H34063AP [HSMC]

DC-TO-DC CONVERTER INTEGRATE CIRCUIT DEVICES; 直流 - 直流转换器集成电路器件
H34063AP
型号: H34063AP
厂家: HI-SINCERITY MOCROELECTRONICS    HI-SINCERITY MOCROELECTRONICS
描述:

DC-TO-DC CONVERTER INTEGRATE CIRCUIT DEVICES
直流 - 直流转换器集成电路器件

转换器
文件: 总7页 (文件大小:75K)
中文:  中文翻译
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Spec. No. : IC200407  
Issued Date : 2003.04.01  
Revised Date : 2005.03.25  
Page No. : 1/7  
HI-SINCERITY  
MICROELECTRONICS CORP.  
H34063AP / H34063AS  
DC-TO-DC CONVERTER INTEGRATE CIRCUIT DEVICES  
8-Lead Plastic DIP-8  
Package Code: P  
Description  
The H34063A Series is a monolithic control circuit containing the primary functions  
required for DC-to-DC converters. These devices consist of an internal temperature  
compensated reference, comparator, controlled duty cycle oscillator with an active  
current limit circuit, driver and high current output switch. This series was  
specifically by Hi-Sincerity Microelectronics Corp.  
8-Lead Plastic SO-8  
Package Code: S  
Features  
3V to 40V Input Voltage Operation  
Internal 1.6A Peak Current Switch  
Internal ±1.8% Reference  
Low Quiescent Current at 1.6mA  
Frequency Operation from 100Hz~100KHz  
Output Voltage Adjustable  
Active Current Limiting  
Step-Up, Step-Down or Inverting Switching Regulators  
Pin Connections  
8
1
7
2
6
3
5
Pin1: Switch Collector (SWC)  
Pin2: Switch Emitter (SWE)  
Pin3: Timing Capacitor (TC)  
Pin4: Ground (GND)  
Pin5: Comparator Inverting Input (FB)  
Pin6: Voltage Supply (Vcc)  
Pin7: Ipk Sense (Ipk)  
4
Pin8: Voltage Driver Collector (DRC)  
Absolute Maxium Rating  
Parameter  
Power Supply Voltage  
Symbol  
VCC  
Value  
40  
Unit  
V
Comparator Input Voltage Range  
Switch Collector Voltage  
Switch Emitter Voltage  
Vir  
-0.3~+40  
40  
V
VC(SW)  
VSWE  
VCE  
V
40  
V
Switch Emitter to Collector Voltage  
Driver Collector Voltage  
Switch Current  
40  
V
VC(DR)  
ISW  
40  
V
1.5  
A
DIP-8  
SO-8  
1.25  
Power Dissipation at TJ=20oC  
PD  
W
0.625  
Operating Ambient Temperature Range  
Storage Temperature Range  
Topr  
Tstg  
Topj  
θJA  
0~+70  
-65~+150  
120  
oC  
oC  
oC  
Operating Junction Temperature  
Thermal Resistance Junction-ambient  
125  
oC/W  
H34063AP, H34063AS  
HSMC Product Specification  
Spec. No. : IC200407  
Issued Date : 2003.04.01  
Revised Date : 2005.03.25  
Page No. : 2/7  
HI-SINCERITY  
MICROELECTRONICS CORP.  
Electrical Characteristics  
(VCC=5V,TA=0~70°C, unless otherwise specified)  
Symbol Test Condition Min.  
Parameter  
Typ. Max.  
Unit  
Oscillator  
Charging Current  
Discharge Current  
Frequency  
Ichg  
Idischg  
fOSC  
VCC=5~40V, Ta=25oC  
VCC=5~40V, Ta=25oC  
VPIN5=0, CT=1nF, Ta=25oC  
10  
140  
28  
25  
190  
33  
40  
240  
40  
uA  
uA  
KHz  
Discharge to Charge Current Ratio Idischg/Ichg VPIN7=VCC, Ta=25oC  
5.2  
250  
6
7.5  
350  
Current Limit Sense Voltage  
Output Switch  
VIPK  
Idischg=Ichg, Ta=25oC  
300  
mV  
Saturation Voltage,  
Darlington Connection  
Saturation Voltage  
DC Current Gain  
VCE(sat)  
1
2
ISW=1A, VC(SW)=VC(DR)  
-
1
1.3  
V
V
VCE(sat)  
hFE  
ISW=1A, IC(DR)=50mA  
ISW=1A, VCE=5V  
VCE=40V, Ta=25oC  
-
35  
-
0.4  
120  
10  
0.7  
-
Collector Off-State Current  
Comparator  
ICC(off)  
100  
uA  
Threshold Voltage  
VFB  
VFB  
IIB  
1.23  
1.25  
1.5  
40  
1.27  
6
V
Threshold Voltage Line Regulation  
Input Bias Current  
VCC=5~40V  
VIN=0V  
-
-
mV  
nA  
400  
Total Device  
VCC=5~40V, VPIN7=VCC, VPin5>VFB,  
CT=0.001uF, Pin7=GND,  
Remaining pins open  
Supply Current  
ICC  
-
1.6  
3
mA  
Block Diagram  
DRI  
Pin8: Driver Collector  
SC  
Pin1: 1.6A Switch Collector  
Q
S
R
Q2  
Q1  
80  
IPK  
Pin7: Highside Current Sense  
Input, VCC-VIPK=300mV  
SE  
Pin2: Darlington Switch Emitter  
IPK  
CT  
Oscillator  
VCC  
TC  
Pin6: Power Supply Input  
Comparator  
Pin3: Oscilletor Timing Capacitor  
+
-
1.25V  
Reference Voltage  
GND  
Pin4: Power GND  
FB  
Pin5: Feedback Comparator  
Inverting Input  
H34063AP, H34063AS  
HSMC Product Specification  
Spec. No. : IC200407  
Issued Date : 2003.04.01  
Revised Date : 2005.03.25  
Page No. : 3/7  
HI-SINCERITY  
MICROELECTRONICS CORP.  
Application Information  
Design Formula Table  
Calculation  
ton/toff  
Step-Down  
(Vout+VF)/(Vin(min) -Vsat-Vout)  
1/Fmin  
Step-Up  
(Vout+VF-Vin(min))/(Vin(min)-Vsat)  
1/Fmin  
Voltage-Inverting  
(|Vout|+VF)/(Vin(max)-Vsat)  
1/Fmin  
(ton+toff) max  
CT  
4*10-5ton  
4*10-5ton  
4*10-5ton  
IC(sw)  
2*Iout(max)  
2*Iout(max)(ton+toff/toff)  
0.3/IC(sw)  
2*Iout(max)(ton+toff/toff)  
0.3/IC(sw)  
RS  
0.3/IC(sw)  
L(min)  
(Vin(min)-Vsat/Ipk(sw))*ton(max)  
(Vin(min)-Vsat/Ipk(sw))*ton(max)  
Iout*ton/Vripple(P-P)  
(Vin(min)-Vsat/Ipk(sw))*ton(max)  
Iout*ton/Vripple(P-P)  
CO  
Vsat: Saturation voltage of the output switch.  
VF: Forward voltage drop of the ringback rectifier.  
(Ipk(sw)*(ton+toff))/(8*Vripple(P-P))  
The following power supply characteristics must be chosen:  
Vin: Nominal input voltage.  
Vout: Desired output voltage. |Vout|=1.25*(1+RB/RA)  
Iout: Desired output current  
Fmin: Minimum desired output switching frequency at the selected values for Vin and Iout.  
Vripple(P-P): Desired peak to peak output ripple voltage in practice, the calculated value will need to be increased due to  
the capacitor equivalent series resistance and board layout. The ripple voltage should be kept to a low value since it  
will directly effect the line and load regulation.  
H34063AP, H34063AS  
HSMC Product Specification  
Spec. No. : IC200407  
Issued Date : 2003.04.01  
Revised Date : 2005.03.25  
Page No. : 4/7  
HI-SINCERITY  
MICROELECTRONICS CORP.  
Application Information (Continuos)  
Fig.2 Step-Up Converter  
D1  
L1  
Vout  
28V / 200mA  
200uH  
R1  
150  
H1N5819  
H34063A  
Cout  
220uF  
8
7
6
1
2
3
4
RSC  
0.22  
Vin  
C1  
CT  
680pF  
5
100uF  
RB  
47kΩ  
RA  
2.2kΩ  
Line Regulation: 100mV (Vin=8V~16V, @Io=200mA)  
Load Regulation: 5mV (Vin=12V, @Io=80mA~200mA)  
Fig.3 Step-Up Converter With External NPN Switch  
L1  
Vout  
R1  
D1  
H34063A  
8
7
6
1
2
3
4
Cout  
RSC  
Vin  
Q1  
R2  
C1  
CT  
5
RB  
RA  
Fig.4 Step-Down Converter  
L1  
Vout  
5V / 500mA  
200uH  
H34063A  
8
1
2
3
4
RSC  
0.25  
Cout  
470uF  
7
6
5
D1  
H1N5819  
Vin  
CT  
470pF  
RB  
C1  
100uF  
3.6kΩ  
RA  
1.2kΩ  
Line Regulation: 40mV (Vin=10V~20V, @Io=500mA)  
Load Regulation: 5mV (Vin=15V, @Io=10mA~500mA)  
Short Circuit Current: 1.3A (Vin=15V, @RL=0.1Ω  
H34063AP, H34063AS  
HSMC Product Specification  
Spec. No. : IC200407  
Issued Date : 2003.04.01  
Revised Date : 2005.03.25  
Page No. : 5/7  
HI-SINCERITY  
MICROELECTRONICS CORP.  
Fig.5 Step-Down Converter With External PNP Saturation Switch  
R1  
H34063A  
R2  
8
7
6
1
2
3
4
Q1  
L1  
RSC  
C1  
Vout  
Cout  
Vin  
CT  
D1  
5
RB  
RA  
Fig.6 Voltage Inverting Converter  
D1  
Vout  
-12V / 100mA  
H34063A  
H1N5819  
8
7
6
RSC  
0.25  
1
2
3
4
L1  
100uH  
Cout  
470uF  
Vin  
4.5V-6V  
CT  
680pF  
5
C1  
100uF  
RA  
953Ω  
RB  
8.2kΩ  
Line Regulation: 20mV (Vin=4.5V~6V, @Io=100mA)  
Load Regulation: 100mV (Vin=5V, @Io=10mA~100mA)  
Fig.7 Voltage Inverting Converter With External PNP Saturation Switch  
R2  
H34063A  
R1  
Q1  
L1  
8
7
6
1
2
3
4
RSC  
Vin  
D1  
5
CT  
RA  
Vout  
C1  
Cout  
RB  
H34063AP, H34063AS  
HSMC Product Specification  
Spec. No. : IC200407  
Issued Date : 2003.04.01  
Revised Date : 2005.03.25  
Page No. : 6/7  
HI-SINCERITY  
MICROELECTRONICS CORP.  
DIP-8 Dimension  
DIM  
A
B
C
D
E
Min.  
6.29  
9.22  
-
-
-
3.25  
3.17  
0.38  
2.28  
7.49  
-
8.56  
0.229  
94o  
Max.  
6.40  
9.32  
*1.52  
*1.27  
*0.99  
3.35  
3.55  
0.53  
2.79  
7.74  
*3.00  
8.81  
0.381  
97o  
Marking:  
6
3
5
4
8
1
7
2
Pb Free Mark  
Pb-Free: " . "  
Normal: None  
(Note)  
A
H
P
3 4 0 6 3 A  
Control Code  
Date Code  
F
B
G
H
I
J
K
L
M
α1  
J
Note: Green label is used for pb-free packing  
Pin Style: 1.SWC 2.SWE 3.TC 4.GND  
5.FB 6.VCC 7.Ipk 8.DRC  
F
Material:  
Lead solder plating: Sn60/Pb40 (Normal),  
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)  
Mold Compound: Epoxy resin family,  
flammability solid burning class: UL94V-0  
α1  
K
L
E
C
G
H
*: Typical, Unit: mm  
M
D
I
8-Lead DIP-8  
Plastic Package  
HSMC Package Code: P  
SO-8 Dimension  
DIM  
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
Min.  
4.85  
3.85  
5.80  
1.22  
0.37  
3.74  
1.45  
4.80  
0.05  
0.30  
0.19  
0.37  
0.23  
0.08  
0.00  
Max.  
5.10  
3.95  
6.20  
1.32  
0.47  
3.88  
1.65  
5.10  
0.20  
0.70  
0.25  
0.52  
0.28  
0.13  
0.15  
Marking:  
A
G
Pb Free Mark  
Pb-Free: " . "  
Normal: None  
(Note)  
H
S
I
3 4 0 6 3 A  
8
7
6
5
4
Pin 1 Index  
Date Code  
Control Code  
C
B
H
Pin1 Index  
Note: Green label is used for pb-free packing  
2
3
Pin Style: 1.SWC 2.SWE 3.TC 4.GND  
5.FB 6.VCC 7.Ipk 8.DRC  
J
Material:  
D
E
K
Lead solder plating: Sn60/Pb40 (Normal),  
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)  
Mold Compound: Epoxy resin family,  
flammability solid burning class: UL94V-0  
Part A  
L
Part A  
N
M
*: Typical, Unit: mm  
O
F
8-Lead SO-8 Plastic  
Surface Mounted Package  
HSMC Package Code: S  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.  
HSMC reserves the right to make changes to its products without notice.  
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
Head Office And Factory:  
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.  
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454  
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel: 886-3-5983621~5 Fax: 886-3-5982931  
H34063AP, H34063AS  
HSMC Product Specification  
Spec. No. : IC200407  
Issued Date : 2003.04.01  
Revised Date : 2005.03.25  
Page No. : 7/7  
HI-SINCERITY  
MICROELECTRONICS CORP.  
Soldering Methods for HSMC’s Products  
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%  
2. Reflow soldering of surface-mount devices  
Figure 1: Temperature profile  
t
P
Critical Zone  
to T  
TP  
T
L
P
Ramp-up  
TL  
t
L
Tsmax  
Tsmin  
tS  
Preheat  
Ramp-down  
25  
t 25oC to Peak  
Time  
Profile Feature  
Average ramp-up rate (TL to TP)  
Preheat  
Sn-Pb Eutectic Assembly  
<3oC/sec  
Pb-Free Assembly  
<3oC/sec  
- Temperature Min (Tsmin  
)
100oC  
150oC  
150oC  
200oC  
- Temperature Max (Tsmax  
- Time (min to max) (ts)  
Tsmax to TL  
)
60~120 sec  
60~180 sec  
- Ramp-up Rate  
<3oC/sec  
<3oC/sec  
Time maintained above:  
- Temperature (TL)  
- Time (tL)  
183oC  
217oC  
60~150 sec  
240oC +0/-5oC  
60~150 sec  
260oC +0/-5oC  
Peak Temperature (TP)  
Time within 5oC of actual Peak  
10~30 sec  
20~40 sec  
Temperature (tP)  
Ramp-down Rate  
<6oC/sec  
<6oC/sec  
Time 25oC to Peak Temperature  
<6 minutes  
<8 minutes  
3. Flow (wave) soldering (solder dipping)  
Products  
Pb devices.  
Peak temperature  
245oC ±5oC  
260oC +0/-5oC  
Dipping time  
5sec ±1sec  
5sec ±1sec  
Pb-Free devices.  
H34063AP, H34063AS  
HSMC Product Specification  

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