W2635A [HP]

BGA Probe Adapter for Infiniium Oscilloscopes; BGA探头适配器的Infiniium示波器


型号：	W2635A
厂家：	HEWLETT-PACKARD
描述：	BGA Probe Adapter for Infiniium Oscilloscopes BGA探头适配器的Infiniium示波器
文件：	总11页 (文件大小：534K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

W2635A and W2636A DDR3 BGA Probe

Adapter for Infiniium Oscilloscopes

Data Sheet

Superior probing for DDR3 compliance test and debug

The Agilent Technologies' W2635A

and W2636A DDR3 BGA probe

adapters provide signal access to

the clock, strobe, data, address

and command signals of the DDR3

BGA package for making electrical

and timing measurements with an

Infiniium oscilloscope. The DDR3

from the memory controller chip and

DRAM directly to the top side of the

BGA probe adapter where they can be

accessed with oscilloscope probes.

location could cause signal reflection,

resulting in non-monotonic edges.

This will cause error in your tests

such as slew rate, setup and hold time

measurements.

Buried resistors placed at the signals

inside the BGA probe adapter

When used with Agilent's U7231A

DDR3 compliance test application, the

BGA adapter provides a fast and easy

way to test, debug and characterize

your DDR3 designs. The tests covered

by the U7231A software are based on

the JEDEC (JESD79-3C) DDR3 SDRAM

Specification. The test application

offers a user-friendly setup wizard and

a comprehensive report that includes

margin analysis.

connect the probed signals to solder

pads designed to work with Agilent

InfiniiMax E2677A, N5381A, N5425A,

and N5426A differential solder-in

probe heads. These resistors isolate

the DDR3 signal and the probe

JEDEC specification (JESD79-3C) is

defined at the DRAM ballout, and the

ballout is difficult to access. The BGA

probe adapter provides direct signal

access to the BGA package for true

compliance testing.

loading effect. This design minimizes

capacitive loading of the probe heads

and allows high-speed operation

without impact on signal integrity.

The W2635A and W2636A DDR3

BGA probe adapters are soldered in

between the DRAM and PC board

or DIMM raw card where the DRAM

would normally be soldered. They

are designed with the PCB or DIMM

footprint on the bottom side and

the DRAM footprint on the top side.

The BGA adapter passes the signals

The JEDEC (Joint Electronic Device Engineering

Council) Solid State Technology Association is

a semiconductor engineering standardization

body of the Electronic Industries Alliance (EIA), a

trade association that represents all areas of the

electronic industry.

Probing at the right location is also

an important consideration for DDR3

measurement. Many designs have

vias or designed-in probe points, but

they do not always produce good

signal integrity. Probing at the wrong

Superior probing for DDR3 compliance test and debug

order, you may prefer to use either

leaded or lead-free solder to attach the

BGA probe adapter.

Features

Installing the DDR3 BGA probe

adapter

• Provides signal access points

for DDR3 DRAM x4, x8 and x16

packages using JEDEC-standard

common BGA footprints to the

oscilloscope

The W2635A and W2636A DDR3 BGA

probe adapter is installed by soldering

it to the BGA footprint on the PC

board or DIMM card where the DRAM

normally would be soldered. Then you

can solder the DDR3 DRAM to the top

side of the BGA probe adapter. These

attachment steps may occur in any

order.

We recommend you attach the BGA

probe during the manufacturing

process. For designs that are

manufactured, it will require expertise

to attach the BGA probe adapter. If you

lack the in-house expertise to attach

the BGA probe adapter, you may wish

to work with a contract manufacturer

with this expertise that may be willing

to perform the attachment for a fee.

You can find more information on BGA

soldering and rework techniques that

may be useful in attaching the probe at:

• 10-mm and 11-mm BGA probe

adapter widths for different spacing

requirement between the DRAM

placements on the PCB or DIMM

• Buried resistors provide signal

isolation and minimize capacitive

The probe is designed to tolerate

lead-free soldering temperature

profiles. However, we recommend

you apply the minimum temperature

required for soldering and you use

the minimum number of heating and

cooling cycles to reduce risk of any

damage to the probe. The probe is

supplied without solder balls attached.

Depending on the exact attachment

• Probing compatibility with

InfiniiMax probe, which includes

E2677A, N5381A, and N5425A/

N5426A differential solder-in probe

heads

http://www.circuitrework.com/

guides/9-0.shtm

http://www.agilent.com/find/

ddr3bga-scope

Figure 1. The diagram above shows the top (left) and

bottom (right) view of the W2636A DDR3 BGA probe

adapter. The top side shows the footprint for DDR3 DRAM

and the bottom side shows the footprint for a PC board or

DIMM card.

Superior probing for DDR3 compliance test and debug

Installing the InfiniiMax probe

You can use the DDR3 BGA probe adapter with various InfiniiMax solder-in

probes. Instructions that come with the InfiniiMax probe provide details on the

proper soldering procedures for the InfiniiMax probe heads.

Figure 2. The picture above shows the InfiniiMax N5425A and N5426A ZIF probe head

connected to the W2636A DDR3 BGA probe adapter.

DDR3 BGA probe adapters dimensions, pad numbering and location

W2635A-010 dimensions, pad numbering and location

Size

Height = 13.97 mm (0.550 in)

Width = 11.176 mm (0.440 in)

Thickness = 1.575 mm (0.062 in)

Brings 20 signals to SMT pads for probing

Provides 12 GND pads (6 on either side of DDR3 BGA probe adapter)

75-ohm buried tip resistor

Signal

Pin #

Signal

GND

LDQS

LDQS#

GND

RAS

GND

DQ1

DQ3

GND

DQ7

DQ5

GND

CAS

GND

ODT

CS0

CK#

GND

CKE

A10

GND

BA1

A12

GND

Table 1. W2635A-010 pad numbering

GND

CS1

GND

BA0

BA2

GND

DDR3 BGA probe adapters dimensions, pad numbering and location

W2635A-011 dimensions, pad numbering and location

Size

Height = 13.97 mm (0.550 in)

Width = 12.192 mm (0.480 in)

Thickness = 1.575 mm (0.062 in)

Brings 20 signals to SMT pads for probing

Provides 12 GND pads (6 on either side of DDR3 BGA probe adapter)

75-ohm buried tip resistor

Pin #

Signal

GND

LDQS

LDQS#

GND

RAS

Signal

GND

DQ1

DQ3

GND

DQ7

DQ5

GND

Pin #

CAS

GND

ODT

CS0

Table 2. W2635A-011 pad numbering

CK#

GND

CKE

GND

CS1

A10

GND

BA0

GND

BA1

A12

BA2

GND

DDR3 BGA probe adapters dimensions, pad numbering and location

W2636A-010 dimensions, pad numbering and location

Size

Height = 19.05 mm (0.750 in)

Width = 11.176 mm (0.440 in)

Thickness = 1.575 mm (0.062 in)

Brings 26 signals to SMT pads for probing

Provides 14 GND pads (7 on either side of DDR3 BGA probe adapter)

75-ohm buried tip resistor

Pin #

Signal

GND

DQ13

DQ19

GND

DQ0

Signal

GND

DQ12

DQ14

GND

UDQS#

UDQS

GND

DQ3

Pin #

LDQS

GND

LDQS#

RAS

DQ5

GND

CAS

GND

Table 3. W2636A-010 pad numbering

ODT

CK#

GND

CKE

GND

CS0

CS1

A10

GND

BA1

BA0

A12

GND

BA2

GND

A11

DDR3 BGA probe adapters dimensions, pad numbering and location

W2636A-011 dimensions, pad numbering and location

Size

Height = 19.05 mm (0.750 in)

Width = 12.192 mm (0.480 in)

Thickness = 1.575 mm (0.062 in)

Brings 26 signals to SMT pads for probing

Provides 14 GND pads (7 on either side of DDR3 BGA probe adapter)

75-ohm buried tip resistor

Signal

GND

DQ12

DQ14

GND

UDQS#

UDQS

GND

DQ3

Pin #

Signal

GND

DQ13

DQ9

GND

DQ0

LDQS

GND

LDQS#

RAS

GND

CAS

DQ5

GND

Table 4. W2636A-011 pad numbering

CK#

GND

CKE

ODT

GND

CS0

A10

CS1

GND

BA1

GND

A12

BA0

GND

A11

GND

BA2

Ordering information

DDR3 BGA probe adapter model numbers and options. Each model comes with a kit of 10 BGA probe adapters.

Model number

W2635A-010

W2635A-011

W2636A-010

W2636A-011

Description

x8, 10 mm width DDR3 BGA probe adapter for x4 and x8 DRAM package

x8, 11 mm width DDR3 BGA probe adapter for x4 and x8 DRAM package

x16, 10 mm width DDR3 BGA probe adapter for x16 DRAM package

x16, 11 mm width DDR3 BGA probe adapter for x16 DRAM package

Infiniium oscilloscope and InfiniiMax oscilloscope probe amplifiers and probe heads that are recommended for use with the

DDR3 BGA probe adapters

Product

Description

9000 Series

9404A

4-GHz 4-channels 10 GSa/s Infiniium scope

90000 Series

90404A

4-GHz, 4 channels Infiniium scope

6-GHz, 4 channels Infiniium scope

8-GHz, 4 channels Infiniium scope

12-GHz, 4 channels Infiniium scope

13-GHz, 4 channels Infiniium scope

90604A

90804A

91204A

91304A

Ordering information

Probe accessories

InfiniiMax probe amplifiers

Model number

1169A

Description

12-GHz differential probe amplifier

10-GHz differential probe amplifier

7-GHz differential probe amplifier

5-GHz differential probe amplifier

3.5-GHz differential probe amplifier

1168A

1134A

1132A

1131A

InfiniiMax probe heads

Model number

N5381A

Description

InfiniiMax II 12-GHz differential solder-in probe head and accessories

InfiniiMax II 12-GHz differential browser

N5382A

E2677A

InfiniiMax 12-GHz differential solder-in probe head and accessories

InfiniiMax 12-GHz ZIF probe head

N5425A

N5426A

InfiniiMax ZIF tips (x10) (requires both N5425A and N5426A)

InfiniiMax differential long wire ZIF tip (x10) (requires both N5425A and N5451A)

N5451A

Related literature

Publication title

Publication type

Data sheet

Publication number

Infiniium 90000 Series Oscilloscopes and InfiniiMax Series Probes

5989-7819EN

5989-4605EN

Agilent InfiniiScan Event Identification Software for Infiniium 80000 and 8000 Series Oscilloscopes

(N5414A and 5415A)

Data sheet

Agilent Technologies E2688A, N5384A High-Speed Serial Data Analysis and Clock Recovery Software

for Infiniium Series Oscilloscopes

Data sheet

5989-0108EN

Agilent Technologies EZJIT and EZJIT Plus Jitter Analysis Software for Infiniium Series Oscilloscopes Data sheet

5989-0109EN

5989-6664EN

A Time-Saving Method for Analyzing Signal Integrity in DDR Memory Buses

Application note

To download copies of these publications go to www.agilent.com/find/ddr3bga-scope

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Revised: October 1, 2008

Product speciﬁcations and descriptions

in this document subject to change

without notice.

Printed in USA, June 1, 2009

5989-7643EN

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