MMA6280QT_08 [FREESCALE]

【1.5 g - 6 g Dual Axis Low-g Micromachined Accelerometer; 【 1.5克 - 6克双轴低g加速度计微机械
MMA6280QT_08
型号: MMA6280QT_08
厂家: Freescale    Freescale
描述:

【1.5 g - 6 g Dual Axis Low-g Micromachined Accelerometer
【 1.5克 - 6克双轴低g加速度计微机械

机械
文件: 总13页 (文件大小:191K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Document Number: MMA6280QT  
Rev 4, 04/2008  
Freescale Semiconductor  
Technical Data  
±1.5 g - 6 g Dual Axis Low-g  
Micromachined Accelerometer  
MMA6280QT  
The MMA6280QT low cost capacitive micromachined accelerometer  
features signal conditioning, a 1-pole low pass filter, temperature  
compensation and g-Select which allows for the selection among 4  
sensitivities. Zero-g offset full scale span and filter cut-off are factory set and  
require no external devices. Includes a Sleep Mode that makes it ideal for  
handheld battery powered electronics.  
MMA6280QT: XZ AXIS  
ACCELEROMETER  
±1.5 g / 2 g / 4 g / 6 g  
Features  
Selectable Sensitivity (1.5 g / 2 g / 4 g / 6 g)  
Low Current Consumption: 500 μA  
Sleep Mode: 3 μA  
Low Voltage Operation: 2.2 V – 3.6 V  
6 mm x 6 mm x 1.45 mm QFN  
High Sensitivity (800 mV/g @1.5 g)  
Fast Turn On Time  
Bottom View  
Integral Signal Conditioning with Low Pass Filter  
Robust Design, High Shocks Survivability  
Pb-Free Terminations  
Environmentally Preferred Package  
Low Cost  
16-LEAD  
QFN  
CASE 1622-02  
Typical Applications  
Portable Applications: Tilt Monitoring, Anti-Theft  
Pedometer: Motion Sensing  
PDA: Text Scroll  
Gaming: Tilt and Motion Sensing, Event Recorder  
Robotics: Motion Sensing  
Top View  
Impact Monitoring (shipping/handling, black box event recorder)  
Vibration Monitoring and Recording (appliance balance, seismic, smart  
motors, etc.).  
16 15 14 13  
Sleep  
ORDERING INFORMATION  
g-Select1  
1
12  
Mode  
Temperature  
Range  
Package  
Drawing  
Device Name  
Package  
g-Select2  
VDD  
2
11 N/C  
10 N/C  
3
4
MMA6280QT  
– 40 to +105°C  
– 40 to +105°C  
1622-02  
1622-02  
QFN-16, Tray  
VSS  
9 N/C  
MMA6280QR2  
QFN-16,Tape & Reel  
5
6
7
8
Figure 1. Pin Connections  
© Freescale Semiconductor, Inc., 2005-2008. All rights reserved.  
VDD  
g-Select1  
g-Select2  
Clock  
Generator  
X-Temp  
Comp  
XOUT  
Oscillator  
Gain  
+
Filter  
G-Cell  
Sensor  
C to V  
Converter  
Sleep Mode  
Control Logic  
EEPROM Trim Circuits  
Z-Temp  
Comp  
ZOUT  
VSS  
Figure 2. Simplified Accelerometer Functional Block Diagram  
Table 1. Maximum Ratings  
(Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)  
Rating  
Maximum Acceleration (all axis)  
Symbol  
gmax  
Value  
±2000  
Unit  
g
Supply Voltage  
VDD  
–0.3 to +3.6  
1.8  
V
Drop Test(1)  
Ddrop  
m
Storage Temperature Range  
1. Dropped onto concrete surface from any axis.  
Tstg  
–40 to +125  
°C  
ELECTRO STATIC DISCHARGE (ESD)  
WARNING: This device is sensitive to electrostatic  
discharge.  
Although the Freescale accelerometer contains internal  
2000 V ESD protection circuitry, extra precaution must be  
taken by the user to protect the chip from ESD. A charge of  
over 2000 volts can accumulate on the human body or  
associated test equipment. A charge of this magnitude can  
alter the performance or cause failure of the chip. When  
handling the accelerometer, proper ESD precautions should  
be followed to avoid exposing the device to discharges which  
may be detrimental to its performance.  
MMA6280QT  
Sensors  
2
Freescale Semiconductor  
Table 2. Operating Characteristics  
Unless otherwise noted: –20°C < TA < 85°C, 2.2 V < VDD < 3.6 V, Acceleration = 0 g, Loaded output(1)  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Operating Range(2)  
Supply Voltage(3)  
Supply Current  
VDD  
IDD  
IDD  
TA  
2.2  
3.3  
500  
3
3.6  
800  
10  
V
μA  
μA  
°C  
Supply Current at Sleep Mode(4)  
Operating Temperature Range  
Acceleration Range, X-Axis, Z-Axis  
g-Select1 & 2: 00  
–40  
+105  
gFS  
gFS  
gFS  
gFS  
±1.5  
±2.0  
±4.0  
±6.0  
g
g
g
g
g-Select1 & 2: 10  
g-Select1 & 2: 01  
g-Select1 & 2: 11  
Output Signal  
Zero-g (TA = 25°C, VDD = 3.3 V)(5)  
VOFF  
1.485  
1.65  
1.815  
V
Zero-g(4)  
X-axis  
Z-axis  
VOFF, TA  
VOFF, TA  
±2.6(6)  
±1.0(6)  
±0.6  
±0.8  
±3.8(7)  
±0.8(7)  
mg/°C  
mg/°C  
Sensitivity (TA = 25°C, VDD = 3.3 V)  
1.5 g  
2 g  
S1.5g  
S2g  
S4g  
740  
555  
277.5  
185  
800  
600  
300  
200  
860  
645  
322.5  
215  
mV/g  
mV/g  
mV/g  
mV/g  
4 g  
6 g  
S6g  
Sensitivity(4)  
X-axis  
Z-axis  
S,TA  
S,TA  
±0.02(6)  
±0.01(6)  
±0.02  
±0.00  
±0.02(7)  
±0.01(7)  
%/°C  
%/°C  
Bandwidth Response  
X
Z
f-3dB  
f-3dB  
350  
150  
Hz  
Hz  
Noise  
RMS (0.1 Hz – 1 kHz)(4)  
nRMS  
nPSD  
4.7  
350  
mVrms  
Power Spectral Density RMS (0.1 Hz – 1 kHz)(4)  
μg/  
Hz  
Control Timing  
Power-Up Response Time(8)  
tRESPONSE  
tENABLE  
1.0  
0.5  
2.0  
2.0  
ms  
ms  
Enable Response Time(9)  
Sensing Element Resonant Frequency  
X
Z
fGCELL  
fGCELL  
fCLK  
6.0  
3.4  
11  
kHz  
kHz  
kHz  
Internal Sampling Frequency  
Output Stage Performance  
Full-Scale Output Range (IOUT = 30 µA)  
VFSO  
VSS+0.25  
–1.0  
VDD–0.25  
+1.0  
V
Nonlinearity, XOUT, ZOUT  
NLOUT  
%FSO  
Cross-Axis Sensitivity(10)  
Ratiometric Error(11)  
VXY, XZ, YZ  
error  
5.0  
%
%
1. For a loaded output, the measurements are observed after an RC filter consisting of a 1.0 kΩ resistor and a 0.1 µF capacitor on VDD-GND.  
2. These limits define the range of operation for which the part will meet specification.  
3. Within the supply range of 2.2 and 3.6 V, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device  
may operate as a linear device but is not guaranteed to be in calibration.  
4. This value is measured with g-Select in 1.5 g mode.  
5. The device can measure both + and – acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output  
will increase above VDD/2. For negative acceleration, the output will decrease below VDD/2.  
6. These values represent the 10th percentile, not the minimum.  
7. These values represent the 90th percentile, not the maximum.  
8. The response time between 10% of full scale VDD input voltage and 90% of the final operating output voltage.  
9. The response time between 10% of full scale Sleep Mode input voltage and 90% of the final operating output voltage.  
10. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity.  
11.Zero-g offset ratiometric error can be typically >20% at VDD = 2.2 V. Sensitivity ratiometric error can be typically >3% at VDD = 2.2. Consult  
factory for additional information  
MMA6280QT  
Sensors  
Freescale Semiconductor  
3
PRINCIPLE OF OPERATION  
The Freescale accelerometer is a surface-micromachined  
SPECIAL FEATURES  
integrated-circuit accelerometer.  
The device consists of two surface micromachined  
capacitive sensing cells (g-cell) and a signal conditioning  
ASIC contained in a single integrated circuit package. The  
sensing elements are sealed hermetically at the wafer level  
using a bulk micromachined cap wafer.  
The g-cell is a mechanical structure formed from  
semiconductor materials (polysilicon) using semiconductor  
processes (masking and etching). It can be modeled as a set  
of beams attached to a movable central mass that move  
between fixed beams. The movable beams can be deflected  
from their rest position by subjecting the system to an  
acceleration (Figure 3).  
As the beams attached to the central mass move, the  
distance from them to the fixed beams on one side will  
increase by the same amount that the distance to the fixed  
beams on the other side decreases. The change in distance  
is a measure of acceleration.  
The g-cell beams form two back-to-back capacitors  
(Figure 3). As the center beam moves with acceleration, the  
distance between the beams changes and each capacitor's  
value will change, (C = Aε/D). Where A is the area of the  
beam, ε is the dielectric constant, and D is the distance  
between the beams.  
g-Select  
The g-Select feature allows for the selection among 4  
sensitivities present in the device. Depending on the logic  
input placed on pins 1 and 2, the device internal gain will be  
changed allowing it to function with a 1.5 g, 2 g, 4 g, or 6 g  
sensitivity (Table 3). This feature is ideal when a product has  
applications requiring different sensitivities for optimum  
performance. The sensitivity can be changed at anytime  
during the operation of the product. The g-Select1 and g-  
Select2 pins can be left unconnected for applications  
requiring only a 1.5 g sensitivity as the device has an internal  
pulldown to keep it at that sensitivity (800 mV/g).  
Table 3. g-Select Pin Descriptions  
g-Select2  
g-Select1  
g-Range  
1.5 g  
2 g  
Sensitivity  
800 mV/g  
600 mV/g  
300 mV/g  
200 mV/g  
0
0
1
1
0
1
0
1
4 g  
6 g  
The ASIC uses switched capacitor techniques to measure  
the g-cell capacitors and extract the acceleration data from  
the difference between the two capacitors. The ASIC also  
signal conditions and filters (switched capacitor) the signal,  
providing a high level output voltage that is ratiometric and  
proportional to acceleration.  
Sleep Mode  
The dual axis accelerometer provides a Sleep Mode that  
is ideal for battery operated products. When Sleep Mode is  
active, the device outputs are turned off, providing significant  
reduction of operating current. A low input signal on pin 12  
(Sleep Mode) will place the device in this mode and reduce  
the current to 3μA typ. For lower power consumption, it is  
recommended to set g-Select1 and g-Select2 to 1.5g mode.  
By placing a high input signal on pin 12, the device will  
resume to normal mode of operation.  
Acceleration  
Filtering  
The dual axis accelerometer contains onboard single-pole  
switched capacitor filters. Because the filter is realized using  
switched capacitor techniques, there is no requirement for  
external passive components (resistors and capacitors) to set  
the cut-off frequency.  
Figure 3. Simplified Transducer Physical Model  
Ratiometricity  
Ratiometricity simply means the output offset voltage and  
sensitivity will scale linearly with applied supply voltage. That  
is, as supply voltage is increased, the sensitivity and offset  
increase linearly; as supply voltage decreases, offset and  
sensitivity decrease linearly. This is a key feature when  
interfacing to a microcontroller or an A/D converter because  
it provides system level cancellation of supply induced errors  
in the analog to digital conversion process.  
MMA6280QT  
Sensors  
4
Freescale Semiconductor  
BASIC CONNECTIONS  
PCB Layout  
Pin Descriptions  
Top View  
POWER SUPPLY  
16 15 14 13  
VDD  
g-Select1  
1
12  
VRH  
VDD  
VSS  
Sleep Mode  
C
C
VSS  
Sleep Mode  
g-Select1  
C
g-Select2  
VDD  
2
11 N/C  
10 N/C  
P0  
P1  
P2  
3
4
VSS  
9
N/C  
g-Select2  
5
6
7
8
R
R
XOUT  
A/DIN  
A/DIN  
C
C
Figure 4. Pinout Description  
Table 4. Pin Descriptions  
ZOUT  
Pin No.  
Pin Name  
g-Select1  
g-Select2  
VDD  
Description  
Logic input pin to select g level.  
Logic input pin to select g level.  
Power Supply Input  
Figure 6. Recommended PCB Layout for Interfacing  
Accelerometer to Microcontroller  
1
2
3
NOTES:  
1. Verify VDD line has the ability to reach 2.2 V in <  
4
VSS  
Power Supply Ground  
0.1 ms as measured on the device at the VDD pin.  
5 - 7  
N/C  
No internal connection.  
Leave unconnected.  
Rise times greater than this most likely will prevent  
start up operation.  
8 - 11  
12  
N/C  
Unused for factory trim.  
Leave unconnected.  
2. Physical coupling distance of the accelerometer to  
the microcontroller should be minimal.  
Sleep Mode Logic input pin to enable product or  
Sleep Mode.  
3. The flag underneath the package is internally  
connected to ground. It is not recommended for the  
flag to be soldered down.  
13  
14  
ZOUT  
N/C  
Z direction output voltage.  
4. Place a ground plane beneath the accelerometer to  
reduce noise, the ground plane should be attached to  
all of the open ended terminals shown in Figure 6.  
No internal connection.  
Leave unconnected.  
15  
16  
XOUT  
N/C  
X direction output voltage.  
5. Use an RC filter with 1.0 kΩ and 0.1 µF on the  
outputs of the accelerometer to minimize clock noise  
(from the switched capacitor filter circuit).  
No internal connection.  
Leave unconnected.  
6. PCB layout of power and ground should not couple  
power supply noise.  
Logic  
Inputs  
1 kΩ  
1
2
13  
ZOUT  
7. Accelerometer and microcontroller should not be a  
high current path.  
g-Select1  
0.1 μF  
g-Select2  
VDD  
8. A/D sampling rate and any external power supply  
switching frequency should be selected such that  
they do not interfere with the internal accelerometer  
sampling frequency (11 kHz for the sampling  
frequency). This will prevent aliasing errors.  
MMA6280QT  
3
VDD  
0.1 μF  
9. PCB layout should not run traces or vias under the  
QFN part. This could lead to ground shorting to the  
accelerometer flag.  
4
VSS  
1 kΩ  
0.1 μF  
15  
12  
XOUT  
Sleep Mode  
Logic  
Input  
Figure 5. Accelerometer with Recommended  
Connection Diagram  
MMA6280QT  
Sensors  
Freescale Semiconductor  
5
DYNAMIC ACCELERATION  
Top View  
Y direction  
(For reference only)  
Side View  
16 15 14 13  
1
2
12  
11  
-Z  
+Z  
+X  
-X  
3
4
10  
9
5
6
7
8
: Arrow indicates direction of mass movement.  
16-Pin QFN Package  
STATIC ACCELERATION  
Direction of Earth’s gravity field.*  
Top View  
Side View  
XOUT  
ZOUT  
@
@
0g = 1.  
65 V  
XOUT @ 0g = 1.65 V  
0g =  
1.65 V  
Z
OUT @ +1g = 2.45 V  
XOUT @ -1g = 0.85 V  
XOUT @ +1g = 2.45 V  
XOUT @ 0g = 1.65 V  
OUT @ -1g = 0.85 V  
Z
OUT @ 0g = 1.65 V  
Z
OUT @ 0g = 1.65 V  
Z
XOUT @ 0g = 1.65 V  
OUT @ 0g = 1.65 V  
Z
* When positioned as shown, the Earth’s gravity will result in a positive 1g output.  
MMA6280QT  
Sensors  
6
Freescale Semiconductor  
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS  
Surface mount board layout is a critical portion of the total  
design. The footprint for the surface mount packages must be  
the correct size to ensure proper solder connection interface  
between the board and the package.  
With the correct footprint, the packages will self-align when  
subjected to a solder reflow process. It is always  
recommended to design boards with a solder mask layer to  
avoid bridging and shorting between solder pads.  
The flag underneath the package is internally connected to  
ground. It is not recommended for the flag to be soldered  
down.  
Do not solder down  
flag and 4 corner  
ground pads on the  
package for  
Pin 1 ID  
(non-metallic)  
consumer application  
Do not place any top  
metal patterns or via  
structures beneath  
the package  
Note: The die pad (flag) is not generally recommended to be  
soldered down for consumer product application. All dimensions  
are in mm.  
Figure 7. PCB Footprint for 16-Lead QFN, 6x6 mm for  
Consumer Grade Products and Applications  
MMA6280QT  
Sensors  
7
Freescale Semiconductor  
PCB DESIGN GUIDELINES  
The following are the recommended guidelines to follow  
min. 0.5mm length for all PCB land pad near package  
are recommended as shown in Figure 8 and  
Figure 9. Wider trace can be continued after the  
0.5mm zone.  
for mounting QFN sensors for either automotive or consumer  
applications.  
1. NSMD (Non Solder Mask Defined) is shown in  
Figure 8.  
2. Solder mask opening = PCB land pad +0.1 mm.  
3. Stencil aperture size = PCB land pad – 0.025mm, as  
shown in Figure 9 with a 6 mil stencil.  
4. Do not place insertion components or vias at a  
distance less than 2mm from the package land area.  
5. Signal trace connected to pads should be as  
symmetric as possible. Put dummy traces if there is  
NC pads, in order to have same length of exposed  
trace for all pads. Signal traces with 0.1mm width and  
6. Use a standard pick and place process and  
equipment (no hand soldering process).  
7. It is recommended to use a cleanable solder paste  
with an additional cleaning step after SMT mount  
8. It is recommended to avoid screwing down the PCB  
to fix it into an enclosure since this may cause the  
PCB to bend.  
9. PC boards should be rated for multiple reflow of lead-  
free conditions with 260°C maximum temperature.  
Signal trace 0.1mm width  
and 0.5mm (min) length near  
PCB land pattern - NSMD  
package. Wider trace can be  
continued after these traces.  
Package Pad  
0.50 mm  
0.55 mm  
Cu: 0.55 x 0.50 mm sq.  
Solder mask opening =  
PCB land pad +0.1mm  
=0.65x0.60 mm sq.  
Figure 8. NSMD Solder Mask Design Guidelines  
Signal trace near package: 0.1mm width and  
0.5mm (min) length are recommended near  
package. Wider trace can be continued after  
these.  
Stencil opening (black) for land pad (yellow)  
= PCB landing pad -0.025mm  
= 0.525mmx0,475mm  
Package foot pirnt  
Figure 9. Stencil Design Guidelines  
MMA6280QT  
Sensors  
Freescale Semiconductor  
8
PACKAGE DIMENSIONS  
PAGE 1 OF 3  
CASE 1622-02  
ISSUE B  
16-LEAD QFN  
MMA6280QT  
Sensors  
Freescale Semiconductor  
9
PACKAGE DIMENSIONS  
PAGE 2 OF 3  
CASE 1622-02  
ISSUE B  
16-LEAD QFN  
MMA6280QT  
Sensors  
Freescale Semiconductor  
10  
PACKAGE DIMENSIONS  
PAGE 3 OF 3  
CASE 1622-02  
ISSUE B  
16-LEAD QFN  
MMA6280QT  
11  
Sensors  
Freescale Semiconductor  
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MMA6280QT  
Rev 4  
04/2008  
MMA6280QT  
Sensors  
Freescale Semiconductor  
13  

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NXP

MMA6341LR2

SPECIALTY ANALOG CIRCUIT, PBGA14, 3 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, LGA-14
NXP

MMA6341LT

±3g, ±9g Two Axis Low-g Micromachined Accelerometer
FREESCALE

MMA6341LT

SPECIALTY ANALOG CIRCUIT, PBGA14, 3 X 5 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, LGA-14
NXP

MMA6361L

±1.5g, ±6g Two Axis Low-g Micromachined Accelerometer
FREESCALE