MPXV7002GC6U [FREESCALE]
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节，温度补偿和校准
| 型号： | MPXV7002GC6U |
| 厂家： | 
Freescale |
| 描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 文件： | 总10页 (文件大小：205K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MPXV7002
Rev 1.0, 09/2008
Freescale Semiconductor
Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXV7002 series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This transducer combines advanced micromachining techniques, thin-film
metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
MPXV7002
SERIES
INTEGRATED
PRESSURE SENSOR
-2 to 2 kPa (-0.3 to 0.3 psi)
0.5 to 4.5 V OUTPUT
SMALL OUTLINE PACKAGE
Features
•
•
•
•
•
•
•
2.5% Typical Error over +10°C to +60°C with Auto Zero
6.25% Maximum Error over +10°C to +60°C without Auto Zero
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Thermoplastic (PPS) Surface Mount Package
MPXV7002GC6U
CASE 482A-01
Temperature Compensated over +10° to +60°C
Patented Silicon Shear Stress Strain Gauge
Available in Differential and Gauge Configurations
Typical Applications
•
•
•
•
Hospital Beds
HVAC
MPXV7002GP
CASE 1369-01
MPXV7002DP
CASE 1351-01
Respiratory Systems
Process Control
SMALL OUTLINE PACKAGE
PIN NUMBERS(1)
ORDERING INFORMATION
1
2
3
4
N/C
VS
5
6
7
8
N/C
N/C
N/C
N/C
Device
Type
Case
No.
MPX Series
Order No.
Packing
Options
Device
Options
Marking
Ported Gauge, Axial Port, SMT 482A MPXV7002GC6U
Elements
Rails MPXV7002G
Gnd
Vout
Gauge, Axial Port, SMT 482A MPXV7002GC6T1 Tape & MPXV7002G
Reel
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
Gauge, Side Port, SMT 1369 MPXV7002G
P
Trays MPXV7002G
Trays MPXV7002DP
Differential, Dual Port,
SMT
1351 MPXV7002DP
Differential, Dual Port,
SMT
1351 MPXV7002DPT1 Tape & MPXV7002DP
Reel
VS
Gain Stage #2
Thin Film
Temperature
Compensation
and
and
Ground
Reference
Shift Circuitry
Sensing
Element
Vout
Gain Stage #1
Pins 1 and 5 through 8 are NO CONNECTS
for surface mount package
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
© Freescale Semiconductor, Inc., 2005, 2008. All rights reserved.
Table 1. Maximum Ratings(1)
Rating
Symbol
Pmax
Tstg
Value
75
Unit
kPa
°C
Maximum Pressure (P1 > P2)
Storage Temperature
–30 to +100
10 to +60
Operating Temperature
TA
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3
required to meet specification.)
Characteristic
Symbol
POP
VS
Min
–2.0
4.75
—
Typ
—
Max
2.0
Unit
kPa
Pressure Range(1)
Supply Voltage(2)
Supply Current
5.0
—
5.25
10
Vdc
Io
mAdc
Vdc
Pressure Offset(3)
@ VS = 5.0 Volts
(10 to 60°C)
(10 to 60°C)
(10 to 60°C)
(10 to 60°C)
Voff
2.25
2.5
2.75
Full Scale Output(4)
@ VS = 5.0 Volts
VFSO
4.25
3.5
4.5
4.0
4.75
Vdc
Vdc
Full Scale Span(5)
@ VS = 5.0 Volts
VFSS
4.5 V
Accuracy(6)
—
V/P
tR
—
—
—
—
—
±2.5(7)
1.0
±6.25
—-
%VFSS
V/kPa
ms
Sensitivity
Response Time(8)
1.0
—-
Output Source Current at Full Scale Output
Warm-Up Time(9)
IO+
—
0.1
—-
mAdc
ms
20
—-
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan:
• TcOffset:
Output deviation over the temperature range of 10° to 60°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to
25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can
affect the zero pressure output reading. Auto zero is defined as storing the zero pressure output reading and subtracting this from the
device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum
temperature change of ± 5°C between auto zero and measurement.
8. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
9. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
MPXV7002
Sensors
2
Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPXV7002 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
10° to 60°C using the decoupling circuit shown in Figure 3.
The output will saturate outside of the specified pressure
range.
Stainless
Steel Cap
Fluoro Silicone
Gel Die Coat
Die
+5 V
P1
Thermoplastic
Case
OUTPUT
Vout
Wire Bond
Vs
Lead
Frame
IPS
1.0 μF
GND
470 pF
0.01 μF
P2
Die Bond
Differential Sensing
Element
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
5.0
Transfer Function:
V
out = VS × (0.2 × P(kPa)+0.5) ± 6.25% VFSS
VS = 5.0 Vdc
TA = 10 to 60°C
4.0
3.0
TYPICAL
MAX
2.0
1.0
0
MIN
-2
-1
0
1
2
Differential Pressure (kPa)
Figure 4. Output versus Pressure Differential
MPXV7002
Sensors
Freescale Semiconductor
3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor The Pressure (P1) side may be identified by using the
table below:
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media.
Pressure (P1)
Side Identifier
Part Number
Case Type
MPXV7002GC6U/GC6T1
MPXV7002GP
482A-01
1369-01
1351-01
Vertical Port Attached
Side with Port Attached
Side with Part Marking
MPXV7002DP
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
0.100 TYP 8X
2.54
mm SCALE 2:1
Figure 5. Small Outline Package Footprint
MPXV7002
Sensors
4
Freescale Semiconductor
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
1
M
S
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
T
B
5
8
N
-B-
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
G
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
S
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
W
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
V
0˚
7˚
C
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
11.28
18.01
6.22
2.92
11.38
18.41
6.48
3.17
S
V
W
H
J
-T-
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV7002
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV7002
Sensors
Freescale Semiconductor
6
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV7002
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPXV7002
Sensors
Freescale Semiconductor
8
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPXV7002
Sensors
Freescale Semiconductor
9
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© Freescale Semiconductor, Inc. 2008. All rights reserved.
MPXV7002
Rev. 1.0
09/2008
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