FTK4N65D [FS]

4 Amps, 650 Volt N-CHANNEL POWER MOSFET;
FTK4N65D
型号: FTK4N65D
厂家: First Silicon Co., Ltd    First Silicon Co., Ltd
描述:

4 Amps, 650 Volt N-CHANNEL POWER MOSFET

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SEMICONDUCTOR  
FTK4N65P/F/I/D  
TECHNICAL DATA  
4 Amps, 650 Volt  
Power MOSFET  
N-CHANNEL POWER MOSFET  
I :  
1
TO - 251  
D :  
DESCRIPTION  
1
TO - 252  
The FTK4N65 is a high voltage MOSFET and is designed to  
have better characteristics, such as fast switching time, low gate  
charge, low on-state resistance and have a high rugged avalanche  
characteristics. This power MOSFET is usually used at high speed  
switching applications in power supplies, PWM motor controls, high  
efficient DC to DC converters and bridge circuits.  
P :  
1
TO - 220  
F :  
FEATURES  
1
TO - 220F  
* RDS(ON) = 2.7Ω@VGS = 10V  
* Ultra low gate charge ( typical 12 nC )  
* Low reverse transfer Capacitance ( CRSS = typical 6.5 pF )  
* Fast switching capability  
* Avalanche energy Specified  
* Improved dv/dt capability, high ruggedness  
SYMBOL  
2.Drain  
1.Gate  
3.Source  
ORDERING INFORMATION  
Pin Assignment  
Ordering Number  
FTK4N65P  
Package  
Packing  
1
G
2
D
3
TO-220  
TO-220F  
TO-251  
TO-252  
S
Tube  
Tube  
Tube  
G
G
G
D
D
D
S
S
S
FTK4N65F  
FTK4N65I  
FTK4N65D  
Tape Reel  
Note: Pin Assignment:  
G: Gate  
D: Drain  
S: Source  
2012. 07. 03  
Revision No : 0  
1/7  
FTK4N65P/F/D/I  
(TC= 25˚C, unless otherwise specified)  
ABSOLUTE MAXIMUM RATINGS  
PARAMET  
SYMBOL  
VDSS  
RATINGS  
UNIT  
V
Drain-Source Voltage  
Gate-Source Voltage  
650  
VGSS  
V
±30  
IAR  
Avalanche Current (Note 1)  
A
4.4  
TC = 25°C  
3.6  
A
Continuous Drain Current  
Pulsed Drain Current (Note 1)  
Avalanche Energy  
ID  
TC = 100°C  
2.3  
16  
IDM  
EAS  
EAR  
dv/dt  
PD  
A
Single Pulse(Note 2)  
mJ  
mJ  
150  
Repetitive Limited by TJ(MAX)  
7.0  
Peak Diode Recovery dv/dt (Note 3)  
V/ns  
W
4.5  
Tc=25  
45/45/31/62.5  
0.36/0.36/0.25/0.5  
+150  
Total Power Dissipation  
(TO-251/252/TO-220F/220)  
W
Derate above 25°C  
˚C  
TJ  
Junction Temperature  
Operating Temperature  
Storage Temperature  
TOPR  
TSTG  
˚C  
˚C  
-55 ~ +150  
-55 ~ +150  
Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.  
Absolute maximum ratings are stress ratings only and functional device operation is not implied.  
(TC = 25˚C , unless Otherwise specified.)  
ELECTRICAL CHARACTERISTICS  
PARAMETER  
OFF CHARACTERISTICS  
Drain-Source Breakdown Voltage  
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
BVDSS  
IDSS  
VGS = 0V, ID = 250µA  
VDS = 600V, VGS = 0V  
VDS = 480V, TC = 125°C  
650  
V
1
µA  
µA  
Drain-Source Leakage Current  
Gate-Source Leakage Current  
10  
V
GS = 30V, VDS = 0V  
Forward  
Reverse  
100  
nA  
nA  
IGSS  
VGS = -30V, VDS = 0V  
-100  
ID = 250µA, Referenced to  
25°C  
ΔBVDSS / ΔTJ  
Breakdown Voltage Temperature Coefficient  
0.7  
1.9  
V / ˚C  
ON CHARACTERISTICS  
Gate Threshold Voltage  
VGS(TH)  
RDS(ON)  
gFS  
VDS = VGS, ID = 250µA  
VGS = 10V, ID = 2.0A  
2.0  
4.0  
2.7  
V
S
Drain-Source On-State Resistance  
VDS = 50V, ID = 2.0A (Note 4)  
Forward Transconductance  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
CISS  
COSS  
CRSS  
510  
60  
pF  
pF  
pF  
VDS = 25V, VGS = 0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
SWITCHING CHARACTERISTICS  
Turn-On Delay Time  
6.5  
tD(ON)  
20  
ns  
tR  
tD(OFF)  
tF  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
VDD = 325V, ID=3.6A, R = 25Ω  
(Note 4,5)  
15  
45  
15  
12  
2.5  
ns  
ns  
G
ns  
QG  
nC  
nC  
VDS = 520V,ID = 3.6A, V =10V  
GS  
QGS  
(Note 4,5)  
QGD  
Gate-Drain Charge  
5.0  
nC  
2012. 07. 03  
Revision No : 0  
2/7  
FTK4N65P/F/D/I  
ELECTRICAL CHARACTERISTICS(Cont.)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS  
VSD  
IS  
VGS = 0 V, IS = 4.0 A  
Drain-Source Diode Forward Voltage  
1.4  
3.6  
V
A
Maximum Continuous Drain-Source Diode  
Forward Current  
Maximum Pulsed Drain-Source Diode Forward  
Current  
ISM  
A
14.4  
tRR  
VGS = 0 V, IS = 4.0A,  
d F/dt =100 A/µs (Note 4)  
Reverse Recovery Time  
350  
2.1  
ns  
QRR  
l
Reverse Recovery Charge  
µC  
Note:  
1. Repetitive Rating : Pulse width limited by maximum junction temperature  
2. L = 15mH, IAS=3.6A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C  
3. ISD ≤ 7A, di/dt ≤ 300A/μs, VDD ≤ BVDSS, Starting TJ = 25°C  
4. Pulse Test: Pulse width ≤ 300μs, Duty cycle ≤ 2%  
5. Essentially independent of operating temperature  
2012. 07. 03  
Revision No : 0  
3/7  
FTK4N65P/F/D/I  
TEST CIRCUITS AND WAVEFORMS  
+
D.U.T.  
VDS  
-
+
-
L
RG  
Driver  
VDD  
* dv/dt controlled by R  
G
* ISD controlled by pulse period  
* D.U.T.-Device Under Test  
Same Type  
as D.U.T.  
VGS  
Fig. 1A Peak Diode Recovery dv/dt Test Circuit  
Period  
P. W.  
VGS  
(Driver)  
D=  
P.W.  
Period  
10V  
=
VGS  
I
FM, Body Diode Forward Current  
ISD  
(D.U.T.)  
di/dt  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VDS  
(D.U.T.)  
VDD  
Body Diode  
Forward Voltage Drop  
Fig. 1B Peak Diode Recovery dv/dt Waveforms  
2012. 07. 03  
Revision No : 0  
4/7  
FTK4N65P/F/D/I  
TEST CIRCUITS AND WAVEFORMS (Cont.)  
RL  
VDS  
VDS  
90%  
VDD  
VGS  
RG  
10%  
VGS  
D.U.T.  
10V  
tD(ON)  
tD(OFF)  
Pulse Width 1μs  
Duty Factor 0 1%  
tF  
tR  
Fig. 2A Switching Test Circuit  
Fig. 2B Switching Waveforms  
Same Type  
as D.U.T.  
50kΩ  
QG  
12V  
10V  
0 3μF  
0.2μF  
VDS  
QGS  
QGD  
VGS  
DUT  
VG  
3mA  
Charge  
Fig. 3A Gate Charge Test Circuit  
Fig. 3B Gate Charge Waveform  
L
VDS  
BVDSS  
RD  
VDD  
10V  
D.U.T.  
tp  
IAS  
Time  
tp  
Fig. 4A Unclamped Inductive Switching Test Circuit  
Fig. 4B Unclamped Inductive Switching Waveforms  
2012. 07. 03  
Revision No : 0  
5/7  
FTK4N65P/F/D/I  
TYPICAL CHARACTERISTICS  
Fig1. I - V  
Fig2. I - V  
D
D
GS  
DS  
100  
10  
V
DS  
=25V  
101  
V
=10V, 7V  
GS  
100 C  
25 C  
100  
1
V
=5V  
GS  
10-1  
0.1  
0.1  
10  
Drain - Source Voltage VDS (V)  
2
4
6
8
10  
1
100  
Gate - Source Voltage VGS (V)  
Fig3. BV  
- T  
Fig4. R  
- I  
DS(ON) D  
DSS  
j
1.2  
1.1  
1.0  
0.9  
0.8  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0
VGS = 0V  
IDS = 250  
V
=7V  
GS  
V
=10V  
GS  
100  
-100  
-50  
0
50  
150  
0
1
2
3
4
5
6
7
8
Junction Temperature Tj (  
)
Drain Current ID (A)  
C
Fig6. R  
- T  
j
DS(ON)  
Fig5. I - V  
S
SD  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V
I
=10V  
= 1.8A  
GS  
DS  
101  
100  
10-1  
150 C  
25 C  
-100  
-50  
0
50  
100  
150  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
(V)  
Junction Temperature T (  
)
C
Source - Drain Voltage VSD  
j
2012. 07. 03  
Revision No : 0  
6/7  
FTK4N65P/F/D/I  
TYPICAL CHARACTERISTICS(Cont.)  
Fig 7. C - V  
DS  
Fig8. Q - V  
g
GS  
104  
103  
102  
101  
100  
12  
10  
8
ID=3 6A  
V
= 520V  
DS  
C
C
iss  
6
oss  
4
C
rss  
2
0
0
2
4
6
8
10  
12  
(nC)  
14  
16  
0
10  
20  
30  
40  
Gate - Charge  
Q
g
Drain - Source Voltage VDS (V)  
Fig10. Safe Operation Area  
Fig9. Safe Operation Area  
(FTK4N65P)  
(FTK4N65F)  
101  
100  
10-1  
10-2  
101  
100  
10-1  
10-2  
10µs  
10µs  
100µs  
100µs  
1ms  
1ms  
10ms  
DC  
10ms  
Operation in this  
area is limited by RDS(ON)  
Operation in this  
area is limited by RDS(ON)  
DC  
T = 25  
T = 25  
C
c
C
c
C
C
T = 150  
j
T = 150  
j
Single nonrepetitive pulse  
Single nonrepetitive pulse  
102  
103  
102  
103  
100  
101  
100  
101  
Drain - Source Voltage V  
(V)  
Drain - Source Voltage V (V)  
DS  
DS  
Fig11. I - T  
D
j
4
3
2
1
0
0
25  
50  
75  
100  
125  
150  
Junction Temperature T  
(
)
C
j
2012. 07. 03  
Revision No : 0  
7/7  

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