S7379-01 [HAMAMATSU]

PIN Photodiode, PLASTIC PACKAGE-8;
S7379-01
型号: S7379-01
厂家: HAMAMATSU CORPORATION    HAMAMATSU CORPORATION
描述:

PIN Photodiode, PLASTIC PACKAGE-8

光电
文件: 总4页 (文件大小:163K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
P H O T O D I O D E  
Si PIN photodiode  
,
,
S7379-01 S6695-01 S6058  
Quadrant photodiode / plastic package  
These Si PIN photodiodes have a quadrant element molded into clear plastic packages, and feature high sensitivity, low noise and low cross-talk.  
Custom-designed devices (with different element shapes, number of elements, characteristics and packages) are also available to meet your  
specific needs. Feel free to contact our sales office.  
Features  
Applications  
Clear plastic package (4 × 4.8 mm)  
High sensitivity  
Signal readout for CD, DVD and MO (Magneto Optical) disc  
Laser beam alignment  
Uniform element characteristic  
Low cross-talk  
Position detection, etc.  
Low noise  
General ratings / Absolute maximum ratings  
Absolute maximum ratings  
Active  
area  
Operating  
temperature  
Topr  
Storage  
temperature  
Tstg  
Elements gap  
Dimensional  
outline  
Reverse voltage  
VR Max.  
Type No.  
(mm)(µm)(V) (°C) (°C)  
S7379-01  
20  
15  
10  
f1.0/4 element  
2.0 × 2.0/4 element  
0.6 × 1.2/4 element  
S6695-01  
S6058  
20  
-25 to +85  
-40 to +100  
Electrical and optical characteristics (Typ. Ta=25 °C, unless otherwise noted, per 1 element)  
Cut-off  
frequency  
fc  
VR=10 V  
RL=50 W  
l=830 nm  
Temp.  
coefficient  
of  
Terminal  
capacitance  
Ct  
VR=10 V  
f=1 MHz  
Spectral  
response sensitivity  
range wavelength  
Peak  
Dark current  
ID  
VR=10 V  
All elements  
Photo sensitivity  
S
NEP  
VR=10 V  
ID  
TCID  
Type No.  
l
lp  
Typ.  
(nA)  
Max.  
(nA)(times/°C) (MHz)  
l=lp l=410 nm  
(A/W)  
0.19  
1/2  
(nm)(nm)  
(pF) (W/Hz  
)
(A/W)  
0.55  
S7379-01  
0.04  
0.1 *1  
0.2  
1 *1  
80  
40 *1  
1
6.5 ×10-15  
8.7 ×10-15  
320 to  
1060  
900  
800  
1
2
S6695-01  
0.65  
0.18  
3 *1  
*
1.15  
320 to  
1000  
S6058  
0.55  
0.21  
0.04 *2  
0.2 *2  
150 *2  
1 *2  
6.5 ×10-15  
*
*1: VR=5 V  
*2: VR=3 V  
1
Si PIN photodiode S7379-01, S6695-01, S6058  
Spectral response  
Photo sensitivity temperature characteristics  
(Typ. Ta=25 ˚C)  
(Typ. )  
0.7  
+1.5  
+1.0  
+0.5  
S6695-01  
QE=100 %  
0.6  
0.5  
0.4  
0.3  
0.2  
S6058  
S6058  
S7379-01  
S7379-01, S6695-01  
0
0.1  
0
-0.5  
200  
400  
600  
800  
1000  
200  
400  
600  
800  
1000  
WAVELENGTH (nm)  
WAVELENGTH (nm)  
KMPDB0145EB  
KMPDB0146EB  
Dark current vs. reverse voltage  
Terminal capacitance vs. reverse voltage  
(Typ. Ta=25 ˚C, f=1 MHz)  
(Typ. Ta=25 ˚C)  
100 pF  
1 nA  
S6695-01  
100 pA  
10 pF  
S6695-01  
S7379-01  
S6058  
S6058  
10 pA  
S7379-01  
1 pF  
1 pA  
100 fF  
100 fA  
0.1  
1
10  
100  
0.01  
0.1  
1
10  
100  
REVERSE VOLTAGE (V)  
REVERSE VOLTAGE (V)  
KMPDB0147EB  
KMPDB0148EB  
2
Si PIN photodiode S7379-01, S6695-01, S6058  
Dimensional outlines (unit: mm, tolerance unless otherwise noted: 0.1ꢀ  
S7379-01  
4.1 0.2 ACTIVE AREA  
(INCLUDING BURR)  
a d  
b c  
(1.25)  
(1.25)  
(0.8)  
(0.8)  
3.4 0.4  
3.4 0.4  
4.0 *  
PHOTOSENSITIVE  
SURFACE  
1.0  
0.02  
10.8 0.3  
(2 ×) 10˚  
a
b
d
c
(2 ×) 5˚  
DETAILS OF PHOTODIODE  
Chip position accuracy with  
respect to the package  
dimensions marked *  
X, Y 0.2  
NC  
ANODE a  
ANODE b  
CATHODE COMMON  
NC  
θ ≤ 2˚  
ANODE c  
ANODE d  
CATHODE COMMON  
KMPDA0137EA  
S6695-01  
4.1 0.2  
(INCLUDING BURR)  
a d  
b c  
1.5 0.4  
1.5 0.4  
4.0 *  
7.0 0.3  
ELECTRODE  
0.7 0.3  
0.7 0.3  
PHOTOSENSITIVE  
SURFACE  
(2 ×) 10˚  
a
b
d
c
(2 ×) 5˚  
0.015  
2.0  
ANODE a  
CATHODE COMMON  
ANODE b  
ANODE c  
CATHODE COMMON  
ANODE d  
DETAILS OF PHOTODIODE  
Chip position accuracy with  
respect to the package  
dimensions marked *  
X, Y 0.2  
θ ≤ 2˚  
KMPDA0121EA  
3
Si PIN photodiode S7379-01, S6695-01, S6058  
S6058  
4.1 0.2 ACTIVE AREA  
(INCLUDING BURR)  
a
b
d
c
(1.25)  
(1.25)  
(0.8)  
3.4 0.4  
(0.8)  
3.4 0.4  
4.0 *  
ELECTRODE  
PHOTOSENSITIVE  
SURFACE  
10.8 0.3  
(2 ×) 10˚  
a
d
c
b
(2 ×) 5˚  
0.01  
0.6  
NC  
ANODE a  
ANODE b  
CATHODE COMMON  
NC  
ANODE c  
ANODE d  
DETAILS OF PHOTODIODE  
Chip position accuracy with  
respect to the package  
dimensions marked *  
X, Y 0.2  
θ ≤ 2˚  
CATHODE COMMON  
KMPDA0007EB  
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.  
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. ©2002 Hamamatsu Photonics K.K.  
HAMAMATSU PHOTONICS K.K., Solid State Division  
1126-1 Ichino-cho, Hamamatsu City, 435-8558 Japan, Telephone: (81) 053-434-3311, Fax: (81) 053-434-5184, http://www.hamamatsu.com  
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218  
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 08152-3750, Fax: (49) 08152-2658  
France: Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10  
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777  
North Europe: Hamamatsu Photonics Norden AB: Smidesvägen 12, SE-171 41 Solna, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01  
Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741  
Cat. No. KMPD1053E05  
May 2002 DN  
4

相关型号:

MILL-MAX

S73WS-P

Stacked Multi-Chip Product (MCP)
SPANSION

S73WS256N

Stacked Multi-Chip Product (MCP)
SPANSION

S73WS256ND0BAWA70

Stacked Multi-Chip Product (MCP)
SPANSION

S73WS256ND0BAWA72

Stacked Multi-Chip Product (MCP)
SPANSION

S73WS256ND0BAWA73

Stacked Multi-Chip Product (MCP)
SPANSION

S73WS256ND0BAWAB0

Stacked Multi-Chip Product (MCP)
SPANSION

S73WS256ND0BAWAB2

Stacked Multi-Chip Product (MCP)
SPANSION

S73WS256ND0BAWAB3

Stacked Multi-Chip Product (MCP)
SPANSION

S73WS256ND0BAWT70

Stacked Multi-Chip Product (MCP)
SPANSION

S73WS256ND0BAWT72

Stacked Multi-Chip Product (MCP)
SPANSION

S73WS256ND0BAWT73

Stacked Multi-Chip Product (MCP)
SPANSION