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MPXV7025 [FREESCALE]

Integrated Silicon Pressure Sensor On-Chip SIgnal Conditioned, Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节，温度补偿和校准
MPXV7025
型号： MPXV7025
厂家： Freescale    Freescale
描述：

Integrated Silicon Pressure Sensor On-Chip SIgnal Conditioned, Temperature Compensated and Calibrated
集成硅压力传感器片上信号调节，温度补偿和校准

传感器 压力传感器 温度补偿
文件： 总10页 (文件大小：126K)
中文：  中文翻译
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Pressure  
MPXV7025  
Rev 5, 1/2009  
Freescale Semiconductor  
+
Integrated Silicon Pressure Sensor  
MPXV7025  
Series  
-25 to 25 kPa (-3.6 to 3.6 psi)  
0.2 to 4.7 V Output  
On-Chip Signal Conditioned,  
Temperature Compensated and  
Calibrated  
The MPXV7025 series piezoresistive transducer is a state-of-the-art  
monolithic silicon pressure sensor designed for a wide range of applications,  
but particularly those employing a microcontroller or microprocessor with A/D  
inputs. This patented, single element transducer combines advanced  
micromachining techniques, thin-film metallization, and bipolar processing to  
provide an accurate, high level analog output signal that is proportional to the  
applied pressure.  
Application Examples  
• Respiratory Systems  
• Process Control  
• Patient Monitoring  
Features  
• Remote Monitoring Devices  
• 5.0% Maximum Error Over 0° to 85°C  
• Ideally Suited for Microprocessor or Microcontroller-Based Systems  
• Temperature Compensated Over –40° to +125°C  
• Thermoplastic (PPS) Surface Mount Package  
• Patented Silicon Shear Stress Strain Gauge  
• Available in Differential and Gauge Configurations  
ORDERING INFORMATION  
# of Ports  
Single  
Pressure Type  
Differential  
Package  
Options  
Case  
No.  
Device  
Marking  
Device Name  
None  
Dual  
Gauge  
Absolute  
Small Outline Package (MPXV7025 Series)  
MPXV7025GC6U  
MPXV7025GC6T1  
MPXV7025GP  
MPXV7025  
G
Rails  
Tape & Reel  
Trays  
482A  
482A  
1369  
1351  
•
•
•
•
•
•
MPXV7025  
G
MPXV7025GP  
MPXV7025DP  
MPXV7025DP  
Trays  
•
•
Small Outline Package (Media Resistant Gel) (MPVZ7025 Series)  
MPVZ7025GC6T1  
MPVZ7025GC6U  
MPVZ7025GP  
MPVZ7025G  
MPVZ7025G  
MPVZ7025GP  
MPVZ7025G  
MPVZ7025G  
MPVZ7025DP  
Tape & Reel  
Rails  
482A  
482A  
1369  
482  
•
•
•
•
•
•
Trays  
MPVZ7025G6T1  
MPVZ7025G6U  
MPVZ7025DP  
Tape & Reel  
Rails  
•
•
•
•
•
482  
Trays  
1351  
•
SMALL OUTLINE PACKAGE  
MPVZ7025G6U/T1  
CASE 482-01  
MPXV7025GP  
MPVZ7025GP  
CASE 1369-01  
MPXV7025DP  
MPVZ7025DP  
CASE 1351-01  
MPXV7025GC6U/T1  
MPVZ7025GC6U/T1  
CASE 482A-01  
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.  
Pressure  
Operating Characteristics  
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in  
Figure 3 required to meet electrical specifications.)  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Pressure Range(1)  
POP  
-25  
—
25  
kPa  
Supply Voltage(2)  
Supply Current  
VS  
Io  
4.75  
—
5.0  
7.0  
5.25  
10  
Vdc  
mAdc  
Vdc  
Minimum Pressure Offset(3)  
@ VS = 5.0 Volts  
(0 to 85°C)  
(0 to 85°C)  
Voff  
0.116  
0.25  
0.384  
Full Scale Output(4)  
@ VS = 5.0 Volts  
VFSO  
VFSS  
—
4.610  
—
4.75  
4.5  
—
4.890  
—
Vdc  
Vdc  
Full Scale Span(5)  
@ VS = 5.0 Volts  
(0 to 85°C)  
(0 to 85°C)  
Accuracy  
—
±5.0  
%VFSS  
Sensitivity  
V/P  
tR  
—
—
90  
—-  
—-  
mV/kPa  
ms  
Response Time(6)  
1.0  
Output Source Current at Full Scale Output  
Io+  
—
—
—
—
—
0.1  
20  
—-  
—-  
—-  
mAdc  
ms  
Warm-Up Time(7)  
Offset Stability(8)  
±0.5  
%VFSS  
1. 1.0 kPa (kiloPascal) equals 0.145 psi.  
2. Device is ratiometric within this specified excitation range.  
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.  
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.  
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the  
minimum rated pressure.  
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to  
a specified step change in pressure.  
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.  
8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.  
MPXV7025  
Sensors  
2
Freescale Semiconductor  
Pressure  
Maximum Ratings  
Table 2. Maximum Ratings(1)  
Rating  
Symbol  
Value  
Unit  
Maximum Pressure (P1 > P2)  
Storage Temperature  
Pmax  
200  
kPa  
Tstg  
TA  
–40 to +125  
–40 to +125  
°C  
°C  
Operating Temperature  
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.  
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.  
2
VS  
Gain Stage #2  
and  
Ground  
Reference  
Shift Circuitry  
Thin Film  
Temperature  
Compensation  
and  
4
Sensing  
Element  
Vout  
Gain Stage #1  
Pins 1, 5, 6, 7, and 8 are NO CONNECTS  
for Small Outline Package Device  
GND  
3
Figure 1. Integrated Pressure Sensor Schematic  
MPXV7025  
Sensors  
Freescale Semiconductor  
3
Pressure  
On-chip Temperature Compensation and Calibration  
The MPXV7025 series pressure sensor operating  
characteristics, and internal reliability and qualification tests  
are based on use of dry air as the pressure media. Media,  
other than dry air, may have adverse effects on sensor  
performance and long-term reliability. Contact the factory for  
information regarding media compatibility in your application.  
Figure 2 shows the sensor output signal relative to  
curves are shown for operation over a temperature range of  
0° to 85°C using the decoupling circuit shown in Figure 3. The  
output will saturate outside of the specified pressure range.  
Figure 3 shows the recommended decoupling circuit for  
interfacing the output of the integrated sensor to the A/D input  
of a microprocessor or microcontroller. Proper decoupling of  
the power supply is recommended.  
pressure input. Typical, minimum, and maximum output  
5.0  
Transfer Function:  
4.5  
V
out = VS*(0.018*P+0.5) ± ERROR  
4.0  
3.5  
3.0  
VS = 5.0 Vdc  
TEMP = 0 to 85°C  
TYPICAL  
2.5  
MAX  
2.0  
1.5  
1.0  
0.5  
0
MIN  
-25  
0
25  
Differential Pressure (kPa)  
Figure 2. Output versus Pressure Differential  
+5 V  
OUTPUT  
Vout  
Vs  
IPS  
1.0 µF  
GND  
470 pF  
0.01 µF  
Figure 3. Recommended Power Supply Decoupling  
and Output Filtering  
(For additional output filtering, please refer to  
Application Note AN1646.))  
MPXV7025  
Sensors  
4
Freescale Semiconductor  
Pressure  
Transfer Function  
Nominal Transfer Value: Vout = VS (P x 0.018 + 0.5)  
± (Pressure Error x Temp. Factor x 0.018 x VS)  
V
S = 5.0 V ± 0.25 Vdc  
Temperature Error Band  
MPXV7025 SERIES  
4.0  
Temp  
Multiplier  
3.0  
–40  
0 to 85  
+125  
3
1
3
Temperature  
Error  
Factor  
2.0  
1.0  
0.0  
–40  
–20  
0
20  
40  
60  
80  
100  
120  
140  
Temperature in °C  
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.  
Pressure Error Band  
Error Limits for Pressure  
3.0  
2.0  
1.0  
Pressure (in kPa)  
0.0  
-25  
0
25  
–1.0  
–2.0  
–3.0  
Pressure  
Error (Max)  
-25 to 25 (kPa) ±1.25 (kPa)  
MPXV7025  
Sensors  
Freescale Semiconductor  
5
Pressure  
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE  
Freescale designates the two sides of the pressure sensor  
as the Pressure (P1) side and the Vacuum (P2) side. The  
Pressure (P1) side is the side containing fluorosilicone gel  
which protects the die from harsh media. The pressure  
sensor is designed to operate with positive differential  
pressure applied, P1 > P2.  
The Pressure (P1) side may be identified by using the  
following table:  
Pressure (P1)  
Side Identifier  
Part Number  
Case Type  
MPXV7025GC6U/C6T1, MPVZ7025GC6U/T1  
MPXV7025GP, MPVZ7025GP  
MPXV7025DP, MPVZ7025DP  
MPVZ7025G6U/T1  
Side with Port Attached  
482A  
1369  
1351  
482  
Side with Port Attached  
Side with Part Marking  
Side with Part Marking  
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS  
Surface mount board layout is a critical portion of the total  
design. The footprint for the surface mount packages must be  
the correct size to ensure proper solder connection interface  
between the board and the package. With the correct  
footprint, the packages will self align when subjected to a  
solder reflow process. It is always recommended to design  
boards with a solder mask layer to avoid bridging and  
shorting between solder pads.  
0.100 TYP 8X  
2.54  
0.660  
16.76  
0.060 TYP 8X  
1.52  
0.300  
7.62  
inch  
0.100 TYP 8X  
2.54  
mm SCALE 2:1  
Figure 4. Small Outline Package Footprint  
MPXV7025  
Sensors  
6
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
-A-  
D 8 PL  
4
1
M
S
S
A
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
0.25 (0.010)  
T
B
5
8
N
-B-  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
G
INCHES  
MIN MAX  
MILLIMETERS  
DIM  
A
B
C
D
G
H
J
K
M
N
MIN  
10.54  
10.54  
12.70  
0.96  
MAX  
10.79  
10.79  
13.21  
1.07  
S
0.415 0.425  
0.415 0.425  
0.500 0.520  
0.038 0.042  
0.100 BSC  
W
2.54 BSC  
0.002 0.010  
0.009 0.011  
0.061 0.071  
0.05  
0.23  
1.55  
0˚  
0.25  
0.28  
1.80  
7˚  
V
0˚  
7˚  
C
0.444 0.448  
0.709 0.725  
0.245 0.255  
0.115 0.125  
11.28  
18.01  
6.22  
2.92  
11.38  
18.41  
6.48  
3.17  
S
V
W
H
J
-T-  
SEATING  
PLANE  
PIN 1 IDENTIFIER  
M
K
CASE 482A-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
-A-  
D 8 PL  
0.25 (0.010)  
4
1
M
S
S
A
T
B
5
8
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
-B-  
G
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
INCHES  
MIN MAX  
MILLIMETERS  
S
N
DIM  
A
B
C
D
G
H
J
K
M
N
MIN  
10.54  
10.54  
5.38  
MAX  
10.79  
10.79  
5.84  
0.415 0.425  
0.415 0.425  
0.212 0.230  
0.038 0.042  
0.100 BSC  
0.96  
1.07  
2.54 BSC  
0.002 0.010  
0.009 0.011  
0.061 0.071  
0.05  
0.23  
1.55  
0˚  
0.25  
0.28  
1.80  
7˚  
H
C
J
0˚  
7˚  
-T-  
0.405 0.415  
0.709 0.725  
10.29  
18.01  
10.54  
18.41  
SEATING  
PLANE  
S
PIN 1 IDENTIFIER  
K
M
CASE 482-01  
ISSUE O  
SMALL OUTLINE PACKAGE  
MPXV7025  
Sensors  
Freescale Semiconductor  
7
Pressure  
PACKAGE DIMENSIONS  
2 PLACES 4 TIPS  
0.006 (0.15) C A  
B
E
A
GAGE  
PLANE  
e
5
8
4
1
e/2  
.014 (0.35)  
θ
L
A1  
D
F
DETAIL G  
NOTES:  
8X b  
0.004 (0.1)  
1. CONTROLLING DIMENSION: INCH.  
2. INTERPRET DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994.  
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE  
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)  
PER SIDE.  
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.  
STYLE 1:  
PIN 1. GND  
STYLE 2:  
PIN 1. N/C  
2. Vs  
M
C
A
B
2. +Vout  
3. Vs  
3. GND  
4. Vout  
5. N/C  
6. N/C  
7. N/C  
8. N/C  
4. -Vout  
5. N/C  
6. N/C  
7. N/C  
8. N/C  
E1  
B
INCHES  
DIM MIN MAX  
0.370  
A1 0.002  
MILLIMETERS  
MIN MAX  
N
T
∅
A
0.390  
0.010  
0.042  
0.485  
0.700  
0.485  
9.39  
0.05  
0.96  
9.91  
0.25  
1.07  
b
D
E
0.038  
0.465  
0.680  
11.81 12.32  
17.27 17.78  
11.81 12.32  
2.54 BSC  
E1 0.465  
M
A
e
F
K
L
M
N
P
T
θ
0.100 BSC  
0.240  
0.115  
0.040  
0.270  
0.160  
0.009  
0.110  
0˚  
0.260  
0.135  
0.060  
0.290  
0.180  
0.011  
0.130  
7˚  
6.10  
2.92  
1.02  
6.86  
4.06  
0.23  
2.79  
0˚  
6.60  
3.43  
1.52  
7.37  
4.57  
0.28  
3.30  
7˚  
8X  
0.004 (0.1)  
K
P
DETAIL G  
SEATING  
PLANE  
C
CASE 1351-01  
ISSUE O  
SMALL OUTLINE PACKAGE  
MPXV7025  
Sensors  
Freescale Semiconductor  
8
Pressure  
PACKAGE DIMENSIONS  
2 PLACES 4 TIPS  
0.008 (0.20) C A  
B
E
A
GAGE  
PLANE  
e
5
8
4
1
e/2  
.014 (0.35)  
θ
L
A1  
D
F
DETAIL G  
NOTES:  
1. CONTROLLING DIMENSION: INCH.  
2. INTERPRET DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994.  
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE  
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)  
PER SIDE.  
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.  
8X b  
0.004 (0.1)  
M
C
A
B
E1  
B
INCHES  
DIM MIN MAX  
0.300  
A1 0.002  
MILLIMETERS  
MIN  
7.11  
MAX  
7.62  
0.25  
N
T
∅
A
0.330  
0.010  
0.042  
0.485  
K
0.05  
0.96  
b
D
E
0.038  
0.465  
0.717 BSC  
1.07  
12.32  
11.81  
18.21 BSC  
E1 0.465  
0.485  
11.81  
2.54 BSC  
12.32  
A
M
e
F
K
L
M
N
P
T
θ
0.100 BSC  
0.245  
0.120  
0.061  
0.270  
0.080  
0.009  
0.115  
0˚  
0.255  
0.130  
0.071  
0.290  
0.090  
0.011  
0.125  
7˚  
6.22  
3.05  
1.55  
6.86  
2.03  
0.23  
2.92  
0˚  
6.47  
3.30  
1.80  
7.36  
2.28  
0.28  
3.17  
7˚  
8X  
0.004 (0.1)  
P
DETAIL G  
SEATING  
PLANE  
C
CASE 1369-01  
ISSUE O  
SMALL OUTLINE PACKAGE  
MPXV7025  
Sensors  
Freescale Semiconductor  
9
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© Freescale Semiconductor, Inc. 2009. All rights reserved.  
MPXV7025  
Rev. 5  
1/2009  

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 Tire Pressure Monitoring Sensor Temperature Compensated
MOTOROLA

MPXY8010A6T1

 ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 0-8.7Psi, SQUARE, SURFACE MOUNT, SSOP-8
MOTOROLA

MPXY8020A

 TIRE PRESSURE MONITORING SENSOR TEMPERATURE COMPENSATED AND CALIBRATED FULLY INTEGRATED DIGITAL OUTPUT
MOTOROLA

MPXY8020A

 Tire Pressure Monitoring Sensor Temperature Compensated and Calibrated, Fully Integrated Digital Output
FREESCALE

MPXY8020A6T1

 TIRE PRESSURE MONITORING SENSOR TEMPERATURE COMPENSATED AND CALIBRATED FULLY INTEGRATED DIGITAL OUTPUT
MOTOROLA
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