G931T24UF [GMT]
3.5V 400mA Low Dropout Regulator; 3.5V 400毫安低压差稳压器
| 型号： | G931T24UF |
| 厂家： | 
GLOBAL MIXED-MODE TECHNOLOGY INC |
| 描述： | 3.5V 400mA Low Dropout Regulator |
| 文件： | 总5页 (文件大小：143K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Global Mixed-mode Technology Inc.
G930/G931
3.5V 400mA Low Dropout Regulator
Features
General Description
Dropout voltage typically 0.8V @ IO = 400mA
The G930/G931 positive 3.5V voltage regulator fea-
Output current in excess of 400mA
Output voltage accuracy +3%/-2%
Quiescent current, typically 600µA
Internal short circuit current limit
Internal over temperature protection
tures the ability to source 400mA of output current
with a dropout voltage of typically 0.8V over the en-
tire operating temperature range. A low quiescent
current is provided over the entire output current
range. The typical quiescent current is 0.6mA. Fur-
thermore, the quiescent current is smaller when the
regulator is in the dropout mode (VIN < 3.5V).
Familiar regulator features such as over temperature
and over current protection circuits are provided to
prevent it from being damaged by abnormal operating
conditions.
Ordering Information
ORDER
NUMBER
ORDER NUMBER
PIN OPTION
PACKAGE TYPE
(Pb free)
G930T21Uf
G931T24Uf
1
2
3
G930T21U
G931T24U
SOT-89
SOT-89
VOUT
GND
GND
VIN
VIN
VOUT
* For other package types, pin options and package, please contact us at sales @gmt.com.tw
Order Number Identification
GXXX XX
X
X
Packing Type
Pin Option
Package Type
Part Number
PACKAGE TYPE
T2 : SOT 89
PIN OPTION
PACKING
U : Tape & Reel
1
2
GND
VIN
3
1 : VOUT
2 : VOUT
VIN
GND
VIN
3 : GND
4 : GND
5 : VIN
VOUT
VIN
VOUT
VOUT
GND
GND
VOUT
6 : VIN
Typical Application
[Note 4] : Type of COUT
Package Type
IO
VOUT
VIN
G930
TopView
C1
0.47µF
COUT
10µF
IQ
1
3
2
SOT-89
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 4.6
Jan 08, 2007
1
Global Mixed-mode Technology Inc.
G930/G931
Absolute Maximum Ratings
(Note 1)
Operating Conditions
(Note 1)
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . .4V~6V
Temperature Range . . . . . . . . . . . . . . 0°C ≤ TJ ≤125°C
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature . . . . . . . . . . . . . . 150°C
Storage Temperature Range . . . .-65°C ≤ TJ ≤+150°C
Reflow Temperature (soldering, 10sec) . . . . . .260°C
Thermal Resistance Junction to Ambient, (θJA)
SOT-89. . . . . . . . . . . . . . . . . . . . . . . . . . . . 173°C/W(1)
Thermal Resistance Junction to Case, (θJc)
SOT-89. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25°C/W
Note (1) :See P.4 Recommended Minimum Footprint.
Electrical Characteristics
VIN =5V, IO = 400mA, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3]
PARAMETER
Output Voltage
CONDITIONS
5mA < IO <400mA
MIN
3.43
---
TYP
3.5
3
MAX
3.605
30
UNITS
V
Line Regulation
Load Regulation
Quiescent Current
Ripple Rejection
4V < VIN < 6V, IO = 10mA
50mA < IO < 400mA
VIN = 5V
mV
mV
mA
dB
---
35
50
0.3
---
0.6
50
1.5
---
fi = 120Hz, 1VP-P, Io = 100mA
IO = 400mA
---
0.8
125
1.6
150
0.9
---
V
Dropout Voltage
IO = 100mA
---
mV
A
Short Circuit Current
Over Temperature
---
---
---
---
°C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications
and test conditions see the Electrical Characteristics.
The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA,
and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If
this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the
G930/G931 in SOT-89 package, θJA is 173°C/W. (See Recommended Minimum Footprint). The safe operation in SOT
-89, it can see “Typical Performance Characteristics”.
Note2:
Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4: The type of output capacitor should be tantalum or aluminum.
Load Regulation
Definitions
The change in output voltage for a change in load
current at constant chip temperature. The measure-
ment is made under conditions of low dissipation or by
using pulse techniques such that average chip tem-
perature is not significantly affected.
Dropout Voltage
The input/output Voltage differential at which the regu-
lator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100mV below its nominal value, dropout
voltage is affected by junction temperature, load cur-
rent and minimum input supply requirements.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Line Regulation
The change in output voltage for a change in input
voltage. The measurement is made under conditions
of low dissipation or by using pulse techniques such
that average chip temperature is not significantly af-
fected.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 4.6
Jan 08, 2007
2
Global Mixed-mode Technology Inc.
G930/G931
Typical Performance Characteristics
(VIN=5V, CIN=1µF, COUT =10µF, TA=25°C, unless otherwise noted.)
Line Transient
Load Transient
Ch1: Iout (400mA/div)
Ch2: Vout (offset=3.50V)
Ch1: Vout (offset=3.50V)
Ch2: Vin (offset=5.0V)
Iout=100mA
Output Voltage vs. Load Current
Dropout Voltage vs. Load Current
3.56
3.55
3.54
3.53
3.52
3.51
3.50
3.49
800
700
600
500
400
300
200
100
0
0
100
200
300
400
500
600
0
100
200
300
400
Load Current (mA)
Load Current (mA)
Ground Current vs. Load Current
1.60
1.50
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
0.60
0
100
200
300
400
Load Current (mA)
TEL: 886-3-5788833
Ver: 4.6
http://www.gmt.com.tw
Jan 08, 2007
3
Global Mixed-mode Technology Inc.
G930/G931
Typical Performance Characteristics (continued)
SOT-89 Max. Power Dissipation vs. TAMB
(still air)
( Different PCB Top Copper Area )
SOT-89 Max.Power Dissipation vs.
PCB Top Copper Area
TAMB = 25°C ; Still Air
Unit : in2
A=0.1
3
2.5
2
3
2.5
2
A=0.2
A=0.3
A=0.4
A=0.5
A=1.0
A=1.5
A=2.0
A=2.5
A=3.0
A=3.5
A=4.0
A=4.5
A=5.0
1.5
1
1.5
1
0.5
0
0.5
25
35
45
55
65
75
85
0
1
2
3
4
5
TAMB (°C)
PCB Top Copper Area (in2)
Recommended Minimum Footprint
SOT-89
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 4.6
Jan 08, 2007
4
Global Mixed-mode Technology Inc.
G930/G931
Package Information
D
D1
POLISH
E
HE
A1
e
C
MATTE FINISH
A
b
b1
POLISH
b
SOT- 89 (T2) Package
DIMENSIONS IN MILLIMETERS
DIMENSIONS IN INCHES
SYMBOLS
MIN
NOM
1.50
1.04
0.42
0.47
0.40
4.50
1.60
-----
MAX
MIN
0.055
0.031
0.014
0.016
0.014
0.173
0.055
-----
NOM
0.059
0.041
0.016
0.018
0.015
0.177
0.062
-----
MAX
0.063
-----
A
A1
b
1.40
0.80
0.36
0.41
038
1.60
-----
0.48
0.53
0.43
4.60
1.75
4.25
2.60
3.10
0.018
0.020
0.017
0.181
0.069
0.167
0.102
0.122
b1
C
D
4.40
1.40
-----
D1
HE
E
2.40
2.90
2.50
3.00
0.094
0.114
0.098
0.118
e
Package Specification
PACKAGE
Q’TY/REEL
1,000 ea
SOT-89
Feed Direction
SOT-89 Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 4.6
Jan 08, 2007
5
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