MPVZ4006G7U [FREESCALE]
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节，温度补偿和校准
| 型号： | MPVZ4006G7U |
| 厂家： | 
Freescale |
| 描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 文件： | 总12页 (文件大小：229K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MPVZ4006G
Rev 2, 02/2008
Freescale Semiconductor
Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The MPVZ4006G series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for the appliance, consumer, health
care and industrial market. The analog output can be read directly into the A/D
input of Freescale microcontrollers. This transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure. The axial port has been modified to accommodate industrial
grade tubing.
MPVZ4006G
INTEGRATED
PRESSURE SENSOR
0 to 6 kPa (0 to 612 mm H2O)
0.3 to 4.6 V OUTPUT
SMALL OUTLINE PACKAGE
SURFACE MOUNT
Features
•
•
•
•
2.5% Maximum Error over +10°C to +60°C with Auto Zero
5% Maximum Error over +10°C to +60°C without Auto Zero
Durable Thermoplastic (PPS) Package
MPVZ4006G6U/T1
CASE 482-01
MPVZ4006GW6U
CASE 1735-01
Available in Surface Mount (SMT) or Through-Hole (DIP) Configurations
Application Examples
•
•
•
•
Washing Machine Water Level Measurement (Reference AN1950)
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Appliance Liquid Level and Pressure Measurement
Respiratory Equipment
SMALL OUTLINE PACKAGE
THROUGH-HOLE
ORDERING INFORMATION
Device
Type
MPX Series
Order No.
Packing
Options
Options
Case No.
Marking
MPVZ4006GW7U
CASE 1560-02
MPVZ4006G7U
CASE 482B-03
Surface Mount 1735-01 MPVZ4006GW6U
Through-Hole 1560-02 MPVZ4006GW7U
Rails
Rails
Rails
MZ4006GW
MZ4006GW
MPVZ4006G
Ported
Element
Surface Mount 482-01
Surface Mount 482-01
MPVZ4006G6U
PIN NUMBERS(1)
MPVZ4006G6T1 Tape & Reel MPVZ4006G
Rails MPVZ4006G
1
2
3
4
N/C
VS
5
N/C
N/C
N/C
N/C
Through-Hole 482B-03 MPVZ4006G7U
6
Gnd
Vout
7
8
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
© Freescale Semiconductor, Inc., 2006, 2008. All rights reserved.
VS
Gain Stage #2
Thin Film
Temperature
Compensation
and
and
Ground
Reference
Shift Circuitry
Sensing
Element
Vout
Gain Stage #1
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package device
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Parametric
Symbol
Pmax
Tstg
Value
Units
kPa
°C
Maximum Pressure (P1 > P2)
Storage Temperature
75
-30° to +100°
+10° to +60°
Operating Temperature
TA
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
0
—
6.0
kPa
612
mm H2O
Supply Voltage(1)
Supply Current
Full Scale Output(2)
Offset(3)(5)
VS
IS
4.75
—
5.0
—
5.25
10
Vdc
mAdc
V
VFSS
Voff
V/P
4.374
0.152
—
4.6
4.826
0.378
—
0.265
V
Sensitivity
766
mV/kPa
7.511
mV/mm H2O
Accuracy(4)(5)
(10 to 60°C)
—
—
—
—
—
—
±2.46
±5.0
%VFSS with
auto zero
%VFSS without
auto zero
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure, at 25°C.
• Offset Stability:
Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with
minimum rated pressure applied.
• TcSpan:
• TcOffset:
Output deviation over the temperature range of 10° to 60°C, relative to 25°C.
Output deviation with minimum pressure applied, over the temperature range of 10° to 60°C, relative to 25°C.
5. Auto Zero at Factory Installation: Due to the sensitivity of the MPVZ4006G, external mechanical stresses and mounting position can affect
the zero pressure output reading. To obtain the 2.46% FSS accuracy, the device output must be “autozeroed'' after installation. Autozeroing
is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. The specified
accuracy assumes a maximum temperature change of ±5°C between autozero and measurement.
MPVZ4006G
Sensors
2
Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION, AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPVZ4006G series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor
performance and long-term reliability. Internal reliability and
qualification test for dry air, and other media, are available
from the factory. Contact the factory for information regarding
media tolerance in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 and Figure 5 shows the sensor output signal
relative to pressure input. Typical, minimum and maximum
output curves are shown for operation over a temperature
range of 10°C to 60°C using the decoupling circuit shown in
Figure 3. The output will saturate outside of the specified
pressure range.
Fluorosilicone
Gel Die Coat
Stainless
Steel Cap
Die
+5 V
P1
Wire
OUTPUT
Vout
Thermoplastic
Case
Bond
Vs
IPS
Lead
Frame
1.0 μF
0.01 μF
GND
470 pF
P2
Differential Sensing
Element
Die Bond
Figure 3. Recommended Power Supply Decoupling
and Output Filtering Recommendations
(For additional output filtering, please refer to
Application Note AN1646.)
Figure 2. Cross Sectional Diagram SOP
(Not to Scale)
5.0
5.0
Transfer Function (kPa):
out = VS*[(0.1533*P) + 0.053] ± 2.46% VFSS
Transfer Function (kPa):
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
V
V
out = VS*[(0.1533*P) + 0.053] ± 5.0% VFSS
VS = 5.0 Vdc
TEMP = 10 to 60°C
VS = 5.0 Vdc
TEMP = 10 to 60°C
TYPICAL
MAX
MAX
TYPICAL
MIN
MIN
0.5
0
0
2.0
4.0
6.0
0
2.0
4.0
6.0
Differential Pressure (kPa)
Differential Pressure (kPa)
Figure 4. Output versus Pressure Differential
at ±5.0% VFSS (without auto zero, note 5 in
Operating Characteristics)
Figure 5. Output versus Pressure Differential
at ±2.46% VFSS (with auto zero, note 5 in
Operating Characteristics)
MPVZ4006G
Sensors
Freescale Semiconductor
3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor designed to operate with positive differential pressure
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
isolates the die from the environment. The pressure sensor is
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table
Part Number
MPVZ4006GW6U
Case Type
1735-01
1560-02
482-01
Pressure (P1) Side Identifier
Vertical Port Attached
MPVZ4006GW7U
MPVZ4006G6U/T1
MPVZ4006G7U
Vertical Port Attached
Stainless Steel Cap
482B-03
Stainless Steel Cap
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
mm
0.100 TYP 8X
2.54
Figure 6. SOP Footprint (Case 482)
MPVZ4006G
Sensors
4
Freescale Semiconductor
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
1
M
S
S
A
T
B
5
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
-B-
G
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
MIN MAX
MILLIMETERS
S
N
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
5.38
MAX
10.79
10.79
5.84
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.96
1.07
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
H
C
J
0˚
7˚
-T-
0.405 0.415
0.709 0.725
10.29
18.01
10.54
18.41
SEATING
PLANE
S
PIN 1 IDENTIFIER
K
M
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
-A-
NOTES:
4
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
5
8
-B-
G
D 8 PL
1
M
S
S
A
0.25 (0.010)
T B
INCHES
MILLIMETERS
DIM MIN MAX MIN
MAX
10.79
10.79
5.59
DETAIL X
A
B
C
D
G
J
K
M
N
S
0.415
0.425 10.54
0.425 10.54
S
N
0.415
0.210
0.026
0.220
0.034
5.33
0.66
PIN 1 IDENTIFIER
0.864
0.100 BSC
2.54 BSC
0.009
0.100
0˚
0.011
0.120
15˚
0.23
2.54
0˚
0.28
3.05
15˚
C
0.405
0.540
0.415 10.29
0.560 13.72
10.54
14.22
SEATING
PLANE
-T-
K
M
J
DETAIL X
CASE 482B-03
ISSUE B
SMALL OUTLINE PACKAGE
MPVZ4006G
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPVZ4006G
Sensors
Freescale Semiconductor
6
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPVZ4006G
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPVZ4006G
Sensors
Freescale Semiconductor
8
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPVZ4006G
Sensors
Freescale Semiconductor
9
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPVZ4006G
Sensors
Freescale Semiconductor
10
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPVZ4006G
11
Sensors
Freescale Semiconductor
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MPVZ4006G
Rev. 2
02/2008
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