HT7825(SOT-23-5) [HOLTEK]
Regulator;型号: | HT7825(SOT-23-5) |
厂家: | HOLTEK SEMICONDUCTOR INC |
描述: | Regulator |
文件: | 总15页 (文件大小:142K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HT78XX Series
500mA TinyPowerTM LDO
Features
·
·
Output voltage ranges: Fixed range of 1.8V, 2.5V,
Low quiescent current: 4mA (typ.)
2.7V, 3.0V, 3.3V, 5.0V type.
·
Current limiting
·
Highly accuracy: ±2%
·
Over-temperature shutdown
·
Low voltage drop: 360mV (typ.),
·
SOT223, SOT23-5, SOT89, TO92 Packages
V
OUT=5.0V at 500mA
·
Guaranteed output current: 500mA
Applications
·
·
Battery powered systems
PCMCIA cards
·
·
Personal Digital Assistants
Personal Communication Equipment
·
Peripheral cards
General Description
The HT78XX series of positive, linear regulators fea-
tures low quiescent current (4mA typ.) with low dropout
voltage, making them ideal for battery applications. The
devices are capable of supplying 500mA of output cur-
rent continuously.
as fixed voltage regulators, these devices can be used
with external components to obtain variable voltages
and currents.
These rugged devices have Thermal Shutdown and
Current Limiting to prevent device failure under the
²Worst² of operating conditions.
They are available with several fixed output voltages
ranging from 1.8V to 5.0V. Although designed primarily
Selection Table
Part No.
HT7818
HT7825
HT7827
HT7830
HT7833
HT7850
Output Voltage
1.8V
Tolerance
Package
Marking
2.5V
SOT223
SOT23-5
SOT89
TO92
HT78XX (for SOT223)
78XX# (for SOT23-5)
HT78XX# (for SOT89)
HT78XX (for TO92)
2.7V
±2%
3.0V
3.3V
5.0V
Note:
²XX² stands for output voltages.
For lead free devices, TO92 & SOT223 package will add a ²#² mark at the end of the date code, whereas
SOT89 & SOT23-5 packages will add a ²#² mark at the end of the marking.
Rev. 1.10
1
September 30, 2008
HT78XX Series
Block Diagram
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Pin Assignment
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2
2
3
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2
3
-
5
S
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8
9
T
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2
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8
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8
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#
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1
2
3
7
8
X
X
#
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Pin Description
Pin No.
Pin Name
Description
SOT223
SOT23-5
SOT89
TO92
3
5
1
2
4
CE
VOUT
VIN
Chip enable pin, high enable
Output pin
¾
3
¾
3
¾
3
2
2
2
Input pin
1
1
1
GND
NC
Ground pin
No connection
¾
¾
¾
Absolute Maximum Ratings*
Maximum Supply Voltage ............................ up to 8.5V
Storage Temperature .......................... -50°C to 125°C
Operating Temperature ......................... -40°C to 85°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
²*² Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings in-
dicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits.
The guaranteed specifications apply only for the test conditions listed.
Rev. 1.10
2
September 30, 2008
HT78XX Series
Thermal Information
Symbol
Parameter
Package
SOT223
SOT23-5
SOT89
TO92
Max.
134
Unit
°C/W
°C/W
°C/W
°C/W
W
Thermal Resistance
(Junction to Ambient)
(Assume no ambient airflow,
no heat sink)
500
qJA
200
200
SOT223
SOT23-5
SOT89
TO92
0.75
0.20
0.50
0.50
W
PD
Power Dissipation
W
W
Note: PD is measured at Ta= 25°C
Electrical Characteristics
Tj=25°C, VIN=VOUT+1.0V, IO=1mA, unless otherwise specified
Symbol
VIN
Parameter
Input Voltage
Test Conditions
Min.
¾
Typ.
¾
Max.
8
Unit
V
¾
¾
Output Voltage Tolerance
Quiescent Current
2
%
DVOUT
-2
¾
¾
ISS
IO=0mA, VCE=VIN
1mA£IOUT£500mA
VO£1.8V
4
7
mA
Load Regulation (Note1)
0.004
800
500
360
0.2
¾
0.008
1200
650
500
0.3
¾
%/mA
DVLOAD
¾
¾
DVOUT=2%
OUT=500mA
VDROP
Dropout Voltage (Note2)
mV
2.5V£VO£2.7V
3.0V£VO£5.0V
¾
I
¾
Line Regulation
%/V
mA
V
DVLINE
ILIM
VOUT+1.0V£VIN£8.0V
DVOUT=10%
¾
Current Limit (Note3)
CE Input High Threshold
CE Input Low Threshold
Shutdown Current
500
2.0
¾
VIH
VOUT+1V£VIN£8V
VOUT+1V£VIN£8V
CE input voltage£0.8V
¾
¾
VIL
0.8
1
V
¾
ISD
0.5
¾
mA
D
V
O U T
Temperature Coefficient
-40°C<Ta<85°C
¾
±0.8
¾
mV/°C
D
T
a
Note: 1. Load regulation is measured at a constant junction temperature, using pulse testing with a low ON time and
is guaranteed up to the maximum power dissipation. Power dissipation is determined by the input/output
differential voltage and the output current. Guaranteed maximum power dissipation will not be available over
the full input/output range. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) - Ta) / qJA
.
2. Dropout voltage is defined as the input voltage minus the output voltage that produces a 2% change in the
output voltage from the value at VIN = VOUT+1V with a fixed load.
3. Current limit is measured by pulsing for a short time.
Rev. 1.10
3
September 30, 2008
HT78XX Series
Application Circuits
Basic Circuits
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8
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1
C
2
2
1
m
F
m
. 2 F
C
o
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7
8
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X
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1
C
2
2
H
G
N
D
L
1
m
F
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. 2 F
C
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n
C
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S
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Typical Application Circuits
·
High output current positive voltage regulator
I
C 1
T
r
1
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8
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C
1
C
2
1
0
m
F
m
1 0 F
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V
B
E
1
R
1
=
,
I
C 1
R
E
G
b
( 1 + )
I
O
=
I
C
1
+
I
R
E
G
Rev. 1.10
4
September 30, 2008
HT78XX Series
·
Increased Output voltage Circuit
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8
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1
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2
V
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1
1
0
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F
m
1 0 F
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2
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C
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R2
VOUT = VXX (1+
) + ISS R2
R1
·
Dual Supply Circuit
I
C
1
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T
7
8
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X
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1
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C
3
V
X
X
1
I
C
2
G
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1
m
0 F
V
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T
7
8
X
X
V
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V
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2
C
1
C
2
G
N
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V
X
X
2
R
1
1
0
m
F
m
1 0 F
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VOUT1 = VXX2 + VXX1
VOUT2 = VXX2
·
Tracking Voltage Regulator
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H
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8
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X
S
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1
C
2
R
A
G
N
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1
m
0 F
1
m
0 F
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R
B
-
V
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B
A
-VO = VOUT
x
R
Rev. 1.10
5
September 30, 2008
HT78XX Series
Package Information
3-pin SOT223 Outline Dimensions
q
D
L
E
1
E
A
1
e
A
2
e
1
A
c
b
Dimensions in mm
Nom.
Symbol
Min.
¾
Max.
1.8
0.10
1.7
0.84
0.35
6.7
7.3
3.7
¾
A
A1
A2
b
¾
¾
¾
¾
¾
¾
¾
¾
2.3
4.6
¾
¾
0.02
1.5
0.66
0.23
6.3
6.7
3.3
¾
C
D
E
E1
e
e1
L
¾
¾
0.75
0°
¾
q
10°
Rev. 1.10
6
September 30, 2008
HT78XX Series
5-pin SOT23-5 Outline Dimensions
D
C
L
E
H
q
e
A
A
2
b
A
1
Dimensions in mm
Nom.
Symbol
Min.
1
Max.
1.3
0.1
0.9
0.50
0.25
3.1
1.8
¾
A
A1
A2
b
¾
¾
¾
¾
¾
¾
¾
1.9
¾
¾
¾
¾
0.7
0.35
0.10
2.7
1.4
¾
C
D
E
e
H
L
2.6
0.37
1°
3.0
¾
q
9°
Rev. 1.10
7
September 30, 2008
HT78XX Series
3-pin SOT89 Outline Dimensions
I
A
B
J
C
E
D
G
F
H
Dimensions in mil
Nom.
Symbol
Min.
173
59
Max.
181
72
A
B
C
D
E
F
G
H
I
¾
¾
¾
¾
¾
¾
¾
59
¾
¾
90
102
47
35
155
14
167
19
17
22
¾
¾
55
63
J
14
17
Rev. 1.10
8
September 30, 2008
HT78XX Series
3-pin TO92 Outline Dimensions
A
B
D
C
E
F
G
H
Dimensions in mil
Nom.
Symbol
Min.
170
170
500
11
Max.
200
200
¾
A
B
C
D
E
F
G
H
I
¾
¾
¾
¾
¾
¾
¾
¾
¾
¾
20
90
110
55
45
45
65
130
8
160
18
a
4°
6°
Rev. 1.10
9
September 30, 2008
HT78XX Series
Product Tape and Reel Specifications
Reel Dimensions
D
T
2
C
A
B
T
1
SOT223
Symbol
Description
Dimensions in mm
A
B
Reel Outer Diameter
Reel Inner Diameter
Spindle Hole Diameter
Key Slit Width
330.0±1.0
62.0±1.5
C
12.75±0.15
2.0+0.6/-0.0
12.4+0.2/-0.0
16.4+0.0/-0.4
D
T1
T2
Space Between Flange
Reel Thickness
SOT23-5
Symbol
Description
Dimensions in mm
178.0±1.0
A
B
Reel Outer Diameter
Reel Inner Diameter
Spindle Hole Diameter
Key Slit Width
62.0±1.0
C
13.0±0.2
D
2.50±0.25
8.4+1.5/-0.0
T1
T2
Space Between Flange
Reel Thickness
11.4+1.5/-0.0
SOT89
Symbol
Description
Dimensions in mm
180.0±1.0
A
B
Reel Outer Diameter
Reel Inner Diameter
Spindle Hole Diameter
Key Slit Width
62.0±1.5
12.75+0.15/-0.00
C
D
1.90±0.15
12.4+0.2/-0.0
17.0+0.0/-0.4
T1
T2
Space Between Flange
Reel Thickness
Rev. 1.10
10
September 30, 2008
HT78XX Series
3-pin TO92 Reel Dimensions (Unit: mm)
P
a
c
k
a
g
e
U
p
,
F
l
a
t
S
i
d
e
U
p
3
0
P
a
c
k
a
g
e
U
p
,
F
l
a
t
S
i
d
e
D
o
w
n
5
8
4
3
8
8
3
6
0
Rev. 1.10
11
September 30, 2008
HT78XX Series
Carrier Tape Dimensions
P
0
P
1
t
D
E
F
W
B
0
C
D
1
P
K
0
A
0
R
e
e
l
H
o
l
e
I
C
M
a
r
k
i
n
g
SOT223
Symbol
Description
Dimensions in mm
12.0±0.3
8.0±0.1
W
P
Carrier Tape Width
Cavity Pitch
E
Perforation Position
1.75±0.10
5.50±0.05
1.5+0.1/-0.0
1.5+0.1/-0.0
4.0±0.1
F
Cavity to Perforation (Width Direction)
Perforation Diameter
Cavity Hole Diameter
Perforation Pitch
D
D1
P0
P1
A0
B0
K0
t
Cavity to Perforation (Length Direction)
Cavity Length
2.00±0.05
6.9±0.1
Cavity Width
7.5±0.1
Cavity Depth
2.1±0.1
Carrier Tape Thickness
Cover Tape Width
0.30±0.05
9.3±0.1
C
SOT23-5
Symbol
Description
Carrier Tape Width
Dimensions in mm
8.0±0.3
W
P
Cavity Pitch
4.0±0.1
E
Perforation Position
Cavity to Perforation (Width Direction)
Perforation Diameter
Cavity Hole Diameter
Perforation Pitch
1.75±0.10
3.50±0.05
1.5+0.1/-0.0
1.5+0.1/-0.0
4.0±0.1
F
D
D1
P0
P1
A0
B0
K0
t
Cavity to Perforation (Length Direction)
Cavity Length
2.00±0.05
3.15±0.1
3.2±0.1
Cavity Width
Cavity Depth
1.4±0.1
Carrier Tape Thickness
Cover Tape Width
0.20±0.03
5.3±0.1
C
Rev. 1.10
12
September 30, 2008
HT78XX Series
SOT89
Symbol
Description
Carrier Tape Width
Dimensions in mm
W
P
12.0+0.3/-0.1
8.0±0.1
Cavity Pitch
E
Perforation Position
Cavity to Perforation (Width Direction)
Perforation Diameter
Cavity Hole Diameter
Perforation Pitch
1.75±0.10
5.50±0.05
1.5+0.1/-0.0
1.5+0.1/-0.0
4.0±0.1
F
D
D1
P0
P1
A0
B0
K0
t
Cavity to Perforation (Length Direction)
Cavity Length
2.0±0.1
4.8±0.1
Cavity Width
4.5±0.1
Cavity Depth
1.8±0.1
Carrier Tape Thickness
Cover Tape Width
0.300±0.013
9.3±0.1
C
Rev. 1.10
13
September 30, 2008
HT78XX Series
Carrier Tape Dimensions
P
D
h
W
2
H
1
H
H
0
t
l
1
W
0
W
1
W
F
1
F
2
D
0
P
2
P
0
TO92
Symbol
I1
Description
Dimensions in mm
(2.5)
Taped Lead Length
Component Pitch
Perforation Pitch
P
12.7±1.0
12.7±0.3
6.35±0.40
2.5+0.4/-0.1
2.5+0.4/-0.1
0.0±0.1
P0
P2
Component to Perforation (Length Direction)
Lead Spread
F1
F2
Lead Spread
Component Alignment
Carrier Tape Width
Dh
W
18.0+1.0/-0.5
W0
W1
W2
H0
Hold-down Tape Width
Perforation Position
6.0±0.5
9.0±0.5
Hold-down Tape Position
Lead Clinch Height
(0.5)
16.0±0.5
Less than 24.7
4.0±0.2
H1
Component Height
D0
Perforation Diameter
Taped Lead Thickness
Component Base Height
t
0.7±0.2
H
19.0±0.5
Note:
Thickness less than 0.38±0.05mm~0.5mm
P0 Accumulated pitch tolerance: ±1mm/20pitches.
( ) Bracketed figures are for consultation only
Rev. 1.10
14
September 30, 2008
HT78XX Series
Holtek Semiconductor Inc. (Headquarters)
No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
Tel: 886-3-563-1999
Fax: 886-3-563-1189
http://www.holtek.com.tw
Holtek Semiconductor Inc. (Taipei Sales Office)
4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan
Tel: 886-2-2655-7070
Fax: 886-2-2655-7373
Fax: 886-2-2655-7383 (International sales hotline)
Holtek Semiconductor Inc. (Shanghai Sales Office)
G Room, 3 Floor, No.1 Building, No.2016 Yi-Shan Road, Minhang District, Shanghai, China 201103
Tel: 86-21-5422-4590
Fax: 86-21-5422-4705
http://www.holtek.com.cn
Holtek Semiconductor Inc. (Shenzhen Sales Office)
5F, Unit A, Productivity Building, Gaoxin M 2nd, Middle Zone Of High-Tech Industrial Park, ShenZhen, China 518057
Tel: 86-755-8616-9908, 86-755-8616-9308
Fax: 86-755-8616-9722
Holtek Semiconductor Inc. (Beijing Sales Office)
Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031
Tel: 86-10-6641-0030, 86-10-6641-7751, 86-10-6641-7752
Fax: 86-10-6641-0125
Holtek Semiconductor Inc. (Chengdu Sales Office)
709, Building 3, Champagne Plaza, No.97 Dongda Street, Chengdu, Sichuan, China 610016
Tel: 86-28-6653-6590
Fax: 86-28-6653-6591
Holtek Semiconductor (USA), Inc. (North America Sales Office)
46729 Fremont Blvd., Fremont, CA 94538
Tel: 1-510-252-9880
Fax: 1-510-252-9885
http://www.holtek.com
Copyright Ó 2008 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek as-
sumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.
Rev. 1.10
15
September 30, 2008
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