HM5116405SI-7 [HITACHI]

EDO DRAM, 4MX4, 70ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24;
HM5116405SI-7
型号: HM5116405SI-7
厂家: HITACHI SEMICONDUCTOR    HITACHI SEMICONDUCTOR
描述:

EDO DRAM, 4MX4, 70ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24

动态存储器 光电二极管 内存集成电路
文件: 总30页 (文件大小:324K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HM5116405I Series  
4,194,304-word × 4-bit Dynamic RAM  
ADE-203-757A (Z)  
Rev. 1.0  
Mar. 17, 1997  
Description  
The Hitachi HM5116405I Series is CMOS dynamic RAM organized 4,194,304-word × 4-bit. It employs  
the most advanced CMOS technology for high performance and low power. The HM5116405I Series  
offers Extended Data Out (EDO) Page Mode as a high speed access mode. It is packaged in 26-pin plastic  
SOJ.  
Features  
Single 5 V (±10%)  
Access time: 60 ns/70 ns (max)  
Power dissipation  
Active mode : 440 mW/385 mW (max)  
Standby mode : 11 mW (max)  
:
0.83 mW (max) (L-version)  
EDO page mode capability  
Refresh cycles  
4096 refresh cycles : 64 ms  
: 128 ms (L-version)  
3 variations of refresh  
RAS-only refresh  
CAS-before-RAS refresh  
Hidden refresh  
Battery backup operation (L-version)  
Test function  
16-bit parallel test mode  
Temperatre range: –40 to +85˚C  
HM5116405I Series  
Ordering Information  
Type No.  
Access time  
Package  
HM5116405SI-6  
HM5116405SI-7  
60 ns  
70 ns  
300-mil 26-pin plastic SOJ  
(CP-26/24DB)  
HM5116405LSI-6  
HM5116405LSI -7  
60 ns  
70 ns  
2
HM5116405I Series  
Pin Arrangement  
HM5116405SI/LSI Series  
VCC  
I/O1  
I/O2  
WE  
1
2
3
4
5
6
26  
25  
24  
23  
22  
21  
VSS  
I/O4  
I/O3  
CAS  
OE  
RAS  
A11  
A9  
A10  
A0  
8
19  
18  
17  
16  
15  
14  
A8  
A7  
A6  
A5  
A4  
VSS  
9
A1  
10  
11  
12  
13  
A2  
A3  
VCC  
(Top view)  
Pin Description  
Pin name  
Function  
Address input  
A0 to A11  
— Row/Refresh address  
— Column address  
A0 to A11  
A0 to A9  
I/O1 to I/O4  
RAS  
CAS  
WE  
Data input/Data output  
Row address strobe  
Column address strobe  
Write enable  
OE  
Output enable  
VCC  
Power supply  
VSS  
Ground  
3
HM5116405I Series  
Block Diagram  
RAS  
CAS  
WE  
OE  
Timing and control  
A0  
Column decoder  
4M array  
A1  
to  
Column  
address  
buffers  
A9  
4M array  
4M array  
4M array  
I/O1  
to  
I/O4  
I/O buffers  
Row  
address  
buffers  
A10  
A11  
4
HM5116405I Series  
Absolute Maximum Ratings  
Parameter  
Symbol  
VT  
Value  
Unit  
V
Voltage on any pin relative to VSS  
Supply voltage relative to VSS  
Short circuit output current  
Power dissipation  
–1.0 to +7.0  
–1.0 to +7.0  
50  
VCC  
V
Iout  
PT  
mA  
W
1.0  
Operating temperature  
Storage temperature  
Topr  
Tstg  
–40 to +85  
–55 to +125  
°C  
°C  
Recommended DC Operating Conditions (Ta = –40 to +85˚C)  
Parameter  
Symbol  
VCC  
Min  
4.5  
Typ  
5.0  
Max  
5.5  
6.5  
0.8  
Unit  
V
Note  
Supply voltage  
Input high voltage  
Input low voltage  
1
1
1
VIH  
2.4  
V
VIL  
–1.0  
V
Note: 1. All voltage referred to VSS.  
DC Characteristics (Ta = –40 to +85˚C, VCC = 5 V ± 10%, VSS = 0 V)  
HM5116405I  
–6  
Max  
–7  
Max  
Parameter  
Symbol Min  
Min  
Unit  
mA  
mA  
Test conditions  
1
2
,
Operating current*  
Standby current  
*
ICC1  
ICC2  
80  
2
70  
2
tRC = min  
TTL interface  
RAS, CAS = VIH  
Dout = High-Z  
1
1
mA  
CMOS interface  
RAS, CAS VCC – 0.2 V  
Dout = High-Z  
Standby current  
(L-version)  
ICC2  
150  
150  
µA  
CMOS interface  
RAS, CAS VCC – 0.2 V  
Dout = High-Z  
RAS-only refresh current*2  
Standby current*1  
ICC3  
ICC5  
80  
5
70  
5
mA  
mA  
tRC = min  
RAS = VIH  
CAS = VIL  
Dout = enable  
CAS-before-RAS refresh  
current  
ICC6  
80  
70  
mA  
tRC = min  
5
HM5116405I Series  
DC Characteristics (cont.)  
HM5116405I  
–6  
Max  
70  
–7  
Max  
Parameter  
EDO page mode current*1, *3 ICC7  
Symbol Min  
Min  
Unit  
mA  
µA  
Test conditions  
65  
tHPC = min  
Battery backup current  
ICC10  
350  
350  
CMOS interface  
Dout = High-Z, CBR  
refresh: tRC = 31.3 µs  
t
RAS 0.3 µs  
Input leakage current  
Output leakage current  
ILI  
–10  
–10  
10  
10  
–10  
–10  
10  
10  
µA  
µA  
0 V Vin 7 V  
ILO  
0 V Vin 7 V  
Dout = disable  
Output high voltage  
Output low voltage  
VOH  
VOL  
2.4  
0
VCC  
0.4  
2.4  
0
VCC  
0.4  
V
V
High Iout = –2 mA  
Low Iout = 2 mA  
Notes : 1. ICC depends on output load condition when the device is selected. ICC max is specified at the  
output open condition.  
2. Address can be changed once or less while RAS = VIL.  
3. Address can be changed once or less while CAS = VIH.  
Capacitance (Ta = 25˚C, VCC = 5 V ±10%)  
Parameter  
Symbol  
CI1  
Typ  
Max  
Unit  
pF  
Notes  
Input capacitance (Address)  
Input capacitance (Clocks)  
5
7
7
1
CI2  
pF  
1
Output capacitance (Data-in, Data-out) CI/O  
pF  
1, 2  
Notes : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.  
2. CAS = VIH to disable Dout.  
6
HM5116405I Series  
AC Characteristics (Ta = –40 to +85˚C, VCC = 5 V ±10%, VSS = 0 V) *1, *2, *18  
Test Conditions  
Input rise and fall time: 2 ns  
Input levels: VIL = 0 V, VIH = 3 V  
Input timing reference levels: 0.8 V, 2.4 V  
Output timing reference levels: 0.8 V, 2.0 V  
Output load: 1 TTL gate + CL (100 pF) (Including scope and jig)  
Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters)  
HM5116405I  
–6  
Max  
–7  
Max  
Parameter  
Symbol  
tRC  
Min  
104  
40  
10  
60  
10  
0
Min  
124  
50  
Unit  
ns  
Notes  
Random read or write cycle time  
RAS precharge time  
tRP  
ns  
CAS precharge time  
tCP  
13  
ns  
RAS pulse width  
tRAS  
tCAS  
tASR  
tRAH  
tASC  
tCAH  
tRCD  
tRAD  
tRSH  
tCSH  
tCRP  
tOED  
tDZO  
tDZC  
tT  
10000 70  
10000 13  
10000 ns  
10000 ns  
CAS pulse width  
Row address setup time  
Row address hold time  
Column address setup time  
Column address hold time  
RAS to CAS delay time  
RAS to column address delay time  
RAS hold time  
45  
30  
50  
0
52  
35  
50  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
10  
0
10  
0
10  
14  
12  
13  
40  
5
13  
14  
12  
13  
45  
5
3
4
CAS hold time  
CAS to RAS precharge time  
OE to Din delay time  
OE delay time from Din  
CAS delay time from Din  
Transition time (rise and fall)  
15  
0
18  
0
5
6
6
7
0
0
2
2
7
HM5116405I Series  
Read Cycle  
HM5116405I  
–6  
Max  
60  
–7  
Max  
Parameter  
Symbol  
tRAC  
Min  
Min  
Unit  
ns  
Notes  
Access time from RAS  
Access time from CAS  
70  
18  
8, 9, 20  
tCAC  
15  
ns  
9, 10, 17,  
20  
Access time from address  
tAA  
30  
35  
ns  
9, 11, 17,  
20  
Access time from OE  
tOEA  
tRCS  
tRCH  
0
15  
15  
15  
15  
15  
0
18  
15  
15  
15  
15  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
9, 20  
Read command setup time  
Read command hold time to CAS  
0
0
12  
Read command hold time from RAS tRCHR  
60  
0
70  
0
Read command hold time to RAS  
Column address to RAS lead time  
Column address to CAS lead time  
CAS to output in low-Z  
tRRH  
tRAL  
tCAL  
tCLZ  
tOH  
12  
30  
18  
0
35  
23  
0
Output data hold time  
3
3
22  
Output data hold time from OE  
Output buffer turn-off time  
Output buffer turn-off to OE  
CAS to Din delay time  
tOHO  
tOFF  
tOEZ  
tCDD  
tOHR  
tOFR  
tWEZ  
tWED  
tRDD  
tRNCD  
3
3
15  
3
18  
3
13, 22  
13  
5
Output data hold time from RAS  
Output buffer turn-off to RAS  
Output buffer turn-off to WE  
WE to Din delay time  
22  
15  
15  
60  
18  
18  
70  
22  
RAS to Din delay time  
RAS next CAS delay time  
8
HM5116405I Series  
Write Cycle  
HM5116405I  
–6  
Max  
–7  
Max  
Parameter  
Symbol  
tWCS  
tWCH  
tWP  
Min  
0
Min  
0
Unit  
ns  
Notes  
Write command setup time  
Write command hold time  
Write command pulse width  
Write command to RAS lead time  
Write command to CAS lead time  
Data-in setup time  
14  
10  
10  
10  
10  
0
13  
10  
13  
13  
0
ns  
ns  
tRWL  
tCWL  
tDS  
ns  
ns  
ns  
15  
15  
Data-in hold time  
tDH  
10  
13  
ns  
Read-Modify-Write Cycle  
HM5116405I  
–6  
–7  
Parameter  
Symbol  
tRWC  
Min  
135  
79  
Max  
Min  
161  
92  
Max  
Unit  
ns  
Notes  
Read-modify-write cycle time  
RAS to WE delay time  
CAS to WE delay time  
Column address to WE delay time  
OE hold time from WE  
tRWD  
ns  
14  
14  
14  
tCWD  
34  
40  
ns  
tAWD  
49  
57  
ns  
tOEH  
15  
18  
ns  
Refresh Cycle  
HM5116405I  
–6  
Max  
–7  
Parameter  
Symbol  
tCSR  
Min  
5
Min  
5
Max  
Unit  
ns  
Notes  
CAS setup time (CBR refresh cycle)  
CAS hold time (CBR refresh cycle)  
WE setup time (CBR refresh cycle)  
WE hold time (CBR refresh cycle)  
RAS precharge to CAS hold time  
tCHR  
10  
0
10  
0
ns  
tWRP  
ns  
tWRH  
10  
5
10  
5
ns  
tRPC  
ns  
9
HM5116405I Series  
EDO Page Mode Cycle  
HM5116405I  
–6  
Max  
–7  
Max  
Parameter  
Symbol  
tHPC  
Min  
25  
35  
3
Min  
Unit  
Notes  
21  
EDO page mode cycle time  
EDO page mode RAS pulse width  
Access time from CAS precharge  
RAS hold time from CAS precharge  
Output data hold time from CAS low  
CAS hold time referred OE  
CAS to OE setup time  
30  
ns  
tRASP  
tCPA  
tCPRH  
tDOH  
100000 —  
100000 ns  
16  
35  
40  
3
40  
ns  
ns  
ns  
ns  
ns  
ns  
9, 17, 20  
9, 17  
tCOL  
10  
5
13  
5
tCOP  
Read command hold time from CAS tRCHC  
precharge  
35  
40  
EDO Page Mode Read-Modify-Write Cycle  
HM5116405I  
–6  
Max  
–7  
Max  
Parameter  
Symbol  
Min  
Min  
Unit  
Notes  
EDO page mode read- modify-write  
cycle time  
tHPRWC  
68  
79  
ns  
WE delay time from CAS precharge  
tCPW  
54  
62  
ns  
14  
Test Mode Cycle *19  
HM5116405I  
-6  
-7  
Parameter  
Symbol  
tWTS  
Min  
0
Max  
Min  
0
Max  
Unit  
ns  
Notes  
Test mode WE setup time  
Test mode WE hold time  
tWTH  
10  
10  
ns  
Refresh  
Parameter  
Symbol  
tREF  
tREF  
Max  
Unit  
ms  
Notes  
Refresh period  
64  
4096 cycles  
4096 cycles  
Refresh period (L-version)  
128  
ms  
10  
HM5116405I Series  
Notes: 1. AC measurements assume tT = 2 ns.  
2. An initial pause of 200 µs is required after power up followed by a minimum of eight initialization  
cycles (any combination of cycles containing RAS-only refresh or CAS-before-RAS refresh). If  
the internal refresh counter is used, a minimum of eight CAS-before-RAS refresh cycles are  
required.  
3. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a  
reference point only; if tRCD is greater than the specified tRCD (max) limit, then access time is  
controlled exclusively by tCAC  
.
4. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a  
reference point only; if tRAD is greater than the specified tRAD (max) limit, then access time is  
controlled exclusively by tAA.  
5. Either tOED or tCDD must be satisfied.  
6. Either tDZO or tDZC must be satisfied.  
7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition  
times are measured between VIH (min) and VIL (max).  
8. Assumes that tRCD tRCD (max) and tRAD tRAD (max). If tRCD or tRAD is greater than the maximum  
recommended value shown in this table, tRAC exceeds the value shown.  
9. Measured with a load circuit equivalent to 1 TTL loads and 100 pF.  
10. Assumes that tRCD tRCD (max) and tRCD + tCAC (max) tRAD + tAA (max).  
11. Assumes that tRAD tRAD (max) and tRCD + tCAC (max) tRAD + tAA (max).  
12. Either tRCH or tRRH must be satisfied for a read cycles.  
13. tOFF (max) and tOEZ (max) define the time at which the outputs achieve the open circuit condition  
and are not referred to output voltage levels.  
14. tWCS, tRWD, tCWD, tAWD and tCPW are not restrictive operating parameters. They are included in the  
data sheet as electrical characteristics only; if tWCS tWCS (min), the cycle is an early write cycle  
and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD  
tRWD (min), tCWD tCWD (min), and tAWD tAWD (min), or tCWD tCWD (min), tAWD tAWD (min) and tCPW  
tCPW (min), the cycle is a read-modify-write and the data output will contain data read from the  
selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out  
(at access time) is indeterminate.  
15. These parameters are referred to CAS leading edge in early write cycles and to WE leading  
edge in delayed write or read-modify-write cycles.  
16. tRASP defines RAS pulse width in EDO page mode cycles.  
17. Access time is determined by the longest among tAA, tCAC and tCPA  
.
18. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data  
to device.  
19. The 16M DRAM offers a 16-bit time saving parallel test mode. Address CA0 and CA1 for the 4M  
×4 are don’t care during test mode. Test mode is set by performing a WE-and-CAS-before-RAS  
(WCBR) cycle. In 16-bit parallel test mode, data is written into 4 bits in parallel at each I/O (I/O1  
to I/O4) and read out from each I/O.  
If 4 bits of each I/O are equal (all 1s or 0s), data output pin is a high state during test mode read  
cycle, then the device has passed. If they are not equal, data output pin is a low state, then the  
device has failed.  
Refresh during test mode operation can be performed by normal read cycles or by WCBR  
refresh cycles.  
To get out of test mode and enter a normal operation mode, perform either a regular CAS-  
before-RAS refresh cycle or RAS-only refresh cycle.  
20. In a test mode read cycle, the value of tRAC, tAA, tCAC and tCPA is delayed by 2 ns to 5 ns for the  
specified value. These parameters should be specified in test mode cycles by adding the above  
value to the specified value in this data sheet.  
11  
HM5116405I Series  
21. tHPC (min) can be achieved during a series of EDO page mode write cycles or EDO page mode  
read cycles. If both write and read operation are mixed in a EDO page mode RAS cycle (EDO  
page mode mix cycle (1), (2)), minimum value of CAS cycle (tCAS + tCP + 2 tT) becomes greater  
than the specified tHPC (min) value. The value of CAS cycle time of mixed EDO page mode is  
shown in EDO page mode mix cycle (1) and (2).  
Data output turns off and becomes high impedance from later risting edge of RAS and CAS.  
Hold time and turn off time are specified by the timing specifications of later rising edge of RAS  
and CAS between tOHR and tOH, and between tOFR and tOFF  
.
22. Data output turns off and becomes high impedance from later rising edge of RAS and CAS .  
Hold time and turn off time are specified by the timing specifications of later rising edge of RAS  
and CAS between tOHR and tOH and between tOFR and tOFF  
.
23. XXX: H or L (H: VIH (min) VIN VIH (max), L: VIL (min) V VIL (max))  
IN  
///////: Invalid Dout  
When the address, clock and input pins are not described on timing waveforms, their pins must  
be applied VIH or VIL.  
12  
HM5116405I Series  
Timing Waveforms*23  
Read Cycle  
13  
HM5116405I Series  
t
t
RC  
t
RAS  
RP  
RAS  
t
t
CSH  
CRP  
t
t
t
RCD  
RSH  
CAS  
t
T
CAS  
t
t
t
RAD  
RAL  
CAL  
t
t
t
CAH  
ASR  
Row  
ASC  
t
RAH  
Address  
Column  
t
RRH  
t
RCHR  
t
t
RCH  
CDD  
t
RCS  
WE  
t
WED  
t
DZC  
t
RDD  
High-Z  
Din  
t
t
t
OED  
DZO  
OEA  
OE  
t
OEZ  
t
OHO  
t
CAC  
t
OFF  
t
AA  
t
OH  
t
t
RAC  
OFR  
t
t
CLZ  
OHR  
t
WEZ  
Dout  
Dout  
14  
HM5116405I Series  
Early Write Cycle  
t
t
RC  
t
RAS  
RP  
RAS  
CAS  
t
t
CRP  
CSH  
t
t
t
RCD  
RSH  
CAS  
t
T
t
t
t
t
CAH  
ASR  
RAH  
ASC  
Row  
Column  
Address  
t
t
WCH  
WCS  
WE  
t
t
DH  
DS  
Din  
Din  
High-Z*  
Dout  
t
t
(min)  
WCS  
WCS  
*
15  
HM5116405I Series  
Delayed Write Cycle*18  
t
t
RC  
t
RAS  
RP  
RAS  
t
t
CRP  
CSH  
t
t
t
RCD  
RSH  
CAS  
t
T
CAS  
t
t
t
t
CAH  
ASR  
RAH  
ASC  
Row  
Column  
Address  
t
t
t
CWL  
RWL  
WP  
t
RCS  
WE  
t
t
t
DH  
DZC  
DS  
High-Z  
Din  
Din  
t
t
OEH  
DZO  
t
OED  
OE  
t
OEZ  
t
CLZ  
High-Z  
Dout  
Invalid Dout  
16  
HM5116405I Series  
Read-Modify-Write Cycle*18  
t
t
RWC  
RAS  
t
RP  
RAS  
t
T
t
t
t
CRP  
RCD  
CAS  
CAS  
t
RAD  
t
t
t
t
CAH  
ASR  
RAH  
ASC  
Address  
Row  
Column  
t
t
t
t
t
CWD  
CWL  
t
RCS  
AWD  
RWD  
RWL  
t
WP  
WE  
Din  
OE  
t
t
DH  
DZC  
t
DS  
High-Z  
Din  
t
OED  
t
OEH  
t
DZO  
t
OEA  
t
CAC  
t
t
OEZ  
t
t
AA  
t
RAC  
OHO  
High-Z  
Dout  
Dout  
CLZ  
17  
HM5116405I Series  
RAS-Only Refresh Cycle  
t
RC  
t
t
RAS  
RP  
RAS  
t
T
t
t
t
CRP  
CRP  
RPC  
CAS  
t
t
RAH  
ASR  
Address  
Row  
t
OFR  
t
OFF  
High-Z  
Dout  
18  
HM5116405I Series  
CAS-Before-RAS Refresh Cycle  
t
RC  
t
t
t
RP  
RP  
RAS  
RAS  
t
t
t
t
CRP  
t
CSR  
CHR  
RPC  
RPC  
t
T
CAS  
t
CP  
t
t
t
WRH  
CP  
WRP  
WE  
Address  
t
OFR  
t
OFF  
High-Z  
Dout  
19  
HM5116405I Series  
Hidden Refresh Cycle  
t
t
t
RC  
RC  
RC  
t
t
t
t
t
t
RP  
RAS  
RP  
RAS  
RP  
RAS  
RAS  
t
T
t
t
t
CRP  
RSH  
CHR  
t
RCD  
CAS  
t
t
RAL  
RAD  
t
t
t
t
CAH  
RAH  
ASR  
ASC  
Address  
Row  
Column  
t
t
t
RRH  
t
WRH  
t
WRP  
RCH  
t
RRH  
t
WRH  
WRP  
t
t
RCS  
DZC  
WE  
t
WED  
t
t
CDD  
RDD  
High-Z  
Din  
t
t
OED  
DZO  
t
OEA  
OE  
t
OEZ  
t
CAC  
t
WEZ  
OHO  
t
AA  
t
t
t
t
RAC  
OFF  
OH  
t
CLZ  
Dout  
Dout  
t
OFR  
t
OHR  
20  
HM5116405I Series  
EDO Page Mode Read Cycle  
t
RP  
t
RNCD  
t
HPC  
t
RASP  
RAS  
CAS  
t
t
t
t
CRP  
HPC  
t
HPC  
t
CPRH  
CP  
t
t
T
CSH  
t
CP  
t
t
CP  
t
RSH  
t
t
CAS  
CAS  
CAS  
CAS  
t
RCHC  
t
RCHR  
tRCS  
t
RRH  
RCH  
tRCS  
tRCH  
t
WE  
t
RAL  
t
WED  
t
t
tCAH  
tCAH  
tASC  
tASC  
tCAH  
tRAH  
CAH  
ASC  
tASC  
tASR  
Address  
Row  
Column 1  
Column 2  
t
Column 3  
t
CAL  
Column 4  
t
t
CAL  
CAL  
CAL  
t
t
RDD  
CDD  
t
DZC  
High-Z  
Din  
t
t
t
COP  
COL  
DZO  
t
OED  
OE  
t
t
OFR  
CPA  
t
CPA  
t
OEA  
t
t
t
CPA  
AA  
t
OHR  
OEZ  
AA  
t
t
OEZ  
AA  
t
t
CAC  
t
CAC  
t
OEZ  
t
t
t
OHO  
CAC  
AA  
t
t
t
t
t
CAC  
WEZ  
OHO  
OFF  
OH  
tOEA  
t
t
RAC  
OEA  
t
DOH  
t
OHO  
Dout  
Dout 1  
Dout 2  
Dout 2  
Dout 3  
Dout 4  
21  
HM5116405I Series  
EDO Page Mode Early Write Cycle  
t
t
RASP  
RP  
RAS  
t
T
t
t
t
RSH  
CSH  
HPC  
t
t
t
t
t
t
t
CRP  
RCD  
CAS  
CP  
CAS  
CP  
CAS  
CAS  
t
t
CAH  
t
t
t
t
t
t
ASC  
ASR RAH  
ASC CAH  
ASC CAH  
Row  
Column 1  
Column 2  
Column N  
Address  
t
t
t
t
t
t
WCH  
WCH  
WCS  
WCS  
WCS  
WCH  
WE  
t
t
t
t
t
t
DH  
DS  
DH  
DS  
DH  
DS  
Din 1  
Din 2  
Din N  
Din  
High-Z*  
Dout  
t
t
(min)  
WCS  
*
WCS  
22  
HM5116405I Series  
EDO Page Mode Delayed Write Cycle*18  
t
RASP  
t
RP  
RAS  
t
t
t
t
CP  
CRP  
T
CP  
t
t
t
t
CSH  
HPC  
RSH  
CAS  
t
t
t
CAS  
RCD  
CAS  
CAS  
t
RAD  
t
t
t
t
ASR  
ASC  
t
ASC  
t
ASC  
t
t
RAH  
CAH  
CAH  
CAH  
Row  
Column 1  
Column 2  
Column N  
Address  
t
t
t
CWL  
CWL  
t
CWL  
t
RWL  
t
t
RCS  
RCS  
RCS  
WE  
t
t
t
WP  
WP  
WP  
t
t
t
t
t
t
t
DZC DS  
DZC DS  
DZC DS  
t
t
t
DH  
DH  
DH  
Din  
1
Din  
2
Din  
N
Din  
t
t
t
DZO  
DZO  
DZO  
OED  
t
t
OED  
OED  
t
t
t
OEH  
OEH  
OEH  
OE  
t
t
t
CLZ  
CLZ  
CLZ  
t
t
t
OEZ  
OEZ  
OEZ  
High-Z  
Dout  
Invalid Dout  
Invalid Dout  
Invalid Dout  
23  
HM5116405I Series  
EDO Page Mode Read-Modify-Write Cycle*18  
t
RASP  
t
RP  
RAS  
t
t
T
HPRWC  
t
t
t
t
RSH  
CAS  
t
CRP  
CP  
CP  
t
t
t
CAS  
RCD  
CAS  
CAS  
t
RAD  
t
t
t
t
ASC  
t
CAH  
ASR  
ASC  
RAH  
ASC  
t
t
t
CAH  
CAH  
Row  
Column 1  
Column 2  
Column N  
Address  
t
t
t
t
t
t
t
t
t
CWL  
RWD  
AWD  
CWL  
CPW  
AWD  
CWL  
CPW  
AWD  
t
RWL  
t
t
t
t
t
CWD  
CWD  
RCS  
CWD  
RCS  
WE  
t
t
t
t
t
WP  
t
DS  
RCS  
DZO  
WP  
DS  
WP  
t
t
t
DS  
t
DZC  
DZC  
DZC  
t
t
t
DH  
DH  
DH  
Din  
1
Din  
2
Din  
N
Din  
t
t
t
OED  
OED  
OED  
t
t
t
DZO  
DZO  
t
t
t
OEH  
OEH  
OEH  
OE  
t
t
t
OHO  
OHO  
OHO  
t
t
t
t
t
t
OEA  
CAC  
OEA  
CAC  
OEA  
CAC  
t
t
t
AA  
AA  
AA  
t
t
CPA  
CPA  
t
t
RAC  
t
t
t
OEZ  
t
t
OEZ  
OEZ  
CLZ  
CLZ  
CLZ  
High-Z  
Dout  
Dout 1  
Dout 2  
Dout N  
24  
HM5116405I Series  
EDO Page Mode Mix Cycle (1)  
t
RP  
t
RASP  
RAS  
t
CRP  
t
T
t
t
t
CP  
CP  
CP  
t
t
t
t
CAS  
CAS  
CAS  
CAS  
CAS  
t
CSH  
t
RSH  
tRCD  
t
t
tRCS  
RRH  
RCH  
tWCS  
tRCS  
tWCH  
t
t
WE  
CPW  
AWD  
tWP  
t
RAL  
tCAH  
tASC  
tRAH  
tASC  
t
tASC tCAH  
tCAH  
CAH  
tASC  
tASR  
Address  
Row  
Column 1  
t
Column 2  
t
Column 3  
t
Column 4  
CAL  
CAL  
CAL  
t
t
RDD  
CAL  
t
t
CDD  
DH  
t
t
DH  
Din 1  
DS  
t
DS  
High-Z  
Din  
Din 3  
t
OED  
t
WED  
OE  
t
t
OFR  
WEZ  
t
CPA  
CPA  
t
t
t
t
CPA  
t
AA  
t
AA  
t
OEZ  
OEZ  
t
t
t
OEA  
AA  
CAC  
OHO  
t
CAC  
tOHO  
t
t
OEA  
CAC  
t
t
OFF  
OH  
t
DOH  
Dout  
Dout 2  
Dout 3  
Dout 4  
25  
HM5116405I Series  
EDO Page Mode Mix Cycle (2)  
t
RNCD  
t
RP  
t
RASP  
RAS  
CAS  
t
CRP  
t
t
T
t
CSH  
t
CP  
CP  
t
t
t
t
CAS  
CAS  
CAS  
CAS  
tRCD  
tRCS  
tRCHR  
t
RSH  
t
RCS  
t
RRH  
RCH  
tWCS  
tWCH  
t
RCS  
tRCH  
t
tWP  
t
WE  
CPW  
t
RAL  
tASC  
tRAH  
t
CAH  
tASC  
tASC tCAH  
tCAH  
tCAH  
tASC  
tASR  
Address  
Row  
Column 1  
Column 2  
t
Column 3  
t
Column 4  
t
t
CAL  
CAL  
CAL  
CAL  
t
DS  
t
t
RDD  
CDD  
t
t
t
DH  
DS  
DH  
High-Z  
Din  
Din 2  
Din 3  
t
t
OED  
t
COP  
OED  
t
WED  
t
COL  
OE  
t
OFR  
WEZ  
t
t
OEA  
t
t
t
t
CPA  
t
AA  
t
CPA  
t
OEA  
AA  
OEZ  
t
t
AA  
OEZ  
t
CAC  
t
t
CAC  
OEZ  
OHO  
t
t
CAC  
RAC  
t
OEA  
t
t
t
OFF  
OH  
t
OHO  
OHO  
Dout  
Dout 1  
Dout 4  
Dout 3  
26  
HM5116405I Series  
Test Mode Cycle *19  
*,**  
Reset Cycle  
Set Cycle**  
Test Mode Cycle  
Normal Mode  
RAS  
CAS  
WE  
*
CBR or RAS-only refresh  
** Address, Din, OE: H or L  
27  
HM5116405I Series  
Test Mode Set Cycle  
t
RC  
t
t
t
RP  
RP  
RAS  
RAS  
t
t
t
t
t
CRP  
RPC  
CSR  
CHR  
RPC  
t
T
CAS  
WE  
t
t
t
t
CP  
CP  
WTS  
WTH  
Address  
t
OFR  
t
OFF  
High-Z  
Dout  
28  
HM5116405I Series  
Package Dimensions  
HM5116405SI/LSI Series (CP-26/24DB)  
Unit: mm  
16.90  
17.27 Max  
26  
1
21 19  
14  
13  
6
8
0.74  
1.30 Max  
1.27  
0.10  
6.71 ± 0.25  
0.43 ± 0.10  
0.41 ± 0.08  
2.54  
Hitachi Code  
JEDEC Code  
EIAJ Code  
Weight  
CP-26/24DB  
MO-077-AA  
SC-632-A  
0.8 g  
29  
HM5116405I Series  
When using this document, keep the following in mind:  
1. This document may, wholly or partially, be subject to change without notice.  
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of  
this document without Hitachi’s permission.  
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any  
other reasons during operation of the user’s unit according to this document.  
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and  
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual  
property claims or other problems that may result from applications based on the examples described  
herein.  
5. No license is granted by implication or otherwise under any patents or other rights of any third party or  
Hitachi, Ltd.  
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL  
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company.  
Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are  
requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL  
APPLICATIONS.  
Revision Record  
Rev. Date  
1.0 Mar. 17, 1997  
Contents of Modification  
Drawn by Approved by  
Initial issue  
30  

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