FX11LB-140P-SV22 [HRS]
0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections;
| 型号： | FX11LB-140P-SV22 |
| 厂家： | 
HRS |
| 描述： | 0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections |
| 文件： | 总8页 (文件大小：545K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NEW
0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections
FX11L Series
■Cross-Section of Mating
■Features
1. Low Profile Design
The board to board mating height of 2 mm suits smaller,thinner
case designs.
2. Improved Transmission Efficiency Between
Boards
Transmission characteristics have been improved through
a design that fixes ground plates to both sides of the
header and receptacle.
3. 10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10:1 with the
ground plate SMT connected to the board. The ground
stability achieved serves to reduce noise.
4. Reinforced Fittings for Added Solder Weld
Strength
Reinforced fittings provide greater adhesion to the
board,protecting against peeling.The unique connector
design provides a connection between the fitting and the
ground plate for a stronger ground.
Detailed Figure of Solder Gap
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm produces a smaller
connector utilizing less board area for mounting.
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT
portion to prevent solder wicking.
7. Optional Ground Plate
An alternate style without the ground plate is available.The
space provided by the ground plate removal has been filled
with additional signal contacts.
Note: The thickness of the solder paste is not included in the 2 mm board-to-board stack height.
■Applications
Notebook computers, PDA, and other miniature electronic equipment.
2003.7
1
■Product Specifications
Rated current 0.3 A (Note 1) Operating temperature range
Storage temperature range
Storage humidity range
-55 to 85ç
-10 to +60ç (Note 2)
Rating Rated voltage 50 V AC
Operating humidity range
Relative humidity 95% or less
(No condensation)
-40 to -70% (Note 2)
Item
Requirements
Conditions
1. Insulation resistance
2. Voltage proof
Measured at 100 V DC
100 Mø or greater
150 V AC applied for one minute
Measured at 100 mA
No flashover or breakdown
3. Contact resistance
60 mø or less
No electrical discontinuity for 1µs or greater
No damage, cracks, or parts looseness
Frequency: 10 to 55 Hz, amplitude of 0.75 mm in 3 directions,
10 cycles each
4. Vibration
5. Shock
2
No electrical discontinuity for 1µs or longer
No damage, cracks, or parts looseness
Acceleration of 490 m/s , 11ms duration, sine half-wave
waveform,for 3 cycles in the both directions of each of the 3 axes
6. Damp heat
(Steady state)
Contact resistance of 70 m
ø or less, insulation resistance of
Temperature of 40ç, humidity of 90 to 95%, duration 96 h
100 M or greater, no damage, cracks, or parts looseness
ø
Temperature: -55
Time: 30 min. ■ 2 to 3 min. ■ 30 min. ■ 2 to 3 min. for 5 cycles
ç ■ 15 to 35ç ■ 85ç ■ 15 to 35ç
7. Rapid change
of temperature
Contact resistance of 70 m
ø or less, insulation resistance of
100 M or greater, no damage, cracks, or parts looseness
ø
8. Insertion/
Withdrawal life
Contact resistance of 70 mø or less
No damage, cracks, or parts looseness
50 times
9. Resistance to
soldering heat
Reflow: At the recommended temperature profile
Soldering iron temperature: 300ç for 3 seconds
No melting of resin portion which affects performance
Note 1: Please contact us when connector application exceeds 0.3 A rated current.
Note 2: The term storage refers to an unused products prior to board mounting (including packing materials) that is being kept for a long period.
The operating temperature and humidity range are applied to the non-conducting condition following board assembly.
Note 3: The aforementioned specifications are representative of this series. For information on specific parts, confirm with Sales Office.
■Materials
Part
Material
LCP resin
Process
UL Rating
UL94V-0
Insulator
Beige
Copper alloy
Header
Engagement Area: Gold plating of 0.1µm
Contacts
----------
Phosphor bronze
Phosphor bronze
Receptacle
Solder plating
Termination Area: Flash plating
Ground plate
----------
----------
----------
Reinforced fitting
Reinforced plate
Phosphor bronze
Tin plating
Note : The black dots on the insulater will not affect performance.
■Product Number Configuration
Please use this information to discern the product specifications from the product number codes.
To order, please select from the product number codes listed in tables on pages 3 to 6 of this catalog.
-
-
(
6
)
#
FX 11L
■ P - /■ - SV ■■■
Type With Ground Plate
Type Without Ground Plate
1
2
3
5
7
4
(
)
#
3
FX 11L
■ P - SV ■■■
1
2
4
5
6
7
1
2
3
5
Series name
Series No. 11L
Form Symbol
:
FX
Connector type
:
P
S
:
:
Header
A
B
:
:
With guide post
Receptacle
6
7
Without guide post
Type with ground plate
Contact form
SV Straight SMT
4
:
Number of contacts
Blank: Tray packaging (Without pick-and-place tape)
(21): Embossed tape packaging (Without pick-and-place tape)
(22): Embossed tape packaging (With pick-and-place tape)
Signal/Ground:60/6, 80/8, 100/10, 120/12
Type without ground
Signal: 68, 92, 116, 140
2
■Headers with Ground Plate
Number of Contacts
HRS No.
Product No.
A
B
C
D
E
Notes
Signal
060
080
100
120
060
080
100
120
Ground
06
CL573-0002-7-■■■
CL573-0003-0-■■■
CL573-0004-2-■■■
CL573-0005-5-■■■
CL573-0012-0-■■■
CL573-0013-3-■■■
CL573-0014-6-■■■
CL573-0015-9-■■■
FX11LA-060P/06-SV (■■■)
FX11LA-080P/08-SV (■■■)
FX11LA-100P/10-SV (■■■)
FX11LA-120P/12-SV (■■■)
FX11LB-060P/06-SV (■■■)
FX11LB-080P/08-SV (■■■)
FX11LB-100P/10-SV (■■■)
FX11LB-120P/12-SV (■■■)
17.5
23.5
29.5
35.5
17.5
23.5
29.5
35.5
12
18
24
30
12
18
24
30
22.6
28.6
34.6
40.6
22.6
28.6
34.6
40.6
18
24
30
36
-
19.4
25.4
31.4
37.4
19.4
25.4
31.4
37.4
08
With guideposts
10
12
06
08
-
Without guideposts
10
-
12
-
[Specifications number] – ■■■, (■■■)
Blank: Tray packaging (Without pick-and-place tape)
(21) : Embossed tape packaging (Without pick-and-place tape)
(22) : Embossed tape packaging (With pick-and-place tape)
Note 1: There is no polarity in terms of board mounting for this product.
Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less.
Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.)
BRecommended Land Pattern Dimensions (Metal Mask Dimensions)
Recommended metal mask thickness: 0.15 mm
Note 1 Cross-hatched portions, totaling n places, indicate the ground circuits.
2 The cross-hatched area
inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
3 Not required in products without guideposts.
3
■Receptacles with Ground Plate
Number of Contacts
Signal Ground
HRS No.
Product No.
A
B
C
D
E
F
Notes
■■■
■■■
■■■
■■■
■■■
■■■
■■■
■■■
■■■
)
CL573-0102-1-
CL573-0103-4-
CL573-0104-7-
CL573-0105-7-
CL573-0112-5-
CL573-0113-8-
CL573-0114-0-
CL573-0105-3-
FX11LA-060S/06-SV (
FX11LA-080S/08-SV (
FX11LA-100S/10-SV (
FX11LA-120S/12-SV (
FX11LB-060S/06-SV (
FX11LB-080S/08-SV (
FX11LB-100S/10-SV (
060
080
100
120
060
080
100
120
06
08
10
12
06
08
10
12
17.5 12
23.5 18
29.5 24
35.5 30
17.5 12
23.5 18
29.5 24
35.5 30
25 20.8 25.4 22.2
31 26.8 31.4 28.2
37 32.8 37.4 34.2
43 38.8 43.4 40.2
■■■
)
With guideposts
■■■
)
■■■
)
■■■
)
25
31
37
43
-
-
-
-
25.4 22.2
31.4 28.2
37.4 34.2
43.4 40.2
■■■
)
Without guideposts
■■■
)
■■■
)s
FX11LB-120S/12-SV (
[Specifications number] - ■■■, (■■■)
Blank: Tray packaging (Without pick-and-place tape)
(21) : Embossed tape packaging (Without pick-and-place tape)
(22) : Embossed tape packaging (With pick-and-place tape)
Note 1: There is no polarity in terms of board mounting for this product.
Note 2: The coplanarity of this product's SMT leads is 0.1mm or less.
Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.)
BRecommended Land Pattern Dimensions (Metal Mask Dimensions)
Recommended metal mask thickness: 0.15 mm
0.25
Note 1 Cross-hatched portions, totaling n places, indicate the ground circuits.
2 Cross-hatched portions, totaling 2 places, indicate the reinforced fittings.
3 The cross-hatched area
inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
4 Not required in products without guideposts.
4
■Headers without Ground Plate
Number of
Contacts
HRS No.
Product No.
A
B
C
D
Notes
Signal
CL573-0042-1-■■■
CL573-0043-4-■■■
CL573-0044-7-■■■
CL573-0045-0-■■■
CL573-0052-5-■■■
CL573-0053-8-■■■
CL573-0054-0-■■■
CL573-0055-3-■■■
FX11LA-068P-SV (■■■)
FX11LA-092P-SV (■■■)
FX11LA-116P-SV (■■■)
FX11LA-140P-SV (■■■)
FX11LB-068P-SV (■■■)
FX11LB-092P-SV (■■■)
FX11LB-116P-SV (■■■)
FX11LB-140P-SV (■■■)
068 16.5 22.6
092 22.5 28.6
116 28.5 34.6
140 34.5 40.6
068 16.5 22.6
092 22.5 28.6
116 28.5 34.6
140 34.5 40.6
18
24
30
36
-
19.4
25.4
31.4
37.4
19.4
25.4
31.4
37.4
With guideposts
-
Without guideposts
-
-
[Specifications number] - ■■■, (■■■)
Blank: Tray packaging (Without pick-and-place tape)
(21) : Embossed tape packaging (Without pick-and-place tape)
(22) : Embossed tape packaging (With pick-and-place tape)
Note 1: There is no polarity in terms of board mounting for this product.
Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less.
Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.)
B
Recommended Land Pattern Dimensions (Metal Mask Dimensions)
Recommended metal mask thickness: 0.15 mm
Note 1 The cross-hatched area
inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
2 Not required in products without guideposts.
5
■Receptacles without Ground Plate
Number of
Contacts
HRS No.
Product No.
A
B
C
D
Notes
Signal
068
092
116
140
068
092
116
140
CL573-0142-6-■■■
CL573-0143-9-■■■
CL573-0144-1-■■■
CL573-0145-4-■■■
CL573-0152-0-■■■
CL573-0153-2-■■■
CL573-0154-5-■■■
CL573-0155-8-■■■
FX11LA-068S-SV (■■■)
FX11LA-092S-SV (■■■)
FX11LA-116S-SV (■■■)
FX11LA-140S-SV (■■■)
FX11LB-068S-SV (■■■)
FX11LB-092S-SV (■■■)
FX11LB-116S-SV (■■■)
FX11LB-140S-SV (■■■)
18
24
30
36
18
24
30
36
16.5
22.5
28.5
34.5
16.5
22.5
28.5
34.5
25
31
37
43
25
31
37
43
20.8
26.8 With guideposts
32.8
38.8
-
-
-
-
Without guideposts
[Specifications number] - ■■■, (■■■)
Blank: Tray packaging (Without pick-and-place tape)
(21) : Embossed tape packaging (Without pick-and-place tape)
(22) : Embossed tape packaging (With pick-and-place tape)
Note 1: There is no polarity in terms of board mounting for this product.
Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less.
Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.)
B
Recommended Land Pattern Dimensions (Metal Mask Dimensions)
Recommended metal mask thickness: 0.15 mm
Note 1 The cross-hatched area
inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
2 Not required in products without guideposts.
6
BEmbossed Carrier Tape Dimensions
■Headers
Insertion Connector
FX11L#-060P/06-SV
FX11L#-080P/08-SV
FX11L#-100P/10-SV
FX11L#-120P/12-SV
FX11L#-068P/12-SV
FX11L#-092P/12-SV
FX11L#-116P/12-SV
FX11L#-140P/12-SV
A
B
C
D
E
20.2 40.4 44 45.5 50.6
26.2 52.4 56
59
64
20.2 40.4 44 45.5 50.5
26.2 52.4 56
59
64
Note 1: There is no polarity in terms of embossed tape
packaging for this product.
Note 2: Left figure is representative of products with
ground plates.
■Receptacles
Insertion Connector
FX11L#-060S/06-SV
FX11L#-080S/08-SV
FX11L#-100S/10-SV
FX11L#-120S/12-SV
FX11L#-068S/12-SV
FX11L#-092S/12-SV
FX11L#-116S/12-SV
FX11L#-140S/12-SV
A
B
C
D
E
20.2 40.4 44 45.5 50.6
26.2 52.4 56
59
64
20.2 40.4 44 45.5 50.5
26.2 52.4 56
59
64
Note 1: There is no polarity in terms of embossed tape
packaging for this product.
Note 2: Left figure is representative of products with
ground plates.
■Reel Packaging Dimensions
7
BRecommended Temperature Profile
This temperature profile is a reference for the setting conditions described below. It will differ depending on conditions and so
mounting should follow verification.
Applicable Conditions
Reflow method
Solder
:
:
IR reflow
Cream type 63Sn/37Pb
(Flux component of 9wt%)
Glass epoxy 85 x 110 x 1.6mm
0.15mm
Test substrate
:
:
Metal mask thickness
This temperature profile is a recommendation.
Conditions may change somewhat depending on the type
of cream solder and the amount.
BWashing Conditions
Organic Solvent Washing
Solvent
Room temperature washing Heated washing
IPA
Yes
Yes
Yes
Yes
(Isopropyl alcohol)
HCFC
(Hydrochlorofluorocarbon)
Water Type Washing
When using water type cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the
documentation issued by the various manufacturers of cleaning agents which describes the effects on metals and resins.
Be careful that parts are not left with moisture remaining on them.
Washing Precautions
Residual flux or cleaning agent on the contacts when washing with organic solvents or water type cleaners can give rise to the
deterioration of electrical performance. In this regard it is important to check whether a thorough washing has been performed.
BConnector Handling Precautions
1. Allowable Creepage Dimensions at Time of Mating
The effective coupling length of this product is 0.55 mm for the signal portion and the ground portion. The creepage of the
header and receptacle at the time of mating should be within 0.18 mm of the completely coupled condition.
2. Retension of Boards
Avoid the support of boards by connectors alone and adopt a board locking measure that does not rely on the connectors.
3. Solder Repair
Flux may rise as far as the contact portion of the connector depending on the flux coating and other factors at the time of repair.
This will cause poor contact reliability; therefore, before use, the aforementioned washing conditions should be taken into
consideration prior to connector washing.
4. Miscellaneous
·Note that excessive twisting while inserting or withdrawing connectors will cause damage.
·The shade of the molded items may vary somewhat depending on the manufacturing lot; however, this does not affect performance.
®
5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN
PHONE: 81-3-3491-9741, FAX: 81-3-3493-2933
The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements.
8
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