HY11P41 [HYCON]
8-Bit RISC-like Mixed Signal Microcontroller;型号: | HY11P41 |
厂家: | HYCON Technology Corporation |
描述: | 8-Bit RISC-like Mixed Signal Microcontroller 微控制器 |
文件: | 总41页 (文件大小:825K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HY11P41
Datasheet
8-Bit RISC-like Mixed Signal Microcontroller
.
Embedded 18-Bit Σ∆ADC
©2011-2014 HYCON Technology Corp.
www.hycontek.com
Preliminary
DS-HY11P41-V13_EN
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
Table of Contents
1. FEATURES ..................................................................................................................5
2. PIN DEFINITION..........................................................................................................6
2.1 SSOP16 Pin Diagram..........................................................................................................................6
2.2 SOP16 Pin Diagram.............................................................................................................................6
2.3 QFN16 Pin Diagram.............................................................................................................................7
2.4 SSOP16 Pinout I/O Description .........................................................................................................8
2.5 SOP16 Pinout I/O Description..........................................................................................................10
2.6 QFN16 Pinout I/O Description..........................................................................................................12
3. APPLICATION CIRCUIT............................................................................................14
3.1 Bridge Sensor I..................................................................................................................................14
.
3.2 Bridge Sensor II.................................................................................................................................15
3.3 4-20mA Two-Wire Current Panel Meter...........................................................................................16
4. FUNCTION OUTLINE ................................................................................................17
4.1 Internal Block Diagram.....................................................................................................................17
4.2 Related Description and Supporting Documents..........................................................................17
4.3 SD18 Network....................................................................................................................................18
5. REGISTER LIST ........................................................................................................19
6. ELECTRICAL CHARACTERISTICS..........................................................................20
6.1 Recommended Operating Conditions ............................................................................................20
6.2 Internal RC Oscillator .......................................................................................................................21
6.3 Supply Current into VDD Excluding Peripherals Current.............................................................22
©2011-2014 HYCON Technology Corp.
www.hycontek.com
Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.4 Port1~4...............................................................................................................................................24
6.5 Reset (Brownout, External RST Pin, Low Voltage Detect)............................................................25
6.6 Power System....................................................................................................................................27
6.7 SD18, Power Supply and Recommended Operating Conditions.................................................29
6.7.1 PGA, Power Supply and Recommended Operating Conditions ....................................................29
6.7.2 SD18, Performance II (fSD18=250KHz).........................................................................................29
6.7.3 SD18, Temperature Sensor ............................................................................................................31
6.7.4 SD18 Noise Performance...............................................................................................................32
6.8 Built-in EPROM (BIE)........................................................................................................................34
7. ORDERING INFORMATION......................................................................................35
8. PACKAGE INFORMATION........................................................................................36
8.1 SSOP16 (E016) ..................................................................................................................................36
8.2 SOP16 (S016).....................................................................................................................................38
.
8.3 QFN16(N016)......................................................................................................................................40
9. REVISION RECORD..................................................................................................41
©2011-2014 HYCON Technology Corp.
www.hycontek.com
Preliminary
DS-HY11P41-V13_EN
Page 3
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
AttentionĈ
1.
2.
3.
HYCON Technology Corp. reserves the right to change the content of this datasheet without further
notice. For most up-to-date information, please constantly visit our website: http://www.hycontek.com .
HYCON Technology Corp. is not responsible for problems caused by figures or application circuits
narrated herein whose related industrial properties belong to third parties.
Specifications of any HYCON Technology Corp. products detailed or contained herein stipulate the
performance, characteristics, and functions of the specified products in the independent state. We does
not guarantee of the performance, characteristics, and functions of the specified products as placed in
the customer’s products or equipment. Constant and sufficient verification and evaluation is highly
advised.
4.
Please note the operating conditions of input voltage, output voltage and load current and ensure the IC
internal power consumption does not exceed that of package tolerance. HYCON Technology Corp.
assumes no responsibility for equipment failures that resulted from using products at values that exceed,
even momentarily, rated values listed in products specifications of HYCON products specified herein.
Notwithstanding this product has built-in ESD protection circuit, please do not exert excessive static
electricity to protection circuit.
5.
6.
Products specified or contained herein cannot be employed in applications which require extremely high
.
levels of reliability, such as device or equipment affecting the human body, health/medical equipments,
security systems, or any apparatus installed in aircrafts and other vehicles.
7.
8.
Despite the fact that HYCON Technology Corp. endeavors to enhance product quality as well as
reliability in every possible way, failure or malfunction of semiconductor products may happen. Hence,
users are strongly recommended to comply with safety design including redundancy and fire-precaution
equipments to prevent any accidents and fires that may follow.
Use of the information described herein for other purposes and/or reproduction or copying without the
permission of HYCON Technology Corp. is strictly prohibited.
©2011-2014 HYCON Technology Corp.
www.hycontek.com
Preliminary
DS-HY11P41-V13_EN
Page 4
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
1. Features
8-bit RISC, 66 instructions included.
Operating voltage range: 2.2V to 3.6V,
operation temperature range: -40℃~85℃.
External Crystal Oscillator and Internal High
Precision RC Oscillator, 6 CPU clock rates
enable users to have the most power-saving
plan.
Built-in absolute temperature sensor
1.0V and 1.2V internal analog circuit common
ground that equips with Push-Pull drive ability
to provide sensor driving voltage.
LVD low voltage detection function has 14
steps of voltage detection configuration and
external input voltage detection function.
VDDA can select 4 different output voltages
that equips with 10mA low dropout regulator
and fast start function.
Active Mode 300uA@2MHz
Standby Mode 3uA@28KHz
Sleep Mode 1uA
2K Word OTP (One Time Programmable) Type
program memory, 128 Byte Data Memory.
Brownout detector and Watch dog Timer,
prevents CPU from Crash.
8-bit Timer A
16-bit Timer B module equips with Capture
function
8-bit Timer C module can generate PWM/PFD
waveform.
18-bit fully differential input Sigma-Delta
Analog-to-Digital Converter (A/D)
Built-in EPROM (BIE)
Built-in PGA (Programmable Gain
Amplifier) 1/4x、1/2x、1x. …128x,10 input
signal gain selection.
Support 6 stack level
.
Built-in Input zero point adjustment can
increase measurement range according
to different application.
Programmable
8SPS~2K SPS
data
output
rate:
©2011-2014 HYCON Technology Corp.
www.hycontek.com
Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2. Pin Definition
2.1 SSOP16 Pin Diagram
AI5/PT4.5
PT4.1/AI1
PT4.0/AI0
ACM
AI6/PT4.6
VSS
RST/VPP
VDDA
PT1.1/INT1/PSCK/TST
PT1.2/LVDIN/PSDI
PFD/PWM0/PT2.2
.4
CCP0/PT2
PT1.5/PSDO
PT1.6
PT2.5
VDD
Figure 2-1 HY11P41 SSOP16 Pin Diagram
2.2 SOP16 Pin Diagram
.
Figure 2-2 HY11P41 SOP16 Pin Diagram
©2011-2014 HYCON Technology Corp.
www.hycontek.com
Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2.3 QFN16 Pin Diagram
12
11
10
9
VSS
VDDA
PT2.2/
AI6/PT4.6
VPP/RST
PWM0/PFD
QFN16
PT2.4/
CCP0
PSCK/INT1/
PT1.1/TST
PT2.5
1
4
Figure 2-3 HY11P41 QFN16 Pin Diagram
.
Note 1ĈVPP and RST use the same pin. Input voltage cannot exceed 5.8V when not programming EPROM.
Note 2:TST and PT1.1 use the same pin. Input voltage cannot exceed VDD+0.3V while operating.
Note 3:If PT1.1 is not configured as external button pin, the anti-interference ability will be enhanced.
©2011-2014 HYCON Technology Corp.
www.hycontek.com
Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2.4 SSOP16 Pinout I/O Description
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel
Pin
Characteristics
No.
Pin Name
AI5/PT4.5
Function Description
Pin
Buffer
Type
Type
A
1
AI5
A
Analog input channel
Digital input
PT4.5
I
C
AI6/PT4.6
2
3
4
AI6
A
I
A
C
P
Analog input channel
Digital input
PT4.6
VSS
P
Ground pin for IC operation voltage
RST/VPP
RST
VPP
I
S
P
Reset the chip
P
EPROM read/write power source
PT1.1/INT1/PSCK/TST
PT1.1
Digital input
I
S
.
INT1
Interrupt source, INT1
5
I
I
I
S
S
S
PSCK
PSCK port of OTP read/write
Test mode enable inputĞinvalidğ
TST
PT1.2/LVDIN/PSDI
PT1.2
LVDIN
PSDI
I
A
I
S
A
S
Digital input
6
7
LVD external signal input port
PSDI port of OTP read/write
PT1.5/PSDO
PT1.6
PT1.5
PSDO
I/O
I/O
S
C
Digital input/output
PSDO port of OTP read/write
8
9
PT1.6
PT2.5
I/O
P
S
P
Digital input/output
VDD
Chip operation power source
PT2.5
10
I/O
S
Digital input/output
PT2.4/CCP0
11
12
PT2.4
CCP0
I/O
I
S
S
Digital input/output
Capture mode signal port
PT2.2/PWM0/PFD
PT2.2
I/O
C
Digital input/output
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
PWM0
PFD
O
O
C
C
PWM output port
PFD output port
Regulator output
VDDA
13
14
P
P
P
P
Analog circuit voltage source
ACM
Internal analog circuit grounding pin
AI0/PT4.0
15
16
AI0
A
I
A
C
Analog input channel
Digital input
PT4.0
AI1/PT4.1
AI1
A
I
A
C
Analog input channel
Digital input
PT4.1
Table 2-1 Pin Definition and Function Description
.
©2011-2014 HYCON Technology Corp.
www.hycontek.com
Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2.5 SOP16 Pinout I/O Description
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel
Pin
Characteristics
No.
Pin Name
Function Description
Pin
Buffer
Type Type
PT1.2/LVDIN/PSDI
PT1.2
LVDIN
PSDI
I
S
A
S
P
Digital input
1
A
I
LVD external signal input port
PSDI port of OTP read/write
Chip operation power source
2
3
VDD
P
PT2.5
PT2.5
I/O
S
Digital input/output
PT2.4/CCP0
4
5
PT2.4
CCP0
I/O
I
S
S
Digital input/output
Capture mode signal port
PT2.2/PWM0/PFD
PT2.2
I/O
O
C
C
C
Digital input/output
PWM output port
.
PWM0
PFD
O
PFD output port
Regulator output
VDDA
ACM
6
7
P
P
P
P
Analog circuit voltage source
Internal analog circuit grounding
pin
AI0/PT4.0
AI1/PT4.1
AI5/PT4.5
AI6/PT4.6
VSS
8
9
AI0
A
I
A
C
Analog input channel
Digital input
PT4.0
AI1
A
I
A
C
Analog input channel
Digital input
PT4.1
10
AI5
A
I
A
C
Analog input channel
Digital input
PT4.5
11
12
AI6
A
I
A
C
Analog input channel
Digital input
PT4.6
Chip operation power source
grounding pin
P
P
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
RST/VPP
13
14
RST
VPP
I
S
P
Reset the chip
P
EPROM read/write power source
PT1.1/INT1/PSCK/TST
PT1.1
INT1
PSCK
TST
I
I
I
I
S
S
S
S
Digital input
Interrupt source, INT1
PSCK port of OTP read/write
Test mode enable input (invalid)
PT1.6
15
16
PT1.6
I/O
S
Digital input/output
PT1.5/PSDO
PT1.5
PSDO
I/O
I/O
S
C
Digital input/output
PSDO port of OTP read/write
Table 2-2 Pin Definition and Function Description
.
©2011-2014 HYCON Technology Corp.
www.hycontek.com
Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2.6 QFN16 Pinout I/O Description
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel
Pin
Characteristics
No.
Pin Name
Function Description
Digital input/output
Pin
Buffer
Type Type
PT1.6
1
PT1.6
I/O
S
PT1.5/PSDO
2
3
PT1.5
PSDO
I/O
I/O
S
C
Digital input/output
PSDO port of OTP read/write
PT1.2/LVDIN/PSDI
PT1.2
LVDIN
PSDI
I
S
A
S
P
Digital input
A
I
LVD external signal input port
PSDI port of OTP read/write
Chip operation power source
4
5
VDD
P
PT2.5
PT2.5
I/O
S
Digital input/output
.
PT2.4/CCP0
6
7
PT2.4
I/O
I
S
S
Digital input/output
CCP0
Capture mode signal port
PT2.2/PWM0/PFD
PT2.2
PWM0
PFD
I/O
O
C
C
C
Digital input/output
PWM output port
O
PFD output port
Regulator output
VDDA
ACM
8
9
P
P
P
P
Analog circuit voltage source
Internal analog circuit grounding
pin
AI0/PT4.0
AI1/PT4.1
AI5/PT4.5
10
11
12
AI0
A
I
A
C
Analog input channel
Digital input
PT4.0
AI1
A
I
A
C
Analog input channel
Digital input
PT4.1
AI5
A
I
A
C
Analog input channel
Digital input
PT4.5
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
VSS
13
Chip operation power source
grounding pin
P
P
AI6/PT4.6
14
15
AI6
A
I
A
C
Analog input channel
Digital input
PT4.6
RST/VPP
RST
VPP
I
S
P
Reset the chip
P
EPROM read/write power source
PT1.1/INT1/PSCK/TST
PT1.1
INT1
PSCK
TST
I
I
I
I
S
S
S
S
Digital input
16
Interrupt source, INT1
PSCK port of OTP read/write
Test mode enable input (invalid)
Table 2-3 Pin Definition and Function Description
.
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
3. Application Circuit
3.1 Bridge Sensor I
VDDA
AI6
D+
D-
AI5/PT4.5
0.1uF
PT4.1/AI1
PT4.0/AI0
0.1uF
AI6/PT4.6
VDD
22~100nF
VSS
ACM
100k
0.47 ~10uF
RST/VPP
VDDA
10nF
PT1.1/INT1/PSCK/TST
PT1.2/LVDIN/PSDI
PT1.5/PSDO
PFD/ PWM0/PT2.2
CCP0/PT2.4
PT2.5
PT1.6
VDD
1~10uF
.
Figure 3-1 Application Circuit for Bridge Sensors
Note 1: DCSET[2:0] can conduct bias adjustment of Load Cell zero point voltage address
Note 2: BIE function can be used to save calibration parameters.
©2011-2014 HYCON Technology Corp.
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Preliminary
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
3.2 Bridge Sensor II
VDDA
VDDA
D+
D-
AI5/PT4.5
AI6
PT4.1/AI1
PT4.0/AI0
0 1uF
RTC
0.1uF
AI6/PT4.6
AI5
VDD
22~100nF
VSS
ACM
100k
0.47 ~10uF
RST/VPP
VDDA
10nF
PT1.1/INT1/PSCK/TST
PFD/ PWM0/PT2.2
PT1.2/ LVDIN /PSDI
PT1.5/PSDO
PT1.6
0/PT2.4
PT2.5
VDD
CCP
1~10uF
.
Figure 3-2 Application Circuit of Temperature Compensation Bridge Sensor
Note 1: Using external reference voltage to design temperature compensation resistor NTC basic circuit
Note 2: DCSET[2:0] can conduct bias adjustment of Load Cell zero point voltage address
Note 3: BIE function can be used to save calibration parameters.
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
3.3 4-20mA Two-Wire Current Panel Meter
Figure 3-3 4-20mA Panel Meter that Unneeded to Connect External Power Supply
.
Note 1: DCSET[2:0] can carry out bias adjustment of Load Cell zero point voltage address
Note 2: BIE function can be used to save calibration parameters.
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
4. Function Outline
4.1 Internal Block Diagram
VDD
VSS
CCP/PPF
PTn.x
P
P
C
C
Data
Memory
(STKĈ6L)
(SPĈ128B)
(GPRĈ128B)
TIMER
A/B/C
(Capture)
RC
Oscillator
(HAO)
PORT
(PT1ăPT2)
(PT4)
(LPO)
(PPF)
Program
Memory
(OTPĈ2KW)
HARDWARE
MULTIPLIER
8x8
CPU
H08A
Watch Dog
RESET
(BOR)
(STACK)
(WDT)
SD18
(ɐɂAD)
(Network)
Low Voltage
Detect
Build-In
EPROM
64 word
Power
System
(LVD)
(Temp.senor)
(RST)
C
A
C
P
P
P
VPP
RST
LVDIN
AIx
VDDA ACM
C
P
D
A
Common I/O Pad
Power Pad
Digital Pad
Analog Pad
.
Figure 4-1 HY11P41 Internal Block Diagram
4.2 Related Description and Supporting Documents
IC Function Related Operating Instruction
DS-HY11P41
UG-HY11S14
HY11P41 Data Sheet
HY11P Series Users’ Manual
APD-CORE002-Vxx H08A Instruction Description
Development Tool Related Operating Instruction
APD-HYIDE006-Vxx HY11xxx Series Development Tool Software Instruction
Manual
APD-HYIDE005-Vxx HY11xxx Series Development Tool Hardware Instruction
Manual
APD-OTP001-Vxx
OTP Products Programming Pin Manual Product
Production Related Operating Instruction
APD-HYIDE004-Vxx HY1xxxx Series Production Line Specialized Programmer
Manual
BDI-HY11P41-Vxx
HY11P41 Individual Product Die Bonding Information
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
4.3 SD18 Network
VDDA
ENADC[0]
ADC_CK
OSR[3:0]
24bit
SD18
INH[2:0]
DCSET[2:0]
VREGN[0]
ADGN[2:0]
000
VSS
AI6 001
LVDIN 010
AI0 011
1bit
ADCR
H/M/L
INX[1:0]
INH
VDD/2 100
ACM 101
TPSH1 110
TPSH0 111
SI+
SI-
ΣΔAD
SI:x¼,x½ ,x2,x4,x8,x16
INX
ADCIF
Interrupt
INIS[0]
INL[2:0]
AI7000
AI7
+ VR:x1,x½ -
PGAGN[1:0]
AI5 010
AI1 011
OPO
INL
VSS 101
TPSL0 110
TPSL1 111
VDDX
VR+
VR-
.
Control Circuit
VRH[1:0]
AI6 00
VRL[1:0]
AI5 00
i
TPSHx
+
-
TPSLx
VDDA
AI2
01
Q1
AI9
VRH
VRL
AI3
ACM 11
VSS 11
Figure 4-2 SD18 Network
Note: If ADC reference voltage end used AI6-AI5 network to connect external VDDA-VSS power, higher
stability would be achieved.
Note: When using development kit (HY11S14-DK02) for emulation, users need to connect AI8 analog network
to VDDA power in order to achieve VRH input as VDDA power source under VRH[1:0]=01b
configuration. Connecting AI2 analog network to VSS power to achieve INH input as VSS power source
under INH[2:0]=000b configuration. Connecting AI4 analog network to PT1.2 pin (LVDIN) to achieve
INH input as LVDIN input source under INH[2:0]=010b configuration.
Note: Users can connect HY11P41 AD Net Board (PCB No.: T10009-2) to Analog Port: JP3 of development
kit (HY11S14-DK02) as to accomplish power configuration of AI8 and AI2 analog network.
©2011-2014 HYCON Technology Corp.
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Preliminary
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
5. Register List
“-”no use,“*”read/write,“w”write,“r”read,“r0”only read 0,“r1”only read 1,“w0”only write 0,“w1”omly write 1
“.”unimplemented bit,“x”unknown,“u”unchanged,“d”depends on condition
Address File Name
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
A-RESET
N/A
i-RESET
N/A
R/W
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
-,-,-,- -,-,-,*
00H
01H
02H
03H
04H
05H
06H
07H
08H
09H
0FH
10H
11H
12H
16H
17H
18H
1AH
1BH
1DH
1EH
1FH
20H
21H
22H
23H
24H
26H
27H
29H
2AH
2BH
2CH
2DH
30H
31H
32H
33H
39H
3AH
3BH
3CH
3DH
3EH
3FH
40H
41H
42H
43H
44H
45H
46H
47H
48H
49H
4AH
4BH
4FH
51H
6AH
6BH
6CH
6DH
6EH
6FH
70H
71H
72H
74H
75H
77H
78H
INDF0
Contents of FSR0 to address data memory value of FSR0 not changed
POINC0
PODEC0
PRINC0
PLUSW0
INDF1
Contents of FSR0 to address data memory value of FSR0 post-incremented
Contents of FSR0 to address data memory value of FSR0 post-decremented
Contents of FSR0 to address data memory value of FSR0 pre-incremented
Contents of FSR0 to address data memory value of FSR0 offset by W
Contents of FSR1 to address data memory value of FSR0 not changed
Contents of FSR1 to address data memory value of FSR0 post-incremented
Contents of FSR1 to address data memory value of FSR0 post-decremented
Contents of FSR1 to address data memory value of FSR0 pre-incremented
Contents of FSR1 to address data memory value of FSR0 offset by W
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
POINC1
PODEC1
PRINC1
PLUSW1
FSR0H
FSR0L
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
FSR0[8]
FSR1[8]
TOS[8]
.... ...x
.... ...u
Indirect Data Memory Address Pointer 0 Low Byte,FSR0[7:0]
Indirect Data Memory Address Pointer 1 Low Byte,FSR1[7:0]
xxxx xxxx uuuu uuuu
.... ...x .... ...u
xxxx xxxx uuuu uuuu
.... .000 .... .000
0000 0000 0000 0000
*,*,*,* *,*,*,*
-,-,-,- -,-,-,*
FSR1H
FSR1L
*,*,*,* *,*,*,*
-,-,-,- -,*,*,*
*,*,*,* *,*,*,*
r,rw0,rw0,- -,r,r,r
-,-,-,- -,*,*,*
*,*,*,* *,*,*,*
-,-,-,- -,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
r,r,r,r r,r,r,r
TOSH
TOS[10]
PC[10]
TOS[9]
Top-of-Stack Low Byte (TOS<7:0>)
STKFL STKUN STKOV
TOSL
STKPRT[2:0]
PC[9]
STKPTR
PCLATH
PCLATL
TBLPTRH
TBLPTRL
TBLDH
TBLDL
000. .000
.... .000
000. .000
.... .000
PC[8]
PC Low Byte for PC<7:0>
0000 0000 0000 0000
TBLPTR[10] TBLPTR[9] TBLPTR[8]
.... .000
.... .000
Program Memory Table Pointer Low Byte (TBLPTR<7:0>)
Program Memory Table Latch High Byte
Program Memory Table Latch Low Byte
Product Register of Multiply High Byte
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
0000 000. 000. 000.
PRODH
PRODL
INTE1
Product Register of Multiply Low Byte
r,r,r,r r,r,r,r
GIE
ADCIE
TMCIE
TMBIE
TMAIE
TMAIF
WDTIE
WDTIF
E1IE
E1IF
*,*,*,* *,*,*,-
-,-,-,- -,-,-,*
INTE2
CCP0IE
CCP0IF
.... ...0
.000 000.
.... ...0
.... ...0
.00. 000.
.... ...0
INTF1
ADCIF
TMCIF
TMBIF
-,*,*,* *,*,*,-
-,-,-,- -,-,-,*
INTF2
Working Register
WREG
BSRCN
STATUS
PSTATUS
LVDCN
PWRCN
MCKCN1
MCKCN2
MCKCN3
ADCRH
ADCRM
ADCRL
ADCCN1
ADCCN2
ADCCN3
AINET1
AINET2
TMACN
TMAR
xxxx xxxx uuuu uuuu
*,*,*,* *,*,*,*
-,-,-,- -,-,-,*
BSR[0]
Z
..... ...0
...x xxxx
000d .0..
..... ...0
...u uuuu
uduu .d..
C
DC
N
OV
-,-,-,* *,*,*,*
rw0,rw0,rw0,rw0 -,rw0,-,-
-,*,r,r *,*,*,*
*,*,*,* -,-,-,-
*,*,*,* -,-,-,*
-,-,-,- *,*,*,*
-,-,-,- *,-,-,-
PD
TO
IDLEB
LVD
BOR
SKERR
VLDX[3:0]
LVDFG
LVDON
ENACM
ADCCK
.000 0000 .000 uuuu
VDDAX[1:0]
ADCS[2:0]
ENVDDA
0000 ....
0000 ...1
…. 0000
.... 0…
0000 ....
0000 ...1
.... 0000
.... 0…
ENHAO
HSS[1:0]
PERCK
CPUCK[1:0]
.
ADC conversion memory HighByte
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
0000 0000 0000 0000
r,r,r,r r,r,r,r
ADC conversion memory Middle Byte
ADC conversion memory Low Byte
r,r,r,r r,r,r,r
r,r,r,r r,r,r,r
PGAGN[1:0]
ADGN[2:0]
DCSET[2:0]
OSR[3]
ENADC
ENHIGN ENCHP
*,*,*,* *,*,*,*
-,-,-,- *,*,*,*
*,*,*,- -,-,*,-
*,*,*,* *,*,*,-
-,*,*,* *,*,*,-
*,*,*,* w1,*,*,*
r,r,r,r r,r,r,r
VREGN
…. 0000
000. ..0.
…. 0000
000. ..0.
OSR[2:0]
INH[2:0]
VRH[1:0]
INL[2:0]
INIS
0000 000. 0000 000.
.000 000. .000 000.
INX[1:0]
ENWDT
VRL[1:0]
WDTS[2:0]
TMAS[1:0]
TMBS[1:0]
ENTMA
TMACK
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
TimerA data register
ENTMB TMBCK
TMBCN
TMBRH
TMBRL
TMCCN
PRC
TMBSYC TMBR2R
TMCS1[2:0]
0000 00..
0000 00..
*,*,*,* *,*,-,-
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
r,r,r,r r,r,r,r
TimerB High Byte data register
TimerB Low Byte data register
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
0000 0000 0000 0000
1111 1111 1111 1111
0000 0000 0000 0000
TMCCK[1:0]
TMCS0[1:0]
ENTMC
TimerC programmable register
TimerC register
TMCR
CCP0M[3:0]
CCPCN
CCP0RH
CCP0RL
PWMCN
PWMR
PT4
…. 0000
…. 0000
-,-,-,- *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* -,-,-,-
*,*,*,* *,*,*,*
-,r,r,- -,-,r,r
CCP0 High Byte data register
CCP0 Low Byte data register
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
PWMRL[1:0]
ENPWM
ENPFD
0000 ….
0000 ….
PWM MSB Byte register
xxxx xxxx uuuu uuuu
PT4.6
DA4.6
PU4.6
PT1.6
TC1.6
PT4.5
PT4.1
DA4.1
PU4.1
PT1.1
PT4.0
DA4.0
PU4.0
.xx. ..xx
.11. ..11
.00. ..00
.xx. .xx.
.00. ....
.... .0..
.uu. ..uu
.11. ..11
.00. ..00
.uu. .uu.
.00. ....
.... .0..
PT4DA
PT4PU
PT1
DA4.5
PU4.5
PT1.5
TC1.5
-,*,*,- -,-,*,*
-,*,*,- -,-,*,*
-,*,*,- -,r,r,-
-,*,*,- -,-,-,-
-,-,-,- -,*,-,-
PT1.2
TRISC1
PT1DA
PT1PU
PT1M1
PT1M2
PT2
DA1.2
PU1.2
PU1.6
PU1.5
PU1.1
.00. .00.
.... 00..
...0 .0..
..xx .x..
..00 .0..
..00 .0..
..00 ....
.00. .00.
.... 00..
...0 .0..
..uu .u..
..00 .0..
..00 .0..
..00 ....
-,*,*,- -,*,*,-
-,-,-,- *,*,-,-
-,-,-,* -,*,-,-
-,-,*,* -,*,-,-
-,-,*,* -,*,-,-
-,-,*,* -,*,-,-
-,-,*,* -,-,-,-
*,*,*,* *,*,*,*
-,-,-,- *,r0,*,*
w0,w0,W0,W0 W0,W0,W0,W0
w0,w0,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
INTEG1[1:0]
PM1.5[0]
PT2.2
PM1.6[0]
PT2.4
PT2.5
TC2.5
PU2.5
TRISC2
PT2PU
PT2M1
TC2.4
TC2.2
PU2.4
PU2.2
PM2.2[1] PM2.2[0]
General Purpose Register as 128Byte
80H ~ FFH GPR0
xxxx xxxx uuuu uuuu
1000 d000 1000 d000
0000 0000 0000 0000
0000 0000 0000 0000
195H
196H
197H
198H
199H
BIECTRL
VPP_HIGH
BIEWR
BIERD
BIEPTRH
BIEPTRL
BIEDH
BIE_ADDR[5:0]
0
0
BIE_DATA[15:8]
BIE_DATA[7:0]
xxxx xxxx
xxxx xxxx
xxxx xxxx
xxxx xxxx
BIEDL
Table 5-1 HY11P41 Register List
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
Page 19
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6. Electrical Characteristics
Absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Voltage applied at VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 4.0 V
Voltage applied to any pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to VDD + 0.3 V
Voltage applied to RST/VPP pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 6.9 V
Voltage applied to TST/PT1.1 pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to VDD + 1 V
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 mA
Storage temperature, Tstg: (unprogrammed device) . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . −55℃to 150℃
(programmed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40℃to 85℃
Total power dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5w
Maximum output current sink by any PORT1 to PORT2 I/O pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25mA
6.1 Recommended Operating Conditions
TA = -40℃ ~ 85℃,unless otherwise noted
Sym.
VDD
Parameter
Test Conditions
All digital peripherals and CPU
Analog peripherals
Min. Typ. Max.
unit
2.2
2.4
0
3.6
3.6
0
Supply Voltage
V
Supply Voltage
VSS
.
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
Page 20
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.2 Internal RC Oscillator
TA = 25℃,VDD = 3.0V,unless otherwise noted
Sym.
HAO
LPO
Parameter
Test Conditions
Min. Typ. Max.
unit
MHz
KHz
High Speed Oscillator frequency
Low Power Oscillator frequency
ENHAO[0]=1
1.8
22
2.0
28
2.2
35
VDD supply voltage be enable LPO
HAO vs. VDD
LPO vs. VDD
2.030
2.025
2.020
2.015
2.010
2.005
2.000
1.995
1.990
1.985
1.980
1.975
1.970
30.00
29.00
28.00
27.00
26.00
25.00
24.00
2.2V
2.4V
2.6V
2.8V
3.0V
3.2V
3.4V
3.6V
2.2V
2.4V
2.6V
2.8V
3.0V
3.2V
3.4V
3.6V
VDD
VDD
Figure 6.2-1 HAO vs. VDD
Figure 6.2-2 LPO vs. VDD
HAO vs. TA@VDD=3.0V
LPO vs. Temperature @VDD
1.980
31.00
30.00
29.00
28.00
27.00
26.00
25.00
24.00
1.960
1.940
1.920
1.900
1.880
.
1.860
1.840
VDD=2.2V
65
1.820
-40
-35
-15
5
25
45
85
-40
℃
-15
℃
15
℃
25
℃
45
℃
75
℃
85
℃
Temperature (
)
℃
Temperature(
)
℃
Figure 6.2-3 HAO vs. Temperature
Figure 6.2-4 LPO vs. Temperature
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
Page 21
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.3 Supply Current into VDD Excluding Peripherals Current
TA = 25℃,VDD = 3.0V,OSC_LPO = 28KHz,unless otherwise noted
Sym. Parameter
Test Conditions
Min. Typ. Max.
unit
mA
mA
uA
Active mode 2
OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 2MHz
OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 1MHz
OSC_CY = off, OSC_HAO = off, CPU_CK = LPO, Idle state
OSC_CY = off, OSC_HAO = off, CPU_CK = off, Sleep state
0.32
0.18
1.65
0.65
0.55
0.3
3
IAM2
Active mode 3
IAM3
Low Power 2
ILP2
Low Power 3
1.2
uA
ILP3
OSC_HAOĈInternal High Accuracy Oscillator frequency.
CPU_CKĈCPU core work frequency.
IAM2 vs VDD
IAM3 vs VDD
450
400
350
300
250
200
150
100
250
200
150
100
50
0
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
.
Figure 6.3-1 IAM2 vs. VDD
Figure 6.3-2 IAM3 vs. VDD
ILP2 vs VDD
ILP3 vs VDD
2.50
2.00
1.50
1.00
0.50
0.00
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-3 ILP2 vs. VDD
Figure 6.3-4 ILP3 vs. VDD
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Preliminary
DS-HY11P41-V13_EN
Page 22
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
ILP2 with temperature at VDD=3V
ILP3 with temperature at VDD=3V
3
2.6
2.2
1.8
1.4
1
1.4
1.2
1
0.8
0.6
0.4
0.2
0
-40
-30
-20
-10
0
10
25
TA(
30
40
50
60
70
85
-40
-30
-20
-10
0
10
25
TA(
30
40
50
60
70
85
)
)
℃
℃
Figure 6.3-5 ILP2 vs. Temperature
Figure 6.3-6 ILP3 vs. Temperature
.
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Preliminary
DS-HY11P41-V13_EN
Page 23
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.4 Port1~4
TA = 25℃,VDD = 3.0V,unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
Input voltage and Schmitt trigger and leakage current and timing
0.7*VDD
High-Level input voltage
VDD
VIH
V
0.3*VDD
Low-Level input voltage
VSS
VIL
0.8
0.1
180
V
Vhys
ILKG
RPU
Input Voltage hysteresis(VIH - VIL )
Leakage Current
uA
kΩ
Port pull high resistance
Output voltage and current and frequency
VDD -0.3
High-level output voltage
IOH=10mA
IOL=-10mA
VOH
V
VSS +0.3
Low-level output voltage
VOL
VOH vs IOH @VDD=3V
VOH vs. IOH@VDD=2.2V
2.35
3.00
2.85
2.70
2.55
2.40
2.25
2.10
2.20
2.05
1.90
1.75
1.60
1.45
1.30
1.15
1.00
25
85
℃
25
℃
℃
85
℃
.
0MA
-5MA
-10MA
-15MA
-20MA
-25MA
-30MA
-35MA
0MA
-5MA
-10MA
-15MA
-20MA
-25MA
-30MA
-35MA
IOH
IOH
Figure 6.4-1 VOH vs. IOH @VDD=3.0V
Figure 6.4-2 VOH vs. IOH @VDD=2.2V
VOL vs. IOL@VDD=3.0V
VOL vs. IOL@VDD=2.2V
0.9
0.8
0.6
0.9
0.8
85
℃
0.6
0.5
0.3
0.2
0.0
85
℃
0.5
0.3
0.2
0.0
25
℃
25
℃
0MA
5MA
10MA 15MA 20MA 25MA 30MA 35MA
IOL
0MA
5MA
10MA 15MA 20MA 25MA 30MA 35MA
IOL
Figure 6.4-3 VOL vs. IOL@VDD=3.0V
Figure 6.4-4 VOL vs. IOL@VDD=2.2V
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Preliminary
DS-HY11P41-V13_EN
Page 24
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.5 Reset (Brownout, External RST Pin, Low Voltage Detect)
TA = 25℃,VDD = 3.0V,unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
us
2
Pulse length needed to accepted reset internally, td-LVR
1.6
1.85
70
2.1
V
BOR
VDD Start Voltage to accepted reset internally (LH),VLVR
Hysteresis, VHYS-LVR
mV
us
2
Pulse length needed as RST/VPP pin to accepted reset internally, td-RST
Input Voltage to accepted reset internally
Hysteresis, VHYS-RST
0.9
V
RST
0.8
10
V
15
uA
Operation current, ISVS
External input voltage to compare reference voltage
1.2
100
3.3
3.2
3.1
3.0
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
V
Compare reference voltage temperature drift
TA = -40℃~ 85 ℃
ppm/℃
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1110b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1101b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1100b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1011b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1010b
.
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1001b
LVD
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1000b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0111b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0110b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0101b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0100b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0011b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0010b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0001b
V
BORĈBrownout Reset
LVRĈLow Voltage Reset of BOR
LVDĈLow Voltage Detect
RSTĈExternal Reset pin
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Preliminary
DS-HY11P41-V13_EN
Page 25
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
.
Figure 6.5-1 BOR Reset Diagram
Figure 6.5-2 RST Reset Diagram
*1 rRSTĈPlease see BOR Introduce of HY11Pxx series User’s Guide (UG-HY11S14-Vxx).
VLVR and VLVR Release Voltaage vs. TA
1.98
1.96
1.94
LVR Release Voltage
V
1.92
1.90
1.88
1.86
1.84
1.82
1.80
LVR Voltage
V
-40
-35
-15
5
25
45
65
85
℃
℃
℃
℃
℃
℃
℃
℃
.
TA
Figure 6.5-3 LVR vs. Temperature
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Preliminary
DS-HY11P41-V13_EN
Page 26
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.6 Power System
TA = 25℃,VDD = 3.0V,unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
uA
IL = 0mA
VDDAX[1:0]=00b
VDDAX[1:0]=00b
VDDAX[1:0]=01b
VDDAX[1:0]=10b
VDDAX[1:0]=11b
VDDAX[1:0]=00b
VDDAX[1:0]=01b
VDDAX[1:0]=10b
VDDAX[1:0]=11b
TA=-40℃~85℃
22
3.4
3.0
2.6
2.4
135
150
165
180
50
VDDA operation current, IVDDA
IL = 0.1mA,
V
VDD≧VDDA+0.2V
V
Select VDDA output voltage
V
V
IL = 10mA
mV
mV
mV
mV
ppm/℃
%/V
uA
VDDA
Dropout voltage
Temperature drift
VDDAX[1:0]=11b
IL = 0.1mA
VDD Voltage drift
VDD=2.5V~3.6V
±0.2
20
IL = 0mA
ACM operation current, IACM
Output voltage ,VACM
Output voltage with Load
Output voltage ,VACM
Output voltage with Load
Temperature drift
*1
ENACM[0]=1,
IL = 0uA
IL = ±200uA
IL = 0uA
1.0
V
0.98
0.98
1.02
1.02
VACM
V
.
*2
ENACM[0]=1,
1.2
ACM
IL = ±200uA
TA=-40℃~85℃
VACM
ppm/℃
uV/V
ENACM[0]=1,
IL = 10uA
50
VDDA Voltage drift
100
VDDAĈAdjust Voltage Regulator
ACMĈAnalog Common Mode Voltage
*1: VACM = 1.0V is just at A/D differential voltage reference < 1.4V ( if delta VR: (VDDA-VSS)/2 )
*2: VACM = 1.2V is just at A/D differential voltage reference > 1.4V ( if delta VR: (VDDA-VSS)/2 )
VDDA@2.4V with VDD
VDDA@2.4V with VDD
2.390
2.3900
2.3895
2.3890
2.3885
2.3880
2.3875
2.3870
2.3865
2.3860
2.3855
2.3850
2.3845
2.3840
2.388
2.386
2.384
2.382
2.380
2.378
2.376
2.374
2.372
L
I =10mA
L
I =0.1mA
3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V
VDD(V)
3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V
VDD(V)
Figure 6.6-1 VDDA lL=0.1mA vs. VDD
Figure 6.6-2 VDDA lL=10mA vs. VDD
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
Page 27
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
VDDA with temperature
VDDA with temperature
2.3910
2.3880
2.3860
2.3840
2.3820
2.3800
2.3780
2.3760
2.3740
2.3720
2.3700
2.3680
2.3660
L
I =10mA
I
L
=0.1mA
2.3900
2.3890
2.3880
2.3870
2.3860
2.3850
2.3840
2.3830
2.3820
2.3810
VDD=3.0V
VDD=2.6V
VDD=3.0V
VDD=2.5V
-40
-35
-15
5
25
45
65
85
-40
-35
-15
5
25
45
65
85
℃
TA(
)
TA(℃)
Figure 6.6-3 VDDA lL=0.1mA vs. Temperature
Figure 6.6-4 VDDA lL=10mA vs. Temperature
ACM Load vs. VDDA
ACM Load vs. VDDA
1.226
1.020
IL=-200uA
IL=-200uA
1.216
IL=0uA
1.010
1.000
0.990
0.980
IL=0uA
IL=200uA
IL=200uA
1.206
1.196
1.186
1.176
2.4
2.6
2.9
3.3
2.4
2.6
2.9
3.3
Internal VDDA(V)
Internal VDDA(V)
Figure 6.6-5 ACM Load vs. VDDA (a)
Figure 6.6-5 ACM Load vs. VDDA (b)
ACM vs. VDD with temperature at VDDA=2.4V
ACM vs. VDD with temperature at VDDA=2.4V
.
1.020
1.010
1.000
0.990
0.980
1.226
VDD=3.6V
VDD=2.5V
VDD=3.6V
VDD=2.5V
1.216
1.206
1.196
1.186
1.176
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
TA(
℃
)
TA( )
℃
Figure 6.6-6 ACM vs. Temperature (a)
Figure 6.6-6 ACM vs. Temperature (b)
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
Page 28
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.7 SD18, Power Supply and Recommended Operating Conditions
TA = 25℃,VDD = 3.0V, VDDA=2.4V,unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage at VDDA
ENVDDA[0]=0
2.4
25
3.6
300
VSD18
Modulator sample frequency, ADC_CK
Over Sample Ratio, OSR
250
120
KHz
f SD18
256
32768
Operation supply current
ENADC[0]=1
without PGA
GAIN =4,
ADC_CK=250KHz
uA
I SD18
*1, OSR=128, setting by ADCCN3[ OSR[3] ] bit.
OSR[3:0]=1010, OSR=128; OSR[3:0]=0xxx, OSR=256 ~ 32768
6.7.1 PGA, Power Supply and Recommended Operating Conditions
TA = 25℃,VDD = 3.0V, VDDA=2.4V,unless otherwise noted
Sym.
VPGA
I PGA
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage at VDDA
Operation supply current
Gain temperature drift
ENVDDA[0]=0
2.4
3.6
PGAGN[1:0]=<01>or<1x>
320
5
uA
TA = -40℃~ 85℃
GAIN=128
ppm/℃
GPGA
.
6.7.2 SD18, Performance II (fSD18=250KHz)
TA = 25℃,VDD = 3.0V, VDDA=2.9V,VVR=1.0V,GAIN=1 without PGA, unless otherwise noted
Sym.
Parameter
Integral Nonlinearity(INL)
No Missing Codes3
Temperature drift
Gain 1~x16
Test Conditions
VDDA=2.4V,VVR=1.0V,∆SI=±450mV
ADC_CK=250KHz,OSR[2:0]=010b
Min. Typ. Max.
unit
%FSR
Bits
±0.003
±0.01
INL
23
TA= -40℃~85℃
2
ppm/℃
GSD18
Offset error of Full Scale
Rang input voltage range
with Chopper without
PGA
Gain=2
1
%FSR
∆AI=0V
∆VR=0.9V
GAIN=1
GAIN=2
GAIN=4
GAIN=16
GAIN=128
VSI=0V,
2
EOS
DCSET[2:0]=<000>
*∆AI is external short
1
Offset temperature drift
with chopper without
PGA
uV/℃
0.5
0.15
0.02
VCM=0.7V to 1.7V,
Common-mode rejection
dB
90
CMSD18
VVR=1.0V,without PGA
GAIN=1
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Preliminary
DS-HY11P41-V13_EN
Page 29
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
VCM=0.7V to 1.7V,
VVR=1.0V,
VSI=0V,
GAIN=16
GAIN=1
PGA=off
GAIN=16
75
DC power supply
rejection
VDDA=3.0V,∆VDDA=±100mV,
PSRR
75
dB
VVR=1.0V, VSI=VSI-=1.2V,
SD18 Offset Drfit vs. Temperature
SD18 Offset Drfit vs. Temperature
5
0
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
-4.5
-5.0
-5
-10
-15
-20
-25
-40
-20
0
20
40
60
80
℃
℃
℃
℃
℃
℃
℃
-40
-20
0
20
40
60
80
℃
℃
℃
℃
℃
℃
℃
TA
TA
Gain=1, SI and VR buffer off
VIN short to ACM
ꢀVR=1.2V, VDDA=2.4V
Gain=16, SI and VR buffer off
VIN short to ACM
ꢀVR=1.2V, VDDA=2.4V
Figure 6.7-1(a) SD18 Offset Temperature Drift
Figure 6.7-1(b) SD18 Offset Temperature Drift
SD18 Offset Drfit vs. Temperature
SD18 Gain Drfit vs. Temperature
1
0.5
0
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
-0.03%
-0.5
-1
.
-1.5
-2
-40
-20
0
20
40
60
80
℃
℃
℃
℃
℃
℃
℃
-40
℃
-20
0
℃
20
40
60
80
℃
℃
℃
℃
℃
TA
Gain=128, SI and VR buffer off
VIN short to ACM
ꢀVR=1.2V, VDDA=2.4V
TA
Gain=16, SI and VR buffer off
ꢀSI=37.5mV, ꢀVR=0.9V
VDDA=2.4V
Figure 6.7-1(c) SD18 Offset Temperature Drift
Figure 6.7-2(b) SD18 Gain Drift with Temperature
SD18 Gain Drfit vs. Temperature
SD18 Gain Drfit vs. Temperature
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
-0.03%
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
-0.03%
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
℃
℃
℃
℃
℃
℃
℃
℃
℃
℃
℃
℃
℃
℃
TA
TA
Gain=128, SI and VR buffer off
ꢀSI=4.6875mV, ꢀVR=0.9V
VDDA=2.4V
Gain=1, SI and VR buffer off
ꢀSI=300mV, ꢀVR=0.9V
VDDA=2.4V
Figure 6.7-2(a) SD18 Gain Drift with Temperature
Figure 6.7-2(c) SD18 Gain Drift with Temperature
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Preliminary
DS-HY11P41-V13_EN
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HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.7.3 SD18, Temperature Sensor
TA = 25℃,VDD = 3.0V, VDDA=2.4V,unless otherwise noted
Sym.
TCS
Parameter
Test Conditions
Min. Typ. Max.
unit
uV/℃
℃
Sensor temperature drift
178
-289
±2
Absolute Temperature Scale 0°K
One point calibrate error temperature
INBUF[0]=1
KT
Calibration at 25℃of -40℃~85℃
℃
TCERR
TPS Voltage vs. Temperature
70
60
50
40
30
20
10
0
-45
-30
-15
0
15
30
45
60
75
90
TA(℃)
Figure 6.7-3 TPS Output Voltage vs. Temperature Drift
.
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Preliminary
DS-HY11P41-V13_EN
Page 31
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
!
6.7.4 SD18 Noise Performance
TA = 25℃,VDD = 3.0V, VDDA=2.4V,unless otherwise noted
HY11P41 provides important input noise specification that aims at SD18. Table 6.7-4(a)
and Table 6.7-4(b) lists out the relations of typical noise specification, Gain, Output rate,
and maximum input voltage of single end. Test condition configuration and external input
signal short, voltage reference: 1.2V and 1024 records were sampled.
ENOB(RMS) with OSR/GAIN at A/D Clock=250Khz, VDDA=2.4V, VREF=1.2V
OSR
128
256
512
1024
2048
4096
8192 16384 32768
Max. Vin(mV)
=0.9*VREF (1)
Output rate(HZ)
1953
977
488
244
122
61
31
15
8
Gain
0.25
0.5
1
=
=
=
=
=
=
=
=
=
=
=
PGA × ADGN
±2400
±2160
±1080
±540
±270
±135
±68
1
1
1
1
1
1
1
2
4
8
×
×
×
×
×
×
×
×
×
×
0.25
0.5
1
14.0
13.9
14.0
13.9
13.9
13.9
13.8
13.5
13.4
13.1
16.3
16.2
16.2
16.1
16.0
15.9
15.6
14.8
14.5
17.6
17.5
17.4
17.3
17.0
16.7
16.3
15.4
15.0
14.6
18.3
18.2
18.1
17.9
17.7
17.3
16.8
15.9
15.5
15.1
18.9
18.8
18.6
18.4
18.1
17.8
17.3
16.4
16.0
15.6
19.4
19.3
19.1
18.9
18.6
18.2
17.8
16.9
16.5
16.1
19.8
19.7
19.5
19.4
19.1
18.8
18.3
17.4
17.0
16.6
20.3
20.2
19.9
19.8
19.6
19.2
18.8
17.9
17.5
17.1
20.7
20.6
20.4
20.2
20.0
19.7
19.3
18.4
18.1
17.6
2
2
4
4
8
8
16
32
64
128
16
16
16
16
±34
±17
±8
14.1
.
(1) Max.Vin (mV) is the max. input voltage of single end to ground (VSS).
Table 6.7-4(a) SD18 ENOB Table
RMS Noise(uV) with OSR/GAIN at A/D Clock=250Khz, VDDA=2.4V, VREF=1.2V
OSR
128
256
512
1024
2048
4096
8192 16384 32768
Max. Vin(mV)
=0.9*VREF
Output rate(HZ)
1953
977
488
244
122
61
31
15
8
Gain
0.25
0.5
1
=
=
=
=
=
=
=
=
=
=
=
PGA × ADGN
±2400
±2160
±1080
±540
±270
±135
±68
1
1
1
1
1
1
1
2
4
8
×
×
×
×
×
×
×
×
×
×
0.25 680.48 122.16 47.79 29.08 20.02 14.45 10.35
7.55
3.99
2.41
1.33
0.78
0.49
0.33
0.32
0.20
0.13
5.90
2.97
1.76
0.98
0.59
0.35
0.23
0.22
0.14
0.10
0.5
1
355.63 63.41 25.72 15.67 10.78
7.66
4.35
2.49
1.51
0.97
0.66
0.62
0.42
0.27
5.63
3.22
1.81
1.08
0.67
0.46
0.44
0.28
0.19
166.02 31.71 13.93
8.63
4.96
2.93
1.91
1.30
1.24
0.80
0.55
5.99
3.49
2.12
1.33
0.91
0.87
0.56
0.38
2
2
85.85
43.52
22.18
11.97
6.75
16.80
9.19
5.10
3.08
2.63
1.68
1.09
7.72
4.53
2.83
1.88
1.79
1.12
0.78
4
4
8
8
16
32
64
128
16
16
16
16
±34
±17
3.75
±8
2.16
Table 6.7-4(b) SD18 RMS Noise Table
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
Page 32
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
The RMS noise is referred to the input. The Effective Number of Bits (ENOB (RMS Bit))
is defined as:
FSR
ln
RMSNoise
ENOB(RMS)
ln(2)
2 VREF 1024ADO
k
- Average
2
k1
RMSNoise
223
Where FSR (Full-Scale Range) 2 VREF/Gain.
1024ADO
k
k1
Average
1024
!
RMS Noise Diagram
RMS Noise Diagram
450
400
350
300
250
200
150
100
50
3
2
Gain=1
Output rate ~ 8sps
Gain=1
Output rate ~ 8sps
1
0
.
-1
-2
-3
0
-3
-2
-1
0
1
2
3
1
201
401
601
801
1001
Output Code (LSB)
Time (reading number)
LSB base on 20-bit output
LSB base on 20-bit output
Figure 6.7-4(a) RMS Noise Diagram
Figure 6.7-4(b) Output Code Diagram
RMS Noise Diagram
RMS Noise Diagram
350
300
250
200
150
100
50
5
4
Gain=128
Output rate ~ 8sps
Gain=128
Output rate ~ 8sps
3
2
1
0
-1
-2
-3
-4
-5
0
-5
-4
-3
-2
-1
0
1
2
3
4
5
1
201
401
601
801
1001
Output Code (LSB)
Time (reading number)
LSB base on 18-bit output
LSB base on 18-bit output
Figure 6.7-4(c) RMS Noise Diagram
Figure 6.7-4(d) Output Code Diagram
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Preliminary
DS-HY11P41-V13_EN
Page 33
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.8 Built-in EPROM (BIE)
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
VBIE
I BIE
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage
6.0
5
6.5
Operation supply current
Supply Voltage
mA
V
0
VSS
.
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
Page 34
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
7. Ordering Information
Shipment
Packing
Type
Package
Type
Package
Drawing
Unit
Material
Device No.1
Pins
Code2
MSL3
Q’ty Composition
4
HY11P41-D000
HY11P41-E016
HY11P41-E016
HY11P41-S016
HY11P41-S016
HY11P41-N016
Die
SSOP
SSOP
SOP
-
D
E
E
S
S
N
000
016
016
016
016
016
000
000
000
000
000
000
-
250
100
-
Green
Green
Green
Green
Green
Green
4
4
4
4
4
16
16
16
16
16
Tube
MSL-3
MSL-3
MSL-3
MSL-3
MSL-3
Tape & Reel
Tube
2500
50
SOP
Tape & Reel
Tape & Reel
2500
5000
QFN
1 Device No.: Model No. – Package Type Description – Code (Blank Code/ Standard/
Customized Programming Code)
Ex: Your customized programming code is 008 and you require die shipment.
The device No. will be HY11P41-D000-008
Ex: You request blank code in die package.
The device No. will be HY11P41-D000
Ex: You request blank code in SSOP16 package.
.
The device No. will be HY11P41-E016
And please clearly indicate the shipment packing type when placing orders.
Ex: Your customized programming code is 009 and you require products in SOP16
package.
The device No. will be HY11P41-S016-009.
And please clearly indicate the shipment packing type when placing orders.
2 Code:
“001”~ “999” is standard or customized programming code. Blank code does not have
these numbers.
3 MSL:
The Moisture Sensitivity Level ranking conforms to IPC/JEDEC J-STD-020 industry
standard categorization. The products are processed, packed, transported and used
with reference to IPC/JEDEC J-STD-033.
4 Green (RoHS & no Cl/Br):
HYCON products are Green products that compliant with RoHS directive and are
Halogen free (Br/Cl<0.1%)
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
Page 35
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8. Package Information
8.1 SSOP16 (E016)
8.1.1 Package Dimensions
D
16
9
1
8
b
e
.
GAUGE PLANE
SEATING PLANE
L
SYMBOLS
MIN
-
NOM
MAX
1.75
0.25
1.50
0.30
0.25
5.00
3.99
6.20
1.27
A
-
A1
0.10
-
0.15
A2
-
b
0.20
0.18
4.80
3.81
5.79
0.41
-
c
-
D
4.90
3.91
5.99
-
E1
E
L
e
0.635 BASIC
-
θ°
0
8
Note:
1. All dimensions refer to JEDEC OUTLINE MO-137.
2. Do not include Mold Flash or Protrusions.
3. Unit : mm.
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
Page 36
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8.1.2 Tube Dimensions
.
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
Page 37
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8.2 SOP16 (S016)
8.2.1 Package Dimensions
.
SYMBOLS
MIN
-
NOM
MAX
1.75
0.25
0.51
0.25
A
-
A1
0.10
0.31
0.10
-
b
-
c
-
D
9.90 BASIC
3.90 BASIC
6.00 BASIC
-
E1
E
L
0.40
0
1.27
8
e
θ
1.27 BASIC
-
Note:
1. All dimensions refer to JEDEC OUTLINE MS-012.
2. Do not include Mold Flash or Protrusions.
3. Unit: mm.
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
Page 38
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8.2.2 Tube Dimensions
.
©2011-2014 HYCON Technology Corp.
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Preliminary
DS-HY11P41-V13_EN
Page 39
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8.3 QFN16(N016)
8.3.1 Package Dimensions
Unit : mm
SYMBOLS
MIN
0.70
NOM
0.75
MAX
0.80
A
A3
b
0.203 REF.
0.25
0.20
2.925
2.925
1.625
1.625
0.30
0.30
3.075
3.075
1.825
1.825
0.40
.
D
3.000
E
3.000
D2
E2
L
1.725
1.725
0.35
e
0.50 BASIC
Note: All dimensions refer to JEDEC OUTLINE MO-220
©2011-2014 HYCON Technology Corp.
www.hycontek.com
Preliminary
DS-HY11P41-V13_EN
Page 40
HY11P41
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
9. Revision Record
Major differences are stated thereinafter:
Version
V06
Page
All
Revision Summary
First Edition
V07
13
Add in note of SD18 Network
V08
7,10~13,35,38 Add in QFN16 package type related information
V10
5~17, 19
Delete the related description and figures of Serial communication SPI
module.
V11
5
14~16
29
Add the description of fast start function
Update the application circuits
Delete the description related to INBUF and VRBUF function of ADC
Update the package information of SSOP16 and SOP16
Update PT1.1/TST pin description
36~37
6~16, 20
35
V12
V13
HY11P41-N016 ordering information (3000/Reel revise to 5000/Reel)
.
©2011-2014 HYCON Technology Corp.
www.hycontek.com
Preliminary
DS-HY11P41-V13_EN
Page 41
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