1SMA4738A [FUTUREWAFER]

1W Zener Diodes;


型号：	1SMA4738A
厂家：	FutureWafer Tech Co.,Ltd
描述：	1W Zener Diodes
文件：	总9页 (文件大小：1861K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

1SMA47xxA Series

1W Zener Diodes

1. Synopsis

1-1. Feature List

● Zener Voltage Range: 6.8V to 100V

● Low Inductance

● Plastic Package Has Underwriters

● ESD Rating of Class 4 ( >30KV )

● Halogen Free and RoHS Compliant

● High Temperature Soldering Guaranteed:

250°C / 10 Seconds at Terminals

● Zener Diode With 5% Tolerance

● Operating T _JMax: 150 °C

SMAJ

1-2. Mechanical Characteristics

● Molded JEDEC Package: SMAJ

● Packing: Tape and Reel

● Flammability Rating UL 94V-0

● Halogen Free

● JEDEC MSL Classification: Level 1

1-3. Device Characteristics

Maximum Ratings@25°C Unless Otherwise Specified

Parameter

Symbol

P _D

Values

Units

Power Dissipation, T _A= 25°C

Peak Forward Surge Current 8.3ms Single Half-Wave

Peak Pulse Voltage ( IEC61000-4-2 Contact )

Operating Temperature

I _FSM

V _PP

±30

°C

T _J

-55 ~ +150

Storage Temperature

T _STG

1-4. Thermal Resistances

Parameter

Symbol

R _thJL

Values

Units

Junction to Leads

Junction to Ambient On PCB

°C/W

R _thJA

125

Document No.: F11824H

www.futurewafer.com.tw

21-DEC-2021 V 2.0

FQE-001-04

1SMA47xxA Series

1W Zener Diodes

2. Contents

1. Synopsis.........................................................................................................................1

1-1. Feature List...................................................................................................................1

1-2. Mechanical Characteristics...........................................................................................1

1-3. Device Characteristics..................................................................................................1

1-4. Thermal Resistances....................................................................................................1

2. Contents .........................................................................................................................2

3. Electrical Property.........................................................................................................3

3-1. Electrical Characteristics ..............................................................................................3

3-2. I-V Curve Characteristics..............................................................................................3

3-3. Ratings and Characteristics Curve ...............................................................................4

4. Soldering Parameters....................................................................................................5

5. Package Information .....................................................................................................6

5-1. Dimension.....................................................................................................................6

5-2. PCB Pad Layout Recommendation..............................................................................6

6. Packing...........................................................................................................................7

6-1. Taping and Reel Specification......................................................................................7

6-2. Embossed Carrier Tape Specification ..........................................................................7

6-3. Surface Mount Reel Specification.................................................................................8

6-4. Tape Leader and Trailer Specification..........................................................................8

7. Ordering Information.....................................................................................................9

8. Version............................................................................................................................9

8-1. History ..........................................................................................................................9

8-2. Company Profile...........................................................................................................9

Document No.: F11824H

www.futurewafer.com.tw

21-DEC-2021 V 2.0

FQE-001-04

1SMA47xxA Series

1W Zener Diodes

3. Electrical Property

3-1. Electrical Characteristics

3-2. I-V Curve Characteristics _TA=(25°C)

Document No.: F11824H

www.futurewafer.com.tw

21-DEC-2021 V 2.0

FQE-001-04

1SMA47xxA Series

1W Zener Diodes

3-3. Ratings and Characteristics Curve _{(TA=25°C unless otherwise noted)}

Fig 1. Power Derating Curve

Fig 2. Typical Thermal Resistance

L, Lead Length to Heat Sink ( Inchs )

T _L, Lead Temperature (°C)

Fig 3. Effect of Zener Current

Fig 4. Effect of Zener Current on Zener impedance

T _J= 25°C

VZ@IZT

I _Z(ms) = 0.1 lZ(dc)

f = 60Hz

47V

27V

20mA

0.01mA

1.0mA

0.8V

V _Z, Zener Voltage (V)

I _Z, Zener Current (mA)

Fig 5. Maximum Surge Power

Document No.: F11824H

www.futurewafer.com.tw

21-DEC-2021 V 2.0

FQE-001-04

1SMA47xxA Series

1W Zener Diodes

4. Soldering Parameters

Document No.: F11824H

www.futurewafer.com.tw

21-DEC-2021 V 2.0

FQE-001-04

1SMA47xxA Series

1W Zener Diodes

5. Package Information

5-1. Dimension

SMAJ

Dim

Min.

4.75

2.50

2.00

0.85

1.35

Max.

5.30

2.85

2.50

1.55

1.65

0.40

4.60

0.30

3.90

0.15

Unit: mm

5-2. PCB Pad Layout Recommendation

Dimensions

Values

4.00

1.50

2.50

6.50

1.70

Unit: mm

Document No.: F11824H

www.futurewafer.com.tw

21-DEC-2021 V 2.0

FQE-001-04

1SMA47xxA Series

1W Zener Diodes

6. Packing

6-1. Taping and Reel Specification

Taping Width

Tape Orientation

12mm

Direction Of Feed

6-2. Embossed Carrier Tape Specification

Unit: mm

Dimension

Values

3.0

5.6

1.5

1.75

5.5

1.2

4.0

2.0

0.25

±0.10 ±0.10 ±0.10 Min

±0.10 ±0.05 ±0.10 ±0.10 ±0.05 ±0.05 ±0.05 ±0.2

A0 /

B0 /

Determined by Component Size. The Clearance Between the Component And The Cavity Must

Comply to The Rotational And Lateral Movement Requirement Provided in Figures in The

“Maximum Component Movement in Tape Pocket” Section.

Document No.: F11824H

www.futurewafer.com.tw

21-DEC-2021 V 2.0

FQE-001-04

1SMA47xxA Series

1W Zener Diodes

6-3. Surface Mount Reel Specification

Unit: mm

Dimension Tape Width Reel Size

Value 12 mm 13”

330

±2

2.0

+0.5-0

20.5

100

±2

12.4

+2.0 -0.0

18.4

+0.5-0.2 ±0.2

6-4. Tape Leader and Trailer Specification

Document No.: F11824H

www.futurewafer.com.tw

21-DEC-2021 V 2.0

FQE-001-04

1SMA47xxA Series

1W Zener Diodes

7. Ordering Information

Part Number

Marking Code

Quantity

Component Package Packaging Option

1SMA47xxA

Series

5,000PCS

SMAJ

Tape & Reel -

12mm tape / 13”reel

8. Version

8-1. History

Version

Date

File No.

Recording

Basis

06-May-2018

06-May-2019

21-Dec-2021

F11824H

New Create

Market

Update Company Info. System

Update Version System

2.0

8-2. Company Profile

Futurewafer Tech Co., Ltd. 台灣未來芯科技股份有限公司

TEL: +886-3-3350161 / FAX: +886-3-3350172

cherry@futurewafer.com.tw

No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan

Document No.: F11824H

www.futurewafer.com.tw

21-DEC-2021 V 2.0

FQE-001-04

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