HM2006 [HMSEMI]
High and Low Side Driver;型号: | HM2006 |
厂家: | H&M Semiconductor |
描述: | High and Low Side Driver |
文件: | 总5页 (文件大小:549K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HM2006
High and Low Side Driver
General Description
The HM2006 is a high voltage, high speed power MOSFET and IGBT driver based on P_SUB P_EPI process.
The floating channel driver can be used to drive two N-channel power MOSFET or IGBT independently which
operates up to 120 V. Logic inputs are compatible with standard CMOS or LSTTL output, down to 3.3V logic.
The output drivers feature a high pulse current buffer stage designed for minimum driver cross -conduction.
Propagation delays are matched to simplify use in high frequency applications. It has two versions HM2006A &
HM2006B.
Features
Packages/Order information
z
z
z
Fully operational to +120 V
3.3 V logic compatible
Floating channel designed for bootstrap
operation
Gate drive supply range from 10 V to 20 V
Output Source / Sink Current Capability
450mA /
900mA
z
z
z
Independent Logic Inputs to Accommodate All
Topologies
z
z
-5V negative Vs ability
Matched propagation delay for both channels
Part number
HM2006A
HM2006B
Order Code
HM2006A
HM2006B
Package
SOIC8
SOIC8
Applications
z
Small and medium- power motor driver
Power MOSFET or IGBT driver
z
Typical Application Circuit
Version 1.1
1 / 6
January 21, 2015
HM2006
Pin Description
1
VCC
Low side and main power supply
Logic input for high side gate driver output (HO)
Logic input for low side gate driver output (LO)
Ground
2
3
HIN
LIN(LIN)
4
COM
Low side gate drive output
5
LO
High side floating supply return or bootstrap return
High side gate drive output, in phase with HIN
High side floating supply
6
7
8
VS
HO
VB
Functional Block Diagram
Version 1.1
2 / 6
January 21, 2015
HM2006
Absolute Maximum Ratings [Note1]
Symbol
VB
Definition
MIN.
-0.3
MAX.
130
Units
High side floating supply
High side floating supply return
High side gate drive output
Low side and main power supply
Low side gate drive output
Logic input of HIN & LIN
VS
VB – 22
VS -0.3
-0.3
VB + 0.3
VB + 0.3
22
VHO
VCC
VLO
VIN
V
-0.3
VCC + 0.3
VCC + 0.3
-0.3
HBM Model
2.5
kV
V
ESD
Machine Model
200
PD
RthJA
TJ
Packa
ge Power Dissipation @ TA
8 Lead SOIC
8 Lead SOIC
--
--
0.625
200
W
Thermal Resistance Junction to
Junction Temperature
Storage
Lead Temperature (Soldering, 10 seconds)
°C /W
--
-55
--
150
150
300
TS
°C
TL
Note 1: Exceeding these ratings may damage the device.
Recommended Operating Conditions
Symbol
Definition
MIN.
VS +10
-
MAX.
Units
VB
VS +20
120
VB
High side floating supply
High side floating supply return
High side gate drive output voltage
Low side supply
VS
VHO
VCC
VLO
VIN
TA
VS
10
0
V
20
VCC
VCC
125
Low side gate drive output voltage
Logic input voltage(HIN & LIN)
Ambient temperature
0
-40
℃
Dynamic Electrical Characteristics
VBIAS (VCC, VBS) = 15V, CL = 1000 pF and TA = 25°C unless otherwise specified.
Symbol
tonH
Definition
TYP
MAX.
250
Units
.
High side turn-on propagation delay
High side turn-off propagation delay
Low side turn-on propagation delay
Low side turn-off propagation delay
Delay matching
220
toffH
90
120
ton
100
90
120
L
toff
110
ns
L
MT
tr
120
70
150
Turn-on rise time
90
tf
Turn-off fall time
60
80
Version 1.1
3 / 6
January 21, 2015
HM2006
Static Electrical Characteristics
VBIAS (VCC, VBS) = 15V, CL = 1000 pF and TA = 25°C unless otherwise specified.
Symbol
VIH
Definition
MIN.
TYP.
MAX.
-
Units
Logic “1”(HIN & LIN) input voltage
Logic “0” (HIN & LIN) input voltage
High level output voltage, VBIAS - VO
Low level output voltage, VO
2.5
-
VIL
-
-
-
-
-
-
0.8
0.3
0.3
270
55
V
VOH
-
VOL
-
IQC
Quiescent VCC supply current
150
30
-
C
IQBS
ILK
Quiescent VB supply current
Leakage current from VS(600V) to GND
Logic “1” input bias current
50
μA
IIN
-
-
6
10
+
IIN-
IO+
IO-
Logic “0” input bias current
1
2
Output high short circuit pulsed current
Output low short circuit pulsed current
450
900
mA
Logic Function
A version
B version
Timing
Spec
Version 1.1
4 / 6
January 21, 2015
HM2006
Package Information
SOIC8 Package Dimensions
Size
MIN(mm)
Symbol
Size
Symbol
TYP(mm)
MAX(mm)
MIN(mm)
TYP(mm)
MAX(mm)
A
A1
A2
A3
b
-
-
-
1.75
0.225
1.50
0.70
0.48
0.43
0.26
0.21
D
E
4.70
5.80
3.70
4.90
5.10
6.20
4.10
0.10
1.30
0.60
0.39
0.38
0.21
0.19
6.00
1.40
0.65
-
E1
e
3.90
1.27BSC
h
0.25
0.50
-
0.50
0.80
b1
c
0.41
-
L
-
L1
θ
1.05BSC
-
c1
0.20
0
8
Package
Outlines
Mark
Packag
HM2006
SOIC8
Version 1.1
5 / 6
January 21, 2015
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