BC846DW [FUTUREWAFER]
NPN Silicon Epitaxial General Purpose Transistors;
| 型号： | BC846DW |
| 厂家： | 
FutureWafer Tech Co.,Ltd |
| 描述： | NPN Silicon Epitaxial General Purpose Transistors |
| 文件： | 总15页 (文件大小：2410K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
1. Synopsis
1-1. Feature List
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Complementary NPN Types Available
For Switching and AF Amplifier Applications
Totally Lead-Free
1-2. Mechanical Characteristics
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Molded JEDEC Package: SOT363
Packing: Tape and Reel
Flammability rating UL 94V-0
Halogen Free
SOT363
JEDEC MSL Classification: LEVEL 1
Pin 1: Emitter
Pin 2: Base
Pin 3: Collector
Pin 4: Emitter
Pin 5: Base
Pin 6: Collector
1-3. Device Characteristics
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FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
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BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
2. Contents
1. Synopsis.............................................................................................................................................. 1
1-1. Feature List ............................................................................................................................... 1
1-2. Mechanical Characteristics..................................................................................................... 1
1-3. Device Characteristics............................................................................................................. 1
2. Contents .............................................................................................................................................. 2
3. Electrical Property............................................................................................................................. 3
3-1. Electrical Characteristics......................................................................................................... 3
3-2. On Characteristics.................................................................................................................... 3
3-3. Small Signal Characteristics................................................................................................... 3
3-4. Ratings and Characteristics Curve- Figure 1 - 6.................................................................. 4
3-4. Ratings and Characteristics Curve- Figure 7 - 12................................................................ 5
3-4. Ratings and Characteristics Curve- Figure 13 - 18.............................................................. 6
3-4. Ratings and Characteristics Curve- Figure 19 - 24.............................................................. 7
3-4. Ratings and Characteristics Curve- Figure 25 - 30.............................................................. 8
3-4. Ratings and Characteristics Curve- Figure 31 - 36.............................................................. 9
3-4. Ratings and Characteristics Curve- Figure 37 - 39............................................................ 10
4. Soldering Parameters..................................................................................................................... 11
5. Package Information....................................................................................................................... 12
5-1. Dimension ............................................................................................................................... 12
5-2. PCB Pad Layout Recommendation..................................................................................... 12
6. Packing .............................................................................................................................................. 13
6-1. Taping and Reel Specification.............................................................................................. 13
6-2. Embossed Carrier Tape Specification................................................................................. 13
6-3. Surface Mount Reel Specification........................................................................................ 14
6-4. Tape Leader and Trailer Specification................................................................................. 14
7. Ordering Information...................................................................................................................... 15
8. Version............................................................................................................................................... 15
8-1. History...................................................................................................................................... 15
8-2. Company Profile..................................................................................................................... 15
www.futurewafer.com.tw
FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
2/15
BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
3. Electrical Property
3-1. Electrical Characteristics
3-2. On Characteristics
3-3. Small Signal Characteristics
www.futurewafer.com.tw
FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
3/15
BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
3-4. Ratings and Characteristics Curve- Figure 1 - 6
www.futurewafer.com.tw
FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
4/15
BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
3-4. Ratings and Characteristics Curve- Figure 7 - 12
www.futurewafer.com.tw
FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
5/15
BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
3-4. Ratings and Characteristics Curve- Figure 13 - 18
www.futurewafer.com.tw
FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
6/15
BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
3-4. Ratings and Characteristics Curve- Figure 19 - 24
www.futurewafer.com.tw
FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
7/15
BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
3-4. Ratings and Characteristics Curve- Figure 25 - 30
www.futurewafer.com.tw
FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
8/15
BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
3-4. Ratings and Characteristics Curve- Figure 31 - 36
www.futurewafer.com.tw
FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
9/15
BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
3-4. Ratings and Characteristics Curve- Figure 37 - 39
Figure 38. Safe Operating Area for BC847A/B/C
Figure 37. Safe Operating Area for BC846A/B/C
Figure 39. Safe Operating Area for BC848A/B/C
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FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
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BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
4. Soldering Parameters
www.futurewafer.com.tw
FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
11/15
BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
5. Package Information
5-1. Dimension
Unit:mm
5-2. PCB Pad Layout Recommendation
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
12/15
BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
6. Packing
6-1. Taping and Reel Specification
Taping Width
Tape Orientation
8mm
Direction Of Feed
6-2. Embossed Carrier Tape Specification
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
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BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
6-3. Surface Mount Reel Specification
Unit:mm
6-4. Tape Leader and Trailer Specification
www.futurewafer.com.tw
FQE-001-04
Document No.: F51833S
20-DEC-2021 V 2.1
14/15
BC846DW / BC847DW / BC848DW
NPN Silicon Epitaxial
General Purpose Transistors
7. Ordering Information
8. Version
8-1. History
8-2. Company Profile
Futurewafer Tech Co., Ltd. 台灣未來芯科技股份有限公司
TEL: +886-3-3350161 / FAX: +886-3-3350172
cherry@futurewafer.com.tw
No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan
www.futurewafer.com.tw
Document No.: F51833S
20-DEC-2021 V 2.1
FQE-001-04
15/15
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