SP721 [HARRIS]

ELECTRONIC PROTECTION ARRAY FOR ESD AND OVER-VOLTAGE PROTECTION; 用于ESD和过电压保护电子保护阵列
SP721
型号: SP721
厂家: HARRIS CORPORATION    HARRIS CORPORATION
描述:

ELECTRONIC PROTECTION ARRAY FOR ESD AND OVER-VOLTAGE PROTECTION
用于ESD和过电压保护电子保护阵列

电子
文件: 总6页 (文件大小:177K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SP721  
100  
80  
2.5  
2
o
o
T
= 25 C  
T = 25 C  
A
A
SINGLE PULSE  
SINGLE PULSE  
60  
1.5  
1
40  
20  
0
I
FWD  
EQUIV. SAT. ON  
THRESHOLD ~ 1.1V  
V
FWD  
0.5  
0
600  
800  
1000  
1200  
0
1
2
3
FORWARD SCR VOLTAGE DROP (mV)  
FORWARD SCR VOLTAGE DROP (V)  
FIGURE 2. LOW CURRENT SCR FORWARDVOLTAGE DROP  
CURVE  
FIGURE 3. HIGH CURRENT SCR FORWARDVOLTAGE DROP  
CURVE  
+V  
+V  
CC  
CC  
INPUT  
DRIVERS  
OR  
SIGNAL  
SOURCES  
LINEAR OR  
DIGITAL IC  
INTERFACE  
TO +V  
V+  
IN 1 - 3  
IN 5 - 7  
CC  
SP721  
V-  
SP721 INPUT PROTECTION CIRCUIT (1 OF 6 SHOWN)  
FIGURE 4. TYPICAL APPLICATION OFTHE SP721 AS AN INPUT CLAMP FOR OVER-VOLTAGE, GREATERTHAN 1V  
ABOVE V+ OR  
BE  
LESS THAN -1V  
BELOW V-  
BE  
6-11  
SP721  
Peak Transient Current Capability of the SP721  
The peak transient current capability rises sharply as the  
width of the current pulse narrows. Destructive testing was  
done to fully evaluate the SP721’s ability to withstand a wide  
range of peak current pulses vs time. The circuit used to  
generate current pulses is shown in Figure 5.  
VARIABLE TIME DURATION  
CURRENT PULSE GENERATOR  
+
R
1
V
X
CURRENT  
SENSE  
-
(-)  
(+)  
The test circuit of Figure 5 is shown with a positive pulse  
input. For a negative pulse input, the (-) current pulse input  
goes to an SP721 ‘IN’ input pin and the (+) current pulse  
input goes to the SP721 V- pin. The V+ to V- supply of the  
SP721 must be allowed to float. (i.e., It is not tied to the  
ground reference of the current pulse generator.) Figure 6  
shows the point of overstress as defined by increased  
leakage in excess of the data sheet published limits.  
1
IN  
IN  
IN  
V-  
V+  
IN  
IN  
IN  
8
7
6
5
2
3
4
SP721  
+
-
C1  
VOLTAGE  
PROBE  
R
X
~ 10TYPICAL  
1
The maximum peak input current capability is dependent on  
the ambient temperature, improving as the temperature is  
reduced. Peak current curves are shown for ambient  
temperatures of 25 C and 105 C and a 15V power supply  
condition. The safe operating range of the transient peak  
current should be limited to no more than 75% of the  
measured overstress level for any given pulse width as  
shown in the curves of Figure 6.  
V
ADJ. 10V/A TYPICAL  
C1 ~ 100µF  
o
o
FIGURE 5. TYPICAL SP721 PEAK CURRENT TEST CIRCUIT  
WITH A VARIABLE PULSE WIDTH INPUT  
Note that adjacent input pins of the SP721 may be  
paralleled to improve current (and ESD) capability. The  
sustained peak current capability is increased to nearly  
twice that of a single pin.  
7
CAUTION: SAFE OPERATING CONDITIONS LIMIT  
THE MAXIMUM PEAK CURRENT FOR A GIVEN  
PULSE WIDTH TO BE NO GREATER THAN 75%  
OF THE VALUES SHOWN ON EACH CURVE.  
6
5
4
3
2
1
0
o
T
= 25 C  
A
V+ TO V- SUPPLY = 15V  
o
T
= 105 C  
A
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE WIDTH TIME (ms)  
FIGURE 6. SP721TYPICAL SINGLE PULSE PEAK CURRENT CURVES SHOWINGTHE MEASURED POINT OF OVERSTRESS IN  
AMPERES vs PULSE WIDTH TIME IN MILLISECONDS  
6-12  
SP721  
Dual-In-Line Plastic Packages (PDIP)  
E8.3 (JEDEC MS-001-BA ISSUE D)  
N
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE  
E1  
INDEX  
AREA  
INCHES  
MILLIMETERS  
1
2
3
N/2  
SYMBOL  
MIN  
MAX  
0.210  
-
MIN  
-
MAX  
5.33  
-
NOTES  
-B-  
-C-  
A
A1  
A2  
B
-
4
-A-  
D
E
0.015  
0.115  
0.014  
0.045  
0.008  
0.355  
0.005  
0.300  
0.240  
0.39  
2.93  
0.356  
1.15  
0.204  
9.01  
0.13  
7.62  
6.10  
4
BASE  
PLANE  
0.195  
0.022  
0.070  
0.014  
0.400  
-
4.95  
0.558  
1.77  
0.355  
10.16  
-
-
A2  
A
-
SEATING  
PLANE  
L
C
L
B1  
C
8, 10  
D1  
B1  
eA  
-
A
1
D1  
e
D
5
eC  
B S  
C
B
eB  
D1  
E
5
0.010 (0.25) M  
C
A
0.325  
0.280  
8.25  
7.11  
6
NOTES:  
E1  
e
5
1. Controlling Dimensions: INCH. In case of conflict between  
0.100 BSC  
0.300 BSC  
2.54 BSC  
7.62 BSC  
-
English and Metric dimensions, the inch dimensions control.  
e
e
6
A
B
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
-
0.430  
0.150  
-
10.92  
3.81  
7
3. Symbols are defined in the “MO Series Symbol List” in Section  
2.2 of Publication No. 95.  
L
0.115  
2.93  
4
9
4. Dimensions A, A1 and L are measured with the package seated  
N
8
8
in JEDEC seating plane gauge GS-3.  
Rev. 0 12/93  
5. D, D1, and E1 dimensions do not include mold flash or protru-  
sions. Mold flash or protrusions shall not exceed 0.010 inch  
(0.25mm).  
e
6. E and  
pendicular to datum  
7. e and e are measured at the lead tips with the leads uncon-  
are measured with the leads constrained to be per-  
A
-C-  
.
B
C
strained. e must be zero or greater.  
C
8. B1 maximum dimensions do not include dambar protrusions.  
Dambar protrusions shall not exceed 0.010 inch (0.25mm).  
9. N is the maximum number of terminal positions.  
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,  
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch  
(0.76 - 1.14mm).  
6-13  
SP721  
Small Outline Plastic Packages (SOIC)  
M8.15 (JEDEC MS-012-AA ISSUE C)  
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC  
PACKAGE  
N
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
E
INCHES  
MILLIMETERS  
-B-  
SYMBOL  
MIN  
MAX  
MIN  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
MAX  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
NOTES  
A
A1  
B
C
D
E
e
0.0532  
0.0040  
0.013  
0.0688  
0.0098  
0.020  
-
1
2
3
L
-
9
SEATING PLANE  
A
0.0075  
0.1890  
0.1497  
0.0098  
0.1968  
0.1574  
-
-A-  
o
h x 45  
D
3
4
-C-  
α
µ
0.050 BSC  
1.27 BSC  
-
e
A1  
H
h
0.2284  
0.0099  
0.016  
0.2440  
0.0196  
0.050  
5.80  
0.25  
0.40  
6.20  
0.50  
1.27  
-
C
B
0.10(0.004)  
5
0.25(0.010) M  
C
A M B S  
L
6
N
α
8
8
7
NOTES:  
o
o
o
o
0
8
0
8
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication Number 95.  
Rev. 0 12/93  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006  
inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. Inter-  
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per  
side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
above the seating plane, shall not exceed a maximum value of  
0.61mm (0.024 inch).  
10. Controlling dimension: MILLIMETER. Converted inch dimensions  
are not necessarily exact.  
6-14  

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