HJ6668 [HSMC]
PNP EPITAXIAL PLANAR TRANSISTOR; PNP外延平面晶体管
| 型号： | HJ6668 |
| 厂家： | 
HI-SINCERITY MOCROELECTRONICS |
| 描述： | PNP EPITAXIAL PLANAR TRANSISTOR |
| 文件： | 总3页 (文件大小：34K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : Preliminary Data
Issued Date : 1999.03.01
Revised Date : 2000.11.01
Page No. : 1/3
HI-SINCERITY
MICROELECTRONICS CORP.
HJ6668
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HJ6668 is designed for general-purpose amplifier and switching
applications.
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature ................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) .................................................................................... 65 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage..................................................................................... -80 V
BVCEO Collector to Emitter Voltage.................................................................................. -80 V
BVEBO Emitter to Base Voltage.......................................................................................... -5 V
IC Collector Current........................................................................................................... -10 A
Characteristics (Ta=25°C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
BVCEO
IEBO
ICEO
ICEV
*VCE(sat)1
*VCE(sat)2
*VBE(on)1
*VBE(on)2
*hFE1
-80
-80
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
mA
mA
uA
V
V
V
V
K
IC=-10mA
IC=-200mA
VEB=-5V
VCE=-80V
VCE=-80V, VBE(off)=-1.5V
IC=-5A, IB=-10mA
IC=-10A, IB=-100mA
IC=-5A, VCE=-3V
IC=-10A, VCE=-3V
IC=-5A, VCE=-3V
IC=-10A, VCE=-3V
-100
-1
-300
-2
-3
-2.8
-4.5
20
-
1
100
*hFE2
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
Spec. No. : Preliminary Data
Issued Date : 1999.03.01
Revised Date : 2000.11.01
Page No. : 2/3
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
10000
1000
100
10
10000
CE
hFE @ V =3V
BE(sat)
V
C
B
@ I =100I
1000
CE(sat)
V
C
B
@ I =100I
100
1
10
100
1000
10000
1
10
100
Collector Current (mA)
1000
10000
Collector Current (mA)
On Voltage & Collector Current
Switching Time & Collector Current
10000
10
CC
V
C
B1
B2
=30V, I =250I =-250I
Tstg
1000
BE(on)
V
CE
@ V =3V
1
Tf
Ton
100
0.1
1
10
100
1000
10000
10
Collector Current (mA)
Collector Current (A)
Capacitance & Reverse-Biased Voltage
1000
100
Cob
10
0.1
1
10
100
Reverse-Biased Voltage (V)
HSMC Product Specification
Spec. No. : Preliminary Data
Issued Date : 1999.03.01
Revised Date : 2000.11.01
Page No. : 3/3
HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
Marking :
A
C
HSMC Logo
Part Number
Date Code
Product Series
D
B
Rank
Ink Mark
L
F
G
Style : Pin 1.Base 2.Collector 3.Emitter
3
2
H
E
K
I
1
J
3-Lead TO-252 Plastic Surface Mount Package
HSMC Package Code : J
*:Typical
Inches
Min. Max.
Millimeters
Inches
Min. Max.
0.0866 0.1102
Millimeters
DIM
DIM
Min.
Max.
0.55
1.95
1.50
0.60
6.80
5.80
Min.
Max.
2.80
*2.30
0.90
0.80
5.50
1.60
A
B
C
D
E
F
0.0177 0.0217
0.0650 0.0768
0.0354 0.0591
0.0177 0.0236
0.2520 0.2677
0.2125 0.2283
0.45
1.65
0.90
0.45
6.40
5.40
G
H
I
J
K
L
2.20
-
-
-
*0.0906
0.0354
0.0315
-
-
-
0.2047 0.2165
0.0551 0.0630
5.20
1.40
Notes : 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
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