MPXH6300A6U [FREESCALE]
High Temperature Accuracy Integrated Silicon Pressure Sensor; 高温度精度集成硅压力传感器
| 型号： | MPXH6300A6U |
| 厂家： | 
Freescale |
| 描述： | High Temperature Accuracy Integrated Silicon Pressure Sensor |
| 文件： | 总13页 (文件大小：186K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pressure
Document Number: MPXH6300A
Rev 5.1, 05/2012
Freescale Semiconductor
Data Sheet: Technical Data
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
MPXH6300A
Series
20 to 304 kPa (3.0 to 42 psi)
0.3 to 4.9 V Output
The Freescale MPXH6300A series sensor integrates on-chip, bipolar op
amp circuitry and thin film resistor networks to provide a high output signal
and temperature compensation. The small form factor and high reliability of
on-chip integration make the Freescale pressure sensor a logical and
economical choice for the system designer.
The MPXH6300A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output
signal that is proportional to applied pressure.
Application Examples
• Industrial Controls
• Engine Control/Manifold Absolute
Pressure (MAP)
Features
• Improved Accuracy at High Temperature
• Available in Super Small Outline Packages
• 1.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated from –40° to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package
ORDERING INFORMATION
# of Ports
None Single
Pressure Type
Gauge Differential Absolute
Package
Options
Case
No.
Device Name
Device Marking
Dual
Super Small Outline Package (MPXH6300A Series)
MPXH6300A6U
MPXH6300A6T1
MPXH6300AC6U
MPXH6300AC6T1
MPXH6300A
MPXH6300A
MPXH6300A
MPXH6300A
Rail
1317
1317
•
•
•
•
•
•
•
•
Tape & Reel
Rail
1317A
1317A
Tape & Reel
SUPER SMALL OUTLINE PACKAGES
MPXH6300AC6U/6T1
CASE 1317A
MPXH6300A6U/6T1
CASE 1317
© 2007, 2010, 2012 Freescale Semiconductor, Inc. All rights reserved.
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.
Characteristic
Symbol
POP
VS
Min
20
Typ
—
Max
304
Unit
kPa
Pressure Range
Supply Voltage(1)
Supply Current
4.74
—
5.1
5.46
10
Vdc
Io
6.0
mAdc
Vdc
Minimum Pressure Offset
@ VS = 5.1 Volts(2)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
Voff
0.241
0.306
0.371
Full Scale Output
VFSO
4.847
4.476
4.912
4.606
4.977
4.736
Vdc
Vdc
@ VS = 5.1 Volts(3)
Full Scale Span
VFSS
@ VS = 5.1 Volts(4)
Accuracy(5)
—
V/P
tR
—
—
—
—
—
—
16.2
1.0
1.5
—
—
—
—
%VFSS
mV/kPa
ms
Sensitivity
Response Time(6)
Warm-Up Time(7)
Offset Stability(8)
—
20
ms
—
0.25
%VFSS
1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
TcSpan:
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:
Variation from Nominal:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXH6300A
Sensors
2
Freescale Semiconductor, Inc.
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Pmax
Tstg
Value
1200
Units
kPa
°C
Maximum Pressure (P1 > P2)
Storage Temperature
-40° to +125°
-40° to +125°
0.5
Operating Temperature
TA
°C
Output Source Current @ Full Scale Output(2)
Io+
mAdc
Output Sink Current @ Minimum Pressure Offset(2)
Io-
-0.5
mAdc
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from VOUT to Gnd or VOUT to VS in the application circuit.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
2
Gain Stage #2
and Ground
Reference
Shift
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
VOUT
4
Circuitry
3
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
3
Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317). Figure 3
illustrates a typical application circuit (output source current
operation).
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXH6300A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Fluoro Silicone
Gel Die Coat
+5.1 V
Stainless
Steel Cap
Die
P1
VS Pin 2
Wire Bond
Thermoplastic
Case
MPXH6300A
to ADC
100 nF
Lead
Frame
V
out Pin 4
47 pF
51 K
GND Pin 3
Die Bond
Absolute Element
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP (not to scale)
Figure 3. Typical Application Circuit
(Output Source Current Operation)
5.0
Transfer Function:
Vout = Vs*(.00318*P-.00353) ± Error
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
VS = 5.1 Vdc
Temperature = 0 to 85°C
MAX
TYP
MIN
Pressure (Reference to Sealed Vacuum) in kPa
Figure 4. Output vs. Absolute Pressure
MPXH6300A
Sensors
4
Freescale Semiconductor, Inc.
Pressure
Transfer Function (MPXH6300A)
Nominal Transfer Value: Vout = VS x (0.00318 x P - 0.00353)
± (Pressure Error x Temp Factor x 0.00318 x VS)
V
S = 5.1 0.36 Vdc
Temperature Error Band
MPXH6300A Series
4.0
Break Points
Temp
Multiplier
3.0
-40
0 to 85
125
3
1
3
Temperature
2.0
Error
Factor
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C.
Pressure Error Band
Error Limits for Pressure
4.0
3.0
2.0
1.0
0.0
Pressure (in kPa)
20
60
100
140
180
220
260
300
-1.0
-2.0
-3.0
-4.0
Pressure
20 to 304 (kPa)
Error (Max)
±4.0 (kPa)
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
5
Pressure
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
MPXH6300A
Sensors
6
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1317-04
ISSUE H
SUPER SMALL OUTLINE PACKAGE
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
7
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1317-04
ISSUE H
SUPER SMALL OUTLINE PACKAGE
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
8
Pressure
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1317-04
ISSUE H
SUPER SMALL OUTLINE PACKAGE
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
9
Pressure
PACKAGE DIMENSIONS
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MPXH6300A
10
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
11
Pressure
Table 3. Revision History
Revision
number
Revision
date
Description of changes
5.1
05/2012
• Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H.
MPXH6300A
Sensors
12
Freescale Semiconductor, Inc.
Information in this document is provided solely to enable system and software
implementers to use Freescale products. There are no express or implied copyright
licenses granted hereunder to design or fabricate any integrated circuits based on the
information in this document.
How to Reach Us:
Home Page:
www.freescale.com
Web Support:
http://www.freescale.com/support
Freescale reserves the right to make changes without further notice to any products
herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
specifications can and do vary in different applications, and actual performance may
vary over time. All operating parameters, including “typicals,” must be validated for each
customer application by customer’s technical experts. Freescale does not convey any
license under its patent rights nor the rights of others. Freescale sells products pursuant
to standard terms and conditions of sale, which can be found at the following address:
http://www.reg.net/v2/webservices/Freescale/Docs/TermsandConditions.htm.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.,
Reg. U.S. Pat. & Tm. Off.
All other product or service names are the property of their respective owners.
© 2012 Freescale Semiconductor, Inc. All rights reserved.
MPXH6300A
Rev. 5.1
05/2012
相关型号：
MPXH6300AC6U
High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure
FREESCALE
MPXH6400A6T1
ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 2.9-58.01Psi, 1.5%, 0.20-4.80V, SQUARE, SURFACE MOUNT, SO-8
MOTOROLA
MPXH6400A6U
ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 2.9-58.01Psi, 1.5%, 0.20-4.80V, SQUARE, SURFACE MOUNT, SO-8
MOTOROLA
MPXH6400AC6T1
ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 2.9-58.01Psi, 1.5%, 0.20-4.80V, SQUARE, SURFACE MOUNT, SO-8
MOTOROLA
©2020 ICPDF网 联系我们和版权申明