HVC133 [HITACHI]

Silicon Epitaxial Planar Pin Diode for High Frequency Switching; 硅外延平面PIN二极管的高频开关


型号：	HVC133
厂家：	HITACHI SEMICONDUCTOR
描述：	Silicon Epitaxial Planar Pin Diode for High Frequency Switching 硅外延平面PIN二极管的高频开关 PIN二极管开关测试光电二极管
文件：	总6页 (文件大小：26K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HVC133

Silicon Epitaxial Planar Pin Diode for High Frequency Switching

ADE-208-423B(Z)

Rev. 2

Feb 2000

Features

•

Low capacitance.(C1=1.0pF max)

Low forward resistance. (rf=0.7Ω max)

Ultra small Flat Package (UFP) is suitable for surface mount design.

Ordering Information

Type No.

Laser Mark

Package Code

HVC133

UFP

Outline

Cathode mark

Mark

1. Cathode

2. Anode

HVC133

Absolute Maximum Ratings (Ta = 25°C)

Item

Symbol

V_R

Value

Unit

Reverse voltage

Power dissipation

Junction temperature

Storage temperature

P_d

150

°C

125

Tstg

-55 to +125

°C

Electrical Characteristics (Ta = 25°C)

Item

Symbol Min

Typ Max Unit Test Condition

Reverse voltage

Reverse current

Forward voltage

Capacitance

V_R

I_R

—

I_R= 1µA

100

0.85

1.0

0.9

V_R= 25V

V_F

C₁

C₆

I_F= 2 mA

V_R= 1V, f = 1 MHz

V_R= 6V, f = 1 MHz

Forward resistance r_f

0.55 0.7

Ω

I_F= 2mA, f = 100 MHz

HVC133

Main Characteristic

-10

10^-2

10^-4

10^-6

10^-8

-11

Ta= 75°C

Ta= 50°C

10^-12

Ta= 75°C

Ta= 50°C

10^-13

10^-10

Ta= 25°C

-12

-14

0.6

0.8

0.2

0.4

1.0

Forward voltage V_F(V)

Reverse voltage V_R(V)

Fig.1 Forward current Vs. Forward voltage

Fig.2 Reverse current Vs. Reverse voltage

10³

f=1MHz

f=100MHz

10²

10¹

1.0

0.1

10^-1

-2

-4

10^-5

Forward current I_F(A)

10^-3

1.0

0.1

Reverse voltage V_R(V)

Fig.4 Forward resistance Vs. Forward current

Fig.3 Capacitance Vs. Reverse voltage

HVC133

Package Dimensions

Unit: mm

1.2 ± 0.10

1.6 ± 0.10

Hitachi Code

JEDEC

EIAJ

UFP

—

Conforms

0.0016 g

Mass

HVC133

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,

Hitachi bears no responsibility for problems that may arise with third party’s rights, including

intellectual property rights, in connection with use of the information contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you have

received the latest product standards or specifications before final design, purchase or use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,

contact Hitachi’s sales office before using the product in an application that demands especially high

quality and reliability or where its failure or malfunction may directly threaten human life or cause risk

of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,

traffic, safety equipment or medical equipment for life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly

for maximum rating, operating supply voltage range, heat radiation characteristics, installation

conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used

beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable

failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-

safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other

consequential damage due to operation of the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without

written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor

products.

HVC133

Hitachi, Ltd.

Semiconductor & Integrated Circuits.

Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109

URL

NorthAmerica

Europe

: http:semiconductor.hitachi.com/

: http://www.hitachi-eu.com/hel/ecg

Asia (Singapore)

Asia (Taiwan)

: http://www.has.hitachi.com.sg/grp3/sicd/index.htm

: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm

Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm

Japan

: http://www.hitachi.co.jp/Sicd/index.htm

For further information write to:

Hitachi Semiconductor

(America) Inc.

Hitachi Europe GmbH

Hitachi Asia (Hong Kong) Ltd.

Group III (Electronic Components)

7/F., North Tower, World Finance Centre,

Harbour City, Canton Road, Tsim Sha Tsui,

Kowloon, Hong Kong

Tel: <852> (2) 735 9218

Fax: <852> (2) 730 0281

Hitachi Asia Pte. Ltd.

16 Collyer Quay #20-00

Hitachi Tower

Singapore 049318

Tel: 535-2100

Electronic components Group

Dornacher Stra§e 3

D-85622 Feldkirchen, Munich

Germany

Tel: <49> (89) 9 9180-0

Fax: <49> (89) 9 29 30 00

179 East Tasman Drive,

San Jose,CA 95134

Tel: <1> (408) 433-1990

Fax: <1>(408) 433-0223

Fax: 535-1533

Hitachi Asia Ltd.

Taipei Branch Office

3F, Hung Kuo Building. No.167,

Tun-Hwa North Road, Taipei (105)

Tel: <886> (2) 2718-3666

Fax: <886> (2) 2718-8180

Telex: 40815 HITEC HX

Hitachi Europe Ltd.

Electronic Components Group.

Whitebrook Park

Lower Cookham Road

Maidenhead

Berkshire SL6 8YA, United Kingdom

Tel: <44> (1628) 585000

Fax: <44> (1628) 778322

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