HY11P35 [HYCON]
8-Bit RISC-like Mixed Signal Microcontroller;
| 型号： | HY11P35 |
| 厂家： | 
HYCON Technology Corporation |
| 描述： | 8-Bit RISC-like Mixed Signal Microcontroller 微控制器 |
| 文件： | 总36页 (文件大小：728K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HY11P35
Datasheet
8-Bit RISC-like Mixed Signal Microcontroller
Embedded 4x32 LCD Driver
Low Noise Amplifier
.
18-Bit Σ∆ADC
DS-HY11P35-V08_EN
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
Table of Content
1. FEATURES ..................................................................................................................4
2. PIN DEFINITION ..........................................................................................................5
2.1 LQFP100 Pin Diagram ........................................................................................................................ 5
2.2 LQFP100 Pinout I/O Description........................................................................................................ 6
3. APPLICATION CIRCUIT............................................................................................11
3.1 Bridge Sensorǵ................................................................................................................................ 11
4. FUNCTION DESCRIPTION........................................................................................12
4.1 Internal Block Diagram..................................................................................................................... 12
4.2 Related Description and Supporting Documents..........................................................................12
4.3 SD18 Network....................................................................................................................................13
.
4.4 Low Noise OPAMP Network............................................................................................................. 14
5. REGISTER LIST ........................................................................................................15
6. ELECTRICAL CHARACTERISTICS..........................................................................17
6.1 Recommended operating conditions..............................................................................................17
6.2 Internal RC Oscillator .......................................................................................................................18
6.3 Supply Current into VDD Excluding Peripherals Current.............................................................19
6.4 Port1~4...............................................................................................................................................21
6.5 Reset (Brownout, External RST Pin, Low Voltage Detect)............................................................22
6.6 Power System....................................................................................................................................24
6.7 LCD.....................................................................................................................................................26
6.8 Low Noise OPAMP ............................................................................................................................ 27
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 2
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.9 SD18, Power Supply and Recommended Operating Conditions.................................................28
6.10 Built-in EPROM (BIE) ........................................................................................................................ 33
7. ORDERING INFORMATION ......................................................................................34
8. PACKAGE INFORMATION........................................................................................35
8.1 LQFP100(L100)..................................................................................................................................35
9. REVISION RECORD..................................................................................................36
.
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 3
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
1. Features
8-bit RISC, 66 instructions included.
Operating voltage range: 2.0V to 3.6V,
operation temperature range: -40ƨ~85ƨ.
External Crystal Oscillator and Internal
High Precision RC Oscillator, 6 CPU clock
rates enable users to have the most
power-saving plan.
ground that equips with Push-Pull drive
ability to provide sensor driving voltage.
LVD low voltage detection function has 14
steps of voltage detection configuration
and external input voltage detection
function.
Analog voltage source, VDDA equips with
10mA low dropout regulator function
4x32 LCD Driver
Active Mode 300uA@2MHz
Standby Mode 3uA@32KHz
Sleep Mode 1uA
1/4 Duty, 1/3 Bias
6K Word OTP (One Time Programmable)
Type Program Memory, 256 Byte Data
Memory
Built-in Charge Pump regulated
circuit, providing 4 LCD Bias voltage
8-bit Timer A
Brownout detector and Watch dog Timer,
prevents CPU from Crash.
16-bit Timer B module has Capture/
Compare function.
18-bit fully differential input Sigma-Delta
Analog-to-Digital Converter (A/D)
8-bit Timer C module can generate
PWM/PFD function.
Built-in PGA (Programmable Gain
Amplifier) 1/4xă1/2xă1x. …128xĂ
10 input signal gain selection.
Built-in EPROM (BIE)
.
Support 6 stack level
Built-in Input zero point adjustment
can increase measurement range
according to different application.
Built-in absolute temperature sensor
Ultra-Low Input Noise (<1uVpp) OP
provides high output impedance, small
signal amplification and low current
voltage transformation
1.0V internal analog circuit common
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 4
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2. Pin Definition
2.1 LQFP100 Pin Diagram
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
SEG17
VDD
PT2.0/XTO
PT2.1/XTI
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
SEG33
NC
PT2.2/PWM0/PFD
PT2.3/TMCKI/PWM1
PT2.4/CCP0/PWM2
PT2.5/CCP1/PWM3
NC
NC
VDDA
ACM
HY11P35
OPO
PT4.0/AI0
PT4.1/AI1
PT4.2/AI2
PT4.3/AI3
PT4.4/AI4
PT4.5/AI5
PT4.6/AI6
PT4.7/AI7
NC
LQFP100
.
NC
NC
NC
NC
NC
NC
NC
NC
NC
VSS
NC
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4
1 5
1 6
1 7
1 8
1 9
2 0
2 1
2 2
2 3
2 4
2 5
Figure 2-1 HY11P35 LQFP100 Pin Diagram
Note 1ĈVPP and RST use the same pin. Input voltage cannot exceed 5.8V when not programming EPROM.
Note 2ĈTST and PT1.3 use the same pin. Input voltage cannot exceed Vdd+0.3V while operating.
Note 3ĈIf PT1.3 is not configured as external pin button, it can help to enhance the anti-interference ability.
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 5
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2.2 LQFP100 Pinout I/O Description
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel
Pin
Characteristics
No.
Pin Name
RST/VPP
Function Description
Pin
Buffer
Type
Type
1
RST
VPP
I
S
P
Reset IC
P
EPROM programming voltage input
PT1.0/INT0/PSCK
PT1.1/INT1/PSDI
PT1.0
INT0
I
I
I
S
S
S
Digital input
2
Interrupt input INT0
PSCK
OTP programming interface SCK
PT1.1
INT1
PSDI
I
I
I
S
S
S
Digital input
3
4
Interrupt input INT0
OTP programming interface SDI
PT1.2/LVDIN
PT1.3/TST
PT1.2 . I
LVDIN
S
A
Digital input
A
LVD external signal input pin
5
6
7
8
9
PT1.3
TST
I
I
S
S
S
Digital input
Test Mode input pin (invalid)
Digital I/O
PT1.4
I/O
PT1.5/PSDO
PT1.5
PSDO
I/O
O
S
C
S
Digital I/O
OTP programming interface SDO
Digital I/O
PT1.6
I/O
PT1.7/BZ
PT1.7
BZ
I/O
O
S
C
C
C
C
C
-
Digital I/O
Buzzer input pin
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Unused
10
11
12
13
14
15
16
PT3.0
PT3.1
PT3.2
PT3.3
NC
I/O
I/O
I/O
I/O
-
NC
-
-
Unused
NC
-
-
Unused
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 6
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
NC
-
-
-
-
Unused
NC
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
SEG33
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
.
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 7
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
COM3
COM2
COM1
COM0
VLCD
NC
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
P
-
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
P
-
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
Segment output for LCD
COM segment output for LDO
COM segment output for LDO
COM segment output for LDO
COM segment output for LDO
Power supply for LCD
Unused
.
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
NC
-
-
Unused
VDD
P
P
Power supply for IC operation
PT2.0/XTO
77
78
PT2.0
XTO
I/O
A
S
A
Digital I/O
External Oscillator output pin
PT2.1/XTI
PT2.1
XTI
I/O
A
S
A
Digital I/O
External Oscillator input pin
PT2.2/PWM0/PFD
PT2.2
PWM0
PFD
I/O
O
C
C
C
Digital I/O
79
80
PWM0 output port
PFD output port
O
PT2.3/TMCKI/PWM1
PT2.3
TMCKI
PWM1
I/O
I
S
S
C
Digital I/O
TIMERC clock source input port
PWM1 output port
O
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 8
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
PT2.4/CCP0/PWM2
PT2.4
CCP0
PWM2
I/O
I
S
S
C
Digital I/O
81
82
Capture/Compare mode signal port
PWM2 output port
O
PT2.5/CCP1/PWM3
PT2.5
CCP1
PWM3
I/O
I
S
S
C
-
Digital I/O
Capture/Compare mode signal port
PWM3 output port
Unused
O
-
83
84
85
NC
NC
-
-
Unused
VDDA
ACM
P
P
Regulator output, analog circuit power
Common ground pin for internal
analog circuit
86
87
P
A
P
A
OPO
OPAMP output
PT4.0/AI0
88
89
90
91
92
93
94
95
PT4.0
AI0
I
C
A
Digital input
A
Analog input channel
PT4.1/AI1
PT4.2/AI2
PT4.3/AI3
PT4.4/AI4
PT4.5/AI5
PT4.6/AI6
PT4.7/AI7
.
PT4.1
AI1
I
C
A
Digital input
A
Analog input channel
PT4.2
AI2
I
C
A
Digital input
A
Analog input channel
PT4.3
AI3
I
C
A
Digital input
A
Analog input channel
PT4.4
AI4
I
C
A
Digital input
A
Analog input channel
PT4.5
AI5
I
C
A
Digital input
A
Analog input channel
PT4.6
AI6
I
C
A
Digital input
A
Analog input channel
PT4.7
AI7
I
C
A
Digital input
A
Analog input channel
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 9
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
96
97
NC
NC
NC
NC
VSS
-
-
-
-
Unused
Unused
98
-
-
Unused
99
-
-
Unused
100
P
P
Ground pin for IC operation voltage
Table 2-1 Pin Definition and Function Description
.
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 10
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
3. Application Circuit
3.1 Bridge SensorⅠ
Kg
Lb
1~4.7uF
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
SEG17
VDD
PT2.0/XTO
PT2.1/XTI
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
SEG33
NC
PT2.2/PWM0/PFD
PT2.3/TMCKI/PWM1
PT2.4/CCP0/PWM2
PT2.5/CCP1/PWM3
NC
NC
VDDA
1~10uF
ACM
VDDA
22~100nF
HY11P35
AI2
OPO
SI+
PT4.0/AI0
PT4.1/AI1
PT4.2/AI2
PT4.3/AI3
PT4.4/AI4
PT4.5/AI5
PT4.6/AI6
PT4.7/AI7
NC
ADC
0.1uF
LQFP100
D+
D-
SI-
AI1
AI0
VRH VRL
0.1uF
AI3
VDD
.
NC
100k
47nF
NC
RST
NC
PT1.7
NC
NC
NC
NC
NC
NC
VSS
NC
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4
1 5
1 6
1 7
1 8
1 9
2 0
2 1
2 2
2 3
2 4
2 5
Figure 3-1 Application Circuit of Bridge Sensor
Note 1ĈDCSET[2:0] can conduct bias adjustment of Load Cell zero point voltage address
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 11
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
4. Function Description
4.1 Internal Block Diagram
.
Figure 4-1 HY11P35 Internal Block Diagram
4.2 Related Description and Supporting Documents
IC Function Related Operating Instruction
DS-HY11P35-Vxx
UG-HY11S14-Vxx
HY11P35 Datasheet
HY11Pxx Series User’s Manual
APD-CORE002-Vxx H08A Instruction Description
Development Tool Related Operating Instruction
APD-HYIDE006-Vxx HY11xxx Series Development Tool Software
Instruction Manual
APD-HYIDE005-Vxx HY11xxx Series Development Tool Hardware
Instruction Manual
APD-OTP001-Vxx
OTP Products Programming Pin Manual
Product Production Related Operating Instruction
APD-HYIDE004-Vxx HY1xxxx Series Production Line Specialized
Programmer Manual
BDI-HY11P35-Vxx
HY11P35 Individual Product Die Bonding Information
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 12
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
4.3 SD18 Network
VDDA
ENADC[0]
ADC_CK
OSR[2:0]
24bit
SD18
INH[1:0]
DCSET[2:0]
VREGN[0]
ADGN[2:0]
AI2 000
AI6 001
AI4 010
1bit
ADCR
H/M/L
AI0 011
VDD/2 100
ACM 101
INX[1:0]
INH
SI+
SI-
ΣΔAD
SI:x¼,x½ ,x2,x4,x8,x16
TPSH1 110
TPSH0 111
INX
ADCIF
Interrupt
INIS[0]
INL[1:0]
AI3 000
AI7 001
AI5 010
AI1 011
OPO 100
VSS 101
TPSL0 110
TPSL1 111
+ VR:x1,x½ -
PGAGN[1:0]
INL
VDDX
VR+
VR-
.
Control Circuit
VRH[1:0]
AI6 00
AI8 01
VRL[1:0]
AI5 00
i
TPSHx
+
-
TPSLx
Q1
AI9 01
AI3 10
VSS 11
VRH
10
VRL
AI2
ACM 11
Figure 4-2 SD18 Network
© 2009-2013 HYCON Technology Corp.
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DS-HY11P35-V08_EN
Page 13
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
4.4 Low Noise OPAMP Network
.
Figure 4-3 Low Noise OPAMP Network
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 14
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
5. Register List
Register File Summary for H08A
“-”no use,“*”read/write,“w”write,“r”read,“r0”only read 0,“r1”only read 1,“w0”only write 0,“w1”omly write 1
“.”unimplemented bit,“x”unknown,“u”unchanged,“d”depends on condition
Address File Name
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
A-RESET i-RESET
R/W
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
-,-,-,- -,-,*,*
*,*,*,* *,*,*,*
-,-,-,- -,-,*,*
*,*,*,* *,*,*,*
-,-,*,* *,*,*,*
*,*,*,* *,*,*,*
r,rw0,rw0,- -,r,r,r
-,-,*,* *,*,*,*
*,*,*,* *,*,*,*
-,-,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
r,r,r,r r,r,r,r
00H
01H
02H
03H
04H
05H
06H
07H
08H
09H
0FH
10H
11H
12H
16H
17H
18H
1AH
1BH
1DH
1EH
1FH
20H
21H
22H
23H
24H
26H
27H
29H
2AH
2BH
2CH
2DH
30H
31H
32H
33H
37H
39H
3AH
3BH
3CH
3DH
3EH
3FH
40H
41H
42H
43H
44H
45H
46H
47H
48H
49H
4AH
4BH
4CH
4DH
4EH
4FH
50H
51H
INDF0
Contents of FSR0 to address data memory–value of FSR0 not changed
N/A
N/A
N/A
N/A
–
Contents of FSR0 to address data memory value of FSR0 post-incremented
POINC0
PODEC0
PRINC0
PLUSW0
INDF1
–
Contents of FSR0 to address data memory value of FSR0 post-decremented
N/A
N/A
–
Contents of FSR0 to address data memory value of FSR0 pre-incremented
N/A
N/A
Contents of FSR0 to address data memory–value of FSR0 offset by W
N/A
N/A
–
Contents of FSR1 to address data memory value of FSR0 not changed
N/A
N/A
–
POINC1
PODEC1
PRINC1
PLUSW1
FSR0H
FSR0L
Contents of FSR1 to address data memory value of FSR0 post-incremented
N/A
N/A
–
Contents of FSR1 to address data memory value of FSR0 post-decremented
N/A
N/A
Contents of FSR1 to address data memory–value of FSR0 pre-incremented
Contents of FSR1 to address data memory–value of FSR0 offset by W
N/A
N/A
N/A
N/A
FSR0[9]
FSR1[9]
TOS[9]
FSR0[8]
FSR1[8]
TOS[8]
.... ..xx
.... ..uu
Indirect Data Memory Address Pointer 0 Low Byte,FSR0[7:0]
xxxx xxxx uuuu uuuu
.... ..xx .... ..uu
xxxx xxxx uuuu uuuu
..00 0000 ..00 0000
0000 0000 0000 0000
FSR1H
FSR1L
Indirect Data Memory Address Pointer 1 Low Byte,FSR1[7:0]
TOSH
TOS[13]
TOS[12]
PC[12]
TOS[11]
PC[11]
TOS[10]
TOSL
Top-of-Stack Low Byte (TOS<7:0>)
STKPTR
PCLATH
PCLATL
TBLPTRH
TBLPTRL
TBLDH
TBLDL
STKFL
STKUN
STKOV
PC[13]
STKPRT[2] STKPRT[1] STKPRT[0] 000. .000
PC[10] PC[9] PC[8] ..00 0000
000. .000
..00 0000
PC Low Byte for PC<7:0>
0000 0000 0000 0000
TBLPTR[13] TBLPTR[12] TBLPTR[11] TBLPTR[10] TBLPTR[9] TBLPTR[8] ..00 0000
..00 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
0000 0000 0000 0000
Program Memory Table Pointer Low Byte (TBLPTR<7:0>)
Program Memory Table Latch High Byte
Program Memory Table Latch Low Byte
Product Register of Multiply High Byte
PRODH
PRODL
INTE1
Product Register of Multiply Low Byte
r,r,r,r r,r,r,r
GIE
ADCIE
TMCIE
TMBIE
TMBIF
TMAIE
TMAIF
WDTIE
WDTIF
E1IE
CCP1IE
E1IF
E0IE
CCP0IE
E0IF
*,*,*,* *,*,*,*
-,-,-,- -,-,*,*
-,*,*,* *,*,*,*
-,-,-,- -,-,*,*
*,*,*,* *,*,*,*
-,-,-,- -,-,-,*
INTE2
.... ..00
.000 0000 .000 0000
.... ..00 .... ..00
xxxx xxxx uuuu uuuu
.... ..00
INTF1
ADCIF
TMCIF
INTF2
CCP1IF
CCP0IF
Working Register
WREG
BSRCN
STATUS
PSTATUS
LVDCN
PWRCN
MCKCN1
MCKCN2
MCKCN3
OPCN1
ADCRH
ADCRM
ADCRL
ADCCN1
ADCCN2
ADCCN3
AINET1
AINET2
TMACN
TMAR
BSR[0]
Z
..... ...0
...x xxxx
000d .0..
.... ...0
.
C
DC
N
OV
...u uuuu
uduu .d..
-,-,-,* *,*,*,*
rw0,rw0,rw0,rw0 -,rw0,-,-
-,*,r,r *,*,*,*
*,*,*,* -,-,-,-
*,*,*,* *,*,*,*
-,-,*,* *,*,*,*
*,*,*,- *,*,*,*
*,*,*,* *,*,*,*
r,r,r,r r,r,r,r
PD
TO
IDLEB
LVD
BOR
SKERR
LVDFG
LVDON
ENACM
ADCCK
HSCK
VLDX[3:0]
.000 0000 .000 uuuu
0000 .... 0000 ....
ENHAO 0000 0001 0000 0001
CPUCK[1:0]
..00 0000 ..00 0000
ENVDDA
VDDAX[1:0]
ADCS[2:0]
LCDS[2:0]
XTHSP
XTSP
ENXT
LSCK
HSS[1:0]
PERCK
OPP[1:0]
BZS[2:0]
OPN[2:0]
000. 0000 000. 0000
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
0000 0000 0000 0000
ENOP
OPM[1:0]
ADC conversion memory HighByte
ADC conversion memory Middle Byte
ADC conversion memory Low Byte
r,r,r,r r,r,r,r
r,r,r,r r,r,r,r
PGAGN[1:0]
ADGN[2:0]
ENADC
ENHIGN
ENCHP
*,*,*,* *,*,*,*
-,-,r0,r0 *,*,*,*
*,*,*,- -,-,-,-
*,*,*,* *,*,*,*
-,*,*,* *,*,*,-
*,*,*,* w1,*,*,*
r,r,r,r r,r,r,r
DCSET[2:0]
INBUF=0 VRBUF=0 VREGN
..00 0000
000. ....
..00 0000
000. ....
OSR[2:0]
INH[2:0]
INL[2:0]
INIS
OPIS
0000 0000 0000 0000
.000 000. .000 000.
VRH[1:0]
INX[1:0]
ENWDT
VRL[1:0]
WDTS[2:0]
TMAS[1:0]
TMBS[1:0]
ENTMA
TMACK
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
TimerA data register
ENTMB TMBCK
TMBCN
TMBRH
TMBRL
TMCCN
PRC
TMBSYC TMBR2R
TMCS1[2:0]
0000 00..
0000 00..
*,*,*,* *,*,-,-
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
r,r,r,r r,r,r,r
TimerB High Byte data register
TimerB Low Byte data register
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
0000 0000 0000 0000
1111 1111 1111 1111
0000 0000 0000 0000
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
0.00 0000 0.00 0000
0000 0000 0000 0000
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
ENTMC
TMCCK[1:0]
TMCS0[1:0]
TimerC programmable register
TimerC register
TMCR
CCPCN
CCP0RH
CCP0RL
CCP1RH
CCP1RL
PASC
CCP1M[3:0]
CCP0M[3:0]
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,-,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
CCP0 High Byte data register
CCP0 Low Byte data register
CCP1 High Byte data register
CCP1 Low Byte data register
PASCF[1:0]
PSSCN0[1:0]
PWMCG[1:0]
PSSCN1[1:0]
PW MM[1:0]
PASF
PWMRL[1:0]
PWMCN
PDBD
ENPWM
ENPRS
ENPFD
DBDC[6:0]
PWM MSB Byte register
PWMR
Table 5-1(a) HY11P35 Register List
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 15
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
Register File Summary for H08A
“-”no use,“*”read/write,“w”write,“r”read,“r0”only read 0,“r1”only read 1,“w0”only write 0,“w1”omly write 1
“.”unimplemented bit,“x”unknown,“u”unchanged,“d”depends on condition
Address File Name
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
A-RESET i-RESET
R/W
52H
53H
54H
55H
56H
57H
58H
59H
5AH
5BH
5CH
5DH
6AH
6BH
6CH
6DH
6EH
6FH
70H
71H
72H
74H
LCDCN1
LCDCN2
LCD0
ENLCD
LCDBL
LCDPR
VLCDX[1:0]
LCDBF
LCDBI[1:0]=10
0000 010. 0000 010.
*,*,*,* *,r1,r0,-
*,r1,r1,- -,-,-,-
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
r,r,r,r r,r,r,r
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* r,r,r,r
*,*,*,* -,-,-,-
-,-,-,- -,*,-,-
*,*,*,* *,*,*,*
-,-,-,- *,*,*,*
-,*,-,- -,-,-,-
-,-,*,* *,*,*,*
LCDMX[1:0]=11
011. ....
011. ....
Segment SEG2@[3:0] and SEG3@[7:4] data register of LCD
Segment SEG4@[3:0] and SEG5@[7:4] data register of LCD
Segment SEG6@[3:0] and SEG7@[7:4] data register of LCD
Segment SEG8@[3:0] and SEG9@[7:4] data register of LCD
Segment SEG10@[3:0] and SEG11@[7:4] data register of LCD
Segment SEG12@[3:0] and SEG13@[7:4] data register of LCD
Segment SEG14@[3:0] and SEG15@[7:4] data register of LCD
Segment SEG16@[3:0] and SEG17@[7:4] data register of LCD
Segment SEG18@[3:0] and SEG19@[7:4] data register of LCD
Segment SEG20@[3:0] and SEG21@[7:4] data register of LCD
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
1111 1111 1111 1111
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
LCD1
LCD2
LCD3
LCD4
LCD5
LCD6
LCD7
LCD8
LCD9
PT4
PT4.7
DA4.7
PU4.7
PT1.7
TC1.7
PT4.6
DA4.6
PU4.6
PT1.6
TC1.6
PT4.5
DA4.5
PU4.5
PT1.5
TC1.5
PT4.4
DA4.4
PU4.4
PT1.4
TC1.4
PT4.3
DA4.3
PU4.3
PT1.3
PT4.2
PT4.1
DA4.1
PU4.1
PT1.1
PT4.0
DA4.0
PU4.0
PT1.0
PT4DA
PT4PU
PT1
DA4.2
PU4.2
PT1.2
TRISC1
PT1DA
PT1PU
PT1M1
PT1M2
PT2
0000 ....
.... .0..
0000 ....
.... .0..
DA1.2
PU1.2
PU1.7
PU1.6
PU1.5
PU1.4
PU1.3
PU1.1
PU1.0
0000 0000 0000 0000
INTEG1[1:0]
INTEG0[1:0]
.... 0000
.0.. ….
.... 0000
.0.. ….
PM1.7[0]
PT2.5
TC2.5
PU2.5
PT2.4
TC2.4
PU2.4
PT2.3
TC2.3
PU2.3
PT2.2
TC2.2
PU2.2
PT2.1
TC2.1
PU2.1
PT2.0
TC2.0
PU2.0
..xx xxxx
..00 0000
..00 0000
.000 ....
..uu uuuu
..00 0000
..00 0000
.000 ....
75H
77H
78H
79H
7AH
7BH
7DH
TRISC2
PT2PU
PT2M1
PT2M2
PT3
-,-,*,* *,*,*,*
-,-,*,* *,*,*,*
-,*,*,* -,-,-,-
*,*,-,- *,*,*,*
-,-,-,- *,*,*,*
-,-,-,- *,*,*,*
-,-,-,- *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
-,-,-,- *,r0,*,*
w0,w0,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
PM2.3[0] PM2.2[1] PM2.2[0]
PW MTR[1] PWMTR[0]
PM2.5[1] PM2.5[0] PM2.4[1]
PM2.4[0] 00.. 0000
00.. 0000
…. uuuu
…. 0000
…. 0000
PT3.3
TC3.3
PU3.3
PT3.2
TC3.2
PU3.2
PT3.1
TC3.1
PU3.1
PT3.0
TC3.0
PU3.0
…. xxxx
…. 0000
…. 0000
TRISC3
PT3PU
General Purpose Register as 128Byte
General Purpose Register as 128Byte
80H ~ FFH GPR0
100H~17FH GPR1
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
1000 d000 1000 d000
0000 0000 0000 0000
Segment SEG22@[3:0] and SEG23@[7:4] data register of LCD
180H
181H
182H
183H
184H
185H
195H
197H
198H
199H
LCD10
LCD11
LCD12
LCD13
LCD14
LCD15
BIECTRL
BIEPTRL
BIEDH
BIEDL
Segment SEG24@[3:0] and SEG25@[7:4] data register of LCD
.
Segment SEG26@[3:0] and SEG27@[7:4] data register of LCD
Segment SEG28@[3:0] and SEG29@[7:4] data register of LCD
Segment SEG30@[3:0] and SEG31@[7:4] data register of LCD
Segment SEG32@[3:0] and SEG33@[7:4] data register of LCD
VPP_HIGH
BIEWR
BIERD
BIE_ADDR[5:0]
BIE_DATA[15:8]
BIE_DATA[7:0]
0
0
xxxx xxxx
xxxx xxxx
xxxx xxxx
xxxx xxxx
Table 5-1(b) HY11P35 Register List (Continued)
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 16
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6. Electrical Characteristics
Absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Voltage applied at VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 4.0 V
Voltage applied to any pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. −0.2 V to VDD + 0.3 V
Voltage applied to RST/VPP pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 6.9 V
Voltage applied to TST/PT1.3 pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
−0.2 V to VDD + 1 V
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 mA
Storage temperature, Tstg: (unprogrammed device) . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . −55℃ to 150℃
(programmed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. −40℃ to 85℃
Total power dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5w
Maximum output current sink by any PORT1 to PORT3 I/O pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25mA
6.1 Recommended Operating Conditions
TA = -40℃ ~ 85℃,unless otherwise noted
Sym.
VDD
Parameter
Test Conditions
All digital peripherals and CPU
Analog peripherals
Min. Typ. Max.
unit
2.2
2.4
0
3.6
3.6
0
Supply Voltage
V
Supply Voltage
External
VSS
XTSP[0]=0, XTHSP[0]=0
Watch crystal
Ceramic resonator
Crystal
32.768K
.
VDD = 2.2V,
XTSP[0]=1, XTHSP[0]=0
Oscillator
Hz
450K
1M
8M
8M
XT
ENXT[0]=1
Frequency
XTSP[0]=1, XTHSP[0]=0
© 2009-2013 HYCON Technology Corp.
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DS-HY11P35-V08_EN
Page 17
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.2 Internal RC Oscillator
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
HAO
LPO
Parameter
Test Conditions
Min. Typ. Max.
unit
MHz
KHz
High Speed Oscillator frequency
Low Power Oscillator frequency
ENHAO[0]=1
1.8
22
2.0
28
2.2
35
VDD supply voltage be enable LPO
HAO vs. VDD
LPO vs. VDD
2.030
2.025
2.020
2.015
2.010
2.005
2.000
1.995
1.990
1.985
1.980
1.975
1.970
30.00
29.00
28.00
27.00
26.00
25.00
24.00
2.2V
2.4V
2.6V
2.8V
3.0V
3.2V
3.4V
3.6V
2.2V
2.4V
2.6V
2.8V
3.0V
3.2V
3.4V
3.6V
VDD
VDD
Figure 6.2-1 HAO vs. VDD
Figure 6.2-2 LPO vs. VDD
HAO vs. TA@VDD=3.0V
LPO vs. Temperature @VDD
1.980
31.00
30.00
29.00
28.00
27.00
26.00
25.00
24.00
1.960
1.940
1.920
1.900
1.880
.
VDD=3.6V
VDD=3.0V
1.860
1.840
VDD=2.2V
65
1.820
-40
-35
-15
5
25
45
85
-40
℃
-15
℃
15
℃
25
℃
45
℃
75
℃
85
℃
Temperature (
)
℃
Temperature(
)
℃
Figure 6.2-3 HAO vs. Temperature
Figure 6.2-4 LPO vs. Temperature
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DS-HY11P35-V08_EN
Page 18
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.3 Supply Current into VDD Excluding Peripherals Current
TA = 25℃,VDD = 3.0V,OSC_LPO = 28KHz, unless otherwise noted
Sym.
IAM1
IAM2
IAM3
ILP1
Parameter
Active mode 1
Active mode 2
Active mode 3
Low Power 1
Low Power 2
Low Power 3
Test Conditions
Min. Typ. Max.
unit
mA
mA
mA
uA
OSC_CY = 8MHz, OSC_HAO = off, CPU_CK = 8MHz
OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 2MHz
OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 1MHz
OSC_CY = 32768Hz, OSC_HAO = off, CPU_CK = 16384Hz
OSC_CY = off, OSC_HAO = off, CPU_CK = LPO, Idle state
OSC_CY = off, OSC_HAO = off, CPU_CK = off, Sleep state
1.34
0.36
0.2
2
0.55
0.3
12
7
1.65
0.65
3
uA
ILP2
1.2
uA
ILP3
OSC_CYĈExternal Oscillator frequency.
OSC_HAOĈInternal High Accuracy Oscillator frequency.
CPU_CKĈCPU core work frequency.
IAM1 vs VDD
IAM2 vs VDD
450
400
350
300
250
200
150
100
1.9
1.7
1.5
1.3
1.1
0.9
0.7
0.5
.
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-1 IAM1 vs. VDD
Figure 6.3-2 IAM2 vs. VDD
IAM3 vs VDD
ILP1 vs VDD
250
200
150
100
50
10
9
8
7
6
5
4
3
2
1
0
0
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-3 IAM3 vs. VDD
Figure 6.3-4 ILP1 vs. VDD
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DS-HY11P35-V08_EN
Page 19
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
ILP2 vs VDD
ILP3 vs VDD
2.50
2.00
1.50
1.00
0.50
0.00
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-5 ILP2 vs. VDD
Figure 6.3-6 ILP3 vs. VDD
IAM1 with temperature at VDD=3V
ILP2 with temperature at VDD=3V
1.30
3
2.6
2.2
1.8
1.4
1
1.29
1.28
1.27
1.26
1.25
-40
-30
-20
-10
0
10
25
TA(
30
40
50
60
70
85
-40
-30
-20
-10
0
10
25
TA(
30
40
50
60
70
85
)
)
℃
℃
.
Figure 6.3-7 IAM1 vs. Temperature
Figure 6.3-8 ILP2 vs. Temperature
.
ILP3 with temperature at VDD=3V
1.4
1.2
1
0.8
0.6
0.4
0.2
0
-40
-30
-20
-10
0
10
25
TA(
30
40
50
60
70
85
)
℃
Figure 6.3-9 ILP3 vs. Temperature
© 2009-2013 HYCON Technology Corp.
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DS-HY11P35-V08_EN
Page 20
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.4 Port1~4
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
Input voltage and Schmitt trigger and leakage current and timing
High-Level input voltage
2.1
VIH
V
Low-Level input voltage
0.9
0.8
0.1
180
VIL
V
Vhys
ILKG
RPU
Input Voltage hysteresis(VIH - VIL )
Leakage Current
uA
kΩ
Port pull high resistance
Output voltage and current and frequency
VDD -0.3
High-level output voltage
IOH=10mA
IOL=-10mA
VOH
V
VSS +0.3
Low-level output voltage
VOL
VOH vs IOH @VDD=3V
VOH vs. IOH@VDD=2.2V
2.35
3.00
2.85
2.70
2.55
2.40
2.25
2.10
2.20
2.05
1.90
1.75
1.60
1.45
1.30
1.15
1.00
25
85
℃
25
℃
℃
85
℃
.
0MA
-5MA
-10MA
-15MA
-20MA
-25MA
-30MA
-35MA
0MA
-5MA
-10MA
-15MA
-20MA
-25MA
-30MA
-35MA
IOH
IOH
Figure 6.4-1 VOH vs. IOH @VDD=3.0V
Figure 6.4-2 VOH vs. IOH @VDD=2.2V
VOL vs. IOL@VDD=3.0V
VOL vs. IOL@VDD=2.2V
0.9
0.8
0.6
0.9
0.8
85
℃
0.6
0.5
0.3
0.2
0.0
85
℃
0.5
0.3
0.2
0.0
25
℃
25
℃
0MA
5MA
10MA 15MA 20MA 25MA 30MA 35MA
IOL
0MA
5MA
10MA 15MA 20MA 25MA 30MA 35MA
IOL
Figure 6.4-3 VOL vs. IOL@VDD=3.0V
Figure 6.4-4 VOL vs. IOL@VDD=2.2V
© 2009-2013 HYCON Technology Corp.
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DS-HY11P35-V08_EN
Page 21
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.5 Reset (Brownout, External RST Pin, Low Voltage Detect)
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
us
2
Pulse length needed to accepted reset internally, td-LVR
1.6
1.85
70
2.1
V
BOR
VDD Start Voltage to accepted reset internally (LH),VLVR
Hysteresis, VHYS-LVR
mV
us
2
Pulse length needed as RST/VPP pin to accepted reset internally, td-RST
Input Voltage to accepted reset internally
Hysteresis, VHYS-RST
0.9
V
RST
0.8
10
V
15
uA
V
Operation current, ILVD
External input voltage to compare reference voltage
1.2
100
2
Compare reference voltage temperature drift
Detect VDD voltage error
TA = -40℃~ 85 ℃
ppm/℃
%
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1110b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1101b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1100b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1011b
3.3
3.2
3.1
3.0
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
.
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1010b
LVD
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1001b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1000b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0111b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0110b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0101b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0100b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0011b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0010b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0001b
V
BORĈBrownout Reset
LVRĈLow Voltage Reset of BOR
LVDĈLow Voltage Detect
RSTĈExternal Reset pin
© 2009-2013 HYCON Technology Corp.
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Page 22
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
.
Figure 6.5-1 BOR reset diagram
Figure 6.5-2 RST reset diagram
*1 rRSTĈPlease see BOR Introduce of HY11Pxx series User’s Guide (UG-HY11S14-Vxx).
VLVR and VLVR Release Voltaage vs. TA
1.98
1.96
1.94
LVR Release Voltage
V
1.92
1.90
1.88
1.86
1.84
1.82
1.80
LVR Voltage
V
-40
-35
-15
5
25
45
65
85
℃
℃
℃
℃
℃
℃
℃
℃
.
TA
Figure6.5-3 LVR vs. Temperature
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Page 23
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.6 Power System
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
Parameter
Test Conditions
Min Typ. Max.
unit
.
IL = 0mA
VDDAX[1:0]=00b
22
uA
V
VDDA operation current, IVDDA
IL = 0.1mA,
VDDAX[1:0]=00b
VDDAX[1:0]=01b
VDDAX[1:0]=10b
VDDAX[1:0]=11b
VDDAX[1:0]=00b
VDDAX[1:0]=01b
VDDAX[1:0]=10b
VDDAX[1:0]=11b
TA=-40℃~85℃
3.3
2.9
2.6
2.4
135
150
165
180
50
VDD≧VDDA+0.2V
V
Select VDDA output voltage
V
V
IL = 10mA
mV
mV
mV
mV
ppm/℃
%/V
uA
VDDA
Dropout voltage
Temperature drift
VDDX[1:0]=11b
IL = 0.1mA
VDD Voltage drift
VDD=2.5V~3.6V
±0.2
20
IL = 0mA
ACM operation current, IACM
Output voltage ,VACM
Output voltage with Load
Temperature drift
ENACM[0]=1
IL = 0uA
IL = ±200uA
1.0
V
.
0.98
1.02
VACM
ppm/℃
uV/V
ACM
ENACM[0]=1,
IL = 10uA
TA=-40℃~85℃
50
VDDA Voltage drift
100
VDDAĈAdjust Voltage Regulator
ACMĈAnalog Common Voltage
VDDA@2.4V with VDD
VDDA@2.4V with VDD
2.3900
2.390
2.388
2.386
2.384
2.382
2.380
2.378
2.376
2.374
2.372
2.3895
2.3890
2.3885
2.3880
2.3875
2.3870
2.3865
2.3860
2.3855
2.3850
2.3845
2.3840
L
I =10mA
L
I =0.1mA
3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V
VDD(V)
3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V
VDD(V)
Figure 6.6-1 VDDA lL=0.1mA vs. VDD
Figure 6.6-2 VDDA lL=10mA vs. VDD
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HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
VDDA with temperature
VDDA with temperature
2.3910
2.3880
2.3860
2.3840
2.3820
2.3800
2.3780
2.3760
2.3740
2.3720
2.3700
2.3680
2.3660
L
I =10mA
I
L
=0.1mA
2.3900
2.3890
2.3880
2.3870
2.3860
2.3850
2.3840
2.3830
2.3820
2.3810
VDD=3.0V
VDD=2.6V
VDD=3.0V
VDD=2.5V
-40
-35
-15
5
25
45
65
85
-40
-35
-15
5
25
45
65
85
℃
TA(
)
TA(℃)
Figure 6.6-3 VDDA lL=0.1mA vs. VDD
Figure 6.6-4 VDDA lL=0.1mA vs. VDD
ACM Load with VDDA
ACM vs. VDD with temperature @VDDA=2.4V
0.992
1.010
IL=200uA
VDD=3.6V
0.992
1.005
1.000
0.995
0.990
0.985
0.980
VDD=2.5V
IL=10uA
0.991
IL=0uA
0.991
0.990
IL=-200uA
0.990
0.989
0.989
0.988
2.4
2.6
2.9
3.3
-40
-20
0
20
TA (
40
60
80
100
Internal VDDA(V)
℃
)
Figure 6.6-5 ACM Load vs. VDDA
Figure 6.6-6 ACM vs. Temperature
.
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Page 25
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.7 LCD
TA = 25℃,VDD = 3.0V, CVLCD =4.7uF, unless otherwise noted.
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
uA
Operation supply current without
output buffer.(all segment turn on)
Supply Voltage at VLCD pin
LCDPR[0]=1
VDD = 2.2V
20
ILCD
VDD = 3.0V
LCDPR[0]=0
VDD = 2.2V,
2.2
3.6
V
VLCDX[1:0]=11b
VLCDX[1:0]=10b
VLCDX[1:0]=01b
VLCDX[1:0]=00b
2.295
2.52
2.55
2.8
2.805
3.08
LCDPR[0]=1,
CVLCD =4.7uF
Embedded Charge Pump output
voltage at VLCD pin
VLCD
ZLCD
V
2.745
2.97
3.05
3.3
3.355
3.63
Output impedance with LCD buffer
fLCD =128Hz,VLCD=3.05V
10
kΩ
Curve ChartĈ
VLCD Start Time
VLCD vs. VDD
142
VDD=2.2V
VDD=3.0V
3.08
122
102
82
62
42
22
2
3.05
3.02
2.99
2.96
2.93
2.90
.
VDD=3.6V
2.55
2.8
3.05
3.3
VLCD(V)
VDD(V)
Figure 6.7-1 LCD start time
Figure 6.7-2 VLCD vs. VDD
VLCD vs. Load
VLCD vs. Load
3.5
3.3
VDD=3.0V
VDD=2.2V
3.3
3.1
2.9
2.7
2.5
2.3
2.1
3.1
2.9
2.7
2.5
2.3
2.1
10
20
30
40
50
60
IL(uA)
70
80
90
100
125
150
175
200
225
250
275
300
325
350
IL(uA)
Figure 6.7-3 VLCD vs. IL @VDD=2.2V
Figure 6.7-4 VLCD vs. IL @VDD=3.0V
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HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.8 Low Noise OPAMP
TA = 25℃,VDD = 3.0V, VDDA=2.4V, unless otherwise noted
Sym.
VLNOP
ILNOP
Parameter
Supply voltage at VDDA
Test Conditions
Min. Typ. Max.
unit
V
ENVDDA[0]=0
2.4
-2
3.6
2
Operation supply current
OPM[1:0]=xxb
200
uA
Input offset voltage without chopper.
Input offset voltage with chopper
OPM[1:0]=1xb
OPM[1:0]=0xb
mV
uV
20
0.1
2
VOS-OP
OPM[1:0]=00b
OPM[1:0]=10
VO=1.2V,
Input offset voltage temperature drift.
Unit gain load regulation
TA=-40℃~85℃
uV/℃
IL=+1mA
IL=-1mA
0.1
%VO
VOLR
VDDA=2.4V
Common-mode voltage input range
Common-mode rejection ratio
OPM[1:0]=xxb
OPM[1:0]=xxb
0.1
VDDA-1.1
V
CMVR
CMRR
90
dB
LNOPoffset vs Temperature
0.195
0.190
0.185
0.180
0.175
0.170
0.165
no chopper
VDDA=2.4V
VDDA=3.3V
.
-40 -30 -20 -10
0
10 25 30 40 50 60 70 85
Temperature(
)
℃
Figure 6.8-1 LNOP Offset Temperature
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HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.9 SD18, Power Supply and Recommended Operating Conditions
TA = 25℃,VDD = 3.0V, VDDA=2.4V, unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage at VDDA
ENVDDA[0]=0
2.4
25
3.6
300
VSD18
Modulator sample frequency, ADC_CK
Over Sample Ratio, OSR
250
120
KHz
f SD18
256
32768
Operation supply current
ENADC[0]=1
without PGA
GAIN =4,
ADC_CK=250KHz
uA
I SD18
6.9.1 PGA, Power Supply and Recommended Operating Conditions
TA = 25℃,VDD = 3.0V, VDDA=2.4V, unless otherwise noted
Sym.
VPGA
I PGA
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage at VDDA
Operation supply current
Gain temperature drift
ENVDDA[0]=0
2.4
3.6
PGAGN[1:0]=<01>or<1x>
320
5
uA
TA = -40℃~ 85℃
GAIN=2 ~ 8
ppm/℃
GPGA
.
6.9.2 SD18, Performance II (fSD18=250KHz)
TA = 25℃,VDD = 3.0V, VDDA=2.9V,VVR=1.0V,GAIN=1 without PGA, unless otherwise noted
Sym.
Parameter
Test Conditions
VDDA=2.4V,VVR=1.0V,∆SI=±200mV
VDDA=2.4V,VVR=1.0V,∆SI=±450mV
Min. Typ. Max.
unit
±0.003
±0.01
Integral Nonlinearity(INL)
%FSR
INL
No Missing Codes3
ADC_CK=250KHz,OSR[2:0]=010b
23
Bits
T
A = -40℃~
Temperature drift
2
ppm/℃
GSD18
85℃
Gain 1~x16
Offset error of Full Scale Rang input
voltage range with Chopper without
PGA
Gain=2
1
%FSR
∆AI=0V
∆VR=0.9V
GAIN=1
GAIN=2
2
DCSET[2:0]=<000>
*∆AI is external
short
EOS
Offset error temperature drift with
chopper without PGA
1
uV/℃
GAIN=4
0.5
0.15
0.02
GAIN=16
GAIN=128
Offset temperature drift with chopper without Buffer
Common-mode rejection
VCM=0.7V to 1.7V,
dB
CMSD18
VSI=0V,
90
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HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
VVR=1.0V,without PGA
VCM=0.7V to 1.7V,
GAIN=1
VSI=0V,
75
VVR=1.0V, without PGA
GAIN=16
GAIN=1
PGA=off
GAIN=16
PGA=8
VDDA=3.0V,∆VDDA=±100m
PSRR
DC power supply rejection
SD18 Offset Drfit vs. Temperature
V,VVR=1.0V,
75
dB
VSI=1.2V,VSI-=1.2V,
SD18 Offset Drfit vs. Temperature
5
0
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
-4.5
-5.0
-5
-10
-15
-20
-25
-40℃ -20℃ 0℃
20℃ 40℃ 60℃ 80℃
-40℃ -20℃ 0℃
20℃ 40℃ 60℃ 80℃
TA
TA
Gain=1, SI and VR buffer off
VIN short to ACM
ꢀVR=1.2V, VDDA=2.4V
Gain=16, SI and VR buffer off
VIN short to ACM
ꢀVR=1.2V, VDDA=2.4V
Figure 6.9-1(a) SD18 Offset Temperature drift
Figure 6.9-1(b) SD18 Offset Temperature drift
SD18 Gain Drfit vs. Temperature
SD18 Offset Drfit vs. Temperature
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
1
0.5
0
.
-0.5
-1
-1.5
-2
-0.03%
-40℃ -20℃ 0℃
20℃ 40℃ 60℃ 80℃
-40℃ -20℃ 0℃ 20℃ 40℃ 60℃ 80℃
Gain=128, SI and VR buffer off
VIN short to ACM
ꢀVR=1.2V, VDDA=2.4V
TA
TA
Gain=1, SI and VR buffer off
ꢀSI=300mV, ꢀVR=0.9V
VDDA=2.4V
Figure 6.9-1(c) SD18 Offset Temperature Drift
Figure 6.9-2(a) SD18 Gain Drift with Temperature
SD18 Gain Drfit vs. Temperature
SD18 Gain Drfit vs. Temperature
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
-0.03%
-0.03%
-40℃ -20℃ 0℃ 20℃ 40℃ 60℃ 80℃
TA
-40℃ -20℃ 0℃ 20℃ 40℃ 60℃ 80℃
Gain=128, SI and VR buffer off
ꢀSI=4.6875mV, ꢀVR=0.9V
VDDA=2.4V
TA
Gain=16, SI and VR buffer off
ꢀSI=37.5mV, ꢀVR=0.9V
VDDA=2.4V
Figure 6.9-2(b) SD18 Gain Drift with Temperature
Figure 6.9-2(c) SD18 Gain Drift with Temperature
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HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.9.3 SD18, Temperature Sensor
TA = 25℃,VDD = 3.0V, VDDA=3.3V, unless otherwise noted
Sym.
TCS
Parameter
Test Conditions
Min. Typ. Max.
unit
uV/℃
℃
Sensor temperature drift
178
-289
±2
Absolute Temperature Scale 0°K
One point calibrate error temperature
KT
Calibration at 25℃of -40℃~85℃
℃
TCERR
TPS Voltage vs. Temperature
70
60
50
40
30
20
10
0
-45
-30
-15
0
15
30
45
60
75
90
TA(℃)
Figure 6.9-3 TPS output voltage vs. Temperature Drift
.
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HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.9.4 SD18 Noise Performance
TA = 25℃,VDD = 3.0V, VDDA=2.4V,unless otherwise noted
HY11P35 provides important input noise specification that aims at SD18. Table 6.9-4(a)
and Table 6.9-4(b) lists out the relations of typical noise specification, Gain, Output rate,
and maximum input voltage of single end. Test condition configuration and external input
signal short, voltage reference: 1.2V and 1024 records were sampled.
ENOB(RMS) with OSR/GAIN at A/D Clock=250Khz, VDDA=2.4V, VREF=1.2V
OSR
256
512
1024
2048
4096
8192 16384 32768
Max. Vin(mV)
=0.9*VREF (1)
Output rate(HZ)
977
488
244
122
61
31
15
8
Gain
0.25
0.5
1
=
=
=
=
=
=
=
=
=
=
=
PGA × ADGN
±2400
±2160
±1080
±540
±270
±135
±68
1
1
1
1
1
1
1
2
4
8
×
×
×
×
×
×
×
×
×
×
0.25
0.5
1
16.3
16.3
16.2
16.1
16.0
15.9
15.6
14.8
14.5
14.0
17.4
17.3
17.2
17.1
16.9
16.6
16.3
15.3
15.0
14.6
17.9
17.9
17.8
17.6
17.5
17.2
16.8
15.9
15.5
15.1
18.5
18.4
18.3
18.2
18.0
17.7
17.3
16.4
16.0
15.6
19.0
18.9
18.8
18.7
18.5
18.2
17.7
16.9
16.5
16.0
19.5
19.4
19.3
19.2
18.9
18.7
18.3
17.4
17.0
16.6
20.0
19.8
19.7
19.6
19.4
19.2
18.8
17.8
17.5
17.0
20.4
20.2
20.1
20.0
19.8
19.6
19.3
18.3
18.0
17.5
2
2
4
4
8
8
16
32
64
128
16
16
16
16
±34
±17
±8
(1) Max.Vin (mV) is the max. input voltage of single end to ground (VSS).
Table 6.9-4(a) SD18 ENOB Table
.
RMS Noise(uV) with OSR/GAIN at A/D Clock=250Khz, VDDA=2.4V, VREF=1.2V
OSR
256
512
1024
2048
4096
8192 16384 32768
Max. Vin(mV)
=0.9*VREF
Output rate(HZ)
977
488
244
122
61
31
15
8
Gain
0.25
0.5
1
=
=
=
=
=
=
=
=
=
=
=
PGA × ADGN
±2400
±2160
±1080
±540
±270
±135
±68
1
1
1
1
1
1
1
2
4
8
×
×
×
×
×
×
×
×
×
×
0.25 121.08 57.40 38.74 26.66 18.39 13.21
9.49
5.12
2.80
1.48
0.87
0.51
0.33
0.32
0.20
0.14
6.98
3.91
2.13
1.12
0.65
0.39
0.24
0.23
0.14
0.10
0.5
1
61.63 29.23 19.21 13.51
9.78
5.19
2.86
1.67
1.01
0.70
0.62
0.41
0.28
7.02
3.77
2.06
1.19
0.73
0.46
0.45
0.29
0.19
32.21 15.70 10.25
7.31
4.06
2.37
1.44
0.92
0.89
0.56
0.38
2
2
16.59
9.00
5.04
3.03
2.61
1.66
1.13
8.54
4.84
2.97
1.84
1.81
1.13
0.77
5.91
3.33
2.02
1.29
1.27
0.80
0.55
4
4
8
8
16
32
64
128
16
16
16
16
±34
±17
±8
Table 6.9-4(b) SD18 RMS Noise Table
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HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
The RMS noise are referred to the input. The Effective Number of Bits (ENOB (RMS
Bit)) is defined as:
FSR
ln
RMSNoise
ENOB(RMS)
ln(2)
2 VREF 1024ADO
k
- Average
2
k1
RMSNoise
223
Where FSR (Full- Scale Range) 2 VREF/Gain.
1024ADO
k
k1
Average
1024
RMS Noise Diagram
RMS Noise Diagram
5
4
500
450
400
350
300
250
200
150
100
50
Gain=1
Output rate ~ 10sps
Gain=1
Output rate ~ 10sps
3
2
1
0
.
-1
-2
-3
-4
-5
0
-5
-4
-3
-2
-1
0
1
2
3
4
5
1
201
401
601
801
1001
Output Code (LSB)
Time (reading number)
LSB base on 22-bit output
LSB base on 22-bit output
Figure 6.9-4(a) RMS Noise Diagram
Figure 6.9-4(b) Output Code Diagram
RMS Noise Diagram
RMS Noise Diagram
350
300
250
200
150
100
50
5
4
Gain=128
Output rate ~ 10sps
Gain=128
Output rate ~ 10sps
3
2
1
0
-1
-2
-3
-4
-5
0
-5
-4
-3
-2
-1
0
1
2
3
4
5
1
201
401
601
801
1001
Output Code (LSB)
Time (reading number)
LSB base on 19-bit output
LSB base on 19-bit output
Figure 6.9-4(c) RMS Noise Diagram
Figure 6.9-4(d) Output Code Diagram
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 32
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.10 Built-in EPROM (BIE)
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
VBIE
I BIE
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage
6.0
5
6.5
Operation supply current
Supply Voltage
mA
V
0
VSS
.
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 33
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
7. Ordering Information
Shipment
Packing
Type
Package
Type
Package
Drawing
Unit
Material
Device No.1
Pins
Code2
MSL3
Q’ty Composition
4
HY11P35-D000
HY11P35-L100
Die
-
D
L
000
100
000
000
-
100
90
-
Green
4
LQFP
100
Tray
MSL-3
Green
1 Device No.: Model No. – Package Type Description – Code (Blank Code/ Standard/
Customized Programming Code)
Ex: Your customized programming code is 008 and you require die shipment.
The device No. will be HY11P35-D000-008.
Ex: You request blank code in die package.
The device No. will be HY11P35-D000.
Ex: You request blank code in LQFP 100 package.
The device No. will be HY11P35-L100.
And please clearly indicate the shipment packing type when placing orders.
Ex: Your customized programming code is 009 and you require products in LQFP 100
package.
.
The device No. will be HY11P35-L100-009.
And please clearly indicate the shipment packing type when placing orders.
2 Code:
“001”~ “999” is standard or customized programming code. Blank code does not have
these numbers.
3 MSL:
The Moisture Sensitivity Level ranking conforms to IPC/JEDEC J-STD-020 industry
standard categorization. The products are processed, packed, transported and used
with reference to IPC/JEDEC J-STD-033.
4 Green (RoHS & no Cl/Br):
HYCON products are Green products that compliant with RoHS directive and are
Halogen free (Br/Cl<0.1%
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 34
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8. Package Information
8.1 LQFP100(L100)
.
JEDEC MS-026 compliant
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 35
HY11P35
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
9. Revision Record
Major differences are stated thereinafter:
Version Page Revision Summary
V03
V06
ALL
5
First Edition
Features revision
12
Revise 4.2 Development Tool Related Operating Instruction serial numbers
Add in 4.3 SD18 Network
14
17
Chapter 6 Electrical Characteristics revision
Chapter 6.6 Power System revision
Add in 6.9.4 SD18 Noise Performance
Chapter 7 Ordering information revision
Add in 4.4 Low Noise OPAMP Network
Revise SD18 Network
24
31~32
33
V07
V08
14
13
All
Update INBUF/VRBUF description
.
© 2009-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P35-V08_EN
Page 36
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