GM71CS18163CLJ-5 [HYNIX]
x16 EDO Page Mode DRAM ; X16 EDO页模式DRAM\n型号: | GM71CS18163CLJ-5 |
厂家: | HYNIX SEMICONDUCTOR |
描述: | x16 EDO Page Mode DRAM
|
文件: | 总11页 (文件大小:114K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
GM71C18163C
GM71CS18163CL
1,048,576 WORDS x 16 BIT
CMOS DYNAMIC RAM
Description
Features
The GM71C(S)18163C/CL is the new
generation dynamic RAM organized 1,048,576
x 16 bit. GM71C(S)18163C/CL has realized
higher density, higher performance and various
functions by utilizing advanced CMOS process
technology. The GM71C(S)18163C/CL offers
Extended Data out(EDO) Mode as a high speed
access mode. Multiplexed address inputs permit
the GM71C(S)18163C/CL to be packaged in
standard 400 mil 42pin plastic SOJ, and standard
400mil 44(50)pin plastic TSOP II. The package
size provides high system bit densities and is
compatible with widely available automated
testing and insertion equipment.
* 1,048,576 Words x 16 Bit Organization
* Extended Data Out Mode Capability
* Single Power Supply (5V+/-10%)
* Fast Access Time & Cycle Time
(Unit: ns)
tRAC
tCAC
tRC
tHPC
50
60
70
13
15 104
18 124
84
20
25
30
GM71C(S)18163C/CL-5
GM71C(S)18163C/CL-6
GM71C(S)18163C/CL-7
* Low Power
Active : 1045/935/825mW (MAX)
Standby : 11mW (CMOS level : MAX)
0.83mW (L-version : MAX)
* RAS Only Refresh, CAS before RAS Refresh,
Hidden Refresh Capability
* All inputs and outputs TTL Compatible
* 1024 Refresh Cycles/16ms
* 1024 Refresh Cycles/128ms (L-version)
* Self Refresh Operation (L-version)
* Battery Back Up Operation (L-version)
* 2 CAS byte Control
Pin Configuration
42 SOJ
44(50) TSOP II
1
VSS
50
VCC
1
42
41
VSS
VCC
I/O0
I/O1
I/O2
I/O3
VCC
49
2
3
4
5
6
7
8
9
I/O0
I/O1
I/O2
I/O3
VCC
I/O4
I/O5
I/O6
I/O7
NC
I/O15
I/O14
I/O13
2
3
4
5
6
I/O15
48
47
40 I/O14
39 I/O13
46 I/O12
45 VSS
38
I/O12
37
VSS
44
I/O11
7
36
I/O11
I/O4
I/O5
I/O6
I/O7
NC
43 I/O10
42 I/O9
41 I/O8
8
35
I/O10
10
11
9
34
33
32
31
30
29
28
I/O9
I/O8
NC
40
NC
10
11
12
13
14
15
LCAS
UCAS
OE
NC
WE
RAS
NC
NC
NC
36 NC
15
16
35
LCAS
34
17
18
WE
UCAS
33
RAS
A9
OE
32
A9
A8
A7
A6
19
A11
A10
A0
A1
A2
16
17
18
19
20
21
27
A8
NC
31
20
21
22
23
26 A7
A0
30
25
A6
A1
A2
29
24
A5
28 A5
27 A4
23 A4
A3
24
25
A3
VCC
26
22
VSS
VCC
VSS
(Top View)
Rev 0.1 / Apr’01
GM71C18163C
GM71CS18163CL
Pin Description
Pin
A0-A9
Function
Pin
WE
OE
Function
Read/Write Enable
Output Enable
Power (+5V)
Address Inputs
A0-A9
Refresh Address Inputs
Data Input/Data Output
Row Address Strobe
I/O0-I/O15
RAS
V
CC
V
SS
Ground
UCAS, LCAS
Column Address Strobe
NC
No Connection
Ordering Information
Type No.
Access Time
Package
GM71C(S)18163CJ/CLJ -5
GM71C(S)18163CJ/CLJ -6
GM71C(S)18163CJ/CLJ -7
50ns
60ns
70ns
400 Mil
42 Pin
Plastic SOJ
GM71C(S)18163CT/CLT -5
GM71C(S)18163CT/CLT -6
GM71C(S)18163CT/CLT -7
50ns
60ns
70ns
400 Mil
44(50) Pin
Plastic TSOP II
Absolute Maximum Ratings*
Symbol
TA
Parameter
Rating
0 ~ +70
Unit
C
Ambient Temperature under Bias
TSTG
VIN/OUT
VCC
Storage Temperature
-55 ~ +125
-1.0 ~ +7.0V
C
Voltage on any Pin Relative to VSS
Supply voltage Relative to VSS
Short Circuit Output Current
V
V
-1.0 ~ +7.0V
IOUT
50
mA
W
PD
1.0
Power Dissipation
Note: Operation at or above Absolute Maximum Ratings can adversely affect device reliability.
Rev 0.1 / Apr’01
GM71C18163C
GM71CS18163CL
Recommended DC Operating Conditions (TA = 0 ~ +70C)
Symbol
VCC
Parameter
Min
4.5
Typ
Max
5.5
Unit
V
Supply Voltage
5.0
VIH
Input High Voltage
Input Low Voltage
2.4
-
-
6.0
V
VIL
-1.0
0.8
V
Note: All voltage referred to Vss.
The supply voltage with all VCC pins must be on the same level. The supply voltage with all VSS pins must be
on the same level.
Truth Table
Output
Open
Operation
RAS
H
LCAS UCAS
WE
D
OE
D
Notes
D
L
H
L
L
H
L
D
H
L
L
H
L
L
H
L
L
H
1,3
Standby
L
H
L
Valid
Lower byte
L
1,3
L
H
Valid
Read cycle
Upper byte
L
Valid
H
L
L
L
L
L
L
L
Word
D
L
Open
Lower byte
L
Open
Early write cycle
D
D
H
H
H
Upper byte
1,2,3
1,2,3
1,3
L
Open
Word
L
Undefined
Undefined
L
Lower byte
Upper byte
Delayed Write
cycle
H
L
L
L
Undefined
Valid
Word
Lower byte
L
L
L
H to L L to H
H to L L to H
H to L L to H
Read-modify
-write cycle
H
L
L
Upper byte
Valid
L
H
L
L
L
Valid
Open
Word
Word
D
D
D
D
D
D
H to L
H to L
H to L
L
CBR Refresh
or
Self Refresh
(L-series)
H
Open
Open
Word
Word
1,3
L
RAS-only
Refresh cycle
Open
Open
Word
H
L
H
D
H
D
H
L
L
1,3
1,3
Read cycle
(Output disabled)
L
Notes: 1. H: High (inactive) L: Low(active) D: H or L
2. tWCS >= 0ns Early write cycle
tWCS <= 0ns Delayed write cycle
3. Mode is determined by the OR function of the UCAS and LCAS. (Mode is set by earliest of
UCAS and LCAS active edge and reset by the latest of UCAS and LCAS inactive edge.) However
write OPERATION and output High-Z control are done independently by each UCAS,LCAS.
ex) if RAS = H to L, UCAS = H, LCAS = L, then CAS-before-RAS refresh cycle is selected.
Rev 0.1 / Apr’01
GM71C18163C
GM71CS18163CL
DC Electrical Characteristics (VCC = 5V+/-10%, Vss = 0V, TA = 0 ~ 70C)
Symbol
Parameter
Min Max Unit Note
V
OH
Output Level
Output "H" Level Voltage (IOUT = -2mA)
2.4
0
V
CC
V
V
Output Level
Output "L" Level Voltage (IOUT = 2mA)
V
OL
0.4
Operating Current
Average Power Supply Operating Current
(RAS, UCAS or LCAS Cycling: tRC = tRC min)
I
CC1
50ns
60ns
70ns
-
-
190
170
mA
mA
mA
1, 2
-
150
I
I
CC2
CC3
Standby Current (TTL)
Power Supply Standby Current
(RAS, UCAS, LCAS = VIH, DOUT = High-Z)
-
2
50ns
-
-
190
170
150
185
RAS Only Refresh Current
Average Power Supply Current
RAS Only Refresh Mode
(tRC = tRC min)
60ns
70ns
50ns
2
-
-
I
CC4
-
EDO Page Mode Current
Average Power Supply Current
EDO Page Mode
mA
1, 3
-
-
60ns
70ns
165
145
(tHPC = tHPC min)
-
-
Standby Current (CMOS)
Power Supply Standby Current
(RAS, UCAS or LCAS >=VCC - 0.2V, DOUT = High-Z)
I
I
CC5
CC6
1
mA
uA
150
5
50ns
60ns
70ns
-
-
190
170
CAS-before-RAS Refresh Current
(tRC = tRC min)
mA
150
500
-
-
Battery Back Up Operating Current(Standby with CBR Ref.)
(CBR refresh, tRC=125us, tRAS<=0.3us,
I
I
CC7
CC8
uA
4,5
1
D
OUT=High-Z, CMOS interface)
Standby Current RAS = VIH
UCAS, LCAS = VIL
-
mA
5
D
OUT = Enable
Self-Refresh Mode Current
(RAS, UCAS or LCAS <=0.2V, DOUT=High-Z, CMOS interface)
I
CC9
-
300
10
uA
uA
uA
5
I
L(I)
Input Leakage Current
Any Input (0V<=VIN<= 6V)
-10
-10
Output Leakage Current
(DOUT is Disabled, 0V<=VOUT<= 6V)
I
L(O)
10
Note: 1. ICC depends on output load condition when the device is selected.
CC(max) is specified at the output open condition.
2. Address can be changed once or less while RAS = VIL
I
.
3. Address can be changed once or less while UCAS and LCAS = VIH
4. CAS = L (<=0.2V) while RAS = L (<=0.2V).
5. L-version.
.
Rev 0.1 / Apr’01
GM71C18163C
GM71CS18163CL
Capacitance (VCC = 5V+/ - 10%, TA = 25C)
Symbol
CI1
Parameter
Input Capacitance (Address)
Input Capacitance (Clocks)
Output Capacitance (Data-In/Out)
Min
Max
Unit
pF
Note
1
-
-
-
5
7
7
pF
1
CI2
pF
1, 2
CI/O
Note: 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.
2. LCAS and UCAS = VIH to disable DOUT
.
AC Characteristics (VCC = 5V+/-10%, TA = 0 ~ +70C, Note 1, 2, 18, 19, 20)
Test Conditions
Input rise and fall times : 2 ns
Input levels : VIL = 0V, VIH = 3V
Input timing reference levels : 0.8V, 2.4V
Output timing reference levels : 0.8V, 2.0V
Output load : 1TTL gate + CL (100 pF)
(Including scope and jig)
Read, Write, Read-Modify-Write and Refresh Cycles (Common Parameters)
GM71C(S)18163 GM71C(S)18163 GM71C(S)18163
C/CL-5
C/CL-6
C/CL-7
Unit Note
Symbol
Parameter
Min Max Min Max Min Max
Random Read or Write Cycle Time
RAS Precharge Time
84
30
-
-
104
40
-
-
124
50
-
-
ns
ns
t
RC
tRP
t
CP
CAS Precharge Time
7
-
10
60
-
13
70
-
ns
ns
ns
ns
ns
RAS Pulse Width
50 10,000
7 10,000
10,000
10,000
t
RAS
CAS
ASR
RAH
ASC
CAH
RCD
RAD
RSH
CSH
CRP
ODD
DZO
DZC
CAS Pulse Width
10 10,000 13 10,000
t
Row Address Set up Time
Row Address Hold Time
Column Address Set-up Time
0
7
0
7
-
-
-
-
0
10
0
-
-
-
-
0
10
0
-
-
-
-
t
t
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
21
t
Column Address Hold Time
RAS to CAS Delay Time
RAS to Column Address Delay Time
RAS Hold Time
10
13
21
3
t
t
11 37
14 45
12 30
14 52
12 35
9
10
35
5
25
-
4
t
t
13
40
5
-
-
13
45
5
-
-
t
CAS Hold Time
-
23
22
CAS to RAS Precharge Time
OE to DIN Delay Time
-
-
-
t
13
0
-
15
0
-
18
0
-
5
6
6
7
t
t
OE Delay Time from DIN
CAS Delay Time from DIN
Transition Time (Rise and Fall)
-
-
-
t
0
-
0
-
0
-
2
50
2
50
2
50
tT
Rev 0.1 / Apr’01
GM71C18163C
GM71CS18163CL
Read Cycle
GM71C(S)18163 GM71C(S)18163 GM71C(S)18163
C/CL-5 C/CL-6 C/CL-7
Unit
Note
Symbol
Parameter
Min Max Min Max Min Max
Access Time from RAS
-
-
-
-
50
13
25
13
-
-
-
-
-
60
15
30
15
-
-
-
-
-
70
18
35
18
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
8,9
9,10,17
9,11,17
9
t
RAC
CAC
AA
OAC
RCS
RCH
Access Time from CAS
t
Access Time from Address
Access Time from OE
t
t
Read Command Setup Time
Read Command Hold Time to CAS
0
0
21
t
0
0
-
0
-
0
-
12,22
t
-
-
-
-
-
Read Command Hold Time to RAS
Column Address to RAS Lead Time
5
5
5
12
t
RRH
RAL
CAL
CLZ
OH
OHO
OFF
OEZ
CDD
RCHR
25
-
30
35
t
-
Column Address to CAS Lead Time
CAS to Output in Low-Z
15
0
18
0
-
-
23
0
-
-
-
-
t
-
t
3
-
27
Output Data Hold Time
3
-
3
t
3
-
Output Data Hold Time from OE
Output Buffer Turn-off Time
Output Buffer Turn-off Time to OE
CAS to DIN Delay Time
3
-
3
t
-
-
13
13
-
15
15
-
-
15
15
-
13,27
13
t
-
-
-
t
13
50
3
15
60
18
5
t
t
-
-
-
-
70
3
Read Command Hold Time from RAS
Output Data hold Time from RAS
Output Buffer turn off to RAS
Output Buffer turn off to WE
-
-
27
27
3
-
t
OHR
-
-
-
15
13
15
t
OFR
-
t
WEZ
-
ns
ns
13
-
15
-
15
-
t
WDD
13
15
18
WE to DIN Delay Time
RAS to DIN Delay Time
-
t
RDD
13
15
-
-
ns
18
Rev 0.1 / Apr’01
GM71C18163C
GM71CS18163CL
Write Cycle
GM71C(S)18163 GM71C(S)18163 GM71C(S)18163
C/CL-5 C/CL-6 C/CL-7
Unit Note
Symbol
Parameter
Min Max Min Max Min Max
Write Command Setup Time
Write Command Hold Time
Write Command Pulse Width
Write Command to RAS Lead Time
Write Command to CAS Lead Time
Data-in Setup Time
14,21
21
0
7
7
7
7
0
7
-
-
-
-
-
-
-
0
10
10
10
10
0
-
-
-
-
-
-
-
0
13
10
13
13
0
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
ns
t
WCS
tWCH
t
t
WP
RWL
CWL
23
t
15,23
15,23
tDS
Data-in Hold Time
10
13
tDH
Read- Modify-Write Cycle
GM71C(S)18163 GM71C(S)18163 GM71C(S)18163
C/CL-5 C/CL-6 C/CL-7
Unit
Note
Symbol
Parameter
Min Max Min Max Min Max
t
RWC
RWD
CWD
AWD
OEH
Read-Modify-Write Cycle Time
RAS to WE Delay Time
111
67
-
-
-
-
-
136
79
-
-
-
-
-
161
92
-
-
-
-
-
ns
ns
ns
ns
ns
t
14
14
14
t
CAS to WE Delay Time
30
34
40
t
Column Address to WE Delay Time
OE Hold Time from WE
42
49
57
t
13
15
18
Refresh Cycle
GM71C(S)18163 GM71C(S)18163 GM71C(S)18163
C/CL-5 C/CL-6 C/CL-7
Unit Note
Symbol
Parameter
Min Max Min Max Min Max
tCSR
CAS Setup Time
(CAS-before-RAS Refresh Cycle)
21
5
-
5
-
5
-
ns
t
CHR
CAS Hold Time
(CAS-before-RAS Refresh Cycle)
22
21
7
5
-
-
10
5
-
-
10
5
-
-
ns
ns
RAS Precharge to CAS Hold Time
tRPC
Rev 0.1 / Apr’01
GM71C18163C
GM71CS18163CL
EDO Page Mode Cycle
GM71C(S)18163 GM71C(S)18163 GM71C(S)18163
C/CL-5 C/CL-6 C/CL-7
Unit
Note
Symbol
Parameter
Min Max Min Max Min Max
t
HPC
EDO Page Mode Cycle Time
20
-
-
25
-
-
30
-
-
ns
ns
ns
ns
ns
25
16
100,000
100,000
100,000
EDO Page Mode RAS Pulse Width
Access Time from CAS Precharge
RAS Hold Time from CAS Precharge
tRASP
-
30
-
-
35
-
-
40
-
9,17,22
tACP
30
35
40
tRHCP
9
tDOH
Output data Hold Time from CAS low
3
7
-
-
3
-
-
3
10
13
ns
ns
ns
CAS Hold Time referred OE
CAS to OE Setup Time
t
COL
-
-
-
-
t
COP
5
5
5
Read command Hold Time
from CAS Precharge
30
35
t
RCHP
40
EDO Page Mode Read-Modify-Write Cycle
GM71C(S)18163 GM71C(S)18163 GM71C(S)18163
C/CL-5 C/CL-6 C/CL-7
Unit Note
Symbol
Parameter
Min Max Min Max Min Max
t
HPRWC
EDO Page Mode Read-Modify-Write
Cycle Time
57
45
-
-
68
54
-
-
79
62
-
-
ns
ns
14,22
tCPW
WE Delay Time from CAS Precharge
Refresh
GM71C(S)18163 GM71C(S)18163 GM71C(S)18163
C/CL-5 C/CL-6 C/CL-7
Unit
Note
Symbol
Parameter
Min Max Min Max Min Max
1024
cycles
-
-
-
-
t
REF
Refresh period
16
16
16
ms
ms
1024
cycles
t
REF
Refresh period (L -Series)
-
128
-
128
128
Rev 0.1 / Apr’01
GM71C18163C
GM71CS18163CL
Self Refresh Mode ( L-version )
GM71CS18163
CL-5
GM71CS18163
CL-6
GM71CS18163
CL-7
Symbol
Parameter
Unit Note
Min Max Min Max Min Max
29
t
RASS
-
-
-
-
-
-
-
-
-
us
ns
RAS Pulse Width(Self-Refresh)
100
90
100
110
-50
100
130
-50
tRPS
RAS Precharge Time(Self-Refresh)
CAS Hold Time(Self-Refresh)
-50
tCHS
ns
Notes :
1. AC measurements assume tT = 2 ns.
2. An initial pause of 200us is required after power followed by a minimum of eight initializa-
tion cycles (any combination of cycles containing RAS-only refresh or CAS-before-RAS
refresh).
3. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is
specified as a reference point only; if tRCD is greater than the specified tRCD (max) limit, then
access time is controlled exclusively by tCAC.
4. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is
specified as a reference point only; if tRAD is greater than the specified tRAD (max) limit, then
access time is controlled exclusively by tAA.
5. Either tODD or tCDD must be satisfied.
6. Either tDZO or tDZC must be satisfied.
7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also,
transition times are measured between VIH (min) and VIL (max).
8. Assumes that tRCD <= tRCD (max) and tRAD <= tRAD (max). If tRCD or tRAD is greater than the
maximum recommended value shown in this table, tRAC exceeds the value shown.
9. Measured with a load circuit equivalent to 1TTL loads and 100pF.
10. Assumes that tRCD >= tRCD (max) and tRAD <= tRAD (max).
11. Assumes that tRCD <= tRCD (max) and tRAD >= tRAD (max).
12. Either tRCH or tRRH must be satisfied for a read cycles.
13. tOFF (max) and tOEZ (max) define the time at which the outputs achieve the open circuit condi-
tion and are not referred to output voltage levels.
14. tWCS, tRWD, tCWD, tAWD and tCPW are not restrictive operating parameters. They are included in
the data sheet as electrical characteristics only; if tWCS >= tWCS (min), the cycle is an early
write cycle and the data out pin will remain open circuit(high impedance) throughout the
entire cycle; if tRWD>=tRWD(min), tCWD>=tCWD(min), and tAWD>=tAWD(min), or tCWD>=tCWD(min)
tAWD >= tAWD (min) and tCPW >= tCPW (min), the cycle is a read-modify-write and the data out-
put will contain data read from the selected cell; if neither of the above sets of conditions is
satisfied, the condition of the data out (at access time) is indeterminate.
Rev 0.1 / Apr’01
GM71C18163C
GM71CS18163CL
15. These parameters are referred to UCAS and LCAS leading edge in early write cycles and to
WE leading edge in delayed write or read-modify-write cycles.
16. tRASP defines RAS pulse width in EDO mode cycles.
17. Access time is determined by the longer of tAA or tCAC or tACP.
18. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying
data to the device. After RAS is reset, if tOEH>=tCWL, the I/O pin will remain open circuit (high
impedance): if tOEH<=tCWL, invalid data will be out at each I/O.
19. When both LCAS and UCAS go low at the same time, all 16-bits data are written into the
device. LCAS and UCAS cannot be staggered within the same write/read cycles.
20. All the Vcc and Vss pins shall be supplied with the same voltages.
21. tASC, tCAH, tRCS, tWCS, tWCH, tCSR and tRPC are determined by the earlier falling edge of UCAS
or LCAS.
22. tCRP, tCHR, tRCH, tACP and tCPW are determined by the later rising edge of UCAS or LCAS.
23. tCWL, tDH, tDS and tCHS should be satisfied by both UCAS and LCAS.
24. tCP is determined by the time that both UCAS and LCAS are high.
25. tHPC(min) can be achieved during a series of EDO page made write cycles or EDO mode
write cycles. It both write and read operation are mixed in a EDO mode RAS cycle(EDO
mode mix cycle (1),(2)) minimum Value of CAS cycle (tCAS+tCP+2tT) becomes greater than
the specified tHPC (min) value. The value of CAS cycle time of mixed EDO mode is shown
in EDO mode mix cycle (1) and (2).
26. When output buffers are enabled once, sustain the low impedance state until valid data
is obtained. When output buffer is turned on and off within a very short time , generally
it causes large Vcc/Vss line noise, which causes to degrade VIH min/VIL max level.
27. Data output turns off and becomes high impedance from later rising edge of RAS and CAS.
Hold time and turn off time are specified by the timing specification of later rising edge of
RAS and CAS between tOHR and tOH, and between tOFR and tOFF.
28. EDO Hi-Z control by OE or WE. OE rising edge disables data outputs. When OE goes high
during CAS high, the data will not come out until next CAS access. When WE goes low
during CAS high, the data will not come out until next CAS access.
29.
Please do not use tRASS timing, 10us<=tRASS<=100us. During this period, the device is in
transition state from normal operation mode to self refresh mode. If tRASS>=100us, then
RAS
precharge time should use tRPS instead of tRP.
H or L ( H : VIH(min) <= VIN <= VIH(max), L : VIL(min) <= VIN <= VIL(max) )
30.
Rev 0.1 / Apr’01
GM71C18163C
GM71CS18163CL
Unit: Inches (mm)
Package Dimension
42 SOJ
0.025(0.64)
MIN
0.093(2.38)
MIN
1.058(26.89) MAX
1.072(27.23) MAX
0.128(3.25) MIN
0.148(3.75) MAX
0.050(1.27)
TYP
0.026(0.66) MIN
0.032(0.81) MAX
0.015(0.38) MIN
0.020(0.50) MAX
44(50) TSOP-II
0.016(0.40) MIN
0.024(0.60) MAX
0 ~ 5¡ £
0.004(0.12) MIN
0.008(0.21) MAX
0.820(20.82) MIN
0.830(21.08) MAX
0.037(0.95) MIN
0.041(1.05) MAX
0.047(1.20)
MAX
0.012(0.30) MIN
0.017(0.45) MAX
0.031(0.80)
TYP
0.002(0.05) MIN
0.006(0.15) MAX
Rev 0.1 / Apr’01
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