SBR1H100A [FUTUREWAFER]
Surface Mount Schottky Barrier Rectifier;
| 型号： | SBR1H100A |
| 厂家： | 
FutureWafer Tech Co.,Ltd |
| 描述： | Surface Mount Schottky Barrier Rectifier |
| 文件： | 总12页 (文件大小：1618K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SBR1H100A / AF / B
Surface Mount Schottky Barrier Rectifier
1. Synopsis
1-1. General Description
These Devices Employ The Schottky Barrier Principle in a
Metal−to−Silicon Power Rectifier. Features Epitaxial
Construction With Oxide Passivation and Metal Overlay
Contact. Ideally Suited For Low Voltage, High Frequency
Switching Power Supplies; Free Wheeling Diodes and
Polarity Protection Diodes.
SMAJ
1-2. Feature List
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High Surge Current Capability
Low Power Loss, High Efficiency
Low Forward Voltage
Ultra Low Leakage Current
Soft, Fast Switching Capability
High Operating Junction Temperature
SMAF
1-3. Applications
●
For Use In Low Voltage High Frequency
Inverters, Freewheeling, DC/DC Converters,
and Polarity Protection Applications.
1-4. Benefits
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●
●
●
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Essentially No Switching Losses
Higher Efficiency
SMBJ
Reduction Of Heat Sink Requirements
Parallel Devices Without Thermal Runaway
Higher System Reliability Due To Lower Operating Temperatures
1-5. Mechanical Characteristics
Cathode
Anode
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Molded JEDEC Package: SMAJ / SMAF / SMBJ
Packing: Tape and Reel
Flammability rating UL 94V-0
Halogen Free
JEDEC MSL Classification: Level 1
www.futurewafer.com.tw
FQE-001-04
Document No.: F22108A
08-NOV-2021 V 2.1
1/12
SBR1H100A / AF / B
Surface Mount Schottky Barrier Rectifier
2. Contents
1. Synopsis.............................................................................................................................................. 1
1-1. General Description ................................................................................................................. 1
1-2. Feature List ............................................................................................................................... 1
1-3. Applications............................................................................................................................... 1
1-4. Benefits...................................................................................................................................... 1
1-5. Mechanical Characteristics..................................................................................................... 1
2. Contents .............................................................................................................................................. 2
3. Electrical Property............................................................................................................................. 3
3-1. Absolute Maximum Ratings .................................................................................................... 3
3-2. Electrical Characteristics (TA=25°C) ........................................................................................... 3
3-3. Thermal Characteristics........................................................................................................... 3
3-4. Ratings and Characteristics Curve (TA=25°C unless otherwise noted)................................................ 4
4. Soldering Parameters....................................................................................................................... 5
5. Package Information......................................................................................................................... 6
5-1. Dimension-SMAJ...................................................................................................................... 6
5-2. PCB Pad Layout Recommendation-SMAJ ........................................................................... 6
5-3. Dimension-SMAF ..................................................................................................................... 7
5-4. PCB Pad Layout Recommendation-SMAF........................................................................... 7
5-5. Dimension-SMBJ...................................................................................................................... 8
5-6. PCB Pad Layout Recommendation-SMBJ ........................................................................... 8
6. Packing ................................................................................................................................................ 9
6-1. Taping and Reel Specification-SMAJ & SMAF .................................................................... 9
6-2. Embossed Carrier Tape Specification-SMAJ & SMAF........................................................ 9
6-3. Taping and Reel Specification-SMBJ.................................................................................. 10
6-4. Embossed Carrier Tape Specification-SMBJ ..................................................................... 10
6-5. Surface Mount Reel Specification........................................................................................ 11
6-6. Tape Leader and Trailer Specification................................................................................. 11
7. Ordering Information...................................................................................................................... 12
8. Version............................................................................................................................................... 12
8-1. History...................................................................................................................................... 12
8-2. Company Profile..................................................................................................................... 12
www.futurewafer.com.tw
FQE-001-04
Document No.: F22108A
08-NOV-2021 V 2.1
2/12
SBR1H100A / AF / B
Surface Mount Schottky Barrier Rectifier
3. Electrical Property
3-1. Absolute Maximum Ratings
3-2. Electrical Characteristics (TA=25°C)
3-3. Thermal Characteristics
www.futurewafer.com.tw
Document No.: F22108A
08-NOV-2021 V 2.1
FQE-001-04
3/12
SBR1H100A / AF / B
Surface Mount Schottky Barrier Rectifier
3-4. Ratings and Characteristics Curve (TA=25°C unless otherwise noted)
Fig 1. Maximum Forward Current Derating Curve
Fig 2. Typical Instantaneous Forward Characteristics
T J = 125°C
T J = 25°C
TM measured at cathode
terminal mount typical values
T M - Mount Temperature (°C)
Instantaneous Forward Voltage, V F (V)
Fig 4. Typical Junction Capacitance
Fig 3. Typical Reverse Current Characteristics
T J = 25 °C
f = 1.0 MHz
V sig = 50 mVp-p
T J = 125°C
T J = 25°C
Reverse Voltage, V R (V)
Reverse Voltage, V R (V)
Fig 5. Maximum Non-repetitive Forward Surge Current
Number of Cycles at 60Hz
www.futurewafer.com.tw
FQE-001-04
Document No.: F22108A
08-NOV-2021 V 2.1
4/12
SBR1H100A / AF / B
Surface Mount Schottky Barrier Rectifier
4. Soldering Parameters
www.futurewafer.com.tw
Document No.: F22108A
08-NOV-2021 V 2.1
FQE-001-04
5/12
SBR1H100A / AF / B
Surface Mount Schottky Barrier Rectifier
5. Package Information
5-1. Dimension-SMAJ
Unit:mm
5-2. PCB Pad Layout Recommendation-SMAJ
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F22108A
08-NOV-2021 V 2.1
6/12
SBR1H100A / AF / B
Surface Mount Schottky Barrier Rectifier
5-3. Dimension-SMAF
Unit:mm
5-4. PCB Pad Layout Recommendation-SMAF
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F22108A
08-NOV-2021 V 2.1
7/12
SBR1H100A / AF / B
Surface Mount Schottky Barrier Rectifier
5-5. Dimension-SMBJ
Unit:mm
5-6. PCB Pad Layout Recommendation-SMBJ
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F22108A
08-NOV-2021 V 2.1
8/12
SBR1H100A / AF / B
Surface Mount Schottky Barrier Rectifier
6. Packing
6-1. Taping and Reel Specification-SMAJ & SMAF
Taping Width
Tape Orientation
12mm
Direction Of Feed
6-2. Embossed Carrier Tape Specification-SMAJ & SMAF
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F22108A
08-NOV-2021 V 2.1
9/12
SBR1H100A / AF / B
Surface Mount Schottky Barrier Rectifier
6-3. Taping and Reel Specification-SMBJ
Taping Width
Tape Orientation
12mm
Direction Of Feed
6-4. Embossed Carrier Tape Specification-SMBJ
Unit:mm
www.futurewafer.com.tw
FQE-001-04
Document No.: F22108A
08-NOV-2021 V 2.1
10/12
SBR1H100A / AF / B
Surface Mount Schottky Barrier Rectifier
6-5. Surface Mount Reel Specification
Unit:mm
6-6. Tape Leader and Trailer Specification
www.futurewafer.com.tw
Document No.: F22108A
08-NOV-2021 V 2.1
FQE-001-04
11/12
SBR1H100A / AF / B
Surface Mount Schottky Barrier Rectifier
7. Ordering Information
8. Version
8-1. History
8-2. Company Profile
Futurewafer Tech Co., Ltd. 台灣未來芯科技股份有限公司
TEL: +886-3-3350161 / FAX: +886-3-3350172
cherry@futurewafer.com.tw
No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan
www.futurewafer.com.tw
Document No.: F22108A
08-NOV-2021 V 2.1
FQE-001-04
12/12
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