MMA6331L [FREESCALE]

±4g, ±9g Two Axis Low-g Micromachined Accelerometer; 为± 4G,为± 9克两轴低g加速度计微机械
MMA6331L
型号: MMA6331L
厂家: Freescale    Freescale
描述:

±4g, ±9g Two Axis Low-g Micromachined Accelerometer
为± 4G,为± 9克两轴低g加速度计微机械

机械
文件: 总11页 (文件大小:140K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Document Number: MMA6331L  
Rev 1, 08/2011  
Freescale Semiconductor  
Data Sheet: Technical Data  
±4g, ±9g Two Axis Low-g  
Micromachined Accelerometer  
MMA6331L  
The MMA6331L is a low power, low profile capacitive micromachined  
accelerometer featuring signal conditioning, a 1-pole low pass filter,  
temperature compensation, and g-Select which allows for the selection  
between two sensitivities. Zero-g offset and sensitivity are factory set and  
require no external devices. The MMA6331L includes a Sleep Mode that  
makes it ideal for handheld battery powered electronics.  
MMA6331L: XY AXIS  
ACCELEROMETER  
±4g, ±9g  
Features  
3mm x 5mm x 1.0mm LGA-14 Package  
Low Current Consumption: 400 μA  
Sleep Mode: 3 μA  
Low Voltage Operation: 2.2 V – 3.6 V  
Selectable Sensitivity (±4g, ±9g)  
Fast Turn On Time (0.5 ms Enable Response Time)  
Signal Conditioning with Low Pass Filter  
Robust Design, High Shocks Survivability  
RoHS Compliant  
Bottom View  
Environmentally Preferred Product  
Low Cost  
14 LEAD  
LGA  
Typical Applications  
CASE 1977-01  
3D Gaming: Tilt and Motion Sensing, Event Recorder  
HDD MP3 Player  
Laptop PC: Anti-Theft  
Cell Phone: Image Stability, Text Scroll, Motion Dialing, eCompass  
Pedometer: Motion Sensing  
Top View  
PDA: Text Scroll  
N/C  
Robotics: Motion Sensing  
N/C  
GND  
N/C  
XOUT  
ORDERING INFORMATION  
YOUT  
N/C  
Temperature  
Range  
Package  
Drawing  
Part Number  
Package  
Shipping  
N/C  
VSS  
g-Select  
N/C  
MMA6331LT  
MMA6331LR1  
MMA6331LR2  
-40 to +85°C  
-40 to +85°C  
-40 to +85°C  
1977-01  
1977-01  
1977-01  
LGA-14  
LGA-14  
LGA-14  
Tray  
7” Tape & Reel  
13” Tape & Reel  
VDD  
N/C  
Sleep  
Figure 1. Pin Connections  
© Freescale Semiconductor, Inc., 2010, 2011. All rights reserved.  
VDD  
CLOCK  
GEN  
OSCILLATOR  
X-TEMP  
COMP  
XOUT  
GAIN  
+
FILTER  
G-CELL  
SENSOR  
C to V  
CONVERTER  
Sleep  
Y-TEMP  
COMP  
YOUT  
CONTROL LOGIC  
NVM TRIM  
CIRCUITS  
VSS  
Figure 2. Simplified Accelerometer Functional Block Diagram  
Table 1. Maximum Ratings  
(Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)  
Rating  
Maximum Acceleration (all axis)  
Symbol  
gmax  
Value  
±5000  
Unit  
g
Supply Voltage  
VDD  
–0.3 to +3.6  
1.8  
V
Drop Test(1)  
Ddrop  
Tstg  
m
Storage Temperature Range  
1. Dropped onto concrete surface from any axis.  
–40 to +125  
°C  
ELECTRO STATIC DISCHARGE (ESD)  
WARNING: This device is sensitive to electrostatic  
discharge.  
Although the Freescale accelerometer contains internal  
2000 V ESD protection circuitry, extra precaution must be  
taken by the user to protect the chip from ESD. A charge of  
over 2000 volts can accumulate on the human body or  
associated test equipment. A charge of this magnitude can  
alter the performance or cause failure of the chip. When  
handling the accelerometer, proper ESD precautions should  
be followed to avoid exposing the device to discharges which  
may be detrimental to its performance.  
MMA6331L  
Sensors  
2
Freescale Semiconductor  
Table 2. Operating Characteristics  
Unless otherwise noted: -40°C < TA < 85°C, 2.2 V < VDD < 3.6 V, Acceleration = 0g, Loaded output(1)  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Operating Range(2)  
Supply Voltage(3)  
Supply Current(4)  
Supply Current at Sleep Mode(4)  
Operating Temperature Range  
Acceleration Range, X-Axis, Y-Axis  
g-Select: 0  
VDD  
IDD  
IDD  
TA  
2.2  
2.8  
400  
3
3.6  
600  
10  
V
μA  
μA  
°C  
-40  
+85  
gFS  
gFS  
±4  
±9  
g
g
g-Select: 1  
Output Signal  
Zero g (TA = 25°C, VDD = 2.8 V)(5), (6)  
Zero g(7)  
VOFF  
1.316  
-2.0  
1.4  
1.484  
+2.0  
V
VOFF, TA  
±0.5  
mg/°C  
Sensitivity (TA = 25°C, VDD = 2.8 V)  
4g  
S4g  
S9g  
289.5  
75.2  
308  
83.6  
326.5  
91.9  
mV/g  
mV/g  
%/°C  
9g  
Sensitivity(4)  
Bandwidth Response  
XY  
S,TA  
-0.0075  
±0.002  
+0.0075  
f-3dBXY  
ZO  
400  
32  
Hz  
Output Impedance  
24  
40  
kΩ  
Noise  
Power Spectral Density RMS (0.1 Hz – 1 kHz)(4)  
nPSD  
350  
μg/  
Hz  
Control Timing  
Power-Up Response Time(8)  
Enable Response Time(9)  
Sensing Element Resonant Frequency  
XY  
tRESPONSE  
tENABLE  
1.0  
0.5  
2.0  
2.0  
ms  
ms  
fGCELLXY  
fCLK  
6.0  
11  
kHz  
kHz  
Internal Sampling Frequency  
Output Stage Performance  
Full-Scale Output Range (IOUT = 3 µA)  
VFSO  
VSS+0.1  
-1.0  
VDD–0.1  
+1.0  
V
Nonlinearity, XOUT, YOUT  
Cross-Axis Sensitivity(10)  
NLOUT  
%FSO  
VXY  
-5.0  
+5.0  
%
1. For a loaded output, the measurements are observed after an RC filter consisting of an internal 32 kΩ resistor and an external 3.3 nF capacitor  
(recommended as a minimum to filter clock noise) on the analog output for each axis and a 0.1 μF capacitor on VDD - GND. The output sensor  
bandwidth is determined by the Capacitor added on the output. f = 1/2π * (32 x 103) * C. C = 3.3 nF corresponds to BW = 1507HZ, which is  
the minimum to filter out internal clock noise.  
2. These limits define the range of operation for which the part will meet specification.  
3. Within the supply range of 2.2 and 3.6 V, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device  
may operate as a linear device but is not guaranteed to be in calibration.  
4. This value is measured with g-Select in 4g mode.  
5. The device can measure both + and – acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output  
will increase above VDD/2. For negative acceleration, the output will decrease below VDD/2.  
6. For optimal 0g offset performance, adhere to AN3484 and AN3447.  
7.Product Performance will not exceed this minimum level, however, measurement over time will not be equal to time zero measurements for  
this specific parameter.  
8. The response time between 10% of full scale VDD input voltage and 90% of the final operating output voltage.  
9. The response time between 10% of full scale Sleep Mode input voltage and 90% of the final operating output voltage.  
10. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity  
MMA6331L  
Sensors  
Freescale Semiconductor  
3
PRINCIPLE OF OPERATION  
The Freescale accelerometer is a surface-micromachined  
SPECIAL FEATURES  
integrated-circuit accelerometer.  
g-Select  
The device consists of a surface micromachined  
capacitive sensing cell (g-cell) and a signal conditioning ASIC  
contained in a single package. The sensing element is sealed  
hermetically at the wafer level using a bulk micromachined  
cap wafer.  
The g-cell is a mechanical structure formed from  
semiconductor materials (polysilicon) using semiconductor  
processes (masking and etching). It can be modeled as a set  
of beams attached to a movable central mass that move  
between fixed beams. The movable beams can be deflected  
from their rest position by subjecting the system to an  
acceleration (Figure 3).  
As the beams attached to the central mass move, the  
distance from them to the fixed beams on one side will  
increase by the same amount that the distance to the fixed  
beams on the other side decreases. The change in distance  
is a measure of acceleration.  
The g-Select feature allows for the selection between two  
sensitivities. Depending on the logic input placed on pin 10,  
the device internal gain will be changed allowing it to function  
with a 4g or 9g sensitivity (Table 3). This feature is ideal when  
a product has applications requiring two different sensitivities  
for optimum performance. The sensitivity can be changed at  
anytime during the operation of the product. The g-Select pin  
can be left unconnected for applications requiring only a 4g  
sensitivity as the device has an internal pull-down to keep it  
at that sensitivity (308 mV/g).  
Table 3. g-Select Pin Description  
g-Select  
g-Range  
Sensitivity  
308 mV/g  
83.6 mV/g  
0
1
4g  
9g  
The g-cell beams form two back-to-back capacitors  
(Figure 3). As the center beam moves with acceleration, the  
distance between the beams changes and each capacitor's  
value will change, (C = Aε/D). Where A is the area of the  
beam, ε is the dielectric constant, and D is the distance  
between the beams.  
The ASIC uses switched capacitor techniques to measure  
the g-cell capacitors and extract the acceleration data from  
the difference between the two capacitors. The ASIC also  
signal conditions and filters (switched capacitor) the signal,  
providing a high level output voltage that is ratiometric and  
proportional to acceleration.  
Sleep Mode  
The 2 axis accelerometer provides a Sleep Mode that is  
ideal for battery operated products. When Sleep Mode is  
active, the device outputs are turned off, providing significant  
reduction of operating current. A low input signal on pin 7  
(Sleep Mode) will place the device in this mode and reduce  
the current to 3 μA typ. For lower power consumption, it is  
recommended to set g-Select to 4g mode. By placing a high  
input signal on pin 7, the device will resume to normal mode  
of operation.  
Filtering  
The 2 axis accelerometer contains an onboard single-pole  
switched capacitor filter. Because the filter is realized using  
switched capacitor techniques, there is no requirement for  
external passive components (resistors and capacitors) to set  
the cut-off frequency.  
Acceleration  
Ratiometricity  
Ratiometricity simply means the output offset voltage and  
sensitivity will scale linearly with applied supply voltage. That  
is, as supply voltage is increased, the sensitivity and offset  
increase linearly; as supply voltage decreases, offset and  
sensitivity decrease linearly. This is a key feature when  
interfacing to a microcontroller or an A/D converter because  
it provides system level cancellation of supply induced errors  
in the analog to digital conversion process.  
Figure 3. Simplified Transducer Physical Model  
MMA6331L  
Sensors  
4
Freescale Semiconductor  
BASIC CONNECTIONS  
PCB Layout  
Pin Descriptions  
Top View  
POWER SUPPLY  
N/C  
VDD  
N/C  
GND  
N/C  
VRH  
P0  
VDD  
VSS  
C
C
XOUT  
YOUT  
VSS  
C
Sleep  
N/C  
N/C  
VSS  
g-Select  
N/C  
g-Select  
P1  
GND  
XOUT  
VDD  
N/C  
A/DIN  
A/DIN  
C
C
Sleep  
YOUT  
Figure 4. Pinout Description  
Table 4. Pin Descriptions  
Pin No. Pin Name  
Description  
Figure 6. Recommended PCB Layout for Interfacing  
Accelerometer to Microcontroller  
1
N/C  
No internal connection  
Leave unconnected  
2
3
4
XOUT  
YOUT  
N/C  
X direction output voltage  
Y direction output voltage  
NOTES:  
1. Use 0.1 µF capacitor on VDD to decouple the power  
No internal connection  
Leave unconnected  
source.  
2. Physical coupling distance of the accelerometer to  
the microcontroller should be minimal.  
5
6
7
8
VSS  
VDD  
Power Supply Ground  
Power Supply Input  
3. Place a ground plane beneath the accelerometer to  
reduce noise, the ground plane should be attached to  
all of the open ended terminals shown in Figure 6.  
Sleep  
N/C  
Logic input pin to enable product or Sleep Mode  
No internal connection  
Leave unconnected  
4. Use a 3.3 nF capacitor on the outputs of the  
accelerometer to minimize clock noise (from the  
switched capacitor filter circuit).  
9
N/C  
No internal connection  
Leave unconnected  
10  
11  
g-Select Logic input pin to select g level  
5. PCB layout of power and ground should not couple  
power supply noise.  
N/C  
Unused for factory trim  
Leave unconnected  
6. Accelerometer and microcontroller should not be a  
high current path.  
12  
N/C  
Unused for factory trim  
Leave unconnected  
13  
14  
GND  
N/C  
Connect to Ground  
7. A/D sampling rate and any external power supply  
switching frequency should be selected such that  
they do not interfere with the internal accelerometer  
sampling frequency (11 kHz for the sampling  
frequency). This will prevent aliasing errors.  
Unused for factory trim  
Leave unconnected  
10  
Logic  
Input  
g-Select  
8. 10 MΩ or higher is recommended on XOUT and YOUT  
MMA6331L  
to prevent loss due to the voltage divider relationship  
between the internal 32 kΩ resistor and the  
measurement input impedance.  
13  
GND  
2
V
DD  
X
OUT  
3.3 nF  
3.3 nF  
6
V
V
DD  
SS  
3
0.1 μF  
Y
OUT  
5
7
Logic  
Input  
Sleep  
Figure 5. Accelerometer with Recommended  
Connection Diagram  
MMA6331L  
Sensors  
Freescale Semiconductor  
5
DYNAMIC ACCELERATION  
Top View  
+Y  
6
8
5
9
4
3
2
1
-X  
+X  
7
14  
10 11 12 13  
-Y  
14-Pin LGA Package  
: Arrow indicates direction of package movement.  
STATIC ACCELERATION  
Direction of Earth's gravity field.*  
Top View  
6
8
5
9
4
3
2
1
Side View  
Top  
7
14  
10 11 12 13  
X
Y
@ 0g = 1.4 V  
OUT  
OUT  
@ +1g = 1.708 V  
Bottom  
X
Y
@ 0g = 1.4 V  
OUT  
OUT  
@ 0g = 1.4 V  
Bottom  
13 12 11 10  
9
5
8
6
Top  
@ 0g = 1.4 V  
X
Y
@ +1g = 1.708 V  
@ 0g = 1.4 V  
X
Y
@ -1g = 1.092 V  
@ 0g = 1.4 V  
OUT  
OUT  
OUT  
OUT  
X
Y
OUT  
OUT  
14  
7
@ 0g = 1.4 V  
1
2
3
4
X
Y
@ 0g = 1.4 V  
OUT  
OUT  
@ -1g = 1.092 V  
* When positioned as shown, the Earth’s gravity will result in a positive 1g output.  
MMA6331L  
Sensors  
6
Freescale Semiconductor  
X-TCO mg/degC  
X-TCS %/degC  
LSL  
Target  
USL  
LSL  
Target  
USL  
-2  
-1  
0
1
2
-0.01  
-0.005  
0
.005  
.01  
Y-TCO mg/degC  
Y-TCS %/degC  
LSL  
Target  
USL  
LSL  
Target  
USL  
-2  
-1  
0
1
2
-0.01  
-0.005  
0
.005  
.01  
Figure 7. MMA6331L Temperature Coefficient of Offset (TCO) and  
Temperature Coefficient of Sensitivity (TCS) Distribution Charts  
MMA6331L  
Sensors  
Freescale Semiconductor  
7
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS  
PCB Mounting Recommendations  
MEMS based sensors are sensitive to Printed Circuit  
Board (PCB) reflow processes. For optimal zero-g offset after  
PCB mounting, care must be taken to PCB layout and reflow  
conditions. Reference application note AN3484 for best  
practices to minimize the zero-g offset shift after PCB  
mounting.  
13  
1
Surface mount board layout is a critical portion of the total  
design. The footprint for the surface mount packages must be  
the correct size to ensure proper solder connection interface  
between the board and the package.  
10x0.8  
With the correct footprint, the packages will self-align when  
subjected to a solder reflow process. It is always  
recommended to design boards with a solder mask layer to  
avoid bridging and shorting between solder pads.  
6x2  
6
8
14x0.6  
14x0.9  
12x1  
Figure 8. LGA 14-Lead, 5 x 3 mm Die Sensor  
MMA6331L  
Sensors  
Freescale Semiconductor  
8
PACKAGE DIMENSIONS  
CASE 1977-01  
ISSUE A  
14-LEAD LGA  
MMA6331L  
Sensors  
Freescale Semiconductor  
9
PACKAGE DIMENSIONS  
CASE 1977-01  
ISSUE A  
14-LEAD LGA  
MMA6331L  
Sensors  
10  
Freescale Semiconductor  
How to Reach Us:  
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www.freescale.com  
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Technical Information Center, EL516  
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www.freescale.com/support  
Information in this document is provided solely to enable system and software  
implementers to use Freescale Semiconductor products. There are no express or  
implied copyright licenses granted hereunder to design or fabricate any integrated  
circuits or integrated circuits based on the information in this document.  
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Freescale Semiconductor reserves the right to make changes without further notice to  
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product or circuit, and specifically disclaims any and all liability, including without  
limitation consequential or incidental damages. “Typical” parameters that may be  
provided in Freescale Semiconductor data sheets and/or specifications can and do vary  
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Freescale Semiconductor Japan Ltd.  
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For information on Freescale’s Environmental Products program, go to http://www.freescale.com/epp.  
MMA6331L  
Rev. 1  
08/2011  

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