HY70R102P [HUAYI]

N-Channel Super Junction Power MOSFET;
HY70R102P
型号: HY70R102P
厂家: HUAYI MICROELECTRONICS CO.,LTD.    HUAYI MICROELECTRONICS CO.,LTD.
描述:

N-Channel Super Junction Power MOSFET

文件: 总12页 (文件大小:1954K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HY70R102P/B/D/U  
N-Channel Super Junction Power MOSFET  
Feature Description  
Pin Description  
700V/5A  
RDS(ON)= 0.92Ω(typ.)@VGS = 10V  
100% Avalanche Tested  
Reliable and Rugged  
Lead Free and Green Devices Available  
(RoHS Compliant)  
TO-220FB-3L  
TO-263-2L  
TO-252-2L  
TO-251-3L  
Applications  
PFC Power Supply Stages  
Switching Applications  
Motor Control  
DCDC Converters  
N-Channel MOSFET  
Ordering and Marking Information  
Package Code  
P: TO-220FB-3L  
D: TO-252-2L  
P
B
B: TO-263-2L  
U: TO-251-3L  
HY70R102  
YYXXXJWW G  
HY70R102  
YYXXXJWW G  
D
U
Date Code  
YYXXX WW  
Assembly Material  
G: Halogen Free  
HY70R102  
YYXXXJWW G  
HY70R102  
YYXXXJWW G  
Note: HUAYI lead-free products contain molding compounds/die attach materials and 100% matte tin plate Termi-  
Nation finish; which are fully compliant with RoHS. HUAYI lead-free products meet or exceed the lead-Free require-  
ments of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature. HUAYI defines Green”  
to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous  
material and total of Br and Cl does not exceed 1500ppm by weight).  
HUAYI reserves the right to make changes, corrections, enhancements, modifications, and improvements to this pr  
-oduct and/or to this document at any time without notice.  
www.hymexa.com  
V1.0  
1
HY70R102P/B/D/U  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Unit  
Common Ratings (Tc=25°C Unless Otherwise Noted)  
VDSS  
VGSS  
TJ  
Drain-Source Voltage  
700  
±30  
V
V
Gate-Source Voltage  
Maximum Junction Temperature  
Storage Temperature Range  
Source Current-Continuous(Body Diode)  
150  
°C  
°C  
A
TSTG  
IS  
-55 to 150  
5
Tc=25°C  
Mounted on Large Heat Sink  
Tc=25°C  
Tc=25°C  
Tc=100°C  
Tc=25°C  
Tc=100°C  
15  
5
A
A
IDM  
Pulsed Drain Current *  
ID  
Continuous Drain Current  
3.2  
37  
A
W
PD  
Maximum Power Dissipation  
16  
W
RJC  
RJA  
RJA  
EAS  
Thermal Resistance, Junction-to-Case  
Junction-to-Ambient **  
3.2  
62.5  
110  
192  
°C/W  
°C/W  
°C/W  
mJ  
TO-220 , TO-263  
TO-251 , TO-252  
L=50mH  
Junction-to-Ambient  
Single Pulsed-Avalanche Energy ***  
Note:  
*
**  
Repetitive ratingpulse width limited by max. junction temperature.  
Surface mounted on FR-4 board.  
***  
Limited by TJmax , starting TJ=25°C , L = 50mH, RG= 25Ω, VGS =10V.  
Electrical Characteristics(Tc =25°C Unless Otherwise Noted)  
HY70R102  
Typ.  
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Max  
Static Characteristics  
VGS=0V,IDS=250uA  
VDS=700V,VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
700  
-
-
1
V
μA  
μA  
V
-
-
-
-
IDSS  
Drain-to-Source Leakage Current  
TJ=55°C  
5
VDS=VGS, IDS=250μA  
VGS=±30V,VDS=0V  
VGS=10V,IDS=2.5A  
VGS(th)  
IGSS  
Gate Threshold Voltage  
2
-
3.3  
-
4
Gate-Source Leakage Current  
Drain-Source On-State Resistance  
±100  
1.0  
nA  
Ω
RDS(ON)*  
-
0.92  
Diode Characteristics  
Diode Forward Voltage  
ISD=5A,VGS=0V  
-
-
-
0.9  
1.3  
V
VSD*  
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
175.7  
1.3  
-
-
ns  
μC  
ISD=5A,dISD/dt=100A/μs  
Qrr  
www.hymexa.com  
V1.0  
2
HY70R102P/B/D/U  
Electrical Characteristics (Cont.) (Tc =25°C Unless Otherwise Noted)  
HY70R102  
Typ.  
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Max  
Dynamic Characteristics  
R
G
Gate Resistance  
VGS=0V,VDS=0V,F=1MHz  
4.7  
363.6  
26.6  
1.1  
Ω
Ciss  
Coss  
Crss  
td(ON)  
Tr  
Input Capacitance  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
VGS=0V,  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Turn-on Rise Time  
VDS=50V,  
pF  
Frequency=1.0MHz  
24  
12  
VDD=350V,RG=25Ω,  
ns  
IDS=3A,VGS=10V  
td(OFF)  
Tf  
Turn-off Delay Time  
Turn-off Fall Time  
49  
28  
Gate Charge Characteristics  
Qg  
Qgs  
Qgd  
Total Gate Charge  
-
-
-
7.3  
1.9  
3
-
-
-
VDS =350V, VGS=10V,  
nC  
Gate-Source Charge  
Gate-Drain Charge  
ID=3A,  
Note: *Pulse testpulse width 300usduty cycle 2%  
www.hymexa.com  
V1.0  
3
HY70R102P/B/D/U  
Typical Operating Characteristics  
Figure 1: Power Dissipation  
Figure 2: Drain Current  
Tc-Case Temperature()  
Tc-Case Temperature()  
Figure 3: Safe Operation Area  
Figure 4: Thermal Transient Impedance  
VDS-Drain-Source Voltage(V)  
Tj-Junction Temperature ()  
Figure 5: Output Characteristics  
Figure 6: Drain-Source On Resistance  
VDS-Drain-Source Voltage (V)  
ID-Drain Current(A)  
www.hymexa.com  
V1.0  
4
HY70R102P/B/D/U  
Typical Operating Characteristics(Cont.)  
Figure 7 : On-Resistance vs. Temperature  
Figure 8 : Source-Drain Diode Forward  
Tj-Junction Temperature ()  
VSD-Source-Drain Voltage(V)  
Figure 9 : Capacitance Characteristics  
Figure 10 : Gate Charge Characteristics  
104  
103  
Ciss  
102  
101  
100  
10-1  
Coss  
Crss  
0
20  
40  
60  
80  
100  
VDS-Drain-Source Voltage (V)  
QG-Gate Charge (nC)  
www.hymexa.com  
V1.0  
5
HY70R102P/B/D/U  
Avalanche Test Circuit and Waveforms  
Switching Time Test Circuit and Waveforms  
Gate Charge Test Circuit and Waveforms  
www.hymexa.com  
V1.0  
6
HY70R102P/B/D/U  
Device Per Unit  
Package Type  
Unit  
Quantity  
TO-220FB-3L  
Tube  
50  
Package Information  
TO-220FB-3L  
COMMON DIMENSIONS  
mm  
NOM  
4.57  
SYMBOL  
MIN  
4.37  
1.25  
2.20  
0.70  
1.17  
0.40  
15.10  
8.80  
5.50  
9.70  
7.00  
MAX  
4.77  
1.45  
2.60  
0.95  
1.47  
0.65  
16.10  
9.40  
-
A
A1  
A2  
b
1.30  
2.40  
0.80  
b2  
c
1.27  
0.50  
D
15.60  
9.10  
D1  
D2  
E
-
10.00  
-
10.30  
-
E3  
e
2.54 BSC  
5.08 BSC  
6.50  
e1  
H1  
L
6.25  
12.75  
-
6.85  
13.80  
3.40  
3.80  
3.00  
13.50  
3.10  
L1  
ΦP  
Q
3.40  
2.60  
3.60  
2.80  
www.hymexa.com  
V1.0  
7
HY70R102P/B/D/U  
Device Per Unit  
Package Type  
Unit  
Quantity  
TO-263-2L  
Reel  
50  
Package Information  
TO-263-2L  
COMMON DIMENSIONS  
mm  
NOM  
4.57  
1.27  
2.69  
0.13  
0.81  
1.27  
0.38  
8.7  
SYMBOL  
MIN  
4.37  
1.22  
2.49  
0
MAX  
4.77  
1.42  
2.89  
0.25  
0.96  
1.47  
0.53  
8.9  
A
A1  
A2  
A3  
b
0.7  
b1  
c
1.17  
0.3  
D1  
D4  
E
8.5  
6.6  
-
-
9.86  
7.06  
10.16  
-
10.36  
-
E5  
e
2.54 BSC  
15.1  
1.27  
2.3  
H
14.7  
1.07  
2
15.5  
1.47  
2.6  
H2  
L
L1  
L4  
θ
1.4  
1.55  
0.25 BSC  
5°  
1.7  
0°  
9°  
www.hymexa.com  
V1.0  
8
HY70R102P/B/D/U  
Device Per Unit  
Package Type  
Unit  
Quantity  
TO-252-2L  
Tube  
75  
Package Information  
TO-252-2L  
COMMON DIMENSIONS  
mm  
NOM  
2.30  
-
SYMBOL  
MIN  
2.20  
0.00  
0.97  
0.68  
5.20  
0.43  
5.98  
MAX  
2.40  
0.20  
1.17  
0.90  
5.50  
0.63  
6.22  
A
A1  
A2  
b
1.07  
0.78  
5.33  
0.53  
6.10  
5.30REF  
6.60  
-
b3  
c
D
D1  
E
6.40  
4.63  
6.80  
-
E1  
e
2.286BSC  
10.10  
1.50  
2.90REF  
0.51BSC  
-
H
9.40  
1.38  
10.50  
1.75  
L
L1  
L2  
L3  
L4  
L5  
θ
0.88  
-
1.28  
1.00  
1.95  
8°  
-
1.65  
0°  
1.80  
-
www.hymexa.com  
V1.0  
9
HY70R102P/B/D/U  
Device Per Unit  
Package Type  
Unit  
Quantity  
TO-251-3L  
Tube  
75  
Package Information  
TO-251-3L  
COMMON DIMENSIONS  
mm  
NOM  
2.30  
SYMBOL  
MIN  
2.20  
0.97  
0.68  
0.00  
0.00  
5.20  
0.43  
5.98  
MAX  
2.40  
1.17  
0.90  
0.10  
0.10  
5.50  
0.63  
6.22  
A
A2  
b
1.07  
0.78  
b2  
b2'  
b3  
c
0.04  
0.04  
5.33  
0.53  
D
6.10  
D1  
E
5.30REF  
6.60  
6.40  
4.63  
6.80  
-
E1  
e
-
2.286BSC  
16.52  
9.40  
H
16.22  
9.15  
0.88  
1.65  
16.82  
9.65  
1.28  
1.95  
L1  
L3  
L5  
1.02  
1.80  
www.hymexa.com  
V1.0  
10  
HY70R102P/B/D/U  
Classification Profile  
Classification Reflow Profiles  
Profile Feature  
Preheat & Soak  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
100 °C  
150 °C  
150 °C  
200 °C  
Temperature min (Ts min  
)
Temperature max (Ts max  
)
60-120 seconds  
60-120 seconds  
Time (Ts min to Ts max) (t  
Average ramp-up rate  
s)  
3 °C/second max.  
3°C/second max.  
(Ts maxto T )  
P
Liquidous temperature (T  
Time at liquidous (t  
Peak package body Temperature  
(T )*  
Time (t  
classification temperature (T  
Average ramp-down rate (T  
Time 25°C to peak temperature  
L
)
183 °C  
217 °C  
L
)
60-150 seconds  
60-150 seconds  
See Classification Temp in table 1 See Classification Temp in table 2  
p
P
)** within 5°C of the specified  
20** seconds  
30** seconds  
c
)
p
to Ts max  
)
6 °C/second max.  
6 minutes max.  
6 °C/second max.  
8 minutes max.  
*Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.  
** Tolerance for time at peak profile temperature (t  
p
) is defined as a supplier minimum and a user maximum.  
www.hymexa.com  
V1.0  
11  
HY70R102P/B/D/U  
Table 1.SnPb Eutectic Process Classification Temperatures (Tc)  
Package  
Thickness  
2.5 mm  
≥2.5 mm  
Volume mm³  
<350  
Volume mm³  
350  
235 °C  
220 °C  
220 °C  
220 °C  
Table 2.Pb-free Process Classification Temperatures (Tc)  
Package  
Thickness  
<1.6 mm  
Volume mm³  
<350  
Volume mm³  
350-2000  
260 °C  
Volume mm³  
2000  
260 °C  
260 °C  
1.6 mm 2.5 mm  
2.5 mm  
260 °C  
250 °C  
245 °C  
250 °C  
245 °C  
245 °C  
Reliability Test Program  
Test item  
Method  
Description  
SOLDERABILITY  
JESD-22, B102  
JESD-22, A108  
JESD-22, A102  
JESD-22, A104  
5 Sec, 245°C  
HTRB  
PCT  
168 Hrs/500 Hrs/1000Hrs, Bias @ 150°C  
96 Hrs, 100%RH, 2atm, 121°C  
500 Cycles, -55°C~150°C  
TCT  
Customer Service  
Worldwide Sales and Service: sales@hymexa.com  
Technical Support: Technology@hymexa.com  
Xi'an Huayi Microelectronics Co., Ltd.  
No.8928,Shangji Road,Economic and Technological Development Zone,Xi'an,China  
TEL: (86-029) 86685706  
FAX: (86-029) 86685705  
E-mail: sales@hymexa.com  
Web net: www.hymexa.com  
www.hymexa.com  
V1.0  
12  

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