HSB1109 [HSMC]

PNP EPITAXIAL PLANAR TRANSISTOR; PNP外延平面晶体管
HSB1109
型号: HSB1109
厂家: HI-SINCERITY MOCROELECTRONICS    HI-SINCERITY MOCROELECTRONICS
描述:

PNP EPITAXIAL PLANAR TRANSISTOR
PNP外延平面晶体管

晶体 晶体管 局域网
文件: 总3页 (文件大小:36K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Spec. No. : HE6607  
Issued Date : 1993.03.15  
Revised Date : 2002.02.06  
Page No. : 1/3  
HI-SINCERITY  
MICROELECTRONICS CORP.  
HSB1109  
PNP EPITAXIAL PLANAR TRANSISTOR  
Features  
Low frequency high voltage amplifier  
Complementary pair with HSD1609  
TO-126ML  
Absolute Maximum Ratings (Ta=25°C)  
Maximum Temperatures  
Storage Temperature............................................................................................ -50 ~ +150 °C  
Junction Temperature.................................................................................... +150 °C Maximum  
Maximum Power Dissipation  
Total Power Dissipation (Ta=25°C).................................................................................. 1.25 W  
Maximum Voltages and Currents  
BVCBO Collector to Base Voltage.................................................................................... -160 V  
BVCEO Collector to Emitter Voltage................................................................................. -160 V  
BVEBO Emitter to Base Voltage........................................................................................... -5 V  
IC Collector Current....................................................................................................... -100 mA  
Electrical Characteristics (Ta=25°C)  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Test Conditions  
BVCBO  
BVCEO  
BVEBO  
ICBO  
*VCE(sat)  
VBE(on)  
*hFE1  
*hFE2  
fT  
-160  
-160  
-5  
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
uA  
V
V
IC=-10uA  
IC=-1mA  
IE=-10uA  
-10  
-2  
-1.5  
320  
-
VCB=-140V  
IC=-30mA, IB=-3mA  
IC=-10mA, VCE=-5V  
IC=-10mA, VCE=-5V  
IC=-1mA, VCE=-5V  
IC=-10mA, VCE=-5V  
VCB=-10V, f=1MHz  
-
60  
30  
-
-
140  
5.5  
-
-
MHz  
pF  
Cob  
-
*Pulse Test: Pulse Width 380us, Duty Cycle2%  
Classification Of hFE1  
Rank  
B
C
D
Range  
60-120  
100-200  
160-320  
HSB1109  
HSMC Product Specification  
Spec. No. : HE6607  
Issued Date : 1993.03.15  
Revised Date : 2002.02.06  
Page No. : 2/3  
HI-SINCERITY  
MICROELECTRONICS CORP.  
Characteristics Curve  
Current Gain & Collector Current  
Saturation Voltage & Collector Current  
1000  
1000  
125oC  
75oC  
25oC  
125oC  
25oC  
100  
100  
75oC  
CE  
hFE @ V =5V  
CE(sat)  
V
C
B
@ I =10I  
10  
10  
0.1  
1
10  
100  
1
10  
100  
C
Collector Current-I (mA)  
C
Collector Current-I (mA)  
ON Voltage & Collector Current  
Capacitance & Reverse-Biased Voltage  
1000  
100  
25oC  
75oC  
10  
125oC  
Cob  
BE(ON)  
V
CE  
@ V =5V  
1
100  
0.1  
1
10  
100  
0.1  
1
10  
100  
C
Reverse Biased Voltage (V)  
Collector Current-I (mA)  
Safe Operating Area  
Cutoff Frequency & Collector Current  
1000  
1
0.1  
T
P =1 ms  
100  
CE  
fT @ V =5V  
T
P =100 ms  
0.01  
0.001  
T
P =1 s  
10  
1
10  
100  
1000  
1
10  
100  
1000  
Collector Current (mA)  
Forward Voltage (V)  
HSB1109  
HSMC Product Specification  
Spec. No. : HE6607  
Issued Date : 1993.03.15  
Revised Date : 2002.02.06  
Page No. : 3/3  
HI-SINCERITY  
MICROELECTRONICS CORP.  
TO-126ML Dimension  
Marking:  
H
S B  
A
B
1 1 0 9  
Rank  
Date Code  
Control Code  
D
F
O
H
E
3
2
1
C
N
Style: Pin 1.Emitter 2.Collector 3.Base  
I
G
J
M
L
K
3-Lead TO-126ML Plastic Package  
HSMC Package Code: D  
*: Typical  
Inches  
Millimeters  
Min.  
Inches  
Max.  
Millimeters  
DIM  
DIM  
Min.  
Max.  
Max.  
3.70  
0.69  
1.12  
1.52  
3.12  
2.12  
1.25  
1.42  
Min.  
-
Min.  
Max.  
*4.56  
0.84  
15.00  
7.62  
3.75  
4.12  
2.14  
A
B
C
D
E
F
0.1356  
0.0170  
0.0344  
0.0501  
0.1131  
0.0737  
0.0294  
0.0462  
0.1457  
0.0272  
0.0444  
0.0601  
0.1231  
0.0837  
0.0494  
0.0562  
3.44  
0.43  
0.87  
1.27  
2.87  
1.87  
0.74  
1.17  
I
*0.1795  
0.0331  
0.5906  
0.3003  
0.1478  
0.1625  
0.0842  
-
J
0.0268  
0.5512  
0.2903  
0.1378  
0.1525  
0.0740  
0.68  
14.00  
7.37  
3.50  
3.87  
1.88  
K
L
M
N
O
G
H
Notes: 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.  
2.Controlling dimension: millimeters.  
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.  
Material:  
Lead: 42 Alloy; solder plating  
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.  
HSMC reserves the right to make changes to its products without notice.  
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
Head Office And Factory:  
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.  
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454  
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel: 886-3-5983621~5 Fax: 886-3-5982931  
HSB1109  
HSMC Product Specification  

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