RFM50-433 [HOPERF]
ISM Band Transceiver Module;
| 型号： | RFM50-433 |
| 厂家： | 
HOPERF |
| 描述： | ISM Band Transceiver Module ISM频段 |
| 文件： | 总8页 (文件大小：244K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RFM50 V1.0
MCU with 100mW 433/470/868/915 MHz ISM Band Transceiver Module
（the purpose of this RFM50 spec covers mainly for the
hardware and RF parameter info of the module, for MCU
and software info please refer to RF50 chip data sheets,
for RFM50’ demo Please refer to RF(M)50 demo kit）
RFM50
1. General Introduction
RFM50 module series’ design is based on the high performance
RF50 SoC chip, It include a CIP-51 core‘ MCU and 100mW
transceiver. It operate at 433/470/868/915 MHz ISM band, comply
with FCC, ETSI regulation.
2. Features
Ultra Low Power: 0.9 to 3.6 V Operation
-Typical sleep mode current < 0.1 μA; retains state and RAM
contents over full supply range; fast wakeup of < 2 μs
-Less than 600 nA with RTC running
-Less than 1 μA with RTC running and radio state retained
-On-chip dc-dc converter allows operation down to 0.9 V.
-Two built-in brown-out detectors cover sleep and active modes
10-Bit Analog to Digital Converter
-Up to 300 ksps
-Up to 18 external inputs
-External pin or internal VREF (no external capacitor required)
-Built-in temperature sensor
-External conversion start input option
-Autonomous burst mode with 16-bit automatic averaging accumulator
Dual Comparators
-Programmable hysteresis and response time
-Configurable as interrupt or reset source
-Low current (< 0.5 μA)
On-Chip Debug
-On-chip debug circuitry facilitates full-speed, non-intrusive in-system debug (No emulator required)
-Provides breakpoints, single stepping
-Inspect/modify memory and registers
-Complete development kit
High-Speed 8051 μC Core
-Pipelined instruction architecture; executes 70% of instructions in 1 or 2 system clocks
-Up to 25 MIPS throughput with 25 MHz clock
-Expanded interrupt handler
Memory
-4352 bytes internal data RAM (256 + 4096)
-64 kB Flash; In-system programmable in 1024-byte sectors—1024 bytes are reserved in the 64 kB devices
Transceiver
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RFM50 V1.0
-Frequency range = 433,470,868,915 MHz ISM Band
-Sensitivity = –121 dBm
-FSK, GFSK, and OOK modulation
-Max output power = +20 dBm
-RF power consumption
- 18.5mA receive
-18 mA @+1 dBm transmit
- 40mA @+13 dBm transmit
- 100mA @+20 dBm transmit
-Data rate = 0.123 to 256 kbps
-Auto-frequency calibration (AFC)
- transmit/receive switch control
-Programmable packet handler
-TX and RX 64 byte FIFOs
-Frequency hopping capability
-On-chip crystal tuning
Digital Peripherals
-19 or 16 port I/O plus 3 GPIO pins; Hardware enhanced UART, SPI, and I2C serial ports available concurrently
-Low power 32-bit SmaRTClock
-Four general purpose 16-bit counter/timers; six channel programmable counter array (PCA)
Clock Sources
-Precision internal oscillators: 24.5 MHz with ±2% accuracy supports UART operation; spread-spectrum mode for
reduced EMI; Low power 20 MHz internal oscillator
-External oscillator: Crystal, RC, C, CMOS clock
-SmaRTClock oscillator: 32.768 kHz crystal or self-oscillate
-Can switch between clock sources on-the-fly; useful in power saving modes and in implementing various power saving
modes
I/O Port
-19 or 20 port I/O (5 V tolerant except for GPIO_2)
Package
-30-pin SMD (11x25X2.0 mm)
3. Typical Application
• Internet of Things
• Wireless data collection
• Meter Reading
• Automobile security system
• Home automation and security system
• Wireless sensor
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RFM50 V1.0
4. Pin Definition
Figure 1. RFM50 Pin Definition(TOP VIEW)
definition
ANT
Type
Function
AI/ AO
RF signal input/output port, Connect 50 OHM antenna
Power ground
GND
G
GPIO2
DI/DO or AI/AO
General Purpose I/O controlled by the RF22 periph-eral. May be configured
through the RF22 registers to perform various functions including: Clock Output,
FIFO status, POR, Wake-Up Timer, Low Battery Detect, TRSW, AntDiversity
control, etc. See the RF22 GPIO Con-figuration Registers for more information.
Port 0.7. See RF50 Port I/O section for a complete description.
P0.7
D I/O or A I
IREF0
P0.6
AO
IREF0 Output. See RF50 IREF section for complete description.
Port 0.6. See RF50 Port I/O section for a complete description.
D I/O or A I
CNVSTR
P0.5
DI
External Convert Start Input for ADC0. See RF50 ADC0 section for a complete
description.
D I/O or A I
Port 0.5. See RF50 Port I/O section for a complete description.
RX
DI
UART RX Pin. See RF50 Port I/O section.
P0.4
D I/O or A I
Port 0.4. See RF50 Port I/O section for a complete description.
TX
DO
UART TX Pin. See RF50 Port I/O section.
P0.1
AGND
P0.3
Port 0.1. See Port I/O Section for a complete description. Optional Analog
Ground. See VREF chapter.
D I/O or A I
G
D I/O or A In
Port 0.3. See RF50 Port I/O Section for a complete description.
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RFM50 V1.0
XTAL2
External Clock Output. This pin is the excitation driver for an external crystal or
A O
DI
resonator.
External Clock Input. This pin is the external clock input in external CMOS clock
mode.
External Clock Input. This pin is the external clock input in capacitor or RC
oscillator configurations.
AI
See RF50 Oscillator section for complete details.
Port 0.2. See RF50 Port I/O Section for a complete description.
P0.2
D I/O or A I
AI
XTAL1
P0.0
External Clock Input. This pin is the external oscillator return for a crystal or
resonator. See RF50 Oscillator section.
D I/O or A I
Port 0.0. See RF50 Port I/O section for a complete description.
VREF
AI
External VREF Input.
AO
Internal VREF Output. External VREF decoupling capacitors are recommended.
See RF50 Voltage Reference section.
RST/
D I/O
Device Reset. Open-drain output of internal POR or VDD monitor. An external
source can initiate a system reset by driving this pin low for at least 15 μs. A 1–5
kꢀ pullup to VDD_MCU is recommended. See Reset Sources section for a
complete description.
C2CK
P2.7/
D I/O
D I/O
Clock signal for the C2 Debug Interface.
Port 2.7. This pin can only be used as GPIO. The Crossbar cannot route signals
to this pin and it cannot be configured as an analog input. See RF50 Port I/O
section for a complete description.
C2D
D I/O
Bi-directional data signal for the C2 Debug Interface.
P2.6
GND
VDD
P2.5
P2.4
P2.3
P2.2
XTAL4
XTAL3
P2.1
P2.0
P1.7
P1.6
P1.5
NIRQ
D I/O or A I
G
Port 2.6. See RF50 Port I/O section for a complete description.
Power ground
PI
Positive power supply, 1.8 to 3.6 V.
D I/O or A I
D I/O or A I
D I/O or A I
D I/O or A I
AO
Port 2.5. See RF50 Port I/O section for a complete description.
Port 2.4. See RF50 Port I/O section for a complete description.
Port 2.3. See RF50 Port I/O section for a complete description.
Port 2.2. See RF50 Port I/O section for a complete description.
SmaRTClock Oscillator Crystal Output.
AI
SmaRTClock Oscillator Crystal Input.
D I/O or A I
D I/O or A I
D I/O or A I
D I/O or A I
D I/O or A I
D O
Port 2.1. See RF50 Port I/O section for a complete description.
Port 2.0. See RF50 Port I/O section for a complete description.
Port 1.7. See RF50 Port I/O section for a complete description.
Port 1.6. See RF50 Port I/O section for a complete description.
Port 1.5. See RF50 Port I/O section for a complete description.
RF22 peripheral interrupt status pin. Will be set low to indicate a pending RF22
interrupt event. See the RF22 Control Logic Registers for more details. This pin
is an open-drain output with a 220 kꢀ internal pullup resistor. An external pull-up
resistor is recommended.
XOUT
AO
RF22 peripheral crystal oscillator output. Connect to an external 30 MHz crystal
or leave floating if driving the XIN pin with an external signal source.
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RFM50 V1.0
XIN
AI
RF22 peripheral crystal oscillator input. Connect to an external 30 MHz crystal or
to an external source. If using an external clock source with no crystal, dc
coupling with a nominal 0.8 VDC level is recommended with a minimum ac
amplitude of 700 mVpp.
5. Electrical Parameter
5.1 Maximum
parameter
minimum
-0.3
maximum
+3.6
Unit
V
Positive power supply
Voltage on Digital Control Inputs
Voltage on Analog Inputs
RX Input Power
-0.3
VDD + 0.3
VDD + 0.3
+10
V
-0.3
V
dBm
℃
Storage temperature
Soldering temperature(10s)
-55
+125
+260
℃
5.2 Recommended working range
parameter
minimum
maximum
+3.6
Unit
V
Positive power supply
Working temperature
2.2
-40
+85
℃
5.3 DC characteristic
parameter
conditions
minimum
typical
maximum
Unit
Supply current
433,470,868,915MHZ band
100
mA
(TX mode, Pout =+20dBm)
Supply current
433,470,868,915MHZ band
433,470,868,915MHZ band
433,470,868,915MHZ band
40
mA
mA
mA
nA
(TX mode, Pout = +13 dBm)
Supply current
18
(TX mode, Pout = +1dBm)
Supply current
18.5
450
(RX mode)
Standby current
Low Power Digital Regulator ON
(Register values retained) and Main
Digital Regula-tor, and RC Oscillator
OFF
800
Sleep current
RC Oscillator and Low Power Digital
Reg-ulator ON (Register values
retained) and Main Digital Regulator
OFF
1
uA
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RFM50 V1.0
5.4 Transmitter AC characteristic
parameter
conditions
minimum
413
typical
maximum
453
Unit
TX frequency range
433 MHz band,
470 MHz band,
868 MHz band,
915 MHz band,
MHz
450
490
848
888
895
935
0.123
0.123
±0.625
±0.625
256
Kbps
Kbps
FSK Data Rate
OOK Data Rate
40
433,470MHZ
868,915MHZ
±320
±160
KHz
KHz
Modulation Deviation
0.625
3
Modulation Deviation
Resolution
+1
+20
dBm
dBm
Output Power Range
TX RF Output Steps
controlled by txpow[2:0]
5.5 Receiver AC characteristic
parameter
conditions
minimum
413
typical
maximum
453
Unit
433 MHz band,
MHz
470 MHz band,
450
490
RX Frequence Range
868 MHz band,
848
888
915 MHz band,
895
935
(BER < 0.1%) (2 kbps, GFSK,
BT = 0.5, ꢀf = ꢀ5 kHz)3
(BER < 0.1%) (40 kbps, GFSK,
BT = 0.5, ꢀf = ꢀ20 kHz)3
(BER < 0.1%) (125 kbps,
GFSK, BT = 0.5, ꢀf = ꢀ62.5
kHz)
dBm
dBm
dBm
RX Sensitivity
–121
–108
–101
(BER < 0.1%) (4.8 kbps, 350
kHz BW, OOK)3
dBm
dBm
–110
-116
(BER<0.1%)(1.2Kbps,
FD=35KHz,BW=105KHz,
2.6
620
20
KHz
dB
RX Channel Bandwidth
RSSI Resolutio
±0.5
-120
dB
RSSI Range
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RFM50 V1.0
6. Mechanical Dimension
（All units in mm）
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RFM50 V1.0
7. Ordering information
Part Number=Module type + Operation Band
RFM50 – 433
module type
operation band
example:
1.RFM50 module at 433MHz band, RFM50-433。
Model
operation band
RFM50-433
RFM50-470
RFM50-868
RFM50-915
433MHZ
470MHZ
868MHZ
915MHZ
This document may contain preliminary information and is subject to change by
Hope Microelectronics without notice. Hope Microelectronics assumes no
responsibility or liability for any use of the information contained herein. Nothing
in this document shall operate as an express or implied license or indemnity
HOPE MICROELECTRONICS CO.,LTD
Add:4/F, Block B3, East Industrial Area, under the intellectual property rights of Hope Microelectronics or third parties.
Huaqiaocheng, Shenzhen, Guangdong, China
Tel: 86-755-82973805
The products described in this document are not intended for use in implantation
or other direct life support applications where malfunction may result in the direct
physical harm or injury to persons. NO WARRANTIES OF ANY KIND,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF
MECHANTABILITY OR FITNESS FOR A ARTICULAR PURPOSE, ARE
OFFERED IN THIS DOCUMENT.
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©2006, HOPE MICROELECTRONICS CO.,LTD. All rights reserved.
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