FMA1127DC-24N [FUJITSU]
Microprocessor Circuit, CMOS, 4 X 4 MM, 0.85 MM HEIGHT, 0.50 MM PITCH, QFN-24;
| 型号： | FMA1127DC-24N |
| 厂家： | 
FUJITSU |
| 描述： | Microprocessor Circuit, CMOS, 4 X 4 MM, 0.85 MM HEIGHT, 0.50 MM PITCH, QFN-24 外围集成电路 |
| 文件： | 总32页 (文件大小：1958K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FMA1127DC
Touch Sensor Controller
Overview
The FMA1127DC is a low-power, compact, flexible touch sensor
controller that converts capacitance generated between the human
body and a conductive touch pad to digital data without any analog
signal processing.
Touch Pad
Zin
Zin
Impendance
Change
Detection
Its programmability increases design flexibility and gives better
performance and stability for a broad range of applications.The
FMA1127DC’sAutomatic Impedance Calibration (AIC™) function
can be easily configured to support different sensitivities for
individual channels independently as well as to change values of
parameters, such as calibration intervals.AIC may also be
temporarily paused and resumed by a host MCU.
Zref
Zref
Zin < Zref
Touch Pad System Model
Impedance Status
Among the many new features of the FMA1127DC isAdjacent
Pattern Interference Suppression (APIS™).APIS is a filtering
function that eliminates adjacent key or pattern interference.The
FMA1127DC also gives touch-strength output in addition to touch
on/off output.There is a number of DIOs depending on the package
type that can be configured and programmed to meet a customer’s
specific needs, giving customers even greater flexibility and value.
Ztouch
Touch Pad
Zin
Zin
Impendance
Change
Detection
Zref
Zref
The FMA1127DC comes with various package types to support
different number of input channels and DIOs.
Touch
Detected
Touch Pad System Model
Impedance Status
The FMA1127DC touch sensor controller is developed and owned by
ATLab Inc., South Korea, and is distributed by Fujitsu
Semiconductor Europe.
• Three different modes forAdjacent Pattern Interference Suppres-
sion (APISTM
)
Features
• Patented full-digital architecture
• Extremely low power consumption (140mA in active mode)
• Supports 12 input channels (40QFN) or 9 input channels (32QFN
and 24SSOP) or 6 input channels (24QFN and 20SSOP)
• Programmable registers to characterize applications
• I2C interface with the host MCU
• ConfigurableAutomatic Impedance Calibration (AICTM
• Configurable DIO pins as direct touch outputs, extended GPIOs,
or external interrupt inputs
• Beep generation for tactile feeling
• Idle and Sleep modes for power saving
• De-bounced touch outputs and external inputs
• 5 steps of FIFO to save external inputs for a slow speed of MCU
Applications
)
• Portable devices such as PDAs, cellular phones, MP3
players, remote controllers, and other integrated input devices
• Home appliances and consumer electronic products
• Computer input devices such as mice and keyboards
• Two types of interrupts (GINT for general purpose andTINT for
touch detection)
• 8-bit resolution of touch strength data (256 steps)
Touch Sensor Controller
Table of Contents
Ordering Information ............................................................................................................................................................................... 1
Package Pinouts ...................................................................................................................................................................................... 1
Electrical Characteristics .......................................................................................................................................................................... 3
Operation Principles................................................................................................................................................................................. 4
Touch Detection................................................................................................................................................................................ 4
AIC™ (Automatic Impedance Calibration)........................................................................................................................................... 4
APIS™Touch Output ....................................................................................................................................................................... 4
Functional Characteristics ........................................................................................................................................................................ 6
Communication Specifications for I2C.......................................................................................................................................................... 7
Application Information ........................................................................................................................................................................... 9
40-pin Package (40QFN) ................................................................................................................................................................... 9
32-pin Package (32QFN) ................................................................................................................................................................. 11
24-pin Package (24QFN) ................................................................................................................................................................. 13
30-pin Package (30SSOP) ................................................................................................................................................................ 15
24-pin Package (24SSOP) ................................................................................................................................................................ 17
20-pin Package (20SSOP) ................................................................................................................................................................ 19
Power Connection ................................................................................................................................................................................. 21
Power Sequence ..................................................................................................................................................................................... 22
Power ConnectionType is Case B or Case D ......................................................................................................................................... 22
Power ConnectionType is CaseA, Case C, or Case E .............................................................................................................................. 22
Register Map Summary ........................................................................................................................................................................... 23
Package Dimensions ............................................................................................................................................................................... 24
40QFN ......................................................................................................................................................................................... 24
32QFN ......................................................................................................................................................................................... 25
24QFN ......................................................................................................................................................................................... 26
30SSOP......................................................................................................................................................................................... 27
24SSOP......................................................................................................................................................................................... 28
20SSOP ........................................................................................................................................................................................ 29
Solder Reflow PeakTemperature ............................................................................................................................................................... 29
Revision History .................................................................................................................................................................................... 30
FMA1127DC
Ordering Information
Number of Sensor
Number of Digital
Outputs
Product Code
Package Type
Package Dimension
Pin Pitch
Inputs
FMA1127DC-40N
FMA1127DC-32N
FMA1127DC-24N
FMA1127DC-24S
FMA1127DC-20S
40QFN
32QFN
5mm x 5mm x 0.85mm
4mm x 4mm x 0.9mm
0.4mm
0.4mm
0.5mm
0.65mm
0.65mm
12
9
12
8
24QFN
4mm x 4mm x 0.85mm
8.2mm x 7.8mm x 2.0mm
6.5mm x 6.4mm x 1.85mm
6
3
24SSOP
20SSOP
9
3
6
2
Package Pinouts
31
20
S2
S9
32
19
25
16
15
14
13
12
11
10
9
S1
S0
RESET_N
S10
S11
AREF
CONFIG_0
CONFIG_1
DIO_6
DIO_7
DIO_8
S3
S2
S1
S8
AREF
CONFIG_0
CONFIG_1
DIO_6
DIO_7
DIO_8
DIO_9
33
18
26
27
28
29
30
31
32
34
17
35
16
ID_1
S0
FMA1127DC
FMA1127DC
32N
36
37
38
39
40
15
ID_0
DIO_5
DIO_4
DIO_3
DIO_2
RESET_N
ID
14
40N
13
DIO_3
DIO_2
12
11
DIO_9
32-Pin QFN
40-Pin QFN
19
20
21
12
11
10
S2
S1
S0
S8
AREF
CONFIG_0
CONFIG_2
DIO_8
FMA1127DC
24N
22
23
24
9
8
7
RESET_N
ID
DIO_2
TOSC
24-Pin QFN
Fujitsu Semiconductor Europe
1
Touch Sensor Controller
1
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
RESET_N
ID
S0
2
S1
3
DIO_5
DIO_4
DIO_3
DIO_2
DIO_1
DIO_0
SDA
S2
4
S3
1
24
23
22
21
20
19
18
17
16
15
14
13
SO
RESET_N
ID
S1
5
S4
2
S2
6
S5
3
S3
7
VPH
VLDO
V25
S6
4
DIO_0
SDA
S4
8
5
S5
9
6
SCL
VPH
VLDO
V25
S6
10
12
13
14
15
SCL
7
TINT
TINT
S7
8
GINT
GINT
TCLK
VSS
S8
9
TCLK
VSS
S9
10
11
12
S8
S10
S11
DIO_8
DIO_6
S9
AREF
AREF
30-Pin SSOP
24-Pin SSOP
1
20
RESET_N
ID
S0
2
19
18
17
16
15
14
13
12
11
S1
S2
S3
3
DIO_0
SDA
4
5
SCL
VPH
VLDO
V25
VSS
S8
6
TINT
7
GINT
TCLK
DIO_8
AREF
8
9
10
S9
20-Pin SSOP
2
Fujitsu Seminconductor Europe
FMA1127DC
Electrical Characteristics
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
ABSOLUTE MAXIMUM RATINGS
Tstg
Topr
Hopr
VPH
VLDO
V25
Storage Temperature
Operating Temperature
Operating Humidity
-45
-40
5
95
90
°C
°C
%
V
95
IO Power Supply Voltage
Core Power Supply Voltage
Core Input Voltage
VPH should be higher than 3V when using internal LDO
2.3
2.3
2.3
3.3
2.5
2.5
5.5
2.7
2.7
V
V
RECOMMENDED OPERATING CONDITIONS
Toprr
Vddp
Vddc
Tr_i
Operating Temperature
-40
2.4
2.4
25
90
5.3
2.6
5
°C
V
Power Supply Voltage (VPH)
Power Supply Voltage (VLDO)
Digital Input Rising Time
Digital Input Falling Time
2.5
V
ns
ns
Tf_i
5
AC ELECTRICAL SPECIFICATIONS (Typical values at Ta = 25°C and VPH = 3.3V)
fsys
fi
System Clock
1.3
2.5
10
1.6
2.1
20
MHz
KHz
Hz
Input frequency (Sensor Clock)
Sample frequency
When System Clock is 1.6MHz
When System Clock is 1.6MHz
fsmp
Stch
Rs_i
TCsr_i
Tr_o
Tf_o
20,000
Touch Sensitivity
0.078
15
pF
Sensor Input Resistance
Tuning Capacitor in Aref or Sin
Output Rising Time
KΩ
pF
0
15
60
60
Load = 100pF
Load = 100pF
50
50
ns
Output Falling Time
ns
DC ELECTRICAL SPECIFICATIONS (Typical values at Ta=25°C and VPH=3.3V)
Idd_a
Idd_i
Idd_ael
Idd_iel
Idd_aeo
Idd_ieo
Idd_s
Vil
Supply Current (Active mode)
Supply Current (Idle mode)
Supply Current (Active mode)
Supply Current (Idle mode)
Supply Current (Active mode)
Supply Current (Idle mode)
Supply Current (Sleep mode)
Digital Input Low Voltage
Digital Input High Voltage
Digital Output Low Voltage
Digital Output High Voltage
Internal LDO Output Voltage
Internal LDO Driving Current
80
40
50
35
45
30
140
100
100
80
200
160
180
140
165
120
1
μA
μA
μA
μA
μA
μA
μA
V
When using internal 2.5V LDO and internal Clock
When using external 2.5V LDO and internal Clock
100
60
When using external 2.5V LDO and external Clock
When using external 2.5V LDO
0.1
0.7
Vih
0.8xVPH
V
Vol
0.6
V
Voh
VPH-0.5
2.3
V
Vldo
2.5
3.0
20
V
Ildo
mA
16
Idr
Iol
GPIO Driving Current
-2 (Source)
mA
mA
(Sync)
At Vol = 0.6V
At Vol = 0.4V
8.4
5.7
Digital Output Low Current
Fujitsu Semiconductor Europe
3
Touch Sensor Controller
Operation Principles
Touch Detection
The FMA1127DC touch sensor controller includes the Impedance Change Detection engine within the device. It detects the impedance difference
between reference and sensor input.
Ztouch
Touch Pad
Touch Pad
Zin
Zin
Zin
Impendance
Change
Detection
Zin
Impendance
Change
Detection
Zref
Zref
Zref
Zref
Touch
Detected
Zin < Zref
Touch Pad System Model
Impedance Status
Touch Pad System Model
Impedance Status
Figure 1:When a Pad is Not Touched.
Figure 2:When a Pad is Touched.
As shown in Figure 1, if the pad is not touched, the impedance of the sensor input Zin should be kept less than the impedance of the reference
Zref. If the pad is touched, as shown in Figure 2, Zin is increased by Ztouch.When Ztouch by touching becomes greater than the difference of Zin
and Zref in the not touched state, i.e., if Zin in touched state becomes greater than Zref by a value higher than 0.078pF, the ICD (Impedance
Change Detection) engine within the chip generates the acknowledged output signal indicating it senses the touch.
1, if Zin – Zref > 0.078pF
IDC =
0, otherwise
Notice the higher value of 0.078pF or higher is needed to maintain stable output against various noises.The sensor input impedance, Zin,
includes parasitic capacitance of the input line, tuning capacitance of input pin and on-chip input impedance, while Zref includes on-chip
impedance,AIC control values and external tuning capacitance if necessary.
AIC™ (Automatic Impedance Calibration)
Automatic Impedance Calibration (AIC) maintains consistent sensitivity against external environmental changes such as temperature, supply
voltage and current, humidity, and system-level variations.This helps users develop their applications more conveniently by providing the actual
impedance value of each sensor input. For developers, aTuningViewer program is provided, which helps to optimize the PCB design and to decide
AIC input parameters. More detailed information is available in the FM1127 Tuning Guide.
The ICD engine residing in the FMA1127DC controls reference impedance values for each sensor input pin by acquiring each input impedance
data. It periodically updates all reference impedance values under the condition that all twelve touch pads remain in no-touched status.This
auto-calibration function absorbs environmental changes and guarantees product stability.
APIS™ Touch Output
When touch pads are arranged too closely to each other, it is sometimes difficult to identify which pad is touched.APIS™ (Adjacent Pattern
Interference Suppression) is a filtering function to identify which pads are intentionally touched. If APIS mode is not defined, all touch data
withoutAPIS filtering are transmitted to the MCU. For example, if the application is a numeric keypad, the user can use theAPIS mode1 to get
the strongest output and filter out all other weakly touched inputs.WithoutAPIS, the host may have to do this filtering function.APIS reduces
the burden of the host computing time.
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Fujitsu Seminconductor Europe
FMA1127DC
There are three modes inAPIS:
APIS mode 1: reports the strongest output only (Figure 3).
APIS mode 2: reports all outputs that exceeds pre-defined thresholds (value of StrengthThreshold register) (Figure 4).
APIS mode 3: reports two strongest outputs (suitable for multi-touch applications) (Figure 5).
All three modes are described in the Figures below.The red-colored circles and bars show the output.
1
4
7
2
5
8
3
6
9
#
1
4
7
2
5
3
6
9
#
APIS Mode I
Output Data
Touch Interference
Area
strength
*
*
8
0
#
*
*
*
Real Touch Output
Touch Output by APIS I
1
4
7
2
5
8
0
3
6
9
#
1
4
7
2
5
3
6
9
#
APIS Mode II
Output Data
Touch Interference
Area
strength
Strength
Threshold
*
*
8
0
#
Real Touch Output
Touch Output by APIS II
1
4
7
2
5
8
0
3
6
9
#
1
4
7
2
5
0
3
6
9
#
APIS Mode III
Output Data
Touch Interference
Area
strength
*
*
8
0
#
Real Touch Output
Touch Output by APIS III
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5
Touch Sensor Controller
Functional Characteristics
Active to Idle
Idle to Active
Active to Sleep
Idle to Sleep
Sleep to Active
Min: 2ns,
Max: 10ms
1ns
1ns
10μs
System Clock: 1.6MHz,
0.25 x A sec.
Sensor Clock: 20kHz
Min: 2ns,
Max: 20ms
1ns
1ns
1ns
1ns
1ns
1ns
1ns
1ns
1ns
1ns
1ns
1ns
1ns
1ns
10μs
10μs
10μs
10μs
10μs
10μs
10μs
System Clock: 1.6MHz,
0.5 x A sec.
Sensor Clock: 10kHz
Min: 2ns,
Max: 20ms
System Clock: 800kHz,
0.5 x A sec.
Sensor Clock: 10kHz
Min: 2ns,
Max: 40ms
System Clock: 800Hz,
1 x A sec.
Sensor Clock: 5kHz
Min: 2ns,
Max: 40ms
System Clock: 400kHz,
1 x A sec.
Sensor Clock: 5kHz
Min: 2ns,
Max: 80ms
System Clock: 400kHz,
2 x A sec.
Sensor Clock: 2.5kHz
Min: 2ns,
Max: 80ms
System Clock: 200kHz,
2 x A sec.
Sensor Clock: 2.5kHz
Min: 2ns,
Max: 160ms
System Clock: 200kHz,
4 x A sec.
Sensor Clock: 1.25kHz
A = IDLE Time Register Value
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Fujitsu Seminconductor Europe
FMA1127DC
Communication Specifications for I2C
Table 1: DC Electrical Specifications for I2C Bus
Standard-Mode
Fast-Mode
Symbol
Parameter
Unit
Min.
Max.
Min.
Max
LOW Level Input Voltage:
-0.5
-0.5
1.5
n/a
n/a
V
V
Fixed Input Levels
VIL
(1)
0.3 VDD
-0.5
0.3 x VDD
VDD Related Input Levels
HIGH Level Input Voltage:
Fixed Input Levels
(2)
(2)
3.0
n/a
n/a
(2)
V
V
VIH
0.7 x VDD
0.7 x VDD
VDD Related Input Levels
Hysteresis of Schmitt Trigger Inputs:
VDD > 2V
(2)
(2)
3.0
n/a
n/a
(2)
V
V
Vhys
0.7 x VDD
0.7 x VDD
V
DD < 2V
LOW Level Output Voltage (open drain or collector)
at 3mA Sink Current:
VDD > 2V
V
V
0
0.4
n/a
0
0
0.4
VOL1
VOL3
n/a
0.2 x VDD
VDD < 2V
Digital Output Low Current at
Vol = 0.6V
Iol
8.4
5.7
8.4
5.7
mA
mA
Vol = 0.4V
250(4)
n/a
20 + 0.1Cb(3)
ns
ns
μA
pF
Output Fall Time from VIHmin to VILmax with a Bus
Capacitance from 10pF to 400pF
tof
n/a
-10
0
50
10(5)
10
Pulse Width of Spike Which Must be Suppressed by
the Input Filter
tsp
10
-10(5)
Input Current each I/O Pin with an Input Voltage
Between 0.1VDD and 0.9V VDDmax
Ii
10
Ci
Capacitance for Each I/O Pin
Note:
1. Devices that use non-standard supply voltages which do not conform to the intended I2C bus system levels must relate their input levels to the VDD voltage to which
the pull-up resistors Rp are connected.
2. Maximum VIH = VDDmax + 0.5V.
3. Cb = capacitance of one bus line in pF.
4. The maximum tf for the SDA and SCL bus lines quoted in Table 2 (300ns) is longer than the specified maximum tof for the output stages (250ns). The allows
series protection resistors (RS) to be connected between the SDA/SCL pins and the SDA/SCL bus lines as shown in Figure 6 without exceeding the maximum
specified for tf.
5. I/O pins of Fast-mode devices must not obstruct the SDA and SCL lines if VDD is switched off.
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7
Touch Sensor Controller
Table 2. AC Electrical Specifications for I2C Bus
Standard-Mode
Fast-Mode
Symbol
Parameter
Unit
Min.
Max.
Min.
Max
0
100
0
400
kHz
SCL Clock Frequency
fSCL
4.0
0.6
μs
Hold Time (repeated) START Condition. After this
Period, the First Clock Pulse is Generated
tHD:STA
4.7
4.0
4.7
1.3
0.6
0.6
μs
μs
μs
LOW Period of the SCL Clock
tLOW
tHIGH
HIGH Period of the SCL Clock
Setup Time for a Repeated START Condition
tSU:STA
Data Hold Time:
5.0
2(2)
–
–
0(2)
–
0.9(3)
μs
μs
tHD:DAT
For CBUS Compatible Master
For I2C Bus Devices
3.45(3)
250
100(4)
ns
ns
ns
μs
μs
pF
V
tSU:DAT
tr
Data Setup Time
1000
300
20 + 0.1Cb(5)
20 + 0.1Cb(5)
0.6
300
300
Rise Time of Both SDA and SCL Signals
Fall Time of Both SDA and SCL Signals
Setup Time for STOP Condition
tf
4.0
4.7
tSU:STO
fBUF
Cb
1.3
Bus Free Time Between a STOP and START Condition
Capacitive Load for Each Bus Line
400
400
0.1 x VDD
0.2 x VDD
0.1 x VDD
0.2 x VDD
Noise Margin at the LOW Level for Each Connected
Device (including Hysteresis)
VnL
VnH
V
Noise Margin at the HIGH Level for Each Connected
Device (including Hysteresis)
Notes:
1. All values referred to VIHmin and VILmax levels (see Table 1).
2. A device must internally provide a hold time of al least 300ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined regions of the
falling edge of SCL.
3. The maximum tHD:DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCL signal.
4. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU:DAT Š 250ns must then be met. This will automatically be the case
if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the
SDA line tmax + tSU:DAT = 1,000 + 250 = 1,250ns (according to the Standard-mode I2C bus specification) before the SCL line is released.
5. Cb = total capacitance of one bus line in pF. If mixed with Hs-mode devices, faster fall-times according the Table 2 are allowed.
n/a = not applicable.
SDA
t
t
SU:DAT
HD:STA
t
t
t
t
BUF
f
f
SP
t
t
r
r
t
LOW
SCL
t
t
SU:STO
t
SU:STA
HD:STA
t
t
HD:DAT
HIGH
S
Sr
P
S
Figure 6: Definition of Timing for F/S-mode Devices on the I2C-Bus
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Fujitsu Seminconductor Europe
FMA1127DC
Application Information
Top View of 40-pin Package (40QFN)
31
20
19
18
17
16
15
14
13
12
11
S2
S1
S0
S9
S10
S11
AREF
CONFIG_0
CONFIG_1
DIO_6
DIO_7
DIO_8
DIO_9
32
33
34
RESET_N
35
ID_1
ID_0
DIO_5
DIO_4
DIO_3
DIO_2
FMA1127DC
40N
36
37
38
39
40
40-Pin QFN
Pin Description
Name
IO
Pin #
Description
RESET_N
TCLK
S
I
I
I
I
34
Reset, active LOW
8
18-23 28-33
17
External Clock Input. Should be grounded if not used.
Twelve Sensor Inputs from external Touch Pads.
Reference Input.
A_REF
Configured by HOST:
DIO
IO
1, 2, 914, 38-40
- extended GPIOs, Direct Button Outputs or External Interrupt inputs
SDA
SCL
IO
I
3
Bidirectional I2C Data from/to Host
I2C CLK from Host
4
5
TINT
GINT
BEEP
ID
O
O
O
I
Touch Interrupt, it can be generated when touch status is changed.
General Interrupts including touch interrupt and EINT. Can be masked.
Beep Output.
6
7
35, 36
15, 16
27
I2C Chip ID Select(00:0x58, 01:0x59, 10:0x5A, 11:0x5B)
Test pins. Should be grounded.
Power (2.3V-5.5V)
CONFIG
VPH
I
P
O
P
P
VLDO
V25
26
2.5V Regulator Power Output
25
2.5V Power Input
VSS
24
Ground
Fujitsu Semiconductor Europe
9
Touch Sensor Controller
TypicalApplication Circuit
Touch PAD 0
Touch PAD 1
Touch PAD 2
Touch PAD 3
Touch PAD 0~11
R1 10K
Data Sensor
Tuning Cap
RESET_N
From MCU
1uF
C1
1
2
30
29
28
DIO_1
DIO_0
SDA
S3
S4
2K R2
2K R3
3
MCU
S5
Touch PAD 4
4
27
26
SCL
VPH
VLDO
V25
VSS
S6
VDD
MCU
MCU
5
FMA1127DC
40N
TINT
Touch PAD 5
Touch PAD 6
6
25
24
23
22
21
GINT
BEEP
TCLK
7
8
9
DIO_11
DIO_10
S7
S8
Touch PAD 7
Touch PAD 8
10
VDD
Touch PAD 9
Touch PAD 10
DIO_N
(LED Control Circuit)
Touch PAD 11
Notes:
• The voltage range of VDD can be from 2.3V to 5.5V. If internal LDO is used, it should be from 3V to 5.5V.
• Pull-Up resistors are required for I2C communication. For 5V application, 2K ohm resistor is typically used. For 3V application, 1K ohm
resistor is typically used.
• Each tuning capacitor is an optional component depending on PCB layout environment.
• The circuit above is a typical application circuit using an internal LDO.
• RESET_N pin should be connected to host MCU GPIO and needs an RC filter. (R1=10KΩ, C1=1uF)
• For LED control through DIO ports, sink current circuit is mandatory as shown above.
10 Fujitsu Seminconductor Europe
FMA1127DC
Top View of 32-pin Package (32QFN)
25
16
15
14
13
12
11
10
9
S3
S2
S1
S0
S8
AREF
CONFIG_0
CONFIG_1
DIO_6
DIO_7
DIO_8
DIO_9
26
27
28
FMA1127DC
29
30
31
32
RESET_N
ID
32N
DIO_3
DIO_2
Pin Description
Name
IO
Pin #
Description
RESET_N
TCLK
S
I
I
I
I
29
Reset, active LOW
7
1618, 23-28
15
External Clock Input. Should be grounded if not used.
Nine Sensor Inputs from external Touch Pads.
Reference Input.
AREF
Configured by HOST:
DIO
IO
1, 2, 9-12, 31, 32
- extended GPIOs, Direct Button Outputs or External Interrupt inputs
SDA
SCL
IO
I
3
4
Bidirectional I2C Data from/to Host
I2C CLK from Host
TINT
GINT
TOSC
ID
O
O
I
5
Touch Interrupt, it can be generated when touch status is changed.
General Interrupts including touch interrupt, and they can be masked.
Test Pin, Should be grounded.
I2C Chip ID Select(0:0x58, 1:0x5B)
Test pins. Should be grounded.
Power (2.5V~5.5V)
6
8
I
30
13, 14
22
21
20
19
CONFIG
VPH
I
P
O
P
P
VLDO
V25
2.5V Regulator Power Output
2.5V Power Input
VSS
Ground
Fujitsu Semiconductor Europe
11
Touch Sensor Controller
TypicalApplication Circuit
Data Sensor
Tuning Cap Touch PAD
Touch_Sensor_8
Touch_Sensor_7
Touch_Sensor_6
10µF
24
23
22
21
20
19
18
17
Touch_Sensor_5
Touch_Sensor_3
Touch_Sensor_8
S3
S2
S1
S8
25
16
15
14
Touch_Sensor_4
X pF
Touch_Sensor_2
AREF
26
Reference Sensor
Tuning Cap
Touch_Sensor_1
Touch_Sensor_3
CONFIG_0
27
Touch_Sensor_0
S0 FMA1127DCCONFIG_1
28
13
12
11
10
9
Touch_Sensor_2
RESET_N
29
RESET
ID
DIO_6
DIO_7
DIO_8
DIO_9
32N
Touch_Sensor_1
30
DIO_3
DIO 2
31
Touch_Sensor_0
32
1
2
3
4
5
6
7
8
2K
2K
R1 10K
RESET_N
VDD
From MCU
1uF
C1
VCC (3V~5V)
DIO_N
(LED Control Circuit)
Notes:
• The voltage range of VDD can be from 2.3V to 5.5V. If internal LDO is used, it should be from 3V to 5.5V.
• Pull-Up resistors are required for I2C communication. For 5V application, 2K ohm resistor is typically used. For 3V application, 1K ohm resis-
tor is typically used.
• Each tuning capacitor is an optional component depending on PCB layout environment.
• The circuit above is a typical application circuit using an internal LDO.
• RESET_N pin should be connected to host MCU GPIO and needs an RC filter. (R1=10KΩ, C1=1uF)
• For LED control through DIO ports, sink current circuit is mandatory as shown above.
12 Fujitsu Seminconductor Europe
FMA1127DC
Top View of 24-pin Package (24QFN)
19
12
11
10
9
S2
S8
20
S1
AREF
21
S0
CONFIG_0
CONFIG_2
DIO_8
FMA1127DC
24N
22
RESET_N
23
8
ID
24
7
DIO_2
TOSC
Pin Description
Name
IO
Pin #
Description
RESET_N
TCLK
S
I
I
I
I
22
Reset, active LOW
6
12, 17-21
11
External Clock Input. Should be grounded if not used.
Nine Sensor Inputs from external Touch Pads.
Reference Input.
AREF
Configured by HOST:
DIO
IO
1, 8, 24
- extended GPIOs, Direct Button Outputs or External Interrupt inputs
SDA
SCL
IO
I
2
3
Bidirectional I2C Data from/to Host
I2C CLK from Host
TINT
GINT
TOSC
ID
O
O
I
4
Touch Interrupt, it can be generated when touch status is changed.
General Interrupts including touch interrupt, and they can be masked.
Test Pin, Should be grounded.
I2C Chip ID Select(0:0x58, 1:0x5B)
Test pins. Should be grounded.
Power (2.5V-5.5V)
5
7
I
23
9, 10
16
15
14
13
CONFIG
VPH
I
P
O
P
P
VLDO
V25
2.5V Regulator Power Output
2.5V Power Input
VSS
Ground
Fujitsu Semiconductor Europe
13
Touch Sensor Controller
TypicalApplication Circuit
Touch PAD
Touch_Sensor_8
18
13
17
16
15
14
12
11
10
9
Touch_Sensor_4
Touch_Sensor_3
Touch_Sensor_2
Touch_Sensor_1
Touch_Sensor_0
Touch_Sensor_2
Touch_Sensor_1
Touch_Sensor_0
RESET_N
Touch_Sensor_8
S8
S2
S1
19
20
21
22
23
24
X pF
AREF
Reference Sensor
Tuning Cap
S0
CONFIG_1
FMA1127DC
24N
RESET_N
ID
CONFIG_0
DIO_8
8
7
DIO_2
TOSC
Touch PAD
Data Sensor
Tuning Cap
1
2
3
4
5
6
2K
2K
VDD
R1 10K
1uF
RESET_N
From MCU
C1
DIO_N
(LED Control Circuit)
Notes:
• The voltage range of VDD can be from 2.3V to 5.5V. If internal LDO is used, it should be from 3V to 5.5V.
• Pull-Up resistors are required for I2C communication. For 5V application, 2K ohm resistor is typically used. For 3V application, 1K ohm
resistor is typically used.
• Each tuning capacitor is an optional component depending on PCB layout environment.
• The circuit above is a typical application circuit using an internal LDO.
• RESET_N pin should be connected to host MCU GPIO and needs an RC filter. (R1=10KΩ, C1=1uF)
• For LED control through DIO ports, sink current circuit is mandatory as shown above.
14 Fujitsu Seminconductor Europe
FMA1127DC
Top View of 30-pin Package (30SSOP)
1
30
29
28
27
26
5
24
23
22
21
20
19
18
17
16
RESET_N
S0
2
ID
S1
3
DIO_5
S2
4
DIO_4
S3
5
DIO_3
S4
6
DIO_2
S5
7
DIO_1
VPH
VLDO
V25
S6
8
DIO_0
9
SDA
10
SCL
11
TINT
S7
12
GINT
S8
13
TCLK
S9
14
VSS
S10
S11
15
AREF
30-Pin SSOP
Pin Description
Name
IO
Pin #
Description
RESET_N
TCLK
S
I
I
I
I
1
Reset, active LOW
13
16-21, 25-30
15
External Clock Input. Should be grounded if not used.
Twelve Sensor Inputs from external Touch Pads.
Reference Input.
AREF
Configured by HOST as below:
DIO
IO
38
-extended GPIOs, Direct Button Outputs or External Interrupt inputs
SDA
SCL
TINT
GINT
ID
IO
I
9
Bidirectional I2C Data from/to Host
I2C CLK from Host
10
11
12
2
O
O
I
Touch Interrupt, it can be generated when touch status is changed.
General Interrupts including touch interrupt and EINT. Can be masked.
I2C Chip ID Select(0:0x58, 1:0x5B)
Power (2.5V~5.5V)
VPH
VLDO
V25
P
O
P
P
24
23
22
14
2.5V Regulator Power Output
2.5V Power Input
VSS
Ground
Fujitsu Semiconductor Europe
15
Touch Sensor Controller
TypicalApplication
Touch PAD
R1 10K
1uF
RESET_N
C1
Data Sensor
Tuning Cap
From MCU
Touch PAD
Touch_Sensor_11
Touch_Sensor_10
Touch_Sensor_9
Touch_Sensor_8
Touch_Sensor_7
Touch_Sensor_6
FMAC
Touch_Sensor_5
Touch_Sensor_4
Touch_Sensor_3
Touch_Sensor_2
Touch_Sensor_1
Touch_Sensor_0
2K
2K
Reference Sensor
Tuning Cap
VDD
DIO_N
(LED Control Circuit)
Notes:
• The voltage range of VDD can be from 2.3V to 5.5V. If internal LDO is used, it should be from 3V to 5.5V.
• Pull-Up resistors are required for I2C communication. For 5V application, 2K ohm resistor is typically used. For 3V application, 1K ohm
resistor is typically used.
• Each tuning capacitor is an optional component depending on PCB layout environment.
• The circuit above is a typical application circuit using an internal LDO.
• RESET_N pin should be connected to host MCU GPIO and needs an RC filter. (R1=10KΩ, C1=1uF)
• For LED control through DIO ports, sink current circuit is mandatory as shown above.
16 Fujitsu Seminconductor Europe
FMA1127DC
Top View of 24-pin Package (24SSOP)
1
24
23
22
21
20
19
18
17
16
15
14
13
SO
S1
2
RESET_N
ID
S2
3
S3
4
DIO_0
SDA
S4
5
S5
6
SCL
VPH
VLDO
V25
S6
7
TINT
8
GINT
TCLK
VSS
9
10
11
12
S8
DIO_8
DIO_6
S9
AREF
Pin Description
Name
IO
Pin #
Description
RESET_N
TCLK
S
I
I
I
I
2
Reset, active LOW
9
1, 14-16, 20-24
13
External Clock Input. Should be grounded if not used.
Nine Sensor Inputs from external Touch Pads.
Reference Input.
AREF
Configured by HOST:
DIO
IO
4, 11, 12
-extended GPIOs, Direct Button Outputs or External Interrupt inputs
SDA
SCL
TINT
GINT
ID
IO
I
5
6
Bidirectional I2C Data from/to Host
I2C CLK from Host
O
O
I
7
Touch Interrupt, it can be generated when touch status is changed.
General Interrupts including touch interrupt and EINT. Can be masked.
I2C Chip ID Select(0:0x58, 1:0x5B)
Power (2.5V-5.5V)
8
3
VPH
VLDO
V25
P
O
P
P
19
18
17
10
2.5V Regulator Power Output
2.5V Power Input
VSS
Ground
Fujitsu Semiconductor Europe
17
Touch Sensor Controller
TypicalApplication
Data Sensor
10µF
Tuning Cap Touch PAD
Touch_Sensor_9
Touch_Sensor_8
Touch_Sensor_6
Touch_Sensor_5
Touch_Sensor_4
Touch_Sensor_3
Touch_Sensor_2
Touch_Sensor_1
Touch_Sensor_0
X pF
Reference Sensor
Tuning Cap
FMA1127DC
24S
2K
2K
VDD
R1 10K
RESET_N
From MCU
1uF
C1
DIO_N
(LED Control Circuit)
Notes:
• The voltage range of VDD can be from 2.3V to 5.5V. If internal LDO is used, it should be from 3V to 5.5V.
• Pull-Up resistors are required for I2C communication. For 5V application, 2K ohm resistor is typically used. For 3V application, 1K ohm
resistor is typically used.
• Each tuning capacitor is an optional component depending on PCB layout environment.
• The circuit above is a typical application circuit using an internal LDO.
• RESET_N pin should be connected to host MCU GPIO and needs an RC filter. (R1=10KΩ, C1=1uF)
• For LED control through DIO ports, sink current circuit is mandatory as shown above.
18 Fujitsu Seminconductor Europe
FMA1127DC
Top View of 20-pin Package (20SSOP)
1
20
19
18
17
16
15
14
13
12
11
RESET_N
S0
2
ID
S1
3
DIO_0
S2
4
SDA
S3
5
SCL
VPH
VLDO
V25
VSS
S8
6
TINT
7
GINT
8
TCLK
9
DIO_8
10
AREF
S9
Pin Description
Name
IO
Pin #
Description
RESET_N
TCLK
S
I
I
I
I
1
Reset, active LOW
8
11-12, 17-20
10
External Clock Input. Should be grounded if not used.
Six Sensor Inputs from external Touch Pads.
Reference Input.
AREF
Configured by HOST:
DIO
IO
3, 9
-extended GPIOs, Direct Button Outputs or External Interrupt inputs
SDA
SCL
TINT
GINT
ID
IO
I
4
5
Bidirectional I2C Data from/to Host
I2C CLK from Host
O
O
I
6
Touch Interrupt, it can be generated when touch status is changed.
General Interrupts including touch interrupt and EINT. Can be masked.
I2C Chip ID Select(0:0x58, 1:0x5B)
Power (2.5V-5.5V)
7
2
VPH
VLDO
V25
P
O
P
P
16
15
14
13
2.5V Regulator Power Output
2.5V Power Input
VSS
Ground
Fujitsu Semiconductor Europe
19
Touch Sensor Controller
TypicalApplication
Touch PAD
Touch_Sensor_9
Touch_Sensor_8
Touch_Sensor_3
Touch_Sensor_2
Touch_Sensor_1
Touch_Sensor_0
FMA1127DC
20S
Touch PAD
Data Sensor
Tuning Cap
Xp F
2K
2K
Reference Sensor
Tuning Cap
VDD
R1 10K
RESET_N
From MCU
1uF
C1
DIO_N
(LED Control Circuit)
Notes:
• The voltage range of VDD can be from 2.3V to 5.5V. If internal LDO is used, it should be from 3V to 5.5V.
• Pull-Up resistors are required for I2C communication. For 5V application, 2K ohm resistor is typically used. For 3V application, 1K ohm resis-
tor is typically used.
• Each tuning capacitor is an optional component depending on PCB layout environment.
• The circuit above is a typical application circuit using an internal LDO.
• RESET_N pin should be connected to host MCU GPIO and needs an RC filter. (R1=10KΩ, C1=1uF)
• For LED control through DIO ports, sink current circuit is mandatory as shown above.
20 Fujitsu Seminconductor Europe
FMA1127DC
Power Connection
There are two methods to supply power to the FMA1127DC touch sensor controller. One is to receiveV25 core voltage from internal LDO and the
other is to receive core voltage from an external power supply. In the case of using internal LDO, the LDO should be turned on in Sleep mode and
hence it will cause slightly higher power consumption than using an external power supply forV25 core voltage.
In Case E, if VPH receives 2.5V, internal LDO can not be used becauseVLDO can not output 2.5V whenVPH receives 2.5V from external LDO.
Case A.
Case B.
VDDH: External 5V
VLDO: Internal LDO 2.5V
VDDH: External 5V
VLDO: External 2.5V (Internal LDO Off: Register Control)
5V
5V
VDDH
VDDH
V25
2.5V
V25
10 μF
External LDO
External LDO
VLDO
VSS
VLDO
VSS
GND
GND
Case C.
VDDH: External 3.3V
VLDO: External 2.5V (Internal LDO Off: Register Control)
Case D.
VDDH: External 3.3V
VLDO: Internal LDO 2.5V
3.3V
3.3V
VDDH
VDDH
V25
2.5V
V25
10 μF
External LDO
External LDO
VLDO
VSS
VLDO
VSS
GND
GND
Case E.
VDDH: External 2.5V
VLDO: External 2.5V (Internal LDO Off: Register Control)
2.5V
VDDH
V25
External LDO
VLDO
VSS
GND
Fujitsu Semiconductor Europe
21
Touch Sensor Controller
Power Sequence
To initialize the FMA1127DC properly, please refer to the Power Sequence below when the power is given initially during boot-up.
If the reset transition time during power on does not follow the time sequence below, the Internal LDO and oscillator would not operate
normally.
The Power Sequence is based on the Power Connection type and is shown in the following example.
Power Connection Type is Case B or Case D
VDDH (3.3V or 5.5V) x 0.9
VDDH(IO)
Reset Period
GND + 0.3V
RESET_N
Fixed “L”
Min 0.1 msec
Power Connection Type is CaseA, Case C, or Case E
VDDH (2.5V or 3.3V or 5.5V) x 0.9
VDDH(IO)
V25 (2.5V) x 0.9
V25(Core)
RESET_N
Reset Period
Min 0.1 msec
GND + 0.3V
Fixed “L”
In order to delay RESET_N transition about 0.1msec thanVDDH transition, 10KΩ resistor and 1uF capacitor should be attached on
RESET_N pin. Please see the typical application circuits described in the previous chapter.Also note that pulse width of RESET_N which is
active low and generated by MCU must be longer than 0.1msec to be valid RESET signal.
22 Fujitsu Seminconductor Europe
FMA1127DC
Register Map Summary
Ads
Reg Name
Ads
Reg Name
Ads
Reg Name
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
21
22
23
24
25
Feature
26
27
28
29
2A
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
Strength Threshold 10
Strength Threshold 11
Sampling Interval
Integration Time
IDLE Time
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
79
7A
7B
FA
FB
FC
FD
FE
FF
Calibrated Impedance 2
Calibrated Impedance 3
Calibrated Impedance 4
Calibrated Impedance 5
Calibrated Impedance 6
Calibrated Impedance 7
Calibrated Impedance 8
Calibrated Impedance 9
Calibrated Impedance 10
Calibrated Impedance 11
Impedance 0
ALPHA 0
ALPHA 1
ALPHA 2
ALPHA 3
ALPHA 4
MODE
ALPHA 5
GPIO REG L
ALPHA 6
GPIO REG H
ALPHA 7
GPIO Configuration L
GPIO Configuration H
GPIO Direction L
GPIO Direction H
Control
ALPHA 8
ALPHA 9
ALPHA 10
Impedance 1
ALPHA 11
Impedance 2
BETA
Interrupt Mask
Interrupt Clear
Interrupt Edge
Control 2
Impedance 3
COT
Impedance 4
Reference Delay
Hysteresis Delay 0
Hysteresis Delay 1
Hysteresis Delay 2
Hysteresis Delay 3
Hysteresis Delay 4
Hysteresis Delay 5
Hysteresis Delay 6
Hysteresis Delay 7
Hysteresis Delay 8
Hysteresis Delay 9
Hysteresis Delay 10
Hysteresis Delay 11
Strength Threshold 0
Strength Threshold 1
Strength Threshold 2
Strength Threshold 3
Strength Threshold 4
Strength Threshold 5
Strength Threshold 6
Strength Threshold 7
Strength Threshold 8
Strength Threshold 9
Impedance 5
Impedance 6
Beep Period
Impedance 7
Beep Frequency
Calibration Interval
EINT Enable
Impedance 8
Impedance 9
Impedance 10
EINT Polarity
FILTER Period
FILTER Threshold
Strength 0
Impedance 11
Status
Touch Byte L
Touch Byte H
Strength 1
Interrupt Pending
GPIO IN L
Strength 2
Strength 3
GPIO IN H
Strength 4
BIAS OFF
Strength 5
BIAS ON
Strength 6
Wakeup SLEEP
Enter SLEEP
Strength 7
Strength 8
Cold Reset
Strength 9
Warm Reset
Strength 10
Strength 11
Calibrated Impedance 0
Calibrated Impedance 1
Notes:
Please refer to theApplication Note “FMA1127_Init_Reg_Description” for detailed register descriptions.
Fujitsu Semiconductor Europe
23
Touch Sensor Controller
Package Dimensions
40QFN
24 Fujitsu Seminconductor Europe
FMA1127DC
32QFN
Fujitsu Semiconductor Europe
25
Touch Sensor Controller
24QFN
26 Fujitsu Seminconductor Europe
FMA1127DC
30SSOP
Fujitsu Semiconductor Europe
27
Touch Sensor Controller
24SSOP
28 Fujitsu Seminconductor Europe
FMA1127DC
20SSOP
Solder Reflow Peak Temperature
Package
Minimum Peak Temperature*
Maximum Peak Temperature
20SSOP, 24SSOP
24QFN, 32QFN, 40QFN
240°C
240°C
260°C
260°C
*Higher temperature may be required based on the solder melting point.Typical temperature for solder is 220 5ꢀC
with Sn-Pb or 245 5ꢀC with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications
Fujitsu Semiconductor Europe
29
Revision History
Date
Revision
Updates
May 1, 2009
V1.0
First Release
New features are added.
Power Sequence is added
Notes in Typical Applications are changed.
RESET_N pin connection is changed in Typical Applications.
Pin descriptions are updated.
Absolute Maximum Operating Temperature is changed.
Notations in Electrical Characteristics are changed.
June 15, 2009
V2.1
Iol is added to Electrical Characteristics and I2C DC specification.
Note6 is added to I2C DC specification.
Cb in I2C AC specification is modified.
Nov. 29, 2010
De. 13, 2010
V2.2
V2.3
FSEU company data
Max value of system clock is changed to 2.1MHz
Solder reflow peak temperature added
Dec. 12, 2010
Aug. 31, 2012
V2.4
V2.5
QFN packages info updated
30SSOP package remove/discontinued
The FMA1127DC touch sensor controller is developed and owned by
ATLab Inc., South Korea, and is distributed by Fujitsu Semiconductor Europe.
© 2011 Fujitsu Semiconductor Europe. All rights reserved.
All company and product names are trademarks or
registered trademarks of their respective owners.
FMA1127DC DS V.2.5 2012-09-28
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