GS81302D18E-167IT [GSI]
DDR SRAM, 8MX18, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165;
| 型号： | GS81302D18E-167IT |
| 厂家： | 
GSI TECHNOLOGY |
| 描述： | DDR SRAM, 8MX18, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 双倍数据速率 静态存储器 |
| 文件： | 总39页 (文件大小：628K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
333 MHz–167 MHz
1.8 V V
1.8 V and 1.5 V I/O
TM
165-Bump BGA
Commercial Temp
Industrial Temp
144Mb SigmaQuad -II
DD
Burst of 4 SRAM
Features
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write controls sampled at data-in time
• Burst of 4 Read and Write
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• Pin-compatible with present 144 Mb devices
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
Bottom View
165-Bump, 15 mm x 17 mm BGA
SigmaQuad™ Family Overview
1 mm Bump Pitch, 11 x 15 Bump Array
The GS81302D08/09/18/36E are built in compliance with the
SigmaQuad-II SRAM pinout standard for Separate I/O
synchronous SRAMs. They are 150,994,944-bit (144Mb)
SRAMs. The GS81302D08/09/18/36E SigmaQuad SRAMs
are just one element in a family of low power, low voltage
HSTL I/O SRAMs designed to operate at the speeds needed to
implement economical high performance networking systems.
C clock inputs. C and C are also independent single-ended
clock inputs, not differential inputs. If the C clocks are tied
high, the K clocks are routed internally to fire the output
registers instead.
Because Separate I/O SigmaQuad-II B4 RAMs always transfer
data in four packets, A0 and A1 are internally set to 0 for the
first read or write transfer, and automatically incremented by 1
for the next transfers. Because the LSBs are tied off internally,
the address field of a SigmaQuad-II B4 RAM is always two
address pins less than the advertised index depth (e.g., the 8M
x 18 has a 2M addressable index).
Clocking and Addressing Schemes
The GS81302D08/09/18/36E SigmaQuad-II SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer. The device also allows the user to manipulate the
output register clock inputs quasi independently with the C and
Parameter Synopsis
- 333
3.0 ns
0.45 ns
-300
3.3 ns
0.45 ns
-250
4.0 ns
0.45 ns
-200
5.0 ns
0.45 ns
-167
6.0 ns
0.50 ns
tKHKH
tKHQV
Rev: 1.02a 6/2010
1/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
4M x 36 SigmaQuad-II SRAM—Top View
1
2
3
4
5
6
7
8
9
10
11
NA/SA
(288Mb)
A
CQ
SA
W
BW2
K
BW1
R
SA
SA
CQ
B
C
D
E
F
Q27
D27
D28
Q29
Q30
D30
Doff
D31
Q32
Q33
D33
D34
Q35
TDO
Q18
Q28
D20
D29
Q21
D22
D18
D19
Q19
Q20
D21
Q22
SA
BW3
SA
K
BW0
SA
SA
D17
D16
Q16
Q15
D14
Q13
Q17
Q7
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
V
NC
V
SS
SS
SS
SS
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
D15
D6
SS
SS
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
V
V
V
V
V
V
V
V
V
V
V
Q14
D13
DDQ
DDQ
DDQ
DDQ
DDQ
G
H
J
V
V
V
V
V
V
V
REF
REF
DDQ
DDQ
Q31
D32
Q24
Q34
D26
D35
TCK
D23
Q23
D24
D25
Q25
Q26
SA
D12
Q12
D11
D10
Q10
Q9
Q4
K
L
V
D3
Q11
Q1
V
V
V
V
V
DDQ
SS
SS
SS
SS
M
N
P
R
V
V
SS
SS
SS
SS
V
SA
SA
SA
SA
C
SA
SA
SA
V
D9
SA
SA
SA
SA
D0
C
SA
TMS
2
11 x 15 Bump BGA—15 x 17 mm Body—1 mm Bump Pitch
Notes:
1. BW0 controls writes to D0:D8; BW1 controls writes to D9:D17; BW2 controls writes to D18:D26; BW3 controls writes to D27:D35.
2. A2 is the expansion address.
Rev: 1.02a 6/2010
2/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
8M x 18 SigmaQuad-II SRAM—Top View
1
2
3
4
5
6
7
8
9
10
11
NC/SA
(288Mb)
A
CQ
SA
SA
W
BW1
K
R
SA
SA
CQ
B
C
D
E
F
NC
NC
NC
NC
NC
NC
Doff
NC
NC
NC
NC
NC
NC
TDO
Q9
NC
D9
SA
NC
SA
K
BW0
SA
SA
NC
NC
NC
NC
NC
NC
NC
Q7
NC
D6
NC
NC
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
D10
Q10
Q11
D12
Q13
V
NC
V
SS
SS
SS
SS
D11
NC
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
SS
SS
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
Q12
D13
V
V
V
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
G
H
J
V
V
V
V
V
V
V
REF
REF
DDQ
DDQ
NC
D14
Q14
D15
D16
Q16
Q17
SA
NC
Q4
K
L
NC
Q15
NC
V
NC
NC
NC
NC
NC
SA
D3
NC
Q1
V
V
V
V
V
DDQ
SS
SS
SS
SS
M
N
P
R
V
V
SS
SS
SS
SS
D17
NC
V
SA
SA
SA
SA
C
SA
SA
SA
V
NC
D0
SA
SA
SA
SA
TCK
C
TMS
2
11 x 15 Bump BGA—15 x 17 mm Body—1 mm Bump Pitch
Notes:
1. BW0 controls writes to D0:D8. BW1 controls writes to D9:D17.
2. A7 is the expansion address.
Rev: 1.02a 6/2010
3/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
16M x 9 SigmaQuad-II SRAM—Top View
1
2
3
4
5
6
7
8
9
10
11
A
B
CQ
SA
SA
W
NC
K
SA
R
SA
SA
CQ
NC/SA
(288Mb)
NC
NC
NC
SA
K
BW0
SA
SA
NC
NC
Q4
C
D
E
F
NC
NC
NC
NC
NC
NC
D5
NC
NC
D6
NC
NC
Q5
NC
Q6
V
SA
NC
V
NC
NC
NC
NC
NC
NC
NC
D3
D4
NC
Q3
NC
NC
ZQ
D2
NC
Q1
D1
NC
Q0
TDI
SS
SS
SS
SS
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
SS
SS
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
V
V
V
V
V
V
V
V
V
V
V
NC
NC
DDQ
DDQ
DDQ
DDQ
DDQ
G
H
J
V
V
V
D
V
V
V
V
REF
off
REF
DDQ
DDQ
NC
NC
NC
NC
NC
Q2
K
L
NC
Q7
NC
D7
NC
NC
Q8
SA
V
NC
NC
NC
NC
NC
SA
NC
NC
NC
NC
D0
NC
V
V
V
V
V
DDQ
SS
SS
SS
SS
M
N
P
R
NC
NC
D8
V
V
SS
SS
SS
SS
NC
V
SA
SA
SA
SA
C
SA
SA
SA
V
NC
NC
TCK
SA
SA
SA
SA
TDO
C
TMS
2
11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch
Notes:
1. BW0 controls writes to D0:D8.
2. B5 is the expansion address.
Rev: 1.02a 6/2010
4/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
16M x 8 SigmaQuad-II SRAM—Top View
1
2
3
4
5
6
7
8
9
10
11
A
B
CQ
SA
SA
W
NW1
K
SA
R
SA
SA
CQ
NC/SA
(288Mb)
NC
NC
NC
SA
K
NW0
SA
SA
NC
NC
Q3
C
D
E
F
NC
NC
NC
NC
NC
Doff
NC
NC
NC
NC
NC
NC
TDO
NC
D4
NC
NC
D5
NC
NC
Q4
NC
Q5
V
SA
NC
V
NC
NC
NC
NC
NC
NC
NC
D2
D3
NC
Q2
NC
NC
ZQ
D1
SS
SS
SS
SS
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
SS
SS
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
V
V
V
V
V
V
V
V
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
DDQ
V
V
V
V
V
V
V
V
V
V
V
NC
NC
DDQ
DDQ
DDQ
DDQ
DDQ
G
H
J
V
V
V
V
V
V
V
REF
REF
DDQ
DDQ
NC
NC
NC
Q1
K
L
NC
Q6
NC
D6
NC
NC
Q7
SA
V
NC
NC
NC
NC
NC
SA
NC
NC
NC
Q0
D0
V
V
V
V
V
DDQ
SS
SS
SS
SS
M
N
P
R
NC
D7
V
V
NC
SS
SS
SS
SS
V
SA
SA
SA
SA
C
SA
SA
SA
V
NC
NC
NC
TDI
NC
TCK
SA
SA
SA
SA
NC
C
TMS
2
11 x 15 Bump BGA—15 x 17 mm Body—1 mm Bump Pitch
Notes:
1. NW0 controls writes to D0:D3. NW1 controls writes to D4:D7.
2. B5 is the expansion address.
Rev: 1.02a 6/2010
5/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Pin Description Table
Symbol
Description
Synchronous Address Inputs
Synchronous Read
Type
Input
Input
Input
Comments
—
SA
R
Active Low
Active Low
W
Synchronous Write
Active Low
x9/x18/x36 only
BW0–BW3
NW0–NW1
Synchronous Byte Writes
Nybble Write Control Pin
Input
Input
Active Low
x8 only
K
K
Input Clock
Input Clock
Input
Input
Active High
Active Low
C
Output Clock
Input
Active High
C
Output Clock
Input
Active Low
TMS
TDI
TCK
TDO
VREF
Test Mode Select
Input
—
Test Data Input
Input
—
Test Clock Input
Input
—
Test Data Output
Output
Input
—
HSTL Input Reference Voltage
Output Impedance Matching Input
Synchronous Data Outputs
Synchronous Data Inputs
Disable DLL when low
Output Echo Clock
Output Echo Clock
Power Supply
—
ZQ
Qn
Dn
Input
—
Output
Input
—
—
Active Low
—
Input
D
off
CQ
CQ
Output
Output
Supply
—
VDD
1.8 V Nominal
VDDQ
VSS
NC
Isolated Output Buffer Supply
Power Supply: Ground
No Connect
Supply
Supply
—
1.5 or 1.8 V Nominal
—
—
Notes:
1. NC = Not Connected to die or any other pin
2. When ZQ pin is directly connected to V , output impedance is set to minimum value and it cannot be connected to ground or left
DDQ
unconnected.
Rev: 1.02a 6/2010
6/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Background
Separate I/O SRAMs, from a system architecture point of view, are attractive in applications where alternating reads and writes are
needed. Therefore, the SigmaQuad-II SRAM interface and truth table are optimized for alternating reads and writes. Separate I/O
SRAMs are unpopular in applications where multiple reads or multiple writes are needed because burst read or write transfers from
Separate I/O SRAMs can cut the RAM’s bandwidth in half.
Alternating Read-Write Operations
SigmaQuad-II SRAMs follow a few simple rules of operation.
- Read or Write commands issued on one port are never allowed to interrupt an operation in progress on the other port.
- Read or Write data transfers in progress may not be interrupted and re-started.
- R and W high always deselects the RAM.
- All address, data, and control inputs are sampled on clock edges.
In order to enforce these rules, each RAM combines present state information with command inputs. See the Truth Table for
details.
SigmaQuad-II B4 SRAM DDR Read
The status of the Address Input, W, and R pins are sampled by the rising edges of K. W and R high causes chip disable. A low on
the Read Enable-bar pin, R, begins a read cycle. R is always ignored if the previous command loaded was a read command. Data
can be clocked out after the next rising edge of K with a rising edge of C (or by K if C and C are tied high), after the following
rising edge of K with a rising edge of C (or by K if C and C are tied high), after the next rising edge of K with a rising edge of C,
and after the following rising edge of K with a rising edge of C. Clocking in a high on the Read Enable-bar pin, R, begins a read
port deselect cycle.
Read A
NOP
Read B
Write C
Read D
Write E
NOP
K
K
Address
A
B
C
D
E
R
W
BWx
D
C
C
C+1
C+1
C+2
C+2
C+3
C+3
E
E
E+1
E+1
C
C
Q
A
A+1
A+2
A+3
B
B+1
B+2
B+3
D
D+1
D+2
CQ
CQ
Rev: 1.02a 6/2010
7/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
SigmaQuad-II B4 SRAM DDR Write
The status of the Address Input, W, and R pins are sampled by the rising edges of K. W and R high causes chip disable. A low on
the Write Enable-bar pin, W, and a high on the Read Enable-bar pin, R, begins a write cycle. W is always ignored if the previous
command was a write command. Data is clocked in by the next rising edge of K, the rising edge of K after that, the next rising edge
of K, and finally by the next rising edge of K.
Write A
NOP
Read B
Write C
Read D
Write E
NOP
K
K
Address
A
B
C
D
E
R
W
BWx
D
A
A
A+1
A+1
A+2
A+2
A+3
A+3
C
C
C+1
C+1
C+2
C+2
C+3
C+3
E
E
E+1
E+1
E+
E+
C
C
Q
B
B+1
B+2
B+3
D
D+1
D+2
CQ
CQ
Rev: 1.02a 6/2010
8/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Power-Up Sequence for SigmaQuad-II SRAMs
SigmaQuad-II SRAMs must be powered-up in a specific sequence in order to avoid undefined operations.
Power-Up Sequence
1. Power-up and maintain Doff at low state.
1a. Apply V
1b. Apply V
1c. Apply V
.
DD
.
DDQ
(may also be applied at the same time as V
).
REF
DDQ
2. After power is achieved and clocks (K, K, C, C) are stablized, change Doff to high.
3. An additional 1024 clock cycles are required to lock the DLL after it has been enabled.
Note:
If you want to tie Doff high with an unstable clock, you must stop the clock for a minimum of 30 ns to reset the DLL after the
clocks become stablized.
DLL Constraints
• The DLL synchronizes to either K or C clock. These clocks should have low phase jitter (t
on page 21).
KCVar
• The DLL cannot operate at a frequency lower than that specified by the t
maximum specification for the desired
KHKH
operating clock frequency.
• If the incoming clock is not stablized when DLL is enabled, the DLL may lock on the wrong frequency and cause
undefined errors or failures during the initial stage.
Note:
If the frequency is changed, DLL reset is required. After reset, a minimum of 1024 cycles is required for DLL lock.
Special Functions
Byte Write and Nybble Write Control
Byte Write Enable pins are sampled at the same time that Data In is sampled. A high on the Byte Write Enable pin associated with
a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be
stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven high or low
during the data in sample times in a write sequence.
Each write enable command and write address loaded into the RAM provides the base address for a 4 beat data transfer. The x18
version of the RAM, for example, may write 72 bits in association with each address loaded. Any 9-bit byte may be masked in any
write sequence.
Nybble Write (4-bit) control is implemented on the 8-bit-wide version of the device. For the x8 version of the device, “Nybble
Write Enable” and “NBx” may be substituted in all the discussion above.
Rev: 1.02a 6/2010
9/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
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Example x18 RAM Write Sequence using Byte Write Enables
Data In Sample Time
BW0
BW1
D0–D8
Data In
D9–D17
Don’t Care
Data In
Beat 1
Beat 2
Beat 3
Beat 4
0
1
0
1
1
0
0
0
Don’t Care
Data In
Data In
Don’t Care
Data In
Resulting Write Operation
Byte 1
D0–D8
Byte 2
D9–D17
Byte 1
D0–D8
Byte 2
D9–D17
Byte 1
D0–D8
Byte 2
D9–D17
Byte 1
D0–D8
Byte 2
D9–D17
Written
Unchanged
Unchanged
Written
Written
Written
Unchanged
Written
Beat 1
Beat 2
Beat 3
Beat 4
Output Register Control
SigmaQuad-II SRAMs offer two mechanisms for controlling the output data registers. Typically, control is handled by the Output
Register Clock inputs, C and C. The Output Register Clock inputs can be used to make small phase adjustments in the firing of the
output registers by allowing the user to delay driving data out as much as a few nanoseconds beyond the next rising edges of the K
and K clocks. If the C and C clock inputs are tied high, the RAM reverts to K and K control of the outputs, allowing the RAM to
function as a conventional pipelined read SRAM.
Rev: 1.02a 6/2010
10/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Example Four Bank Depth Expansion Schematic
R
3
W
3
R
2
W
2
1
0
R
1
W
R
0
W
A –A
0
n
K
D –D
1
n
Bank 3
Bank 1
Bank 2
Bank 0
A
A
A
A
W
R
W
W
W
R
R
R
CQ
K
CQ
K
CQ
CQ
K
D
C
K
D
C
D
C
Q
D
C
Q
Q
Q
C
Q –Q
1
n
CQ
0
CQ
1
CQ
CQ
2
3
Note:
For simplicity BWn, NWn, K, and C are not shown.
Rev: 1.02a 6/2010
11/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Rev: 1.02a 6/2010
12/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
FLXDrive-II Output Driver Impedance Control
HSTL I/O SigmaQuad-II SRAMs are supplied with programmable impedance output drivers. The ZQ pin must be connected to
via an external resistor, RQ, to allow the SRAM to monitor and adjust its output driver impedance. The value of RQ must be
V
SS
5X the value of the desired RAM output impedance. The allowable range of RQ to guarantee impedance matching continuously is
between 175Ω and 350Ω. Periodic readjustment of the output driver impedance is necessary as the impedance is affected by drifts
in supply voltage and temperature. The SRAM’s output impedance circuitry compensates for drifts in supply voltage and
temperature. A clock cycle counter periodically triggers an impedance evaluation, resets and counts again. Each impedance
evaluation may move the output driver impedance level one step at a time towards the optimum level. The output driver is
implemented with discrete binary weighted impedance steps.
Rev: 1.02a 6/2010
13/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
x36 Byte Write Enable (BWn) Truth Table
BW0
BW1
BW2
BW3
D0–D8
Don’t Care
Data In
D9–D17
Don’t Care
Don’t Care
Data In
D18–D26
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Data In
D27–D35
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Data In
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
1
0
0
0
0
1
1
1
1
0
1
1
1
1
1
1
1
1
0
0
0
0
0
Don’t Care
Data In
Data In
Don’t Care
Data In
Don’t Care
Don’t Care
Data In
Data In
Don’t Care
Data In
Data In
Data In
Data In
Don’t Care
Data In
Don’t Care
Don’t Care
Data In
Don’t Care
Don’t Care
Don’t Care
Don’t Care
Data In
Data In
Don’t Care
Data In
Data In
Data In
Data In
Don’t Care
Don’t Care
Data In
Rev: 1.02a 6/2010
14/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
x36 Byte Write Enable (BWn) Truth Table
BW0
BW1
BW2
BW3
D0–D8
Data In
D9–D17
Don’t Care
Data In
D18–D26
Data In
D27–D35
Data In
0
1
0
1
0
0
0
0
0
0
0
0
Don’t Care
Data In
Data In
Data In
Data In
Data In
Data In
x18 Byte Write Enable (BWn) Truth Table
BW0
BW1
D0–D8
Don’t Care
Data In
D9–D17
Don’t Care
Don’t Care
Data In
1
0
1
0
1
1
0
0
Don’t Care
Data In
Data In
x09 Byte Write Enable (BWn) Truth Table
BW0
D0–D8
Don’t Care
Data In
1
0
1
0
Don’t Care
Data In
x8 Nybble Write Enable (NWn) Truth Table
NW0
NW1
D0–D3
Don’t Care
Data In
D4–D7
Don’t Care
Don’t Care
Data In
1
0
1
0
1
1
0
0
Don’t Care
Data In
Data In
Rev: 1.02a 6/2010
15/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
State Diagram
Power-Up
Read NOP
Write NOP
READ
WRITE
READ
WRITE
Load New
Write Address
D Count = 0
Load New
Read Address
D Count = 0
READ
D Count = 2
WRITE
D Count = 2
WRITE
D Count = 2
READ
D Count = 2
Always
Always
DDR Read
D Count = D Count + 1
DDR Write
D Count = D Count + 1
READ
Always
WRITE
D Count = 1
Always
D Count = 1
Increment
Read Address
Increment
Write Address
Notes:
1. Internal burst counter is fixed as 2-bit linear (i.e., when first address is A0+0, next internal burst address is A0+1.
2. “READ” refers to read active status with R = Low, “READ” refers to read inactive status with R = High. The same is
true for “WRITE” and “WRITE”.
3. Read and write state machine can be active simultaneously.
4. State machine control timing sequence is controlled by K.
Rev: 1.02a 6/2010
16/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Absolute Maximum Ratings
(All voltages reference to V
)
SS
Symbol
VDD
Description
Value
–0.5 to 2.9
Unit
Voltage on VDD Pins
Voltage in VDDQ Pins
Voltage in VREF Pins
V
VDDQ
VREF
VI/O
–0.5 to VDD
V
V
–0.5 to VDDQ
–0.5 to VDDQ +0.5 (≤ 2.9 V max.)
–0.5 to VDDQ +0.5 (≤ 2.9 V max.)
Voltage on I/O Pins
V
VIN
Voltage on Other Input Pins
Input Current on Any Pin
V
IIN
+/–100
+/–100
125
mA dc
mA dc
IOUT
Output Current on Any I/O Pin
Maximum Junction Temperature
Storage Temperature
oC
oC
TJ
TSTG
–55 to 125
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect
reliability of this component.
Recommended Operating Conditions
Power Supplies
Parameter
Supply Voltage
Symbol
VDD
Min.
1.7
Typ.
1.8
—
Max.
1.9
Unit
V
VDDQ
VREF
VDD
I/O Supply Voltage
Reference Voltage
1.4
V
0.68
—
0.95
V
Notes:
1. The power supplies need to be powered up simultaneously or in the following sequence: V , V , V , followed by signal inputs. The
DD DDQ REF
power down sequence must be the reverse. V
must not exceed V .
DD
DDQ
2. Most speed grades and configurations of this device are offered in both Commercial and Industrial Temperature ranges. The part number
of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are
evaluated for worst case in the temperature range marked on the device.
Operating Temperature
Parameter
Symbol
Min.
Typ.
Max.
Unit
Ambient Temperature
(Commercial Range Versions)
TA
0
25
70
°C
Ambient Temperature
(Industrial Range Versions)
TA
–40
25
85
°C
Rev: 1.02a 6/2010
17/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
HSTL I/O DC Input Characteristics
Parameter
DC Input Logic High
Symbol
VIH (dc)
VIL (dc)
Min
Max
Units
Notes
VREF + 0.1
VDDQ + 0.3
VREF – 0.1
V
V
1
1
–0.3
DC Input Logic Low
Notes:
1. Compatible with both 1.8 V and 1.5 V I/O drivers.
2. These are DC test criteria. DC design criteria is V
± 50 mV. The AC V /V levels are defined separately for measuring timing
REF
IH IL
parameters.
3. V (Min)DC = –0.3 V, V (Min)AC = –1.5 V (pulse width ≤ 3 ns).
IL
IL
4.
V
(Max)DC = V
+ 0.3 V, V (Max)AC = V
+ 0.85 V (pulse width ≤ 3 ns).
IH
DDQ
IH
DDQ
HSTL I/O AC Input Characteristics
Parameter
AC Input Logic High
Symbol
VIH (ac)
VIL (ac)
Min
Max
—
Units
mV
Notes
2,3
VREF + 200
VREF – 200
5% VREF (DC)
—
—
mV
2,3
AC Input Logic Low
V
Peak-to-Peak AC Voltage
VREF (ac)
mV
1
REF
Notes:
1. The peak-to-peak AC component superimposed on V
may not exceed 5% of the DC component of V
.
REF
REF
2. To guarantee AC characteristics, V ,V , Trise, and Tfall of inputs and clocks must be within 10% of each other.
IH IL
3. For devices supplied with HSTL I/O input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.
Undershoot Measurement and Timing
Overshoot Measurement and Timing
V
IH
20% tKHKH
V
+ 1.0 V
DD
V
SS
50%
50%
V
DD
V
– 1.0 V
SS
20% tKHKH
V
IL
Capacitance
o
(T = 25 C, f = 1 MHZ, V = 1.8 V)
A
DD
Parameter
Symbol
CIN
Test conditions
VIN = 0 V
Typ.
Max.
Unit
pF
Input Capacitance
Output Capacitance
Clock Capacitance
4
6
5
5
7
6
COUT
CCLK
VOUT = 0 V
VIN = 0 V
pF
pF
Note:
This parameter is sample tested.
Rev: 1.02a 6/2010
18/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
AC Test Conditions
Parameter
Input high level
Conditions
1.25 V
Input low level
0.25 V
Max. input slew rate
Input reference level
Output reference level
2 V/ns
0.75 V
VDDQ/2
Note:
Test conditions as specified with output loading as shown unless otherwise noted.
AC Test Load Diagram
DQ
RQ = 250 Ω (HSTL I/O)
= 0.75 V
V
REF
50Ω
VT = V /2
DDQ
Input and Output Leakage Characteristics
Parameter
Symbol
IIL
IILDOFF
IOL
Test Conditions
VIN = 0 to VDDQ
VIN = 0 to VDDQ
Min.
–2 uA
–20 uA
–2 uA
Max
2 uA
2 uA
2 uA
Input Leakage Current
(except mode pins)
Doff
Output Disable,
VOUT = 0 to VDDQ
Output Leakage Current
Rev: 1.02a 6/2010
19/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Programmable Impedance HSTL Output Driver DC Electrical Characteristics
Parameter
Symbol
VOH1
Min.
Max.
Units
Notes
1, 3
VDDQ/2 – 0.12
VDDQ/2 – 0.12
VDDQ – 0.2
VDDQ/2 + 0.12
VDDQ/2 + 0.12
VDDQ
V
V
V
V
Output High Voltage
Output Low Voltage
Output High Voltage
VOL1
2, 3
VOH2
4, 5
VOL2
Vss
0.2
4, 6
Output Low Voltage
Notes:
1.
I
= (V /2) / (RQ/5) +/– 15% @ V = V /2 (for: 175Ω ≤ RQ ≤ 350Ω).
DDQ OH DDQ
OH
2.
I
= (V /2) / (RQ/5) +/– 15% @ V = V /2 (for: 175Ω ≤ RQ ≤ 350Ω).
OL
DDQ
OL
DDQ
3. Parameter tested with RQ = 250Ω and V
4. 0Ω ≤ RQ ≤ ∞Ω
= 1.5 V or 1.8 V
DDQ
5.
I
= –1.0 mA
OH
6.
I
= 1.0 mA
OL
Operating Currents
-333
-300
-250
-200
-167
Parameter
Symbol
Test Conditions
Notes
0
to
–40
to
0
to
–40
to
0
to
–40
to
0
to
–40
to
0
to
–40
to
70°C
85°C
70°C
85°C
70°C
85°C
70°C
85°C
70°C
85°C
VDD = Max, IOUT = 0 mA
Operating Current
(x36): DDR
IDD
IDD
IDD
IDD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
2, 3
2, 3
2, 3
2, 3
Cycle Time ≥ tKHKH Min
VDD = Max, IOUT = 0 mA
Operating Current
(x18): DDR
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Cycle Time ≥ tKHKH Min
VDD = Max, IOUT = 0 mA
Operating Current
(x9): DDR
Cycle Time ≥ tKHKH Min
VDD = Max, IOUT = 0 mA
Operating Current
(x8): DDR
Cycle Time ≥ tKHKH Min
Device deselected,
IOUT = 0 mA, f = Max,
Standby Current
(NOP): DDR
ISB1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
2, 4
All Inputs ≤ 0.2 V or ≥ VDD – 0.2 V
Notes:
1.
2.
Power measured with output pins floating.
Minimum cycle, IOUT = 0 mA
3.
4.
Operating current is calculated with 50% read cycles and 50% write cycles.
Standby Current is only after all pending read and write burst operations are completed.
Rev: 1.02a 6/2010
20/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
AC Electrical Characteristics
-333
-300
-250
-200
-167
Parameter
Symbol
Units Notes
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Clock
tKHKH
tCHCH
K, K Clock Cycle Time
C, C Clock Cycle Time
3.0
—
8.4
0.2
—
3.3
—
8.4
0.2
—
4.0
—
8.4
0.2
—
5.0
—
8.4
0.2
—
6.0
—
8.4
0.2
—
ns
tKCVar
tKC Variable
ns
ns
6
tKHKL
tCHCL
K, K Clock High Pulse Width
C, C Clock High Pulse Width
1.2
1.32
1.6
2.0
2.4
tKLKH
tCLCH
K, K Clock Low Pulse Width
C, C Clock Low Pulse Width
1.2
—
—
—
1.32
1.49
1.49
—
—
—
1.6
1.8
—
—
—
2.0
2.2
—
—
—
2.4
2.7
2.7
—
—
—
ns
ns
ns
tKHKH
tCHCH
K to K High
C to C High
1.35
tKHKH
tCHCH
K to K High
C to C High
1.35
0
1.8
0
2.2
0
tKHCH
tKCLock
tKCReset
K, K Clock High to C, C Clock High
DLL Lock Time
0.8
—
0
0.8
—
1.8
—
2.3
—
0
2.8
—
ns
cycle
ns
1024
30
1024
30
1024
30
1024
30
1024
30
7
K Static to DLL reset
—
—
—
—
—
Output Times
tKHQV
tCHQV
K, K Clock High to Data Output Valid
C, C Clock High to Data Output Valid
—
0.45
—
—
0.45
—
—
0.45
—
—
0.45
—
—
–0.5
—
0.5
—
ns
ns
ns
ns
4
4
tKHQX
tCHQX
K, K Clock High to Data Output Hold
C, C Clock High to Data Output Hold
–0.45
—
–0.45
—
–0.45
—
–0.45
—
tKHCQV
tCHCQV
K, K Clock High to Echo Clock Valid
C, C Clock High to Echo Clock Valid
0.45
—
0.45
—
0.45
—
0.45
—
0.5
—
tKHCQX
tCHCQX
K, K Clock High to Echo Clock Hold
C, C Clock High to Echo Clock Hold
–0.45
–0.45
–0.45
–0.45
–0.5
tCQHQV
tCQHQX
tCQHCQH
tCQHCQH
tKHQZ
tCHQZ
tKHQX1
tCHQX1
CQ, CQ High Output Valid
CQ, CQ High Output Hold
—
0.25
—
—
0.27
—
—
0.30
—
—
0.35
—
—
0.40
—
ns
ns
8
8
–0.25
–0.27
–0.30
–0.35
–0.40
CQ Phase Distortion
1.10
—
—
0.45
—
1.24
—
—
0.45
—
1.55
—
—
0.45
—
1.95
—
—
0.45
—
2.45
—
—
0.5
—
ns
ns
ns
K Clock High to Data Output High-Z
C Clock High to Data Output High-Z
4
4
K Clock High to Data Output Low-Z
C Clock High to Data Output Low-Z
–0.45
–0.45
–0.45
–0.45
–0.5
Setup Times
tAVKH
tIVKH
tIVKH
tDVKH
Address Input Setup Time
0.4
0.4
—
—
—
—
0.4
0.4
0.3
0.3
—
—
—
—
0.5
0.5
—
—
—
—
0.6
0.6
0.4
0.4
—
—
—
—
0.7
0.7
0.5
0.5
—
—
—
—
ns
ns
ns
ns
1
2
3
Control Input Setup Time (R, W)
Control Input Setup Time (BWX), (BWX)
Data Input Setup Time
0.28
0.28
0.35
0.35
Rev: 1.02a 6/2010
21/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
AC Electrical Characteristics (Continued)
-333
-300
-250
-200
-167
Parameter
Symbol
Units Notes
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Hold Times
tKHAX
tKHIX
tKHIX
tKHDX
Address Input Hold Time
0.4
0.4
—
—
—
—
0.4
0.4
0.3
0.3
—
—
—
—
0.5
0.5
—
—
—
—
0.6
0.6
0.4
0.4
—
—
—
—
0.7
0.7
0.5
0.5
—
—
—
—
ns
ns
ns
ns
1
2
3
Control Input Hold Time (R, W)
Control Input Hold Time (BWX), (BWX)
0.28
0.28
0.35
0.35
Data Input Hold Time
Notes:
1.
2.
3.
4.
5.
All Address inputs must meet the specified setup and hold times for all latching clock edges.
Control singles are R, W
Control singles are BW0, BW1, and (NW0, NW1 for x8) and (BW2, BW3 for x36).
If C, C are tied high, K, K become the references for C, C timing parameters
To avoid bus contention, at a given voltage and temperature tCHQX1 is bigger than tCHQZ. The specs as shown do not imply bus contention because tCHQX1 is a MIN param-
eter that is worst case at totally different test conditions (0°C, 1.9 V) than tCHQZ, which is a MAX parameter (worst case at 70°C, 1.7 V). It is not possible for two SRAMs on the
same board to be at such different voltages and temperatures.
6.
7.
Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge.
V
DD slew rate must be less than 0.1 V DC per 50 ns for DLL lock retention. DLL lock time begins once VDD and input clock are stable.
8.
Echo clock is very tightly controlled to data valid/data hold. By design, there is a ±0.1 ns variation from echo clock to data. The datasheet parameters reflect tester guard bands
and test setup variations.
Rev: 1.02a 6/2010
22/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Rev: 1.02a 6/2010
23/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Rev: 1.02a 6/2010
24/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Rev: 1.02a 6/2010
25/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
JTAG Port Operation
Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with V . The JTAG output
DD
drivers are powered by V
.
DD
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either V or V . TDO should be left unconnected.
DD
SS
JTAG Pin Descriptions
Pin
Pin Name
I/O
Description
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate
from the falling edge of TCK.
TCK
Test Clock
In
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP
TMS
TDI
Test Mode Select
Test Data In
In controller state machine. An undriven TMS input will produce the same result as a logic one input
level.
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers
placed between TDI and TDO. The register placed between TDI and TDO is determined by the
In state of the TAP Controller state machine and the instruction that is currently loaded in the TAP
Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce
the same result as a logic one input level.
Output that is active depending on the state of the TAP state machine. Output changes in
Out response to the falling edge of TCK. This is the output side of the serial registers placed between
TDI and TDO.
TDO
Test Data Out
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
JTAG Port Registers
Overview
The various JTAG registers, refered to as Test Access Port or TAP Registers, are selected (one at a time) via the sequences of 1s
and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the
rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the
TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.
Rev: 1.02a 6/2010
26/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
JTAG TAP Block Diagram
·
·
·
·
·
·
·
·
Boundary Scan Register
·
·
·
0
Bypass Register
2
1 0
Instruction Register
TDI
TDO
ID Code Register
31 30 29
2 1
0
·
· · ·
Control Signals
Test Access Port (TAP) Controller
TMS
TCK
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
Rev: 1.02a 6/2010
27/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
ID Register Contents
GSI Technology
JEDEC Vendor
ID Code
See BSDL Model
Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
0 1 1 0 1 1 0 0 1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
Tap Controller Instruction Set
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.
Rev: 1.02a 6/2010
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© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
JTAG Tap Controller State Diagram
Test Logic Reset
1
0
1
1
1
Run Test Idle
Select DR
Select IR
0
0
0
1
1
1
1
Capture DR
Capture IR
0
0
Shift DR
Shift IR
0
0
1
1
Exit1 DR
Exit1 IR
0
0
Pause DR
Pause IR
0
0
0
0
1
1
Exit2 DR
Exit2 IR
1
1
Update DR
Update IR
1
0
1
0
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This
occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facili-
tate testing of other devices in the scan path.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is
loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and
I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and
are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because
the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents
while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will
not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the
TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP
operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then
places the boundary scan register between the TDI and TDO pins.
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with
all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is
still determined by its input pins.
Rev: 1.02a 6/2010
29/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.
Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output
drivers on the falling edge of TCK when the controller is in the Update-IR state.
Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruc-
tion is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not asso-
ciated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR
state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associ-
ated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and
places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction
loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-
Z) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR
state.
JTAG TAP Instruction Set Summary
Instruction
EXTEST
Code
000
Description
Notes
1
Places the Boundary Scan Register between TDI and TDO.
Preloads ID Register and places it between TDI and TDO.
IDCODE
001
1, 2
Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.
Forces all RAM output drivers to High-Z.
SAMPLE-Z
010
1
GSI
011
100
101
110
111
GSI private instruction.
Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.
GSI private instruction.
1
1
1
1
1
SAMPLE/PRELOAD
GSI
GSI
GSI private instruction.
BYPASS
Places Bypass Register between TDI and TDO.
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Rev: 1.02a 6/2010
30/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
JTAG Port Recommended Operating Conditions and DC Characteristics
Parameter
Symbol
Min.
–0.3
Max.
Unit Notes
V
0.3 * V
Test Port Input Low Voltage
V
V
1
1
ILJ
DD
V
0.7 * V
V
+0.3
DD
Test Port Input High Voltage
IHJ
DD
I
TMS, TCK and TDI Input Leakage Current
TMS, TCK and TDI Input Leakage Current
TDO Output Leakage Current
Test Port Output High Voltage
Test Port Output Low Voltage
Test Port Output CMOS High
Test Port Output CMOS Low
–300
–1
1
uA
uA
uA
V
2
INHJ
I
100
1
3
INLJ
I
–1
4
OLJ
V
V
V
– 0.2
DD
—
0.2
—
0.1
5, 6
5, 7
5, 8
5, 9
OHJ
V
—
V
OLJ
V
– 0.1
DD
V
OHJC
V
—
V
OLJC
Notes:
1. Input Under/overshoot voltage must be –1 V < Vi < V
+1 V not to exceed 2.9 V maximum, with a pulse width not to exceed 20% tTKC.
DDn
2.
V
≤ V ≤ V
ILJ
IN
DDn
3. 0 V ≤ V ≤ V
IN
ILJn
4. Output Disable, V
= 0 to V
DDn
OUT
5. The TDO output driver is served by the V supply.
DD
6.
7.
8.
9.
I
I
I
I
= –2 mA
OHJ
= + 2 mA
OLJ
= –100 uA
= +100 uA
OHJC
OLJC
JTAG Port AC Test Conditions
Parameter
Conditions
JTAG Port AC Test Load
TDO
V
– 0.2 V
Input high level
Input low level
DD
0.2 V
1 V/ns
*
50Ω
30pF
Input slew rate
V
/2
DD
V
V
/2
Input reference level
DD
* Distributed Test Jig Capacitance
/2
Output reference level
DD
Notes:
1. Include scope and jig capacitance.
2. Test conditions as shown unless otherwise noted.
Rev: 1.02a 6/2010
31/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
JTAG Port Timing Diagram
tTKC
tTKH
tTKL
TCK
TDI
tTH
tTH
tTS
tTS
TMS
TDO
tTKQ
tTH
tTS
Parallel SRAM input
JTAG Port AC Electrical Characteristics
Parameter
Symbol
tTKC
tTKQ
tTKH
tTKL
tTS
Min
Max
—
Unit
TCK Cycle Time
50
—
ns
ns
ns
ns
ns
ns
TCK Low to TDO Valid
TCK High Pulse Width
TCK Low Pulse Width
TDI & TMS Set Up Time
TDI & TMS Hold Time
20
—
20
20
10
10
—
—
tTH
—
Rev: 1.02a 6/2010
32/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Package Dimensions—165-Bump FPBGA (Package E)
A1 CORNER
TOP VIEW
BOTTOM VIEW
A1 CORNER
M
M
Ø0.10
C
Ø0.25 C A B
Ø0.40~0.60 (165x)
1
2 3 4 5 6 7 8 9 10 11
11 10 9 8
7 6 5 4 3 2 1
A
B
C
D
E
F
A
B
C
D
E
F
G
H
J
G
H
J
K
L
K
L
M
N
P
R
M
N
P
R
A
1.0
10.0
1.0
15±0.05
B
0.20(4x)
SEATING PLANE
C
Rev: 1.02a 6/2010
33/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Ordering Information—GSI SigmaQuad-II SRAM
Speed
(MHz)
2
Org
Part Number1
Type
Package
T
A
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
4M x 36
GS81302D08E-333
GS81302D08E-300
GS81302D08E-250
GS81302D08E-200
GS81302D08E-167
GS81302D08E-333I
GS81302D08E-300I
GS81302D08E-250I
GS81302D08E-200I
GS81302D08E-167I
GS81302D09E-333
GS81302D09E-300
GS81302D09E-250
GS81302D09E-200
GS81302D09E-167
GS81302D09E-333I
GS81302D09E-300I
GS81302D09E-250I
GS81302D09E-200I
GS81302D09E-167I
GS81302D18E-333
GS81302D18E-300
GS81302D18E-250
GS81302D18E-200
GS81302D18E-167
GS81302D18E-333I
GS81302D18E-300I
GS81302D18E-250I
GS81302D18E-200I
GS81302D18E-167I
GS81302D36E-333
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
333
300
250
200
167
333
300
250
200
167
333
300
250
200
167
333
300
250
200
167
333
300
250
200
167
333
300
250
200
167
333
C
C
C
C
C
I
I
I
I
I
C
C
C
C
C
I
I
I
I
I
C
C
C
C
C
I
I
I
I
I
C
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS81302D36E-300T.
2. C = Commercial Temperature Range. I = Industrial Temperature Range.
Rev: 1.02a 6/2010
34/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Ordering Information—GSI SigmaQuad-II SRAM
Speed
(MHz)
2
Org
Part Number1
Type
Package
T
A
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
8M x 18
8M x 18
8M x 18
GS81302D36E-300
GS81302D36E-250
GS81302D36E-200
GS81302D36E-167
GS81302D36E-333I
GS81302D36E-300I
GS81302D36E-250I
GS81302D36E-200I
GS81302D36E-167I
GS81302D08GE-333
GS81302D08GE-300
GS81302D08GE-250
GS81302D08GE-200
GS81302D08GE-167
GS81302D08GE-333I
GS81302D08GE-300I
GS81302D08GE-250I
GS81302D08GE-200I
GS81302D08GE-167I
GS81302D09GE-333
GS81302D09GE-300
GS81302D09GE-250
GS81302D09GE-200
GS81302D09GE-167
GS81302D09GE-333I
GS81302D09GE-300I
GS81302D09GE-250I
GS81302D09GE-200I
GS81302D09GE-167I
GS81302D18GE-333
GS81302D18GE-300
GS81302D18GE-250
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
165-bump BGA
300
250
200
167
333
300
250
200
167
333
300
250
200
167
333
300
250
200
167
333
300
250
200
167
333
300
250
200
167
333
300
250
C
C
C
C
I
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
I
165-bump BGA
I
165-bump BGA
I
165-bump BGA
I
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
C
C
C
C
C
I
I
I
I
I
C
C
C
C
C
I
I
I
I
I
C
C
C
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS81302D36E-300T.
2. C = Commercial Temperature Range. I = Industrial Temperature Range.
Rev: 1.02a 6/2010
35/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Ordering Information—GSI SigmaQuad-II SRAM
Speed
(MHz)
2
Org
Part Number1
Type
Package
T
A
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
GS81302D18GE-200
GS81302D18GE-167
GS81302D18GE-333I
GS81302D18GE-300I
GS81302D18GE-250I
GS81302D18GE-200I
GS81302D18GE-167I
GS81302D36GE-333
GS81302D36GE-300
GS81302D36GE-250
GS81302D36GE-200
GS81302D36GE-167
GS81302D36GE-333I
GS81302D36GE-300I
GS81302D36GE-250I
GS81302D36GE-200I
GS81302D36GE-167I
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
200
167
333
300
250
200
167
333
300
250
200
167
333
300
250
200
167
C
C
I
I
I
I
I
C
C
C
C
C
I
I
I
I
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS81302D36E-300T.
2. C = Commercial Temperature Range. I = Industrial Temperature Range.
Ordering Information—GSI SigmaQuad-II SRAM
Speed
(MHz)
2
1
Org
Type
Package
T
Part Number
A
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
8M x 18
GS81302Q36E-300
GS81302Q36E-250
GS81302Q36E-200
GS81302Q36E-167
GS81302Q36E-300I
GS81302Q36E-250I
GS81302Q36E-200I
GS81302Q36E-167I
GS81302Q18E-300
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
300
250
200
167
300
250
200
167
300
C
C
C
C
I
I
I
I
C
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS81302Q36E-200T.
2. C = Commercial Temperature Range. I = Industrial Temperature Range.
Rev: 1.02a 6/2010
36/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Ordering Information—GSI SigmaQuad-II SRAM
Speed
(MHz)
2
1
Org
Type
Package
T
Part Number
A
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
4M x 36
8M x 18
GS81302Q18E-250
GS81302Q18E-200
GS81302Q18E-167
GS81302Q18E-300I
GS81302Q18E-250I
GS81302Q18E-200I
GS81302Q18E-167I
GS81302Q09E-300
GS81302Q09E-250
GS81302Q09E-200
GS81302Q09E-167
GS81302Q09E-300I
GS81302Q09E-250I
GS81302Q09E-200I
GS81302Q09E-167I
GS81302Q08E-300
GS81302Q08E-250
GS81302Q08E-200
GS81302Q08E-167
GS81302Q08E-300I
GS81302Q08E-250I
GS81302Q08E-200I
GS81302Q08E-167I
GS81302Q36GE-300
GS81302Q36GE-250
GS81302Q36GE-200
GS81302Q36GE-167
GS81302Q36GE-300I
GS81302Q36GE-250I
GS81302Q36GE-200I
GS81302Q36GE-167I
GS81302Q18GE-300
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
165-bump BGA
165-bump BGA
250
200
167
300
250
200
167
300
250
200
167
300
250
200
167
300
250
200
167
300
250
200
167
300
250
200
167
300
250
200
167
300
C
C
C
I
165-bump BGA
165-bump BGA
165-bump BGA
I
165-bump BGA
I
165-bump BGA
I
165-bump BGA
C
C
C
C
I
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
I
165-bump BGA
I
165-bump BGA
I
165-bump BGA
C
C
C
C
I
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
165-bump BGA
I
165-bump BGA
I
165-bump BGA
I
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
C
C
C
C
I
I
I
I
C
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS81302Q36E-200T.
2. C = Commercial Temperature Range. I = Industrial Temperature Range.
Rev: 1.02a 6/2010
37/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
Ordering Information—GSI SigmaQuad-II SRAM
Speed
(MHz)
2
1
Org
Type
Package
T
Part Number
A
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
8M x 18
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 9
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
16M x 8
GS81302Q18GE-250
GS81302Q18GE-200
GS81302Q18GE-167
GS81302Q18GE-300I
GS81302Q18GE-250I
GS81302Q18GE-200I
GS81302Q18GE-167I
GS81302Q09GE-300
GS81302Q09GE-250
GS81302Q09GE-200
GS81302Q09GE-167
GS81302Q09GE-300I
GS81302Q09GE-250I
GS81302Q09GE-200I
GS81302Q09GE-167I
GS81302Q08GE-300
GS81302Q08GE-250
GS81302Q08GE-200
GS81302Q08GE-167
GS81302Q08GE-300I
GS81302Q08GE-250I
GS81302Q08GE-200I
GS81302Q08GE-167I
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
SigmaQuad-II SRAM
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
RoHS-compliant 165-bump BGA
250
200
167
300
250
200
167
300
250
200
167
300
250
200
167
300
250
200
167
300
250
200
167
C
C
C
I
I
I
I
C
C
C
C
I
I
I
I
C
C
C
C
I
I
I
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS81302Q36E-200T.
2. C = Commercial Temperature Range. I = Industrial Temperature Range.
Rev: 1.02a 6/2010
38/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS81302D08/09/18/36E-333/300/250/200/167
SigmaQuad-II Revision History
File Name
81302Dxx_r1
Format/Content
Description of changes
Creation of datasheet
81302Dxx_r1.00a
Editorial
Content
Corrected Ordering Information Table
Updated AC Characteristics Table
Updated 165 BGA Package Drawing
Updated JTAG Port Operation Section
81302Dxx_r1.01
81302Dxx_r1.02
Added 300 MHz speed bin to Q
(Rev1.02a: removed CQ reference from SAMPLE-Z section in
JTAG Tap Instruction Set Summary)
Content
Rev: 1.02a 6/2010
39/39
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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