HSA1015 [HSMC]
PNP EPITAXIAL PLANAR TRANSISTOR; PNP外延平面晶体管![HSA1015](http://pdffile.icpdf.com/pdf1/p00054/img/icpdf/HSA1015_280359_icpdf.jpg)
型号: | HSA1015 |
厂家: | ![]() |
描述: | PNP EPITAXIAL PLANAR TRANSISTOR |
文件: | 总3页 (文件大小:38K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Spec. No. : HE6512-B
Issued Date : 1992.11.25
Revised Date : 2000.09.15
Page No. : 1/3
HI-SINCERITY
MICROELECTRONICS CORP.
HSA1015
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HSA1015 is designed for use in driver stage of AF amplifier and
general purpose amplification.
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature ................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................... 400 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ....................................................................................... -50 V
VCEO Collector to Emitter Voltage .................................................................................... -50 V
VEBO Emitter to Base Voltage ............................................................................................ -5 V
IC Collector Current ..................................................................................................... -150 mA
(Ta=25°C)
Characteristics
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
IC=-100uA, IE=0
IC=-1mA, IB=0
IE=-10uA, IC=0
VCB=-50V, IE=0
BVCBO
BVCEO
BVEBO
ICBO
-50
-50
-5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
nA
nA
mV
V
-100
-100
-300
-1.1
700
-
IEBO
VEB=-5V, IC=0
*VCE(sat)
*VBE(sat)
*hFE1
*hFE2
fT
IC=-100mA, IB=-10mA
IC=-100mA, IB=-10mA
VCE=-6V, IC=-2mA
VCE=-6V, IC=-150mA
VCE=-10V, IC=-1mA, f=100MHz
VCB=-10V, f=1MHz, IE=0
-
120
25
80
-
-
7
MHz
pF
Cob
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE1
Rank
Y
GR
200-400
BL
350-700
Range
120-240
HSMC Product Specification
Spec. No. : HE6512-B
Issued Date : 1992.11.25
Revised Date : 2000.09.15
Page No. : 2/3
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
1000.0
100.0
10.0
1
BE(sat)
C
B
V
@ I =10I
CE
=6V
V
0.1
CE(sat)
V
C
B
@ I =10I
1.0
0.01
0.1
1
10
Collector Current (mA)
100
1000
0.01
0.1
1
10
100
1000
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
Cutoff Frequency & Collector Current
10.00
1000
100
10
CE
=10V
V
Cob
1.00
0.1
1
1
10
100
1
10
100
1000
Collector Current (mA)
Reverse-Biased Voltage (V)
Safe Operating Area
PD-Ta
10000
1000
100
10
450
400
350
300
250
200
150
100
50
T
P =1ms
T
P =100ms
T
P =1s
0
1
0
50
100
150
200
1
10
Forward Biased Voltage-V (V)
100
Ambient Temperature-Ta(oC)
CE
HSMC Product Specification
Spec. No. : HE6512-B
Issued Date : 1992.11.25
Revised Date : 2000.09.15
Page No. : 3/3
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
α
α
2
3
Marking :
A
HSMC Logo
Part Number
Date Code
Product Series
B
C
1
2
3
Rank
Laser Mark
HSMC Logo
Product Series
D
Part Number
H
G
Ink Mark
Style : Pin 1.Emitter 2.Collector 3.Base
α
1
I
E
F
3-Lead TO-92 Plastic Package
HSMC Package Code : A
*:Typical
Inches
Millimeters
DIM
Inches
Min. Max.
0.0142 0.0220
Millimeters
DIM
Min.
Max.
Min.
4.33
4.33
12.70
0.36
-
Max.
4.83
4.83
-
Min.
0.36
Max.
0.56
*2.54
*1.27
*5°
A
B
C
D
E
F
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
G
H
I
-
-
-
-
-
*0.1000
*0.0500
*5°
-
-
-
-
-
-
0.56
*1.27
3.76
α1
α2
α3
-
*2°
*2°
*2°
3.36
*2°
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
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