HY11P42-D000 [HYCON]
8-Bit RISC-like Mixed Signal Microcontroller;
| 型号： | HY11P42-D000 |
| 厂家： | 
HYCON Technology Corporation |
| 描述： | 8-Bit RISC-like Mixed Signal Microcontroller 微控制器 |
| 文件： | 总42页 (文件大小：926K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HY11P42
Datasheet
8-Bit RISC-like Mixed Signal Microcontroller
Embedded 18-Bit Σ∆ADC
.
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
Table of Contents
1. FEATURES 5
2. PIN DEFINITION 6
2.1 SSOP28 Pin Diagram..........................................................................................................................6
2.2 TSSOP28 Pin Diagram........................................................................................................................6
2.3 QFN24 Pin Diagram.............................................................................................................................7
2.4 SSOP28 Pin out I/O Description ........................................................................................................8
2.5 TSSOP28 Pin out I/O Description....................................................................................................10
2.6 QFN24 Pin out I/O Description.........................................................................................................12
3. APPLICATION CIRCUIT 14
3.1 Bridge Sensor ǵ ..............................................................................................................................14
.
3.2 Bridge Sensor Ƕ ..............................................................................................................................15
3.3 4-20mA Two-Wire Current Panel Meter...........................................................................................16
4. FUNCTION OUTLINE 17
4.1 Internal Block Diagram.....................................................................................................................17
4.2 Related Description and Supporting Documents..........................................................................17
4.3 SD18 Network....................................................................................................................................18
6. ELECTRICAL CHARACTERISTICS
20
6.1 Recommended operating conditions..............................................................................................20
6.2 Internal RC Oscillator .......................................................................................................................21
6.3 Supply current into VDD excluding peripherals current...............................................................22
6.4 Port1~5...............................................................................................................................................24
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page2
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.5 Reset (Brownout, External RST pin, Low Voltage Detect)............................................................25
6.6 Power System....................................................................................................................................27
6.7 SD18, Power Supply and Recommended Operating Conditions.................................................29
6.8 Built-in EPROM (BIE)........................................................................................................................35
7. ORDERING INFORMATION 36
8. PACKAGE INFORMATION
37
8.1 SSOP28 (E028) ..................................................................................................................................37
8.2 QFN24(N024)......................................................................................................................................39
8.3 TSSOP28(T028) .................................................................................................................................40
9. REVISION RECORD 42
.
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page3
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
AttentionĈ
1.
HYCON Technology Corp. reserves the right to change the content of this datasheet without further
notice. For most up-to-date information, please constantly visit our website:
http://www.hycontek.com .
2.
3.
HYCON Technology Corp. is not responsible for problems caused by figures or application circuits
narrated herein whose related industrial properties belong to third parties.
Specifications of any HYCON Technology Corp. products detailed or contained herein stipulate the
performance, characteristics, and functions of the specified products in the independent state. We
does not guarantee of the performance, characteristics, and functions of the specified products as
placed in the customer’s products or equipment. Constant and sufficient verification and evaluation
is highly advised.
4.
Please note the operating conditions of input voltage, output voltage and load current and ensure
the IC internal power consumption does not exceed that of package tolerance. HYCON Technology
Corp. assumes no responsibility for equipment failures that resulted from using products at values
that exceed, even momentarily, rated values listed in products specifications of HYCON products
specified herein.
5.
6.
Notwithstanding this product has built-in ESD protection circuit, please do not exert excessive static
electricity to protection circuit.
.
Products specified or contained herein cannot be employed in applications which require extremely
high levels of reliability, such as device or equipment affecting the human body, health/medical
equipments, security systems, or any apparatus installed in aircrafts and other vehicles.
Despite the fact that HYCON Technology Corp. endeavors to enhance product quality as well as
reliability in every possible way, failure or malfunction of semiconductor products may happen.
Hence, users are strongly recommended to comply with safety design including redundancy and
fire-precaution equipments to prevent any accidents and fires that may follow.
7.
8.
Use of the information described herein for other purposes and/or reproduction or copying without
the permission of HYCON Technology Corp. is strictly prohibited.
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page4
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
1. Features
8-bit RISC, 66 instructions included.
Operating voltage range: 2.2V to 3.6V,
operation temperature range: -40℃~85℃.
External Crystal Oscillator and Internal High
Precision RC Oscillator, 6 CPU clock rates
enable users to have the most power-saving
plan.
Built-in absolute temperature sensor
1.0V and 1.2V internal analog circuit common
ground that equips with Push-Pull drive ability
to provide sensor driving voltage.
LVD low voltage detection function has 14
steps of voltage detection configuration and
external input voltage detection function.
VDDA can select 4 different output voltages
that equip with 10mA low dropout regulator
function.
Active Mode 300uA@2MHz
Standby Mode 3uA@28KHz
Sleep Mode 1uA
2K Word OTP (One Time Programmable) Type
program memory, 128 Byte Data Memory.
Brownout detector and Watch dog Timer,
prevents CPU from Crash.
8-bit Timer A
8-bit Timer C module can generate PWM/PFD
waveform.
EUART module.
18-bit fully differential input Sigma-Delta
Analog-to-Digital Converter (A/D)
Built-In EPROM (BIE)
Support 6 stack level
Built-in PGA (Programmable Gain
Amplifier) 1/4x、1/2x、1x. …128x，10 input
signal gain selection.
.
Built-in Input zero point adjustment can
increase measurement range according
to different application.
Built-in high impedance input buffer (Not
suitable for 4x or upwards input gain).
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page5
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2. Pin Definition
2.1 SSOP28 Pin Diagram
28 27 26 25 24 23 22 21 20 19 18 17 16 15
SSOP28
1
2
3
4
5
6
7
8
9
1 0 1 1 1 2 1 3 1 4
Figure 2-1 HY11P42 SSOP28 Pin Diagram
2.2 TSSOP28 Pin Diagram
.
Figure 2-2 HY11P42 TSSOP28 Pin Diagram
Note 1ĈVPP and RST use the same pin. Input voltage cannot exceed 5.8V when not programming EPROM.
Note 2：TST and PT1.3 use the same pin. Input voltage cannot exceed Vdd+0.3V while operating.
Note 3：If PT1.3 is not configured as external button pin, the anti-interference ability will be enhanced.
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page6
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2.3 QFN24 Pin Diagram
Figure 2-3 HY11P42 N-QFN24 Pin Diagram
Note 1ĈVPP and RST use the same pin. Input voltage cannot exceed 5.8V when not programming EPROM.
.
Note 2：TST and PT1.3 use the same pin. Input voltage cannot exceed Vdd+0.3V while operating.
Note 3：If PT1.3 is not configured as external button pin, the anti-interference ability will be enhanced.
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page7
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2.4 SSOP28 Pinout I/O Description
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel
Pin characteristic
NO.
1
Pin Name
Description
Pin
Type
Buffer
Type
VSS
P
P
Grounding pin for IC operation voltage
RST/VPP
2
RST
VPP
I
S
P
Reset IC
P
EPROM programming voltage input
PT1.0/INT0/PSCK
PT1.1/INT1/PSDI
PT1.0
INT0
I
I
I
S
S
S
Digital input
3
Interrupt input INT0
PSCK
OTP programming interface SCK
PT1.1
INT1
I
I
I
S
S
S
Digital input
4
5
6
7
Interrupt input INT1
OTP programming interface SDI
PSDI
PT1.2/LVDIN
PT1.2
LVDIN
I
S
A
Digital input
A
.
LVD external signal input port
PT1.3/TST/RC
PT1.3
RC
I
I/O
I
S
S
S
Digital input
EUART communication interface RC
Test Mode input pin (invalid)
TST
PT1.4/TX
PT1.4
TX
I/O
I/O
S
S
Digital I/O
EUART communication interface TX
PT1.5/PSDO
8
9
PT1.5
PSDO
I/O
I/O
S
C
Digital I/O
OTP programming interface SDO
PT1.6
PT1.6
I/O
S
Digital I/O
PT1.7/BZ
10
PT1.7
BZ
I/O
O
S
C
Digital I/O
Buzzer output
VDD
Power source for IC operation
11
12
P
P
PT2.0/XTO
PT2.0
I/O
S
Digital I/O
©2010-2013 HYCON Technology Corp.
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DS-HY11P42-V10_EN
Page8
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
XTO
A
A
External oscillator output
PT2.1/XTI
13
14
15
PT2.1
XTI
I/O
A
S
A
Digital I/O
External oscillator input
PT2.2/PWM0/PFD
PT2.2
PWM0
PFD
I/O
O
C
C
C
Digital I/O
PWM output port
PFD output port
O
PT2.3/TMCKI
PT2.3
I/O
I
S
S
S
S
C
C
Digital I/O
TMCKI
TIMERC clock source input port
Digital I/O
16
17
18
19
PT2.4
PT2.5
PT2.6
PT2.7
I/O
I/O
I/O
I/O
Digital I/O
Digital I/O
Digital I/O
Regulator output
20
VDDA
P
P
P
Analog circuit voltage source
Internal analog circuit grounding pin
Analog input channel
Analog input channel
Analog input channel
Analog input channel
21
22
23
24
25
ACM
AI0
P
A
A
A
A
.
A
AI1
A
A
A
AI2
AI3
PT4.4/AI4
26
27
28
PT4.4
AI4
I
C
A
Digital input
A
Analog input channel
PT4.5/AI5
PT4.6/AI6
PT4.5
AI5
I
C
A
Digital input
A
Analog input channel
PT4.6
AI6
I
C
A
Digital input
A
Analog input channel
Table 2-1 Pin Definition and Function Description
©2010-2013 HYCON Technology Corp.
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DS-HY11P42-V10_EN
Page9
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2.5 TSSOP28 Pin out I/O Description
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel
Pin Characteristic
NO.
Pin Name
Description
Pin
Type
Buffer
Type
1
2
3
4
PT2.4
PT2.5
PT2.6
PT2.7
VDDA
I/O
I/O
I/O
I/O
S
S
C
C
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Regulator output
5
P
P
Analog circuit voltage source
Internal analog circuit grounding pin
Analog input channel
6
7
ACM
AI0
P
A
A
A
A
P
A
A
A
A
8
AI1
Analog input channel
9
AI2
Analog input channel
10
AI3
Analog input channel
PT4.4/AI4
11
12
PT4.4
AI4
I
A
.
C
A
Digital input
Analog input channel
PT4.5/AI5
PT4.6/AI6
PT4.5
AI5
I
C
A
Digital input
A
Analog input channel
13
14
15
PT4.6
AI6
I
C
A
Digital input
A
Analog input channel
Grounding pin for IC operation
voltage
VSS
P
P
RST/VPP
RST
VPP
I
S
P
Reset IC
P
EPROM programming voltage input
PT1.0/INT0/PSCK
PT1.1/INT1/PSDI
PT1.2/LVDIN
PT1.0
INT0
I
I
I
S
S
S
Digital input
16
Interrupt input INT0
PSCK
OTP programming interface SCK
PT1.1
INT1
I
I
I
S
S
S
Digital input
17
18
Interrupt input INT1
OTP programming interface SDI
PSDI
©2010-2013 HYCON Technology Corp.
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DS-HY11P42-V10_EN
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HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
PT1.2
LVDIN
I
S
A
Digital input
A
LVD external signal input port
PT1.3/TST/RC
PT1.3
RC
I
I/O
I
S
S
S
Digital input
19
20
EUART communication interface RC
Test Mode input pin (invalid)
TST
PT1.4/TX
PT1.4
TX
I/O
I/O
S
S
Digital I/O
EUART communication interface TX
PT1.5/PSDO
21
22
PT1.5
PSDO
I/O
I/O
S
C
Digital I/O
OTP programming interface SDO
PT1.6
PT1.6
I/O
S
Digital I/O
PT1.7/BZ
23
24
25
PT1.7
BZ
I/O
O
S
C
P
Digital I/O
Buzzer output
VDD
P
Power source for IC operation
.
I/O
PT2.0/XTO
PT2.0
XTO
S
A
Digital I/O
A
External oscillator output
PT2.1/XTI
26
27
28
PT2.1
XTI
I/O
A
S
A
Digital I/O
External oscillator input
PT2.2/PWM0/PFD
PT2.2
PWM0
PFD
I/O
O
C
C
C
Digital I/O
PWM output port
PFD output port
O
PT2.3/TMCKI
PT2.3
I/O
I
S
S
Digital I/O
TMCKI
TIMERC clock source input port
Table 2-2 Pin Definition and Function Description
©2010-2013 HYCON Technology Corp.
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DS-HY11P42-V10_EN
Page11
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
2.6 QFN24 Pin out I/O Description
“I/O” input/output, “I” input, “O” output, “S” Smith Trigger, “C” CMOS features compatible input/output, “P” power supply, “A” analog channel
Pin Characteristic
NO.
Pin Name
Description
Pin
Type
Buffer
Type
1
2
3
4
5
ACM
AI0
P
A
A
A
A
P
A
A
A
A
Internal analog circuit grounding pin
Analog input channel
AI1
Analog input channel
AI2
Analog input channel
AI3
Analog input channel
PT4.4/AI4
6
7
8
9
PT4.4
AI4
I
C
A
Digital input
A
Analog input channel
PT4.5/AI5
PT4.6/AI6
RST/VPP
PT4.5
AI5
I
C
A
Digital input
A
Analog input channel
PT4.6
AI6
I
A
.
C
A
Digital input
Analog input channel
RST
VPP
I
S
P
Reset IC
P
EPROM programming voltage input
PT1.0/INT0/PSCK
PT1.1/INT1/PSDI
PT1.0
INT0
I
I
I
S
S
S
Digital input
10
Interrupt input INT0
PSCK
OTP programming interface SCK
PT1.1
INT1
I
I
I
S
S
S
Digital input
11
12
Interrupt input INT1
OTP programming interface SDI
PSDI
PT1.2/LVDIN
PT1.2
LVDIN
I
S
A
Digital input
A
LVDIN external signal input port
PT1.3/TST/RC
PT1.3
RC
I
I/O
I
S
S
S
Digital input
13
14
EUART communication interface RC
Test Mode input pin (invalid)
TST
PT1.4/TX
PT1.4
I/O
S
Digital I/O
©2010-2013 HYCON Technology Corp.
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DS-HY11P42-V10_EN
Page12
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
TX
I/O
S
EUART communication interface TX
PT1.5/PSDO
15
16
17
PT1.5
PSDO
I/O
I/O
S
C
Digital I/O
OTP programming interface SDO
PT1.6
PT1.6
I/O
S
Digital I/O
PT1.7/BZ
PT1.7
BZ
I/O
O
S
C
Digital I/O
Buzzer output
VSS
Grounding pin for IC operation
voltage
18
19
P
P
P
P
VDD
Power source for IC operation
PT2.0/XTO
20
21
PT2.0
XTO
I/O
A
S
A
Digital I/O
External oscillator output
PT2.1/XTI
PT2.1
XTI
I/O
A
S
A
Digital I/O
External oscillator input
.
PT2.2/PWM0/PFD
PT2.2
PWM0
PFD
I/O
C
C
C
S
Digital I/O
22
O
PWM output port
PFD output port
Digital I/O
O
23
24
PT2.4
VDDA
I/O
Regulator output
Analog circuit voltage source
P
P
Table 2-3 Pin Definition and Function Description
©2010-2013 HYCON Technology Corp.
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DS-HY11P42-V10_EN
Page13
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
3. Application Circuit
3.1 Bridge Sensor Ⅰ
VDDA
VDD
AI2
D-
D+
PT1.7
1~10uF
0.1uF
0.1uF
22~100nF
28 27 26 25 24 23 22 21 20 19 18 17 16 15
.
SSOP28
1
2
3
4
5
6
7
8
9
1 0 1 1 1 2 1 3 1 4
100k
10nF
1uF
Figure 3-1 Application Circuit for Bridge Sensors
Note 1: DCSET[2:0] can conduct bias adjustment of Load Cell zero point voltage address
Note 2: BIE function can be used to save calibration parameters.
©2010-2013 HYCON Technology Corp.
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Page14
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
3.2 Bridge Sensor Ⅱ
VDDA
VDDA
VDD
AI2
AI3
D-
D+
RTC
PT1.7
1~10uF
0.1uF
0.1uF
22~100nF
28 27 26 25 24 23 22 21 20 19 18 17 16 15
.
SSOP28
1
2
3
4
5
6
7
8
9
1 0 1 1 1 2 1 3 1 4
100k
10nF
1uF
Figure 3-2 Application Circuit of Temperature Compensation Bridge Sensor
Note 1: Using external reference voltage to design temperature compensation resistor NTC basic circuit
Note 2: DCSET[2:0] can conduct bias adjustment of Load Cell zero point voltage address
Note 3: BIE function can be used to save calibration parameters.
©2010-2013 HYCON Technology Corp.
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DS-HY11P42-V10_EN
Page15
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
3.3 4-20mA Two-Wire Current Panel Meter
4~20mA
VDD
1~10uF
PT1.7
4~20mA
VDDA
1~10uF
0.1uF
0.1uF
22~100nF
28 27 26 25 24 23 22 21 20 19 18 17 16 15
.
SSOP28
1
2
3
4
5
6
7
8
9
1 0 1 1 1 2 1 3 1 4
100k
10nF
Figure 3-3 4-20mA Panel Meter that Unneeded to Connect External Power Supply
Note 1: DCSET[2:0] can carry out bias adjustment of Load Cell zero point voltage address
Note 2: BIE function can be used to save calibration parameters.
©2010-2013 HYCON Technology Corp.
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DS-HY11P42-V10_EN
Page16
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
4. Function Outline
4.1 Internal Block Diagram
XTI XTO VDD
VSS
TMCKI/PPF
PTn.x/BZ
RC
TX
C
C
P
P
C
C
C
C
Interface
(EUART)
Data
Memory
(STK：6L)
(SP：128B)
(GPR：128B)
RC
Oscillator
(HAO)
PORT
(PT1、PT2)
(PT4)
TIMER
A/C
(PPF)
(LPO)
(BZ)
Program
Memory
(OTP：2KW)
HARDWARE
MULTIPLIER
8x8
CPU
H08A
Watch Dog
RESET
(BOR)
(STACK)
(WDT)
SD18
(Σ∆AD)
(Network)
Low Voltage
Detect
Build-In
EPROM
64 word
Power
System
(LVD)
(Temp.senor)
(RST)
C
A
C
P
P
P
VPP
RST
LVDIN
AIx
VDDA ACM
.
C
P
D
A
Common I/O Pad
Power Pad
Digital Pad
Analog Pad
Figure 4-1 HY11P42 Internal Block Diagram
4.2 Related Description and Supporting Documents
IC Function Related Operating Instruction
DS-HY11P42-Vxx
UG-HY11S14-Vxx
HY11P42 Data Sheet
HY11P Series Users’ Manual
APD-CORE002-Vxx H08A Instruction Description
Development Tool Related Operating Instruction
APD-HYIDE006-Vxx HY11xxx Series Development Tool Software Instruction
Manual
APD-HYIDE005-Vxx HY11xxx Series Development Tool Hardware Instruction
Manual
APD-OTP001-Vxx
OTP Products Programming Pin Manual Product
Production Related Operating Instruction
APD-HYIDE004-Vxx HY1xxxx Series Production Line Specialized Programmer
Manual
BDI-HY11P42-Vxx
HY11P42 Individual Product Die Bonding Information
©2010-2013 HYCON Technology Corp.
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DS-HY11P42-V10_EN
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HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
4.3 SD18 Network
VDDA
ENADC[0]
ADC_CK
OSR[2:0]
24bit
SD18
INH[2:0]
DCSET[2:0]
VREGN[0]
ADGN[2:0]
AI2 000
AI6 001
AI4 010
1bit
ADCR
H/M/L
AI0 011
VDD/2 100
ACM 101
INX[1:0]
INH
SI+
SI-
ΣΔAD
SI:x¼,x½ ,x2,x4,x8,x16
TPSH1 110
TPSH0 111
INX
ADCIF
Interrupt
INIS[0]
INL[2:0]
AI3 000
AI7 001
AI5 010
AI1 011
OPO 100
VSS 101
TPSL0 110
TPSL1 111
+ VR:x1,x½ -
GAGN[1:0]
INL
VDDX
VR+
VR-
.
Control Circuit
VRH[1:0]
AI6 00
AI8 01
VRL[1:0]
i
TPSHx
+
-
TPSLx
AI5 00
AI9 01
Q1
VRH
10
VRL
AI2
ACM 11
AI3
10
VSS 11
Figure 4-2 SD18 Network
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HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
5. Register List
“-”no use,“*”read/write,“w”write,“r”read,“r0”only read 0,“r1”only read 1,“w0”only write 0,“w1”omly write 1
“.”unimplemented bit,“x”unknown,“u”unchanged,“d”depends on condition
Address File Name
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
A-RESET
N/A
i-RESET
N/A
R/W
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
-,-,-,- -,-,-,*
*,*,*,* *,*,*,*
-,-,-,- -,-,-,*
*,*,*,* *,*,*,*
-,-,-,- -,*,*,*
*,*,*,* *,*,*,*
r,rw0,rw0,- -,r,r,r
-,-,-,- -,*,*,*
*,*,*,* *,*,*,*
-,-,-,- -,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
r,r,r,r r,r,r,r
r,r,r,r r,r,r,r
*,*,*,- *,*,*,*
*,*,-,- -,-,-,-
-,*,*,- *,*,*,*
*,*,-,- -,-,-,-
*,*,*,* *,*,*,*
-,-,-,- -,-,-,*
-,-,-,* *,*,*,*
rw0,rw0,rw0,rw0 -,rw0,-,-
-,*,r,r *,*,*,*
*,*,*,* -,-,-,-
*,*,*,* *,*,*,*
-,-,*,* *,*,*,*
-,-,-,- *,*,*,*
r,r,r,r r,r,r,r
r,r,r,r r,r,r,r
r,r,r,r r,r,r,r
*,*,*,* *,*,*,*
-,-,*,* *,*,*,*
*,*,*,- -,-,-,-
*,*,*,* *,*,*,-
-,*,*,* *,*,*,-
*,*,*,* w1,*,*,*
r,r,r,r r,r,r,r
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
r,r,r,r r,r,r,r
*,-,*,* -,-,-,-
*,*,*,* -,-,-,-
*,*,*,* *,*,*,*
*,*,*,* *,-,-,*
-,r,r,r r,r,r,rw0
-,-,-,- *,*,*,*'
-,-,-,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
r,r,r,r r,r,r,r
-,r,r,r -,-,-,-
-,*,*,* -,-,-,-
-,*,*,* -,-,-,-
*,*,*,* r,r,r,r
*,*,*,* -,-,-,-
-,-,-,- -,*,-,-
*,*,*,* *,*,*,*
-,-,-,- *,*,*,*
-,*,-,* -,*,-,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
*,*,*,* *,*,*,*
-,-,*,* -,-,-,-
*,*,-,- *,*,*,*
*,*,*,* *,*,*,*
-,-,-,- *,r0,*,*
00H
01H
02H
03H
04H
05H
06H
07H
08H
09H
0FH
10H
11H
12H
16H
17H
18H
1AH
1BH
1DH
1EH
1FH
20H
21H
22H
23H
24H
26H
27H
29H
2AH
2BH
2CH
2DH
30H
31H
32H
33H
39H
3AH
3BH
3CH
3DH
3EH
3FH
40H
41H
42H
46H
47H
48H
4EH
4FH
51H
63H
64H
65H
66H
67H
68H
69H
6AH
6BH
6CH
6DH
6EH
6FH
70H
71H
72H
74H
75H
77H
78H
79H
INDF0
Contents of FSR0 to address data memory value of FSR0 not changed
POINC0
PODEC0
PRINC0
PLUSW0
INDF1
Contents of FSR0 to address data memory value of FSR0 post-incremented
Contents of FSR0 to address data memory value of FSR0 post-decremented
Contents of FSR0 to address data memory value of FSR0 pre-incremented
Contents of FSR0 to address data memory value of FSR0 offset by W
Contents of FSR1 to address data memory value of FSR0 not changed
Contents of FSR1 to address data memory value of FSR0 post-incremented
Contents of FSR1 to address data memory value of FSR0 post-decremented
Contents of FSR1 to address data memory value of FSR0 pre-incremented
Contents of FSR1 to address data memory value of FSR0 offset by W
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
POINC1
PODEC1
PRINC1
PLUSW1
FSR0H
FSR0L
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
FSR0[8]
FSR1[8]
TOS[8]
.... ...x
.... ...u
Indirect Data Memory Address Pointer 0 Low Byte,FSR0[7:0]
Indirect Data Memory Address Pointer 1 Low Byte,FSR1[7:0]
xxxx xxxx uuuu uuuu
.... ...x .... ...u
xxxx xxxx uuuu uuuu
.... .000 .... .000
0000 0000 0000 0000
FSR1H
FSR1L
TOSH
TOS[10]
PC[10]
TOS[9]
Top-of-Stack Low Byte (TOS<7:0>)
STKFL STKUN STKOV
TOSL
STKPRT[2:0]
PC[9]
STKPTR
PCLATH
PCLATL
TBLPTRH
TBLPTRL
TBLDH
TBLDL
000. .000
.... .000
000. .000
.... .000
PC[8]
PC Low Byte for PC<7:0>
0000 0000 0000 0000
.... .000 .... .000
TBLPTR[10] TBLPTR[9] TBLPTR[8]
Program Memory Table Pointer Low Byte (TBLPTR<7:0>)
Program Memory Table Latch High Byte
Program Memory Table Latch Low Byte
Product Register of Multiply High Byte
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
000. 0000 000. 0000
PRODH
PRODL
INTE1
Product Register of Multiply Low Byte
GIE
ADCIE
RCIE
TMCIE
TMAIE
TMAIF
WDTIE
WDTIF
E1IE
E1IF
E0IE
E0IF
INTE2
TXIE
00.. ....
.00. 0000
00.. ....
00.. ....
.00. 0000
00.. ....
INTF1
ADCIF
RCIF
TMCIF
INTF2
TXIF
Working Register
WREG
BSRCN
STATUS
PSTATUS
LVDCN
PWRCN
MCKCN1
MCKCN2
MCKCN3
ADCRH
ADCRM
ADCRL
ADCCN1
ADCCN2
ADCCN3
AINET1
AINET2
TMACN
TMAR
xxxx xxxx uuuu uuuu
BSR[0]
Z
..... ...0
...x xxxx
000d .0..
..... ...0
...u uuuu
uduu .d..
C
DC
N
OV
PD
TO
IDLEB
LVD
BOR
SKERR
VLDX[3:0]
LVDFG
LVDON
ENACM
ADCCK
HSCK
.000 0000 .000 uuuu
0000 .... 0000 ....
ENHAO 0000 0001 0000 0001
VDDAX[1:0]
ADCS[2:0]
ENVDDA
XTHSP
XTSP
ENXT
HSS[1:0]
PERCK
CPUCK[1:0]
LSCK
..00 0000
.... 0000
..00 0000
.... 0000
BZS[2:0]
ADC conversion memory HighByte
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
0000 0000 0000 0000
ADC conversion memory Middle Byte
ADC conversion memory Low Byte
.
PGAGN[1:0]
ADGN[2:0]
ENADC
ENHIGN ENCHP
INBUF
DCSET[2:0]
VRBUF
VREGN
..00 0000
000. ....
..00 0000
000. ....
OSR[2:0]
INH[2:0]
INL[2:0]
INIS
0000 000. 0000 000.
.000 000. .000 000.
VRH[1:0]
INX[1:0]
VRL[1:0]
WDTS[2:0]
TMAS[1:0]
ENTMA
TMACK
ENWDT
0000 0000 0000 0000
xxxx xxxx uuuu uuuu
0000 0000 0000 0000
1111 1111 1111 1111
0000 0000 0000 0000
TimerA data register
TMCCK[1:0]
TMCS1[2:0]
TMCS0[1:0]
TMCCN
PRC
ENTMC
TimerC programmable register
TimerC register
TMCR
PASCF[1:0]
PWMRL[1:0]
PASC
PASF
0.00 ….
0000 ….
0.00 ….
0000 ….
PWMCN
PWMR
URCON
URSTA
BAUDCON
BRGRH
BRGRL
TXREG
RCREG
PT4
ENPWM
ENPFD
PWM MSB Byte register
xxxx xxxx uuuu uuuu
0000 0..0 0000 0..0
ABDOVF .000 0110 .000 0110
ENSP
ENTX
RC9D
TX9
TX9D
FERR
PARITY
OERR
ENCR
WUE
PERR
RCIDL
RC9
TRMT
ENADD
ENABD
.... 0000
...x xxxx
.... 0000
...u uuuu
Baud Rate Generator Register High Byte
Baud Rate Generator Register Low Byte
UART Transmit Register
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
UART Receive Register
PT4.6
DA4.6
PU4.6
PT1.6
TC1.6
PT4.5
DA4.5
PU4.5
PT1.5
TC1.5
PT4.4
DA4.4
PU4.4
PT1.4
TC1.4
.xxx ….
.111 ….
.000 ….
.uuu ….
.111 ….
.000 ….
PT4DA
PT4PU
PT1
PT1.7
TC1.7
PT1.3
PU1.3
PT1.2
PT1.1
PU1.1
PT1.0
PU1.0
xxxx xxxx uuuu uuuu
TRISC1
PT1DA
PT1PU
PT1M1
PT1M2
PT2
0000 ....
.... .0..
0000 ....
.... .0..
DA1.2
PU1.2
PU1.7
PU1.6
PU1.5
PU1.4
0000 0000 0000 0000
INTEG1[1:0]
INTEG0[1:0]
.... 0000
.0.0 .0.0
.... 0000
.0.0 .0.0
PM1.7[0]
PT2.6
PM1.6[0]
PT2.4
PM1.5[0]
PT2.2
PM1.4[0]
PT2.0
PT2.7
TC2.7
PU2.7
PT2.5
TC2.5
PU2.5
PT2.3
TC2.3
PU2.3
PT2.1
TC2.1
PU2.1
xxxx xxxx uuuu uuuu
0000 0000 0000 0000
0000 0000 0000 0000
TRISC2
PT2PU
PT2M1
PT2M2
TC2.6
TC2.4
TC2.2
TC2.0
PU2.6
PU2.4
PU2.2
PU2.0
PM2.2[1] PM2.2[0]
..00 ....
00.. ….
..00 ....
00.. ….
PWMTR[1] PWMTR[0]
General Purpose Register as 128Byte
80H ~ FFH GPR0
xxxx xxxx uuuu uuuu
1000 d000 1000 d000
195H
196H
197H
198H
199H
BIECTRL
VPP_HIGH
BIEWR
BIERD
BIEPTRH
BIEPTRL
BIEDH
0000 0000 0000 0000 w0,w0,W0,W0 W0,W0,W0,W0
BIE_ADDR[5:0]
BIE_DATA[15:8]
BIE_DATA[7:0]
0
0
0000 0000 0000 0000
w0,w0,*,* *,*,*,*
*,*,*,* *,*,*,*
xxxx xxxx
xxxx xxxx
xxxx xxxx
xxxx xxxx
BIEDL
*,*,*,* *,*,*,*
Table 5-1 HY11P42 Register List
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page19
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6. Electrical Characteristics
Absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Voltage applied at VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 4.0 V
Voltage applied to any pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to VDD + 0.3 V
Voltage applied to RST/VPP pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to 6.9 V
Voltage applied to TST/PT1.3 pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to VDD + 1 V
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 mA
Storage temperature, Tstg: (unprogrammed device) . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . −55℃to 150℃
(programmed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40℃to 85℃
Total power dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5w
Maximum output current sink by any PORT1 to PORT3 I/O pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25mA
6.1 Recommended operating conditions
TA = -40℃ ~ 85℃,unless otherwise noted
Sym.
VDD
Parameter
Test Conditions
All digital peripherals and CPU
Analog peripherals
Min. Typ. Max.
unit
2.2
2.4
0
3.6
3.6
0
Supply Voltage
V
Supply Voltage
External
VSS
XTSP[0]=0, XTHSP[0]=0
Watch crystal
Ceramic resonator
Crystal
32.768K
.
VDD = 2.2V,
XTSP[0]=1, XTHSP[0]=0
Oscillator
Hz
450K
1M
8M
8M
XT
ENXT[0]=1
Frequency
XTSP[0]=1, XTHSP[0]=0
©2010-2013 HYCON Technology Corp.
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DS-HY11P42-V10_EN
Page20
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.2 Internal RC Oscillator
TA = 25℃,VDD = 3.0V,unless otherwise noted
Sym.
HAO
LPO
Parameter
Test Conditions
Min. Typ. Max.
unit
MHz
KHz
High Speed Oscillator frequency
Low Power Oscillator frequency
ENHAO[0]=1
1.7
22
2.0
28
2.3
35
VDD supply voltage be enable LPO
HAO vs. VDD
LPO vs. VDD
2.030
2.025
2.020
2.015
2.010
2.005
2.000
1.995
1.990
1.985
1.980
1.975
1.970
30.00
29.00
28.00
27.00
26.00
25.00
24.00
2.2V
2.4V
2.6V
2.8V
3.0V
3.2V
3.4V
3.6V
2.2V
2.4V
2.6V
2.8V
3.0V
3.2V
3.4V
3.6V
VDD
VDD
Figure 6.2-1 HAO vs. VDD
Figure 6.2-2 LPO vs. VDD
HAO vs. TA@VDD=3.0V
LPO vs. Temperature @VDD
1.980
31.00
30.00
29.00
28.00
27.00
26.00
25.00
24.00
1.960
.
1.940
1.920
1.900
1.880
1.860
1.840
1.820
VDD=2.2V
65
-40
-35
-15
5
25
45
85
-40
℃
-15
℃
15
℃
25
℃
45
℃
75
℃
85
℃
Temperature (
)
℃
Temperature(
)
℃
Figure 6.2-3 HAO vs. Temperature
Figure 6.2-4 LPO vs. Temperature
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DS-HY11P42-V10_EN
Page21
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.3 Supply current into VDD excluding peripherals current
TA = 25℃,VDD = 3.0V,OSC_LPO = 28KHz,unless otherwise noted
Sym. Parameter
Test Conditions
Min. Typ. Max.
unit
mA
mA
mA
uA
Active mode 1
OSC_CY = 8MHz, OSC_HAO = off, CPU_CK = 8MHz
OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 2MHz
OSC_CY = off, OSC_HAO = 2MHz, CPU_CK = 1MHz
OSC_CY = 32768Hz, OSC_HAO = off, CPU_CK = 16384Hz
OSC_CY = off, OSC_HAO = off, CPU_CK = LPO, Idle state
OSC_CY = off, OSC_HAO = off, CPU_CK = off, Sleep state
1.2
0.32
0.18
7
2
0.55
0.3
12
IAM1
Active mode 2
IAM2
Active mode 3
IAM3
Low Power 1
ILP1
Low Power 2
1.65
0.65
3
uA
ILP2
Low Power 3
1.2
uA
ILP3
OSC_CYĈExternal Oscillator frequency.
OSC_HAOĈInternal High Accuracy Oscillator frequency.
CPU_CKĈCPU core work frequency.
IAM1 vs VDD
IAM2 vs VDD
450
400
350
300
250
200
150
100
1.9
1.7
1.5
1.3
1.1
0.9
0.7
0.5
.
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-1 IAM1 vs. VDD
Figure 6.3-2 IAM2 vs. VDD
IAM3 vs VDD
ILP1 vs VDD
250
200
150
100
50
10
9
8
7
6
5
4
3
2
1
0
0
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-3 IAM3 vs. VDD
Figure 6.3-4 ILP1 vs. VDD
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Page22
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
ILP2 vs VDD
ILP3 vs VDD
2.50
2.00
1.50
1.00
0.50
0.00
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VDD(V)
Figure 6.3-5 ILP2 vs. VDD
Figure 6.3-6 ILP3 vs. VDD
IAM1 with temperature at VDD=3V
ILP2 with temperature at VDD=3V
1.30
3
2.6
2.2
1.8
1.4
1
1.29
1.28
1.27
1.26
1.25
-40
-30
-20
-10
0
10
25
TA(
30
40
50
60
70
85
-40
-30
-20
-10
0
10
25
TA(
30
40
50
60
70
85
)
)
℃
℃
Figure 6.3-7 IAM1 vs. Temperature
Figure 6.3-8 ILP2 vs. Temperature
.
.
ILP3 with temperature at VDD=3V
1.4
1.2
1
0.8
0.6
0.4
0.2
0
-40
-30
-20
-10
0
10
25
TA(
30
40
50
60
70
85
)
℃
Figure 6.3-9 ILP3 vs. Temperature
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DS-HY11P42-V10_EN
Page23
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.4 Port1~5
TA = 25℃,VDD = 3.0V,unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
Input voltage and Schmitt trigger and leakage current and timing
High-Level input voltage
2.1
VIH
V
Low-Level input voltage
0.9
0.8
0.1
180
VIL
V
Vhys
ILKG
RPU
Input Voltage hysteresis(VIH - VIL )
Leakage Current
uA
kΩ
Port pull high resistance
Output voltage and current and frequency
VDD -0.3
High-level output voltage
IOH=10mA
IOL=-10mA
VOH
V
VSS +0.3
Low-level output voltage
VOL
VOH vs IOH @VDD=3V
VOH vs. IOH@VDD=2.2V
2.35
3.00
2.85
2.70
2.55
2.40
2.25
2.10
2.20
2.05
1.90
1.75
1.60
1.45
1.30
1.15
1.00
25
85
℃
25
℃
℃
85
℃
.
0MA
-5MA
-10MA
-15MA
-20MA
-25MA
-30MA
-35MA
0MA
-5MA
-10MA
-15MA
-20MA
-25MA
-30MA
-35MA
IOH
IOH
Figure 6.4-1 VOH vs. IOH @VDD=3.0V
Figure 6.4-2 VOH vs. IOH @VDD=2.2V
VOL vs. IOL@VDD=3.0V
VOL vs. IOL@VDD=2.2V
0.9
0.8
0.6
0.9
0.8
85
℃
0.6
0.5
0.3
0.2
0.0
85
℃
0.5
0.3
0.2
0.0
25
℃
25
℃
0MA
5MA
10MA 15MA 20MA 25MA 30MA 35MA
IOL
0MA
5MA
10MA 15MA 20MA 25MA 30MA 35MA
IOL
Figure 6.4-3 VOL vs. IOL@VDD=3.0V
Figure 6.4-4 VOL vs. IOL@VDD=2.2V
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Page24
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.5 Reset (Brownout, External RST pin, Low Voltage Detect)
TA = 25℃,VDD = 3.0V,unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
us
2
Pulse length needed to accepted reset internally, td-LVR
1.6
1.85
70
2.1
V
BOR
VDD Start Voltage to accepted reset internally (LH),VLVR
Hysteresis, VHYS-LVR
mV
us
2
Pulse length needed as RST/VPP pin to accepted reset internally, td-RST
Input Voltage to accepted reset internally
Hysteresis, VHYS-RST
0.9
V
RST
0.8
10
V
15
uA
Operation current, ILVD
External input voltage to compare reference voltage
1.2
100
3.3
3.2
3.1
3.0
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
V
Compare reference voltage temperature drift
TA = -40℃~ 85 ℃
ppm/℃
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1110b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1101b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1100b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1011b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1010b
.
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1001b
LVD
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=1000b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0111b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0110b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0101b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0100b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0011b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0010b
Detect VDD voltage rang by user option, VSVS VLDx[3:0]=0001b
V
BORĈBrownout Reset
LVRĈLow Voltage Reset of BOR
LVDĈLow Voltage Detect
RSTĈExternal Reset pin
©2010-2013 HYCON Technology Corp.
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Page25
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
.
Figure 6.5-1 BOR Reset diagram
Figure 6.5-2 RST Reset diagram
*1 rRSTĈPlease see BOR Introduce of HY11Pxx series User’s Guide (UG-HY11S14-Vxx).
VLVR and VLVR Release Voltaage vs. TA
1.98
1.96
1.94
LVR Release Voltage
V
1.92
1.90
1.88
1.86
1.84
1.82
1.80
LVR Voltage
V
-40
-35
-15
5
25
45
65
85
℃
℃
℃
℃
℃
℃
℃
℃
.
TA
Figure 6.5-3 LVR vs. Temperature
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Page26
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.6 Power System
TA = 25℃,VDD = 3.0V,unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
uA
IL = 0mA
VDDAX[1:0]=00b
VDDAX[1:0]=00b
VDDAX[1:0]=01b
VDDAX[1:0]=10b
VDDAX[1:0]=11b
VDDAX[1:0]=00b
VDDAX[1:0]=01b
VDDAX[1:0]=10b
VDDAX[1:0]=11b
TA=-40℃~85℃
22
3.3
2.9
2.6
2.4
135
150
165
180
50
VDDA operation current, IVDDA
IL = 0.1mA,
V
VDD≧VDDA+0.2V
V
Select VDDA output voltage
V
V
IL = 10mA
mV
mV
mV
mV
ppm/℃
%/V
uA
VDDA
Dropout voltage
Temperature drift
VDDAX[1:0]=11b
IL = 0.1mA
VDD Voltage drift
VDD=2.5V~3.6V
±0.2
20
IL = 0mA
ACM operation current, IACM
Output voltage ,VACM
Output voltage with Load
Output voltage ,VACM
Output voltage with Load
Temperature drift
*1
ENACM[0]=1,
IL = 0uA
IL = ±200uA
IL = 0uA
1.0
V
0.98
0.98
1.02
1.02
VACM
V
.
*2
ENACM[0]=1,
1.2
ACM
IL = ±200uA
TA=-40℃~85℃
VACM
ppm/℃
uV/V
ENACM[0]=1,
IL = 10uA
50
VDDA Voltage drift
100
VDDAĈAdjust Voltage Regulator
ACMĈAnalog Common Mode Voltage
*1: VACM = 1.0V is just for VDDAX[1:0]=1xb mode. (at A/D differential voltage reference < 1.4V)
*2: VACM = 1.2V is just for VDDAX[1:0]=0xb mode. (at A/D differential voltage reference > 1.4V)
VDDA@2.4V with VDD
VDDA@2.4V with VDD
2.390
2.3900
2.3895
2.3890
2.3885
2.3880
2.3875
2.3870
2.3865
2.3860
2.3855
2.3850
2.3845
2.3840
2.388
2.386
2.384
2.382
2.380
2.378
2.376
2.374
2.372
L
I =10mA
L
I =0.1mA
3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V
VDD(V)
3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V
VDD(V)
Figure 6.6-1 VDDA lL=0.1mA vs. VDD
Figure 6.6-2 VDDA lL=10mA vs. VDD
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Page27
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
VDDA with temperature
VDDA with temperature
2.3910
2.3880
2.3860
2.3840
2.3820
2.3800
2.3780
2.3760
2.3740
2.3720
2.3700
2.3680
2.3660
L
I =10mA
I
L
=0.1mA
2.3900
2.3890
2.3880
2.3870
2.3860
2.3850
2.3840
2.3830
2.3820
2.3810
VDD=3.0V
VDD=2.6V
VDD=3.0V
VDD=2.5V
-40
-35
-15
5
25
45
65
85
-40
-35
-15
5
25
45
65
85
℃
TA(
)
TA(℃)
Figure 6.6-3 VDDA lL=0.1mA vs. Temperature
Figure 6.6-4 VDDA lL=10mA vs. Temperature
ACM Load vs. VDDA
ACM Load vs. VDDA
1.226
1.020
IL=-200uA
IL=-200uA
1.216
IL=0uA
1.010
1.000
0.990
0.980
IL=0uA
IL=200uA
IL=200uA
1.206
1.196
1.186
1.176
2.4
2.6
2.9
3.3
2.4
2.6
2.9
3.3
Internal VDDA(V)
Internal VDDA(V)
Figure 6.6-5 ACM Load vs. VDDA (a)
Figure 6.6-5 ACM Load vs. VDDA (b)
ACM vs. VDD with temperature at VDDA=2.4V
ACM vs. VDD with temperature at VDDA=2.4V
.
1.020
1.010
1.000
0.990
0.980
1.226
VDD=3.6V
VDD=2.5V
VDD=3.6V
VDD=2.5V
1.216
1.206
1.196
1.186
1.176
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
TA(
℃
)
TA( )
℃
Figure 6.6-6 ACM vs. Temperature (a)
Figure 6.6-6 ACM vs. Temperature (b)
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HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.7 SD18, Power Supply and Recommended Operating Conditions
TA = 25℃,VDD = 3.0V, VDDA=2.4V,unless otherwise noted
Sym.
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage at VDDA
ENVDDA[0]=0
2.4
25
3.6
300
VSD18
Modulator sample frequency, ADC_CK
Over Sample Ratio, OSR
ENADC[0]=1
250
KHz
f SD18
256
32768
168
150
120
INBUF[0]=1,VRBUF[0]=0
Operation supply current
without PGA
GAIN =4,
ADC_CK=250KHz
ENADC[0]=1
uA
I SD18
INBUF[0]=0,VRBUF[0]=1
ENADC[0]=1
INBUF[0]=0,VRBUF[0]=0
6.7.1 PGA, Power Supply and Recommended Operating Conditions
TA = 25℃,VDD = 3.0V, VDDA=2.4V,unless otherwise noted
Sym.
VPGA
I PGA
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage at VDDA
Operation supply current
Gain temperature drift
ENVDDA[0]=0
2.4
3.6
.
PGAGN[1:0]=<01>or<1x>
320
5
uA
TA = -40℃~ 85℃
GAIN=128
ppm/℃
GPGA
6.7.2 SD18, Performance II (fSD18=250KHz)
TA = 25℃,VDD = 3.0V, VDDA=2.9V,VVR=1.0V,GAIN=1 without PGA, unless otherwise noted
Sym.
Parameter
Test Conditions
VDDA=2.4V,VVR=1.0V,∆SI=±200mV
VDDA=2.4V,VVR=1.0V,∆SI=±450mV
Min. Typ. Max.
unit
±0.003
±0.01
Integral Nonlinearity(INL)
%FSR
INL
No Missing Codes3
ADC_CK=250KHz,OSR[2:0]=010b
INBUF[0]=0b,VRBUF[0]=0b
23
Bits
Temperature drift
INBUF[0]=1b,VRBUF[0]=0b
INBUF[0]=0b,VRBUF[0]=1b
INBUF[0]=1b,VRBUF[0]=1b
T
A = -40℃~
Gain 1~x16 (INBUF[0]=0b,)
Gain 1~x4 (INBUF[0]=1b,)
2
ppm/℃
GSD18
85℃
Offset error of Full Scale Rang input ∆AI=0V
voltage range with Chopper and
Buffer(INBUF,VRBUF)
∆VR=0.9V
Gain=2
Gain=2
1
1
EOS
DCSET[2:0]=<000>
*∆AI is external
short
%FSR
Offset error of Full Scale Rang input
voltage range with Chopper without
Buffer(INBUF,VRBUF)
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HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
GAIN=1
GAIN=2
GAIN=4
GAIN=16
GAIN=1
GAIN=2
GAIN=4
2
1
Offset temperature drift with
chopper without Buffer
(INBUF,VRBUF).
0.5
0.15
2
uV/℃
Offset temperature drift with chopper and Buffer
(INBUF,VRBUF)
1
0.5
Offset temperature drift with chopper without Buffer
(INBUF,VRBUF).
GAIN=128
0.02
90
VCM=0.7V to 1.7V,
VSI=0V,
GAIN=1
VSI=0V,
VVR=1.0V,without PGA
Common-mode rejection
dB
dB
CMSD18
VCM=0.7V to 1.7V,
VVR=1.0V,
75
GAIN=16
GAIN=1
PGA=off
GAIN=16
VDDA=3.0V,∆VDDA=±100m
V,VVR=1.0V,
PSRR
DC power supply rejection
SD18 Offset Drfit vs. Temperature
75
VSI=1.2V,VSI-=1.2V,
SD18 Offset Drfit vs. Temperature
5
0
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
-4.5
-5.0
.
-5
-10
-15
-20
-25
-40
-20
0
20
40
60
80
℃
℃
℃
℃
℃
℃
℃
-40
-20
0
20
40
60
80
℃
℃
℃
℃
℃
℃
℃
TA
TA
Gain=1, SI and VR buffer off
VIN short to ACM
ꢀVR=1.2V, VDDA=2.4V
Gain=16, SI and VR buffer off
VIN short to ACM
ꢀVR=1.2V, VDDA=2.4V
Figure 6.7-1(a) SD18 Offset Temperature Drift
Figure 6.7-1(b) SD18 Offset Temperature Drift
SD18 Gain Drfit vs. Temperature
SD18 Offset Drfit vs. Temperature
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
-0.03%
1
0.5
0
-0.5
-1
-1.5
-2
-40
℃
-20
0
℃
20
40
60
80
-40
-20
0
20
40
60
80
℃
℃
℃
℃
℃
℃
℃
℃
℃
℃
℃
℃
Gain=128, SI and VR buffer off
VIN short to ACM
ꢀVR=1.2V, VDDA=2.4V
TA
TA
Gain=1, SI and VR buffer off
ꢀSI=300mV, ꢀVR=0.9V
VDDA=2.4V
Figure 6.7-1(c) SD18 Offset Temperature Drift
Figure 6.7-2(a) SD18 Gain Drift with Temperature
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HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
SD18 Gain Drfit vs. Temperature
SD18 Gain Drfit vs. Temperature
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
-0.03%
0.03%
0.02%
0.01%
0.00%
-0.01%
-0.02%
-0.03%
-40
-20
0
20
TA
40
60
80
℃
℃
℃
℃
℃
℃
℃
-40
-20
0
20
TA
40
60
80
℃
℃
℃
℃
℃
℃
℃
Gain=128, SI and VR buffer off
ꢀSI=4.6875mV, ꢀVR=0.9V
VDDA=2.4V
Gain=16, SI and VR buffer off
ꢀSI=37.5mV, ꢀVR=0.9V
VDDA=2.4V
Figure 6.7-2(b) SD18 Gain Drift with Temperature
Figure 6.7-2(c) SD18 Gain Drift with Temperature
.
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HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.7.3 SD18, Temperature Sensor
TA = 25℃,VDD = 3.0V, VDDA=2.4V,unless otherwise noted
Sym.
TCS
Parameter
Test Conditions
Min. Typ. Max.
unit
uV/℃
℃
Sensor temperature drift
178
-289
±2
Absolute Temperature Scale 0°K
One point calibrate error temperature
INBUF[0]=1
KT
Calibration at 25℃of -40℃~85℃
℃
TCERR
TPS Voltage vs. Temperature
70
60
50
40
30
20
10
0
-45
-30
-15
0
15
30
45
60
75
90
TA(℃)
Figure 6.7-3 TPS Output Voltage vs. Temperature Drift
.
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HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
!
6.7.4 SD18 Noise Performance
TA = 25℃,VDD = 3.0V, VDDA=2.4V,unless otherwise noted
HY11P42 provides important input noise specification that aims at SD18. Table6.7-4(a)
and Table6.7-4(b) lists out the relations of typical noise specification, Gain, Output rate, and
maximum input voltage of single end. Test condition configuration and external input signal
short, voltage reference: 1.2V and 1024 records were sampled.
ENOB(RMS) with OSR/GAIN at A/D Clock=250Khz, VDDA=2.4V, VREF=1.2V
OSR
256
512
1024
2048
4096
8192 16384 32768
Max. Vin(mV)
=0.9*VREF (1)
Output rate(HZ)
977
488
244
122
61
31
15
8
Gain
0.25
0.5
1
=
=
=
=
=
=
=
=
=
=
=
PGA × ADGN
±2400
±2160
±1080
±540
±270
±135
±68
1
1
1
1
1
1
1
2
4
8
×
×
×
×
×
×
×
×
×
×
0.25
0.5
1
16.3
16.3
16.2
16.1
16.0
15.9
15.6
14.8
14.5
14.0
17.4
17.3
17.2
17.1
16.9
16.6
16.3
15.3
15.0
14.6
17.9
17.9
17.8
17.6
17.5
17.2
16.8
15.9
15.5
15.1
18.5
18.4
18.3
18.2
18.0
17.7
17.3
16.4
16.0
15.6
19.0
18.9
18.8
18.7
18.5
18.2
17.7
16.9
16.5
16.0
19.5
19.4
19.3
19.2
18.9
18.7
18.3
17.4
17.0
16.6
20.0
19.8
19.7
19.6
19.4
19.2
18.8
17.8
17.5
17.0
20.4
20.2
20.1
20.0
19.8
19.6
19.3
18.3
18.0
17.5
2
2
4
4
8
8
16
32
64
128
16
16
16
16
±34
±17
±8
.
(1) Max.Vin (mV) is the max. input voltage of single end to ground (VSS).
Table6.7-4(a) SD18 ENOB Table
RMS Noise(uV) with OSR/GAIN at A/D Clock=250Khz, VDDA=2.4V, VREF=1.2V
OSR
256
512
1024
2048
4096
8192 16384 32768
Max. Vin(mV)
=0.9*VREF
Output rate(HZ)
977
488
244
122
61
31
15
8
Gain
0.25
0.5
1
=
=
=
=
=
=
=
=
=
=
=
PGA × ADGN
±2400
±2160
±1080
±540
±270
±135
±68
1
1
1
1
1
1
1
2
4
8
×
×
×
×
×
×
×
×
×
×
0.25 121.08 57.40 38.74 26.66 18.39 13.21
9.49
5.12
2.80
1.48
0.87
0.51
0.33
0.32
0.20
0.14
6.98
3.91
2.13
1.12
0.65
0.39
0.24
0.23
0.14
0.10
0.5
1
61.63 29.23 19.21 13.51
9.78
5.19
2.86
1.67
1.01
0.70
0.62
0.41
0.28
7.02
3.77
2.06
1.19
0.73
0.46
0.45
0.29
0.19
32.21 15.70 10.25
7.31
4.06
2.37
1.44
0.92
0.89
0.56
0.38
2
2
16.59
9.00
5.04
3.03
2.61
1.66
1.13
8.54
4.84
2.97
1.84
1.81
1.13
0.77
5.91
3.33
2.02
1.29
1.27
0.80
0.55
4
4
8
8
16
32
64
128
16
16
16
16
±34
±17
±8
Table6.7-4(b) SD18 RMS Noise Table
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HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
The RMS noise is referred to the input. The Effective Number of Bits (ENOB(RMS Bit))
is defined as:
FSR
ln
RMSNoise
ENOB(RMS)
ln(2)
2 VREF 1024ADO
k
- Average
2
k1
RMSNoise
223
Where FSR (Full-Scale Range) 2 VREF/Gain.
1024ADO
k
k1
Average
1024
!
RMS Noise Diagram
RMS Noise Diagram
5
4
500
450
400
350
300
250
200
150
100
50
Gain=1
Output rate ~ 10sps
Gain=1
Output rate ~ 10sps
3
2
1
0
.
-1
-2
-3
-4
-5
0
-5
-4
-3
-2
-1
0
1
2
3
4
5
1
201
401
601
801
1001
Output Code (LSB)
Time (reading number)
LSB base on 22-bit output
LSB base on 22-bit output
Figure 6.7-4(a) RMS Noise Diagram
Figure 6.7-4(b) Output Code Diagram
RMS Noise Diagram
RMS Noise Diagram
5
4
350
300
250
200
150
100
50
Gain=128
Output rate ~ 10sps
Gain=128
Output rate ~ 10sps
3
2
1
0
-1
-2
-3
-4
-5
0
-5
-4
-3
-2
-1
0
1
2
3
4
5
1
201
401
601
801
1001
Output Code (LSB)
Time (reading number)
LSB base on 19-bit output
LSB base on 19-bit output
Figure 6.7-4(c) RMS Noise Diagram
Figure 6.7-4(d) Output Code Diagram
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HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
6.8 Built-in EPROM (BIE)
TA = 25℃,VDD = 3.0V, unless otherwise noted
Sym.
VBIE
I BIE
Parameter
Test Conditions
Min. Typ. Max.
unit
V
Supply Voltage
6.0
5
6.5
Operation supply current
Supply Voltage
mA
V
0
VSS
.
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HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
7. Ordering Information
Shipment
Packing
Type
Package
Type
Package
Drawing
Unit
Material
Device No.1
Pins
Code2
MSL3
Q’ty Composition
4
HY11P42-D000
HY11P42-E028
HY11P42-E028
HY11P42-N024
HY11P42-T028
HY11P42-T028
Die
-
D
E
E
N
T
T
000
028
028
024
028
028
000
000
000
000
000
000
-
200
48
-
Green
Green
Green
Green
Green
Green
4
4
4
4
4
SSOP
SSOP
QFN
28
28
24
28
28
Tube
MSL-3
MSL-3
MSL-3
MSL-3
MSL-3
Tape & Reel
Tray
2000
490
50
TSSOP
TSSOP
Tube
Tape & Reel
3000
1 Device No.: Model No. – Package Type Description – Code (Blank Code/ Standard/
Customized Programming Code)
Ex: Your customized programming code is 008 and you require die shipment.
The device No. will be HY11P42-D000-008
Ex: You request blank code in die package.
The device No. will be HY11P42-D000
Ex: You request blank code in SSOP28 package.
.
The device No. will be HY11P42-E028
And please clearly indicate the shipment packing type when placing orders.
Ex: Your customized programming code is 009 and you require products in TSSOP28
package.
The device No. will be HY11P42-T028-009.
And please clearly indicate the shipment packing type when placing orders.
2 Code:
“001”~ “999” is standard or customized programming code. Blank code does not have
these numbers.
3 MSL:
The Moisture Sensitivity Level ranking conforms to IPC/JEDEC J-STD-020 industry
standard categorization. The products are processed, packed, transported and used
with reference to IPC/JEDEC J-STD-033.
4 Green (RoHS & no Cl/Br):
HYCON products are Green products that compliant with RoHS directive and are
Halogen free (Br/Cl<0.1%)
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page36
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8. Package Information
8.1 SSOP28 (E028)
8.1.1 Package Dimensions
.
JEDEC MO-150 AH compliant
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page37
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8.1.2 Tube Dimensions
.
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page38
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8.2 QFN24(N024)
8.2.1 Package Dimensions
.
JEDEC MO-220 compliant
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page39
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8.3 TSSOP28(T028)
8.3.1 Package Dimensions
.
JEDEC MO-153 compliant
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page40
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
8.3.2 Tube Dimensions
.
!
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page41
HY11P42
Embedded 18-Bit Σ∆ADC
8-Bit RISC-like Mixed Signal Microcontroller
9. Revision Record
Major differences are stated thereinafter:
Version
V03
Page
All
Revision Summary
First Edition
V07
6
Add in 2.2 TSSOP28 Pin Diagram
2.4 SSOP28 Pin out I/O Description order revision
Chapter 3 Application Circuit revision
4.1 Internal Block Diagram & 4.2 Related Description and Supporting Documents
revision
8~9
10~11
13
14
15
4.3 SD18 Network revision
32
Chapter 5 Register List revision
Chapter 7 Ordering Information revision
Add in 8.3 TSSOP28(T028)
35
V08
V10
5~9,14~17,19 Delete the related description and figures of Serial Communication SPI module.
10~11
12~13
21
Add in 2.5 TSSOP28 Pin out I/O Description
Add in 2.6 QFN24 Pin out I/O Description
Update Internal RC Oscillator frequency spec
.
©2010-2013 HYCON Technology Corp.
www.hycontek.com
DS-HY11P42-V10_EN
Page42
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