MPX53DP [FREESCALE]
50 kPa Uncompensated Silicon Pressure Sensors; 50军未补偿硅压力传感器型号: | MPX53DP |
厂家: | Freescale |
描述: | 50 kPa Uncompensated Silicon Pressure Sensors |
文件: | 总9页 (文件大小:222K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MPX53
Rev 4, 01/2007
Freescale Semiconductor
Technical Data
50 kPa Uncompensated
Silicon Pressure Sensors
MPX53
MPXV53GC
SERIES
The MPX53/MPXV53GC series silicon piezoresistive pressure sensors
provide a very accurate and linear voltage output — directly proportional to the
applied pressure. These standard, low cost, uncompensated sensors permit
manufacturers to design and add their own external temperature compensating
and signal conditioning networks. Compensation techniques are simplified
because of the predictability of Freescale's single element strain gauge design.
UNCOMPENSATED PRESSURE
SENSOR
Features
0 TO 50 kPA (0 – 7.25 psi)
60 mV FULL SCALE SPAN
(TYPICAL)
•
•
•
•
•
•
Low Cost
Patented Silicon Shear Stress Strain Gauge Design
Ratiometric to Supply Voltage
Easy to Use Chip Carrier Package Options
60 mV Span (Typ)
SMALL OUTLINE PACKAGES
Differential and Gauge Options
Typical Applications
•
•
•
•
•
•
•
•
Air Movement Control
Environmental Control Systems
Level Indicators
Leak Detection
Medical Instrumentation
Industrial Controls
MPXV53GC6U
CASE 482A-01
MPXV53GC7U
CASE 482C-03
Pneumatic Control Systems
Robotics
ORDERING INFORMATION
SMALL OUTLINE PACKAGE
PIN NUMBERS
Device
Type
MPX Series
Order No.
Packing
Options
Device
Marking
Options
Case No.
1
2
3
4
GND(1)
+VOUT
VS
5
6
7
8
N/C
N/C
N/C
N/C
SMALL OUTLINE PACKAGE(1) (MPXV53 SERIES)
Ported
Elements
Gauge, Side Port, SMT 482A
MPXV53GC6T1 Tape & Rail MPXV53G
482A
MPXV53GC6U
MPXV53GC7U
Rails
Rails
MPXV53G
MPXV53G
482C
–VOUT
UNIBODY PACKAGE(2) (MPX53 SERIES)
1. Pin 1 in noted by the notch in the lead.
Basic
Differential
344
MPX53D
—
MPX53D
Element
UNIBODY PACKAGE PIN NUMBERS
Ported
Elements
Differential
Gauge
344C
344B
MPX53DP
MPX53GP
—
—
MPX53DP
MPX53GP
1
2
GND(1)
3
4
VS
+VOUT
–VOUT
1. The MPXV53GC series pressure sensors are available with a pressure port, surface
mount, or DIP leadforms and two packing options.
2. MPX53 series pressure sensors are available in differential and gauge configurations.
Devices are available with basic element package or with pressure port fittings,
providing printed circuit board mounting ease and barbed hose pressure.
1. Pin 1 in noted by the notch in the lead.
UNIBODY PACKAGES
MPX53D
CASE 344-15
MPX53DP
CASE 344C-01
MPX53GP
CASE 344B-01
© Freescale Semiconductor, Inc., 2007. All rights reserved.
+VS
+VOUT
Sensor
-VOUT
GND
Figure 1. Uncompensated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the sensor is directly
as increasing vacuum is applied to the vacuum side (P2)
proportional to the differential the pressure side (P1) relative
to the vacuum side (P2). Similarly, output voltage increases
relative to the pressure side (P1).
Figure 1 shows a schematic of the internal circuitry on the
stand-alone pressure sensor chip.
Table 1. Maximum Ratings(1)
Rating
Maximum Pressure (P1 > P2)
Storage Temperature
Symbol
PMAX
TSTG
TA
Value
200
Unit
kPa
°C
–40 to +125
–40 to +125
Operating Temperature
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX53
Sensors
Freescale Semiconductor
2
Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
POP
VS
Min
0
Typ
—
Max
50
Units
kPa
Pressure Range(1)
Supply Voltage(2)
Supply Current
Full Scale Span(3)
Offset(4)
—
3.0
6.0
60
6.0
—
VDC
IO
—
mAdc
mV
VFSS
VOFF
∆V/∆Ρ
—
45
90
0
20
35
mV
Sensitivity
—
1.2
—
—
mV/kPa
%VFSS
%VFSS
%VFSS
%VFSS/°C
µV/°C
%ZIN/°C
Ω
Linearity(5)
–0.6
—
0.4
—
Pressure Hysteresis(5) (0 to 50 kPa)
Temperature Hysteresis(5) (–40°C to +125°C)
Temperature Coefficient of Full Scale Span(5)
Temperature Coefficient of Offset(5)
Temperature Coefficient of Resistance(5)
Input Impedance
—
±0.1
±0.5
—
—
—
—
TCVFSS
TCVOFF
TCR
ZIN
–0.22
—
-0.16
—
±15
—
0.31
355
750
—
0.37
505
1875
—
—
Output Impedance
ZOUT
tR
—
Ω
Response Time(6) (10% to 90%)
Warm-Up Time
1.0
2.0
±0.5
ms
—
—
—
ms
Offset Stability(7)
—
—
—
%VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25°C.
• TcSpan:
• TcOffset:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX53
Sensors
Freescale Semiconductor
3
TEMPERATURE COMPENSATION
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
or by designing your system using the MPX2053 series
sensors.
Figure 2 shows the typical output characteristics of the
MPX53/MPXV53GC series over temperature.
The piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This device
uses a unique transverse voltage diffused semiconductor
strain gauge which is sensitive to stresses produced in a thin
silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
Several approaches to external temperature
compensation over both –40 to +125°C and 0 to +80°C
ranges are presented in Freescale Application Note AN840.
100
MPX53
S = 3 Vdc
P1 > P2
+25°C
90
V
80
70
60
50
40
–40°C
Span
Range
(Typ)
+125×C
30
20
10
0
Offset
(Typ)
0
0
1
2
3
20
4
5
6
7
50
8
PSI
10
30
40
kPa
Pressure Differential
Figure 2. Output vs. Pressure Differential
LINEARITY
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (see Figure 3). There are two basic methods
for calculating nonlinearity: (1) end point straight line fit or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
90
80
Linearity
70
Actual
60
Span
50
40
(VFSS
)
Theoretical
30
20
Offset
(VOFF
10
)
0
0
MAX
POP
Pressure (kPA)
Figure 3. Linearity Specification Comparison
MPX53
Sensors
4
Freescale Semiconductor
Stainless Steel
Metal Cover
Silicone
Die Coat
Die
P1
P2
Epoxy
Case
Wire Bond
RTV Die
Bond
Lead Frame
Figure 4. Unibody Package: Cross Sectional Diagram (Not to Scale)
Figure 4 illustrates the differential or gauge configuration
The MPX53/MPXV53GC series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
in the unibody chip carrier (Case 344). A silicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
Pressure (P1) Side
Part Number
MPX53D
Case Type
Identifier
344
Stainless Steep Cap
Side with Port Marking
Side with Port Attached
MPX53DP
344C
344B
MPX53GP
The Pressure (P1) side may be identified by using the
following table.
MPX53GC Series
482A, 482C Side with Port Attached
MPX53
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
C
R
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
Z
1
4
2
3
INCHES
MILLIMETERS
B
-A-
DIM MIN MAX MIN
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
N
0.514
0.200
0.016
0.048
L
1
2
3
4
0.220
0.020
0.064
5.08
0.41
1.22
PIN 1
0.51
1.63
-T-
SEATING
PLANE
G
J
L
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
G
J
F
Y
M
N
R
Y
Z
30˚ NOM
30˚ NOM
D 4 PL
0.475
0.430
0.048
0.106
0.495 12.07
0.450 10.92
12.57
11.43
1.32
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
M
0.136 (0.005)
T A
0.052
0.118
1.22
2.68
3.00
STYLE 1:
PIN 1. GROUND
STYLE 2:
PIN 1.
STYLE 3:
VCC
PIN 1. GND
2. -VOUT
3. VS
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
2. - SUPPLY
3. + SUPPLY
4. GROUND
4. +VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
NOTES:
SEATING
PLANE
-A-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-T-
U
L
R
INCHES
DIM MIN MAX
MILLIMETERS
H
MIN
29.08
17.40
7.75
MAX
29.85
18.16
8.26
A
B
C
D
F
1.145
0.685
0.305
0.016
0.048
1.175
0.715
0.325
0.020
0.064
N
B
PORT #1
-Q-
POSITIVE
PRESSURE
(P1)
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC
2.54 BSC
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.250
0.240
4.62
0.36
17.65
7.37
10.67
3.89
3.89
5.84
5.59
4.93
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.10
1
2 3 4
PIN 1
K
-P-
S
M
S
0.25 (0.010)
T Q
J
F
0.910 BSC
23.11 BSC
G
C
D 4 PL
M
S
S
0.13 (0.005)
T
S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX53
Sensors
Sensors
Freescale Semiconductor
Freescale Semiconductor
6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
-A-
U
V
PORT #1
2. CONTROLLING DIMENSION: INCH.
W
L
R
H
INCHES
DIM MIN MAX
MILLIMETERS
PORT #2
MIN MAX
29.08 29.85
17.40 18.16
10.29 11.05
PORT #1
PORT #2
VACUUM
(P2)
POSITIVE PRESSURE
(P1)
A
B
C
D
F
1.145
0.685
0.405
0.016
0.048
1.175
0.715
0.435
0.020
0.064
N
-Q-
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
V
W
0.100 BSC
2.54 BSC
SEATING
PLANE
SEATING
PLANE
B
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
4.62
0.36
4.93
0.41
1
2 3 4
17.65 18.42
7.37 7.62
10.67 11.18
PIN 1
K
-P-
M
S
0.25 (0.010)
T Q
3.89
3.89
1.60
5.59
4.04
4.04
2.11
6.10
-T-
-T-
S
F
J
G
C
0.910 BSC
23.11 BSC
D 4 PL
0.248
0.310
0.278
0.330
6.30
7.87
7.06
8.38
M
S
S
0.13 (0.005)
T
S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
MPX53
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPX53
Sensors
8
Freescale Semiconductor
How to Reach Us:
Home Page:
www.freescale.com
Web Support:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor, Inc.
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
+1-800-521-6274 or +1-480-768-2130
www.freescale.com/support
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
www.freescale.com/support
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
support.japan@freescale.com
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
support.asia@freescale.com
Semiconductor was negligent regarding the design or manufacture of the part.
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
Denver, Colorado 80217
1-800-441-2447 or 303-675-2140
Fax: 303-675-2150
LDCForFreescaleSemiconductor@hibbertgroup.com
© Freescale Semiconductor, Inc. 2007. All rights reserved.
MPX53
Rev. 4
01/2007
相关型号:
MPX5500
INTEGRATED SILICON PRESSURE SENSOR ON CHIP SIGNAL CONDITIONED TEMPERATURE COMPENSATED AND CALIBRATED
MOTOROLA
MPX5500
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
FREESCALE
MPX5500D
INTEGRATED SILICON PRESSURE SENSOR ON CHIP SIGNAL CONDITIONED TEMPERATURE COMPENSATED AND CALIBRATED
MOTOROLA
MPX5500D
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
FREESCALE
MPX5500DP
INTEGRATED SILICON PRESSURE SENSOR ON CHIP SIGNAL CONDITIONED TEMPERATURE COMPENSATED AND CALIBRATED
MOTOROLA
MPX5500DP
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
FREESCALE
MPX5500GP
Peizoresistive Sensor, Gage, 0Psi Min, 72.51Psi Max, 2.5%, 0.20-4.70V, Round, PLASTIC, UNIBODY PACKAGE-6
MOTOROLA
MPX5500GSX
GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-72.51Psi, 2.5%, 0.20-4.70V, ROUND, PLASTIC, UNIBODY PACKAGE-6
MOTOROLA
©2020 ICPDF网 联系我们和版权申明