MP3V5050_09 [FREESCALE]
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节，温度补偿和校准
| 型号： | MP3V5050_09 |
| 厂家： | 
Freescale |
| 描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 文件： | 总11页 (文件大小：206K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pressure
MP3V5050
Rev 1, 11/2009
Freescale Semiconductor
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MP3V5050
Series
0 to 50 kPa (0 to 7.25 psi)
0.06 to 2.82 V Output
The MP3V5050 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated Over -40° to +125°C
• Patented Silicon Shear Stress Strain Gauge
• Thermoplastic (PPS) Surface Mount Package
• Multiple Porting Options for Design Flexibility
• Barbed Side Ports for Robust Tube Connection
ORDERING INFORMATION
# of Ports
Single
Pressure Type
Differential
Case
No.
Device
Marking
Device Name
None
Dual
Gauge
Absolute
Small Outline Package (MP3V5050 Series)
MP3V5050DP
1351
1369
482A
482A
•
•
MP3V5050G
MP3V5050G
MP3V5050G
MP3V5050G
MP3V5050GP
•
•
•
•
•
•
MP3V5050GC6U
MP3V5050GC6T1
SMALL OUTLINE PACKAGES
MP3V5050GC6U/6T1
CASE 482A-01
MP3V5050DP
CASE 1351-01
MP3V5050GP
CASE 1369-01
© Freescale Semiconductor, Inc., 2008, 2009. All rights reserved.
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
—
50
kPa
Supply Voltage(2)
Supply Current
VS
Io
2.7
—
3.0
7.0
3.3
10
Vdc
mAdc
Vdc
Minimum Pressure Offset(3)
@ VS = 3.0 Volts
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
Voff
0.053
0.12
0.188
Full Scale Output(4)
@ VS = 3.0 Volts
VFSO
VFSS
—
2.752
—
2.8
2.7
—
2.888
—
Vdc
Vdc
Full Scale Span(5)
@ VS = 3.0 Volts
Accuracy(6)
Sensitivity
—
±2.5
%VFSS
V/P
tR
—
—
54
—
—
mV/kPa
ms
Response Time(7)
1.0
Output Source Current at Full Scale Output
Io+
—
—
—
—
—
0.1
20
—
—
—
mAdc
ms
Warm-Up Time(8)
Offset Stability(9)
±0.5
%VFSS
1.1.0 kPa (kiloPascal) equals 0.145 psi.
2.Device is ratiometric within this specified excitation range.
3.Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5.Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6.Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
7.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MP3V5050
Sensors
2
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Storage Temperature
Pmax
200
kPa
Tstg
TA
-40° to +125°
-40° to +125°
°C
°C
Operating Temperature
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
2
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Thin Film
Temperature
Compensation
and
4
Vout
Sensing
Element
Gain Stage #1
3
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for Small Outline Package Device
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
MP3V5050
Sensors
Freescale Semiconductor
3
Pressure
On-chip Temperature Compensation and Calibration
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 482A). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
The MP3V5050 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
3
Transfer Function:
V
V
out = VS*(0.018*P+0.04) ± ERROR
S = 3.0 Vdc
TEMP = 0 to 85°C
2
1
0
TYPICAL
MAX
MIN
0
5
10 15 20
25
30 35 40
45
50
55
Differential Pressure (kPa)
Figure 2. Output vs. Pressure Differential
STAINLESS
STEEL CAP
FLUOROSILICONE
GEL DIE COAT
DIE
P1
WIRE BOND
THERMOPLASTIC
CASE
LEAD
FRAME
P2
DIFFERENTIAL
DIE BOND
SENSING ELEMENT
Figure 3. Cross-Sectional Diagram SOP (not to scale)
3 V
OUTPUT
Vout
Vs
IPS
1.0 μF
GND
470 pF
0.01 μF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
MP3V5050
Sensors
Freescale Semiconductor
4
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Transfer Function
Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04)
± (Pressure Error x Temp. Factor x 0.018 x VS)
S = 3.0 V ± 0.30 Vdc
V
Temperature Error Band
MP3V5050 SERIES
4.0
Temp
Multiplier
3.0
–40
0 to 85
+125
3
1
3
Temperature
Error
Factor
2.0
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Pressure Error Band
Error Limits for Pressure
3.0
2.0
1.0
Pressure (in kPa)
0.0
0
10
20
30
40
50
60
–1.0
–2.0
–3.0
Pressure
Error (Max)
0 to 50 (kPa)
±1.25 (kPa)
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor as the Pressure (P1)
side and the Vacuum (P2) side. The Pressure (P1) side is the
side containing fluorosilicone gel which protects the die from
harsh media. The MP3V pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Part Number
MP3V5050GP
Case Type
Pressure (P1) Side Identifier
Side with Port Attached
1369
1351
482A
MP3V5050DP
Side with Part Marking
MP3V5050GC6U/T1
Vertical Port Attached
MP3V5050
Sensors
Freescale Semiconductor
5
Pressure
PACKAGE DIMENSIONS
–A–
D 8 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4
M
S
S
0.25 (0.010)
T
B
A
5
N
–B–
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
G
INCHES
MILLIMETERS
8
1
DIM
A
B
C
D
MIN
MAX
0.425
0.425
0.520
0.042
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
0.415
0.415
0.500
0.038
S
W
G
H
J
K
M
N
S
V
W
0.100 BSC
2.54 BSC
0.002
0.009
0.061
0
0.010
0.011
0.071
7
0.05
0.23
1.55
0
0.25
0.28
1.80
7
V
0.444
0.709
0.245
0.115
0.448
0.725
0.255
0.125
11.28
18.01
6.22
2.92
11.38
18.41
6.48
3.17
C
H
J
–T–
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
UNIBODY PACKAGE
MP3V5050
Sensors
Freescale Semiconductor
6
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5050
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5050
Sensors
Freescale Semiconductor
8
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MP3V5050
Sensors
Freescale Semiconductor
9
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MP3V5050
10
Sensors
Freescale Semiconductor
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© Freescale Semiconductor, Inc. 2009. All rights reserved.
MP3V5050
Rev. 1
11/2009
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