HY5PS1G1631CFR-Y5 [HYNIX]
DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA84, ROHS COMPLIANT, FBGA-84;
| 型号： | HY5PS1G1631CFR-Y5 |
| 厂家： | 
HYNIX SEMICONDUCTOR |
| 描述： | DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA84, ROHS COMPLIANT, FBGA-84 时钟 动态存储器 双倍数据速率 内存集成电路 |
| 文件： | 总45页 (文件大小：565K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
1Gb DDR2 SDRAM
HY5PS1G431C(L)FP
HY5PS1G831C(L)FP
HY5PS1G1631C(L)FP
HY5PS1G431CFR
HY5PS1G831CFR
HY5PS1G1631CFR
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 0.7 / Nov. 2008
1
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
Revision Details
Rev.
History
Draft Date
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Nov. 2006
Initial data sheet released
IDD Values added
Dec. 2006
Mar. 2007
May. 2007
Jun. 2007
Jul. 2008
Nov. 2008
Inserted Pin Description & Corrected typos
Adjusted IDD values & Corrected typos
Adjusted IDD values
Updated IDD values and Halogen-free added
Editorial change on TOPER
Rev. 0.7 / Nov. 2008
2
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
Contents
1. Description
1.1 Device Features and Ordering Information
1.1.1 Key Features
1.1.2 Ordering Information
1.1.3 Operating Frequency
1.2 Pin configuration
1.3 Pin Description
2. Maximum DC ratings
2.1 Absolute Maximum DC Ratings
2.2 Operating Temperature Condition
3. AC & DC Operating Conditions
3.1 DC Operating Conditions
3.1.1 Recommended DC Operating Conditions(SSTL_1.8)
3.1.2 ODT DC Electrical Characteristics
3.2 DC & AC Logic Input Levels
3.2.1 Input DC Logic Level
3.2.2 Input AC Logic Level
3.2.3 AC Input Test Conditions
3.2.4 Differential Input AC Logic Level
3.2.5 Differential AC Output Parameters
3.3 Output Buffer Levels
3.3.1 Output AC Test Conditions
3.3.2 Output DC Current Drive
3.3.3 OCD default characteristics
3.4 IDD Specifications & Measurement Conditions
3.5 Input/Output Capacitance
4. AC Timing Specifications
5. Package Dimensions
Rev. 0.7 / Nov. 2008
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HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
1. Description
1.1 Device Features & Ordering Information
1.1.1 Key Features
• VDD = 1.8 +/- 0.1V
• VDDQ = 1.8 +/- 0.1V
• All inputs and outputs are compatible with SSTL_18 interface
• 8 banks
• Fully differential clock inputs (CK, /CK) operation
• Double data rate interface
• Source synchronous-data transaction aligned to bidirectional data strobe (DQS, DQS)
• Differential Data Strobe (DQS, DQS)
• Data outputs on DQS, DQS edges when read (edged DQ)
• Data inputs on DQS centers when write (centered DQ)
• On chip DLL align DQ, DQS and DQS transition with CK transition
• DM mask write data-in at the both rising and falling edges of the data strobe
• All addresses and control inputs except data, data strobes and data masks latched on the rising
edges of the clock
• Programmable CAS latency 3, 4, 5 and 6 supported
• Programmable additive latency 0, 1, 2, 3, 4 and 5 supported
• Programmable burst length 4/8 with both nibble sequential and interleave mode
• Internal eight bank operations with single pulsed RAS
• Auto refresh and self refresh supported
• tRAS lockout supported
• 8K refresh cycles /64ms
• JEDEC standard 60ball FBGA(x4/x8), 84ball FBGA(x16)
• Full strength driver option controlled by EMR
• On Die Termination supported
• Off Chip Driver Impedance Adjustment supported
• Read Data Strobe supported (x8 only)
• Self-Refresh High Temperature Entry
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HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
1.1.2 Ordering Information
Part No.
Configuration
Package
HY5PS1G431C(L)FP-XX*
HY5PS1G431CFR-XX*
HY5PS1G831C(L)FP-XX*
HY5PS1G831CFR-XX*
HY5PS1G1631C(L)FP-XX*
HY5PS1G1631CFR-XX*
256Mx4
60 Ball
84 Ball
128Mx8
64Mx16
Note:
-XX* is the speed bin, refer to the Operating Frequency table for complete part number.
Hynix lead-free products are compliant to RoHS.
1.1.3 Operating Frequency
Grade
tCK(ns)
CL
3
tRCD
tRP
3
Unit
E3
Clk
5
3.75
3
3
4
5
6
5
C4
Y5
S6
S5
Clk
Clk
Clk
Clk
4
4
5
5
2.5
2.5
6
6
5
5
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HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
1.2 Pin Configuration & Address Table
256Mx4 DDR2 Pin Configuration(Top view: see balls through package)
7
8
3
9
1
2
VSSQ
DQS
VSS
VDDQ
VDD
NC
NC
A
B
C
DQS
VDDQ
DQ2
VSSQ
DQ0
VSSQ
CK
DM
VDDQ
DQ3
VSS
NC
VDDQ
NC
VSSQ
DQ1
VDDQ
NC
VSSQ
VREF
CKE
D
E
VSSDL
RAS
VDD
ODT
VDDL
F
G
H
J
CK
WE
CAS
A2
CS
A0
BA1
A1
BA2
VSS
VDD
BA0
A10
A3
VDD
VSS
A6
A4
A5
K
A11
NC
A8
A9
A7
L
A13
NC
A12
ROW AND COLUMN ADDRESS TABLE
ITEMS
256Mx4
# of Bank
Bank Address
Auto Precharge Flag
Row Address
8
BA0,BA1,BA2
A10/AP
A0 - A13
A0-A9, A11
1 KB
Column Address
Page size
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HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
128Mx8 DDR2 PIN CONFIGURATION(Top view: see balls through package)
7
8
3
9
1
2
VSSQ
DQS
VSS
VDDQ
VDD
DQ6
NU/RDQS
A
B
C
DQS
VDDQ
DQ2
VSSQ
DQ0
VSSQ
CK
DM/RDQS
VDDQ
DQ3
DQ7
VDDQ
DQ5
VSSQ
DQ1
VDDQ
DQ4
VSSQ
VREF
CKE
D
E
VSSDL
RAS
VSS
VDD
VDDL
F
G
H
J
CK
WE
ODT
CAS
A2
CS
A0
BA1
A1
BA2
VSS
VDD
BA0
A10
A3
VDD
VSS
A6
A4
A5
K
A11
NC
A8
A9
A7
L
A13
NC
A12
ROW AND COLUMN ADDRESS TABLE
ITEMS
128Mx8
# of Bank
Bank Address
Auto Precharge Flag
Row Address
8
BA0, BA1, BA2
A10/AP
A0 - A13
A0-A9
Column Address
Page size
1 KB
Rev. 0.7 / Nov. 2008
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HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
64Mx16 DDR2 PIN CONFIGURATION(Top view: see balls through package)
7
8
3
9
1
2
A
B
C
D
E
VSSQ
UDQS
VDDQ
DQ10
VSSQ
LDQS
VDDQ
DQ2
UDQS
VSSQ
DQ8
VSS
UDM
VDDQ
DQ11
VSS
VDDQ
DQ15
VDDQ
DQ13
VDDQ
DQ7
VDD
DQ14
VDDQ
DQ12
VDD
NC
VSSQ
DQ9
VSSQ
NC
VSSQ
LDQS
VSSQ
DQ0
F
LDM
DQ6
VSSQ
DQ1
VSSQ
G
VDDQ
DQ3
VDDQ
DQ5
VDDQ
DQ4
H
J
VSSQ
VSSDL
RAS
CK
CK
VSS
WE
VDD
ODT
VDDL
VREF
CKE
K
L
CAS
A2
CS
A0
BA1
A1
NC, BA2
VSS
BA0
A10/AP
A3
M
VDD
VSS
A6
A4
A5
N
P
A11
A8
A9
A7
NC, A15
NC, A13
NC, A14
VDD
A12
R
ROW AND COLUMN ADDRESS TABLE
ITEMS
64Mx16
# of Bank
8
BA0, BA1, BA2
A10/AP
Bank Address
Auto Precharge Flag
Row Address
A0 - A12
A0-A9
Column Address
Page size
2 KB
Rev. 0.7 / Nov. 2008
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HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
1.3 PIN DESCRIPTION
PIN
TYPE
DESCRIPTION
Clock: CK and CK are differential clock inputs. All address and control input signals are sampled
on the crossing of the positive edge of CK and negative edge of CK. Output (read) data is refer-
enced to the crossings of CK and CK (both directions of crossing).
CK, CK
Input
Clock Enable: CKE HIGH activates, and CKE LOW deactivates internal clock signals, and device
input buffers and output drivers. Taking CKE LOW provides PRECHARGE POWER DOWN and SELF
REFRESH operation (all banks idle), or ACTIVE POWER DOWN (row ACTIVE in any bank). CKE is
synchronous for POWER DOWN entry and exit, and for SELF REFRESH entry. CKE is asynchro-
nous for SELF REFRESH exit. After VREF has become stable during the power on and initialization
sequence, it must be maintained for proper operation of the CKE receiver. For proper self-refresh
entry and exit, VREF must be maintained to this input. CKE must be maintained HIGH throughout
READ and WRITE accesses. Input buffers, excluding CK, CK and CKE are disabled during POWER
DOWN. Input buffers, excluding CKE are disabled during SELF REFRESH.
CKE
CS
Input
Chip Select: All commands are masked when CS is registered HIGH. CS provides for external
bank selection on systems with multiple banks. CS is considered part of the command code.
Input
Input
On Die Termination Control: ODT (registered HIGH) enables on die termination resistance
internal to the DDR2 SDRAM. When enabled, ODT is only applied to DQ, DQS, DQS, RDQS,
RDQS, and DM signal for x4,x8 configurations. For x16 configuration ODT is applied to each DQ,
UDQS/UDQS.LDQS/LDQS, UDM and LDM signal. The ODT pin will be ignored if the Extended
Mode Register(EMR(1)) is programmed to disable ODT.
ODT
RAS, CAS, WE
Input
Input
Command Inputs: RAS, CAS and WE (along with CS) define the command being entered.
Input Data Mask: DM is an input mask signal for write data. Input Data is masked when DM is
sampled High coincident with that input data during a WRITE access. DM is sampled on both
edges of DQS, Although DM pins are input only, the DM loading matches the DQ and DQS load-
ing. For x8 device, the function of DM or RDQS/ RDQS is enabled by EMR command to EMR(1).
DM
(LDM, UDM)
Bank Address Inputs: BA0 - BA2 define to which bank an ACTIVE, Read, Write or PRECHARGE
command is being applied (For 256Mb and 512Mb, BA2 is not applied). Bank address also deter-
mines if one of the mode register or extended mode register is to be accessed during a MR or
EMR command cycle.
BA0 - BA2
Input
Input
Address Inputs: Provide the row address for ACTIVE commands, and the column address and
AUTO PRECHARGE bit for READ/WRITE commands to select one location out of the memory
array in the respective bank. A10 is sampled during a precharge command to determine whether
the PRECHARGE applies to one bank (A10 LOW) or all banks (A10 HIGH). If only one bank is to
be precharged, the bank is selected by BA0-BA2. The address inputs also provide the op code
during MRS or EMRS commands.
A0 -A15
DQ
Input/Output Data input / output: Bi-directional data bus
Data Strobe: Output with read data, input with write data. Edge aligned with read data, cen-
tered in write data. For the x16, LDQS correspond to the data on DQ0~DQ7; UDQS corresponds
to the data on DQ8~DQ15. For the x8, an RDQS option using DM pin can be enabled via the
EMR(1) to simplify read timing. The data strobes DQS, LDQS, UDQS, and RDQS may be used in
single ended mode or paired with optional complementary signals DQS, LDQS,UDQS and RDQS
to provide differential pair signaling to the system during both reads and writes. An EMR(1) con-
trol bit enables or disables all complementary data strobe signals.
DQS, (DQS)
(UDQS),(UDQS)
(LDQS),(LDQS)
(RDQS),(RDQS)
In this data sheet, "differential DQS signals" refers to any of the following with A10 = 0 of EMR(1)
x4 DQS/DQS
Input/Output
x8 DQS/DQS
if EMR(1)[A11] = 0
if EMR(1)[A11] = 1
x8 DQS/DQS, RDQS/RDQS,
x16 LDQS/LDQS and UDQS/UDQS
"single-ended DQS signals" refers to any of the following with A10 = 1 of
EMR(1)
x4 DQS
x8 DQS
x8 DQS, RDQS,
if EMR(1)[A11] = 0
if EMR(1)[A11] = 1
x16 LDQS and UDQS
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HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
-Continued-
PIN
TYPE
DESCRIPTION
NC
VDDQ
VSSQ
VDDL
VSSDL
VDD
No Connect: No internal electrical connection is present.
DQ Power Supply: 1.8V +/- 0.1V
DQ Ground
Supply
Supply
Supply
Supply
Supply
Supply
Supply
DLL Power Supply: 1.8V +/- 0.1V
DLL Ground
Power Supply: 1.8V +/- 0.1V
Ground
VSS
VREF
Reference voltage.
Rev. 0.7 / Nov. 2008
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HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
2. Maximum DC Ratings
2.1 Absolute Maximum DC Ratings
Symbol
Parameter
Rating
Units
Notes
VDD
- 1.0 V ~ 2.3 V
V
1
Voltage on VDD pin relative to Vss
Voltage on VDDQ pin relative to Vss
Voltage on VDDL pin relative to Vss
Voltage on any pin relative to Vss
Storage Temperature
VDDQ
VDDL
- 0.5 V ~ 2.3 V
- 0.5 V ~ 2.3 V
- 0.5 V ~ 2.3 V
-55 to +100
V
V
1
1
V
IN, VOUT
V
1
TSTG
°C
1, 2
Input leakage current; any input 0V VIN VDD;
all other balls not under test = 0V)
II
-2 uA ~ 2 uA
-5 uA ~ 5 uA
uA
uA
Output leakage current; 0V VOUT VDDQ; DQ
and ODT disabled
IOZ
Note:
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rat-
ing conditions for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement
conditions. please refer to JESD51-2 standard.
2.2 Operating Temperature Condition
Symbol
Parameter
Rating
Units
Notes
TOPER
0 to 95
°C
1,2
Operating Temperature
Note:
1. Operating Temperature is the case surface temperature on the center/top side of the DRAM. For the measure-
ment conditions, please refer to JESD51-2 standard.
2. At 85~95° TOPER , Double refresh rate(tREFI: 3.9us) is required, and to enter the self refresh mode at this tem-
perature range it must be required an EMRS command to change itself refresh rate.
Rev. 0.7 / Nov. 2008
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HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
3. AC & DC Operating Conditions
3.1 DC Operating Conditions
3.1.1 Recommended DC Operating Conditions (SSTL_1.8)
Rating
Symbol
Parameter
Supply Voltage
Units
Notes
Min.
Typ.
Max.
VDD
VDDL
VDDQ
VREF
VTT
1.7
1.8
1.9
V
V
1
1.7
1.8
1.8
1.9
1,2
1,2
3,4
5
Supply Voltage for DLL
Supply Voltage for Output
Input Reference Voltage
Termination Voltage
1.7
1.9
V
0.49*VDDQ
VREF-0.04
0.50*VDDQ
VREF
0.51*VDDQ
VREF+0.04
mV
V
Note:
1. Min. Typ. and Max. values increase by 100mV for C3(DDR2-533 3-3-3) speed option.
2. VDDQ tracks with VDD,VDDL tracks with VDD. AC parameters are measured with VDD,VDDQ and VDD.
3. The value of VREF may be selected by the user to provide optimum noise margin in the system. Typically the
value of VREF is expected to be about 0.5 x VDDQ of the transmitting device and VREF is expected to track varia-
tions in VDDQ
4. Peak to peak ac noise on VREF may not exceed +/-2% VREF (dc).
5. VTT of transmitting device must track VREF of receiving device.
3.1.2 ODT DC electrical characteristics
PARAMETER/CONDITION
SYMBOL MIN NOM MAX UNITS NOTES
Rtt effective impedance value for EMR(A6,A2)=0,1; 75 ohm
Rtt effective impedance value for EMR(A6,A2)=1,0; 150 ohm
Rtt effective impedance value for EMR(A6,A2)=1,1; 50 ohm
Deviation of VM with respect to VDDQ/2
Rtt1(eff)
Rtt2(eff)
Rtt3(eff)
delta VM
60
120
40
75
150
50
90
180
60
ohm
ohm
ohm
%
1
1
1
1
-6
+6
Note:
1. Test condition for Rtt measurements
Measurement Definition for Rtt(eff): Apply VIH (ac) and VIL (ac) to test pin separately, then measure current I(VIH (ac))
and I(VIL(ac)) respectively. VIH (ac), VIL (ac), and VDDQ values defined in SSTL_18
V
IH (ac) - VIL (ac)
Rtt(eff) =
I(VIH (ac)) - I(VIL (ac))
Measurement Definition for VM: Measurement Voltage at test pin (mid point) with no load.
2 x Vm
delta VM =(
- 1) x 100%
VDDQ
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HY5PS1G4(8,16)31CFR
3.2 DC & AC Logic Input Levels
3.2.1 Input DC Logic Level
Symbol
Parameter
Min.
Max.
Units
Notes
Notes
VIH(dc)
VREF + 0.125
VDDQ + 0.3
V
dc input logic HIGH
dc input logic LOW
VIL(dc)
- 0.3
VREF - 0.125
V
3.2.2 Input AC Logic Level
DDR2 400,533
DDR2 667,800
Symbol
Parameter
Units
Min.
Max.
Min.
Max.
V
IH (ac)
VREF + 0.250
-
VREF + 0.200
-
-
V
V
ac input logic HIGH
ac input logic LOW
VIL (ac)
-
VREF - 0.250
VREF - 0.200
3.2.3 AC Input Test Conditions
Symbol
Condition
Input reference voltage
Value
Units
Notes
VREF
0.5 * VDDQ
1.0
V
V
1
VSWING(MAX)
SLEW
Input signal maximum peak to peak swing
Input signal minimum slew rate
1
1.0
V/ns
2, 3
Note:
1. Input waveform timing is referenced to the input signal crossing through the VREF level applied to the device
under test.
2. The input signal minimum slew rate is to be maintained over the range from VREF to VIH(ac) min for rising
edges and the range from VREF to VIL(ac) max for falling edges as shown in the figure below.
3. AC timings are referenced with input waveforms switching from VIL(ac) to VIH(ac) on the positive transitions
and VIH(ac) to VIL(ac) on the negative transitions.
VDDQ
VIH(ac) min
VIH(dc) min
VREF
VSWING(MAX)
V
IL(dc) max
VIL(ac) max
VSS
delta TF
delta TR
VREF - VIL(ac) max
delta TF
VIH(ac) min - VREF
Falling Slew =
Rising Slew =
delta TR
< Figure: AC Input Test Signal Waveform>
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HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
3.2.4 Differential Input AC logic Level
Symbol
Parameter
Min.
Max.
Units Notes
VID (ac)
0.5
VDDQ + 0.6
V
V
1
2
ac differential input voltage
ac differential cross point voltage
VIX (ac)
0.5 * VDDQ - 0.175 0.5 * VDDQ + 0.175
Note:
1. VIN(DC) specifies the allowable DC execution of each input of differential pair such as CK, CK, DQS, DQS, LDQS,
LDQS, UDQS and UDQS.
2. VID(DC) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input
(such as CK, DQS, LDQS or UDQS) level and VCP is the complementary input (such as CK, DQS, LDQS or UDQS)
level.
The minimum value is equal to VIH(DC) - V IL(DC).
V
DDQ
V
TR
Crossing point
V
ID
V
V
IX or OX
V
CP
V
SSQ
< Differential signal levels >
Note:
1. VID(AC) specifies the input differential voltage |VTR -VCP | required for switching, where VTR is the true input sig-
nal
(such as CK, DQS, LDQS or UDQS) and VCP is the complementary input signal (such as CK, DQS, LDQS or UDQS).
The minimum value is equal to V IH(AC) - V IL(AC).
2. The typical value of VIX(AC) is expected to be about 0.5 * VDDQ of the transmitting device and VIX(AC) is
expected to track variations in VDDQ. VIX(AC) indicates the voltage at which differential input signals must cross.
3.2.5 Differential AC output parameters
Symbol
Parameter
Min.
Max.
Units Notes
VOX (ac)
0.5 * VDDQ - 0.125 0.5 * VDDQ + 0.125
V
1
ac differential cross point voltage
Note:
1. The typical value of VOX(AC) is expected to be about 0.5 * V DDQ of the transmitting device and VOX(AC) is
expected to track variations in VDDQ. VOX(AC) indicates the voltage at w hich differential output signals must
cross.
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HY5PS1G4(8,16)31CFR
3.3 Output Buffer Characteristics
3.3.1 Output AC Test Conditions
Symbol
Parameter
SSTL_18 Class II
Units
Notes
VOTR
Output Timing Measurement Reference Level
0.5 * VDDQ
V
1
Note:
1. The VDDQ of the device under test is referenced.
3.3.2 Output DC Current Drive
Symbol
IOH(dc)
IOL(dc)
Parameter
Output Minimum Source DC Current
Output Minimum Sink DC Current
SSTl_18
- 13.4
Units
mA
Notes
1, 3, 4
2, 3, 4
13.4
mA
Note:
1. VDDQ = 1.7 V; VOUT = 1420 mV. (VOUT - VDDQ)/IOH must be less than 21 ohm for values of VOUT between VDDQ
and VDDQ - 280 mV.
2. VDDQ = 1.7 V; VOUT = 280 mV. VOUT/IOL must be less than 21 ohm for values of VOUT between 0 V and 280 mV.
3. The dc value of VREF applied to the receiving device is set to VTT
4. The values of IOH(dc) and IOL(dc) are based on the conditions given in Notes 1 and 2. They are used to test
device drive current capability to ensure VIH min plus a noise margin and VIL max minus a noise margin are
delivered to an SSTL_18 receiver. The actual current values are derived by shifting the desired driver operating
point (see Section 3.3) along a 21 ohm load line to define a convenient driver current for measurement.
Rev. 0.7 / Nov. 2008
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HY5PS1G4(8,16)31CFR
3.3.3 OCD default characteristics
Description
Parameter
Min
Nom
Max
Unit
ohms
ohms
ohms
V/ns
Notes
Output impedance
-
0
-
-
1.5
4
1
6
Output impedance step size for OCD calibration
Pull-up and pull-down mismatch
Output slew rate
0
1,2,3
Sout
1.5
-
5
1,4,5,6,7,8
Note :
1. Absolute Specifications ( Toper; VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V)
2. Impedance measurement condition for output source dc current: VDDQ=1.7V; VOUT=1420mV; (VOUT-
VDDQ)/Ioh must be less than 23.4 ohms for values of VOUT between VDDQ and VDDQ-280mV.
Impedance measurement condition for output sink dc current: VDDQ = 1.7V; VOUT = 280mV; VOUT/Iol must be
less than 23.4 ohms for values of VOUT between 0V and 280mV.
3. Mismatch is absolute value between pull-up and pull-dn, both are measured at same temperature and voltage.
4. Slew rate measured from vil(ac) to vih(ac).
5. The absolute value of the slew rate as measured from DC to DC is equal to or greater than the slew rate as
measured from AC to AC. This is guaranteed by design and characterization.
6. This represents the step size when the OCD is near 18 ohms at nominal conditions across all process
corners/variations and represents only the DRAM uncertainty. A 0 ohm value(no calibration) can only be achieved
if the OCD impedance is 18 ohms +/- 0.75 ohms under nominal conditions.
Output Slew rate load:
VTT
25 ohms
Reference
point
Output
(Vout)
7. DRAM output slew rate specification applies to 400, 533 and 667 MT/s speed bins.
8. Timing skew due to DRAM output slew rate mis-match between DQS / DQS and associated DQs is included in
tDQSQ and tQHS specification.
Rev. 0.7 / Nov. 2008
16
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
3.4 IDD Specifications & Test Conditions
IDD Specifications(max)
DDR2
400
DDR2 533
DDR2 667
DDR2 800
Units
Symbol
x4/x8
x4/x8
x16
x4/x8
x16
x4/x8
x16
IDD0
IDD1
60
65
75
85
70
90
75
95
mA
70
10
110
10
80
10
115
10
85
10
120
10
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
IDD2P
IDD2Q
IDD2N
10
22
27
27
30
30
32
32
30
35
35
40
40
45
45
F
S
20
20
20
25
25
25
25
IDD3P
12
12
12
12
12
12
12
IDD3N
IDD4W
IDD4R
IDD5
35
45
45
50
50
55
55
100
100
165
10
125
125
165
10
160
160
165
10
155
150
175
10
210
195
175
10
180
170
180
10
240
225
175
10
Normal
IDD6
Low
power
5
5
5
5
5
5
5
mA
mA
IDD7
165
175
260
200
265
235
295
Rev. 0.7 / Nov. 2008
17
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
IDD Test Conditions
(IDD values are for full operating range of Voltage and Temperature, Notes 1-5)
Symbol
IDD0
Conditions
Units
t
t
t
t
t
t
Operating one bank active-precharge current; CK = CK(IDD), RC = RC(IDD), RAS = RAS
min(IDD); CKE is HIGH, CS is HIGH between valid commands;Address bus inputs are SWITCH-
ING;Data bus inputs are SWITCHING
mA
Operating one bank active-read-precharge current; IOUT = 0mA;BL = 4, CL = CL(IDD), AL
t
t
t
t
t
t
t
t
= 0; CK = CK(IDD), RC = RC (IDD), RAS = RASmin(IDD), RCD = RCD(IDD); CKE is HIGH, CS
is HIGH between valid commands; Address bus inputs are SWITCHING; Data pattern is same as
IDD4W
IDD1
mA
t
t
Precharge power-down current; All banks idle; CK = CK(IDD); CKE is LOW; Other control and
IDD2P
IDD2Q
IDD2N
mA
mA
mA
address bus inputs are STABLE; Data bus inputs are FLOATING
t
t
Precharge quiet standby current;All banks idle; CK = CK(IDD);CKE is HIGH, CS is HIGH;
Other control and address bus inputs are STABLE; Data bus inputs are FLOATING
t
t
Precharge standby current; All banks idle; CK = CK(IDD); CKE is HIGH, CS is HIGH; Other
control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING
t
t
mA
mA
Active power-down current; All banks open; CK = CK(IDD);
CKE is LOW; Other control and address bus inputs are STABLE;
Data bus inputs are FLOATING
Fast PDN Exit MR(12) = 0
Slow PDN Exit MR(12) = 1
IDD3P
IDD3N
IDD4W
t
t
t
t
t
Active standby current; All banks open; CK = CK(IDD), RAS = RASmax(IDD), RP
t
mA
mA
= RP(IDD); CKE is HIGH, CS is HIGH between valid commands; Other control and address bus
inputs are SWITCHING; Data bus inputs are SWITCHING
Operating burst write current; All banks open, Continuous burst writes; BL = 4, CL = CL(IDD),
AL = 0; CK = CK(IDD), RAS = RASmax(IDD), RP = RP(IDD); CKE is HIGH, CS is HIGH between
valid commands; Address bus inputs are SWITCHING; Data bus inputs are SWITCHING
t
t
t
t
t
t
Operating burst read current; All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL
t
t
t
t
t
t
= CL(IDD), AL = 0; CK = CK(IDD), RAS = RASmax(IDD), RP = RP(IDD); CKE is HIGH, CS is
HIGH between valid commands; Address bus inputs are SWITCHING; Data pattern is same as
IDD4W
IDD4R
mA
t
t
t
Burst refresh current; CK = CK(IDD); Refresh command at every RFC(IDD) interval; CKE is
HIGH, CS is HIGH between valid commands; Other control and address bus inputs are SWITCH-
ING; Data bus inputs are SWITCHING
IDD5B
IDD6
mA
mA
Self refresh current; CK and CK at 0V; CKE ≤ 0.2V; Other control and address bus inputs are
FLOATING; Data bus inputs are FLOATING
Operating bank interleave read current; All bank interleaving reads, IOUT = 0mA; BL = 4, CL
t
t
t
t
t
t
t
t
= CL(IDD), AL = RCD(IDD)-1* CK(IDD); CK = CK(IDD), RC = RC(IDD), RRD = RRD(IDD),
IDD7
t
t
mA
RCD = 1* CK(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are
STABLE during DESELECTs; Data pattern is same as IDD4R; - Refer to the following page for
detailed timing conditions
Rev. 0.7 / Nov. 2008
18
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
Note :
1. VDDQ = 1.8 +/- 0.1V ; VDD = 1.8 +/- 0.1V (exclusively VDDQ = 1.9 +/- 0.1V ; VDD = 1.9 +/- 0.1V for C3 speed
grade)
2. IDD specifications are tested after the device is properly initialized
3. Input slew rate is specified by AC Parametric Test Condition
4. IDD parameters are specified with ODT disabled.
5. Data bus consists of DQ, DM, DQS, DQS, RDQS, RDQS, LDQS, LDQS, UDQS, and UDQS. IDD values must be met
with all combinations of EMR bits 10 and 11.
6. For DDR2-667/800 testing, tCK in the COnditions should be interpreted as tCK (avg).
7. Definitions for IDD
LOW is defined as Vin ≤ VILAC (max)
HIGH is defined as Vin ≥ VIHAC (min)
STABLE is defined as inputs stable at a HIGH or LOW level
FLOATING is defined as inputs at VREF = VDDQ/2
SWITCHING is defined as: inputs changing between HIGH and LOW every other clock cycle (once per two clocks)
for address and control signals, and inputs changing between HIGH and LOW every other data transfer (once per
clock) for DQ signals not including masks or strobes.
Rev. 0.7 / Nov. 2008
19
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
IDD Testing Parameters
For purposes of IDD testing, the following parameters are to be utilized.
DDR2-800
DDR2-
667
DDR2-
533
DDR2-
400
Parameter
5-5-5
6-6-6
6
5-5-5
5
4-4-4
4
3-3-3
3
Units
CL(IDD)
5
tCK
t
12.5
15
15
15
15
RCD(IDD)
ns
ns
t
57.5
7.5
60
60
60
RC(IDD)
55
t
7.5
ns
ns
RRD(IDD)-x4/x8
7.5
7.5
7.5
t
10
5
RRD(IDD)-x16
10
10
10
3
10
t
2.5
2.5
3.75
CK(IDD)
ns
ns
t
45
70000
12.5
75
45
70000
15
45
70000
15
45
70000
15
40
RASmin(IDD)
t
70000
15
ns
ns
ns
ns
ns
ns
RASmax(IDD)
t
RP(IDD)
t
t
75
75
75
75
RFC(IDD)-256Mb
105
105
105
105
105
127.5
197.5
RFC(IDD)-512Mb
t
t
127.5
197.5
127.5
197.5
127.5
197.5
127.5
197.5
RFC(IDD)-1Gb
RFC(IDD)-2Gb
Detailed IDD7
The detailed timings are shown below for IDD7. Changes will be required if timing parameter changes are made to the
specification.
Legend: A = Active; RA = Read with Autoprecharge; D = Deselect
IDD7: Operating Current: All Bank Interleave Read operation
t
t
All banks are being interleaved at minimum RC(IDD) without violating RRD(IDD) and tFAW (IDD) using a burst length
of 4. Control and address bus inputs are STABLE during DESELECTs. IOUT = 0mA
Timing Patterns for 4 bank devices x4/ x8/ x16
-DDR2-400 4/4/4: A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D D D D
-DDR2-400 3/3/3: A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D D D
-DDR2-533 4/4/4: A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D D D
-DDR2-533 3/3/3: A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D D
-DDR2-667 5/5/5: A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D
-DDR2-667 4/4/4: A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D
-DDR2-800 6/6/6: A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D D D D D
-DDR2-800 5/5/5: A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D D D D
-DDR2-800 4/4/4: A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D D D
Timing Patterns for 8 bank devices x4/8
-DDR2-400 all bins: A0 RA0 A1 RA1 A2 RA2 A3 RA3 A4 RA4 A5 RA5 A6 RA6 A7 RA7
-DDR2-533 all bins: A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D A4 RA4 A5 RA5 A6 RA6 A7 RA7 D D
-DDR2-667 all bins: A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D
-DDR2-800 all bins: A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D D
Rev. 0.7 / Nov. 2008
20
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
Timing Patterns for 8 bank devices x16
-DDR2-400 all bins: A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D A4 RA4 A5 RA5 A6 RA6 A7 RA7 D D
-DDR2-533 all bins: A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D A4 RA4 D A5 D A6 RA6 D A7 RA7 D D D
-DDR2-667 all bins: A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7
D D D
-DDR2-800 all bins: A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7
D D D D
3.5. Input/Output Capacitance
DDR2 400
DDR2 533
DDR2 667
DDR2 800
Parameter
Symbol
Units
Min
1.0
x
Max
Min
1.0
x
Max
Min
1.0
x
Max
Input capacitance, CK and CK
Input capacitance delta, CK and CK
CCK
CDCK
CI
2.0
0.25
2.0
2.0
0.25
2.0
2.0
0.25
1.75
0.25
3.5
pF
pF
pF
pF
pF
pF
Input capacitance, all other input-only pins
Input capacitance delta, all other input-only pins
Input/output capacitance, DQ, DM, DQS, DQS
Input/output capacitance delta, DQ, DM, DQS, DQS
1.0
x
1.0
x
1.0
x
CDI
0.25
4.0
0.25
3.5
CIO
2.5
x
2.5
x
2.5
x
CDIO
0.5
0.5
0.5
Rev. 0.7 / Nov. 2008
21
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
4. Electrical Characteristics & AC Timing Specification
(T
; V
= 1.8 +/- 0.1V; V = 1.8 +/- 0.1V)
OPER
DDQ DD
Refresh Parameters by Device Density
Symbol
Parameter
256Mb 512Mb 1Gb 2Gb 4Gb Units Notes
Refresh to Active/Refresh
command time
tRFC
75
105
127.5 195 327.5
ns
1
0 ℃≤ TCASE ≤ 85℃
85℃＜TCASE ≤ 95℃
7.8
3.9
7.8
3.9
7.8
3.9
7.8
3.9
7.8
3.9
us
us
1
Average periodic
refresh interval
tREFI
1,2
Note:
1: If refresh timing is violated, data corruption may occur and the data must be re-written with valid data before a valid READ can be
executed.
2. This is an optional feature. For detailed information, please refer to “operating temperature condition” in this data sheet.
DDR2 SDRAM speed bins and tRCD, tRP and tRC for corresponding bin
Speed
DDR2-800
DDR2-667
DDR2-533 DDR2-400 Units Notes
Parameter
min
min
6-6-6
6
min
min
5-5-5
5
min
4-4-4
4
min
3-3-3
3
Bin(CL-tRCD-tRP)
CAS Latency
tRCD
5-5-5
5
4-4-4
4
tCK
ns
12.5
12.5
45
15
12
15
15
15
2
2
tRP*1
15
12
15
15
15
ns
tRAS
45
45
57
45
45
40
ns
2,3
2
tRC
57.5
60
60
60
55
ns
Note:
1. 8 bank device Precharge All Allowance: tRP for a Precharge All command for an 8 Bank device will equal to tRP+1*tCK, where tRP
are the values for a single bank Precharge, which are shown in the table above.
2. Refer to Specific Notes 32.
3. Refer to Specific Notes 3.
Rev. 0.7 / Nov. 2008
22
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
Timing Parameters by Speed Grade (DDR2-400 and DDR2-533)
DDR2-400
DDR2-533
Symbol
Unit
Note
Parameter
min
max
+600
+500
0.55
0.55
-
min
max
+500
+450
0.55
0.55
-
DQ output access time from CK/CK
DQS output access time from CK/CK
CK HIGH pulse width
tAC
-600
-500
0.45
0.45
-500
-450
0.45
0.45
ps
ps
tDQSCK
tCH
tCK
tCK
ps
CK LOW pulse width
tCL
tHP
min(tCL,
tCH)
min(tCL,
tCH)
11,12
15
CK half period
Clock cycle time, CL=x
tCK
5000
150
8000
-
3750
100
8000
-
ps
ps
6,7,8,20
,28
DQ and DM input setup time(differential strobe)
tDS(base)
6,7,8,21
,28
DQ and DM input hold time(differential strobe)
tDH(base)
275
-
225
-
ps
DQ and DM input setup time(single ended strobe)
DQ and DM input hold time(single ended strobe)
tDS(base)
tDH(base)
25
25
-
-
-25
-25
-
-
ps
ps
6,7,8,25
6,7,8,26
Control & Address input pulse width for each
input
tIPW
0.6
-
0.6
-
tCK
DQ and DM input pulse width for each input
Data-out high-impedance time from CK/CK
tDIPW
tHZ
0.35
-
-
0.35
-
-
tCK
ps
tAC max
tAC max
18
18
tLZ
(DQS)
DQS low-impedance time from CK/CK
DQ low-impedance time from CK/CK
tAC min
2*tAC min
-
tAC max
tAC max
350
tAC min
2*tAC min
-
tAC max
tAC max
300
ps
ps
ps
tLZ
(DQ)
18
DQS-DQ skew for DQS and associated DQ
signals
tDQSQ
13
12
DQ hold skew factor
tQHS
tQH
-
tHP - tQHS
WL - 0.25
0.35
0.35
0.2
450
-
tHP - tQHS
WL - 0.25
0.35
0.35
0.2
400
ps
DQ/DQS output hold time from DQS
Write command to first DQS latching transition
DQS input HIGH pulse width
DQS input LOW pulse width
DQS falling edge to CK setup time
DQS falling edge hold time from CK
Mode register set command cycle time
Write preamble
-
-
ps
tDQSS
tDQSH
tDQSL
tDSS
tDSH
tMRD
tWPRE
tWPST
tIS
WL + 0.25
WL + 0.25
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
ps
-
-
-
-
-
-
0.2
-
-
0.2
-
-
2
2
0.35
0.4
-
0.35
0.4
-
Write postamble
0.6
-
0.6
-
10
5,7,9,23
5,7,9,23
19
Address and control input setup time
Address and control input hold time
Read preamble
350
250
tIH
475
-
375
-
ps
tRPRE
tRPST
0.9
1.1
0.6
0.9
1.1
0.6
tCK
tCK
Read postamble
0.4
0.4
19
Active to active command period for 1KB
page size products (x4, x8)
ns
ns
4
tRRD
tRRD
7.5
10
-
-
7.5
10
-
-
Active to active command period for 2KB
page size products (x16)
4
Rev. 0.7 / Nov. 2008
23
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
-Continued-
DDR2-400
DDR2-533
Symbol
Units
Notes
Parameter
min
max
min
max
Four Active Window for 1KB page size
products
ns
ns
tFAW
tFAW
37.5
50
-
37.5
-
Four Active Window for 2KB page size
products
-
50
-
CAS to CAS command delay
Write recovery time
tCCD
tWR
2
2
tCK
ns
15
-
-
-
15
-
-
-
Auto precharge write recovery +
precharge time
tDAL
WR+tRP*
WR+tRP*
tCK
14
Internal write to read command delay
Internal read to precharge command delay
Exit self refresh to a non-read command
Exit self refresh to a read command
tWTR
tRTP
10
7.5
7.5
7.5
ns
ns
24
3
tXSNR
tXSRD
tRFC + 10
200
tRFC + 10
200
ns
-
-
-
-
tCK
Exit precharge power down to any non-
read command
tXP
2
2
2
2
tCK
tCK
tCK
Exit active power down to read command
tXARD
tXARDS
1
Exit active power down to read command
(Slow exit, Lower power)
6 - AL
6 - AL
1, 2
CKE minimum pulse width
(HIGH and LOW pulse width)
tCKE
tAOND
tAON
3
2
3
2
tCK
tCK
ns
27
16
16
ODT turn-on delay
ODT turn-on
2
2
tAC(max)
+1
tAC(max)
+1
tAC(min)
tAC(min)
2tCK+tAC
(max)
+1
tAC(min)+
2
tAC(min)+
2
2tCK+tA
C(max)+1
ODT turn-on(Power-Down mode)
tAONPD
ns
ODT turn-off delay
ODT turn-off
tAOFD
tAOF
2.5
2.5
2.5
2.5
tCK
ns
17,44
17,44
tAC(max)
+ 0.6
tAC(max)
+ 0.6
tAC(min)
tAC(min)
2.5tCK+t
AC(max)
+1
tAC(min)+
2
2.5tCK+tA
C(max)+1
tAC(min)+
2
ODT turn-off (Power-Down mode)
tAOFPD
ns
ODT to power down entry latency
ODT power down exit latency
OCD drive mode output delay
tANPD
tAXPD
tOIT
3
8
0
3
8
0
tCK
tCK
ns
12
12
Minimum time clocks remains ON after
CKE asynchronously drops LOW
tIS+tCK+tI
H
tIS+tCK+tI
H
tDelay
ns
15
Rev. 0.7 / Nov. 2008
24
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
(DDR2-667 and DDR2-800)
DDR2-667
DDR2-800
Symbol
Unit
Note
Parameter
min
max
+450
+400
0.52
min
-400
-350
0.48
0.48
max
+400
+350
0.52
DQ output access time from CK/CK
DQS output access time from CK/CK
CK HIGH pulse width
tAC
-450
-400
0.48
0.48
ps
40
40
tDQSCK
tCH(avg)
tCL(avg)
ps
tCK(avg)
tCK(avg)
35,36
35,36
CK LOW pulse width
0.52
0.52
min(tCL(abs),
tCH(abs))
min(tCL(abs),
tCH(abs))
CK half period
tHP
-
-
ps
37
Clock cycle time, CL=x
tCK(avg)
3000
8000
2500
8000
ps
35,36
DQ and DM input setup time
DQ and DM input hold time
tDS(base)
tDH(base)
100
-
50
-
ps
6,7,8,20,28,31
6,7,8,21,28,31
175
-
125
-
ps
Control & Address input pulse width for each input tIPW
0.6
-
-
0.6
-
-
tCK(avg)
DQ and DM input pulse width for each input
Data-out high-impedance time from CK/CK
DQS low-impedance time from CK/CK
DQ low-impedance time from CK/CK
DQS-DQ skew for DQS and associated DQ signals
DQ hold skew factor
tDIPW
tHZ
0.35
0.35
tCK(avg)
-
tAC max
tAC max
tAC max
240
-
tAC max
tAC max
tAC max
200
ps
ps
ps
ps
ps
ps
18,40
18,40
18,40
13
tLZ(DQS)
tLZ(DQ)
tDQSQ
tQHS
tAC min
tAC min
2*tAC min
2*tAC min
-
-
-
340
-
300
38
DQ/DQS output hold time from DQS
tQH
tHP - tQHS
-
tHP - tQHS
-
39
First DQS latching transition to associated clock
edge
tDQSS
- 0.25
+ 0.25
- 0.25
+ 0.25
tCK(avg)
30
DQS input HIGH pulse width
DQS input LOW pulse width
DQS falling edge to CK setup time
DQS falling edge hold time from CK
Mode register set command cycle time
Write preamble
tDQSH
tDQSL
tDSS
0.35
0.35
0.2
0.2
2
-
0.35
0.35
0.2
0.2
2
-
tCK(avg)
tCK(avg)
tCK(avg)
tCK(avg)
tCK(avg)
tCK(avg)
tCK(avg)
ps
-
-
-
-
30
30
tDSH
-
-
tMRD
-
-
-
-
tWPRE
tWPST
tIS(base)
tIH(base)
tRPRE
tRPST
tRAS
0.35
0.4
200
275
0.9
0.4
45
0.35
0.4
175
250
0.9
0.4
45
Write postamble
0.6
-
0.6
-
10
5,7,9,22,29
5,7,9,23,29
19,41
Address and control input setup time
Address and control input hold time
Read preamble
-
-
ps
1.1
0.6
70000
1.1
0.6
70000
tCK(avg)
tCK(avg)
ns
Read postamble
19,42
Activate to precharge command
3
Active to active command period for 1KB page size
products (x4, x8)
tRRD
tRRD
7.5
10
-
-
7.5
10
-
-
ns
ns
4,32
4,32
Active to active command period for 2KB page size
products (x16)
Four Active Window for 1KB page size products
Four Active Window for 2KB page size products
CAS to CAS command delay
tFAW
tFAW
tCCD
tWR
37.5
-
-
35
-
-
ns
ns
32
32
50
45
2
15
2
15
nCK
ns
Write recovery time
-
-
-
-
32
33
Auto precharge write recovery + precharge time
tDAL
WR+tnRP
WR+tnRP
nCK
Rev. 0.7 / Nov. 2008
25
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
-Continued-
DDR2-667
DDR2-800
Symbol
Unit
Notes
Parameter
min
max
min
7.5
max
Internal write to read command delay
Internal read to precharge command delay
Exit self refresh to a non-read command
Exit self refresh to a read command
tWTR
tRTP
7.5
7.5
-
-
ns
ns
24,32
3,32
32
7.5
tXSNR
tXSRD
tRFC + 10
200
tRFC + 10
200
ns
-
-
-
-
nCK
Exit precharge power down to any non-read
command
tXP
2
2
2
2
nCK
nCK
nCK
Exit active power down to read command
tXARD
tXARDS
1
Exit active power down to read command
(Slow exit, Lower power)
7 - AL
8 - AL
1, 2
CKE minimum pulse width
(HIGH and LOW pulse width)
tCKE
3
2
3
2
nCK
nCK
ns
27
16
ODT turn-on delay
ODT turn-on
tAOND
tAON
2
2
tAC(max)
+0.7
tAC(max)
+0.7
tAC(min)
tAC(min)
6,16,40
2tCK(avg)+
tAC(max)+1
tAC(min)
+2
2tCK(avg)+
tAC(max)+1
ODT turn-on(Power-Down mode)
ODT turn-off delay
tAONPD
tAOFD
tAOF
tAC(min)+2
2.5
ns
nCK
ns
2.5
2.5
2.5
17,45
tAC(max)
+0.6
17,43,4
5
ODT turn-off
tAC(min)
tAC(max)+ 0.6
tAC(min)
tAC(min)
+2
2.5tCK(avg)+
tAC(max)+1
tAC(min)
+2
2.5tCK(avg)+
tAC(max)+1
ODT turn-off (Power-Down mode)
tAOFPD
ns
ODT to power down entry latency
ODT power down exit latency
OCD drive mode output delay
tANPD
tAXPD
tOIT
3
8
0
3
8
0
nCK
nCK
ns
12
12
32
15
tIS + tCK
(avg)
+ tIH
Minimum time clocks remains ON after CKE
asynchronously drops LOW
tIS + tCK (avg)
+ tIH
tDelay
ns
Rev. 0.7 / Nov. 2008
26
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
General notes, which may apply for all AC parameters
1. DDR2 SDRAM AC timing reference load
The following figure represents the timing reference load used in defining the relevant timing parameters
of the part. It is not intended to be either a precise representation of the typical system environment nor a
depiction of the actual load presented by a production tester. System designers will use IBIS or other simula-
tion tools to correlate the timing reference load to a system environment. Manufacturers will correlate to their
production test conditions (generally a coaxial transmission line terminated at the tester electronics).
VDDQ
DQ
DQS
DQS
Output
DUT
VTT = VDDQ/2
RDQS
RDQS
Timing
reference
point
25Ω
AC Timing Reference Load
The output timing reference voltage level for single ended signals is the crosspoint with VTT. The output tim-
ing reference voltage level for differential signals is the crosspoint of the true (e.g. DQS) and the complement
(e.g. DQS) signal.
2. Slew Rate Measurement Levels
a. Output slew rate for falling and rising edges is measured between VTT - 250 mV and VTT + 250 mV for
single ended signals. For differential signals (e.g. DQS - DQS) output slew rate is measured between
DQS - DQS = -500 mV and DQS - DQS = +500mV. Output slew rate is guaranteed by design, but is
not necessarily tested on each device.
b. Input slew rate for single ended signals is measured from dc-level to ac-level: from VREF - 125 mV to
VREF + 250 mV for rising edges and from VREF + 125 mV and VREF - 250 mV for falling edges.
For differential signals (e.g. CK - CK) slew rate for rising edges is measured from CK - CK = -250 mV
to CK - CK = +500 mV (+250mV to -500 mV for falling edges).
c. VID is the magnitude of the difference between the input voltage on CK and the input voltage on CK, or
between DQS and DQS for differential strobe.
3. DDR2 SDRAM output slew rate test load
Output slew rate is characterized under the test conditions as shown below.
VDDQ
DUT
DQ
Output
DQS, DQS
VTT = VDDQ/2
RDQS, RDQS
25Ω
Test point
Slew Rate Test Load
Rev. 0.7 / Nov. 2008
27
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
4. Differential data strobe
DDR2 SDRAM pin timings are specified for either single ended mode or differential mode depending on the
setting of the EMR “Enable DQS” mode bit; timing advantages of differential mode are realized in system
design. The method by which the DDR2 SDRAM pin timings are measured is mode dependent. In single
ended mode, timing relationships are measured relative to the rising or falling edges of DQS crossing at VREF.
In differential mode, these timing relationships are measured relative to the crosspoint of DQS and its com-
plement, DQS. This distinction in timing methods is guaranteed by design and characterization. Note that
when differential data strobe mode is disabled via the EMR, the complementary pin, DQS, must be tied exter-
nally to VSS through a 20 Ω to 10 KΩ resistor to insure proper operation.
t
t
DQSL
DQSH
DQS
DQS
DQS/
DQS
t
t
WPST
WPRE
V
(dc)
V
(ac)
IH
IH
DQ
DM
D
D
D
t
D
t
V
(ac)
V
(dc)
IL
IL
t
t
DH
DH
DS
DS
V
(dc)
V
(ac)
IH
IH
DMin
DMin
DMin
(ac)
DMin
(dc)
V
IL
V
IL
Figure -- Data input (write) timing
t
t
CL
CH
CK
CK
CK/CK
DQS
DQS
DQS/DQS
DQ
t
t
RPRE
RPST
Q
Q
Q
Q
t
DQSQmax
t
DQSQmax
t
t
QH
QH
Figure -- Data output (read) timing
5. AC timings are for linear signal transitions. See System Derating for other signal transitions.
6. All voltages referenced to VSS.
7. These parameters guarantee device behavior, but they are not necessarily tested on each device. They
may be guaranteed by device design or tester correlation.
8. Tests for AC timing, IDD, and electrical (AC and DC) characteristics, may be conducted at nominal refer-
ence/supply voltage levels, but the related specifications and device operation are guaranteed for the full
voltage range specified.
Rev. 0.7 / Nov. 2008
28
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
Specific Notes for dedicated AC parameters
1. User can choose which active power down exit timing to use via MRS(bit 12). tXARD is expected to be
used for fast active power down exit timing. tXARDS is expected to be used for slow active power down exit
timing where a lower power value is defined by each vendor data sheet.
2. AL = Additive Latency
3. This is a minimum requirement. Minimum read to precharge timing is AL + BL/2 providing the tRTP and
tRAS(min) have been satisfied.
4. A minimum of two clocks (2 * tCK or 2 * nCK) is required irrespective of operating frequency
5. Timings are specified with command/address input slew rate of 1.0 V/ns. See System Derating for other
slew rate values.
6. Timings are guaranteed with DQs, DM, and DQS’s (DQS/RDQS in singled ended mode) input slew rate of
1.0 V/ns. See System Derating for other slew rate values.
7. Timings are specified with CK/CK differential slew rate of 2.0 V/ns. Timings are guaranteed for DQS signals
with a differential slew rate of 2.0 V/ns in differential strobe mode and a slew rate of 1V/ns in single ended
mode. See System Derating for other slew rate values.
8. tDS and tDH derating
tDS, tDH Derating Values for DDR2-400, DDR2-533(ALL units in 'ps', Note 1 applies to entire Table)
DQS, DQS Differential Slew Rate
4.0 V/ns
3.0 V/ns
2.0 V/ns
1.8 V/ns
1.6 V/ns
1.4 V/ns
1.2 V/ns
1.0 V/ns
0.8 V/ns
△
△
△
△
△
△
△
△
△
△
△
△
△
△
△
△
△
△
tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH
2.0 125
45 125
45 +125 +45
21 +83 +21
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5
1.0
0.9
0.8
0.7
0.6
0.5
83
0
-
21
0
-
83
0
95
12
1
33
12
-2
-
-
-
-
-
0
0
0
24
13
-1
24
10
-7
-
-
-
-
-
-
-
DQ
Slew
rate
V/ns
-11 -14 -11 -14
25
11
-7
22
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-25 -31 -13 -19
23
5
17
-6
-
-
-
-
-
-
-
-
-
-
-
-31 -42 -42 -19
-8
17
-7
6
-
-
-
-
-
-
-
-
-43 -59 -31 -47 -19 -35
-23
5
-11
-
-
-
-
-74 -89 -62 -77 -50 -65 -38 -53
tDS, tDH Derating Values for DDR2-667, DDR2-800(ALL units in 'ps', Note 1 applies to entire Table)
DQS, DQS Differential Slew Rate
4.0 V/ns
3.0 V/ns
2.0 V/ns
1.8 V/ns
1.6 V/ns
1.4 V/ns
1.2 V/ns
1.0 V/ns
0.8 V/ns
△
△
△
△
△
△
△
△
△
△
△
△
△
△
△
△
△
△
tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH
2.0 100
45 100
45 100
45
21
0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5
1.0
0.9
0.8
0.7
0.6
0.5
0.4
67
0
-
21
0
-
67
0
-5
-
21
67
0
79
12
7
33
12
-2
-
-
-
-
0
24
19
11
2
24
10
-7
-
-
-
-
-
-
-
-
DQ
Slew
rate
V/ns
-14
-5
-14
31
23
14
2
22
5
-
-
-
-
-
-
-
-
-
-
-
-
-13 -31
-1
-19
35
26
14
17
-6
-35
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-10 -42
-30
-18
-47
38
26
0
6
-
-
-
-
-
-
-
-
-
-
-
-10 -59
-23
-65
38
12
-11
-53
-
-
-
-
-
-
-
-24 -89 -12 -77
-
-
-
-
-
-52 -140 -40 -128 -28 -116
1) For all input signals the total tDS(setup time) and tDH(hold time) required is calculated by adding the datasheet value to the derating
Rev. 0.7 / Nov. 2008 29
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
tDS, tDH Derating Values for DDR2-400, DDR2-533(ALL units in 'ps', Note 1 applies to entire Table)
DQS, DQS Single-ended Slew Rate
1.8 V/ns 1.6 V/ns 1.4 V/ns
4.0 V/ns
3.0 V/ns
2.0 V/ns
1.2 V/ns
1.0 V/ns
0.8 V/ns
△
△
△
△
△
△
△
△
△
△
△
△
△
△
△
△
△
△
tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH
2.0 188 188 167 146 125
63
42
0
-
-
43
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5 146 167 125 125
83
0
81
-2
1.0
0.9
0.8
0.7
0.6
0.5
0.4
63 125
42
31
-
83
69
-
-7
-13
DQ
Slew
rate
V/ns
-
-
-
-
-
-
-
-
-
-
-
-
-11 -14 -13 -13 -18 -27 -29 -45
-25 -31 -27 -30 -32 -44 -43 -62 -60 -86
-
-
-
-
-
-
-
-
-
-
-45 -53 -50 -67 -61 -85 -78 -109 -108 -152
-
-
-
-
-
-
-
-
-74 -96 -85 -114 -102 -138 -132 -181 -183 -248
-
-
-
-
-
-
-128 -156 -145 -180 -175 -223 -226 -288
-210 -243 -240 -286 -291 -351
-
-
-
-
value listed in Table x.
Setup(tDS) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of VREF(dc) and the first crossing
of Vih(ac)min. Setup(tDS) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of VREF(dc) and the
first crossing of Vil(ac)max. If the actual signal is always earlier than the nominal slew rate line between shaded ‘ VREF(dc) to ac region’,
use nominal slew rate for derating value(see Fig a.) If the actual signal is later than the nominal slew rate line anywhere between shaded
‘VREF(dc) to ac region’, the slew rate of a tangent line to the actual signal from the ac level to dc level is used for derating value(see Fig b.)
Hold(tDH) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of Vil(dc) max and the first crossing
of VREF(dc). Hold (tDH) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of Vih(dc) min and the
first crossing of VREF(dc). If the actual signal is always later than the nominal slew rate line anywhere between shaded ‘dc to VREF(dc)
region’, the slew rate of a tangent line to the actual signal from the dc level to VREF(dc) level is used for derating value(see Fig c.) If the
actual signal is earlier than the nominal slew rate line anywhere between shaded ‘dc to VREF(dc) region’, the slew rate of a tangent line
to the actual signal from the dc level to VREF(dc) level is used for derating value(see Fig d.)
Although for slow slew rates the total setup time might be negative(i.e. a valid input signal will not have reached VIH/IL(ac) at the time
of the rising clock transition) a valid input signal is still required to complete the transition and reach VIH/IL(ac).
For slew rate in between the values listed in table x, the derating valued may obtained by linear interpolation.
These values are typically not subject to production test. They are verified by design and characterization.
Rev. 0.7 / Nov. 2008
30
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
Fig. a. Illustration of nominal slew rate for tIS,tDS
CK,DQS
CK, DQS
tIS,
tDS
tIH,
tDH
tIS,
tDS
tIH,
tDH
VDDQ
VIH(ac)min
VIH(dc)min
nominal
slew rate
VREF(dc)
nominal
slew rate
VIL(dc)max
VREF to ac
region
VIL(ac)max
Vss
Delta TF
Delta TR
Setup Slew Rate
Falling Signal
V
REF(dc)-VIL(ac)max
Setup Slew Rate
Rising Signal
VIH(ac)min-VREF(dc)
Delta TR
=
=
Delta TF
Rev. 0.7 / Nov. 2008
31
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
Fig. b. Illustration of tangent line for tIS,tDS
CK, DQS
CK, DQS
tIS,
tDS
tIH,
tDH
tIS,
tDS
tIH,
tDH
VDDQ
nominal
line
VIH(ac)min
VIH(dc)min
tangent
line
VREF(dc)
Tangent
line
VIL(dc)max
VREF to ac
region
VIL(ac)max
Nomial
line
Vss
Delta TR
Setup Slew Rate
Rising Signal
Tangent line[VIH(ac)min-VREF(dc)]
Delta TR
=
Delta TF
Tangent line[VREF(dc)-VIL(ac)max]
Delta TF
Setup Slew Rate
Falling Signal
=
Rev. 0.7 / Nov. 2008
32
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
Fig. c. Illustration of nominal line for tIH, tDH
CK, DQS
CK, DQS
tIS,
tDS
tIH,
tDH
tIS,
tDS
tIH,
tDH
VDDQ
VIH(ac)min
VIH(dc)min
dc to VREF
region
nominal
slew rate
VREF(dc)
nominal
slew rate
VIL(dc)max
VIL(ac)max
Vss
Delta TR
Hold Slew Rate
Delta TF
VIH(dc)min - VREF(dc)
Delta TF
Hold Slew Rate
Rising Signal
VREF(dc)-VIL(dc)max
Delta TR
=
=
Falling Signal
Rev. 0.7 / Nov. 2008
33
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
Fig. d. Illustration of tangent line for tIH, tDH
CK, DQS
CK, DQS
tIS,
tDS
tIS,
tDS
tIH,
tDH
tIH,
tDH
VDDQ
VIH(ac)min
nominal
line
VIH(dc)min
tangent
line
VREF(dc)
dc to VREF
region
Tangent
line
nominal
line
VIL(dc)max
VIL(ac)max
Vss
Delta TR
Delta TF
Hold Slew Rate Tangent line[VREF(dc)-VIL(ac)max]
=
Rising Signal
Delta TR
Tangent line[VIH(ac)min-VREF(dc)]
Delta TF
Hold Slew Rate
Falling Signal
=
Rev. 0.7 / Nov. 2008
34
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
9. tIS and tIH (input setup and hold) derating
tIS, tIH Derating Values for DDR2-400, DDR2-533
CK, CK Differential Slew Rate
1.5 V/ns
2.0 V/ns
tIS
1.0 V/ns
tIS tIH
△
tIH
tIS
tIH
△
△
△
△
△
Units
Notes
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.25
0.2
0.15
0.1
+187
+179
+167
+150
+125
+83
+94
+217
+209
+197
+180
+155
+113
+30
+124
+119
+113
+105
+75
+247
+239
+227
+210
+185
+143
+60
+154
+149
+143
+135
+105
+81
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
+89
+83
+75
+45
+21
0
+51
+0
+30
+60
-11
-14
+19
+16
+49
+46
Command /
Address
Slew
-25
-31
+5
-1
+35
+29
-43
-54
-13
-24
+17
+6
rate(V/ns)
-67
-83
-37
-53
-7
-23
-110
-175
-285
-350
-525
-800
-1450
-125
-188
-292
-375
-500
-708
-1125
-80
-95
-80
-65
-145
-255
-320
-495
-770
-1420
-158
-262
-345
-470
-678
-1095
-115
-225
-290
-465
-740
-1390
-128
-232
-315
-440
-648
-1065
Rev. 0.7 / Nov. 2008
35
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
tIS, tIH Derating Values for DDR2-667, DDR2-800
CK, CK Differential Slew Rate
1.5 V/ns
2.0 V/ns
tIS
1.0 V/ns
tIS tIH
△
tIH
tIS
tIH
△
△
△
△
△
Units
Notes
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.25
0.2
0.15
0.1
+15
+94
+180
+173
+163
+150
+130
+97
+30
+25
+17
+8
+124
+119
+113
+105
+75
+210
+203
+193
+180
+150
+127
+60
+154
+149
+143
+135
+105
+81
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
+143
+133
+120
+100
+67
0
+89
+83
+75
+45
+21
0
+51
+30
+60
-5
-14
+16
+55
+46
Command /
Address
Slew
-13
-31
-1
+47
+29
-22
-54
-24
+38
+6
rate(V/ns)
-34
-83
-4
-53
+26
-23
-60
-125
-188
-292
-375
-500
-708
-1125
-30
-95
0
-65
-100
-168
-200
-325
-517
-1000
-70
-158
-262
-345
-470
-678
-1095
-40
-128
-232
-315
-440
-648
-1065
-138
-170
-395
-487
-970
-108
-140
-265
-457
-940
1) For all input signals the total tIS(setup time) and tIH(hold) time) required is calculated by adding the
datasheet value to the derating value listed in above Table.
Setup(tIS) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of
V
(dc) and the first crossing of V (ac)min. Setup(tIS) nominal slew rate for a falling signal is defined as
REF
IH
the slew rate between the last crossing of VREF(dc) and the first crossing of V (ac)max. If the actual signal is
IL
always earlier than the nominal slew rate for line between shaded ‘V (dc) to ac region’, use nominal slew
REF
rate for derating value(see fig a.) If the actual signal is later than the nominal slew rate line anywhere
between shaded ‘V (dc) to ac region’, the slew rate of a tangent line to the actual signal from the ac level
REF
to dc level is used for derating value(see Fig b.)
Hold(tIH) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of
VIL(dc)max and the first crossing of V (dc). Hold(tIH) nominal slew rate for a falling signal is defined as the
REF
slew rate between the last crossing of V (dc). If the actual signalis always later than the nominal slew rate
REF
line between shaded ‘dc to V (dc) region’, use nominal slew rate for derating value(see Fig.c) If the actual
REF
signal is earlier than the nominal slew rate line anywhere between shaded ‘dc to V (dc) region’, the slew
REF
rate of a tangent line to the actual signal from the dc level to V (dc) level is used for derating value(see Fig
REF
d.)
Although for slow rates the total setup time might be negative(i.e. a valid input signal will not have reached
V
(ac) at the time of the rising clock transition) a valid input signal is still required to complete the transi-
IH/IL
tion and reach V
(ac).
IH/IL
For slew rates in between the values listed in table, the derating values may obtained by linear interpolation.
These values are typically not subject to production test. They are verified by design and characterization.
Rev. 0.7 / Nov. 2008
36
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
10. The maximum limit for this parameter is not a device limit. The device will operate with a greater value for
this parameter, but system performance (bus turnaround) will degrade accordingly.
11. MIN (t CL, t CH) refers to the smaller of the actual clock LOW time and the actual clock HIGH time as
provided to the device (i.e. this value can be greater than the minimum specification limits for t CL and t CH).
For example, t CL and t CH are = 50% of the period, less the half period jitter (t JIT(HP)) of the clock source,
and less the half period jitter due to crosstalk (t JIT(crosstalk)) into the clock traces.
12. t QH = t HP – t QHS, where:
tHP = minimum half clock period for any given cycle and is defined by clock HIGH or clock LOW (tCH, tCL).
tQHS accounts for:
1) The pulse duration distortion of on-chip clock circuits; and
2) The worst case push-out of DQS on one transition followed by the worst case pull-in of DQ on the
next transition, both of which are, separately, due to data pin skew and output pattern effects, and
p-channel to n-channel variation of the output drivers.
13. tDQSQ: Consists of data pin skew and output pattern effects, and p-channel to n-channel variation of the
output drivers as well as output slew rate mismatch between DQS/ DQS and associated DQ in any given cycle.
14. t DAL = (nWR) + (tRP/tCK):
For each of the terms above, if not already an integer, round to the next highest integer. tCK refers to the appli-
cation clock period. nWR refers to the t WR parameter stored in the MR.
Example: For DDR533 at t CK = 3.75 ns with t WR programmed to 4 clocks. tDAL = 4 + (15 ns / 3.75 ns)
clocks =4 +(4)clocks=8clocks.
15. The clock frequency is allowed to change during self–refresh mode or precharge power-down mode.
In case of clock frequency change during precharge power-down, a specific procedure is required as described
in section 2.9.
16. ODT turn on time min is when the device leaves high impedance and ODT resistance begins to turn on.
ODT turn on time max is when the ODT resistance is fully on. Both are measured from tAOND.
17. ODT turn off time min is when the device starts to turn off ODT resistance.
ODT turn off time max is when the bus is in high impedance. Both are measured from tAOFD.
18. tHZ and tLZ transitions occur in the same access time as valid data transitions. Thesed parameters are
referenced to a specific voltage level which specifies when the device output is no longer driving (tHZ), or
begins driving (tLZ). Below figure shows a method to calculate the point when device is no longer driving
(tHZ), or begins driving (tLZ) by measuring the signal at two different voltages. The actual voltage measure-
ment points are not critical as long as the calculation is consistent.
Rev. 0.7 / Nov. 2008
37
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
19. tRPST end point and tRPRE begin point are not referenced to a specific voltage level but specify when
the device output is no longer driving (tRPST), or begins driving (tRPRE). Below figure shows a method to
calculate these points when the device is no longer driving (tRPST), or begins driving (tRPRE). Below Fig-
ure shows a method to calculate these points when the device is no longer driving (tRPST), or begins driv-
ing (tRPRE) by measuring the signal at two different voltages. The actual voltage measurement points are
not critical as long as the calculation is consistent.
VOH + xmV
VTT + 2xmV
VTT + xmV
VOH + 2xmV
tHZ
tLZ
tRPST end point
tRPRE begin point
T1
T2
VOL + 1xmV
VOL + 2xmV
VTT -xmV
T1
VTT - 2xmV
T2
tHZ , tRPST end point = 2*T1-T2
tLZ , tRPRE begin point = 2*T1-T2
20. Input waveform timing with differential data strobe enabled MR[bit10] =0, is referenced from the input
signal crossing at the V (ac) level to the differential data strobe crosspoint for a rising signal, and from
IH
the input signal crossing at the V (ac) level to the differential data strobe crosspoint for a falling signal
IL
applied to the device under test.
21. Input waveform timing with differential data strobe enabled MR[bit10]=0, is referenced from the input
signal crossing at the V (dc) level to the differential data strobe crosspoint for a rising signal and V (dc)
IH
IL
to the differential data strobe crosspoint for a falling signal applied to the device under test.
Differential Input waveform timing
DQS
DQS
tDS tDH
tDS tDH
VDDQ
VIH(ac)min
VIH(dc)min
VREF(dc)
VIL(dc)max
VIL(ac)max
VSS
Rev. 0.7 / Nov. 2008
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HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
22. Input waveform timing is referenced from the input signal crossing at the V (ac) level for a rising sig-
IH
nal and V (ac) for a falling signal applied to the device under test.
IL
23. Input waveform timing is referenced from the input signal crossing at the V (dc) level for a rising sig-
IL
nal and V (dc) for a falling signal applied to the device under test.
IH
24. tWTR is at least two clocks (2 x tCK or 2 x nCK) independent of operation frequency.
25. Input waveform timing with single-ended data strobe enabled MR[bit10] = 1, is referenced from the
input signal crossing at the VIH (ac) level to the single-ended data strobe crossing VIH/L (dc) at the start
of its transition for a rising signal, and from the input signal crossing at the VIL (ac) level to the single-
ended data strobe crossing VIH/L (dc) at the start of its transition for a falling signal applied to the device
under test. The DQS signal must be monotonic between Vil(dc)max and Vih (dc) min.
26. Input waveform timing with single-ended data strobe enabled MR[bit10] = 1, is referenced from the
input signal crossing at the VIH(dc) level to the single-ended data strobe crossing VIH/L(ac) at the end of
its transition for a rising signal, and from the input signal crossing at the VIL(dc) level to the single-ended
data strobe crossing VIH/L(ac) at the end of its transition for a falling signal applied to the device under
test. The DQS signal must be monotonic between Vil(dc)max and Vih (dc) min.
27. tCKEmin of 3 clocks means CKE must be registered on three consecutive positive clock edges. CKE
must remain at the valid input level the entire time it takes to achieve the 3 clocks of registration. Thus,
after any CKE transition, CKE may not transition from its valid level during the time period of tIS + 2 x tCK
+ tIH.
28. If tDS or tDH is violated, data corruption may occur and the data must be re-written with valid data
before a valid READ can be executed.
29. These parameters are measured from a command/address signal (CKE, CS, RAS, CAS, WE, ODT, BA0,
A0, A1, etc.) transition edge to its respective clock signal (CK/CK) crossing. The spec values are not
affected by the amount of clock jitter applied (i.e. tJIT (per), tJIT (cc), etc.), as the setup and hold are rel-
ative to the clock signal crossing that latches the command/address. That is, these parameters should be
met whether clock jitter is present or not.
30. These parameters are measured from a data strobe signal ((L/U/R)DQS/DQS) crossing to its respective
clock signal (CK/CK) crossing. The spec values are not affected by the amount of clock jitter applied (i.e.
tJIT (per), tJIT (cc), etc.), as these are relative to the clock signal crossing. That is, these parameters
should be met whether clock jitter is present or not.
31. These parameters are measured from a data signal ((L/U) DM, (L/U) DQ0, (L/U) DQ1, etc.) transition
edge to its respective data strobe signal ((L/U/R)DQS/DQS) crossing.
32. For these parameters, the DDR2 SDRAM device is characterized and verified to support
tnPARAM = RU {tPARAM / tCK (avg)}, which is in clock cycles, assuming all input clock jitter specifications
Rev. 0.7 / Nov. 2008
39
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
are satisfied.
For example, the device will support tnRP = RU {tRP / tCK (avg)}, which is in clock cycles, if all input clock
jitter specifications are met. This means: For DDR2-667 5-5-5, of which tRP = 15ns, the device will support
tnRP =RU {tRP / tCK (avg)} = 5, i.e. as long as the input clock jitter specifications are met, Precharge
command at Tm and Active command at Tm+5 is valid even if (Tm+5 - Tm) is less than 15ns due to input
clock jitter.
33. tDAL [nCK] = WR [nCK] + tnRP [nCK] = WR + RU {tRP [ps] / tCK (avg) [ps]}, where WR is the value
programmed in the mode register set.
34. New units, ‘tCK (avg)’ and ‘nCK’, are introduced in DDR2-667 and DDR2-800.
Unit ‘tCK (avg)’ represents the actual tCK (avg) of the input clock under operation.
Unit ‘nCK’, represents one clock cycle of the input clock, counting the actual clock edges.
Note that in DDR2-400 and DDR2-533, ‘tCK’, is used for both concepts.
ex) tXP = 2 [nCK] means; if Power Down exit is registered at Tm, an Active command may be registered
at Tm+2, even if (Tm+2 - Tm) is 2 x tCK (avg) + tERR(2per),min.
35. Input clock jitter spec parameter. These parameters and the ones in the table below are referred to as
'input clock jitter spec parameters' and these parameters apply to DDR2-667 and DDR2-800 only. The jitter
specified is a random jitter meeting a Gaussian distribution.
DDR2-667
DDR2-800
Parameter
Symbol
tJIT (per)
Units
Notes
min
max
125
100
250
min
max
100
80
Clock period jitter
-125
-100
-250
-100
-80
ps
ps
ps
35
35
35
Clock period jitter during DLL locking period tJIT (per, lck)
Cycle to cycle clock period jitter
tJIT (cc)
-200
200
Cycle to cycle clock period jitter during DLL
locking period
tJIT (cc, lck)
-200
200
-160
160
ps
35
Cumulative error across 2 cycles
Cumulative error across 3 cycles
Cumulative error across 4 cycles
Cumulative error across 5 cycles
tERR(2per)
tERR(3per)
tERR(4per)
tERR(5per)
-175
-225
-250
-250
175
225
250
250
-150
-175
-200
-200
150
175
200
200
ps
ps
ps
ps
35
35
35
35
Cumulative error across n cycles,
n=6...10, inclusive
tERR(6~10per)
-350
350
-300
300
ps
35
Cumulative error across n cycles,
n=11...50, inclusive
tERR(11~50per)
tJIT (duty)
-450
-125
450
125
-450
-100
450
100
ps
ps
35
35
Duty cycle jitter
Rev. 0.7 / Nov. 2008
40
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
36. These parameters are specified per their average values, however it is understood that the following
relationship between the average timing and the absolute instantaneous timing holds at all times. (Min and
max of SPEC values are to be used for calculations in the table below.)
Parameter
Symbol
min
max
Units
Absolute clock period
tCK (abs)
tCK (avg), min + tJIT (per), min tCK (avg), max + tJIT (per), max
ps
tCH (avg), min* CK (avg), min + tCH (avg), max* tCK (avg), max
Absolute clock HIGH pulse width
Absolute clock LOW pulse width
tCH (abs)
tCL (abs)
ps
ps
tJIT (per), min
+ tJIT(per), max
tCL (avg), min* tCK (avg), min + tCL (avg), max* tCK (avg), max +
tJIT (per), min tJIT (per), max
Example: For DDR2-667, tCH (abs), min = (0.48 x 3000 ps) - 125 ps = 1315 ps
37. tHP is the minimum of the absolute half period of the actual input clock. tHP is an input parameter but
not an input specification parameter. It is used in conjunction with tQHS to derive the DRAM output timing
tQH.
The value to be used for tQH calculation is determined by the following equation;
tHP = Min (tCH (abs), tCL (abs)),
where,
tCH (abs) is the minimum of the actual instantaneous clock HIGH time;
tCL (abs) is the minimum of the actual instantaneous clock LOW time;
38. tQHS accounts for:
1) The pulse duration distortion of on-chip clock circuits, which represents how well the actual tHP at the
input is transferred to the output; and
2) The worst case push-out of DQS on one transition followed by the worst case pull-in of DQ on the next
transition, both of which are independent of each other, due to data pin skew, output pattern effects, and
p-channel to n-channel variation of the output drivers
39. tQH = tHP? tQHS, where:
tHP is the minimum of the absolute half period of the actual input clock; and
tQHS is the specification value under the max column.
{The less half-pulse width distortion present, the larger the tQH value is; and the larger the valid data eye
will be.}
Examples:
1) If the system provides tHP of 1315 ps into a DDR2-667 SDRAM, the DRAM provides tQH of 975 ps min-
imum.
2) If the system provides tHP of 1420 ps into a DDR2-667 SDRAM, the DRAM provides tQH of 1080 ps
minimum.
40. When the device is operated with input clock jitter, this parameter needs to be derated by the actual
tERR(6-10per) of the input clock. (output deratings are relative to the SDRAM input clock.)
For example, if the measured jitter into a DDR2-667 SDRAM has tERR(6-10per),min = - 272 ps and
tERR(6-10per), max = + 293 ps, then tDQSCK, min (derated) = tDQSCK, min - tERR(6-10per),max = -
400 ps - 293 ps = - 693 ps and tDQSCK, max (derated) = tDQSCK, max - tERR(6-10per),min = 400 ps +
Rev. 0.7 / Nov. 2008
41
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
272 ps = + 672 ps. Similarly, tLZ (DQ) for DDR2-667 derates to tLZ (DQ), min (derated) = - 900 ps - 293
ps = - 1193 ps and tLZ (DQ), max (derated) = 450 ps + 272 ps = + 722 ps. (Caution on the min/max
usage!)
41. When the device is operated with input clock jitter, this parameter needs to be derated by the actual
tJIT (per) of the input clock. (output deratings are relative to the SDRAM input clock.)
For example, if the measured jitter into a DDR2-667 SDRAM has tJIT (per), min = - 72 ps and tJIT (per),
max = + 93 ps, then tRPRE, min (derated) = tRPRE, min + tJIT (per), min = 0.9 x tCK (avg) - 72 ps = +
2178 ps and tRPRE, max (derated) = tRPRE, max + tJIT (per), max = 1.1 x tCK (avg) + 93 ps = + 2843
ps. (Caution on the min/max usage!)
42. When the device is operated with input clock jitter, this parameter needs to be derated by the actual
tJIT (duty) of the input clock. (output deratings are relative to the SDRAM input clock.)
For example, if the measured jitter into a DDR2-667 SDRAM has tJIT (duty), min = - 72 ps and tJIT (duty),
max = + 93 ps, then tRPST, min (derated) = tRPST, min + tJIT (duty), min = 0.4 x tCK (avg) - 72 ps = +
928 ps and tRPST, max (derated) = tRPST, max + tJIT (duty), max = 0.6 x tCK (avg) + 93 ps = + 1592 ps.
(Caution on the min/max usage!)
43. When the device is operated with input clock jitter, this parameter needs to be derated by {-
tJIT (duty), max - tERR(6-10per),max} and {- tJIT (duty), min - tERR(6-10per),min} of the actual input
clock.(output deratings are relative to the SDRAM input clock.)
For example, if the measured jitter into a DDR2-667 SDRAM has tERR(6-10per),min = - 272 ps, tERR(6-
10per), max = + 293 ps, tJIT (duty), min = - 106 ps and tJIT (duty), max = + 94 ps, then tAOF, min (der-
ated) = tAOF, min + {- tJIT (duty), max - tERR(6-10per),max} = - 450 ps + {- 94 ps - 293 ps} = - 837 ps
and tAOF, max (derated) = tAOF, max + {- tJIT (duty), min - tERR(6-10per),min} = 1050 ps + {106 ps +
272 ps} = + 1428 ps. (Caution on the min/max usage!)
44. For tAOFD of DDR2-400/533, the 1/2 clock of tCK in the 2.5 x tCK assumes a tCH, input clock HIGH
pulse width of 0.5 relative to tCK. tAOF, min and tAOF, max should each be derated by the same amount
as the actual amount of tCH offset present at the DRAM input with respect to 0.5. For example, if an input
clock has a worst case tCH of 0.45, the tAOF, min should be derated by subtracting 0.05 x tCK from it,
whereas if an input clock has a worst case tCH of 0.55, the tAOF, max should be derated by adding 0.05 x
tCK to it. Therefore, we have;
tAOF, min (derated) = tAC, min - [0.5 - Min(0.5, tCH, min)] x tCK
tAOF, max (derated) = tAC, max + 0.6 + [Max(0.5, tCH, max) - 0.5] x tCK
or
tAOF, min (derated) = Min (tAC, min, tAC, min - [0.5 - tCH, min] x tCK)
tAOF, max (derated) = 0.6 + Max (tAC, max, tAC, max + [tCH, max - 0.5] x tCK)
where tCH, min and tCH, max are the minimum and maximum of tCH actually measured at the DRAM
input balls.
45. For tAOFD of DDR2-667/800, the 1/2 clock of nCK in the 2.5 x nCK assumes a tCH (avg), average input
clock HIGH pulse width of 0.5 relative to tCK (avg). tAOF, min and tAOF, max should each be derated by
the same amount as the actual amount of tCH (avg) offset present at the DRAM input with respect to 0.5.
For example, if an input clock has a worst case tCH (avg) of 0.48, the tAOF, min should be derated by sub-
Rev. 0.7 / Nov. 2008
42
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
tracting 0.02 x tCK (avg) from it, whereas if an input clock has a worst case tCH (avg) of 0.52, the tAOF,
max should be derated by adding 0.02 x tCK (avg) to it. Therefore, we have;
tAOF, min (derated) = tAC, min - [0.5 - Min(0.5, tCH (avg), min)] x tCK (avg)
tAOF, max (derated) = tAC, max + 0.6 + [Max(0.5, tCH (avg), max) - 0.5] x tCK (avg)
or
tAOF, min (derated) = Min (tAC, min, tAC, min - [0.5 - tCH (avg), min] x tCK (avg))
tAOF, max (derated) = 0.6 + Max (tAC, max, tAC, max + [tCH (avg), max - 0.5] x tCK (avg))
where tCH (avg), min and tCH (avg), max are the minimum and maximum of tCH (avg) actually measured
at the DRAM input balls.
Note that these deratings are in addition to the tAOF derating per input clock jitter, i.e. tJIT (duty) and
tERR(6-10per). However tAC values used in the equations shown above are from the timing parameter
table and are not derated. Thus the final derated values for tAOF are;
tAOF, min (derated_final) = tAOF, min (derated) + {- tJIT (duty), max - tERR(6-10per),max}
tAOF, max (derated_final) = tAOF, max (derated) + {- tJIT (duty), min - tERR(6-10per),min}
Rev. 0.7 / Nov. 2008
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HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
5. Package Dimensions
Package Dimension(x4,x8)
60Ball Fine Pitch Ball Grid Array Outline
8.00 ± 0.10
A1 BALL MARK
2-R0.13MAX
< Top View>
< SIDE View>
1.10 ± 0.10
0.34 ± 0.05
0.80 X 8 = 6.40
2.10 ± 0.10
A1 BALL MARK
8
9
7
3 2 1
A
B
C
D
E
F
G
H
J
K
L
60X Φ0.45 ± 0.05
1.60 1.60
0.80
< Bottom View>
Note: All dim ensions are in m illim eters.
Rev. 0.7 / Nov. 2008
44
HY5PS1G4(8,16)31C(L)FP
HY5PS1G4(8,16)31CFR
Package Dimension(x16)
84Ball Fine Pitch Ball Grid Array Outline
8.00 ± 0.10
A1 BALL MARK
2-R0.13MAX
< Top View>
< SIDE View>
1.10 ± 0.10
0.34 ± 0.05
0.80 X 8 = 6.40
2.10 ± 0.10
A1 BALL MARK
3 2 1
9
8 7
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.80
84X Φ0.45 ± 0.05
1.60 1.60
< Bottom View>
Note: All dim ensions are in m illim eters.
45
Rev. 0.7 / Nov. 2008
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