HSA1015 [HSMC]

PNP EPITAXIAL PLANAR TRANSISTOR; PNP外延平面晶体管
HSA1015
型号: HSA1015
厂家: HI-SINCERITY MOCROELECTRONICS    HI-SINCERITY MOCROELECTRONICS
描述:

PNP EPITAXIAL PLANAR TRANSISTOR
PNP外延平面晶体管

晶体 晶体管 局域网
文件: 总3页 (文件大小:38K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Spec. No. : HE6512-B  
Issued Date : 1992.11.25  
Revised Date : 2000.09.15  
Page No. : 1/3  
HI-SINCERITY  
MICROELECTRONICS CORP.  
HSA1015  
PNP EPITAXIAL PLANAR TRANSISTOR  
Description  
The HSA1015 is designed for use in driver stage of AF amplifier and  
general purpose amplification.  
Absolute Maximum Ratings  
Maximum Temperatures  
Storage Temperature............................................................................................ -55 ~ +150 °C  
Junction Temperature ................................................................................... +150 °C Maximum  
Maximum Power Dissipation  
Total Power Dissipation (Ta=25°C) ............................................................................... 400 mW  
Maximum Voltages and Currents (Ta=25°C)  
VCBO Collector to Base Voltage ....................................................................................... -50 V  
VCEO Collector to Emitter Voltage .................................................................................... -50 V  
VEBO Emitter to Base Voltage ............................................................................................ -5 V  
IC Collector Current ..................................................................................................... -150 mA  
(Ta=25°C)  
Characteristics  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Test Conditions  
IC=-100uA, IE=0  
IC=-1mA, IB=0  
IE=-10uA, IC=0  
VCB=-50V, IE=0  
BVCBO  
BVCEO  
BVEBO  
ICBO  
-50  
-50  
-5  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
nA  
nA  
mV  
V
-100  
-100  
-300  
-1.1  
700  
-
IEBO  
VEB=-5V, IC=0  
*VCE(sat)  
*VBE(sat)  
*hFE1  
*hFE2  
fT  
IC=-100mA, IB=-10mA  
IC=-100mA, IB=-10mA  
VCE=-6V, IC=-2mA  
VCE=-6V, IC=-150mA  
VCE=-10V, IC=-1mA, f=100MHz  
VCB=-10V, f=1MHz, IE=0  
-
120  
25  
80  
-
-
7
MHz  
pF  
Cob  
*Pulse Test : Pulse Width 380us, Duty Cycle2%  
Classification Of hFE1  
Rank  
Y
GR  
200-400  
BL  
350-700  
Range  
120-240  
HSMC Product Specification  
Spec. No. : HE6512-B  
Issued Date : 1992.11.25  
Revised Date : 2000.09.15  
Page No. : 2/3  
HI-SINCERITY  
MICROELECTRONICS CORP.  
Characteristics Curve  
Current Gain & Collector Current  
Saturation Voltage & Collector Current  
1000.0  
100.0  
10.0  
1
BE(sat)  
C
B
V
@ I =10I  
CE  
=6V  
V
0.1  
CE(sat)  
V
C
B
@ I =10I  
1.0  
0.01  
0.1  
1
10  
Collector Current (mA)  
100  
1000  
0.01  
0.1  
1
10  
100  
1000  
Collector Current (mA)  
Capacitance & Reverse-Biased Voltage  
Cutoff Frequency & Collector Current  
10.00  
1000  
100  
10  
CE  
=10V  
V
Cob  
1.00  
0.1  
1
1
10  
100  
1
10  
100  
1000  
Collector Current (mA)  
Reverse-Biased Voltage (V)  
Safe Operating Area  
PD-Ta  
10000  
1000  
100  
10  
450  
400  
350  
300  
250  
200  
150  
100  
50  
T
P =1ms  
T
P =100ms  
T
P =1s  
0
1
0
50  
100  
150  
200  
1
10  
Forward Biased Voltage-V (V)  
100  
Ambient Temperature-Ta(oC)  
CE  
HSMC Product Specification  
Spec. No. : HE6512-B  
Issued Date : 1992.11.25  
Revised Date : 2000.09.15  
Page No. : 3/3  
HI-SINCERITY  
MICROELECTRONICS CORP.  
TO-92 Dimension  
α
α
2
3
Marking :  
A
HSMC Logo  
Part Number  
Date Code  
Product Series  
B
C
1
2
3
Rank  
Laser Mark  
HSMC Logo  
Product Series  
D
Part Number  
H
G
Ink Mark  
Style : Pin 1.Emitter 2.Collector 3.Base  
α
1
I
E
F
3-Lead TO-92 Plastic Package  
HSMC Package Code : A  
*:Typical  
Inches  
Millimeters  
DIM  
Inches  
Min. Max.  
0.0142 0.0220  
Millimeters  
DIM  
Min.  
Max.  
Min.  
4.33  
4.33  
12.70  
0.36  
-
Max.  
4.83  
4.83  
-
Min.  
0.36  
Max.  
0.56  
*2.54  
*1.27  
*5°  
A
B
C
D
E
F
0.1704 0.1902  
0.1704 0.1902  
0.5000  
0.0142 0.0220  
*0.0500  
0.1323 0.1480  
G
H
I
-
-
-
-
-
*0.1000  
*0.0500  
*5°  
-
-
-
-
-
-
0.56  
*1.27  
3.76  
α1  
α2  
α3  
-
*2°  
*2°  
*2°  
3.36  
*2°  
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.  
2.Controlling dimension : millimeters.  
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.  
Material :  
Lead : 42 Alloy ; solder plating  
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.  
HSMC reserves the right to make changes to its products without notice.  
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
Head Office And Factory :  
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.  
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454  
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel : 886-3-5983621~5 Fax : 886-3-5982931  
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel : 886-3-5977061 Fax : 886-3-5979220  
HSMC Product Specification  

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