JK-SMD-0603-300L [HUAXINAN]

Low Resistance Resettable Fuse PTC SMD0603 Series;


型号：	JK-SMD-0603-300L
厂家：	HuaXinAn Electronics CO.,LTD
描述：	Low Resistance Resettable Fuse PTC SMD0603 Series
文件：	总6页 (文件大小：389K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SMD0603 Low Resistance Series

Low Resistance Resettable Fuse PTC SMD0603 Series

Features

RoHS Compliant ＆ Halogen Free

faster tripping, 0603 Dimension, Surface mountable, Solid state

Operation Current: 0.35A~3.0A

Maximum Voltage: 6V

Operating Temperature：-40℃ to +85℃

Agency recognition:

Dimensions(1608mm / 0603 mils) Unit: mm

UL TUV

Delivery Time

Marking

in stock Produce

Part number

Min max Min Max

1.45 1.85 0.65 1.05

Min Max Min Min

3days 18days

JK-SMD-0603-035L

JK-SMD-0603-050L

JK-SMD-0603-075L

JK-SMD-0603-100L

JK-SMD-0603-125L

JK-SMD-0603-150L

JK-SMD-0603-175L

JK-SMD-0603-200L

JK-SMD-0603-260L

JK-SMD-0603-300L

0.3

0.4

0.5

0.7

0.7 0.15

1.0 0.15

1.2 0.15

1.4 0.15

0.1

Specifications are subject to change without notice

Tel: +86-755-27465585

HUAAN LIMITED

www.huaandz.com

Email: sales@huaandz.com

SMD0603 Low Resistance Series

Electrical characteristics(25℃)

Maximum Time

to Trip

max

Imax

Resistance（Ω）

I Hold

I Trip

Max

Certification

Delivery Time

Current

Time

in stock Produce

Part Number

（A）

（S）

Rimin

R1max

UL TUV

3days 18days

0.35 0.70

6.0V

0.50

8.0

0.1

0.6

1.0

2.0

3.0

4.0

5.0

0.15

1.0

JK-SMD-0603-035L

JK-SMD-0603-050L

JK-SMD-0603-075L

JK-SMD-0603-100L

JK-SMD-0603-125L

JK-SMD-0603-150L

JK-SMD-0603-175L

JK-SMD-0603-200L

JK-SMD-0603-260L

JK-SMD-0603-300L

0.5

0.75

1.0

1.5

2.0

2.5

3.0

3.5

4.0

5.2

6.0

0.50

0.07

0.4

0.055

0.045

0.035

0.025

0.015

0.012

0.008

0.25

0.12

0.10

0.08

0.07

0.06

0.05

0.04

1.25

1.5

1.75

2.0

2.6

3.0

Ihold = Hold Current. Maximum current device will not trip in 25°C still air.

Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air.

Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).

Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax).

Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.

R1max = Maximum device resistance is measured one hour post reflow.

Thermal Derating Chart-IH(A)

Maximum ambient operating temperatures ℃

Part Number

-40℃

0.46

0.66

0.99

1.32

1.96

-20℃

0.40

0.57

0.85

1.14

1.49

0℃

0.37

0.53

0.79

1.05

1.31

25℃

40℃

50℃

60℃

70℃

85℃

0.14

0.35A

0.50A

0.75A

1.00A

1.25A

0.29

0.41

0.61

0.82

1.02

0.25

0.36

0.44

0.73

0.91

0.24

0.34

0.30

0.69

0.86

0.20

0.28

0.17

0.56

0.70

JK-SMD-0603-035L

JK-SMD-0603-050L

JK-SMD-0603-075L

JK-SMD-0603-100L

JK-SMD-0603-125L

JK-SMD-0603-150L

JK-SMD-0603-175L

JK-SMD-0603-200L

JK-SMD-0603-260L

JK-SMD-0603-300L

0.21

0.07

0.41

0.51

2.35

2.30

1.79

1.99

1.58

1.84

1.50A

1.75A

1.22

1.43

1.09

1.27

1.03

1.20

0.84

0.98

0.62

0.72

2.00A

2.60A

3.00A

1.63

2.12

2.45

1.45

1.89

2.18

1.37

1.78

2.06

1.12

1.46

1.68

0.82

1.07

1.23

2.63

3.42

3.95

2.27

2.95

3.41

2.10

2.73

3.15

Specifications are subject to change without notice

Tel: +86-755-27465585

HUAAN LIMITED

www.huaandz.com

Email: sales@huaandz.com

SMD0603 Low Resistance Series

Part number System

JK- SMD-0603-XXX - L → Low Resistance

Holding Current Rating

0603 Dimension

Surface Mount Device

Our Mark

Test Procedures and Requirements

Test Item

Initial Resistance

Time to Trip

Test Conditions

In still air @ 25℃

Accept/Reject Criteria

Rimin ≤ R ≤ R1max

T≤maximum Time to Trip

No trip

Specified current,Vmax，25℃

30min ,at IH

Hold Current

Trip Cycle Life

Vmax，Imax，100cycles

Vmax，1hours

No arcing or burning

Trip Endurance

Physical Characteristics

Terminal materials :

Soldering zone

Tin-Plated Nickle-copper

Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.

Level 2a, per IPC/JEDEC J-STD 020C

Moisture Sensitivity

Environmental Specifications

Test

Conditions

Resistance change

Passive aging

+85℃，1000hours

±10%

±5%

Humidity aging

+85℃/85%R.H.1000hours

Thermal shock

Solvent Resistance

Vibration

MIL-STD-202,Method 107G ,+85℃/-40℃,20times

MIL-STD-202,Method 215

-30% typical resistance change

No change

ML-STD-883C,Test Condition A

No change

Recommended Pad layout(mm)

Specifications are subject to change without notice

Tel: +86-755-27465585

HUAAN LIMITED

www.huaandz.com

Email: sales@huaandz.com

SMD0603 Low Resistance Series

Solder reflow conditions

Profile Feature

Pb-Free Assembly

Average ramp-up rate (TS maxto TP)

3℃/second max.

Preheat

-Temperature Min (TS min)

-Temperature Max (TS max)

-Time (min to max) (TS min to TS max)

Time maintained above:

-Temperature (TL)

150℃

200℃

60-180 seconds

217℃

-Time (tL)

60-150 seconds

260℃

Peak Temperature (TP)

Time within 5℃of actual PeakTemperature (tP)

Ramp-down Rate

20-40 seconds

3℃/second max.

8 minutes max.

Time 25℃to Peak Temperature

StorageCondition

0℃~35℃, ≤70%RH

● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.

● Devices are not designed to be wave soldered to the bottom side of the board.

● Recommended maximum paste thickness is 0.25mm (0.010inch).

● Devices can be cleaned using standard industry methods and solvents.

Note 1: All temperature refer to topside of the package, measured on the package body surface.

Note 2: If reflow temperature exceed the recommended profile, devices may not meet the performance requirements.

Specifications are subject to change without notice

Tel: +86-755-27465585

HUAAN LIMITED

www.huaandz.com

Email: sales@huaandz.com

SMD0603 Low Resistance Series

Tape Specification and Reel Dimensions

Symbol

Dimensions(mm)

Tape

8.00±0.30

3.50±0.05

1.75±0.10

1.55±0.05

0.50±0.10

4.00±0.10

2.00±0.05

1.10±0.10

1.92±0.10

0.20±0.10

0.75/0.95±0.10

390

Leader min

Trailer min

160

Φ178±1.0

Reel

Φ60.2±0.5

11.0±0.5

9.0±1.5

Packaging Quantity

Part Number

Quantity

5000pcs

Part Number

Quantity

4000pcs

JK-SMD-0603-035L

JK-SMD-0603-050L

JK-SMD-0603-075L

JK-SMD-0603-100L

JK-SMD-0603-125L

JK-SMD-0603-150L

JK-SMD-0603-175L

JK-SMD-0603-200L

JK-SMD-0603-260L

JK-SMD-0603-300L

5000pcs

4000pcs

Specifications are subject to change without notice

Tel: +86-755-27465585

HUAAN LIMITED

www.huaandz.com

Email: sales@huaandz.com

SMD0603 Low Resistance Series

Storage

The maximum ambient temperature shall not exceed 40℃. Storage temperatures higher than 40℃ could result in the

deformation of packaging materials. The maximum relative humidity recommended for storage is 70%. High humidity with

high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the

components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be

opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.

Warning

• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and

flame.

• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be

used when repeated fault conditions or prolonged trip events are anticipated.

• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended

electronic, thermal, and mechanical procedures for electronic components.

• Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.

• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.

• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the

performance of the devices.PPTC SMD can be cleaned by standard methods.

• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper

board layouts or reflow profilecould negatively impact solderability performance of our devices.

Notes

The specification is intended to present application,product and technical data to assist the user in selecting PPTC circuit

production devices,However,users should imdependently evaluate and test the suitability of each product.HUAAN makes

on warranties as to the acduracy or completeness of the information and disclaims any liatility resulting form its use,

HUAAN’s only obligations are those im the HUAAN Standard Rerms and Conditions of Sale and in no case will HUAAN be

liable for any incidental,imdirect,or consequential damages arising from the sale,resale,or misues of its products. HUAAN

reserves the right to change of update, without notice, any information contained in this specification.

Specifications are subject to change without notice

Tel: +86-755-27465585

HUAAN LIMITED

www.huaandz.com

Email: sales@huaandz.com

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