that wakes up the CPU.
1 SCI clocks freeze while CPU is in wait mode.
5
Receiver Source Select — This bit has no meaning or effect unless the LOOPS bit is set to 1. When
LOOPS = 1, the receiver input is internally connected to the TxD pin and RSRC determines whether this
connection is also connected to the transmitter output.
RSRC
0 Provided LOOPS = 1, RSRC = 0 selects internal loop back mode and the SCI does not use the RxD pins.
1 Single-wire SCI mode where the TxD pin is connected to the transmitter output and receiver input.
4
9-Bit or 8-Bit Mode Select
M
0 Normal — start + 8 data bits (LSB first) + stop.
1 Receiver and transmitter use 9-bit data characters
start + 8 data bits (LSB first) + 9th data bit + stop.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
329
Chapter 14 Serial Communications Interface (S08SCIV4)
Table 14-4. SCIxC1 Field Descriptions (continued)
Field
Description
3
Receiver Wakeup Method Select — Refer to Section 14.3.3.2, “Receiver Wakeup Operation” for more
WAKE
information.
0 Idle-line wakeup.
1 Address-mark wakeup.
2
ILT
Idle Line Type Select — Setting this bit to 1 ensures that the stop bit and logic 1 bits at the end of a character
do not count toward the 10 or 11 bit times of logic high level needed by the idle line detection logic. Refer to
Section 14.3.3.2.1, “Idle-Line Wakeup” for more information.
0 Idle character bit count starts after start bit.
1 Idle character bit count starts after stop bit.
1
PE
Parity Enable — Enables hardware parity generation and checking. When parity is enabled, the most significant
bit (MSB) of the data character (eighth or ninth data bit) is treated as the parity bit.
0 No hardware parity generation or checking.
1 Parity enabled.
0
Parity Type — Provided parity is enabled (PE = 1), this bit selects even or odd parity. Odd parity means the total
PT
number of 1s in the data character, including the parity bit, is odd. Even parity means the total number of 1s in
the data character, including the parity bit, is even.
0 Even parity.
1 Odd parity.
14.2.3 SCI Control Register 2 (SCIxC2)
This register can be read or written at any time.
7
6
5
4
3
2
1
0
R
W
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SBK
Reset
0
0
0
0
0
0
0
0
Figure 14-7. SCI Control Register 2 (SCIxC2)
Table 14-5. SCIxC2 Field Descriptions
Description
Field
7
Transmit Interrupt Enable (for TDRE)
TIE
0 Hardware interrupts from TDRE disabled (use polling).
1 Hardware interrupt requested when TDRE flag is 1.
6
Transmission Complete Interrupt Enable (for TC)
0 Hardware interrupts from TC disabled (use polling).
1 Hardware interrupt requested when TC flag is 1.
TCIE
5
Receiver Interrupt Enable (for RDRF)
RIE
0 Hardware interrupts from RDRF disabled (use polling).
1 Hardware interrupt requested when RDRF flag is 1.
4
Idle Line Interrupt Enable (for IDLE)
ILIE
0 Hardware interrupts from IDLE disabled (use polling).
1 Hardware interrupt requested when IDLE flag is 1.
MC9S08DZ128 Series Data Sheet, Rev. 1
330
Freescale Semiconductor
Chapter 14 Serial Communications Interface (S08SCIV4)
Table 14-5. SCIxC2 Field Descriptions (continued)
Field
Description
3
TE
Transmitter Enable
0 Transmitter off.
1 Transmitter on.
TE must be 1 in order to use the SCI transmitter. When TE = 1, the SCI forces the TxD pin to act as an output
for the SCI system.
When the SCI is configured for single-wire operation (LOOPS = RSRC = 1), TXDIR controls the direction of
traffic on the single SCI communication line (TxD pin).
TE also can be used to queue an idle character by writing TE = 0 then TE = 1 while a transmission is in progress.
Refer to Section 14.3.2.1, “Send Break and Queued Idle” for more details.
When TE is written to 0, the transmitter keeps control of the port TxD pin until any data, queued idle, or queued
break character finishes transmitting before allowing the pin to revert to a general-purpose I/O pin.
2
Receiver Enable — When the SCI receiver is off, the RxD pin reverts to being a general-purpose port I/O pin.
RE
If LOOPS = 1 the RxD pin reverts to being a general-purpose I/O pin even if RE = 1.
0 Receiver off.
1 Receiver on.
1
Receiver Wakeup Control — This bit can be written to 1 to place the SCI receiver in a standby state where it
waits for automatic hardware detection of a selected wakeup condition. The wakeup condition is either an idle
line between messages (WAKE = 0, idle-line wakeup), or a logic 1 in the most significant data bit in a character
(WAKE = 1, address-mark wakeup). Application software sets RWU and (normally) a selected hardware
condition automatically clears RWU. Refer to Section 14.3.3.2, “Receiver Wakeup Operation” for more details.
0 Normal SCI receiver operation.
RWU
1 SCI receiver in standby waiting for wakeup condition.
0
SBK
Send Break — Writing a 1 and then a 0 to SBK queues a break character in the transmit data stream. Additional
break characters of 10 or 11 (13 or 14 if BRK13 = 1) bit times of logic 0 are queued as long as SBK = 1.
Depending on the timing of the set and clear of SBK relative to the information currently being transmitted, a
second break character may be queued before software clears SBK. Refer to Section 14.3.2.1, “Send Break and
Queued Idle” for more details.
0 Normal transmitter operation.
1 Queue break character(s) to be sent.
14.2.4 SCI Status Register 1 (SCIxS1)
This register has eight read-only status flags. Writes have no effect. Special software sequences (which do
not involve writing to this register) are used to clear these status flags.
7
6
5
4
3
2
1
0
R
W
TDRE
TC
RDRF
IDLE
OR
NF
FE
PF
Reset
1
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 14-8. SCI Status Register 1 (SCIxS1)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
331
Chapter 14 Serial Communications Interface (S08SCIV4)
Table 14-6. SCIxS1 Field Descriptions
Field
Description
7
Transmit Data Register Empty Flag — TDRE is set out of reset and when a transmit data value transfers from
the transmit data buffer to the transmit shifter, leaving room for a new character in the buffer. To clear TDRE, read
SCIxS1 with TDRE = 1 and then write to the SCI data register (SCIxD).
0 Transmit data register (buffer) full.
TDRE
1 Transmit data register (buffer) empty.
6
TC
Transmission Complete Flag — TC is set out of reset and when TDRE = 1 and no data, preamble, or break
character is being transmitted.
0 Transmitter active (sending data, a preamble, or a break).
1 Transmitter idle (transmission activity complete).
TC is cleared automatically by reading SCIxS1 with TC = 1 and then doing one of the following three things:
• Write to the SCI data register (SCIxD) to transmit new data
• Queue a preamble by changing TE from 0 to 1
• Queue a break character by writing 1 to SBK in SCIxC2
5
Receive Data Register Full Flag — RDRF becomes set when a character transfers from the receive shifter into
RDRF
the receive data register (SCIxD). To clear RDRF, read SCIxS1 with RDRF = 1 and then read the SCI data
register (SCIxD).
0 Receive data register empty.
1 Receive data register full.
4
IDLE
Idle Line Flag — IDLE is set when the SCI receive line becomes idle for a full character time after a period of
activity. When ILT = 0, the receiver starts counting idle bit times after the start bit. So if the receive character is
all 1s, these bit times and the stop bit time count toward the full character time of logic high (10 or 11 bit times
depending on the M control bit) needed for the receiver to detect an idle line. When ILT = 1, the receiver doesn’t
start counting idle bit times until after the stop bit. So the stop bit and any logic high bit times at the end of the
previous character do not count toward the full character time of logic high needed for the receiver to detect an
idle line.
To clear IDLE, read SCIxS1 with IDLE = 1 and then read the SCI data register (SCIxD). After IDLE has been
cleared, it cannot become set again until after a new character has been received and RDRF has been set. IDLE
will get set only once even if the receive line remains idle for an extended period.
0 No idle line detected.
1 Idle line was detected.
3
OR
Receiver Overrun Flag — OR is set when a new serial character is ready to be transferred to the receive data
register (buffer), but the previously received character has not been read from SCIxD yet. In this case, the new
character (and all associated error information) is lost because there is no room to move it into SCIxD. To clear
OR, read SCIxS1 with OR = 1 and then read the SCI data register (SCIxD).
0 No overrun.
1 Receive overrun (new SCI data lost).
2
NF
Noise Flag — The advanced sampling technique used in the receiver takes seven samples during the start bit
and three samples in each data bit and the stop bit. If any of these samples disagrees with the rest of the samples
within any bit time in the frame, the flag NF will be set at the same time as the flag RDRF gets set for the
character. To clear NF, read SCIxS1 and then read the SCI data register (SCIxD).
0 No noise detected.
1 Noise detected in the received character in SCIxD.
MC9S08DZ128 Series Data Sheet, Rev. 1
332
Freescale Semiconductor
Chapter 14 Serial Communications Interface (S08SCIV4)
Table 14-6. SCIxS1 Field Descriptions (continued)
Field
Description
1
FE
Framing Error Flag — FE is set at the same time as RDRF when the receiver detects a logic 0 where the stop
bit was expected. This suggests the receiver was not properly aligned to a character frame. To clear FE, read
SCIxS1 with FE = 1 and then read the SCI data register (SCIxD).
0 No framing error detected. This does not guarantee the framing is correct.
1 Framing error.
0
Parity Error Flag — PF is set at the same time as RDRF when parity is enabled (PE = 1) and the parity bit in
PF
the received character does not agree with the expected parity value. To clear PF, read SCIxS1 and then read
the SCI data register (SCIxD).
0 No parity error.
1 Parity error.
14.2.5 SCI Status Register 2 (SCIxS2)
This register has one read-only status flag.
7
6
5
4
3
2
1
0
R
W
0
RAF
LBKDIF
RXEDGIF
RXINV
RWUID
BRK13
LBKDE
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 14-9. SCI Status Register 2 (SCIxS2)
Table 14-7. SCIxS2 Field Descriptions
Description
Field
7
LIN Break Detect Interrupt Flag — LBKDIF is set when the LIN break detect circuitry is enabled and a LIN break
character is detected. LBKDIF is cleared by writing a “1” to it.
0 No LIN break character has been detected.
LBKDIF
1 LIN break character has been detected.
6
RxD Pin Active Edge Interrupt Flag — RXEDGIF is set when an active edge (falling if RXINV = 0, rising if
RXEDGIF RXINV=1) on the RxD pin occurs. RXEDGIF is cleared by writing a “1” to it.
0 No active edge on the receive pin has occurred.
1 An active edge on the receive pin has occurred.
4
Receive Data Inversion — Setting this bit reverses the polarity of the received data input.
0 Receive data not inverted
RXINV1
1 Receive data inverted
3
Receive Wake Up Idle Detect— RWUID controls whether the idle character that wakes up the receiver sets the
IDLE bit.
RWUID
0 During receive standby state (RWU = 1), the IDLE bit does not get set upon detection of an idle character.
1 During receive standby state (RWU = 1), the IDLE bit gets set upon detection of an idle character.
2
Break Character Generation Length — BRK13 is used to select a longer transmitted break character length.
Detection of a framing error is not affected by the state of this bit.
BRK13
0 Break character is transmitted with length of 10 bit times (11 if M = 1)
1 Break character is transmitted with length of 13 bit times (14 if M = 1)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
333
Chapter 14 Serial Communications Interface (S08SCIV4)
Table 14-7. SCIxS2 Field Descriptions (continued)
Field
Description
1
LIN Break Detection Enable— LBKDE is used to select a longer break character detection length. While
LBKDE is set, framing error (FE) and receive data register full (RDRF) flags are prevented from setting.
0 Break character is detected at length of 10 bit times (11 if M = 1).
LBKDE
1 Break character is detected at length of 11 bit times (12 if M = 1).
0
RAF
Receiver Active Flag — RAF is set when the SCI receiver detects the beginning of a valid start bit, and RAF is
cleared automatically when the receiver detects an idle line. This status flag can be used to check whether an
SCI character is being received before instructing the MCU to go to stop mode.
0 SCI receiver idle waiting for a start bit.
1 SCI receiver active (RxD input not idle).
1
Setting RXINV inverts the RxD input for all cases: data bits, start and stop bits, break, and idle.
When using an internal oscillator in a LIN system, it is necessary to raise the break detection threshold by
one bit time. Under the worst case timing conditions allowed in LIN, it is possible that a 0x00 data
character can appear to be 10.26 bit times long at a slave which is running 14% faster than the master. This
would trigger normal break detection circuitry which is designed to detect a 10 bit break symbol. When
the LBKDE bit is set, framing errors are inhibited and the break detection threshold changes from 10 bits
to 11 bits, preventing false detection of a 0x00 data character as a LIN break symbol.
14.2.6 SCI Control Register 3 (SCIxC3)
7
6
5
4
3
2
1
0
R
W
R8
T8
TXDIR
TXINV
ORIE
NEIE
FEIE
PEIE
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 14-10. SCI Control Register 3 (SCIxC3)
Table 14-8. SCIxC3 Field Descriptions
Description
Field
7
R8
Ninth Data Bit for Receiver — When the SCI is configured for 9-bit data (M = 1), R8 can be thought of as a
ninth receive data bit to the left of the MSB of the buffered data in the SCIxD register. When reading 9-bit data,
read R8 before reading SCIxD because reading SCIxD completes automatic flag clearing sequences which
could allow R8 and SCIxD to be overwritten with new data.
6
T8
Ninth Data Bit for Transmitter — When the SCI is configured for 9-bit data (M = 1), T8 may be thought of as a
ninth transmit data bit to the left of the MSB of the data in the SCIxD register. When writing 9-bit data, the entire
9-bit value is transferred to the SCI shift register after SCIxD is written so T8 should be written (if it needs to
change from its previous value) before SCIxD is written. If T8 does not need to change in the new value (such
as when it is used to generate mark or space parity), it need not be written each time SCIxD is written.
5
TxD Pin Direction in Single-Wire Mode — When the SCI is configured for single-wire half-duplex operation
(LOOPS = RSRC = 1), this bit determines the direction of data at the TxD pin.
0 TxD pin is an input in single-wire mode.
TXDIR
1 TxD pin is an output in single-wire mode.
MC9S08DZ128 Series Data Sheet, Rev. 1
334
Freescale Semiconductor
Chapter 14 Serial Communications Interface (S08SCIV4)
Table 14-8. SCIxC3 Field Descriptions (continued)
Field
Description
4
Transmit Data Inversion — Setting this bit reverses the polarity of the transmitted data output.
0 Transmit data not inverted
TXINV1
1 Transmit data inverted
3
Overrun Interrupt Enable — This bit enables the overrun flag (OR) to generate hardware interrupt requests.
0 OR interrupts disabled (use polling).
ORIE
1 Hardware interrupt requested when OR = 1.
2
Noise Error Interrupt Enable — This bit enables the noise flag (NF) to generate hardware interrupt requests.
0 NF interrupts disabled (use polling).
NEIE
1 Hardware interrupt requested when NF = 1.
1
Framing Error Interrupt Enable — This bit enables the framing error flag (FE) to generate hardware interrupt
FEIE
requests.
0 FE interrupts disabled (use polling).
1 Hardware interrupt requested when FE = 1.
0
Parity Error Interrupt Enable — This bit enables the parity error flag (PF) to generate hardware interrupt
PEIE
requests.
0 PF interrupts disabled (use polling).
1 Hardware interrupt requested when PF = 1.
1
Setting TXINV inverts the TxD output for all cases: data bits, start and stop bits, break, and idle.
14.2.7 SCI Data Register (SCIxD)
This register is actually two separate registers. Reads return the contents of the read-only receive data
buffer and writes go to the write-only transmit data buffer. Reads and writes of this register are also
involved in the automatic flag clearing mechanisms for the SCI status flags.
7
6
5
4
3
2
1
0
R
W
R7
R6
R5
R4
R3
R2
R1
R0
T7
0
T6
0
T5
0
T4
0
T3
0
T2
0
T1
0
T0
0
Reset
Figure 14-11. SCI Data Register (SCIxD)
14.3 Functional Description
The SCI allows full-duplex, asynchronous, NRZ serial communication among the MCU and remote
devices, including other MCUs. The SCI comprises a baud rate generator, transmitter, and receiver block.
The transmitter and receiver operate independently, although they use the same baud rate generator. During
normal operation, the MCU monitors the status of the SCI, writes the data to be transmitted, and processes
received data. The following describes each of the blocks of the SCI.
14.3.1 Baud Rate Generation
As shown in Figure 14-12, the clock source for the SCI baud rate generator is the bus-rate clock.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
335
Chapter 14 Serial Communications Interface (S08SCIV4)
MODULO DIVIDE BY
(1 THROUGH 8191)
DIVIDE BY
16
Tx BAUD RATE
BUSCLK
SBR12:SBR0
Rx SAMPLING CLOCK
BAUD RATE GENERATOR
OFF IF [SBR12:SBR0] = 0
(16 × BAUD RATE)
BUSCLK
BAUD RATE =
[SBR12:SBR0] × 16
Figure 14-12. SCI Baud Rate Generation
SCI communications require the transmitter and receiver (which typically derive baud rates from
independent clock sources) to use the same baud rate. Allowed tolerance on this baud frequency depends
on the details of how the receiver synchronizes to the leading edge of the start bit and how bit sampling is
performed.
The MCU resynchronizes to bit boundaries on every high-to-low transition, but in the worst case, there are
no such transitions in the full 10- or 11-bit time character frame so any mismatch in baud rate is
accumulated for the whole character time. For a Freescale Semiconductor SCI system whose bus
frequency is driven by a crystal, the allowed baud rate mismatch is about 4.5percent for 8-bit data format
and about 4 percent for 9-bit data format. Although baud rate modulo divider settings do not always
produce baud rates that exactly match standard rates, it is normally possible to get within a few percent,
which is acceptable for reliable communications.
14.3.2 Transmitter Functional Description
This section describes the overall block diagram for the SCI transmitter, as well as specialized functions
for sending break and idle characters. The transmitter block diagram is shown in Figure 14-2.
The transmitter output (TxD) idle state defaults to logic high (TXINV = 0 following reset). The transmitter
output is inverted by setting TXINV = 1. The transmitter is enabled by setting the TE bit in SCIxC2. This
queues a preamble character that is one full character frame of the idle state. The transmitter then remains
idle until data is available in the transmit data buffer. Programs store data into the transmit data buffer by
writing to the SCI data register (SCIxD).
The central element of the SCI transmitter is the transmit shift register that is either 10 or 11 bits long
depending on the setting in the M control bit. For the remainder of this section, we will assume M = 0,
selecting the normal 8-bit data mode. In 8-bit data mode, the shift register holds a start bit, eight data bits,
and a stop bit. When the transmit shift register is available for a new SCI character, the value waiting in
the transmit data register is transferred to the shift register (synchronized with the baud rate clock) and the
transmit data register empty (TDRE) status flag is set to indicate another character may be written to the
transmit data buffer at SCIxD.
If no new character is waiting in the transmit data buffer after a stop bit is shifted out the TxD pin, the
transmitter sets the transmit complete flag and enters an idle mode, with TxD high, waiting for more
characters to transmit.
MC9S08DZ128 Series Data Sheet, Rev. 1
336
Freescale Semiconductor
Chapter 14 Serial Communications Interface (S08SCIV4)
Writing 0 to TE does not immediately release the pin to be a general-purpose I/O pin. Any transmit activity
that is in progress must first be completed. This includes data characters in progress, queued idle
characters, and queued break characters.
14.3.2.1 Send Break and Queued Idle
The SBK control bit in SCIxC2 is used to send break characters which were originally used to gain the
attention of old teletype receivers. Break characters are a full character time of logic 0 (10 bit times
including the start and stop bits). A longer break of 13 bit times can be enabled by setting BRK13 = 1.
Normally, a program would wait for TDRE to become set to indicate the last character of a message has
moved to the transmit shifter, then write 1 and then write 0 to the SBK bit. This action queues a break
character to be sent as soon as the shifter is available. If SBK is still 1 when the queued break moves into
the shifter (synchronized to the baud rate clock), an additional break character is queued. If the receiving
device is another Freescale Semiconductor SCI, the break characters will be received as 0s in all eight data
bits and a framing error (FE = 1) occurs.
When idle-line wakeup is used, a full character time of idle (logic 1) is needed between messages to wake
up any sleeping receivers. Normally, a program would wait for TDRE to become set to indicate the last
character of a message has moved to the transmit shifter, then write 0 and then write 1 to the TE bit. This
action queues an idle character to be sent as soon as the shifter is available. As long as the character in the
shifter does not finish while TE = 0, the SCI transmitter never actually releases control of the TxD pin. If
there is a possibility of the shifter finishing while TE = 0, set the general-purpose I/O controls so the pin
that is shared with TxD is an output driving a logic 1. This ensures that the TxD line will look like a normal
idle line even if the SCI loses control of the port pin between writing 0 and then 1 to TE.
The length of the break character is affected by the BRK13 and M bits as shown below.
Table 14-9. Break Character Length
BRK13
M
Break Character Length
0
0
1
1
0
1
0
1
10 bit times
11 bit times
13 bit times
14 bit times
14.3.3 Receiver Functional Description
In this section, the receiver block diagram (Figure 14-3) is used as a guide for the overall receiver
functional description. Next, the data sampling technique used to reconstruct receiver data is described in
more detail. Finally, two variations of the receiver wakeup function are explained.
The receiver input is inverted by setting RXINV = 1. The receiver is enabled by setting the RE bit in
SCIxC2. Character frames consist of a start bit of logic 0, eight (or nine) data bits (LSB first), and a stop
bit of logic 1. For information about 9-bit data mode, refer to Section 14.3.5.1, “8- and 9-Bit Data Modes.”
For the remainder of this discussion, we assume the SCI is configured for normal 8-bit data mode.
After receiving the stop bit into the receive shifter, and provided the receive data register is not already full,
the data character is transferred to the receive data register and the receive data register full (RDRF) status
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
337
Chapter 14 Serial Communications Interface (S08SCIV4)
flag is set. If RDRF was already set indicating the receive data register (buffer) was already full, the overrun
(OR) status flag is set and the new data is lost. Because the SCI receiver is double-buffered, the program
has one full character time after RDRF is set before the data in the receive data buffer must be read to avoid
a receiver overrun.
When a program detects that the receive data register is full (RDRF = 1), it gets the data from the receive
data register by reading SCIxD. The RDRF flag is cleared automatically by a 2-step sequence which is
normally satisfied in the course of the user’s program that handles receive data. Refer to Section 14.3.4,
“Interrupts and Status Flags” for more details about flag clearing.
14.3.3.1 Data Sampling Technique
The SCI receiver uses a 16× baud rate clock for sampling. The receiver starts by taking logic level samples
at 16 times the baud rate to search for a falling edge on the RxD serial data input pin. A falling edge is
defined as a logic 0 sample after three consecutive logic 1 samples. The 16× baud rate clock is used to
divide the bit time into 16 segments labeled RT1 through RT16. When a falling edge is located, three more
samples are taken at RT3, RT5, and RT7 to make sure this was a real start bit and not merely noise. If at
least two of these three samples are 0, the receiver assumes it is synchronized to a receive character.
The receiver then samples each bit time, including the start and stop bits, at RT8, RT9, and RT10 to
determine the logic level for that bit. The logic level is interpreted to be that of the majority of the samples
taken during the bit time. In the case of the start bit, the bit is assumed to be 0 if at least two of the samples
at RT3, RT5, and RT7 are 0 even if one or all of the samples taken at RT8, RT9, and RT10 are 1s. If any
sample in any bit time (including the start and stop bits) in a character frame fails to agree with the logic
level for that bit, the noise flag (NF) will be set when the received character is transferred to the receive
data buffer.
The falling edge detection logic continuously looks for falling edges, and if an edge is detected, the sample
clock is resynchronized to bit times. This improves the reliability of the receiver in the presence of noise
or mismatched baud rates. It does not improve worst case analysis because some characters do not have
any extra falling edges anywhere in the character frame.
In the case of a framing error, provided the received character was not a break character, the sampling logic
that searches for a falling edge is filled with three logic 1 samples so that a new start bit can be detected
almost immediately.
In the case of a framing error, the receiver is inhibited from receiving any new characters until the framing
error flag is cleared. The receive shift register continues to function, but a complete character cannot
transfer to the receive data buffer if FE is still set.
14.3.3.2 Receiver Wakeup Operation
Receiver wakeup is a hardware mechanism that allows an SCI receiver to ignore the characters in a
message that is intended for a different SCI receiver. In such a system, all receivers evaluate the first
character(s) of each message, and as soon as they determine the message is intended for a different
receiver, they write logic 1 to the receiver wake up (RWU) control bit in SCIxC2. When RWU bit is set,
the status flags associated with the receiver (with the exception of the idle bit, IDLE, when RWUID bit is
set) are inhibited from setting, thus eliminating the software overhead for handling the unimportant
MC9S08DZ128 Series Data Sheet, Rev. 1
338
Freescale Semiconductor
Chapter 14 Serial Communications Interface (S08SCIV4)
message characters. At the end of a message, or at the beginning of the next message, all receivers
automatically force RWU to 0 so all receivers wake up in time to look at the first character(s) of the next
message.
14.3.3.2.1
Idle-Line Wakeup
When WAKE = 0, the receiver is configured for idle-line wakeup. In this mode, RWU is cleared
automatically when the receiver detects a full character time of the idle-line level. The M control bit selects
8-bit or 9-bit data mode that determines how many bit times of idle are needed to constitute a full character
time (10 or 11 bit times because of the start and stop bits).
When RWU is one and RWUID is zero, the idle condition that wakes up the receiver does not set the IDLE
flag. The receiver wakes up and waits for the first data character of the next message which will set the
RDRF flag and generate an interrupt if enabled. When RWUID is one, any idle condition sets the IDLE
flag and generates an interrupt if enabled, regardless of whether RWU is zero or one.
The idle-line type (ILT) control bit selects one of two ways to detect an idle line. When ILT = 0, the idle
bit counter starts after the start bit so the stop bit and any logic 1s at the end of a character count toward
the full character time of idle. When ILT = 1, the idle bit counter does not start until after a stop bit time,
so the idle detection is not affected by the data in the last character of the previous message.
14.3.3.2.2
Address-Mark Wakeup
When WAKE = 1, the receiver is configured for address-mark wakeup. In this mode, RWU is cleared
automatically when the receiver detects a logic 1 in the most significant bit of a received character (eighth
bit in M = 0 mode and ninth bit in M = 1 mode).
Address-mark wakeup allows messages to contain idle characters but requires that the MSB be reserved
for use in address frames. The logic 1 MSB of an address frame clears the RWU bit before the stop bit is
received and sets the RDRF flag. In this case the character with the MSB set is received even though the
receiver was sleeping during most of this character time.
14.3.4 Interrupts and Status Flags
The SCI system has three separate interrupt vectors to reduce the amount of software needed to isolate the
cause of the interrupt. One interrupt vector is associated with the transmitter for TDRE and TC events.
Another interrupt vector is associated with the receiver for RDRF, IDLE, RXEDGIF and LBKDIF events,
and a third vector is used for OR, NF, FE, and PF error conditions. Each of these ten interrupt sources can
be separately masked by local interrupt enable masks. The flags can still be polled by software when the
local masks are cleared to disable generation of hardware interrupt requests.
The SCI transmitter has two status flags that optionally can generate hardware interrupt requests. Transmit
data register empty (TDRE) indicates when there is room in the transmit data buffer to write another
transmit character to SCIxD. If the transmit interrupt enable (TIE) bit is set, a hardware interrupt will be
requested whenever TDRE = 1. Transmit complete (TC) indicates that the transmitter is finished
transmitting all data, preamble, and break characters and is idle with TxD at the inactive level. This flag is
often used in systems with modems to determine when it is safe to turn off the modem. If the transmit
complete interrupt enable (TCIE) bit is set, a hardware interrupt will be requested whenever TC = 1.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
339
Chapter 14 Serial Communications Interface (S08SCIV4)
Instead of hardware interrupts, software polling may be used to monitor the TDRE and TC status flags if
the corresponding TIE or TCIE local interrupt masks are 0s.
When a program detects that the receive data register is full (RDRF = 1), it gets the data from the receive
data register by reading SCIxD. The RDRF flag is cleared by reading SCIxS1 while RDRF = 1 and then
reading SCIxD.
When polling is used, this sequence is naturally satisfied in the normal course of the user program. If
hardware interrupts are used, SCIxS1 must be read in the interrupt service routine (ISR). Normally, this is
done in the ISR anyway to check for receive errors, so the sequence is automatically satisfied.
The IDLE status flag includes logic that prevents it from getting set repeatedly when the RxD line remains
idle for an extended period of time. IDLE is cleared by reading SCIxS1 while IDLE = 1 and then reading
SCIxD. After IDLE has been cleared, it cannot become set again until the receiver has received at least one
new character and has set RDRF.
If the associated error was detected in the received character that caused RDRF to be set, the error flags —
noise flag (NF), framing error (FE), and parity error flag (PF) — get set at the same time as RDRF. These
flags are not set in overrun cases.
If RDRF was already set when a new character is ready to be transferred from the receive shifter to the
receive data buffer, the overrun (OR) flag gets set instead the data along with any associated NF, FE, or PF
condition is lost.
At any time, an active edge on the RxD serial data input pin causes the RXEDGIF flag to set. The
RXEDGIF flag is cleared by writing a “1” to it. This function does depend on the receiver being enabled
(RE = 1).
14.3.5 Additional SCI Functions
The following sections describe additional SCI functions.
14.3.5.1 8- and 9-Bit Data Modes
The SCI system (transmitter and receiver) can be configured to operate in 9-bit data mode by setting the
M control bit in SCIxC1. In 9-bit mode, there is a ninth data bit to the left of the MSB of the SCI data
register. For the transmit data buffer, this bit is stored in T8 in SCIxC3. For the receiver, the ninth bit is
held in R8 in SCIxC3.
For coherent writes to the transmit data buffer, write to the T8 bit before writing to SCIxD.
If the bit value to be transmitted as the ninth bit of a new character is the same as for the previous character,
it is not necessary to write to T8 again. When data is transferred from the transmit data buffer to the
transmit shifter, the value in T8 is copied at the same time data is transferred from SCIxD to the shifter.
9-bit data mode typically is used in conjunction with parity to allow eight bits of data plus the parity in the
ninth bit. Or it is used with address-mark wakeup so the ninth data bit can serve as the wakeup bit. In
custom protocols, the ninth bit can also serve as a software-controlled marker.
MC9S08DZ128 Series Data Sheet, Rev. 1
340
Freescale Semiconductor
Chapter 14 Serial Communications Interface (S08SCIV4)
14.3.5.2 Stop Mode Operation
During all stop modes, clocks to the SCI module are halted.
In stop1 and stop2 modes, all SCI register data is lost and must be re-initialized upon recovery from these
two stop modes. No SCI module registers are affected in stop3 mode.
The receive input active edge detect circuit is still active in stop3 mode, but not in stop2. . An active edge
on the receive input brings the CPU out of stop3 mode if the interrupt is not masked (RXEDGIE = 1).
Note, because the clocks are halted, the SCI module will resume operation upon exit from stop (only in
stop3 mode). Software should ensure stop mode is not entered while there is a character being transmitted
out of or received into the SCI module.
14.3.5.3 Loop Mode
When LOOPS = 1, the RSRC bit in the same register chooses between loop mode (RSRC = 0) or
single-wire mode (RSRC = 1). Loop mode is sometimes used to check software, independent of
connections in the external system, to help isolate system problems. In this mode, the transmitter output is
internally connected to the receiver input and the RxD pin is not used by the SCI, so it reverts to a
general-purpose port I/O pin.
14.3.5.4 Single-Wire Operation
When LOOPS = 1, the RSRC bit in the same register chooses between loop mode (RSRC = 0) or
single-wire mode (RSRC = 1). Single-wire mode is used to implement a half-duplex serial connection.
The receiver is internally connected to the transmitter output and to the TxD pin. The RxD pin is not used
and reverts to a general-purpose port I/O pin.
In single-wire mode, the TXDIR bit in SCIxC3 controls the direction of serial data on the TxD pin. When
TXDIR = 0, the TxD pin is an input to the SCI receiver and the transmitter is temporarily disconnected
from the TxD pin so an external device can send serial data to the receiver. When TXDIR = 1, the TxD pin
is an output driven by the transmitter. In single-wire mode, the internal loop back connection from the
transmitter to the receiver causes the receiver to receive characters that are sent out by the transmitter.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
341
Chapter 14 Serial Communications Interface (S08SCIV4)
MC9S08DZ128 Series Data Sheet, Rev. 1
342
Freescale Semiconductor
Chapter 15
Real-Time Counter (S08RTCV1)
15.1 Introduction
The RTC module consists of one 8-bit counter, one 8-bit comparator, several binary-based and
decimal-based prescaler dividers, three clock sources, and one programmable periodic interrupt. This
module can be used for time-of-day, calendar or any task scheduling functions. It can also serve as a cyclic
wake up from low power modes without the need of external components.
All devices in the MC9S08DZ128 Series feature the RTC.
15.1.1 RTC Clock Signal Names
References to ERCLK and IRCLK in this chapter correspond to signals MCGERCLK and MCGIRCLK,
respectively.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
343
Chapter 15 Real-Time Counter (S08RTCV1)
PTA7/PIA7/ADP7/IRQ
PTA6/PIA6/ADP6
PTA5/PIA5/ADP5
HCS08 CORE
DEBUG MODULE (DBG)
CPU
BKGD/MS
PTA4/PIA4/ADP4
ACMP1O
ACMP1-
ACMP1+
BDC
BKP
PTA3/PIA3/ADP3/ACMP1O
PTA2/PIA2/ADP2/ACMP1-
PTA1/PIA1/ADP1/ACMP1+
PTA0/PIA0/ADP0/MCLK
ANALOG COMPARATOR
(ACMP1)
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
RESET
REAL-TIME COUNTER (RTC)
PTB7/PIB7/ADP15
PTB6/PIB6/ADP14
PTB5/PIB5/ADP13
PTB4/PIB4/ADP12
PTB3/PIB3/ADP11
PTB2/PIB2/ADP10
PTB1/PIB1/ADP9
PTB0/PIB0/ADP8
COP
INT
LVD
IRQ
V
DD
8
VOLTAGE
REGULATOR
V
SS
V
REFH
ADP7-ADP0
24-CHANNEL,12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
V
V
V
REFL
DDA
SSA
●
●
●
●
●
●
●
●
PTC7/ADP23
PTC6/ADP22
PTC5/ADP21
PTC4/ADP20
PTC3/ADP19
PTC2/ADP18
PTC1/ADP17
PTC0/ADP16
ADP15-ADP8
ADP23-ADP16
USER MEMORY
FLASH _EEPROM _RAM
MC9S08DZ128 = 128K_2K_8K
MC9S08DZ96 = 96K_2K_6K
MC9S08DV128 = 128K_0K_6K
MC9S08DV96 = 96K_0K_4K
TPM1CH5 -
6-CHANNEL TIMER/PWM TPM1CH0
TPM1CLK
PTJ7/PIJ7/TPM3CLK
PTJ6/PIJ6
PTJ5/PIJ5
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTD1/PID1/TPM2CH1
PTD0/PID0/TPM2CH0
TPM3CLK
6
MODULE (TPM1)
TPM2CH1,
TPM2CH0
TPM2CLK
TPM3CH0 -
TPM3CH3
PTJ4/PIJ4
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTJ3/PIJ3/TMP3CH3
PTJ2/PIJ2/TPM3CH2
PTJ1/PIJ1/TPM3CH1
PTJ0/PIJ0/TMP3CH0
4-CHANNEL TIMER/PWM
MODULE (TPM3)
4
RxCAN
TXCAN
MISO1
PTK7
PTK6
PTK5
PTK4
PTK3
PTK2
PTK1
PTK0
CONTROLLER AREA
NETWORK (MSCAN)
PTE7/RxD2/RXCAN
PTE6/TxD2/TXCAN
PTE5/SDA1/MISO1
PTE4/SCL1/MOSI1
PTE3/SPSCK1
PTE2/SS1
MOSI1
SPSCK1
SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
SS1
RxD1
TxD1
PTE1/RxD1
SERIAL COMMUNICATIONS
INTERFACE (SCI1)
PTE0/TxD1
●
●
PTL7
PTL6
PTL5
PTL4
PTL3
PTL2
PTL1
PTL0
PTF7
ACMP2O
ACMP2-
ACMP2+
SDA1
PTF6/ACMP2O
PTF5/ACMP2-
PTF4/ACMP2+
PTF3/TPM2CLK/SDA1
PTF2/TPM1CLK/SCL1
PTF1/RxD2
ANALOG COMPARATOR
(ACMP2)
SCL1
IIC MODULE (IIC1)
RxD2
TxD2
SERIAL COMMUNICATIONS
INTERFACE (SCI2)
PTF0/TxD2
SDA2
SCL2
PTH7
PTH6
PTG7/SDA2
PTG6/SCL2
PTG5
IIC MODULE (IIC2)
●
●
●
●
PTH5
MULTI-PURPOSE
CLOCK
GENERATOR
(MCG)
PTH4
MISO2
PTG4
PTG3
PTH3/MISO2
PTH2/MOSI2
PTH1/SPSCK2
PTH0/SS2
MOSI2
SPSCK2
SERIAL PERIPHERAL
PTG2
XTAL
EXTAL
INTERFACE MODULE (SPI2)
OSCILLATOR
(XOSC)
SS2
PTG1/XTAL
PTG0/EXTAL
- Pin not connected in 64-pin and 48-pin packages ● - Pin not available in the 48-pin package
- In 48-pin package, VDDA and VREFH are internally connected to each other and VSSA and VREFL are internally connected to each other.
Figure 15-1. MC9S08DZ128 Block Diagram with RTC Highlighted
MC9S08DZ128 Series Data Sheet, Rev. 1
344
Freescale Semiconductor
Chapter 15 Real-Time Counter (S08RTCV1)
15.1.2 Features
Features of the RTC module include:
•
8-bit up-counter
— 8-bit modulo match limit
— Software controllable periodic interrupt on match
•
Three software selectable clock sources for input to prescaler with selectable binary-based and
decimal-based divider values
— 1-kHz internal low-power oscillator (LPO)
— External clock (ERCLK)
— 32-kHz internal clock (IRCLK)
15.1.3 Modes of Operation
This section defines the operation in stop, wait and background debug modes.
15.1.3.1 Wait Mode
The RTC continues to run in wait mode if enabled before executing the appropriate instruction. Therefore,
the RTC can bring the MCU out of wait mode if the real-time interrupt is enabled. For lowest possible
current consumption, the RTC should be stopped by software if not needed as an interrupt source during
wait mode.
15.1.3.2 Stop Modes
The RTC continues to run in stop2 or stop3 mode if the RTC is enabled before executing the STOP
instruction. Therefore, the RTC can bring the MCU out of stop modes with no external components, if the
real-time interrupt is enabled.
The LPO clock can be used in stop2 and stop3 modes. ERCLK and IRCLK clocks are only available in
stop3 mode.
Power consumption is lower when all clock sources are disabled, but in that case, the real-time interrupt
cannot wake up the MCU from stop modes.
15.1.3.3 Active Background Mode
The RTC suspends all counting during active background mode until the microcontroller returns to normal
user operating mode. Counting resumes from the suspended value as long as the RTCMOD register is not
written and the RTCPS and RTCLKS bits are not altered.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
345
Chapter 15 Real-Time Counter (S08RTCV1)
15.1.4 Block Diagram
The block diagram for the RTC module is shown in Figure 15-2.
LPO
Clock
Source
Select
ERCLK
IRCLK
V
DD
8-Bit Modulo
(RTCMOD)
RTCLKS
RTC
RTIF
Q
D
Background
Mode
Interrupt
Request
RTCPS
E
RTCLKS[0]
8-Bit Comparator
R
RTIE
RTC
Clock
Write 1 to
RTIF
Prescaler
Divide-By
8-Bit Counter
(RTCCNT)
Figure 15-2. Real-Time Counter (RTC) Block Diagram
15.2 External Signal Description
The RTC does not include any off-chip signals.
15.3 Register Definition
The RTC includes a status and control register, an 8-bit counter register, and an 8-bit modulo register.
Refer to the direct-page register summary in the memory section of this document for the absolute address
assignments for all RTC registers.This section refers to registers and control bits only by their names and
relative address offsets.
Table 15-1 is a summary of RTC registers.
Table 15-1. RTC Register Summary
Name
7
6
5
4
3
2
1
0
R
W
R
RTCSC
RTIF
RTCLKS
RTIE
RTCPS
RTCCNT
RTCCNT
RTCMOD
W
R
RTCMOD
W
MC9S08DZ128 Series Data Sheet, Rev. 1
346
Freescale Semiconductor
Chapter 15 Real-Time Counter (S08RTCV1)
15.3.1 RTC Status and Control Register (RTCSC)
RTCSC contains the real-time interrupt status flag (RTIF), the clock select bits (RTCLKS), the real-time
interrupt enable bit (RTIE), and the prescaler select bits (RTCPS).
7
6
5
4
3
2
1
0
R
W
RTIF
RTCLKS
RTIE
RTCPS
Reset:
0
0
0
0
0
0
0
0
Figure 15-3. RTC Status and Control Register (RTCSC)
Table 15-2. RTCSC Field Descriptions
Description
Field
7
RTIF
Real-Time Interrupt Flag This status bit indicates the RTC counter register reached the value in the RTC modulo
register. Writing a logic 0 has no effect. Writing a logic 1 clears the bit and the real-time interrupt request. Reset
clears RTIF.
0 RTC counter has not reached the value in the RTC modulo register.
1 RTC counter has reached the value in the RTC modulo register.
6–5
RTCLKS
Real-Time Clock Source Select. These two read/write bits select the clock source input to the RTC prescaler.
Changing the clock source clears the prescaler and RTCCNT counters. When selecting a clock source, ensure
that the clock source is properly enabled (if applicable) to ensure correct operation of the RTC. Reset clears
RTCLKS.
00 Real-time clock source is the 1-kHz low power oscillator (LPO)
01 Real-time clock source is the external clock (ERCLK)
1x Real-time clock source is the internal clock (IRCLK)
4
Real-Time Interrupt Enable. This read/write bit enables real-time interrupts. If RTIE is set, then an interrupt is
generated when RTIF is set. Reset clears RTIE.
RTIE
0 Real-time interrupt requests are disabled. Use software polling.
1 Real-time interrupt requests are enabled.
3–0
RTCPS
Real-Time Clock Prescaler Select. These four read/write bits select binary-based or decimal-based divide-by
values for the clock source. See Table 15-3. Changing the prescaler value clears the prescaler and RTCCNT
counters. Reset clears RTCPS.
Table 15-3. RTC Prescaler Divide-by values
RTCPS
RTCLKS[0]
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
Off
Off
23
25
26
27
28
29
210
1
2
22
10
24
102 5x102 103
210
211
212
213 214 215 216 103 2x103 5x103 104 2x104 5x104 105 2x105
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
347
Chapter 15 Real-Time Counter (S08RTCV1)
15.3.2 RTC Counter Register (RTCCNT)
RTCCNT is the read-only value of the current RTC count of the 8-bit counter.
7
6
5
4
3
2
1
0
R
W
RTCCNT
Reset:
0
0
0
0
0
0
0
0
Figure 15-4. RTC Counter Register (RTCCNT)
Table 15-4. RTCCNT Field Descriptions
Description
Field
7:0
RTC Count. These eight read-only bits contain the current value of the 8-bit counter. Writes have no effect to this
RTCCNT register. Reset, writing to RTCMOD, or writing different values to RTCLKS and RTCPS clear the count to 0x00.
15.3.3 RTC Modulo Register (RTCMOD)
7
6
5
4
3
2
1
0
R
W
RTCMOD
Reset:
0
0
0
0
0
0
0
0
Figure 15-5. RTC Modulo Register (RTCMOD)
Table 15-5. RTCMOD Field Descriptions
Description
Field
7:0
RTC Modulo. These eight read/write bits contain the modulo value used to reset the count to 0x00 upon a compare
RTCMOD match and set the RTIF status bit. A value of 0x00 sets the RTIF bit on each rising edge of the prescaler output.
Writing to RTCMOD resets the prescaler and the RTCCNT counters to 0x00. Reset sets the modulo to 0x00.
15.4 Functional Description
The RTC is composed of a main 8-bit up-counter with an 8-bit modulo register, a clock source selector,
and a prescaler block with binary-based and decimal-based selectable values. The module also contains
software selectable interrupt logic.
After any MCU reset, the counter is stopped and reset to 0x00, the modulus register is set to 0x00, and the
prescaler is off. The 1-kHz internal oscillator clock is selected as the default clock source. To start the
prescaler, write any value other than zero to the prescaler select bits (RTCPS).
Three clock sources are software selectable: the low power oscillator clock (LPO), the external clock
(ERCLK), and the internal clock (IRCLK). The RTC clock select bits (RTCLKS) select the desired clock
source. If a different value is written to RTCLKS, the prescaler and RTCCNT counters are reset to 0x00.
MC9S08DZ128 Series Data Sheet, Rev. 1
348
Freescale Semiconductor
Chapter 15 Real-Time Counter (S08RTCV1)
RTCPS and the RTCLKS[0] bit select the desired divide-by value. If a different value is written to RTCPS,
the prescaler and RTCCNT counters are reset to 0x00. Table 15-6 shows different prescaler period values.
Table 15-6. Prescaler Period
1-kHz Internal Clock 1-MHz External Clock 32-kHz Internal Clock 32-kHz Internal Clock
RTCPS
(RTCLKS = 00)
(RTCLKS = 01)
(RTCLKS = 10)
(RTCLKS = 11)
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
Off
Off
Off
250 μs
1 ms
Off
8 ms
1.024 ms
2.048 ms
4.096 ms
8.192 ms
16.4 ms
32.8 ms
65.5 ms
1 ms
32 ms
32 ms
64 ms
128 ms
256 ms
512 ms
1.024 s
1 ms
64 ms
2 ms
128 ms
256 ms
512 ms
1.024 s
2.048 s
31.25 ms
62.5 ms
156.25 ms
312.5 ms
0.625 s
1.5625 s
3.125 s
6.25 s
4 ms
8 ms
16 ms
32 ms
31.25 μs
62.5 μs
125 μs
312.5 μs
0.5 ms
3.125 ms
15.625 ms
31.25 ms
2 ms
2 ms
4 ms
5 ms
10 ms
16 ms
0.1 s
10 ms
20 ms
50 ms
0.5 s
0.1 s
1 s
0.2 s
The RTC modulo register (RTCMOD) allows the compare value to be set to any value from 0x00 to 0xFF.
When the counter is active, the counter increments at the selected rate until the count matches the modulo
value. When these values match, the counter resets to 0x00 and continues counting. The real-time interrupt
flag (RTIF) is set when a match occurs. The flag sets on the transition from the modulo value to 0x00.
Writing to RTCMOD resets the prescaler and the RTCCNT counters to 0x00.
The RTC allows for an interrupt to be generated when RTIF is set. To enable the real-time interrupt, set
the real-time interrupt enable bit (RTIE) in RTCSC. RTIF is cleared by writing a 1 to RTIF.
15.4.1 RTC Operation Example
This section shows an example of the RTC operation as the counter reaches a matching value from the
modulo register.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
349
Chapter 15 Real-Time Counter (S08RTCV1)
Internal 1-kHz
Clock Source
RTC Clock
(RTCPS = 0xA)
RTCCNT
0x52
0x53
0x54
0x55
0x00
0x01
RTIF
RTCMOD
0x55
Figure 15-6. RTC Counter Overflow Example
In the example of Figure 15-6, the selected clock source is the 1-kHz internal oscillator clock source. The
prescaler (RTCPS) is set to 0xA or divide-by-4. The modulo value in the RTCMOD register is set to 0x55.
When the counter, RTCCNT, reaches the modulo value of 0x55, the counter overflows to 0x00 and
continues counting. The real-time interrupt flag, RTIF, sets when the counter value changes from 0x55 to
0x00. A real-time interrupt is generated when RTIF is set, if RTIE is set.
15.5 Initialization/Application Information
This section provides example code to give some basic direction to a user on how to initialize and configure
the RTC module. The example software is implemented in C language.
The example below shows how to implement time of day with the RTC using the 1-kHz clock source to
achieve the lowest possible power consumption. Because the 1-kHz clock source is not as accurate as a
crystal, software can be added for any adjustments. For accuracy without adjustments at the expense of
additional power consumption, the external clock (ERCLK) or the internal clock (IRCLK) can be selected
with appropriate prescaler and modulo values.
/* Initialize the elapsed time counters */
Seconds = 0;
Minutes = 0;
Hours = 0;
Days=0;
/* Configure RTC to interrupt every 1 second from 1-kHz clock source */
RTCMOD.byte = 0x00;
RTCSC.byte = 0x1F;
/**********************************************************************
Function Name : RTC_ISR
Notes : Interrupt service routine for RTC module.
**********************************************************************/
MC9S08DZ128 Series Data Sheet, Rev. 1
350
Freescale Semiconductor
Chapter 15 Real-Time Counter (S08RTCV1)
#pragma TRAP_PROC
void RTC_ISR(void)
{
/* Clear the interrupt flag */
RTCSC.byte = RTCSC.byte | 0x80;
/* RTC interrupts every 1 Second */
Seconds++;
/* 60 seconds in a minute */
if (Seconds > 59){
Minutes++;
Seconds = 0;
}
/* 60 minutes in an hour */
if (Minutes > 59){
Hours++;
Minutes = 0;
}
/* 24 hours in a day */
if (Hours > 23){
Days ++;
Hours = 0;
}
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
351
Chapter 15 Real-Time Counter (S08RTCV1)
MC9S08DZ128 Series Data Sheet, Rev. 1
352
Freescale Semiconductor
Chapter 16
Timer Pulse-Width Modulator (S08TPMV3)
16.1 Introduction
The TPM uses one input/output (I/O) pin per channel, TPMxCHn, where x is the TPM number (for
example, 1 or 2) and n is the channel number (for example, 0–4). The TPM shares its I/O pins with
general-purpose I/O port pins (refer to the Pins and Connections chapter for more information).
NOTE
MC9S08DZ128 Series MCUs have three TPM modules. TPM3 channels
are not bonded out in the 64-pin and 48-pin packages.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
353
Chapter 16 Timer Pulse-Width Modulator (S08TPMV3)
PTA7/PIA7/ADP7/IRQ
PTA6/PIA6/ADP6
PTA5/PIA5/ADP5
HCS08 CORE
DEBUG MODULE (DBG)
CPU
BKGD/MS
PTA4/PIA4/ADP4
ACMP1O
ACMP1-
ACMP1+
BDC
BKP
PTA3/PIA3/ADP3/ACMP1O
PTA2/PIA2/ADP2/ACMP1-
PTA1/PIA1/ADP1/ACMP1+
PTA0/PIA0/ADP0/MCLK
ANALOG COMPARATOR
(ACMP1)
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
RESET
REAL-TIME COUNTER (RTC)
PTB7/PIB7/ADP15
PTB6/PIB6/ADP14
PTB5/PIB5/ADP13
PTB4/PIB4/ADP12
PTB3/PIB3/ADP11
PTB2/PIB2/ADP10
PTB1/PIB1/ADP9
PTB0/PIB0/ADP8
COP
INT
LVD
IRQ
V
DD
8
VOLTAGE
REGULATOR
V
SS
V
REFH
ADP7-ADP0
24-CHANNEL,12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
V
V
V
REFL
DDA
SSA
●
●
●
●
●
●
●
●
PTC7/ADP23
PTC6/ADP22
PTC5/ADP21
PTC4/ADP20
PTC3/ADP19
PTC2/ADP18
PTC1/ADP17
PTC0/ADP16
ADP15-ADP8
ADP23-ADP16
USER MEMORY
FLASH _EEPROM _RAM
MC9S08DZ128 = 128K_2K_8K
MC9S08DZ96 = 96K_2K_6K
MC9S08DV128 = 128K_0K_6K
MC9S08DV96 = 96K_0K_4K
TPM1CH5 -
6-CHANNEL TIMER/PWM TPM1CH0
TPM1CLK
PTJ7/PIJ7/TPM3CLK
PTJ6/PIJ6
PTJ5/PIJ5
PTD7/PID7/TPM1CH5
PTD6/PID6/TPM1CH4
PTD5/PID5/TPM1CH3
PTD4/PID4/TPM1CH2
PTD3/PID3/TPM1CH1
PTD2/PID2/TPM1CH0
PTD1/PID1/TPM2CH1
PTD0/PID0/TPM2CH0
TPM3CLK
6
MODULE (TPM1)
TPM2CH1,
TPM2CH0
TPM2CLK
TPM3CH0 -
TPM3CH3
PTJ4/PIJ4
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTJ3/PIJ3/TMP3CH3
PTJ2/PIJ2/TPM3CH2
PTJ1/PIJ1/TPM3CH1
PTJ0/PIJ0/TMP3CH0
4-CHANNEL TIMER/PWM
MODULE (TPM3)
4
RxCAN
TXCAN
MISO1
PTK7
PTK6
PTK5
PTK4
PTK3
PTK2
PTK1
PTK0
CONTROLLER AREA
NETWORK (MSCAN)
PTE7/RxD2/RXCAN
PTE6/TxD2/TXCAN
PTE5/SDA1/MISO1
PTE4/SCL1/MOSI1
PTE3/SPSCK1
PTE2/SS1
MOSI1
SPSCK1
SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
SS1
RxD1
TxD1
PTE1/RxD1
SERIAL COMMUNICATIONS
INTERFACE (SCI1)
PTE0/TxD1
●
●
PTL7
PTL6
PTL5
PTL4
PTL3
PTL2
PTL1
PTL0
PTF7
ACMP2O
ACMP2-
ACMP2+
SDA1
PTF6/ACMP2O
PTF5/ACMP2-
PTF4/ACMP2+
PTF3/TPM2CLK/SDA1
PTF2/TPM1CLK/SCL1
PTF1/RxD2
ANALOG COMPARATOR
(ACMP2)
SCL1
IIC MODULE (IIC1)
RxD2
TxD2
SERIAL COMMUNICATIONS
INTERFACE (SCI2)
PTF0/TxD2
SDA2
SCL2
PTH7
PTH6
PTG7/SDA2
PTG6/SCL2
PTG5
IIC MODULE (IIC2)
●
●
●
●
PTH5
MULTI-PURPOSE
CLOCK
GENERATOR
(MCG)
PTH4
MISO2
PTG4
PTG3
PTH3/MISO2
PTH2/MOSI2
PTH1/SPSCK2
PTH0/SS2
MOSI2
SPSCK2
SERIAL PERIPHERAL
PTG2
XTAL
EXTAL
INTERFACE MODULE (SPI2)
OSCILLATOR
(XOSC)
SS2
PTG1/XTAL
PTG0/EXTAL
- Pin not connected in 64-pin and 48-pin packages ● - Pin not available in the 48-pin package
- In 48-pin package, VDDA and VREFH are internally connected to each other and VSSA and VREFL are internally connected to each other.
Figure 16-1. MC9S08DZ128 Block Diagram with TPM Highlighted
MC9S08DZ128 Series Data Sheet, Rev. 1
354
Freescale Semiconductor
Chapter 16 Timer/PWM Module (S08TPMV3)
16.1.1 Features
The TPM includes these distinctive features:
•
One to eight channels:
— Each channel may be input capture, output compare, or edge-aligned PWM
— Rising-Edge, falling-edge, or any-edge input capture trigger
— Set, clear, or toggle output compare action
— Selectable polarity on PWM outputs
•
•
Module may be configured for buffered, center-aligned pulse-width-modulation (CPWM) on all
channels
Timer clock source selectable as prescaled bus clock, fixed system clock, or an external clock pin
— Prescale taps for divide-by 1, 2, 4, 8, 16, 32, 64, or 128
— Fixed system clock source are synchronized to the bus clock by an on-chip synchronization
circuit
— External clock pin may be shared with any timer channel pin or a separated input pin
16-bit free-running or modulo up/down count operation
Timer system enable
•
•
•
One interrupt per channel plus terminal count interrupt
16.1.2 Modes of Operation
In general, TPM channels may be independently configured to operate in input capture, output compare,
or edge-aligned PWM modes. A control bit allows the whole TPM (all channels) to switch to
center-aligned PWM mode. When center-aligned PWM mode is selected, input capture, output compare,
and edge-aligned PWM functions are not available on any channels of this TPM module.
When the microcontroller is in active BDM background or BDM foreground mode, the TPM temporarily
suspends all counting until the microcontroller returns to normal user operating mode. During stop mode,
all system clocks, including the main oscillator, are stopped; therefore, the TPM is effectively disabled
until clocks resume. During wait mode, the TPM continues to operate normally. Provided the TPM does
not need to produce a real time reference or provide the interrupt source(s) needed to wake the MCU from
wait mode, the user can save power by disabling TPM functions before entering wait mode.
•
Input capture mode
When a selected edge event occurs on the associated MCU pin, the current value of the 16-bit timer
counter is captured into the channel value register and an interrupt flag bit is set. Rising edges,
falling edges, any edge, or no edge (disable channel) may be selected as the active edge which
triggers the input capture.
•
Output compare mode
When the value in the timer counter register matches the channel value register, an interrupt flag
bit is set, and a selected output action is forced on the associated MCU pin. The output compare
action may be selected to force the pin to zero, force the pin to one, toggle the pin, or ignore the
pin (used for software timing functions).
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
355
Chapter 16 Timer/PWM Module (S08TPMV3)
•
Edge-aligned PWM mode
The value of a 16-bit modulo register plus 1 sets the period of the PWM output signal. The channel
value register sets the duty cycle of the PWM output signal. The user may also choose the polarity
of the PWM output signal. Interrupts are available at the end of the period and at the duty-cycle
transition point. This type of PWM signal is called edge-aligned because the leading edges of all
PWM signals are aligned with the beginning of the period, which is the same for all channels within
a TPM.
•
Center-aligned PWM mode
Twice the value of a 16-bit modulo register sets the period of the PWM output, and the
channel-value register sets the half-duty-cycle duration. The timer counter counts up until it
reaches the modulo value and then counts down until it reaches zero. As the count matches the
channel value register while counting down, the PWM output becomes active. When the count
matches the channel value register while counting up, the PWM output becomes inactive. This type
of PWM signal is called center-aligned because the centers of the active duty cycle periods for all
channels are aligned with a count value of zero. This type of PWM is required for types of motors
used in small appliances.
This is a high-level description only. Detailed descriptions of operating modes are in later sections.
16.1.3 Block Diagram
The TPM uses one input/output (I/O) pin per channel, TPMxCHn (timer channel n) where n is the channel
number (1-8). The TPM shares its I/O pins with general purpose I/O port pins (refer to I/O pin descriptions
in full-chip specification for the specific chip implementation).
Figure 16-2 shows the TPM structure. The central component of the TPM is the 16-bit counter that can
operate as a free-running counter or a modulo up/down counter. The TPM counter (when operating in
normal up-counting mode) provides the timing reference for the input capture, output compare, and
edge-aligned PWM functions. The timer counter modulo registers, TPMxMODH:TPMxMODL, control
the modulo value of the counter (the values 0x0000 or 0xFFFF effectively make the counter free running).
Software can read the counter value at any time without affecting the counting sequence. Any write to
either half of the TPMxCNT counter resets the counter, regardless of the data value written.
MC9S08DZ128 Series Data Sheet, Rev. 1
356
Freescale Semiconductor
Chapter 16 Timer/PWM Module (S08TPMV3)
BUS CLOCK
CLOCK SOURCE
SELECT
OFF, BUS, FIXED
SYSTEM CLOCK, EXT
PRESCALE AND SELECT
1, 2, 4, 8, 16, 32, 64,
or 128
FIXED SYSTEM CLOCK
EXTERNAL CLOCK
SYNC
PS2:PS1:PS0
CLKSB:CLKSA
CPWMS
16-BIT COUNTER
INTER-
RUPT
LOGIC
TOF
COUNTER RESET
TOIE
16-BIT COMPARATOR
TPMxMODH:TPMxMODL
ELS0B
ELS0A
PORT
LOGIC
CHANNEL 0
TPMxCH0
16-BIT COMPARATOR
TPMxC0VH:TPMxC0VL
CH0F
INTER-
RUPT
LOGIC
16-BIT LATCH
CHANNEL 1
CH0IE
MS0B
MS0A
ELS1B
ELS1A
PORT
LOGIC
TPMxCH1
16-BIT COMPARATOR
TPMxC1VH:TPMxC1VL
CH1F
INTER-
RUPT
16-BIT LATCH
LOGIC
CH1IE
MS1B
MS1A
Up to 8 channels
ELS7B
MS7B
ELS7A
PORT
LOGIC
CHANNEL 7
TPMxCH7
16-BIT COMPARATOR
TPMxC7VH:TPMxC7VL
CH7F
INTER-
RUPT
LOGIC
16-BIT LATCH
CH7IE
MS7A
Figure 16-2. TPM Block Diagram
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
357
Chapter 16 Timer/PWM Module (S08TPMV3)
The TPM channels are programmable independently as input capture, output compare, or edge-aligned
PWM channels. Alternately, the TPM can be configured to produce CPWM outputs on all channels. When
the TPM is configured for CPWMs, the counter operates as an up/down counter; input capture, output
compare, and EPWM functions are not practical.
If a channel is configured as input capture, an internal pullup device may be enabled for that channel. The
details of how a module interacts with pin controls depends upon the chip implementation because the I/O
pins and associated general purpose I/O controls are not part of the module. Refer to the discussion of the
I/O port logic in a full-chip specification.
Because center-aligned PWMs are usually used to drive 3-phase AC-induction motors and brushless DC
motors, they are typically used in sets of three or six channels.
16.2 Signal Description
Table 16-1 shows the user-accessible signals for the TPM. The number of channels may be varied from
one to eight. When an external clock is included, it can be shared with the same pin as any TPM channel;
however, it could be connected to a separate input pin. Refer to the I/O pin descriptions in full-chip
specification for the specific chip implementation.
Table 16-1. Signal Properties
Name
Function
EXTCLK1
External clock source which may be selected to drive the TPM counter.
I/O pin associated with TPM channel n
TPMxCHn2
1
2
When preset, this signal can share any channel pin; however depending upon full-chip
implementation, this signal could be connected to a separate external pin.
n=channel number (1 to 8)
Refer to documentation for the full-chip for details about reset states, port connections, and whether there
is any pullup device on these pins.
TPM channel pins can be associated with general purpose I/O pins and have passive pullup devices which
can be enabled with a control bit when the TPM or general purpose I/O controls have configured the
associated pin as an input. When no TPM function is enabled to use a corresponding pin, the pin reverts
to being controlled by general purpose I/O controls, including the port-data and data-direction registers.
Immediately after reset, no TPM functions are enabled, so all associated pins revert to general purpose I/O
control.
16.2.1 Detailed Signal Descriptions
This section describes each user-accessible pin signal in detail. Although Table 16-1 grouped all channel
pins together, any TPM pin can be shared with the external clock source signal. Since I/O pin logic is not
part of the TPM, refer to full-chip documentation for a specific derivative for more details about the
interaction of TPM pin functions and general purpose I/O controls including port data, data direction, and
pullup controls.
MC9S08DZ128 Series Data Sheet, Rev. 1
358
Freescale Semiconductor
Chapter 16 Timer/PWM Module (S08TPMV3)
16.2.1.1 EXTCLK — External Clock Source
Control bits in the timer status and control register allow the user to select nothing (timer disable), the
bus-rate clock (the normal default source), a crystal-related clock, or an external clock as the clock which
drives the TPM prescaler and subsequently the 16-bit TPM counter. The external clock source is
synchronized in the TPM. The bus clock clocks the synchronizer; the frequency of the external source must
be no more than one-fourth the frequency of the bus-rate clock, to meet Nyquist criteria and allowing for
jitter.
The external clock signal shares the same pin as a channel I/O pin, so the channel pin will not be usable
for channel I/O function when selected as the external clock source. It is the user’s responsibility to avoid
such settings. If this pin is used as an external clock source (CLKSB:CLKSA = 1:1), the channel can still
be used in output compare mode as a software timer (ELSnB:ELSnA = 0:0).
16.2.1.2 TPMxCHn — TPM Channel n I/O Pin(s)
Each TPM channel is associated with an I/O pin on the MCU. The function of this pin depends on the
channel configuration. The TPM pins share with general purpose I/O pins, where each pin has a port data
register bit, and a data direction control bit, and the port has optional passive pullups which may be enabled
whenever a port pin is acting as an input.
The TPM channel does not control the I/O pin when (ELSnB:ELSnA = 0:0) or when (CLKSB:CLKSA =
0:0) so it normally reverts to general purpose I/O control. When CPWMS = 1 (and ELSnB:ELSnA not =
0:0), all channels within the TPM are configured for center-aligned PWM and the TPMxCHn pins are all
controlled by the TPM system. When CPWMS=0, the MSnB:MSnA control bits determine whether the
channel is configured for input capture, output compare, or edge-aligned PWM.
When a channel is configured for input capture (CPWMS=0, MSnB:MSnA = 0:0 and ELSnB:ELSnA not
= 0:0), the TPMxCHn pin is forced to act as an edge-sensitive input to the TPM. ELSnB:ELSnA control
bits determine what polarity edge or edges will trigger input-capture events. A synchronizer based on the
bus clock is used to synchronize input edges to the bus clock. This implies the minimum pulse width—that
can be reliably detected—on an input capture pin is four bus clock periods (with ideal clock pulses as near
as two bus clocks can be detected). TPM uses this pin as an input capture input to override the port data
and data direction controls for the same pin.
When a channel is configured for output compare (CPWMS=0, MSnB:MSnA = 0:1 and ELSnB:ELSnA
not = 0:0), the associated data direction control is overridden, the TPMxCHn pin is considered an output
controlled by the TPM, and the ELSnB:ELSnA control bits determine how the pin is controlled. The
remaining three combinations of ELSnB:ELSnA determine whether the TPMxCHn pin is toggled, cleared,
or set each time the 16-bit channel value register matches the timer counter.
When the output compare toggle mode is initially selected, the previous value on the pin is driven out until
the next output compare event—then the pin is toggled.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
359
Chapter 16 Timer/PWM Module (S08TPMV3)
When a channel is configured for edge-aligned PWM (CPWMS=0, MSnB=1 and ELSnB:ELSnA not =
0:0), the data direction is overridden, the TPMxCHn pin is forced to be an output controlled by the TPM,
and ELSnA controls the polarity of the PWM output signal on the pin. When ELSnB:ELSnA=1:0, the
TPMxCHn pin is forced high at the start of each new period (TPMxCNT=0x0000), and the pin is forced
low when the channel value register matches the timer counter. When ELSnA=1, the TPMxCHn pin is
forced low at the start of each new period (TPMxCNT=0x0000), and the pin is forced high when the
channel value register matches the timer counter.
TPMxMODH:TPMxMODL = 0x0008
TPMxMODH:TPMxMODL = 0x0005
1
TPMxCNTH:TPMxCNTL
2
6
...
0
3
4
5
7
8
0
1
2
...
TPMxCHn
CHnF BIT
TOF BIT
Figure 16-3. High-True Pulse of an Edge-Aligned PWM
TPMxMODH:TPMxMODL = 0x0008
TPMxMODH:TPMxMODL = 0x0005
TPMxCNTH:TPMxCNTL
1
2
6
...
0
3
4
5
7
8
0
1
2
...
TPMxCHn
CHnF BIT
TOF BIT
Figure 16-4. Low-True Pulse of an Edge-Aligned PWM
MC9S08DZ128 Series Data Sheet, Rev. 1
360
Freescale Semiconductor
Chapter 16 Timer/PWM Module (S08TPMV3)
When the TPM is configured for center-aligned PWM (and ELSnB:ELSnA not = 0:0), the data direction
for all channels in this TPM are overridden, the TPMxCHn pins are forced to be outputs controlled by the
TPM, and the ELSnA bits control the polarity of each TPMxCHn output. If ELSnB:ELSnA=1:0, the
corresponding TPMxCHn pin is cleared when the timer counter is counting up, and the channel value
register matches the timer counter; the TPMxCHn pin is set when the timer counter is counting down, and
the channel value register matches the timer counter. If ELSnA=1, the corresponding TPMxCHn pin is set
when the timer counter is counting up and the channel value register matches the timer counter; the
TPMxCHn pin is cleared when the timer counter is counting down and the channel value register matches
the timer counter.
TPMxMODH:TPMxMODL = 0x0008
TPMxMODH:TPMxMODL = 0x0005
TPMxCNTH:TPMxCNTL
7
8
4
...
7
6
5
3
2
1
0
1
2
3
4
5
6
7
8
7
6
5
...
TPMxCHn
CHnF BIT
TOF BIT
Figure 16-5. High-True Pulse of a Center-Aligned PWM
TPMxMODH:TPMxMODL = 0x0008
TPMxMODH:TPMxMODL = 0x0005
TPMxCNTH:TPMxCNTL
TPMxCHn
7
8
4
...
7
6
5
3
2
1
0
1
2
3
4
5
6
7
8
7
6
5
...
CHnF BIT
TOF BIT
Figure 16-6. Low-True Pulse of a Center-Aligned PWM
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
361
Chapter 16 Timer/PWM Module (S08TPMV3)
16.3 Register Definition
This section consists of register descriptions in address order. A typical MCU system may contain multiple
TPMs, and each TPM may have one to eight channels, so register names include placeholder characters to
identify which TPM and which channel is being referenced. For example, TPMxCnSC refers to timer
(TPM) x, channel n. TPM1C2SC would be the status and control register for channel 2 of timer 1.
16.3.1 TPM Status and Control Register (TPMxSC)
TPMxSC contains the overflow status flag and control bits used to configure the interrupt enable, TPM
configuration, clock source, and prescale factor. These controls relate to all channels within this timer
module.
7
6
5
4
3
2
1
0
R
W
TOF
TOIE
CPWMS
CLKSB
CLKSA
PS2
PS1
PS0
0
0
Reset
0
0
0
0
0
0
0
Figure 16-7. TPM Status and Control Register (TPMxSC)
Table 16-2. TPMxSC Field Descriptions
Description
Field
7
TOF
Timer overflow flag. This read/write flag is set when the TPM counter resets to 0x0000 after reaching the modulo
value programmed in the TPM counter modulo registers. Clear TOF by reading the TPM status and control
register when TOF is set and then writing a logic 0 to TOF. If another TPM overflow occurs before the clearing
sequence is complete, the sequence is reset so TOF would remain set after the clear sequence was completed
for the earlier TOF. This is done so a TOF interrupt request cannot be lost during the clearing sequence for a
previous TOF. Reset clears TOF. Writing a logic 1 to TOF has no effect.
0 TPM counter has not reached modulo value or overflow
1 TPM counter has overflowed
6
Timer overflow interrupt enable. This read/write bit enables TPM overflow interrupts. If TOIE is set, an interrupt is
generated when TOF equals one. Reset clears TOIE.
TOIE
0 TOF interrupts inhibited (use for software polling)
1 TOF interrupts enabled
5
Center-aligned PWM select. When present, this read/write bit selects CPWM operating mode. By default, the
CPWMS TPM operates in up-counting mode for input capture, output compare, and edge-aligned PWM functions. Setting
CPWMS reconfigures the TPM to operate in up/down counting mode for CPWM functions. Reset clears CPWMS.
0 All channels operate as input capture, output compare, or edge-aligned PWM mode as selected by the
MSnB:MSnA control bits in each channel’s status and control register.
1 All channels operate in center-aligned PWM mode.
MC9S08DZ128 Series Data Sheet, Rev. 1
362
Freescale Semiconductor
Chapter 16 Timer/PWM Module (S08TPMV3)
Table 16-2. TPMxSC Field Descriptions (continued)
Field
Description
4–3
Clock source selects. As shown in Table 16-3, this 2-bit field is used to disable the TPM system or select one of
CLKS[B:A] three clock sources to drive the counter prescaler. The fixed system clock source is only meaningful in systems
with a PLL-based or FLL-based system clock. When there is no PLL or FLL, the fixed-system clock source is the
same as the bus rate clock. The external source is synchronized to the bus clock by TPM module, and the fixed
system clock source (when a PLL or FLL is present) is synchronized to the bus clock by an on-chip
synchronization circuit. When a PLL or FLL is present but not enabled, the fixed-system clock source is the same
as the bus-rate clock.
2–0
PS[2:0]
Prescale factor select. This 3-bit field selects one of 8 division factors for the TPM clock input as shown in
Table 16-4. This prescaler is located after any clock source synchronization or clock source selection so it affects
the clock source selected to drive the TPM system. The new prescale factor will affect the clock source on the
next system clock cycle after the new value is updated into the register bits.
Table 16-3. TPM-Clock-Source Selection
CLKSB:CLKSA TPM Clock Source to Prescaler Input
00
01
10
11
No clock selected (TPM counter disable)
Bus rate clock
Fixed system clock
External source
Table 16-4. Prescale Factor Selection
PS2:PS1:PS0
TPM Clock Source Divided-by
000
001
010
011
100
101
110
111
1
2
4
8
16
32
64
128
16.3.2 TPM-Counter Registers (TPMxCNTH:TPMxCNTL)
The two read-only TPM counter registers contain the high and low bytes of the value in the TPM counter.
Reading either byte (TPMxCNTH or TPMxCNTL) latches the contents of both bytes into a buffer where
they remain latched until the other half is read. This allows coherent 16-bit reads in either big-endian or
little-endian order which makes this more friendly to various compiler implementations. The coherency
mechanism is automatically restarted by an MCU reset or any write to the timer status/control register
(TPMxSC).
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
363
Chapter 16 Timer/PWM Module (S08TPMV3)
Reset clears the TPM counter registers. Writing any value to TPMxCNTH or TPMxCNTL also clears the
TPM counter (TPMxCNTH:TPMxCNTL) and resets the coherency mechanism, regardless of the data
involved in the write.
7
6
5
4
3
2
1
0
R
W
Bit 15
14
13
12
11
10
9
Bit 8
Any write to TPMxCNTH clears the 16-bit counter
Reset
0
0
0
0
0
0
0
0
Figure 16-8. TPM Counter Register High (TPMxCNTH)
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Any write to TPMxCNTL clears the 16-bit counter
Reset
0
0
0
0
0
0
0
0
Figure 16-9. TPM Counter Register Low (TPMxCNTL)
When BDM is active, the timer counter is frozen (this is the value that will be read by user); the coherency
mechanism is frozen such that the buffer latches remain in the state they were in when the BDM became
active, even if one or both counter halves are read while BDM is active. This assures that if the user was
in the middle of reading a 16-bit register when BDM became active, it will read the appropriate value from
the other half of the 16-bit value after returning to normal execution.
In BDM mode, writing any value to TPMxSC, TPMxCNTH or TPMxCNTL registers resets the read
coherency mechanism of the TPMxCNTH:L registers, regardless of the data involved in the write.
16.3.3 TPM Counter Modulo Registers (TPMxMODH:TPMxMODL)
The read/write TPM modulo registers contain the modulo value for the TPM counter. After the TPM
counter reaches the modulo value, the TPM counter resumes counting from 0x0000 at the next clock, and
the overflow flag (TOF) becomes set. Writing to TPMxMODH or TPMxMODL inhibits the TOF bit and
overflow interrupts until the other byte is written. Reset sets the TPM counter modulo registers to 0x0000
which results in a free running timer counter (modulo disabled).
Writing to either byte (TPMxMODH or TPMxMODL) latches the value into a buffer and the registers are
updated with the value of their write buffer according to the value of CLKSB:CLKSA bits, so:
•
•
If (CLKSB:CLKSA = 0:0), then the registers are updated when the second byte is written
If (CLKSB:CLKSA not = 0:0), then the registers are updated after both bytes were written, and the
TPM counter changes from (TPMxMODH:TPMxMODL - 1) to (TPMxMODH:TPMxMODL). If
the TPM counter is a free-running counter, the update is made when the TPM counter changes from
0xFFFE to 0xFFFF
The latching mechanism may be manually reset by writing to the TPMxSC address (whether BDM is
active or not).
MC9S08DZ128 Series Data Sheet, Rev. 1
364
Freescale Semiconductor
Chapter 16 Timer/PWM Module (S08TPMV3)
When BDM is active, the coherency mechanism is frozen (unless reset by writing to TPMxSC register)
such that the buffer latches remain in the state they were in when the BDM became active, even if one or
both halves of the modulo register are written while BDM is active. Any write to the modulo registers
bypasses the buffer latches and directly writes to the modulo register while BDM is active.
7
6
5
4
3
2
1
0
R
W
Bit 15
14
13
12
11
10
9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 16-10. TPM Counter Modulo Register High (TPMxMODH)
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 16-11. TPM Counter Modulo Register Low (TPMxMODL)
Reset the TPM counter before writing to the TPM modulo registers to avoid confusion about when the first
counter overflow will occur.
16.3.4 TPM Channel n Status and Control Register (TPMxCnSC)
TPMxCnSC contains the channel-interrupt-status flag and control bits used to configure the interrupt
enable, channel configuration, and pin function.
7
6
5
4
3
2
1
0
R
W
CHnF
0
0
CHnIE
MSnB
MSnA
ELSnB
ELSnA
0
0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 16-12. TPM Channel n Status and Control Register (TPMxCnSC)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
365
Chapter 16 Timer/PWM Module (S08TPMV3)
Table 16-5. TPMxCnSC Field Descriptions
Field
Description
7
Channel n flag. When channel n is an input-capture channel, this read/write bit is set when an active edge occurs
on the channel n pin. When channel n is an output compare or edge-aligned/center-aligned PWM channel, CHnF
is set when the value in the TPM counter registers matches the value in the TPM channel n value registers. When
channel n is an edge-aligned/center-aligned PWM channel and the duty cycle is set to 0% or 100%, CHnF will
not be set even when the value in the TPM counter registers matches the value in the TPM channel n value
registers.
CHnF
A corresponding interrupt is requested when CHnF is set and interrupts are enabled (CHnIE = 1). Clear CHnF by
reading TPMxCnSC while CHnF is set and then writing a logic 0 to CHnF. If another interrupt request occurs
before the clearing sequence is complete, the sequence is reset so CHnF remains set after the clear sequence
completed for the earlier CHnF. This is done so a CHnF interrupt request cannot be lost due to clearing a previous
CHnF.
Reset clears the CHnF bit. Writing a logic 1 to CHnF has no effect.
0 No input capture or output compare event occurred on channel n
1 Input capture or output compare event on channel n
6
Channel n interrupt enable. This read/write bit enables interrupts from channel n. Reset clears CHnIE.
0 Channel n interrupt requests disabled (use for software polling)
1 Channel n interrupt requests enabled
CHnIE
5
Mode select B for TPM channel n. When CPWMS=0, MSnB=1 configures TPM channel n for edge-aligned PWM
mode. Refer to the summary of channel mode and setup controls in Table 16-6.
MSnB
4
Mode select A for TPM channel n. When CPWMS=0 and MSnB=0, MSnA configures TPM channel n for
input-capture mode or output compare mode. Refer to Table 16-6 for a summary of channel mode and setup
controls.
MSnA
Note: If the associated port pin is not stable for at least two bus clock cycles before changing to input capture
mode, it is possible to get an unexpected indication of an edge trigger.
3–2
ELSnB
ELSnA
Edge/level select bits. Depending upon the operating mode for the timer channel as set by CPWMS:MSnB:MSnA
and shown in Table 16-6, these bits select the polarity of the input edge that triggers an input capture event, select
the level that will be driven in response to an output compare match, or select the polarity of the PWM output.
Setting ELSnB:ELSnA to 0:0 configures the related timer pin as a general purpose I/O pin not related to any timer
functions. This function is typically used to temporarily disable an input capture channel or to make the timer pin
available as a general purpose I/O pin when the associated timer channel is set up as a software timer that does
not require the use of a pin.
Table 16-6. Mode, Edge, and Level Selection
CPWMS
MSnB:MSnA
ELSnB:ELSnA
Mode
Configuration
X
XX
00
Pin not used for TPM - revert to general
purpose I/O or other peripheral control
MC9S08DZ128 Series Data Sheet, Rev. 1
366
Freescale Semiconductor
Chapter 16 Timer/PWM Module (S08TPMV3)
Table 16-6. Mode, Edge, and Level Selection
CPWMS
MSnB:MSnA
ELSnB:ELSnA
Mode
Configuration
0
00
01
Input capture
Capture on rising edge
only
10
11
01
10
Capture on falling edge
only
Capture on rising or
falling edge
01
Output compare
Toggle output on
compare
Clear output on
compare
11
10
Set output on compare
1X
XX
Edge-aligned
PWM
High-true pulses (clear
output on compare)
X1
10
X1
Low-true pulses (set
output on compare)
1
Center-aligned
PWM
High-true pulses (clear
output on compare-up)
Low-true pulses (set
output on compare-up)
16.3.5 TPM Channel Value Registers (TPMxCnVH:TPMxCnVL)
These read/write registers contain the captured TPM counter value of the input capture function or the
output compare value for the output compare or PWM functions. The channel registers are cleared by
reset.
7
6
5
4
3
2
1
0
R
W
Bit 15
14
13
12
11
10
9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 16-13. TPM Channel Value Register High (TPMxCnVH)
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 16-14. TPM Channel Value Register Low (TPMxCnVL)
In input capture mode, reading either byte (TPMxCnVH or TPMxCnVL) latches the contents of both bytes
into a buffer where they remain latched until the other half is read. This latching mechanism also resets
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
367
Chapter 16 Timer/PWM Module (S08TPMV3)
(becomes unlatched) when the TPMxCnSC register is written (whether BDM mode is active or not). Any
write to the channel registers will be ignored during the input capture mode.
When BDM is active, the coherency mechanism is frozen (unless reset by writing to TPMxCnSC register)
such that the buffer latches remain in the state they were in when the BDM became active, even if one or
both halves of the channel register are read while BDM is active. This assures that if the user was in the
middle of reading a 16-bit register when BDM became active, it will read the appropriate value from the
other half of the 16-bit value after returning to normal execution. The value read from the TPMxCnVH
and TPMxCnVL registers in BDM mode is the value of these registers and not the value of their read
buffer.
In output compare or PWM modes, writing to either byte (TPMxCnVH or TPMxCnVL) latches the value
into a buffer. After both bytes are written, they are transferred as a coherent 16-bit value into the
timer-channel registers according to the value of CLKSB:CLKSA bits and the selected mode, so:
•
•
If (CLKSB:CLKSA = 0:0), then the registers are updated when the second byte is written.
If (CLKSB:CLKSA not = 0:0 and in output compare mode) then the registers are updated after the
second byte is written and on the next change of the TPM counter (end of the prescaler counting).
•
If (CLKSB:CLKSA not = 0:0 and in EPWM or CPWM modes), then the registers are updated after
the both bytes were written, and the TPM counter changes from (TPMxMODH:TPMxMODL - 1)
to (TPMxMODH:TPMxMODL). If the TPM counter is a free-running counter then the update is
made when the TPM counter changes from 0xFFFE to 0xFFFF.
The latching mechanism may be manually reset by writing to the TPMxCnSC register (whether BDM
mode is active or not). This latching mechanism allows coherent 16-bit writes in either big-endian or
little-endian order which is friendly to various compiler implementations.
When BDM is active, the coherency mechanism is frozen such that the buffer latches remain in the state
they were in when the BDM became active even if one or both halves of the channel register are written
while BDM is active. Any write to the channel registers bypasses the buffer latches and directly write to
the channel register while BDM is active. The values written to the channel register while BDM is active
are used for PWM & output compare operation once normal execution resumes. Writes to the channel
registers while BDM is active do not interfere with partial completion of a coherency sequence. After the
coherency mechanism has been fully exercised, the channel registers are updated using the buffered values
written (while BDM was not active) by the user.
16.4 Functional Description
All TPM functions are associated with a central 16-bit counter which allows flexible selection of the clock
source and prescale factor. There is also a 16-bit modulo register associated with the main counter.
The CPWMS control bit chooses between center-aligned PWM operation for all channels in the TPM
(CPWMS=1) or general purpose timing functions (CPWMS=0) where each channel can independently be
configured to operate in input capture, output compare, or edge-aligned PWM mode. The CPWMS control
bit is located in the main TPM status and control register because it affects all channels within the TPM
and influences the way the main counter operates. (In CPWM mode, the counter changes to an up/down
mode rather than the up-counting mode used for general purpose timer functions.)
MC9S08DZ128 Series Data Sheet, Rev. 1
368
Freescale Semiconductor
Chapter 16 Timer/PWM Module (S08TPMV3)
The following sections describe the main counter and each of the timer operating modes (input capture,
output compare, edge-aligned PWM, and center-aligned PWM). Because details of pin operation and
interrupt activity depend upon the operating mode, these topics will be covered in the associated mode
explanation sections.
16.4.1 Counter
All timer functions are based on the main 16-bit counter (TPMxCNTH:TPMxCNTL). This section
discusses selection of the clock source, end-of-count overflow, up-counting vs. up/down counting, and
manual counter reset.
16.4.1.1 Counter Clock Source
The 2-bit field, CLKSB:CLKSA, in the timer status and control register (TPMxSC) selects one of three
possible clock sources or OFF (which effectively disables the TPM). See Table 16-3. After any MCU reset,
CLKSB:CLKSA=0:0 so no clock source is selected, and the TPM is in a very low power state. These
control bits may be read or written at any time and disabling the timer (writing 00 to the CLKSB:CLKSA
field) does not affect the values in the counter or other timer registers.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
369
Chapter 16 Timer/PWM Module (S08TPMV3)
Table 16-7. TPM Clock Source Selection
CLKSB:CLKSA
TPM Clock Source to Prescaler Input
00
01
10
11
No clock selected (TPM counter disabled)
Bus rate clock
Fixed system clock
External source
The bus rate clock is the main system bus clock for the MCU. This clock source requires no
synchronization because it is the clock that is used for all internal MCU activities including operation of
the CPU and buses.
In MCUs that have no PLL and FLL or the PLL and FLL are not engaged, the fixed system clock source
is the same as the bus-rate-clock source, and it does not go through a synchronizer. When a PLL or FLL
is present and engaged, a synchronizer is required between the crystal divided-by two clock source and the
timer counter so counter transitions will be properly aligned to bus-clock transitions. A synchronizer will
be used at chip level to synchronize the crystal-related source clock to the bus clock.
The external clock source may be connected to any TPM channel pin. This clock source always has to pass
through a synchronizer to assure that counter transitions are properly aligned to bus clock transitions. The
bus-rate clock drives the synchronizer; therefore, to meet Nyquist criteria even with jitter, the frequency of
the external clock source must not be faster than the bus rate divided-by four. With ideal clocks the external
clock can be as fast as bus clock divided by four.
When the external clock source shares the TPM channel pin, this pin should not be used for other channel
timing functions. For example, it would be ambiguous to configure channel 0 for input capture when the
TPM channel 0 pin was also being used as the timer external clock source. (It is the user’s responsibility
to avoid such settings.) The TPM channel could still be used in output compare mode for software timing
functions (pin controls set not to affect the TPM channel pin).
16.4.1.2 Counter Overflow and Modulo Reset
An interrupt flag and enable are associated with the 16-bit main counter. The flag (TOF) is a
software-accessible indication that the timer counter has overflowed. The enable signal selects between
software polling (TOIE=0) where no hardware interrupt is generated, or interrupt-driven operation
(TOIE=1) where a static hardware interrupt is generated whenever the TOF flag is equal to one.
The conditions causing TOF to become set depend on whether the TPM is configured for center-aligned
PWM (CPWMS=1). In the simplest mode, there is no modulus limit and the TPM is not in CPWMS=1
mode. In this case, the 16-bit timer counter counts from 0x0000 through 0xFFFF and overflows to 0x0000
on the next counting clock. TOF becomes set at the transition from 0xFFFF to 0x0000. When a modulus
limit is set, TOF becomes set at the transition from the value set in the modulus register to 0x0000. When
the TPM is in center-aligned PWM mode (CPWMS=1), the TOF flag gets set as the counter changes
direction at the end of the count value set in the modulus register (that is, at the transition from the value
set in the modulus register to the next lower count value). This corresponds to the end of a PWM period
(the 0x0000 count value corresponds to the center of a period).
MC9S08DZ128 Series Data Sheet, Rev. 1
370
Freescale Semiconductor
Chapter 16 Timer/PWM Module (S08TPMV3)
16.4.1.3 Counting Modes
The main timer counter has two counting modes. When center-aligned PWM is selected (CPWMS=1), the
counter operates in up/down counting mode. Otherwise, the counter operates as a simple up counter. As
an up counter, the timer counter counts from 0x0000 through its terminal count and then continues with
0x0000. The terminal count is 0xFFFF or a modulus value in TPMxMODH:TPMxMODL.
When center-aligned PWM operation is specified, the counter counts up from 0x0000 through its terminal
count and then down to 0x0000 where it changes back to up counting. Both 0x0000 and the terminal count
value are normal length counts (one timer clock period long). In this mode, the timer overflow flag (TOF)
becomes set at the end of the terminal-count period (as the count changes to the next lower count value).
16.4.1.4 Manual Counter Reset
The main timer counter can be manually reset at any time by writing any value to either half of
TPMxCNTH or TPMxCNTL. Resetting the counter in this manner also resets the coherency mechanism
in case only half of the counter was read before resetting the count.
16.4.2 Channel Mode Selection
Provided CPWMS=0, the MSnB and MSnA control bits in the channel n status and control registers
determine the basic mode of operation for the corresponding channel. Choices include input capture,
output compare, and edge-aligned PWM.
16.4.2.1 Input Capture Mode
With the input-capture function, the TPM can capture the time at which an external event occurs. When an
active edge occurs on the pin of an input-capture channel, the TPM latches the contents of the TPM counter
into the channel-value registers (TPMxCnVH:TPMxCnVL). Rising edges, falling edges, or any edge may
be chosen as the active edge that triggers an input capture.
In input capture mode, the TPMxCnVH and TPMxCnVL registers are read only.
When either half of the 16-bit capture register is read, the other half is latched into a buffer to support
coherent 16-bit accesses in big-endian or little-endian order. The coherency sequence can be manually
reset by writing to the channel status/control register (TPMxCnSC).
An input capture event sets a flag bit (CHnF) which may optionally generate a CPU interrupt request.
While in BDM, the input capture function works as configured by the user. When an external event occurs,
the TPM latches the contents of the TPM counter (which is frozen because of the BDM mode) into the
channel value registers and sets the flag bit.
16.4.2.2 Output Compare Mode
With the output-compare function, the TPM can generate timed pulses with programmable position,
polarity, duration, and frequency. When the counter reaches the value in the channel-value registers of an
output-compare channel, the TPM can set, clear, or toggle the channel pin.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
371
Chapter 16 Timer/PWM Module (S08TPMV3)
In output compare mode, values are transferred to the corresponding timer channel registers only after both
8-bit halves of a 16-bit register have been written and according to the value of CLKSB:CLKSA bits, so:
•
•
If (CLKSB:CLKSA = 0:0), the registers are updated when the second byte is written
If (CLKSB:CLKSA not = 0:0), the registers are updated at the next change of the TPM counter
(end of the prescaler counting) after the second byte is written.
The coherency sequence can be manually reset by writing to the channel status/control register
(TPMxCnSC).
An output compare event sets a flag bit (CHnF) which may optionally generate a CPU-interrupt request.
16.4.2.3 Edge-Aligned PWM Mode
This type of PWM output uses the normal up-counting mode of the timer counter (CPWMS=0) and can
be used when other channels in the same TPM are configured for input capture or output compare
functions. The period of this PWM signal is determined by the value of the modulus register
(TPMxMODH:TPMxMODL) plus 1. The duty cycle is determined by the setting in the timer channel
register (TPMxCnVH:TPMxCnVL). The polarity of this PWM signal is determined by the setting in the
ELSnA control bit. 0% and 100% duty cycle cases are possible.
The output compare value in the TPM channel registers determines the pulse width (duty cycle) of the
PWM signal (Figure 16-15). The time between the modulus overflow and the output compare is the pulse
width. If ELSnA=0, the counter overflow forces the PWM signal high, and the output compare forces the
PWM signal low. If ELSnA=1, the counter overflow forces the PWM signal low, and the output compare
forces the PWM signal high.
OVERFLOW
OVERFLOW
OVERFLOW
PERIOD
PULSE
WIDTH
TPMxCHn
OUTPUT
COMPARE
OUTPUT
COMPARE
OUTPUT
COMPARE
Figure 16-15. PWM Period and Pulse Width (ELSnA=0)
When the channel value register is set to 0x0000, the duty cycle is 0%. 100% duty cycle can be achieved
by setting the timer-channel register (TPMxCnVH:TPMxCnVL) to a value greater than the modulus
setting. This implies that the modulus setting must be less than 0xFFFF in order to get 100% duty cycle.
Because the TPM may be used in an 8-bit MCU, the settings in the timer channel registers are buffered to
ensure coherent 16-bit updates and to avoid unexpected PWM pulse widths. Writes to any of the registers
TPMxCnVH and TPMxCnVL, actually write to buffer registers. In edge-aligned PWM mode, values are
transferred to the corresponding timer-channel registers according to the value of CLKSB:CLKSA bits, so:
•
•
If (CLKSB:CLKSA = 0:0), the registers are updated when the second byte is written
If (CLKSB:CLKSA not = 0:0), the registers are updated after the both bytes were written, and the
TPM counter changes from (TPMxMODH:TPMxMODL - 1) to (TPMxMODH:TPMxMODL). If
MC9S08DZ128 Series Data Sheet, Rev. 1
372
Freescale Semiconductor
Chapter 16 Timer/PWM Module (S08TPMV3)
the TPM counter is a free-running counter then the update is made when the TPM counter changes
from 0xFFFE to 0xFFFF.
16.4.2.4 Center-Aligned PWM Mode
This type of PWM output uses the up/down counting mode of the timer counter (CPWMS=1). The output
compare value in TPMxCnVH:TPMxCnVL determines the pulse width (duty cycle) of the PWM signal
while the period is determined by the value in TPMxMODH:TPMxMODL. TPMxMODH:TPMxMODL
should be kept in the range of 0x0001 to 0x7FFF because values outside this range can produce ambiguous
results. ELSnA will determine the polarity of the CPWM output.
pulse width = 2 x (TPMxCnVH:TPMxCnVL)
period = 2 x (TPMxMODH:TPMxMODL); TPMxMODH:TPMxMODL=0x0001-0x7FFF
If the channel-value register TPMxCnVH:TPMxCnVL is zero or negative (bit 15 set), the duty cycle will
be 0%. If TPMxCnVH:TPMxCnVL is a positive value (bit 15 clear) and is greater than the (non-zero)
modulus setting, the duty cycle will be 100% because the duty cycle compare will never occur. This
implies the usable range of periods set by the modulus register is 0x0001 through 0x7FFE (0x7FFF if you
do not need to generate 100% duty cycle). This is not a significant limitation. The resulting period would
be much longer than required for normal applications.
TPMxMODH:TPMxMODL=0x0000 is a special case that should not be used with center-aligned PWM
mode. When CPWMS=0, this case corresponds to the counter running free from 0x0000 through 0xFFFF,
but when CPWMS=1 the counter needs a valid match to the modulus register somewhere other than at
0x0000 in order to change directions from up-counting to down-counting.
The output compare value in the TPM channel registers (times 2) determines the pulse width (duty cycle)
of the CPWM signal (Figure 16-16). If ELSnA=0, a compare occurred while counting up forces the
CPWM output signal low and a compare occurred while counting down forces the output high. The
counter counts up until it reaches the modulo setting in TPMxMODH:TPMxMODL, then counts down
until it reaches zero. This sets the period equal to two times TPMxMODH:TPMxMODL.
COUNT= 0
OUTPUT
COMPARE
(COUNT DOWN)
OUTPUT
COMPARE
(COUNT UP)
COUNT=
COUNT=
TPMxMODH:TPMxMODL
TPMxMODH:TPMxMODL
TPMxCHn
PULSE WIDTH
2 x TPMxCnVH:TPMxCnVL
PERIOD
2 x TPMxMODH:TPMxMODL
Figure 16-16. CPWM Period and Pulse Width (ELSnA=0)
Center-aligned PWM outputs typically produce less noise than edge-aligned PWMs because fewer I/O pin
transitions are lined up at the same system clock edge. This type of PWM is also required for some types
of motor drives.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
373
Chapter 16 Timer/PWM Module (S08TPMV3)
Input capture, output compare, and edge-aligned PWM functions do not make sense when the counter is
operating in up/down counting mode so this implies that all active channels within a TPM must be used in
CPWM mode when CPWMS=1.
The TPM may be used in an 8-bit MCU. The settings in the timer channel registers are buffered to ensure
coherent 16-bit updates and to avoid unexpected PWM pulse widths. Writes to any of the registers
TPMxMODH, TPMxMODL, TPMxCnVH, and TPMxCnVL, actually write to buffer registers.
In center-aligned PWM mode, the TPMxCnVH:L registers are updated with the value of their write buffer
according to the value of CLKSB:CLKSA bits, so:
•
•
If (CLKSB:CLKSA = 0:0), the registers are updated when the second byte is written
If (CLKSB:CLKSA not = 0:0), the registers are updated after the both bytes were written, and the
TPM counter changes from (TPMxMODH:TPMxMODL - 1) to (TPMxMODH:TPMxMODL). If
the TPM counter is a free-running counter, the update is made when the TPM counter changes from
0xFFFE to 0xFFFF.
When TPMxCNTH:TPMxCNTL=TPMxMODH:TPMxMODL, the TPM can optionally generate a TOF
interrupt (at the end of this count).
Writing to TPMxSC cancels any values written to TPMxMODH and/or TPMxMODL and resets the
coherency mechanism for the modulo registers. Writing to TPMxCnSC cancels any values written to the
channel value registers and resets the coherency mechanism for TPMxCnVH:TPMxCnVL.
16.5 Reset Overview
16.5.1 General
The TPM is reset whenever any MCU reset occurs.
16.5.2 Description of Reset Operation
Reset clears the TPMxSC register which disables clocks to the TPM and disables timer overflow interrupts
(TOIE=0). CPWMS, MSnB, MSnA, ELSnB, and ELSnA are all cleared which configures all TPM
channels for input-capture operation with the associated pins disconnected from I/O pin logic (so all MCU
pins related to the TPM revert to general purpose I/O pins).
16.6 Interrupts
16.6.1 General
The TPM generates an optional interrupt for the main counter overflow and an interrupt for each channel.
The meaning of channel interrupts depends on each channel’s mode of operation. If the channel is
configured for input capture, the interrupt flag is set each time the selected input capture edge is
recognized. If the channel is configured for output compare or PWM modes, the interrupt flag is set each
time the main timer counter matches the value in the 16-bit channel value register.
MC9S08DZ128 Series Data Sheet, Rev. 1
374
Freescale Semiconductor
Chapter 16 Timer/PWM Module (S08TPMV3)
All TPM interrupts are listed in Table 16-8 which shows the interrupt name, the name of any local enable
that can block the interrupt request from leaving the TPM and getting recognized by the separate interrupt
processing logic.
Table 16-8. Interrupt Summary
Local
Interrupt
Source
Description
Enable
TOF
TOIE
Counter overflow Set each time the timer counter reaches its terminal
count (at transition to next count value which is
usually 0x0000)
CHnF
CHnIE
Channel event
An input capture or output compare event took
place on channel n
The TPM module will provide a high-true interrupt signal. Vectors and priorities are determined at chip
integration time in the interrupt module so refer to the user’s guide for the interrupt module or to the chip’s
complete documentation for details.
16.6.2 Description of Interrupt Operation
For each interrupt source in the TPM, a flag bit is set upon recognition of the interrupt condition such as
timer overflow, channel-input capture, or output-compare events. This flag may be read (polled) by
software to determine that the action has occurred, or an associated enable bit (TOIE or CHnIE) can be set
to enable hardware interrupt generation. While the interrupt enable bit is set, a static interrupt will generate
whenever the associated interrupt flag equals one. The user’s software must perform a sequence of steps
to clear the interrupt flag before returning from the interrupt-service routine.
TPM interrupt flags are cleared by a two-step process including a read of the flag bit while it is set (1)
followed by a write of zero (0) to the bit. If a new event is detected between these two steps, the sequence
is reset and the interrupt flag remains set after the second step to avoid the possibility of missing the new
event.
16.6.2.1 Timer Overflow Interrupt (TOF) Description
The meaning and details of operation for TOF interrupts varies slightly depending upon the mode of
operation of the TPM system (general purpose timing functions versus center-aligned PWM operation).
The flag is cleared by the two step sequence described above.
16.6.2.1.1
Normal Case
Normally TOF is set when the timer counter changes from 0xFFFF to 0x0000. When the TPM is not
configured for center-aligned PWM (CPWMS=0), TOF gets set when the timer counter changes from the
terminal count (the value in the modulo register) to 0x0000. This case corresponds to the normal meaning
of counter overflow.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
375
Chapter 16 Timer/PWM Module (S08TPMV3)
16.6.2.1.2
Center-Aligned PWM Case
When CPWMS=1, TOF gets set when the timer counter changes direction from up-counting to
down-counting at the end of the terminal count (the value in the modulo register). In this case the TOF
corresponds to the end of a PWM period.
16.6.2.2 Channel Event Interrupt Description
The meaning of channel interrupts depends on the channel’s current mode (input-capture, output-compare,
edge-aligned PWM, or center-aligned PWM).
16.6.2.2.1
Input Capture Events
When a channel is configured as an input capture channel, the ELSnB:ELSnA control bits select no edge
(off), rising edges, falling edges or any edge as the edge which triggers an input capture event. When the
selected edge is detected, the interrupt flag is set. The flag is cleared by the two-step sequence described
in Section 16.6.2, “Description of Interrupt Operation.”
16.6.2.2.2
Output Compare Events
When a channel is configured as an output compare channel, the interrupt flag is set each time the main
timer counter matches the 16-bit value in the channel value register. The flag is cleared by the two-step
sequence described Section 16.6.2, “Description of Interrupt Operation.”
16.6.2.2.3
PWM End-of-Duty-Cycle Events
For channels configured for PWM operation there are two possibilities. When the channel is configured
for edge-aligned PWM, the channel flag gets set when the timer counter matches the channel value register
which marks the end of the active duty cycle period. When the channel is configured for center-aligned
PWM, the timer count matches the channel value register twice during each PWM cycle. In this CPWM
case, the channel flag is set at the start and at the end of the active duty cycle period which are the times
when the timer counter matches the channel value register. The flag is cleared by the two-step sequence
described Section 16.6.2, “Description of Interrupt Operation.”
16.7 The Differences from TPM v2 to TPM v3
1. Write to TPMxCnTH:L registers (Section 16.3.2, “TPM-Counter Registers
(TPMxCNTH:TPMxCNTL)) [SE110-TPM case 7]
Any write to TPMxCNTH or TPMxCNTL registers in TPM v3 clears the TPM counter
(TPMxCNTH:L) and the prescaler counter. Instead, in the TPM v2 only the TPM counter is cleared
in this case.
2. Read of TPMxCNTH:L registers (Section 16.3.2, “TPM-Counter Registers
(TPMxCNTH:TPMxCNTL))
— In TPM v3, any read of TPMxCNTH:L registers during BDM mode returns the value of the
TPM counter that is frozen. In TPM v2, if only one byte of the TPMxCNTH:L registers was
read before the BDM mode became active, then any read of TPMxCNTH:L registers during
MC9S08DZ128 Series Data Sheet, Rev. 1
376
Freescale Semiconductor
Chapter 16 Timer/PWM Module (S08TPMV3)
BDM mode returns the latched value of TPMxCNTH:L from the read buffer instead of the
frozen TPM counter value.
— This read coherency mechanism is cleared in TPM v3 in BDM mode if there is a write to
TPMxSC, TPMxCNTH or TPMxCNTL. Instead, in these conditions the TPM v2 does not clear
this read coherency mechanism.
3. Read of TPMxCnVH:L registers (Section 16.3.5, “TPM Channel Value Registers
(TPMxCnVH:TPMxCnVL))
— In TPM v3, any read of TPMxCnVH:L registers during BDM mode returns the value of the
TPMxCnVH:L register. In TPM v2, if only one byte of the TPMxCnVH:L registers was read
before the BDM mode became active, then any read of TPMxCnVH:L registers during BDM
mode returns the latched value of TPMxCNTH:L from the read buffer instead of the value in
the TPMxCnVH:L registers.
— This read coherency mechanism is cleared in TPM v3 in BDM mode if there is a write to
TPMxCnSC. Instead, in this condition the TPM v2 does not clear this read coherency
mechanism.
4. Write to TPMxCnVH:L registers
— Input Capture Mode (Section 16.4.2.1, “Input Capture Mode)
In this mode the TPM v3 does not allow the writes to TPMxCnVH:L registers. Instead, the
TPM v2 allows these writes.
— Output Compare Mode (Section 16.4.2.2, “Output Compare Mode)
In this mode and if (CLKSB:CLKSA not = 0:0), the TPM v3 updates the TPMxCnVH:L
registers with the value of their write buffer at the next change of the TPM counter (end of the
prescaler counting) after the second byte is written. Instead, the TPM v2 always updates these
registers when their second byte is written.
— Edge-Aligned PWM (Section 16.4.2.3, “Edge-Aligned PWM Mode)
In this mode and if (CLKSB:CLKSA not = 00), the TPM v3 updates the TPMxCnVH:L
registers with the value of their write buffer after that the both bytes were written and when the
TPM counter changes from (TPMxMODH:L - 1) to (TPMxMODH:L). If the TPM counter is
a free-running counter, then this update is made when the TPM counter changes from $FFFE
to $FFFF. Instead, the TPM v2 makes this update after that the both bytes were written and
when the TPM counter changes from TPMxMODH:L to $0000.
— Center-Aligned PWM (Section 16.4.2.4, “Center-Aligned PWM Mode)
In this mode and if (CLKSB:CLKSA not = 00), the TPM v3 updates the TPMxCnVH:L
registers with the value of their write buffer after that the both bytes were written and when the
TPM counter changes from (TPMxMODH:L - 1) to (TPMxMODH:L). If the TPM counter is
a free-running counter, then this update is made when the TPM counter changes from $FFFE
to $FFFF. Instead, the TPM v2 makes this update after that the both bytes were written and
when the TPM counter changes from TPMxMODH:L to (TPMxMODH:L - 1).
5. Center-Aligned PWM (Section 16.4.2.4, “Center-Aligned PWM Mode)
— TPMxCnVH:L = TPMxMODH:L [SE110-TPM case 1]
In this case, the TPM v3 produces 100% duty cycle. Instead, the TPM v2 produces 0% duty
cycle.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
377
Chapter 16 Timer/PWM Module (S08TPMV3)
— TPMxCnVH:L = (TPMxMODH:L - 1) [SE110-TPM case 2]
In this case, the TPM v3 produces almost 100% duty cycle. Instead, the TPM v2 produces 0%
duty cycle.
— TPMxCnVH:L is changed from 0x0000 to a non-zero value [SE110-TPM case 3 and 5]
In this case, the TPM v3 waits for the start of a new PWM period to begin using the new duty
cycle setting. Instead, the TPM v2 changes the channel output at the middle of the current
PWM period (when the count reaches 0x0000).
— TPMxCnVH:L is changed from a non-zero value to 0x0000 [SE110-TPM case 4]
In this case, the TPM v3 finishes the current PWM period using the old duty cycle setting.
Instead, the TPM v2 finishes the current PWM period using the new duty cycle setting.
6. Write to TPMxMODH:L registers in BDM mode (Section 16.3.3, “TPM Counter Modulo
Registers (TPMxMODH:TPMxMODL))
In the TPM v3 a write to TPMxSC register in BDM mode clears the write coherency mechanism
of TPMxMODH:L registers. Instead, in the TPM v2 this coherency mechanism is not cleared when
there is a write to TPMxSC register.
MC9S08DZ128 Series Data Sheet, Rev. 1
378
Freescale Semiconductor
Chapter 17
Development Support
17.1 Introduction
Development support systems in the HCS08 include the background debug controller (BDC) and the
on-chip debug module (DBG). The BDC provides a single-wire debug interface to the target MCU that
provides a convenient interface for programming the on-chip FLASH and other nonvolatile memories. The
BDC is also the primary debug interface for development and allows non-intrusive access to memory data
and traditional debug features such as CPU register modify, breakpoints, and single instruction trace
commands.
In the HCS08 Family, address and data bus signals are not available on external pins (not even in test
modes). Debug is done through commands fed into the target MCU via the single-wire background debug
interface. The debug module provides a means to selectively trigger and capture bus information so an
external development system can reconstruct what happened inside the MCU on a cycle-by-cycle basis
without having external access to the address and data signals.
17.1.1 Forcing Active Background
The method for forcing active background mode depends on the specific HCS08 derivative. For the
MC9S08DZ128 Series, you can force active background after a power-on reset by holding the BKGD pin
low as the device exits the reset condition. You can also force active background by driving BKGD low
immediately after a serial background command that writes a one to the BDFR bit in the SBDFR register.
Other causes of reset including an external pin reset or an internally generated error reset ignore the state
of the BKGD pin and reset into normal user mode. If no debug pod is connected to the BKGD pin, the
MCU will always reset into normal operating mode.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
379
Chapter 17 Development Support
17.1.2 Features
Features of the BDC module include:
•
•
•
•
•
•
•
•
•
•
Single pin for mode selection and background communications
BDC registers are not located in the memory map
SYNC command to determine target communications rate
Non-intrusive commands for memory access
Active background mode commands for CPU register access
GO and TRACE1 commands
BACKGROUND command can wake CPU from stop or wait modes
One hardware address breakpoint built into BDC
Oscillator runs in stop mode, if BDC enabled
COP watchdog disabled while in active background mode
17.2 Background Debug Controller (BDC)
All MCUs in the HCS08 Family contain a single-wire background debug interface that supports in-circuit
programming of on-chip nonvolatile memory and sophisticated non-intrusive debug capabilities. Unlike
debug interfaces on earlier 8-bit MCUs, this system does not interfere with normal application resources.
It does not use any user memory or locations in the memory map and does not share any on-chip
peripherals.
BDC commands are divided into two groups:
•
Active background mode commands require that the target MCU is in active background mode (the
user program is not running). Active background mode commands allow the CPU registers to be
read or written, and allow the user to trace one user instruction at a time, or GO to the user program
from active background mode.
•
Non-intrusive commands can be executed at any time even while the user’s program is running.
Non-intrusive commands allow a user to read or write MCU memory locations or access status and
control registers within the background debug controller.
Typically, a relatively simple interface pod is used to translate commands from a host computer into
commands for the custom serial interface to the single-wire background debug system. Depending on the
development tool vendor, this interface pod may use a standard RS-232 serial port, a parallel printer port,
or some other type of communications such as a universal serial bus (USB) to communicate between the
host PC and the pod. The pod typically connects to the target system with ground, the BKGD pin, RESET,
and sometimes V . An open-drain connection to reset allows the host to force a target system reset,
DD
which is useful to regain control of a lost target system or to control startup of a target system before the
on-chip nonvolatile memory has been programmed. Sometimes V can be used to allow the pod to use
DD
power from the target system to avoid the need for a separate power supply. However, if the pod is powered
separately, it can be connected to a running target system without forcing a target system reset or otherwise
disturbing the running application program.
MC9S08DZ128 Series Data Sheet, Rev. 1
380
Freescale Semiconductor
Chapter 17 Development Support
2
GND
BKGD
1
NO CONNECT 3
NO CONNECT 5
4 RESET
6 V
DD
Figure 17-1. BDM Tool Connector
17.2.1 BKGD Pin Description
BKGD is the single-wire background debug interface pin. The primary function of this pin is for
bidirectional serial communication of active background mode commands and data. During reset, this pin
is used to select between starting in active background mode or starting the user’s application program.
This pin is also used to request a timed sync response pulse to allow a host development tool to determine
the correct clock frequency for background debug serial communications.
BDC serial communications use a custom serial protocol first introduced on the M68HC12 Family of
microcontrollers. This protocol assumes the host knows the communication clock rate that is determined
by the target BDC clock rate. All communication is initiated and controlled by the host that drives a
high-to-low edge to signal the beginning of each bit time. Commands and data are sent most significant bit
first (MSB first). For a detailed description of the communications protocol, refer to Section 17.2.2,
“Communication Details.”
If a host is attempting to communicate with a target MCU that has an unknown BDC clock rate, a SYNC
command may be sent to the target MCU to request a timed sync response signal from which the host can
determine the correct communication speed.
BKGD is a pseudo-open-drain pin and there is an on-chip pullup so no external pullup resistor is required.
Unlike typical open-drain pins, the external RC time constant on this pin, which is influenced by external
capacitance, plays almost no role in signal rise time. The custom protocol provides for brief, actively
driven speedup pulses to force rapid rise times on this pin without risking harmful drive level conflicts.
Refer to Section 17.2.2, “Communication Details,” for more detail.
When no debugger pod is connected to the 6-pin BDM interface connector, the internal pullup on BKGD
chooses normal operating mode. When a debug pod is connected to BKGD it is possible to force the MCU
into active background mode after reset. The specific conditions for forcing active background depend
upon the HCS08 derivative (refer to the introduction to this Development Support section). It is not
necessary to reset the target MCU to communicate with it through the background debug interface.
17.2.2 Communication Details
The BDC serial interface requires the external controller to generate a falling edge on the BKGD pin to
indicate the start of each bit time. The external controller provides this falling edge whether data is
transmitted or received.
BKGD is a pseudo-open-drain pin that can be driven either by an external controller or by the MCU. Data
is transferred MSB first at 16 BDC clock cycles per bit (nominal speed). The interface times out if
512 BDC clock cycles occur between falling edges from the host. Any BDC command that was in progress
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
381
Chapter 17 Development Support
when this timeout occurs is aborted without affecting the memory or operating mode of the target MCU
system.
The custom serial protocol requires the debug pod to know the target BDC communication clock speed.
The clock switch (CLKSW) control bit in the BDC status and control register allows the user to select the
BDC clock source. The BDC clock source can either be the bus or the alternate BDC clock source.
The BKGD pin can receive a high or low level or transmit a high or low level. The following diagrams
show timing for each of these cases. Interface timing is synchronous to clocks in the target BDC, but
asynchronous to the external host. The internal BDC clock signal is shown for reference in counting cycles.
Figure 17-2 shows an external host transmitting a logic 1 or 0 to the BKGD pin of a target HCS08 MCU.
The host is asynchronous to the target so there is a 0-to-1 cycle delay from the host-generated falling edge
to where the target perceives the beginning of the bit time. Ten target BDC clock cycles later, the target
senses the bit level on the BKGD pin. Typically, the host actively drives the pseudo-open-drain BKGD pin
during host-to-target transmissions to speed up rising edges. Because the target does not drive the BKGD
pin during the host-to-target transmission period, there is no need to treat the line as an open-drain signal
during this period.
BDC CLOCK
(TARGET MCU)
HOST
TRANSMIT 1
HOST
TRANSMIT 0
10 CYCLES
EARLIEST START
OF NEXT BIT
SYNCHRONIZATION
UNCERTAINTY
TARGET SENSES BIT LEVEL
PERCEIVED START
OF BIT TIME
Figure 17-2. BDC Host-to-Target Serial Bit Timing
MC9S08DZ128 Series Data Sheet, Rev. 1
382
Freescale Semiconductor
Chapter 17 Development Support
Figure 17-3 shows the host receiving a logic 1 from the target HCS08 MCU. Because the host is
asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on
BKGD to the perceived start of the bit time in the target MCU. The host holds the BKGD pin low long
enough for the target to recognize it (at least two target BDC cycles). The host must release the low drive
before the target MCU drives a brief active-high speedup pulse seven cycles after the perceived start of the
bit time. The host should sample the bit level about 10 cycles after it started the bit time.
BDC CLOCK
(TARGET MCU)
HOST DRIVE
HIGH-IMPEDANCE
TO BKGD PIN
TARGET MCU
SPEEDUP PULSE
HIGH-IMPEDANCE
HIGH-IMPEDANCE
PERCEIVED START
OF BIT TIME
R-C RISE
BKGD PIN
10 CYCLES
10 CYCLES
EARLIEST START
OF NEXT BIT
HOST SAMPLES BKGD PIN
Figure 17-3. BDC Target-to-Host Serial Bit Timing (Logic 1)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
383
Chapter 17 Development Support
Figure 17-4 shows the host receiving a logic 0 from the target HCS08 MCU. Because the host is
asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on
BKGD to the start of the bit time as perceived by the target MCU. The host initiates the bit time but the
target HCS08 finishes it. Because the target wants the host to receive a logic 0, it drives the BKGD pin low
for 13 BDC clock cycles, then briefly drives it high to speed up the rising edge. The host samples the bit
level about 10 cycles after starting the bit time.
BDC CLOCK
(TARGET MCU)
HOST DRIVE
TO BKGD PIN
HIGH-IMPEDANCE
SPEEDUP
PULSE
TARGET MCU
DRIVE AND
SPEED-UP PULSE
PERCEIVED START
OF BIT TIME
BKGD PIN
10 CYCLES
10 CYCLES
EARLIEST START
OF NEXT BIT
HOST SAMPLES BKGD PIN
Figure 17-4. BDM Target-to-Host Serial Bit Timing (Logic 0)
MC9S08DZ128 Series Data Sheet, Rev. 1
384
Freescale Semiconductor
Chapter 17 Development Support
17.2.3 BDC Commands
BDC commands are sent serially from a host computer to the BKGD pin of the target HCS08 MCU. All
commands and data are sent MSB-first using a custom BDC communications protocol. Active background
mode commands require that the target MCU is currently in the active background mode while
non-intrusive commands may be issued at any time whether the target MCU is in active background mode
or running a user application program.
Table 17-1 shows all HCS08 BDC commands, a shorthand description of their coding structure, and the
meaning of each command.
Coding Structure Nomenclature
This nomenclature is used in Table 17-1 to describe the coding structure of the BDC commands.
Commands begin with an 8-bit hexadecimal command code in the host-to-target
direction (most significant bit first)
/
d
= separates parts of the command
=
=
=
=
=
=
=
=
=
delay 16 target BDC clock cycles
a 16-bit address in the host-to-target direction
AAAA
RD
8 bits of read data in the target-to-host direction
8 bits of write data in the host-to-target direction
16 bits of read data in the target-to-host direction
16 bits of write data in the host-to-target direction
the contents of BDCSCR in the target-to-host direction (STATUS)
8 bits of write data for BDCSCR in the host-to-target direction (CONTROL)
WD
RD16
WD16
SS
CC
RBKP
16 bits of read data in the target-to-host direction (from BDCBKPT breakpoint
register)
WBKP
=
16 bits of write data in the host-to-target direction (for BDCBKPT breakpoint register)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
385
Chapter 17 Development Support
Table 17-1. BDC Command Summary
Command
Mnemonic
Active BDM/
Non-intrusive
Coding
Structure
Description
Request a timed reference pulse to determine
target BDC communication speed
n/a1
D5/d
D6/d
90/d
SYNC
Non-intrusive
Non-intrusive
Non-intrusive
Non-intrusive
Enable acknowledge protocol. Refer to
Freescale document order no. HCS08RMv1/D.
ACK_ENABLE
ACK_DISABLE
BACKGROUND
Disable acknowledge protocol. Refer to
Freescale document order no. HCS08RMv1/D.
Enter active background mode if enabled
(ignore if ENBDM bit equals 0)
READ_STATUS
WRITE_CONTROL
READ_BYTE
Non-intrusive
Non-intrusive
Non-intrusive
Non-intrusive
E4/SS
C4/CC
Read BDC status from BDCSCR
Write BDC controls in BDCSCR
Read a byte from target memory
Read a byte and report status
E0/AAAA/d/RD
READ_BYTE_WS
E1/AAAA/d/SS/RD
Re-read byte from address just read and
report status
READ_LAST
Non-intrusive
E8/SS/RD
WRITE_BYTE
WRITE_BYTE_WS
READ_BKPT
Non-intrusive
Non-intrusive
Non-intrusive
Non-intrusive
C0/AAAA/WD/d
C1/AAAA/WD/d/SS
E2/RBKP
Write a byte to target memory
Write a byte and report status
Read BDCBKPT breakpoint register
Write BDCBKPT breakpoint register
WRITE_BKPT
C2/WBKP
Go to execute the user application program
starting at the address currently in the PC
GO
Active BDM
Active BDM
Active BDM
08/d
10/d
18/d
Trace 1 user instruction at the address in the
PC, then return to active background mode
TRACE1
TAGGO
Same as GO but enable external tagging
(HCS08 devices have no external tagging pin)
READ_A
Active BDM
Active BDM
Active BDM
Active BDM
Active BDM
68/d/RD
Read accumulator (A)
READ_CCR
READ_PC
READ_HX
READ_SP
69/d/RD
Read condition code register (CCR)
Read program counter (PC)
Read H and X register pair (H:X)
Read stack pointer (SP)
6B/d/RD16
6C/d/RD16
6F/d/RD16
Increment H:X by one then read memory byte
located at H:X
READ_NEXT
Active BDM
Active BDM
70/d/RD
Increment H:X by one then read memory byte
located at H:X. Report status and data.
READ_NEXT_WS
71/d/SS/RD
WRITE_A
Active BDM
Active BDM
Active BDM
Active BDM
Active BDM
48/WD/d
Write accumulator (A)
WRITE_CCR
WRITE_PC
WRITE_HX
WRITE_SP
49/WD/d
Write condition code register (CCR)
Write program counter (PC)
Write H and X register pair (H:X)
Write stack pointer (SP)
4B/WD16/d
4C/WD16/d
4F/WD16/d
Increment H:X by one, then write memory byte
located at H:X
WRITE_NEXT
Active BDM
Active BDM
50/WD/d
Increment H:X by one, then write memory byte
located at H:X. Also report status.
WRITE_NEXT_WS
51/WD/d/SS
1
The SYNC command is a special operation that does not have a command code.
MC9S08DZ128 Series Data Sheet, Rev. 1
386
Freescale Semiconductor
Chapter 17 Development Support
The SYNC command is unlike other BDC commands because the host does not necessarily know the
correct communications speed to use for BDC communications until after it has analyzed the response to
the SYNC command.
To issue a SYNC command, the host:
•
Drives the BKGD pin low for at least 128 cycles of the slowest possible BDC clock (The slowest
clock is normally the reference oscillator/64 or the self-clocked rate/64.)
•
Drives BKGD high for a brief speedup pulse to get a fast rise time (This speedup pulse is typically
one cycle of the fastest clock in the system.)
•
•
Removes all drive to the BKGD pin so it reverts to high impedance
Monitors the BKGD pin for the sync response pulse
The target, upon detecting the SYNC request from the host (which is a much longer low time than would
ever occur during normal BDC communications):
•
•
•
•
•
Waits for BKGD to return to a logic high
Delays 16 cycles to allow the host to stop driving the high speedup pulse
Drives BKGD low for 128 BDC clock cycles
Drives a 1-cycle high speedup pulse to force a fast rise time on BKGD
Removes all drive to the BKGD pin so it reverts to high impedance
The host measures the low time of this 128-cycle sync response pulse and determines the correct speed for
subsequent BDC communications. Typically, the host can determine the correct communication speed
within a few percent of the actual target speed and the communication protocol can easily tolerate speed
errors of several percent.
17.2.4 BDC Hardware Breakpoint
The BDC includes one relatively simple hardware breakpoint that compares the CPU address bus to a
16-bit match value in the BDCBKPT register. This breakpoint can generate a forced breakpoint or a tagged
breakpoint. A forced breakpoint causes the CPU to enter active background mode at the first instruction
boundary following any access to the breakpoint address. The tagged breakpoint causes the instruction
opcode at the breakpoint address to be tagged so that the CPU will enter active background mode rather
than executing that instruction if and when it reaches the end of the instruction queue. This implies that
tagged breakpoints can only be placed at the address of an instruction opcode while forced breakpoints can
be set at any address.
The breakpoint enable (BKPTEN) control bit in the BDC status and control register (BDCSCR) is used to
enable the breakpoint logic (BKPTEN = 1). When BKPTEN = 0, its default value after reset, the
breakpoint logic is disabled and no BDC breakpoints are requested regardless of the values in other BDC
breakpoint registers and control bits. The force/tag select (FTS) control bit in BDCSCR is used to select
forced (FTS = 1) or tagged (FTS = 0) type breakpoints.
17.3 Register Definition
This section contains the descriptions of the BDC registers and control bits.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
387
Chapter 17 Development Support
This section refers to registers and control bits only by their names. A Freescale-provided equate or header
file is used to translate these names into the appropriate absolute addresses.
17.3.1 BDC Registers and Control Bits
The BDC has two registers:
•
The BDC status and control register (BDCSCR) is an 8-bit register containing control and status
bits for the background debug controller.
•
The BDC breakpoint match register (BDCBKPT) holds a 16-bit breakpoint match address.
These registers are accessed with dedicated serial BDC commands and are not located in the memory
space of the target MCU (so they do not have addresses and cannot be accessed by user programs).
Some of the bits in the BDCSCR have write limitations; otherwise, these registers may be read or written
at any time. For example, the ENBDM control bit may not be written while the MCU is in active
background mode. (This prevents the ambiguous condition of the control bit forbidding active background
mode while the MCU is already in active background mode.) Also, the four status bits (BDMACT, WS,
WSF, and DVF) are read-only status indicators and can never be written by the WRITE_CONTROL serial
BDC command. The clock switch (CLKSW) control bit may be read or written at any time.
MC9S08DZ128 Series Data Sheet, Rev. 1
388
Freescale Semiconductor
Chapter 17 Development Support
17.3.1.1 BDC Status and Control Register (BDCSCR)
This register can be read or written by serial BDC commands (READ_STATUS and WRITE_CONTROL)
but is not accessible to user programs because it is not located in the normal memory map of the MCU.
7
6
5
4
3
2
1
0
R
BDMACT
WS
WSF
DVF
ENBDM
BKPTEN
FTS
CLKSW
W
Normal
Reset
0
1
0
1
0
0
0
0
0
1
0
0
0
0
0
0
Reset in
Active BDM:
= Unimplemented or Reserved
Figure 17-5. BDC Status and Control Register (BDCSCR)
Table 17-2. BDCSCR Register Field Descriptions
Description
Field
7
Enable BDM (Permit Active Background Mode) — Typically, this bit is written to 1 by the debug host shortly
after the beginning of a debug session or whenever the debug host resets the target and remains 1 until a normal
reset clears it.
ENBDM
0 BDM cannot be made active (non-intrusive commands still allowed)
1 BDM can be made active to allow active background mode commands
6
Background Mode Active Status — This is a read-only status bit.
BDMACT 0 BDM not active (user application program running)
1 BDM active and waiting for serial commands
5
BDC Breakpoint Enable — If this bit is clear, the BDC breakpoint is disabled and the FTS (force tag select)
control bit and BDCBKPT match register are ignored.
0 BDC breakpoint disabled
BKPTEN
1 BDC breakpoint enabled
4
FTS
Force/Tag Select — When FTS = 1, a breakpoint is requested whenever the CPU address bus matches the
BDCBKPT match register. When FTS = 0, a match between the CPU address bus and the BDCBKPT register
causes the fetched opcode to be tagged. If this tagged opcode ever reaches the end of the instruction queue,
the CPU enters active background mode rather than executing the tagged opcode.
0 Tag opcode at breakpoint address and enter active background mode if CPU attempts to execute that
instruction
1 Breakpoint match forces active background mode at next instruction boundary (address need not be an
opcode)
3
Select Source for BDC Communications Clock — CLKSW defaults to 0, which selects the alternate BDC
CLKSW
clock source.
0 Alternate BDC clock source
1 MCU bus clock
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
389
Chapter 17 Development Support
Table 17-2. BDCSCR Register Field Descriptions (continued)
Field
Description
2
WS
Wait or Stop Status — When the target CPU is in wait or stop mode, most BDC commands cannot function.
However, the BACKGROUND command can be used to force the target CPU out of wait or stop and into active
background mode where all BDC commands work. Whenever the host forces the target MCU into active
background mode, the host should issue a READ_STATUS command to check that BDMACT = 1 before
attempting other BDC commands.
0 Target CPU is running user application code or in active background mode (was not in wait or stop mode when
background became active)
1 Target CPU is in wait or stop mode, or a BACKGROUND command was used to change from wait or stop to
active background mode
1
WSF
Wait or Stop Failure Status — This status bit is set if a memory access command failed due to the target CPU
executing a wait or stop instruction at or about the same time. The usual recovery strategy is to issue a
BACKGROUND command to get out of wait or stop mode into active background mode, repeat the command
that failed, then return to the user program. (Typically, the host would restore CPU registers and stack values and
re-execute the wait or stop instruction.)
0 Memory access did not conflict with a wait or stop instruction
1 Memory access command failed because the CPU entered wait or stop mode
0
DVF
Data Valid Failure Status — This status bit is not used in the MC9S08DZ128 Series because it does not have
any slow access memory.
0 Memory access did not conflict with a slow memory access
1 Memory access command failed because CPU was not finished with a slow memory access
17.3.1.2 BDC Breakpoint Match Register (BDCBKPT)
This 16-bit register holds the address for the hardware breakpoint in the BDC. The BKPTEN and FTS
control bits in BDCSCR are used to enable and configure the breakpoint logic. Dedicated serial BDC
commands (READ_BKPT and WRITE_BKPT) are used to read and write the BDCBKPT register but is
not accessible to user programs because it is not located in the normal memory map of the MCU.
Breakpoints are normally set while the target MCU is in active background mode before running the user
application program. For additional information about setup and use of the hardware breakpoint logic in
the BDC, refer to Section 17.2.4, “BDC Hardware Breakpoint.”
17.3.2 System Background Debug Force Reset Register (SBDFR)
This register contains a single write-only control bit. A serial background mode command such as
WRITE_BYTE must be used to write to SBDFR. Attempts to write this register from a user program are
ignored. Reads always return 0x00.
MC9S08DZ128 Series Data Sheet, Rev. 1
390
Freescale Semiconductor
Chapter 17 Development Support
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
BDFR1
0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
1
BDFR is writable only through serial background mode debug commands, not from user programs.
Figure 17-6. System Background Debug Force Reset Register (SBDFR)
Table 17-3. SBDFR Register Field Description
Description
Field
0
Background Debug Force Reset — A serial active background mode command such as WRITE_BYTE allows
an external debug host to force a target system reset. Writing 1 to this bit forces an MCU reset. This bit cannot
be written from a user program.
BDFR
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
391
Chapter 17 Development Support
MC9S08DZ128 Series Data Sheet, Rev. 1
392
Freescale Semiconductor
Chapter 18
Debug Module (S08DBGV3) (128K)
18.1 Introduction
The DBG module implements an on-chip ICE (in-circuit emulation) system and allows non-intrusive
debug of application software by providing an on-chip trace buffer with flexible triggering capability. The
trigger also can provide extended breakpoint capacity. The on-chip ICE system is optimized for the HCS08
8-bit architecture and supports 64K bytes or 128K bytes of memory space.
18.1.1 Features
The on-chip ICE system includes these distinctive features:
•
Three comparators (A, B, and C) with ability to match addresses in 128K space
— Dual mode, Comparators A and B used to compare addresses
— Full mode, Comparator A compares address and Comparator B compares data
— Can be used as triggers and/or breakpoints
— Comparator C can be used as a normal hardware breakpoint
— Loop1 capture mode, Comparator C is used to track most recent COF event captured into FIFO
Tag and Force type breakpoints
•
•
Nine trigger modes
— A
— A Or B
— A Then B
— A And B, where B is data (Full mode)
— A And Not B, where B is data (Full mode)
— Event Only B, store data
— A Then Event Only B, store data
— Inside Range, A ≤ Address ≤ B
— Outside Range, Address < Α or Address > B
FIFO for storing change of flow information and event only data
— Source address of conditional branches taken
— Destination address of indirect JMP and JSR instruction
— Destination address of interrupts, RTI, RTC, and RTS instruction
— Data associated with Event B trigger modes
•
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
393
Chapter 18 Debug Module (S08DBGV3) (128K)
•
Ability to End-trace until reset and Begin-trace from reset
18.1.2 Modes of Operation
The on-chip ICE system can be enabled in all MCU functional modes. The DBG module is disabled if the
MCU is secure. The DBG module comparators are disabled when executing a Background Debug Mode
(BDM) command.
18.1.3 Block Diagram
Figure 18-1 shows the structure of the DBG module.
1
core_cpu_aob_14_t2
1
core_cpu_aob_15_t2
1
core_ppage_t2[2:0]
DBG Read Data Bus
FIFO Data
control
1
Address Bus[16:0]
Address/Data/Control Registers
c
o
n
t
Write Data Bus
Read Data Bus
Trigger
Break
Control
Logic
match_A
r
Comparator A
Comparator B
Read/Write
Tag
o
l
match_B
match_C
DBG Module Enable
Force
1
mmu_ppage_sel
Comparator C
core_cof[1:0]
MCU in BDM
MCU reset
Change of Flow Indicators
event only
store
Read DBGFL
Read DBGFH
Read DBGFX
Instr. Lastcycle
Bus Clk
1
ppage_sel
register
m
u
x
m
u
x
FIFO Data
8 deep
FIFO
m
u
x
subtract 2
1
addr[16:0]
Write Data Bus
m
u
x
Read Data Bus
Read/Write
1. In 64K versions of this module there are only 16 address lines [15:0], there are no core_cpu_aob_14_t2,
core_cpu_aob_15_t2, core_ppage_t2[2:0], and ppage_sel signals.
Figure 18-1. DBG Block Diagram
18.2 Signal Description
The DBG module contains no external signals.
MC9S08DZ128 Series Data Sheet, Rev. 1
394
Freescale Semiconductor
Chapter 18 Debug Module (S08DBGV3) (128K)
18.3 Memory Map and Registers
This section provides a detailed description of all DBG registers accessible to the end user.
18.3.1 Module Memory Map
Table 18-1 shows the registers contained in the DBG module.
Table 18-1. Module Memory Map
Address
Use
Access
Base + $0000
Base + $0001
Base + $0002
Base + $0003
Base + $0004
Base + $0005
Base + $0006
Base + $0007
Base + $0008
Base + $0009
Base + $000A
Base + $000B
Base + $000C
Base + $000D
Base + $000E
Base + $000F
Debug Comparator A High Register (DBGCAH)
Debug Comparator A Low Register (DBGCAL)
Debug Comparator B High Register (DBGCBH)
Debug Comparator B Low Register (DBGCBL)
Debug Comparator C High Register (DBGCCH)
Debug Comparator C Low Register (DBGCCL)
Debug FIFO High Register (DBGFH)
Read/write
Read/write
Read/write
Read/write
Read/write
Read/write
Read only
Read only
Read/write
Read/write
Read/write
Read only
Read/write
Read/write
Read only
Read only
Debug FIFO Low Register (DBGFL)
Debug Comparator A Extension Register (DBGCAX)
Debug Comparator B Extension Register (DBGCBX)
Debug Comparator C Extension Register (DBGCCX)
Debug FIFO Extended Information Register (DBGFX)
Debug Control Register (DBGC)
Debug Trigger Register (DBGT)
Debug Status Register (DBGS)
Debug FIFO Count Register (DBGCNT)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
395
Chapter 18 Debug Module (S08DBGV3) (128K)
18.3.2
Table 18-2. Register Bit Summary
7
6
5
4
3
2
1
0
DBGCAH
DBGCAL
DBGCBH
DBGCBL
DBGCCH
DBGCCL
DBGFH
Bit 15
Bit 7
Bit 14
Bit 6
Bit 14
Bit 6
Bit 14
Bit 6
Bit 14
Bit 6
RWA
RWB
RWC
0
Bit 13
Bit 5
Bit 12
Bit 4
Bit 12
Bit 4
Bit 12
Bit 4
Bit 12
Bit 4
0
Bit 11
Bit 3
Bit 11
Bit 3
Bit 11
Bit 3
Bit 11
Bit 3
0
Bit 10
Bit 2
Bit 10
Bit 2
Bit 10
Bit 2
Bit 10
Bit 2
0
Bit 9
Bit 1
Bit 9
Bit 1
Bit 9
Bit 1
Bit 9
Bit 1
0
Bit 8
Bit 0
Bit 15
Bit 13
Bit 5
Bit 8
Bit 7
Bit 0
Bit 15
Bit 13
Bit 5
Bit 8
Bit 7
Bit 0
Bit 15
Bit 13
Bit 5
Bit 8
DBGFL
Bit 7
Bit 0
DBGCAX
DBGCBX
DBGCCX
DBGFX
RWAEN
RWBEN
RWCEN
PPACC
DBGEN
PAGSEL
PAGSEL
PAGSEL
0
bit-16
bit-16
bit-16
bit-16
LOOP1
0
0
0
0
0
0
0
0
0
0
0
0
DBGC
ARM
BEGIN
BF
TAG
BRKEN
0
-
-
-
DBGT TRGSEL
0
TRG[3:0]
DBGS
AF
0
CF
0
0
0
0
ARMF
DBGCNT
0
0
0
CNT[3:0]
MC9S08DZ128 Series Data Sheet, Rev. 1
396
Freescale Semiconductor
Chapter 18 Debug Module (S08DBGV3) (128K)
18.3.3 Register Descriptions
This section consists of the DBG register descriptions in address order.
Note: For all registers below, consider: U = Unchanged, bit maintain its value after reset.
18.3.3.1 Debug Comparator A High Register (DBGCAH)
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
W
POR
or non-
end-run
1
1
1
1
1
1
1
1
Reset
U
U
U
U
U
U
U
U
end-run1
Figure 18-2. Debug Comparator A High Register (DBGCAH)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the bits in this register do not change after reset.
Table 18-3. DBGCAH Field Descriptions
Field
Description
Bits 15–8 Comparator A High Compare Bits — The Comparator A High compare bits control whether Comparator A will
compare the address bus bits [15:8] to a logic 1 or logic 0.
0 Compare corresponding address bit to a logic 0
1 Compare corresponding address bit to a logic 1
18.3.3.2 Debug Comparator A Low Register (DBGCAL)
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
W
POR
or non-
end-run
1
1
1
1
1
1
1
0
Reset
U
U
U
U
U
U
U
U
end-run1
Figure 18-3. Debug Comparator A Low Register (DBGCAL)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the bits in this register do not change after reset.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
397
Chapter 18 Debug Module (S08DBGV3) (128K)
Table 18-4. DBGCAL Field Descriptions
Field
Description
Bits 7–0
Comparator A Low Compare Bits — The Comparator A Low compare bits control whether Comparator A will
compare the address bus bits [7:0] to a logic 1 or logic 0.
0 Compare corresponding address bit to a logic 0
1 Compare corresponding address bit to a logic 1
18.3.3.3 Debug Comparator B High Register (DBGCBH)
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
W
POR
or non-
end-run
0
0
0
0
0
0
0
0
Reset
U
U
U
U
U
U
U
U
end-run1
Figure 18-4. Debug Comparator B High Register (DBGCBH)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the bits in this register do not change after reset.
Table 18-5. DBGCBH Field Descriptions
Field
Description
Bits 15–8 Comparator B High Compare Bits — The Comparator B High compare bits control whether Comparator B will
compare the address bus bits [15:8] to a logic 1 or logic 0. Not used in Full mode.
0 Compare corresponding address bit to a logic 0
1 Compare corresponding address bit to a logic 1
18.3.3.4 Debug Comparator B Low Register (DBGCBL)
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
W
POR
or non-
end-run
0
0
0
0
0
0
0
0
Reset
U
U
U
U
U
U
U
U
end-run1
Figure 18-5. Debug Comparator B Low Register (DBGCBL)
MC9S08DZ128 Series Data Sheet, Rev. 1
398
Freescale Semiconductor
Chapter 18 Debug Module (S08DBGV3) (128K)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the bits in this register do not change after reset.
Table 18-6. DBGCBL Field Descriptions
Field
Description
Bits 7–0
Comparator B Low Compare Bits — The Comparator B Low compare bits control whether Comparator B will
compare the address bus or data bus bits [7:0] to a logic 1 or logic 0.
0 Compare corresponding address bit to a logic 0, compares to data if in Full mode
1 Compare corresponding address bit to a logic 1, compares to data if in Full mode
18.3.3.5 Debug Comparator C High Register (DBGCCH)
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
W
POR
or non-
end-run
0
0
0
0
0
0
0
0
Reset
U
U
U
U
U
U
U
U
end-run1
Figure 18-6. Debug Comparator C High Register (DBGCCH)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the bits in this register do not change after reset.
Table 18-7. DBGCCH Field Descriptions
Field
Description
Bits 15–8 Comparator C High Compare Bits — The Comparator C High compare bits control whether Comparator C will
compare the address bus bits [15:8] to a logic 1 or logic 0.
0 Compare corresponding address bit to a logic 0
1 Compare corresponding address bit to a logic 1
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
399
Chapter 18 Debug Module (S08DBGV3) (128K)
18.3.3.6 Debug Comparator C Low Register (DBGCCL)
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
W
POR
or non-
end-run
0
0
0
0
0
0
0
0
Reset
U
U
U
U
U
U
U
U
end-run1
Figure 18-7. Debug Comparator C Low Register (DBGCCL)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the bits in this register do not change after reset.
Table 18-8. DBGCCL Field Descriptions
Field
Description
Bits 7–0
Comparator C Low Compare Bits — The Comparator C Low compare bits control whether Comparator C will
compare the address bus bits [7:0] to a logic 1 or logic 0.
0 Compare corresponding address bit to a logic 0
1 Compare corresponding address bit to a logic 1
18.3.3.7 Debug FIFO High Register (DBGFH)
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
W
POR
or non-
end-run
0
0
0
0
0
0
0
0
Reset
U
U
U
U
U
U
U
U
end-run1
= Unimplemented or Reserved
Figure 18-8. Debug FIFO High Register (DBGFH)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the bits in this register do not change after reset.
MC9S08DZ128 Series Data Sheet, Rev. 1
400
Freescale Semiconductor
Chapter 18 Debug Module (S08DBGV3) (128K)
Table 18-9. DBGFH Field Descriptions
Field
Description
Bits 15–8 FIFO High Data Bits — The FIFO High data bits provide access to bits [15:8] of data in the FIFO. This register
is not used in event only modes and will read a $00 for valid FIFO words.
18.3.3.8 Debug FIFO Low Register (DBGFL)
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
W
POR
or non-
end-run
0
0
0
0
0
0
0
0
Reset
U
U
U
U
U
U
U
U
end-run1
= Unimplemented or Reserved
Figure 18-9. Debug FIFO Low Register (DBGFL)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the bits in this register do not change after reset.
Table 18-10. DBGFL Field Descriptions
Field
Description
Bits 7–0
FIFO Low Data Bits — The FIFO Low data bits contain the least significant byte of data in the FIFO. When
reading FIFO words, read DBGFX and DBGFH before reading DBGFL because reading DBGFL causes the
FIFO pointers to advance to the next FIFO location. In event-only modes, there is no useful information in DBGFX
and DBGFH so it is not necessary to read them before reading DBGFL.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
401
Chapter 18 Debug Module (S08DBGV3) (128K)
18.3.3.9 Debug Comparator A Extension Register (DBGCAX)
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
0
0
0
0
RWAEN
RWA
PAGSEL
Bit 16
W
POR
or non-
end-run
0
0
0
0
0
0
0
0
0
0
0
0
Reset
U
U
U
U
end-run1
= Unimplemented or Reserved
Figure 18-10. Debug Comparator A Extension Register (DBGCAX)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the bits in this register do not change after reset.
Table 18-11. DBGCAX Field Descriptions
Field
Description
7
Read/Write Comparator A Enable Bit — The RWAEN bit controls whether read or write comparison is enabled
RWAEN
for Comparator A.
0 Read/Write is not used in comparison
1 Read/Write is used in comparison
6
Read/Write Comparator A Value Bit — The RWA bit controls whether read or write is used in compare for
Comparator A. The RWA bit is not used if RWAEN = 0.
0 Write cycle will be matched
RWA
1 Read cycle will be matched
5
Comparator A Page Select Bit — This PAGSEL bit controls whether Comparator A will be qualified with the
internal signal (mmu_ppage_sel) that indicates an extended access through the PPAGE mechanism. When
mmu_ppage_sel = 1, the 17-bit core address is a paged program access, and the 17-bit core address is made
up of PPAGE[2:0]:addr[13:0]. When mmu_ppage_sel = 0, the 17-bit core address is either a 16-bit CPU address
with a leading 0 in bit 16, or a 17-bit linear address pointer value.
PAGSEL
0 Match qualified by mmu_ppage_sel = 0 so address bits [16:0] correspond to a 17-bit CPU address with a
leading zero at bit 16, or a 17-bit linear address pointer address
1 Match qualified by mmu_ppage_sel = 1 so address bits [16:0] compare to flash memory address made up of
PPAGE[2:0]:addr[13:0]
0
Comparator A Extended Address Bit 16 Compare Bit — The Comparator A bit 16 compare bit controls
whether Comparator A will compare the core address bus bit 16 to a logic 1 or logic 0.
0 Compare corresponding address bit to a logic 0
Bit 16
1 Compare corresponding address bit to a logic 1
MC9S08DZ128 Series Data Sheet, Rev. 1
402
Freescale Semiconductor
Chapter 18 Debug Module (S08DBGV3) (128K)
18.3.3.10 Debug Comparator B Extension Register (DBGCBX)
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
0
0
0
0
RWBEN
W
RWB
PAGSEL
Bit 16
POR
or non-
end-run
0
0
0
0
0
0
0
0
0
0
0
0
Reset
U
U
U
U
end-run1
= Unimplemented or Reserved
Figure 18-11. Debug Comparator B Extension Register (DBGCBX)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the bits in this register do not change after reset.
Table 18-12. DBGCBX Field Descriptions
Field
Description
7
Read/Write Comparator B Enable Bit — The RWBEN bit controls whether read or write comparison is enabled
RWBEN
for Comparator B. In full modes, RWAEN and RWA are used to control comparison of R/W and RWBEN is
ignored.
0 Read/Write is not used in comparison
1 Read/Write is used in comparison
6
Read/Write Comparator B Value Bit — The RWB bit controls whether read or write is used in compare for
Comparator B. The RWB bit is not used if RWBEN = 0. In full modes, RWAEN and RWA are used to control
comparison of R/W and RWB is ignored.
RWB
0 Write cycle will be matched
1 Read cycle will be matched
5
Comparator B Page Select Bit — This PAGSEL bit controls whether Comparator B will be qualified with the
internal signal (mmu_papge_sel) that indicates an extended access through the PPAGE mechanism. When
mmu_ppage_sel = 1, the 17-bit core address is a paged program access, and the 17-bit core address is made
up of PPAGE[2:0]:addr[13:0]. When mmu_papge_sel = 0, the 17-bit core address is either a 16-bit CPU address
with a leading 0 in bit 16, or a 17-bit linear address pointer value. This bit is not used in full modes where
comparator B is used to match the data value.
PAGSEL
0 Match qualified by mmu_ppage_sel = 0 so address bits [16:0] correspond to a 17-bit CPU address with a
leading zero at bit 16, or a 17-bit linear address pointer address
1 Match qualified by mmu_ppage_sel = 1 so address bits [16:0] compare to flash memory address made up of
PPAGE[2:0]:addr[13:0]
0
Comparator B Extended Address Bit 16 Compare Bit — The Comparator B bit 16 compare bit controls
whether Comparator B will compare the core address bus bit 16 to a logic 1 or logic 0. This bit is not used in full
modes where comparator B is used to match the data value.
Bit 16
0 Compare corresponding address bit to a logic 0
1 Compare corresponding address bit to a logic 1
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
403
Chapter 18 Debug Module (S08DBGV3) (128K)
18.3.3.11 Debug Comparator C Extension Register (DBGCCX)
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
0
0
0
0
RWCEN
RWC
PAGSEL
Bit 16
W
POR
or non-
end-run
0
0
0
0
0
0
0
0
0
0
0
0
Reset
U
U
U
U
end-run1
= Unimplemented or Reserved
Figure 18-12. Debug Comparator C Extension Register (DBGCCX)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the bits in this register do not change after reset.
Table 18-13. DBGCCX Field Descriptions
Field
Description
7
Read/Write Comparator C Enable Bit — The RWCEN bit controls whether read or write comparison is enabled
RWCEN
for Comparator C.
0 Read/Write is not used in comparison
1 Read/Write is used in comparison
6
Read/Write Comparator C Value Bit — The RWC bit controls whether read or write is used in compare for
Comparator C. The RWC bit is not used if RWCEN = 0.
0 Write cycle will be matched
RWC
1 Read cycle will be matched
5
Comparator C Page Select Bit — This PAGSEL bit controls whether Comparator C will be qualified with the
internal signal (mmu_papge_sel) that indicates an extended access through the PPAGE mechanism. When
mmu_ppage_sel = 1, the 17-bit core address is a paged program access, and the 17-bit core address is made
up of PPAGE[2:0]:addr[13:0]. When mmu_papge_sel = 0, the 17-bit core address is either a 16-bit CPU address
with a leading 0 in bit 16, or a 17-bit linear address pointer value.
PAGSEL
0 Match qualified by mmu_ppage_sel = 0 so address bits [16:0] correspond to a 17-bit CPU address with a
leading zero at bit 16, or a 17-bit linear address pointer address
1 Match qualified by mmu_ppage_sel = 1 so address bits [16:0] compare to flash memory address made up of
PPAGE[2:0]:addr[13:0]
0
Comparator C Extended Address Bit 16 Compare Bit — The Comparator C bit 16 compare bit controls
whether Comparator C will compare the core address bus bit 16 to a logic 1 or logic 0.
0 Compare corresponding address bit to a logic 0
Bit 16
1 Compare corresponding address bit to a logic 1
MC9S08DZ128 Series Data Sheet, Rev. 1
404
Freescale Semiconductor
Chapter 18 Debug Module (S08DBGV3) (128K)
18.3.3.12 Debug FIFO Extended Information Register (DBGFX)
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
PPACC
0
0
0
0
0
0
Bit 16
W
POR
or non-
end-run
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Reset
U
U
end-run1
= Unimplemented or Reserved
Figure 18-13. Debug FIFO Extended Information Register (DBGFX)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the bits in this register do not change after reset.
Table 18-14. DBGFX Field Descriptions
Field
Description
7
PPAGE Access Indicator Bit — This bit indicates whether the captured information in the current FIFO word is
associated with an extended access through the PPAGE mechanism or not. This is indicated by the internal
signal mmu_ppage_sel which is 1 when the access is through the PPAGE mechanism.
0 The information in the corresponding FIFO word is event-only data or an unpaged 17-bit CPU address with
bit-16 = 0
PPACC
1 The information in the corresponding FIFO word is a 17-bit flash address with PPAGE[2:0] in the three most
significant bits and CPU address[13:0] in the 14 least significant bits
0
Extended Address Bit 16 — This bit is the most significant bit of the 17-bit core address.
Bit 16
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
405
Chapter 18 Debug Module (S08DBGV3) (128K)
18.3.3.13 Debug Control Register (DBGC)
Module Base + 0x000C
7
6
5
4
3
2
1
0
R
0
0
0
DBGEN
ARM
TAG
BRKEN
LOOP1
W
POR
or non-
end-run
1
1
0
0
0
0
0
0
0
0
0
0
0
Reset
U
U
U
end-run1
= Unimplemented or Reserved
Figure 18-14. Debug Control Register (DBGC)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the ARM and BRKEN bits are cleared but the remaining
control bits in this register do not change after reset.
Table 18-15. DBGC Field Descriptions
Field
Description
7
DBG Module Enable Bit — The DBGEN bit enables the DBG module. The DBGEN bit is forced to zero and
DBGEN
cannot be set if the MCU is secure.
0 DBG not enabled
1 DBG enabled
6
ARM
Arm Bit — The ARM bit controls whether the debugger is comparing and storing data in FIFO. See
Section 18.4.4.2, “Arming the DBG Module” for more information.
0 Debugger not armed
1 Debugger armed
5
TAG
Tag or Force Bit — The TAG bit controls whether a debugger or comparator C breakpoint will be requested as
a tag or force breakpoint to the CPU. The TAG bit is not used if BRKEN = 0.
0 Force request selected
1 Tag request selected
4
Break Enable Bit — The BRKEN bit controls whether the debugger will request a breakpoint to the CPU at the
end of a trace run, and whether comparator C will request a breakpoint to the CPU.
0 CPU break request not enabled
BRKEN
1 CPU break request enabled
0
Select LOOP1 Capture Mode — This bit selects either normal capture mode or LOOP1 capture mode. LOOP1
is not used in event-only modes.
LOOP1
0 Normal operation - capture COF events into the capture buffer FIFO
1 LOOP1 capture mode enabled. When the conditions are met to store a COF value into the FIFO, compare the
current COF address with the address in comparator C. If these addresses match, override the FIFO capture
and do not increment the FIFO count. If the address does not match comparator C, capture the COF address,
including the PPACC indicator, into the FIFO and into comparator C.
MC9S08DZ128 Series Data Sheet, Rev. 1
406
Freescale Semiconductor
Chapter 18 Debug Module (S08DBGV3) (128K)
18.3.3.14 Debug Trigger Register (DBGT)
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
0
0
TRGSEL
BEGIN
TRG
W2
POR
or non-
end-run
0
1
0
0
0
0
0
0
0
0
Reset
U
U
U
U
U
U
end-run1
= Unimplemented or Reserved
Figure 18-15. Debug Trigger Register (DBGT)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the control bits in this register do not change after reset.
2 The DBG trigger register (DBGT) can not be changed unless ARM=0.
Table 18-16. DBGT Field Descriptions
Field
Description
7
Trigger Selection Bit — The TRGSEL bit controls the triggering condition for the comparators. See
Section 18.4.4, “Trigger Break Control (TBC)” for more information.
0 Trigger on any compare address access
TRGSEL
1 Trigger if opcode at compare address is executed
6
Begin/End Trigger Bit — The BEGIN bit controls whether the trigger begins or ends storing of data in FIFO.
BEGIN
0 Trigger at end of stored data
1 Trigger before storing data
3–0
Trigger Mode Bits — The TRG bits select the trigger mode of the DBG module as shown in Table 18-17.
TRG
Table 18-17. Trigger Mode Encoding
TRG Value
Meaning
0000
0001
0010
0011
0100
0101
0110
0111
1000
A Only
A Or B
A Then B
Event Only B
A Then Event Only B
A And B (Full Mode)
A And Not B (Full mode)
Inside Range
Outside Range
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
407
Chapter 18 Debug Module (S08DBGV3) (128K)
Table 18-17. Trigger Mode Encoding
TRG Value
Meaning
1001
↓
1111
No Trigger
NOTE
The DBG trigger register (DBGT) can not be changed unless ARM=0.
18.3.3.15 Debug Status Register (DBGS)
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
AF
BF
CF
0
0
0
0
ARMF
W
POR
or non-
end-run
0
0
0
0
0
0
0
0
0
0
0
1
0
Reset
U
U
U
end-run1
= Unimplemented or Reserved
Figure 18-16. Debug Status Register (DBGS)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, ARMF gets cleared by reset but AF, BF, and CF do not
change after reset.
Table 18-18. DBGS Field Descriptions
Field
Description
7
AF
Trigger A Match Bit — The AF bit indicates if Trigger A match condition was met since arming.
0 Comparator A did not match
1 Comparator A match
6
BF
Trigger B Match Bit — The BF bit indicates if Trigger B match condition was met since arming.
0 Comparator B did not match
1 Comparator B match
5
CF
Trigger C Match Bit — The CF bit indicates if Trigger C match condition was met since arming.
0 Comparator C did not match
1 Comparator C match
0
Arm Flag Bit — The ARMF bit indicates whether the debugger is waiting for trigger or waiting for the FIFO to fill.
ARMF
While DBGEN = 1, this status bit is a read-only image of the ARM bit in DBGC. See Section 18.4.4.2, “Arming
the DBG Module” for more information.
0 Debugger not armed
1 Debugger armed
MC9S08DZ128 Series Data Sheet, Rev. 1
408
Freescale Semiconductor
Chapter 18 Debug Module (S08DBGV3) (128K)
18.3.3.16 Debug Count Status Register (DBGCNT)
Module Base + 0x000F
7
6
5
4
3
2
1
0
R
0
0
0
0
CNT
W
POR
or non-
end-run
0
0
0
0
0
0
0
0
0
0
0
0
Reset
U
U
U
U
end-run1
= Unimplemented or Reserved
Figure 18-17. Debug Count Status Register (DBGCNT)
1
In the case of an end-trace to reset where DBGEN=1 and BEGIN=0, the CNT[3:0] bits do not change after reset.
Table 18-19. DBGS Field Descriptions
Field
Description
3–0
CNT
FIFO Valid Count Bits — The CNT bits indicate the amount of valid data stored in the FIFO. Table 18-20 shows
the correlation between the CNT bits and the amount of valid data in FIFO. The CNT will stop after a count to
eight even if more data is being stored in the FIFO. The CNT bits are cleared when the DBG module is armed,
and the count is incremented each time a new word is captured into the FIFO. The host development system is
responsible for checking the value in CNT[3:0] and reading the correct number of words from the FIFO because
the count does not decrement as data is read out of the FIFO at the end of a trace run.
Table 18-20. CNT Bits
CNT Value
Meaning
0000
0001
0010
0011
0100
0101
0110
0111
1000
No data valid
1 word valid
2 words valid
3 words valid
4 words valid
5 words valid
6 words valid
7 words valid
8 words valid
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
409
Chapter 18 Debug Module (S08DBGV3) (128K)
18.4 Functional Description
This section provides a complete functional description of the on-chip ICE system. The DBG module is
enabled by setting the DBGEN bit in the DBGC register. Enabling the module allows the arming,
triggering and storing of data in the FIFO. The DBG module is made up of three main blocks, the
Comparators, Trigger Break Control logic and the FIFO.
18.4.1 Comparator
The DBG module contains three comparators, A, B, and C. Comparator A compares the core address bus
with the address stored in the DBGCAX, DBGCAH, and DBGCAL registers. Comparator B compares the
core address bus with the address stored in the DBGCBX, DBGCBH, and DBGCBL registers except in
full mode, where it compares the data buses to the data stored in the DBGCBL register. Comparator C
compares the core address bus with the address stored in the DBGCCX, DBGCCH, and DBGCCL
registers. Matches on Comparators A, B, and C are signaled to the Trigger Break Control (TBC) block.
18.4.1.1 RWA and RWAEN in Full Modes
In full modes ("A And B" and "A And Not B") RWAEN and RWA are used to select read or write
comparisons for both comparators A and B. To select write comparisons and the write data bus in Full
Modes set RWAEN=1 and RWA=0, otherwise read comparisons and the read data bus will be selected.
The RWBEN and RWB bits are not used and will be ignored in Full Modes.
18.4.1.2 Comparator C in LOOP1 Capture Mode
Normally comparator C is used as a third hardware breakpoint and is not involved in the trigger logic for
the on-chip ICE system. In this mode, it compares the core address bus with the address stored in the
DBGCCX, DBGCCH, and DBGCCL registers. However, in LOOP1 capture mode, comparator C is
managed by logic in the DBG module to track the address of the most recent change-of-flow event that
was captured into the FIFO buffer. In LOOP1 capture mode, comparator C is not available for use as a
normal hardware breakpoint.
When the ARM and DBGEN bits are set to one in LOOP1 capture mode, comparator C value registers are
cleared to prevent the previous contents of these registers from interfering with the LOOP1 capture mode
operation. When a COF event is detected, the address of the event is compared to the contents of the
DBGCCX, DBGCCH, and DBGCCL registers to determine whether it is the same as the previous COF
entry in the capture FIFO. If the values match, the capture is inhibited to prevent the FIFO from filling up
with duplicate entries. If the values do not match, the COF event is captured into the FIFO and the
DBGCCX, DBGCCH, and DBGCCL registers are updated to reflect the address of the captured COF
event. When comparator C is updated, the PAGSEL bit (bit-7 of DBGCCX) is updated with the PPACC
value that is captured into the FIFO. This bit indicates whether the COF address was a paged 17-bit
program address using the PPAGE mechanism (PPACC=1) or a 17-bit CPU address that resulted from an
unpaged CPU access.
MC9S08DZ128 Series Data Sheet, Rev. 1
410
Freescale Semiconductor
Chapter 18 Debug Module (S08DBGV3) (128K)
18.4.2 Breakpoints
A breakpoint request to the CPU at the end of a trace run can be created if the BRKEN bit in the DBGC
register is set. The value of the BEGIN bit in DBGT register determines when the breakpoint request to
the CPU will occur. If the BEGIN bit is set, begin-trigger is selected and the breakpoint request will not
occur until the FIFO is filled with 8 words. If the BEGIN bit is cleared, end-trigger is selected and the
breakpoint request will occur immediately at the trigger cycle.
When traditional hardware breakpoints from comparators A or B are desired, set BEGIN=0 to select an
end-trace run and set the trigger mode to either 0x0 (A-only) or 0x1 (A OR B) mode.
There are two types of breakpoint requests supported by the DBG module, tag-type and force-type. Tagged
breakpoints are associated with opcode addresses and allow breaking just before a specific instruction
executes. Force breakpoints are not associated with opcode addresses and allow breaking at the next
instruction boundary. The TAG bit in the DBGC register determines whether CPU breakpoint requests will
be a tag-type or force-type breakpoints. When TAG=0, a force-type breakpoint is requested and it will take
effect at the next instruction boundary after the request. When TAG=1, a tag-type breakpoint is registered
into the instruction queue and the CPU will break if/when this tag reaches the head of the instruction queue
and the tagged instruction is about to be executed.
18.4.2.1 Hardware Breakpoints
Comparators A, B, and C can be used as three traditional hardware breakpoints whether the on-chip ICE
real-time capture function is required or not. To use any breakpoint or trace run capture functions set
DBGEN=1. BRKEN and TAG affect all three comparators. When BRKEN=0, no CPU breakpoints are
enabled. When BRKEN=1, CPU breakpoints are enabled and the TAG bit determines whether the
breakpoints will be tag-type or force-type breakpoints. To use comparators A and B as hardware
breakpoints, set DBGT=0x81 for tag-type breakpoints and 0x01 for force-type breakpoints. This sets up
an end-type trace with trigger mode “A OR B”.
Comparator C is not involved in the trigger logic for the on-chip ICE system.
18.4.3 Trigger Selection
The TRGSEL bit in the DBGT register is used to determine the triggering condition of the on-chip ICE
system. TRGSEL applies to both trigger A and B except in the event only trigger modes. By setting the
TRGSEL bit, the comparators will qualify a match with the output of opcode tracking logic. The opcode
tracking logic is internal to each comparator and determines whether the CPU executed the opcode at the
compare address. With the TRGSEL bit cleared a comparator match is all that is necessary for a trigger
condition to be met.
NOTE
If the TRGSEL is set, the address stored in the comparator match address
registers must be an opcode address for the trigger to occur.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
411
Chapter 18 Debug Module (S08DBGV3) (128K)
18.4.4 Trigger Break Control (TBC)
The TBC is the main controller for the DBG module. Its function is to decide whether data should be stored
in the FIFO based on the trigger mode and the match signals from the comparator. The TBC also
determines whether a request to break the CPU should occur.
The TAG bit in DBGC controls whether CPU breakpoints are treated as tag-type or force-type breakpoints.
The TRGSEL bit in DBGT controls whether a comparator A or B match is further qualified by opcode
tracking logic. Each comparator has a separate circuit to track opcodes because the comparators could
correspond to separate instructions that could be propagating through the instruction queue at the same
time.
In end-type trace runs (BEGIN=0), when the comparator registers match, including the optional R/W
match, this signal goes to the CPU break logic where BRKEN determines whether a CPU break is
requested and the TAG control bit determines whether the CPU break will be a tag-type or force-type
breakpoint. When TRGSEL is set, the R/W qualified comparator match signal also passes through the
opcode tracking logic. If/when it propagates through this logic, it will cause a trigger to the ICE logic to
begin or end capturing information into the FIFO. In the case of an end-type (BEGIN=0) trace run, the
qualified comparator signal stops the FIFO from capturing any more information.
If a CPU breakpoint is also enabled, you would want TAG and TRGSEL to agree so that the CPU break
occurs at the same place in the application program as the FIFO stopped capturing information. If
TRGSEL was 0 and TAG was 1 in an end-type trace run, the FIFO would stop capturing as soon as the
comparator address matched, but the CPU would continue running until a TAG signal could propagate
through the CPUs instruction queue which could take a long time in the case where changes of flow caused
the instruction queue to be flushed. If TRGSEL was one and TAG was zero in an end-type trace run, the
CPU would break before the comparator match signal could propagate through the opcode tracking logic
to end the trace run.
In begin-type trace runs (BEGIN=1), the start of FIFO capturing is triggered by the qualified comparator
signals, and the CPU breakpoint (if enabled by BRKEN=1) is triggered when the FIFO becomes full. Since
this FIFO full condition does not correspond to the execution of a tagged instruction, it would not make
sense to use TAG=1 for a begin-type trace run.
18.4.4.1 Begin- and End-Trigger
The definition of begin- and end-trigger as used in the DBG module are as follows:
•
•
Begin-trigger: Storage in FIFO occurs after the trigger and continues until 8 locations are filled.
End-trigger: Storage in FIFO occurs until the trigger with the least recent data falling out of the
FIFO if more than 8 words are collected.
18.4.4.2 Arming the DBG Module
Arming occurs by enabling the DBG module by setting the DBGEN bit and by setting the ARM bit in the
DBGC register. The ARM bit in the DBGC register and the ARMF bit in the DBGS register are cleared
when the trigger condition is met in end-trigger mode or when the FIFO is filled in begin-trigger mode. In
the case of an end-trace where DBGEN=1 and BEGIN=0, ARM and ARMF are cleared by any reset to
MC9S08DZ128 Series Data Sheet, Rev. 1
412
Freescale Semiconductor
Chapter 18 Debug Module (S08DBGV3) (128K)
end the trace run that was in progress. The ARMF bit is also cleared if ARM is written to zero or when the
DBGEN bit is low. The TBC logic determines whether a trigger condition has been met based on the
trigger mode and the trigger selection.
18.4.4.3 Trigger Modes
The on-chip ICE system supports nine trigger modes. The trigger modes are encoded as shown in
Table 18-17. The trigger mode is used as a qualifier for either starting or ending the storing of data in the
FIFO. When the match condition is met, the appropriate flag AF or BF is set in DBGS register. Arming
the DBG module clears the AF, BF, and CF flags in the DBGS register. In all trigger modes except for the
event only modes change of flow addresses are stored in the FIFO. In the event only modes only the value
on the data bus at the trigger event B comparator match address will be stored.
18.4.4.3.1
A Only
In the A Only trigger mode, if the match condition for A is met, the AF flag in the DBGS register is set.
18.4.4.3.2
A Or B
In the A Or B trigger mode, if the match condition for A or B is met, the corresponding flag(s) in the DBGS
register are set.
18.4.4.3.3
A Then B
In the A Then B trigger mode, the match condition for A must be met before the match condition for B is
compared. When the match condition for A or B is met, the corresponding flag in the DBGS register is set.
18.4.4.3.4
Event Only B
In the Event Only B trigger mode, if the match condition for B is met, the BF flag in the DBGS register is
set. The Event Only B trigger mode is considered a begin-trigger type and the BEGIN bit in the DBGT
register is ignored.
18.4.4.3.5
A Then Event Only B
In the A Then Event Only B trigger mode, the match condition for A must be met before the match
condition for B is compared. When the match condition for A or B is met, the corresponding flag in the
DBGS register is set. The A Then Event Only B trigger mode is considered a begin-trigger type and the
BEGIN bit in the DBGT register is ignored.
18.4.4.3.6
A And B (Full Mode)
In the A And B trigger mode, Comparator A compares to the address bus and Comparator B compares to
the data bus. In the A and B trigger mode, if the match condition for A and B happen on the same bus cycle,
both the AF and BF flags in the DBGS register are set. If a match condition on only A or only B happens,
no flags are set.
For Breakpoint tagging operation with an end-trigger type trace, only matches from Comparator A will be
used to determine if the Breakpoint conditions are met and Comparator B matches will be ignored.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
413
Chapter 18 Debug Module (S08DBGV3) (128K)
18.4.4.3.7
A And Not B (Full Mode)
In the A And Not B trigger mode, comparator A compares to the address bus and comparator B compares
to the data bus. In the A And Not B trigger mode, if the match condition for A and Not B happen on the
same bus cycle, both the AF and BF flags in the DBGS register are set. If a match condition on only A or
only Not B occur no flags are set.
For Breakpoint tagging operation with an end-trigger type trace, only matches from Comparator A will be
used to determine if the Breakpoint conditions are met and Comparator B matches will be ignored.
18.4.4.3.8
Inside Range, A ≤ address ≤ B
In the Inside Range trigger mode, if the match condition for A and B happen on the same bus cycle, both
the AF and BF flags in the DBGS register are set. If a match condition on only A or only B occur no flags
are set.
18.4.4.3.9
Outside Range, address < A or address > B
In the Outside Range trigger mode, if the match condition for A or B is met, the corresponding flag in the
DBGS register is set.
The four control bits BEGIN and TRGSEL in DBGT, and BRKEN and TAG in DBGC, determine the basic
type of debug run as shown in Table 1.21. Some of the 16 possible combinations are not used (refer to the
notes at the end of the table).
Table 18-21. Basic Types of Debug Runs
BEGIN
TRGSEL
BRKEN
TAG
Type of Debug Run
(1)
x
Fill FIFO until trigger address (No CPU breakpoint - keep
running)
0
0
0
Fill FIFO until trigger address, then force CPU breakpoint
Do not use(2)
0
0
0
0
0
1
1
1
0
0
1
(1)
x
Fill FIFO until trigger opcode about to execute (No CPU
breakpoint - keep running)
Do not use(3)
0
0
1
1
1
1
0
1
Fill FIFO until trigger opcode about to execute (trigger causes
CPU breakpoint)
(1)
x
Start FIFO at trigger address (No CPU breakpoint - keep
running)
1
1
0
0
0
1
Start FIFO at trigger address, force CPU breakpoint when
FIFO full
0
1
Do not use(4)
1
1
0
1
1
0
(1)
x
Start FIFO at trigger opcode (No CPU breakpoint - keep
running)
Start FIFO at trigger opcode, force CPU breakpoint when FIFO
full
1
1
1
1
1
1
0
1
Do not use(4)
MC9S08DZ128 Series Data Sheet, Rev. 1
414
Freescale Semiconductor
Chapter 18 Debug Module (S08DBGV3) (128K)
1
2
When BRKEN = 0, TAG is do not care (x in the table).
In end trace configurations (BEGIN = 0) where a CPU breakpoint is enabled (BRKEN = 1), TRGSEL should agree with TAG. In this case, where
TRGSEL = 0 to select no opcode tracking qualification and TAG = 1 to specify a tag-type CPU breakpoint, the CPU breakpoint would not take
effect until sometime after the FIFO stopped storing values. Depending on program loops or interrupts, the delay could be very long.
3
In end trace configurations (BEGIN = 0) where a CPU breakpoint is enabled (BRKEN = 1), TRGSEL should agree with TAG. In this case, where
TRGSEL = 1 to select opcode tracking qualification and TAG = 0 to specify a force-type CPU breakpoint, the CPU breakpoint would erroneously
take effect before the FIFO stopped storing values and the debug run would not complete normally.
4 In begin trace configurations (BEGIN = 1) where a CPU breakpoint is enabled (BRKEN = 1), TAG should not be set to 1. In begin trace debug
runs, the CPU breakpoint corresponds to the FIFO full condition which does not correspond to a taggable instruction fetch.
18.4.5 FIFO
The FIFO is an eight word deep FIFO. In all trigger modes except for event only, the data stored in the
FIFO will be change of flow addresses. In the event only trigger modes only the data bus value
corresponding to the event is stored. In event only trigger modes, the high byte of the valid data from the
FIFO will always read a 0x00 and the extended information byte in DBGFX will always read 0x00.
18.4.5.1 Storing Data in FIFO
In all trigger modes except for the event only modes, the address stored in the FIFO will be determined by
the change of flow indicators from the core. The signal core_cof[1] indicates the current core address is
the destination address of an indirect JSR or JMP instruction, or a RTS, RTC, or RTI instruction or interrupt
vector and the destination address should be stored. The signal core_cof[0] indicates that a conditional
branch was taken and that the source address of the conditional branch should be stored.
18.4.5.2 Storing with Begin-Trigger
Storing with Begin-Trigger can be used in all trigger modes. Once the DBG module is enabled and armed
in the begin-trigger mode, data is not stored in the FIFO until the trigger condition is met. Once the trigger
condition is met the DBG module will remain armed until 8 words are stored in the FIFO. If the
core_cof[1] signal becomes asserted, the current address is stored in the FIFO. If the core_cof[0] signal
becomes asserted, the address registered during the previous last cycle is decremented by two and stored
in the FIFO.
18.4.5.3 Storing with End-Trigger
Storing with End-Trigger cannot be used in event-only trigger modes. Once the DBG module is enabled
and armed in the end-trigger mode, data is stored in the FIFO until the trigger condition is met. If the
core_cof[1] signal becomes asserted, the current address is stored in the FIFO. If the core_cof[0] signal
becomes asserted, the address registered during the previous last cycle is decremented by two and stored
in the FIFO. When the trigger condition is met, the ARM and ARMF will be cleared and no more data will
be stored. In non-event only end-trigger modes, if the trigger is at a change of flow address the trigger event
will be stored in the FIFO.
18.4.5.4 Reading Data from FIFO
The data stored in the FIFO can be read using BDM commands provided the DBG module is enabled and
not armed (DBGEN=1 and ARM=0). The FIFO data is read out first-in-first-out. By reading the CNT bits
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
415
Chapter 18 Debug Module (S08DBGV3) (128K)
in the DBGCNT register at the end of a trace run, the number of valid words can be determined. The FIFO
data is read by optionally reading the DBGFX and DBGFH registers followed by the DBGFL register.
Each time the DBGFL register is read the FIFO is shifted to allow reading of the next word however the
count does not decrement. In event-only trigger modes where the FIFO will contain only the data bus
values stored, to read the FIFO only DBGFL needs to be accessed.
The FIFO is normally only read while ARM and ARMF=0, however reading the FIFO while the DBG
module is armed will return the data value in the oldest location of the FIFO and the TBC will not allow
the FIFO to shift. This action could cause a valid entry to be lost because the unexpected read blocked the
FIFO advance.
If the DBG module is not armed and the DBGFL register is read, the TBC will store the current opcode
address. Through periodic reads of the DBGFX, DBGFH, and DBGFL registers while the DBG module
is not armed, host software can provide a histogram of program execution. This is called profile mode.
Since the full 17-bit address and the signal that indicates whether an address is in paged extended memory
are captured on each FIFO store, profile mode works correctly over the entire extended memory map.
18.4.6 Interrupt Priority
When TRGSEL is set and the DBG module is armed to trigger on begin- or end-trigger types, a trigger is
not detected in the condition where a pending interrupt occurs at the same time that a target address reaches
the top of the instruction pipe. In these conditions, the pending interrupt has higher priority and code
execution switches to the interrupt service routine.
When TRGSEL is clear and the DBG module is armed to trigger on end-trigger types, the trigger event is
detected on a program fetch of the target address, even when an interrupt becomes pending on the same
cycle. In these conditions, the pending interrupt has higher priority, the exception is processed by the core
and the interrupt vector is fetched. Code execution is halted before the first instruction of the interrupt
service routine is executed. In this scenario, the DBG module will have cleared ARM without having
recorded the change-of-flow that occurred as part of the interrupt exception. Note that the stack will hold
the return addresses and can be used to reconstruct execution flow in this scenario.
When TRGSEL is clear and the DBG module is armed to trigger on begin-trigger types, the trigger event
is detected on a program fetch of the target address, even when an interrupt becomes pending on the same
cycle. In this scenario, the FIFO captures the change of flow event. Because the system is configured for
begin-trigger, the DBG remains armed and does not break until the FIFO has been filled by subsequent
change of flow events.
18.5 Resets
The DBG module cannot cause an MCU reset.
There are two different ways this module will respond to reset depending upon the conditions before the
reset event. If the DBG module was setup for an end trace run with DBGEN=1 and BEGIN=0, ARM,
ARMF, and BRKEN are cleared but the reset function on most DBG control and status bits is overridden
so a host development system can read out the results of the trace run after the MCU has been reset. In all
other cases including POR, the DBG module controls are initialized to start a begin trace run starting from
when the reset vector is fetched. The conditions for the default begin trace run are:
MC9S08DZ128 Series Data Sheet, Rev. 1
416
Freescale Semiconductor
Chapter 18 Debug Module (S08DBGV3) (128K)
•
DBGCAX=0x00, DBGCAH=0xFF, DBGCAL=0xFE so comparator A is set to match when the
16-bit CPU address 0xFFFE appears during the reset vector fetch
•
•
DBGC=0xC0 to enable and arm the DBG module
DBGT=0x40 to select a force-type trigger, a BEGIN trigger, and A-only trigger mode
18.6 Interrupts
The DBG contains no interrupt source.
18.7 Electrical Specifications
The DBG module contain no electrical specifications.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
417
Chapter 18 Debug Module (S08DBGV3) (128K)
MC9S08DZ128 Series Data Sheet, Rev. 1
418
Freescale Semiconductor
Appendix A
Electrical Characteristics
A.1
Introduction
This section contains the most accurate electrical and timing information for the MC9S08DZ128 Series of
microcontrollers available at the time of publication.
A.2
Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods. To give the
customer a better understanding the following classification is used and the parameters are tagged
accordingly in the tables where appropriate:
Table A-1. Parameter Classifications
P
C
Those parameters are guaranteed during production testing on each individual device.
Those parameters are achieved by the design characterization by measuring a
statistically relevant sample size across process variations.
Those parameters are achieved by design characterization on a small sample size from
typical devices under typical conditions unless otherwise noted. All values shown in
the typical column are within this category.
T
D
Those parameters are derived mainly from simulations.
NOTE
The classification is shown in the column labeled “C” in the parameter
tables where appropriate.
A.3
Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not
guaranteed. Stress beyond the limits specified in Table A-2 may affect device reliability or cause
permanent damage to the device. For functional operating conditions, refer to the remaining tables in this
section.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
419
Appendix A Electrical Characteristics
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for instance, either V or V ).
SS
DD
y
Table A-2. Absolute Maximum Ratings
Num
Rating
Symbol
Value
Unit
1
2
Supply voltage
Input voltage
V
–0.3 to + 5.8
V
V
DD
V
– 0.3 to VDD + 0.3
In
Instantaneous maximum current
Single pin limit (applies to all port pins)1, 2, 3
I
3
25
mA
D
4
5
Maximum current into V
Storage temperature
I
120
mA
DD
DD
T
–55 to +150
°C
stg
1
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp
voltages, then use the larger of the two resistance values.
2
3
All functional non-supply pins are internally clamped to VSS and VDD
.
Power supply must maintain regulation within operating VDD range during instantaneous and operating
maximum current conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection
current may flow out of VDD and could result in external power supply going out of regulation. Ensure
external VDD load will shunt current greater than maximum injection current. This will be the greatest
risk when the MCU is not consuming power. Examples are: if no system clock is present, or if the clock
rate is very low which would reduce overall power consumption.
A.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
P
into account in power calculations, determine the difference between actual pin voltage and V or
I/O
SS
V
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
DD
loads), the difference between pin voltage and V or V will be very small.
SS
DD
MC9S08DZ128 Series Data Sheet, Rev. 1
420
Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-3. Thermal Characteristics
Num
C
Rating
Symbol
Value
Unit
D
Operating temperature range (packaged)
TL to TH
–40 to 85
–40 to 105
–40 to 125
135
P1
TA
1
2
V
°C
M
T
Maximum junction temperature
TJ
Thermal resistance 2,3
Single-layer board
D
100-pin LQFP
64-pin LQFP
48-pin LQFP
61
67
75
3
4
θJA
°C/W
°C/W
Thermal resistance2,3
Four-layer board
100-pin LQFP
64-pin LQFP
48-pin LQFP
48
49
52
D
θJA
1
2
Freescale may eliminate a test insertion at a particular temperature from the production test flow once sufficient
data has been collected and is approved.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
3
Junction to Ambient Natural Convection
The average chip-junction temperature (T ) in °C can be obtained from:
J
T = T + (P × θ
)
Eqn. A-1
J
A
D
JA
where:
T = Ambient temperature, °C
A
θ = Package thermal resistance, junction-to-ambient, °C/W
JA
P = P + P
D
int
I/O
P = I × V , Watts — chip internal power
int
DD
DD
P
= Power dissipation on input and output pins — user determined
I/O
For most applications, P << P and can be neglected. An approximate relationship between P and T
J
I/O
int
D
(if P is neglected) is:
I/O
P = K ÷ (T + 273°C)
Eqn. A-2
Eqn. A-3
D
J
Solving equations 1 and 2 for K gives:
2
K = P × (T + 273°C) + θ × (P )
D
A
JA
D
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
421
Appendix A Electrical Characteristics
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
P (at equilibrium) for a known T . Using this value of K, the values of P and T can be obtained by
D
A
D
J
solving equations 1 and 2 iteratively for any value of T .
A
A.5
ESD Protection and Latch-Up Immunity
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with AEC-Q100 Stress Test Qualification for Automotive Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM) and the Charge Device Model (CDM).
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Table A-4. ESD and Latch-up Test Conditions
Model
Description
Symbol
Value
Unit
Ω
Series Resistance
R1
1500
Human Body
Storage Capacitance
C
100
3
pF
Number of Pulse per pin
Minimum input voltage limit
Maximum input voltage limit
—
—
—
–2.5
7.5
V
V
Latch-up
Table A-5. ESD and Latch-Up Protection Characteristics
1
Num
Symbol
VHBM
VCDM
ILAT
Min
2ꢀꢀꢀ
500
100
Max
Unit
V
Rating
1
2
3
Human Body Model (HBM)
–
–
–
Charge Device Model (CDM)
V
Latch-up Current at TA = 125°C
mA
1
Parameter is achieved by design characterization on a small sample size from typical devices under typical
conditions unless otherwise noted.
MC9S08DZ128 Series Data Sheet, Rev. 1
422
Freescale Semiconductor
Appendix A Electrical Characteristics
A.6
DC Characteristics
This section includes information about power supply requirements, I/O pin characteristics, and power
supply current in various operating modes.
Table A-6. DC Characteristics
Num C
Characteristic
Symbol
Condition
Min
Typ1
Max
Unit
1
2
— Operating voltage
VDD
—
2.7
—
—
—
—
—
—
—
5.5
—
—
—
—
—
—
V
C
All I/O pins,
5 V, ILoad = –4 mA
5 V, ILoad = –2 mA
3 V, ILoad = –1 mA
5 V, ILoad = –20 mA
5 V, ILoad = –10 mA
3 V, ILoad = –5 mA
VOUT < VDD
VDD – 1.5
VDD – 0.8
VDD – 0.8
VDD – 1.5
VDD – 0.8
VDD – 0.8
P
low-drive strength
C Output high
VOH
V
C voltage
P
C
All I/O pins,
high-drive strength
Output high
current
Max total IOH for
all ports
3
4
D
IOHT
0
—
–100
mA
V
C
All I/O pins
5 V, ILoad = 4 mA
5 V, ILoad = 2 mA
3 V, ILoad = 1 mA
5 V, ILoad = 20 mA
5 V, ILoad = 10 mA
3 V, ILoad = 5 mA
VOUT > VSS
—
—
—
—
—
—
—
—
—
—
—
—
1.5
0.8
0.8
1.5
0.8
0.8
P
low-drive strength
C Output low
VOL
C voltage
P
C
All I/O pins
high-drive strength
Output low
current
Max total IOL for all ports
5
6
C
IOLT
VIH
0
—
100
mA
V
P Input high voltage; all digital inputs
5V
3V
5V
3V
0.65 x VDD
0.7 x VDD
—
—
—
—
—
—
C
—
P Input low voltage; all digital inputs
C
VIL
0.35 x VDD
0.35 x VDD
V
7
—
8
9
C Input hysteresis
Vhys
0.06 x VDD
—
V
P Input leakage current (per pin)
|IIn|
VIn = VDD or VSS
0.1
1
μA
P
Hi-Z (off-state) leakage current (per pin)
10
input/output port pins |IOZ|
VIn = VDD or VSS
,
—
—
0.1
0.2
1
2
μA
μA
PTG1/XTAL/PTE1/
VIn = VDD or VSS
Pullup or Pulldown2 resistors; when
enabled
11
P
C
I/O pins RPU,RPD
PTE1/3
RPU
17
17
37
37
52
52
kΩ
kΩ
D DC injection current 4, 5, 6, 7
Single pin limit
VIN > VDD
VIN < VSS
VIN > VDD
VIN < VSS
0
0
—
—
—
—
—
2
–0.2
25
–5
8
mA
mA
mA
mA
pF
12
IIC
,
Total MCU limit, includes
sum of all stressed pins
0
,
0
13 D Input Capacitance, all pins
Freescale Semiconductor
CIn
—
MC9S08DZ128 Series Data Sheet, Rev. 1
423
Appendix A Electrical Characteristics
Table A-6. DC Characteristics (continued)
Num C
Characteristic
Symbol
Condition
Min
Typ1
Max
Unit
14 D RAM retention voltage
15 D POR re-arm voltage8
16 D POR re-arm time9
VRAM
VPOR
tPOR
—
0.9
10
0.6
1.4
—
1.0
2.0
—
V
V
μs
P Low-voltage detection threshold —
high range
VLVD1
VLVD0
VLVW3
VLVW2
VLVW1
VLVW0
17
V
V
DD falling
DD rising
3.9
4.0
4.0
4.1
4.1
4.2
V
V
V
V
V
V
P Low-voltage detection threshold —
low range
18
19
20
21
22
V
V
DD falling
DD rising
2.48
2.54
2.56
2.62
2.64
2.70
P Low-voltage warning threshold —
high range 1
.
VDD falling
DD rising
4.5
4.6
4.6
4.7
4.7
4.8
V
P Low-voltage warning threshold —
high range 0
VDD falling
V
4.2
4.3
4.3
4.4
4.4
4.5
DD rising
P Low-voltage warning threshold
low range 1
VDD falling
V
2.84
2.90
2.92
2.98
3.00
3.06
DD rising
P Low-voltage warning threshold —
low range 0
VDD falling
DD rising
2.66
2.72
2.74
2.80
2.82
2.88
V
T
P
Low-voltage inhibit reset/recover
hysteresis
Vlvihys
5 V
3 V
—
—
100
60
—
—
23
24
mV
V
Bandgap Voltage Reference10
VBG
1.19
1.20
1.21
1
2
3
Typical values are measured at 25°C. Characterized, not tested.
When a pin interrupt is configured to detect rising edges, pulldown resistors are used in place of pullup resistors.
The specified resistor value is the actual value internal to the device. The pullup value may measure higher when measured
externally on the pin.
4
Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current
conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection current may flow out of VDD and could result
in external power supply going out of regulation. Ensure external VDD load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock is present, or if
clock rate is very low (which would reduce overall power consumption).
5
6
All functional non-supply pins are internally clamped to VSS and VDD
.
Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate
resistance values for positive and negative clamp voltages, then use the larger of the two values.
7
8
9
The PTE1 pin does not have a clamp diode to VDD. Do not drive this pin above VDD
.
Maximum is highest voltage that POR will occur.
Simulated, not tested
10 Factory trimmed at VDD = 5.0 V, Temp = 25°C
MC9S08DZ128 Series Data Sheet, Rev. 1
424
Freescale Semiconductor
Appendix A Electrical Characteristics
2
1.5
1
1.0
0.8
0.6
0.4
0.2
0
125˚C
25˚C
125˚C
25˚C
–40˚C
Max 0.8V@5mA
Max 1.5V@25mA
–40˚C
0.5
0
0
5
10
I
15
(mA)
20
25
0
2
4
I
6
8
10
2.0
425
(mA)
OL
OL
a) V = 5V, High Drive
b) V = 3V, High Drive
DD
DD
Figure A-1. Typical V vs I , High Drive Strength
OL
OL
2
1.5
1
1.0
0.8
0.6
0.4
0.2
0
125˚C
25˚C
–40˚C
125˚C
25˚C
–40˚C
Max 0.8V@1mA
Max 1.5V@4mA
0.5
0
0
1
2
3
4
5
0
0.4
0.8
1.2
(mA)
1.6
I
(mA)
I
OL
OL
a) V = 5V, Low Drive
b) V = 3V, Low Drive
DD
DD
Figure A-2. Typical V vs I , Low Drive Strength
OL
OL
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
Appendix A Electrical Characteristics
2
1.0
0.8
0.6
0.4
0.2
0
125˚C
25˚C
125˚C
Max 0.8V@5mA
Max 1.5V@20mA
25˚C
–40˚C
–40˚C
1.5
1
0.5
0
0
–5
–10
–15
(mA)
–20
–25
0
–2
–4
–6
(mA)
–8
–10
I
I
OH
OH
a) V = 5V, High Drive
b) V = 3V, High Drive
DD
DD
Figure A-3. Typical V – V vs I , High Drive Strength
DD
OH
OH
2
1.5
1
1.0
0.8
0.6
0.4
0.2
0
125˚C
25˚C
125˚C
25˚C
Max 0.8V@1mA
Max 1.5V@4mA
–40˚C
–40˚C
0.5
0
0
–1
–2
I
–3
(mA)
–4
–5
0
–0.4
–0.8
–1.2
(mA)
–1.6
–2.0
I
OH
OH
a) V = 5V, Low Drive
b) V = 3V, Low Drive
DD
DD
Figure A-4. Typical V – V vs I , Low Drive Strength
DD
OH
OH
MC9S08DZ128 Series Data Sheet, Rev. 1
426
Freescale Semiconductor
Appendix A Electrical Characteristics
A.7
Supply Current Characteristics
This section includes information about power supply current in various operating modes.
Table A-7. Supply Current Characteristics
VDD
Typ1
Max2
Num
C
Parameter
Symbol
Unit
(V)
5
34
Run supply current3 measured at
(CPU clock = 2 MHz, fBus = 1 MHz)
C
C
2.1
2.0
1
RIDD
mA
4.6
3
2.5
94
8.7
24
23
Run supply current3 measured at
(CPU clock = 16 MHz, fBus = 8 MHz)
C
C
P
5
3
5
3
8.4
8.3
2
3
RIDD
RIDD
Run supply current4 measured at
(CPU clock = 40 MHz, fBus = 20MHz)
17.9
17.8
mA
C
Stop3 mode supply current
–40°C (C,V, & M suffix)
25°C (All parts)
C
P
0.7
1.1
—
—
P5
P5
85°C (C suffix only)
5
3
14.8
18.5
μA
105°C (V suffix only)
125°C (M suffix only)
38.8
172
49
P5
C
257
4
S3IDD
–40°C (C,V, & M suffix)
25°C (All parts)
0.34
0.79
12.7
—
—
15
P
P5
P5
P5
85°C (C suffix only)
μA
105°C (V suffix only)
125°C (M suffix only)
33.6
159
42.4
208
Stop2 mode supply current
–40°C (C,M, & V suffix)
25°C (All parts)
C
P
0.65
0.94
11.3
—
—
14
P5
P5
85°C (C suffix only)
5
3
μA
μA
105°C (V suffix only)
125°C (M suffix only)
29.7
140
37.4
220
P5
C
5
S2IDD
–40°C (C,M, & V suffix)
25°C (All parts)
0.33
0.69
9.4
—
—
P
P5
P5
85°C (C suffix only)
11.6
105°C (V suffix only)
125°C (M suffix only)
25
95
31.3
155
P5
P
6
7
RTC adder to stop2 or stop36
5
3
5
3
300
300
110
90
500
500
180
160
nA
nA
μA
μA
S23IDDRTI
P
P
LVD adder to stop3 (LVDE = LVDSE = 1)
S3IDDLVD
P
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
427
Appendix A Electrical Characteristics
Table A-7. Supply Current Characteristics (continued)
VDD
Typ1
Max2
Num
C
Parameter
Symbol
Unit
(V)
8
P
P
Adder to stop3 for oscillator enabled7
(EREFSTEN =1)
5
5
5
8
8
S3IDDOSC
μA
3
1
2
Typical are measured at 25°C. See Figure A-8 through Figure A-10 for typical curves across
voltage/temperature.
Max values in this column apply for the full operating temperature range of the device unless otherwise
noted.
3
4
5
All modules except ADC active, ICS configured for FBE, and does not include any dc loads on port pins
All modules except ADC active, ICS configured for FEI, and does not include any dc loads on port pins
Stop currents are tested in production for 25°C on all parts. Tests at other temperatures depend upon the
part number suffix and maturity of the product. Freescale may eliminate a test insertion at a particular
temperature from the production test flow once sufficient data has been collected and approved.
6
7
Most customers are expected to find that auto-wakeup from stop2 or stop3 can be used instead of the
higher current wait mode.
Values given under the following conditions: low range operation (RANGE = 0) with a 32.768kHz crystal
and low power mode (HGO = 0).
18
PEI or FEI (mid range DCO)
16
FEI (low range DCO)
FBE
14
12
10
8
6
4
2
0
20
0 1
2
4
8
16
f
(MHz)
bus
Figure A-5. Typical Run I vs. Bus Frequency (V = 5V)
DD
DD
MC9S08DZ128 Series Data Sheet, Rev. 1
428
Freescale Semiconductor
Appendix A Electrical Characteristics
20
18
16
14
12
10
8
f
= 20MHz
= 8MHz
bus
f
bus
6
4
2
0
125
–40
0
25
Temperature (˚C
85
105
)
Figure A-6. Typical Run IDD vs. Temperature (VDD = 5V)
150
140
130
120
110
100
90
STOP2
STOP3
80
70
60
50
40
30
20
10
0
125
–40
0
25
85
105
Temperature (˚C
)
Figure A-7. Typical Stop I vs. Temperature (V = 5V)
DD
DD
A.8
Analog Comparator (ACMP) Electricals
Table A-8. Analog Comparator Electrical Specifications
Num
C
Rating
Symbol
Min
Typical
Max
Unit
VDD
1
—
Supply voltage
2.7
—
5.5
V
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
429
Appendix A Electrical Characteristics
Table A-8. Analog Comparator Electrical Specifications
Num
C
Rating
Supply current (active)
Symbol
Min
Typical
Max
Unit
IDDAC
2
3
4
5
D
D
D
D
—
20
—
35
VDD
40
μA
V
Analog input voltage
VAIN
VAIO
VH
VSS – 0.3
Analog input offset voltage
Analog Comparator hysteresis
20
6.0
mV
mV
3.0
--
20.0
IALKG
tAINIT
6
7
D
D
Analog input leakage current
--
1.0
1.0
μA
μs
Analog Comparator initialization delay
—
—
MC9S08DZ128 Series Data Sheet, Rev. 1
430
Freescale Semiconductor
Appendix A Electrical Characteristics
A.9
ADC Characteristics
Table A-9. 5 Volt 12-bit ADC Operating Conditions
Characteristic
Supply voltage
Conditions
Symb
Min
Typ1
Max
Unit
Comment
Absolute
Delta to VDD (VDD-VDDA
VDDA
ΔVDDA
ΔVSSA
VREFH
2.7
-100
-100
2.7
—
0
5.5
V
mV
mV
V
2
)
+100
+100
VDDA
2
Ground voltage Delta to VSS (VSS-VSSA
)
0
Ref Voltage
High
VDDA
• Applicable only
in 100-pin and
64-pin
packages.
Ref Voltage
Low
VREFL
VSSA
VSSA
VSSA
V
• Applicable only
in 100-pin and
64-pin
packages.
Input Voltage
VADIN
CADIN
VREFL
—
—
VREFH
5.5
V
Input
4.5
pF
Capacitance
Input
Resistance
RADIN
—
3
5
kΩ
kΩ
Analog Source
Resistance
12 bit mode
RAS
External to MCU
f
ADCK > 4MHz
ADCK < 4MHz
—
—
—
—
2
5
f
10 bit mode
fADCK > 4MHz
ADCK < 4MHz
—
—
—
—
5
10
f
8 bit mode (all valid fADCK
High Speed (ADLPC=0)
Low Power (ADLPC=1)
)
—
—
—
—
10
8.0
4.0
ADC
Conversion
Clock Freq.
fADCK
0.4
0.4
MHz
1
2
Typical values assume VDDAD = 5.0V, Temp = 25C, fADCK=1.0MHz unless otherwise stated. Typical values are for reference
only and are not tested in production.
DC potential difference.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
431
Appendix A Electrical Characteristics
SIMPLIFIED
INPUT PIN EQUIVALENT
CIRCUIT
Z
ADIN
SIMPLIFIED
CHANNEL SELECT
CIRCUIT
Pad
Z
AS
leakage
due to
input
ADC SAR
ENGINE
R
R
AS
ADIN
protection
+
V
ADIN
–
C
AS
V
+
AS
–
R
ADIN
INPUT PIN
INPUT PIN
INPUT PIN
R
ADIN
R
ADIN
C
ADIN
Figure A-8. ADC Input Impedance Equivalency Diagram
MC9S08DZ128 Series Data Sheet, Rev. 1
432
Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-10. 5 Volt 12-bit ADC Characteristics (V
= V
, V
= V
)
SSA
REFH
DDA
REFL
Characteristic
Conditions
C
Symb
Min
Typ1
Max
Unit
Comment
Supply Current
ADLPC=1
ADLSMP=1
ADCO=1
IDDAD
—
133
—
μA
T
Supply Current
ADLPC=1
ADLSMP=0
ADCO=1
IDDAD
IDDAD
IDDAD
—
—
—
218
327
—
—
1
μA
μA
T
T
T
Supply Current
ADLPC=0
ADLSMP=1
ADCO=1
Supply Current
ADLPC=0
ADLSMP=0
ADCO=1
0.582
mA
Supply Current
Stop, Reset, Module Off
High Speed (ADLPC=0)
Low Power (ADLPC=1)
T
IDDAD
—
2
0.011
3.3
2
1
5
μA
ADC
Asynchronous
Clock Source
fADACK
MHz
tADACK =
1/fADACK
D
1.25
3.3
Conversion
Time(Including
sample time)
Short Sample (ADLSMP=0)
Long Sample (ADLSMP=1)
tADC
—
—
20
40
—
—
ADCK
cycles
See the ADC
Chapter for
conversion
D
D
time variances
Sample Time
Short Sample (ADLSMP=0)
Long Sample (ADLSMP=1)
12 bit mode
tADS
—
—
—
—
—
—
—
—
—
—
—
—
—
—
3.5
23.5
3.0
1
—
ADCK
cycles
—
Total
Unadjusted
Error
T
P
T
T
P
T
T
P
T
C
P
T
ETUE
10
LSB2
LSB2
LSB2
LSB2
Includes
quantization
10 bit mode
2.5
1.0
4.0
1.0
0.5
4.0
1.0
0.5
6.0
1.5
0.5
8 bit mode
0.5
1.75
0.5
0.3
1.5
0.5
0.3
1.5
0.5
0.5
Differential
Non-Linearity
12 bit mode
DNL
INL
10 bit mode3
8 bit mode3
Integral
Non-Linearity
12 bit mode
10 bit mode
8 bit mode
Zero-Scale
Error
12 bit mode
EZS
VADIN = VSSAD
10 bit mode
8 bit mode
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
433
Appendix A Electrical Characteristics
Table A-10. 5 Volt 12-bit ADC Characteristics (V
= V
, V
= V
) (continued)
SSA
REFH
DDA
REFL
Characteristic
Conditions
C
Symb
Min
Typ1
Max
Unit
Comment
Full-Scale Error 12 bit mode
10 bit mode
T
T
T
D
EFS
—
—
—
—
—
—
—
—
—
—
—
—
1
0.5
4.0
1
LSB2
VADIN = VDDAD
8 bit mode
0.5
0.5
-1 to 0
0.5
0.5
10.0
2.5
1
Quantization
Error
12 bit mode
10 bit mode
8 bit mode
12 bit mode
10 bit mode
8 bit mode
-40°C– 25°C
25°C– 125°C
25°C
EQ
-1 to 0
—
LSB2
LSB2
—
Input Leakage
Error
D
EIL
1
Padleakage4 *
RAS
0.2
0.1
Temp Sensor
Slope
D
D
m
3.266
3.638
1.396
—
mV/°C
—
Temp Sensor
Voltage
VTEMP25
—
V
1
Typical values assume VDDAD = 5.0V, Temp = 25C, fADCK=1.0MHz unless otherwise stated. Typical values are for reference
only and are not tested in production.
2
3
4
1 LSB = (VREFH - VREFL)/2N
Monotonicity and No-Missing-Codes guaranteed in 10 bit and 8 bit modes
Based on input pad leakage current. Refer to pad electricals.
MC9S08DZ128 Series Data Sheet, Rev. 1
434
Freescale Semiconductor
Appendix A Electrical Characteristics
A.10 External Oscillator (XOSC) Characteristics
Table A-11. Oscillator Electrical Specifications (Temperature Range = –40 to 125°C Ambient)
Num
C
Rating
Symbol
Min
Typ1
Max
Unit
Oscillator crystal or resonator (EREFS = 1, ERCLKEN = 1)
Low range (RANGE = 0)
flo
32
1
—
—
—
—
—
38.4
5
kHz
MHz
MHz
MHz
MHz
High range (RANGE = 1) FEE or FBE mode 2
fhi-fll
1
C
High range (RANGE = 1) PEE or PBE mode 3
High range (RANGE = 1, HGO = 1) BLPE mode
High range (RANGE = 1, HGO = 0) BLPE mode
fhi-pll
fhi-hgo
fhi-lp
1
16
16
8
1
1
C1
C2
See crystal or resonator
manufacturer’s recommendation.
2
3
–
–
Load capacitors
Feedback resistor
RF
—
—
10
1
—
—
MΩ
MΩ
Low range (32 kHz to 38.4 kHz)
High range (1 MHz to 16 MHz)
Series resistor
Low range, low gain (RANGE = 0, HGO = 0)
Low range, high gain (RANGE = 0, HGO = 1)
High range, low gain (RANGE = 1, HGO = 0)
—
—
—
0
100
0
—
—
—
RS
4
kΩ
–
High range, high gain (RANGE = 1, HGO = 1)
≥ 8 MHz
4 MHz
1 MHz
—
—
—
0
0
0
0
10
20
Crystal start-up time 4
t
Low range, low gain (RANGE = 0, HGO = 0)
—
—
—
—
200
400
5
—
—
—
—
CSTL-LP
t
Low range, high gain (RANGE = 0, HGO = 1)
High range, low gain (RANGE = 1, HGO = 0) 5
5
6
T
T
ms
CSTL-HGO
t
CSTH-LP
t
High range, high gain (RANGE = 1, HGO = 1) 5
20
CSTH-HGO
Square wave input clock frequency (EREFS = 0, ERCLKEN = 1)
FEE or FBE mode 2
0.03125
—
—
—
5
fextal
MHz
PEE or PBE mode 3
BLPE mode
1
0
16
40
1
2
Data in Typical column was characterized at 3.0 V, 25°C or is typical recommended value.
When MCG is configured for FEE or FBE mode, input clock source must be divisible using RDIV to within the range of 31.25
kHz to 39.0625 kHz.
3
4
When MCG is configured for PEE or PBE mode, input clock source must be divisible using RDIV to within the range of 1 MHz
to 2 MHz.
This parameter is characterized and not tested on each device. Proper PC board layout procedures must be followed to achieve
specifications. This data varies based on crystal manufacturer and board design. The crystal should be characterized by the
crystal manufacturer.
5
4 MHz crystal
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
435
Appendix A Electrical Characteristics
MCU
EXTAL
XTAL
RS
R
F
C
1
Crystal or Resonator
C
2
A.11 MCG Specifications
Table A-12. MCG Frequency Specifications (Temperature Range = –40 to 125°C Ambient)
Num C
Rating
Symbol
Min
Typical
Max
Unit
Internal reference frequency - factory trimmed at
fint_ft
1
P VDD=5.0V and temperature=25C
—
31.25
—
kHz
Internal reference frequency - untrimmed 1
P
fint_ut
fint_t
2
3
4
25
31.25
—
36
—
55
41.66
39.0625
100
kHz
kHz
us
P Internal reference frequency - user trimmed
D Internal reference startup time
tirefst
Low range (DRS=0,
DMX32=0)
—
—
P
12.8
25.6
16
18.43
36.86
—
21.33
42.66
20
f
dco_ut = 512X fint_ut
DCO output frequency range -
untrimmed 1
fdco_ut
5
6
MHz
MHz
Mid range (DRS=1,
DMX32=0)
f
dco_ut = 1024 X fint_ut
Low range (DRS=0,
DMX32=0)
f
dco_ut = 512X fint_ut
DCO output frequency range -
trimmed2
fdco_t
Mid range (DRS=1,
DMX32=0)
P
32
—
40
fdco_ut = 1024 X fint_ut
Resolution of trimmed DCO output frequency at fixed
voltage and temperature (using FTRIM)
Δfdco_res_t
Δfdco_res_t
Δfdco_t
%fdco
%fdco
%fdco
%fdco
7
8
C
C
P
C
—
—
—
—
0.1
0.2
0.2
0.4
2
Resolution of trimmed DCO output frequency at fixed
voltage and temperature (not using FTRIM)
Total deviation of trimmed DCO output frequency over
voltage and temperature
+ 0.5
-1.0
9
Total deviation of trimmed DCO output frequency over
fixed voltage and temperature range of 0 - 70 °C
Δfdco_t
10
0.5
1
FLL acquisition time 3
tfll_acquire
tpll_acquire
11
12
C
D
—
—
—
—
1
1
ms
ms
PLL acquisition time 4
Long term Jitter of DCO output clock (averaged over 2mS
interval) 5
CJitter
fvco
%fdco
MHz
13
C
—
0.02
—
0.2
14 D VCO operating frequency
7.0
55.0
MC9S08DZ128 Series Data Sheet, Rev. 1
436
Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-12. MCG Frequency Specifications (Temperature Range = –40 to 125°C Ambient) (continued)
Num C
Rating
Symbol
Min
Typical
Max
Unit
fpll_ref
15 D PLL reference frequency range
1.0
—
2.0
MHz
RMS frequency variation of a single clock cycle measured
2 ms after reference edge.6
0.5905
0.001
fpll_cycjit_2ms
fpll_maxjit_2ms
fpll_cycjit_625ns
fpll_maxjit_625ns
%fpll
%fpll
%fpll
%fpll
16
17
18
19
T
T
T
T
—
—
—
—
—
—
—
—
Maximum frequency variation averaged over 2 ms
window.
RMS frequency variation of a single clock cycle measured
625 ns after reference edge.7
0.5665
0.113
Maximum frequency variation averaged over 625 ns
window.
Lock entry frequency tolerance 8
Lock exit frequency tolerance 9
Dlock
Dunl
20
21
D
D
1.49
4.47
—
—
2.98
5.97
%
%
tfll_acquire+
1075(1/fint_t)
tfll_lock
22 D Lock time - FLL
—
—
s
1
2
3
This applies when TRIM register at value (0x80) and FTRIM control bit at value (0x0). These values load when in BDM modes.
The resulting bus clock frequency should not exceed the maximum specified bus clock frequency of the device.
This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed, DMX32 bit
is changed, DRS bit is changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI). If a
crystal/resonator is being used as the reference, this specification assumes it is already running.
4
5
This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled (BLPE,
BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes it is already
running.
Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum fBUS
.
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise injected
into the FLL circuitry via VDD and VSS and variation in crystal oscillator frequency increase the CJitter percentage for a given interval.
These jitter measurements are based upon a 40 MHz MCGOUT clock frequency.
6
7
8
In some specifications, this value is described as, “Long term accuracy of PLL output clock (averaged over 2 ms)” with symbol
“fpll_jitter_2ms.” The parameter is unchanged, but the description has been changed for clarification purposes.
In some specifications, this value is described as “Jitter of PLL output clock measured over 625 ns” with symbol “fpll_jitter_625ns.”
The parameter is unchanged, but the description has been changed for clarification purposes.
Below Dlock minimum, the MCG is guaranteed to enter lock. Above Dlock maximum, the MCG will not enter lock. But if the MCG is
already in lock, then the MCG may stay in lock.
9
Below Dunl minimum, the MCG will not exit lock if already in lock. Above Dunl maximum, the MCG is guaranteed to exit lock.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
437
Appendix A Electrical Characteristics
+2%
+1%
0
–1%
–2%
125
–40
0
25
85
105
Temperature (˚C
)
1
Figure A-9. Typical Frequency Deviation vs Temperature (ICS Trimmed to 16MHz bus@25˚C, 5V, FEI)
A.12 AC Characteristics
This section describes ac timing characteristics for each peripheral system.
A.12.1 Control Timing
Table A-13. Control Timing
Num
C
D
D
D
D
D
D
Rating
Symbol
fBus
Min
Typical1
Max
20
Unit
MHz
μs
Bus frequency (tcyc = 1/fBus
)
Internal low-power oscillator period
External reset pulse width2
1
2
3
4
5
6
dc
800
—
tLPO
1500
—
textrst
trstdrv
tMSSU
tMSH
100
ns
Reset low drive3
34 x tcyc
—
ns
Active background debug mode latch setup time
Active background debug mode latch hold time
500
100
—
ns
—
ns
IRQ/PIAx/ PIBx/PIDx/PIJx pulse width
Asynchronous path2
7
8
D
C
tILIH, IHIL
t
100
1.5 tcyc
—
—
ns
ns
Synchronous path3
Port rise and fall time (load = 50 pF)4
Slew rate control disabled tRise, tFall
Slew rate control enabled
—
—
3
30
1
2
Typical data was characterized at 5.0 V, 25°C unless otherwise stated.
This is the shortest pulse that is guaranteed to be recognized as a RESET pin or pin interrupt request. Shorter pulses are not
guaranteed to override reset requests from internal sources.
1. Based on the average of several hundred units from a typical characterization lot.
MC9S08DZ128 Series Data Sheet, Rev. 1
438
Freescale Semiconductor
Appendix A Electrical Characteristics
3
4
When any reset is initiated, internal circuitry drives the RESET pin low for about 34 cycles of fsys. After POR reset, the bus
clock frequency changes to the untrimmed DCO frequency (freset = (fdco_ut)/4) because TRIM is reset to 0x80, FTRIM is reset
to 0, and there is an extra divide-by-two because BDIV is reset to 0:1. After other resets, trim stays at the pre-reset value.
Timing is shown with respect to 20% VDD and 80% VDD levels. Temperature range –40°C to 125°C.
t
extrst
RESET PIN
Figure A-10. Reset Timing
BKGD/MS
RESET
t
MSH
t
MSSU
Figure A-11. Active Background Debug Mode Latch Timing
t
IHIL
PIAx/PIBx/PIDx/PIJx
Q/PIAx/PIBx/PIDx/PIJx
t
ILIH
Figure A-12. Pin Interrupt Timing
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
439
Appendix A Electrical Characteristics
A.12.2 Timer/PWM
Synchronizer circuits determine the shortest input pulses that can be recognized or the fastest clock that
can be used as the optional external source to the timer counter. These synchronizers operate from the
current bus rate clock.
Table A-14. TPM Input Timing
Num
C
—
—
D
Rating
External clock frequency
External clock period
Symbol
fTPMext
tTPMext
tclkh
Min
dc
Max
fBus/4
—
Unit
1
2
3
4
5
MHz
tcyc
tcyc
tcyc
tcyc
4
External clock high time
External clock low time
Input capture pulse width
1.5
1.5
1.5
—
tclkl
D
—
tICPW
D
—
t
Text
t
clkh
TPMxCHn
t
clkl
Figure A-13. Timer External Clock
t
ICPW
TPMxCHn
TPMxCHn
t
ICPW
Figure A-14. Timer Input Capture Pulse
MC9S08DZ128 Series Data Sheet, Rev. 1
440
Freescale Semiconductor
Appendix A Electrical Characteristics
A.12.3 MSCAN
Table A-15. MSCAN Wake-up Pulse Characteristics
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
D MSCAN Wake-up dominant pulse filtered
D MSCAN Wake-up dominant pulse pass
tWUP
tWUP
—
5
—
—
2
μs
μs
—
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
441
Appendix A Electrical Characteristics
A.12.4 SPI
Table A-16 and Figure A-15 through Figure A-18 describe the timing requirements for the SPI system.
Table A-16. SPI Electrical Characteristic
Num1
C
Rating2
Symbol
Min
Max
Unit
Cycle time
Master
Slave
2
2.5
2048
—
tcyc
tcyc
1
D
tSCK
tSCK
Enable lead time
Enable lag time
Master
Slave
—
1/2
2
3
D
D
t
t
1/2
—
t
t
Lead
Lead
SCK
SCK
Master
Slave
—
1/2
t
t
1/2
—
t
t
Lag
Lag
SCK
SCK
Clock (SPSCK) high time
Master and Slave
4
5
D
D
1/2 tSCK – 25
1/2 tSCK – 25
—
—
ns
ns
t
SCKH
Clock (SPSCK) low time Master
and Slave
t
SCKL
Data setup time (inputs)
Master
Slave
30
30
—
—
ns
ns
6
7
D
D
t
t
SI(M)
SI(S)
Data hold time (inputs)
Master
Slave
30
30
—
—
ns
ns
t
HI(M)
t
HI(S)
Access time, slave3
Disable time, slave4
0
40
40
ns
ns
8
9
D
D
t
A
—
t
dis
Data setup time (outputs)
Master
Slave
25
25
—
—
ns
ns
10
11
12
D
D
D
t
t
SO
SO
Data hold time (outputs)
Master
Slave
–10
–10
—
—
ns
ns
t
t
HO
HO
Operating Frequency5
Master
Slave
fBus/2048
DC
fBus/2
Bus/4
Hz
f
f
op
f
op
1
2
Refer to Figure A-15 through Figure A-18.
All timing is shown with respect to 20% V
and 70% V , unless noted; 100 pF load on all SPI
DD
DD
pins. All timing assumes slew rate control disabled and high drive strength enabled for SPI output
pins.
3
4
5
Time to data active from high-impedance state.
Hold time to high-impedance state.
Maximum baud rate must be limited to 5 MHz due to input filter characteristics.
MC9S08DZ128 Series Data Sheet, Rev. 1
442
Freescale Semiconductor
Appendix A Electrical Characteristics
1
SS
(OUTPUT)
1
2
3
SCK
(CPOL = 0)
(OUTPUT)
5
4
4
5
SCK
(CPOL = 1)
(OUTPUT)
6
7
MISO
(INPUT)
2
MSB IN
BIT 6 . . . 1
LSB IN
10
10
11
MOSI
(OUTPUT)
2
BIT 6 . . . 1
LSB OUT
MSB OUT
NOTES:
1. SS output mode (MODFEN = 1, SSOE = 1).
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure A-15. SPI Master Timing (CPHA = 0)
(1)
SS
(OUTPUT)
1
2
3
SCK
(CPOL = 0)
(OUTPUT)
5
4
SCK
(CPOL = 1)
5
4
(OUTPUT)
6
7
MISO
(INPUT)
(2)
MSB IN
BIT 6 . . . 1
11
BIT 6 . . . 1
LSB IN
10
MOSI
(OUTPUT)
(2)
LSB OUT
MSB OUT
NOTES:
1. SS output mode (MODFEN = 1, SSOE = 1).
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure A-16. SPI Master Timing (CPHA = 1)
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
443
Appendix A Electrical Characteristics
SS
(INPUT)
3
1
SCK
5
4
(CPOL = 0)
4
5
(INPUT)
2
SCK
(CPOL = 1)
(INPUT)
9
8
11
10
MISO
(OUTPUT)
SEE
NOTE
BIT 6 . . . 1
BIT 6 . . . 1
SLAVE LSB OUT
MSB OUT
7
SLAVE
6
MOSI
(INPUT)
MSB IN
LSB IN
NOTE:
1. Not defined but normally MSB of character just received
Figure A-17. SPI Slave Timing (CPHA = 0)
SS
(INPUT)
1
3
2
SCK
(CPOL = 0)
(INPUT)
5
4
SCK
(CPOL = 1)
5
4
(INPUT)
10
11
9
MISO
(OUTPUT)
SEE
BIT 6 . . . 1
SLAVE LSB OUT
LSB IN
SLAVE MSB OUT
NOTE
6
7
8
MOSI
(INPUT)
MSB IN
BIT 6 . . . 1
NOTE:
1. Not defined but normally LSB of character just received
Figure A-18. SPI Slave Timing (CPHA = 1)
MC9S08DZ128 Series Data Sheet, Rev. 1
444
Freescale Semiconductor
Appendix A Electrical Characteristics
A.13 FLASH and EEPROM
This section provides details about program/erase times and program-erase endurance for the FLASH and
EEPROM memory.
Program and erase operations do not require any special power sources other than the normal V supply.
DD
For more detailed information about program/erase operations, see Chapter 4, “Memory.”
NOTE
All values shown in Table A-17 are preliminary and subject to further
characterization.
Table A-17. FLASH and EEPROM Characteristics
Num
C
Rating
Symbol
Vprog/erase
VRead
fFCLK
Min
2.7
2.7
150
5
Typical
Max
5.5
Unit
1
2
3
4
5
6
7
8
—
—
—
—
—
—
—
—
Supply voltage for program/erase
Supply voltage for read operation
V
5.5
V
Internal FCLK frequency1
200
6.67
kHz
μs
tFcyc
Internal FCLK period (1/FCLK)
Byte program time (random location)(2)
Byte program time (burst mode)(2)
Page erase time2
tprog
tFcyc
tFcyc
tFcyc
tFcyc
9
4
tBurst
tPage
4000
20,000
Mass erase time(2)
tMass
FLASH Program/erase endurance3
TL to TH = –40°C to + 125°C
nFLPE
9
C
10,000
—
—
cycles
100,000
T = 25°C
EEPROM Program/erase endurance3
TL to TH = –40°C to + 0°C
TL to TH = 0°C to + 125°C
T = 25°C
10,000
50,000
—
—
—
10
11
C
C
nEEPE
cycles
years
300,000
100
Data retention4
tD_ret
15
—
1
2
The frequency of this clock is controlled by a software setting.
These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for
calculating approximate time to program and erase.
3
4
Typical endurance for FLASH and EEPROM is based on the intrinsic bitcell performance. For additional information on how
Freescale Semiconductor defines typical endurance, please refer to Engineering Bulletin EB619, Typical Endurance for
Nonvolatile Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated
to 25°C using the Arrhenius equation. For additional information on how Freescale Semiconductor defines typical data
retention, please refer to Engineering Bulletin EB618, Typical Data Retention for Nonvolatile Memory.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
445
Appendix A Electrical Characteristics
A.14 EMC Performance
Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the
MCU resides. Board design and layout, circuit topology choices, location and characteristics of external
components as well as MCU software operation all play a significant role in EMC performance. The
system designer should consult Freescale applications notes such as AN2321, AN1050, AN1263,
AN2764, and AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
A.14.1 Radiated Emissions
Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell
method in accordance with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed
with the microcontroller installed on a custom EMC evaluation board while running specialized EMC test
software. The radiated emissions from the microcontroller are measured in a TEM cell in two package
orientations (North and East). For more detailed information concerning the evaluation results, conditions
and setup, please refer to the EMC Evaluation Report for this device.
The maximum radiated RF emissions of the tested configuration in all orientations are less than or equal
to the reported emissions levels.
Table A-18. Radiated Emissions
Level1
(Max)
Parameter
Symbol
Conditions
Frequency
fosc/fCPU
Unit
VRE_TEM
VDD = 5V
TA = +25oC
100 LQFP
0.15 – 50 MHz
50 – 150 MHz
150 – 500 MHz
500 – 1000 MHz
IEC Level
14
21
6
dBμV
Radiated emissions,
electric field
16 MHz Crystal
20 MHz Bus
-5
L
—
—
SAE Level
3
1
Data based on qualification test results.
MC9S08DZ128 Series Data Sheet, Rev. 1
446
Freescale Semiconductor
Appendix B
Ordering Information and Mechanical Drawings
B.1
Ordering Information
This section contains ordering information for MC9S08DZ128 Series devices.
Example of the device numbering system:
MC 9 S08 DZ 128 F2 C xx
Package Designator
Status
Two letter descriptor
(refer to Table B-2).
- S = Auto Qualified
- MC = Fully Qualified
Main Memory Type
- 9 = Flash-based
Temperature Option
- C = -40 to 85 °C
- V = -40 to 105 °C
- M = -40 to 125 °C
Core
Mask Set Identifier
Family
- DZ
- DV
Only appears for “Auto Qualified”
part numbers beginning with “S.”
F2 = 2M78G mask set in this case.
Flash
Memory Size
-128 KBytes
- 96 KBytes
Figure 18-18. Device Numbering Scheme
B.1.1
MC9S08DZ128 Series Devices
Table B-1. Devices in the MC9S08DZ128 Series
Memory
Device Number
Available Packages1
FLASH
RAM
EEPROM
MC9S08DZ128
MC9S08DZ96
MC9S08DV128
MC9S08DV96
128K
96K
8K
6K
6K
4K
2K
2K
—
100 LQFP
64 LQFP
48 LQFP
128K
96K
—
1
See Table B-2 for package information.
MC9S08DZ128 Series Data Sheet, Rev. 1
Freescale Semiconductor
447
Appendix B Ordering Information and Mechanical Drawings
B.2
Mechanical Drawings
The following pages are mechanical drawings for the packages described in the following table:
Table B-2. Package Descriptions
Pin Count
Type
Abbreviation
Designator
Document No.
100
64
Low-profile Quad Flat Package
Low-profile Quad Flat Package
Low-profile Quad Flat Package
LQFP
LQFP
LQFP
LL
LH
LF
98ASS23308W
98ASS23234W
98ASH00962A
48
MC9S08DZ128 Series Data Sheet, Rev. 1
448
Freescale Semiconductor
How to Reach Us:
Home Page:
www.freescale.com
E-mail:
support@freescale.com
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, CH370
1300 N. Alma School Road
Chandler, Arizona 85224
+1-800-521-6274 or +1-480-768-2130
support@freescale.com
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
support@freescale.com
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
support.japan@freescale.com
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
support.asia@freescale.com
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Semiconductor was negligent regarding the design or manufacture of the part.
Denver, Colorado 80217
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
1-800-441-2447 or 303-675-2140
Fax: 303-675-2150
© Freescale Semiconductor, Inc. 2007, 2008. All rights reserved.
LDCForFreescaleSemiconductor@hibbertgroup.com
MC9S08DZ128
Rev. 1, 5/2008
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明