GS74108AGP-10T [GSI]
Standard SRAM, 512KX8, 10ns, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, TSOP2-44;
| 型号： | GS74108AGP-10T |
| 厂家： | 
GSI TECHNOLOGY |
| 描述： | Standard SRAM, 512KX8, 10ns, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, TSOP2-44 静态存储器 光电二极管 内存集成电路 |
| 文件： | 总11页 (文件大小：157K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GS74108AGP/X
8, 10, 12 ns
TSOP, FP-BGA
Commercial Temp
Industrial Temp
512K x 8
4Mb Asynchronous SRAM
3.3 V V
DD
Center V and V
DD
SS
Features
FP-BGA 512K x 8 Bump Configuration (Package X)
• Fast access time: 8, 10, 12 ns
• CMOS low power operation: 120/95/85 mA at minimum
cycle time
1
2
3
4
5
6
• Single 3.3 V power supply
• All inputs and outputs are TTL-compatible
• Fully static operation
• Industrial Temperature Option: –40° to 85°C
• Package line up
A
B
C
D
E
F
NC
OE
A2
A1
A6
A5
A7
NC
DQ1 NC
DQ2 NC
CE DQ8
NC DQ7
A0
A4
GP: RoHS-compliant 400 mil, 44-pin TSOP-II package
X: 6 mm x 10 mm FPBGA package
GX: RoHS-compliant 6 mm x 10 mm FPBGA package
VSS
VDD
NC
NC
A18
A17
A13
A14
A15
A3
NC
NC
VDD
VSS
A9
Description
DQ3 NC
DQ4 NC
A10
A11
A12
NC DQ6
WE DQ5
The GS74108A is a high speed CMOS Static RAM organized
as 524,288 words by 8 bits. Static design eliminates the need
for external clocks or timing strobes. The GS74108A operates
on a single 3.3 V power supply and all inputs and outputs are
TTL-compatible. The GS74108A is available in 400 mil
TSOP-II and 6 mm x 10 mm FPBGA packages.
G
H
NC
A16
A8
NC
6 mm x 10 mm
TSOP-II 512K x 8-Pin Configuration
NC
NC
A4
1
44
NC
NC
NC
A5
Pin Descriptions
2
43
42
3
Symbol
A0–A18
DQ1–DQ8
CE
Description
Address input
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
4
A3
5
A2
A6
6
Data input/output
Chip enable input
Write enable input
Output enable input
+3.3 V power supply
A1
A7
7
A0
A8
8
CE
OE
DQ8
DQ7
VSS
VDD
DQ6
DQ5
WE
9
DQ1
DQ2
VDD
VSS
DQ3
DQ4
10
11
12
13
14
15
16
17
18
OE
44-pin
V
DD
400 mil TSOP II
V
Ground
SS
NC
No connect
A
9
WE
A17
A16
A10
A11
A12
A18
NC
A15
A14
19
20
21
22
A13
NC
NC
24
23
NC
NC
Rev: 1.09 1/2013
1/11
© 2001, GSI Technology, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108AGP/X
Block Diagram
A0
Row
Decoder
Memory Array
Address
Input
Buffer
Column
Decoder
A18
CE
WE
OE
I/O Buffer
Control
DQ8
DQ1
Truth Table
CE
V
Current
OE
WE
DQ1 to DQ8
DD
H
L
L
L
X
L
X
H
L
Not Selected
Read
ISB1, ISB2
X
H
Write
IDD
H
High Z
Note:
X: “H” or “L”
Rev: 1.09 1/2013
2/11
© 2001, GSI Technology, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108AGP/X
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply Voltage
VDD
–0.5 to +4.6
V
–0.5 to V +0.5
DD
Input Voltage
VIN
V
(≤ 4.6 V max.)
–0.5 to V +0.5
DD
Output Voltage
VOUT
V
(≤ 4.6 V max.)
Allowable power dissipation
Storage temperature
PD
0.7
W
o
TSTG
–55 to 150
C
Note:
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended
Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
Recommended Operating Conditions
Parameter
Supply Voltage for -8/-10/-12
Input High Voltage
Symbol
Min
3.0
Typ
3.3
—
Max
Unit
V
3.6
V
V
V
DD
V
+0.3
VIH
VIL
2.0
DD
Input Low Voltage
–0.3
—
0.8
Ambient Temperature,
Commercial Range
o
TAc
TAI
0
—
—
70
85
C
Ambient Temperature,
Industrial Range
o
–40
C
Notes:
1. Input overshoot voltage should be less than V +2 V and not exceed 20 ns.
DD
2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns.
Capacitance
Parameter
Input Capacitance
Output Capacitance
Symbol
CIN
Test Condition
Max
Unit
pF
VIN = 0 V
5
7
COUT
VOUT = 0 V
pF
Notes:
1. Tested at TA = 25°C, f = 1 MHz
2. These parameters are sampled and are not 100% tested.
Rev: 1.09 1/2013
3/11
© 2001, GSI Technology, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108AGP/X
DC I/O Pin Characteristics
Parameter
Symbol
Test Conditions
Min
Max
VIN = 0 to V
DD
Input Leakage Current
IIL
– 1 uA
1 uA
Output High Z
Output Leakage Current
ILO
–1 uA
1 uA
VOUT = 0 to V
DD
Output High Voltage
Output Low Voltage
VOH
VOL
IOH = –4 mA
ILO = +4 mA
2.4
—
—
0.4 V
Power Supply Currents
0 to 70°C
–40 to 85°C
10 ns
Parameter
Symbol
Test Conditions
8 ns
10 ns
12 ns
8 ns
12 ns
CE ≤ VIL
Operating
Supply
Current
All other inputs
≥ VIH or ≤ VIL
Min. cycle time
IOUT = 0 mA
IDD
120 mA
95 mA
85 mA
130 mA
105 mA
95 mA
CE ≥ VIH
Standby
Current
All other inputs
≥ VIH or ≤VIL
Min. cycle time
ISB1
30 mA
25 mA
10 mA
22 mA
40 mA
35 mA
20 mA
32 mA
CE ≥ VDD - 0.2V
All other inputs
≥ VDD - 0.2V or ≤ 0.2V
Standby
Current
ISB2
Rev: 1.09 1/2013
4/11
© 2001, GSI Technology, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108AGP/X
AC Test Conditions
Output Load 1
Parameter
Input high level
Input low level
Conditions
VIH = 2.4 V
VIL = 0.4 V
tr = 1 V/ns
tf = 1 V/ns
1.4 V
DQ
1
30pF
50Ω
Input rise time
VT = 1.4 V
Input fall time
Input reference level
Output reference level
Output load
Output Load 2
1.4 V
3.3 V
Fig. 1& 2
589Ω
434Ω
DQ
Notes:
1
1. Include scope and jig capacitance.
5pF
2. Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted.
3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ
AC Characteristics
Read Cycle
-8
-10
-12
Parameter
Symbol
Unit
Min
8
Max
—
8
Min
Max
—
Min
12
—
—
—
3
Max
—
Read cycle time
tRC
tAA
tAC
tOE
tOH
10
—
—
—
3
ns
ns
ns
ns
ns
ns
Address access time
—
—
—
3
10
10
4
12
12
5
Chip enable access time (CE)
Output enable to output valid (OE)
Output hold from address change
Chip enable to output in low Z (CE)
8
3.5
—
—
—
—
*
3
3
—
3
—
tLZ
*
Output enable to output in low Z (OE)
Chip disable to output in High Z (CE)
0
—
4
0
—
5
0
—
6
ns
ns
ns
tOLZ
*
—
—
—
—
—
—
tHZ
*
Output disable to output in High Z (OE)
3.5
4
5
tOHZ
* These parameters are sampled and are not 100% tested.
Rev: 1.09 1/2013
5/11
© 2001, GSI Technology, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108AGP/X
Read Cycle 1: CE = OE = V , WE = V
IL
IH
tRC
Address
Data Out
tAA
tOH
Previous Data
Data valid
Read Cycle 2: WE = V
IH
tRC
Address
CE
tAA
tAC
tHZ
tLZ
OE
tOE
tOHZ
tOLZ
DATA VALID
Data Out
High impedance
Rev: 1.09 1/2013
6/11
© 2001, GSI Technology, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108AGP/X
Write Cycle
-8
-10
-12
Parameter
Symbol
Unit
Max
Min
8
Max
—
—
—
—
—
—
—
—
—
—
Min
10
7
Max
—
—
—
—
—
—
—
—
—
—
Min
12
8
Write cycle time
Address valid to end of write
Chip enable to end of write
Data set up time
tWC
tAW
tCW
tDW
tDH
—
—
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
5.5
5.5
4
7
8
5
6
Data hold time
0
0
0
Write pulse width
tWP
tAS
5.5
0
7
8
Address set up time
Write recovery time (WE)
Write recovery time (CE)
0
0
tWR
tWR1
0
0
0
0
0
0
*
Output Low Z from end of write
Write to output in High Z
3
3
3
tWLZ
*
—
3.5
—
4
—
5
ns
tWHZ
* These parameters are sampled and are not 100% tested.
Write Cycle 1: WE control
tWC
Address
OE
tAW
tWR
tCW
CE
tAS
tWP
WE
tDW
tDH
DATA VALID
Data In
Data Out
tWHZ
tWLZ
HIGH IMPEDANCE
Rev: 1.09 1/2013
7/11
© 2001, GSI Technology, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108AGP/X
Write Cycle 2: CE control
tWC
Address
OE
tAW
tWR1
tAS
tCW
CE
tWP
WE
tDW
tDH
DATA VALID
Data In
Data Out
HIGH IMPEDANCE
44-Pin, 400 mil TSOP-II
D
Dimension in inch Dimension in mm
min nom max min nom max
c
44
23
22
Symbol
A
A1
A2
B
—
—
—
0.047
—
—
—
1.20
—
0.002
0.05
—
A
0.037 0.039 0.041 0.95
0.01 0.014 0.018 0.25
1.00
0.35
0.15
1.05
0.45
—
c
—
0.006
—
—
1
e
D
0.721 0.725 0.729 18.31 18.41 18.51
0.396 0.400 0.404 10.06 10.16 10.26
B
E
e
—
0.031
—
—
0.80
—
HE
L
0.455 0.463 0.471 11.56 11.76 11.96
y
0.016 0.020 0.024 0.40
0.50
0.80
—
0.60
—
L1
y
—
—
0.031
—
—
—
—
Q
0.004
0.10
Detail A
o
o
o
o
Q
—
—
0
5
0
5
Notes:
1. Dimension D& E do not include interlead flash.
2. Dimension B does not include dambar protrusion/intrusion.
3. Controlling dimension: mm
Rev: 1.09 1/2013
8/11
© 2001, GSI Technology, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108AGP/X
6 mm x 10 mm FPBGA
Symbol
Unit: mm
D
A
1.10±0.10
0.20~0.30
f0.30~0.40
0.36(TYP)
10.0±0.05
5.25
A1
fb
c
E
D
Pin A1
Index
D1
E
6.0±0.05
3.75
E1
e
0.75(TYP)
0.10
Top View
aaa
A
c
Side View
A1
aaa
E1
Pin A1
A B C D E F G H
fb Solder Ball
Index
1
2
3
4
5
6
e
e
D1
Bottom View
Rev: 1.09 1/2013
9/11
© 2001, GSI Technology, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108AGP/X
Ordering Information
1
2
Access Time
Temp. Range
Part Number
Package
GS74108AGP-8
GS74108AGP-10
GS74108AGP-12
GS74108AGP-8I
GS74108AGP-10I
GS74108AGP-12I
GS74108AX-8
RoHS-compliant 400 mil TSOP-II
RoHS-compliant 400 mil TSOP-II
RoHS-compliant 400 mil TSOP-II
RoHS-compliant 400 mil TSOP-II
RoHS-compliant 400 mil TSOP-II
RoHS-compliant 400 mil TSOP-II
6 mm x 10 mm FPBGA
8 ns
10 ns
12 ns
8 ns
Commercial
Commercial
Commercial
Industrial
10 ns
12 ns
8 ns
Industrial
Industrial
Commercial
Commercial
Commercial
Industrial
GS74108AX-10
GS74108AX-12
GS74108AX-8I
6 mm x 10 mm FPBGA
10 ns
12 ns
8 ns
6 mm x 10 mm FPBGA
6 mm x 10 mm FPBGA
GS74108AX-10I
GS74108AX-12I
GS74108AGX-8
GS74108AGX-10
GS74108AGX-12
GS74108AGX-8I
GS74108AGX-10I
GS74108AGX-12I
Notes:
6 mm x 10 mm FPBGA
10 ns
12 ns
8 ns
Industrial
6 mm x 10 mm FPBGA
Industrial
RoHS-compliant 6 mm x 10 mm FPBGA
RoHS-compliant 6 mm x 10 mm FPBGA
RoHS-compliant 6 mm x 10 mm FPBGA
RoHS-compliant 6 mm x 10 mm FPBGA
RoHS-compliant 6 mm x 10 mm FPBGA
RoHS-compliant 6 mm x 10 mm FPBGA
Commercial
Commercial
Commercial
Industrial
10 ns
12 ns
8 ns
10 ns
12 ns
Industrial
Industrial
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example: GS74108AGP-8T.
2. Packages listed with the additional “G” designator are 6/6 RoHS compliant.
Rev: 1.09 1/2013
10/11
© 2001, GSI Technology, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS74108AGP/X
4M Asynchronous Datasheet Revision History
Rev. Code: Old;
New
Types of Changes
Format or Content
Page #/Revisions/Reason
• Creation of new datasheet
74108A_r1
Format/Content
• Added 6 ns speed bin
• Updated all power numbers
74108A_r1; 74108A_r1_01
Content
• Updated Recommended Operating Conditions table on page 4
• Added 7 ns bin to entire document
74108A_r1_01; 74108A_r1_02
Content
• Added X package
• Removed 6 ns speed bin from entire document
• Corrected “X” package pinout
74108A_r1_02; 74108A_r1_03
74108A_r1_03; 74108A_r1_04
74108A_r1_04; 74108A_r1_05
74108A_r1_05; 74108A_r1_06
Content
Content
Content
Content
• Removed 7 ns speed bin from entire document
• Updated format
• Added Pb-free information for TSOP-II package
• Added Pb-free information for FP-BGA package
• Added RoHS-compliant information for SOJ
• Changed Pb-free references to RoHS-compliant
• Added status to ordering information table
74108A_r1_06; 74108A_r1_07
Content
• Removed status from ordering information table (all parts MP)
• (Rev1.08a: Removed SOJ references due to EOL)
74108A_r1_07; 74108A_r1_08
74108A_r1_08; 74108A_r1_09
Content
Content
• Removed 5/6 RoHS TSOP-II references due to EOL)
Rev: 1.09 1/2013
11/11
© 2001, GSI Technology, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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