HY11P12 [HYCON]
8-Bit RISC-like Mixed Signal Microcontroller;
| 型号： | HY11P12 |
| 厂家： | 
HYCON Technology Corporation |
| 描述： | 8-Bit RISC-like Mixed Signal Microcontroller 微控制器 |
| 文件： | 总42页 (文件大小：1589K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HY11P12
Datasheet
8-Bit RISC-like Mixed Signal Microcontroller
Embedded 4x12 LCD Driver
18-Bit ΣΔADC
.
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
Table of Contents
1. FEATURES ..................................................................................................................5
2. PIN DEFINITION ..........................................................................................................6
2.1. Pin Diagram LQFP44................................................................................................6
2.2. Pin Diagram LQFP48................................................................................................7
2.3. Pin Diagram QFN48..................................................................................................8
2.4. LQFP44 Pinout I/O Description.................................................................................9
2.5. LQFP48/QFN48 Pinout I/O Description ..................................................................11
2.5.1. LQFP package marker information .......................................................14
2.5.2. QFN package marker information .........................................................14
3. APPLICATION CIRCUIT............................................................................................15
.
3.1. Bridge Sensor I .......................................................................................................15
3.2. Bridge Sensor II ......................................................................................................16
4. FUNCTION OUTLINE ................................................................................................17
4.1. Internal Block Diagram............................................................................................17
4.2. Related Description and Supporting Documents ....................................................17
4.3. SD18 Network.........................................................................................................18
5. REGISTER LIST ........................................................................................................19
6. ELECTRICAL CHARACTERISTICS..........................................................................20
6.1. Recommended operating conditions.......................................................................20
6.2. Internal RC Oscillator..............................................................................................21
6.3. Supply current into VDD excluding peripherals current...........................................22
6.4. Port1~2 ...................................................................................................................24
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page2
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
6.5. Reset (Brownout, External RST pin, Low Voltage Detect) ......................................25
6.6. Power System.........................................................................................................27
6.7. LCD.........................................................................................................................29
6.8. SD18, Power Supply and Recommended Operating Conditions ............................30
6.8.1. PGA, Power Supply and Recommended Operating Conditions............30
6.8.2. SD18, Performance II (fSD18=250KHz)...............................................31
6.8.3. SD18, Temperature Sensor...................................................................33
6.8.4. SD18 Noise Performance .....................................................................34
7. ORDERING INFORMATION ......................................................................................36
8. PACKAGE INFORMATION........................................................................................37
8.1. LQFP44(L044) ........................................................................................................37
8.2. LQFP48(L048) ........................................................................................................38
.
8.3. QFN48(N048) .........................................................................................................39
8.3.1. Package Dimensions ............................................................................39
8.3.2. Tape & Reel Information........................................................................40
9. REVISION RECORD..................................................................................................41
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page3
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
Attention:
1、 HYCON Technology Corp. reserves the right to change the content of this datasheet
without further notice. For most up-to-date information, please constantly visit our
website: http://www.hycontek.com .
2、 HYCON Technology Corp. is not responsible for problems caused by figures or
application circuits narrated herein whose related industrial properties belong to third
parties.
3、 Specifications of any HYCON Technology Corp. products detailed or contained herein
stipulate the performance, characteristics, and functions of the specified products in the
independent state. We does not guarantee of the performance, characteristics, and
functions of the specified products as placed in the customer’s products or equipment.
Constant and sufficient verification and evaluation is highly advised.
4、 Please note the operating conditions of input voltage, output voltage and load current
and ensure the IC internal power consumption does not exceed that of package
tolerance. HYCON Technology Corp. assumes no responsibility for equipment failures
that resulted from using products at values that exceed, even momentarily, rated values
listed in products specifications of HYCON products specified herein.
5、 Notwithstanding this product has built-in ESD protection circuit, please do not exert
.
excessive static electricity to protection circuit.
6、 Products specified or contained herein cannot be employed in applications which
require extremely high levels of reliability, such as device or equipment affecting the
human body, health/medical equipments, security systems, or any apparatus installed in
aircrafts and other vehicles.
7、 Despite the fact that HYCON Technology Corp. endeavors to enhance product quality
as well as reliability in every possible way, failure or malfunction of semiconductor
products may happen. Hence, users are strongly recommended to comply with safety
design including redundancy and fire-precaution equipments to prevent any accidents
and fires that may follow.
8、 Use of the information described herein for other purposes and/or reproduction or
copying without the permission of HYCON Technology Corp. is strictly prohibited.
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page4
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
1. Features
8-bit RISC, 46 instructions included.
Operating voltage range: 2.0V to 3.6V,
operation temperature range: -40℃~85℃.
External Crystal Oscillator and Internal
High Precision RC Oscillator, 6 CPU clock
rates enable users to have the most
power-saving plan.
Built-in absolute temperature sensor
1.0V internal analog circuit common
ground that equips with Push-Pull drive
ability to provide sensor driving voltage.
LVD low voltage detection function has 14
steps of voltage detection configuration
and external input voltage detection
function.
Active Mode 300uA@2MHz
Standby Mode 3uA@28KHz
Sleep Mode 1uA
VDDA can select 4 different output voltage
that equips with 10mA low dropout
regulator function.
2K Word OTP (One Time Programmable)
Type program memory, 128 Byte Data
Memory.
4x12 LCD driver
Static、1/2、1/3、1/4 Duty and 1/3
Bias Programmable Option.
Brownout detector and Watch dog Timer,
prevents CPU from Crash.
Built-in Charge Pump regulated
circuit, providing 4 LCD Bias voltage.
18-bit fully differential input Sigma-Delta
Analog-to-Digital Converter (A/D)
.
8-bit Timer A
Built-in PGA (Programmable Gain
Amplifier) 1/4x、1/2x、1x. …128x，
10 input signal gain selection.
Built-in Input zero point adjustment
can increase measurement range
according to different application.
Built-in high impedance input buffer
(Not suitable for 4x or upwards input
gain).
Support 6 stack level
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page5
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
2. Pin Definition
2.1. Pin Diagram LQFP44
33 32 31 30 29 28 27 26 25 24 23
P2.4
P2.5
VDDA
ACM
AI0
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
HY11P12
AI1
.
AI2
LQFP44
AI3
NC
NC
VSS
1
2
3
4
5
6
7
8
9
1 0 1 1
Figure 2-1 HY11P12 LQFP44 Pin Diagram
Note 1：VPP and RST use the same pin. Input voltage cannot exceed 5.8V when not programming EPROM.
Note 2：TST and PT1.3 use the same pin. Input voltage cannot exceed Vdd+0.3V while operating.
Note 3：If PT1.3 is not configured as external pin button, it can help to enhance the anti-interference ability.
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page6
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
2.2. Pin Diagram LQFP48
36 35 34 33 32 31 30 29 28 27 26 25
NC
NC
SEG2
SEG3
VDDA
ACM
AI0
SEG4
SEG5
SEG6
AI1
SEG7
HY11P12
AI2
SEG8
AI3
SEG9
LQFP48
.
NC
SEG10
SEG11
SEG12
SEG13
NC
VSS
NC
1 2
1
2
3
4
5
6
7
8
9
1 0 1 1
Figure 2-2 HY11P12 LQFP48 Pin Diagram
Note 1：VPP and RST use the same pin. Input voltage cannot exceed 5.8V when not programming EPROM.
Note 2：TST and PT1.3 use the same pin. Input voltage cannot exceed Vdd+0.3V while operating.
Note 3：If PT1.3 is not configured as external pin button, it can help to enhance the anti-interference ability.
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page7
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
2.3. Pin Diagram QFN48
36 35 34 33 32 31 30 29 28 27 26 25
NC
NC
SEG2
SEG3
VDDA
ACM
AI0
SEG4
SEG5
SEG6
AI1
SEG7
HY11P12
AI2
SEG8
AI3
SEG9
QFN48
.
NC
SEG10
SEG11
SEG12
SEG13
NC
VSS
NC
1 2
1
2
3
4
5
6
7
8
9
1 0 1 1
Figure 2-3 HY11P12 QFN48 Pin Diagram
Note 1：VPP and RST use the same pin. Input voltage cannot exceed 5.8V when not programming EPROM.
Note 2：TST and PT1.3 use the same pin. Input voltage cannot exceed Vdd+0.3V while operating.
Note 3：If PT1.3 is not configured as external pin button, it can help to enhance the anti-interference ability.
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page8
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
2.4. LQFP44 Pinout I/O Description
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel
Pin
characteristic
NO.
Pin Name
RST/VPP
Description
Pin
Buffer
Type
Type
1
RST
VPP
I
S
P
Reset IC
P
EPROM programming voltage input
PT1.0/INT0/PSCK
PT1.1/INT1/PSDI
PT1.0
INT0
I
I
I
S
S
S
Digital input
2
Interrupt input INT0
PSCK
OTP programming interface SCK
PT1.1
INT1
I
I
I
S
S
S
Digital input
3
4
Interrupt input INT1
OTP programming interface SDI
PSDI
PT1.2/LVDIN
PT1.3/TST
.
PT1.2
LVDIN
I
S
A
Digital input
A
LVD external signal input interface
5
6
7
8
9
PT1.3
TST
I
I
S
S
S
Digital input
Test Mode input pin (invalid)
Digital output
PT1.4
I/O
PT1.5/PSDO
PT1.5
PSDO
I/O
O
S
C
S
Digital output
OTP programming interface SDO
Digital input/output
PT1.6
I/O
PT1.7/BZ
PT1.7
BZ
I/O
O
-
S
C
-
Digital I/O
Buzzer output
10
11
12
13
14
15
NC
Unused
SEG13
SEG12
SEG11
SEG10
SEG9
O
O
O
O
O
A
A
A
A
A
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page9
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
16
17
18
19
20
21
22
23
24
25
26
27
28
29
SEG8
O
O
O
O
O
O
O
O
O
O
O
P
-
A
A
A
A
A
A
A
A
A
A
A
P
-
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
COM/segment output for LCD
COM/segment output for LCD
COM output for LCD
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
COM3/SEG1
COM2/SEG0
COM1
COM0
VLCD
COM output for LCD
Power supply for LCD
Unused
NC
VDD
P
P
Power supply for IC operation
PT2.0/XTO
30
31
PT2.0
XTO
I/O
A
S
A
Digital I/O
External oscillator output
.
PT2.1/XTI
PT2.1
XTI
I/O
A
S
A
C
S
S
S
Digital I/O
External oscillator input
Digital I/O
32
33
34
35
PT2.2
PT2.3
PT2.4
PT2.5
VDDA
I/O
I/O
I/O
I/O
Digital I/O
Digital I/O
Digital I/O
Regulator output, analog circuit
voltage source
Internal analog circuit common
ground pin
36
37
P
P
P
P
ACM
38
39
40
41
42
43
AI0
AI1
AI2
AI3
NC
NC
VSS
A
A
A
A
-
A
A
A
A
-
Analog channel pin
Analog channel pin
Analog channel pin
Analog channel pin
Unused
-
-
Unused
Grounding pin for IC operation
voltage
44
P
P
Table 2-1 Pin Definition and Function Description
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page10
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
2.5. LQFP48/QFN48 Pinout I/O Description
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel
Pin
Characteristic
NO.
Pin Name
Description
Unused
Pin
Type
-
Buffer
Type
-
1
2
NC
RST/VPP
RST
VPP
I
S
P
Reset IC
P
EPROM programming voltage input
PT1.0/INT0/PSCK
PT1.1/INT1/PSDI
PT1.2/LVDIN
PT1.0
INT0
I
I
I
S
S
S
Digital input
3
4
5
Interrupt input INT0
PSCK
OTP programming interface SCK
PT1.1
INT1
I
I
I
S
S
S
Digital input
Interrupt input INT1
OTP programming interface SDI
PSDI
.
PT1.2
Digital input
I
S
A
LVD external signal input interface
A
LVDIN
PT1.3/TST
6
7
PT1.3
TST
I
I
S
S
S
Digital input
Test Mode input pin (invalid)
Digital input/output
PT1.4
I/O
PT1.5/PSDO
8
PT1.5
PSDO
I/O
O
S
C
S
Digital I/O
OTP programming interface SDO
Digital input/output
9
PT1.6
I/O
PT1.7/BZ
10
PT1.7
BZ
I/O
O
-
S
C
-
Digital I/O
Buzzer output
Unused
11
12
13
14
NC
NC
-
-
Unused
SEG13
SEG12
O
O
A
A
Segment output for LCD
Segment output for LCD
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page11
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
SEG11
SEG10
SEG9
O
O
O
O
O
O
O
O
O
O
O
O
O
O
P
A
A
A
A
A
A
A
A
A
A
A
A
A
A
P
P
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
COM/segment output for LCD
COM/segment output for LCD
COM output for LCD
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
COM3/SEG1
COM2/SEG0
COM1
COM0
COM output for LCD
VLCD
Power supply for LCD
VDD
P
Power supply for IC operation
PT2.0/XTO
.
31
32
PT2.0
XTO
I/O
A
S
A
Digital I/O
External oscillator output
PT2.1/XTI
PT2.1
XTI
I/O
A
S
A
C
S
S
S
-
Digital I/O
External oscillator input
Digital input/output
Digital input/output
Digital input/output
Digital input/output
Unused
33
34
35
36
37
38
PT2.2
PT2.3
PT2.4
PT2.5
NC
I/O
I/O
I/O
I/O
-
NC
-
-
Unused
VDDA
Regulator output, analog circuit
voltage source
39
40
P
P
P
P
ACM
Internal analog circuit common
ground pin
41
42
43
44
45
AI0
AI1
AI2
AI3
NC
A
A
A
A
-
A
A
A
A
-
Analog channel pin
Analog channel pin
Analog channel pin
Analog channel pin
Unused
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page12
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
46
47
48
NC
-
P
-
-
P
-
Unused
VSS
Grounding pin for IC operation
voltage
Unused
NC
Table 2-2 LQFP48/QFN48 Pin Definition and Function Description
.
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page13
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
2.5.1. LQFP package marker information
HYCON’s Logo + Traceability code
XXXX
HY11P12
Product Name : HY11P12
Product Lot No.
XXXXXX
PIN 1 MARK
2.5.2. QFN package marker information
.
HYCON’s Logo + Traceability code
XXXX
Product Name : HY11P12
Product Lot No.
HY11P12
XXXXXX
LASER MARK for PIN 1
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page14
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
3. Application Circuit
3.1. Bridge Sensor I
Kg
Lb
1~4.7uF
1~10uF
33 32 31 30 29 28 27 26 25 24 23
P2.4
P2.5
VDDA
ACM
AI0
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
VDDA
1~10uF
AI2
22~100nF
D-
D+
0.1uF
AI1
HY11P12
LQFP44
AI2
0.1uF
AI3
VDD
PT2.2
PT2.3
NC
VDD
NC
100k
.
8
7
6
5
RST
PT1.7
24LC02
VSS
10nF
1
2
3
4
1
2
3
4
5
6
7
8
9
1 0 1 1
Figure 3-1 Bridge Sensor Application Circuit
Note 1：DCSET[2:0] can conduct bias adjustment of Load Cell zero point voltage address
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page15
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
3.2. Bridge Sensor II
Kg
Lb
1~4.7uF
1~10uF
33 32 31 30 29 28 27 26 25 24 23
P2.4
P2.5
VDDA
ACM
AI0
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
VDDA
VDDA
1~10uF
22~100nF
AI2
AI3
D-
R
TC
D+
0.1uF
AI1
HY11P12
LQFP44
AI2
0.1uF
AI3
VDD
PT2.2
PT2.3
NC
VDD
NC
100k
8
7
6
5
RST
PT1.7
24LC02
VSS
.
10nF
1
2
3
4
1
2
3
4
5
6
7
8
9
1 0 1 1
Figure 3-2 Application Circuit of Temperature Compensation Bridge Sensor
Note 1：Using external reference voltage to design temperature compensation resistor NTC basic circuit
Note 2：DCSET [2:0] can conduct bias adjustment of Load Cell zero point voltage address
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page16
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
4. Function Outline
4.1. Internal Block Diagram
XTI XTO VDD
VSS
PTn.x/BZ
C
C
P
P
C
Data
Memory
(STK：6L)
(SP：128B)
(GPR：128B)
RC
Oscillator
(HAO)
PORT
(PT1、PT2)
(BZ)
TIMER
A
(LPO)
D
D
COMx
SEGx
Program
Memory
(OTP：2KW)
LCD
4x12
CPU
H08B
Watch Dog
P
VLCD
SD18
(PGA)
(ΣΔAD)
(Network)
(Temp.senor)
RESET
(BOR)
(STACK)
(WDT)
Low Voltage
Detect
Power
System
(LVD)
(RST)
C
A
C
P
P
RST
LVDIN
AIx
VDDA ACM
.
C
P
D
A
Common I/O Pad
Power Pad
Digital Pad
Analog Pad
Figure 4-1 HY11P12 Internal Block Diagram
4.2. Related Description and Supporting Documents
IC Function Related Operating Instruction
DS-HY11P12-Vxx
UG-HY11S14-Vxx
HY11P12 Data Sheet
HY11P Series Users’ Manual
APD-CORE003-Vxx H08B Instruction Description
Development Tool Related Operating Instruction
APD-HYIDE006-Vxx HY11xxx Series Development Tool Software
Instruction Manual
APD-HYIDE005-Vxx HY11xxx Series Development Tool Hardware
Instruction Manual
APD-OTP001-Vxx
OTP Products Programming Pin Manual
Product Production Related Operating Instruction
APD-HYIDE004-Vxx HY1xxxx Series Production Line Specialized
Programmer Manual
BDI-HY11P12-Vxx
HY11P12 Individual Product Die Bonding Information
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page17
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
4.3. SD18 Network
VDDA
ENADC[0]
ADC_CK
SD18
INH[2:0]
DCSET[2:0]
VREGN[0]
ADGN[2:0]
AI2 000
AI6 001
AI4 010
OSR[2:0]
24bit
1bit
ADCR
H/M/L
Comb Filter2
AI0 011
VDD/2 100
ACM 101
INX[1:0]
INH
ADCIF
Interrupt
SI+
SI-
ΣΔAD
SI:x¼,x½ ,x2,x4,x8,x16
TPSH1 110
TPSH0 111
INX
INIS[0]
INL[2:0]
AI3 000
AI7 001
AI5 010
AI1 011
OPO 100
VSS 101
TPSL0 110
TPSL1 111
+ VR:x1,x½ -
PGAGN[1:0]
INL
VDDX
.
VR+
VR-
Control Circuit
VRH[1:0]
AI6 00
AI8 01
VRL[1:0]
i
TPSHx
+
-
TPSLx
AI5 00
AI9 01
Q1
VRH
10
VRL
AI2
ACM 11
AI3
10
VSS 11
Figure 4-2 SD18 Network
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DS-HY11P12-V16_EN
page18
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
5. Register List
“-”no use,“*”read/write,“w”write,“r”read,“r0”only read 0,“r1”only read 1,“w0”only write 0,“w1”omly write 1
“.”unimplemented bit,“x”unknown,“u”unchanged,“d”depends on condition
Address File Name
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
A-RESET i-RESET
R/W
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
r,rw0,rw0,- -,r,r,r
-,-,-,- -,*,*,*
*,*,*,* *,*,*,*
*,*,-,- *,*,*,*
-,*,-,- *,*,*,*
*,*,*,* *,*,*,*
-,-,-,* -,-,-,*
rw0,rw0,rw0,rw0 -,rw0,-,-
-,*,r,r *,*,*,*
*,*,*,* -,-,-,-
*,*,*,* *,*,*,*
-,-,*,* *,*,*,*
*,*,*,- *,*,*,*
r,r,r,r r,r,r,r
00H
05H
10H
12H
18H
1AH
1BH
23H
26H
29H
2BH
2CH
2DH
30H
31H
32H
33H
39H
3AH
3BH
3CH
3DH
3EH
3FH
40H
41H
42H
52H
53H
54H
55H
56H
57H
58H
59H
6DH
6EH
6FH
70H
71H
72H
74H
75H
77H
INDF0
Contents of FSR0 to address data memoryvalue of FSR0 not changed
Contents of FSR1 to address data memoryvalue of FSR0 not changed
Indirect Data Memory Address Pointer 0 Low Byte,FSR0[7:0]
Indirect Data Memory Address Pointer 1 Low Byte,FSR1[7:0]
N/A
N/A
N/A
N/A
INDF1
FSR0L
FSR1L
STKPTR
PCLATH
PCLATL
INTE1
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
000. .000 000. .000
STKPRT[2:0]
PC[9]
STKFL STKUN STKOV
PC[10]
PC[8]
.... .000
.... .000
PC Low Byte for PC<7:0>
0000 0000 0000 0000
00.. 0000 00.. 0000
GIE
ADCIE
ADCIF
TMAIE WDTIE
TMAIF WDTIF
E1IE
E1IF
E0IE
E0IF
INTF1
.0.. 0000
.0.. 0000
Working Register
WREG
STATUS
PSTATUS
LVDCN
PWRCN
MCKCN1
MCKCN2
MCKCN3
ADCRH
ADCRM
ADCRL
ADCCN1
ADCCN2
ADCCN3
AINET1
AINET2
TMACN
TMAR
xxxx xxxx uuuu uuuu
C
Z
...x ...x
...u ...u
PD
TO
IDLEB
LVD
BOR
SKERR
000d .0..
uduu .d..
VLDX[3:0]
LVDFG
LVDON
.000 0000 .000 uuuu
0000 .... 0000 ....
ENXT ENHAO 0000 0001 0000 0001
VDDAX[1:0]
ENVDDA
ENACM
ADCCK XTHSP
ADCS[2:0]
XTSP
HSS[1:0]
PERCK
CPUCK[1:0]
BZS[2:0]
LSCK
HSCK
..00 0000 ..00 0000
000. 0000 000. 0000
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
0000 0000 0000 0000
..00 0000 ..00 0000
LCDS[2:0]
ADC conversion memory HighByte
ADC conversion memory Middle Byte
ADC conversion memory Low Byte
r,r,r,r r,r,r,r
r,r,r,r r,r,r,r
PGAGN[1:0]
ADGN[2:0]
ENADC ENHIGN ENCHP
*,*,*,* *,*,*,*
-,-,*,* *,*,*,*
*,*,*,- -,-,-,-
*,*,*,* *,*,*,-
-,*,*,* *,*,*,-
*,*,*,* w1,*,*,*
r,r,r,r r,r,r,r
DCSET[2:0]
INBUF VRBUF VREGN
OSR[2:0]
INH[2:0]
000. ....
000. ....
INL[2:0]
INIS
0000 000. 0000 000.
.000 000. .000 000.
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
0000 000. 0000 000.
VRH[1:0]
INX[1:0]
VRL[1:0]
WDTS[2:0]
TMAS[1:0]
ENTMA TMACK
TimerA data register
ENLCD LCDPR
ENWDT
VLCDX[1:0]
LCDBI[1:0]
LCDCN1
LCDCN2
LCD0
LCDBF
*,*,*,* *,*,*,-
*,*,*,- -,-,-,-
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* r,r,r,r
*,*,*,* -,-,-,-
-,-,-,- -,*,-,-
.
LCDMX[1:0]
LCDBL
000. ....
000. ....
Segment SEG2@[3:0] and SEG3@[7:4] data register of LCD
Segment SEG4@[3:0] and SEG5@[7:4] data register of LCD
Segment SEG6@[3:0] and SEG7@[7:4] data register of LCD
Segment SEG8@[3:0] and SEG9@[7:4] data register of LCD
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
LCD1
LCD2
LCD3
Segment SEG10@[3:0] and SEG11@[7:4] data register of LCD
Segment SEG12@[3:0] and SEG13@[7:4] data register of LCD
LCD4
LCD5
PT1
PT1.7
TC1.7
PT1.6
TC1.6
PT1.5
TC1.5
PT1.4
TC1.4
PT1.3
PT1.2
PT1.1
PU1.1
PT1.0
TRISC1
PT1DA
PT1PU
PT1M1
PT1M2
PT2
0000 ....
.... .0..
0000 ....
.... .0..
DA1.2
PU1.2
PU1.7
PU1.6
PU1.5
PU1.4
PU1.3
PU1.0 0000 0000 0000 0000
*,*,*,* *,*,*,*
-,-,-,- *,*,*,*
-,*,-,- -,-,-,-
INTEG1[1:0]
INTEG0[1:0]
.... 0000
.0.. ....
.... 0000
.0.. ....
PM1.7[0]
PT2.5
TC2.5
PU2.5
PT2.4
TC2.4
PU2.4
PT2.3
TC2.3
PU2.3
PT2.2
TC2.2
PU2.2
PT2.1
TC2.1
PU2.1
PT2.0
TC2.0
PU2.0
..xx xxxx
..uu uuuu
-,-,*,* *,*,*,*
-,-,*,* *,*,*,*
-,-,*,* *,*,*,*
*,*,*,* *,*,*,*
TRISC2
PT2PU
..00 0000 ..00 0000
..00 0000 ..00 0000
xxxx xxxx uuuu uuuu
General Purpose Register as 128Byte
80H ~ FFH GPR0
Figure 5-1 HY11P12 Register List
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DS-HY11P12-V16_EN
page19
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
6. Electrical Characteristics
Absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Voltage applied at VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 4.0 V
Voltage applied to any pin (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to V + 0.3 V
DD
Voltage applied to RST/VPP pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 6.9 V
Voltage applied to TST/PT1.3 pin (see Note 1) . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to VDD + 1 V
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 mA
Storage temperature, Tstg: (unprogrammed device) . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . −55℃ to 150℃
(programmed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40℃ to 85℃
Total power dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5w
Maximum output current sink by any PORT1 to PORT3 I/O pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25mA
6.1. Recommended operating conditions
TA = -40℃ ~ 85℃, unless otherwise noted
Sym.
VDD
Parameter
Test Conditions
Min. Typ. Max.
unit
All digital peripherals and CPU
2.2
2.4
0
3.6
3.6
0
.
Supply Voltage
Analog peripherals
V
Supply Voltage
External
VSS
XTSP[0]=0, XTHSP[0]=0
Watch crystal
Ceramic resonator
Crystal
32.768K
VDD = 2.2V,
XTSP[0]=1, XTHSP[0]=0
Oscillator
450K
1M
8M
8M
Hz
XT
ENXT[0]=1
XTSP[0]=1, XTHSP[0]=0
Frequency
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DS-HY11P12-V16_EN
page20
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
6.2. Internal RC Oscillator
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
HAO
LPO
Parameter
Test Conditions
Min. Typ. Max.
unit
MHz
KHz
High Speed Oscillator frequency
Low Power Oscillator frequency
ENHAO[0]=1
1.8
22
2.0
28
2.2
35
VDD supply voltage be enable LPO
HAO vs. VDD
LPO vs. VDD
2.030
2.025
2.020
2.015
2.010
2.005
2.000
1.995
1.990
1.985
1.980
1.975
1.970
30.00
29.00
28.00
27.00
26.00
25.00
24.00
2.2V
2.4V
2.6V
2.8V
3.0V
3.2V
3.4V
3.6V
2.2V
2.4V
2.6V
2.8V
3.0V
3.2V
3.4V
3.6V
VDD
VDD
Figure 6.2-1 HAO vs. VDD
Figure 6.2-2 LPO vs. VDD
HAO vs. TA@VDD=3.0V
LPO vs. Temperature @VDD
.
1.980
31.00
30.00
29.00
28.00
27.00
26.00
25.00
24.00
1.960
1.940
1.920
1.900
1.880
1.860
1.840
1.820
VDD=3.6V
VDD=3.0V
VDD=2.2V
65
-40
-35
-15
5
25
45
85
-40℃
-15℃
15℃
25℃
45℃
75℃
85℃
Temperature (℃)
Temperature(℃)
Figure 6.2-3 HAO vs. Temperature
Figure 6.2-4 LPO vs. Temperature
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DS-HY11P12-V16_EN
page21
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
6.3. Supply current into VDD excluding peripherals current
TA = 25℃,VDD = 3.0V,OSC_LPO = 28KHz, unless otherwise noted
Sym. Parameter
Test Conditions
Min. Typ. Max.
unit
mA
mA
mA
uA
Active mode 1
OSC_CY = 8MHz, OSC_HAO = off, CPU_CK = 8MHz
OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 2MHz
OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 1MHz
OSC_CY = 32768Hz, OSC_HAO = off, CPU_CK = 16384Hz
OSC_CY = off, OSC_HAO = off, CPU_CK = LPO, Idle state
OSC_CY = off, OSC_HAO = off, CPU_CK = off, Sleep state
1
2
0.55
0.3
12
IAM1
Active mode 2
0.28
0.165
7
IAM2
Active mode 3
IAM3
Low Power 1
ILP1
Low Power 2
1.65
0.65
3
uA
ILP2
Low Power 3
1.2
uA
ILP3
OSC_CY：External Oscillator frequency.
OSC_HAO：Internal High Accuracy Oscillator frequency.
CPU_CK：CPU core work frequency.
IAM2 vs VDD
IAM1 vs VDD
450
400
350
300
250
200
150
100
1.9
1.7
1.5
1.3
1.1
0.9
0.7
0.5
.
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-1 IAM1 vs. VDD
Figure 6.3-2 IAM2 vs. VDD
ILP1 vs VDD
IAM3 vs VDD
10
9
8
7
6
5
4
3
2
1
0
250
200
150
100
50
0
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-3 IAM3 vs. VDD
Figure 6.3-4 ILP1 vs. VDD
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DS-HY11P12-V16_EN
page22
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
ILP2 vs VDD
ILP3 vs VDD
2.50
2.00
1.50
1.00
0.50
0.00
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-5 ILP2 vs. VDD
Figure 6.3-6 ILP3 vs. VDD
IAM1 with temperature at VDD=3V
ILP2 with temperature at VDD=3V
1.30
3
2.6
2.2
1.8
1.4
1
1.29
1.28
1.27
1.26
1.25
-40
-30
-20
-10
0
10
25
30
40
50
60
70
85
-40
-30
-20
-10
0
10
25
30
40
50
60
70
85
TA(℃)
TA(℃)
Figure 6.3-7 IAM1 vs. Temperature
Figure 6.3-8 ILP2 vs. Temperature
.
ILP3 with temperature at VDD=3V
1.4
1.2
1
0.8
0.6
0.4
0.2
0
-40
-30
-20
-10
0
10
25
30
40
50
60
70
85
TA(℃)
Figure 6.3-9 ILP3 vs. Temperature
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DS-HY11P12-V16_EN
page23
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
6.4. Port1~2
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
Input voltage and Schmitt trigger and leakage current and timing
High-Level input voltage
2.1
VIH
V
Low-Level input voltage
0.9
0.8
0.1
180
VIL
V
Vhys
ILKG
RPU
Input Voltage hysteresis(VIH - VIL )
Leakage Current
uA
kΩ
Port pull high resistance
Output voltage and current and frequency
VDD -0.3
High-level output voltage
IOH=10mA
IOL=-10mA
VOH
V
VSS +0.3
Low-level output voltage
VOL
VOH vs IOH @VDD=3V
VOH vs. IOH@VDD=2.2V
2.35
2.20
2.05
1.90
1.75
1.60
1.45
1.30
1.15
1.00
3.00
2.85
2.70
2.55
2.40
2.25
2.10
.
25℃
85℃
25℃
85℃
0MA
-5MA
-10MA
-15MA
-20MA
-25MA
-30MA
-35MA
0MA
-5MA
-10MA
-15MA
-20MA
-25MA
-30MA
-35MA
IOH
IOH
Figure 6.4-1 VOH vs. IOH @VDD=3.0V
Figure 6.4-2 VOH vs. IOH @VDD=2.2V
VOL vs. IOL@VDD=3.0V
VOL vs. IOL@VDD=2.2V
0.9
0.8
0.9
0.8
85℃
0.6
0.6
85℃
0.5
0.5
25℃
25℃
0.3
0.2
0.0
0.3
0.2
0.0
0MA
5MA
10MA 15MA 20MA 25MA 30MA 35MA
IOL
0MA
5MA
10MA 15MA 20MA 25MA 30MA 35MA
IOL
Figure 6.4-3 VOL vs. IOL@VDD=3.0V
Figure 6.4-4 VOL vs. IOL@VDD=2.2V
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DS-HY11P12-V16_EN
page24
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
6.5. Reset (Brownout, External RST pin, Low Voltage Detect)
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
us
2
Pulse length needed to accepted reset internally, td-LVR
1.6
1.85
70
2.1
V
VDD Start Voltage to accepted reset internally (LH),VLVR
Hysteresis, VHYS-LVR
BOR
mV
us
2
Pulse length needed as RST/VPP pin to accepted reset internally, td-RST
Input Voltage to accepted reset internally
Hysteresis, VHYS-RST
0.9
V
RST
0.8
10
V
15
uA
Operation current, ILVD
External input voltage to compare reference voltage
1.2
100
3.3
3.2
3.1
3.0
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
V
TA = -40℃ ~ 85 ℃
ppm/℃
Compare reference voltage temperature drift
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1110b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1101b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1100b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1011b
.
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1010b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1001b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1000b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0111b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0110b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0101b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0100b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0011b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0010b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0001b
LVD
V
BOR：Brownout Reset
LVR：Low Voltage Reset of BOR
LVD：Low Voltage Detect
RST：External Reset pin
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DS-HY11P12-V16_EN
page25
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
VHYS-LVR
VRST=VDD
VLVR =1.8V
BOR Start
VDD Start
VHYS-RST
VRST
=0.3xVDD
*1
*1
tRST
td-LVR
rRST
td-RST
occur
Reset stage
no occur
occur
Reset state
no occur
Figure6.5-1 BOR reset diagram
Figure6.5-2 RST reset diagram
*1 rRST：Please see BOR Introduce of HY11Pxx series User’s Guide (UG-HY11S14-Vxx).
VLVR and VLVR Release Voltaage vs. TA
1.98
1.96
1.94
VLVR Release Voltage
1.92
1.90
1.88
1.86
1.84
VLVR Voltage
1.82
1.80
-40℃
-35℃
-15℃
5℃
25℃
45℃
65℃
85℃
.
TA
Figure 6.5-3 LVR vs. Temperature
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DS-HY11P12-V16_EN
page26
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
6.6. Power System
TA = 25℃,VDD = 3.0V,unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
uA
IL = 0mA
VDDAX[1:0]=00b
VDDAX [1:0]=00b
VDDAX [1:0]=01b
VDDAX [1:0]=10b
VDDAX [1:0]=11b
VDDAX [1:0]=00b
VDDAX [1:0]=01b
VDDAX [1:0]=10b
VDDAX [1:0]=11b
TA=-40℃~85℃
22
3.3
2.9
2.6
2.4
135
150
165
180
50
VDDA operation current, IVDDA
IL = 0.1mA,
V
VDD≧VDDA+0.2V
V
Select VDDA output voltage
V
V
IL = 10mA
mV
mV
mV
mV
ppm/℃
%/V
uA
VDDA
Dropout voltage
Temperature drift
VDDAX [1:0]=11b
IL = 0.1mA
IL = 0mA
VDD Voltage drift
VDD=2.5V~3.6V
±0.2
20
ACM operation current, IACM
Output voltage ,VACM
Output voltage with Load
Temperature drift
ENACM[0]=1
.
IL = 0uA
IL = ±200uA
1.0
V
0.98
1.02
VACM
ppm/℃
uV/V
ACM
TA=-40℃~85℃
ENACM[0]=1,
50
IL = 10uA
VDDA Voltage drift
100
VDDA：Adjust Voltage Regulator
ACM：Analog Common Mode Voltage
VDDA@2.4V with VDD
VDDA@2.4V with VDD
2.3900
2.390
2.388
2.386
2.384
2.382
2.380
2.378
2.376
2.374
2.372
2.3895
2.3890
2.3885
2.3880
2.3875
2.3870
2.3865
2.3860
2.3855
2.3850
2.3845
2.3840
IL=10mA
IL=0.1mA
3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V
VDD(V)
3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V
VDD(V)
Figure 6.6-1 VDDA lL=0.1mA vs. VDD
Figure 6.6-2 VDDA lL=10mA vs. VDD
© 2008~2016 HYCON Technology Corp.
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DS-HY11P12-V16_EN
page27
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
VDDA with temperature
VDDA with temperature
2.3910
2.3880
2.3860
2.3840
2.3820
2.3800
2.3780
2.3760
2.3740
2.3720
2.3700
2.3680
2.3660
IL=10mA
I =0.1mA
L
2.3900
2.3890
2.3880
2.3870
2.3860
2.3850
2.3840
2.3830
2.3820
2.3810
VDD=3.0V
VDD=2.6V
VDD=3.0V
VDD=2.5V
-40
-35
-15
5
25
45
65
85
-40
-35
-15
5
25
45
65
85
TA(℃)
TA(℃)
Figure 6.6-3 VDDA lL=0.1mA vs. Temperature
Figure 6.6-4 VDDA lL=10mA vs. Temperature
ACM Load with VDDA
ACM vs. VDD with temperature @VDDA=2.4V
0.992
1.010
IL=200uA
VDD=3.6V
0.992
1.005
1.000
0.995
0.990
0.985
0.980
VDD=2.5V
IL=10uA
0.991
IL=0uA
0.991
0.990
IL=-200uA
0.990
0.989
0.989
0.988
2.4
2.6
2.9
3.3
-40
-20
0
20
40
60
80
100
Internal VDDA(V)
TA (℃)
Figure 6.6-5 ACM Load vs. VDDA
Figure 6.6-6 ACM vs. Temperature
.
© 2008~2016 HYCON Technology Corp.
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DS-HY11P12-V16_EN
page28
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
6.7. LCD
TA = 25℃,VDD = 3.0V, CVLCD =4.7uF, unless otherwise noted.
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
uA
LCDPR[0]=1
VDD = 2.2V
Operation supply current without
output buffer.(all segment turn on)
Supply Voltage at VLCD pin
10
ILCD
VDD = 3.0V
LCDPR[0]=0
VDD = 2.2V,
2.2
3.6
V
VLCDX[1:0]=11b
VLCDX[1:0]=10b
VLCDX[1:0]=01b
VLCDX[1:0]=00b
2.295
2.52
2.55
2.8
2.805
3.08
LCDPR[0]=1,
CVLCD =4.7uF
Embedded Charge Pump output
voltage at VLCD pin
VLCD
ZLCD
V
2.745
2.97
3.05
3.3
3.355
3.63
Output impedance with LCD buffer
fLCD =128Hz,VLCD=3.05V
10
kΩ
VLCD vs. VDD
VLCD Start Time
142
VDD=2.2V
3.08
3.05
3.02
2.99
122
102
82
62
42
22
2
2.96
VDD=3.0V
VDD=3.6V
3.3
.
2.93
2.90
2V
2.
4V
2.
6V
2.
8V
2.
0V
2V
3.
4V
3.
6V
3.
2.55
2.8
3.05
3.
VLCD(V)
VDD(V)
Figure 6.7-1 LCD start time
Figure 6.7-2 VLCD vs. VDD
VLCD vs. Load
VLCD vs. Load
3.5
3.3
VDD=3.0V
VDD=2.2V
3.3
3.1
2.9
2.7
2.5
2.3
2.1
3.1
2.9
2.7
2.5
2.3
2.1
10
20
30
40
50
60
70
80
90
100
125
150
175
200
225
250
(uA)
275
300
325
350
IL(uA)
IL
Figure 6.7-3 VLCD vs. IL @VDD=2.2V
Figure 6.7-4 VLCD vs. IL @VDD=3.0V
© 2008~2016 HYCON Technology Corp.
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DS-HY11P12-V16_EN
page29
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
6.8. SD18, Power Supply and Recommended Operating Conditions
TA = 25℃,VDD = 3.0V, VDDA=2.4V, unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage at VDDA
ENVDDA[0]=0
2.4
25
3.6
300
VSD18
Modulator sample frequency, ADC_CK
Over Sample Ratio, OSR
ENADC[0]=1
250
KHz
f SD18
256
32768
168
150
120
INBUF[0]=1,VRBUF[0]=0
ENADC[0]=1
Operation supply current
without PGA
GAIN =4,
uA
I SD18
INBUF[0]=0,VRBUF[0]=1
ENADC[0]=1
ADC_CK=250KHz
INBUF[0]=0,VRBUF[0]=0
6.8.1. PGA, Power Supply and Recommended Operating Conditions
TA = 25℃,VDD = 3.0V, VDDA=2.4V, unless otherwise noted
.
Sym.
VPGA
I PGA
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage at VDDA
Operation supply current
Gain temperature drift
ENVDDA[0]=0
2.4
3.6
PGAGN[1:0]=<01>or<1x>
320
5
uA
TA = -40℃~ 85℃
ppm/℃
GAIN=128
GPGA
© 2008~2016 HYCON Technology Corp.
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DS-HY11P12-V16_EN
page30
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
6.8.2. SD18, Performance II (fSD18=250KHz)
TA = 25℃,VDD = 3.0V, VDDA=2.9V,VVR=1.0V,GAIN=1 without PGA, unless otherwise noted
Sym.
Parameter
Integral Nonlinearity(INL)
No Missing Codes3
Test Conditions
Min. Typ. Max.
unit
%FSR
Bits
VDDA=2.4V,VVR=1.0V,ΔSI=±200mV
±0.003
±0.01
INL
VDDA=2.4V,VVR=1.0V,ΔSI=±450mV
ADC_CK=250KHz,OSR[2:0]=010b
INBUF[0]=0b,VRBUF[0]=0b
23
Temperature drift
INBUF[0]=1b,VRBUF[0]=0b
INBUF[0]=0b,VRBUF[0]=1b
INBUF[0]=1b,VRBUF[0]=1b
TA = -40℃~
85℃
ppm/℃
Gain 1~x16 (INBUF[0]=0b,)
Gain 1~x4 (INBUF[0]=1b,)
2
GSD18
Offset error of Full Scale Rang input
voltage range with Chopper and
Buffer(INBUF,VRBUF) without PGA
Offset error of Full Scale Rang input
voltage range with Chopper without
PGA and Buffer(INBUF,VRBUF)
Gain=2
1
1
%FSR
ΔAI=0V
Gain=2
ΔVR=0.9V
DCSET[2:0]=<000>
.
GAIN=1
GAIN=2
GAIN=4
GAIN=16
GAIN=1
GAIN=2
GAIN=4
2
1
*ΔAI is external short
Offset temperature drift with
chopper without PGA and Buffer
(INBUF,VRBUF).
EOS
0.5
0.15
2
uV/℃
Offset temperature drift with chopper and Buffer
(INBUF,VRBUF) without PGA.
1
0.5
Offset temperature drift with chopper without Buffer
(INBUF,VRBUF).
GAIN=128
0.02
90
VCM=0.7V to 1.7V,
VSI=0V,
GAIN=1
VSI=0V,
GAIN=16
GAIN=1
PGA=off
GAIN=16
PGA=8
VVR=1.0V,without PGA
Common-mode rejection
dB
dB
CMSD18
VCM=0.7V to 1.7V,
75
VVR=1.0V, without PGA
VDDA=3.0V,ΔVDDA=±100mV,
DC power supply rejection
PSRR
75
VVR=1.0V, VSI=1.2V,VSI-=1.2V,
© 2008~2016 HYCON Technology Corp.
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DS-HY11P12-V16_EN
page31
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
SD18 Offset Drfit vs. Temperature
SD18 Offset Drfit vs. Temperature
5
0
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
-4.5
-5.0
-5
-10
-15
-20
-25
-40℃ -20℃ 0℃
20℃ 40℃ 60℃ 80℃
-40℃ -20℃
0℃
20℃ 40℃ 60℃ 80℃
TA
TA
Gain=1, SI and VR buffer off
VIN short to ACM
∆VR=1.2V, VDDA=2.4V
Gain=16, SI and VR buffer off
VIN short to ACM
∆VR=1.2V, VDDA=2.4V
Figure 6.8-1(a) SD18 Offset Temperature Drift
Figure 6.8-1(b) SD18 Offset Temperature Drift
SD18 Gain Drfit vs. Temperature
SD18 Offset Drfit vs. Temperature
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
1
0.5
0
-0.5
-1
-1.5
-2
-0.03%
-40℃ -20℃ 0℃ 20℃ 40℃ 60℃ 80℃
-40℃ -20℃ 0℃ 20℃ 40℃ 60℃ 80℃
TA
Gain=128, SI and VR buffer off
VIN short to ACM
∆VR=1.2V, VDDA=2.4V
TA
Gain=1, SI and VR buffer off
∆SI=300mV, ∆VR=0.9V
VDDA=2.4V
Figure 6.8-1(c) SD18 Offset Temperature Drift
Figure 6.8-2(a) SD18 Gain Drift with Temperature
.
SD18 Gain Drfit vs. Temperature
SD18 Gain Drfit vs. Temperature
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
-0.03%
-0.03%
-40℃ -20℃ 0℃ 20℃ 40℃ 60℃ 80℃
TA
-40℃ -20℃ 0℃ 20℃ 40℃ 60℃ 80℃
TA
Gain=128, SI and VR buffer off
∆SI=4.6875mV, ∆VR=0.9V
VDDA=2.4V
Gain=16, SI and VR buffer off
∆SI=37.5mV, ∆VR=0.9V
VDDA=2.4V
Figure 6.8-2(b) SD18 Gain Drift with Temperature
Figure 6.8-2(c) SD18 Gain Drift with Temperature
© 2008~2016 HYCON Technology Corp.
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DS-HY11P12-V16_EN
page32
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
6.8.3. SD18, Temperature Sensor
TA = 25℃,VDD = 3.0V, VDDA=3.3V, unless otherwise noted
Sym.
TCS
Parameter
Test Conditions
ΔVR=2.4V,VRGN[0]=1,
INBUF[0]=1
Min. Typ. Max.
unit
uV/℃
℃
Sensor temperature drift
178
-289
±2
Absolute Temperature Scale 0°K
One point calibrate error temperature
KT
Calibration at 25℃ of -40℃~85℃
℃
TCERR
TPS Voltage vs. Temperature
70
60
50
40
30
20
10
0
-45
-30
-15
0
15
30
45
60
75
90
TA(℃)
Figure 6.8-3 TPS Output Voltage vs. Temperature Drift
.
© 2008~2016 HYCON Technology Corp.
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page33
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
6.8.4. SD18 Noise Performance
TA = 25℃,VDD = 3.0V, VDDA=2.4V,unless otherwise noted
HY11P12 provides important input noise specification that aims at SD18. Table6.8-4(a)
and Table6.8-4(b) lists out the relations of typical noise specification, Gain, Output rate, and
maximum input voltage of single end. Test condition configuration and external input signal
short, voltage reference: 1.2V and 1024 records were sampled.
ENOB(RMS) with OSR/GAIN at A/D Clock=250Khz, VDDA=2.4V, VREF=1.2V
OSR
256
512
1024
2048
4096
8192 16384 32768
Max. Vin(mV)
=0.9*VREF (1)
Output rate(HZ)
977
488
244
122
61
31
15
8
Gain
0.25
0.5
1
=
=
=
=
=
=
=
=
=
=
=
PGA × ADGN
±2400
±2160
±1080
±540
±270
±135
±68
1
1
1
1
1
1
1
2
4
8
×
×
×
×
×
×
×
×
×
×
0.25
0.5
1
16.3
16.3
16.2
16.1
16.0
15.9
15.6
14.8
14.5
14.0
17.4
17.3
17.2
17.1
16.9
16.6
16.3
15.3
15.0
14.6
17.9
17.9
17.8
17.6
17.5
17.2
16.8
15.9
15.5
15.1
18.5
18.4
18.3
18.2
18.0
17.7
17.3
16.4
16.0
15.6
19.0
18.9
18.8
18.7
18.5
18.2
17.7
16.9
16.5
16.0
19.5
19.4
19.3
19.2
18.9
18.7
18.3
17.4
17.0
16.6
20.0
19.8
19.7
19.6
19.4
19.2
18.8
17.8
17.5
17.0
20.4
20.2
20.1
20.0
19.8
19.6
19.3
18.3
18.0
17.5
2
2
4
4
8
8
16
32
64
128
16
16
16
16
±34
±17
±8
.
(1) Max.Vin (mV) is the max. input voltage of single end to ground (VSS).
Table6.8-4(a) SD18 ENOB Table
RMS Noise(uV) with OSR/GAIN at A/D Clock=250Khz, VDDA=2.4V, VREF=1.2V
OSR
256
512
1024
2048
4096
8192 16384 32768
Max. Vin(mV)
=0.9*VREF
Output rate(HZ)
977
488
244
122
61
31
15
8
Gain
0.25
0.5
1
=
=
=
=
=
=
=
=
=
=
=
PGA × ADGN
±2400
±2160
±1080
±540
±270
±135
±68
1
1
1
1
1
1
1
2
4
8
×
×
×
×
×
×
×
×
×
×
0.25 121.08 57.40 38.74 26.66 18.39 13.21
9.49
5.12
2.80
1.48
0.87
0.51
0.33
0.32
0.20
0.14
6.98
3.91
2.13
1.12
0.65
0.39
0.24
0.23
0.14
0.10
0.5
1
61.63 29.23 19.21 13.51
9.78
5.19
2.86
1.67
1.01
0.70
0.62
0.41
0.28
7.02
3.77
2.06
1.19
0.73
0.46
0.45
0.29
0.19
32.21 15.70 10.25
7.31
4.06
2.37
1.44
0.92
0.89
0.56
0.38
2
2
16.59
9.00
5.04
3.03
2.61
1.66
1.13
8.54
4.84
2.97
1.84
1.81
1.13
0.77
5.91
3.33
2.02
1.29
1.27
0.80
0.55
4
4
8
8
16
32
64
128
16
16
16
16
±34
±17
±8
Table6.8-4(b) SD18 RMS Noise Table
© 2008~2016 HYCON Technology Corp.
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DS-HY11P12-V16_EN
page34
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
The RMS noise is referred to the input. The Effective Number of Bits (ENOB (RMS Bit))
is defined as :
FSR
ln
RMSNoise
ENOB(RMS) =
ln(2)
1024
2
2× VREF×
(
[
ADO k
]
- Average
)
∑
k=1
RMSNoise =
223
Where FSR (Full- Scale Range) = 2× VREF/Gain.
1024
(
ADO
[ ]
k
)
∑
k=1
Average =
1024
RMS Noise Diagram
RMS Noise Diagram
450
400
350
300
250
200
150
100
50
3
2
Gain=1
Output rate ~ 8sps
Gain=1
Output rate ~ 8sps
1
0
.
-1
-2
-3
0
-3
-2
-1
0
1
2
3
1
201
401
601
801
1001
Output Code (LSB)
Time (reading number)
LSB base on 20-bit output
LSB base on 20-bit output
Figure 6.8-4(a) RMS Noise Diagram
Figure 6.8-4(b) Output Code Diagram
RMS Noise Diagram
RMS Noise Diagram
5
4
350
300
250
200
150
100
50
Gain=128
Output rate ~ 8sps
Gain=128
Output rate ~ 8sps
3
2
1
0
-1
-2
-3
-4
-5
0
-5
-4
-3
-2
-1
0
1
2
3
4
5
1
201
401
601
801
1001
Output Code (LSB)
Time (reading number)
LSB base on 18-bit output
LSB base on 18-bit output
Figure 6.8-4(c) RMS Noise Diagram
Figure 6.8-4(d) Output Code Diagram
© 2008~2016 HYCON Technology Corp.
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DS-HY11P12-V16_EN
page35
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
7. Ordering Information
Shipment
Code2 Packing
Type
Package
Type
Package
Drawing
Unit
Material
Device No.1
Pins
MSL3
Q’ty Composition
4
HY11P12-D000
HY11P12-L044
HY11P12-L048
HY11P12-N048
Die
-
D
L
000
044
048
048
000
000
000
000
-
200
160
250
-
Green
Green
Green
Green
4
4
4
LQFP
LQFP
QFN
44
48
48
Tray
Tray
MSL-3
MSL-3
MSL-3
L
N
Tape & Reel 3000
1 Device No.: Model No. – Package Type Description – Code (Blank Code/ Standard/
Customized Programming Code)
Ex: Your customized programming code is 008 and you require die shipment.
The device No. will be HY11P12-D000-008.
Ex: You request blank code in die package.
The device No. will be HY11P12-D000.
Ex: You request blank code in LQFP 44 package.
.
The device No. will be HY11P12-L044.
And please clearly indicate the shipment packing type when placing orders.
Ex: Your customized programming code is 009 and you require products in LQFP 48
package.
The device No. will be HY11P12-L048-009.
And please clearly indicate the shipment packing type when placing orders.
2 Code:
“001”~ “999” is standard or customized programming code. Blank code does not have
these numbers.
3 MSL:
The Moisture Sensitivity Level ranking conforms to IPC/JEDEC J-STD-020 industry
standard categorization. The products are processed, packed, transported and used
with reference to IPC/JEDEC J-STD-033.
4 Green (RoHS & no Cl/Br):
HYCON products are Green products that are compliant with RoHS directive, SVHC
under REACH and Halogen free.
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page36
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
8. Package Information
8.1. LQFP44(L044)
.
JEDEC MS-026 compliant
© 2008~2016 HYCON Technology Corp.
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DS-HY11P12-V16_EN
page37
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
8.2. LQFP48(L048)
.
JEDEC MS-026 compliant
© 2008~2016 HYCON Technology Corp.
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DS-HY11P12-V16_EN
page38
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
8.3. QFN48(N048)
8.3.1. Package Dimensions
D2
D
37
48
1
36
PIN 1
MARK
E2
12
25
24
13
A1
A3
e
L
b
A
.
SYMBOLS
MIN
0.70
0.00
NOM
0.75
0.02
MAX
0.80
0.05
A
A1
A3
b
0.20 REF.
0.20
0.15
0.25
D
6.00 BSC
6.00 BSC
4.50
E
D2
E2
L
4.40
4.40
0.35
4.55
4.55
0.45
4.50
0.40
e
0.40 BSC
Note: All dimensions refer to JEDEC OUTLINE MO-220.
© 2008~2016 HYCON Technology Corp.
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DS-HY11P12-V16_EN
page39
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
8.3.2. Tape & Reel Information
8.3.2.1. Reel Dimensions –Type1
Unit : mm
A
W1
8.3.2.2. Carrier Tape Dimensions
P2
D0
P0
.
B0
P1
K0
A0
Reel
Carrier Tape Dimensions
P1 P2
Dimensions
SYMBOLS
Spec.
A
W1
A0
B0
K0
P0
E
F
D0
W
330
16.5
6.30 6.30 1.10 4.00 12.00 2.00 1.75 7.50
1.50
16.00
Tolerance +6/-3 +1.5/-0 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 +0.1/-0 ±0.30
Note: 10 Sprocket hole pitch cumulative tolerance is ±0.20mm.
8.3.2.3. Pin1 direction
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page40
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
9. Revision Record
The following describes the major changes made to the document, excluding the
punctuation and font changes.
Version
V03
Page
ALL
Revision Summary
First edition
V06
With reference to documentation: DS-HY11P12-V06_TC
Features revision
4
6~7
8~9
10
14
17
19
20
22~24
11
Table 2-1 Pin Definition and Function Description revision
Chapter 4 Application circuit revision
Chapter 5 Register List revision
Chapter 6.3 Supply Current content revision
Chapter 6.5 Reset content revision
Chapter 6.6 Power System content revision
Figure 6.6-5, Figure 6.6-6 ACM Chart revision
Chapter 6.8 content revision
V07
V09
Chapter 5 Register List revision
.
1
Title revision
4
Delete 1/2 bias feature
5
Pin Diagram revision, add in LVDIN pin , add in Note 3
Chapter 3 Application circuit revision, add in LVDIN pin and RC circuit of RST
Add in LVDIN pin of the internal block diagram
Revise Chapter 1 Features
8~9
10
4
V12
9
Revise Figure 3-2
11
Add in Chapter 4.3 ADC Network
13
20
22
27~28
6
Revise Chapter 6 Electrical Characteristics Content
Revise Power System temperature drift spec
Revise ILCD spec
Add in Chapter 6.8.4 SD18 Noise Performance
Add in LQFP48 pin diagram
V14
V15
11
Revise Development Tool Related Operating Instruction serial numbers
Revise Figure 4-2 INH/INL
12
30
32
7
Add in ordering information
Add in package information
Add in QFN48 pin diagram
10~12
34
Add in LQFP48/QFN48 pinout I/O description
Add in ordering information
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page41
HY11P12
Embedded 18-Bit ΣΔADC
8-Bit RISC-Like Mixed Signal Microcontroller
37
14
36
40
Add in package information
V16
Update Package marker information
Update Green (RoHS & no Cl/Br)
Update Tape & Reel Information
.
© 2008~2016 HYCON Technology Corp.
www.hycontek.com
DS-HY11P12-V16_EN
page42
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