HY11P41 [HYCON]

8-Bit RISC-like Mixed Signal Microcontroller;
HY11P41
型号: HY11P41
厂家: HYCON Technology Corporation    HYCON Technology Corporation
描述:

8-Bit RISC-like Mixed Signal Microcontroller

微控制器
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中文:  中文翻译
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HY11P41  
Datasheet  
8-Bit RISC-like Mixed Signal Microcontroller  
.
Embedded 18-Bit Σ∆ADC  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
Table of Contents  
1. FEATURES ..................................................................................................................5  
2. PIN DEFINITION..........................................................................................................6  
2.1 SSOP16 Pin Diagram..........................................................................................................................6  
2.2 SOP16 Pin Diagram.............................................................................................................................6  
2.3 QFN16 Pin Diagram.............................................................................................................................7  
2.4 SSOP16 Pinout I/O Description .........................................................................................................8  
2.5 SOP16 Pinout I/O Description..........................................................................................................10  
2.6 QFN16 Pinout I/O Description..........................................................................................................12  
3. APPLICATION CIRCUIT............................................................................................14  
3.1 Bridge Sensor I..................................................................................................................................14  
.
3.2 Bridge Sensor II.................................................................................................................................15  
3.3 4-20mA Two-Wire Current Panel Meter...........................................................................................16  
4. FUNCTION OUTLINE ................................................................................................17  
4.1 Internal Block Diagram.....................................................................................................................17  
4.2 Related Description and Supporting Documents..........................................................................17  
4.3 SD18 Network....................................................................................................................................18  
5. REGISTER LIST ........................................................................................................19  
6. ELECTRICAL CHARACTERISTICS..........................................................................20  
6.1 Recommended Operating Conditions ............................................................................................20  
6.2 Internal RC Oscillator .......................................................................................................................21  
6.3 Supply Current into VDD Excluding Peripherals Current.............................................................22  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 2  
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
6.4 Port1~4...............................................................................................................................................24  
6.5 Reset (Brownout, External RST Pin, Low Voltage Detect)............................................................25  
6.6 Power System....................................................................................................................................27  
6.7 SD18, Power Supply and Recommended Operating Conditions.................................................29  
6.7.1 PGA, Power Supply and Recommended Operating Conditions ....................................................29  
6.7.2 SD18, Performance II (fSD18=250KHz).........................................................................................29  
6.7.3 SD18, Temperature Sensor ............................................................................................................31  
6.7.4 SD18 Noise Performance...............................................................................................................32  
6.8 Built-in EPROM (BIE)........................................................................................................................34  
7. ORDERING INFORMATION......................................................................................35  
8. PACKAGE INFORMATION........................................................................................36  
8.1 SSOP16 (E016) ..................................................................................................................................36  
8.2 SOP16 (S016).....................................................................................................................................38  
.
8.3 QFN16(N016)......................................................................................................................................40  
9. REVISION RECORD..................................................................................................41  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 3  
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
AttentionĈ  
1.  
2.  
3.  
HYCON Technology Corp. reserves the right to change the content of this datasheet without further  
notice. For most up-to-date information, please constantly visit our website: http://www.hycontek.com .  
HYCON Technology Corp. is not responsible for problems caused by figures or application circuits  
narrated herein whose related industrial properties belong to third parties.  
Specifications of any HYCON Technology Corp. products detailed or contained herein stipulate the  
performance, characteristics, and functions of the specified products in the independent state. We does  
not guarantee of the performance, characteristics, and functions of the specified products as placed in  
the customer’s products or equipment. Constant and sufficient verification and evaluation is highly  
advised.  
4.  
Please note the operating conditions of input voltage, output voltage and load current and ensure the IC  
internal power consumption does not exceed that of package tolerance. HYCON Technology Corp.  
assumes no responsibility for equipment failures that resulted from using products at values that exceed,  
even momentarily, rated values listed in products specifications of HYCON products specified herein.  
Notwithstanding this product has built-in ESD protection circuit, please do not exert excessive static  
electricity to protection circuit.  
5.  
6.  
Products specified or contained herein cannot be employed in applications which require extremely high  
.
levels of reliability, such as device or equipment affecting the human body, health/medical equipments,  
security systems, or any apparatus installed in aircrafts and other vehicles.  
7.  
8.  
Despite the fact that HYCON Technology Corp. endeavors to enhance product quality as well as  
reliability in every possible way, failure or malfunction of semiconductor products may happen. Hence,  
users are strongly recommended to comply with safety design including redundancy and fire-precaution  
equipments to prevent any accidents and fires that may follow.  
Use of the information described herein for other purposes and/or reproduction or copying without the  
permission of HYCON Technology Corp. is strictly prohibited.  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 4  
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
1. Features  
8-bit RISC, 66 instructions included.  
Operating voltage range: 2.2V to 3.6V,  
operation temperature range: -40~85.  
External Crystal Oscillator and Internal High  
Precision RC Oscillator, 6 CPU clock rates  
enable users to have the most power-saving  
plan.  
Built-in absolute temperature sensor  
1.0V and 1.2V internal analog circuit common  
ground that equips with Push-Pull drive ability  
to provide sensor driving voltage.  
LVD low voltage detection function has 14  
steps of voltage detection configuration and  
external input voltage detection function.  
VDDA can select 4 different output voltages  
that equips with 10mA low dropout regulator  
and fast start function.  
Active Mode 300uA@2MHz  
Standby Mode 3uA@28KHz  
Sleep Mode 1uA  
2K Word OTP (One Time Programmable) Type  
program memory, 128 Byte Data Memory.  
Brownout detector and Watch dog Timer,  
prevents CPU from Crash.  
8-bit Timer A  
16-bit Timer B module equips with Capture  
function  
8-bit Timer C module can generate PWM/PFD  
waveform.  
18-bit fully differential input Sigma-Delta  
Analog-to-Digital Converter (A/D)  
Built-in EPROM (BIE)  
Built-in PGA (Programmable Gain  
Amplifier) 1/4x1/2x1x. …128x10 input  
signal gain selection.  
Support 6 stack level  
.
Built-in Input zero point adjustment can  
increase measurement range according  
to different application.  
Programmable  
8SPS~2K SPS  
data  
output  
rate:  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 5  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
2. Pin Definition  
2.1 SSOP16 Pin Diagram  
AI5/PT4.5  
PT4.1/AI1  
PT4.0/AI0  
ACM  
AI6/PT4.6  
VSS  
RST/VPP  
VDDA  
PT1.1/INT1/PSCK/TST  
PT1.2/LVDIN/PSDI  
PFD/PWM0/PT2.2  
.4  
CCP0/PT2  
PT1.5/PSDO  
PT1.6  
PT2.5  
VDD  
Figure 2-1 HY11P41 SSOP16 Pin Diagram  
2.2 SOP16 Pin Diagram  
.
Figure 2-2 HY11P41 SOP16 Pin Diagram  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 6  
 
 
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
2.3 QFN16 Pin Diagram  
12  
11  
10  
9
VSS  
VDDA  
PT2.2/  
AI6/PT4.6  
VPP/RST  
PWM0/PFD  
QFN16  
PT2.4/  
CCP0  
PSCK/INT1/  
PT1.1/TST  
PT2.5  
1
4
Figure 2-3 HY11P41 QFN16 Pin Diagram  
.
Note 1ĈVPP and RST use the same pin. Input voltage cannot exceed 5.8V when not programming EPROM.  
Note 2TST and PT1.1 use the same pin. Input voltage cannot exceed VDD+0.3V while operating.  
Note 3If PT1.1 is not configured as external button pin, the anti-interference ability will be enhanced.  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 7  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
2.4 SSOP16 Pinout I/O Description  
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel  
Pin  
Characteristics  
No.  
Pin Name  
AI5/PT4.5  
Function Description  
Pin  
Buffer  
Type  
Type  
A
1
AI5  
A
Analog input channel  
Digital input  
PT4.5  
I
C
AI6/PT4.6  
2
3
4
AI6  
A
I
A
C
P
Analog input channel  
Digital input  
PT4.6  
VSS  
P
Ground pin for IC operation voltage  
RST/VPP  
RST  
VPP  
I
S
P
Reset the chip  
P
EPROM read/write power source  
PT1.1/INT1/PSCK/TST  
PT1.1  
Digital input  
I
S
.
INT1  
Interrupt source, INT1  
5
I
I
I
S
S
S
PSCK  
PSCK port of OTP read/write  
Test mode enable inputĞinvalidğ  
TST  
PT1.2/LVDIN/PSDI  
PT1.2  
LVDIN  
PSDI  
I
A
I
S
A
S
Digital input  
6
7
LVD external signal input port  
PSDI port of OTP read/write  
PT1.5/PSDO  
PT1.6  
PT1.5  
PSDO  
I/O  
I/O  
S
C
Digital input/output  
PSDO port of OTP read/write  
8
9
PT1.6  
PT2.5  
I/O  
P
S
P
Digital input/output  
VDD  
Chip operation power source  
PT2.5  
10  
I/O  
S
Digital input/output  
PT2.4/CCP0  
11  
12  
PT2.4  
CCP0  
I/O  
I
S
S
Digital input/output  
Capture mode signal port  
PT2.2/PWM0/PFD  
PT2.2  
I/O  
C
Digital input/output  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 8  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
PWM0  
PFD  
O
O
C
C
PWM output port  
PFD output port  
Regulator output  
VDDA  
13  
14  
P
P
P
P
Analog circuit voltage source  
ACM  
Internal analog circuit grounding pin  
AI0/PT4.0  
15  
16  
AI0  
A
I
A
C
Analog input channel  
Digital input  
PT4.0  
AI1/PT4.1  
AI1  
A
I
A
C
Analog input channel  
Digital input  
PT4.1  
Table 2-1 Pin Definition and Function Description  
.
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 9  
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
2.5 SOP16 Pinout I/O Description  
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel  
Pin  
Characteristics  
No.  
Pin Name  
Function Description  
Pin  
Buffer  
Type Type  
PT1.2/LVDIN/PSDI  
PT1.2  
LVDIN  
PSDI  
I
S
A
S
P
Digital input  
1
A
I
LVD external signal input port  
PSDI port of OTP read/write  
Chip operation power source  
2
3
VDD  
P
PT2.5  
PT2.5  
I/O  
S
Digital input/output  
PT2.4/CCP0  
4
5
PT2.4  
CCP0  
I/O  
I
S
S
Digital input/output  
Capture mode signal port  
PT2.2/PWM0/PFD  
PT2.2  
I/O  
O
C
C
C
Digital input/output  
PWM output port  
.
PWM0  
PFD  
O
PFD output port  
Regulator output  
VDDA  
ACM  
6
7
P
P
P
P
Analog circuit voltage source  
Internal analog circuit grounding  
pin  
AI0/PT4.0  
AI1/PT4.1  
AI5/PT4.5  
AI6/PT4.6  
VSS  
8
9
AI0  
A
I
A
C
Analog input channel  
Digital input  
PT4.0  
AI1  
A
I
A
C
Analog input channel  
Digital input  
PT4.1  
10  
AI5  
A
I
A
C
Analog input channel  
Digital input  
PT4.5  
11  
12  
AI6  
A
I
A
C
Analog input channel  
Digital input  
PT4.6  
Chip operation power source  
grounding pin  
P
P
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 10  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
RST/VPP  
13  
14  
RST  
VPP  
I
S
P
Reset the chip  
P
EPROM read/write power source  
PT1.1/INT1/PSCK/TST  
PT1.1  
INT1  
PSCK  
TST  
I
I
I
I
S
S
S
S
Digital input  
Interrupt source, INT1  
PSCK port of OTP read/write  
Test mode enable input (invalid)  
PT1.6  
15  
16  
PT1.6  
I/O  
S
Digital input/output  
PT1.5/PSDO  
PT1.5  
PSDO  
I/O  
I/O  
S
C
Digital input/output  
PSDO port of OTP read/write  
Table 2-2 Pin Definition and Function Description  
.
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 11  
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
2.6 QFN16 Pinout I/O Description  
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel  
Pin  
Characteristics  
No.  
Pin Name  
Function Description  
Digital input/output  
Pin  
Buffer  
Type Type  
PT1.6  
1
PT1.6  
I/O  
S
PT1.5/PSDO  
2
3
PT1.5  
PSDO  
I/O  
I/O  
S
C
Digital input/output  
PSDO port of OTP read/write  
PT1.2/LVDIN/PSDI  
PT1.2  
LVDIN  
PSDI  
I
S
A
S
P
Digital input  
A
I
LVD external signal input port  
PSDI port of OTP read/write  
Chip operation power source  
4
5
VDD  
P
PT2.5  
PT2.5  
I/O  
S
Digital input/output  
.
PT2.4/CCP0  
6
7
PT2.4  
I/O  
I
S
S
Digital input/output  
CCP0  
Capture mode signal port  
PT2.2/PWM0/PFD  
PT2.2  
PWM0  
PFD  
I/O  
O
C
C
C
Digital input/output  
PWM output port  
O
PFD output port  
Regulator output  
VDDA  
ACM  
8
9
P
P
P
P
Analog circuit voltage source  
Internal analog circuit grounding  
pin  
AI0/PT4.0  
AI1/PT4.1  
AI5/PT4.5  
10  
11  
12  
AI0  
A
I
A
C
Analog input channel  
Digital input  
PT4.0  
AI1  
A
I
A
C
Analog input channel  
Digital input  
PT4.1  
AI5  
A
I
A
C
Analog input channel  
Digital input  
PT4.5  
©2011-2014 HYCON Technology Corp.  
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Preliminary  
DS-HY11P41-V13_EN  
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HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
VSS  
13  
Chip operation power source  
grounding pin  
P
P
AI6/PT4.6  
14  
15  
AI6  
A
I
A
C
Analog input channel  
Digital input  
PT4.6  
RST/VPP  
RST  
VPP  
I
S
P
Reset the chip  
P
EPROM read/write power source  
PT1.1/INT1/PSCK/TST  
PT1.1  
INT1  
PSCK  
TST  
I
I
I
I
S
S
S
S
Digital input  
16  
Interrupt source, INT1  
PSCK port of OTP read/write  
Test mode enable input (invalid)  
Table 2-3 Pin Definition and Function Description  
.
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 13  
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
3. Application Circuit  
3.1 Bridge Sensor I  
VDDA  
AI6  
D+  
D-  
AI5/PT4.5  
0.1uF  
PT4.1/AI1  
PT4.0/AI0  
0.1uF  
AI6/PT4.6  
VDD  
22~100nF  
VSS  
ACM  
100k  
0.47 ~10uF  
RST/VPP  
VDDA  
10nF  
PT1.1/INT1/PSCK/TST  
PT1.2/LVDIN/PSDI  
PT1.5/PSDO  
PFD/ PWM0/PT2.2  
CCP0/PT2.4  
PT2.5  
PT1.6  
VDD  
1~10uF  
.
Figure 3-1 Application Circuit for Bridge Sensors  
Note 1: DCSET[2:0] can conduct bias adjustment of Load Cell zero point voltage address  
Note 2: BIE function can be used to save calibration parameters.  
©2011-2014 HYCON Technology Corp.  
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Preliminary  
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HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
3.2 Bridge Sensor II  
VDDA  
VDDA  
D+  
D-  
AI5/PT4.5  
AI6  
PT4.1/AI1  
PT4.0/AI0  
0 1uF  
RTC  
0.1uF  
AI6/PT4.6  
AI5  
VDD  
22~100nF  
VSS  
ACM  
100k  
0.47 ~10uF  
RST/VPP  
VDDA  
10nF  
PT1.1/INT1/PSCK/TST  
PFD/ PWM0/PT2.2  
PT1.2/ LVDIN /PSDI  
PT1.5/PSDO  
PT1.6  
0/PT2.4  
PT2.5  
VDD  
CCP  
1~10uF  
.
Figure 3-2 Application Circuit of Temperature Compensation Bridge Sensor  
Note 1: Using external reference voltage to design temperature compensation resistor NTC basic circuit  
Note 2: DCSET[2:0] can conduct bias adjustment of Load Cell zero point voltage address  
Note 3: BIE function can be used to save calibration parameters.  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 15  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
3.3 4-20mA Two-Wire Current Panel Meter  
Figure 3-3 4-20mA Panel Meter that Unneeded to Connect External Power Supply  
.
Note 1: DCSET[2:0] can carry out bias adjustment of Load Cell zero point voltage address  
Note 2: BIE function can be used to save calibration parameters.  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 16  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
4. Function Outline  
4.1 Internal Block Diagram  
VDD  
VSS  
CCP/PPF  
PTn.x  
P
P
C
C
Data  
Memory  
(STKĈ6L)  
(SPĈ128B)  
(GPRĈ128B)  
TIMER  
A/B/C  
(Capture)  
RC  
Oscillator  
(HAO)  
PORT  
(PT1ăPT2)  
(PT4)  
(LPO)  
(PPF)  
Program  
Memory  
(OTPĈ2KW)  
HARDWARE  
MULTIPLIER  
8x8  
CPU  
H08A  
Watch Dog  
RESET  
(BOR)  
(STACK)  
(WDT)  
SD18  
(ɐɂAD)  
(Network)  
Low Voltage  
Detect  
Build-In  
EPROM  
64 word  
Power  
System  
(LVD)  
(Temp.senor)  
(RST)  
C
A
C
P
P
P
VPP  
RST  
LVDIN  
AIx  
VDDA ACM  
C
P
D
A
Common I/O Pad  
Power Pad  
Digital Pad  
Analog Pad  
.
Figure 4-1 HY11P41 Internal Block Diagram  
4.2 Related Description and Supporting Documents  
IC Function Related Operating Instruction  
DS-HY11P41  
UG-HY11S14  
HY11P41 Data Sheet  
HY11P Series Users’ Manual  
APD-CORE002-Vxx H08A Instruction Description  
Development Tool Related Operating Instruction  
APD-HYIDE006-Vxx HY11xxx Series Development Tool Software Instruction  
Manual  
APD-HYIDE005-Vxx HY11xxx Series Development Tool Hardware Instruction  
Manual  
APD-OTP001-Vxx  
OTP Products Programming Pin Manual Product  
Production Related Operating Instruction  
APD-HYIDE004-Vxx HY1xxxx Series Production Line Specialized Programmer  
Manual  
BDI-HY11P41-Vxx  
HY11P41 Individual Product Die Bonding Information  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 17  
 
 
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
4.3 SD18 Network  
VDDA  
ENADC[0]  
ADC_CK  
OSR[3:0]  
24bit  
SD18  
INH[2:0]  
DCSET[2:0]  
VREGN[0]  
ADGN[2:0]  
000  
VSS  
AI6 001  
LVDIN 010  
AI0 011  
1bit  
ADCR  
H/M/L  
INX[1:0]  
INH  
VDD/2 100  
ACM 101  
TPSH1 110  
TPSH0 111  
SI+  
SI-  
ΣΔAD  
SI:x¼,x½ ,x2,x4,x8,x16  
INX  
ADCIF  
Interrupt  
INIS[0]  
INL[2:0]  
AI7000  
AI7  
+ VR:x1,x½ -  
PGAGN[1:0]  
AI5 010  
AI1 011  
OPO  
INL  
VSS 101  
TPSL0 110  
TPSL1 111  
VDDX  
VR+  
VR-  
.
Control Circuit  
VRH[1:0]  
AI6 00  
VRL[1:0]  
AI5 00  
i
TPSHx  
+
-
TPSLx  
VDDA  
AI2  
01  
Q1  
AI9  
VRH  
VRL  
AI3  
ACM 11  
VSS 11  
Figure 4-2 SD18 Network  
Note: If ADC reference voltage end used AI6-AI5 network to connect external VDDA-VSS power, higher  
stability would be achieved.  
Note: When using development kit (HY11S14-DK02) for emulation, users need to connect AI8 analog network  
to VDDA power in order to achieve VRH input as VDDA power source under VRH[1:0]=01b  
configuration. Connecting AI2 analog network to VSS power to achieve INH input as VSS power source  
under INH[2:0]=000b configuration. Connecting AI4 analog network to PT1.2 pin (LVDIN) to achieve  
INH input as LVDIN input source under INH[2:0]=010b configuration.  
Note: Users can connect HY11P41 AD Net Board (PCB No.: T10009-2) to Analog Port: JP3 of development  
kit (HY11S14-DK02) as to accomplish power configuration of AI8 and AI2 analog network.  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 18  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
5. Register List  
“-”no use,“*”read/write,“w”write,“r”read,“r0”only read 0,“r1”only read 1,“w0”only write 0,“w1”omly write 1  
“.”unimplemented bit,“x”unknown,“u”unchanged,“d”depends on condition  
Address File Name  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
A-RESET  
N/A  
i-RESET  
N/A  
R/W  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
-,-,-,- -,-,-,*  
00H  
01H  
02H  
03H  
04H  
05H  
06H  
07H  
08H  
09H  
0FH  
10H  
11H  
12H  
16H  
17H  
18H  
1AH  
1BH  
1DH  
1EH  
1FH  
20H  
21H  
22H  
23H  
24H  
26H  
27H  
29H  
2AH  
2BH  
2CH  
2DH  
30H  
31H  
32H  
33H  
39H  
3AH  
3BH  
3CH  
3DH  
3EH  
3FH  
40H  
41H  
42H  
43H  
44H  
45H  
46H  
47H  
48H  
49H  
4AH  
4BH  
4FH  
51H  
6AH  
6BH  
6CH  
6DH  
6EH  
6FH  
70H  
71H  
72H  
74H  
75H  
77H  
78H  
INDF0  
Contents of FSR0 to address data memory value of FSR0 not changed  
POINC0  
PODEC0  
PRINC0  
PLUSW0  
INDF1  
Contents of FSR0 to address data memory value of FSR0 post-incremented  
Contents of FSR0 to address data memory value of FSR0 post-decremented  
Contents of FSR0 to address data memory value of FSR0 pre-incremented  
Contents of FSR0 to address data memory value of FSR0 offset by W  
Contents of FSR1 to address data memory value of FSR0 not changed  
Contents of FSR1 to address data memory value of FSR0 post-incremented  
Contents of FSR1 to address data memory value of FSR0 post-decremented  
Contents of FSR1 to address data memory value of FSR0 pre-incremented  
Contents of FSR1 to address data memory value of FSR0 offset by W  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
POINC1  
PODEC1  
PRINC1  
PLUSW1  
FSR0H  
FSR0L  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
FSR0[8]  
FSR1[8]  
TOS[8]  
.... ...x  
.... ...u  
Indirect Data Memory Address Pointer 0 Low Byte,FSR0[7:0]  
Indirect Data Memory Address Pointer 1 Low Byte,FSR1[7:0]  
xxxx xxxx uuuu uuuu  
.... ...x .... ...u  
xxxx xxxx uuuu uuuu  
.... .000 .... .000  
0000 0000 0000 0000  
*,*,*,* *,*,*,*  
-,-,-,- -,-,-,*  
FSR1H  
FSR1L  
*,*,*,* *,*,*,*  
-,-,-,- -,*,*,*  
*,*,*,* *,*,*,*  
r,rw0,rw0,- -,r,r,r  
-,-,-,- -,*,*,*  
*,*,*,* *,*,*,*  
-,-,-,- -,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
r,r,r,r r,r,r,r  
TOSH  
TOS[10]  
PC[10]  
TOS[9]  
Top-of-Stack Low Byte (TOS<7:0>)  
STKFL STKUN STKOV  
TOSL  
STKPRT[2:0]  
PC[9]  
STKPTR  
PCLATH  
PCLATL  
TBLPTRH  
TBLPTRL  
TBLDH  
TBLDL  
000. .000  
.... .000  
000. .000  
.... .000  
PC[8]  
PC Low Byte for PC<7:0>  
0000 0000 0000 0000  
TBLPTR[10] TBLPTR[9] TBLPTR[8]  
.... .000  
.... .000  
Program Memory Table Pointer Low Byte (TBLPTR<7:0>)  
Program Memory Table Latch High Byte  
Program Memory Table Latch Low Byte  
Product Register of Multiply High Byte  
0000 0000 0000 0000  
0000 0000 0000 0000  
0000 0000 0000 0000  
xxxx xxxx uuuu uuuu  
xxxx xxxx uuuu uuuu  
0000 000. 000. 000.  
PRODH  
PRODL  
INTE1  
Product Register of Multiply Low Byte  
r,r,r,r r,r,r,r  
GIE  
ADCIE  
TMCIE  
TMBIE  
TMAIE  
TMAIF  
WDTIE  
WDTIF  
E1IE  
E1IF  
*,*,*,* *,*,*,-  
-,-,-,- -,-,-,*  
INTE2  
CCP0IE  
CCP0IF  
.... ...0  
.000 000.  
.... ...0  
.... ...0  
.00. 000.  
.... ...0  
INTF1  
ADCIF  
TMCIF  
TMBIF  
-,*,*,* *,*,*,-  
-,-,-,- -,-,-,*  
INTF2  
Working Register  
WREG  
BSRCN  
STATUS  
PSTATUS  
LVDCN  
PWRCN  
MCKCN1  
MCKCN2  
MCKCN3  
ADCRH  
ADCRM  
ADCRL  
ADCCN1  
ADCCN2  
ADCCN3  
AINET1  
AINET2  
TMACN  
TMAR  
xxxx xxxx uuuu uuuu  
*,*,*,* *,*,*,*  
-,-,-,- -,-,-,*  
BSR[0]  
Z
..... ...0  
...x xxxx  
000d .0..  
..... ...0  
...u uuuu  
uduu .d..  
C
DC  
N
OV  
-,-,-,* *,*,*,*  
rw0,rw0,rw0,rw0 -,rw0,-,-  
-,*,r,r *,*,*,*  
*,*,*,* -,-,-,-  
*,*,*,* -,-,-,*  
-,-,-,- *,*,*,*  
-,-,-,- *,-,-,-  
PD  
TO  
IDLEB  
LVD  
BOR  
SKERR  
VLDX[3:0]  
LVDFG  
LVDON  
ENACM  
ADCCK  
.000 0000 .000 uuuu  
VDDAX[1:0]  
ADCS[2:0]  
ENVDDA  
0000 ....  
0000 ...1  
…. 0000  
.... 0…  
0000 ....  
0000 ...1  
.... 0000  
.... 0…  
ENHAO  
HSS[1:0]  
PERCK  
CPUCK[1:0]  
.
ADC conversion memory HighByte  
xxxx xxxx uuuu uuuu  
xxxx xxxx uuuu uuuu  
xxxx xxxx uuuu uuuu  
0000 0000 0000 0000  
r,r,r,r r,r,r,r  
ADC conversion memory Middle Byte  
ADC conversion memory Low Byte  
r,r,r,r r,r,r,r  
r,r,r,r r,r,r,r  
PGAGN[1:0]  
ADGN[2:0]  
DCSET[2:0]  
OSR[3]  
ENADC  
ENHIGN ENCHP  
*,*,*,* *,*,*,*  
-,-,-,- *,*,*,*  
*,*,*,- -,-,*,-  
*,*,*,* *,*,*,-  
-,*,*,* *,*,*,-  
*,*,*,* w1,*,*,*  
r,r,r,r r,r,r,r  
VREGN  
…. 0000  
000. ..0.  
…. 0000  
000. ..0.  
OSR[2:0]  
INH[2:0]  
VRH[1:0]  
INL[2:0]  
INIS  
0000 000. 0000 000.  
.000 000. .000 000.  
INX[1:0]  
ENWDT  
VRL[1:0]  
WDTS[2:0]  
TMAS[1:0]  
TMBS[1:0]  
ENTMA  
TMACK  
0000 0000 0000 0000  
xxxx xxxx uuuu uuuu  
TimerA data register  
ENTMB TMBCK  
TMBCN  
TMBRH  
TMBRL  
TMCCN  
PRC  
TMBSYC TMBR2R  
TMCS1[2:0]  
0000 00..  
0000 00..  
*,*,*,* *,*,-,-  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
r,r,r,r r,r,r,r  
TimerB High Byte data register  
TimerB Low Byte data register  
xxxx xxxx uuuu uuuu  
xxxx xxxx uuuu uuuu  
0000 0000 0000 0000  
1111 1111 1111 1111  
0000 0000 0000 0000  
TMCCK[1:0]  
TMCS0[1:0]  
ENTMC  
TimerC programmable register  
TimerC register  
TMCR  
CCP0M[3:0]  
CCPCN  
CCP0RH  
CCP0RL  
PWMCN  
PWMR  
PT4  
…. 0000  
…. 0000  
-,-,-,- *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* -,-,-,-  
*,*,*,* *,*,*,*  
-,r,r,- -,-,r,r  
CCP0 High Byte data register  
CCP0 Low Byte data register  
xxxx xxxx uuuu uuuu  
xxxx xxxx uuuu uuuu  
PWMRL[1:0]  
ENPWM  
ENPFD  
0000 ….  
0000 ….  
PWM MSB Byte register  
xxxx xxxx uuuu uuuu  
PT4.6  
DA4.6  
PU4.6  
PT1.6  
TC1.6  
PT4.5  
PT4.1  
DA4.1  
PU4.1  
PT1.1  
PT4.0  
DA4.0  
PU4.0  
.xx. ..xx  
.11. ..11  
.00. ..00  
.xx. .xx.  
.00. ....  
.... .0..  
.uu. ..uu  
.11. ..11  
.00. ..00  
.uu. .uu.  
.00. ....  
.... .0..  
PT4DA  
PT4PU  
PT1  
DA4.5  
PU4.5  
PT1.5  
TC1.5  
-,*,*,- -,-,*,*  
-,*,*,- -,-,*,*  
-,*,*,- -,r,r,-  
-,*,*,- -,-,-,-  
-,-,-,- -,*,-,-  
PT1.2  
TRISC1  
PT1DA  
PT1PU  
PT1M1  
PT1M2  
PT2  
DA1.2  
PU1.2  
PU1.6  
PU1.5  
PU1.1  
.00. .00.  
.... 00..  
...0 .0..  
..xx .x..  
..00 .0..  
..00 .0..  
..00 ....  
.00. .00.  
.... 00..  
...0 .0..  
..uu .u..  
..00 .0..  
..00 .0..  
..00 ....  
-,*,*,- -,*,*,-  
-,-,-,- *,*,-,-  
-,-,-,* -,*,-,-  
-,-,*,* -,*,-,-  
-,-,*,* -,*,-,-  
-,-,*,* -,*,-,-  
-,-,*,* -,-,-,-  
*,*,*,* *,*,*,*  
-,-,-,- *,r0,*,*  
w0,w0,W0,W0 W0,W0,W0,W0  
w0,w0,*,* *,*,*,*  
*,*,*,* *,*,*,*  
*,*,*,* *,*,*,*  
INTEG1[1:0]  
PM1.5[0]  
PT2.2  
PM1.6[0]  
PT2.4  
PT2.5  
TC2.5  
PU2.5  
TRISC2  
PT2PU  
PT2M1  
TC2.4  
TC2.2  
PU2.4  
PU2.2  
PM2.2[1] PM2.2[0]  
General Purpose Register as 128Byte  
80H ~ FFH GPR0  
xxxx xxxx uuuu uuuu  
1000 d000 1000 d000  
0000 0000 0000 0000  
0000 0000 0000 0000  
195H  
196H  
197H  
198H  
199H  
BIECTRL  
VPP_HIGH  
BIEWR  
BIERD  
BIEPTRH  
BIEPTRL  
BIEDH  
BIE_ADDR[5:0]  
0
0
BIE_DATA[15:8]  
BIE_DATA[7:0]  
xxxx xxxx  
xxxx xxxx  
xxxx xxxx  
xxxx xxxx  
BIEDL  
Table 5-1 HY11P41 Register List  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 19  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
6. Electrical Characteristics  
Absolute maximum ratings over operating free-air temperature (unless otherwise noted)  
Voltage applied at VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.2 V to 4.0 V  
Voltage applied to any pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.2 V to VDD + 0.3 V  
Voltage applied to RST/VPP pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.2 V to 6.9 V  
Voltage applied to TST/PT1.1 pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.2 V to VDD + 1 V  
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 mA  
Storage temperature, Tstg: (unprogrammed device) . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . 55to 150℃  
(programmed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40to 85℃  
Total power dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5w  
Maximum output current sink by any PORT1 to PORT2 I/O pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25mA  
6.1 Recommended Operating Conditions  
TA = -40~ 85,unless otherwise noted  
Sym.  
VDD  
Parameter  
Test Conditions  
All digital peripherals and CPU  
Analog peripherals  
Min. Typ. Max.  
unit  
2.2  
2.4  
0
3.6  
3.6  
0
Supply Voltage  
V
Supply Voltage  
VSS  
.
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 20  
 
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
6.2 Internal RC Oscillator  
TA = 25,VDD = 3.0V,unless otherwise noted  
Sym.  
HAO  
LPO  
Parameter  
Test Conditions  
Min. Typ. Max.  
unit  
MHz  
KHz  
High Speed Oscillator frequency  
Low Power Oscillator frequency  
ENHAO[0]=1  
1.8  
22  
2.0  
28  
2.2  
35  
VDD supply voltage be enable LPO  
HAO vs. VDD  
LPO vs. VDD  
2.030  
2.025  
2.020  
2.015  
2.010  
2.005  
2.000  
1.995  
1.990  
1.985  
1.980  
1.975  
1.970  
30.00  
29.00  
28.00  
27.00  
26.00  
25.00  
24.00  
2.2V  
2.4V  
2.6V  
2.8V  
3.0V  
3.2V  
3.4V  
3.6V  
2.2V  
2.4V  
2.6V  
2.8V  
3.0V  
3.2V  
3.4V  
3.6V  
VDD  
VDD  
Figure 6.2-1 HAO vs. VDD  
Figure 6.2-2 LPO vs. VDD  
HAO vs. TA@VDD=3.0V  
LPO vs. Temperature @VDD  
1.980  
31.00  
30.00  
29.00  
28.00  
27.00  
26.00  
25.00  
24.00  
1.960  
1.940  
1.920  
1.900  
1.880  
.
VDD=3.6V  
VDD=3.0V  
1.860  
1.840  
VDD=2.2V  
65  
1.820  
-40  
-35  
-15  
5
25  
45  
85  
-40  
-15  
15  
25  
45  
75  
85  
Temperature (  
)
Temperature(  
)
Figure 6.2-3 HAO vs. Temperature  
Figure 6.2-4 LPO vs. Temperature  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 21  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
6.3 Supply Current into VDD Excluding Peripherals Current  
TA = 25,VDD = 3.0V,OSC_LPO = 28KHz,unless otherwise noted  
Sym. Parameter  
Test Conditions  
Min. Typ. Max.  
unit  
mA  
mA  
uA  
Active mode 2  
OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 2MHz  
OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 1MHz  
OSC_CY = off, OSC_HAO = off, CPU_CK = LPO, Idle state  
OSC_CY = off, OSC_HAO = off, CPU_CK = off, Sleep state  
0.32  
0.18  
1.65  
0.65  
0.55  
0.3  
3
IAM2  
Active mode 3  
IAM3  
Low Power 2  
ILP2  
Low Power 3  
1.2  
uA  
ILP3  
OSC_HAOĈInternal High Accuracy Oscillator frequency.  
CPU_CKĈCPU core work frequency.  
IAM2 vs VDD  
IAM3 vs VDD  
450  
400  
350  
300  
250  
200  
150  
100  
250  
200  
150  
100  
50  
0
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6  
VDD(V)  
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6  
VDD(V)  
.
Figure 6.3-1 IAM2 vs. VDD  
Figure 6.3-2 IAM3 vs. VDD  
ILP2 vs VDD  
ILP3 vs VDD  
2.50  
2.00  
1.50  
1.00  
0.50  
0.00  
0.80  
0.75  
0.70  
0.65  
0.60  
0.55  
0.50  
0.45  
0.40  
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6  
VDD(V)  
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6  
VDD(V)  
Figure 6.3-3 ILP2 vs. VDD  
Figure 6.3-4 ILP3 vs. VDD  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 22  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
ILP2 with temperature at VDD=3V  
ILP3 with temperature at VDD=3V  
3
2.6  
2.2  
1.8  
1.4  
1
1.4  
1.2  
1
0.8  
0.6  
0.4  
0.2  
0
-40  
-30  
-20  
-10  
0
10  
25  
TA(  
30  
40  
50  
60  
70  
85  
-40  
-30  
-20  
-10  
0
10  
25  
TA(  
30  
40  
50  
60  
70  
85  
)
)
Figure 6.3-5 ILP2 vs. Temperature  
Figure 6.3-6 ILP3 vs. Temperature  
.
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 23  
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
6.4 Port1~4  
TA = 25,VDD = 3.0V,unless otherwise noted  
Sym.  
Parameter  
Test Conditions  
Min. Typ. Max.  
unit  
Input voltage and Schmitt trigger and leakage current and timing  
0.7*VDD  
High-Level input voltage  
VDD  
VIH  
V
0.3*VDD  
Low-Level input voltage  
VSS  
VIL  
0.8  
0.1  
180  
V
Vhys  
ILKG  
RPU  
Input Voltage hysteresis(VIH - VIL )  
Leakage Current  
uA  
k  
Port pull high resistance  
Output voltage and current and frequency  
VDD -0.3  
High-level output voltage  
IOH=10mA  
IOL=-10mA  
VOH  
V
VSS +0.3  
Low-level output voltage  
VOL  
VOH vs IOH @VDD=3V  
VOH vs. IOH@VDD=2.2V  
2.35  
3.00  
2.85  
2.70  
2.55  
2.40  
2.25  
2.10  
2.20  
2.05  
1.90  
1.75  
1.60  
1.45  
1.30  
1.15  
1.00  
25  
85  
25  
85  
.
0MA  
-5MA  
-10MA  
-15MA  
-20MA  
-25MA  
-30MA  
-35MA  
0MA  
-5MA  
-10MA  
-15MA  
-20MA  
-25MA  
-30MA  
-35MA  
IOH  
IOH  
Figure 6.4-1 VOH vs. IOH @VDD=3.0V  
Figure 6.4-2 VOH vs. IOH @VDD=2.2V  
VOL vs. IOL@VDD=3.0V  
VOL vs. IOL@VDD=2.2V  
0.9  
0.8  
0.6  
0.9  
0.8  
85  
0.6  
0.5  
0.3  
0.2  
0.0  
85  
0.5  
0.3  
0.2  
0.0  
25  
25  
0MA  
5MA  
10MA 15MA 20MA 25MA 30MA 35MA  
IOL  
0MA  
5MA  
10MA 15MA 20MA 25MA 30MA 35MA  
IOL  
Figure 6.4-3 VOL vs. IOL@VDD=3.0V  
Figure 6.4-4 VOL vs. IOL@VDD=2.2V  
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DS-HY11P41-V13_EN  
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HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
6.5 Reset (Brownout, External RST Pin, Low Voltage Detect)  
TA = 25,VDD = 3.0V,unless otherwise noted  
Sym.  
Parameter  
Test Conditions  
Min. Typ. Max.  
unit  
us  
2
Pulse length needed to accepted reset internally, td-LVR  
1.6  
1.85  
70  
2.1  
V
BOR  
VDD Start Voltage to accepted reset internally (LH),VLVR  
Hysteresis, VHYS-LVR  
mV  
us  
2
Pulse length needed as RST/VPP pin to accepted reset internally, td-RST  
Input Voltage to accepted reset internally  
Hysteresis, VHYS-RST  
0.9  
V
RST  
0.8  
10  
V
15  
uA  
Operation current, ISVS  
External input voltage to compare reference voltage  
1.2  
100  
3.3  
3.2  
3.1  
3.0  
2.9  
2.8  
2.7  
2.6  
2.5  
2.4  
2.3  
2.2  
2.1  
2.0  
V
Compare reference voltage temperature drift  
TA = -40~ 85 ℃  
ppm/℃  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1110b  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1101b  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1100b  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1011b  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1010b  
.
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1001b  
LVD  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1000b  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0111b  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0110b  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0101b  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0100b  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0011b  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0010b  
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0001b  
V
BORĈBrownout Reset  
LVRĈLow Voltage Reset of BOR  
LVDĈLow Voltage Detect  
RSTĈExternal Reset pin  
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Page 25  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
.
Figure 6.5-1 BOR Reset Diagram  
Figure 6.5-2 RST Reset Diagram  
*1 rRSTĈPlease see BOR Introduce of HY11Pxx series User’s Guide (UG-HY11S14-Vxx).  
VLVR and VLVR Release Voltaage vs. TA  
1.98  
1.96  
1.94  
LVR Release Voltage  
V
1.92  
1.90  
1.88  
1.86  
1.84  
1.82  
1.80  
LVR Voltage  
V
-40  
-35  
-15  
5
25  
45  
65  
85  
.
TA  
Figure 6.5-3 LVR vs. Temperature  
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HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
6.6 Power System  
TA = 25,VDD = 3.0V,unless otherwise noted  
Sym.  
Parameter  
Test Conditions  
Min. Typ. Max.  
unit  
uA  
IL = 0mA  
VDDAX[1:0]=00b  
VDDAX[1:0]=00b  
VDDAX[1:0]=01b  
VDDAX[1:0]=10b  
VDDAX[1:0]=11b  
VDDAX[1:0]=00b  
VDDAX[1:0]=01b  
VDDAX[1:0]=10b  
VDDAX[1:0]=11b  
TA=-40~85℃  
22  
3.4  
3.0  
2.6  
2.4  
135  
150  
165  
180  
50  
VDDA operation current, IVDDA  
IL = 0.1mA,  
V
VDDVDDA+0.2V  
V
Select VDDA output voltage  
V
V
IL = 10mA  
mV  
mV  
mV  
mV  
ppm/℃  
%/V  
uA  
VDDA  
Dropout voltage  
Temperature drift  
VDDAX[1:0]=11b  
IL = 0.1mA  
VDD Voltage drift  
VDD=2.5V~3.6V  
±0.2  
20  
IL = 0mA  
ACM operation current, IACM  
Output voltage ,VACM  
Output voltage with Load  
Output voltage ,VACM  
Output voltage with Load  
Temperature drift  
*1  
ENACM[0]=1,  
IL = 0uA  
IL = ±200uA  
IL = 0uA  
1.0  
V
0.98  
0.98  
1.02  
1.02  
VACM  
V
.
*2  
ENACM[0]=1,  
1.2  
ACM  
IL = ±200uA  
TA=-40~85℃  
VACM  
ppm/℃  
uV/V  
ENACM[0]=1,  
IL = 10uA  
50  
VDDA Voltage drift  
100  
VDDAĈAdjust Voltage Regulator  
ACMĈAnalog Common Mode Voltage  
*1: VACM = 1.0V is just at A/D differential voltage reference < 1.4V ( if delta VR: (VDDA-VSS)/2 )  
*2: VACM = 1.2V is just at A/D differential voltage reference > 1.4V ( if delta VR: (VDDA-VSS)/2 )  
VDDA@2.4V with VDD  
VDDA@2.4V with VDD  
2.390  
2.3900  
2.3895  
2.3890  
2.3885  
2.3880  
2.3875  
2.3870  
2.3865  
2.3860  
2.3855  
2.3850  
2.3845  
2.3840  
2.388  
2.386  
2.384  
2.382  
2.380  
2.378  
2.376  
2.374  
2.372  
L
I =10mA  
L
I =0.1mA  
3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V  
VDD(V)  
3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V  
VDD(V)  
Figure 6.6-1 VDDA lL=0.1mA vs. VDD  
Figure 6.6-2 VDDA lL=10mA vs. VDD  
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HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
VDDA with temperature  
VDDA with temperature  
2.3910  
2.3880  
2.3860  
2.3840  
2.3820  
2.3800  
2.3780  
2.3760  
2.3740  
2.3720  
2.3700  
2.3680  
2.3660  
L
I =10mA  
I
L
=0.1mA  
2.3900  
2.3890  
2.3880  
2.3870  
2.3860  
2.3850  
2.3840  
2.3830  
2.3820  
2.3810  
VDD=3.0V  
VDD=2.6V  
VDD=3.0V  
VDD=2.5V  
-40  
-35  
-15  
5
25  
45  
65  
85  
-40  
-35  
-15  
5
25  
45  
65  
85  
TA(  
)
TA()  
Figure 6.6-3 VDDA lL=0.1mA vs. Temperature  
Figure 6.6-4 VDDA lL=10mA vs. Temperature  
ACM Load vs. VDDA  
ACM Load vs. VDDA  
1.226  
1.020  
IL=-200uA  
IL=-200uA  
1.216  
IL=0uA  
1.010  
1.000  
0.990  
0.980  
IL=0uA  
IL=200uA  
IL=200uA  
1.206  
1.196  
1.186  
1.176  
2.4  
2.6  
2.9  
3.3  
2.4  
2.6  
2.9  
3.3  
Internal VDDA(V)  
Internal VDDA(V)  
Figure 6.6-5 ACM Load vs. VDDA (a)  
Figure 6.6-5 ACM Load vs. VDDA (b)  
ACM vs. VDD with temperature at VDDA=2.4V  
ACM vs. VDD with temperature at VDDA=2.4V  
.
1.020  
1.010  
1.000  
0.990  
0.980  
1.226  
VDD=3.6V  
VDD=2.5V  
VDD=3.6V  
VDD=2.5V  
1.216  
1.206  
1.196  
1.186  
1.176  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
TA(  
)
TA( )  
Figure 6.6-6 ACM vs. Temperature (a)  
Figure 6.6-6 ACM vs. Temperature (b)  
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DS-HY11P41-V13_EN  
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HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
6.7 SD18, Power Supply and Recommended Operating Conditions  
TA = 25,VDD = 3.0V, VDDA=2.4V,unless otherwise noted  
Sym.  
Parameter  
Test Conditions  
Min. Typ. Max.  
unit  
V
Supply Voltage at VDDA  
ENVDDA[0]=0  
2.4  
25  
3.6  
300  
VSD18  
Modulator sample frequency, ADC_CK  
Over Sample Ratio, OSR  
250  
120  
KHz  
f SD18  
256  
32768  
Operation supply current  
ENADC[0]=1  
without PGA  
GAIN =4,  
ADC_CK=250KHz  
uA  
I SD18  
*1, OSR=128, setting by ADCCN3[ OSR[3] ] bit.  
OSR[3:0]=1010, OSR=128; OSR[3:0]=0xxx, OSR=256 ~ 32768  
6.7.1 PGA, Power Supply and Recommended Operating Conditions  
TA = 25,VDD = 3.0V, VDDA=2.4V,unless otherwise noted  
Sym.  
VPGA  
I PGA  
Parameter  
Test Conditions  
Min. Typ. Max.  
unit  
V
Supply Voltage at VDDA  
Operation supply current  
Gain temperature drift  
ENVDDA[0]=0  
2.4  
3.6  
PGAGN[1:0]=<01>or<1x>  
320  
5
uA  
TA = -40~ 85℃  
GAIN=128  
ppm/℃  
GPGA  
.
6.7.2 SD18, Performance II (fSD18=250KHz)  
TA = 25,VDD = 3.0V, VDDA=2.9V,VVR=1.0V,GAIN=1 without PGA, unless otherwise noted  
Sym.  
Parameter  
Integral Nonlinearity(INL)  
No Missing Codes3  
Temperature drift  
Gain 1~x16  
Test Conditions  
VDDA=2.4V,VVR=1.0V,SI=±450mV  
ADC_CK=250KHz,OSR[2:0]=010b  
Min. Typ. Max.  
unit  
%FSR  
Bits  
±0.003  
±0.01  
INL  
23  
TA= -40~85℃  
2
ppm/℃  
GSD18  
Offset error of Full Scale  
Rang input voltage range  
with Chopper without  
PGA  
Gain=2  
1
%FSR  
AI=0V  
VR=0.9V  
GAIN=1  
GAIN=2  
GAIN=4  
GAIN=16  
GAIN=128  
VSI=0V,  
2
EOS  
DCSET[2:0]=<000>  
*AI is external short  
1
Offset temperature drift  
with chopper without  
PGA  
uV/℃  
0.5  
0.15  
0.02  
VCM=0.7V to 1.7V,  
Common-mode rejection  
dB  
90  
CMSD18  
VVR=1.0V,without PGA  
GAIN=1  
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HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
VCM=0.7V to 1.7V,  
VVR=1.0V,  
VSI=0V,  
GAIN=16  
GAIN=1  
PGA=off  
GAIN=16  
75  
DC power supply  
rejection  
VDDA=3.0V,VDDA=±100mV,  
PSRR  
75  
dB  
VVR=1.0V, VSI=VSI-=1.2V,  
SD18 Offset Drfit vs. Temperature  
SD18 Offset Drfit vs. Temperature  
5
0
0.0  
-0.5  
-1.0  
-1.5  
-2.0  
-2.5  
-3.0  
-3.5  
-4.0  
-4.5  
-5.0  
-5  
-10  
-15  
-20  
-25  
-40  
-20  
0
20  
40  
60  
80  
-40  
-20  
0
20  
40  
60  
80  
TA  
TA  
Gain=1, SI and VR buffer off  
VIN short to ACM  
VR=1.2V, VDDA=2.4V  
Gain=16, SI and VR buffer off  
VIN short to ACM  
VR=1.2V, VDDA=2.4V  
Figure 6.7-1(a) SD18 Offset Temperature Drift  
Figure 6.7-1(b) SD18 Offset Temperature Drift  
SD18 Offset Drfit vs. Temperature  
SD18 Gain Drfit vs. Temperature  
1
0.5  
0
0.03%  
0.02%  
0.01%  
0.00%  
-0.01%  
-0.02%  
-0.03%  
-0.5  
-1  
.
-1.5  
-2  
-40  
-20  
0
20  
40  
60  
80  
-40  
-20  
0
20  
40  
60  
80  
TA  
Gain=128, SI and VR buffer off  
VIN short to ACM  
VR=1.2V, VDDA=2.4V  
TA  
Gain=16, SI and VR buffer off  
SI=37.5mV, VR=0.9V  
VDDA=2.4V  
Figure 6.7-1(c) SD18 Offset Temperature Drift  
Figure 6.7-2(b) SD18 Gain Drift with Temperature  
SD18 Gain Drfit vs. Temperature  
SD18 Gain Drfit vs. Temperature  
0.03%  
0.02%  
0.01%  
0.00%  
-0.01%  
-0.02%  
-0.03%  
0.03%  
0.02%  
0.01%  
0.00%  
-0.01%  
-0.02%  
-0.03%  
-40  
-20  
0
20  
40  
60  
80  
-40  
-20  
0
20  
40  
60  
80  
TA  
TA  
Gain=128, SI and VR buffer off  
SI=4.6875mV, VR=0.9V  
VDDA=2.4V  
Gain=1, SI and VR buffer off  
SI=300mV, VR=0.9V  
VDDA=2.4V  
Figure 6.7-2(a) SD18 Gain Drift with Temperature  
Figure 6.7-2(c) SD18 Gain Drift with Temperature  
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Preliminary  
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HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
6.7.3 SD18, Temperature Sensor  
TA = 25,VDD = 3.0V, VDDA=2.4V,unless otherwise noted  
Sym.  
TCS  
Parameter  
Test Conditions  
Min. Typ. Max.  
unit  
uV/℃  
Sensor temperature drift  
178  
-289  
±2  
Absolute Temperature Scale 0°K  
One point calibrate error temperature  
INBUF[0]=1  
KT  
Calibration at 25of -40~85℃  
TCERR  
TPS Voltage vs. Temperature  
70  
60  
50  
40  
30  
20  
10  
0
-45  
-30  
-15  
0
15  
30  
45  
60  
75  
90  
TA(℃)  
Figure 6.7-3 TPS Output Voltage vs. Temperature Drift  
.
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HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
!
6.7.4 SD18 Noise Performance  
TA = 25,VDD = 3.0V, VDDA=2.4V,unless otherwise noted  
HY11P41 provides important input noise specification that aims at SD18. Table 6.7-4(a)  
and Table 6.7-4(b) lists out the relations of typical noise specification, Gain, Output rate,  
and maximum input voltage of single end. Test condition configuration and external input  
signal short, voltage reference: 1.2V and 1024 records were sampled.  
ENOB(RMS) with OSR/GAIN at A/D Clock=250Khz, VDDA=2.4V, VREF=1.2V  
OSR  
128  
256  
512  
1024  
2048  
4096  
8192 16384 32768  
Max. Vin(mV)  
=0.9*VREF (1)  
Output rate(HZ)  
1953  
977  
488  
244  
122  
61  
31  
15  
8
Gain  
0.25  
0.5  
1
=
=
=
=
=
=
=
=
=
=
=
PGA × ADGN  
±2400  
±2160  
±1080  
±540  
±270  
±135  
±68  
1
1
1
1
1
1
1
2
4
8
×
×
×
×
×
×
×
×
×
×
0.25  
0.5  
1
14.0  
13.9  
14.0  
13.9  
13.9  
13.9  
13.8  
13.5  
13.4  
13.1  
16.3  
16.2  
16.2  
16.1  
16.0  
15.9  
15.6  
14.8  
14.5  
17.6  
17.5  
17.4  
17.3  
17.0  
16.7  
16.3  
15.4  
15.0  
14.6  
18.3  
18.2  
18.1  
17.9  
17.7  
17.3  
16.8  
15.9  
15.5  
15.1  
18.9  
18.8  
18.6  
18.4  
18.1  
17.8  
17.3  
16.4  
16.0  
15.6  
19.4  
19.3  
19.1  
18.9  
18.6  
18.2  
17.8  
16.9  
16.5  
16.1  
19.8  
19.7  
19.5  
19.4  
19.1  
18.8  
18.3  
17.4  
17.0  
16.6  
20.3  
20.2  
19.9  
19.8  
19.6  
19.2  
18.8  
17.9  
17.5  
17.1  
20.7  
20.6  
20.4  
20.2  
20.0  
19.7  
19.3  
18.4  
18.1  
17.6  
2
2
4
4
8
8
16  
32  
64  
128  
16  
16  
16  
16  
±34  
±17  
±8  
14.1  
.
(1) Max.Vin (mV) is the max. input voltage of single end to ground (VSS).  
Table 6.7-4(a) SD18 ENOB Table  
RMS Noise(uV) with OSR/GAIN at A/D Clock=250Khz, VDDA=2.4V, VREF=1.2V  
OSR  
128  
256  
512  
1024  
2048  
4096  
8192 16384 32768  
Max. Vin(mV)  
=0.9*VREF  
Output rate(HZ)  
1953  
977  
488  
244  
122  
61  
31  
15  
8
Gain  
0.25  
0.5  
1
=
=
=
=
=
=
=
=
=
=
=
PGA × ADGN  
±2400  
±2160  
±1080  
±540  
±270  
±135  
±68  
1
1
1
1
1
1
1
2
4
8
×
×
×
×
×
×
×
×
×
×
0.25 680.48 122.16 47.79 29.08 20.02 14.45 10.35  
7.55  
3.99  
2.41  
1.33  
0.78  
0.49  
0.33  
0.32  
0.20  
0.13  
5.90  
2.97  
1.76  
0.98  
0.59  
0.35  
0.23  
0.22  
0.14  
0.10  
0.5  
1
355.63 63.41 25.72 15.67 10.78  
7.66  
4.35  
2.49  
1.51  
0.97  
0.66  
0.62  
0.42  
0.27  
5.63  
3.22  
1.81  
1.08  
0.67  
0.46  
0.44  
0.28  
0.19  
166.02 31.71 13.93  
8.63  
4.96  
2.93  
1.91  
1.30  
1.24  
0.80  
0.55  
5.99  
3.49  
2.12  
1.33  
0.91  
0.87  
0.56  
0.38  
2
2
85.85  
43.52  
22.18  
11.97  
6.75  
16.80  
9.19  
5.10  
3.08  
2.63  
1.68  
1.09  
7.72  
4.53  
2.83  
1.88  
1.79  
1.12  
0.78  
4
4
8
8
16  
32  
64  
128  
16  
16  
16  
16  
±34  
±17  
3.75  
±8  
2.16  
Table 6.7-4(b) SD18 RMS Noise Table  
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HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
The RMS noise is referred to the input. The Effective Number of Bits (ENOB (RMS Bit))  
is defined as:  
FSR  
ln  
RMSNoise  
ENOB(RMS)   
ln(2)  
2VREF1024ADO  
k
- Average  
2   
k1  
RMSNoise   
223  
Where FSR (Full-Scale Range) 2VREF/Gain.  
1024ADO  
   
k
k1  
Average   
1024  
!
RMS Noise Diagram  
RMS Noise Diagram  
450  
400  
350  
300  
250  
200  
150  
100  
50  
3
2
Gain=1  
Output rate ~ 8sps  
Gain=1  
Output rate ~ 8sps  
1
0
.
-1  
-2  
-3  
0
-3  
-2  
-1  
0
1
2
3
1
201  
401  
601  
801  
1001  
Output Code (LSB)  
Time (reading number)  
LSB base on 20-bit output  
LSB base on 20-bit output  
Figure 6.7-4(a) RMS Noise Diagram  
Figure 6.7-4(b) Output Code Diagram  
RMS Noise Diagram  
RMS Noise Diagram  
350  
300  
250  
200  
150  
100  
50  
5
4
Gain=128  
Output rate ~ 8sps  
Gain=128  
Output rate ~ 8sps  
3
2
1
0
-1  
-2  
-3  
-4  
-5  
0
-5  
-4  
-3  
-2  
-1  
0
1
2
3
4
5
1
201  
401  
601  
801  
1001  
Output Code (LSB)  
Time (reading number)  
LSB base on 18-bit output  
LSB base on 18-bit output  
Figure 6.7-4(c) RMS Noise Diagram  
Figure 6.7-4(d) Output Code Diagram  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 33  
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
6.8 Built-in EPROM (BIE)  
TA = 25,VDD = 3.0V, unless otherwise noted  
Sym.  
VBIE  
I BIE  
Parameter  
Test Conditions  
Min. Typ. Max.  
unit  
V
Supply Voltage  
6.0  
5
6.5  
Operation supply current  
Supply Voltage  
mA  
V
0
VSS  
.
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 34  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
7. Ordering Information  
Shipment  
Packing  
Type  
Package  
Type  
Package  
Drawing  
Unit  
Material  
Device No.1  
Pins  
Code2  
MSL3  
Q’ty Composition  
4
HY11P41-D000  
HY11P41-E016  
HY11P41-E016  
HY11P41-S016  
HY11P41-S016  
HY11P41-N016  
Die  
SSOP  
SSOP  
SOP  
-
D
E
E
S
S
N
000  
016  
016  
016  
016  
016  
000  
000  
000  
000  
000  
000  
-
250  
100  
-
Green  
Green  
Green  
Green  
Green  
Green  
4
4
4
4
4
16  
16  
16  
16  
16  
Tube  
MSL-3  
MSL-3  
MSL-3  
MSL-3  
MSL-3  
Tape & Reel  
Tube  
2500  
50  
SOP  
Tape & Reel  
Tape & Reel  
2500  
5000  
QFN  
1 Device No.: Model No. – Package Type Description – Code (Blank Code/ Standard/  
Customized Programming Code)  
Ex: Your customized programming code is 008 and you require die shipment.  
The device No. will be HY11P41-D000-008  
Ex: You request blank code in die package.  
The device No. will be HY11P41-D000  
Ex: You request blank code in SSOP16 package.  
.
The device No. will be HY11P41-E016  
And please clearly indicate the shipment packing type when placing orders.  
Ex: Your customized programming code is 009 and you require products in SOP16  
package.  
The device No. will be HY11P41-S016-009.  
And please clearly indicate the shipment packing type when placing orders.  
2 Code:  
“001”~ “999” is standard or customized programming code. Blank code does not have  
these numbers.  
3 MSL:  
The Moisture Sensitivity Level ranking conforms to IPC/JEDEC J-STD-020 industry  
standard categorization. The products are processed, packed, transported and used  
with reference to IPC/JEDEC J-STD-033.  
4 Green (RoHS & no Cl/Br):  
HYCON products are Green products that compliant with RoHS directive and are  
Halogen free (Br/Cl<0.1%)  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 35  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
8. Package Information  
8.1 SSOP16 (E016)  
8.1.1 Package Dimensions  
D
16  
9
1
8
b
e
.
GAUGE PLANE  
SEATING PLANE  
L
SYMBOLS  
MIN  
-
NOM  
MAX  
1.75  
0.25  
1.50  
0.30  
0.25  
5.00  
3.99  
6.20  
1.27  
A
-
A1  
0.10  
-
0.15  
A2  
-
b
0.20  
0.18  
4.80  
3.81  
5.79  
0.41  
-
c
-
D
4.90  
3.91  
5.99  
-
E1  
E
L
e
0.635 BASIC  
-
θ°  
0
8
Note:  
1. All dimensions refer to JEDEC OUTLINE MO-137.  
2. Do not include Mold Flash or Protrusions.  
3. Unit : mm.  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 36  
 
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
8.1.2 Tube Dimensions  
.
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 37  
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
8.2 SOP16 (S016)  
8.2.1 Package Dimensions  
.
SYMBOLS  
MIN  
-
NOM  
MAX  
1.75  
0.25  
0.51  
0.25  
A
-
A1  
0.10  
0.31  
0.10  
-
b
-
c
-
D
9.90 BASIC  
3.90 BASIC  
6.00 BASIC  
-
E1  
E
L
0.40  
0
1.27  
8
e
θ
1.27 BASIC  
-
Note:  
1. All dimensions refer to JEDEC OUTLINE MS-012.  
2. Do not include Mold Flash or Protrusions.  
3. Unit: mm.  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 38  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
8.2.2 Tube Dimensions  
.
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 39  
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
8.3 QFN16(N016)  
8.3.1 Package Dimensions  
Unit : mm  
SYMBOLS  
MIN  
0.70  
NOM  
0.75  
MAX  
0.80  
A
A3  
b
0.203 REF.  
0.25  
0.20  
2.925  
2.925  
1.625  
1.625  
0.30  
0.30  
3.075  
3.075  
1.825  
1.825  
0.40  
.
D
3.000  
E
3.000  
D2  
E2  
L
1.725  
1.725  
0.35  
e
0.50 BASIC  
Note: All dimensions refer to JEDEC OUTLINE MO-220  
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 40  
 
HY11P41  
Embedded 18-Bit Σ∆ADC  
8-Bit RISC-like Mixed Signal Microcontroller  
9. Revision Record  
Major differences are stated thereinafter:  
Version  
V06  
Page  
All  
Revision Summary  
First Edition  
V07  
13  
Add in note of SD18 Network  
V08  
7,10~13,35,38 Add in QFN16 package type related information  
V10  
5~17, 19  
Delete the related description and figures of Serial communication SPI  
module.  
V11  
5
14~16  
29  
Add the description of fast start function  
Update the application circuits  
Delete the description related to INBUF and VRBUF function of ADC  
Update the package information of SSOP16 and SOP16  
Update PT1.1/TST pin description  
36~37  
6~16, 20  
35  
V12  
V13  
HY11P41-N016 ordering information (3000/Reel revise to 5000/Reel)  
.
©2011-2014 HYCON Technology Corp.  
www.hycontek.com  
Preliminary  
DS-HY11P41-V13_EN  
Page 41  
 

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