FMP06N60E [FUJI]

N-CHANNEL SILICON POWER MOSFET; N沟道硅功率MOSFET
FMP06N60E
型号: FMP06N60E
厂家: FUJI ELECTRIC    FUJI ELECTRIC
描述:

N-CHANNEL SILICON POWER MOSFET
N沟道硅功率MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
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FMP06N60E  
FUJI POWER MOSFET  
3
N-CHANNEL SILICON POWER MOSFET  
Super FAP-E series  
Features  
Outline Drawings [mm]  
Equivalent circuit schematic  
Maintains both low power loss and low noise  
Lower RDS(on) characteristic  
TO-220AB  
More controllable switching dv/dt by gate resistance  
Smaller VGS ringing waveform during switching  
Narrow band of the gate threshold voltage (3.0±0.5V)  
High avalanche durability  
Drain(D)  
Gate(G)  
Applications  
Source(S)  
Switching regulators  
UPS (Uninterruptible Power Supply)  
DC-DC converters  
Maximum Ratings and Characteristics  
Absolute Maximum Ratings at Tc=25°C (unless otherwise specified)  
Description  
Symbol  
Characteristics  
Unit  
V
Remarks  
VDS  
600  
600  
Drain-Source Voltage  
VDSX  
V
VGS = -30V  
Continuous Drain Current  
I
I
D
±6  
A
Pulsed Drain Current  
DP  
±24  
A
Gate-Source Voltage  
VGS  
±30  
V
Repetitive and Non-Repetitive Maximum AvalancheCurrent  
Non-Repetitive Maximum Avalanche Energy  
Repetitive Maximum Avalanche Energy  
Peak Diode Recovery dV/dt  
I
AR  
6
A
Note*1  
Note*2  
Note*3  
Note*4  
E
E
AS  
AR  
313.7  
10.5  
4.5  
mJ  
mJ  
kV/µs  
A/µs  
dV/dt  
-di/dt  
Peak Diode Recovery -di/dt  
100  
Note*5  
2.02  
105  
Ta=25°C  
Tc=25°C  
Maximum Power Dissipation  
P
D
W
T
ch  
150  
°C  
°C  
Operating and Storage Temperature range  
Tstg  
-55 to + 150  
Electrical Characteristics at Tc=25°C (unless otherwise specified)  
Description  
Symbol  
Conditions  
min.  
typ.  
-
max.  
-
Unit  
Drain-Source Breakdown Voltage  
Gate Threshold Voltage  
BVDSS  
I
I
D
=250µA, VGS=0V  
=250µA, VDS=VGS  
DS=600V, VGS=0V  
DS=480V, VGS=0V  
GS=±30V, VDS=0V  
600  
V
V
VGS (th)  
D
2.5  
-
3.0  
-
3.5  
25  
V
V
V
T
ch=25°C  
Zero Gate Voltage Drain Current  
I
DSS  
µA  
Tch=125°C  
-
-
250  
100  
1.20  
-
Gate-Source Leakage Current  
Drain-Source On-State Resistance  
Forward Transconductance  
Input Capacitance  
I
GSS  
-
10  
nA  
R
DS (on)  
I
I
D
=3.0A, VGS=10V  
=3.0A, VDS=25V  
-
1.03  
8
g
fs  
D
4
-
S
Ciss  
Coss  
Crss  
td(on)  
tr  
1100  
100  
7.5  
20  
1650  
150  
11  
V
V
DS=25V  
GS=0V  
Output Capacitance  
-
pF  
ns  
f=1MHz  
Reverse Transfer Capacitance  
-
-
30  
V
V
cc=300V  
GS=10V  
Turn-On Time  
Turn-Off Time  
-
9.0  
100  
17.5  
35  
14  
I
D
=3.0A  
td(off)  
tf  
-
150  
26.5  
53  
R
G=24Ω  
-
Total Gate Charge  
Q
Q
Q
G
-
Vcc=300V  
Gate-Source Charge  
GS  
SW  
I
D
=6A  
-
9.0  
10  
14  
nC  
VGS=10V  
Gate-Drain Crossover Charge  
Avalanche Capability  
-
15  
I
AV  
L=6.39mH, Tch=25°C  
6
-
-
-
A
V
Diode Forward On-Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
VSD  
I
F
=6A, VGS=0V, Tch=25°C  
0.90  
0.4  
3.3  
1.35  
-
trr  
-
µS  
µC  
I
F
=6A, VGS=0V  
-di/dt=100A/µs, Tch=25°C  
Qrr  
-
-
Thermal Characteristics  
Description  
Symbol  
Test Conditions  
Channel to Case  
Channel to Ambient  
min.  
typ.  
max.  
1.19  
Unit  
°C/W  
°C/W  
Rth (ch-c)  
Rth (ch-a)  
Thermal resistance  
62.0  
Note *1 : Tch≤150°C  
Note *2 : Stating Tch=25°C, IAS=2.4A, L=99.8mH, Vcc=60V, RG=50Ω  
Note *3 : Repetitive rating : Pulse width limited by maximum channel temperature.  
See to the 'Transient Themal impeadance' graph.  
E
AS limited by maximum channel temperature and avalanche current.  
Note *4 : I  
Note *5 : I  
F
≤-I  
≤-I  
D
, -di/dt=100A/μs, Vcc≤BVDSS, Tch≤150°C.  
, dv/dt≤4.5kV/μs, Vcc≤BVDSS, Tch≤150°C.  
See to 'Avalanche Energy' graph.  
F
D
1
FUJI POWER MOSFET  
FMP06N60E  
Allowable Power Dissipation  
PD=f(Tc)  
Safe Operating Area  
ID=f(VDS):Duty=0(Single pulse),Tc=25 °c  
150  
125  
100  
75  
t=  
1µs  
101  
100  
10µs  
100µs  
1ms  
D.C.  
10-1  
10-2  
10-3  
50  
Power loss waveform :  
Square waveform  
PD  
t
25  
0
100  
101  
102  
103  
0
25  
50  
75  
100  
125  
150  
VDS [V]  
Tc [°C]  
Typical Output Characteristics  
ID=f(VDS):80 µs pulse test,Tch=25 °C  
Typical Transfer Characteristic  
ID=f(VGS):80 µs pulse test,VDS=25V,Tch=25 °C  
14  
12  
10  
8
10  
1
6
4
2
0.1  
0
0
4
8
12  
16  
20  
24  
0
1
2
3
4
5
6
7
8
9
10  
VDS [V]  
VGS[V]  
Typical Transconductance  
gfs=f(ID):80 µs pulse test,VDS=25V,Tch=25 °C  
Typical Drain-Source on-state Resistance  
RDS(on)=f(ID):80 µs pulse test,Tch=25 °C  
100  
10  
1
2.8  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
VGS=4.5V  
5.0V  
5.5V  
6.0V  
10V  
0.1  
0.1  
1
10  
100  
0
2
4
6
8
10  
12  
14  
ID [A]  
ID [A]  
2
FUJI POWER MOSFET  
FMP06N60E  
Gate Threshold Voltage vs. Tch  
Drain-Source On-state Resistance  
RDS(on)=f(Tch):ID=3A,VGS=10V  
VGS(th)=f(Tch):VDS=VGS,ID=250µA  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
6
5
4
3
2
1
0
max.  
typ.  
max.  
typ.  
min.  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Tch [°C]  
Tch [°C]  
Typical Gate Charge Characteristics  
VGS=f(Qg):ID=6A,Tch=25 °C  
Typical Capacitance  
C=f(VDS):VGS=0V,f=1MHz  
104  
103  
102  
101  
100  
14  
12  
10  
8
Vcc= 120V  
300V  
480V  
Ciss  
6
Coss  
Crss  
4
2
0
10-1  
100  
101  
102  
103  
0
5
10  
15  
20  
25  
30  
35  
40  
45  
50  
Qg [nC]  
VDS [V]  
Typical Forward Characteristics of Reverse Diode  
IF=f(VSD):80 µs pulse test,Tch=25 °C  
Typical Switching Characteristics vs. ID  
t=f(ID):Vcc=300V,VGS=10V,RG=24 Ω  
103  
102  
101  
100  
100  
10  
1
tf  
td(off)  
td(on)  
tr  
0.1  
10-1  
100  
101  
0.00  
0.25  
0.50  
0.75  
1.00  
1.25  
1.50  
1.75  
2.00  
VSD [V]  
3
FUJI POWER MOSFET  
FMP06N60E  
Maximum Avalanche Energy vs. starting Tch  
E(AV)=f(starting Tch):Vcc=60V,I(AV)<=6A  
Maximum Transient Thermal Impedance  
Zth(ch-c)=f(t):D=0  
101  
100  
350  
300  
250  
200  
150  
100  
50  
IAS=2.4A  
IAS=3.6A  
IAS=6.0A  
10-1  
10-2  
10-3  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
t [sec]  
0
0
25  
50  
75  
100  
125  
150  
starting Tch [°C]  
4
FUJI POWER MOSFET  
FMP06N60E  
WARNING  
1. This Catalog contains the product specifications, characteristics, data, materials, and structures as of October 2008.  
The contents are subject to change without notice for specification changes or other reasons. When using a product listed in this  
Catalog, be sure to obtain the latest specifications.  
2. All applications described in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either  
express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Device  
Technology Co., Ltd. is (or shall be deemed) granted. Fuji Electric Device Technology Co., Ltd. makes no representation or  
warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property rights which  
may arise from the use of the applications described herein.  
3. Although Fuji Electric Device Technology Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor  
products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take  
adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the products  
become faulty. It is recommended to make your design fail-safe, flame retardant, and free of malfunction.  
4. The products introduced in this Catalog are intended for use in the following electronic and electrical equipment which has  
normal reliability requirements.  
• Computers  
• Machine tools  
• OA equipment  
• Audiovisual equipment  
• Communications equipment (terminal devices)  
• Electrical home appliances • Personal equipment  
• Measurement equipment  
• Industrial robots etc.  
5. If you need to use a product in this Catalog for equipment requiring higher reliability than normal, such as for the equipment listed  
below, it is imperative to contact Fuji Electric Device Technology Co., Ltd. to obtain prior approval. When using these products for  
such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's  
product incorporated in the equipment becomes faulty.  
• Transportation equipment (mounted on cars and ships)  
• Traffic-signal control equipment  
• Trunk communications equipment  
• Gas leakage detectors with an auto-shut-off feature  
• Emergency equipment for responding to disasters and anti-burglary devices  
• Medical equipment  
• Safety devices  
6. Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic  
equipment (without limitation).  
• Space equipment  
• Aeronautic equipment  
• Nuclear control equipment  
• Submarine repeater equipment  
7. Copyright ©1996-2008 by Fuji Electric Device Technology Co., Ltd. All rights reserved.  
No part of this Catalog may be reproduced in any form or by any means without the express permission of Fuji Electric Device  
Technology Co., Ltd.  
8. If you have any question about any portion in this Catalog, ask Fuji Electric Device Technology Co., Ltd. or its sales agents before  
using the product.  
Neither Fuji Electric Device Technology Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in  
accordance with instructions set forth herein.  
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