MPXAZ4100A6T1 [FREESCALE]
Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal; 集成硅压力传感器用于歧管绝对压力应用的片上信号
| 型号： | MPXAZ4100A6T1 |
| 厂家： | 
Freescale |
| 描述： | Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal |
| 文件： | 总8页 (文件大小：194K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MPXAZ4100A
Rev 1, 05/2005
Freescale Semiconductor
Technical Data
Integrated Silicon Pressure Sensor
for Manifold Absolute Pressure
Applications On-Chip Signal
Conditioned, Temperature
MPXAZ4100A
SERIES
INTEGRATED
PRESSURE SENSOR
20 TO 105 kPA (2.9 TO 15.2 psi)
0.3 TO 4.9 V OUTPUT
Compensated and Calibrated
The Freescale MPXAZ4100A series Manifold Absolute Pressure (MAP)
sensor for engine control is designed to sense absolute air pressure within the
intake manifold. This measurement can be used to compute the amount of fuel
required for each cylinder. The small form factor and high reliability of on-chip
integration makes the Freescale MAP sensor a logical and economical choice for
automotive system designers.
SMALL OUTLINE PACKAGES
The MPXAZ4100A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
MPXA4100A6U/6T1
CASE 482-01
Figure 1 shows a block diagram of the internal circuitry integrated on a
pressure sensor chip.
Features
•
•
•
Resistant to high humidity and common automotive media
1.8% Maximum Error Over 0° to 85°C
Specifically Designed for Intake Manifold Absolute
Pressure Sensing in Engine Control Systems
MPXA4100AC6U/AC6T1
CASE 482A-01
•
•
•
Ideally Suited for Microprocessor or Microcontroller Based Systems
Temperature Compensated Over –40°C to +125°C
Durable Thermoplastic (PPS) Surface Mount Package
PIN NUMBER(1)
1
2
3
4
N/C
VS
5
6
7
8
N/C
N/C
N/C
N/C
Typical Applications
•
•
Manifold Sensing for Automotive Systems
Also Ideal for Non-Automotive Applications
GND
VOUT
ORDERING INFORMATION
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
Device
Type
Case
No.
MPX Series
Order No.
Packing
Options
Device
Marking
Options
SMALL OUTLINE PACKAGE (MPXAZ4100A SERIES)
Basic
Absolute,
MPXAZ4100A6U
MPXAZ4100A6T1
MPXAZ4100AC6U
MPXAZ4100AC6T1
MPXAZ4100A
MPXAZ4100A
MPXAZ4100A
MPXAZ4100A
482
Rails
Elements Element Only
Absolute,
Element Only
482
Tape & Reel
Rails
Ported
Elements Port
Absolute, Axial
482A
482A
Absolute, Axial
Port
Tape & Reel
© Freescale Semiconductor, Inc., 2005. All rights reserved.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Sensing
Element
Vout
Gain Stage #1
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package devices.
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating
Symbol
PMAX
TSTG
TA
Value
Unit
kPa
°C
Maximum Pressure (P1 > P2)
Storage Temperature
400
–40 to +125
–40 to +125
Operating Temperature
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPXAZ4100A
Sensors
Freescale Semiconductor
2
Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 3 required to meet electrical specifications.)
Characteristic
Symbol
POP
VS
Min
20
Typ
—
Max
105
Unit
kPa
Pressure Range(1)
Supply Voltage(2)
Supply Current
4.85
—
5.1
5.35
10
Vdc
Io
7.0
mAdc
Vdc
Minimum Pressure Offset
@ VS = 5.1 Volts(3)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
Voff
0.225
0.306
0.388
Full Scale Output
VFSO
4.870
—
4.951
4.59
5.032
—
Vdc
Vdc
@ VS = 5.1 Volts(4)
Full Scale Span
VFSS
@ VS = 5.1 Volts(5)
Accuracy(6)
—
V/P
tR
—
—
—
—
—
—
—
54
1.8
—
—
—
—
—
%VFSS
mV/kPa
ms
Sensitivity
Response Time(7)
1.0
0.1
20
Output Source Current at Full Scale Output
Warm-Up Time(8)
Io+
—
mAdc
ms
Offset Stability(9)
—
0.5
%VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
• TcSpan:
• TcOffset:
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXAZ4100A
Sensors
Freescale Semiconductor
3
Figure 2 illustrates an absolute sensing chip in the basic
chip carrier (Case 482).
durable polymer package provide a media resistant barrier
that allows the sensor to operate reliably in high humidity
conditions as well as environments containing common
automotive media. Contact the factory for more information
regarding media compatibility in your specific application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
A gel die coat isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm. The gel die coat and
Fluoro Silicone
Gel Die Coat
Stainless Steel Cap
Die
P1
Wire Bond
Thermoplastic Case
Lead Frame
Absolute Element
Die Bond
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SOP
(not to scale)
+5 V
Output
Vout
Vs
IPS
1.0 µF
GND
470 pF
0.01 µF
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646.)
5.0
Transfer Function:
4.5
Vout = Vs* (.01059*P-.152) ± Error
S = 5.1 Vdc
4.0
V
Temperature = 0 to 85°C
20 kPa TO 105 kPa
MPXAZ4100A
3.5
3.0
TYP
2.5
MAX
2.0
1.5
1.0
0.5
MIN
0
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
MPXAZ4100A
Sensors
4
Freescale Semiconductor
Transfer Function (MPXAZ4100A)
Nominal Transfer Value: Vout = VS (P x 0.01059 - 0.1518)
± (Pressure Error x Temp. Factor x 0.01059 x VS)
V
S = 5.1 V 0.25 Vdc
Temperature Error Band
MPXAZ4100A Series
4.0
Temp
Multiplier
3.0
-
40
0 to 85
+125
3
1
3
Temperature
Error
Factor
2.0
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0°C to-40°C and from 85°C to 125°C.
Pressure Error Band
Error Limits for Pressure
3.0
2.0
1.0
0.0
Pressure (in kPa)
Error (Max)
20
40
60
80
100
120
-1.0
-2.0
-3.0
Pressure
20 to 105 (kPa) ±1.5 (kPa)
MPXAZ4100A
Sensors
Freescale Semiconductor
5
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
0.100 TYP 8X
2.54
mm SCALE 2:1
Figure 5. SOP Footprint (Case 482)
MPXAZ4100A
Sensors
6
Freescale Semiconductor
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
1
M
S
S
A
T
B
5
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
-B-
G
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
MIN MAX
MILLIMETERS
S
N
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
5.38
MAX
10.79
10.79
5.84
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.96
1.07
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
H
C
J
0˚
7˚
-T-
0.405 0.415
0.709 0.725
10.29
18.01
10.54
18.41
SEATING
PLANE
S
PIN 1 IDENTIFIER
K
M
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
-A-
D 8 PL
4
M
S
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
0.25 (0.010)
T
B
5
8
N
-B-
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
G
1
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
S
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
W
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
V
0˚
7˚
C
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
11.28
18.01
6.22
2.92
11.38
18.41
6.48
3.17
S
V
W
H
J
-T-
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXAZ4100A
Sensors
Freescale Semiconductor
7
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MPXAZ4100A
Rev. 1
05/2005
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Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal
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