GPY0030C-HS01x [GENERALPLUS]
Audiio Driiver;
| 型号： | GPY0030C-HS01x |
| 厂家： | 
Generalplus Technology Inc. |
| 描述： | Audiio Driiver |
| 文件： | 总17页 (文件大小：735K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GPY0030C
Audio Driver
May 05, 2015
Version 1.2
GENERALPLUS TECHNOLOGY INC. reserves the right to change this documentation without prior notice. Information provided by GENERALPLUS
TECHNOLOGY INC. is believed to be accurate and reliable. However, GENERALPLUS TECHNOLOGY INC. makes no warranty for any errors which may
appear in this document. Contact GENERALPLUS TECHNOLOGY INC. to obtain the latest version of device specifications before placing your order. No
responsibility is assumed by GENERALPLUS TECHNOLOGY INC. for any infringement of patent or other rights of third parties which may result from its use.
In addition, GENERALPLUS products are not authorized for use as critical components in life support devices/systems or aviation devices/systems, where a
malfunction or failure of the product may reasonably be expected to result in significant injury to the user, without the express written approval of Generalplus.
GPY0030C
Table of Contents
PAGE
1. GENERAL DESCRIPTION.......................................................................................................................................................................... 3
2. FEATURES.................................................................................................................................................................................................. 3
3. BLOCK DIAGRAM ...................................................................................................................................................................................... 3
4. SIGNAL DESCRIPTIONS............................................................................................................................................................................ 4
4.1. PAD ASSIGNMENT ................................................................................................................................................................................. 4
4.2. PACKAGE PIN ASSIGNMENT.................................................................................................................................................................... 4
5. ELECTRICAL SPECIFICATIONS ............................................................................................................................................................... 5
5.1. ABSOLUTE MAXIMUM RATINGS ............................................................................................................................................................... 5
5.2. THERMAL CHARACTERISTICS.................................................................................................................................................................. 5
5.3. DC CHARACTERISTICS (TA = 25℃) ........................................................................................................................................................ 5
5.4. TYPICAL PERFORMANCE CHARACTERISTICS ........................................................................................................................................... 6
5.4.1. THD+N vs. Frequency .............................................................................................................................................................. 6
5.4.2. THD+N vs. Output Power ......................................................................................................................................................... 7
5.4.3. Output Power vs. Supply Voltage ............................................................................................................................................. 8
5.4.4. Noise......................................................................................................................................................................................... 8
5.4.5. Output Noise Spectrum............................................................................................................................................................. 9
6. APPLICATION CIRCUIT ........................................................................................................................................................................... 10
6.1. BTLAMPLIFIER EFFICIENCY ..................................................................................................................................................................11
6.2. POWER DISSIPATION.............................................................................................................................................................................11
6.3. THERMAL PAD CONSIDERATIONS ...........................................................................................................................................................11
7. PACKAGE/PAD LOCATIONS ................................................................................................................................................................... 13
7.1. ORDERING INFORMATION ..................................................................................................................................................................... 13
7.2. PACKAGE INFORMATION ....................................................................................................................................................................... 13
7.2.1. SOP-8 ..................................................................................................................................................................................... 13
7.2.2. SOP-8-P.................................................................................................................................................................................. 14
7.2.3. PDIP-8 .................................................................................................................................................................................... 15
8. DISCLAIMER............................................................................................................................................................................................. 16
9. REVISION HISTORY ................................................................................................................................................................................. 17
© Generalplus Technology Inc.
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May 05, 2015
Version: 1.2
GPY0030C
AUDIO DRIVER
1. GENERAL DESCRIPTION
2. FEATURES
The GPY0030C is an audio driver, in which gain can be adjusted
by external resistor (Maximum gain is 20) and embedded the
anti-pop circuit to minimize the turn-on and turn-off pop noise.
Normally, it is applied for GPC series, GPF series, GPL series and
other GENERALPLUS products. The GPY0030C is easily to be
used in variety of applications and products.
Wide operating range: 2.4V – 6.8V
Bridge-Tied Load
Low distortion: THD+N = 0.15% (Typ.)
(For VDD = 5.0V, RL = 8.0 & Pout = 500mW)
High output power: POUT = 825mW
(For VDD = 5.0V, THD+N =1.0%, f =1.0KHz & RL = 8.0)
Low standby current: 1.0A
Minimize the turn-on and turn-off pop noise
3. BLOCK DIAGRAM
8
R2
VDD
55kΩ
R1
5kΩ
5
1
ACIN
INN
SPN
4
R5
R6
R3
5kΩ
VDD
R4
55kΩ
R7
SPP
2
3
6
7
VREF
CE
R8
BIAS
GND
GND
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Version: 1.2
GPY0030C
4. SIGNAL DESCRIPTIONS
Mnemonic
PIN No.
Type
Description
Audio output negative
Electrical Characteristics
SPN
SPP
VSS
INN
1
2
3
4
5
6
7
8
O
O
I
-
-
-
-
-
Audio output positive
Power VSS
I
Signal input negative
Signal input positive
Reference voltage
Chip enable
ACIN
VREF
CE
I
O
I
VDD/2
-
VDD
I
Power VDD
2.4V - 6.8V
4.1. PAD Assignment
This IC substrate should be connected to VSS
Note: To assure IC operates properly, please bond all of VDD and VSS pins.
4.2. Package Pin Assignment
1
2
3
SPN
VDD
CE
8
7
6
5
1
2
3
4
SPN
SPP
VSS
INN
VDD 8
SPP
VSS
CE 7
VREF
ACIN
VREF 6
4
INN
ACIN
5
PDIP-8
SOP-8
SOP-8-P
= Thermal PAD
(Connected to GND plane for better heat dissipation)
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GPY0030C
5. ELECTRICAL SPECIFICATIONS
5.1. Absolute Maximum Ratings
Characteristics
Symbol
Ratings
DC Supply Voltage
Input Voltage Range
V+
VIN
TA
< 7.0V
-0.5V to V+ + 0.5V
0℃ to + 60℃
Operating Temperature
Operating junction Temperature Range
Storage Temperature
TJ
-40℃ to + 150℃
-50℃ to + 150℃
TSTO
Note: Stresses beyond those given in the Absolute Maximum Rating table may cause permanent damage to the device. For normal operational conditions,
see AC/DC Electrical Characteristics.
5.2. Thermal Characteristics
Characteristics
Symbol
RTHJA
Value
160
Unit
SOP-8 Package Thermal Resistance
SOP-8-P Package Thermal Resistance
COB Package Thermal Resistance
DIP-8 Package Thermal Resistance
℃/W
℃/W
℃/W
RTHJA
60
RTHJA
160~200
110
RTHJA
℃/W
5.3. DC Characteristics (TA = 25℃)
Item
Test Conditions
Symbol
VDD
Min.
Typ.
-
Max.
Unit
V
Operation Voltage
2.4
6.8
Shutdown Current
Operating Current
Reference Voltage
Input Resister(CE)
Input Current(CE)
Total Harmonic
CE=VSS
ISTBY
IDD
-
-
-
-
-
0.1
2.5
VDD /2
40
1.0
uA
mA
V
VDD = 5.0V, CE=VDD, No Load
VDD=5.0V
-
-
-
-
VREF
RCE
CE=VDD
kΩ
uA
CE=2.3V at VDD=5.0V
ICE
85
VDD = 5.0V, RL = 8.0,
THD+N
-
0.15
-
%
Distortion + Noise
Signal to Noise Ratio
POUT = 500mW
VDD=5.0V, Av= -1, f=1.0KHz & RL=8.0
VDD=5.0V, THD+N=1%, f=1.0KHz & RL=8.0
VDD=5.0V, THD+N=10%, f=1.0KHz & RL=8.0
VIN=0V
SNR
POUT
POUT
VOS
100
825
1000
30
dB
mW
mW
mV
dB
-
-
-
-
-
-
-
-
-
-
Output Power (Note2)
Output Offset Voltage
Power Rejection Ratio
-
f = 1kHz
PSRR
70
-
VDD = 5.0V, CIN=1.0uF, CVREF=4.7uF
VDD = 5.0V, CIN=1.0uF, CVREF=2.2uF
VDD = 5.0V, CIN=1.0uF, CVREF=4.7uF
VDD = 5.0V, CIN=1.0uF, CVREF=2.2uF
50
90
60
80
50
ms
ms
ms
ms
Enable Time
TON
32
40
Shutdown Time
TOFF
25
Note1: Output power = (VO(PEAK)2/2/RL; VO(PEAK) = (VI(PEAK))*GAIN; So we can get the input range from output power, output loading and audio driver’s gain.
Note2: Proper thermal dissipation must be considered for desired output power and operating voltage. Please refer to Table-2.
Note3: tON is the time from CE high (chip enable) to SPP or SPN output.
ACIN
CE
T
ON
SPP-SPN
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GPY0030C
5.4. Typical Performance Characteristics
5.4.1. THD+N vs. Frequency
THD+N vs Frequency
VDD=5.0V Po=250mW
RL=16Ω
THD+N vs Frequency
5
5
VDD=5.0V Po=300mW
RL=8Ω
1
1
AV=2
AV=2
AV=10
AV=20
0.1
0.1
AV=10
AV=20
0.01
0.01
20
100
1k
10k
20k
20
5
100
1k
10k
20k
Frequency (Hz)
Frequency (Hz)
THD+N vs Frequency
THD+N vs Frequency
5
VDD=3.3V Po=100mW
RL=8Ω
VDD=5.0V Po=200mW
RL=32Ω
1
1
AV=20
AV=10
AV=2
0.1
0.1
AV=2
AV=10
AV=20
0.01
0.01
20
100
1k
10k
20k
20
100
1k
10k
20k
Frequency (Hz)
Frequency (Hz)
THD+N vs Frequency
THD+N vs Frequency
5
5
VDD=3.3V Po=75mW
RL=32Ω
VDD=3.3V Po=100mW
RL=16Ω
1
1
AV=2
AV=20
AV=20
AV=2
0.1
0.1
AV=10
AV=10
0.01
0.01
20
100
1k
Frequency (Hz)
10k
20k
20
100
1k
Frequency (Hz)
10k
20k
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GPY0030C
5.4.2. THD+N vs. Output Power
THD+N vs Output Power
THD+N vs Output Power
10
10
VDD=5.0V RL=8Ω
Av=20 BW < 80kHz
VDD=5.0V RL=16Ω
Av=20 BW < 80kHz
f=20k
f=20k
1
1
f=20
f=20
0.1
0.1
f=1k
f=1k
0.01
0.01
0.01
0.01
0.1
1
0.1
1
2
2
Output Power (W)
Output Power (W)
THD+N vs Output Power
THD+N vs Output Power
10
10
VDD=5.0V RL=32Ω
Av=20 BW < 80kHz
VDD=3.3V RL=8Ω
Av=20 BW < 80kHz
f=20k
f=20k
f=20
1
1
f=20
0.1
0.1
f=1k
f=1k
0.01
0.01
0.01
0.01
0.1
1
0.1
1
Output Power (W)
Output Power (W)
THD+N vs Output Power
THD+N vs Output Power
10
10
VDD=3.3V RL=16Ω
Av=20 BW < 80kHz
VDD=3.3V RL=32Ω
Av=20 BW < 80kHz
f=20k
f=20k
1
1
f=20
f=20
0.1
0.1
f=1k
f=1k
0.01
0.01
0.01
0.01
0.1
1
0.1
Output Power (W)
1
Output Power (W)
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GPY0030C
5.4.3. Output Power vs. Supply Voltage
Output Power vs Supply Voltage
Output Power vs Supply Voltage
1.3
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1.2
RL=8Ω f=1kHz
BW < 80kHz
RL=16Ω f=1kHz
BW < 80kHz
1.1
1
0.9
0.8
THD+N=10%
0.7
THD+N=10%
0.6
0.5
THD+N=1%
0.4
THD+N=1%
0.3
0.2
0.1
0
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
Supply Voltage (V)
Supply Voltage (V)
Output Power vs Supply Voltage
0.6
0.55
0.5
0.45
0.4
0.35
0.3
0.25
0.2
0.15
0.1
0.05
0
RL=32Ω f=1kHz
BW < 80kHz
THD+N=10%
THD+N=1%
2.5
3
3.5
4
4.5
5
5.5
Supply Voltage (V)
5.4.4. Noise
Noise Floor
Noise Floor
1m
1m
VDD=3.3v RL=8Ω
BW < 22kHz
VDD=5.0v RL=8Ω
BW < 22kHz
Av=10
Av=20
Av=10
Av=20
100u
100u
10u
10u
Av=2
Av=2
1u
1u
20
100
1k
10k
20k
20
100
1k
10k
20k
Frequency (Hz)
Frequency (Hz)
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GPY0030C
5.4.5. Output Noise Spectrum
VDD=5.0v, RL=8Ω
BW < 22kHz, Av = -1
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GPY0030C
6. APPLICATION CIRCUIT
1. Double-end
50000
Gain = 2*
VDD
5000+RI
Speaker
SPN
SPP
VSS
INN
VDD
CE
+
100
GPY0030C
CVREF=1µF (Optional. Refer to table 6.1.)
VREF
ACIN
+
RI
+
CIN=1µF
(Optional. Refer to table 6.1.)
2.PWM
50000
Gain = 2*
VDD
5000+RI
Speaker
+
SPN
SPP
VSS
INN
VDD
100
CE
GPY0030C
CVREF=1µF (Optional. Refer to table 6.1.)
VREF
ACIN
+
(Optional. Refer to table 6.1.)
CIN=1µF
RI
R1
+
(5~50k)
(50k)
R2
(20k)
C1
(1000p)
10k
RI
R1
+
(5~50k)
(50k)
CIN=1µF
(Optional. Refer to table 6.1.)
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GPY0030C
6.1. BTL Amplifier Efficiency
Since the GPY0030C has two operational amplifiers in one
package, the maximum internal power dissipation is four times
that of a single-end amplifier. The maximum power dissipation
from equation 8 must not be greater than the power dissipation
that results from the equation 9.
The following equations are basis for amplifier efficiency
calculation.
Output Power
Input Power
POUT
PSUP
Efficiency =
=
(1)
PD.MAX = (TJ.MAX-TJ) /θJA
(9)
Where
2
2
VP
VO.RMS
For SOP-8 package with and without thermal pad, the thermal
POUT
=
=
(2)
(3)
(4)
RL
2RL
resistance (θJA) is equal to 60°C/W and 160°C/W, respectively.
2
VP
Since the maximum junction temperature (TJ.MAX) of GPY0030C is
150°C and ambient temperature (TA) is defined by the power
system design, the maximum power dissipation which the IC
package is able to handle from equation 9. Once the power
dissipation is greater than the maximum limit (PD.MAX), either the
supply voltage (VDD) must be decreased, the load impedance (RL)
must be increased, or the θJA must be reduced with heat-sink.
VO.RMS
=
2
2VP
πRL
PSUP = VDD x IDD.AVG = VDD
x
Efficiency of a BTL configuration:
POUT
PSUP
πVP
=
(5)
(6)
4VDD
Example: VDD=6.0V, Load=8Ω, TA=30°C, GPY0030C SOP-8
without thermal pad (θJA=160°C/W).
PD = PSUP - POUT
From equation 9:
PD.MAX = (150-30)/160 = 0.75W < 4(VDD)2 /(2π2 RL) = 0.913W
Table-1 Efficiency vs. Output Power in 3.3V 8Ω BTL System
POUT (W)
0.125
Efficiency (%)
33.6
VP (V)
1.41
PD (W)
0.26
Decrease Power Voltage VDD to 5V.
PD.MAX = (150-30)/160 = 0.75W > 4(VDD)2 /(2π2 RL) = 0.634W
0.250
47.6
2.00
0.29
0.375
58.3
2.45*
0.28
6.3. Thermal Pad Considerations
* High-peak voltage values cause the THD to increase.
The thermal pad must be connected to ground. The package
with thermal pad of the GPY0030C requires special attention on
thermal design. If the thermal design issues are not properly
addressed, the temperature beyond which damage occurs to the
GPY0030C (150°C). The GPY0030C may not function or meet
expected performance at this temperature.
6.2. Power Dissipation
Power dissipation is a major concern when designing a successful
amplifier, whether the amplifier is bridged or single-ended.
Equation 7 states the maximum power dissipation point for a
single-ended mode operating at a given supply voltage and driving
a specified output load.
Thermal pad on the bottom of the GPY0030C should be soldered
down to a copper pad on the circuit board. Heat can be
conducted away from the thermal pad through the copper plane to
ambient. The copper plane used to conduct heat away from the
thermal pad should be as large as practical.
PD.MAX = (VDD)2 /(2π2 RL)
Single-Ended (7)
However, a direct consequence of the increased power delivered
to the load by bridge amplifier is an increment in internal power
dissipation point for a bridge amplifier operating at the same
condition.
If the ambient temperature is higher than 25°C, a larger copper
plane or forced-air cooling will be required to keep the GPY0030C
junction temperature below maximum junction temperature
(150°C).
PD.MAX = 4(VDD)2 /(2π2 RL)
Bridge-Mode (8)
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GPY0030C
Table-2 Output Power vs. Junction Temperature in BTL System (TA=25°C)
Output
Power
Efficiency
(%)
Internal
Dissipatio
n
Power
From
VOUT
Peak-to-Peak
VP (V)
Junction Temperature
TJ (°C)
POUT (W)
Supply
PSUP (W)
SOP-8
SOP-8-P
COB
DIP-8
PD (W)
VDD = 3.3V, Load=8Ω System
0.25
0.4
47.6
60.2
70.7
0.28
0.26
0.22
0.53
2.00
69.8
41.8
40.6
38.2
70.0
71.8
64.6
55.8
53.6
49.2
0.66
0.77
2.53
2.97
66.6
60.2
0.55
VDD = 5V, Load=8Ω System
0.5
1
44.4
62.8
70.7
0.63
0.59
0.52
1.13
1.59
1.79
2.83
4.00
4.50
125.8
119.4
108.2
62.8
60.4
56.2
138.4
131.2
118.6
94.3
89.9
82.2
1.27
VDD = 6.8V, Load=8Ω System
135.4
0.15
0.75
1.18
2.33
17.9
39.8
50.2
70.4
0.69
1.12
1.17
0.98
0.84
1.87
2.35
3.31
1.55
3.45
4.35
6.10
66.4
92.2
95.2
83.8
149.2
226.6*
235.6*
201.4*
100.9
148.2
153.7*
132.8
204.2*
212.2*
181.8*
* TJ must be less than TJ.MAX (150°C).
** TJ = θJA x PD + TA ; θJA(SOP-8) = 160°C/W ; θJA(SOP-8-P) = 60°C/W ; θJA(COB) = 180°C/W ; θJA(DIP-8) = 110°C/W
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GPY0030C
7. PACKAGE/PAD LOCATIONS
7.1. Ordering Information
Product Number
Package Type
GPY0030C - C
Chip form
GPY0030C - HS01x
GPY0030C - HS14x
Green Package – SOP-8 (150mil)
Green Package – SOP-8-P With Thermal PAD (150mil)
Green Package – PDIP-8 (300mil)
GPY0030C - HD01x
Note: Package form number (x = 1 - 9, serial number).
7.2. Package Information
7.2.1. SOP-8
D
E
X
c
y
H
8
5
A
A1
L1
pin 1 index
detail X
1
4
e
b
Dimension in inch
Symbol
Min.
0.053
0.004
-
Typ.
Max.
0.069
0.010
-
A
A1
b
-
-
0.016
D
E
0.189
0.150
-
-
0.196
0.157
-
-
e
0.050
H
L1
y
0.228
0.016
-
-
-
-
0.244
0.050
0.004
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GPY0030C
7.2.2. SOP-8-P
Thermal PAD
UNIT: INCH
Dimension in inch
Symbol
Min.
0.053
0.000
0.189
0.077
0.150
0.077
0.228
0.016
-
Typ.
Max.
0.067
0.006
0.196
0.090
0.157
0.090
0.244
0.050
-
A
A1
D
-
-
D1
E
-
-
E1
H
-
-
-
L
e1
e2
Φ1
0.016
0.050
8º
-
-
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GPY0030C
7.2.3. PDIP-8
4
5
1
8
E1
D1
A2
c
L1
D1 Body Length
E1 Body Width
A2 Body Thickness
L1 Lead Length
e
b
Body Size
E1
Lead Size
b
c
e
Lead Width
D1
A2
L1
b
c
e
Lead Thickness
374±10 250±4 130±5 130±15 18±2 10Typ 100Typ
All units are in mil. 1mil = 25.4m
Lead Pitch
PDIP-8-300
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GPY0030C
8. DISCLAIMER
The information appearing in this publication is believed to be accurate.
Integrated circuits sold by Generalplus Technology are covered by the warranty and patent indemnification provisions stipulated in the
terms of sale only. GENERALPLUS makes no warranty, express, statutory implied or by description regarding the information in this
publication or regarding the freedom of the described chip(s) from patent infringement. FURTHERMORE, GENERALPLUS MAKES NO
WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PURPOSE. GENERALPLUS reserves the right to halt production or alter
the specifications and prices at any time without notice. Accordingly, the reader is cautioned to verify that the data sheets and other
information in this publication are current before placing orders. Products described herein are intended for use in normal commercial
applications. Applications involving unusual environmental or reliability requirements, e.g. military equipment or medical life support
equipment, are specifically not recommended without additional processing by GENERALPLUS for such applications. Please note that
application circuits illustrated in this document are for reference purposes only.
© Generalplus Technology Inc.
Proprietary & Confidential
16
May 05, 2015
Version: 1.2
GPY0030C
9. REVISION HISTORY
Date
Revision #
Description
Page
5
Modify 5.5 DC Characteristics Table.
Add 5.4.5 Output Noise Spectrum.
Modify 7.1 Ordering Information.
Modify section 6.3.
May 05, 2015
1.2
9
Jun. 26, 2013
Mar. 12, 2013
Oct 11, 2012
1.1
1.0
0.1
12
16
16
Original
© Generalplus Technology Inc.
Proprietary & Confidential
17
May 05, 2015
Version: 1.2
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