ICS8305AGIT [ICSI]

LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER; 低偏移, 1到4 ,差分复用/ LVCMOS - TO- LVCMOS / LVTTL扇出缓冲器
ICS8305AGIT
型号: ICS8305AGIT
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER
低偏移, 1到4 ,差分复用/ LVCMOS - TO- LVCMOS / LVTTL扇出缓冲器

逻辑集成电路 光电二极管 驱动
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ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
GENERAL DESCRIPTION  
FEATURES  
The ICS8305I is a low skew, 1-to-4, Differential/ • 4 LVCMOS/LVTTL outputs  
ICS  
LVCMOS-to-LVCMOS/LVTTL Fanout Buffer and a  
• Selectable differential or LVCMOS/LVTTL clock inputs  
HiPerClockS™  
member of the HiPerClockS™ family of High  
Performance Clock Solutions from ICS. The  
ICS8305I has selectable clock inputs that accept  
CLK, nCLK pair can accept the following differential  
input levels: LVPECL, LVDS, LVHSTL, HCSL, SSTL  
either differential or single ended input levels.The clock enable is  
internally synchronized to eliminate runt pulses on the outputs  
during asynchronous assertion/deassertion of the clock enable  
pin. Outputs are forced LOW when the clock is disabled. A sepa-  
rate output enable pin controls whether the outputs are in the  
active or high impedance state.  
LVCMOS_CLK supports the following input types:  
LVCMOS, LVTTL  
• Maximum output frequency: 350MHz  
• Output skew: 40ps (maximum)  
• Part-to-part skew: 700ps (maximum)  
Additive phase jitter, RMS: 0.04ps (typical)  
• 3.3V core, 3.3V, 2.5V or 1.8V output operating supply  
• -40°C to 85°C ambient operating temperature  
• Lead-Free package fully RoHS compliant  
Guaranteed output and part-to-part skew characteristics make  
the ICS8305I ideal for those applications demanding well de-  
fined performance and repeatability.  
BLOCK DIAGRAM  
PIN ASSIGNMENT  
1
2
3
4
5
6
7
8
GND  
OE  
VDD  
16  
15  
14  
13  
12  
11  
10  
9
Q0  
VDDO  
Q1  
GND  
Q2  
VDDO  
Q3  
CLK_EN  
D
Q
LE  
CLK_EN  
CLK  
nCLK  
CLK_SEL  
LVCMOS_CLK  
LVCMOS_CLK  
0
Q0  
Q1  
Q2  
Q3  
CLK  
nCLK  
1
GND  
CLK_SEL  
ICS8305I  
16-LeadTSSOP  
4.4mm x 3.0mm x 0.92mm package body  
G Package  
Top View  
OE  
8305AGI  
www.icst.com/products/hiperclocks.html  
REV. B MAY 19, 2005  
1
ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
TABLE 1. PIN DESCRIPTIONS  
Number  
Name  
Type  
Description  
1, 9, 13  
GND  
Power  
Input  
Power supply ground.  
Output enable. When LOW, outputs are in HIGH impedance state.  
When HIGH, outputs are active. LVCMOS / LVTTL interface levels.  
2
3
OE  
VDD  
Pullup  
Power  
Core supply pin.  
Synchronizing clock enable. When LOW, the output clocks are  
disabled. When HIGH, output clocks are enabled.  
LVCMOS / LVTTL interface levels.  
4
CLK_EN  
Input  
Pullup  
5
6
CLK  
Input Pulldown Non-inverting differential clock input.  
Pullup/  
nCLK  
Input  
Input  
Inverting differential clock input. VDD/2 default when left floating.  
Pulldown  
Pullup  
Clock select input. When HIGH, selects CLK, nCLK inputs.  
When LOW, selects LVCMOS_CLK input.  
LVCMOS / LVTTL interface levels.  
7
8
CLK_SEL  
LVCMOS_CLK  
Input Pulldown LVCMOS / LVTTL clock input.  
10, 12, 14, 16 Q3, Q2, Q1, Q0 Output  
11, 15 VDDO Power  
Clock outputs. LVCMOS / LVTTL interface levels.  
Output supply pins.  
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.  
TABLE 2. PIN CHARACTERISTICS  
Units  
pF  
Symbol Parameter  
Test Conditions  
Minimum Typical Maximum  
CIN  
Input Capacitance  
Input Pullup Resistor  
4
RPULLUP  
51  
51  
kΩ  
RPULLDOWN Input Pulldown Resistor  
kΩ  
Power Dissipation Capacitance  
(per output)  
CPD  
11  
pF  
ROUT  
Output Impedance  
5
7
12  
Ω
8305AGI  
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REV. B MAY 19, 2005  
2
ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
TABLE 3A. CONTROL INPUT FUNCTION TABLE  
Inputs  
CLK_SEL  
Outputs  
OE  
1
CLK_EN  
Selected Source  
LVCMOS_CLK  
CLK, nCLK  
Q0:Q3  
Disabled; LOW  
Disabled; LOW  
Enabled  
0
0
1
1
X
0
1
0
1
X
1
1
LVCMOS_CLK  
CLK, nCLK  
1
Enabled  
0
HiZ  
NOTE: After CLK_EN switches, the clock outputs are disabled or enabled following a rising and falling input clock edge  
as shown in Figure 1.  
Enabled  
Disabled  
nCLK  
CLK,  
LVCMOS_CLK  
CLK_EN  
Q0:Q3  
FIGURE 1. CLK_EN TIMING DIAGRAM  
8305AGI  
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REV. B MAY 19, 2005  
3
ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
ABSOLUTE MAXIMUM RATINGS  
SupplyVoltage, V  
4.6V  
NOTE: Stresses beyond those listed under Absolute  
Maximum Ratings may cause permanent damage to the  
DD  
Inputs, V  
-0.5V toVDD + 0.5 V  
-0.5V to VDDO + 0.5V  
89°C/W (0 lfpm)  
-65°C to 150°C  
I
device.These ratings are stress specifications only.Functional  
operation of product at these conditions or any conditions be-  
yond those listed in the DC Characteristics or AC Character-  
istics is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect product reliability.  
Outputs, VO  
PackageThermal Impedance, θ  
JA  
StorageTemperature,T  
STG  
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V 5ꢀ, TA = -40°C TO 85°C  
Symbol  
Parameter  
Test Conditions  
Minimum  
3.135  
Typical  
3.3  
Maximum Units  
VDD  
Core Supply Voltage  
3.465  
3.465  
2.625  
1.95  
21  
V
V
3.135  
3.3  
VDDO  
Output Supply Voltage  
2.375  
2.5  
V
1.65  
1.8  
V
IDD  
Power Supply Current  
Output Supply Current  
mA  
mA  
IDDO  
5
TABLE 4B. LVCMOS/LVTTL DC CHARACTERISTICS, VDD = 3.3V 5ꢀ, TA = -40°C TO 85°C  
Symbol Parameter  
Test Conditions  
Minimum Typical Maximum Units  
CLK_EN, CLK_SEL, OE  
LVCMOS_CLK  
2
VDD + 0.3  
VDD + 0.3  
0.8  
V
V
Input  
VIH  
High Voltage  
2
CLK_EN, CLK_SEL, OE  
LVCMOS_CLK  
-0.3  
-0.3  
V
Input  
VIL  
Low Voltage  
1.3  
V
CLK_EN, CLK_SEL, OE  
LVCMOS_CLK  
VDD = VIN = 3.465V  
VDD = VIN = 3.465V  
VDD = 3.465V, VIN = 0V  
VDD = 3.465V, VIN = 0V  
VDDO = 3.3V 5ꢀ  
5
µA  
µA  
µA  
µA  
V
Input  
IIH  
High Current  
150  
CLK_EN, CLK_SEL, OE  
LVCMOS_CLK  
-150  
-5  
Input  
IIL  
Low Current  
2.6  
VOH  
Output High Voltage; NOTE 1  
VDDO = 2.5V 5ꢀ  
1.8  
V
VDDO = 1.8V 0.15V  
VDDO - 0.3  
V
V
DDO = 3.3V 5ꢀ  
0.5  
0.5  
0.4  
V
VOL  
Output Low Voltage; NOTE 1  
VDDO = 2.5V 5ꢀ  
V
VDDO = 1.8V 0.15V  
V
IOZL  
IOZH  
Output Tristate Current Low  
Output Tristate Current High  
-5  
µA  
µA  
5
NOTE 1: Outputs terminated with 50Ω to VDDO/2. See Parameter Measurement Information, Output Load Test Circuit.  
8305AGI  
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REV. B MAY 19, 2005  
4
ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
TABLE 4C. DIFFERENTIAL DC CHARACTERISTICS, VDD = 3.3V 5ꢀ, TA = -40°C TO 85°C  
Symbol Parameter  
IIH Input High Current  
Test Conditions  
VIN = VDD = 3.465V  
VIN = VDD = 3.465V  
IN = 0V, VDD = 3.465V  
IN = 0V, VDD = 3.465V  
Minimum Typical Maximum Units  
nCLK  
CLK  
150  
150  
µA  
µA  
µA  
µA  
V
nCLK  
CLK  
V
V
-150  
-5  
IIL  
Input Low Current  
VPP  
Peak-to-Peak Input Voltage  
0.15  
1.3  
Common Mode Input Voltage;  
NOTE 1, 2  
VCMR  
GND + 0.5  
VDD - 0.85  
V
NOTE 1: For single ended applications, the maximum input voltage for CLK, nCLK is VDD + 0.3V.  
NOTE 2: Common mode voltage is defined as VIH.  
TABLE 5A. AC CHARACTERISTICS, VDD = VDDO = 3.3V 5ꢀ, TA = -40°C TO 85°C  
Symbol Parameter  
fMAX Output Frequency  
Test Conditions  
Ref = CLK/nCLK  
Minimum Typical Maximum Units  
350  
300  
MHz  
MHz  
Ref = LVCMOS_CLK  
LVCMOS_CLK;  
Propagation Delay, NOTE 1A  
tpLH  
1.75  
2.8  
ns  
Low to High  
CLK, nCLK;  
NOTE 1B  
tsk(o)  
Output Skew; NOTE 2, 6  
Measured on the Rising Edge  
40  
ps  
ps  
tsk(pp)  
Part-to-Part Skew; NOTE 3, 6  
700  
Buffer Additive Phase Jitter, RMS;  
refer to Additive Phase Jitter section,  
NOTE 5  
tjit  
0.04  
ps  
tR / tF  
odc  
Output Rise/Fall Time  
20ꢀ to 80ꢀ  
ƒ200MHz  
ƒ> 200MHz  
100  
45  
700  
55  
58  
5
ps  
Output Duty Cycle  
42  
tEN  
Output Enable Time; NOTE 4  
Output Disable Time; NOTE 4  
ns  
ns  
tDIS  
5
NOTE 1A: Measured from the VDD/2 of the input to VDDO/2 of the output.  
NOTE 1B: Measured from the differential input crossing point to VDDO/2 of the output.  
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.  
Measured at VDDO/2.  
NOTE 3: Defined as skew between outputs on different devices operating a the same supply voltages and  
with equal load conditions. Using the same type of input on each device, the output is measured at VDDO/2.  
NOTE 4: These parameters are guaranteed by characterization. Not tested in production.  
NOTE 5: Driving only one input clock.  
NOTE 6: This parameter is defined in accordance with JEDEC Standard 65.  
8305AGI  
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REV. B MAY 19, 2005  
5
ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
TABLE 5B. AC CHARACTERISTICS, VDD = 3.3V 5ꢀ, VDDO = 2.5V 5ꢀ, TA = -40°C TO 85°C  
Symbol Parameter  
fMAX Output Frequency  
Test Conditions  
Ref = CLK/nCLK  
Minimum Typical Maximum Units  
350  
300  
MHz  
MHz  
Ref = LVCMOS_CLK  
LVCMOS_CLK;  
Propagation Delay, NOTE 1A  
tpLH  
1.75  
2.95  
ns  
Low to High  
CLK, nCLK;  
NOTE 1B  
tsk(o)  
Output Skew; NOTE 2, 6  
Measured on the Rising Edge  
40  
ps  
ps  
tsk(pp)  
Part-to-Part Skew; NOTE 3, 6  
800  
Buffer Additive Phase Jitter, RMS;  
refer to Additive Phase Jitter section,  
NOTE 5  
tjit  
0.04  
ps  
tR / tF  
odc  
Output Rise/Fall Time  
20ꢀ to 80ꢀ  
ƒ166MHz  
f > 166MHz  
100  
45  
700  
55  
58  
5
ps  
Output Duty Cycle  
42  
tEN  
Output Enable Time; NOTE 4  
Output Disable Time; NOTE 4  
ns  
ns  
tDIS  
5
NOTE 1A: Measured from the VDD/2 of the input to VDDO/2 of the output.  
NOTE 1B: Measured from the differential input crossing point to VDDO/2 of the output.  
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
NOTE 3: Defined as skew between outputs on different devices operating a the same supply voltages and  
with equal load conditions. Using the same type of input on each device, the output is measured at VDDO/2.  
NOTE 4: These parameters are guaranteed by characterization. Not tested in production.  
NOTE 5: Driving only one input clock.  
NOTE 6: This parameter is defined in accordance with JEDEC Standard 65.  
TABLE 5C. AC CHARACTERISTICS, VDD = 3.3V 5ꢀ, VDDO = 1.8V -0.15V, TA = -40°C TO 85°C  
Symbol Parameter  
fMAX Output Frequency  
Test Conditions  
Ref = CLK/nCLK  
Minimum Typical Maximum Units  
350  
300  
MHz  
MHz  
Ref = LVCMOS_CLK  
LVCMOS_CLK;  
Propagation Delay, NOTE 1A  
tpLH  
1.75  
3.7  
ns  
Low to High  
CLK, nCLK;  
NOTE 1B  
tsk(o)  
Output Skew; NOTE 2, 6  
Measured on the Rising Edge  
45  
ps  
ps  
tsk(pp)  
Part-to-Part Skew; NOTE 3, 6  
900  
Buffer Additive Phase Jitter, RMS;  
refer to Additive Phase Jitter section,  
NOTE 5  
tjit  
0.04  
ps  
tR / tF  
odc  
Output Rise/Fall Time  
20ꢀ to 80ꢀ  
ƒ166MHz  
f > 166MHz  
100  
45  
700  
55  
58  
5
ps  
Output Duty Cycle  
42  
tEN  
Output Enable Time; NOTE 4  
Output Disable Time; NOTE 4  
ns  
ns  
tDIS  
5
For notes, see Table 5B.  
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REV. B MAY 19, 2005  
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ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
ADDITIVE PHASE JITTER  
the 1Hz band to the power in the fundamental. When the re-  
quired offset is specified, the phase noise is called a dBc value,  
which simply means dBm at a specified offset from the funda-  
mental. By investigating jitter in the frequency domain, we get a  
better understanding of its effects on the desired application over  
the entire time record of the signal. It is mathematically possible  
to calculate an expected bit error rate given a phase noise plot.  
The spectral purity in a band at a specific offset from the funda-  
mental compared to the power of the fundamental is called the  
dBc Phase Noise. This value is normally expressed using a  
Phase noise plot and is most often the specified plot in many  
applications. Phase noise is defined as the ratio of the noise  
power present in a 1Hz band at a specified offset from the fun-  
damental frequency to the power value of the fundamental.This  
ratio is expressed in decibels (dBm) or a ratio of the power in  
0
Input/Output Additive  
Phase Jitter at 155.52MHz  
= 0.04ps typical  
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
-110  
-120  
-130  
-140  
-150  
-160  
-170  
-180  
-190  
100  
1k  
10k  
100k  
1M  
10M  
100M  
OFFSET FROM CARRIER FREQUENCY (HZ)  
As with most timing specifications, phase noise measurements vice meets the noise floor of what is shown, but can actually be  
have issues.The primary issue relates to the limitations of the lower. The phase noise is dependant on the input source and  
equipment. Often the noise floor of the equipment is higher than measurement equipment.  
the noise floor of the device. This is illustrated above. The de-  
8305AGI  
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REV. B MAY 19, 2005  
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ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
PARAMETER MEASUREMENT INFORMATION  
1.65V 5ꢀ  
2.05V 5ꢀ 1.25V 5ꢀ  
SCOPE  
SCOPE  
VDD  
VDD  
VDDO  
,
VDDO  
Qx  
Qx  
LVCMOS  
GND  
LVCMOS  
GND  
-1.65V 5ꢀ  
-1.25V 5ꢀ  
3.3V CORE/2.5V OUTPUT LOAD AC TEST CIRCUIT  
3.3V CORE/3.3V OUTPUT LOAD AC TEST CIRCUIT  
2.4V 0.09V  
0.9V 0.075V  
VDD  
SCOPE  
VDD  
nCLK  
VDDO  
VPP  
VCMR  
Cross Points  
Qx  
LVCMOS  
CLK  
GND  
GND  
-0.9V 0.075V  
3.3V CORE/1.8V OUTPUT LOAD AC TEST CIRCUIT  
DIFFERENTIAL INPUT LEVEL  
PART 1  
Qx  
VDDO  
2
VDDO  
Qx  
Qy  
2
PART 2  
Qy  
VDDO  
VDDO  
2
2
tsk(pp)  
tsk(o)  
OUTPUT SKEW  
PART-TO-PART SKEW  
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REV. B MAY 19, 2005  
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ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
VDD  
2
LVCMOS_CLK  
80ꢀ  
tF  
80ꢀ  
tR  
nCLK  
CLK  
20ꢀ  
20ꢀ  
Clock  
Outputs  
VDDO  
2
Q0:Q3  
tPD  
PROPAGATION DELAY  
OUTPUT RISE/FALL TIME  
VDDO  
2
Q0:Q3  
tPW  
tPERIOD  
tPW  
x 100ꢀ  
odc =  
tPERIOD  
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD  
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REV. B MAY 19, 2005  
9
ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
APPLICATION INFORMATION  
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS  
Figure 2 shows how the differential input can be wired to accept  
single ended levels. The reference voltage V_REF = VDD/2 is  
generated by the bias resistors R1, R2 and C1.This bias circuit  
should be located as close as possible to the input pin.The ratio  
of R1 and R2 might need to be adjusted to position theV_REF in  
the center of the input voltage swing. For example, if the input  
clock swing is only 2.5V andVDD = 3.3V, V_REF should be 1.25V  
and R2/R1 = 0.609.  
VDD  
R1  
1K  
Single Ended Clock Input  
V_REF  
CLK  
nCLK  
C1  
0.1u  
R2  
1K  
FIGURE 2. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT  
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REV. B MAY 19, 2005  
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ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
DIFFERENTIAL CLOCK INPUT INTERFACE  
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL here are examples only. Please consult with the vendor of the  
and other differential signals.BothVSWING and VOH must meet the driver component to confirm the driver termination requirements.  
VPP and VCMR input requirements. Figures 3A to 3E show inter- For example in Figure 3A, the input termination applies for ICS  
face examples for the HiPerClockS CLK/nCLK input driven by HiPerClockS LVHSTL drivers. If you are using an LVHSTL driver  
the most common driver types.The input interfaces suggested from another vendor, use their termination recommendation.  
3.3V  
3.3V  
3.3V  
1.8V  
Zo = 50 Ohm  
CLK  
Zo = 50 Ohm  
CLK  
Zo = 50 Ohm  
nCLK  
Zo = 50 Ohm  
HiPerClockS  
Input  
LVPECL  
nCLK  
HiPerClockS  
Input  
LVHSTL  
R1  
50  
R2  
50  
ICS  
HiPerClockS  
R1  
50  
R2  
50  
LVHSTL Driver  
R3  
50  
FIGURE 3A. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY  
ICS HIPERCLOCKS LVHSTL DRIVER  
FIGURE 3B. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY  
3.3V LVPECL DRIVER  
3.3V  
3.3V  
3.3V  
3.3V  
Zo = 50 Ohm  
3.3V  
R3  
R4  
125  
125  
LVDS_Driver  
Zo = 50 Ohm  
Zo = 50 Ohm  
CLK  
CLK  
R1  
100  
nCLK  
Receiver  
nCLK  
HiPerClockS  
Input  
Zo = 50 Ohm  
LVPECL  
R1  
84  
R2  
84  
FIGURE 3C. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY  
3.3V LVPECL DRIVER  
FIGURE 3D. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY  
3.3V LVDS DRIVER  
3.3V  
3.3V  
3.3V  
R3  
125  
R4  
125  
C1  
C2  
LVPECL  
Zo = 50 Ohm  
Zo = 50 Ohm  
CLK  
nCLK  
HiPerClockS  
Input  
R5  
100 - 200  
R6  
100 - 200  
R1  
84  
R2  
84  
R5,R6 locate near the driver pin.  
FIGURE 3E. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY  
3.3V LVPECL DRIVER WITH AC COUPLE  
8305AGI  
www.icst.com/products/hiperclocks.html  
REV. B MAY 19, 2005  
11  
ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
SCHEMATIC EXAMPLE  
This application note provides general design guide using is driven by an LVCMOS driver. CLK_EN is set at logic low to  
ICS8305I LVCMOS buffer. Figure 4 shows a schematic example select LVCMOS_CLK input.  
of the ICS8305I LVCMOS clock buffer.In this example, the input  
VDD  
Zo = 50  
VDD  
R1  
43  
R4  
1K  
R5  
1K  
U1  
1
16  
15  
14  
13  
12  
11  
10  
9
GND  
OE  
VDD  
CLK_EN  
CLK  
nCLK  
CLK_SEL  
LVCMOS_CLK  
Q0  
VDDO  
Q1  
GND  
Q2  
VDDO  
Q3  
GND  
VDD  
2
3
4
5
6
7
8
LVCMOS Receiver  
Zo = 50  
Zo = 50  
R2  
43  
Ro  
~
7
Ohm  
R3  
43  
R6  
1K  
ICS8305  
3,.3V LVCMOS  
(U1,3)  
(U1,11)  
C2  
(U1,15)  
VDD  
C1  
0.1u  
LVCMOS Receiver  
C3  
VDD=3.3V  
0.1u  
0.1u  
FIGURE 4. EXAMPLE ICS8305I LVCMOS CLOCK OUTPUT BUFFER SCHEMATIC  
RELIABILITY INFORMATION  
TABLE 6. θJAVS. AIR FLOW TABLE FOR 16 LEAD TSSOP  
θJA byVelocity (Linear Feet per Minute)  
0
200  
118.2°C/W  
81.8°C/W  
500  
106.8°C/W  
78.1°C/W  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
137.1°C/W  
89.0°C/W  
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.  
TRANSISTOR COUNT  
The transistor count for ICS8305I is: 459  
8305AGI  
www.icst.com/products/hiperclocks.html  
REV. B MAY 19, 2005  
12  
ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
PACKAGE OUTLINE - G SUFFIX FOR 16 LEAD TSSOP  
TABLE 7. PACKAGE DIMENSIONS  
Millimeters  
Minimum Maximum  
SYMBOL  
N
A
16  
--  
1.20  
0.15  
1.05  
0.30  
0.20  
5.10  
A1  
A2  
b
0.05  
0.80  
0.19  
0.09  
4.90  
c
D
E
6.40 BASIC  
0.65 BASIC  
E1  
e
4.30  
4.50  
L
0.45  
0°  
0.75  
8°  
α
aaa  
--  
0.10  
Reference Document: JEDEC Publication 95, MO-153  
8305AGI  
www.icst.com/products/hiperclocks.html  
REV. B MAY 19, 2005  
13  
ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
TABLE 8. ORDERING INFORMATION  
Part/Order Number  
ICS8305AGI  
Marking  
Package  
Shipping Packaging  
tube  
Temperature  
-40°C to 85°C  
-40°C to 85°C  
-40°C to 85°C  
-40°C to 85°C  
8305AGI  
8305AGI  
8305AGIL  
8305AGIL  
16 Lead TSSOP  
ICS8305AGIT  
16 Lead TSSOP  
2500 tape & reel  
tube  
ICS8305AGILF  
ICS8305AGILFT  
16 Lead "Lead-Free" TSSOP  
16 Lead "Lead-Free" TSSOP  
2500 tape & reel  
NOTE: Parts that are ordered with an"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.  
The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use  
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use  
in normal commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not  
recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product  
for use in life support devices or critical medical instruments.  
8305AGI  
www.icst.com/products/hiperclocks.html  
REV. B MAY 19, 2005  
14  
ICS8305I  
LOW SKEW, 1-TO-4, MULTIPLEXED DIFFERENTIAL/  
LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER  
Integrated  
Circuit  
Systems, Inc.  
REVISION HISTORY SHEET  
Description of Change  
Rev  
Table  
Page  
Date  
Ordering Information table - corrected Part/Order Number typo from  
ICS88305AGIT to ICS8305AGIT.  
A
T8  
14  
1/20/04  
T5A - T5C  
5 & 6  
7
AC Characteristics Tables - changed tjit from 0.05ps typical to 0.04ps typical.  
Updated Additive Phase Jitter plot.  
B
2/26/04  
B
B
T1  
T8  
2
Pin Description Table - corrected CLK_EN description.  
Ordering Information Table - added Lead-Free part number  
12/7/04  
5/19/05  
14  
8305AGI  
www.icst.com/products/hiperclocks.html  
REV. B MAY 19, 2005  
15  

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