GS8662Q37BD-300I_技术文档

GS8662Q07/10/19/37BD-357/333/300/250/200

357 MHz–200 MHz

72Mb SigmaQuad-II+^TM

Burst of 2 SRAM

165-Bump BGA

Commercial Temp

Industrial Temp

1.8 V V

DD

1.8 V and 1.5 V I/O

are just one element in a family of low power, low voltage

HSTL I/O SRAMs designed to operate at the speeds needed to

implement economical high performance networking systems.

Features

• 2.0 Clock Latency

• Simultaneous Read and Write SigmaQuad™ Interface

• JEDEC-standard pinout and package

• Dual Double Data Rate interface

• Byte Write controls sampled at data-in time

• On-Die Termination (ODT) on Data (D), Byte Write (BW),

and Clock (K, K) inputs

• Burst of 2 Read and Write

• 1.8 V +100/–100 mV core power supply

• 1.5 V or 1.8 V HSTL Interface

Clocking and Addressing Schemes

The GS8662Q07/10/19/37BD SigmaQuad-II+ SRAMs are

synchronous devices. They employ two input register clock

inputs, K and K. K and K are independent single-ended clock

inputs, not differential inputs to a single differential clock input

buffer.

• Pipelined read operation

• Fully coherent read and write pipelines

• ZQ pin for programmable output drive strength

• Data Valid Pin (QVLD) Support

• IEEE 1149.1 JTAG-compliant Boundary Scan

• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package

• RoHS-compliant 165-bump BGA package available

Each internal read and write operation in a SigmaQuad-II+ B2

RAM is two times wider than the device I/O bus. An input data

bus de-multiplexer is used to accumulate incoming data before

it is simultaneously written to the memory array. An output

data multiplexer is used to capture the data produced from a

single memory array read and then route it to the appropriate

output drivers as needed. Therefore the address field of a

SigmaQuad-II+ B2 RAM is always one address pin less than

the advertised index depth (e.g., the 8M x 8 has an 4M

addressable index).

SigmaQuad™ Family Overview

The GS8662Q07/10/19/37BD are built in compliance with the

SigmaQuad-II+ SRAM pinout standard for Separate I/O

synchronous SRAMs. They are 75,497,472-bit (72Mb)

SRAMs. The GS8662Q07/10/19/37BD SigmaQuad SRAMs

Parameter Synopsis

-357

2.8 ns

0.45 ns

-333

3.0 ns

0.45 ns

-300

3.3 ns

0.45 ns

-250

4.0 ns

0.45 ns

-200

5.0 ns

0.45 ns

tKHKH

tKHQV

Rev: 1.02c 8/2017

1/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

8M x 8 SigmaQuad-II SRAM—Top View

1

2

3

4

5

6

7

8

9

10

11

NC/SA

(144Mb)

A

B

CQ

SA

W

NW1

K

R

SA

CQ

NC/SA

(288Mb)

NC

SA

K

NW0

SA

NC

Q3

C

D

E

F

NC

Doff

NC

TDO

NC

D4

NC

D5

NC

Q4

NC

Q5

V

SA

V

NC

D2

D3

NC

Q2

NC

ZQ

D1

SS

V

SS

DD

SS

DD

V

DDQ

V

NC

DDQ

G

H

J

V

REF

DDQ

NC

Q1

K

L

NC

Q6

NC

D6

NC

Q7

SA

V

NC

SA

NC

Q0

D0

V

DDQ

SS

M

N

P

R

NC

D7

V

NC

SS

V

SA

V

NC

TDI

NC

TCK

SA

QVLD

ODT

SA

NC

TMS

11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Notes:

1. NW0 controls writes to D0:D3. NW1 controls writes to D4:D7.

2. Pins A7 and B5 are the expansion addresses.

Rev: 1.02c 8/2017

2/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

8M x 9 SigmaQuad-II SRAM—Top View

1

2

3

4

5

6

7

8

9

10

11

NC/SA

(144Mb)

A

B

CQ

SA

W

NC

K

R

SA

CQ

NC/SA

(288Mb)

NC

SA

K

BW0

SA

NC

Q4

C

D

E

F

NC

Doff

NC

TDO

NC

D5

NC

D6

NC

Q5

NC

Q6

V

SA

V

NC

D3

D4

NC

Q3

NC

ZQ

D2

NC

Q1

D1

NC

Q0

TDI

SS

V

SS

DD

SS

DD

V

DDQ

V

NC

DDQ

G

H

J

V

REF

DDQ

NC

Q2

K

L

NC

Q7

NC

D7

NC

Q8

SA

V

NC

SA

NC

D0

V

DDQ

SS

M

N

P

R

NC

D8

V

SS

V

SA

V

NC

TCK

SA

QVLD

ODT

SA

TMS

11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Notes:

1. BW0 controls writes to D0:D8.

2. Pins A7 and B5 are the expansion addresses.

Rev: 1.02c 8/2017

3/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

4M x 18 SigmaQuad-II+ SRAM—Top View

1

2

3

4

5

6

7

8

9

10

11

NC/SA

(144Mb)

NC/SA

(288Mb )

A

CQ

SA

W

BW1

K

R

SA

CQ

B

C

D

E

F

NC

Doff

NC

TDO

Q9

NC

D9

SA

NC

SA

K

BW0

SA

NC

Q7

NC

D6

NC

Q8

D8

D7

Q6

Q5

D5

ZQ

D4

Q3

Q2

D2

D1

Q0

TDI

D10

Q10

Q11

D12

Q13

V

SA

V

SS

D11

NC

V

SS

DD

SS

DD

V

DDQ

Q12

D13

V

DDQ

G

H

J

V

REF

DDQ

NC

D14

Q14

D15

D16

Q16

Q17

SA

NC

Q4

K

L

V

NC

SA

D3

NC

Q1

Q15

NC

V

DDQ

SS

M

N

P

R

V

SS

D17

NC

V

SA

V

NC

D0

SA

QVLD

ODT

SA

TCK

TMS

11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Notes:

1. BW0 controls writes to D0:D8. BW1 controls writes to D9:D17.

2. Pins A2 and A7 are the expansion addresses.

Rev: 1.02c 8/2017

4/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

2M x 36 SigmaQuad-II+ SRAM—Top View

1

2

3

4

5

6

7

8

9

10

11

NC/SA

(288Mb )

NC/SA

(144Mb)

A

CQ

SA

W

BW2

K

BW1

R

SA

CQ

B

C

D

E

F

Q27

D27

D28

Q29

Q30

D30

Doff

D31

Q32

Q33

D33

D34

Q35

TDO

Q18

Q28

D20

D29

Q21

D22

D18

D19

Q19

Q20

D21

Q22

SA

BW3

SA

K

BW0

SA

D17

D16

Q16

Q15

D14

Q13

Q17

Q7

Q8

D8

D7

Q6

Q5

D5

ZQ

D4

Q3

Q2

D2

D1

Q0

TDI

V

SA

V

SS

V

D15

D6

SS

DD

SS

DD

V

DDQ

V

Q14

D13

DDQ

G

H

J

V

REF

DDQ

Q31

D32

Q24

Q34

D26

D35

TCK

D23

Q23

D24

D25

Q25

Q26

SA

D12

Q12

D11

D10

Q10

Q9

Q4

D3

K

L

V

Q11

Q1

DDQ

SS

M

N

P

R

V

SS

V

SA

V

D9

SA

QVLD

ODT

SA

D0

SA

TMS

11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Notes:

3. BW0 controls writes to D0:D8; BW1 controls writes to D9:D17; BW2 controls writes to D18:D26; BW3 controls writes to D27:D35

4. Pins A2 and A10 are the expansion addresses.

Rev: 1.02c 8/2017

5/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Pin Description Table

Symbol

Description

Synchronous Address Inputs

Synchronous Read

Type

Input

Comments

—

SA

R

W

Active Low

Synchronous Write

BW0–BW3

Synchronous Byte Writes

Active Low

(x8 only)

NW0–NW1

Synchronous Nybble Writes

Input

K

Input Clock

Input

Active High

K

Active Low

TMS

TDI

TCK

TDO

V_REF

Test Mode Select

Input

—

Test Data Input

Input

—

Test Clock Input

Input

—

Test Data Output

Output

Input

—

HSTL Input Reference Voltage

Output Impedance Matching Input

Synchronous Data Outputs

Synchronous Data Inputs

Disable DLL when low

Output Echo Clock

—

ZQ

Qn

Input

—

Output

Input

—

Dn

—

Active Low

—

Input

Doff

CQ

V_DD

Output

Supply

Output Echo Clock

—

Power Supply

1.8 V Nominal

V_DDQ

V_SS

Isolated Output Buffer Supply

Supply

1.8 V or 1.5 V Nominal

Power Supply: Ground

Q Valid Output

Supply

Output

Input

—

QVLD

ODT

—

Active High

—

On-Die Termination

No Connect

NC

Notes:

1. NC = Not Connected to die or any other pin

2. When ZQ pin is directly connected to V , output impedance is set to minimum value and it cannot be connected to ground or left

DDQ

unconnected.

3. K and K cannot be set to V

voltage.

REF

Rev: 1.02c 8/2017

6/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Background

Separate I/O SRAMs, from a system architecture point of view, are attractive in applications where alternating reads and writes are

needed. Therefore, the SigmaQuad-II+ SRAM interface and truth table are optimized for alternating reads and writes. Separate I/O

SRAMs are unpopular in applications where multiple reads or multiple writes are needed because burst read or write transfers from

Separate I/O SRAMs can cut the RAM’s bandwidth in half.

SigmaQuad-II B2 SRAM DDR Read

The read port samples the status of the Address Input and R pins at each rising edge of K. A low on the Read Enable-bar pin, R,

begins a read cycle. Clocking in a high on the Read Enable-bar pin, R, begins a read port deselect cycle.

SigmaQuad-II B2 SRAM DDR Write

The write port samples the status of the W pin at each rising edge of K and the Address Input pins on the following rising edge of

K. A low on the Write Enable-bar pin, W, begins a write cycle. The first of the data-in pairs associated with the write command is

clocked in with the same rising edge of K used to capture the write command. The second of the two data in transfers is captured on

the rising edge of K along with the write address. Clocking in a high on W causes a write port deselect cycle.

Special Functions

Byte Write and Nybble Write Control

Byte Write Enable pins are sampled at the same time that Data In is sampled. A High on the Byte Write Enable pin associated with

a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be

stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven High or Low

during the data in sample times in a write sequence.

Each write enable command and write address loaded into the RAM provides the base address for a 2beat data transfer. The x18

version of the RAM, for example, may write 36 bits in association with each address loaded. Any 9-bit byte may be masked in any

write sequence.

Nybble Write (4-bit) control is implemented on the 8-bit-wide version of the device. For the x8 version of the device, “Nybble

Write Enable” and “NWx” may be substituted in all the discussion above.

Example x18 RAM Write Sequence using Byte Write Enables

Data In Sample Time

BW0

BW1

D0–D8

Data In

D9–D17

Don’t Care

Data In

Beat 1

Beat 2

0

1

0

Don’t Care

Resulting Write Operation

Byte 1

D0–D8

Byte 2

D9–D17

Byte 3

D0–D8

Byte 4

D9–D17

Written

Unchanged

Written

Beat 1

Beat 2

Rev: 1.02c 8/2017

7/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

FLXDrive-II Output Driver Impedance Control

HSTL I/O SigmaQuad-II+ SRAMs are supplied with programmable impedance output drivers. The ZQ pin must be connected to

V_SSvia an external resistor, RQ, to allow the SRAM to monitor and adjust its output driver impedance. The value of RQ must be

5X the value of the desired RAM output impedance. The allowable range of RQ to guarantee impedance matching continuously is

between 175 and 350. Periodic readjustment of the output driver impedance is necessary as the impedance is affected by drifts

in supply voltage and temperature. The SRAM’s output impedance circuitry compensates for drifts in supply voltage and

temperature. A clock cycle counter periodically triggers an impedance evaluation, resets and counts again. Each impedance

evaluation may move the output driver impedance level one step at a time towards the optimum level. The output driver is

implemented with discrete binary weighted impedance steps.

Input Termination Impedance Control

These SigmaQuad-II+ SRAMs are supplied with programmable input termination on Data (D), Byte Write (BW), and Clock (K/K)

input receivers. Input termination can be enabled or disabled via the ODT pin (6R). When the ODT pin is tied Low (or left

floating —the pin has a small pull-down resistor), input termination is disabled. When the ODT pin is tied High, input termination

is enabled. Termination impedance is programmed via the same RQ resistor (connected between the ZQ pin and V ) used to

SS

program output driver impedance, and is nominally RQ*0.6 Thevenin-equivalent when RQ is between 175 and 250. Periodic

readjustment of the termination impedance occurs to compensate for drifts in supply voltage and temperature, in the same manner

as for driver impedance (see above).

Note:

When ODT = 1, Data (D), Byte Write (BW), and Clock (K, K) input termination is always enabled. Consequently, D, BW, K, K

inputs should always be driven High or Low; they should never be tri-stated (i.e., in a High-Z state). If the inputs are tri-stated, the

input termination will pull the signal to V

/2 (i.e., to the switch point of the diff-amp receiver), which could cause the receiver

DDQ

to enter a meta-stable state and prevent the SRAM from operating within specification.

Separate I/O SigmaQuad-II B2 SigmaQuad-II SRAM Read Truth Table

A

R

Output Next State

Q

K 

(t )

(t

)

(t

)

n

n+2

Hi-Z

Q0

n+2½

X

V

1

0

Deselect

Read

Hi-Z

Q1

Notes:

1. X = Don’t Care, 1 = High, 0 = Low, V = Valid.

2. R is evaluated on the rising edge of K.

3. Q0 and Q1 are the first and second data output transfers in a read.

Rev: 1.02c 8/2017

8/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Separate I/O SigmaQuad-II B2 SigmaQuad-II SRAM Write Truth Table

A

W

BWn/NWn BWn/NWn

Input Next State

D

K 

K K 

(t

)

(t )

(t

)

(t_n), (t_{n + ½}

)

(t )

(t

)

n + ½

n

n + ½

n

n + ½

V

X

0

1

0

1

X

0

1

0

1

X

Write Byte Dx0, Write Byte Dx1

Write Byte Dx0, Write Abort Byte Dx1

Write Abort Byte Dx0, Write Byte Dx1

Write Abort Byte Dx0, Write Abort Byte Dx1

Deselect

D0

X

D1

X

D1

X

Notes:

1. X = Don’t Care, H = High, L = Low, V = Valid.

2. W is evaluated on the rising edge of K.

3. D0 and D1 are the first and second data input transfers in a write.

4. BWn represents any of the Byte Write Enable inputs (BW0, BW1, etc.). NWn represents any of the Nybble Write Enable inputs (NW0,

NW1).

x36 Byte Write Enable (BWn) Truth Table

BW0

BW1

BW2

BW3

D0–D8

Don’t Care

Data In

D9–D17

Don’t Care

Data In

D18–D26

Don’t Care

Data In

D27–D35

Don’t Care

Data In

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Don’t Care

Data In

Rev: 1.02c 8/2017

9/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

x18 Byte Write Enable (BWn) Truth Table

BW0

BW1

D0–D8

Don’t Care

Data In

D9–D17

Don’t Care

Data In

1

0

1

0

1

0

Don’t Care

Data In

x9 Byte Write Enable (BWn) Truth Table

BW0

D0–D8

Don’t Care

Data In

1

0

1

0

Don’t Care

Data In

x8 Nybble Write Enable (NWn) Truth Table

NW0

NW1

D0–D3

Don’t Care

Data In

D4–D7

Don’t Care

Data In

1

0

1

0

1

0

Don’t Care

Data In

Rev: 1.02c 8/2017

10/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Absolute Maximum Ratings

(All voltages reference to V

)

SS

Symbol

V_DD

Description

Value

Unit

Voltage on V_DDPins

Voltage in V_DDQPins

Voltage in V_REFPins

–0.5 to 2.9

V

V_DDQ

V_REF

V_I/O

–0.5 to V_DD

V

–0.5 to V_DDQ

V

–0.5 to V_DDQ+0.5 ( 2.9 V max.)

Voltage on I/O Pins

V_IN

V_TIN

I_IN

Input Voltage (Address, Control, Data, Clock)

Input Voltage (TCK, TMS, TDI)

Input Current on Any Pin

V

+/–100

125

mA dc

I_OUT

T_J

Output Current on Any I/O Pin

Maximum Junction Temperature

Storage Temperature

^oC

T_STG

–55 to 125

Note:

Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended

Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect

reliability of this component.

Recommended Operating Conditions

Power Supplies

Parameter

Supply Voltage

Symbol

V_DD

Min.

1.7

Typ.

1.8

—

Max.

1.9

Unit

V

V_DDQ

V_REF

V_DD

I/O Supply Voltage

Reference Voltage

1.4

V

V_DDQ/2 – 0.05

V_DDQ/2 + 0.05

—

V

Note:

The power supplies need to be powered up simultaneously or in the following sequence: V , V , V , followed by signal inputs. The power

DD DDQ REF

down sequence must be the reverse. V

must not exceed V . For more information, read AN1021 SigmaQuad and SigmaDDR Power-Up.

DD

DDQ

Operating Temperature

Parameter

Symbol

Min.

Typ.

Max.

Unit

Junction Temperature

(Commercial Range Versions)

T_J

0

25

85

C

Junction Temperature

(Industrial Range Versions)*

T_J

–40

25

100

C

Note:

* The part numbers of Industrial Temperature Range versions end with the character “I”. Unless otherwise noted, all performance specifications

quoted are evaluated for worst case in the temperature range marked on the device.

Rev: 1.02c 8/2017

11/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Thermal Impedance

Test PCB

Substrate

JA (C°/W)

Airflow = 0 m/s

 JA (C°/W)

Airflow = 1 m/s

 JA (C°/W)

Airflow = 2 m/s

JB (C°/W)

 JC (C°/W)

Package

165 BGA

4-layer

22.300

18.572

17.349

9.292

2.310

Notes:

1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.

2. Please refer to JEDEC standard JESD51-6.

3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to

the PCB can result in cooling or heating of the RAM depending on PCB temperature.

HSTL I/O DC Input Characteristics

Parameter

Input Reference Voltage

Symbol

V_REF

V_IH1

Min

Max

Units

Notes

—

V_DDQ/2 – 0.05

V_REF+ 0.1

V_DDQ/2 + 0.05

V_DDQ+ 0.3

V_REF– 0.1

V_DDQ+ 0.3

0.3 * V_DDQ

V

1

Input High Voltage

Input Low Voltage

Input High Voltage

V_IL1

–0.3

1

V_IH2

0.7 * V_DDQ

2,3

V_IL2

–0.3

Input Low Voltage

Notes:

1. Parameters apply to K, K, SA, D, R, W, BW during normal operation and JTAG boundary scan testing.

2. Parameters apply to Doff, ODT during normal operation and JTAG boundary scan testing.

3. Parameters apply to ZQ during JTAG boundary scan testing only.

HSTL I/O AC Input Characteristics

Parameter

Input Reference Voltage

Symbol

V_REF

V_IH1

Min

Max

Units

Notes

—

V_DDQ/2 – 0.08

V_REF+ 0.2

V_DDQ/2 + 0.08

V_DDQ+ 0.5

V_REF– 0.2

V_DDQ+ 0.5

V

1,2,3

4,5

Input High Voltage

Input Low Voltage

Input High Voltage

V_IL1

–0.5

V_IH2

V_DDQ– 0.2

V_IL2

–0.5

0.2

4,5

Input Low Voltage

Notes:

1.

V

and V

apply for pulse widths less than one-quarter of the cycle time.

IL(MIN)

IH(MAX)

2. Input rise and fall times must be a minimum of 1 V/ns, and within 10% of each other.

3. Parameters apply to K, K, SA, D, R, W, BW during normal operation and JTAG boundary scan testing.

4. Parameters apply to Doff, ODT during normal operation and JTAG boundary scan testing.

5. Parameters apply to ZQ during JTAG boundary scan testing only.

Rev: 1.02c 8/2017

12/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Capacitance

o

(T = 25 C, f = 1 MHZ, V = 1.8 V)

A

DD

Parameter

Symbol

C_IN

Test conditions

V_IN= 0 V

Typ.

Max.

Unit

pF

Input Capacitance

Output Capacitance

Clock Capacitance

4

6

5

7

6

C_OUT

C_CLK

V_OUT= 0 V

V_IN= 0 V

pF

Note:

This parameter is sample tested.

AC Test Conditions

Parameter

Input high level

Input low level

Conditions

1.25

0.25 V

2 V/ns

Max. input slew rate

Input reference level

Output reference level

0.75

V_DDQ/2

Note:

Test conditions as specified with output loading as shown unless otherwise noted.

AC Test Load Diagram

DQ

RQ = 250 (HSTL I/O)

= 0.75 V

V

REF

50

VT == 0.75 V

Input and Output Leakage Characteristics

Parameter

Symbol

Test Conditions

Min.

Max

Input Leakage Current

(except mode pins)

I_IL

V_IN= 0 to V_DD

–2 uA

2 uA

I_ILDOFF

I_{IL ODT}

V_IN= 0 to V_DD

Doff

–2 uA

100 uA

ODT

Output Disable,

V_OUT= 0 to V_DDQ

I_OL

Output Leakage Current

–2 uA

2 uA

Rev: 1.02c 8/2017

13/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Programmable Impedance HSTL Output Driver DC Electrical Characteristics

Parameter

Symbol

V_OH1

Min.

Max.

Units

Notes

1, 3

V_DDQ/2 – 0.12

V_DDQ– 0.2

V_DDQ/2 + 0.12

V_DDQ

V

Output High Voltage

Output Low Voltage

Output High Voltage

V_OL1

2, 3

V_OH2

4, 5

V_OL2

Vss

0.2

4, 6

Output Low Voltage

Notes:

1.

I

= (V /2) / (RQ/5) +/– 15% @ V = V /2 (for: 175 RQ  350

DDQ OH DDQ

OH

2.

I

= (V /2) / (RQ/5) +/– 15% @ V = V /2 (for: 175  RQ 350.

OL

DDQ

OL

DDQ

3. Parameter tested with RQ = 250 and V

= 1.5 V

DDQ

4. 0RQ  

5.

6.

I

= –1.0 mA

= 1.0 mA

OH

OL

Operating Currents

-357

-333

-300

-250

-200

Parameter

Symbol

Test Conditions

Notes

0

to

–40

to

0

to

–40

to

0

to

–40

to

0

to

–40

to

0

to

–40

to

70°C 85°C 70°C 85°C 70°C 85°C 70°C 85°C 70°C 85°C

V_DD= Max, I_OUT= 0 mA

Operating Current

(x36): DDR

1195

mA

1205

mA

1100

mA

1110

mA

1060

mA

1070

mA

895

mA

905

mA

740

mA

750

mA

I_DD

2, 3

Cycle Time t_KHKHMin

V_DD= Max, I_OUT= 0 mA

Operating Current

(x18): DDR

985

mA

995

mA

920

mA

930

mA

850

mA

860

mA

720

mA

730

mA

600

mA

610

mA

Cycle Time t_KHKHMin

V_DD= Max, I_OUT= 0 mA

Operating Current

(x9): DDR

985

mA

995

mA

920

mA

930

mA

850

mA

860

mA

720

mA

730

mA

600

mA

610

mA

Cycle Time t_KHKHMin

V_DD= Max, I_OUT= 0 mA

Operating Current

(x8): DDR

985

mA

995

mA

920

mA

930

mA

850

mA

860

mA

720

mA

730

mA

600

mA

610

mA

Cycle Time t_KHKHMin

Device deselected,

_OUT= 0 mA, f = Max,

Standby Current

(NOP): DDR

275

mA

285

mA

270

mA

280

mA

255

mA

265

mA

240

mA

250

mA

220

mA

230

mA

I

I_SB1

2, 4

^{All Inputs}0.2 V or V_DD– 0.2 V

Notes:

1.

2.

Power measured with output pins floating.

Minimum cycle, I_OUT= 0 mA

3.

4.

Operating current is calculated with 50% read cycles and 50% write cycles.

Standby Current is only after all pending read and write burst operations are completed.

Rev: 1.02c 8/2017

14/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

AC Electrical Characteristics

-357

-333

-300

-250

-200

Parameter

Symbol

Units Notes

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

Clock

t_KHKH

t_KVar

K, K Clock Cycle Time

2.8

—

8.4

0.2

—

3.0

—

8.4

0.2

—

3.3

—

8.4

0.2

—

4.0

—

8.4

0.2

—

5.0

—

8.4

0.2

—

ns

tK Variable

ns

4

t_KHKL

K, K Clock High Pulse Width

K, K Clock Low Pulse Width

K to K High

1.12

1.26

2048

30

1.2

1.32

1.49

2048

30

1.6

1.8

2048

30

2.0

2.2

2048

30

t_KLKH

1.2

ns

t_KHKH

t_KCLock

t_KCReset

1.28

2048

30

ns

K to K High

ns

DLL Lock Time

cycle

ns

5

K Static to DLL reset

Output Times

t_KHQV

t_KHQX

K, K Clock High to Data Output Valid

—

0.45

—

0.45

—

0.45

—

0.45

—

0.45

—

ns

K, K Clock High to Data Output Hold

K, K Clock High to Echo Clock Valid

K, K Clock High to Echo Clock Hold

CQ, CQ High Output Valid

–0.45

—

–0.45

—

–0.45

—

–0.45

—

–0.45

—

t_KHCQV

t_KHCQX

t_CQHQV

t_CQHQX

t_QVLD

0.45

—

0.45

—

0.45

—

0.45

—

0.45

—

–0.45

—

–0.45

—

–0.45

—

–0.45

—

–0.45

—

0.23

—

0.25

—

0.27

—

0.30

—

0.35

—

CQ, CQ High Output Hold

–0.23

–0.25

–0.27

–0.30

–0.35

CQ, CQ High to QVLD

0.23

0.25

0.27

0.30

0.35

t_CQHCQH

CQ Phase Distortion

1.00

—

1.10

—

1.24

—

1.55

—

1.95

—

ns

t_KHQZ

K Clock High to Data Output High-Z

—

0.45

—

0.45

—

0.45

—

0.45

—

0.45

—

ns

t_KHQX1

K Clock High to Data Output Low-Z

Setup Times

–0.45

t_AVKH

t_IVKH

t_DVKH

Address Input Setup Time

0.28

—

0.28

—

0.30

—

0.35

—

0.4

—

ns

1

2

3

Control Input Setup Time (R, W)

Control Input Setup Time (BWX) (BWX)

Data Input Setup Time

Hold Times

t_KHAX

t_KHIX

t_KHDX

Address Input Hold Time

0.28

—

0.28

—

0.30

—

0.35

—

0.4

—

ns

1

2

3

Control Input Hold Time (R, W)

Control Input Hold Time (BWX) (BWX)

Data Input Hold Time

Notes:

1.

2.

3.

4.

5.

All Address inputs must meet the specified setup and hold times for all latching clock edges.

Control signals are R, W

Control signals are BW0, BW1, and (NW0, NW1 for x8) and (BW2, BW3 for x36).

Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge.

V_DDslew rate must be less than 0.1 V DC per 50 ns for DLL lock retention. DLL lock time begins once V_DDand input clock are stable.

Rev: 1.02c 8/2017

15/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Rev: 1.02c 8/2017

16/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Rev: 1.02c 8/2017

17/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Rev: 1.02c 8/2017

18/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

JTAG Port Operation

Overview

The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan

interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with V . The JTAG output

DD

drivers are powered by V

.

DD

Disabling the JTAG Port

It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless

clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG

Port unused, TCK, TDI, and TMS may be left floating or tied to either V or V . TDO should be left unconnected.

DD

SS

JTAG Pin Descriptions

Pin Name

I/O

Description

Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the

falling edge of TCK.

TCK

Test Clock

In

The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state

machine. An undriven TMS input will produce the same result as a logic one input level.

TMS

TDI

Test Mode Select

Test Data In

In

The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers placed

between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP

In Controller state machine and the instruction that is currently loaded in the TAP Instruction Register (refer to

the TAP Controller State Diagram). An undriven TDI pin will produce the same result as a logic one input

level.

Output that is active depending on the state of the TAP state machine. Output changes in response to the

falling edge of TCK. This is the output side of the serial registers placed between TDI and TDO.

TDO

Test Data Out

Out

Note:

This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is

held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.

JTAG Port Registers

Overview

The various JTAG registers, refered to as Test Access Port or TAP Registers, are selected (one at a time) via the sequences of 1s

and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the

rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the

TDI and TDO pins.

Instruction Register

The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or

the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the

TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the

controller is placed in Test-Logic-Reset state.

Bypass Register

The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through

the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.

Boundary Scan Register

The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.

The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The

Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the

device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan

Rev: 1.02c 8/2017

19/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in

Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,

SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.

JTAG TAP Block Diagram

·

Boundary Scan Register

·

0

Bypass Register

2

1 0

Instruction Register

TDI

TDO

ID Code Register

31 30 29

2 1

0

·

· · ·

Control Signals

Test Access Port (TAP) Controller

TMS

TCK

Identification (ID) Register

The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in

Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.

It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the

controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.

ID Register Contents

GSI Technology

See BSDL Model

JEDEC Vendor

ID Code

31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10

9

0

8

1

7

1

6

0

5

1

4

1

3

0

2

0

1

0

1

Bit #

X

0

Rev: 1.02c 8/2017

20/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Tap Controller Instruction Set

Overview

There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific

(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be

implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load

address, data or control signals into the RAM or to preload the I/O buffers.

When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.

When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired

instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the

TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this

device is listed in the following table.

JTAG Tap Controller State Diagram

Test Logic Reset

1

0

1

Run Test Idle

Select DR

Select IR

0

1

Capture DR

Capture IR

0

Shift DR

Shift IR

0

1

Exit1 DR

Exit1 IR

0

Pause DR

Pause IR

0

1

Exit2 DR

Exit2 IR

1

Update DR

Update IR

1

0

1

0

Instruction Descriptions

BYPASS

When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This

occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facili-

tate testing of other devices in the scan path.

SAMPLE/PRELOAD

SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is

Rev: 1.02c 8/2017

21/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and

I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and

are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because

the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents

while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will

not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the

TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP

operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then

places the boundary scan register between the TDI and TDO pins.

EXTEST

EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with

all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is

still determined by its input pins.



Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.

Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output

drivers on the falling edge of TCK when the controller is in the Update-IR state.



Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruc-

tion is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not asso-

ciated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR

state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associ-

ated.

IDCODE

The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and

places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction

loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.

SAMPLE-Z

If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-

Z) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR

state.

JTAG TAP Instruction Set Summary

Instruction

EXTEST

Code

000

Description

Notes

1

Places the Boundary Scan Register between TDI and TDO.

Preloads ID Register and places it between TDI and TDO.

IDCODE

001

1, 2

Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.

Forces all RAM output drivers to High-Z.

SAMPLE-Z

010

1

GSI

SAMPLE/PRELOAD

GSI

011

100

101

110

111

GSI private instruction.

Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.

GSI private instruction.

1

GSI

GSI private instruction.

BYPASS

Places Bypass Register between TDI and TDO.

Notes:

1. Instruction codes expressed in binary, MSB on left, LSB on right.

2. Default instruction automatically loaded at power-up and in test-logic-reset state.

Rev: 1.02c 8/2017

22/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

JTAG Port Recommended Operating Conditions and DC Characteristics

Parameter

Symbol

V_ILJ

Min.

–0.3

Max.

Unit Notes

0.3 * V_DD

V_DD+0.3

Test Port Input Low Voltage

V

1

V_IHJ

0.7 * V_DD

Test Port Input High Voltage

I_INHJ

TMS, TCK and TDI Input Leakage Current

TDO Output Leakage Current

Test Port Output High Voltage

Test Port Output Low Voltage

Test Port Output CMOS High

Test Port Output CMOS Low

–300

–1

1

100

1

uA

V

2

I_INLJ

3

I_OLJ

–1

4

V_OHJ

V_OLJ

V_OHJC

V_OLJC

V_DD– 0.2

—

0.2

—

0.1

5, 6

5, 7

5, 8

5, 9

—

V

V_DD– 0.1

V

—

V

Notes:

1. Input Under/overshoot voltage must be –1 V < Vi < V

+1 V not to exceed V maximum, with a pulse width not to exceed 20% tTKC.

DDn

2.

V

 V V

ILJ

IN

DDn

ILJn

3. 0 V V V

IN

4. Output Disable, V

= 0 to V

DDn

OUT

5. The TDO output driver is served by the V supply.

DD

6.

7.

8.

9.

I

= –2 mA

OHJ

= + 2 mA

OLJ

= –100 uA

= +100 uA

OHJC

OLJC

JTAG Port AC Test Conditions

Parameter

Input high level

Input low level

Conditions

JTAG Port AC Test Load

V_DD– 0.2 V

TDO

0.2 V

*

Input slew rate

1 V/ns

50

30pF

V

_DD/2

Input reference level

V

/2

DD

V_DD/2

Output reference level

* Distributed Test Jig Capacitance

Notes:

1. Include scope and jig capacitance.

2. Test conditions as shown unless otherwise noted.

Rev: 1.02c 8/2017

23/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

JTAG Port Timing Diagram

tTKC

tTKH

tTKL

TCK

TDI

tTH

tTS

TMS

TDO

tTKQ

tTH

tTS

Parallel SRAM input

JTAG Port AC Electrical Characteristics

Parameter

Symbol

tTKC

tTKQ

tTKH

tTKL

tTS

Min

Max

—

Unit

ns

TCK Cycle Time

50

—

20

10

TCK Low to TDO Valid

TCK High Pulse Width

TCK Low Pulse Width

TDI & TMS Set Up Time

TDI & TMS Hold Time

20

—

ns

—

ns

—

ns

tTH

—

ns

Rev: 1.02c 8/2017

24/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Package Dimensions—165-Bump FPBGA (Package D)

A1 CORNER

TOP VIEW

BOTTOM VIEW

A1 CORNER

M

Ø0.10

C

Ø0.25 C A B

Ø0.40~0.60 (165x)

1

2 3 4 5 6 7 8 9 10 11

11 10 9 8

7 6 5 4 3 2 1

A

B

C

D

E

F

A

B

C

D

E

F

G

H

J

G

H

J

K

L

K

L

M

N

P

R

M

N

P

R

A

1.0

10.0

1.0

13±0.05

B

0.20(4x)

SEATING PLANE

C

Rev: 1.02c 8/2017

25/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Ordering Information—GSI SigmaQuad-II+ SRAM

Speed

(MHz)

2

1

Org

Type

Package

T

Part Number

J

8M x 8

8M x 9

GS8662Q07BD-357

GS8662Q07BD-333

GS8662Q07BD-300

GS8662Q07BD-250

GS8662Q07BD-200

GS8662Q07BD-357I

GS8662Q07BD-333I

GS8662Q07BD-300I

GS8662Q07BD-250I

GS8662Q07BD-200I

GS8662Q07BGD-357

GS8662Q07BGD-333

GS8662Q07BGD-300

GS8662Q07BGD-250

GS8662Q07BGD-200

GS8662Q07BGD-357I

GS8662Q07BGD-333I

GS8662Q07BGD-300I

GS8662Q07BGD-250I

GS8662Q07BGD-200I

GS8662Q10BD-357

GS8662Q10BD-333

GS8662Q10BD-300

GS8662Q10BD-250

GS8662Q10BD-200

GS8662Q10BD-357I

GS8662Q10BD-333I

GS8662Q10BD-300I

GS8662Q10BD-250I

GS8662Q10BD-200I

GS8662Q10BGD-357

GS8662Q10BGD-333

SigmaQuad-II+ B2 SRAM

165-bump BGA

357

333

300

250

200

357

333

300

250

200

357

333

300

250

200

357

333

300

250

200

357

333

300

250

200

357

333

300

250

200

357

333

C

I

165-bump BGA

I

165-bump BGA

I

165-bump BGA

I

165-bump BGA

I

RoHS-compliant 165-bump BGA

165-bump BGA

C

I

C

I

165-bump BGA

I

165-bump BGA

I

165-bump BGA

I

165-bump BGA

I

RoHS-compliant 165-bump BGA

C

Notes:

1. For Tape and Reel add the character “T” to the end of the part number. Example: GS8662QxxBD-300T.

2. C = Commercial Temperature Range. I = Industrial Temperature Range.

Rev: 1.02c 8/2017

26/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Ordering Information—GSI SigmaQuad-II+ SRAM (Continued)

Speed

(MHz)

2

1

Org

Type

Package

T

Part Number

J

8M x 9

GS8662Q10BGD-300

GS8662Q10BGD-250

GS8662Q10BGD-200

GS8662Q10BGD-357I

GS8662Q10BGD-333I

GS8662Q10BGD-300I

GS8662Q10BGD-250I

GS8662Q10BGD-200I

GS8662Q19BD-357

GS8662Q19BD-333

GS8662Q19BD-300

GS8662Q19BD-250

GS8662Q19BD-200

GS8662Q19BD-357I

GS8662Q19BD-333I

GS8662Q19BD-300I

GS8662Q19BD-250I

GS8662Q19BD-200I

GS8662Q19BGD-357

GS8662Q19BGD-333

GS8662Q19BGD-300

GS8662Q19BGD-250

GS8662Q19BGD-200

GS8662Q19BGD-357I

GS8662Q19BGD-333I

GS8662Q19BGD-300I

GS8662Q19BGD-250I

GS8662Q19BGD-200I

GS8662Q37BD-357

GS8662Q37BD-333

GS8662Q37BD-300

GS8662Q37BD-250

SigmaQuad-II+ B2 SRAM

RoHS-compliant 165-bump BGA

165-bump BGA

300

250

200

357

333

300

250

200

357

333

300

250

200

357

333

300

250

200

357

333

300

250

200

357

333

300

250

200

357

333

300

250

C

I

8M x 9

I

8M x 9

I

8M x 9

I

8M x 9

I

4M x 18

2M x 36

C

I

165-bump BGA

I

165-bump BGA

I

165-bump BGA

I

165-bump BGA

I

RoHS-compliant 165-bump BGA

165-bump BGA

C

I

C

165-bump BGA

Notes:

1. For Tape and Reel add the character “T” to the end of the part number. Example: GS8662QxxBD-300T.

2. C = Commercial Temperature Range. I = Industrial Temperature Range.

Rev: 1.02c 8/2017

27/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8662Q07/10/19/37BD-357/333/300/250/200

Ordering Information—GSI SigmaQuad-II+ SRAM (Continued)

Speed

(MHz)

2

1

Org

Type

Package

T

Part Number

J

2M x 36

GS8662Q37BD-200

GS8662Q37BD-357I

GS8662Q37BD-333I

GS8662Q37BD-300I

GS8662Q37BD-250I

GS8662Q37BD-200I

GS8662Q37BGD-357

GS8662Q37BGD-333

GS8662Q37BGD-300

GS8662Q37BGD-250

GS8662Q37BGD-200

GS8662Q37BGD-357I

GS8662Q37BGD-333I

GS8662Q37BGD-300I

GS8662Q37BGD-250I

GS8662Q37BGD-200I

SigmaQuad-II+ B2 SRAM

165-bump BGA

200

357

333

300

250

200

357

333

300

250

200

357

333

300

250

200

C

I

165-bump BGA

I

165-bump BGA

I

165-bump BGA

I

165-bump BGA

I

RoHS-compliant 165-bump BGA

C

I

Notes:

1. For Tape and Reel add the character “T” to the end of the part number. Example: GS8662QxxBD-300T.

2. C = Commercial Temperature Range. I = Industrial Temperature Range.

SigmaQuad-II+ SRAM Revision History

File Name

Format/Content

Description of changes

Creation of datasheet

8662QxxB_r1

• Addition of T information

J

8662QxxB_r1_01

8662QxxB_r1_02

Content

• Addition of 357 MHz speed bin

• (Rev1.01a: Removed T references)

A

• Update to MP status

• (Rev1.02a: Removed Power-up section and added AN1021 link to

Power Supplies table)

Content

• (Rev1.02b: Editorial updates)

• (Rev1.02c: Corrected erroneous information in Input and Output

Leakage Characteristics table)

Rev: 1.02c 8/2017

28/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.


型号：	GS8662Q37BD-300I
厂家：	GSI TECHNOLOGY
描述：	72Mb SigmaQuad-IITM Burst of 2 SRAM 静态存储器
文件：	总28页 (文件大小：502K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

GS8662Q37BD-300I [GSI]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E