HM3800S [HMSEMI]

BOOST CONVERT CONTROL IC;
HM3800S
型号: HM3800S
厂家: H&M Semiconductor    H&M Semiconductor
描述:

BOOST CONVERT CONTROL IC

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HM3800S  
BOOST CONVERT CONTROL IC  
GENERAL DESCRIPTION  
The HM3800 is a boost topology switching regulator control IC for battery-used applications  
field. The HM3800 includes a totem-pole single output stage for driving NPN transistor or  
N-MOS, high precision reference (0.5V) for comparing output voltage with feedback amplifier,  
an internal dead-time control for controlling the minimum duty cycle, programmable soft start  
with short circuit protection function and logic level control for operating mode or standby  
mode.  
FEATURES  
˙Wide supply voltage operating range: 1.8 to 15V  
˙Reference voltage precision: 4%  
˙Low current consumption: Operation Mode 5.5mA  
Standby-by Mode 1μA  
SOP8  
˙High speed oscillator frequency: 1MHz max.  
˙Programmable Soft Start function (SS)  
˙Short Circuit Protection function(SCP)  
˙Totem-pole output with adjustable on/off current  
(for NPN transistors or n-channel MOSFET)  
˙Logic level control stand-by mode function  
˙Package: SOP8/TSSOP8/MSOP8/SOP8(EP)  
TSSOP8  
TYPICAL APPLICATION  
˙Digital Camera  
˙PDA  
MS OP8  
˙Portable Equipment  
1
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HM3800S  
FUNCTIONAL BLOCK DIAGRAM  
3
7
Reference  
voltage supply  
Sawtooth wave  
oscillator  
0.8V  
0.1V  
5
1.25V  
0.1V  
PWM  
Comp.  
30 Ω  
k
1
8
36kΩ  
+
+
+
Output drive  
control circuit  
+
Error Amp.  
500KΩ  
0.5V  
DTC 0.6V  
0.22V  
Soft start &  
SCP circuit  
6
2
4
PIN DESCRIPTION  
MARK VIEW  
Name No. I/O  
Description  
FB  
SCP  
VCC  
1
2
3
I
Error amplifier inverting input pin  
Connected a capacitor  
Soft start and SCP function pin  
IC power supply  
1
2
3
4
8
7
6
5
I
P
I
BR/CTL 4  
Output current setting and control pin  
Totem-pole output  
OUT  
GND  
5
6
O
P
IC ground  
Capacitor and resistor connected for  
the frequency of oscillation  
OSC  
7
8
I
COMP  
O
Error amplifier compensation output  
2
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HM3800S  
ORDER INFORMATION  
Part Number  
HM3800S-LF  
HM3800SR-LF  
HM3800T-LF  
HM3800TR-LF  
HM3800E-LF  
HM3800ER-LF  
Operating Temperature  
Package  
Description  
-10°C ~ +85°C  
SOP8  
Tube  
-10°C ~ +85°C  
-10°C ~ +85°C  
SOP8  
TSSOP8  
Tape & Reel  
Tube  
-10°C ~ +85°C  
-10°C ~ +85°C  
TSSOP8  
SOP8-EXPOSED PAD  
Tape & Reel  
Tube  
-10°C ~ +85°C  
SOP8-EXPOSED PAD  
Tape & Reel  
IC DATE CODE DISTINGUISH  
HM38  
HM3800  
8
-
L
Lead Free  
Lot Number  
Mass Production Version  
Per Half Month  
Year  
FOR EXAMPLE:  
January  
A (Front Half Month), B (Last Half Month)  
C, D  
February  
March  
E, F  
------------And so on  
Lot Number is the last two numbers  
3
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HM3800S  
ABSOLUTE MAXIMUM RATINGS  
Power supply voltage--------------------------------------------------------------------------- +15V  
Output source current-------------------------------------------------------------------------- -50mA  
Output sink current----------------------------------------------------------------------------- +50mA  
Allowable dissipation  
SOP8 Ta+25------------------------------------------------------------------------- 570mW  
MSOP8 Ta+25------------------------------------------------------------------------ 400mW  
TSSOP8 Ta+25------------------------------------------------------------------------- 400mW  
SOP8-EXPOSED PAD  
Ta+25------------------------------------------------- 600mW  
Operating temperature---------------------------------------------------------------------- -10℃~+85℃  
Storage temperature------------------------------------------------------------------------ -55℃~+125℃  
Junction breakdown Temperature--------------------------------------------------------- +125  
SOP8 Lead Temperature (soldering, 10 sec) ------------------------------------------- +260℃  
TSSOP8 Lead Temperature (soldering, 10 sec) --------------------------------------- +260℃  
MSOP8 Lead Temperature (soldering, 10 sec) ---------------------------------------- +260℃  
260/sec  
260℃  
-1.2/sec  
+0.23/sec  
210℃  
180℃  
+3.4/sec  
25℃  
280s  
15s  
60s  
190s  
IR Re-flow Soldering Curve  
4
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HM3800S  
DC ELECTRICAL CHARACTERISTICS (Ta=25,VCC=2V, unless otherwise noted)  
Under Voltage Lock-Out section (U.V.L.O.)  
PARAMETER  
Low threshold voltage  
Upper threshold voltage  
SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT  
VLOW  
--  
--  
-
-
0.9  
1.5  
V
V
VUPPER  
1.1  
1.3  
Soft Start section (S.S.)  
PARAMETER  
SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT  
μA  
Input source current  
Soft start threshold voltage  
ISS  
VSCP= 0V  
--  
-1.5  
0.8  
-1.0  
0.9  
-0.7  
1.0  
VSST  
V
Short Circuit Protection section (S.C.P.)  
PARAMETER  
Input source current  
S.C.P. threshold voltage  
SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT  
μA  
ISCP  
VSCP= 0V  
--  
-1.5  
0.7  
-1.0  
0.8  
-0.7  
0.9  
VSCP  
V
Oscillator section  
PARAMETER  
SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT  
Oscillation frequency  
Frequency change with  
voltage  
f
RT=3.0KΩ,CT=270pF  
400  
500  
600  
KHz  
Δf / ΔV  
VCC=2V to 15V  
-
2
10  
%
Frequency change with  
temperature  
Ta = 0to 85℃  
Δf / ΔT  
-
5
-
%
Idle Period Adjustment section  
PARAMETER  
SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT  
RT=3.0kΩ, CT=270pF,  
Maximum duty cycle  
TDUTY  
75  
-
85  
%
VFB=0.8V  
Total device section  
PARAMETER  
SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT  
Stand-by current  
ISTANDBY  
IAVE  
Pin4 is open or VCC  
-
-
-
1
μA  
Average supply current  
RB=390Ω,VCC=0~20V  
5.0  
10  
mA  
5
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HM3800S  
DC ELECTRICAL CHARACTERISTICS (Cont.)  
Error Amplifier section  
PARAMETER  
Input threshold voltage  
VT change with voltage  
SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT  
VFB  
VCOMP=450mV  
495  
500  
5
505  
20  
-
mV  
mV  
%
ΔVFB / ΔV  
VCC=2V to 15V  
-
Ta = -10to 85℃  
VT change with temperature ΔVFB / ΔT  
-
1
Input bias current  
IB  
Av  
--  
-1.0  
-0.2  
100  
6
1.0  
-
μA  
Voltage Gain  
--  
-
V/V  
MHz  
Frequency bandwidth  
Output voltage Positive  
BW  
Av=0 dB  
-
0.78  
-
-
VPOS  
VNEG  
ISOURCE  
ISINK  
--  
--  
0.87  
0.05  
-40  
40  
-
V
Swing  
Negative  
0.2  
-24  
-
Output source current  
Output sink current  
-
μA  
μA  
VCOMP=450mV  
24  
Output section  
PARAMETER  
SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT  
Output high voltage  
VOH1  
VOH2  
VOL1  
VOL2  
RB=390Ω, IO=-15mA  
RB=750Ω, IO=-10mA,  
VCC= 1.8V  
1.0  
0.8  
-
1.2  
1.0  
0.1  
0.1  
-
V
V
V
V
Output high voltage  
-
Output saturation voltage  
Output saturation voltage  
RB=390Ω, IO=15mA  
RB=750Ω, IO=10mA,  
VCC= 1.8V  
0.2  
0.2  
-
Output source current  
Output sink current  
IOSOURCE RB=390Ω, Vo=0.9V  
-
-40  
40  
-20  
-
mA  
mA  
kΩ  
IOSINK  
RO  
RB=390Ω, Vo=0.3V  
30  
20  
Internal pull-down resistor  
--  
30  
40  
Output Current Setting / Control section  
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT  
Pin voltage  
VBR  
RB  
RB=390Ω  
0.15  
300  
0.22  
390  
0.3  
V
Output current setting  
resistance  
Ω
-
5000  
Input off condition  
Input on condition  
Pin current range  
IOFF  
ION  
IBR  
--  
--  
--  
-20  
-
-
-
-
0
μA  
μA  
-45  
-0.1  
-1.8  
mA  
6
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HM3800S  
TYPICAL CHARACTERISTICS  
Supply Voltage  
VS  
Input Threshold Voltage  
Supply Voltage VS Supply Current  
12  
1.2  
1.0  
Ta=25  
RB=390Ω  
Ta=25℃  
10  
8
6
4
2
0
0.8  
0.6  
0.4  
0.2  
0
8
8
0
4
12  
16  
20  
0
4
12  
16  
20  
Supply Voltage (V)  
Figure 1  
Supply Voltage (V)  
Figure 2  
Ambient Temperature  
VS  
High Level Output  
Input Threshold Voltage Variation Ratio  
1.2  
1.0  
30  
VCC=2V  
VCC=2V  
RB=390Ω  
Ta=25℃  
10  
0.8  
5
0
0.6  
0.4  
0.2  
- 5  
-10  
-15  
0
-10  
-20  
-30  
-40  
-50  
0
-25  
0
25  
50  
75  
100  
High Level Output Current Iout (mA)  
Figure 4  
Ambient Temperature Ta ()  
Figure 3  
BR/CTL Pin Current  
VS  
Output Source Current  
Low Level Output  
600  
500  
400  
300  
200  
100  
-60  
-50  
-40  
-30  
-20  
-10  
VCC=2V  
RB=390Ω  
Ta=25℃  
VCC=2V  
Vout=0.9V  
Ta=25℃  
0
0
20  
40  
60  
80  
100  
-0.4  
-0.8  
-1.2  
-1.6  
-2.0  
0
0
BR/CTL Pin Current IBR (mA)  
Figure 6  
Low Level Output Current Iout (mA)  
Figure 5  
7
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HM3800S  
TYPICAL CHARACTERISTICS (Cont.)  
BR/CTL Pin Current  
VS  
BR/CTL Pin Current  
VS  
BR/CTL Pin Voltage  
Supply Current  
600  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
VCC=2V  
Ta=25℃  
VCC=2V  
Ta=25℃  
500  
400  
300  
200  
100  
0
0
-0.4  
-0.8  
-1.2  
-1.6  
-2.0  
-20  
-40  
-60  
-80  
-100  
0
0
BR/CTL Pin Current IBR (μA)  
BR/CTL Pin Current IBR(mA)  
Figure 7  
Figure 8  
Supply Voltage  
VS  
Frequency Variation Ration  
Triangle Oscillator Frequency  
VS  
15  
10  
5
Timing Resistance  
1M  
VCC=2V  
Ta=25℃  
CT=270PF  
RT=3.0KΩ  
Ta=25℃  
C
C
= 100 pF  
T
T
100K  
0
= 1000 pF  
-5  
10K  
2K  
-10  
-15  
C
= 10000 pF  
T
8
0
4
12  
16  
20  
10K  
40K 100K  
400K 1M  
1K  
4K  
Supply Voltage VCC (V)  
Figure 10  
Timing Resistor Rt (Ω)  
Figure 9  
Ambient Temperature  
VS  
Frequency Variation Ration  
30  
10  
5
VCC=2V  
CT=270PF  
RT=3.0LΩ  
0
-
5
-10  
-15  
-25  
0
25  
50  
75  
100  
Ambient Temperature Ta ()  
Figure 11  
8
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HM3800S  
TIMING WAVEFORM  
COMP Pin Voltage  
Reference Input For Short  
Circuit Detection Comparator  
Idle Period Setting Voltage  
Soft Start Setting Voltage  
OUT Pin Waveforms  
SCP Pin Waveforms  
tpe  
Output  
Short  
Circuit  
Soft Start  
ts  
Output Short Circuit  
ON  
Power Supply Control SW  
OFF  
Short Circuit  
Detection  
HM3800 Timing Diagram  
9
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HM3800S  
DETAILED DESCRIPTION  
Voltage reference  
A 1.25V regulator operating from VCC is used to power the internal circuitry of the HM3800. An  
internal resistive divider provides 0.5V reference for the error amplifier, Soft-start (typ. 0.9V)  
and SCP (typ. 0.8V) circuits.  
Error amplifier  
The error amplifier compares a sample of the dc-dc converter output voltage to the 0.5V  
reference and generates an error signal for the PWM comparator. Output voltage of dc-dc  
converter is setting with the resistor divider using the following expression (see fig12):  
R1  
R2  
æ
ö
÷
ø
Vout = 1+  
*0.5  
ç
è
VOUT  
R1  
R2  
Error Amplifier  
1
36K  
0.5V  
500  
HM3800  
8
C1  
Figure 12. Error Amplifier with Feedback resistance divider  
Oscillator  
The oscillator frequency can be set between 20KHz and 500KHz by connecting a resistor and  
a capacitor at OSC pin of HM3800 to ground. The oscillator frequency can be determined by  
using the graph shown in Figure 9.  
The oscillator output is a sawtooth wave with a minimum value of approximately 0.1V and a  
maximum value of approximately 0.8V. The PWM comparator compares the oscillator voltage  
with error amplifier output voltage; internal DTC voltage (typ. 0.6V) and soft start setting  
voltage. When the sawtooth wave voltage is low than above three-output voltage, the output of  
HM3800 is high (Turn on NPN transistor or NMOS).  
10  
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HM3800S  
Under voltage lockout (UVLO)  
The under voltage lockout circuits turn the output off and whenever the supply voltage drops  
too low (approximately 0.9V at 25) for proper operation. A hysteresis voltage of 200mV  
eliminates false triggering on noise and chattering.  
Soft Start/ Short-circuit protection (S.S. / S.C.P.)  
The soft start is functional after power on, and the interval of soft start time is determined by a  
capacitor connected to SCP pin (pin 2). When soft start function finished, the internal soft start  
voltage is setting high, but external SCP pin is setting low in order to change to short circuit  
detection / protection function.  
The time of soft start is following expression:  
Tss = 0.35*C  
[mF  
]
The short circuit protection is functional due to a heavy loading drop and output of error  
amplifier (COMP pin) is maintain a VPOS (typ. 0.9V), the capacitor is charged until SCP  
threshold voltage (typ. 0.8V), then HM3800 output is disable (internal pull-low) and the  
capacitor is discharged to low.  
The time of short circuit protection is following expression:  
Tscp = 0.8*C  
[mF  
]
11  
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HM3800S  
Output transistor  
The HM3800 has a totem-pole transistor with a 40mA source/sink current rating to drive an  
external NPN transistor or NMOS directly. The driving current capability depends on a resistor  
R that is connected to BR/CTL pin (Pin4) of HM3800. (see fig. 14)  
HM3800  
4
BR/CTL  
R
Control  
Q1  
Figure 13. Output transistor driving control circuit  
BR/CTL pin can also use to control the output of HM3800 for disable or enable function of  
system.  
Control Pin  
Low  
Q1  
Off  
On  
BR/CTL Pin Output Transistor Function  
Mode  
Open  
Disable  
Enable  
Stand-by  
Operation  
High  
Bias Current  
12  
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HM3800S  
APPLICATION NOTE (1)  
L1  
20uH  
SCD34  
D1  
Vin +12V  
Vout +24V/1A  
IC1  
FB  
R1  
C2  
COMP  
OSC  
R2  
47k 1%  
SCP  
C1  
0.027uF  
VCC  
GND  
0
R3  
Q2  
C7  
220uF/25V  
1
C8  
C4  
BR/CTL OUT  
0.1uF  
100uF/35V  
HM3800  
C5  
0.1uF  
R4  
1k  
R6  
1k 1%  
R5  
3k  
C6  
Q1  
3904  
470pF  
ON/OFF Socket  
Vin  
R7 4.7k  
1
2
SW1  
Figure 14. DC12V to DC24V Boost Regulator  
L1  
20uH  
SCD34  
D1  
C9  
Vin +2.5V ~ +6V  
Vout +3.3V  
IC1  
FB  
10u  
R1  
C2  
COMP  
OSC  
R2  
5.6k 1%  
SCP  
C1  
0.027uF  
VCC  
GND  
L2  
0
R3  
Q2  
20uH  
C7  
220uF/25V  
1
C8  
C4  
BR/CTL OUT  
MOSFET N GDS  
0.1uF  
100uF/35V  
HM3800  
C5  
0.1uF  
R4  
1k  
R6  
1k 1%  
R5  
3k  
C6  
Q1  
3904  
470pF  
ON/OFF Socket  
Vin  
R7 4.7k  
1
2
SW1  
Figure 15. DC2.5V~DC6V to DC3.3V SEPIC Regulator  
13  
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HM3800S  
APPLICATION NOTE (2)  
L1  
Pmos HM2305  
33uH  
Vout +1.8V  
Q1  
Vin +3.3V  
3
2
R1  
C1  
IC1  
1
R2  
10k  
8
7
6
5
R3  
100  
FB  
COMP  
C2  
C
2
3
4
0.027uF  
C3  
C4  
330uF  
SCP  
VCC  
OSC  
GND  
D1  
SCD34  
R4  
1k  
Q2  
NPN 3904  
BR/CTL OUT  
C5  
0.1uF  
HM3800  
R5  
499  
R6  
3.9k  
R7  
C6  
270pF  
Q3  
NPN 3904  
3.3k  
ON/OFF Socket  
Vin  
R8 4.7k  
1
2
SW1  
Figure 16. DC3.3V to DC1.8V Buck Regulator  
D1  
BAT54S/SOT_0  
2
Q1  
Q2  
Vout3 +17V  
C1  
C2  
0.1uF  
0.1uF  
3
NPN BEC 3904  
PMOS HM2305  
2
3
Q3  
Vout2 -6.8V  
PNP BEC 3906  
1
D2  
BAT54S/SOT_0  
C3  
1uF  
R1  
390  
C4  
1uF  
R2  
2.2k  
C5  
1uF  
R3  
5.6k  
R4  
30k  
R5  
30k  
R6  
R7  
2.2k  
5.1k  
C6  
1uF  
D3  
1
C8  
1uF  
R8  
1
D4  
HM431  
6.8k  
HM431  
R9  
Q4  
NPN 3904  
L1  
L2  
33uH  
33uH  
300k  
R10  
5.1k  
D5 SCD34  
Vin  
C9  
1uF  
Vout1 +9V  
IC1  
FB  
R11  
C11  
1
2
3
4
8
7
6
5
COMP  
OSC  
R12  
51k 1%  
SCP  
C10  
0.027uF  
VCC  
GND  
0
R13  
Q1 NMOS HM3400  
C12  
1
C13  
100uF  
C14  
C15  
100uF  
BR/CTL OUT  
220uF/6.3V  
0.1uF  
R14  
1k  
C16  
0.1uF  
C7  
0.1uF  
HM3800  
R15  
R16  
3k  
C17  
470pF  
3k 1%  
Q6  
NPN 3904  
ON/OFF Socket  
Vin  
R17 4.7k  
1
2
SW1  
Figure 17. Charge Pump DC-DC Converter Circuits  
14  
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HM3800S  
APPLICATION NOTE (3)  
R9  
R8  
V2  
56K  
R10  
1.8K  
R11  
FB  
V3  
33K  
5.1K  
D2 BAT54HT1  
L2 33uH  
+15V  
R12  
3.3K  
V1  
(R9+R8)=17.48*R12  
0.66*(R8+R9)=(R10+R11)  
C8  
100uF/25V  
C9  
47uF/16V  
+
+
D3  
T1  
VCC  
L1 18uH  
F1  
L3  
4
5
6
33uH  
V2  
+5V  
FUSE  
C2  
104  
C1  
+
R7  
C7  
470pF  
7
C10  
100uF/16V  
C11  
47uF/16V  
+
+
330uF  
1
BAT54RCLT1  
8
2
D4  
D6  
8.2  
9
L4  
33uH  
U1  
V3  
+3.3V  
COMP  
1
2
3
4
8
7
6
5
3
10  
FB  
COMP  
Cosc  
GND  
OUT  
C12  
C13  
47uF/16V  
+
+
100uF/16V  
SCP  
C5  
0.1uF  
CLS12  
SCP  
VCC  
CTL  
BAT54RCLT1  
V4  
C6  
C4  
0.47uF  
L5  
CTL  
1
Q3  
33uH  
-7.5V  
HM3400  
R6  
0
HM3800  
R5  
220  
D5 BAT54HT1  
C14  
100uF/16V  
C15  
47uF/16V  
+
+
R1  
Q2  
2N3904  
R4  
33K  
C3  
270pF  
R3  
3K  
ON / OFF  
C16  
1nF  
R2  
10K  
Figure 18. Flyback Multi-output DC-DC Converter Circuits  
15  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  
HM3800S  
PACKAGE OUTLINE  
SOP8  
0.008typ.  
0.016typ  
0.050typ  
D
L
SEATING PLANE  
0.004max  
SYMBOLS  
MIN  
MAX  
A
A1  
D
1.346  
0.101  
4.800  
3.810  
5.791  
0.406  
0
1.752  
0.254  
4.978  
3.987  
6.197  
1.270  
8
E
H
L
θ°  
UNIT:MM  
NOTE:  
1. JEDEC OUTLINE:MS-012 AA  
2. DIMENSIONS DDOES NOT INCLUDE MOLD FLASH,PROTRUSIONS OR GATE BURRS.MOLD  
FLASH,PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED .15mm (.0.06in) PER SIDE  
3. DIMENSIONS EDOES NOT INCLUDE INTER-LEAD FLASH,OR PROTRUSIONS. INTER-LEAD  
FLASH AND PROTRUSIONS SHALL NOT EXCEED .25mm (.0.10in) PER SIDE.  
16  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  
HM3800S  
MSOP8  
8
5
A”  
1
4
0.30  
0.65 BSC  
GAUEGE PLANE  
SEATING PLANE  
θ°  
D
L
L1  
0.05  
SYMBOLS  
MIN  
-
MAX  
1.10  
0.15  
0.95  
A
A1  
A2  
D
0.00  
0.75  
3.00 BSC  
4.90 BSC  
3.00 BSC  
E
E1  
L
0.40  
0
0.80  
8
L1  
θ°  
0.95 REF  
UNIT:MM  
NOTE:  
1.JEDEC OUTLINE:MO-187 AA  
2.DIMENSIONS DDOES NOT INCLUDE MOLD FLASH,PROTRUSIONS OR GATE BURRS.MOLD  
FLASH,PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE  
3.DIMENSIONS E1DOES NOT INCLUDE INTERLEAD FLASH,OR PROTRUSIONS. INTERLEAD  
FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.25 PER SIDE.  
4.DIMENSIONS 0.22DOES NOT INCLUDE DAMBAR PROTRUSIONS.ALLOWABLE DAMBAR  
PROTRUSIONS SHALL BE 0.08 MM TOTAL IN EXCESS OF THE 0.22DIMENSION AT MAXIMUM  
MATERIAL CONDITION.DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE  
FOOT.MINIMIM SPAC BETWEEN PROTRUSION AND ADJACENT LEAD IS 0.07MM.  
5.DIMENSIONS DAND E1TO BE DETERMINED AT DATUM PLANE H  
17  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  
HM3800S  
TSSOP8  
SYMBOLS  
MIN  
-
NOR  
MAX  
1.20  
0.15  
1.06  
3.10  
A
A1  
A2  
D
-
-
0.05  
0.96  
2.90  
1.01  
3.00  
6.40 BSC  
4.40  
0.60  
-
E
E1  
L
4.30  
0.45  
0
4.50  
0.75  
8
θ°  
UNIT:MM  
NOTE:  
1.JEDEC OUTLINE:MO-187 AA  
2.DIMENSIONS DDOES NOT INCLUDE MOLD FLASH,PROTRUSIONS OR GATE BURRS.MOLD  
FLASH,PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE  
3.DIMENSIONS E1DOES NOT INCLUDE INTERLEAD FLASH,OR PROTRUSIONS. INTERLEAD  
FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.25 PER SIDE.  
4.DIMENSIONS 0.22DOES NOT INCLUDE DAMBAR PROTRUSIONS.ALLOWABLE DAMBAR  
PROTRUSIONS SHALL BE 0.08 MM TOTAL IN EXCESS OF THE 0.22DIMENSION AT MAXIMUM  
MATERIAL CONDITION.DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE  
FOOT.MINIMIM SPAC BETWEEN PROTRUSION AND ADJACENT LEAD IS 0.07MM.  
5.DIMENSIONS DAND E1TO BE DETERMINED AT DATUM PLANE H  
18  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  
HM3800S  
SOP8-EXPOSED PAD  
SYMBOLS  
MIN  
MAX  
A
A1  
B
1.346  
0.101  
1.752  
0.254  
1.27 BSC.  
C
0.4064 BSC.  
D
4.800  
3.810  
4.978  
3.987  
E
F
0.2032 BSC.  
G
0.381×45°BSC.  
H
5.791  
0.406  
0
6.197  
1.270  
8
L
θ°  
UNIT:MM  
UNIT:MM  
THERMALLY ENHANCED DIMENSISONS  
PAD SIZE  
E1  
D1  
A
2.057 REF  
2.184 REF  
2.057 REF  
2.971 REF  
A1  
NOTE:  
1. JEDEC OUTLINE:N/A  
2. DIMENSIONS DDOES NOT INCLUDE MOLD FLASH,PROTRUSIONS OR GATE BURRS.MOLD  
FLASH,PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED .15mm (.0.06in) PER SIDE  
3. DIMENSIONS EDOES NOT INCLUDE INTER-LEAD FLASH,OR PROTRUSIONS. INTER-LEAD  
FLASH AND PROTRUSIONS SHALL NOT EXCEED .25mm (.0.10in) PER SIDE.  
19  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  
HM3800S  
PACKING SPECIFICATIONS  
BOX DIMENSION  
TUBE INSIDE BOX AND CARTON  
100mm  
220mm  
FTC Logo  
FTC Logo  
630mm  
BOX  
640mm  
LABEL  
BOX  
LABEL  
190mm  
380mm  
INSIDE BOX  
TUBE CARTON  
TAPE AND REEL INSIDE BOX AND CARTON  
380mm  
362mm  
365mm  
342mm  
FTC label  
50mm  
CARTON  
LABEL  
FTC Logo  
Tape & Reel Carton  
PACKING QUANTITY SPECIFICATIONS  
SOP 8  
MSOP8  
TSSOP8 SOP8-EXPOSED PAD  
SOP 8  
MSOP8 TSSOP8 SOP8-EXPOSED PAD  
100  
80  
160  
100 EA/TUBE  
2500 EA / REEL  
EA/TUBE EA/TUBE EA/TUBE  
100 TUBES / INSIDE BOX  
4 INSIDE BOXES / CARTON  
4 INSIDE BOXES / CARTON  
LABEL SPECIFICATIONS  
Tapping & Reel  
Feeling Technology Corp.  
Product  
Lot No  
D/C  
HM3800  
A3311C62-L  
4Xx-XXL  
Q'ty  
◎~◎  
無鉛  
Lead Free  
20  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  
HM3800S  
CARTON  
Feeling Technology Corp.  
Product Type: HM3800  
Lot No: A3311C62-L  
Date Code: 4Xx-XXL  
Package Type: SOP-8L  
Marking Type: Laser  
無鉛  
Lead Free  
Total Q'ty:  
10,000  
SOP8  
CARRIER TAPE DIMENSIONS  
APPLICATION  
SOP8  
W
P
8.0±0.1  
E
F
D
D1  
+0.3  
1.75±0.1  
5.5±0.1  
1.55±0.1  
1.5+0.25  
12.0  
-0.1  
APPLICATION  
SOP8  
P0  
4.0±0.1  
P1  
AD  
B0  
K0  
t
2.0±0.1  
6.4±0.1  
5.20±0.1 2.1±0.10 0.30±0.013  
21  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  
HM3800S  
REEL DIMENISIONS  
APPLICATION  
SOP8  
MATERIAL  
A
B
C
D
T1  
T2  
PLASTIC REEL  
330±0.1  
62±1.5  
12.75+0.15  
2+0.6  
12.4+0.2  
2.0+0.2  
22  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  
HM3800S  
MSOP8  
CARRIER TAPE DIMENSIONS  
APPLICATION  
MSOP8  
W
P
E
F
D
1.5+0.1  
D1  
12.0±3  
8.0  
1.75±1.0  
5.5±0.5  
1.50  
APPLICATION  
MSOP8  
P0  
P1  
2.0±0.5  
AD  
B0  
K0  
t
4.0±0.1  
4.20  
3.30  
1.20  
0.30±0.5  
(mm)  
23  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  
HM3800S  
REEL DIMENISIONS  
APPLICATION  
MATERIAL  
PLASTIC REEL  
(WHILE)  
A
B
C
D
T1  
T2  
MSOP8  
330±1  
62±1.5  
12.75+0.15  
12.4+0.2  
16.8-0.4  
2±0.15  
24  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  
HM3800S  
TSSOP8  
CARRIER TAPE DIMENSIONS  
APPLICATION  
TSSOP8  
W
P
E
F
D
1.5+0.1  
D1  
12.0±0.3  
8.00  
1.75±1.0 5.5±0.05  
1.50  
APPLICATION  
TSSOP8  
P0  
P1  
AD  
B0  
K0  
t
4.00  
2.00±0.05  
4.20  
3.40  
1.30  
0.30±0.5  
(mm)  
25  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  
HM3800S  
REEL DIMENISIONS  
APPLICATION  
TSSOP8  
MATERIAL  
A
B
C
D
T1  
PLASTIC REEL  
(WHILE)  
13.0+0.5  
12.5  
2±0.5  
330  
100  
.
26  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  
HM3800S  
SOP8-EXPOSED PAD  
CARRIER TAPE DIMENSIONS  
APPLICATION  
SOP8  
W
P
E
F
D
D1  
+0.3  
8.0±0.1  
1.75±0.1  
5.5±0.1  
1.55±0.1  
1.5+0.25  
12.0  
-0.1  
APPLICATION  
SOP8  
P0  
4.0±0.1  
P1  
AD  
B0  
K0  
t
2.0±0.1  
6.4±0.1  
5.20±0.1 2.1±0.10 0.30±0.013  
REEL DIMENISIONS  
APPLICATION  
SOP8  
MATERIAL  
PLASTIC REEL  
(WHILE)  
A
B
C
D
T1  
T2  
330±0.1  
62±1.5  
12.75+0.15  
2+0.6  
12.4+0.2  
2.0+0.2  
27  
Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com  

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