MB88153-101 [FUJITSU]

Spread Spectrum Clock Generator; 扩频时钟发生器


型号：	MB88153-101
厂家：	FUJITSU
描述：	Spread Spectrum Clock Generator 扩频时钟发生器时钟发生器
文件：	总19页 (文件大小：152K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

FUJITSU SEMICONDUCTOR

DATA SHEET

DS04-29118-2E

Spread Spectrum Clock Generator

MB88153

■ DESCRIPTION

MB88153 is a clock generator for EMI (Electro Magnetic Interference) reduction. The peak of unnecessary (EMI)

can be attenuated by making the oscillation frequency slightly modulate periodically with the internal modulator.

It corresponds to both of the center spread which modulates input frequency as Middle Centered and down spread

which modulates so as not to exceed input frequency.

■ FEATURE

• Power down pin : 600 µA (Max) consumption current at power down

• Input frequency : 16.6 MHz to 134 MHz

• Output frequency : 16.6 MHz to 134 MHz (One-fold input frequency)

• Modulation rate can select from 0.5%, 1.5% − 1.0% or − 3.0%. (For center spread / down spread.)

• Modulation clock output Duty : 40% to 60%

• Modulation clock Cycle-Cycle Jitter : Less than 100 ps

• Low current consumption by CMOS process : 4.0 mA (24 MHz : Typ-sample, no load)

• Power supply voltage : 3.3 V 0.3 V

• Operating temperature : − 40 °C to +85 °C

• Package : SOP 8-pin

■ PACKAGE

8-pin plastic SOP

(FPT-8P-M02)

MB88153

■ PRODUCT LINEUP

MB88153 has four kinds of modulation rate and modulation type (center/down spread).

Product

MB88153-100

Modulation rate

−1.0%

Modulation type

Down

MB88153-101

MB88153-110

MB88153-111

−3.0%

0.5%

1.5%

Center

■ PIN ASSIGNMENT

TOP VIEW

CKIN

XPD

VDD

FREQ0

FREQ1

ENS

MB88153

CKOUT

FPT-8P-M02

■ PIN DESCRIPTION

Pin name

CKIN

V^DD

I/O

Pin no.

Description

Clock input pin

⎯

Power supply voltage pin

GND pin

V^SS

Modulated clock output pin

“L” output at power down

CKOUT

ENS

Modulation enable setting pin

Frequency setting pin

FREQ1

FREQ0

Frequency setting pin (with pull-up resistor)

Power down pin (with pull-up resistor)

Power down at “L” input

XPD

MB88153

■ I/O CIRCUIT TYPE

Circuit type

Remarks

• CMOS hysteresis input

CKIN,

ENS,

FREQ1

• CMOS hysteresis input with pull-up

resistor 50 kΩ (typ)

50 kΩ

FREQ0,

XPD

• CMOS output

• “L” output at power down

CKOUT

MB88153

■ HANDLING DEVICES

Preventing Latchup

A latchup can occur if, on this device, (a) a voltage higher than V^DDor a voltage lower than V^SSis applied to an

input or output pin or (b) a voltage higher than the rating is applied between V^DDand V^SS. The latchup, if it occurs,

significantly increases the power supply current and may cause thermal destruction of an element. When you

use this device, be very careful not to exceed the maximum rating.

Handling unused pins

Do not leave an unused input pin open, since it may cause a malfunction. Handle by, using a pull-up or

pull-down resistor.

Unused output pin should be opened.

Power supply pins

Please design connecting the power supply pin of this device by as low impedance as possible from the current

supply source.

We recommend connecting electrolytic capacitor (about 10 µF) and the ceramic capacitor (about 0.01 µF) in

parallel between V^SSand V^DDnear the device, as a bypass capacitor.

Clock I/O circuit

Noise near the CKIN pin may cause the device to malfunction. Design the printed circuit board so that the wiring

for the clock input does not intersect any other wiring.

Please pay attention so that an overshoot and an undershoot do not occur to an input clock of CKIN pin.

Design the printed circuit board that surrounds the CKIN and CKOUT pins with ground.

MB88153

■ BLOCK DIAGRAM

Power down

setting

XPD

FREQ0

FREQ1

ENS

Frequency setting

Clock output

PLL block

CKOUT

Modulation enable

setting

Reference clock

CKIN

Frequency setting

−

V/I

conversion

Charge

pump

Phase

compare

IDAC

ICO

Modulation

clock output

−

Reference

clock

Loop filter

Modulation rate

setting

Modulation enable

setting

−

Modulation logic

MB88153 PLL block

A glitchless IDAC (current output D/A converter) provides precise modulation, thereby dramatically reducing

EMI.

MB88153

■ PIN SETTING

When changing the pin setting, the stabilization wait time for the modulation clock required. The stabilization

wait time for the modulation clock takes the maximum value of Lock-Up time in “■ ELECTRICAL CHARACTER-

ISTICS • AC characteristics”.

ENS modulation enable setting

ENS

Modulation

No modulation

Modulation

Note : Spectrum does not spread when “L” is set to ENS. The clock with low jitter can be obtained.

FREQ0, FREQ1 frequency setting

FREQ0

FREQ1

Input frequency range

16.6 MHz to 40 MHz

66 MHz to 134 MHz

33 MHz to 67 MHz

40 MHz to 80 MHz

Note : It is set according to the frequency of the clock input to the device. Set FREQ0 pin to “H” for the pin opened

because FREQ0 pin has pull-up resistor.

XPD power down setting

XPD

Power down

Normal operation

Note : When “L” is set to XPD pin, the power down operation is implemented and “L” is output to CKOUT pin. When

“H” is input to XPD pin or XPD pin is opened, normal operation is implemented because the XPD pin has

pull-up resistor.

MB88153

• Center spread

Spectrum is spread (modulated) by centering on the input frequency.

3.0% modulation width

Radiation level

−1.5%

+1.5%

Frequency

Input frequency

Center spread example of 1.5% modulation rate

• Down spread

Spectrum is spread (modulated) below the input frequency.

3.0% modulation width

Radiation level

−3.0%

Frequency

Input frequency

Down spread example of − 3.0% modulation rate

MB88153

■ ABSOLUTE MAXIMUM RATINGS

Rating

Parameter

Symbol

Unit

Min

− 0.5

Max

+ 4.0

Power supply voltage*

Input voltage*

V^DD

V^I

V^SS− 0.5

− 55

V^DD+ 0.5

+ 125

Output voltage*

V^O

T^ST

Storage temperature

°C

Operation junction

temperature

T^J

− 40

+ 125

°C

Output current

Overshoot

I^O

− 14

+ 14

V^IOVER

V^IUNDER

⎯

V^DD+ 1.0 (t^OVER≤ 50 ns)

Undershoot

V^SS− 1.0 (t^UNDER≤ 50 ns)

⎯

* : The parameter is based on V^SS= 0.0 V.

WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,

temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.

Overshoot/Undershoot

t^UNDER≤ 50 ns

V^IOVER≤ V^DD+ 1.0 V

VDD

Input pin

VSS

V^IUNDER≤ V^SS− 1.0 V

t^OVER≤ 50 ns

MB88153

■ RECOMMENDED OPERATING CONDITIONS

(V^SS= 0.0 V)

Value

Typ

Sym-

bol

Parameter

Conditions

Unit

Max

Min

Power supply voltage

V^DD

⎯

3.0

3.3

3.6

CKIN, ENS,

FREQ0, FREQ1,

XPD

“H” level input voltage

“L” level input voltage

V^IH

V^IL

⎯

V^DD× 0.80

⎯

V^DD+ 0.3

CKIN, ENS,

FREQ0, FREQ1,

XPD

V^SS

V^DD× 0.20

16.6 MHz to

134 MHz

Input clock duty cycle

Operating temperature

t^DCI

CKIN

⎯

− 40

⎯

+ 85

°C

WARNING: The recommended operating conditions are required in order to ensure the normal operation of the

semiconductor device. All of the device’s electrical characteristics are warranted when the device is

operated within these ranges.

Always use semiconductor devices within their recommended operating condition ranges. Operation

outside these ranges may adversely affect reliability and could result in device failure.

No warranty is made with respect to uses, operating conditions, or combinations not represented on

the data sheet. Users considering application outside the listed conditions are advised to contact their

FUJITSU representatives beforehand.

Input clock duty cycle (t^DCI= t^b/t^a)

1.5 V

CKIN

MB88153

■ ELECTRICAL CHARACTERISTICS

• DC Characteristics

(Ta = − 40 °C to + 85 °C, V^DD= 3.3 V 0.3 V, V^SS= 0.0 V)

Value

Parameter

Symbol

Conditions

Unit

Min

Typ

Max

“H” level output

I^OH= − 4 mA

V^OH

CKOUT

V^DD− 0.5

⎯

V^DD

Output voltage

“L” level output

I^OL= 4 mA

V^OL

Z^O

V^SS

⎯

0.4

Output impedance

Input capacitance

CKOUT 16.6 MHz to 134 MHz

⎯

Ω

CKIN,

ENS, Ta = + 25 °C,

FREQ0, V^DD= V^I= 0.0 V,

FREQ1, f = 1 MHz

XPD

C^IN

⎯

16.6 MHz to 67 MHz

CKOUT 67 MHz to 100 MHz

100 MHz to 134 MHz

⎯

Load capacitance

C^L

FREQ0,

V^IL= 0.0 V

XPD

Input Pull-up resistance

R^PU

200

kΩ

No load capacitance

V^DD

Power supply current

Power down current

I^CC

⎯

4.0

6.0

at 24 MHz output

Ipd

V^DD

Input clock stopping

⎯

600

µA

• AC Characteristics

(Ta = − 40 °C to + 85 °C, V^DD= 3.3 V 0.3 V, V^SS= 0.0 V)

Value

Parameter

Symbol

Conditions

Unit

Min

16.6

Typ

⎯

Max

134

Input frequency

fⁱⁿ

CKIN

⎯

MHz

Output frequency

f^OUT

CKOUT

⎯

Load capacitance 15 pF

0.4 V to 2.4 V

Output slew rate

CKOUT

0.4

⎯

4.0

V/ns

Output clock duty cycle

Modulation frequency

Lock-up time

t^DCC

f^MOD

t^LK

CKOUT 1.5 V

CKOUT

⎯

12.5

⎯

kHz

CKOUT

No load capacitance,

Ta = + 25 °C,

Cycle-cycle jitter

t^JC

CKOUT

⎯

100

V^DD= 3.3 V,

^{Standard deviation}σ

Note : The modulation clock stabilization wait time is required after the power is turned on, the IC recovers from

power saving, or after FREQ (frequency range) or ENS (modulation ON/OFF) setting is changed. For the

modulation clock stabilization wait time, assign the maximum value for lock-up time.

MB88153

■ OUTPUT CLOCK DUTY CYCLE (t^DCC= t^b/t^a)

1.5 V

CKOUT

■ INPUT FREQUENCY (fⁱⁿ= 1/tⁱⁿ)

0.8 VDD

CKIN

■ OUTPUT SLEW RATE (SR)

2.4 V

0.4 V

CKOUT

Note : SR = (2.4−0.4) /t^r, SR = (2.4−0.4) /t^f

■ CYCLE-CYCLE JITTER

CKOUT

tn+1

Note : Cycle-cycle jitter is defined the difference between a certain cycle and immediately after

(or, immediately before) .

MB88153

■ MODULATION WAVEFORM

• 1.5% modulation rate, Example of center spread

CKOUT

output frequency

+ 1.5 %

Frequency at modulation OFF

Time

− 1.5 %

fMOD = 12.5 kHz (Typ)

• −1.0% modulation rate, Example of down spread

CKOUT

output frequency

Frequency at modulation OFF

Time

− 0.5 %

− 1.0 %

fMOD = 12.5 kHz (Typ)

MB88153

■ LOCK-UP TIME

3.0 V

V^DD

External clock

stabilization wait time

CKIN

VIH

XPD

Setting pin

FREQ0,

FREQ1,

ENS

t^LK

(lock-up time )

CKOUT

If the XPD pin is fixed at the “H” level, the maximum time after the power is turned on until the set clock signal is

output from CKOUT pin is (the stabilization wait time of input clock to CKIN pin) + (the lock-up time “t^LK”). For the

input clock stabilization time, check the characteristics of the resonator or oscillator used.

3.0 V

External clock stabilization wait time

CKIN

XPD

Setting pin

FREQ0,

FREQ1,

ENS

t^LK

(lock-up time )

CKOUT

When XPD pin controls the power-down, stable clock is output from CKOUT pin after becoming XPD pin = “H” level

(in the maximum after lock-Up time (t^LK) ).

MB88153

(Continued)

CKIN

XPD

VIH

ENS

VIL

t^LK

(lock-up time )

CKOUT

When ENS pin is controlled for enable modulation, it is necessary for the stably clock output from CKOUT pin to

wait lock-up time (t^LK) .

Note : In the following cases, it is necessary for the stably clock output from CKOUT pin, to wait lock-up time (t^LK) .

- After releasing power-down

- When you change other terminal settings

Output frequency, output clock duty cycle, modulation frequency, and cycle-cycle jitter are not guaranteed

until the output clock is stable. It is recommended to take procedure to release of reset after. lock-up time

(t^LK) on the device using the modulation clock or etc.

MB88153

■ INTERCONNECTION CIRCUIT EXAMPLE

CKIN

XPD

VDD

FREQ0

FREQ1

ENS

MB88153

VSS

CKOUT

C¹: Capacitor of 10 µF or higher

C²: Capacitor of approximately 0.01 µF (connect a capacitor of good high frequency

property (ex. laminated ceramic capacitor) to close to this device)

R¹: Impedance matching resistor for a circuit on a board

MB88153

■ SPECTRUM EXAMPLE CHARACTERISTICS

The condition of the examples of the characteristic is shown as follows: Input frequency = 20 MHz (Output

frequency = 20 MHz), use for MB88153-111.

Power-supply voltage = 3.3 V, None load capacity. Modulation rate = 1.5% (center spread).

Spectrum analyzer HP4396B is connected with CKOUT. The result of the measurement with RBW = 1 kHz (ATT

use for −6 dB) .

CH B Spectrum

10 dB /REF 0 dBm

No modulation

−8.86 dBm

Avg

1.5% modulation

−26.54 dBm

SWP 2.505 s

SPAN 4 MHZ

RBW# 1 kH^Z

CENTER 20 MH^Z

VBW 1 kHZ

ATT 6 dB

MB88153

■ ORDERING INFORMATION

Part number

modulation rate

modulation type

Down

Package

Remarks

MB88153PNF-G-100-JNE1

MB88153PNF-G-101-JNE1

MB88153PNF-G-110-JNE1

MB88153PNF-G-111-JNE1

MB88153PNF-G-100-JN-EFE1

MB88153PNF-G-101-JN-EFE1

MB88153PNF-G-110-JN-EFE1

MB88153PNF-G-111-JN-EFE1

MB88153PNF-G-100-JN-ERE1

MB88153PNF-G-101-JN-ERE1

MB88153PNF-G-110-JN-ERE1

MB88153PNF-G-111-JN-ERE1

−1.0%

−3.0%

0.5%

Down

8-pin plastic SOP

(FPT-8P-M02)

Center

Down

1.5%

−1.0%

−3.0%

0.5%

Down

8-pin plastic SOP Emboss taping

(FPT-8P-M02)

(EF type)

Center

Down

1.5%

−1.0%

−3.0%

0.5%

Down

8-pin plastic SOP Emboss taping

(FPT-8P-M02) (ER type)

Center

1.5%

MB88153

■ PACKAGE DIMENSION

Note 1) *1 : These dimensions include resin protrusion.

Note 2) *2 : These dimensions do not include resin protrusion.

Note 3) Pins width and pins thickness include plating thickness.

Note 4) Pins width do not include tie bar cutting remainder.

8-pin plastic SOP

(FPT-8P-M02)

+0.25

¹5.05 ^–0.20.199 ⁺^–.^.⁰⁰⁰¹⁸⁰

0.22 –⁺0⁰.^.0⁰7³

.009 ⁺^–.^.⁰⁰⁰⁰³¹

*²3.90±0.30 6.00±0.40

(.154±.012) (.236±.016)

Details of "A" part

1.55±0.20

45˚

(Mounting height)

(.061±.008)

0.25(.010)

0.40(.016)

0~8˚

"A"

1.27(.050)

0.44±0.08

(.017±.003)

0.13(.005)

0.50±0.20

(.020±.008)

0.15±0.10

(.006±.004)

(Stand off)

0.60±0.15

(.024±.006)

0.10(.004)

2002 FUJITSU LIMITED F08004S-c-4-7

Dimensions in mm (inches)

Note : The values in parentheses are reference values.

MB88153

FUJITSU LIMITED

The contents of this document are subject to change without notice.

Customers are advised to consult with FUJITSU sales

representatives before ordering.

The information, such as descriptions of function and application

circuit examples, in this document are presented solely for the

purpose of reference to show examples of operations and uses of

Fujitsu semiconductor device; Fujitsu does not warrant proper

operation of the device with respect to use based on such

information. When you develop equipment incorporating the

device based on such information, you must assume any

responsibility arising out of such use of the information. Fujitsu

assumes no liability for any damages whatsoever arising out of

the use of the information.

Any information in this document, including descriptions of

function and schematic diagrams, shall not be construed as license

of the use or exercise of any intellectual property right, such as

patent right or copyright, or any other right of Fujitsu or any third

party or does Fujitsu warrant non-infringement of any third-party’s

intellectual property right or other right by using such information.

Fujitsu assumes no liability for any infringement of the intellectual

property rights or other rights of third parties which would result

from the use of information contained herein.

The products described in this document are designed, developed

and manufactured as contemplated for general use, including

without limitation, ordinary industrial use, general office use,

personal use, and household use, but are not designed, developed

and manufactured as contemplated (1) for use accompanying fatal

risks or dangers that, unless extremely high safety is secured, could

have a serious effect to the public, and could lead directly to death,

personal injury, severe physical damage or other loss (i.e., nuclear

reaction control in nuclear facility, aircraft flight control, air traffic

control, mass transport control, medical life support system, missile

launch control in weapon system), or (2) for use requiring

extremely high reliability (i.e., submersible repeater and artificial

satellite).

Please note that Fujitsu will not be liable against you and/or any

third party for any claims or damages arising in connection with

above-mentioned uses of the products.

Any semiconductor devices have an inherent chance of failure. You

must protect against injury, damage or loss from such failures by

incorporating safety design measures into your facility and

equipment such as redundancy, fire protection, and prevention of

over-current levels and other abnormal operating conditions.

If any products described in this document represent goods or

technologies subject to certain restrictions on export under the

Foreign Exchange and Foreign Trade Law of Japan, the prior

authorization by Japanese government will be required for export

of those products from Japan.

F0502

MB88153-101 [FUJITSU]

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