G960T45UF [GMT]
Regulator;型号: | G960T45UF |
厂家: | GLOBAL MIXED-MODE TECHNOLOGY INC |
描述: | Regulator |
文件: | 总9页 (文件大小:225K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Global Mixed-mode Technology Inc.
3.3V 1A Low Dropout Regulator
General Description
G960
Features
Dropout voltage typically 0.8V @ IO = 1A
Output current in excess of 1A
The G960 positive 3.3V voltage regulator features
the ability to source 1A of output current with a
dropout voltage of typically 0.8V over the entire op-
erating temperature range. A low quiescent current
is provided over the entire current output current
range. The typical quiescent current is 0.6mA. Fur-
thermore, the quiescent current is smaller when the
regulator is in the dropout mode (VIN < 3.3V).
Output voltage accuracy ±2%
Quiescent current, typically 600µA
Internal short circuit current limit
Internal over temperature protection
Applications
Familiar regulator features such as over tem-
perature and over current protection circuits are
provided to prevent it from being damaged by
abnormal operating conditions.
CD-R/W
ADSL
Cable Modem
Set-Top-Box
LAN switch/Hub
Router
DVD-R/W
Ordering Information
ORDER
NUMBER
G960T33T
G960T35T
G960T36T
G960T43U
G960T45U
G960T53U
G960T63U
G960T65U
ORDER NUMBER
TEMP.
RANGE
PIN OPTION
PACKAGE
MARKING
(Pb free)
G960T33Tf
G960T35Tf
G960T36Tf
G960T43Uf
G960T45Uf
G960T53Uf
G960T63Uf
G960T65Uf
1
2
3
VIN
960T33
960T35
960T36
960T43
960T45
960T53
960T63
960T65
TO-220
TO-220
TO-220
TO-252
TO-252
TO-263
SOT-223
SOT-223
GND
VIN
VIN
GND
VIN
GND
GND
VIN
VOUT
GND
VOUT
VOUT
GND
VOUT
VOUT
GND
-40°C~85°C
-40°C~85°C
-40°C~85°C
-40°C~85°C
-40°C~85°C
-40°C~85°C
-40°C~85°C
-40°C~85°C
VOUT
GND
VIN
VOUT
VIN
VIN
VOUT
Order Number Identification
GXXX XX
X
X
Packing Type
Pin Option
Package Type
Part Number
PACKAGE TYPE
T3 : TO-220
PIN OPTION
PACKING
U : Tape & Reel Direction
T : Tube
1
2
3
T4 : TO-252
1 : VOUT
2 : VOUT
3 : GND
4 : GND
5 : VIN
GND
VIN
VIN
T5 : TO-263
GND
VIN
T6 : SOT-223
VOUT
VIN
VOUT
VOUT
GND
GND
VOUT
6 : VIN
Package Type
Typical Application
[Note 4] : Type of COUT
IO
VIN
VOUT
G960
Top View
Top View
Top View
C1
0.47µF
COUT
10µF
IQ
3
1
2
1
2
3
1
2
3
TO-252、263
SOT-223
TO-220
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.7
Apr 18, 2006
1
Global Mixed-mode Technology Inc.
G960
Absolute Maximum Ratings
(Note 1)
Operating Conditions (Note 1)
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . 4V~7V
Temperature Range. . . . . . . . . . . . .-40°C ≤ TA ≤85°C
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature . . . . . . . . . . . . . .150°C
Storage Temperature Range . . . .-65°C ≤ TJ ≤+150°C
Reflow Temperature (soldering, 10sec) . . . . . .260°C
Thermal Resistance Junction to Ambient, (θJA)
SOT-223. . . . . . . . . . . . . . . . . . . . . . . . . . . .148°C/W
TO-220. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76°C/W
TO-252. . . . . . . . . . . . . . . . . . . . . . . . . . . . .124°C/W
TO-263. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76°C/W
Thermal Resistance Junction to Case, (θJC)
SOT-223. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22°C/W
TO-252. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7°C/W
TO-263. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6°C/W
Electrical Characteristics
VIN =5V, IO = 1A, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3]
PARAMETER
Output Voltage
CONDITION
MIN
3.234
---
---
---
0.3
---
---
---
---
TYP
3.3
20
MAX UNIT
50mA < IO <1A
4V < VIN < 7V, IO = 10mA
50mA < IO < 1A
3.366
30
50
---
1.5
---
V
mV
mV
mΩ
mA
dB
V
Line Regulation
Load Regulation
Output Impedance
Quiescent Current
Ripple Rejection
30
200mA DC and 100mA AC, fo = 120Hz
100
0.6
42
0.8
200
1.6
150
VIN = 5V
fi = 120Hz, 1VP-P, Io = 100mA
IO = 1A
---
Dropout Voltage
IO = 100mA
---
---
mV
A
Short Circuit Current
Over Temperature
VIN=7.05V, IO=1.1A, duration time=40msec with G960T45 package
---
---
°C
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications
and test conditions see the Electrical Characteristics.
The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA, and
ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If this dis-
sipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the G960 in the
SOT-223 package, θJA is 148°C/W; in the TO-252 package, θJA is 124°C/W; in the TO-263 package, θJA is 76°C/W, and in
the TO-220 package, θJA is 76°C/W (No heat sink).
Note 1:
Note2:
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
The type of output capacitor should be tantalum or aluminum.
Note3:
Note4:
Definitions
Dropout Voltage
Load Regulation
The input/output Voltage differential at which the
regulator output no longer maintains regulation
against further reductions in input voltage. Measured
when the output drops 100mV below its nominal
value, dropout voltage is affected by junction tem-
perature, load current and minimum input supply re-
quirements.
The change in output voltage for a change in load
current at constant chip temperature. The measure-
ment is made under conditions of low dissipation or
by using pulse techniques such that average chip
temperature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Line Regulation
The change in output voltage for a change in input
voltage. The measurement is made under conditions
of low dissipation or by using pulse techniques such
that average chip temperature is not significantly af-
fected.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.7
Apr 18, 2006
2
Global Mixed-mode Technology Inc.
G960
Typical Performance Characteristics
(VIN=5V, CIN=1µF, COUT =10µF, TA=25°C, unless otherwise noted.)
Line Transient
Load Transient
Ch1: Vout (offset=3.30V)
Ch2: Vin (offset=5.0V)
Iout=100mA
Ch1: Vout (offset=3.30V)
Ch2: Iout (780mA/div)
Output Voltage vs. Load Current
Dropout Voltage vs. Load Current
3.380
3.360
3.340
3.320
3.300
3.280
3.260
1200
1000
800
600
400
200
0
0
100
200
300
400
500
600
700
800
900
1000
0
100
200
300
400
500
600
700
800
900
1000
Load Current (mA)
Load Current (mA)
Ground Current vs. Load Current
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0
100
200
300
400
500
600
700
800
900
1000
Load Current (mA)
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.7
Apr 18, 2006
3
Global Mixed-mode Technology Inc.
G960
Typical Performance Characteristics (continued)
SOT-223 Max. Power Dissipation vs.
SOT-223 Power Dissipation vs.
PCB Top Copper Area
TAMB (still air)
T
AMB = 25°C ; Still Air
( Different PCB Top Copper Area )
Unit:in2
3
2.5
2
3
2.5
2
A=0.5
A=1.0
A=1.5
A=2.0
A=2.5
A=3.0
A=3.5
A=4.0
A=4.5
A=5.0
1.5
1
1.5
1
0.5
0
0.5
0
0.5
1.5
2.5
3.5
4.5
25
35
45
55
65
75
85
PCB Top Copper Area (in2)
TAMB (°C)
TO-252 Max. Power Dissipation vs.
TAMB (still air)
TO-252 Power Dissipation vs.
PCB Top Copper Area
T
AMB = 25°C ; Still Air
( Different PCB Top Copper Area )
Unit:in2
4
3.5
3
4
3.5
3
A=0.5
A=1.0
A=1.5
A=2.0
A=2.5
A=3.0
A=3.5
A=4.0
A=4.5
A=5.0
2.5
2
2.5
2
1.5
1
1.5
1
0.5
0
0.5
0
25
35
45
55
65
75
85
0.5
1.5
2.5
3.5
4.5
PCB Top Copper Area (in2)
TAMB (°C)
TO-263 Power Dissipation vs.
PCB Top Copper Area
TO-263 Max. Power Dissipation vs.
TAMB (still air)
T
AMB = 25°C ; Still Air
Unit:in2
( Different PCB Top Copper Area )
4
3.5
3
4
3.5
A=0.5
A=1.0
A=1.5
A=2.0
A=2.5
A=3.0
A=3.5
A=4.0
A=4.5
A=5.0
3
2.5
2
2.5
2
1.5
1
1.5
1
0.5
0
0.5
0
25
35
45
55
65
75
85
0.5
1.5
2.5
3.5
4.5
PCB Top Copper Area (in2)
TAMB (°C)
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.7
Apr 18, 2006
4
Global Mixed-mode Technology Inc.
G960
Typical Performance Characteristics
Heatsink Package Dimension
(continued)
TO-220 Max. Power Dissipation vs.
TO-220
Temperature
5
4.5
4
3.5
3
Heatsink
2.5
2
1.5
1
Without heatsink
0.5
0
-45
-15
15
45
75
105
Temparature (°C)
Recommended Minimum Footprint
TO-252
SOT-223
TO-263
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.7
Apr 18, 2006
5
Global Mixed-mode Technology Inc.
G960
Package Information
E
A
E1
E1
DIA
F
d
D
D1
I
L
e
C
A1
b
b1
e1
TO-220 (T3) Package
MILLIMETER
INCH
SYMBOL
MIN
MAX
4.826
2.72
MIN
MAX
0.190
0.107
0.037
0.055
0.018
0.145
0.356
0.113
0.410
0.206
0.156
0.110
0.210
0.055
0.565
0.16
A
A1
b
4.318
2.46
0.170
0.097
0.027
0.045
0.012
0.135
0.336
0.103
0.390
0.195
0.146
0.090
0.190
0.045
0.535
0.140
0.69
0.94
b1
C
1.143
0.304
3.429
8.53
1.397
0.460
3.683
9.04
D
D1
d
2.62
2.87
E
9.906
4.953
3.708
2.29
10.40
5.22
E1
DIA
e
3.962
2.79
e1
F
4.83
5.33
1.143
1.397
14.351
4.06
L
13.589
3.56
I
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.7
Apr 18, 2006
6
Global Mixed-mode Technology Inc.
G960
A
E
A1
c1
b2
L2
Seating
Plane
D
H
L1
L3
L
c
b1
b
e
e1
E1
BACK VIEW Z-Z
TO-252 (T4) Package
MILLIMETERS
INCHES
SYMBOL
MIN.
2.19
0.89
0.64
0.76
5.21
0.46
0.46
5.97
6.35
MAX.
2.38
1.14
0.88
1.14
5.46
0.58
0.58
6.22
6.73
MIN.
0.086
0.035
0.025
0.030
0.205
0.018
0.018
0.235
0.250
MAX.
0.094
0.045
0.035
0.045
0.215
0.023
0.023
0.244
0.265
A
A1
b
b1
b2
c
c1
D
E
E1
e
MIN 4.32
2.28 BSC
4.57 BSC
MIN 0.170
0.090 BSC
0.180 BSC
e1
H
9.40
0.51
0.64
0.88
1.15
10.42
-----
0.370
0.020
0.025
0.035
0.045
0.410
-----
L
L1
L2
L3
1.02
1.27
1.52
0.040
0.050
0.060
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.7
Apr 18, 2006
7
Global Mixed-mode Technology Inc.
G960
A
E
A1
L3
D
H
C
L1
L
e
L2
A2
e1
b
b1
TO-263 (T5) Package
MILLIMETER
INCH
SYMBOL
MIN
4.30
1.22
2.45
0.69
1.22
0.36
8.64
9.70
2.29
4.83
14.60
4.70
1.20
2.24
MAX
4.70
1.32
2.69
0.94
1.40
0.56
9.652
10.54
2.79
5.33
15.78
5.84
1.778
2.84
MIN
0.169
0.048
0.104
0.027
0.048
0.014
0.340
0.382
0.090
0.190
0.575
0.185
0.047
0.088
MAX
0.185
0.055
0.106
0.037
0.055
0.022
0.380
0.415
0.110
0.210
0.625
0.230
0.070
0.111
A
A1
A2
b
b1
C
D
E
e
e1
H
L
L1
L2
L3
1.40MAX
0.055MAX
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.7
Apr 18, 2006
8
Global Mixed-mode Technology Inc.
G960
A
D
α
B1
C
13°(4X)
H
E
L
L2
e
e1
13°(4X)
A1
B
SOT-223 (T6) Package
MILLIMETER
INCH
SYMBOL
MIN
MAX
1.80
0.12
0.80
3.10
0.32
6.70
3.70
MIN
0.061
0.0008
0.024
0.114
0.009
0.248
0.130
MAX
0.071
0.0047
0.031
0.122
0.013
0.264
0.146
A
A1
B
1.55
0.02
0.60
2.90
0.24
6.30
3.30
B1
C
D
E
e
2.30 BSC
4.60 BSC
0.090 BSC
0.181 BSC
e1
H
6.70
7.30
0.264
0.287
L
0.90 MIN
0.06 BSC
0.036 MIN
L2
α
0.0024 BSC
0°
10°
0°
10°
Taping Specification
PACKAGE
TO-220
Q’TY/REEL
-----
Q’TY/TUBE
50 ea
-----
TO-252
2,500 ea
800 ea
Feed Direction
TO-252 Package Orientation
Feed Direction
SOT-223 Package Orientation
TO-263
-----
SOT-223
2,500 ea
-----
Feed Direction
TO-263 Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 2.7
Apr 18, 2006
9
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